TWI825719B - System and method for automatic correction of double valves - Google Patents
System and method for automatic correction of double valves Download PDFInfo
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- TWI825719B TWI825719B TW111117974A TW111117974A TWI825719B TW I825719 B TWI825719 B TW I825719B TW 111117974 A TW111117974 A TW 111117974A TW 111117974 A TW111117974 A TW 111117974A TW I825719 B TWI825719 B TW I825719B
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- 238000012937 correction Methods 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000012530 fluid Substances 0.000 claims abstract description 133
- 230000009977 dual effect Effects 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims description 40
- 239000011248 coating agent Substances 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 29
- 230000003287 optical effect Effects 0.000 claims description 14
- 238000005516 engineering process Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 2
- 238000006073 displacement reaction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
本發明提供一種雙閥自動校正的系統及方法，包含初級***、第一 次級***及第二次級***，第一次級***及第二次級***分別連接第一流體塗覆器及第二流體塗覆器，其中初級***包含初級X軸***及初級Y軸***，第一次級***及第二次級***連接於初級X軸***，相較於先前技術將次級***安裝於初級Z軸***上，具有因減緩Z軸負重而可以提升Z軸方向上校正精度的技術效果。 The invention provides a system and method for automatic correction of dual valves, including a primary positioner, a first The secondary positioner and the second secondary positioner, the first secondary positioner and the second secondary positioner are respectively connected to the first fluid applicator and the second fluid applicator, wherein the primary positioner includes primary X-axis positioning and the primary Y-axis positioner. The first secondary positioner and the second secondary positioner are connected to the primary X-axis positioner. Compared with the previous technology, the secondary positioner is installed on the primary Z-axis positioner. The technical effect of slowing down the Z-axis load and improving the correction accuracy in the Z-axis direction.
Description
本發明是關於一種雙閥自動校正的系統及方法，且特別是關於一種用於自動點膠機之雙閥自動校正的系統及方法。 The present invention relates to a system and method for automatic correction of double valves, and in particular to a system and method for automatic correction of double valves for automatic dispensing machines.
近年來，由於電路板的微小化，關於如何將微小的電子元件(例如晶片等)以精密地、準確地方式固定於電路板上的技術越來越受重視，並進一步要求在維持上述精密度的情況下進行大量生產。 In recent years, due to the miniaturization of circuit boards, more and more attention has been paid to the technology of how to fix tiny electronic components (such as chips, etc.) on the circuit board in a precise and accurate manner, and there is further demand for maintaining the above-mentioned precision. mass production.
現有技術中，通常藉由點膠的方式將電子元件固定於基板上，目前已經有很多自動點膠相關的技術，為了提高點膠的效率，提出使用雙閥的概念進行點膠，其是搭配***將兩組流體塗覆器同時定位特定的位置，並使兩組流體塗覆器同時進行塗膠。 In the existing technology, electronic components are usually fixed on the substrate by dispensing. Currently, there are many technologies related to automatic dispensing. In order to improve the efficiency of dispensing, the concept of using a double valve for dispensing is proposed, which is combined with The positioner positions the two groups of fluid applicators at a specific position at the same time and enables the two groups of fluid applicators to apply glue at the same time.
關於***的結構，現有技術可分為初級定位結構及次級定位結構，初級定位結構為了使兩組流體塗覆器同時在X軸、Y軸、Z軸上進行定位，而包含初級X軸定位結構、初級Y軸定位結構、初級Z軸定位結構，同樣地，次級定位結構也包含次級X軸定位結構、次級Y軸定位結構、次級Z軸定位結構，且次級定位結構通常是安裝於初級Z軸定位結構。 Regarding the structure of the positioner, the existing technology can be divided into a primary positioning structure and a secondary positioning structure. In order to position the two groups of fluid applicators on the X-axis, Y-axis, and Z-axis at the same time, the primary positioning structure includes the primary X-axis Positioning structure, primary Y-axis positioning structure, primary Z-axis positioning structure, similarly, the secondary positioning structure also includes secondary X-axis positioning structure, secondary Y-axis positioning structure, secondary Z-axis positioning structure, and secondary positioning structure Usually installed on the primary Z-axis positioning structure.
然而，上述的***的結構存在有下述技術問題： However, the structure of the above locator has the following technical problems:
(1)次級定位結構安裝於初級Z軸定位結構，即次級定位結構將帶給初級Z軸定位結構額外的負重，導致初級Z軸定位結構的精密度下降。 (1) The secondary positioning structure is installed on the primary Z-axis positioning structure, that is, the secondary positioning structure will bring additional load to the primary Z-axis positioning structure, resulting in a decrease in the precision of the primary Z-axis positioning structure.
(2)初級定位結構及次級定位結構同時包含Z軸方向上的定位，彼此容易干擾而降低整體定位的精密度與點膠效率，例如當初級定位結構提供沿Z軸向上，而次級定位結構提供沿Z軸向下的定位時，彼此抵消反而影響整體在Z軸上定位的精密度與點膠效率。 (2) The primary positioning structure and the secondary positioning structure both include positioning in the Z-axis direction. They can easily interfere with each other and reduce the overall positioning precision and dispensing efficiency. For example, when the primary positioning structure provides upward positioning along the Z-axis, and the secondary positioning structure When the structure provides downward positioning along the Z-axis, they offset each other and affect the overall positioning precision and dispensing efficiency on the Z-axis.
(3)在兩組流體塗覆器共用相同的次級定位結構的情況下，兩組流體塗覆器彼此缺乏在特定方向上相對移動的靈活性；而當兩組流體塗覆器各自包含一組次級定位結構的情況下，如同上述，兩組流體塗覆器各自的次級定位結構容易彼此干擾而降低整體定位的精密度與點膠效率。 (3) When two groups of fluid applicators share the same secondary positioning structure, the two groups of fluid applicators lack the flexibility to move relative to each other in a specific direction; and when the two groups of fluid applicators each contain a In the case of a set of secondary positioning structures, as mentioned above, the secondary positioning structures of the two sets of fluid applicators are easy to interfere with each other and reduce the overall positioning precision and dispensing efficiency.
本發明創作人鑑於上述先前技術的各項缺點，乃亟思加以改良創新，並經多年的研究實驗後，終於成功研發完成本發明之雙閥自動校正的系統及方法。 In view of the shortcomings of the above-mentioned prior art, the creator of the present invention is eager to improve and innovate. After years of research and experiments, the inventor has finally successfully developed and completed the dual-valve automatic calibration system and method of the present invention.
本發明揭露一種雙閥自動校正的系統，包含：第一流體塗覆器，用於在目標基板之第一塗覆區域塗覆流體；第二流體塗覆器，用於在目標基板之第二塗覆區域塗覆流體；初級***，包含初級X軸***及初級Y軸***，使第一流體塗覆器及第二流體塗覆器在X軸及Y軸的方向上移動並進行初級定位；第一次級***，包含一第一次級Z軸***，且連接於初級X軸***及第一流體塗覆器，使第一流體塗覆器沿Z軸的方向上移動並進行次級定位而自動校正；以及第二次級***，包含次級X軸***、次級Y軸***、 以及第二次級Z軸***，且連接於初級X軸***及第二流體塗覆器，使第二流體塗覆器在X軸、Y軸及Z軸的方向上移動並進行次級定位而自動校正。 The invention discloses a dual-valve automatic calibration system, which includes: a first fluid applicator for applying fluid to a first coating area of a target substrate; a second fluid applicator for applying a fluid to a second coating area of the target substrate. The coating area applies fluid; the primary positioner includes a primary X-axis positioner and a primary Y-axis positioner to move the first fluid applicator and the second fluid applicator in the directions of the X-axis and the Y-axis. Primary positioning; the first secondary positioner includes a first secondary Z-axis positioner and is connected to the primary X-axis positioner and the first fluid applicator, so that the first fluid applicator moves in the direction of the Z-axis Move and perform secondary positioning and automatic correction; and the second secondary positioner, including the secondary X-axis positioner, the secondary Y-axis positioner, and a second secondary Z-axis positioner, and is connected to the primary X-axis positioner and the second fluid applicator, so that the second fluid applicator moves in the directions of the X-axis, Y-axis and Z-axis and performs secondary Positioning and automatic correction.
在本發明的一實施例中，初級***無法使第一流體塗覆器及第二流體塗覆器在Z軸的方向上移動。 In an embodiment of the invention, the primary positioner cannot move the first fluid applicator and the second fluid applicator in the Z-axis direction.
在本發明的一實施例中，第一次級***無法使第一流體塗覆器在X軸及Y軸的方向上移動。 In one embodiment of the invention, the first secondary positioner cannot move the first fluid applicator in the X-axis and Y-axis directions.
在本發明的一實施例中，在第二次級***中，第二次級Z軸***連接於初級X軸***，並且支撐著次級X軸***及次級Y軸***，次級X軸***及次級Y軸***連接於第二流體塗覆器。 In an embodiment of the invention, in the second secondary positioner, the second secondary Z-axis positioner is connected to the primary X-axis positioner and supports the secondary X-axis positioner and the secondary Y-axis positioner , the secondary X-axis positioner and the secondary Y-axis positioner are connected to the second fluid applicator.
在本發明的一實施例中，在第二次級***中，次級X軸***及次級Y軸***連接於初級X軸***，並且支撐著第二次級Z軸***，第二次級Z軸***連接於第二流體塗覆器。 In an embodiment of the invention, in the second secondary positioner, the secondary X-axis positioner and the secondary Y-axis positioner are connected to the primary X-axis positioner and support the second secondary Z-axis positioner , the second secondary Z-axis positioner is connected to the second fluid applicator.
在本發明的一實施例中，雙閥自動校正的系統更包含用於偵測目標基板之第一塗覆區域及第二塗覆區域的光學元件。 In an embodiment of the present invention, the dual-valve automatic calibration system further includes an optical element for detecting the first coating area and the second coating area of the target substrate.
在本發明的一實施例中，光學元件包含電荷耦合裝置(CCD)及雷射感測器。 In one embodiment of the invention, the optical element includes a charge coupled device (CCD) and a laser sensor.
本發明另揭露一種雙閥自動校正的方法，包含：偵測目標基板之第一塗覆區域及第二塗覆區域的位置資訊，藉由初級***使第一流體塗覆器及第二流體塗覆器在X軸及Y軸的方向上移動並進行初級定位；偵測目標基板之第一塗覆區域的第一傾斜或第一起伏所對應的第一誤差資訊，藉由第一次級***使第一流體塗覆器在Z軸方向上移動並進行次級定位而自動校正；偵測目標基板之第二塗覆區域的第二傾斜或第二起伏所對應的第二誤差資訊，藉由 第二次級***使第二流體塗覆器在X軸、Y軸及Z軸方向上移動並進行次級定位而自動校正；以及藉由所述第一流體塗覆器將流體塗覆於所述第一塗覆區域，藉由所述第二流體塗覆器將流體塗覆於所述第二塗覆區域。 The present invention also discloses a dual-valve automatic calibration method, which includes: detecting the position information of the first coating area and the second coating area of the target substrate, and using the primary positioner to move the first fluid applicator and the second fluid The coater moves in the direction of the X-axis and the Y-axis and performs primary positioning; detects the first error information corresponding to the first tilt or the first undulation of the first coating area of the target substrate, and uses the first primary The positioner moves the first fluid applicator in the Z-axis direction and performs secondary positioning for automatic correction; detects second error information corresponding to the second inclination or the second undulation of the second coating area of the target substrate, by The second secondary positioner moves the second fluid applicator in the X-axis, Y-axis and Z-axis directions and performs secondary positioning for automatic correction; and the first fluid applicator applies the fluid to In the first coating area, the second fluid applicator applies fluid to the second coating area.
在本發明的一實施例中，初級***無法使第一流體塗覆器及第二流體塗覆器在Z軸的方向上移動。 In an embodiment of the invention, the primary positioner cannot move the first fluid applicator and the second fluid applicator in the Z-axis direction.
在本發明的一實施例中，第一次級***無法使第一流體塗覆器在X軸及Y軸的方向上移動。 In one embodiment of the invention, the first secondary positioner cannot move the first fluid applicator in the X-axis and Y-axis directions.
藉由如上的雙閥自動校正的系統及方法，本發明相較於傳統的雙閥點膠技術，由於本發明不將次級***安裝於初級Z軸***，能夠降低初級Z軸***的負重而提高Z軸定位的精密度。 Through the above dual-valve automatic correction system and method, compared with the traditional dual-valve dispensing technology, the present invention does not install the secondary positioner on the primary Z-axis positioner, and can reduce the size of the primary Z-axis positioner. load-bearing to improve the precision of Z-axis positioning.
在一實施例中，由於本發明初級定位結構無法使兩組流體塗覆器在Z軸的方向上移動，在Z軸方向上不會產生因初級定位結構與次級定位結構彼此之間的干擾，進而提升精密度與點膠效率。 In one embodiment, since the primary positioning structure of the present invention cannot move the two groups of fluid applicators in the Z-axis direction, there will be no interference between the primary positioning structure and the secondary positioning structure in the Z-axis direction. , thereby improving precision and dispensing efficiency.
在一實施例中，由於本發明使兩組流體塗覆器各自包含次級***，並使其一次級***包含次級Z軸***而無法在X、Y軸方向上移動、另一次級***包含次級X、Y、Z軸***，上述結構可以降低兩組次級***之間的干擾，進而提升整體定位的精密度與點膠效率。 In one embodiment, due to the present invention, the two groups of fluid applicators each include a secondary positioner, and the primary positioner includes a secondary Z-axis positioner and cannot move in the X and Y axis directions. The first-level positioner includes secondary X, Y, and Z-axis positioners. The above structure can reduce the interference between the two sets of secondary positioners, thereby improving the overall positioning precision and dispensing efficiency.
1:第一流體塗覆器 1: First fluid applicator
2:第二流體塗覆器 2: Second fluid applicator
3:初級*** 3: Primary locator
31:初級X軸*** 31: Primary X-axis positioner
32:初級Y軸*** 32: Primary Y-axis positioner
4:第一次級*** 4: First secondary locator
41:第一次級Z軸*** 41: First secondary Z-axis positioner
5:第二次級*** 5:Second secondary locator
51:第二次級Z軸*** 51: Secondary Z-axis positioner
52:次級X軸*** 52:Secondary X-axis positioner
53:次級Y軸*** 53: Secondary Y-axis positioner
6:光學元件 6: Optical components
61:電荷耦合裝置(CCD) 61: Charge coupled device (CCD)
62:雷射 62:Laser
X、Y、Z:方向 X, Y, Z: direction
圖1為本發明的一實施例之雙閥自動校正的系統正面的示意圖。 FIG. 1 is a schematic diagram of the front of a dual-valve automatic correction system according to an embodiment of the present invention.
圖2為本發明的一實施例之雙閥自動校正的系統側面的示意圖。 FIG. 2 is a schematic side view of a dual-valve automatic correction system according to an embodiment of the present invention.
圖3為本發明的另一實施例之雙閥自動校正的系統正面的示意圖。 FIG. 3 is a schematic diagram of the front side of a dual-valve automatic correction system according to another embodiment of the present invention.
圖4為本發明的另一實施例之雙閥自動校正的系統側面的示意圖。 FIG. 4 is a schematic side view of a dual-valve automatic correction system according to another embodiment of the present invention.
為了使所屬技術領域中具有通常識者能夠充分瞭解本發明之技術特徵、內容與優點及其所能達到之功效，茲將本發明配合圖式，並以實施例之表達形式詳細說明如下，而其中所使用之圖式，其主旨僅為示意及輔助說明書之用，未必為本發明實施後之真實比例與精準配置，故不應就所附之圖式的比例與配置關係解讀、侷限本發明於實際實施上的專利申請範圍，合先敘明。 In order to enable those with ordinary knowledge in the technical field to fully understand the technical features, content, advantages and effects achieved by the present invention, the present invention is described in detail below in conjunction with the drawings and in the form of embodiments, wherein The purpose of the drawings used is only for illustration and auxiliary description, and may not represent the actual proportions and precise configurations after implementation of the present invention. Therefore, the proportions and configuration relationships of the attached drawings should not be interpreted or limited to the scope of the present invention. The actual implementation scope of the patent application shall be stated first.
請參閱圖1、圖2，其係為本發明的一實施例之雙閥自動校正的系統正面及側面的示意圖，如圖所示，雙閥自動校正的系統包含：第一流體塗覆器1，用於在目標基板之第一塗覆區域塗覆流體；第二流體塗覆器2，用於在目標基板之第二塗覆區域塗覆流體；初級***3，包含初級X軸***31及初級Y軸***32，使第一流體塗覆器1及第二流體塗覆器2在X軸及Y軸的方向上移動並進行初級定位；第一次級***4，包含第一次級Z軸***41，且連接於初級X軸***31及第一流體塗覆器1，使第一流體塗覆器1沿Z軸的方向上移動並進行次級定位而自動校正；以及第二次級***5，包含次級X軸***52、次級Y軸***53、以及第二次級Z軸***51，且連接於初級X軸***31及第二流體塗覆器2，使第二流體塗覆器2在X軸、Y軸及Z軸的方向上移動並進行次級定位而自動校正。 Please refer to Figures 1 and 2, which are schematic diagrams of the front and side of a dual-valve automatic correction system according to an embodiment of the present invention. As shown in the figure, the dual-valve automatic correction system includes: a first fluid applicator 1 , used to apply fluid in the first coating area of the target substrate; the second fluid applicator 2, used to apply fluid in the second coating area of the target substrate; the primary positioner 3, including the primary X-axis positioner 31 and the primary Y-axis positioner 32 to move the first fluid applicator 1 and the second fluid applicator 2 in the directions of the X-axis and the Y-axis and perform primary positioning; the first secondary positioner 4 includes the The primary Z-axis positioner 41 is connected to the primary X-axis positioner 31 and the first fluid applicator 1 to move the first fluid applicator 1 in the direction of the Z-axis and perform secondary positioning for automatic correction. ; and the second secondary positioner 5, including the secondary X-axis positioner 52, the secondary Y-axis positioner 53, and the second secondary Z-axis positioner 51, and is connected to the primary X-axis positioner 31 and the second The fluid applicator 2 moves the second fluid applicator 2 in the directions of the X-axis, Y-axis, and Z-axis and performs secondary positioning to automatically correct.
以下針對本發明之雙閥自動校正的系統之各個元件進行詳細說明，然而，本發明並不受限於此。 Each component of the dual-valve automatic correction system of the present invention will be described in detail below. However, the present invention is not limited thereto.
[雙閥之流體塗覆器] [Two valve fluid applicator]
本發明的雙閥自動校正的系統中，所謂的雙閥是指系統所採用的兩個噴閥，系統可以使兩個噴閥同時進行塗覆的作業；在本發明中，雙閥可以是兩個流體塗覆器，在一實施例中，雙閥例如分別是指第一流體塗覆器1及第二流體塗覆器2，上述流體塗覆器的結構並不限定，可以是適用於使用者所預期應用的任何類型，例如可列舉：空氣操作的針閥或噴口、氣動操作的噴射閥、儲存有流體的塗覆閥等；並且，第一流體塗覆器1及第二流體塗覆器2的結構彼此可以相同，也可以不同；此外，流體的種類並不限定，可以是氣體或液體，其中液體可以是任何焊膏、底部填充材料、黏合劑或密封劑；在一實施例中，第一流體塗覆器1及第二流體塗覆器2兩者皆為儲存有黏膠流體的點膠閥。 In the double-valve automatic correction system of the present invention, the so-called double valve refers to the two spray valves used in the system. The system can enable the two spray valves to perform coating operations at the same time; in the present invention, the double valve can be two spray valves. A fluid applicator. In one embodiment, the double valves refer to a first fluid applicator 1 and a second fluid applicator 2 respectively. The structure of the above-mentioned fluid applicator is not limited and may be suitable for use. Any type of application expected by the user, for example, air-operated needle valves or nozzles, pneumatically operated injection valves, fluid-stored coating valves, etc.; and, the first fluid applicator 1 and the second fluid applicator 1 The structures of the devices 2 can be the same as each other or different; in addition, the type of fluid is not limited and can be gas or liquid, wherein the liquid can be any solder paste, underfill material, adhesive or sealant; in an embodiment , both the first fluid applicator 1 and the second fluid applicator 2 are dispensing valves storing adhesive fluid.
[***] [Locator]
本發明的雙閥自動校正的系統中，所謂的***是指用於將流體塗覆器位移到特定位置所使用的裝置，例如可以直線、弧線等方式進行位移，也可以藉由移動、滑動等方式進行位移；在本發明中，***包含初級***3、第一次級***4、第二次級***5，其中初級***3的移動可以轉換到次級***及連接於次級***上的流體塗覆器；***只要能夠實現在X軸、Y軸、Z軸上的位移與定位，其結構並不受限制，例如可以包含支撐件、引導件、軌道、滑架等元件。 In the dual-valve automatic correction system of the present invention, the so-called positioner refers to a device used to displace the fluid applicator to a specific position. For example, it can be displaced in a straight line, an arc, etc., or it can be moved or slid. Displacement is carried out in other ways; in the present invention, the positioner includes a primary positioner 3, a first secondary positioner 4, and a second secondary positioner 5, in which the movement of the primary positioner 3 can be converted to the secondary positioner and connected Fluid applicator on the secondary positioner; as long as the positioner can achieve displacement and positioning on the X-axis, Y-axis, and Z-axis, its structure is not limited, for example, it can include supports, guides, tracks, Slides and other components.
[初級***] [Primary locator]
本發明的雙閥自動校正的系統中，初級***3包含初級X軸***31及初級Y軸***32，只要可以使第一流體塗覆器1及第二流體塗覆器2在X軸及Y軸的方向上移動並進行初級定位，則初級***3的結構並不限定，例如可藉由一系列可控制的動力驅動機構來實現，具體來說，每一移動方向(X軸 方向、Y軸方向)可藉由至少一個對應的動力驅動機構來提供動力；初級***3與次級***連接，較佳為初級X軸***31與次級***連接、或初級Y軸***32與次級***連接；在一實施例中，初級***3無法使第一流體塗覆器1及第二流體塗覆器2在Z軸的方向上移動，並且使初級X軸***31與次級***連接，藉由上述構成，相較於傳統的雙閥點膠裝置將次級***安裝於初級Z軸***上，本發明能夠降低初級Z軸***的負重而提高Z軸定位的精密度，並進一步減少初級***3與次級***之間在Z軸方向上的干擾，可提升整體定位的精密度與點膠效率。 In the dual-valve automatic correction system of the present invention, the primary positioner 3 includes a primary X-axis positioner 31 and a primary Y-axis positioner 32, as long as the first fluid applicator 1 and the second fluid applicator 2 can be positioned at X The structure of the primary positioner 3 is not limited to move in the direction of the axis and the Y-axis and perform primary positioning. For example, it can be realized by a series of controllable power drive mechanisms. Specifically, each movement direction (X-axis direction, Y-axis direction) can be powered by at least one corresponding power drive mechanism; the primary positioner 3 is connected to the secondary positioner, preferably the primary X-axis positioner 31 is connected to the secondary positioner, or the primary Y-axis positioner is connected to the secondary positioner. The axis positioner 32 is connected to the secondary positioner; in one embodiment, the primary positioner 3 cannot move the first fluid applicator 1 and the second fluid applicator 2 in the direction of the Z axis, and makes the primary X The axis positioner 31 is connected to the secondary positioner. Through the above structure, compared with the traditional dual-valve dispensing device that installs the secondary positioner on the primary Z-axis positioner, the present invention can reduce the load of the primary Z-axis positioner. Load-bearing can improve the precision of Z-axis positioning and further reduce the interference between the primary positioner 3 and the secondary positioner in the Z-axis direction, which can improve the overall positioning precision and dispensing efficiency.
在一實施例中，初級***3的初級X軸***31與次級***連接，可以將初級***3在X軸方向上所提供的位移X1、以及在Y軸方向上所提供的位移Y1轉移到次級***，並實現連接於次級***之上之雙閥的初級定位。 In one embodiment, the primary X-axis positioner 31 of the primary positioner 3 is connected to the secondary positioner, and the displacement X 1 provided by the primary positioner 3 in the X-axis direction and the displacement X 1 provided in the Y-axis direction can be The displacement Y 1 is transferred to the secondary positioner and realizes the primary positioning of the double valve connected to the secondary positioner.
[第一次級***] [first secondary locator]
本發明的雙閥自動校正的系統中，次級***實現相對於初級***3的額外移動，且雙閥之流體塗覆器各別具有自己的次級***，即第一流體塗覆器連接於第一次級***，第二流體塗覆器連接於第二次級***；第一次級***4包含第一次級Z軸***41，且連接於初級X軸***31及第一流體塗覆器1，使所述第一流體塗覆器1沿Z軸的方向上移動並進行次級定位而自動校正。 In the dual-valve automatic correction system of the present invention, the secondary positioner realizes additional movement relative to the primary positioner 3, and the fluid applicators of the dual valves each have their own secondary positioner, that is, the first fluid applicator The first secondary positioner 4 includes the first secondary Z-axis positioner 41 and is connected to the primary X-axis positioner. The device 31 and the first fluid applicator 1 are moved in the direction of the Z-axis and perform secondary positioning for automatic correction.
在一實施例中，第一次級***4無法使第一流體塗覆器1在X軸及Y軸的方向上移動，藉由上述構成，可以降低兩組次級***之間在X軸方向、Y軸方向上彼此的干擾，進而提升整體定位的精密度與點膠效率。 In one embodiment, the first secondary positioner 4 cannot move the first fluid applicator 1 in the directions of the X-axis and Y-axis. With the above structure, the X-axis between the two sets of secondary positioners can be reduced. Axis direction and Y-axis direction interfere with each other, thus improving the overall positioning precision and dispensing efficiency.
在一實施例中，第一流體塗覆器1藉由初級***3先進行X1、Y1方向的初級定位，再藉由第一次級Z軸***41進行Z1方向的次級定位及校正，藉由上述構成，初級***3與第一次級***4之間在X軸、Y軸、Z軸方向都不會產生彼此之間的干擾，進而提升精密度與點膠效率。 In one embodiment, the first fluid applicator 1 first performs primary positioning in the X 1 and Y 1 directions through the primary positioner 3 , and then performs secondary positioning in the Z 1 direction through the first secondary Z-axis positioner 41 Positioning and correction, with the above structure, there will be no interference between the primary positioner 3 and the first secondary positioner 4 in the X-axis, Y-axis, and Z-axis directions, thereby improving precision and dispensing. efficiency.
[第二次級***] [Second Secondary Locator]
本發明的雙閥自動校正的系統中，第二次級***5包含次級X軸***52、次級Y軸***53、以及第二次級Z軸***51，且連接於初級X軸***31及第二流體塗覆器2，使第二流體塗覆器2在X軸、Y軸及Z軸的方向上移動並進行次級定位而自動校正。 In the dual-valve automatic correction system of the present invention, the second secondary positioner 5 includes a secondary X-axis positioner 52, a secondary Y-axis positioner 53, and a second secondary Z-axis positioner 51, and is connected to the primary The X-axis positioner 31 and the second fluid applicator 2 move the second fluid applicator 2 in the directions of the X-axis, Y-axis and Z-axis and perform secondary positioning for automatic correction.
在一實施例中，第二流體塗覆器2藉由初級***3先進行X1、Y1方向的初級定位，再藉由次級X軸***52、次級Y軸***53、以及第二次級Z軸***51進行X2、Y2、Z2方向的次級定位及校正，其中X2、Y2方向的移動相對於初級***3所進行的X1、Y1方向的移動相對細微，即次級***所實現的X2、Y2方向移動範圍相對於初級***3所進行的X1、Y1方向的移動範圍小；藉由上述構成，可以降低兩組次級***之間的干擾，進而提升整體定位的精密度與點膠效率。 In one embodiment, the second fluid applicator 2 first performs primary positioning in the X 1 and Y 1 directions through the primary positioner 3, and then through the secondary X-axis positioner 52, the secondary Y-axis positioner 53, And the second secondary Z-axis positioner 51 performs secondary positioning and correction in the X 2 , Y 2 , and Z 2 directions, where the movement in the X 2 and Y 2 directions is relative to the X 1 and Y 1 performed by the primary positioner 3 The movement in the direction is relatively subtle, that is, the movement range in the X 2 and Y 2 directions realized by the secondary positioner is smaller than the movement range in the X 1 and Y 1 directions performed by the primary positioner 3; with the above structure, both The interference between the secondary positioners is eliminated, thereby improving the overall positioning precision and dispensing efficiency.
本發明之第二次級***5中，其次級X軸***52、次級Y軸***53、以及第二次級Z軸***51彼此設置的位置並不受限制，請參考圖1、圖2，本發明的一實施例中，第二次級Z軸***51連接於初級X軸***31，並且支撐著次級X軸***52及次級Y軸***53，次級X軸***52及次級Y軸***53連接於第二流體塗覆器2；藉由上述的構成，由於次 級X軸***52及次級Y軸***53與第二流體塗覆器2的距離較近，可以提升在X軸、Y軸方向上的校正精密度。 In the second secondary positioner 5 of the present invention, the positions of the secondary X-axis positioner 52, the secondary Y-axis positioner 53, and the second secondary Z-axis positioner 51 are not limited to each other. Please refer to the figure. 1. Figure 2, in an embodiment of the present invention, the second secondary Z-axis positioner 51 is connected to the primary X-axis positioner 31, and supports the secondary X-axis positioner 52 and the secondary Y-axis positioner 53. The secondary X-axis positioner 52 and the secondary Y-axis positioner 53 are connected to the second fluid applicator 2; with the above structure, due to the secondary The distance between the primary X-axis positioner 52 and the secondary Y-axis positioner 53 is relatively close to the second fluid applicator 2, which can improve the correction precision in the X-axis and Y-axis directions.
請參考圖3、圖4，在本發明的另一實施例中，在第二次級***5中，次級X軸***52及次級Y軸***53連接於初級X軸***31，並且支撐著第二次級Z軸***51，第二次級Z軸***51連接於第二流體塗覆器2；藉由上述的構成，由於第二次級Z軸***51與第二流體塗覆器2的距離較近，可以提升在Z軸方向上的校正精密度。 Please refer to Figures 3 and 4. In another embodiment of the present invention, in the second secondary positioner 5, the secondary X-axis positioner 52 and the secondary Y-axis positioner 53 are connected to the primary X-axis positioner. 31, and supports the second secondary Z-axis positioner 51, which is connected to the second fluid applicator 2; with the above structure, due to the second secondary Z-axis positioner 51 The closer distance to the second fluid applicator 2 can improve the correction precision in the Z-axis direction.
[光學元件] [Optical components]
在一實施例中，雙閥自動校正的系統可更包含用於偵測目標基板之第一塗覆區域及第二塗覆區域的光學元件6，具體來說，光學元件6用於高度感測操作，例如沿者目標基板的XY平面偵測每一個位置的Z軸狀態，上述每一個位置的Z軸狀態可包含目標基板相對於XY平面的傾斜、起伏；在此情況下，光學元件6可以測量上述基板的傾斜、起伏之多個Z軸狀態並使第一流體塗覆器1及第二流體塗覆器2定位於適當的位置；在一實施例中，光學元件6可以為包含電荷耦合裝置(CCD)61或雷射62之雷射感測器。 In one embodiment, the dual-valve automatic correction system may further include an optical element 6 for detecting the first coating area and the second coating area of the target substrate. Specifically, the optical element 6 is used for height sensing. Operation, for example, detecting the Z-axis state of each position along the XY plane of the target substrate. The Z-axis state of each position may include the tilt and undulation of the target substrate relative to the XY plane; in this case, the optical element 6 can Measure multiple Z-axis states of the inclination and undulation of the substrate and position the first fluid applicator 1 and the second fluid applicator 2 at appropriate positions; in one embodiment, the optical element 6 may include charge coupling Device (CCD) 61 or laser sensor 62.
上述構成可以使第一流體塗覆器1及第二流體塗覆器2彼此在X、Y、Z軸的方向上相對移動而進行定位校正，使第一流體塗覆器1及第二流體塗覆器2精準地將流體圖案塗覆於目標基板之第一塗覆區域及第二塗覆區域；在一實施例中，上述流體圖案可以為一個或多個線條、弧形、點狀、其他形狀或其組合，也可以為連續地塗覆、間隔地塗覆、其他塗覆方式或其組合；在一實施例中，當第一流體塗覆器1及第二流體塗覆器2的結構相同的情況下，經過上述的自動校正之後，可以在目標基板未對準(例如存在有傾斜、起伏等)時精準地 進行流體的塗覆，使兩者在目標基板上的流體圖案位置、大小、形狀實質上相同。 The above structure allows the first fluid applicator 1 and the second fluid applicator 2 to move relative to each other in the directions of the X, Y, and Z axes for positioning correction, so that the first fluid applicator 1 and the second fluid applicator 2 The coater 2 accurately applies a fluid pattern to the first coating area and the second coating area of the target substrate; in one embodiment, the fluid pattern may be one or more lines, arcs, dots, or other shapes. The shape or combination thereof can also be continuous coating, interval coating, other coating methods or combinations thereof; in one embodiment, when the structures of the first fluid applicator 1 and the second fluid applicator 2 Under the same circumstances, after the above-mentioned automatic correction, it can be accurately detected when the target substrate is misaligned (for example, there is tilt, undulation, etc.) The fluid is applied so that the positions, sizes, and shapes of the fluid patterns on the target substrate are substantially the same.
初級***3和次級***可藉由至少一控制裝置(圖未示出)來獨立地控制，例如控制裝置可以藉由控制至少一驅動裝置來引導初級***3進行X1、Y1方向的定位，藉由控制驅動裝置來引導第一次級***4進行Z1方向的定位、以及藉由控制至少一驅動裝置來引導第二次級***5進行X2、Y2、Z2方向的定位；藉由上述構成，可以更加靈活地控制第一流體塗覆器1及第二流體塗覆器2的定位與校正，可以在目標基板未對準(例如存在有傾斜、起伏等)時精準地進行流體的塗覆。 The primary positioner 3 and the secondary positioner can be independently controlled by at least one control device (not shown). For example, the control device can guide the primary positioner 3 to perform X 1 and Y 1 by controlling at least one driving device. Positioning in the direction, by controlling the driving device to guide the first secondary positioner 4 to position in the Z 1 direction, and by controlling at least one driving device to guide the second secondary positioner 5 to perform X 2 , Y 2 , Z Positioning in 2 directions; with the above structure, the positioning and correction of the first fluid applicator 1 and the second fluid applicator 2 can be more flexibly controlled, and can be used when the target substrate is misaligned (such as tilt, undulation, etc.) ) to accurately apply the fluid.
當雙閥自動校正的系統包含用於偵測目標基板之第一塗覆區域及第二塗覆區域之光學元件6的情況下，光學元件6測量基板的傾斜、起伏之多個Z軸狀態，並將該訊息傳輸給控制裝置，控制裝置可基於光學元件6所提供的多個Z軸狀態資訊來控制初級***3和次級***以進行定位。 When the dual-valve automatic correction system includes an optical element 6 for detecting the first coating area and the second coating area of the target substrate, the optical element 6 measures multiple Z-axis states of the tilt and undulation of the substrate, The information is transmitted to the control device, and the control device can control the primary positioner 3 and the secondary positioner for positioning based on the multiple Z-axis status information provided by the optical element 6 .
[雙閥自動校正的方法] [Method for automatic calibration of dual valves]
本發明之雙閥自動校正的方法，包含：偵測目標基板之第一塗覆區域及第二塗覆區域的位置資訊，藉由初級***3使第一流體塗覆器1及第二流體塗覆器2在X軸及Y軸的方向上移動並進行初級定位；偵測目標基板之第一塗覆區域的第一傾斜或第一起伏所對應的第一誤差資訊，藉由第一次級***4使第一流體塗覆器1在Z軸方向上移動並進行次級定位而自動校正；以及偵測目標基板之第二塗覆區域的第二傾斜或第二起伏所對應的第二誤差資訊，藉由第二次級***5使第二流體塗覆器2在X軸、Y軸及Z軸方向上移動並進行次級定位而自動校正。 The dual-valve automatic calibration method of the present invention includes: detecting the position information of the first coating area and the second coating area of the target substrate, and using the primary positioner 3 to move the first fluid applicator 1 and the second fluid The coater 2 moves in the direction of the X-axis and the Y-axis and performs primary positioning; detects the first error information corresponding to the first tilt or the first undulation of the first coating area of the target substrate, and uses the first The stage positioner 4 moves the first fluid applicator 1 in the Z-axis direction and performs secondary positioning for automatic correction; and detects the second inclination or the second undulation corresponding to the second coating area of the target substrate. The second error information is automatically corrected by the second secondary positioner 5 moving the second fluid applicator 2 in the X-axis, Y-axis and Z-axis directions and performing secondary positioning.
在一實施例中，藉由偵測目標基板之第一塗覆區域及第二塗覆區域的Z軸狀態，來控制初級***3和次級***以進行定位。 In one embodiment, the primary positioner 3 and the secondary positioner are controlled to perform positioning by detecting the Z-axis status of the first coating area and the second coating area of the target substrate.
在一實施例中，初級***3無法使第一流體塗覆器1及第二流體塗覆器2在Z軸的方向上移動，藉此減少初級***3與次級***之間的干擾，可提升整體定位的精密度與點膠效率。 In one embodiment, the primary positioner 3 cannot move the first fluid applicator 1 and the second fluid applicator 2 in the Z-axis direction, thereby reducing the friction between the primary positioner 3 and the secondary positioner. Interference can improve the overall positioning precision and dispensing efficiency.
在一實施例中，第一次級***4無法使所述第一流體塗覆器1在X軸及Y軸的方向上移動，可以降低兩組次級***之間的干擾，進而提升整體定位的精密度與點膠效率。 In one embodiment, the first secondary positioner 4 cannot move the first fluid applicator 1 in the directions of the X-axis and Y-axis, which can reduce the interference between the two sets of secondary positioners, thereby improving Overall positioning precision and dispensing efficiency.
綜上所述，本發明藉由不將次級***安裝於初級Z軸***，能夠降低初級Z軸***的負重而提高整體Z軸定位的精密度；並且，由於本發明使兩組流體塗覆器各自包含次級***，並將其一次級***包含次級Z軸***而無法在X軸、Y軸方向上移動，可以降低兩組次級***之間的干擾，進而提升整體定位的精密度與點膠效率；此外，由於本發明初級定位結構無法使兩組流體塗覆器在Z軸的方向上移動，在Z軸方向上不會產生因初級定位結構與次級定位結構之間的干擾，進而提升精密度與點膠效率。 In summary, by not installing the secondary positioner on the primary Z-axis positioner, the present invention can reduce the load of the primary Z-axis positioner and improve the overall Z-axis positioning precision; and, because the present invention allows two groups of Each fluid applicator contains a secondary positioner, and its primary positioner contains a secondary Z-axis positioner so that it cannot move in the X-axis and Y-axis directions, which can reduce the interference between the two sets of secondary positioners. This further improves the overall positioning precision and dispensing efficiency; in addition, since the primary positioning structure of the present invention cannot move the two groups of fluid applicators in the Z-axis direction, there will be no interference between the primary positioning structure and the secondary fluid applicators in the Z-axis direction. levels of interference between positioning structures, thereby improving precision and dispensing efficiency.
以上所述僅為舉例性，用以說明本發明之技術內容的可行具體實施例，而非用於限制本發明。本發明所屬技領域具有通常知識者基於說明書中所揭示內容之教示所為的等效置換、修改或變更，均包含於本發明之申請專利範圍中，未脫離本發明的專利申請範疇。 The above descriptions are only exemplary and are used to illustrate possible specific embodiments of the technical content of the present invention, but are not intended to limit the present invention. Equivalent substitutions, modifications or alterations made by those with ordinary skill in the art based on the teachings disclosed in the specification are included in the patent application scope of the present invention and do not deviate from the patent application scope of the present invention.
1:第一流體塗覆器 1: First fluid applicator
2:第二流體塗覆器 2: Second fluid applicator
3:初級*** 3: Primary locator
31:初級X軸*** 31: Primary X-axis positioner
32:初級Y軸*** 32: Primary Y-axis positioner
4:第一次級*** 4: First secondary locator
41:第一次級Z軸*** 41: First secondary Z-axis positioner
5:第二次級*** 5:Second secondary locator
51:第二次級Z軸*** 51: Secondary Z-axis positioner
52:次級X軸*** 52:Secondary X-axis positioner
53:次級Y軸*** 53: Secondary Y-axis positioner
6:光學元件 6: Optical components
61:電荷耦合裝置(CCD) 61: Charge coupled device (CCD)
62:雷射 62:Laser
X、Z:方向 X, Z: direction
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111117974A TWI825719B (en) | 2022-05-13 | 2022-05-13 | System and method for automatic correction of double valves |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111117974A TWI825719B (en) | 2022-05-13 | 2022-05-13 | System and method for automatic correction of double valves |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202344314A TW202344314A (en) | 2023-11-16 |
| TWI825719B true TWI825719B (en) | 2023-12-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111117974A TWI825719B (en) | 2022-05-13 | 2022-05-13 | System and method for automatic correction of double valves |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI825719B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201513762A (en) * | 2013-09-30 | 2015-04-01 | Illinois Tool Works | Method and apparatus for automatically adjusting dispensing units of a dispenser |
| TWM531649U (en) * | 2016-06-03 | 2016-11-01 | Siacin Internat Co Ltd | Platform level automatic calibration device |
| CN208853149U (en) * | 2018-07-10 | 2019-05-14 | 深圳市轴心自控技术有限公司 | Synchronous bivalve self-checking device |
| CN112505958A (en) * | 2020-12-18 | 2021-03-16 | 深圳智赛机器人有限公司 | High-precision calibrating mechanism for attaching ultralong auxiliary materials and automatic adhesive tape sticking equipment |
| CN113245144A (en) * | 2021-06-28 | 2021-08-13 | 普洛赛斯（苏州）智能装备有限公司 | Automatic synchronous adjustment double-head dispenser for PCB |
| TWM631214U (en) * | 2022-05-13 | 2022-08-21 | 邑富股份有限公司 | Two-valve automatic calibrating system |
-
2022
- 2022-05-13 TW TW111117974A patent/TWI825719B/en active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201513762A (en) * | 2013-09-30 | 2015-04-01 | Illinois Tool Works | Method and apparatus for automatically adjusting dispensing units of a dispenser |
| TW201739331A (en) * | 2013-09-30 | 2017-11-01 | 伊利諾工具工程公司 | Method and apparatus for automatically adjusting dispensing units of a dispenser |
| TW201739332A (en) * | 2013-09-30 | 2017-11-01 | 伊利諾工具工程公司 | Method and apparatus for automatically adjusting dispensing units of a dispenser |
| TWM531649U (en) * | 2016-06-03 | 2016-11-01 | Siacin Internat Co Ltd | Platform level automatic calibration device |
| CN208853149U (en) * | 2018-07-10 | 2019-05-14 | 深圳市轴心自控技术有限公司 | Synchronous bivalve self-checking device |
| CN112505958A (en) * | 2020-12-18 | 2021-03-16 | 深圳智赛机器人有限公司 | High-precision calibrating mechanism for attaching ultralong auxiliary materials and automatic adhesive tape sticking equipment |
| CN113245144A (en) * | 2021-06-28 | 2021-08-13 | 普洛赛斯（苏州）智能装备有限公司 | Automatic synchronous adjustment double-head dispenser for PCB |
| TWM631214U (en) * | 2022-05-13 | 2022-08-21 | 邑富股份有限公司 | Two-valve automatic calibrating system |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202344314A (en) | 2023-11-16 |
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