TWI841876B - Semiconductor strip cutting and sorting equipment, package drying equipment and handling equipment - Google Patents
Semiconductor strip cutting and sorting equipment, package drying equipment and handling equipment Download PDFInfo
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- TWI841876B TWI841876B TW110140143A TW110140143A TWI841876B TW I841876 B TWI841876 B TW I841876B TW 110140143 A TW110140143 A TW 110140143A TW 110140143 A TW110140143 A TW 110140143A TW I841876 B TWI841876 B TW I841876B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 69
- 238000001035 drying Methods 0.000 title claims abstract description 51
- 238000005520 cutting process Methods 0.000 title claims abstract description 38
- 239000007921 spray Substances 0.000 claims abstract description 53
- 239000007788 liquid Substances 0.000 claims abstract description 18
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 21
- 238000007689 inspection Methods 0.000 description 19
- 238000004140 cleaning Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 3
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 3
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 3
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 238000011179 visual inspection Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Dicing (AREA)
- Drying Of Solid Materials (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Details Of Cutting Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本發明的實施例提供半導體條帶切割及分類設備、封裝體乾燥裝置及搬運裝置。根據本發明的實施例的用於在半導體條帶切割及分類設備中乾燥單個化的封裝體的封裝體乾燥裝置包括:底座,安放所述封裝體;龍門架,在所述底座的上方或者下方設置成能夠移動;噴氣單元,設置於所述龍門架,並朝向安放於所述底座的封裝體噴射空氣;以及抽吸單元,在所述龍門架中與所述噴氣單元相鄰設置,並抽吸從所述封裝體飛散的液體。The embodiments of the present invention provide a semiconductor strip cutting and sorting device, a package drying device and a transport device. The package drying device for drying singulated packages in the semiconductor strip cutting and sorting device according to the embodiments of the present invention comprises: a base for placing the packages; a gantry for being movable above or below the base; a spray unit for spraying air toward the packages placed on the base; and a suction unit for being adjacent to the spray unit in the gantry for sucking liquid scattered from the packages.
Description
本發明涉及半導體條帶切割及分類設備中封裝體乾燥裝置,更具體地提供用於迅速且有效地乾燥單個化的封裝體的裝置。The present invention relates to a package drying device in a semiconductor strip cutting and sorting equipment, and more particularly to a device for rapidly and effectively drying singulated packages.
半導體製造製程作為用於在晶圓上製造半導體元件的製程,例如包括曝光、蒸鍍、蝕刻、離子注入、清洗等。半導體條帶切割及分類設備將配置有多個封裝體的條帶以封裝體單位切割而單個化,通過針對各封裝體的清洗、乾燥、檢查,區分為正常或者不良狀態而分別分類並裝載於最終的收納容器即托盤。Semiconductor manufacturing processes are processes used to manufacture semiconductor devices on wafers, including exposure, evaporation, etching, ion implantation, cleaning, etc. Semiconductor strip cutting and sorting equipment cuts a strip with multiple packages into individual packages, cleans, dries, and inspects each package, and then classifies it into normal or defective states and loads it into the final storage container, i.e., tray.
針對各封裝體的檢查通過相機之類視覺檢查裝置執行,為了精密的檢查,各封裝體需要去除可能會阻礙檢查的異物。使用於清洗被切割的封裝體的清洗液也可能在檢查過程中成為阻礙,因此需要管理成在封裝體不殘留清洗液。Inspection of each package is performed using visual inspection devices such as cameras. In order to conduct precise inspection, foreign objects that may hinder the inspection need to be removed from each package. The cleaning liquid used to clean the cut package may also become an obstacle during the inspection process, so it is necessary to manage so that no residual cleaning liquid remains on the package.
因此,本發明的實施例提供能夠迅速且有效地去除殘留於單個化的半導體封裝體的清洗液的封裝體乾燥裝置以及具備封裝體乾燥裝置的半導體條帶切割及分類設備。Therefore, embodiments of the present invention provide a package drying device capable of quickly and effectively removing cleaning liquid remaining in singulated semiconductor packages and a semiconductor strip cutting and sorting apparatus having the package drying device.
本發明的解決課題不限於以上提及的,本領域技術人員可以從下面的記載明確地理解未提及的其它解決課題。The problems to be solved by the present invention are not limited to those mentioned above, and those skilled in the art can clearly understand other problems to be solved that are not mentioned from the following description.
根據本發明的實施例的用於在半導體條帶切割及分類設備中乾燥單個化的封裝體的封裝體乾燥裝置包括:底座,安放所述封裝體;龍門架,在所述底座的上方或者下方設置成能夠移動;噴氣單元,設置於所述龍門架,並朝向安放於所述底座的封裝體噴射空氣;以及抽吸單元,在所述龍門架中與所述噴氣單元相鄰設置,並抽吸從所述封裝體飛散的液體。According to an embodiment of the present invention, a package drying device for drying singulated packages in a semiconductor strip cutting and sorting device includes: a base on which the package is placed; a gantry which is movably arranged above or below the base; a spray unit which is arranged on the gantry and sprays air toward the package placed on the base; and a suction unit which is arranged adjacent to the spray unit in the gantry and sucks liquid scattered from the package.
根據本發明的實施例,可以是,所述底座包括:安放部,安放所述封裝體;以及凸出部,比所述安放部凸出。According to an embodiment of the present invention, the base may include: a placement portion for placing the package body; and a protruding portion that protrudes more than the placement portion.
根據本發明的實施例,可以是,所述安放部具有與所述封裝體相同的大小以及形状。According to an embodiment of the present invention, the placement portion may have the same size and shape as the packaging body.
根據本發明的實施例,可以是,所述凸出部從所述安放部凸出與所述封裝體的厚度相同的高度。According to an embodiment of the present invention, the protrusion may protrude from the mounting portion to a height that is the same as the thickness of the packaging body.
根據本發明的實施例,可以是,所述噴氣單元向傾斜的方向噴射空氣。According to an embodiment of the present invention, the air jet unit may jet air in an inclined direction.
根據本發明的實施例,可以是,所述抽吸單元位於所述噴氣單元傾斜的方向。According to an embodiment of the present invention, the suction unit may be located in a direction in which the spray unit is tilted.
根據本發明的實施例,可以是,所述抽吸單元向相對於所述噴氣單元傾斜的方向相反方向傾斜。According to an embodiment of the present invention, the suction unit may be inclined in a direction opposite to the direction in which the spray unit is inclined.
根據本發明的實施例的在半導體條帶切割及分類設備中搬運單個化的封裝體的封裝體搬運裝置包括:翻轉台,包括安放所述封裝體的底座和用於旋轉所述底座的旋轉軸;乾燥單元,乾燥安放於所述底座的所述封裝體;以及隨行夾具台,從所述翻轉台容納所述封裝體。所述乾燥單元包括:龍門架,在所述底座的上方或者下方設置成能夠移動;噴氣單元,設置於所述龍門架,並朝向安放於所述底座的封裝體噴射空氣;以及抽吸單元,在所述龍門架中與所述噴氣單元相鄰設置,並抽吸從所述封裝體飛散的液體。According to an embodiment of the present invention, a package transporting device for transporting singulated packages in a semiconductor strip cutting and sorting device includes: a turning table including a base for placing the package and a rotating shaft for rotating the base; a drying unit for drying the package placed on the base; and a portable fixture table for accommodating the package from the turning table. The drying unit includes: a gantry, which is arranged to be movable above or below the base; a spray unit, which is arranged on the gantry and sprays air toward the package placed on the base; and a suction unit, which is arranged adjacent to the spray unit in the gantry and sucks liquid scattered from the package.
根據本發明的實施例的半導體條帶切割及分類設備包括:裝載單元,裝載配置有多個封裝體的半導體條帶;切割單元,切割所述半導體條帶並傳送單個化的半導體封裝體;以及分類單元,對所述半導體封裝體進行乾燥及檢查並收納於托盤。所述分類單元包括:翻轉台,包括安放所述封裝體的底座和用於旋轉所述底座的旋轉軸;乾燥單元,乾燥安放於所述底座的所述封裝體;以及隨行夾具台,從所述翻轉台容納所述封裝體。所述底座包括:安放部,安放所述封裝體;以及凸出部,形成於所述底座中除所述安放部以外的其餘區域,並比所述安放部凸出。所述乾燥單元包括:龍門架,在所述底座的上方或者下方設置成能夠移動;噴氣單元,設置於所述龍門架,並朝向安放於所述底座的封裝體噴射空氣;以及抽吸單元,在所述龍門架中與所述噴氣單元相鄰設置,並抽吸從所述封裝體飛散的液體。According to an embodiment of the present invention, the semiconductor strip cutting and sorting equipment includes: a loading unit for loading a semiconductor strip configured with a plurality of packages; a cutting unit for cutting the semiconductor strip and transferring singulated semiconductor packages; and a sorting unit for drying and inspecting the semiconductor packages and storing them in a tray. The sorting unit includes: a turning table including a base for placing the packages and a rotating shaft for rotating the base; a drying unit for drying the packages placed on the base; and a portable fixture table for accommodating the packages from the turning table. The base includes: a placement portion for placing the packages; and a protruding portion formed in the remaining area of the base except for the placement portion and protruding beyond the placement portion. The drying unit includes: a gantry frame, which is movably arranged above or below the base; a spray unit, which is arranged on the gantry frame and sprays air toward a package placed on the base; and a suction unit, which is arranged adjacent to the spray unit in the gantry frame and sucks liquid scattered from the package.
根據本發明的實施例,抽吸單元構成朝向封裝體噴射空氣的噴氣單元和抽吸從封裝體飛散的水汽,從而可以與去除封裝體的水汽一起防止水汽飛散到周邊的裝置。According to an embodiment of the present invention, the suction unit is configured as a spray unit that sprays air toward the package body and a device that sucks water vapor scattered from the package body, thereby removing water vapor from the package body and preventing the water vapor from scattering to the surroundings.
本發明的效果不限於以上提及的,本領域技術人員可以從下面的記載明確地理解未提及的其它效果。The effects of the present invention are not limited to those mentioned above, and those skilled in the art can clearly understand other effects not mentioned from the following description.
以下,參照附圖來詳細說明本發明的實施例,以使得本發明所屬技術領域中具有通常知識的人能夠容易地實施。本發明可以以各種不同方式實現,不限於在此說明的實施例。Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that a person with ordinary knowledge in the technical field to which the present invention belongs can easily implement the present invention. The present invention can be implemented in various different ways, not limited to the embodiments described herein.
為了清楚地說明本發明,省略了與說明無關的部分,貫穿說明書整體對相同或類似的構成要件標注相同的附圖標記。In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar constituent elements are marked with the same figure marks throughout the entire specification.
另外,在多個實施例中,對具有相同結構的構成要件,使用相同的附圖標記來僅說明代表性實施例,在其餘的其它實施例中僅說明與代表性實施例不同的結構。In addition, among a plurality of embodiments, components having the same structure are denoted by the same reference numerals only in a representative embodiment, and only structures different from the representative embodiment are described in the remaining embodiments.
在說明書整體中,當表述某部分與其它部分“連接(或者結合)”時,其不僅是“直接連接(或者結合)”的情況,還包括將其它部件置於中間“間接連接(或者結合)”的情況。另外,當表述某部分“包括”某構成要件時,只要沒有特別相反記載,其意指可以還包括其它構成要件而不是排除其它構成要件。Throughout the specification, when it is stated that a part is "connected (or coupled)" to other parts, it includes not only the case of "direct connection (or coupling)" but also the case of "indirect connection (or coupling)" with other parts placed in between. In addition, when it is stated that a part "includes" a certain constituent element, unless otherwise stated, it means that other constituent elements may also be included rather than excluded.
只要沒有不同地定義,包括技術或科學術語在內在此使用的所有術語具有與本發明所屬技術領域中具有通常知識的人一般所理解的含義相同的含義。在通常使用的詞典中定義的術語之類的術語應解釋為具有與相關技術文脈上具有的含義一致的含義,只要在本申請中沒有明確定義,不會理想性或過度地解釋為形式性含義。Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by a person having ordinary knowledge in the technical field to which the present invention belongs. Terms such as terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meanings in the relevant technical context, and will not be ideally or excessively interpreted as formal meanings unless they are clearly defined in this application.
圖1示出根據本發明的實施例的半導體條帶切割及分類設備10的概要結構。參照圖1,根據本發明的實施例的半導體封裝體切割及分類設備10包括裝載單元100、切割單元200以及分類單元300。FIG1 shows a schematic structure of a semiconductor strip cutting and sorting apparatus 10 according to an embodiment of the present invention. Referring to FIG1 , the semiconductor package cutting and sorting apparatus 10 according to an embodiment of the present invention includes a
根據本發明的實施例的半導體條帶切割及分類設備10包括裝載配置有多個封裝體的半導體條帶S的裝載單元100、切割半導體條帶S並傳送單個化的封裝體P的切割單元200以及乾燥及檢查封裝體P並收納於托盤的分類單元300。The semiconductor strip cutting and sorting device 10 according to an embodiment of the present invention includes a
裝載單元100將從外部傳送的半導體條帶S向切割單元200的臨時保管單元205傳遞。雖未在圖1詳細示出,裝載單元100可以包括裝載半導體條帶S的料盒以及將半導體條帶S推動傳遞的推送器。供應到裝載單元100的半導體條帶S可以位於臨時保管單元205。The
條帶拾取器210把持位於臨時保管單元205的半導體條帶S向卡盤240傳送。封裝體拾取器220將被切刀250切割並通過卡盤240傳送的封裝體P通過真空吸附方式把持而向清洗單元260以及翻轉台310傳送。導架230提供用於供條帶拾取器210、封裝體拾取器220向X軸方向移動的路徑。在導架230可以結合用於使條帶拾取器210以及封裝體拾取器220移動的驅動部。The
卡盤240可以使得在條帶拾取器210和切刀250之間以及在切刀250和封裝體拾取器220之間分別傳送半導體條帶S和封裝體P。卡盤240可以向Y軸方向移動,並可以以Z軸方向為中心旋轉,並且可以安放半導體條帶S。卡盤240將通過條帶拾取器210傳送的半導體條帶S吸附並向切刀250傳送。另外,卡盤240將通過切刀250完成切割的多個封裝體P向封裝體拾取器220傳遞。即,卡盤240可以在切刀250和第一導架230之間往復移動。可以是,封裝體拾取器220吸附在清洗單元260中清洗的半導體封裝體P而向翻轉台310傳送,傳送到翻轉台310的半導體封裝體P通過乾燥單元320乾燥。翻轉台310可以沿著導架230移動。The
分類單元300根據針對各半導體封裝體P的檢查結果而分別分類半導體封裝體P。分類單元300可以指稱為用於搬運單個化的封裝體P的搬運裝置。更具體地,分類單元300將通過球檢查單元330B、標記檢查單元330M、對準檢查單元360完成檢查而裝載於第一隨行夾具台341和第二隨行夾具台346的半導體封裝體P獨立地拾取而根據檢查結果依次分類並向其它地點傳送。第一隨行夾具台341和第二隨行夾具台346可以分別通過第一隨行夾具驅動部件340和第二隨行夾具驅動部件345移動。The
為此的分類單元300可以包括分揀拾取器370、分揀拾取器驅動部件380、第一搬出托盤351、第二搬出托盤356、第一搬出托盤驅動部件350以及第二搬出托盤驅動部件355。The
分揀拾取器370將通過球檢查單元330B、標記檢查單元330M、對準檢查單元360完成檢查而分別裝載於第一隨行夾具台341和第二隨行夾具台346的半導體封裝體P拾取而向要後述的第一搬出托盤351、第二搬出托盤356傳送。The
分揀拾取器驅動部件380可以呈導軌狀形成並沿著X軸方向設置,一部分設置成與對準檢查單元360相鄰。分揀拾取器驅動部件380使分揀拾取器370向X軸方向移動。為此的分揀拾取器驅動部件380可以內置有用於移動分揀拾取器370的驅動工具。The sorting
第一搬出托盤351和第二搬出托盤356可以分別裝載合格半導體封裝體P和不合格半導體封裝體P而向其它地點搬出。與此不同地,第一搬出托盤351和第二搬出托盤356也可以根據製造狀態而將半導體封裝體P評價等級並按照等級分別裝載。例如,可以是,第一搬出托盤351裝載A等級的半導體封裝體P,第二搬出托盤356裝載製造狀態比A等級低的B等級的半導體封裝體P。The
若分揀拾取器370從第一隨行夾具台341和第二隨行夾具台346拾取半導體封裝體P而全部裝載於第一搬出托盤351或者第二搬出托盤356各自,第一搬出托盤351或者第二搬出托盤356向Y軸方向移動而將半導體封裝體P向其它地點傳遞。If the
第一搬出托盤驅動部件350使第一搬出托盤351移動。第一搬出托盤驅動部件350可以內置有用於移動第一搬出托盤351的驅動工具。The first unloading
第二搬出托盤驅動部件355使第二搬出托盤356移動。第二搬出托盤驅動部件355可以內置有用於移動第二搬出托盤356的驅動工具。The second unloading
半導體條帶切割及分類設備10可以如前述那樣將半導體條帶S切割、清洗、乾燥以及檢查後分類並向其它地點排出。另一方面,根據本發明的實施例的封裝體拾取器220不限於包括在半導體條帶切割及分類設備10中,可以適用於普通的半導體封裝體製造系統。以下,說明用於在清洗單元260中使用清洗液而在乾燥單元320中迅速且有效地乾燥封裝體P的裝置以及方法。The semiconductor strip cutting and sorting device 10 can cut, clean, dry and inspect the semiconductor strip S, sort it and discharge it to other places as described above. On the other hand, the
通常,半導體條帶S和封裝體P由形成有用於電連接的球(Ball)的球面B和刻印有各封裝體P的標記的標記面M構成。另一方面,將封裝體P的球面B朝上且標記面M朝下的狀態指稱為死缺陷(Dead Bug),將封裝體P的標記面M朝上且球面B朝下的狀態指稱為活缺陷(Live Bug)。切割單元200中的切割以及清洗過程都在球面B朝上的死缺陷狀態下執行,各封裝體P在死缺陷狀態下通過封裝體拾取器220向翻轉台310傳遞。Generally, the semiconductor strip S and the package P are composed of a spherical surface B forming a ball (Ball) for electrical connection and a marking surface M engraved with a mark of each package P. On the other hand, the state in which the spherical surface B of the package P faces upward and the marking surface M faces downward is referred to as a dead bug, and the state in which the marking surface M of the package P faces upward and the spherical surface B faces downward is referred to as a live bug. The cutting and cleaning processes in the
參照圖2的(a)以及圖3的(a),翻轉台310包括:能夠向水準方向移動的週邊架311;吸附並固定封裝體P的底座312;以及使底座312相對於週邊架311旋轉的旋轉軸313。底座312可以以抽吸封裝體P的標記面M的狀態以旋轉軸313為中心旋轉而如圖2的(a)那樣使封裝體P的球面B朝上,另外,可以如圖3的(b)那樣使封裝體P的球面B朝下。Referring to FIG. 2 (a) and FIG. 3 (a), the turning table 310 includes: a
圖4示出通過噴射空氣去除封裝體的水汽的過程。參照圖4,在安放於底座312的封裝體P的周邊殘留有清洗液,噴氣單元322在上方朝向封裝體P噴射空氣而去除水汽。然而,如圖4中用虛線所表示那樣,發生由於底座312和封裝體P之間的臺階而水汽堆積的情況。針對這樣堆積的水汽,即使噴射空氣也不易去除水汽,另外若向臺階噴射空氣,則產生噪音而可能對作業環境帶來壞影響。FIG4 shows the process of removing water vapor from a package by spraying air. Referring to FIG4 , cleaning liquid remains around the package P placed on the
同時,若對封裝體P噴射空氣,則一部分的水汽蒸發,另一部分水汽可能飛散到周邊的其它裝置。如圖1所示,在乾燥單元320的周邊可以設置球檢查單元330B之類視覺檢查裝置,若水汽飛散到視覺檢查裝置,則可能對以後的檢查功能帶來壞影響。At the same time, if air is sprayed on the package body P, part of the water vapor evaporates and the other part of the water vapor may be scattered to other devices around. As shown in FIG1, a visual inspection device such as a
因此,本發明的實施例提供能夠迅速且有效地去除封裝體P的水汽的乾燥裝置。根據本發明的實施例,與噴氣單元322一起構成抽吸單元323而抽吸飛散的水汽,從而防止水汽飛散到周邊裝置。另外,根據本發明的實施例,在底座312構成安放封裝體P的安放部312A和從安放部312A凸出的凸出部312B而去除封裝體P和底座312之間的臺階,因此能夠防止水汽堆積到臺階。Therefore, the embodiment of the present invention provides a drying device capable of quickly and effectively removing the water vapor of the package body P. According to the embodiment of the present invention, the
根據本發明的實施例的半導體條帶切割及分類設備10中用於乾燥單個化的封裝體P的封裝體乾燥裝置包括:底座312,安放封裝體P;龍門架321,在底座312的上方設置成能夠移動;噴氣單元322,設置於所述龍門架,並朝向安放於所述底座的封裝體噴射空氣;以及抽吸單元323,在龍門架321中與噴氣單元322相鄰設置,並抽吸從封裝體P飛散的液體。The package drying device for drying singulated packages P in the semiconductor strip cutting and sorting equipment 10 according to an embodiment of the present invention includes: a
圖5至圖7示出根據本發明的實施例的安放封裝體的底座312。圖5示出沒有安放封裝體P的狀態的底座312,圖6示出安放有封裝體P的狀態的底座312,圖7示出又另一種形態的底座312。5 to 7 show a
如圖5以及圖6所示,底座312包括安放封裝體P的安放部312A和比安放部312A凸出的凸出部312B。如圖5所示,在底座312中排列有能夠安放封裝體的呈槽形態形成的安放部312A。另外,在底座312中除安放部312A以外的其餘區域形成比安放部312A向上方凸出的凸出部312B。As shown in Fig. 5 and Fig. 6, the
根據本發明的實施例,安放部312A可以具有與封裝體P相同的大小以及形狀。如圖5以及圖6所示,以具有與封裝體P相同的大小以及形狀的方式形成安放部312A,在其餘區域形成凸出部312B。封裝體P嵌入於呈槽形態構成的安放部312A,在此,在封裝體P和凸出部312B之間沒有臺階或非常窄,因此清洗液不能滲入。安放部312A可以形成為與封裝體P相同或稍微大,其可以根據實施例,考慮公差和清洗液能夠滲入的尺寸來進行設計。According to an embodiment of the present invention, the
根據本發明的實施例,凸出部312B可以從安放部312A凸出與封裝體P的厚度相同的高度。將凸出部312B的凸出高度構成為與封裝體P相同,從而能夠防止在封裝體P和凸出部312B之間產生臺階,最終防止水汽堆積於臺階而清洗液殘留於封裝體P。According to an embodiment of the present invention, the
另一方面,底座312可以提供為各種形狀。如圖5以及圖6所示,安放部312A可以構成為陣列形態,如圖7所示,安放部312A可以構成為使封裝體P向行方向和列方向彼此不相鄰。On the other hand, the
根據本發明的實施例,底座312可以根據封裝體P的類型變更。即,當處理與之前製程不同類型的封裝體P時,可以使用其它類型的底座312。另外,底座312可以區分為2個模型,一個是針對各種類型的封裝體P共同使用,另一個是按照封裝體P的類型進行變更。According to an embodiment of the present invention, the base 312 can be changed according to the type of package P. That is, when processing a package P of a different type from the previous process, another type of
例如,如圖8所示,底座312可以包括針對多種類型的封裝體P共同使用的底座板3122和可裝卸地結合於底座板3122的吸附板3121。與封裝體P直接接觸的吸附板3121包括安放部312A和凸出部312B,安放部312A和凸出部312B的形態可以按照封裝體P的種類不同。例如,安放部312A的大小、尺寸或者凸出部312B的凸出高度可以按照封裝體P的種類不同。For example, as shown in FIG8 , the
圖9以及圖10示出根據本發明的一實施例的用於乾燥封裝體的乾燥單元的結構。圖9示出乾燥單元320位於底座312的上方的情況,圖10示出乾燥單元320位於底座312的下方的情況。Figures 9 and 10 show the structure of a drying unit for drying a package according to an embodiment of the present invention. Figure 9 shows a situation where the
參照圖9以及圖10,在位於底座312的凸出部312B之間的安放部312A中安放封裝體P。用於去除封裝體P的水汽的乾燥裝置包括:龍門架321,在底座312的上方或者下方設置成能夠移動;噴氣單元322,設置於所述龍門架並朝向安放於所述底座的封裝體噴射空氣;以及抽吸單元323,在龍門架321中與噴氣單元322相鄰設置並抽吸從封裝體P飛散的液體。9 and 10 , a package P is placed in a
如圖9以及圖10所示,移動體324構成為隨著龍門架321向水準方向(例如:x方向)移動,噴氣單元322通過第一連接部件325結合於移動體324,抽吸單元323通過第二連接部件326結合於移動體324。即,噴氣單元322和抽吸單元323可以與隨著龍門架321移動的移動體324一起向水準方向(例如:x方向)移動。As shown in FIG9 and FIG10, the moving
根據本發明的實施例,噴氣單元322可以向傾斜的方向噴射空氣。如圖9以及圖10所示,噴氣單元322可以在垂直方向(例如:z方向)上以傾斜一定角度的狀態向封裝體P噴射空氣。與單純地向垂直方向噴射而水汽四處飛濺的情況不同,噴氣單元322以傾斜的狀態向封裝體P噴射空氣,從而能夠將水汽向一定方向引導而更方便地管理。According to an embodiment of the present invention, the
根據本發明的實施例,抽吸單元323可以位於噴氣單元322傾斜的方向。參照圖9以及圖10,噴氣單元322向+x方向傾斜來噴射空氣,抽吸單元323位於從噴氣單元322向+x方向。如圖9以及圖10那樣,抽吸單元323配置於噴氣單元322傾斜的方向,從而通過抽吸單元323能夠更容易地去除被引導的水汽。According to an embodiment of the present invention, the
根據本發明的實施例,抽吸單元323可以向與相對於噴氣單元322傾斜的方向相反方向傾斜。如圖9以及圖10所示,噴氣單元322向與抽吸單元323傾斜的方向(+x方向)相反的方向(例如:-x方向)傾斜來抽吸水汽。這樣將抽吸單元323的傾斜方向構成為與噴氣單元322的傾斜方向相反,從而通過抽吸單元323更容易地抽吸被噴氣單元322引導的水汽。According to an embodiment of the present invention, the
上述的用於去除封裝體P的水汽的乾燥裝置可以構成為封裝體搬運裝置和半導體條帶切割及分類設備10的一部分。根據本發明的實施例的在半導體條帶切割及分類設備10中搬運單個化的封裝體的封裝體搬運裝置包括:翻轉台310,包括安放封裝體P的底座312和用於旋轉底座312的旋轉軸313;乾燥單元320,乾燥安放於底座312的封裝體P;以及隨行夾具台341、346,從翻轉台310容納封裝體P。乾燥單元320包括:龍門架321,在底座312的上方或者下方設置成能夠移動;噴氣單元322,設置於所述龍門架,並朝向安放於所述底座的封裝體噴射空氣;以及抽吸單元323,在龍門架321中與噴氣單元322相鄰設置,並抽吸從封裝體P飛散的液體。The above-mentioned drying device for removing moisture from the package P can constitute a part of the package transporting device and the semiconductor strip cutting and sorting device 10. The package transporting device for transporting individualized packages in the semiconductor strip cutting and sorting device 10 according to the embodiment of the present invention includes: a turning table 310, including a
根據本發明的實施例的半導體條帶切割及分類設備10包括:裝載單元100,裝載配置有多個封裝體的半導體條帶S;切割單元200,切割半導體條帶S並傳送單個化的半導體封裝體P;以及分類單元300,對半導體封裝體P進行乾燥及檢查並收納於托盤351、356。分類單元300包括:翻轉台310,包括安放封裝體P的底座312和用於旋轉底座312的旋轉軸313;乾燥單元320,乾燥安放於底座312的封裝體P;以及隨行夾具台341、346,從翻轉台310容納封裝體P。乾燥單元320包括:龍門架321,在底座312的上方或者下方設置成能夠移動;噴氣單元322,設置於所述龍門架,並朝向安放於所述底座的封裝體噴射空氣;以及抽吸單元323,在龍門架321中與噴氣單元322相鄰設置,並抽吸從封裝體P飛散的液體。The semiconductor strip cutting and sorting device 10 according to the embodiment of the present invention includes: a
本實施例以及本說明書中所附的附圖只不過明確表示包括在本發明中的技術構思的一部分,顯而易見由本領域技術人員能夠在包括在本發明的說明書以及附圖中的技術構思的範圍內容易導出的變形例和具體實施例均包括在本發明的申請專利範圍中。This embodiment and the drawings attached in this specification only clearly indicate a part of the technical concept included in the present invention. It is obvious that the variants and specific embodiments that can be easily derived by technical personnel in this field within the scope of the technical concept included in the specification and drawings of the present invention are all included in the patent application scope of the present invention.
因此,本發明的構思不應局限於所說明的實施例,不僅是所附的申請專利範圍,與其申請專利範圍等同或等價變形的所有構思屬於本發明構思的範疇。Therefore, the concept of the present invention should not be limited to the described embodiments, but should be within the scope of the attached patent application. All concepts that are equivalent to or equivalently modified to the scope of the patent application belong to the scope of the concept of the present invention.
100:裝載單元
200:切割單元
205:臨時保管單元
210:條帶拾取器
220:封裝體拾取器
230:導架
240:卡盤
250:切刀
260:清洗單元
300:分類單元
310:翻轉台
311:週邊架
312:底座
312A:安放部
312B:凸出部
313:旋轉軸
320:乾燥單元
321:龍門架
322:噴氣單元
323:抽吸單元
324:移動體
325:第一連接部件
326:第二連接部件
330B:球檢查單元
330M:標記檢查單元
340:第一隨行夾具驅動部件
341:第一隨行夾具台
345:第二隨行夾具驅動部件
346:第二隨行夾具台
350:第一搬出托盤驅動部件
351:第一搬出托盤
352:第二搬出托盤
355:搬出托盤驅動部件
356:第二搬出托盤
360:檢查部
370:分揀拾取器
380:分揀拾取器驅動部件
800:分類部
3121:吸附板
3122:底座板
P:半導體封裝體
S:半導體條帶
100: Loading unit
200: Cutting unit
205: Temporary storage unit
210: Strip picker
220: Package picker
230: Guide frame
240: Chuck
250: Cutter
260: Cleaning unit
300: Sorting unit
310: Turntable
311: Peripheral frame
312:
圖1示出根據本發明的實施例的半導體條帶切割及分類設備的概要結構。FIG. 1 shows a schematic structure of a semiconductor strip cutting and sorting apparatus according to an embodiment of the present invention.
圖2以及圖3示出抽吸有封裝體的狀態的翻轉台。FIG. 2 and FIG. 3 show the turning table in a state where the package is sucked.
圖4示出通過噴射空氣去除封裝體的水汽的過程。FIG. 4 shows the process of removing moisture from a package by spraying air.
圖5至圖8示出根據本發明的實施例的安放有封裝體的底座。5 to 8 show a base on which a package is placed according to an embodiment of the present invention.
圖9示出根據本發明的一實施例的用於乾燥封裝體的乾燥單元的結構。FIG. 9 shows the structure of a drying unit for drying a package according to an embodiment of the present invention.
圖10示出根據本發明的另一實施例的用於乾燥封裝體的乾燥單元的結構。FIG. 10 shows the structure of a drying unit for drying a package according to another embodiment of the present invention.
(無)(without)
312A:安放部 312A: Placement Department
312B:凸出部 312B: protrusion
321:龍門架 321: Gantry
322:噴氣單元 322: Jet unit
323:抽吸單元 323: Suction unit
324:移動體 324: Mobile body
325:第一連接部件 325: First connecting component
326:第二連接部件 326: Second connecting component
P:半導體封裝體 P:Semiconductor package
Claims (11)
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KR1020200155932A KR102610004B1 (en) | 2020-11-19 | 2020-11-19 | Apparatus for drying package in semiconductor strip sawing and sorting equipment |
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KR (1) | KR102610004B1 (en) |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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TW200913025A (en) * | 2007-05-23 | 2009-03-16 | Semes Co Ltd | Apparatus and method for drying substrates |
CN209631736U (en) * | 2018-10-17 | 2019-11-15 | 大陆泰密克汽车***(上海)有限公司 | Electronic device dust-extraction unit and system |
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JP3300624B2 (en) * | 1997-01-24 | 2002-07-08 | 東京エレクトロン株式会社 | Substrate edge cleaning method |
JP2002134440A (en) * | 2000-10-27 | 2002-05-10 | Tokuyama Corp | Substrate treating method and tray used therefor |
US20030102016A1 (en) * | 2001-12-04 | 2003-06-05 | Gary Bouchard | Integrated circuit processing system |
KR100799208B1 (en) * | 2002-02-26 | 2008-01-29 | 삼성테크윈 주식회사 | Method and apparatus for inspecting and sorting semiconductor package |
JP2004111857A (en) * | 2002-09-20 | 2004-04-08 | Dainippon Screen Mfg Co Ltd | Wafer treating system |
KR101561745B1 (en) * | 2013-12-27 | 2015-10-19 | 세메스 주식회사 | Method of drying and inspecting semiconductor packages |
KR20200041501A (en) * | 2018-10-12 | 2020-04-22 | 세메스 주식회사 | Reversing module and apparatus for sorting semiconductor packages including the same |
KR102190923B1 (en) * | 2019-03-05 | 2020-12-14 | 세메스 주식회사 | Drying module for drying semiconductor packages and apparatus including the same |
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TW200913025A (en) * | 2007-05-23 | 2009-03-16 | Semes Co Ltd | Apparatus and method for drying substrates |
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