TWI842571B - Cabinet and server device - Google Patents
Cabinet and server device Download PDFInfo
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- TWI842571B TWI842571B TW112122716A TW112122716A TWI842571B TW I842571 B TWI842571 B TW I842571B TW 112122716 A TW112122716 A TW 112122716A TW 112122716 A TW112122716 A TW 112122716A TW I842571 B TWI842571 B TW I842571B
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 49
- 238000001816 cooling Methods 0.000 claims description 28
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 241000219122 Cucurbita Species 0.000 claims description 8
- 235000009852 Cucurbita pepo Nutrition 0.000 claims description 8
- 230000004308 accommodation Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 16
- 239000007788 liquid Substances 0.000 description 12
- 240000009087 Crescentia cujete Species 0.000 description 8
- 235000005983 Crescentia cujete Nutrition 0.000 description 8
- 235000009797 Lagenaria vulgaris Nutrition 0.000 description 8
- 238000012986 modification Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 3
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
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Abstract
Description
本發明係關於一種伺服器裝置,特別是一種結合風冷系統以及液冷系統之伺服器裝置。 The present invention relates to a server device, in particular to a server device combining an air cooling system and a liquid cooling system.
在電腦系統中,會透過伺服器來進行資料的處理,而在伺服器處理資料時會持續產生熱量。過高的熱量將會對伺服器造成毀損,故使用者會透過在電腦系統中設置冷卻系統來對伺服器進行散熱。在過去,使用者通常採用風冷系統就足以滿足伺服器的散熱需求。隨著大數據時代的來臨及雲端技術的不斷發展,各行各業對伺服器的要求越來越高,且需透過伺服器處理的資料量越來越龐大,使得伺服器熱流密度及發熱量也大幅提升,故使用者會改為採用散熱效率較高的液冷系統來加強對伺服器的散熱。 In a computer system, data is processed through a server, and heat is continuously generated when the server processes data. Excessive heat will damage the server, so users will set up a cooling system in the computer system to dissipate heat from the server. In the past, users usually used air cooling systems to meet the heat dissipation needs of the server. With the advent of the big data era and the continuous development of cloud technology, all walks of life have higher and higher requirements for servers, and the amount of data that needs to be processed by servers is getting larger and larger, which greatly increases the heat flux density and heat generation of the server. Therefore, users will switch to liquid cooling systems with higher heat dissipation efficiency to enhance the heat dissipation of the server.
一般來說,為了改為採用液冷系統來對伺服器散熱,使用者需對存放伺服器的機櫃進行改造。然而,改造機櫃的成本過高。若當前的機櫃設計難以與液冷系統相容,甚至需重新訂製機櫃,造成使用者在改造上的不便。因此,如何降低機櫃的改造成本,以便於採用液冷系統來對伺服器散熱,即為研發人員應解決的問題之一。 Generally speaking, in order to switch to a liquid cooling system to dissipate heat from the server, the user needs to modify the cabinet that stores the server. However, the cost of modifying the cabinet is too high. If the current cabinet design is difficult to be compatible with the liquid cooling system, the cabinet may even need to be re-customized, causing inconvenience to the user in the modification. Therefore, how to reduce the cost of cabinet modification so that the liquid cooling system can be used to dissipate heat from the server is one of the problems that R&D personnel should solve.
本發明在於提供一種機櫃及伺服器裝置,藉以降低機櫃的改造成本,以便於採用液冷系統來對伺服器散熱。 The present invention provides a cabinet and server device to reduce the cost of cabinet modification so as to facilitate the use of a liquid cooling system to dissipate heat from the server.
本發明之一實施例所揭露之機櫃,包含一底板、多個右立柱與多個左立柱以及一頂板。這些右立柱與這些左立柱立於底板。頂板設置於這些右立柱與這些左立柱,並覆蓋底板。其中,底板之後側具有多個第一組裝結構。這些第一組裝結構自後側的左立柱朝後側的右立柱排列。頂板之後側具有多個第二組裝結構。這些第二組裝結構自後側的左立柱朝後側的右立柱排列。 The cabinet disclosed in one embodiment of the present invention includes a bottom plate, a plurality of right columns, a plurality of left columns, and a top plate. The right columns and the left columns stand on the bottom plate. The top plate is arranged on the right columns and the left columns and covers the bottom plate. The back side of the bottom plate has a plurality of first assembly structures. The first assembly structures are arranged from the left column on the back side to the right column on the back side. The back side of the top plate has a plurality of second assembly structures. The second assembly structures are arranged from the left column on the back side to the right column on the back side.
本發明之另一實施例所揭露之伺服器裝置,包含一機櫃以及至少一伺服器。機櫃包含一底板、多個右立柱與多個左立柱以及一頂板。這些右立柱與這些左立柱立於底板。頂板設置於這些右立柱與這些左立柱,並與底板、這些右立柱與這些左立柱共同形成一容置空間。其中,底板之後側具有多個第一組裝結構。這些第一組裝結構自後側的左立柱朝後側的右立柱排列。頂板之後側具有多個第二組裝結構。這些第二組裝結構自後側的左立柱朝後側的右立柱排列。其中,機櫃包含一第一組裝架、一第二組裝架、一支撐架及一分水器。第一組裝架可分離地裝設於這些第一組裝結構之一。第二組裝架可分離地裝設於這些第二組裝結構之一。支撐架之相對兩端分別裝設於第一組裝架及第二組裝架,分水器裝設於支撐架。至少一伺服器可滑動地位於容置空間,並具有一水冷散熱組件。水冷散熱組件與分水器相連通。 Another embodiment of the present invention discloses a server device, which includes a cabinet and at least one server. The cabinet includes a bottom plate, a plurality of right columns, a plurality of left columns, and a top plate. The right columns and the left columns stand on the bottom plate. The top plate is arranged on the right columns and the left columns, and together with the bottom plate, the right columns, and the left columns, forms a containing space. The back side of the bottom plate has a plurality of first assembly structures. The first assembly structures are arranged from the left column on the back side to the right column on the back side. The back side of the top plate has a plurality of second assembly structures. The second assembly structures are arranged from the left column on the back side to the right column on the back side. The cabinet includes a first assembly frame, a second assembly frame, a support frame, and a water distributor. The first assembly frame can be detachably mounted on one of these first assembly structures. The second assembly frame can be detachably mounted on one of these second assembly structures. The opposite ends of the support frame are respectively mounted on the first assembly frame and the second assembly frame, and the water distributor is mounted on the support frame. At least one server can be slidably positioned in the accommodation space and has a water cooling component. The water cooling component is connected to the water distributor.
根據上述實施例之機櫃及伺服器裝置,由於分水器可分離地裝設於支撐架,使得使用者可根據散熱需求來安裝分水器而採用液冷方式來對伺服器散熱,或移除分水器而採用風冷方式來對伺服器散熱,因此無需額外大幅改造機櫃以裝設液冷系統,除了可降低機櫃的改造成本之外,更可使散熱方式更靈活。 According to the cabinet and server device of the above embodiment, since the water distributor can be detachably installed on the support frame, the user can install the water distributor according to the heat dissipation requirements and use liquid cooling to dissipate the heat of the server, or remove the water distributor and use air cooling to dissipate the heat of the server. Therefore, there is no need to significantly modify the cabinet to install a liquid cooling system. In addition to reducing the cost of cabinet modification, the heat dissipation method can be more flexible.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。 The above description of the content of the present invention and the following description of the implementation method are used to demonstrate and explain the principle of the present invention, and provide a further explanation of the scope of the patent application of the present invention.
10:伺服器裝置 10: Server device
20:機櫃 20: Cabinet
21:底板 21: Base plate
211:第一組裝結構 211: First assembly structure
22:右立柱 22: Right column
23:左立柱 23: Left pillar
24:頂板 24: Top plate
241:第二組裝結構 241: Second assembly structure
251:第一組裝架 251: First assembly
2511:第一葫蘆孔 2511: The first gourd hole
252:第二組裝架 252: Second assembly
2521:第二葫蘆孔 2521: Second gourd hole
26:支撐架 26: Support frame
261:組裝板 261:Assembly board
2611:第一面 2611: First page
2612:第二面 2612: Second side
262:側板 262: Side panels
263:第一組裝凸塊 263: First assembly bump
264:第二組裝凸塊 264: Second assembly bump
27:分水器 27: Water distributor
28:定位擋塊 28: Positioning block
29:定位支架 29: Positioning bracket
30:伺服器 30: Server
31:水冷散熱組件 31: Water cooling components
S:容置空間 S: Storage space
圖1為根據本發明第一實施例所述之伺服器裝置之前視示意圖。 FIG1 is a front view schematic diagram of a server device according to the first embodiment of the present invention.
圖2為根據本發明第一實施例所述之伺服器裝置之另一前視示意圖。 FIG2 is another front view schematic diagram of the server device according to the first embodiment of the present invention.
圖3為圖1之伺服器裝置之立體示意圖。 Figure 3 is a three-dimensional schematic diagram of the server device in Figure 1.
圖4為圖3之伺服器裝置之局部放大的立體示意圖。 Figure 4 is a partially enlarged three-dimensional schematic diagram of the server device in Figure 3.
圖5為圖1之伺服器裝置的第一組裝架及支撐架之局部放大的立體示意圖。 FIG5 is a partially enlarged three-dimensional schematic diagram of the first set of mounting frames and support frames of the server device in FIG1.
圖6為圖1之分水器以及支撐架之分解示意圖。 Figure 6 is a schematic diagram of the exploded view of the water distributor and support frame in Figure 1.
圖7為圖6之分水器以及支撐架之局部放大的分解示意圖。 Figure 7 is a partially enlarged exploded schematic diagram of the water distributor and support frame in Figure 6.
圖8為圖6之分水器以及支撐架之局部放大的平面示意圖。 Figure 8 is a partially enlarged schematic plan view of the water distributor and support frame in Figure 6.
圖9為圖1之伺服器裝置之局部放大的俯視示意圖。 FIG9 is a partially enlarged top view of the server device in FIG1.
請參閱圖1與圖2。圖1為根據本發明第一實施例所述之伺服器裝置之前視示意圖。圖2為根據本發明第一實施例所述之伺服器裝置之另一前視示意圖。 Please refer to Figures 1 and 2. Figure 1 is a front view schematic diagram of a server device according to the first embodiment of the present invention. Figure 2 is another front view schematic diagram of a server device according to the first embodiment of the present invention.
本實施例之伺服器裝置10,包含一機櫃20以及多個伺服器30。機櫃20包含一底板21、多個右立柱22與多個左立柱23以及一頂板24。多個右立柱22與多個左立柱23立於底板21。頂板24設置於這些右立柱22與這些左立柱23,並與底板21、這些右立柱22與這些左立柱23共同形成一容置空間S。這些伺服器30可滑動地位於容置空間S。
The
請一併參閱圖3至圖6。圖3為圖1之伺服器裝置之立體示意圖。圖4為圖3之伺服器裝置之局部放大的立體示意圖。圖5為圖1之伺服器裝置的第一組裝架及支撐架之局部放大的立體示意圖。圖6為圖1之分水器以及支撐架之分解示意圖。 Please refer to Figures 3 to 6 together. Figure 3 is a three-dimensional schematic diagram of the server device in Figure 1. Figure 4 is a three-dimensional schematic diagram of a partial enlargement of the server device in Figure 3. Figure 5 is a three-dimensional schematic diagram of a partial enlargement of the first set of mounting frames and support frames of the server device in Figure 1. Figure 6 is a disassembled schematic diagram of the water distributor and support frame in Figure 1.
在本實施例中,底板21之後側還可以具有多個第一組裝結構211。後側係指遠離機櫃20的開口之一側。這些第一組裝結構211自後側的左立柱23朝後側的右立柱22排列。頂板24之後側還可以具有多個第二組裝結構241。這些第二組裝結構241自後側的左立柱23朝後側的右立柱22排列。
In this embodiment, the rear side of the
在本實施例中,機櫃20還可以包含一第一組裝架251、一第二組裝架252、一支撐架26、一分水器27、多個定位擋塊28以及多個定位支架29。第一組裝架251可分離地裝設於這些第一組裝結構211之
一,並位於底板21之後側。第二組裝架252可分離地裝設於這些第二組裝結構241之一,並位於頂板24之後側。
In this embodiment, the
支撐架26包含一組裝板261以及二側板262。組裝板261具有相對的一第一面2611以及一第二面2612。二側板262分別連接於組裝板261之相對兩側,並凸出於第一面2611。支撐架26之相對兩端別具有二第一組裝凸塊263以及二第二組裝凸塊264。二第一組裝凸塊263以及二第二組裝凸塊264位於組裝板261。第一組裝架251以及第二組裝架252分別具有二第一葫蘆孔2511以及二第二葫蘆孔2521。二第一組裝凸塊263與二第二組裝凸塊264分別可分離地裝設於二第一葫蘆孔2511與二第二葫蘆孔2521,使得支撐架26之組裝板261裝設於第一組裝架251以及第二組裝架252。也就是說,支撐架26位於遠離機櫃20的開口之一側。此外,組裝板261之第二面2612部分面向第一組裝架251以及第二組裝架252。
The
請一併參閱圖7至圖9。圖7為圖6之分水器以及支撐架之局部放大的分解示意圖。圖8為圖6之分水器以及支撐架之局部放大的平面示意圖。圖9為圖1之伺服器裝置之局部放大的俯視示意圖。 Please refer to Figures 7 to 9 together. Figure 7 is a partially enlarged exploded schematic diagram of the water distributor and support frame of Figure 6. Figure 8 is a partially enlarged plan schematic diagram of the water distributor and support frame of Figure 6. Figure 9 is a partially enlarged top view schematic diagram of the server device of Figure 1.
分水器27用以供冷卻液(未繪示)於分水器27內流動,並可分離地裝設於組裝板261之第一面2611。也就是說,分水器27位於遠離機櫃20的開口之一側。這些定位擋塊28裝設於分水器27。這些定位支架29裝設於組裝板261並用以支撐這些定位擋塊28。透過這些定位支架29與這些定位擋塊28之設置,可定位分水器27以便於分水器27的安裝與拆換。每一伺服器30還可以具有一水冷散熱組件31。水冷散熱組件31
與分水器27相連通,使得冷卻液可透過這些水冷散熱組件31與分水器27流至這些伺服器30,以對這些伺服器30進行散熱。
The
在本實施例中,由於分水器27可分離地裝設於支撐架26,使得使用者可根據散熱需求來安裝分水器27而採用液冷方式來對伺服器30散熱,或移除分水器27而採用風冷方式來對伺服器30散熱,因此無需額外大幅改造機櫃20以裝設液冷系統,除了可降低機櫃20的改造成本之外,更可使散熱方式更靈活。此外,由於分水器27位於遠離機櫃20的開口之一側,故不會影響分水器27以及伺服器30之管路或線路的理線空間,以便於使用者連接管路或線路。
In this embodiment, since the
在本實施例中,組裝板261之第一面2611可選擇地面向左立柱23與右立柱22之其中一者。也就是說,裝設於組裝板261之第一面2611的分水器27會隨著組裝板261之第一面2611所面對的方向來裝設。如此一來,使用者可根據這些伺服器30之水冷散熱組件31的位置來選擇分水器27之設置方向。
In this embodiment, the
在本實施例中,伺服器30的數量為多個,且這些伺服器30可滑動地位於容置空間S,並透過水冷散熱組件31與分水器27相連通,但不以此為限。在其他實施例中,伺服器的數量也可以僅為單個,且伺服器可滑動地位於容置空間,並透過水冷散熱組件與分水器相連通。
In this embodiment, there are
在本實施例中,第一組裝凸塊263、第二組裝凸塊264、第一葫蘆孔2511以及第二葫蘆孔2521的數量分別為二個,且二第一組裝凸塊263與二第二組裝凸塊264分別可分離地裝設於二第一葫蘆孔
2511與二第二葫蘆孔2521,但不以此為限。在其他實施例中,第一組裝凸塊、第二組裝凸塊、第一葫蘆孔以及第二葫蘆孔的數量也可以分別僅為單個或三個以上,且第一組裝凸塊與第二組裝凸塊分別可分離地裝設於第一葫蘆孔與第二葫蘆孔。
In this embodiment, the number of the
在本實施例中,定位擋塊28以及定位支架29的數量為多個,且這些定位擋塊28裝設於分水器27,這些定位支架29裝設於組裝板261並用以支撐該這些定位擋塊28,但不以此為限。在其他實施例中,定位擋塊以及定位支架的數量也可以僅為單個,且定位擋塊裝設於分水器,定位支架裝設於組裝板並用以支撐定位擋塊。
In this embodiment, there are multiple positioning blocks 28 and
根據上述實施例之機櫃及伺服器裝置,由於分水器可分離地裝設於支撐架,使得使用者可根據散熱需求來安裝分水器而採用液冷方式來對伺服器散熱,或移除分水器而採用風冷方式來對伺服器散熱,因此無需額外大幅改造機櫃以裝設液冷系統,除了可降低機櫃的改造成本之外,更可使散熱方式更靈活。 According to the cabinet and server device of the above embodiment, since the water distributor can be detachably installed on the support frame, the user can install the water distributor according to the heat dissipation requirements and use liquid cooling to dissipate the heat of the server, or remove the water distributor and use air cooling to dissipate the heat of the server. Therefore, there is no need to significantly modify the cabinet to install a liquid cooling system. In addition to reducing the cost of cabinet modification, the heat dissipation method can be more flexible.
雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the present invention is disclosed as above by the aforementioned embodiments, they are not used to limit the present invention. Anyone familiar with similar techniques can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.
10:伺服器裝置 10: Server device
20:機櫃 20: Cabinet
21:底板 21: Base plate
211:第一組裝結構 211: First assembly structure
22:右立柱 22: Right column
23:左立柱 23: Left pillar
24:頂板 24: Top plate
241:第二組裝結構 241: Second assembly structure
251:第一組裝架 251: First assembly
252:第二組裝架 252: Second assembly
26:支撐架 26: Support frame
27:分水器 27: Water distributor
30:伺服器 30: Server
S:容置空間 S: Storage space
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US8854808B2 (en) | 2012-06-27 | 2014-10-07 | International Business Machines Corporation | Fitting for flexible manifold system |
Patent Citations (1)
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US8854808B2 (en) | 2012-06-27 | 2014-10-07 | International Business Machines Corporation | Fitting for flexible manifold system |
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