TWI825292B - Wafer surface particle cleaning nozzle - Google Patents
Wafer surface particle cleaning nozzle Download PDFInfo
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- TWI825292B TWI825292B TW109109734A TW109109734A TWI825292B TW I825292 B TWI825292 B TW I825292B TW 109109734 A TW109109734 A TW 109109734A TW 109109734 A TW109109734 A TW 109109734A TW I825292 B TWI825292 B TW I825292B
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- gas
- wafer surface
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- 238000004140 cleaning Methods 0.000 title claims abstract description 54
- 239000002245 particle Substances 0.000 title claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 161
- 238000000889 atomisation Methods 0.000 claims abstract description 51
- 238000007789 sealing Methods 0.000 claims description 35
- 238000003860 storage Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 36
- 239000007789 gas Substances 0.000 description 33
- 239000011261 inert gas Substances 0.000 description 13
- 230000009286 beneficial effect Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 238000009434 installation Methods 0.000 description 7
- 238000002788 crimping Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
- B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
- B05B7/02—Spray pistols; Apparatus for discharge
- B05B7/08—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point
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- Nozzles (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
本發明提供了一種晶圓表面顆粒清洗噴嘴包括液體輸送管和霧化裝置，上述液體輸送管與上述霧化裝置連接，上述霧化裝置用於將上述液體輸送管輸送的清洗液霧化成液滴，以將液滴直接作用於晶圓表面。上述霧化裝置將上述液體輸送管輸送的清洗液霧化成液滴，以將液滴直接作用於晶圓表面，避免了液滴輸送設備的使用，減少了設備的複雜度，同時減少了液體在傳遞過程中出現相互結合的情況，可以保證液滴的尺寸，並且通過調節上述液體輸送管內的液壓即可調節液滴速度，液滴速度調節準確而便捷。 The invention provides a wafer surface particle cleaning nozzle including a liquid delivery pipe and an atomization device. The liquid delivery pipe is connected to the atomization device. The atomization device is used to atomize the cleaning liquid delivered by the liquid delivery pipe into droplets. , to apply droplets directly to the wafer surface. The above-mentioned atomization device atomizes the cleaning liquid transported by the above-mentioned liquid transport pipe into droplets to directly act on the wafer surface, avoiding the use of droplet transport equipment, reducing the complexity of the equipment, and at the same time reducing the amount of liquid in the wafer surface. The mutual combination during the transfer process can ensure the size of the droplets, and the droplet speed can be adjusted by adjusting the hydraulic pressure in the liquid delivery pipe. The droplet speed adjustment is accurate and convenient.
Description
本發明涉及晶圓清洗技術領域，尤其涉及一種晶圓表面顆粒清洗噴嘴。 The invention relates to the technical field of wafer cleaning, and in particular to a wafer surface particle cleaning nozzle.
晶圓清洗是晶片製造領域的重要工藝，晶圓清洗效果決定了晶片製造的良率。 Wafer cleaning is an important process in the field of wafer manufacturing. The effect of wafer cleaning determines the yield of wafer manufacturing.
在晶片製造領域，90奈米以下的晶片製造良率就開始有所下降，主要原因在於晶圓上的顆粒物難以清洗。隨著半導體工藝從2D走向3D，圖形結構晶圓的清洗難度遠遠大於平坦表面晶圓的清洗。而且隨著線寬的減小，深度比的增加，晶圓的清洗難度大大增加。現有技術中，晶圓清洗噴嘴包括兩種，一種為普通的晶圓清洗噴嘴，這種噴嘴需要配備獨立於噴嘴外的霧化裝置，但液滴在輸送過程中容易相互結合導致液滴尺寸變大，達不到理想的清洗效果；另一種晶圓清洗噴嘴具有液體輸送管和氣體輸送管，由氣體輸送管輸送的惰性氣體將液體輸送管輸送的清洗液霧化，但液滴尺寸不易控制，達不到理想的清洗效果。 In the field of wafer manufacturing, the manufacturing yield of wafers below 90 nanometers has begun to decline. The main reason is that particles on the wafer are difficult to clean. As the semiconductor process moves from 2D to 3D, cleaning wafers with patterned structures is much more difficult than cleaning wafers with flat surfaces. Moreover, as the line width decreases and the depth ratio increases, the difficulty of cleaning the wafer increases greatly. In the existing technology, there are two types of wafer cleaning nozzles. One is an ordinary wafer cleaning nozzle. This nozzle needs to be equipped with an atomization device independent of the nozzle, but the droplets are easy to combine with each other during the transportation process, causing the size of the droplets to change. It is too large and cannot achieve the ideal cleaning effect; another type of wafer cleaning nozzle has a liquid delivery pipe and a gas delivery pipe. The inert gas delivered by the gas delivery pipe atomizes the cleaning liquid delivered by the liquid delivery pipe, but the droplet size is not easy to control. , unable to achieve the ideal cleaning effect.
因此，有必要提供一種新型的晶圓表面顆粒清洗噴嘴以解決現有技術中存在的上述問題。 Therefore, it is necessary to provide a new type of wafer surface particle cleaning nozzle to solve the above problems existing in the prior art.
本發明的目的在於提供一種晶圓表面顆粒清洗噴嘴，便於液滴的產生和對滴液速度的控制，以保證清洗效果。 The object of the present invention is to provide a wafer surface particle cleaning nozzle that facilitates the generation of droplets and the control of the droplet speed to ensure the cleaning effect.
為實現上述目的，本發明的上述晶圓表面顆粒清洗噴嘴包括液體輸送管和霧化裝置，上述液體輸送管與上述霧化裝置連接，上述霧化裝置用於將上述液體輸送管輸送的清洗液霧化成液滴，並將液滴直接作用於晶圓表面。 In order to achieve the above object, the above-mentioned wafer surface particle cleaning nozzle of the present invention includes a liquid delivery pipe and an atomization device. The above-mentioned liquid delivery pipe is connected to the above-mentioned atomization device. The above-mentioned atomization device is used to transport the cleaning liquid transported by the above-mentioned liquid delivery pipe. Atomize into droplets and apply the droplets directly to the wafer surface.
本發明的有益效果在於：上述晶圓表面顆粒清洗噴嘴包括液體輸送管和霧化裝置，上述霧化裝置將上述液體輸送管輸送的清洗液霧化成液滴，以將液滴直接作用於晶圓表面，避免了液滴輸送設備的使用，減少了設備的複雜度，同時減少了液體在傳遞過程中出現相互結合的情況，可以保證液滴的尺寸，並且通過調節上述液體輸送管內的液壓即可調節液滴速度，液滴速度調節準確而便捷。 The beneficial effect of the present invention is that the above-mentioned wafer surface particle cleaning nozzle includes a liquid delivery pipe and an atomization device. The above-mentioned atomization device atomizes the cleaning liquid delivered by the above-mentioned liquid delivery pipe into droplets, so that the droplets can be directly applied to the wafer. surface, avoids the use of droplet transport equipment, reduces the complexity of the equipment, and reduces the mutual combination of liquids during the transfer process, which can ensure the size of the droplets, and by adjusting the hydraulic pressure in the above-mentioned liquid transport pipe. The droplet speed can be adjusted accurately and conveniently.
依據一實施例，上述晶圓表面顆粒清洗噴嘴還包括外殼和密封部，上述外殼和上述密封部連接形成內置空間，上述霧化裝置設置於上述內置空間內，上述液體輸送管設置於上述密封部上。其有益效果在於，上述外殼和上述密封部連接形成內置空間，能起到保護霧化裝置的作用，防止碰撞而損壞。 According to one embodiment, the above-mentioned wafer surface particle cleaning nozzle further includes a shell and a sealing part. The above-mentioned shell and the above-mentioned sealing part are connected to form a built-in space. The above-mentioned atomizing device is provided in the above-mentioned built-in space, and the above-mentioned liquid delivery pipe is provided in the above-mentioned sealing part. superior. The beneficial effect is that the above-mentioned outer shell and the above-mentioned sealing part are connected to form a built-in space, which can protect the atomization device and prevent damage due to collision.
依據另一實施例，上述內置空間內還設有相互連接的氣液混合導向部和氣液混合部，上述密封部上還設有氣體輸送管，上述氣體輸送管與上述氣體導向部連通，上述氣體導向部與上述氣液混合部連通，上述氣液混合部與上述外殼的外部相通。其有益效果在於：便於通過導入惰性氣體，進一步對液滴的速度進行調節。 According to another embodiment, the built-in space is also provided with a gas-liquid mixing guide part and a gas-liquid mixing part that are connected to each other. The sealing part is also provided with a gas delivery pipe, and the gas delivery pipe is connected with the gas guide part. The gas The guide part communicates with the gas-liquid mixing part, and the gas-liquid mixing part communicates with the outside of the housing. The beneficial effect is that it is convenient to further adjust the speed of the droplets by introducing inert gas.
依據又一實施例，上述密封部包括內殼和上壓塊，上述上壓塊與上述內殼可拆卸連接。其有益效果在於：上述上壓塊可以對內殼起到固定的作用。 According to another embodiment, the sealing part includes an inner shell and an upper pressure block, and the upper pressure block is detachably connected to the inner shell. The beneficial effect is that the above-mentioned upper pressing block can fix the inner shell.
依據又一實施例，上述內殼與上述外殼螺紋連接。其有益效果在於：便於將上述內殼和上述外殼拆分，以對內部進行清洗。 According to yet another embodiment, the inner shell is threadedly connected to the outer shell. The beneficial effect is that it is convenient to disassemble the above-mentioned inner shell and the above-mentioned outer shell to clean the interior.
依據又一實施例，上述內殼上設有臨時儲液槽，上述臨時儲液槽連通上述液體輸送管和上述霧化裝置。其有益效果在於：通過上述臨時儲液槽與上述霧化裝置連接，僅需使上述臨時儲液槽與上述霧化裝置相匹配即可，無需使上述液體輸送管與上述霧化裝置的相匹配，可以降低上述液體輸送管的橫截面積，節約空間。 According to another embodiment, the inner shell is provided with a temporary liquid storage tank, and the temporary liquid storage tank is connected to the liquid delivery pipe and the atomization device. The beneficial effect is that by connecting the temporary liquid storage tank to the atomization device, it is only necessary to match the temporary liquid storage tank with the atomization device, and there is no need to match the liquid delivery pipe with the atomization device. , can reduce the cross-sectional area of the above-mentioned liquid delivery pipe and save space.
依據又一實施例，上述密封部上還設有迴圈部，上述迴圈部包括相互連接的第一迴圈部和第二迴圈部，上述第一迴圈部的一端上設有管閥，上述第二迴圈部的一端與上述臨時儲液槽連接。其有益效果在於：上述迴圈部便於排出上述臨時儲液槽內因上述霧化裝置產生的泡沫或殘餘的清洗液。 According to another embodiment, the above-mentioned sealing part is further provided with a loop part, the above-mentioned loop part includes a first loop part and a second loop part connected to each other, and a pipe valve is provided on one end of the above-mentioned first loop part , one end of the second loop portion is connected to the temporary liquid storage tank. The beneficial effect is that the above-mentioned loop part facilitates the discharge of foam or residual cleaning liquid generated by the above-mentioned atomization device in the above-mentioned temporary liquid storage tank.
依據又一實施例，上述內殼上還設有液體輸送管管套和氣體輸送管管套，上述液體輸送管管套套於上述液體輸送管外側，上述氣體輸送管管套套於上述氣體輸送管外側。其有益效果在於：便於分別固定上述液體輸送管和上述氣體輸送管，防止上述液體輸送管和上述氣體輸送管在使用過程中晃動。 According to another embodiment, the inner shell is further provided with a liquid delivery pipe sleeve and a gas delivery pipe sleeve. The liquid delivery pipe sleeve is sleeved on the outside of the liquid delivery pipe, and the gas delivery pipe sleeve is sleeved on the outside of the gas delivery pipe. . The beneficial effect is that it is convenient to respectively fix the liquid delivery pipe and the gas delivery pipe, and prevent the liquid delivery pipe and the gas delivery pipe from shaking during use.
依據又一實施例，上述氣液混合導向部上設有滴液輸送管道，上述滴液輸送管道連通上述霧化裝置和上述氣液混合部。其有益效果在於：使清洗液進入上述氣液混合部前被霧化成液滴，以便於在上述氣液混合部內對液滴的速度進行調節。 According to yet another embodiment, the gas-liquid mixing guide part is provided with a dripping liquid transport pipe, and the dripping liquid transporting pipe communicates with the atomizing device and the gas-liquid mixing part. The beneficial effect is that the cleaning liquid is atomized into droplets before entering the gas-liquid mixing part, so that the speed of the droplets can be adjusted in the gas-liquid mixing part.
依據又一實施例，上述氣液混合部上設有x個進氣口，上述進氣口與上述氣液混合導向部連通，x為大於0的自然數。其有益效果在於：x個進氣口可以使惰性氣體從多個角度進入上述氣液混合部，減少了上述氣液混合部的內壁對惰性氣體速度的影響。 According to another embodiment, the gas-liquid mixing part is provided with x air inlets, the air inlets are connected to the gas-liquid mixing guide part, and x is a natural number greater than 0. The beneficial effect is that: x air inlets can allow inert gas to enter the gas-liquid mixing part from multiple angles, reducing the influence of the inner wall of the gas-liquid mixing part on the velocity of the inert gas.
依據又一實施例，上述霧化裝置包括多孔板，上述多孔板上設有n個通孔，n為大於0的自然數。其有益效果在於：產生的液滴尺寸由上述通孔的大小決定，可以滿足晶圓表面顆粒的清洗需求。 According to another embodiment, the above-mentioned atomization device includes a porous plate, and the above-mentioned porous plate is provided with n through holes, where n is a natural number greater than 0. The beneficial effect is that the size of the droplets generated is determined by the size of the above-mentioned through holes, which can meet the cleaning requirements of particles on the wafer surface.
依據又一實施例，上述通孔的尺寸種類為m種，上述m為大於0的自然數。其有益效果在於：可以根據通孔的尺寸產生不同大小的液滴，以對多種大小顆粒的晶圓表面進行清洗。 According to yet another embodiment, the size types of the above-mentioned through holes are m, and the above-mentioned m is a natural number greater than 0. The beneficial effect is that droplets of different sizes can be generated according to the size of the through hole to clean the wafer surface of particles of various sizes.
依據又一實施例，上述通孔的排布方式為環形排布、圓形排布或線性排布中的一種。 According to another embodiment, the arrangement of the above-mentioned through holes is one of annular arrangement, circular arrangement or linear arrangement.
依據又一實施例，上述霧化裝置包括弧形板，上述弧形板上設有n個通孔，上述通孔的排布方式為蜂窩排布。 According to another embodiment, the above-mentioned atomization device includes an arc-shaped plate, the above-mentioned arc-shaped plate is provided with n through holes, and the arrangement of the above-mentioned through holes is a honeycomb arrangement.
10:晶圓表面顆粒清洗噴嘴 10: Wafer surface particle cleaning nozzle
11:外殼 11: Shell
111:第一安裝部 111:First installation department
1111:外噴射口 1111:Outer jet port
112:第二安裝部 112: Second installation department
113:第三安裝部 113: The third installation department
1131:外殼密封圈凹口 1131: Housing sealing ring notch
11311:外殼密封圈 11311: Shell sealing ring
12:氣液混合部 12: Gas-liquid mixing section
121:第一錐形部 121: First tapered part
1211:內噴射口 1211:Inner jet port
122:圓柱部 122:Cylinder part
123:圓臺部 123: round cone part
1231:進氣口 1231:Air inlet
13:氣液混合導向部 13: Gas-liquid mixing guide part
131:圓臺口 131: Yuantaikou
132:凸台 132:Boss
133:霧化裝置安裝口 133:Atomizer device installation port
134:滴液輸送管道 134:Drip delivery pipeline
135:霧化裝置密封墊 135:Atomizer device gasket
14:霧化裝置 14:Atomization device
141:通孔 141:Through hole
1412:第一通孔 1412: First through hole
1413:第二通孔 1413: Second through hole
15:密封部 15:Sealing part
151:內殼 151:Inner shell
1511:臨時儲液槽 1511: Temporary reservoir
1512:配合凸台 1512: Matching the boss
1513:儲液密封圈凹槽 1513: Fluid storage seal ring groove
1514:液體輸送管管套 1514: Liquid delivery pipe sleeve
1515:氣體輸送管管套 1515: Gas delivery pipe sleeve
1516:環形凹槽 1516: Annular groove
152:上壓塊 152: Upper pressure block
1521:環形內嵌部 1521: Ring-shaped embedded part
1522:氣體輸送管管套扣壓部 1522: Gas delivery pipe sleeve crimping part
1523:液體輸送管管套扣壓部 1523: Liquid delivery pipe sleeve crimping part
1524:液體輸送管延伸管道 1524: Liquid delivery pipe extension pipe
1525:氣體輸送管延伸管道 1525: Gas delivery pipe extension pipe
153:迴圈部 153:Loop Department
1531:第一迴圈部 1531:First Circle Department
15311:管閥 15311:Pipe valve
1532:第二迴圈部 1532:Second Circle Department
16:液體輸送管 16:Liquid delivery pipe
17:氣體輸送管 17:Gas delivery pipe
18:噴嘴安裝杆 18:Nozzle mounting rod
圖1為本發明一實施例的晶圓表面顆粒清洗噴嘴的剖面結構示意圖；圖2為本發明一實施例的外殼的剖面結構示意圖；圖3為本發明一實施例的氣液混合部的結構示意圖；圖4A為本發明一實施例的氣液混合導向部的剖面結構示意圖；圖4B為圖4A的俯視圖；圖5為本發明一實施例的多孔板的結構示意圖； 圖6為本發明一實施例的內殼的剖面結構示意圖；圖7為本發明一實施例的上壓塊的剖面結構示意圖；圖8為本發明一實施例的晶圓表面顆粒清洗噴嘴另一個角度的剖面結構示意圖。 Figure 1 is a schematic cross-sectional structural view of a wafer surface particle cleaning nozzle according to an embodiment of the present invention; Figure 2 is a schematic cross-sectional structural view of a housing according to an embodiment of the present invention; Figure 3 is a structure of a gas-liquid mixing section according to an embodiment of the present invention. Schematic diagram; Figure 4A is a schematic cross-sectional structural diagram of a gas-liquid mixing guide part according to an embodiment of the present invention; Figure 4B is a top view of Figure 4A; Figure 5 is a schematic structural diagram of a porous plate according to an embodiment of the present invention; Figure 6 is a schematic cross-sectional structural view of the inner shell according to one embodiment of the present invention; Figure 7 is a schematic cross-sectional structural view of the upper pressure block according to one embodiment of the present invention; Figure 8 is another schematic view of the wafer surface particle cleaning nozzle according to one embodiment of the present invention. A schematic cross-sectional view of the angle.
為使本發明的目的、技術方案和優點更加清楚，下面將結合本發明的附圖，對本發明實施例中的技術方案進行清楚、完整地描述，顯然，所描述的實施例是本發明的一部分實施例，而不是全部的實施例。基於本發明中的實施例，本領域普通技術人員在沒有作出進步性勞動前提下所獲得的所有其他實施例，都屬於本發明保護的範圍。除非另外定義，此處使用的技術術語或者科學術語應當為本發明所屬領域內具有一般技能的人士所理解的通常意義。本文中使用的“包括”等類似的詞語意指出現該詞前面的元件或者物件涵蓋出現在該詞後面列舉的元件或者物件及其等同，而不排除其他元件或者物件。 In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the present invention. Obviously, the described embodiments are part of the present invention. Examples, not all examples. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making any progressive efforts fall within the scope of protection of the present invention. Unless otherwise defined, technical or scientific terms used herein shall have their ordinary meaning understood by one of ordinary skill in the art to which this invention belongs. The use of "comprising" and similar words herein means that the elements or things appearing before the word include the elements or things listed after the word and their equivalents, without excluding other elements or things.
針對現有技術存在的問題，本發明的實施例提供了一種晶圓表面顆粒清洗噴嘴，參照圖1，上述晶圓表面顆粒清洗噴嘴10包括液體輸送管16和霧化裝置14，上述液體輸送管16與上述霧化裝置14連接，上述霧化裝置14用於將上述液體輸送管16輸送的清洗液霧化成液滴，並將液滴直接作用於晶圓表面。
In order to solve the problems existing in the prior art, embodiments of the present invention provide a wafer surface particle cleaning nozzle. Referring to Figure 1, the above-mentioned wafer surface
本發明的一些實施例中，參照圖1，上述晶圓表面顆粒清洗噴嘴10還包括外殼11、氣液混合部12、氣液混合導向部13和密封部15，上述外殼11和上述密封部15連接形成內置空間(圖中未標示)，上述氣
液混合部12、上述氣液混合導向部13和上述霧化裝置14設置於上述內置空間內，上述密封部15上設有液體輸送管16，上述液體輸送管16與上述霧化裝置14連接，上述霧化裝置14與上述氣液混合部12連接，上述氣體輸送管17設置於上述密封部15上，上述氣體輸送管17與上述氣液混合導向部13連接，上述氣液混合導向部13與上述氣液混合部12連接，上述氣液混合部12與上述外殼11的外部相通。
In some embodiments of the present invention, referring to Figure 1, the above-mentioned wafer surface
本發明的一些實施例中，參照圖1，上述密封部15包括內殼151和上壓塊152，上述上壓塊152與上述內殼151可拆卸連接。
In some embodiments of the present invention, referring to FIG. 1 , the above-mentioned
本發明的一些實施例中，參照圖1，上述密封部15上還設有噴嘴安裝杆18，上述噴嘴安裝杆18用於將上述晶圓表面顆粒清洗噴嘴10根據需求安裝於指定場所。
In some embodiments of the present invention, referring to FIG. 1 , the sealing
本發明的一些實施例中，參照圖1，上述氣體輸送管17用於接入惰性氣體，上述惰性氣體通過上述氣體輸送管17進入到上述氣液混合導向部13，然後進入到上述氣液混合部12內，上述液體輸送管16用於接入清洗液，上述清洗液經過上述液體輸送管16進入上述霧化裝置14，經過上述霧化裝置14產生具有一定初始速度的液滴，具有一定初始速度的滴液進入上述氣液混合部12內後與上述惰性氣體混合，上述惰性氣體在注入時也具有一定的速度，兩種速度的惰性氣體和液滴混合後，則會起到調速的作用。
In some embodiments of the present invention, referring to Figure 1, the
圖2為本發明一些實施例中外殼的剖面結構示意圖。參照圖1和圖2，上述外殼11包括自下而上依次連接的第一安裝部111、第二安裝部112和第三安裝部113，上述第一安裝部111內部呈圓錐狀凹槽，上述第二安裝部112和上述第三安裝部113均呈圓柱狀，且上述圓錐狀凹槽的第一圓錐角(圖中未標示)方向朝下。上述第三安裝部113內部的下側
設有外殼密封圈凹口1131，上述外殼密封圈凹口1131內設有外殼密封圈11311，上述第一安裝部111的下側設有外噴射口1111。上述第一安裝部111與上述氣液混合部12固定連接或可拆卸連接；上述第二安裝部112與上述氣液混合導向部13固定連接或可拆卸連接；上述第三安裝部113與上述內殼151螺紋連接。
Figure 2 is a schematic cross-sectional structural view of the housing in some embodiments of the present invention. Referring to Figures 1 and 2, the above-mentioned
圖3為本發明一些實施例中氣液混合部的結構示意圖。參照圖2和圖3，上述氣液混合部12包括自下而上依次連接的第一錐形部121、圓柱部122和圓臺部123，上述第一錐形部121呈圓錐形狀，上述圓柱部122呈圓柱形狀，上述圓臺部123呈圓臺形狀。上述第一錐形部121的圓錐角(圖中未標示)方向朝下，上述第一錐形部121安裝於上述第一安裝部111的圓錐狀凹槽內，且上述第一錐形部121的大小與上述圓錐狀凹槽大小相同，且上述圓錐角上設有內噴射口1211，上述內噴射口1211與上述外噴射口1111相通，在液滴的輸送過程中，上述第一錐形部121的橫截面積從上到下越來越小，以便於聚集混合了惰性氣體的液滴，保證液滴的濃度；上述第一錐形部121的圓錐底面(圖中未標示)向上，且上述圓錐底面與上述圓柱部122的圓柱下底面(圖中未標示)的面積相同；上述圓臺部123的圓臺下底面(圖中未標示)朝下，上述圓臺下底面的面積與上述圓柱部122的圓柱上底面(圖中未標示)的面積相同，且上述圓臺部123的圓臺上底面(圖中未標示)的面積小於上述圓臺下底面的面積，上述圓臺部123的橫截面積從上到下越來越大，以防止上述霧化裝置14剛產生的液滴發生相互結合變大，保證液滴的尺寸大小。具體地，上述氣液混合部12內為空腔。
Figure 3 is a schematic structural diagram of a gas-liquid mixing section in some embodiments of the present invention. Referring to FIGS. 2 and 3 , the gas-
參照圖2和圖3，上述圓臺部123的側壁上均勻的分佈有x個進氣口1231，x為大於0的自然數。上述進氣口1231可以使惰性氣體
從多個角度進入上述氣液混合部12內，減少了上述氣液混合部12的內壁對惰性氣體速度的影響，便於通過上述惰性氣體對液滴的速度進行調節。
Referring to FIGS. 2 and 3 ,
圖4A為本發明的一些實施例中氣液混合導向部的剖面結構示意圖。參照圖3和圖4A，上述氣液混合導向部13的下側設有圓臺口131，上述圓臺口131的內壁上設有與上述進氣口1231相匹配的出氣口(圖中未標示)，上述圓臺口131的大小與上述圓臺部123的大小相匹配，以便於上述圓臺部123安裝於上述圓臺口131內，使上述圓臺部123的側壁與上述圓臺口131的內壁相貼合，並且上述出氣口與上述進氣口1231一一對應。具體地，上述氣液混合導向部13內為空腔。
Figure 4A is a schematic cross-sectional structural diagram of a gas-liquid mixing guide in some embodiments of the present invention. 3 and 4A, a
參照圖1和圖4A，上述氣液混合導向部13的上側設有凸台132，上述凸台132中部設有霧化裝置安裝口133，上述霧化裝置14安裝於上述霧化裝置安裝口133內，上述圓臺口131中部設有滴液輸送管道134，上述滴液輸送管道134連通上述霧化裝置14和上述氣液混合部12。
Referring to Figures 1 and 4A, a
本發明的一些實施例中，參照圖4A，上述霧化裝置14與上述霧化裝置安裝口133之間安裝有霧化裝置密封墊135，且上述霧化裝置密封墊135成環狀。上述霧化裝置密封墊135為本領域的已知技術，在此不再贅述。
In some embodiments of the present invention, referring to Figure 4A, an atomization
圖4B為圖4A的俯視圖。參照圖4B，上述凸台132、上述滴液輸送管道134和上述霧化裝置14均為圓柱狀。
Figure 4B is a top view of Figure 4A. Referring to FIG. 4B , the above-mentioned
本發明的一些具體實施例中，上述霧化裝置為超聲波霧化裝置。 In some specific embodiments of the present invention, the above-mentioned atomization device is an ultrasonic atomization device.
本發明的又一些具體實施例中，上述霧化裝置為振動膜片。 In some specific embodiments of the present invention, the atomization device is a vibrating diaphragm.
本發明的一些實施例中，上述霧化裝置包括多孔板和驅動器，上述驅動器用於驅動上述多孔板震動，上述多孔板為平面結構。具體 地，上述多孔板上設有n個通孔，n為大於0的自然數，上述驅動器為壓電陶瓷。產生的液滴尺寸由上述通孔的大小決定，可以滿足晶圓表面顆粒的清洗需求。 In some embodiments of the present invention, the atomization device includes a porous plate and a driver. The driver is used to drive the porous plate to vibrate. The porous plate has a planar structure. specific Ground, the above-mentioned porous plate is provided with n through holes, n is a natural number greater than 0, and the above-mentioned driver is a piezoelectric ceramic. The size of the droplets generated is determined by the size of the above-mentioned through holes, which can meet the cleaning needs of particles on the wafer surface.
本發明的一些實施例中，上述多孔板在上述驅動器的作用下震動頻率為20KHz-5MHz，為了與上述多孔板的震動頻率相適配上述清洗液的注入壓力為0.02Mpa-1Mpa。 In some embodiments of the present invention, the vibration frequency of the porous plate under the action of the driver is 20KHz-5MHz. In order to match the vibration frequency of the porous plate, the injection pressure of the cleaning liquid is 0.02Mpa-1Mpa.
本發明的一些實施例中，上述多孔板的材質為不與清洗液發生化學反應的材質。依據又一實施例，上述多孔板的材質為陶瓷。 In some embodiments of the present invention, the material of the above-mentioned porous plate is a material that does not chemically react with the cleaning solution. According to yet another embodiment, the porous plate is made of ceramic.
本發明的一些實施例中，上述通孔的尺寸種類為m種，上述m為大於0的自然數。可以根據通孔的尺寸產生不同大小的液滴，以對多種大小顆粒的晶圓表面進行清洗。 In some embodiments of the present invention, the size types of the above-mentioned through holes are m, and the above-mentioned m is a natural number greater than 0. Droplets of different sizes can be generated according to the size of the through holes to clean the wafer surface of particles of various sizes.
本發明的一些實施例中，上述通孔的排布方式為環形排布、圓形排布或線性排布中的一種。上述環形排布有利於使液滴分散，上述圓形排布有利於使液滴比較集中，上述線性排布有利於使液滴呈線性分佈。 In some embodiments of the present invention, the arrangement of the above-mentioned through holes is one of annular arrangement, circular arrangement or linear arrangement. The above-mentioned annular arrangement is conducive to the dispersion of the droplets, the above-mentioned circular arrangement is conducive to the concentration of the droplets, and the above-mentioned linear arrangement is conducive to the linear distribution of the droplets.
本發明的一些實施例中，上述霧化裝置包括弧形板，上述弧形板上設有n個通孔，上述通孔的排布方式為蜂窩排布，上述弧形板的中部向下凸起，上述通孔分佈於上述凸起上。其中，上述蜂窩排布有利於使液滴更加密集。 In some embodiments of the present invention, the above-mentioned atomization device includes an arc-shaped plate. The above-mentioned arc-shaped plate is provided with n through holes. The arrangement of the above-mentioned through holes is a honeycomb arrangement. The middle part of the above-mentioned arc-shaped plate protrudes downward. , the above-mentioned through holes are distributed on the above-mentioned protrusions. Among them, the above-mentioned honeycomb arrangement is conducive to making the droplets denser.
本發明的一些實施例中，上述通孔的尺寸為1μm-250μm。 In some embodiments of the present invention, the size of the above-mentioned through hole is 1 μm-250 μm.
本發明的一些具體實施例中，上述通孔的尺寸種類為1種，即上述多孔板上的n個通孔的尺寸均相同。 In some specific embodiments of the present invention, the size of the through holes is one type, that is, the n through holes on the porous plate all have the same size.
圖5為本發明一些實施例中多孔板的結構示意圖。參照圖5，上述通孔141包括第一通孔1412和第二通孔1413，上述第一通孔1412
的尺寸小於上述第二通孔1413的尺寸，即上述通孔141的尺寸種類為2種。
Figure 5 is a schematic structural diagram of a porous plate in some embodiments of the present invention. Referring to Figure 5, the above-mentioned through
圖6為本發明一些實施例中內殼的剖面結構示意圖。參照圖4A和圖6，上述內殼151下側設有臨時儲液槽1511和配合凸台1512，上述臨時儲液槽1511位於上述配合凸台1512的中部，上述配合凸台1512下側設有儲液密封圈凹槽1513，上述儲液密封圈凹槽1513呈環狀且環繞于上述臨時儲液槽1511，上述儲液密封圈凹槽1513內設有儲液密封圈15131，上述儲液密封圈15131環繞於上述臨時儲液槽1511的外側。上述內殼151位於上述氣液混合導向部13的上側，上述配合凸台1512與凸台132對應，以使臨時儲液槽1511連通上述霧化裝置14和上述液體輸送管16。上述臨時儲液槽1511與上述霧化裝置14連接，僅需使上述臨時儲液槽1511與上述霧化裝置14相匹配即可，無需使上述液體輸送管16與上述霧化裝置14相匹配，可以降低上述液體輸送管16的橫截面積，節約空間。
Figure 6 is a schematic cross-sectional structural diagram of the inner shell in some embodiments of the present invention. 4A and 6 , a temporary
參照圖1和圖6，上述內殼151上還設有液體輸送管管套1514、氣體輸送管管套1515和環形凹槽1516，且上述液體輸送管管套1514位於上述環形凹槽1516的中心處，上述液體輸送管管套1514套於上述液體輸送管16外側，用於固定上述液體輸送管16，上述氣體輸送管管套1515套於上述氣體輸送管17外側，用於固定上述氣體輸送管17。
Referring to Figures 1 and 6, the
圖7為本發明一些實施例中上壓塊的剖面結構示意圖。參照圖6和圖7，上述上壓塊152的下側設有環形內嵌部1521和氣體輸送管管套扣壓部1522，上述環形內嵌部1521中部形成液體輸送管管套扣壓部1523，上述上壓塊152安裝於上述內殼151的上側，以使上述環形內嵌部1521內嵌於上述環形凹槽1516內，以使上述液體輸送管管套扣壓部1523
壓在上述液體輸送管管套1514上，使上述氣體輸送管管套扣壓部1522壓在上述氣體輸送管管套1515上。
Figure 7 is a schematic cross-sectional structural view of the upper pressing block in some embodiments of the present invention. Referring to Figures 6 and 7, the lower side of the
參照圖1、圖6和圖7，上述上壓塊152內設有液體輸送管延伸管道1524和氣體輸送管延伸管道1525，上述液體輸送管延伸管道1524與上述液體輸送管管套扣壓部1523連通，且上述液體輸送管16通過上述液體輸送管延伸管道1524延伸到上述上壓塊152的外側，上述氣體輸送管延伸管道1525與上述氣體輸送管管套扣壓部1522連通，且上述氣體輸送管17通過上述氣體輸送管延伸管道1525延伸到上述上壓塊152的外側。
Referring to Figures 1, 6 and 7, the
圖8為本發明的一些實施例中晶圓表面顆粒清洗噴嘴另一個角度的剖面結構示意圖。參照圖8，上述密封部15上還設有迴圈部153，上述迴圈部153包括相互連接的第一迴圈部1531和第二迴圈部1532，上述第一迴圈部1531的一端上設有管閥15311，上述第二迴圈部1532的一端與上述臨時儲液槽1511連接。打開上述管閥15311後，上述臨時儲液槽1511內的壓力就會使因上述霧化裝置14產生的泡沫或殘餘的清洗液經上述迴圈部153排出。
8 is a schematic cross-sectional structural diagram of a wafer surface particle cleaning nozzle from another angle in some embodiments of the present invention. Referring to Figure 8, the sealing
雖然在上文中詳細說明了本發明的實施方式，但是對於本領域的技術人員來說顯而易見的是，能夠對這些實施方式進行各種修改和變化。但是，應理解，這種修改和變化都屬於權利要求書中上述的本發明的範圍和精神之內。而且，在此說明的本發明可有其它的實施方式，並且可通過多種方式實施或實現。 Although the embodiments of the present invention have been described in detail above, it will be obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are within the scope and spirit of the invention as described in the claims. Furthermore, the invention described herein is capable of other embodiments and of being practiced or carried out in various ways.
10:晶圓表面顆粒清洗噴嘴 10: Wafer surface particle cleaning nozzle
11:外殼 11: Shell
12:氣液混合部 12: Gas-liquid mixing section
13:氣液混合導向部 13: Gas-liquid mixing guide part
14:霧化裝置 14:Atomization device
15:密封部 15:Sealing part
151:內殼 151:Inner shell
152:上壓塊 152: Upper pressure block
16:液體輸送管 16:Liquid delivery pipe
17:氣體輸送管 17:Gas delivery pipe
18:噴嘴安裝杆 18:Nozzle mounting rod
Claims (9)
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| CN202010050969.5 | 2020-01-17 | ||
| CN202010050969.5A CN113134434B (en) | 2020-01-17 | 2020-01-17 | Wafer surface particle cleaning nozzle |
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| TW202128294A TW202128294A (en) | 2021-08-01 |
| TWI825292B true TWI825292B (en) | 2023-12-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW109109734A TWI825292B (en) | 2020-01-17 | 2020-03-24 | Wafer surface particle cleaning nozzle |
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| CN (1) | CN113134434B (en) |
| TW (1) | TWI825292B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208894002U (en) * | 2018-08-30 | 2019-05-24 | 中国航天空气动力技术研究院 | A kind of low pressure atomization nozzle applied to sprinkling irrigation |
| TWM600659U (en) * | 2020-01-17 | 2020-09-01 | 大陸商瀋陽芯源微電子設備股份有限公司 | Wafer surface particle cleaning nozzle |
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| JP2009021617A (en) * | 2002-11-12 | 2009-01-29 | Dainippon Screen Mfg Co Ltd | Substrate processing method |
| CN101484974B (en) * | 2006-07-07 | 2013-11-06 | Fsi国际公司 | Barrier structure, device and method to process microelectronic workpieces |
| WO2009067488A1 (en) * | 2007-11-19 | 2009-05-28 | Spraying Systems Company | Ultrasonic atomizing nozzle with cone-spray feature |
| US8672234B2 (en) * | 2010-05-20 | 2014-03-18 | Enginetics, Llc | Multi-physics fuel atomizer and methods |
| CN102641865B (en) * | 2012-04-26 | 2014-03-05 | 北京七星华创电子股份有限公司 | Atomizing jet device for cleaning |
| CN105764616A (en) * | 2013-09-09 | 2016-07-13 | 奥姆纽斯特有限责任公司 | Atomizing spray apparatus |
| CN205199773U (en) * | 2015-12-10 | 2016-05-04 | 北京七星华创电子股份有限公司 | Belt cleaning device is sprayed in two -phase flow atomizing |
| CN207914020U (en) * | 2018-02-02 | 2018-09-28 | 深圳市恒升电子材料有限公司 | A kind of corrosion resistant micropore atomization piece |
| CN110052340B (en) * | 2019-04-01 | 2024-03-19 | 江苏大学 | Multistage ultrasonic atomization spraying device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208894002U (en) * | 2018-08-30 | 2019-05-24 | 中国航天空气动力技术研究院 | A kind of low pressure atomization nozzle applied to sprinkling irrigation |
| TWM600659U (en) * | 2020-01-17 | 2020-09-01 | 大陸商瀋陽芯源微電子設備股份有限公司 | Wafer surface particle cleaning nozzle |
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| TW202128294A (en) | 2021-08-01 |
| CN113134434B (en) | 2024-03-29 |
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