TWI824150B - Feedthrough apparatus - Google Patents

Feedthrough apparatus Download PDF

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TWI824150B
TWI824150B TW109116800A TW109116800A TWI824150B TW I824150 B TWI824150 B TW I824150B TW 109116800 A TW109116800 A TW 109116800A TW 109116800 A TW109116800 A TW 109116800A TW I824150 B TWI824150 B TW I824150B
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conductor
hole
interposer
cross
wire
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TW109116800A
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TW202145850A (en
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倪玉河
胡瑞滄
王德民
簡鉦茂
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漢辰科技股份有限公司
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Abstract

A feed-through apparatus which comprises an intermediate board having at least one through-hole (thru-hole), wherein each thru-hole allows one or more cables/wires passing through from one side of the intermediate board to the opposite side, wherein each thru-hole having an elastic plug positioned inside and separating the intermediate board and the cables/wires passing through, also wherein each cable/wire comprises at least a conducting line for conducting current and an insulator layer surrounding the conductor. Inside each thru-hole, the insulator layer of the cables/wires pass through and the elastic plug positioned inside is pressed and deformed. Thus, there is no gap between the conducting line and the intermediate board through which any gas can pass.

Description

饋通裝置Feedthrough

本發明係有關於一種饋通裝置,特別係有關於一種適合用來在其相對兩側的真空程度不一樣時防止通過其間的導線發生放電現象的饋通裝置。 The present invention relates to a feed-through device, and in particular to a feed-through device suitable for preventing discharge phenomena in conductors passing therebetween when the vacuum levels on opposite sides of the feed-through device are different.

饋通裝置(Feedthrough Apparatus)已經廣泛地被應用在半導體產業、微機電產業、面板產業與記憶體產業等等產業,舉凡在不同真空程度的兩個環境之間,或是在二個真空度明顯有差距的硬體之間,或甚至在二個會相對運動(相對移動及/或相對轉動都可以)的硬體之間,都可以使用饋通裝置做為二者之間的介面,並且讓傳導電流、電能量及/或電訊號的導線可以自某一者經由饋通裝置而到達另一者。舉例來說,美國專利公報第6156978號披露了一種電性饋通裝置及其形成方法(Electrical Feedthrough and Its Preparation)、美國專利公報第7706275號披露了一種具有多層饋通孔(Feedthrough)的基底載具(Substrate Support Having Brazed Plates and Resistance heater)、而美國專利公報第6538872號披露了一種可以減少O型環(O-ring)被高溫損壞的靜電夾具(e-chuck)(Electrostatic Chuck Having Heater and Method),在此O型環是用來防止饋通孔(Feedthrough)發生洩漏或放電。 Feedthrough devices (Feedthrough Apparatus) have been widely used in the semiconductor industry, micro-electromechanical industry, panel industry, memory industry and other industries, such as between two environments with different vacuum levels, or between two vacuum levels with obvious Between disparate hardware, or even between two hardware that moves relative to each other (relative movement and/or relative rotation is acceptable), a feedthrough device can be used as the interface between the two, and allows Wires that conduct current, electrical energy, and/or electrical signals can pass from one to another through a feedthrough device. For example, U.S. Patent Publication No. 6156978 discloses an electrical feedthrough device and its preparation method (Electrical Feedthrough and Its Preparation), and U.S. Patent Publication No. 7706275 discloses a substrate carrier with multi-layer feedthrough holes (Feedthrough). U.S. Patent No. 6,538,872 discloses an electrostatic chuck (e-chuck) (Electrostatic Chuck Having Heater and Method) that can reduce O-ring damage due to high temperatures. ), where the O-ring is used to prevent leakage or discharge from the feedthrough hole.

舉例來說,如圖1A和圖1B所示,饋通裝置100可以被用來連 接二個相鄰但是相互分離的硬體裝置,像是在離子佈植機中可以用來讓導線140貫穿其中而連接靜電吸盤(electrostatic chuck,ESC)191和基座(pedestal)192,又像是在兩個反應室193/195之間可以用來透過導線140連接位於其內部不同的真空環境194/196中的不同硬體裝置198/199。 For example, as shown in Figures 1A and 1B, feedthrough 100 can be used to connect Connect two adjacent but mutually separated hardware devices, such as in an ion implanter, which can be used to let the wire 140 pass through it to connect the electrostatic chuck (ESC) 191 and the pedestal (pedestal) 192, and like The two reaction chambers 193/195 can be used to connect different hardware devices 198/199 located in different vacuum environments 194/196 inside the reaction chambers 193/195 through wires 140.

一般來說,如圖1C到圖1D所示,現有普遍使用的商業化饋通裝置100的結構,是一個由陶瓷材料所製作的中介板110,並且存在有一或多個導線孔洞120分別自此中介板110的一側貫通到相對的另一側。藉此,一或多條用來傳輸電流、電能量及/或電訊號的導線140可以經由這些導線孔洞120自中介板110的一側而抵達中介板110的另一側,從而在不同真空程度的不同空間之間,或者在相互分離的不同硬體之間,傳輸電流、電能量及/或電訊號。並且,這些導線140與中介板110彼此之間是以異質焊接130(Heterogeneous Welding)的方式相互連接,藉以封閉住導線140與中介板110之間的空隙進而隔離分開中介板110兩側(像是兩側的不同真空環境)。而且,為了避免發生電流短路等問題,也往往是使用絕緣材料所製作的套環150來環繞導線140,至少環繞住位於中介板110某一側的部分導線140,藉以減少導線140發生放電(discharge)進而傷害到靠近中介板110此一側的周圍硬體或是導線140不能正常傳輸的風險。 Generally speaking, as shown in FIGS. 1C to 1D , the structure of the currently commonly used commercial feedthrough device 100 is an intermediary plate 110 made of ceramic material, and there are one or more conductor holes 120 therefrom. One side of the intermediary plate 110 penetrates to the opposite side. Thereby, one or more wires 140 for transmitting current, electrical energy and/or electrical signals can pass from one side of the interposer 110 to the other side of the interposer 110 through these wire holes 120, thereby operating at different vacuum levels. Transmit current, electrical energy and/or electrical signals between different spaces, or between different hardware that are separated from each other. Moreover, these conductors 140 and the interposer 110 are connected to each other by heterogeneous welding 130 (Heterogeneous Welding), thereby closing the gap between the conductors 140 and the interposer 110 and isolating both sides of the interposer 110 (such as Different vacuum environments on both sides). Moreover, in order to avoid problems such as current short circuits, a collar 150 made of insulating material is often used to surround the wires 140 , at least around a portion of the wires 140 located on one side of the interposer 110 , thereby reducing discharge of the wires 140 ), thereby causing damage to the surrounding hardware on the side close to the interposer 110 or the risk of the wires 140 not being able to transmit normally.

但是,即使異質焊接130可以百分之百的封閉住空隙,以及,即使套環150可以百分之百的環繞住位於異質焊接130之外的導線,現有製造工藝總是難免會在中介板110、異質焊接130與套環150之間出現空隙。亦即,部分的導線140未被覆蓋的機率是不可忽略的。因此,當未被覆蓋的導線140所接觸的空間被抽真空到某些特定壓力範圍時,這部分導 線140總難免會出現放電現象(discharge phenomena),進而多多少少地損壞中介板110、導線140、套環150及/或位於中介板110附近的其他硬體(像是離子佈植機中的靜電吸盤191及/或基座192)。放電現象的發生,基本上係取決於未被覆蓋的部分導線140所在空間的真空程度以及被傳導通過這部分導線140的電流與電壓。舉例來說,當高電壓(像是1KV到30KV之間的電壓)被傳導通過這部分未被覆蓋的導線140時,往往會在毫托(mTorr)的真空環境中發生放電現象。 However, even if the heterogeneous welding 130 can 100% close the gap, and even if the collar 150 can 100% surround the wires located outside the heterogeneous welding 130, the existing manufacturing process will inevitably cause gaps between the interposer 110, the heterogeneous welding 130 and the sleeve. Gaps appear between the rings 150 . That is, the probability that part of the wire 140 is not covered is not negligible. Therefore, when the space contacted by the uncovered wire 140 is evacuated to some specific pressure range, this part of the wire 140 Discharge phenomena will inevitably occur in the wire 140, which may damage the interposer 110, the wires 140, the ferrule 150, and/or other hardware located near the interposer 110 (such as those in the ion implanter). Electrostatic chuck 191 and/or base 192). The occurrence of the discharge phenomenon basically depends on the vacuum degree of the space where the uncovered portion of the conductor 140 is located and the current and voltage conducted through this portion of the conductor 140 . For example, when a high voltage (such as a voltage between 1KV and 30KV) is conducted through the uncovered portion of the wire 140, a discharge phenomenon often occurs in a millitorr (mTorr) vacuum environment.

因此,有必要發展新的饋通裝置,藉以改善現有商業化饋通裝置的缺點。 Therefore, it is necessary to develop new feed-through devices to improve the shortcomings of existing commercial feed-through devices.

本發明提出一種饋通裝置,其基本架構是一個中介板,而且這個中介板具有貫穿通過其中的至少一個導線孔洞,並且每一個導線孔洞都可以讓至少一導線自中介板的一側經由此而抵達中介板的另一側。特別是,每一條導線都包含了用以傳遞電流的導體線以及圍繞包覆導體線的絕緣材料層,並且每一個導線孔洞也可以有一個由絕緣材料所製作的彈性墊子被放置其中而隔離開中介板以及通過其中的一或多導線。藉此,對於每一個導線孔洞,當相對應的一或多導線被放置通過期間時,此一或多導線各自的絕緣層在導線孔洞內部可以因為受到壓力而發生形變,或者,介於中介板與此一或多導線間的彈性墊子也可以因為受到壓力而發生形變,因此導體線與中介板之間會被形變的絕緣材料給填滿塞實而並不會存在任何氣體可以通過的空隙。 The present invention proposes a feedthrough device, the basic structure of which is an interposer board, and the interposer board has at least one conductor hole passing through it, and each conductor hole can allow at least one conductor to pass through from one side of the interposer board. Reach the other side of the mediator. In particular, each conductor includes a conductor wire for carrying current and a layer of insulating material surrounding the conductor wire, and each conductor hole may also be isolated by an elastic cushion made of insulating material placed therein The interposer and one or more conductors passing through it. Thereby, for each conductor hole, when the corresponding one or more conductors are placed through, the insulation layer of the one or more conductors can be deformed due to pressure inside the conductor hole, or, between the interposer board The elastic cushion between the one or more conductors can also be deformed due to pressure, so that the space between the conductor line and the intermediary board will be filled with the deformed insulating material without any gaps through which gas can pass.

顯然地,當中介板兩側的真空程度有所差距時(特別是當中 介板兩側的壓力差距夠大時),或當中介板與某一導線高度密合(特別是當中介板與某一導線間的機械壓力夠大時),不論是這些導線各自的絕緣材料層,又或是這些彈性墊子,都會被這個壓力差距給壓迫變形,進而將中介板與這些導線各自的導體線間任何空隙都給填滿填實。在此,本發明只有要求絕緣材料層與彈性墊子都具有電性絕緣的性質,並且其形狀可以在受到壓力時發生變化,至於是使用怎樣的橡膠(rubber),或者是哪種的塑膠(plastic),或甚至是使用何種的膠(glue)或矽膠(silicone),本發明並不需要多做限制,只要在放電現象發生時不會輕易地被打穿而破裂損耗的絕緣材料就可以。當然,具有高介電係數的絕緣材料是較適合被用來製作絕緣材料層與彈性墊子。 Obviously, when there is a difference in vacuum levels on both sides of the interposer (especially in the When the pressure difference on both sides of the interposer is large enough), or when the interposer and a certain conductor are highly tightly connected (especially when the mechanical pressure between the interposer and a certain conductor is large enough), regardless of the insulation materials of these conductors The layers, or these elastic cushions, will be compressed and deformed by this pressure difference, thereby filling any gaps between the interposer board and the respective conductor lines of these wires. Here, the present invention only requires that both the insulating material layer and the elastic cushion have electrical insulation properties, and that their shapes can change when subjected to pressure. As for what kind of rubber (rubber) or what kind of plastic (plastic) is used? ), or even what kind of glue or silicone is used, the present invention does not need to be more limited, as long as the insulating material cannot be easily penetrated and broken when the discharge phenomenon occurs. Of course, insulating materials with high dielectric coefficients are more suitable for making insulating material layers and elastic mats.

此時,由於絕緣材料層及/或彈性墊子的使用可以有效地阻擋氣體自中介板一側的高壓力環境流入到中介板另一側的低壓力環境,即使在中介板另一側的低壓力環境中,導線發生放電現象的機率也可以大幅度地降低,甚至即使有放電現象發生時也可以把放電強度給有效地降低。 At this time, the use of insulating material layers and/or elastic cushions can effectively prevent gas from flowing from the high-pressure environment on one side of the interposer board to the low-pressure environment on the other side of the interposer board, even if the low-pressure environment on the other side of the interposer board In the environment, the probability of discharge in wires can also be greatly reduced, and even when discharge occurs, the discharge intensity can be effectively reduced.

當然,在使用彈性墊子時,不論彈性墊子與導線是相互分離的元件進而分別被置放入導線孔洞中,又或者,彈性墊子是整合於導線上(與導線相互結合),都可以在導線通過導線孔洞時讓彈性墊子發生形變,而使得導線孔洞中沒有任何空隙可以讓氣體自中介板的一側流通到另一側。 Of course, when using elastic cushions, whether the elastic cushions and the wires are separate components and are placed in the wire holes respectively, or the elastic cushions are integrated with the wires (combined with the wires), they can be used when the wires pass through. The elastic pad deforms when the conductor holes are formed, leaving no gaps in the conductor holes for gas to flow from one side of the interposer to the other.

當然,在未使用彈性墊子時,可以透過將每個導線孔洞的橫截面面積縮小到相等或略小於商業化導線的橫截面面積來達成。因為此時可以在導線通過導線孔洞時讓導線的絕緣材料層受到壓力發生形變,進而 使得導線孔洞中沒有任何氣體可以流經的空隙。 Of course, when elastic mats are not used, this can be achieved by reducing the cross-sectional area of each wire hole to be equal to or slightly smaller than the cross-sectional area of commercial wires. Because at this time, the insulating material layer of the wire can be deformed under pressure when the wire passes through the wire hole, and then There is no gap in the wire hole for gas to flow through.

另外,由於本發明並不需要使用異質焊接來填滿各個導線所分別對應到的導線孔洞,也就不需要預防電流直接自導線流到中介板這樣會引發副作用的意外。因此,本發明可以使用金屬來製作中介板,亦即不論中介板的尺寸、輪廓與結構為何,本發明都可以簡化加工製作的難度。雖然,本發明並不排斥使用陶瓷或工程橡膠來製作中介板。 In addition, since the present invention does not require the use of heterogeneous welding to fill the conductor holes corresponding to each conductor, there is no need to prevent current from flowing directly from the conductor to the interposer, which may cause unexpected side effects. Therefore, the present invention can use metal to make the interposer board, that is, regardless of the size, contour, and structure of the interposer board, the present invention can simplify the difficulty of processing and manufacturing. Although, the present invention does not exclude the use of ceramics or engineering rubber to make the intermediate plate.

100:饋通裝置 100:Feedthrough device

110:中介板 110:Intermediate board

120:導線孔洞 120: Wire hole

130:異質焊接 130:Heterogeneous welding

140:導線 140:Wire

150:套環 150: Collar

191:靜電吸盤 191:Electrostatic sucker

192:基座 192:Pedestal

193:反應室 193:Reaction chamber

194:真空環境 194: Vacuum environment

195:反應室 195:Reaction chamber

196:真空環境 196: Vacuum environment

198:硬體裝置 198:Hardware device

199:硬體裝置 199:Hardware device

200:饋通裝置 200:Feedthrough device

201:中介板 201:Intermediate board

2011:第一次中介板 2011: The first intermediary board

2012:第二次中介板 2012: The second intermediary board

2013:相鄰接表面 2013: Adjacent surfaces

2014:相背離表面 2014: Phase Divergence Surface

202:彈性墊子 202:Elastic cushion

2025:中空空隙 2025: Hollow void

203:導線孔洞 203: Wire holes

204:導線 204:Wire

2041:導體線 2041: Conductor wire

2042:絕緣材料層 2042:Insulating material layer

205:固定物 205:Fixed objects

[圖1A~圖1B]係饋通裝置之應用示意圖。 [Figure 1A~Figure 1B] is a schematic diagram of the application of the feedthrough device.

[圖1C~圖1D]係習知技術之饋通裝置之示意圖。 [Fig. 1C~Fig. 1D] are schematic diagrams of the feed-through device of the conventional technology.

[圖2A~圖2E]係本發明之饋通裝置之示意圖。 [Fig. 2A~Fig. 2E] are schematic diagrams of the feed-through device of the present invention.

本發明的一些實施例係有關於一種饋通裝置。如圖2A所示,如此饋通裝置200至少包含一個中介板201與位於有一或多個導線孔洞203,並且這些彈性墊子202係被一對一地放置(像是塞入)到這些導線孔洞203。此外,如圖2B所示,各個彈性墊子202的輪廓大抵都是有一個可以讓導線204通過的中空空隙2025,以及具有一個一端窄另一端寬的形狀,其中較窄一端的部分不寬於相對應導線孔洞203的寬度但是較寬一端的部分則寬於相對應導線孔洞203的寬度。藉此,既可以在彈性墊子202被放置到導線孔洞203時仍然讓導線204自中介板201的一端經由中空空隙2025而貫通到其另一側,也可以用較窄一端的部分填實位於中介板201內部的導線孔洞203,並也可用較寬一端的部分塞滿位於中介板201下方 的導線孔洞203的開口並且同時讓彈性墊子202被確實卡住在導線孔洞203。顯然的,在不同實施例中,只需要彈性墊子202在被放置到導線孔洞203時可以塞滿填實住導線孔洞203而使得導線孔洞203內部沒有可以讓氣體通過的空隙,亦即可以隔離開中介板201兩側的不同真空程度的環境,至於彈性墊子202的具體輪廓則可以有多種變化,不論是像圖2B那樣的由大小兩個圓柱體所組合而成的輪廓,又或是彈性墊子202的橫截面為具有中空孔洞的十字架型等等並未被特別畫出的種種變化。 Some embodiments of the invention relate to a feedthrough device. As shown in FIG. 2A , the feedthrough device 200 at least includes an intermediary plate 201 and one or more wire holes 203 , and the elastic pads 202 are placed one-to-one (such as stuffed) into these wire holes 203 . In addition, as shown in FIG. 2B , the outline of each elastic pad 202 generally has a hollow gap 2025 that allows the wire 204 to pass through, and has a shape that is narrow at one end and wide at the other end, where the part at the narrower end is not wider than the corresponding part. The width of the corresponding conductor hole 203 but the wider end is wider than the width of the corresponding conductor hole 203 . In this way, when the elastic cushion 202 is placed in the conductor hole 203, the conductor 204 can still be allowed to penetrate from one end of the interposer 201 through the hollow gap 2025 to the other side, or the narrower end portion can be used to fill the intermediary. The conductor hole 203 inside the board 201 can also be filled with the wider end part located under the interposer board 201 The opening of the wire hole 203 and at the same time allow the elastic pad 202 to be firmly stuck in the wire hole 203. Obviously, in different embodiments, it is only necessary that the elastic pad 202 can be filled up when placed in the conductor hole 203 so that there is no gap inside the conductor hole 203 for gas to pass, that is, it can be isolated. In environments with different vacuum levels on both sides of the intermediary plate 201, the specific outline of the elastic cushion 202 can have many changes, whether it is an outline composed of two large and small cylinders as shown in Figure 2B, or an elastic cushion. The cross-section of 202 is a cross-shaped one with hollow holes and other variations that are not specifically drawn.

本發明的另外一些實施例也係關於一種饋通裝置。如圖2C所示,如此饋通裝置200至少包含一個中介板201與至少一個彈性墊子202,在此中介板201係由第一次中介板2011與第二次中介板2012二者組合而成,其中二個次中介板2011/2012彼此係透過至少一固定物(如螺絲)205所相互連接,在此中介板201具有一或多個導線孔洞203,其中每一個導線孔洞203在第一次中介板2011與第二次中介板2012二者的相鄰接表面2013附近的橫截面尺寸皆大於其在第一次中介板2011與第二次中介板2012二者的相背離表面2014附近的橫截面尺寸,在此這些彈性墊子202係被一對一地放置到這至少一導線孔洞203,並且每一個彈性墊子202都被固定在第一次中介板2011與第二次中介板2012之間。換言之,每一個彈性墊子202都至少對應到導線孔洞203位於第一次中介板2011與第二次中介板2012二者的相鄰接表面2013附近的部分。此外,參照圖2C所示之側視角度與圖2D所示之俯視角度,各個彈性墊子202的橫截面輪廓大抵都具有一個可以讓導線204通過的中空空隙2025,以及具有一個中間部分較寬而相對二端較窄的輪廓。藉此,既可以在彈性墊子202被放置到導線 孔洞203時仍然讓導線204自中介板201的一端經由中空空隙2025而貫通到其另一側,也可以用彈性墊子202橫截面面積較大的中間部分來讓彈性墊子202被固定在中介板201內部(或說被固定在第一次中介板2011與第二次中介板2012之間),並且用彈性墊子202橫截面面積較小的兩端部分來進一步的填滿導線孔洞203。顯然的,在不同實施例中,只需要彈性墊子202在被放置到導線孔洞203時可以塞滿填實導線孔洞203而使得導線孔洞203內部沒有可以讓氣體通過的空隙,亦即可以隔離開中介板201兩側的不同真空程度的環境,至於彈性墊子202的具體輪廓則可以有多種變化,或可像圖2D所示般具有中空孔洞的圓形,或是具有中空孔洞的四邊形,或也可以是具有中空孔洞的十字架型,甚至也可以是只有圖2D中橫截面面積較大的中間部分而沒有相對二端較窄的部分,又甚至可以是未被特別畫出的種種變化。 Other embodiments of the invention also relate to a feedthrough device. As shown in FIG. 2C , the feedthrough device 200 includes at least one intermediary plate 201 and at least one elastic pad 202 , where the intermediary plate 201 is composed of a first intermediary plate 2011 and a second intermediary plate 2012 . The two secondary interposer boards 2011/2012 are connected to each other through at least one fixing object (such as a screw) 205. The interposer board 201 has one or more conductor holes 203, and each conductor hole 203 is in the first interposer. The cross-sectional dimensions near the adjacent surfaces 2013 of both the plate 2011 and the second intermediary plate 2012 are larger than their cross-sections near the away surfaces 2014 of the first intermediary plate 2011 and the second intermediary plate 2012. size, here these elastic pads 202 are placed one-to-one to the at least one wire hole 203, and each elastic pad 202 is fixed between the first intermediary board 2011 and the second intermediary board 2012. In other words, each elastic pad 202 corresponds to at least the portion of the wire hole 203 located near the adjacent surfaces 2013 of the first interposer 2011 and the second interposer 2012 . In addition, referring to the side view shown in FIG. 2C and the top view shown in FIG. 2D , the cross-sectional profile of each elastic pad 202 generally has a hollow gap 2025 that can allow the wire 204 to pass, and has a middle portion that is wider and Narrower profile at opposite ends. Thereby, the elastic pad 202 can be placed onto the wire The hole 203 still allows the conductor 204 to pass from one end of the interposer 201 to the other side through the hollow gap 2025. The middle part of the elastic mat 202 with a larger cross-sectional area can also be used to fix the elastic mat 202 to the interposer 201. inside (or fixed between the first interposer board 2011 and the second interposer board 2012), and the two end portions of the elastic pad 202 with smaller cross-sectional areas are used to further fill the conductor holes 203. Obviously, in different embodiments, it is only necessary that the elastic pad 202 can fill the conductor hole 203 when it is placed in the conductor hole 203 so that there is no gap inside the conductor hole 203 for gas to pass, that is, the intermediary can be isolated. In environments with different vacuum levels on both sides of the plate 201, the specific outline of the elastic cushion 202 can have many changes, or it can be a circle with hollow holes as shown in Figure 2D, or a quadrilateral with hollow holes, or it can also be It is a cross shape with hollow holes, or it can even have only the middle part with a larger cross-sectional area as shown in Figure 2D without the narrower parts at the opposite ends, or it can even have various changes that are not specifically drawn.

本發明的一些實施例係有關於一種饋通裝置。如圖2E所示,如此饋通裝置200至少包含一個中介板201,中介板201具有一或多個自其一第一側貫穿通過到相對於第一側的一第二側之一或多個導線孔洞203,而且任一個導線孔洞203都有至少一導線204自中介板201的一側貫穿通過而抵達中介板201的另一側(在此為簡化圖示,僅繪出每個導線孔洞203只有一條導線204通過的狀況),並且每一條導線204都包含了用以傳遞電流的導體線2041以及圍繞包覆導體線2041的絕緣材料層(也可以視為絕緣外殼)2042。這些實施例的主要特徵是在每一個導線孔洞203,導體線2041與中介板201之間並不存在任何空隙可以讓氣體自中介板201的一側流經抵達中介板201的另一側。也就是說,由於絕緣材料在受到壓力時 會發生形變,這些實施例只有限制到通過任一導線孔洞203的一或多導線204的所有絕緣材料層2042在受到壓力發生形變後,可以填滿塞實中介板201與此一或多導線204的所有導體線2041之間,而使得氣體無法經由此導線孔洞203自中介板201的一側流通到中介板201的另一側。附帶地,當導線孔洞203內部的絕緣材料層2042受到壓力而變形時,部分變形的絕緣材料層2042會外溢到導線孔洞203的兩個開口附近(或說是外溢到中介板201的兩個相對表面上的導線孔洞203的周圍),而使得在中介板201兩個相對表面靠近導線孔洞這一部分的導線204的橫截面變得更寬(或說是在導線孔洞203在中介板201得兩個開口附近會被較在導線孔洞203內部更多的絕緣材料層2042給圍繞與填滿塞實),進而強化中介板201兩側的相互隔絕。換句話說,這些實施例並不需要特別限制任一導線孔洞203與通過其間的一或多導線204各自的橫截面面積與橫截面輪廓,也不需要限制每條導線204內部的導體線2041與絕緣材料層2042的相對大小,甚至也不需要限制是否導線孔洞203的橫截面面積/橫截面輪廓,都與相對應的一或多導線204的總和相類似;或者,只有此一或多導線204通過導線孔洞203的部分的橫截面面積/橫截面輪廓的總和與此導線孔洞203相類似。也就是說,在這些實施例,可以使用商業化產品來做為導線204,而將中介板201的至少一個導線孔洞203的橫截面面積與橫截面輪廓調整到導線204受到壓力發生形變後便可以填滿塞實,藉此便可以簡單地使用商業化產品的導線204以及對於中介板201的簡單加工,來實現這些實施例。 Some embodiments of the invention relate to a feedthrough device. As shown in FIG. 2E , the feedthrough device 200 includes at least one intermediary plate 201 . The intermediary plate 201 has one or more through-passes from a first side to a second side opposite to the first side. Conductor holes 203, and any conductor hole 203 has at least one conductor 204 penetrating from one side of the interposer 201 to the other side of the interposer 201 (here, for a simplified illustration, only each conductor hole 203 is drawn. Only one wire 204 passes through), and each wire 204 includes a conductor wire 2041 for transmitting current and an insulating material layer (can also be regarded as an insulating shell) 2042 surrounding the conductor wire 2041. The main feature of these embodiments is that there is no gap between each conductor hole 203 , the conductor line 2041 and the interposer 201 to allow gas to flow from one side of the interposer 201 to the other side of the interposer 201 . That is to say, since the insulating material is under pressure Deformation will occur. In these embodiments, all insulating material layers 2042 limited to one or more conductors 204 passing through any conductor hole 203 can be filled with the interposer 201 and the one or more conductors 204 after being deformed under pressure. between all the conductor lines 2041 , so that gas cannot flow from one side of the interposer plate 201 to the other side of the interposer plate 201 through the conductor holes 203 . Incidentally, when the insulating material layer 2042 inside the conductor hole 203 is deformed under pressure, the partially deformed insulating material layer 2042 will overflow to the vicinity of the two openings of the conductor hole 203 (or overflow to the two opposite openings of the interposer 201 around the conductor holes 203 on the surface), so that the cross-sections of the conductors 204 on the two opposite surfaces of the interposer 201 near the conductor holes become wider (or in other words, the conductor holes 203 are formed on the interposer 201 The vicinity of the opening will be surrounded and filled with more layers of insulating material 2042 than inside the wire hole 203), thus strengthening the mutual isolation between the two sides of the interposer 201. In other words, these embodiments do not need to specifically limit the cross-sectional area and cross-sectional profile of any conductor hole 203 and one or more conductors 204 passing therethrough, nor do they need to limit the conductor line 2041 and the conductor line 2041 inside each conductor 204. The relative size of the insulating material layer 2042, and even whether the cross-sectional area/cross-sectional profile of the conductor hole 203 is similar to the sum of the corresponding one or more conductors 204; or, only this one or more conductors 204 The sum of the cross-sectional area/cross-sectional profile of the portion passing through the conductor hole 203 is similar to that of the conductor hole 203 . That is to say, in these embodiments, commercial products can be used as the wires 204, and the cross-sectional area and cross-sectional profile of at least one wire hole 203 of the interposer 201 are adjusted to the point where the wires 204 are deformed under pressure. By filling the plug tightly, these embodiments can be implemented by simply using commercial product wires 204 and simple processing of the interposer 201 .

彈性墊子202的材料可以在受到壓力時發生形變,因此當彈性墊子202被放置到相對應的導線孔洞203並且受到壓力時,可以將通過 其中的導線204與中介板201之間完全填滿,而不留下任何氣體可以通過的空隙。在此,壓力可以是來自導線孔洞203兩側的不同真空程度,也可以是來自第一次中介板2011與第二次中介板2012被固定物205所相互固定時的機械壓力,當然也可以是其它未特別描述的壓力來源。舉例來說,在未被放置到導線孔洞203之前,各個彈性墊子202的橫截面(特別是其被放置在導線孔洞203中的部分的橫截面)的輪廓與其相對應導線孔洞203的橫截面輪廓可以是大致相當,而且其橫截面(特別是其被放置在導線孔洞203中的部分的橫截面)的面積則可以是略大於其相對應導線孔洞203的橫截面面積。藉此,彈性墊子202在受到壓力時只需要輕微變形便可以完全填滿導線孔洞203而不留下任何氣體可以通過的空隙。在此,若所有彈性墊子202都是位於中介板201的同一側,相對應導線孔洞203的橫截面輪廓與橫截面面積可以是指相對應導線孔洞203在靠近這些彈性墊子202所在的中介板201這一側的橫截面輪廓與橫截面面積。在此,若彈性墊子202係位於第一次中介板2011與第二次中介板2012的交界處,相對應導線孔洞203的橫截面輪廓與橫截面面積可以是指相對應導線孔洞203在這二個次中介板2011/2012交界處的橫截面輪廓與橫截面面積。 The material of the elastic cushion 202 can deform when subjected to pressure. Therefore, when the elastic cushion 202 is placed into the corresponding wire hole 203 and is subjected to pressure, it can pass through The space between the wires 204 and the interposer 201 is completely filled without leaving any gaps through which gas can pass. Here, the pressure can be from different vacuum levels on both sides of the wire hole 203, or it can be the mechanical pressure from when the first intermediary plate 2011 and the second intermediary plate 2012 are fixed to each other by the fixture 205. Of course, it can also be Other sources of stress not specifically described. For example, before being placed in the conductor hole 203, the cross-sectional profile of each elastic pad 202 (especially the cross-section of the portion placed in the conductor hole 203) is the same as the cross-sectional profile of its corresponding conductor hole 203. The cross-sectional area (especially the cross-sectional area of the portion placed in the conductive hole 203) may be approximately the same, and the cross-sectional area thereof may be slightly larger than the cross-sectional area of the corresponding conductive hole 203. Thereby, the elastic pad 202 only needs to be slightly deformed when subjected to pressure to completely fill the wire hole 203 without leaving any gaps through which gas can pass. Here, if all the elastic pads 202 are located on the same side of the interposer 201, the cross-sectional profile and cross-sectional area of the corresponding conductor holes 203 may mean that the corresponding conductor holes 203 are close to the interposer 201 where these elastic pads 202 are located. The cross-sectional profile and cross-sectional area of this side. Here, if the elastic pad 202 is located at the junction of the first interposer plate 2011 and the second interposer plate 2012, the cross-sectional profile and cross-sectional area of the corresponding conductor hole 203 may mean that the corresponding conductor hole 203 is located between these two The cross-sectional profile and cross-sectional area of the 2011/2012 junction of each sub-intermediate board.

絕緣材料層2042的材料也可以在受到壓力時發生形變,因此當某導線孔洞203被放入相對應的一或多導線204並且受到壓力時,也可以將此一或多導線204內部的導體線2041與中介板201之間完全填滿,而不留下任何氣體可以通過的空隙。在此,壓力可以是通過此導線孔洞203的一或多導線204相互之間及/或和中介板201之間相互接觸的機械壓力,當然也可以是其它未特別描述的壓力來源。也就是說,對於至少一導線孔 洞203橫截面輪廓,與其相對應的一或多條導線204在尚未被放置到此導線孔洞203內的橫截面輪廓的總和(特別是其被放置到此導線孔洞203中的部分,該部分的橫截面輪廓的總和)大致相當。或者,該一或多條導線204其橫截面面積的總和(特別是其被放置在導線孔洞203中的部分的橫截面面積的總和),可以略大於此導線孔洞203的橫截面面積。藉此,此一或多導線204的所有絕緣材料層2042在受到壓力時只需要輕微變形便可以與此一或多導線204的所有導體線2041共同地完全填滿導線孔洞203而不留下任何氣體可以通過的空隙。 The material of the insulating material layer 2042 can also deform when subjected to pressure. Therefore, when a certain conductor hole 203 is put into the corresponding one or more conductors 204 and is subjected to pressure, the conductor lines inside the one or more conductors 204 can also be deformed. The space between 2041 and the intermediary plate 201 is completely filled without leaving any gaps through which gas can pass. Here, the pressure may be mechanical pressure caused by contact between one or more conductors 204 passing through the conductor hole 203 and/or the interposer 201 . Of course, it may also be other pressure sources not specifically described. That is, for at least one wire hole The cross-sectional profile of the hole 203, the sum of the cross-sectional profiles of the corresponding one or more wires 204 that have not been placed in the wire hole 203 (especially the part that is placed in the wire hole 203, the portion of cross-sectional profile) are roughly equivalent. Alternatively, the sum of the cross-sectional areas of the one or more wires 204 (especially the sum of the cross-sectional areas of the portions placed in the wire holes 203 ) may be slightly larger than the cross-sectional area of the wire holes 203 . Thereby, all the insulating material layers 2042 of the one or more conductors 204 only need to be slightly deformed when subjected to pressure to completely fill the conductor holes 203 together with all the conductor lines 2041 of the one or more conductors 204 without leaving any traces. A gap through which gas can pass.

另外,本發明還可以讓任一個彈性墊子202的厚度不小於中介板201的厚度(因為導線孔洞203係貫穿通過中介板201),或者,雖小於中介板201的厚度但是不小於導線孔洞203位於二個次中介板2011/2012之間具有較寬橫截面面積的部分的深度,藉以進一步確保任一導線204與其中介板201之間的整個相對應導線孔洞203都會被彈性墊子202所填滿,亦即極小化導線204中用以傳輸電流/電壓/電訊號的導體發生裸露而引發放電現象的機率。也就是說,彈性墊子202的使用便可以讓氣體無法經由導線孔洞203自中介板201的一側流通到中介板201的另一側。 In addition, the present invention can also make the thickness of any elastic pad 202 not less than the thickness of the intermediary plate 201 (because the conductor holes 203 penetrate through the intermediary plate 201), or, although it is smaller than the thickness of the intermediary plate 201, it is not less than the thickness of the conductor holes 203 where the conductor holes 203 are located. The depth of the part with a wider cross-sectional area between the two secondary interposers 2011/2012 further ensures that the entire corresponding conductor hole 203 between any conductor 204 and its interposer 201 will be filled by the elastic pad 202. That is to say, the probability that the conductors used to transmit current/voltage/electrical signals in the wire 204 are exposed and cause discharge is minimized. In other words, the use of the elastic cushion 202 prevents gas from flowing from one side of the interposer plate 201 to the other side of the interposer plate 201 through the wire holes 203 .

綜上討論,藉由使用彈性墊子202及/或絕緣材料層2042,本發明不同實施例都可以確保任一導線孔洞203中都不存在可以讓氣體流通的空隙,亦即可以極小化導線204中用以傳輸的導體線2041發生裸露而引發放電現象的機率。亦即,在饋通裝置200的相對二側係分別相鄰到不同真空程度的二個空間時,藉由中介板201與彈性墊子202二者的組合,及/或藉由中介板201與絕緣材料層2042二者的組合,饋通裝置200既可以讓 導線204自某一個空間貫穿而到達另一個空間,也可以確保兩個空間持續具有其各自的真空程度。 In summary, by using the elastic cushion 202 and/or the insulating material layer 2042, different embodiments of the present invention can ensure that there is no gap for gas circulation in any conductor hole 203, that is, the air gap in the conductor 204 can be minimized. The probability that the conductor line 2041 used for transmission is exposed and causes discharge. That is, when the two opposite sides of the feedthrough device 200 are adjacent to two spaces with different vacuum levels, through the combination of the intermediary plate 201 and the elastic cushion 202, and/or through the intermediary plate 201 and the insulation With the combination of material layer 2042, the feedthrough device 200 can both The wire 204 runs from a certain space to another space, which can also ensure that the two spaces continue to have their respective vacuum levels.

如同習知技術的饋通裝置100,本發明所提出的饋通裝置200可以用來連接具有不同真空環境的二個不同反應室,也可以用來連接會相對運動的二個硬體裝置,像是在離子佈植機中會相對移動及/或相對轉動的位於大氣環境中的基座與位於真空環境中的靜電吸盤。顯然地,由於饋通裝置200兩側的真空程度差異,當一或多個彈性墊子202都係位於中介板201兩側中氣體壓力較高的一側時,中介板201兩邊的壓力差距會將這些彈性墊子202壓入導線孔洞203而且壓往中介板201兩側中氣體壓力較低的一側,而當一或多彈性墊子202係位於構成中介板201的兩個次中介板2011/2012之間時,中介板201兩邊的壓力差距會導致彈性墊子202形變而且將鄰近兩個次中介板2011/2012的相鄰接表面2013的部分導線孔洞203給完全填滿,並且當一或多條導線204係位於一個導線孔洞203內部時,除了此一或多條導線204與中介板201之間相互接觸擠壓的機械壓力之外,中介板201兩邊的壓力差距也可以再增強此一或多條導線204的所有絕緣材料層2042的形變,進而確保在此導線孔洞203中此一或多條導線204的所有導體線2041與中介板201之間都會被這些絕緣材料層2042給填好填滿。也就是說,即便在饋通裝置200的製造過程中,並沒有將彈性墊子202完整地放置到導線孔洞203並且填滿塞住至少部分的導線孔洞203,及/或並沒有放置好通過滿導線孔洞203的一或多導線204來填滿塞住至少部分的導線孔洞203,本發明所提出的饋通裝置200也可以利用中介板201兩側的真空程度差異,自動地讓彈性墊子202及/或絕緣材料層2042 在導線孔洞203中發生形變及/或位移,進而降低或甚至完全消除導線孔洞203中還存在有可以讓氣體自饋通裝置200一側流通到饋通裝置200另一側的任何空隙的機率。相對於習知技術的饋通裝置100需要主動使用異質焊接130來完全封住導線孔洞120(或說完全封住導線140與中介板110之間的空隙),並且在異質焊接130若出現瑕疵而存在氣體可能通過的空隙時便需要再次主動進行異質焊接來修補,本發明所提出的饋通裝置200不只結構較為簡單,較易製作,也較可能自行修補而較不需要額外的維修保養。 Like the feedthrough device 100 of the prior art, the feedthrough device 200 proposed by the present invention can be used to connect two different reaction chambers with different vacuum environments, or can also be used to connect two hardware devices that move relative to each other, such as It is a base located in the atmospheric environment and an electrostatic chuck located in a vacuum environment that can move and/or rotate relative to each other in the ion implanter. Obviously, due to the difference in vacuum levels on both sides of the feedthrough device 200, when one or more elastic pads 202 are located on the side with higher gas pressure on both sides of the intermediary plate 201, the pressure difference on both sides of the intermediary plate 201 will These elastic pads 202 are pressed into the wire holes 203 and toward the side with lower gas pressure on both sides of the interposer 201. When one or more elastic pads 202 are located between the two secondary interposers 2011/2012 that constitute the interposer 201 Over time, the pressure difference on both sides of the interposer 201 will cause the elastic pad 202 to deform and completely fill part of the conductor holes 203 adjacent to the adjacent surfaces 2013 of the two sub-interposers 2011/2012, and when one or more conductors When wire 204 is located inside a conductor hole 203, in addition to the mechanical pressure of mutual contact and extrusion between the one or more conductors 204 and the interposer 201, the pressure difference on both sides of the interposer 201 can also further enhance the one or more conductors 204. The deformation of all the insulating material layers 2042 of the wires 204 ensures that the space between all the conductor lines 2041 of the one or more wires 204 in the wire hole 203 and the interposer 201 will be filled with these insulating material layers 2042. That is to say, even during the manufacturing process of the feedthrough device 200, the elastic pad 202 is not completely placed into the conductor hole 203 and fills at least part of the conductor hole 203, and/or is not placed through the full conductor hole 203. One or more wires 204 in the hole 203 are used to fill at least part of the wire hole 203. The feedthrough device 200 proposed by the present invention can also use the difference in vacuum levels on both sides of the intermediary plate 201 to automatically allow the elastic pad 202 and/or or layer of insulating material 2042 Deformation and/or displacement occurs in the conductor hole 203 , thereby reducing or even completely eliminating the probability that there are any gaps in the conductor hole 203 that allow gas to flow from one side of the feedthrough device 200 to the other side of the feedthrough device 200 . Compared with the conventional feedthrough device 100, it is necessary to actively use the heterogeneous welding 130 to completely seal the conductor hole 120 (or to completely seal the gap between the conductor 140 and the interposer 110), and if defects occur in the heterogeneous welding 130, When there is a gap through which gas may pass, it is necessary to actively perform heterogeneous welding to repair it. The feedthrough device 200 proposed by the present invention not only has a simpler structure and is easier to manufacture, but is also more likely to be repaired by itself without requiring additional maintenance.

在不同實施例,彈性墊子202及/或絕緣材料層2042都可以是由不同的絕緣材料所製作的,不論是橡膠、塑膠、膠、矽膠或是其任意組合。本發明僅要求絕緣材料必須具有機械彈性,使得彈性墊子202可以因為中介板201兩側的壓力差而發生形變進而與中介板201與導線204二者的邊緣緊緊地貼合,進而消除任何氣體可能通過的空隙。舉例來說,邵氏硬度D小於60的聚合物,像是軟塑膠與橡膠,便適合用來提供需要的形變,特別是適合來做為任一導線204的絕緣材料層2042。當然,取決於不同饋通裝置200的具體設計以及應用範圍,像是需要的不同形變程度與不同形變範圍,邵氏硬度D不小於60的聚合物,像是中等硬度塑膠與硬塑,也可以應用在本發明不同實施例的不同彈性墊子202及/或不同絕緣材料層2042。當然,取決於饋通裝置200預計使用範圍中彈性墊子202所會接觸到的真空壓力範圍,所使用的絕緣材料必須在這樣的真空壓力範圍中不只具有機械彈性而且還不容易破裂損傷。當然,若其他性質都相等時,介電係數較高的絕緣材料比較適合,因為其可以承載較高的電壓或較大的電流而還不會破裂損耗。當然,若其他性質都相等時,較容易被機械加工到 具有與導線孔洞203相等輪廓相似大小並且具有中空通道讓導線通過的絕緣材料,及/或較容易被加工來環繞包覆住導體線2041而形成導線204的絕緣材料,便較為適合。 In different embodiments, the elastic cushion 202 and/or the insulating material layer 2042 can be made of different insulating materials, whether rubber, plastic, glue, silicone, or any combination thereof. The present invention only requires that the insulating material must have mechanical elasticity, so that the elastic cushion 202 can be deformed due to the pressure difference on both sides of the intermediary plate 201 and tightly fit the edges of the intermediary plate 201 and the conductor 204, thereby eliminating any gas. Possible gaps to pass through. For example, polymers with a Shore hardness D less than 60, such as soft plastics and rubbers, are suitable for providing the required deformation, and are particularly suitable for use as the insulating material layer 2042 of any conductor 204 . Of course, depending on the specific design and application scope of different feedthrough devices 200, such as the required different degrees of deformation and different deformation ranges, polymers with a Shore hardness D of not less than 60, such as medium-hard plastics and hard plastics, can also be used. Different elastic cushions 202 and/or different insulating material layers 2042 used in different embodiments of the present invention. Of course, depending on the vacuum pressure range to which the elastic cushion 202 will be exposed in the expected use range of the feedthrough device 200, the insulating material used must not only be mechanically elastic but also not prone to rupture damage in such a vacuum pressure range. Of course, if other properties are equal, insulating materials with higher dielectric coefficients are more suitable because they can carry higher voltages or larger currents without rupture and loss. Of course, if other properties are equal, it is easier to be machined to An insulating material having the same contour as the wire hole 203 and having a hollow channel for the wire to pass through, and/or an insulating material that is easier to process to wrap around the conductor wire 2041 to form the wire 204 is more suitable.

在不同實施例,中介板201可以是由不同的金屬、不同的陶瓷及或不同的工程塑膠所製作的。使用金屬,像是不銹鋼、鍍鉻的鋼鐵、或是銅,來製作中介板201的理由至少有二個。第一、由於本發明使用絕緣材料所製作的彈性墊子202及/或絕緣材料層2042來充填導線孔洞203,而不需要如習知技術般使用異質焊接來填滿導線孔洞203與導線204之間的空隙,因此本發明並不限於使用陶瓷材料來製作中介板201。第二、金屬容易被機械加工,不論中介板201的具體形狀、具體尺寸與具體結構為何。舉例來說,由金屬材料所製作的兩個次中介板2011/2012可以輕易地被鑽出螺絲孔並且透過將螺絲鎖入螺絲孔來將這兩個次中介板2011/2012相互密合成為中介板201,甚至可以輕易地透過調整螺絲的鎖入程度來調整彈性墊子202被夾住在兩個次中介板2011/2012之間的程度(或者說是調整彈性墊子202怎樣填滿塞住導線孔洞203的程度)。但是,使用陶瓷及/或工程塑膠來製作中介板201也有其好處,像是在饋通裝置200的應用場合需要較能隔離電場或是較能防止放電損傷中介板201時,又或像是在饋通裝置200的應用場合需要較具有機械彈性的中介板201時。 In different embodiments, the interposer 201 may be made of different metals, different ceramics, and/or different engineering plastics. There are at least two reasons for using metal, such as stainless steel, chromium-plated steel, or copper, to make the interposer 201 . First, since the present invention uses the elastic pad 202 and/or the insulating material layer 2042 made of insulating material to fill the conductor hole 203, there is no need to use heterogeneous welding to fill the gap between the conductor hole 203 and the conductor 204 as in the conventional technology. gap, therefore the present invention is not limited to using ceramic materials to make the interposer 201. Second, metal is easy to be machined, regardless of the specific shape, specific size and specific structure of the intermediary plate 201. For example, two sub-interposers 2011/2012 made of metal materials can be easily drilled with screw holes and the two sub-interposers 2011/2012 can be tightly connected to each other by locking screws into the screw holes to form an intermediary. board 201, you can even easily adjust the degree to which the elastic cushion 202 is sandwiched between the two secondary interposer boards 2011/2012 by adjusting the locking degree of the screw (or in other words, adjust how the elastic cushion 202 fills and plugs the wire holes. 203 degree). However, using ceramics and/or engineering plastics to make the interposer 201 also has its advantages, such as when the feedthrough device 200 is used in applications where it is necessary to better isolate the electric field or to prevent discharge damage to the interposer 201, or when When the application of the feedthrough device 200 requires an intermediate plate 201 with greater mechanical flexibility.

在不同實施例,中介板201的具體輪廓、具體尺寸與具體結構都可以視實際需要調整,導線孔洞203的數量、導線孔洞203的數量、以及導線孔洞203在中介板201垂直於導線孔洞203的橫截面上的分布方 式也都可以視實際需要調整,本發明並不需要限制這些細節。舉例來說,多數個導線孔洞203可以是均勻地分布在中介板201的橫截面上,也可以是集中在中介板201的橫截面的中間。舉例來說,中介板201垂直於導線孔洞203的橫截面可以是正方形、長方形、四邊形、橢圓形、圓形或是其它形狀。舉例來說,任一個導線孔洞203的橫截面可以是近似於使用商業化產品的導線204的橫截面。 In different embodiments, the specific outline, specific size and specific structure of the interposer 201 can be adjusted according to actual needs. The distribution square on the cross section The formulas can also be adjusted according to actual needs, and the present invention does not need to limit these details. For example, the plurality of conductor holes 203 may be evenly distributed on the cross-section of the interposer 201 , or may be concentrated in the middle of the cross-section of the interposer 201 . For example, the cross-section of the interposer 201 perpendicular to the conductor hole 203 may be square, rectangular, quadrilateral, elliptical, circular or other shapes. For example, the cross-section of any wire hole 203 may be similar to the cross-section of the wire 204 using a commercial product.

在不同實施例,任一條導線204都是用絕緣材料包覆用以傳遞電流的導體線2041(像是用氧化鋁套管來環繞包圍可以傳遞電流的銅線),藉此避免導體線2041裸露發生放電或是預防導體線2041與中介板201相互接觸發生電流短路。另外,進一步降低放電現象發生的機率,像是為了減少導線在真空壓力介於一毫托到一大氣壓之間的環境中引發放電現象的機率,任一條導線或可以是麻花線(twisted line,花線)也或可以是單心線(single-core line),因為這些可以同時具有較低的洩漏率(leak rate)並且不容易因為受到壓力而斷裂。 In different embodiments, any wire 204 is covered with an insulating material to cover the conductor wire 2041 for transmitting current (such as using an aluminum oxide sleeve to surround the copper wire that can transmit current), thereby preventing the conductor wire 2041 from being exposed. Discharge occurs or the conductor line 2041 and the intermediary board 201 are prevented from contacting each other to cause a current short circuit. In addition, to further reduce the probability of discharge phenomena, for example, in order to reduce the probability of wires causing discharge phenomena in an environment where the vacuum pressure is between one millitorr and one atmosphere, any wire may be a twisted line. Lines) may also be single-core lines, as these can simultaneously have a lower leak rate and are less likely to break due to pressure.

綜上所述,相較於習知技術的饋通裝置100,本發明所提出的饋通裝置200可以更有效地阻絕氣體通過,亦即本發明所提出的饋通裝置200更可以保持住其任何一側的真空程度。因此,在真空環境中發生放電現象的機率可以顯著地降低,即便發生放電現象時也可以顯著地降低其強度。舉例來說,在離子佈植機中由基座經由導線傳輸往靜電夾具的電流的電壓有時會在1~10KV之間,此時若因為氣體洩漏而導致靜電夾具附近的氣體壓力約在1托(torr)到1毫托之間,若導線204中傳導電流的金屬線有任何部分裸露,便容易發生放電現象。但是,由於本發明所提出的饋通裝 置200可以較習知技術更有效率地防止氣體洩漏,只要一開始能夠將靜電夾具附近空間的真空程度降低到低於1毫托,本發明便可以在離子佈植機運作期間有效地防止放電現象的發生。 To sum up, compared with the feed-through device 100 of the conventional technology, the feed-through device 200 proposed by the present invention can more effectively block the passage of gas, that is, the feed-through device 200 proposed by the present invention can better maintain its The degree of vacuum on either side. Therefore, the probability of a discharge phenomenon occurring in a vacuum environment can be significantly reduced, and even if a discharge phenomenon occurs, its intensity can be significantly reduced. For example, in an ion implanter, the voltage of the current transmitted from the base to the electrostatic clamp through the wire is sometimes between 1 and 10KV. At this time, if the gas pressure near the electrostatic clamp is about 1 due to gas leakage, Torr to 1 millitorr, if any part of the metal wire conducting current in the conductor 204 is exposed, discharge will easily occur. However, due to the feedthrough device proposed by the present invention The device 200 can prevent gas leakage more efficiently than the conventional technology. As long as the vacuum level in the space near the electrostatic clamp can be initially reduced to less than 1 mTorr, the present invention can effectively prevent discharge during the operation of the ion implanter. occurrence of phenomena.

顯然地,依照上面實施例中的描述,本發明可能有許多的修正與差異。因此需在其附加的權利請求項的範圍內加以理解,除上述詳細描述外,本發明還可以廣泛地在其他的實施例中施行。上述僅為本發明的較佳實施例而已,並非用以限定本發明的申請專利範圍;凡其它未脫離本發明所揭示的精神下所完成的等效改變或修飾,均應包括在下述申請專利範圍內。 Obviously, the present invention may have many modifications and differences according to the description of the above embodiments. Therefore, it should be understood that within the scope of the appended claims, the present invention can be widely implemented in other embodiments in addition to the above detailed description. The above are only preferred embodiments of the present invention, and are not intended to limit the scope of the patent application of the present invention; all other equivalent changes or modifications completed without departing from the spirit disclosed by the present invention shall be included in the following patent applications. within the range.

200:饋通裝置200:Feedthrough device

201:中介板201:Intermediate board

202:彈性墊子202:Elastic cushion

203:導線孔洞203: Wire hole

Claims (17)

一種饋通裝置,包括:一中介板,其具一第一側與遠離該第一側之一第二側;至少一導線孔洞,該至少一導線孔洞自該第一側貫穿通過到該第二側;以及至少一彈性墊子,分別被一對一地放置在該至少一導線孔洞之中,其中:該至少一彈性墊子的材料係選自橡膠或矽膠,且該至少一彈性墊子的材料之邵氏硬度D小於60;該至少一彈性墊子具有一較寬部與一較窄部,該至少一彈性墊子之較寬部係位於該中介板的第一側,該至少一彈性墊子之較窄部穿入該導線孔洞;該至少一彈性墊子皆具有一中空空隙藉以讓至少一導線可以自一中介板一側經由此而抵達該中介板另一側;在此,該至少一彈性墊子皆使得通過其相對應之該至少一導線孔洞的一導線與該中介板之間並不存在氣體可以自該中介板一側流通到該中介板另一側的空隙;其中,該中介板之第一側的氣體壓力高於該中介板之第二側的氣體壓力,且中介板之第二側的氣體壓力低於1毫托。 A feedthrough device includes: an interposer plate having a first side and a second side away from the first side; at least one conductor hole penetrating from the first side to the second and at least one elastic pad, which is placed one-to-one in the at least one conductor hole, wherein: the material of the at least one elastic pad is selected from rubber or silicone, and the material of the at least one elastic pad is The hardness D is less than 60; the at least one elastic cushion has a wider part and a narrower part, the wider part of the at least one elastic cushion is located on the first side of the intermediate plate, and the narrower part of the at least one elastic cushion Penetrate the conductor hole; the at least one elastic pad has a hollow space so that at least one conductor can pass from one side of an interposer board to the other side of the interposer board; here, the at least one elastic pad allows passage There is no gap between a conductor corresponding to the at least one conductor hole and the interposer plate through which gas can flow from one side of the interposer plate to the other side of the interposer plate; wherein, the first side of the interposer plate The gas pressure is higher than the gas pressure on the second side of the interposer plate, and the gas pressure on the second side of the interposer plate is less than 1 millitorr. 如請求項1所述之饋通裝置,該中介板更包含一第一次中介板、一第二次中介板與一螺絲,該第一次中介板與該第二次中介板各包 含一螺絲孔,該螺絲穿過該二個螺絲孔以利於藉由調整該螺絲的鎖入程度改變該彈性墊子於該中介板的密合程度。 As for the feedthrough device of claim 1, the intermediary board further includes a first intermediary board, a second intermediary board and a screw, and the first intermediary board and the second intermediary board each include Containing a screw hole, the screw passes through the two screw holes to facilitate changing the tightness of the elastic cushion on the intermediary board by adjusting the locking degree of the screw. 如請求項1所述之饋通裝置,該至少一彈性墊子的厚度大於其相對應之該至少一導線孔洞的深度,使該至少一彈性墊子之一部份凸出該導線孔洞。 As in the feedthrough device of claim 1, the thickness of the at least one elastic pad is greater than the corresponding depth of the at least one wire hole, so that a part of the at least one elastic pad protrudes from the wire hole. 如請求項1所述之饋通裝置,該至少一彈性墊子在未被放置到相對應的該至少一導線孔洞之前,其橫截面輪廓與其相對應之該至少一導線孔洞的橫截面輪廓大致相當,而且其橫截面面積略大於其相對應之該至少一導線孔洞的橫截面面積。 As for the feedthrough device of claim 1, before the at least one elastic pad is placed in the corresponding at least one conductor hole, its cross-sectional profile is substantially equivalent to the cross-sectional profile of the corresponding at least one conductor hole. , and its cross-sectional area is slightly larger than the corresponding cross-sectional area of the at least one conductor hole. 如請求項1所述之饋通裝置,該至少一彈性墊子在未被放置到相對應的該至少一導線孔洞之前,其被放置在相對應的一線孔洞中的部分的橫截面的輪廓與其在該至少一導線孔洞在其所在的該中介板這一側的橫截面輪廓大致相當,而且其被放置在相對應該至少一導線孔洞中的部分的橫截面的面積略大於該至少一導線孔洞在其所在的該中介板這一側的橫截面面積。 As for the feedthrough device of claim 1, before the at least one elastic pad is placed in the corresponding at least one wire hole, the cross-sectional profile of the part placed in the corresponding wire hole is different from the cross-sectional contour of the part placed in the corresponding wire hole. The cross-sectional profile of the at least one conductive hole on the side of the interposer board is approximately the same, and the cross-sectional area of the portion placed in the corresponding at least one conductive hole is slightly larger than the at least one conductive hole on the side thereof. The cross-sectional area of this side of the interposer. 如請求項2所述之饋通裝置,該至少一彈性墊子的厚度小於其相對應之該至少一導線孔洞的深度,但是不小於所對應之該至少一導線孔洞位於二個次中介板之間具有較寬橫截面面積的部分的深度。 As for the feedthrough device of claim 2, the thickness of the at least one elastic pad is smaller than the depth of the corresponding at least one wire hole, but not smaller than the depth of the corresponding at least one wire hole located between the two secondary interposers. The depth of the portion with wider cross-sectional area. 如請求項1所述之饋通裝置,該中介板的材料係選自下列之一:金屬、陶瓷、工程塑膠及其任意組合。 As for the feedthrough device described in claim 1, the material of the intermediary plate is selected from one of the following: metal, ceramics, engineering plastics and any combination thereof. 如請求項1所述之饋通裝置,更包含至少下列之一:該至少一導線係為麻花線;以及 該至少一導線係以絕緣材料包覆用以傳遞電流的導體線。 The feedthrough device of claim 1 further includes at least one of the following: the at least one conductor is a twist wire; and The at least one conductor is a conductor wire covered with insulating material for transmitting current. 如請求項1所述之饋通裝置,該至少一導線係為單心線。 In the feedthrough device of claim 1, the at least one conductor is a single-core wire. 一種饋通裝置,包括:一中介板,其具有一第一側與遠離該第一側之一第二側;至少一個導線孔洞,該至少一導線孔洞自該第一側貫穿通過到該第二側,其中該至少一個導線孔洞分別於該第一側以及該第二側形成至少一個開口;至少一導線,該至少一導線自該中介板的第一側,貫穿通過該至少一導線孔洞,到達該中介板的第二側;其中,該至少一導線皆包含用以傳遞電流的一導體線及圍繞包覆該導體線的一絕緣材料層,該絕緣材料層的材料係選自橡膠或矽膠,且該絕緣材料層之邵氏硬度D小於60,當該中介板之該第一側與該第二側之間具有壓力差時,該絕緣材料層受到壓力而變形,使該絕緣材料層外溢到該第一側之該至少一個開口的周圍以及該第二側之該至少一個開口的周圍;以及在該至少一導線孔洞中,該導體線與該中介板之間並不存在任何空隙可以讓氣體自該中介板的第一側流經抵達該中介板的第二側;其中,該中介板之第一側的氣體壓力高於該中介板之第二側的氣體壓力,且中介板之第二側的氣體壓力低於1毫托。 A feedthrough device includes: an interposer plate having a first side and a second side away from the first side; at least one conductor hole, the at least one conductor hole penetrating from the first side to the second side, wherein the at least one wire hole forms at least one opening on the first side and the second side respectively; at least one wire penetrates from the first side of the interposer through the at least one wire hole to reach the second side of the interposer; wherein the at least one conductor includes a conductor line for transmitting current and an insulating material layer surrounding and covering the conductor line, and the material of the insulating material layer is selected from rubber or silicone, And the Shore hardness D of the insulating material layer is less than 60. When there is a pressure difference between the first side and the second side of the interposer, the insulating material layer is deformed under pressure, causing the insulating material layer to overflow to Around the at least one opening on the first side and around the at least one opening on the second side; and in the at least one conductor hole, there is no gap between the conductor line and the interposer to allow gas Flows from the first side of the interposer plate to the second side of the interposer plate; wherein the gas pressure on the first side of the interposer plate is higher than the gas pressure on the second side of the interposer plate, and the second side of the interposer plate side gas pressure is less than 1 mTorr. 如請求項10所述之饋通裝置,該絕緣材料層在受到壓力發生形變後,填滿塞實該至少一導線孔洞與該導體線之間的空隙。 In the feedthrough device of claim 10, the insulating material layer fills the gap between the at least one conductor hole and the conductor line after being deformed under pressure. 如請求項10所述之饋通裝置,係使用商業化產品來做為該導線,而且該中介板的任一個該導線孔洞的橫截面面積與橫截面輪廓皆係為通過其中的一或多條該導線在受到壓力發生形變後便可以填滿塞實。 The feedthrough device described in claim 10 is a commercial product used as the conductor, and the cross-sectional area and cross-sectional profile of any of the conductor holes in the interposer are such that one or more of them pass through The wire can be filled and plugged after deformation under pressure. 如請求項10所述之饋通裝置,更包含至少下列之一:對於該至少一導線孔洞,其相對應的一或多條該導線在未被放置到該至少一導線孔洞之前,其會被放置到該至少一導線孔洞中的部分的橫截面輪廓的總和與該至少一導線孔洞的橫截面輪廓是大致相當;以及對於該至少一導線孔洞,其相對應的一或多條該導線在未被放置到該至少一導線孔洞之前,其會被放置到該至少一導線孔洞中的部分的橫截面面積的總和與該至少一導線孔洞的橫截面面積是大致相當。 The feedthrough device according to claim 10, further comprising at least one of the following: for the at least one conductor hole, the corresponding one or more conductors will be placed before the at least one conductor hole. The sum of the cross-sectional profiles of the parts placed into the at least one conductor hole is substantially equivalent to the cross-sectional profile of the at least one conductor hole; and for the at least one conductor hole, the corresponding one or more conductors are in the future. Before being placed into the at least one conductive hole, the sum of the cross-sectional areas of the parts that will be placed into the at least one conductive hole is approximately equal to the cross-sectional area of the at least one conductive hole. 如請求項10所述之饋通裝置,該中介板的材料係選自下列之一:金屬、陶瓷、工程塑膠及其任意組合。 As for the feedthrough device described in claim 10, the material of the intermediary plate is selected from one of the following: metal, ceramics, engineering plastics and any combination thereof. 如請求項10所述之饋通裝置,該至少一導線為麻花線。 In the feed-through device of claim 10, the at least one conductor is a twist wire. 如請求項10所述之饋通裝置,該至少一導線係為單心線。 In the feedthrough device of claim 10, the at least one conductor is a single-core wire. 如請求項10所述之饋通裝置,當該中介板之該第一側與該第二側之間具有一壓力差時,該絕緣材料層受到該壓力差而變形,使該絕緣材料層外溢到該第一側之該至少一個開口的周圍以及該第二側之該至少一個開口的周圍。In the feedthrough device of claim 10, when there is a pressure difference between the first side and the second side of the interposer, the insulating material layer is deformed by the pressure difference, causing the insulating material layer to overflow. to the periphery of the at least one opening on the first side and the periphery of the at least one opening on the second side.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3605076A (en) * 1969-08-21 1971-09-14 Us Terminals Inc Hermetically sealed terminal construction
US6156978A (en) * 1994-07-20 2000-12-05 Raytheon Company Electrical feedthrough and its preparation
CN105143942A (en) * 2013-03-13 2015-12-09 3M创新有限公司 Sealing tube for cable entry port

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3605076A (en) * 1969-08-21 1971-09-14 Us Terminals Inc Hermetically sealed terminal construction
US6156978A (en) * 1994-07-20 2000-12-05 Raytheon Company Electrical feedthrough and its preparation
CN105143942A (en) * 2013-03-13 2015-12-09 3M创新有限公司 Sealing tube for cable entry port

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