TWI837460B - Probe Manufacturing Method - Google Patents
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- TWI837460B TWI837460B TW110106026A TW110106026A TWI837460B TW I837460 B TWI837460 B TW I837460B TW 110106026 A TW110106026 A TW 110106026A TW 110106026 A TW110106026 A TW 110106026A TW I837460 B TWI837460 B TW I837460B
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- 239000000523 sample Substances 0.000 title claims abstract description 184
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- 238000000034 method Methods 0.000 claims description 15
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Abstract
本發明提供一種探針製造方法，係可應用於探針卡之產製。探針製造方法之實施係在一載板的探針導接部上透過三維列印手段直接積層生成一探針，藉此使得探針與探針導接部能緊密銜接導電，並且免除習知探針卡之導板的設置，不但大幅簡化了探針卡的結構，更可簡化探針卡的組裝作業，並有利於微型化探針卡的實施。The present invention provides a probe manufacturing method that can be applied to the production of probe cards. The probe manufacturing method is implemented by directly laminating a probe on a probe conductive part of a carrier board by means of three-dimensional printing, thereby making the probe and the probe conductive part closely connected and electrically conductive, and eliminating the need for a guide plate of a conventional probe card, which not only greatly simplifies the structure of the probe card, but also simplifies the assembly operation of the probe card, and is conducive to the implementation of a miniaturized probe card.
Description
本發明係提供一種探針的製造方法，尤指一種透過三維列印直接積層生成一探針的方法。 The present invention provides a method for manufacturing a probe, in particular a method for directly laminating a probe by three-dimensional printing.
探針卡為用來連接待測半導體與測試系統之重要元件，其主要的功能包含達成電路導通以及空間大小的適配轉換。 The probe card is an important component used to connect the semiconductor to be tested and the test system. Its main functions include achieving circuit conduction and adaptive conversion of spatial size.
請參閱第一圖所示，為習知探針卡之結構示意圖，探針卡通常會包含，載板90以及架設在載板90前端的探針組件91(又可稱為探頭)，探針組件91是透過二個平行設置的導板92穿設複數探針93而成，探針93的一端為銜接端931、另端為測試端932。
Please refer to the first figure, which is a schematic diagram of the structure of the probe card. The probe card usually includes a
載板90一面設有複數探針導接部94以供前述複數探針93的銜接端931接觸，複數探針93之間的排列通常相當密集，因此載板90內設有空間適配電路95用於進行電路配置空間的放大，使空間適配電路95能與一電路基板96進行銜接，有部分廠商亦會將電路基板96視為是探針卡的一部分，或者會將電路基板96視為是測試系統的一部分。
A plurality of
由於習知探針93是用傳統的機械加工方法製造，因此會存在著製造時的尺寸誤差，待測半導體97上的複數半導體端子971之間也可能存在著不同的高度差異，因此探針93在設計上通常會包含一個用來產生適當彈性的彎繞區段933，當探針93之測試端932觸碰到待測半導體97上的半導體端子971時，彎繞
區段933就會產生適當的彈性退縮，以使複數探針93與複數半導體端子971在接觸時，不會因為各探針93之間的長度差異、各半導體端子971之高度差異而產生無法接觸的情形。
As it is known that the
惟習知複數探針93必須進行精確排列與定位，並保持各探針93之間的間距，方可使得探針卡93進行正常運作，以進行與精密檢測。習知同時定位複數探針93的手段，如上所述是透過二個平行設置的導板92穿設複數探針93而成，在組裝上相當耗費人力與工時，甚至很容易產生組裝上的誤差，且在微小化的電路下，探針93製造時所產生的誤差，有可能會嚴重影響測量的準確度。其次，探針93與探針導接部94之間還有可能產生接觸不良的問題。而因應半導體發展的微型化，晶圓上的晶元也越來越小，或是類似Micro LED的微型半導體元件也需要透過微小尺寸、微小間距的探針卡進行測試，而微小化的大量探針93與導板92之間的組裝困難度也就越高，組裝品質也難以維持。而以上種種原因都有可能造成探針卡產生阻抗匹配不良的問題，更使得探針卡的產製成本逐漸升高。
However, it is known that the
本發明之主要目的，在於提供一種探針製造方法，以應用於探針卡的產製，不但可免除習知導板的設置，且同時能提供良好的檢測效果。為達上述目的，本發明探針製造方法，包含下列步驟：提供一載板，載板的表面具有至少一探針導接部；以及積層生成一探針，在至少一探針導接部上以導體材料進行三維列印，以在探針導接部上直接積層生成一探針。 The main purpose of the present invention is to provide a probe manufacturing method for use in the production of probe cards, which can not only avoid the setting of the conventional guide plate, but also provide good detection results. To achieve the above purpose, the probe manufacturing method of the present invention includes the following steps: providing a carrier board, the surface of the carrier board has at least one probe guide portion; and laminating a probe, performing three-dimensional printing with a conductive material on at least one probe guide portion to directly laminate a probe on the probe guide portion.
藉由在探針導接部上直接進行探針的積層生成，省去了先前技術之組裝步驟，例如先前技術需要將探針安裝在導板或類似的引導機構，過程中 還設計探針安裝時的對準步驟，而本發明不需如同先前技術進行對準步驟。此外，在積層生成探針時，還允許針對探針的不同部分採用不同的材料，並且還可以改變探針的尺寸，例如探針直徑，這具有在預定位置產生特定材料性能的優點。 By performing the layering of the probe directly on the probe guide, the assembly steps of the prior art are omitted. For example, the prior art requires the probe to be installed on a guide plate or a similar guide mechanism, and the alignment step when the probe is installed is also designed during the process. The present invention does not require the alignment step as in the prior art. In addition, when the probe is layered, different materials can be used for different parts of the probe, and the size of the probe, such as the probe diameter, can also be changed, which has the advantage of producing specific material properties at a predetermined position.
在一實施例中，三維列印為微電鍍列印。 In one embodiment, the three-dimensional printing is micro-electroplating printing.
在一實施例中，積層生成一探針的步驟還包含下列步驟：積層生成一針體，在探針導接部上積層生成一針體，且針體包含至少一個不垂直於載板的彈性區段；以及積層生成一針尖，在針體上積層生成一針尖。 In one embodiment, the step of laminating a probe further includes the following steps: laminating a needle body, laminating a needle body on the probe guide portion, and the needle body includes at least one elastic section that is not perpendicular to the carrier; and laminating a needle tip, laminating a needle tip on the needle body.
在一實施例中，針體與針尖分別採用硬度相異的導體材料所構成，針尖的硬度大於針體。 In one embodiment, the needle body and the needle tip are respectively made of conductive materials with different hardness, and the hardness of the needle tip is greater than that of the needle body.
在一實施例中，探針製造方法進一步包含下列步驟：電鍍生成表層，在探針表面進行電鍍，以使探針表面生成一表層。 In one embodiment, the probe manufacturing method further includes the following steps: electroplating to form a surface layer, electroplating is performed on the probe surface to form a surface layer on the probe surface.
在一實施例中，針體呈螺旋狀。 In one embodiment, the needle body is spiral-shaped.
在一實施例中，積層生成一探針步驟包含下列步驟：積層生成複數針體，在探針導接部上積層生成複數針體，且複數針體中之每一針體包含至少一個不垂直於載板的彈性區段；以及積層生成一針尖，在複數針體上積層生成一針尖。 In one embodiment, the step of laminating a probe comprises the following steps: laminating a plurality of needle bodies, laminating a plurality of needle bodies on the probe guide portion, and each of the plurality of needle bodies comprises at least one elastic section that is not perpendicular to the carrier; and laminating a needle tip, laminating a needle tip on the plurality of needle bodies.
在一實施例中，針體與針尖分別採用硬度相異的導體材料所構成，針尖的硬度大於針體。 In one embodiment, the needle body and the needle tip are respectively made of conductive materials with different hardness, and the hardness of the needle tip is greater than that of the needle body.
在一實施例中，探針製造方法進一步包含一電鍍步驟，在探針表面進行電鍍，以使探針表面生成一表層。 In one embodiment, the probe manufacturing method further includes an electroplating step, in which electroplating is performed on the probe surface to form a surface layer on the probe surface.
在一實施例中，針體呈螺旋狀。 In one embodiment, the needle body is spiral-shaped.
相較於先前技術，本發明藉由三維列印在探針導接部上直接積層生成探針，可免除習知導板的設置，且同時能提供良好的檢測效果，且探針與 探針導接部能產生良好且穩固的電性連接效果。其次，藉由三維列印可輕易地在同一載板上直積層生成各種不同長度、間距、大小或造型的探針，使得同一探針卡上具二種或兩種以上的探針，而發揮最更佳的檢測效果。再者，三維列印的技術之最小積層生厚度成已達0.2μm，並且可以積層累積厚度成型1000μm以上的物件，因此透過三維列印直接積層生成探針時，會具有高精度、低誤差的優點。除此之外，因應半導體高速測試中容易產生阻抗不匹配的問題，透過本發明的實施，可提供相較於先前技術更短距、更微距且結構更為穩固的探針，以改善阻抗不匹配的問題，以應用於各種需要進行高速測試的半導體產業。 Compared with the prior art, the present invention directly generates the probe by three-dimensional printing on the probe guide part, which can avoid the need for the known guide plate and provide good detection effect at the same time. The probe and the probe guide part can produce good and stable electrical connection effect. Secondly, three-dimensional printing can easily generate probes of different lengths, spacings, sizes or shapes on the same carrier, so that the same probe card has two or more probes, and the best detection effect is achieved. Furthermore, the minimum layer thickness of the three-dimensional printing technology has reached 0.2μm, and the objects with a cumulative thickness of more than 1000μm can be formed by layering. Therefore, when the probe is directly generated by three-dimensional printing, it has the advantages of high precision and low error. In addition, in response to the problem of impedance mismatch that is easily generated during high-speed semiconductor testing, the implementation of the present invention can provide a probe with a shorter distance, finer distance and more stable structure than the previous technology to improve the impedance mismatch problem, so as to be applied to various semiconductor industries that require high-speed testing.
10:載板 10: Carrier board
11:探針導接部 11: Probe guide part
20:探針 20: Probe
21:針體 21: Needle body
21a:彈性區段 21a: Elastic section
21b:底座 21b: Base
22:針尖 22: Needle tip
30:表層 30: Surface layer
90:載板 90: Carrier board
91:探針組件 91: Probe assembly
92:導板 92: Guide plate
93:探針 93:Probe
931:銜接端 931:Connection terminal
932:測試端 932: Test terminal
933:彎繞區段 933: Bend section
94:探針導接部 94: Probe guide part
95:空間適配電路 95: Space adaptation circuit
96:電路基板 96: Circuit board
97:待測半導體 97: Semiconductor to be tested
971:半導體端子 971:Semiconductor terminal
第一圖為習知探針卡結構示意圖。 The first picture is a schematic diagram of the learning probe card structure.
第二圖為本發明第一實施例之探針製造方法示意圖。 The second figure is a schematic diagram of the probe manufacturing method of the first embodiment of the present invention.
第三圖為本發明第一實施例之積層生成一探針步驟示意圖。 The third figure is a schematic diagram of the step of generating a probe by layering in the first embodiment of the present invention.
第四圖為本發明第一實施例之探針剖視圖。 The fourth figure is a cross-sectional view of the probe of the first embodiment of the present invention.
第五圖為本發明第一實施例之探針陣列示意圖。 Figure 5 is a schematic diagram of the probe array of the first embodiment of the present invention.
第六圖為本發明第一實施例應用於探針卡示意圖。 Figure 6 is a schematic diagram of the first embodiment of the present invention applied to a probe card.
第七圖為本發明第一實施例之探針造型變化示意圖(一)。 Figure 7 is a schematic diagram of the probe shape change of the first embodiment of the present invention (I).
第八圖為本發明第一實施例之探針造型變化示意圖(二)。 Figure 8 is a schematic diagram of the probe shape change of the first embodiment of the present invention (II).
第九圖為本發明第二實施例之積層生成一探針步驟示意圖。 Figure 9 is a schematic diagram of the step of generating a probe by layering in the second embodiment of the present invention.
第十圖為本發明第二實施例之探針側視圖。 Figure 10 is a side view of the probe of the second embodiment of the present invention.
第十一圖為本發明第二實施例之探針立體外觀圖。 Figure 11 is a three-dimensional external view of the probe of the second embodiment of the present invention.
第十二圖為本發明第二實施例之探針造型變化示意圖(一)。 Figure 12 is a schematic diagram of the probe shape change of the second embodiment of the present invention (I).
第十三圖為本發明第二實施例之探針造型變化示意圖(二)。 Figure 13 is a schematic diagram of the probe shape change of the second embodiment of the present invention (II).
第十四圖為本發明第三實施例之多探針實施示意圖。 Figure 14 is a schematic diagram of the multi-probe implementation of the third embodiment of the present invention.
請參閱第一圖至第三圖所示，第一實施例所示探針製造方法，包含下列步驟：步驟S1：提供一載板10，載板10的表面具有至少一探針導接部11；步驟S2：積層生成一探針20，在至少一探針導接部11上以導體材料進行三維列印，以在探針導接部11上直接積層生成一探針20；以及步驟S3：電鍍生成一表層30，在探針20表面進行電鍍，以使探針20表面生成一表層30。
Please refer to the first to third figures, the probe manufacturing method shown in the first embodiment includes the following steps: step S1: providing a
第一實施例所示之步驟S2：積層生成一探針20還進一步包含下列步驟：步驟S21：積層生成一針體21，在探針導接部11上積層生成一針體21，且針體21包含至少一個不垂直於載板10的彈性區段21a；以及步驟S22：積層生成一針尖22，在針體21上積層生成一針尖22。
The step S2 shown in the first embodiment: laminating a
請參閱第四圖所示，載板10主要的功能在於轉換適配電路之用能，以使探針20能與測試系統間接連接。而載板10除了可採用印刷電路版載板(PCB)實施之外，還可晶圓(wafer)的態樣或其他材料的態樣實施，例如多層有機載板(MLO)、多層陶瓷載板(MLC)、玻璃載板(GLASS)或矽載板(Silicon interposer)。以提供探針20生成所需的探針導接部11，並透過內部設置的轉換適配電路使探針20能間接與測試系統連接。由於探針20是直接三維列印積層生成在探針導接部11
上，因此與探針導接部11之間會充分的接觸，不會有接觸不良或接觸面積不足的問題，又實施時三維列印可採用微電鍍列印以積層生成探針20。
Please refer to the fourth figure, the main function of the
由於三維列印的技術之最小積層生厚度成已達0.2μm，並且可以積層累積厚度成型1000μm以上的物件，因此透過三維列印直接積層生成探針20時，會具有高精度、低誤差的優點。除此之外，因應半導體高速測試中容易產生阻抗不匹配的問題，透過本發明的實施，可提供相較於先前技術更短距、更微距且結構更為穩固的探針20，以改善阻抗不匹配的問題，以應用於各種需要進行高速測試的半導體產業。
Since the minimum layering thickness of 3D printing technology has reached 0.2μm, and objects with a layered thickness of more than 1000μm can be formed, the
實施時，針體21與針尖22可分別採用硬度相異的導體材料三維列印而成，使針尖22的硬度大於針體，此目的在於使提供針體21較佳的彈性力，而提供針尖22較佳的耐磨、抗變形力。其次。前述步驟S3用於電鍍生成表層30的材料，係採用優於步驟S2積層生成一探針20時所使用的導體材料者。例如：探針2可由鎳或鎳合金所構成，針體21與針尖22的差異可由鎳含量或鎳合金之混合種類進行硬度調整，而表層30可為金、鉑、鈀、銠、石墨烯或其他良導體等材料所構成。(表層30位於以探針20的表面，以下說明係省略表層30之標示，以免造成各元件符號標示之誤解。)
In practice, the
請參閱第五圖及第六圖所示，由於三維列印具有高精密以及直接成型的優點，因此非常適合進行微小化、高密度、大數量的重複積層生成加工，可輕易的完成複數探針20的生成並且直接排列成所需要的陣列形式，以與待測半導體40之半導體端子41對應；當複數探針20直接在載板10的各探針導接部11上進行三維列印完成時，即同時完成了將所有探針20固定在載板10上的作業，可
免除先前技術所述，需要進行先前技術之探針93與導板92的安裝作業(有如第一圖所示)，因此可以大幅的降低產製成本。
Please refer to the fifth and sixth figures. As three-dimensional printing has the advantages of high precision and direct molding, it is very suitable for miniaturization, high density, and large-scale repeated lamination processing. It can easily complete the generation of
請參閱第七圖所示者，係為依照第一實施例所示之方法所產製的探針20，第七圖所示的探針20與第四圖所示的探針20具有相異之造型，其針體21積層生成於探針導接部11，針體21之底端具有一底座21b，底座21b的上方斜向延伸有一彈性區段21a，針尖22積層生成於彈性區段21a的端部，藉以透過底座21b與探針導接部11之間產生較佳的銜接面積。
Please refer to the seventh figure, which is a
請參閱第八圖所示者，係為另一依照第一實施例所示之方法所產製的探針20，第八圖所示的探針20與第四圖所示的探針20具有相異之造型，其針體21積層生成於探針導接部11，彈性區段21a呈螺旋狀且涵蓋整個針體21，針尖22積層生成於針體21的端部，以透過螺旋狀的彈性區段21a產生較佳的彈性效果。
Please refer to the eighth figure, which is another
請參閱第九圖至第十一圖所示，係為本發明第二實施例之積層生成一探針步驟示意圖，第二實施例同樣包含第二圖所示之步驟S1、步驟S2以及步驟S3，第二實施與第一實施例不同之處在於，積層生成一探針步驟時包含下列步驟：步驟S23：積層生成複數針體21，在探針導接部11上積層生成複數針體21，且複數針體21中之每一針體21包含至少一個不垂直於載板10的彈性區段21a；以及步驟24：積層生成一針尖22，在複數針體21上積層生成一針尖22。
Please refer to Figures 9 to 11, which are schematic diagrams of the step of laminating a probe of the second embodiment of the present invention. The second embodiment also includes step S1, step S2 and step S3 shown in the second figure. The second embodiment is different from the first embodiment in that the step of laminating a probe includes the following steps: Step S23: Laminating a plurality of
積層生成複數針體21呈現S形的造型以產生多個彈性區段21a，且可與探針導接部11之間形成多個銜接區域而增強結構應力，並且還可提升整體導電效果，在複數針體21上積層生成一針尖22可使複數針體21被其中固定，當針
尖22進行檢測而受力時，可將壓力均勻的分散至各針體21，而各針體21又能提供針尖22退縮的彈性力，藉此使得探針20更為堅固耐用，而又兼具良好的檢測效果。此種探針20所呈現的結構與功效，是無法由傳統方法所製造，此第二實施例更可證明本發明在探針導接部11上直接以導體材料進行三維列印積層生成探針20的技術，所能夠提供結構變化更複雜、設計更為細膩的探針20。
The plurality of
請參閱第十二圖所示者，係為依照第二實施例所示之方法所產製的探針20，第十二圖所示的探針20與第十圖所示的探針20具有相異之造型，其複數針體21積層生成於探針導接部11，彈性區段21a略呈螺旋狀且涵蓋整個針體21，針尖22積層生成於複數針體21的端部，以透過螺旋狀的彈性區段21a產生較佳的彈性效果。
Please refer to the twelfth figure, which is a
請參閱第十三圖所示者，係為依照第二實施例所示之方法所產製的探針20，第十三圖所示的探針20與第十二圖所示的探針20具有相異之造型，其，彈性區段21a略呈螺旋狀且涵蓋整個針體21，主要差異在於針體21的長度以及、彈性區段21a之螺旋態樣有所不同，使得積層生成於複數針體21端部的針尖22位置產生變化，而使探針20整體的長度不同，且彈性區段21a的傾斜角度不同也會使得彈性效果產生明顯的變化。
Please refer to the thirteenth figure, which is a
請參閱第十四圖所示，圖中所示之第三實施例，是在同一載板10上直積層生成各種不同長度、間距、大小或造型的探針20。相較於一般以複數單一長度、單一大小或單一形狀之探針20進行陣列組合的實施方式，本實施例能達成先前技術所不能偵測者，先前技術在某些情況下已不足以應付檢測之需求，例如待測半導體物40表面之複數半導體端子41之間呈現非相同高度之排列，或是非相同間距之排列，又或是因應不同高度端子特性需要採用不同大小或造
型之探針20時，可透過第三實施例所示之實施方式，解決在同一載板10上直積層生成各種不同長度、間距、大小或造型的探針20，使得同一載板10上具二種或兩種以上的探針20，而發揮最更佳的檢測效果。
Please refer to FIG. 14 , which shows a third embodiment in which probes 20 of various lengths, spacings, sizes or shapes are formed by direct layering on the
以上所述，僅為舉例說明本發明的較佳實施方式，並非以此限定實施的範圍，凡是依本發明申請專利範圍及專利說明書內容所作的簡單置換及等效變化，皆屬本發明之專利申請範疇。 The above is only an example to illustrate the preferred implementation of the present invention, and is not intended to limit the scope of implementation. All simple substitutions and equivalent changes made according to the scope of the patent application of the present invention and the content of the patent specification are within the scope of the patent application of the present invention.
10:載板 10: Carrier board
11:探針導接部 11: Probe guide part
20:探針 20: Probe
21:針體 21: Needle body
21a:彈性區段 21a: Elastic section
22:針尖 22: Needle tip
30:表層 30: Surface layer
Claims (10)
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| TW110106026A TWI837460B (en) | 2021-02-22 | Probe Manufacturing Method |
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| Application Number | Priority Date | Filing Date | Title |
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| TW110106026A TWI837460B (en) | 2021-02-22 | Probe Manufacturing Method |
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| TW202234074A TW202234074A (en) | 2022-09-01 |
| TWI837460B true TWI837460B (en) | 2024-04-01 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021023744A1 (en) | 2019-08-07 | 2021-02-11 | Technoprobe S.P.A. | Manufacturing method for manufacturing contact probes for probe heads of electronic devices and corresponding contact probe |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2021023744A1 (en) | 2019-08-07 | 2021-02-11 | Technoprobe S.P.A. | Manufacturing method for manufacturing contact probes for probe heads of electronic devices and corresponding contact probe |
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