TWI827722B - Processing device and cassette loading mechanism - Google Patents
Processing device and cassette loading mechanism Download PDFInfo
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- TWI827722B TWI827722B TW108140132A TW108140132A TWI827722B TW I827722 B TWI827722 B TW I827722B TW 108140132 A TW108140132 A TW 108140132A TW 108140132 A TW108140132 A TW 108140132A TW I827722 B TWI827722 B TW I827722B
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- cassette
- processing device
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- placing
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- 230000007246 mechanism Effects 0.000 title claims abstract description 79
- 230000001681 protective effect Effects 0.000 claims abstract description 8
- 238000001514 detection method Methods 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract description 76
- 230000032258 transport Effects 0.000 abstract description 11
- 239000002184 metal Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
防止在晶圓單元的搬送中或晶圓的加工中，作業人員誤接觸到片匣 之情形。 Prevent workers from accidentally touching the cassette during transportation of wafer units or processing of wafers situation.
提供一種片匣載置機構，前述片匣載置機構是併設在加工板狀 的被加工物之加工裝置上，並具備：載置台，供容置被加工物的片匣載置；框架部，配置於載置台的側邊，且具有用於從載置於載置台的片匣搬送被加工物時使被加工物通過的開口部；門部，設置在框架部之與載置台為相反的相反側，且將開口部關閉；罩蓋部，設置在框架部的載置台側，且構成為可以保護載置於載置台之片匣的除了框架部側的一部分以外的側部；及升降機構，使罩蓋部在保護位置與退避位置之間升降，前述保護位置是保護片匣的除了框架部側的一部分以外的側部的位置，前述退避位置是比保護位置更下方的位置。 A film cassette placing mechanism is provided. The aforementioned film cassette placing mechanism is arranged parallel to the processing plate-shaped The processing device of the object to be processed is further provided with: a mounting table for placing a cassette containing the object to be processed; a frame part arranged on the side of the mounting platform and having a cassette for removing the cassette placed on the mounting platform. The opening allows the workpiece to pass when the cassette transports the workpiece; the door is provided on the side of the frame opposite to the placement table and closes the opening; and the cover is provided on the side of the placement table of the frame. , and is configured to protect the side parts of the film cassette placed on the mounting table except for a part of the frame part side; and a lifting mechanism to lift the cover part between a protective position and a retreat position, the aforementioned protective position being the protective sheet The retracted position is a position of the side portion of the box other than a part of the frame portion, which is a position lower than the protection position.
Description
發明領域 Field of invention
本發明是有關於一種供容置晶圓等的片匣載置之片匣載置機構。 The present invention relates to a cassette loading mechanism for placing cassettes containing wafers and the like.
發明背景 Background of the invention
於正面側形成有IC(積體電路，integrated circuit)、LSI(大型積體電路，Large Scale Integration)等器件的矽晶圓等的被加工物，在例如將背面側磨削成預定的厚度之後，是藉由切割裝置等而被分割成一個個的器件晶片。 A workpiece such as a silicon wafer with devices such as IC (integrated circuit) or LSI (Large Scale Integration) formed on the front side, after grinding the back side to a predetermined thickness, for example , which is divided into individual device wafers by a cutting device or the like.
通常，在使用磨削裝置或切割裝置等之加工裝置來加工晶圓之前，首先是形成晶圓單元。例如，在金屬製的環狀框架的開口部上配置晶圓，且將面積比環狀框架的開口部更大的圓形膠帶貼附到環狀框架與晶圓。藉此，可形成將晶圓、環狀框架及膠帶一體化而成之晶圓單元。 Generally, before processing the wafer using a processing device such as a grinding device or a cutting device, a wafer unit is first formed. For example, a wafer is placed on an opening of a metal annular frame, and a circular tape having a larger area than the opening of the annular frame is attached to the annular frame and the wafer. Thereby, a wafer unit integrating the wafer, the ring-shaped frame and the tape can be formed.
此晶圓單元是容置在可容置複數個晶圓單元的片匣內(參照例如專利文獻1)。藉由在片匣內容置複數個晶圓單元，即變得容易將複數個晶圓單元集合到一起來搬送。 This wafer unit is accommodated in a cassette that can accommodate a plurality of wafer units (see, for example, Patent Document 1). By placing a plurality of wafer units in the cassette, it becomes easy to gather the plurality of wafer units together and transport them.
於加工裝置設有用於載置此片匣的片匣載 置機構。於將片匣載置於片匣載置機構後，是藉由設置於加工裝置內的搬送單元來將各晶圓單元從片匣搬出到加工裝置內。已在加工裝置內加工晶圓後，是將晶圓單元從加工裝置內搬入到片匣。像這樣，可藉由搬送單元而在片匣與加工裝置之間搬送各晶圓單元。 The processing device is provided with a cassette carrier for carrying the cassette establishment organization. After the cassette is placed on the cassette loading mechanism, each wafer unit is moved out of the cassette into the processing device through a transport unit provided in the processing device. After the wafer has been processed in the processing device, the wafer unit is moved from the processing device to the cassette. In this manner, each wafer unit can be transported between the cassette and the processing device by the transport unit.
專利文獻1：日本專利特開2000-91411號公報 Patent Document 1: Japanese Patent Application Publication No. 2000-91411
發明概要 Summary of the invention
然而，在片匣及加工裝置之間搬送晶圓單元時、或在加工裝置內加工晶圓時，會有以下情況：因作業人員誤接觸到片匣而導致片匣移動。當片匣被移動時，通常會為了安全而停止加工裝置，並中斷晶圓單元的搬送或晶圓的加工等。 However, when the wafer unit is transported between the cassette and the processing device, or when the wafer is processed in the processing device, there may be cases where the wafer cassette moves due to an operator accidentally touching the wafer cassette. When the cassette is moved, the processing device is usually stopped for safety reasons, and transportation of the wafer unit, processing of the wafer, etc. are interrupted.
本發明是有鑒於所述的問題點而作成的發明，其目的在於防止在晶圓單元的搬送中或晶圓的加工中，作業人員誤接觸到片匣之情形。 The present invention was made in view of the above-mentioned problems, and its purpose is to prevent workers from accidentally touching the cassette during transportation of wafer units or processing of wafers.
根據本發明之一態樣，可提供一種片匣載置機構，前述片匣載置機構是併設在加工板狀的被加工物的加工裝置上，並具備： 載置台，供容置該被加工物的片匣載置；框架部，配置於該載置台的側邊，且具有從載置於該載置台的該片匣搬送該被加工物時使該被加工物通過的開口部；門部，設置在該框架部之與該載置台為相反的相反側，且將該開口部關閉；罩蓋部，設置在該框架部的該載置台側，且構成為可以保護載置於該載置台之該片匣的除了該框架部側的一部分以外的側部；及升降機構，使該罩蓋部在保護位置與退避位置之間升降，前述保護位置是保護該片匣的除了該框架部側的該一部分以外的該側部的位置，前述退避位置是比該保護位置更下方的位置。 According to one aspect of the present invention, a cassette placing mechanism can be provided. The cassette placing mechanism is provided in conjunction with a processing device for processing plate-shaped workpieces, and is provided with: The placing table is for placing the cassette containing the object to be processed; the frame part is arranged on the side of the placing platform, and has the function of allowing the object to be processed when the object is transported from the cassette placed on the placing platform. an opening through which the workpiece passes; a door part provided on the opposite side of the frame part to the mounting table and closing the opening part; and a cover part provided on the mounting table side of the frame part and constituted In order to protect the side parts of the film cassette placed on the mounting platform except for a part of the frame part side; and a lifting mechanism to lift the cover part between the protection position and the retreat position, the aforementioned protection position is the protection position. As for the position of the side portion of the film cassette except the portion on the side of the frame portion, the retracted position is a position lower than the protective position.
較佳的是，該片匣載置機構是構成為：以該罩蓋部已上升至該保護位置作為條件，來使該門部從關閉該開口部的關閉位置往打開該開口部的打開位置移動，且以該門部已從該打開位置移動至該關閉位置作為條件，來使該罩蓋部朝該退避位置下降。 Preferably, the cassette placing mechanism is configured to move the door from a closed position for closing the opening to an open position for opening the opening on the condition that the cover has risen to the protective position. Move, and on the condition that the door part has moved from the open position to the closed position, the cover part is lowered toward the retreat position.
又，較佳的是，該片匣載置機構更具備腳踏開關部，前述腳踏開關部是設置於該載置台的下方，且可以使該升降機構動作。 Furthermore, preferably, the cassette placing mechanism is further provided with a foot switch section, and the foot switch section is provided below the placing platform and can operate the lifting mechanism.
本發明的一態樣之片匣載置機構具備罩蓋部，前述罩蓋部是構成為可以保護載置在載置台之片匣的 除了框架部側的一部分以外的側部。藉此，當在片匣與加工裝置之間搬送被加工物時、或在加工裝置內加工被加工物時，可以防止作業人員誤接觸到片匣之情形。因此，可以防止加工裝置中的板狀的被加工物的加工或搬送被中斷之情形。 A cassette loading mechanism according to one aspect of the present invention includes a cover portion, and the cover portion is configured to protect the cassette placed on the loading table. The side part except part of the frame part side. Thereby, when the object to be processed is transported between the cassette and the processing device, or when the object to be processed is processed in the processing device, it is possible to prevent the operator from accidentally touching the cassette. Therefore, it is possible to prevent the processing or transportation of the plate-shaped workpiece in the processing device from being interrupted.
1:晶圓(被加工物) 1: Wafer (processed object)
2:加工裝置 2: Processing device
2a、26a:正面 2a, 26a: front
3:膠帶 3: Tape
4:監視器 4:Monitor
5:環狀框架 5: Ring frame
6:搬送臂 6:Conveying arm
8:控制部 8:Control Department
9:晶圓單元 9: Wafer unit
10:片匣載置機構 10:Cassette loading mechanism
12:基台部 12:Abutment part
12a:開口部 12a: opening
12b:踏板(腳踏開關部) 12b: Pedal (foot switch part)
14:載置台 14: Loading platform
16:罩蓋部 16: Cover part
16a:第1側面部 16a: 1st side face
16b:第2側面部 16b: 2nd side face
16c:正面部 16c: Front face
16d:上端部 16d: upper end
18:升降機構 18:Lifting mechanism
20:托架 20: Bracket
20a:第1直線部 20a: 1st linear section
20b:第2直線部 20b: 2nd linear part
20c:第3直線部 20c: 3rd linear part
20d:第1角部 20d: 1st corner
20e:第2角部 20e: 2nd corner
22a、22b:無桿氣缸 22a, 22b: Rodless cylinder
24a、24b:主體部 24a, 24b: Main part
24c、24d:壓缸管 24c, 24d: Press cylinder tube
24e、24f:基部 24e, 24f: base
24g、24h:滑件 24g, 24h: sliding parts
24i、24j:導軌 24i, 24j: guide rail
26:框架部 26:Frame Department
26b:背面 26b: Back
26c:開口部 26c: opening
26d:腳輪 26d: casters
28:門部 28:Department
30:片匣 30: film box
32a:第1側面部 32a: 1st side face
32b:第2側面部 32b: 2nd side face
32c:連接部 32c:Connection part
32d:把手 32d: handle
32e:架板 32e: Shelves
32f:卡止部側 32f:Latching part side
32g:搬出入部側 32g: Moving in and out side
40:發光元件 40:Light-emitting components
42:受光元件 42:Light-receiving element
A:區域 A:Region
L:光 L:Light
X、Y、Z:方向 X, Y, Z: direction
S10、S20、S30、S40、S50:階段 S10, S20, S30, S40, S50: stages
圖1是第1實施形態之加工裝置及片匣載置機構的立體圖。 Fig. 1 is a perspective view of the processing device and the cassette placing mechanism of the first embodiment.
圖2是罩蓋部及移動機構的立體圖。 Fig. 2 is a perspective view of the cover part and the moving mechanism.
圖3是將圖2之區域A放大的局部截面側視圖。 FIG. 3 is an enlarged partial cross-sectional side view of area A in FIG. 2 .
圖4是顯示搬送作業中的情形的立體圖。 FIG. 4 is a perspective view showing the situation during transportation work.
圖5是顯示加工及搬送作業結束後之情形的立體圖。 FIG. 5 is a perspective view showing the situation after completion of processing and transportation operations.
圖6(A)是顯示將片匣載置在載置台之階段S10的圖，圖6(B)是顯示使罩蓋部上升到保護位置之階段S20的圖，圖6(C)是顯示在使門部移動至打開位置後，進行搬送及加工作業之階段S30的圖，圖6(D)是顯示使門部移動至關閉位置之階段S40的圖，圖6(E)是顯示使罩蓋部下降到退避位置之階段S50的圖。 FIG. 6(A) is a diagram showing the step S10 of placing the film cassette on the mounting table. FIG. 6(B) is a diagram showing the step S20 of raising the cover part to the protection position. FIG. 6(C) is a diagram showing the step S10 of placing the film cassette on the mounting table. After moving the door to the open position, the diagram shows the step S30 of carrying out transportation and processing operations. Figure 6(D) is a diagram showing the step S40 of moving the door to the closed position. Figure 6(E) shows the step of moving the cover. Picture of stage S50 when the robot descends to the retreat position.
圖7是第2實施形態之加工裝置及片匣載置機構的立體圖。 7 is a perspective view of the processing device and the cassette placing mechanism of the second embodiment.
圖8是第3實施形態之腳踏開關部的立體圖。 Fig. 8 is a perspective view of the foot switch unit of the third embodiment.
用以實施發明之形態 Form for carrying out the invention
參照附加圖式，說明本發明的一個態樣之實施形態。 圖1是第1實施形態之加工裝置2及片匣載置機構10的立體圖。加工裝置2是用於加工被加工物之裝置，可為例如對被加工物照射雷射光束之雷射加工裝置、切割被加工物之切割裝置、磨削被加工物之磨削裝置、或是研磨被加工物之研磨裝置。 An embodiment of one aspect of the present invention will be described with reference to the attached drawings. FIG. 1 is a perspective view of the processing device 2 and the cassette placing mechanism 10 of the first embodiment. The processing device 2 is a device for processing the workpiece, and may be, for example, a laser processing device that irradiates the workpiece with a laser beam, a cutting device that cuts the workpiece, a grinding device that grinds the workpiece, or A grinding device for grinding the workpiece.
加工裝置2具有以金屬等所形成的殼體，且在此殼體的正面2a配置有觸控面板式的監視器4。監視器4是兼作為作業人員對加工裝置2輸入指示的輸入裝置、及顯示被加工物的圖像、加工條件、加工結果等的顯示裝置。 The processing device 2 has a casing made of metal or the like, and a touch panel monitor 4 is arranged on the front surface 2 a of the casing. The monitor 4 serves both as an input device for the operator to input instructions to the processing device 2 and as a display device for displaying images of the workpiece, processing conditions, processing results, and the like.
例如，作業人員可以藉由觸碰顯示於監視器4的按鈕等，而透過監視器4對加工裝置2設定加工條件。又，可在監視器4上顯示藉由設置於加工裝置2內之未圖示的拍攝裝置所拍攝到的被加工物的圖像等。 For example, the operator can set processing conditions for the processing device 2 through the monitor 4 by touching buttons or the like displayed on the monitor 4 . In addition, an image of the workpiece captured by an imaging device (not shown) provided in the processing device 2 can be displayed on the monitor 4 .
在加工裝置2的殼體之正面2a當中，於與監視器4不同的預定的位置上併設有片匣載置機構10。本實施形態之片匣載置機構10與加工裝置2為分開的個體，且為以附加的方式對加工裝置2安裝的構造物。 In the front surface 2 a of the housing of the processing device 2 , a cassette placing mechanism 10 is provided at a predetermined position different from the monitor 4 . The cassette placing mechanism 10 and the processing device 2 in this embodiment are separate entities, and are structures that are additionally attached to the processing device 2 .
片匣載置機構10具備基台部12，前述基台部12具有以不鏽鋼等金屬材料所形成之大致長方體形狀的殼體。基台部12的上部設有開口部，在此開口部的上方設置有供供片匣30載置的載置台14。 The cassette placing mechanism 10 includes a base portion 12 having a substantially rectangular parallelepiped-shaped housing made of a metal material such as stainless steel. An opening is provided at the upper part of the base part 12, and a mounting table 14 on which the film cassette 30 is placed is provided above the opening.
載置台14是以不鏽鋼等金屬材料所形成之矩形的板狀構件，且為大致水平地配置在基台部12的上部。載置台14具有比基台部12的開口部更小，且比片匣30 的底面部更大的面積。 The mounting base 14 is a rectangular plate-shaped member made of metal material such as stainless steel, and is arranged substantially horizontally on the upper portion of the base portion 12 . The mounting table 14 has an opening smaller than that of the base portion 12 and is smaller than that of the cassette 30 The bottom surface has a larger area.
載置台14是受到可在高度方向(Z軸方向)上移動的升降單元(未圖示)所支撐。升降單元是位於基台部12之殼體的內側。升降單元可以使載置台14沿著高度方向移動，而調節載置台14的高度位置。 The mounting table 14 is supported by a lifting unit (not shown) movable in the height direction (Z-axis direction). The lifting unit is located inside the housing of the base portion 12 . The lifting unit can move the mounting platform 14 along the height direction to adjust the height position of the mounting platform 14 .
於載置台14的上表面，是以從該上表面突出之態樣而設置有可上下移動之按壓銷(未圖示)，且在載置台14內部設置有檢測按壓銷的接觸的第1感測器部(未圖示)。 A pressing pin (not shown) that can move up and down is provided on the upper surface of the mounting base 14 so as to protrude from the upper surface, and a first sensor for detecting contact of the pressing pin is provided inside the mounting base 14 . Detector part (not shown).
當將片匣30載置於載置台14時，此按壓銷即被往下壓而接觸於設在載置台14內的第1感測器部，並將表示於載置台14載置有片匣30之意旨的預定的訊號從第1感測器部傳送到後述的控制部8。 When the film cassette 30 is placed on the mounting platform 14, the pressing pin is pressed down and contacts the first sensor part provided in the mounting platform 14, and will indicate that the film cassette is placed on the mounting platform 14. A predetermined signal indicating 30 is transmitted from the first sensor unit to the control unit 8 described below.
又，於配置在載置台14的側邊的框架部26(詳細內容容後敘述)設置有具有發光元件及受光元件的第2感測器部(未圖示)，且此第2感測器部是檢測片匣30內是否存在晶圓單元9。 In addition, a second sensor portion (not shown) having a light-emitting element and a light-receiving element is provided on the frame portion 26 (details will be described later) arranged on the side of the mounting table 14, and this second sensor The first step is to detect whether there is a wafer unit 9 in the cassette 30 .
在載置台14的上表面可載置以金屬或樹脂所形成之大致長方體狀的片匣30。片匣30是用於容置複數個被加工物的容置容器。本實施形態的片匣30具有板狀的一對側面部(亦即，第1側面部32a及第2側面部32b)。 A substantially rectangular parallelepiped-shaped film cassette 30 made of metal or resin can be placed on the upper surface of the mounting table 14 . The cassette 30 is a container for accommodating a plurality of workpieces. The cassette 30 of this embodiment has a pair of plate-shaped side parts (that is, the first side part 32a and the second side part 32b).
第1側面部32a及第2側面部32b的各上部，是藉由棒狀的複數個連接部32c而相互連結。又，第1側面部32a及第2側面部32b的各下部也是同樣地藉由棒狀的複數 個連接部32c而相互連結。 The upper portions of the first side portion 32a and the second side portion 32b are connected to each other by a plurality of rod-shaped connecting portions 32c. In addition, the lower portions of the first side portion 32a and the second side portion 32b are also formed by rod-shaped plurality. The connecting portions 32c are connected to each other.
再者，如圖1所示，雖然在第1側面部32a的上部設置有2個連接部32c，但連接部32c的數量並非限定為2個，亦可為1個或3個以上。又，連接部32c的形狀並非限定為棒狀，亦可為板狀。 Furthermore, as shown in FIG. 1 , although two connecting portions 32 c are provided on the upper portion of the first side portion 32 a, the number of the connecting portions 32 c is not limited to two, and may be one or three or more. In addition, the shape of the connecting portion 32c is not limited to a rod shape and may be a plate shape.
第1側面部32a及第2側面部32b的上部側中的複數個連接部32c是以把手32d來相互連結。藉由具有把手32d，作業人員可以搬運片匣30。 The plurality of connecting portions 32c on the upper side of the first side portion 32a and the second side portion 32b are connected to each other by handles 32d. By having the handle 32d, the operator can carry the film cassette 30.
第1側面部32a及第2側面部32b的每一個在相互相向的內側側面具有複數個架板32e。各架板32e是沿著片匣30的高度方向以預定的間隔設置有複數個。在本實施形態中，是藉由相互相向的架板32e當中位於相同高度位置的一對架板32e，來支撐1個晶圓單元9。 Each of the first side part 32a and the second side part 32b has a plurality of shelf plates 32e on the inner side surfaces facing each other. A plurality of each shelf plate 32e is provided at predetermined intervals along the height direction of the cassette 30. In this embodiment, one wafer unit 9 is supported by a pair of shelf plates 32e located at the same height position among the shelf plates 32e facing each other.
晶圓單元9是藉由以下方式而形成：將晶圓(被加工物)1配置在金屬製的環狀框架5的開口部，且藉由具有比環狀框架5的開口部更大的面積之圓形的膠帶3來接著環狀框架5與晶圓1。 The wafer unit 9 is formed by arranging the wafer (processed object) 1 in the opening of the metal annular frame 5 and by having a larger area than the opening of the annular frame 5 The circular tape 3 is used to connect the annular frame 5 and the wafer 1 .
在本實施形態中，是藉由複數對架板32e，而將複數個晶圓單元9容置成於片匣30的高度方向上重疊。像這樣，複數對架板32e形成有容置複數個晶圓1的容置空間。再者，亦可藉由一對架板32e來直接支撐1個晶圓1，而非1個晶圓單元9。 In this embodiment, a plurality of wafer units 9 are accommodated so as to overlap in the height direction of the cassette 30 by a plurality of alignment plates 32e. In this way, the plurality of pair of rack plates 32e form accommodating spaces for accommodating a plurality of wafers 1 . Furthermore, a pair of shelf plates 32e can also be used to directly support one wafer 1 instead of one wafer unit 9 .
於架板32e的一端側設置有卡止被加工物的卡止構造(未圖示)。在本實施形態中，是將架板32e的一端 側稱為卡止部側32f，並將架板32e的另一端側(亦即，與卡止部側32f為相反的相反側)稱為搬出入部側32g。 A locking structure (not shown) for locking the workpiece is provided on one end side of the shelf plate 32e. In this embodiment, one end of the shelf plate 32e side is called the locking part side 32f, and the other end side of the shelf plate 32e (that is, the opposite side to the locking part side 32f) is called the carry-out part side 32g.
片匣30的卡止部側32f以及搬出入部側32g，是未設置有板狀的平面構件的開放區域。晶圓單元9是進行成通過片匣30的搬出入部側32g，而從片匣30往外部搬出，並從外部往片匣30搬入。 The locking portion side 32f and the loading and unloading portion side 32g of the cassette 30 are open areas where no plate-shaped planar member is provided. The wafer unit 9 is carried out from the cassette 30 to the outside through the carry-in/out part side 32g of the cassette 30, and is carried into the wafer cassette 30 from the outside.
再者，片匣30並非限定於圖1所示之形狀。例如，亦可於片匣30的卡止部側32f、上部及下部設置板狀的平面構件，而僅將搬出入部側32g完全地開放。又，片匣30亦可是FOUP(前開式晶圓傳送盒，Front Opening Unified Pod)型的片匣。 Furthermore, the film cassette 30 is not limited to the shape shown in FIG. 1 . For example, plate-shaped planar members may be provided on the locking part side 32f, the upper part, and the lower part of the cassette 30, and only the unloading part side 32g may be completely opened. In addition, the cassette 30 may also be a FOUP (Front Opening Unified Pod) type cassette.
於基台部12的內側以及載置台14的側邊的外側設置有罩蓋部16。本實施形態的罩蓋部16是由3個大致矩形形狀的樹脂製的板構件所構成，且是構成為在載置台14載置有片匣30的情況下，可以保護片匣30的除了一部分(亦即搬出入部側32g)以外的側部(亦即，第1側面部32a、第2側面部32b以及卡止部側32f)。 A cover part 16 is provided inside the base part 12 and outside the side of the mounting table 14 . The cover part 16 of this embodiment is composed of three substantially rectangular-shaped resin plate members, and is configured to protect all but a part of the film cassette 30 when the film cassette 30 is placed on the mounting table 14 (ie, the first side portion 32a, the second side portion 32b, and the locking portion side 32f) other than the side portion (that is, the carry-out portion side 32g).
罩蓋部16具有相互相向的第1側面部16a及第2側面部16b、以及連接於第1側面部16a及第2側面部16b的一端側的正面部16c。第1側面部16a、第2側面部16b及正面部16c是高度方向(亦即Z軸方向)的長度相同，且各自的長度比片匣30之從下端部起到上端部的長度更長。 The cover part 16 has a first side part 16a and a second side part 16b facing each other, and a front part 16c connected to one end side of the first side part 16a and the second side part 16b. The first side part 16 a , the second side part 16 b and the front part 16 c have the same length in the height direction (that is, the Z-axis direction), and are longer than the length from the lower end to the upper end of the cassette 30 .
第1側面部16a及第2側面部16b的內側面是相互平行，且正面部16c的內側面是與第1側面部16a及第2 側面部16b的內側面正交。第1側面部16a以及第2側面部16b的另一端側、與罩蓋部16的上部及下部是完全地開放。 The inner surfaces of the first side part 16a and the second side part 16b are parallel to each other, and the inner surface of the front part 16c is parallel to the first side part 16a and the second side part 16c. The inner surfaces of the side portion 16b are orthogonal to each other. The other end sides of the first side part 16a and the second side part 16b and the upper and lower parts of the cover part 16 are completely open.
罩蓋部16是連接於升降機構18(參照圖2及圖3)，前述升降機構18是容置於基台部12之殼體的內側。罩蓋部16可藉由此升降機構18而相對於載置於載置台14上的片匣30升降。在此，利用圖2及圖3來說明升降機構18。 The cover part 16 is connected to the lifting mechanism 18 (refer to FIGS. 2 and 3 ), and the lifting mechanism 18 is housed inside the casing of the base part 12 . The cover portion 16 can be raised and lowered relative to the film cassette 30 placed on the mounting table 14 by the lifting mechanism 18 . Here, the lifting mechanism 18 will be described using FIGS. 2 and 3 .
圖2是罩蓋部16及升降機構18的立體圖。升降機構18具有以金屬所形成的托架20。托架20是連接於罩蓋部16的下部，而與罩蓋部16一體化。 FIG. 2 is a perspective view of the cover portion 16 and the lifting mechanism 18 . The lifting mechanism 18 has a bracket 20 formed of metal. The bracket 20 is connected to the lower part of the cover part 16 and is integrated with the cover part 16 .
托架20是以連接於罩蓋部16的第1側面部16a之下部的第1直線部20a、連接於第2側面部16b之下部的第2直線部20b、及連接於正面部16c之下部的第3直線部20c所構成。 The bracket 20 has a first straight portion 20a connected to the lower portion of the first side portion 16a of the cover portion 16, a second straight portion 20b connected to the lower portion of the second side portion 16b, and a lower portion connected to the front portion 16c. It is composed of the third linear portion 20c.
第1直線部20a及第3直線部20c構成有第1角部20d，第2直線部20b及第3直線部20c構成有第2角部20e。在第1角部20d的附近設置有第1線性導引部，且在第2角部20e設置有第2線性導引部。 The first linear portion 20a and the third linear portion 20c constitute the first corner portion 20d, and the second linear portion 20b and the third linear portion 20c constitute the second corner portion 20e. A first linear guide is provided in the vicinity of the first corner 20d, and a second linear guide is provided in the second corner 20e.
第1線性導引部是由大致長方體狀之金屬製的滑件24g、及細長之板狀的金屬製的導軌24i所形成，第2線性導引部也是同樣地由大致長方體狀之金屬製的滑件24h、及細長之板狀的金屬製的導軌24j所形成。 The first linear guide part is formed of a substantially rectangular parallelepiped-shaped metal slider 24g and an elongated plate-shaped metal guide rail 24i, and the second linear guide part is similarly formed of a substantially rectangular parallelepiped-shaped metal slider 24g. The slider 24h and the elongated plate-shaped metal guide rail 24j are formed.
導軌24i及24j是配置於托架20的外側，且導軌24i及24j的側面是大致平行於第1直線部20a及第2直線部20b的側面、與第1側面部16a及第2側面部16b。 The guide rails 24i and 24j are arranged outside the bracket 20, and the side surfaces of the guide rails 24i and 24j are substantially parallel to the side surfaces of the first linear portion 20a and the second linear portion 20b, and the first side portion 16a and the second side portion 16b. .
在導軌24i及24j上，是將滑件24g及24h的一邊的側部以可在上下方向上移動的方式連結。在滑件24g的上部連接有托架20的第1角部20d，在滑件24h的上部連接有托架20的第2角部20e。 To the guide rails 24i and 24j, one side portion of the sliders 24g and 24h is connected movably in the vertical direction. The first corner portion 20d of the bracket 20 is connected to the upper portion of the slider 24g, and the second corner portion 20e of the bracket 20 is connected to the upper portion of the slider 24h.
在相對於第1直線部20a而比第1線性導引部更內側，設置有無桿氣缸(rodless cylinder)22a，且在相對於第2直線部20b而比第2線性導引部更內側設置有另1個無桿氣缸22b。無桿氣缸22a及22b具有以金屬所形成之長方體形狀的主體部24a及24b。 A rodless cylinder 22a is provided on the inner side of the first linear guide portion 20a with respect to the first linear portion 20a, and a rodless cylinder 22a is provided on the inner side of the second linear guide portion with respect to the second linear portion 20b. Another rodless cylinder 22b. The rodless cylinders 22a and 22b have rectangular parallelepiped-shaped main body parts 24a and 24b formed of metal.
位於與滑件24g的一邊的側部為相反的相反側之滑件24g的另一側部，是固定在無桿氣缸22a的主體部24a。同樣地，滑件24h的另一側部是固定在無桿氣缸22b的主體部24b。像這樣，托架20是透過第1及第2線性導引部，而受到無桿氣缸22a及22b所支撐。 The other side portion of the slider 24g located on the opposite side to one side of the slider 24g is fixed to the main body portion 24a of the rodless cylinder 22a. Similarly, the other side part of the slider 24h is fixed to the main body part 24b of the rodless cylinder 22b. In this way, the bracket 20 is supported by the rodless cylinders 22a and 22b through the first and second linear guide parts.
主體部24a及24b具有圓筒狀的貫通開口。在此貫通開口配置有圓筒狀的壓缸管24c及24d，前述壓缸管24c及24d是沿著導軌24i及24j的延伸方向而設置且以金屬形成。主體部24a及24b是構成為可沿著壓缸管24c及24d的高度方向移動。 The main body parts 24a and 24b have a cylindrical through opening. Cylindrical cylinder tubes 24c and 24d are disposed through the through opening. The cylinder tubes 24c and 24d are provided along the extending direction of the guide rails 24i and 24j and are made of metal. The main body portions 24a and 24b are configured to be movable along the height direction of the cylinder tubes 24c and 24d.
在壓缸管24c及24d的內部設置有可在壓缸管24c及24d的長度方向上滑動的圓柱狀的活塞(未圖示)。在活塞設有磁鐵，且在主體部24a及24b是將磁鐵設置成包圍活塞。活塞的磁鐵與主體部24a及24b的磁鐵是相互磁性地耦合。 A cylindrical piston (not shown) slidable in the length direction of the cylinder tubes 24c and 24d is provided inside the cylinder tubes 24c and 24d. The piston is provided with a magnet, and the magnets are provided in the main body portions 24a and 24b so as to surround the piston. The magnet of the piston and the magnets of the main body portions 24a and 24b are magnetically coupled to each other.
在壓缸管24c及24d的底部設置有基部24e及24f，且在頂部設置有頭蓋(未圖示)。例如，當從基部24e及24f將空氣供給至壓缸管24c及24d的內部，且從頭蓋排出空氣時，會使活塞相對於壓缸管24c及24d而上升。 Base portions 24e and 24f are provided at the bottoms of the cylinder tubes 24c and 24d, and a head cover (not shown) is provided at the top. For example, when air is supplied from the base portions 24e and 24f to the inside of the cylinder tubes 24c and 24d and the air is discharged from the head, the piston is raised relative to the cylinder tubes 24c and 24d.
同樣地，當從基部24e及24f排出空氣，並從頭蓋將空氣供給至壓缸管24c及24d的內部時，會使活塞相對於壓缸管24c及24d而下降。像這樣，隨著活塞在壓缸管24c及24d的內部朝上下方向滑動，主體部24a及24b也朝上下方向滑動。 Similarly, when the air is exhausted from the base portions 24e and 24f and the air is supplied from the head to the inside of the cylinder tubes 24c and 24d, the piston will be lowered relative to the cylinder tubes 24c and 24d. In this way, as the pistons slide in the up-and-down direction inside the cylinder tubes 24c and 24d, the main body portions 24a and 24b also slide in the up-and-down direction.
如上述，由於主體部24a及24b是透過滑件24g及24h而固定在托架20，因此可以藉由使主體部24a及24b朝上下滑動，而透過托架20來使罩蓋部16上升或下降。圖3是將圖2之區域A放大的局部截面側視圖。 As mentioned above, since the main body parts 24a and 24b are fixed to the bracket 20 through the sliders 24g and 24h, the cover part 16 can be raised or raised through the bracket 20 by sliding the main body parts 24a and 24b up and down. decline. FIG. 3 is an enlarged partial cross-sectional side view of area A in FIG. 2 .
罩蓋部16是藉由升降機構18，而在保護片匣30的保護位置(參照圖1)、及退避到基台部12的內側的退避位置(參照圖5)之間移動(亦即，升降)。本實施形態中的保護位置是指罩蓋部16覆蓋已載置在載置台14之片匣30的第1側面部32a、第2側面部32b及卡止部側32f的位置。 The cover part 16 is moved by the lifting mechanism 18 between a protective position (see FIG. 1 ) for protecting the film cassette 30 and a retracted position (see FIG. 5 ) that is retracted to the inside of the base part 12 (that is, lifting). The protection position in this embodiment refers to the position where the cover part 16 covers the first side part 32a, the second side part 32b and the locking part side 32f of the cassette 30 placed on the mounting table 14.
罩蓋部16位於保護位置時，罩蓋部16的各側部(亦即，第1側面部16a、第2側面部16b及正面部16c)的上端部16d，是位於比片匣30的頂面部更上方。藉此，罩蓋部16會保護片匣30的側邊。 When the cover part 16 is in the protection position, the upper end 16d of each side part of the cover part 16 (that is, the first side part 16a, the second side part 16b and the front part 16c) is located above the top of the film cassette 30. The face is further up. Thereby, the cover portion 16 protects the sides of the film cassette 30 .
又，本實施形態中的退避位置，是位於比保護位置更下方，且是將罩蓋部16隱藏於基台部12的內側之 位置。罩蓋部16位於退避位置時，罩蓋部16的各側部的上端部16d是位於與載置台14相同或比載置台14更低的位置。此時，由於罩蓋部16未保護片匣30，因此作業人員能夠容易地對片匣30進行存取。 In addition, the retreat position in this embodiment is located below the protection position and hides the cover part 16 inside the base part 12. Location. When the cover portion 16 is in the retracted position, the upper end portions 16 d of each side of the cover portion 16 are located at the same position as or lower than the mounting base 14 . At this time, since the cover portion 16 does not protect the film cassette 30 , the operator can easily access the film cassette 30 .
在此，返回到圖1。在相對於載置台14為正面部16c的相反側(亦即，載置台14的背面側的側邊)，並且在從第1側面部16a及第2側面部16b的另一端側起距離預定距離(例如數mm)的位置上，配置有框架部26。框架部26是以不鏽鋼等金屬材料所形成的板狀構件，且相對於地面大致垂直地豎立。 At this point, return to Figure 1. On the opposite side of the front part 16c with respect to the mounting table 14 (that is, the side on the back side of the mounting table 14), and at a predetermined distance from the other end sides of the first side part 16a and the second side part 16b The frame part 26 is arranged at a position (for example, several mm). The frame part 26 is a plate-shaped member formed of a metal material such as stainless steel, and stands substantially vertically with respect to the ground.
在框架部26的大致上半部，設置有從框架部26的正面26a貫通到背面26b之大致矩形的開口部26c。開口部26c是長方體狀的貫通開口，且正面26a及背面26b中的開口部26c的大小，與片匣30的搬出入部側32g大致相同或比其更大。因此，開口部26c可以使晶圓單元9通過。 A substantially rectangular opening 26 c penetrating from the front 26 a to the back 26 b of the frame 26 is provided in substantially the upper half of the frame 26 . The opening 26 c is a rectangular parallelepiped-shaped through opening, and the size of the opening 26 c in the front surface 26 a and the back surface 26 b is approximately the same as or larger than the loading/unloading portion side 32 g of the cassette 30 . Therefore, the opening 26c allows the wafer unit 9 to pass through.
於框架部26的大致上半部的背面26b側配置有大致矩形形狀，且具有比開口部26c的背面26b中的開口面積更大的面積的門部28。再者，門部28是片匣載置機構10的一部分。本實施形態之門部28是構成為藉由移動單元(未圖示)，而沿著框架部26的高度方向(亦即Z軸方向)滑動並移動。 A door portion 28 having a substantially rectangular shape and having an area larger than the opening area in the back surface 26b of the opening portion 26c is disposed on the back surface 26b side of the substantially upper half of the frame portion 26. Furthermore, the door portion 28 is a part of the cassette placing mechanism 10 . The door portion 28 of this embodiment is configured to slide and move along the height direction of the frame portion 26 (that is, the Z-axis direction) by a moving unit (not shown).
本實施形態的門部28是可藉由移動單元而移動成例如位於將開口部26c的背面26b側完全關閉的關閉位置(亦即圖1所示之門部28的位置，亦即上方位置)、與 將開口部26c的背面26b側完全打開的打開位置(亦即圖4所示之門部28的位置，亦即下方位置)。 The door 28 of this embodiment can be moved by a moving unit to, for example, a closed position in which the back surface 26b side of the opening 26c is completely closed (that is, the position of the door 28 shown in FIG. 1 , that is, the upper position). ,and An open position in which the back surface 26b side of the opening 26c is fully opened (that is, the position of the door 28 shown in FIG. 4, that is, the downward position).
在框架部26的大致下半部的區域(亦即比開口部26c更下方的區域)連結有上述之基台部12的背面側。又，於框架部26的下方設置有與地面相接的複數個腳輪26d。 The back side of the above-described base portion 12 is connected to a substantially lower half region of the frame portion 26 (that is, a region below the opening 26c). In addition, a plurality of casters 26d in contact with the ground are provided below the frame part 26.
腳輪26d是設置在例如框架部26的寬度方向(圖1的Y軸方向)的兩端部。腳輪26d是為了要使片匣載置機構10從加工裝置2獨立並移動而使用。 The casters 26d are provided, for example, at both ends of the frame portion 26 in the width direction (Y-axis direction in FIG. 1). The casters 26d are used to move the cassette placing mechanism 10 independently from the processing device 2.
如圖1所示，本實施形態之片匣載置機構10是安裝於加工裝置2。特別地，將框架部26及門部28嵌入加工裝置2，以使框架部26的正面26a成為與加工裝置2之殼體的正面2a大致平行。 As shown in FIG. 1 , the cassette placing mechanism 10 of this embodiment is installed on the processing device 2 . In particular, the frame part 26 and the door part 28 are embedded in the processing device 2 so that the front surface 26a of the frame part 26 is substantially parallel to the front surface 2a of the housing of the processing device 2.
在加工裝置2的內部之相向於開口部26c的位置上配置有搬送臂6。此搬送臂6具有大致U字形的手部，且在手部的一側之面上設置有吸附晶圓單元9的吸附墊等的吸附機構。 The transfer arm 6 is arranged inside the processing device 2 at a position facing the opening 26c. The transfer arm 6 has a substantially U-shaped hand, and an adsorption mechanism such as an adsorption pad for adsorbing the wafer unit 9 is provided on one side of the hand.
搬送臂6是使手部移動到例如容置於片匣30的晶圓單元9的下方，並且以手部吸附晶圓單元9，來將晶圓單元9往配置於加工裝置2的內部之對位工作台(未圖示)等搬送。 The transfer arm 6 moves the hand below the wafer unit 9 accommodated in the cassette 30 , for example, and sucks the wafer unit 9 with the hand to move the wafer unit 9 to the inside of the processing device 2 . Move it to a workbench (not shown), etc.
搬送臂6等的動作是由設置於加工裝置2內的控制部8所控制。控制部8是例如電腦，並具有透過主機/控制器而相互地連接的CPU、RAM、硬磁碟驅動機等。 The operations of the transport arm 6 and the like are controlled by the control unit 8 provided in the processing device 2 . The control unit 8 is, for example, a computer, and has a CPU, a RAM, a hard disk drive, etc. that are connected to each other through a host/controller.
CPU是依據保存於RAM、硬磁碟驅動機等之儲存部分的程式、資料等來進行運算處理等。控制部8可以藉由讀取CPU已保存於儲存部分的程式，而作為使軟體與上述之硬體資源協同合作之具體的組件來發揮功能。 The CPU performs calculations and processing based on programs and data stored in storage parts such as RAM and hard disk drives. The control unit 8 can function as a specific component that enables software to cooperate with the above-mentioned hardware resources by reading the program stored in the storage part of the CPU.
控制部8除了搬送臂6以外，還電連接於監視器4。又，已將片匣載置機構10安裝到加工裝置2時，控制部8是與片匣載置機構10電連接。 The control unit 8 is electrically connected to the monitor 4 in addition to the transport arm 6 . Furthermore, when the cassette placing mechanism 10 is installed in the processing device 2 , the control unit 8 is electrically connected to the cassette placing mechanism 10 .
控制部8是透過監視器4接受來自作業人員的指示，而控制各部的動作。例如，控制部8會透過監視器4接受使罩蓋部16及門部28等移動之意旨的指示，並控制用以反映該指示的升降機構18及移動單元的動作。 The control unit 8 receives instructions from the operator through the monitor 4 and controls the operations of each unit. For example, the control unit 8 receives an instruction to move the cover part 16, the door part 28, etc. through the monitor 4, and controls the operations of the lifting mechanism 18 and the moving unit to reflect the instruction.
接著，使用圖1、圖4及圖5，來說明在加工裝置2加工晶圓1時的搬送臂6、罩蓋部16及門部28的動作。作業人員是在門部28位於關閉位置，且罩蓋部16位於退避位置時，將片匣30載置於載置台14。 Next, the operations of the transfer arm 6 , the cover part 16 and the door part 28 when the processing apparatus 2 processes the wafer 1 will be described using FIGS. 1 , 4 and 5 . The operator places the film cassette 30 on the mounting table 14 when the door portion 28 is in the closed position and the cover portion 16 is in the retracted position.
當將片匣30載置於載置台14時，即可按壓上述之按壓銷，而將表示載置台14上存在片匣30之情形的資訊a從載置台14的第1感測器部往控制部8傳送。 When the film cassette 30 is placed on the placement table 14, the above-mentioned pressing pin can be pressed, and the information a indicating the presence of the film cassette 30 on the placement table 14 is controlled from the first sensor part of the placement table 14. Part 8 is transmitted.
又，上述之第2感測器部是在片匣30內存在晶圓單元9的情況下，將表示該意旨之資訊b往控制部8傳送。資訊a及b是被利用為例如加工裝置2開始進行晶圓單元9從片匣30的搬出時的前提條件。 In addition, when the wafer unit 9 is present in the cassette 30 , the above-mentioned second sensor unit transmits information b indicating this to the control unit 8 . The information a and b are used, for example, as a prerequisite when the processing device 2 starts unloading the wafer unit 9 from the cassette 30 .
接著，作業人員是透過監視器4將使罩蓋部16往保護位置上升之意旨的指示傳送到控制部8。控制部8 是以例如接收資訊a及b為條件來控制升降機構18的動作，而使罩蓋部16往保護位置上升(參照圖1)。 Next, the operator transmits an instruction to the control unit 8 through the monitor 4 to raise the cover portion 16 to the protection position. Control section 8 For example, the operation of the lifting mechanism 18 is controlled based on the reception of information a and b, so that the cover part 16 is raised to the protection position (see FIG. 1 ).
在罩蓋部16已到達保護位置後，控制部8會控制移動單元的動作，並使使門部28下降至打開位置(參照圖4)。在使門部28移動至打開位置後，為了讓片匣30內的晶圓單元9的高度位置對齊於搬送臂6的高度位置，控制部8會控制升降單元的動作來調節載置台14的高度位置。 After the cover part 16 has reached the protection position, the control part 8 controls the movement of the mobile unit and lowers the door part 28 to the open position (see FIG. 4 ). After the door 28 is moved to the open position, in order to align the height of the wafer unit 9 in the cassette 30 with the height of the transfer arm 6 , the control unit 8 controls the movement of the lifting unit to adjust the height of the mounting table 14 Location.
然後，搬送臂6是藉由控制部8控制搬送臂6的動作，而將晶圓單元9從片匣30搬出至加工裝置2內。之後，可在加工裝置2內加工晶圓1。圖4是顯示搬送作業中的情形的立體圖。 Then, the control unit 8 controls the movement of the transfer arm 6 to carry out the wafer unit 9 from the cassette 30 into the processing device 2 . Thereafter, the wafer 1 can be processed in the processing device 2 . FIG. 4 is a perspective view showing the situation during transportation work.
在本實施形態中，是在晶圓單元9的搬送中及晶圓1的加工中，讓罩蓋部16包圍片匣30的第1側面部32a、第2側面部32b及卡止部側32f(亦即搬出入部側32g以外的片匣30的外周側面)。 In this embodiment, during the transportation of the wafer unit 9 and the processing of the wafer 1, the cover portion 16 surrounds the first side portion 32a, the second side portion 32b and the locking portion side 32f of the cassette 30. (That is, the outer peripheral side surface of the cassette 30 other than the carry-out part side 32g).
藉此，能夠防止以下情形：在晶圓單元9的搬送中及晶圓1的加工中，作業人員誤接觸到片匣30及晶圓單元9。因此，可以防止搬送或加工被中斷之情形。 This can prevent an operator from accidentally touching the cassette 30 and the wafer unit 9 during transportation of the wafer unit 9 and processing of the wafer 1 . Therefore, interruption of transportation or processing can be prevented.
又，在本實施形態的片匣30中，是與FOUP型的片匣不同，所容置的晶圓單元9為暴露於外部環境。因此，在搬出入部側32g以外的片匣30的外周側面未被罩蓋部16所包圍的情況下，恐有以下疑慮：作業人員誤接觸到晶圓單元9且作業人員讓手受傷、或移動晶圓1。 In addition, the cassette 30 of this embodiment is different from the FOUP type cassette in that the accommodated wafer unit 9 is exposed to the external environment. Therefore, when the outer peripheral side of the cassette 30 other than the loading and unloading portion side 32 g is not surrounded by the cover portion 16 , there is a possibility that the operator accidentally touches the wafer unit 9 and that the operator injures his or her hand or moves the wafer. Circle 1.
然而，在本實施形態中，由於是藉由罩蓋部 16包圍搬出入部側32g以外的片匣30的外周側面，因此可以防止以下情形：作業人員誤接觸到晶圓1，且作業人員讓手受傷、或移動晶圓1。 However, in this embodiment, since the cover portion 16 surrounds the outer peripheral side of the cassette 30 other than the loading/unloading portion side 32g, so it is possible to prevent an operator from accidentally touching the wafer 1, injuring his or her hand, or from moving the wafer 1.
加工結束後，是將各晶圓1藉由搬送臂6而搬入到片匣30。已將全部的晶圓1搬入片匣30後，控制部8是使門部28移動到關閉位置，接著，使罩蓋部16下降至退避位置。藉此，結束晶圓1的加工及搬送作業。圖5是顯示加工及搬送作業結束後之情形的立體圖。 After the processing is completed, each wafer 1 is transported into the cassette 30 by the transport arm 6 . After all the wafers 1 have been loaded into the cassette 30, the control part 8 moves the door part 28 to the closed position, and then lowers the cover part 16 to the retracted position. Thereby, the processing and transportation operations of the wafer 1 are completed. FIG. 5 is a perspective view showing the situation after completion of processing and transportation operations.
接著，使用圖6來說明罩蓋部16及門部28等的動作順序的詳細內容。作業人員是在罩蓋部16位於退避位置，且門部28位於關閉位置時，將片匣30載置到載置台14上(階段S10)。圖6(A)是顯示將片匣30載置在載置台14的階段S10的圖。 Next, the details of the operation sequence of the cover part 16, the door part 28, etc. are demonstrated using FIG. 6. When the cover part 16 is in the retracted position and the door part 28 is in the closed position, the operator places the cassette 30 on the mounting table 14 (stage S10). FIG. 6(A) is a diagram showing the stage S10 of placing the cassette 30 on the mounting table 14 .
在S10之後，可將上述之資訊a及b往控制部8傳送，而以控制部8確認以下情形：在載置台14上存在片匣30，且在片匣30內存在晶圓單元9。再者，控制部8亦可將於資訊a及b中所接收到的意旨顯示在監視器4，來使作業人員確認片匣30及晶圓單元9的存在。 After S10, the above-mentioned information a and b can be transmitted to the control unit 8, and the control unit 8 can confirm the following situation: there is a cassette 30 on the mounting table 14, and the wafer unit 9 is present in the cassette 30. Furthermore, the control unit 8 may also display the information received in the information a and b on the monitor 4 to allow the operator to confirm the existence of the cassette 30 and the wafer unit 9 .
之後，當作業人員透過監視器4將使罩蓋部16上升之意旨的指示傳送到控制部8時，控制部8即控制升降機構18的動作而使罩蓋部16上升(S20)。圖6(B)是顯示使罩蓋部16上升到保護位置的階段S20的圖。再者，圖6(B)所示之片匣載置機構10的狀態是對應於圖1所示之片匣載置機構10的狀態。 Thereafter, when the operator sends an instruction to raise the cover part 16 to the control part 8 through the monitor 4, the control part 8 controls the operation of the lifting mechanism 18 to raise the cover part 16 (S20). FIG. 6(B) is a diagram showing step S20 in which the cover part 16 is raised to the protection position. Furthermore, the state of the cassette placing mechanism 10 shown in FIG. 6(B) corresponds to the state of the cassette placing mechanism 10 shown in FIG. 1 .
在階段S20中，當罩蓋部16藉由升降機構18上升到保護位置時，罩蓋部16即包圍片匣30的搬出入部側32g以外的外周側面。再者，此時，門部28的位置是維持在關閉開口部26c的關閉位置。 In step S20 , when the cover portion 16 is raised to the protection position by the lifting mechanism 18 , the cover portion 16 surrounds the outer peripheral side surface of the film cassette 30 other than the carry-in/out portion side 32 g. In addition, at this time, the position of the door part 28 is maintained at the closed position which closes the opening part 26c.
在S20之後，作業人員是透過監視器4將加工開始的指示傳送到控制部8。控制部8在接收到加工開始的指示後，是以罩蓋部16已上升到保護位置之情形作為條件，來使門部28從關閉位置移動到打開位置。之後，控制部8是控制搬送臂6的動作，來使晶圓單元9從片匣30搬出到加工裝置2(S30)。 After S20 , the operator transmits an instruction to start processing to the control unit 8 through the monitor 4 . After receiving the instruction to start processing, the control part 8 moves the door part 28 from the closed position to the open position on the condition that the cover part 16 has risen to the protection position. Thereafter, the control unit 8 controls the movement of the transfer arm 6 to carry out the wafer unit 9 from the cassette 30 to the processing device 2 (S30).
之後，可在加工裝置2的內部加工晶圓1(S30)。圖6(C)是顯示使門部28移動至打開位置後，進行搬送及加工作業的階段S30的圖。再者，圖6(C)所示之片匣載置機構10的狀態是對應於圖4所示之片匣載置機構10的狀態。 Thereafter, the wafer 1 can be processed inside the processing device 2 (S30). FIG. 6(C) is a diagram showing step S30 in which the transport and processing operations are performed after the door 28 is moved to the open position. Furthermore, the state of the cassette placing mechanism 10 shown in FIG. 6(C) corresponds to the state of the cassette placing mechanism 10 shown in FIG. 4 .
當晶圓單元9的加工結束，且將全部的晶圓單元9搬入到片匣30時，S30即結束。S30之後，控制部8是控制移動單元的動作，而使門部28從打開位置移動至關閉位置(S40)。圖6(D)是顯示使門部28移動至關閉位置的階段S40的圖。 When the processing of the wafer unit 9 is completed and all the wafer units 9 are loaded into the cassette 30 , S30 ends. After S30, the control unit 8 controls the operation of the moving unit to move the door 28 from the open position to the closed position (S40). FIG. 6(D) is a diagram showing step S40 in which the door 28 is moved to the closed position.
在階段S40之後，控制部8是以已將門部28從打開位置移動至關閉位置之情形作為條件，來控制升降機構18的動作而使罩蓋部16下降至退避位置(S50)。藉此，形成為作業人員可以對載置台14進行存取。例如，作 業人員可將容置有加工完畢之晶圓單元9的片匣30從載置台14搬出。 After stage S40, the control unit 8 controls the action of the lifting mechanism 18 to lower the cover portion 16 to the retreat position (S50), based on the condition that the door portion 28 has moved from the open position to the closed position. This allows workers to access the mounting table 14 . For example, do The operator can move out the cassette 30 containing the processed wafer unit 9 from the loading table 14 .
圖6(E)是顯示使罩蓋部16下降到退避位置的階段(S50)的圖。再者，圖6(E)所示之片匣載置機構10的狀態是對應於圖5所示之片匣載置機構10的狀態。 FIG. 6(E) is a diagram showing a stage (S50) in which the cover portion 16 is lowered to the retracted position. Furthermore, the state of the cassette placing mechanism 10 shown in FIG. 6(E) corresponds to the state of the cassette placing mechanism 10 shown in FIG. 5 .
S50之後，作業人員亦可將容置有未加工之晶圓1的新的片匣30載置到載置台14。作業人員在S50之後，亦可再次返回到S10，且將S20、S30及S40的各階段依此順序來重複。 After S50, the operator can also place the new cassette 30 containing the unprocessed wafer 1 on the loading table 14. After S50, the operator can also return to S10 again and repeat the stages of S20, S30 and S40 in this order.
其次說明第2實施形態。第2實施形態之片匣載置機構10是以下述的態樣來設置：於基台部12的正面側之比載置台14更下方具有開口部12a，且在此開口部12a使踏板(腳踏開關部)12b露出於外部。例如，踏板12b的至少一部分是以從開口部12a突出的態樣來設置。圖7是第2實施形態之加工裝置2及片匣載置機構10的立體圖。 Next, the second embodiment will be described. The cassette placing mechanism 10 of the second embodiment is provided in such a manner that an opening 12a is provided on the front side of the base portion 12 below the placement table 14, and a pedal (foot) is provided in the opening 12a. The pedal switch part) 12b is exposed to the outside. For example, at least a part of the pedal 12b is provided to protrude from the opening 12a. FIG. 7 is a perspective view of the processing device 2 and the cassette placing mechanism 10 of the second embodiment.
作業人員除了藉由以手觸碰監視器4的方式來使升降機構18動作以外，還可以或取代於此，而藉由以腳來踩踏踏板12b的方式來透過控制部8使升降機構18動作，並使罩蓋部16在保護位置與退避位置之間升降。 In addition to operating the lifting mechanism 18 by touching the monitor 4 with his hand, the operator may also or instead of operating the lifting mechanism 18 through the control unit 8 by stepping on the pedal 12b with his foot. , and the cover portion 16 is raised and lowered between the protection position and the retreat position.
例如，如圖6(A)所示，在載置台14上存在片匣30(亦即，控制部8接收到上述之資訊a)的情況下，當作業人員踩踏踏板12b時，控制部8即控制升降機構18的動作而使罩蓋部16上升至保護位置。相對於此，在載置台14上不存在片匣30的情況下，即使作業人員踩踏踏板12b，控 制部8仍然不會使罩蓋部16移動。 For example, as shown in FIG. 6(A) , when the cassette 30 is present on the mounting table 14 (that is, the control unit 8 receives the above-mentioned information a), when the operator steps on the pedal 12 b, the control unit 8 The operation of the lifting mechanism 18 is controlled to raise the cover portion 16 to the protection position. On the other hand, when there is no cassette 30 on the mounting table 14, even if the operator steps on the pedal 12b, the control The control part 8 still does not cause the cover part 16 to move.
再者，若是在晶圓單元9的搬送或晶圓1的加工作業前，控制部8亦可在作業人員於使罩蓋部16上升到保護位置後再次踩踏踏板12b時，使罩蓋部16下降至退避位置。 Furthermore, before the transportation of the wafer unit 9 or the processing operation of the wafer 1 , the control unit 8 may also cause the cover unit 16 to move downward when the operator steps on the pedal 12 b again after raising the cover unit 16 to the protective position. Descend to retreat position.
又，例如，如圖6(E)所示，在搬送及加工作業的結束後，當作業人員踩踏踏板12b時，控制部8即控制升降機構18的動作而使罩蓋部16降下至退避位置。相對於此，在搬送及加工作業中的情況下，即使作業人員踩踏踏板12b，控制部8仍然不會使罩蓋部16移動。藉此，可以防止以下情形：因錯誤的踏板12b的操作而中斷搬送或加工。 For example, as shown in FIG. 6(E) , after the transportation and processing operations are completed, when the operator steps on the pedal 12 b, the control unit 8 controls the operation of the lifting mechanism 18 to lower the cover unit 16 to the retracted position. . On the other hand, even if the operator steps on the pedal 12b during transportation and processing operations, the control unit 8 will not move the cover unit 16. This can prevent interruption of transportation or processing due to incorrect operation of the pedal 12b.
如此，作業人員可以只用腳來踩踏踏板12b而使罩蓋部16上升或下降。由於在作業人員站立在片匣載置機構10的正面側，且為手無法構著監視器4的情況下、或作業人員的手正在忙碌未能空出的情況下，作業人員可以使用腳來使罩蓋部16升降，因此讓作業效率提升。 In this way, the operator can move the cover portion 16 up or down by simply stepping on the pedal 12b with his or her feet. Because when the operator stands on the front side of the cassette loading mechanism 10 and cannot hold the monitor 4 with his hands, or when the operator's hands are busy and cannot be free, the operator can use his feet to The cover portion 16 is raised and lowered, thereby improving work efficiency.
其次說明第3實施形態。第3實施形態的片匣載置機構10，是具備具有發光元件40及受受光元件42的腳踏開關部來取代踏板12b。在所述之點上，與第2實施形態不同。圖8是第3實施形態之腳踏開關部的立體圖。 Next, the third embodiment will be described. The cassette placing mechanism 10 of the third embodiment includes a foot switch unit including a light-emitting element 40 and a light-receiving element 42 instead of the pedal 12b. This point is different from the second embodiment. Fig. 8 is a perspective view of the foot switch unit of the third embodiment.
發光元件40及受光元件42是比開口部12a更配置在基台部12的內側。受光元件42是配置在基台部12的一側面的內側。相對於此，發光元件40是在基台部12的內部配置成與受光元件42相向。發光元件40的發光面與受 光元件42的受光面是比開口部12a的橫寬的長度更相遠離而配置，以夾持從開口部12a延續到基台部12的內側的空間。 The light-emitting element 40 and the light-receiving element 42 are arranged inside the base part 12 rather than the opening part 12a. The light-receiving element 42 is arranged inside one side surface of the base portion 12 . On the other hand, the light-emitting element 40 is arranged to face the light-receiving element 42 inside the base portion 12 . The light-emitting surface of the light-emitting element 40 and the receiver The light-receiving surface of the optical element 42 is disposed farther apart than the lateral width of the opening 12 a so as to sandwich a space extending from the opening 12 a to the inside of the base portion 12 .
於發光元件40的發光面設置有透鏡等光學系統(未圖示)，發光元件40是通過此光學系統來將紅外線或近紅外線之光L朝向受光元件42的受光面照射。藉此，可在基台部12之比開口部12a更內側形成由光L所構成的檢測線。 An optical system (not shown) such as a lens is provided on the light-emitting surface of the light-emitting element 40 . The light-emitting element 40 irradiates infrared or near-infrared light L toward the light-receiving surface of the light-receiving element 42 through this optical system. Thereby, the detection line composed of the light L can be formed inside the opening 12 a of the base portion 12 .
例如，藉由作業人員將腳伸入開口部12a，光L即暫時被遮蔽。此時，受光元件42是將使升降機構18動作的預定的訊號傳送至控制部8。控制部8是依此預定的訊號來使升降機構18動作，而使罩蓋部16在保護位置與退避位置之間升降。 For example, when an operator puts his or her feet into the opening 12a, the light L is temporarily blocked. At this time, the light-receiving element 42 transmits a predetermined signal for operating the lifting mechanism 18 to the control unit 8 . The control part 8 operates the lifting mechanism 18 according to the predetermined signal, so that the cover part 16 moves up and down between the protection position and the retreat position.
在第3實施形態中，也是作業人員除了藉由以手來觸碰監視器4的方式來使升降機構18動作以外，還可以或取代於此，而藉由以腳來遮蔽光L的方式來使升降機構18動作，並使罩蓋部16在保護位置與退避位置之間升降。 In the third embodiment, in addition to touching the monitor 4 with their hands to operate the lifting mechanism 18, the operator may also or instead of this operate by blocking the light L with their feet. The lifting mechanism 18 is operated to lift the cover portion 16 between the protection position and the retracted position.
因此，作業人員只要將腳伸入開口部12a，就可以使罩蓋部16上升或下降。由於在作業人員站立在片匣載置機構10的正面側，且為手無法構著監視器4的情況下、或作業人員的手正在忙碌未能空出的情況下，作業人員可以使用腳來使罩蓋部16升降，因此讓作業效率提升。 Therefore, the operator can raise or lower the cover portion 16 simply by inserting his or her feet into the opening 12a. Because when the operator stands on the front side of the cassette loading mechanism 10 and cannot hold the monitor 4 with his hands, or when the operator's hands are busy and cannot be free, the operator can use his feet to The cover portion 16 is raised and lowered, thereby improving work efficiency.
再者，圖8所示之發光元件40及受光元件42 雖然是構成所謂的透射檢測方式之感測器部，但是亦可構成所謂的反射檢測方式之感測器部。例如，可將發光元件40的發光面與受光元件42的受光面，以相向於基台部12的一側面的內側的方式於基台部12的內部並排配置。 Furthermore, the light-emitting element 40 and the light-receiving element 42 shown in FIG. 8 Although it constitutes a so-called transmission detection type sensor unit, it may also constitute a so-called reflection detection type sensor unit. For example, the light-emitting surface of the light-emitting element 40 and the light-receiving surface of the light-receiving element 42 may be arranged side by side inside the base part 12 so as to face the inside of one side surface of the base part 12 .
此時，可藉由發光元件40以及受光元件42與基台部12的一側面的內側，來夾持從開口部12a延續到基台部12的內側的空間。發光元件40是通過透鏡等光學系統(未圖示)而讓光L朝基台部12的一側面的內側發光，且受光元件42是接收來自基台部12的一側面的內側的反射光。亦即，基台部12之一側面的內側是作為反射器而發揮功能。 At this time, a space extending from the opening 12 a to the inside of the base portion 12 can be sandwiched between the light-emitting element 40 and the light-receiving element 42 and the inner side of one side of the base portion 12 . The light-emitting element 40 emits light L toward the inside of one side of the base portion 12 through an optical system (not shown) such as a lens, and the light-receiving element 42 receives the reflected light from the inside of one side of the base portion 12 . That is, the inner side of one side surface of the base portion 12 functions as a reflector.
由於可藉由作業人員將腳伸入開口部12a，而將光L及其反射光遮蔽，因此讓受光元件42的受光光量改變。受光元件42在受光光量已改變到預定量以上的情況下，是將使升降機構18動作的預定的訊號傳送到控制部8。控制部8會依此預定的訊號來使升降機構18動作，而使罩蓋部16在保護位置與退避位置之間升降。 When the worker inserts his or her feet into the opening 12 a, the light L and its reflected light can be blocked, thereby changing the amount of light received by the light receiving element 42 . When the amount of light received by the light receiving element 42 has changed to a predetermined amount or more, a predetermined signal for operating the lifting mechanism 18 is transmitted to the control unit 8 . The control part 8 will operate the lifting mechanism 18 according to the predetermined signal to make the cover part 16 lift between the protection position and the retreat position.
再者，亦可將光L利用作為用於使加工裝置2辨識片匣搬運裝置等之自動搬送裝置(AGV(自動導引車輛)：Automatic Guided Vehicle)的辨識感測器。例如，在地面上移動的自動搬送裝置(未圖示)具有在其移動方向的前方朝水平方向突出的突起部。 Furthermore, the light L can also be used as a recognition sensor for causing the processing device 2 to recognize an automatic transport device (AGV (Automatic Guided Vehicle)) such as a cassette transport device. For example, an automatic conveyance device (not shown) that moves on the ground has a protrusion protruding in the horizontal direction in front of the moving direction.
在這種情況下，當自動搬送裝置來到片匣載置機構10的正面，且此突起部進入開口部12a，而藉由突 起部遮蔽光L時，加工裝置2即可以辨識自動搬送裝置已來到片匣載置機構10的正面之情形。之後，可將片匣30從自動搬送裝置載置到載置台14上(階段S10)，並接著依序進行上述之階段S20到階段S50。 In this case, when the automatic conveying device comes to the front of the cassette placing mechanism 10 and the protrusion enters the opening 12a, the protrusion When the rising portion blocks the light L, the processing device 2 can recognize that the automatic conveying device has arrived in front of the cassette placing mechanism 10 . After that, the film cassette 30 can be placed on the loading table 14 from the automatic transport device (stage S10 ), and then the above-mentioned stages S20 to S50 are sequentially performed.
另外，上述實施形態之構造、方法等，只要在不脫離本發明的目的之範圍下，均可適當變更而實施。本實施形態的升降機構18，雖然是所謂的磁鐵式的無桿氣缸22a、22b，但是無桿氣缸22a、22b亦可是狹縫式等的其他構造。 In addition, the structures, methods, etc. of the above-described embodiments can be appropriately modified and implemented without departing from the scope of the purpose of the present invention. The lifting mechanism 18 of this embodiment is a so-called magnet type rodless cylinder 22a, 22b. However, the rodless cylinders 22a, 22b may also be of other structures such as a slit type.
又，例如，上述的罩蓋部16雖然是以第1側面部16a、第2側面部16b及正面部16c之三個面所構成，但只要不阻礙罩蓋部16的升降動作，亦可在罩蓋部16的上部或位於與正面部16c為相反的相反側的背面部等的一部分設置罩蓋構件。 Furthermore, for example, although the above-mentioned cover part 16 is composed of three surfaces: the first side part 16a, the second side part 16b, and the front part 16c, as long as the lifting operation of the cover part 16 is not hindered, it may also be A cover member is provided on a part of the upper part of the cover part 16 or the back part located on the opposite side to the front part 16c.
1:晶圓(被加工物) 1: Wafer (processed object)
2:加工裝置 2: Processing device
2a、26a:正面 2a, 26a: front
3:膠帶 3: Tape
4:監視器 4:Monitor
5:環狀框架 5: Ring frame
6:搬送臂 6:Conveying arm
8:控制部 8:Control Department
9:晶圓單元 9: Wafer unit
10:片匣載置機構 10:Cassette loading mechanism
12:基台部 12:Abutment part
14:載置台 14: Loading platform
16:罩蓋部 16: Cover part
16a:第1側面部 16a: 1st side face
16b:第2側面部 16b: 2nd side face
16c:正面部 16c: Front face
16d:上端部 16d: upper end
26:框架部 26:Frame Department
26b:背面 26b: Back
26c:開口部 26c: opening
26d:腳輪 26d: casters
28:門部 28:Department
30:片匣 30: film box
32a:第1側面部 32a: 1st side face
32b:第2側面部 32b: 2nd side face
32c:連接部 32c:Connection part
32d:把手 32d: handle
32e:架板 32e: Shelves
32f:卡止部側 32f:Latching part side
32g:搬出入部側 32g: Moving in and out side
X、Y、Z:方向 X, Y, Z: direction
Claims (7)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-209753 | 2018-11-07 | ||
| JP2018209753A JP7330606B2 (en) | 2018-11-07 | 2018-11-07 | Processing device and cassette mounting mechanism |
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|---|---|
| TW202018853A TW202018853A (en) | 2020-05-16 |
| TWI827722B true TWI827722B (en) | 2024-01-01 |
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| JP (1) | JP7330606B2 (en) |
| KR (1) | KR20200052836A (en) |
| CN (1) | CN111162033A (en) |
| TW (1) | TWI827722B (en) |
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| JP6906674B1 (en) * | 2020-12-11 | 2021-07-21 | リンテック株式会社 | Frame accommodating device and frame accommodating method |
| CN112242338B (en) * | 2020-12-18 | 2021-03-02 | 西安奕斯伟硅片技术有限公司 | Load port and front end module capable of maintaining cleanliness of FOUP lid |
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| JP2016181655A (en) * | 2015-03-25 | 2016-10-13 | 株式会社テックインテック | Cassette stage and substrate processing apparatus |
| JP6551197B2 (en) * | 2015-11-30 | 2019-07-31 | シンフォニアテクノロジー株式会社 | Load port |
| TW201740495A (en) * | 2015-11-30 | 2017-11-16 | Sinfonia Technology Co Ltd | Load port |
| JP6804146B2 (en) * | 2016-11-10 | 2020-12-23 | 株式会社ディスコ | Transport equipment, processing equipment and transport method |
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2018
- 2018-11-07 JP JP2018209753A patent/JP7330606B2/en active Active
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2019
- 2019-10-31 KR KR1020190137284A patent/KR20200052836A/en not_active Application Discontinuation
- 2019-11-01 CN CN201911059612.7A patent/CN111162033A/en active Pending
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| US5026239A (en) * | 1988-09-06 | 1991-06-25 | Canon Kabushiki Kaisha | Mask cassette and mask cassette loading device |
| JPH10261686A (en) * | 1997-03-17 | 1998-09-29 | Dainippon Screen Mfg Co Ltd | Substrate treating apparatus and substrate carrying-in/ out device |
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| KR20200052836A (en) | 2020-05-15 |
| JP2020077737A (en) | 2020-05-21 |
| TW202018853A (en) | 2020-05-16 |
| CN111162033A (en) | 2020-05-15 |
| JP7330606B2 (en) | 2023-08-22 |
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