TWI831660B - Liquid immersion cooling circulation system and liquid immersion cooling chassis - Google Patents
Liquid immersion cooling circulation system and liquid immersion cooling chassis Download PDFInfo
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- 239000007788 liquid Substances 0.000 title claims abstract description 136
- 238000001816 cooling Methods 0.000 title claims abstract description 111
- 238000007654 immersion Methods 0.000 title abstract description 8
- 239000002826 coolant Substances 0.000 claims abstract description 130
- 230000017525 heat dissipation Effects 0.000 claims description 79
- 238000010438 heat treatment Methods 0.000 claims description 42
- 239000000110 cooling liquid Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 239000012809 cooling fluid Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 238000005265 energy consumption Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
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Abstract
Description
本申請涉及電子設備散熱技術領域，尤其涉及一種浸沒式液冷循環系統及浸沒式液冷機櫃。 This application relates to the field of electronic equipment heat dissipation technology, and in particular to an immersed liquid cooling circulation system and an immersed liquid cooling cabinet.
先前的伺服器系統中，散熱問題越來越重要，故已經發展出把整台伺服器浸於液體裡迴圈冷卻的技術。在實際應用中，每個伺服器上通常設有複數個電子元件，這些電子元件各自的發熱量不同，對散熱的需求亦不同，而冷卻液均勻流過主發熱元件以及普通元件，會導致對主發熱元件的散熱需求供給不足，普通元件則存在一定的浪費。因此，優化關鍵部件的熱傳導將對節能產生積極影響。 In previous server systems, heat dissipation issues have become more and more important, so technology has been developed to immerse the entire server in liquid for loop cooling. In practical applications, each server is usually equipped with a plurality of electronic components. Each of these electronic components generates different amounts of heat and has different requirements for heat dissipation. The coolant flows evenly through the main heating components and ordinary components, which will lead to The heat dissipation demand of the main heating element is insufficient, and there is a certain waste of ordinary components. Therefore, optimizing heat transfer in critical components will have a positive impact on energy savings.
鑒於以上內容，有必要提出一種浸沒式液冷循環系統，以解決對主發熱元件的散熱需求供給不足，以及冷卻液的利用率較低的技術問題。 In view of the above, it is necessary to propose an immersed liquid cooling circulation system to solve the technical problems of insufficient supply of heat dissipation demand for the main heating element and low utilization rate of coolant.
本申請實施例提供一種浸沒式液冷循環系統，用於電子設備的散熱，該浸沒式液冷循環系統包括冷卻槽、冷卻回路、熱交換器、分液器以及冷卻液泵，冷卻槽用於容納冷卻液以及複數個電子設備，冷卻槽於靠近底部設有進液口，並於靠近頂部設有出液口，電子設備上設有主發熱元件以及普通元件，冷 卻回路包括供液管路、回流管路與散熱支路，供液管路與回流管路設於冷卻槽外部，供液管路連接於進液口，回流管路連接於出液口，散熱支路設於冷卻槽中，且每個散熱支路連接於一個主發熱元件，熱交換器設於冷卻回路上，並設於供液管路與回流管路連接處，分液器設於供液管路與散熱支路之間，分液器上設有與散熱支路一一對應的分液口，分液口連接於對應的散熱支路並將冷卻液從供液管路供應至散熱支路，冷卻液泵設於冷卻回路上，並控制流過散熱支路的冷卻液流速高於冷卻槽中其他冷卻液的流速。 Embodiments of the present application provide an immersed liquid cooling circulation system for heat dissipation of electronic equipment. The immersed liquid cooling circulation system includes a cooling tank, a cooling circuit, a heat exchanger, a liquid distributor and a cooling liquid pump. The cooling tank is used for It contains coolant and multiple electronic devices. The cooling tank is equipped with a liquid inlet near the bottom and a liquid outlet near the top. The electronic devices are equipped with main heating components and ordinary components. The cooling circuit includes a liquid supply pipeline, a return pipeline and a heat dissipation branch. The liquid supply pipeline and the return pipeline are located outside the cooling tank. The liquid supply pipeline is connected to the liquid inlet, and the return pipeline is connected to the liquid outlet for heat dissipation. The branch circuits are located in the cooling tank, and each heat dissipation branch circuit is connected to a main heating element. The heat exchanger is located on the cooling circuit and at the connection between the liquid supply pipeline and the return pipeline. The liquid distributor is located at the supply pipe. Between the liquid pipeline and the heat dissipation branch, the liquid distributor is provided with a liquid dispensing port corresponding to the heat dissipation branch. The liquid dispensing port is connected to the corresponding heat dissipation branch and supplies coolant from the liquid supply pipe to the heat dissipation branch. branch, the coolant pump is located on the cooling circuit, and controls the flow rate of the coolant flowing through the heat dissipation branch to be higher than the flow rate of other coolants in the cooling tank.
在其他實施例中，供液管路包括專用管路與普通管路，專用管路藉由進液口連接於分液器，用於為散熱支路供應冷卻液，普通管路藉由進液口連接於冷卻槽，用於為冷卻槽供應冷卻液。 In other embodiments, the liquid supply pipeline includes a dedicated pipeline and an ordinary pipeline. The dedicated pipeline is connected to the liquid distributor through a liquid inlet and is used to supply cooling liquid to the heat dissipation branch. The ordinary pipeline is connected through a liquid inlet. The port is connected to the cooling tank and is used to supply coolant to the cooling tank.
在其他實施例中，冷卻液泵包括第一冷卻液泵與第二冷卻液泵，第一冷卻液泵連接於專用管路，第二冷卻液泵連接於普通管路，第一冷卻液泵所控制的流過專用管路的冷卻液流速大於第二冷卻液泵所控制的流過普通管路的冷卻液流速。 In other embodiments, the coolant pump includes a first coolant pump and a second coolant pump. The first coolant pump is connected to a dedicated pipeline, and the second coolant pump is connected to a common pipeline. The first coolant pump is connected to a common pipeline. The controlled coolant flow rate flowing through the special pipeline is greater than the coolant flow rate controlled by the second coolant pump flowing through the common pipeline.
在其他實施例中，冷卻液泵包括第三冷卻液泵及與分液口一一對應的複數個第四冷卻液泵，第三冷卻液泵連接於回流管路，每個第四冷卻液泵連接於一個分液口，用於將冷卻液供應至散熱支路，第三冷卻液泵與第四冷卻液泵協同控制流過散熱支路的冷卻液流速大於流過普通管路的冷卻液流速。 In other embodiments, the coolant pump includes a third coolant pump and a plurality of fourth coolant pumps corresponding to the liquid distribution port. The third coolant pump is connected to the return line, and each fourth coolant pump Connected to a liquid distribution port for supplying coolant to the heat dissipation branch, the third coolant pump and the fourth coolant pump cooperate to control the coolant flow rate flowing through the heat dissipation branch to be greater than the coolant flow rate flowing through the ordinary pipeline. .
在其他實施例中，電子設備上設有複數個主發熱元件，浸沒式液冷循環系統還包括設置於每個主發熱元件上的散熱片，複數個散熱片藉由散熱支路串聯連接。 In other embodiments, the electronic device is provided with a plurality of main heating elements, and the immersed liquid cooling circulation system further includes a heat sink disposed on each main heating element, and the plurality of heat sinks are connected in series through a heat dissipation branch.
在其他實施例中，複數個散熱片藉由散熱支路並聯連接，並連接至同一個分液口。 In other embodiments, multiple heat sinks are connected in parallel through heat dissipation branches and connected to the same liquid dispensing port.
在其他實施例中，每個散熱片藉由散熱支路連接於一個分液口。 In other embodiments, each heat sink is connected to a liquid dispensing port through a heat dissipation branch.
在其他實施例中，普通管路的橫截面積大於專用管路的橫截面積。 In other embodiments, the cross-sectional area of the general pipeline is larger than the cross-sectional area of the dedicated pipeline.
在其他實施例中，普通管路的橫截面積大於散熱支路的橫截面積。 In other embodiments, the cross-sectional area of the common pipeline is larger than the cross-sectional area of the heat dissipation branch.
另一方面，本申請還提供一種浸沒式液冷機櫃，包括如上所述的浸沒式液冷循環系統。 On the other hand, this application also provides an immersed liquid cooling cabinet, including the immersed liquid cooling circulation system as mentioned above.
在實際使用中，電子設備上主發熱元件以及普通元件的功率不同，發熱量亦不同，主發熱元件(例如CPU與GPU等)的功率占到了電子設備總發熱量的絕大部分，使用本申請實施例所提供的浸沒式液冷循環系統對電子設備進行冷卻時，散熱支路連接於主發熱元件，冷卻液泵控制流過散熱支路的冷卻液流速高於冷卻槽中其他冷卻液的流速，即流過主發熱元件的冷卻液的流速高於流過普通元件的冷卻液的流速，改善主發熱元件的散熱效果。本申請實施例藉由採用不同流速的冷卻液對主發熱元件以及普通元件進行冷卻，有效改善主發熱元件的散熱效果，提高了冷卻液的利用率，減小了浸沒式液冷循環系統的能耗，提供了更有效的熱力解決方案。 In actual use, the power of the main heating element and the ordinary components on the electronic equipment are different, and the amount of heat generated is also different. The power of the main heating element (such as CPU and GPU, etc.) accounts for the majority of the total heat generation of the electronic equipment. Using this application When the immersed liquid cooling circulation system provided in the embodiment cools electronic equipment, the heat dissipation branch is connected to the main heating element, and the coolant pump controls the flow rate of the coolant flowing through the heat dissipation branch to be higher than the flow rate of other coolant in the cooling tank. , that is, the flow rate of the coolant flowing through the main heating element is higher than the flow rate of the coolant flowing through the ordinary element, thereby improving the heat dissipation effect of the main heating element. The embodiments of the present application use coolants with different flow rates to cool the main heating element and ordinary components, effectively improving the heat dissipation effect of the main heating element, increasing the utilization rate of the coolant, and reducing the energy consumption of the immersed liquid cooling circulation system. consumption, providing a more efficient thermal solution.
100:浸沒式液冷循環系統 100: Immersed liquid cooling circulation system
10:冷卻槽 10: Cooling tank
11:進液口 11:Liquid inlet
12:出液口 12:Liquid outlet
20:冷卻回路 20: Cooling circuit
21:供液管路 21:Liquid supply line
211:專用管路 211:Special pipeline
212:普通管路 212: Ordinary pipeline
22:回流管路 22: Return line
23:散熱支路 23:Heat dissipation branch
30:熱交換器 30:Heat exchanger
40:分液器 40:Dispenser
41:分液口 41:Dispensing port
50:冷卻液泵 50: Coolant pump
51:第一冷卻液泵 51:First coolant pump
52:第二冷卻液泵 52:Second coolant pump
53:第三冷卻液泵 53:Third coolant pump
54:第四冷卻液泵 54:Fourth coolant pump
200:電子設備 200:Electronic equipment
201:主發熱元件 201: Main heating element
202:普通元件 202: Ordinary components
300:浸沒式液冷機櫃 300:Immersed liquid cooling cabinet
圖1為本申請一實施例的浸沒式液冷循環系統的結構示意圖。 Figure 1 is a schematic structural diagram of an immersed liquid cooling circulation system according to an embodiment of the present application.
圖2為本申請另一實施例的浸沒式液冷循環系統的架構示意圖。 Figure 2 is a schematic structural diagram of an immersed liquid cooling circulation system according to another embodiment of the present application.
圖3為本申請又一實施例的浸沒式液冷循環系統的架構示意圖。 Figure 3 is a schematic structural diagram of an immersed liquid cooling circulation system according to another embodiment of the present application.
圖4為本申請再一實施例的浸沒式液冷循環系統的架構示意圖。 Figure 4 is a schematic structural diagram of an immersed liquid cooling circulation system according to yet another embodiment of the present application.
圖5為本申請一實施例的浸沒式液冷液冷機櫃的結構示意圖。 Figure 5 is a schematic structural diagram of an immersed liquid-cooling cabinet according to an embodiment of the present application.
下面詳細描述本申請的實施方式，所述實施方式的示例於附圖中示出，其中自始至終相同或類似的標號表示相同或類似的元件或具有相同或類似 功能的元件。下面藉由參考附圖描述的實施方式係示例性的，僅用於解釋本申請，而不能理解為對本申請的限制。 The embodiments of the present application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or have the same or similar elements. Functional components. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application and cannot be understood as limiting the present application.
本申請提供了一種浸沒式液冷循環系統，用於電子設備的散熱，該浸沒式液冷循環系統包括冷卻槽、冷卻回路、熱交換器、分液器以及冷卻液泵，冷卻槽用於容納冷卻液以及複數個電子設備，冷卻槽於靠近底部設有進液口，並於靠近頂部設有出液口，電子設備上設有主發熱元件以及普通元件，冷卻回路包括供液管路、回流管路與散熱支路，供液管路與回流管路設於冷卻槽外部，供液管路連接於進液口，回流管路連接於出液口，散熱支路設於冷卻槽中，且每個散熱支路連接於一個主發熱元件，熱交換器設於冷卻回路上，並設於供液管路與回流管路連接處，熱交換器設於供液管路與散熱支路之間，分液器上設有與散熱支路一一對應的分液口，分液口連接於對應的散熱支路並將冷卻液從供液管路供應至散熱支路，冷卻液泵設於冷卻回路上，並控制流過散熱支路的冷卻液流速高於冷卻槽中其他冷卻液的流速。 This application provides an immersed liquid cooling circulation system for heat dissipation of electronic equipment. The immersed liquid cooling circulation system includes a cooling tank, a cooling circuit, a heat exchanger, a liquid distributor and a coolant pump. The cooling tank is used to accommodate Coolant and a plurality of electronic equipment. The cooling tank is equipped with a liquid inlet near the bottom and a liquid outlet near the top. The electronic equipment is equipped with main heating components and ordinary components. The cooling circuit includes a liquid supply pipeline and a return flow. The pipeline and heat dissipation branch, the liquid supply pipeline and the return pipeline are located outside the cooling tank, the liquid supply pipeline is connected to the liquid inlet, the return pipeline is connected to the liquid outlet, the heat dissipation branch is located in the cooling tank, and Each heat dissipation branch is connected to a main heating element. The heat exchanger is located on the cooling circuit and at the connection between the liquid supply pipe and the return pipe. The heat exchanger is located between the liquid supply pipe and the heat dissipation branch. , the liquid distributor is equipped with a liquid dispensing port corresponding to the heat dissipation branch. The liquid dispensing port is connected to the corresponding heat dissipation branch and supplies coolant from the liquid supply pipeline to the heat dissipation branch. The coolant pump is located in the cooling loop, and control the flow rate of the coolant flowing through the cooling branch to be higher than the flow rate of other coolant in the cooling tank.
本申請所提供的浸沒式液冷循環系統藉由採用不同流速的冷卻液對主發熱元件以及普通元件進行冷卻，有效改善主發熱元件的散熱效果，提高了冷卻液的利用率，減小了浸沒式液冷循環系統的能耗，提供了更有效的熱力解決方案。 The immersed liquid cooling circulation system provided by this application effectively improves the heat dissipation effect of the main heating element by using coolant with different flow rates to cool the main heating element and ordinary components, improves the utilization rate of the coolant, and reduces the risk of immersion The energy consumption of the liquid cooling circulation system is reduced, providing a more effective thermal solution.
以下將結合附圖對本申請的一些實施方式作詳細說明。 Some embodiments of the present application will be described in detail below with reference to the accompanying drawings.
請參閱圖1，圖1示出了本申請一個實施例的浸沒式液冷循環系統100，用於電子設備200的散熱，該浸沒式液冷循環系統100包括冷卻槽10、冷卻回路20、熱交換器30、分液器40、與冷卻液泵50，具體地，如圖1與圖2所示，冷卻槽10用於容納冷卻液以及複數個電子設備200，冷卻槽10於靠近底部設有進液口11，並於靠近頂部設有出液口12，電子設備200上設有主發熱元件201以及普通元件202；冷卻回路20包括供液管路21、回流管路22與散熱支路23，供液管路21
與回流管路22設於冷卻槽10外部，供液管路21連接於進液口11，回流管路22連接於出液口12，散熱支路23設於冷卻槽10中，且每個散熱支路23連接於一個主發熱元件201；熱交換器30設於冷卻回路20上供液管路21與回流管路22的連接處；分液器40設於供液管路21與散熱支路23之間，分液器40上設有與散熱支路23一一對應的分液口41，分液口41連接於對應的散熱支路23並將冷卻液從供液管路21供應至各個散熱支路23，進而用於冷卻各個主發熱元件201；冷卻液泵50設於冷卻回路20上，並控制流過散熱支路23的冷卻液流速高於冷卻槽10中其他冷卻液的流速。
Please refer to Figure 1. Figure 1 shows an immersed liquid
在實際使用中，電子設備200上主發熱元件201以及普通元件202的功率不同，發熱量亦不同，主發熱元件201(例如CPU與GPU等)的功率可能占到電子設備200總發熱量的60%左右，使用本實施例所提供的浸沒式液冷循環系統100對電子設備200進行冷卻時，散熱支路23連接於主發熱元件201，冷卻液泵50控制流過散熱支路23的冷卻液流速高於冷卻槽10中其他冷卻液的流速，即流過主發熱元件201的冷卻液的流速高於流過普通元件202的冷卻液的流速，改善主發熱元件201的散熱效果。本實施例藉由採用不同流速的冷卻液對主發熱元件201以及普通元件202進行冷卻，有效改善主發熱元件201的散熱效果，提高了冷卻液的利用率，減小了浸沒式液冷循環系統100的能耗，提供了更有效的熱力解決方案。
In actual use, the power of the
在其他實施例中，如圖2所示，供液管路21包括專用管路211與普通管路212，專用管路211藉由進液口11連接於分液器40，用於為散熱支路23供應冷卻液，普通管路212藉由進液口11連接於冷卻槽10，用於為冷卻槽10供應冷卻液。
In other embodiments, as shown in FIG. 2 , the
如此，普通管路212中的冷卻液直接流入冷卻槽10，專用管路211中的冷卻液流入散熱支路23，從而確保散熱支路23中的冷卻液流速，改善主發熱元件201的散熱。
In this way, the coolant in the
在其他實施例中，如圖3所示，冷卻液泵50包括第一冷卻液泵51與第二冷卻液泵52，第一冷卻液泵51連接於專用管路211，第二冷卻液泵52連接於普通管路212，第一冷卻液泵51與第二冷卻液泵52控制流過專用管路211的冷卻液流速大於流過普通管路212的冷卻液流速。
In other embodiments, as shown in FIG. 3 , the
如此，藉由為專用管路211與普通管路212分別設置第一冷卻液泵51與第二冷卻液泵52，能夠控制專用管路211與普通管路212中的冷卻液流速，進而確保散熱支路23中的冷卻液流速高於冷卻槽10中的冷卻液流速，實現對流過主發熱元件201與普通元件202的冷卻液流速的分別控制。
In this way, by providing the first coolant pump 51 and the
在其他實施例中，如圖4所示，冷卻液泵50包括第三冷卻液泵53及與分液口41一一對應的複數個第四冷卻液泵54，第三冷卻液泵53連接於回流管路22，每個第四冷卻液泵54連接於一個分液口41，用於將冷卻液供應至散熱支路23，第三冷卻液泵53與第四冷卻液泵54控制流過散熱支路的冷卻液流速大於冷卻槽10中的冷卻液流速。
In other embodiments, as shown in FIG. 4 , the
如此，藉由為專用管路211與普通管路212分別設置第三冷卻液泵53與第四冷卻液泵54，能夠直接控制普通管路212與散熱支路23中的冷卻液流速，進而確保散熱支路23中的冷卻液流速高於冷卻槽10中的冷卻液流速，實現對流過主發熱元件201與普通元件202的冷卻液流速的分別控制。
In this way, by providing the
在其他實施例中，電子設備200上設有複數個主發熱元件201，浸沒式液冷循環系統100還包括設置於每個主發熱元件201上的散熱片203，複數個散熱片203藉由散熱支路23串聯連接。
In other embodiments, the
在其他實施例中，複數個散熱片203藉由散熱支路23並聯連接，並連接至同一個分液口41。
In other embodiments, a plurality of heat sinks 203 are connected in parallel through the
在其他實施例中，每個散熱片203藉由一個散熱支路23連接於一個分液口41。
In other embodiments, each heat sink 203 is connected to a
在其他實施例中，普通管路212的橫截面積大於專用管路211的橫截面積。
In other embodiments, the cross-sectional area of the
如此，無需對冷卻液泵50進行額外設置，即可確保普通管路212中的冷卻液流速小於專用管路211中的冷卻液流速。
In this way, it is possible to ensure that the coolant flow rate in the
在其他實施例中，普通管路212的橫截面積大於散熱支路23的橫截面積。
In other embodiments, the cross-sectional area of the
如此，無需對冷卻液泵50進行額外設置，即可確保散熱支路23中的冷卻液流速小於專用管路211中的冷卻液流速。
In this way, it is possible to ensure that the coolant flow rate in the
在其他實施例中，每個分液口41處設有一個快接頭，用於與對應的散熱支路23連接。如此，在更換冷卻槽10中的電子設備200時，能夠將散熱支路23與分液器40快速地斷開或連接起來。
In other embodiments, each liquid dispensing
在其他實施例中，如圖5所示，本申請還提供一種浸沒式液冷機櫃300，包括如上文所述的浸沒式液冷循環系統。
In other embodiments, as shown in Figure 5, the present application also provides an immersed
最後應說明的是，以上實施例僅用以說明本申請的技術方案而非限制，儘管參照較佳實施例對本申請進行了詳細說明，本領域的普通技術人員應當理解，可對本申請的技術方案進行修改或等同替換，而不脫離本申請技術方案的精神與範圍。 Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified. Modifications or equivalent substitutions may be made without departing from the spirit and scope of the technical solution of the present application.
100:浸沒式液冷循環系統 100: Immersed liquid cooling circulation system
200:電子設備 200:Electronic equipment
10:冷卻槽 10: Cooling tank
11:進液口 11:Liquid inlet
12:出液口 12:Liquid outlet
20:冷卻回路 20: Cooling circuit
30:熱交換器 30:Heat exchanger
40:分液器 40:Dispenser
50:冷卻液泵 50: Coolant pump
Claims (7)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112112024A TWI831660B (en) | 2023-03-29 | 2023-03-29 | Liquid immersion cooling circulation system and liquid immersion cooling chassis |
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| Application Number | Priority Date | Filing Date | Title |
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| TW112112024A TWI831660B (en) | 2023-03-29 | 2023-03-29 | Liquid immersion cooling circulation system and liquid immersion cooling chassis |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111352489A (en) * | 2020-02-29 | 2020-06-30 | 苏州浪潮智能科技有限公司 | Flowing boiling immersion type liquid cooling device |
| CN115023075A (en) * | 2022-06-02 | 2022-09-06 | 超聚变数字技术有限公司 | Computing equipment and cabinet |
| US20220322570A1 (en) * | 2021-04-01 | 2022-10-06 | Ovh | Systems and methods for autonomously activable redundant cooling of a heat generating component |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111352489A (en) * | 2020-02-29 | 2020-06-30 | 苏州浪潮智能科技有限公司 | Flowing boiling immersion type liquid cooling device |
| US20220322570A1 (en) * | 2021-04-01 | 2022-10-06 | Ovh | Systems and methods for autonomously activable redundant cooling of a heat generating component |
| CN115023075A (en) * | 2022-06-02 | 2022-09-06 | 超聚变数字技术有限公司 | Computing equipment and cabinet |
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