TWI822363B - Pick-up and installation devices - Google Patents

Pick-up and installation devices Download PDF

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Publication number
TWI822363B
TWI822363B TW111136715A TW111136715A TWI822363B TW I822363 B TWI822363 B TW I822363B TW 111136715 A TW111136715 A TW 111136715A TW 111136715 A TW111136715 A TW 111136715A TW I822363 B TWI822363 B TW I822363B
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Taiwan
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electronic component
pickup
collet
angle
opposing surface
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TW111136715A
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Chinese (zh)
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TW202314954A (en
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羽根洋祐
楠部善弘
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日商芝浦機械電子裝置股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools

Abstract

本發明提供一種以非接觸方式拾取電子零件、並且能夠將所述電子零件定位的拾取裝置及安裝裝置。實施方式是一種拾取裝置，具有拾取筒夾、方向變更部，拾取筒夾中，具有多孔質構件，所述多孔質構件具有通氣性，經由與電子零件相向的相向面的細孔將被供給至內部的氣體呈面狀噴出，在多孔質構件設置有抽吸孔與導引部，所述抽吸孔在相向面具有開口，通過負壓抽吸電子零件，所述導引部以沿著電子零件的外緣的方式配置，對由相向面保持的電子零件的移動進行限制，方向變更部具有：旋轉部，以相向面從電子零件的供給位置反轉的方式使拾取筒夾旋轉；及角度變更部，沿著與相向面平行的面變更拾取筒夾的角度。The present invention provides a pickup device and a mounting device that can pick up electronic components in a non-contact manner and position the electronic components. An embodiment is a pick-up device having a pick-up collet and a direction changing unit, the pick-up collet having a porous member having air permeability, and supplying electronic components via pores on an opposing surface. The gas inside is sprayed out in a planar shape. The porous member is provided with a suction hole and a guide part. The suction hole has an opening on the opposite surface to suck the electronic components through negative pressure. The guide part is arranged along the electron The direction changing unit is arranged in such a manner as to form the outer edge of the component to restrict the movement of the electronic component held by the opposing surface. The direction changing unit has: a rotation unit that rotates the pickup collet in such a manner that the opposing surface is reversed from the supply position of the electronic component; and an angle. The changing part changes the angle of the pickup collet along a surface parallel to the opposing surface.

Description

拾取裝置及安裝裝置Pick-up and installation devices

本發明是有關於一種拾取裝置及安裝裝置。The invention relates to a picking device and a mounting device.

在將邏輯器件、儲存器、圖像感測器等作為半導體元件的電子零件安裝在基板上時，通過切斷形成有半導體元件的晶圓而製成單片化的晶片。然後，通過拾取裝置將所述晶片逐一拾取，移送至基板並利用搭載裝置進行安裝。作為將這種半導體安裝於基板時所使用的安裝裝置，提出了各種裝置，作為其中一種，已知有包括晶片等電子零件的移送裝置、供給裝置、及基板載台的裝置。而且，在移送裝置上設置有拾取裝置、搭載裝置、及它們的控制裝置。拾取裝置進行以下作業：從供給裝置拾取電子零件，並將所拾取的電子零件交接至搭載裝置。When electronic components, such as logic devices, memories, and image sensors, which are semiconductor elements, are mounted on a substrate, the wafer on which the semiconductor elements are formed is cut into individual wafers. Then, the wafers are picked up one by one by a pick-up device, transferred to the substrate, and mounted using a loading device. Various devices have been proposed as mounting devices used when mounting such semiconductors on a substrate. As one of them, a device including a transfer device for electronic components such as wafers, a supply device, and a substrate stage is known. Furthermore, the transfer device is provided with a pickup device, a loading device, and their control devices. The pick-up device picks up electronic components from the supply device and delivers the picked-up electronic components to the mounting device.

作為晶片的其中一面的表面成為形成有微細的電路的功能面。在從晶圓拾取所述晶片時，若拾取的構件與功能面直接接觸，則電路等有破損的擔心，因此有希望避免接觸的要求。One surface of the wafer becomes a functional surface on which fine circuits are formed. When picking up the wafer from the wafer, if the picked up member comes into direct contact with the functional surface, there is a risk of damage to the circuit, etc., so there is a demand to avoid contact.

而且，還使晶片的表面的連接端子與基板的連接端子相向地接合。此時，為了確保並提高連接端子彼此的接合性，有時對晶片的表面進行電漿體處理或表面活性化處理等表面處理。為了維持進行了這種處理的晶片的表面狀態，也有希望避免拾取的構件與晶片的表面直接接觸的要求。Furthermore, the connection terminals on the surface of the wafer and the connection terminals on the substrate are joined to face each other. At this time, in order to ensure and improve the bonding properties between the connection terminals, the surface of the wafer may be subjected to surface treatment such as plasma treatment or surface activation treatment. In order to maintain the surface condition of the wafer subjected to such processing, there is also a requirement to avoid direct contact between the picked-up member and the surface of the wafer.

為了應對使構件不與晶片的表面接觸的要求，以往在作為拾取晶片的構件的筒夾中，將保持晶片的面設為錐面，以並非晶片的表面而是僅周緣部與筒夾的錐面接觸的狀態從晶片的中央被抽吸保持（參照專利文獻1）。 [先前技術文獻] [專利文獻] In order to cope with the requirement that the member does not come into contact with the surface of the wafer, conventionally, in collets as members for picking up wafers, the surface holding the wafer is made into a tapered surface, so that only the peripheral edge portion of the collet is tapered with the collet, not the surface of the wafer. The state of surface contact is sucked and maintained from the center of the wafer (see Patent Document 1). [Prior technical literature] [Patent Document]

[專利文獻1]日本專利實開昭63-124746號公報[Patent Document 1] Japanese Patent Application Publication No. Sho 63-124746

[發明所欲解決之課題][Problem to be solved by the invention]

但是，在如所述那樣的現有技術中，僅在晶片的周邊部與筒夾接觸，從晶片的中央部進行抽吸。因此，晶片容易發生應變，有可能產生晶片的缺損、破裂。而且，筒夾與晶片周邊的邊緣部分接觸，利用所述接觸部分支撐被抽吸的晶片，因此應力集中於周邊部，而容易產生缺損、破裂。進而，由於在抽吸保持的狀態下晶片的保持位置被固定，故而於在抽吸保持時發生偏移或傾斜的情況下，在其後交接至搭載裝置時無法修正。However, in the conventional technology as described above, only the peripheral portion of the wafer comes into contact with the collet, and suction is performed from the center portion of the wafer. Therefore, the wafer is prone to strain, which may lead to chip defects or cracks. Furthermore, the collet is in contact with the peripheral edge portion of the wafer, and the contact portion is used to support the sucked wafer. Therefore, stress is concentrated on the peripheral portion, which easily causes defects and cracks. Furthermore, since the holding position of the wafer is fixed in the suction-holding state, if the wafer is shifted or tilted during the suction-holding, it cannot be corrected when it is subsequently transferred to the mounting device.

本發明的實施方式是為了解決如所述那樣的課題而完成，其目的在於提供一種以非接觸方式拾取電子零件、並且能夠將所述電子零件定位的拾取裝置及安裝裝置。 [解決課題之手段] Embodiments of the present invention were made to solve the above-described problems, and an object thereof is to provide a pickup device and a mounting device that can pick up electronic components in a non-contact manner and position the electronic components. [Means to solve the problem]

本發明的實施方式是一種拾取裝置，具有矩形外緣，且拾取電子零件，所述拾取裝置具有：拾取筒夾，抽吸保持所述電子零件；及方向變更部，改變所述拾取筒夾的朝向，所述拾取筒夾中，具有多孔質構件，所述多孔質構件具有通氣性，經由與所述電子零件相向的相向面的細孔將被供給至內部的氣體呈面狀噴出，在所述多孔質構件設置有抽吸孔，所述抽吸孔在所述相向面具有開口，通過負壓抽吸所述電子零件，設置有導引部，所述導引部以沿著所述電子零件的外緣的方式配置，對由所述相向面保持的所述電子零件的移動進行限制，所述方向變更部具有：旋轉部，以所述相向面從所述電子零件的供給位置反轉的方式，使所述拾取筒夾旋轉；及角度變更部，沿著與所述相向面平行的面，變更所述拾取筒夾的角度。An embodiment of the present invention is a pickup device that has a rectangular outer edge and picks up electronic components. The pickup device has: a pickup collet that suctions and holds the electronic components; and a direction changing portion that changes the direction of the pickup collet. In this direction, the pickup collet is provided with a porous member having air permeability, and the gas supplied to the inside is ejected in a planar shape through the pores on the opposing surface facing the electronic component. The porous member is provided with a suction hole, the suction hole has an opening on the opposing surface, and the electronic component is suctioned by negative pressure, and is provided with a guide portion to follow the electronic components. The direction changing unit is arranged on the outer edge of the component to restrict the movement of the electronic component held by the opposing surface, and the direction changing unit includes a rotation unit that reverses the supply position of the electronic component with the opposing surface. The method of rotating the pickup collet; and the angle changing part changing the angle of the pickup collet along a surface parallel to the opposing surface.

而且，本發明的實施方式的安裝裝置具有：所述拾取裝置；接合頭，以相對於所述拾取筒夾能夠相對移動的方式設置，從所述拾取筒夾接收所述電子零件；及搭載裝置，將由所述接合頭保持的所述電子零件移送至基板並予以安裝。 [發明的效果] Furthermore, the mounting device according to the embodiment of the present invention includes: the pickup device; a bonding head that is disposed movably relative to the pickup collet and receives the electronic component from the pickup collet; and a mounting device. , the electronic component held by the bonding head is transferred to the substrate and mounted. [Effects of the invention]

根據本發明的實施方式的拾取裝置及安裝裝置，能夠以非接觸方式拾取電子零件，並且將所述電子零件定位。According to the pickup device and the mounting device of the embodiment of the present invention, electronic components can be picked up and positioned in a non-contact manner.

參照圖式對本發明的實施方式進行說明。另外，圖式為示意圖，各部的尺寸、比率等包括為了容易理解而誇張的部分。如圖1及圖2所示，本實施方式的拾取筒夾200用於電子零件2的移送裝置1。移送裝置1是包括拾取裝置20、搭載裝置30、及控制裝置50且利用拾取裝置20將電子零件2交接至搭載裝置30的裝置。Embodiments of the present invention will be described with reference to the drawings. In addition, the drawings are schematic diagrams, and the dimensions, ratios, etc. of each part include exaggerated portions for easy understanding. As shown in FIGS. 1 and 2 , the pickup collet 200 of this embodiment is used in the transfer device 1 of the electronic components 2 . The transfer device 1 includes a pickup device 20 , a mounting device 30 , and a control device 50 , and is a device that transfers the electronic components 2 to the mounting device 30 using the pickup device 20 .

電子零件2例如為矩形狀的薄小片零件。在本實施方式中，電子零件2是將晶圓分割成單片的半導體晶片。半導體晶片在表背中的一面具有作為半導體元件發揮功能的功能面。而且，安裝裝置100是將從供給裝置10供給的電子零件2經由移送裝置1的移送而安裝於基板的裝置。即，安裝裝置100除了包括移送裝置1的結構以外，還包括供給裝置10、支撐基板的基板載台60。The electronic component 2 is, for example, a rectangular thin chip component. In this embodiment, the electronic component 2 is a semiconductor wafer obtained by dividing a wafer into individual pieces. The semiconductor wafer has a functional surface that functions as a semiconductor element on one of the front and back surfaces. Furthermore, the mounting device 100 is a device that mounts the electronic components 2 supplied from the supply device 10 on the substrate through transfer by the transfer device 1 . That is, the mounting device 100 includes the supply device 10 and the substrate stage 60 that supports the substrate in addition to the structure of the transfer device 1 .

供給裝置10是向拾取裝置20供給電子零件2的裝置。供給裝置10使作為拾取對象的電子零件2移動至供給位置P1。供給位置P1是拾取裝置20拾取作為拾取對象的電子零件2的位置。供給裝置10包括支撐貼附有電子零件2的片材11的供給載台12、使供給載台12移動的載台移動機構13。所述載台移動機構13例如可使用通過由伺服馬達驅動的滾珠螺桿機構而使滑動器在軌道上移動的線性引導件。The supply device 10 is a device that supplies the electronic components 2 to the pickup device 20 . The supply device 10 moves the electronic component 2 to be picked up to the supply position P1. The supply position P1 is a position where the pickup device 20 picks up the electronic component 2 as a pickup target. The supply device 10 includes a supply stage 12 that supports the sheet 11 to which the electronic components 2 are attached, and a stage moving mechanism 13 that moves the supply stage 12 . The stage moving mechanism 13 may use, for example, a linear guide that moves a slider on a track using a ball screw mechanism driven by a servo motor.

此處，貼附有電子零件2的片材11是貼附在未圖示的晶圓環上的具有粘著性的晶圓片材。在片材11上，電子零件2配置成矩陣（matrix）狀。在本實施方式中，電子零件2以功能面向上方露出的朝上狀態配置。Here, the sheet 11 on which the electronic components 2 are attached is an adhesive wafer sheet attached to a wafer ring (not shown). On the sheet 11, the electronic components 2 are arranged in a matrix. In this embodiment, the electronic component 2 is arranged in an upward state with its functional surface exposed upward.

供給載台12是水平支撐貼附有片材11的晶圓環的台。即，供給載台12經由晶圓環支撐貼附有電子零件2的片材11。供給載台12被設置成能夠通過載台移動機構13在水平方向上移動。片材11由供給載台12以及載台移動機構13一起水平地支撐，因此片材11及載置於所述片材11的電子零件2也被設置成能夠在水平方向上移動。The supply stage 12 is a stage that horizontally supports the wafer ring to which the sheet 11 is attached. That is, the supply stage 12 supports the sheet 11 on which the electronic component 2 is attached via the wafer ring. The supply stage 12 is provided movably in the horizontal direction by a stage moving mechanism 13 . Since the sheet 11 is supported horizontally by the supply stage 12 and the stage moving mechanism 13, the sheet 11 and the electronic components 2 placed on the sheet 11 are also provided to be movable in the horizontal direction.

另外，如圖1所示，將水平方向中供給裝置10與搭載裝置30排列的方向稱為X軸方向，將與X軸正交的方向稱為Y軸方向。而且，將與片材11的平面正交的方向稱為Z軸方向或上下方向。上方向是以片材11的平面為邊界且載置有電子零件2一側的方向，下方向是以片材11的平面為邊界且未載置電子零件2一側的方向。θz方向是在平行於XY平面的面上旋轉的方向，θx方向是在平行於ZY平面的面上旋轉的方向。In addition, as shown in FIG. 1 , the direction in which the supply device 10 and the mounting device 30 are arranged in the horizontal direction is called the X-axis direction, and the direction orthogonal to the X-axis is called the Y-axis direction. Furthermore, the direction orthogonal to the plane of the sheet 11 is called the Z-axis direction or the up-down direction. The upward direction is the direction with the plane of the sheet 11 as a boundary and the side where the electronic components 2 are placed, and the downward direction is the direction with the plane of the sheet 11 as a boundary and the side where the electronic components 2 are not placed. The θz direction is the direction of rotation on the plane parallel to the XY plane, and the θx direction is the direction of rotation on the plane parallel to the ZY plane.

[拾取裝置] 拾取裝置20是從供給裝置10拾取電子零件2並將所拾取的電子零件2交接至搭載裝置30的裝置。所述拾取裝置20包括拾取筒夾200、筒夾移動機構22、方向變更部23、及上推銷24。 [pickup device] The pickup device 20 is a device that picks up the electronic components 2 from the supply device 10 and delivers the picked-up electronic components 2 to the mounting device 30 . The pickup device 20 includes a pickup collet 200 , a collet moving mechanism 22 , a direction changing part 23 , and an upper push button 24 .

如圖3～圖5所示，拾取筒夾200是抽吸保持電子零件2並解除抽吸保持而釋放電子零件2的構件。拾取筒夾200具有多孔質構件201、基座202、導引部203。As shown in FIGS. 3 to 5 , the pick-up collet 200 is a member that suction-holds the electronic components 2 and releases the suction-holding to release the electronic components 2 . The pickup collet 200 has a porous member 201, a base 202, and a guide part 203.

多孔質構件201是具有通氣性且經由與電子零件2相向的相向面201a的細孔供給被供給至內部的氣體的構件（另外，在以下說明中，對向電子零件2供給的氣體標注符號G進行圖示）。本實施方式的多孔質構件201為長方體的板形狀，整體上緻密且大致均一地形成有連通的微細的空間。多孔質構件201通過所述結構而具有通氣性，但其流導率非常小。多孔質構件201的任一面成為相向面201a，若從與相向面201a相反側的背面201b向內部供給氣體，則會從相向面201a的緻密且均等地存在的細孔中噴出氣體。所述噴出成為向噴出的相向面201a的整個面擴展的實質上為面狀的噴出。所述噴出極為緩慢，可以說是滲出來的感覺，是靠近手指稍微感覺到氣流的程度。另外，相向面201a與背面201b以外的面的細孔也可以堵塞。The porous member 201 is a member that has air permeability and supplies gas supplied to the inside through the pores of the opposing surface 201 a facing the electronic component 2 (in addition, in the following description, the gas supplied to the electronic component 2 is denoted by a symbol G (illustrated). The porous member 201 of this embodiment has a rectangular parallelepiped plate shape, and is densely and substantially uniformly formed with interconnected fine spaces as a whole. The porous member 201 has air permeability due to the above-mentioned structure, but its flow conductivity is very small. Either surface of the porous member 201 serves as the opposing surface 201a. If gas is supplied into the interior from the back surface 201b opposite to the opposing surface 201a, the gas will be ejected from the dense and uniform pores of the opposing surface 201a. The discharge is a substantially planar discharge that spreads over the entire surface of the facing surface 201 a where the discharge is directed. The ejection is extremely slow, and it can be said to be an oozing feeling, to the extent that you can feel the airflow slightly when you get close to your finger. In addition, pores on surfaces other than the opposing surface 201a and the back surface 201b may be clogged.

多孔質構件201是如上所述作為內部的微細空間的細孔彼此連通且氣體能夠通過細孔間的連續結構體。作為這種多孔質構件201，可使用燒結金屬、陶瓷、樹脂等。就內部的粒子難以分離流出的觀點而言，優選設為燒結金屬。The porous member 201 is a continuous structure in which pores serving as internal microspaces are connected to each other and gas can pass between the pores as described above. As this porous member 201, sintered metal, ceramics, resin, etc. can be used. From the viewpoint that the particles inside are difficult to separate and flow out, it is preferable to use sintered metal.

進而，如圖3及圖4所示，在多孔質構件201設置有抽吸孔201c，所述抽吸孔201c是在相向面201a具有開口201d且通過負壓抽吸電子零件2的貫穿孔。本實施方式的抽吸孔201c從背面201b的中央直線狀地貫穿至相向面201a的中央。Furthermore, as shown in FIGS. 3 and 4 , the porous member 201 is provided with a suction hole 201 c , which is a through hole having an opening 201 d on the opposing surface 201 a and sucking the electronic component 2 by negative pressure. The suction hole 201c of this embodiment linearly penetrates from the center of the back surface 201b to the center of the opposing surface 201a.

基座202是覆蓋相向面201a以外的多孔質構件201的面的構件。本實施方式的基座202是下方開口的長方體形狀的箱。通過所述基座202的外形構成了拾取筒夾200的矩形的外緣。多孔質構件201從基座202的開口以底面成為相向面201a而露出的方式***，組裝至基座202內並被固定。The base 202 is a member that covers the surfaces of the porous member 201 other than the facing surface 201a. The base 202 of this embodiment is a rectangular parallelepiped box with an open bottom. The outer edge of the rectangle of the pickup collet 200 is formed by the shape of the base 202 . The porous member 201 is inserted from the opening of the base 202 so that the bottom surface becomes the facing surface 201a and is exposed, and is assembled into the base 202 and fixed.

如圖3及圖5所示，在基座202的頂面上設置有供氣孔202a、排氣孔202b、安裝孔202c。供氣孔202a是用來向多孔質構件201供氣的貫穿孔。供氣孔202a因連接於供氣孔202a的配管而形成於靠近基座202的外緣的位置。排氣孔202b是用於經由抽吸孔201c使開口201d產生負壓的貫穿孔。排氣孔202b向下方延伸，以與多孔質構件201的抽吸孔201c一致的方式形成。在排氣孔202b的周圍的基座202的內表面與多孔質構件201之間形成有氣體滯留的空間。另外，排氣孔202b也可以貫穿抽吸孔201c而到達相向面201a。在所述情況下，多孔質構件201的抽吸孔201c、開口201d以與到達多孔質構件201的相向面201a的排氣孔202b的外側密接的方式設置。安裝孔202c是在與筒夾移動機構22連接時用於防止偏移的一對凹陷孔。As shown in FIGS. 3 and 5 , an air supply hole 202a, an exhaust hole 202b, and a mounting hole 202c are provided on the top surface of the base 202. The air supply hole 202a is a through hole for supplying air to the porous member 201. The air supply hole 202a is formed close to the outer edge of the base 202 by a pipe connected to the air supply hole 202a. The exhaust hole 202b is a through hole for generating negative pressure in the opening 201d via the suction hole 201c. The exhaust hole 202b extends downward and is formed in line with the suction hole 201c of the porous member 201. A space in which gas accumulates is formed between the inner surface of the base 202 and the porous member 201 around the exhaust hole 202b. In addition, the exhaust hole 202b may penetrate the suction hole 201c and reach the opposing surface 201a. In this case, the suction hole 201c and the opening 201d of the porous member 201 are provided in close contact with the outside of the exhaust hole 202b reaching the facing surface 201a of the porous member 201. The mounting holes 202c are a pair of recessed holes for preventing offset when connected to the collet moving mechanism 22 .

供氣孔202a經由未圖示的配管連接於氣體的供給回路。供給回路包括氣體的供給源、泵、閥等而構成。此處，經由供氣孔202a供給至多孔質構件201的氣體設為惰性氣體。排氣孔202b經由未圖示的配管而與包括真空泵、閥等的負壓產生回路連通。The gas supply hole 202a is connected to a gas supply circuit via a pipe (not shown). The supply circuit is composed of a gas supply source, a pump, a valve, etc. Here, the gas supplied to the porous member 201 via the gas supply hole 202a is an inert gas. The exhaust hole 202b is connected to a negative pressure generating circuit including a vacuum pump, a valve, and the like via piping (not shown).

導引部203是沿著電子零件2的外緣配置且對由相向面201a保持的電子零件2的移動進行限制的構件。所謂沿著電子零件2的外緣，只要配置於沿著外緣的方向上即可，導引部203並非一定與電子零件2接觸。本實施方式的導引部203沿著矩形基座202的側面的四條邊配置。例如如圖3、圖4及圖5所示，導引部203是沿著基座202的四個側面、即矩形的相向面201a的四條邊設置的多個板狀體。本實施方式的導引部203在相向面201a的各邊各設置有一個，但不限定於此。The guide portion 203 is a member arranged along the outer edge of the electronic component 2 and restricting the movement of the electronic component 2 held by the opposing surface 201a. The so-called "along the outer edge of the electronic component 2" only needs to be arranged in the direction along the outer edge, and the guide portion 203 does not necessarily need to be in contact with the electronic component 2. The guide portion 203 of this embodiment is arranged along the four sides of the side surface of the rectangular base 202 . For example, as shown in FIGS. 3 , 4 and 5 , the guide portion 203 is a plurality of plate-shaped bodies provided along the four side surfaces of the base 202 , that is, the four sides of the rectangular facing surface 201 a. In this embodiment, one guide part 203 is provided on each side of the opposing surface 201a, but the guide part 203 is not limited to this.

各導引部203具有比相向面201a突出的突出部分。導引部203從相向面201a突出的距離（突出量）只要能夠限制隔著氣體層由相向面201a保持的電子零件2的移動即可，為至少從相向面201a至隔著氣體層所保持的電子零件2的程度以上即可。但，在成為所述導引部203的突出部分超過隔著氣體層由相向面201a保持的電子零件2而突出的距離的情況下，在從晶圓拾取時，需要考慮到避免與所拾取的電子零件2的周圍的電子零件2接觸。因此，導引部203的突出部分從相向面201a突出的距離優選設為隔著氣體層由相向面201a保持的電子零件2的側面內。但，如下文所述，通過在拾取時控制上推銷24，能夠應對各種突出量而避免與周圍的電子零件2接觸。Each guide portion 203 has a protruding portion protruding from the opposing surface 201a. The distance (protrusion amount) of the guide portion 203 from the opposing surface 201a is sufficient as long as it can restrict the movement of the electronic component 2 held by the opposing surface 201a across the gas layer, and is at least from the opposing surface 201a to the distance held across the gas layer. Electronic parts level 2 or above is enough. However, when the protruding portion of the guide portion 203 exceeds the protruding distance of the electronic component 2 held by the opposing surface 201a across the gas layer, it is necessary to take into account the avoidance of contact with the picked-up part when picking up the wafer. The electronic components 2 around the electronic component 2 come into contact. Therefore, the distance by which the protruding portion of the guide portion 203 protrudes from the facing surface 201a is preferably within the side surface of the electronic component 2 held by the facing surface 201a via the gas layer. However, as described below, by controlling the upper pusher 24 when picking up, it is possible to cope with various protruding amounts and avoid contact with the surrounding electronic components 2 .

另外，在以下說明中，將其中一正交的導引部203設為203K、203L，將另一正交的導引部203設為203M、203N，在不對這些進行區分的情況下，以導引部203的形式進行說明。此處所謂的正交，包括相鄰的邊的兩個導引部203接觸或連續而形成直角的情況，也包括在一條邊上有多個導引部203且這些導引部203分離而兩者所沿著的直線（平面）正交的情況（參照圖19）。In addition, in the following description, one of the orthogonal guide parts 203 is referred to as 203K and 203L, and the other orthogonal guide part 203 is referred to as 203M and 203N. It will be described in the form of introduction 203. The so-called orthogonality here includes the case where two guide parts 203 on adjacent sides are in contact or continuous to form a right angle, and also includes the case where there are multiple guide parts 203 on one side and these guide parts 203 are separated into two sides. The straight lines (planes) along which they are drawn are orthogonal to each other (see Figure 19).

筒夾移動機構22是使裝設有拾取筒夾200的拾取頭21在供給位置P1與交接位置P2之間往返移動且在供給位置P1及交接位置P2升降的機構。另外，交接位置P2是拾取裝置20將在供給位置P1拾取的電子零件2交接至後述的作為接收部發揮功能的接合頭31的位置。供給位置P1及交接位置P2主要是指XY方向的位置，不一定指Z軸方向的位置。The collet moving mechanism 22 is a mechanism that reciprocates the pickup head 21 equipped with the pickup collet 200 between the supply position P1 and the delivery position P2, and moves the pickup head 21 mounted on the pickup collet 200 up and down between the supply position P1 and the delivery position P2. In addition, the delivery position P2 is a position where the pick-up device 20 delivers the electronic component 2 picked up at the supply position P1 to the bonding head 31 that functions as a receiving portion to be described later. The supply position P1 and the delivery position P2 mainly refer to the positions in the XY direction, and do not necessarily refer to the positions in the Z-axis direction.

而且，即使在指Z軸方向的位置（高度）的情況下，所述高度也具有規定的寬度。規定的寬度包括電子零件2的厚度、將電子零件2上推的距離、能夠吸附電子零件2的距離等。尤其是在指Z軸方向的位置（高度）的情況下，在供給位置P1中，將接近位置處的高度設為H1，將剝離位置處的高度設為H2（參照圖11）。Furthermore, even when referring to the position (height) in the Z-axis direction, the height has a predetermined width. The prescribed width includes the thickness of the electronic component 2, the distance to push the electronic component 2 up, the distance to which the electronic component 2 can be adsorbed, and the like. In particular, when referring to the position (height) in the Z-axis direction, in the supply position P1, let the height at the approach position be H1 and the height at the peeling position be H2 (see FIG. 11 ).

筒夾移動機構22具有安裝有拾取頭21的臂222a，通過使臂222a移動，而使裝設於拾取頭21的拾取筒夾200移動。在拾取頭21的前端設置有裝卸部222b。裝卸部222b在內部包括磁鐵，利用磁鐵的抽吸力吸附保持拾取筒夾200的基座202。如圖4及圖5所示，在裝卸部222b的與基座202的接觸面設置有一對銷222c。通過將銷222c嵌入設置於基座202的安裝孔202c中，防止拾取筒夾200相對於裝卸部222b的偏移。另外，雖未圖示，但與排氣孔202b連接的配管通過裝卸部222b內，與供氣孔202a連接的配管由裝卸部222b支撐。The collet moving mechanism 22 has an arm 222a to which the pickup head 21 is attached, and moves the arm 222a to move the pickup collet 200 attached to the pickup head 21. A detachable portion 222b is provided at the front end of the pickup head 21 . The attachment and detachment portion 222b includes a magnet inside, and uses the suction force of the magnet to attract and hold the base 202 of the pickup collet 200 . As shown in FIGS. 4 and 5 , a pair of pins 222 c is provided on the contact surface of the attachment and detachment portion 222 b with the base 202 . By fitting the pin 222c into the mounting hole 202c provided in the base 202, the pickup collet 200 is prevented from being displaced relative to the attachment and detachment portion 222b. In addition, although not shown in the figure, the pipe connected to the exhaust hole 202b passes through the attachment and detachment part 222b, and the pipe connected to the air supply hole 202a is supported by the attachment and detachment part 222b.

筒夾移動機構22包括滑動機構221、升降機構222。滑動機構221通過使安裝有拾取頭21的臂222a移動，而使拾取筒夾200在供給位置P1與交接位置P2之間往返移動。此處，滑動機構221具有與X軸方向平行地延伸且固定於支撐框架221a的軌道221b、及在軌道221b上行進的滑動器221c。The collet moving mechanism 22 includes a sliding mechanism 221 and a lifting mechanism 222. The sliding mechanism 221 moves the arm 222a on which the pickup head 21 is mounted, thereby causing the pickup collet 200 to reciprocate between the supply position P1 and the delivery position P2. Here, the sliding mechanism 221 has a rail 221b extending parallel to the X-axis direction and fixed to the support frame 221a, and a slider 221c running on the rail 221b.

升降機構222通過使安裝有拾取頭21的臂222a移動，而使拾取筒夾200在上下方向上移動。具體而言，升降機構222可使用通過由伺服馬達驅動的滾珠螺桿機構使滑動器在軌道上移動的線性引導件。即，通過伺服馬達的驅動，拾取筒夾200沿著Z軸方向升降。另外，拾取筒夾200經由裝卸部222b被拾取頭21彈性支撐，並且以相對於拾取頭21而能夠沿著Z軸方向上下滑動移動的方式設置。並且，拾取頭21具有檢測所述滑動移動的感測器。The lifting mechanism 222 moves the arm 222a on which the pickup head 21 is mounted, thereby moving the pickup collet 200 in the up and down direction. Specifically, the lifting mechanism 222 may use a linear guide that moves a slider on a track through a ball screw mechanism driven by a servo motor. That is, by driving the servo motor, the pickup collet 200 moves up and down along the Z-axis direction. In addition, the pickup collet 200 is elastically supported by the pickup head 21 via the attachment and detachment portion 222 b, and is provided so as to be slidable up and down in the Z-axis direction relative to the pickup head 21 . Furthermore, the pickup head 21 has a sensor that detects the sliding movement.

方向變更部23變更拾取筒夾200的朝向。拾取筒夾200的朝向包括從基座202朝向相向面201a的方向、沿著與相向面201a平行的面的角度。如圖6所示，方向變更部23具有旋轉部231、角度變更部232。旋轉部231以相向面201a從自片材11拾取電子零件2的位置反轉的方式使拾取筒夾200旋轉。The direction changing unit 23 changes the direction of the pickup collet 200 . The orientation of the pickup collet 200 includes the direction from the base 202 toward the opposing surface 201a and the angle along a surface parallel to the opposing surface 201a. As shown in FIG. 6 , the direction changing unit 23 includes a rotating unit 231 and an angle changing unit 232 . The rotation unit 231 rotates the pickup collet 200 so that the opposing surface 201 a is reversed from the position where the electronic component 2 is picked up from the sheet 11 .

旋轉部231具有驅動源231a。驅動源231a例如為設置於升降機構222的馬達，通過使連接於其旋轉軸的臂222a繞X軸旋轉，而使拾取頭21沿著θx方向旋轉。由此，旋轉部231可使由拾取頭21支撐的拾取筒夾200反轉。The rotating part 231 has a drive source 231a. The drive source 231a is, for example, a motor provided in the lifting mechanism 222, and the pickup head 21 is rotated in the θx direction by rotating the arm 222a connected to the rotation axis about the X-axis. Thereby, the rotating part 231 can reverse the pickup collet 200 supported by the pickup head 21 .

角度變更部232沿著與相向面201a平行的面變更拾取筒夾200的角度。如下文所述，利用所述角度變更部232形成的變更角度是通過反轉使電子零件2朝向相向面201a的角落移動的角度。而且，角度變更部232在拾取電子零件2後的任一時機變更角度，但在停止於相向面201a反轉的位置之後，恢復為原來的角度（拾取時的角度）。角度變更部232具有驅動源232a及未圖示的傳導部。驅動源232a例如為設置於拾取頭21的馬達，具有Z軸方向的旋轉軸。傳導部通過將驅動源232a的動力傳導至裝卸部222b，而使拾取頭21繞Z軸旋轉。傳導部例如為內置於拾取頭21中的皮帶傳動機構。由此，角度變更部232可使由拾取頭21支撐的拾取筒夾200沿著θz方向旋轉。The angle change part 232 changes the angle of the pickup collet 200 along the surface parallel to the opposing surface 201a. As described below, the changing angle formed by the angle changing portion 232 is an angle at which the electronic component 2 moves toward the corner of the opposing surface 201 a by inversion. Furthermore, the angle changing unit 232 changes the angle at any time after picking up the electronic component 2, but after stopping at the position where the opposing surface 201a is reversed, it returns to the original angle (the angle at the time of picking up). The angle changing part 232 has a drive source 232a and a conductive part not shown in the figure. The drive source 232a is, for example, a motor provided in the pickup head 21 and has a rotation axis in the Z-axis direction. The transmission part transmits the power of the drive source 232a to the attachment and detachment part 222b, thereby rotating the pickup head 21 around the Z-axis. The transmission part is, for example, a belt transmission mechanism built into the pickup head 21 . Thereby, the angle changing part 232 can rotate the pickup collet 200 supported by the pickup head 21 in the θz direction.

例如，如圖7的（A）所示，使相向面201a朝向供給載台12的拾取筒夾200在供給位置P1吸附保持電子零件2。如圖7的（C）、圖7的（D）所示，方向變更部23的旋轉部231以相向面201a朝上的方式從供給位置P1起變更拾取筒夾200的朝向。即，由拾取筒夾200保持的電子零件2從相向面201a朝向下方的方向反轉至朝向上方的方向。此時，從供給位置P1起繞X軸旋轉的角度為180°。For example, as shown in FIG. 7(A) , the pick-up collet 200 with the opposing surface 201 a facing the supply stage 12 attracts and holds the electronic component 2 at the supply position P1. As shown in FIGS. 7(C) and 7(D) , the rotation unit 231 of the direction changing unit 23 changes the direction of the pickup collet 200 from the supply position P1 so that the opposing surface 201 a faces upward. That is, the electronic component 2 held by the pickup collet 200 is reversed from the downward direction of the opposing surface 201a to the upward direction. At this time, the angle of rotation around the X-axis from the supply position P1 is 180°.

而且，例如，如圖7的（B）所示，角度變更部232使供給位置P1處的拾取筒夾200繞Z軸轉動45°（圖中α所示）。所述轉動可在拾取電子零件2後立即進行，也可以在利用旋轉部231進行旋轉的途中進行。但，優選在利用旋轉部231形成的旋轉角度成為180°之前利用角度變更部232變更角度。然後，如圖7的（E）所示，通過180°的旋轉使電子零件2反轉後，角度變更部232使拾取筒夾200轉動45°以恢復為原來的角度。Furthermore, for example, as shown in (B) of FIG. 7 , the angle changing unit 232 rotates the pickup collet 200 at the supply position P1 by 45° around the Z axis (indicated by α in the figure). The rotation may be performed immediately after picking up the electronic component 2 , or may be performed while the electronic component 2 is being rotated by the rotating part 231 . However, it is preferable to use the angle changing unit 232 to change the angle before the rotation angle formed by the rotating unit 231 reaches 180°. Then, as shown in (E) of FIG. 7 , after the electronic component 2 is reversed by 180° rotation, the angle changing unit 232 rotates the pickup collet 200 by 45° to restore the original angle.

如圖1所示，上推銷24設置於供給裝置10的片材11的下方。上推銷24是前端尖銳的針狀的構件。上推銷24以長度方向平行於Z軸方向的方式設置於支承體241的內部。As shown in FIG. 1 , the push push button 24 is provided below the sheet 11 of the supply device 10 . The upper push pin 24 is a needle-shaped member with a sharp front end. The upper push pin 24 is provided inside the support body 241 so that its length direction is parallel to the Z-axis direction.

支承體241具有使上推銷24從其內部進出或向其內部退避的驅動機構。所述進出或退避沿著上下方向進行。所述驅動機構例如包括由上下方向的軌道導引而移動的滑動器、及驅動滑動器的氣缸或凸輪機構。The support body 241 has a driving mechanism for moving the upper push pin 24 in and out of the support body 241 or retracting the support body 241 to the inside thereof. The entry and exit or retraction is performed along the up and down direction. The driving mechanism includes, for example, a slider that is guided to move by an up-and-down rail, and a cylinder or a cam mechanism that drives the slider.

[搭載裝置] 搭載裝置30是將從拾取裝置20接收到的電子零件2移送至安裝位置P3並搭載於基板上的裝置。安裝位置P3是將電子零件2安裝於基板的位置。搭載裝置30具有接合頭31、頭移動機構32。 [Mounted device] The mounting device 30 is a device that transfers the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it on the substrate. The mounting position P3 is a position where the electronic component 2 is mounted on the substrate. The mounting device 30 includes a bonding head 31 and a head moving mechanism 32 .

接合頭31是具有作為在交接位置P2從拾取筒夾200接收電子零件2的接收部的功能且將所述電子零件2在安裝位置P3安裝於基板上的裝置。接合頭31保持電子零件2，並且在安裝後解除保持狀態而釋放電子零件2。The bonding head 31 has a function as a receiving portion for receiving the electronic component 2 from the pickup collet 200 at the transfer position P2, and is a device that mounts the electronic component 2 on the substrate at the mounting position P3. The bonding head 31 holds the electronic component 2 and releases the holding state after mounting to release the electronic component 2 .

具體而言，接合頭31包括噴嘴31a。噴嘴31a保持電子零件2，並且解除保持狀態而釋放電子零件2。噴嘴31a包括噴嘴孔。噴嘴孔在噴嘴31a的前端的吸附面開口。噴嘴孔與真空泵等負壓產生回路（未圖示）連通，通過所述回路產生負壓，在噴嘴31a的吸附面吸附保持電子零件2。而且，通過解除負壓，從吸附面解除電子零件2的保持狀態。Specifically, the bonding head 31 includes a nozzle 31a. The nozzle 31a holds the electronic component 2, releases the holding state, and releases the electronic component 2. The nozzle 31a includes a nozzle hole. The nozzle hole opens on the suction surface of the tip of the nozzle 31a. The nozzle hole is connected to a negative pressure generating circuit (not shown) such as a vacuum pump, and a negative pressure is generated through the circuit to suck and hold the electronic component 2 on the suction surface of the nozzle 31a. Furthermore, by releasing the negative pressure, the electronic component 2 is released from the holding state on the adsorption surface.

頭移動機構32是使接合頭31在交接位置P2與安裝位置P3之間往返移動且在交接位置P2及安裝位置P3升降的機構。具體而言，頭移動機構32包括滑動機構321、升降機構322。The head moving mechanism 32 is a mechanism that reciprocates the bonding head 31 between the delivery position P2 and the mounting position P3, and moves the bonding head 31 up and down between the delivery position P2 and the mounting position P3. Specifically, the head moving mechanism 32 includes a sliding mechanism 321 and a lifting mechanism 322 .

滑動機構321使接合頭31在交接位置P2與安裝位置P3之間往返移動。此處，滑動機構321具有與X軸方向平行地延伸且固定於支撐框架321a的兩條軌道321b、及在軌道321b上行進的滑動器321c。The sliding mechanism 321 reciprocates the joint head 31 between the transfer position P2 and the installation position P3. Here, the sliding mechanism 321 has two rails 321b extending parallel to the X-axis direction and fixed to the support frame 321a, and a slider 321c running on the rails 321b.

另外，雖未圖示，但滑動機構321具有使接合頭31沿著Y軸方向滑動移動的滑動機構。所述滑動機構也可包括Y軸方向的軌道與在軌道上行進的滑動器。滑動器通過由旋轉馬達驅動的滾珠螺桿、線性馬達等來驅動。升降機構322使接合頭31在上下方向上移動。具體而言，升降機構322可使用通過由伺服馬達驅動的滾珠螺桿機構使滑動器在軌道上移動的線性引導件。即，通過伺服馬達的驅動，接合頭31沿著Z軸方向升降。In addition, although not shown in the figure, the sliding mechanism 321 has a sliding mechanism that slides the bonding head 31 along the Y-axis direction. The sliding mechanism may also include a track in the Y-axis direction and a slider traveling on the track. The slider is driven by a ball screw driven by a rotary motor, a linear motor, etc. The lifting mechanism 322 moves the bonding head 31 in the up and down direction. Specifically, the lifting mechanism 322 may use a linear guide that moves a slider on a track through a ball screw mechanism driven by a servo motor. That is, by driving the servo motor, the bonding head 31 moves up and down along the Z-axis direction.

基板載台60是支撐用來安裝電子零件2的基板的台。基板載台60設置於載台移動機構61。載台移動機構61是使基板載台60在XY平面上滑動移動並將電子零件2在基板上的安裝預定位置定位於安裝位置P3的移動機構。載台移動機構61例如可使用通過由伺服馬達驅動的滾珠螺桿機構使滑動器在軌道上移動的線性引導件。The substrate stage 60 is a stage that supports the substrate on which the electronic component 2 is mounted. The substrate stage 60 is provided in the stage moving mechanism 61 . The stage moving mechanism 61 is a moving mechanism that slides the substrate stage 60 on the XY plane and positions the planned mounting position of the electronic component 2 on the substrate at the mounting position P3. The stage moving mechanism 61 may use, for example, a linear guide that moves a slider on a track using a ball screw mechanism driven by a servo motor.

另外，搭載裝置30具有未圖示的拍攝裝置、圖像處理裝置、位置識別裝置。通過所述拍攝裝置，拍攝由接合頭31保持的電子零件2與由基板載台60支撐的基板，並基於圖像處理裝置所處理的圖像，位置識別裝置識別兩者的位置關係。基於所述位置關係，搭載裝置30將電子零件2安裝於基板。作為拍攝裝置，可為***電子零件2與基板之間而能夠同時拍攝兩者的上下雙視野照相機，也可為分開拍攝兩者的照相機。In addition, the mounting device 30 includes an imaging device, an image processing device, and a position recognition device (not shown). The electronic component 2 held by the bonding head 31 and the substrate supported by the substrate stage 60 are photographed by the imaging device, and based on the image processed by the image processing device, the position recognition device recognizes the positional relationship between the two. Based on the positional relationship, the mounting device 30 mounts the electronic component 2 on the substrate. The imaging device may be an upper-lower dual-view camera inserted between the electronic component 2 and the substrate to capture both simultaneously, or a camera capable of capturing both electronic components separately.

[控制裝置] 控制裝置50控制供給裝置10、拾取裝置20、搭載裝置30、基板載台60的啟動、停止、速度、動作時機等。即，控制裝置50是移送裝置1及安裝裝置100的控制裝置。控制裝置50例如可通過專用的電子電路或以規定的程序運行的計算機等來實現。在控制裝置50連接有操作者輸入控制所需的指示或資訊的輸入裝置、用來確認裝置的狀態的輸出裝置。輸入裝置可使用開關、觸摸屏、鍵盤、鼠標等。輸出裝置可使用液晶、有機電致發光（electroluminescence，EL）等顯示部。 [Control device] The control device 50 controls the start, stop, speed, operation timing, etc. of the supply device 10 , the pickup device 20 , the loading device 30 , and the substrate stage 60 . That is, the control device 50 is a control device of the transfer device 1 and the mounting device 100 . The control device 50 can be implemented by, for example, a dedicated electronic circuit or a computer running a predetermined program. The control device 50 is connected to an input device for the operator to input instructions or information required for control, and an output device for confirming the status of the device. The input device may use a switch, a touch screen, a keyboard, a mouse, etc. The output device may use a display unit such as liquid crystal or organic electroluminescence (EL).

圖9是控制裝置50的功能框圖。如圖9所示，控制裝置50具有供給裝置控制部51、上推銷控制部52、拾取控制部53、接合頭控制部54、基板載台控制部56、儲存部57。FIG. 9 is a functional block diagram of the control device 50. As shown in FIG. 9 , the control device 50 includes a supply device control unit 51 , an upward push control unit 52 , a pickup control unit 53 , a bonding head control unit 54 , a substrate stage control unit 56 , and a storage unit 57 .

供給裝置控制部51控制供給載台12的移動。即，控制載置於片材11的成為拾取對象的電子零件2的移動。上推銷控制部52控制上推銷24的移動、即支承體241的動作。The supply device control unit 51 controls the movement of the supply stage 12 . That is, the movement of the electronic component 2 to be picked up placed on the sheet 11 is controlled. The upper pusher control unit 52 controls the movement of the upper pusher 24 , that is, the operation of the support body 241 .

拾取控制部53控制拾取筒夾200的移動。即拾取控制部53控制筒夾移動機構22及方向變更部23的動作。例如，拾取控制部53控制與供氣孔202a連通的氣體的供給回路、與排氣孔202b連通的負壓產生回路、旋轉部231的驅動源231a、角度變更部232的驅動源232a。由此，如下文所述，拾取控制部53控制電子零件2的保持、反轉、定位及釋放。The pickup control unit 53 controls the movement of the pickup collet 200 . That is, the pickup control unit 53 controls the operations of the collet moving mechanism 22 and the direction changing unit 23. For example, the pickup control unit 53 controls the gas supply circuit connected to the air supply hole 202a, the negative pressure generating circuit connected to the exhaust hole 202b, the drive source 231a of the rotation unit 231, and the drive source 232a of the angle changing unit 232. Thereby, as described below, the pick-up control unit 53 controls the holding, reversal, positioning and release of the electronic component 2 .

接合頭控制部54控制接合頭31的移動、即頭移動機構32的動作。而且，接合頭控制部54控制與接合頭31的噴嘴孔連通的負壓產生回路，從而控制電子零件2的保持及釋放。基板載台控制部56控制基板載台60的移動、即載台移動機構61的動作。The bonding head control unit 54 controls the movement of the bonding head 31 , that is, the operation of the head moving mechanism 32 . Furthermore, the bonding head control unit 54 controls the negative pressure generating circuit connected to the nozzle hole of the bonding head 31 to control holding and releasing of the electronic component 2 . The substrate stage control unit 56 controls the movement of the substrate stage 60 , that is, the operation of the stage moving mechanism 61 .

儲存部57是包括作為記錄介質的各種儲存器（硬盤驅動器（Hard Disk Drive，HDD）或固態驅動器（Solid State Drive，SSD）等）、記錄介質與外部的接口的儲存裝置。儲存部57中預先儲存移送裝置1的動作所需的數據、程序，且儲存移送裝置1的動作所需的數據。所述所需的數據例如為氣體的供給量、排氣壓力、供給位置P1、交接位置P2、安裝位置P3的位置坐標、各移動機構的位置坐標。所述各移動機構基於這些坐標進行各結構的移動控制。The storage unit 57 is a storage device including various memories as recording media (hard disk drive (HDD), solid state drive (SSD), etc.) and an interface between the recording medium and the outside. The storage unit 57 stores data and programs required for the operation of the transfer device 1 in advance, and stores data required for the operation of the transfer device 1 . The required data are, for example, the gas supply amount, the exhaust pressure, the position coordinates of the supply position P1, the transfer position P2, the installation position P3, and the position coordinates of each moving mechanism. Each of the moving mechanisms controls the movement of each structure based on these coordinates.

[利用拾取筒夾進行的抽吸保持的原理] 接著，對利用如上所述的拾取筒夾200可抽吸保持電子零件2的原理進行說明。如圖3的（A）所示，從供氣孔202a供給的氣體通過從相向面201a的細孔呈面狀噴出，而在與電子零件2之間形成氣體的層。所述層例如成為2 μm～10 μm。然後，在通過負壓產生回路使負壓作用於抽吸孔201c的狀態下，使相向面201a接近電子零件2，由此抽吸保持電子零件2。此時，由於在相向面201a與電子零件2之間形成有氣體的層，故而相向面201a與電子零件2維持不接觸的狀態。而且，通過解除由負壓產生回路產生的負壓，負壓不再作用於抽吸孔201c，因此從拾取筒夾200釋放電子零件2。 [Principle of suction holding using pick-up collet] Next, the principle of sucking and holding the electronic components 2 using the pickup collet 200 as described above will be described. As shown in FIG. 3(A) , the gas supplied from the gas supply hole 202 a is ejected in a planar shape through the pores on the opposing surface 201 a , and forms a gas layer between the gas and the electronic component 2 . The layer is, for example, 2 μm to 10 μm. Then, with the negative pressure acting on the suction hole 201c through the negative pressure generating circuit, the opposing surface 201a is brought close to the electronic component 2, thereby sucking and holding the electronic component 2. At this time, since a gas layer is formed between the facing surface 201a and the electronic component 2, the facing surface 201a and the electronic component 2 are maintained in a non-contact state. Furthermore, by releasing the negative pressure generated by the negative pressure generating circuit, the negative pressure no longer acts on the suction hole 201 c, so the electronic component 2 is released from the pickup collet 200 .

[拾取筒夾的將電子零件定位的原理] 進而，參照圖7對如上所述的拾取筒夾200中可定位電子零件2的原理進行說明。另外，圖7的（A）～圖7的（E）的左側的圖的中央的虛線表示旋轉的臂222a（以虛線圖示），外側的虛線的圓與右側的圖的虛線表示拾取筒夾200的一部分旋轉軌跡RT。如圖7的（A）所示，在利用拾取筒夾200抽吸保持電子零件2的時點，一對相向的導引部203K、導引部203M平行於旋轉軌跡RT。如圖7的（B）所示，在拾取電子零件2後，通過角度變更部232使拾取筒夾200的角度變更45°。在所述時點，一對相向的導引部203K、導引部203M相對於旋轉軌跡RT傾斜45°。 [Principle of positioning electronic parts by picking up collet] Furthermore, the principle of positioning the electronic components 2 in the pickup collet 200 as described above will be described with reference to FIG. 7 . In addition, the dotted line in the center of the left figure of FIGS. 7(A) to 7(E) represents the rotating arm 222a (shown as a dotted line), and the dotted circle on the outside and the dotted line of the right figure indicate the pickup collet. Part of the rotation trajectory RT of 200. As shown in (A) of FIG. 7 , when the electronic component 2 is sucked and held by the pickup collet 200 , a pair of opposing guide portions 203K and 203M are parallel to the rotation trajectory RT. As shown in FIG. 7(B) , after the electronic component 2 is picked up, the angle of the pickup collet 200 is changed by 45° by the angle changing unit 232 . At this point in time, the pair of opposing guide portions 203K and 203M are inclined at 45° with respect to the rotation trajectory RT.

然後，如圖7的（C）所示，開始利用旋轉部231使拾取筒夾200旋轉後，由相向面201a抽吸保持的電子零件2因慣性力與重力而朝向其中一正交的導引部203K、導引部203L所沿著的相向面201a的角落移動。如上所述，電子零件2以隔著氣體的層而不與相向面201a接觸的狀態由拾取筒夾200保持，容易沿著與相向面201a平行的方向移動。由此，以電子零件2的其中一正交的兩個側面與導引部203K、導引部203L相接的方式定位。即，電子零件2被定位於靠近拾取筒夾200的一個角落的位置。Then, as shown in FIG. 7(C) , after the rotation of the pick-up collet 200 starts using the rotating part 231 , the electronic component 2 sucked and held by the opposing surface 201 a is directed toward one of the orthogonal guides due to the inertial force and gravity. The corner of the opposing surface 201a along which the portion 203K and the guide portion 203L moves. As described above, the electronic component 2 is held by the pickup collet 200 in a state that is not in contact with the opposing surface 201a across the gas layer, and can easily move in a direction parallel to the opposing surface 201a. Thereby, the electronic component 2 is positioned so that two orthogonal side surfaces thereof are in contact with the guide portions 203K and 203L. That is, the electronic component 2 is positioned close to one corner of the pickup collet 200 .

進而，如圖7的（D）所示，在相向面201a靠向反轉位置的近側，旋轉部231減速後，到達反轉位置，旋轉部231停止。此時，電子零件2要繼續移動的慣性發揮作用，但如以下所說明那樣，可防止從導引部203K、導引部203L脫離。Furthermore, as shown in FIG. 7(D) , when the opposing surface 201 a approaches the near side of the reverse position, the rotating part 231 decelerates and then reaches the reverse position, whereupon the rotating part 231 stops. At this time, the inertia of the electronic component 2 to continue moving acts, but as will be described below, separation from the guide portions 203K and 203L can be prevented.

首先，由於拾取筒夾200繞水平方向的X軸旋轉，故而在旋轉過程中，離心力、重力、慣性力合力作用於電子零件2。因此，在旋轉停止時，離心力與慣性力使得要從其中一正交的導引部203K、導引部203L脫離移動的力作用於電子零件2。而且，以如下方式發揮作用：在反轉的狀態下，此時的慣性力與重力一起將電子零件2沿著豎直方向壓抵於拾取筒夾200（參照圖7的（D））。電子零件2相對於拾取筒夾200而經由氣體層所保持，但若力沿著這種豎直方向發揮作用，則變得不易向水平方向移動。即，避免從其中一正交的導引部203K、導引部203L脫離移動的力作用於電子零件2。First, since the pick-up collet 200 rotates around the horizontal X-axis, the centrifugal force, gravity, and inertial force act on the electronic component 2 during the rotation process. Therefore, when the rotation is stopped, the centrifugal force and the inertial force act on the electronic component 2 to move away from one of the orthogonal guide portions 203K and 203L. Furthermore, in the reversed state, the inertial force at this time and the gravity force press the electronic component 2 against the pickup collet 200 in the vertical direction (see (D) of FIG. 7 ). The electronic component 2 is held by the gas layer with respect to the pickup collet 200 . However, if a force acts in such a vertical direction, it becomes difficult to move in the horizontal direction. That is, a force that prevents the electronic component 2 from moving away from one of the orthogonal guide portions 203K and 203L acts on the electronic component 2 .

此處，拾取筒夾200的反轉的旋轉並非突然停止，而是如上所述那樣逐漸減速而停止。因此，離心力朝著停止逐漸減小，在拾取筒夾200停止的時點不再發揮作用。在拾取筒夾200停止時，減速的減速度所產生的慣性發揮作用。因此，減速度設為電子零件2不會從導引部203K、導引部203L脫離移動的程度。這樣，可防止電子零件2從導引部203K、導引部203L脫離移動。電子零件2在反轉的位置處被定位於導引部203K、導引部203L所沿著的相向面201a的角落的適當位置。Here, the reverse rotation of the pickup collet 200 does not stop suddenly, but gradually decelerates and stops as described above. Therefore, the centrifugal force gradually decreases toward the stop and no longer acts at the point when the pickup collet 200 stops. When the pick-up collet 200 is stopped, the inertia generated by the deceleration acts. Therefore, the deceleration is set to such an extent that the electronic component 2 does not move away from the guide portion 203K or the guide portion 203L. This prevents the electronic component 2 from moving away from the guide portion 203K and the guide portion 203L. The electronic component 2 is positioned at an appropriate position at the corner of the opposing surface 201 a along which the guide portions 203K and 203L are in the reversed position.

在反轉結束時，由於被定位於相向面201a的其中一角落，故而能夠修正拾取時及反轉動作引起的電子零件2的位置偏移。即使電子零件2在相向面201a上移動，如上所述，相向面201a與電子零件2也會維持不接觸的狀態，因此不存在電子零件2的相向面201a側的面受到損傷的情況。並且，在反轉動作的初期，由於尚加速的速度慢，故而靠近導引部203K、導引部203L時的衝擊小。因此，幾乎不存在缺損或損傷的危險性。也不存在與相向的導引部203M、導引部203N碰撞的危險性。When the reversal is completed, since it is positioned at one of the corners of the opposing surface 201a, the positional deviation of the electronic component 2 caused during picking up and reversal operation can be corrected. Even if the electronic component 2 moves on the facing surface 201a, as mentioned above, the facing surface 201a and the electronic component 2 will maintain a non-contact state, so the surface of the electronic component 2 on the facing surface 201a side will not be damaged. Moreover, in the early stage of the reversing operation, since the speed of acceleration is slow, the impact when approaching the guide portion 203K and the guide portion 203L is small. Therefore, there is almost no risk of chipping or damage. There is also no risk of collision with the opposing guide portions 203M and 203N.

而且，在所述形態中，反轉停止時的減速度設為電子零件2不會從導引部203K、導引部203L脫離移動的程度，但也可以設為電子零件2從導引部203K、導引部203L脫離移動的程度。即，如圖8的（D）所示，可設為如下減速度：在停止於反轉位置時，由相向面201a抽吸保持的電子零件2因慣性力與重力而向另一正交的導引部203M、導引部203N所沿著的相向面201a的角落移動（圖8的（A）～圖8的（C）與所述圖7的（A）～圖7的（C）相同）。由此，以電子零件2的其中一正交的兩個側面與導引部203M、導引部203N相接的方式被定位。然後，如圖8的（E）所示，在通過180°的旋轉使電子零件2反轉後，角度變更部232使拾取筒夾200轉動45°以恢復為原來的角度。Furthermore, in the above-mentioned form, the deceleration at the time of stopping the reverse rotation is set to such an extent that the electronic component 2 does not move away from the guide portion 203K or the guide portion 203L. However, the deceleration may be set so that the electronic component 2 does not move away from the guide portion 203K. , the extent to which the guide part 203L moves away from the guide part 203L. That is, as shown in (D) of FIG. 8 , the deceleration can be set such that when stopped at the reverse position, the electronic component 2 sucked and held by the opposing surface 201 a is sucked and held toward another orthogonal surface due to the inertial force and gravity. The corner movement of the opposing surface 201a along which the guide portions 203M and 203N move (Fig. 8(A) to Fig. 8(C)) is the same as the above-mentioned Fig. 7(A) to Fig. 7(C) ). Thereby, the electronic component 2 is positioned so that one of the two orthogonal side surfaces is in contact with the guide portion 203M and the guide portion 203N. Then, as shown in (E) of FIG. 8 , after the electronic component 2 is reversed by 180° rotation, the angle changing unit 232 rotates the pickup collet 200 by 45° to restore the original angle.

在將電子零件2定位於導引部203M、導引部203N的情況下，在停止反轉的旋轉時，增大旋轉部231的旋轉的減速度。若以所述方式停止於反轉位置，則慣性使得電子零件2可移動至導引部203M、導引部203N所沿著的相向面201a的角落。由於減速所花費的時間縮短，故而反轉所需的時間縮短，可抑制改變拾取筒夾200的角度對節拍時間的影響而提高生產性。但，存在因電子零件2與導引部203M、導引部203N接觸而受到影響的可能性。因此，旋轉部231的減速度設為容許電子零件2的移動並且可容許接觸對電子零件2的影響的程度。When the electronic component 2 is positioned on the guide parts 203M and 203N, when the reverse rotation is stopped, the deceleration of the rotation of the rotation part 231 is increased. If it stops at the reverse position in the above manner, the inertia allows the electronic component 2 to move to the corner of the opposing surface 201a along which the guide portions 203M and 203N follow. Since the time required for deceleration is shortened, the time required for reverse rotation is shortened, and the impact of changing the angle of the pickup collet 200 on the takt time can be suppressed, thereby improving productivity. However, there is a possibility that the electronic component 2 may be affected by contact with the guide portion 203M and the guide portion 203N. Therefore, the deceleration of the rotating part 231 is set to a level that allows the movement of the electronic component 2 and allows the influence of contact on the electronic component 2 to be tolerated.

另外，電子零件2無需一定與導引部203完全接觸而定位。在接近導引部203的狀態下進入電子零件2的識別範圍中即可，只要在識別範圍中，則無需一定被定位於固定位置。In addition, the electronic component 2 does not necessarily need to be in complete contact with the guide portion 203 to be positioned. It suffices to enter the recognition range of the electronic component 2 while approaching the guide part 203. As long as it is within the recognition range, it does not need to be positioned at a fixed position.

[動作] 關於在如以上的移送裝置1中通過拾取裝置20從供給裝置10拾取電子零件2並將所述電子零件2交接至搭載裝置30的動作，除了參照圖1～圖8以外，還參照圖10的流程圖、圖11的說明圖在下文進行說明。 [action] Regarding the operation of picking up the electronic components 2 from the supply device 10 by the pickup device 20 in the above transfer device 1 and transferring the electronic components 2 to the mounting device 30, refer to FIG. 10 in addition to FIGS. 1 to 8 The flow chart and the explanatory diagram of FIG. 11 will be described below.

首先，通過拾取裝置20及供給裝置10，使拾取筒夾200移動至上推銷24所在的供給位置P1，使拾取筒夾200的相向面201a與上推銷24相向（步驟S01）。此時，經由供氣孔202a向多孔質構件201供給經加壓的氣體，從相向面201a吹出氣體。而且，此時，不從排氣孔202b排氣，不從開口201d進行抽吸。First, the pickup collet 200 is moved to the supply position P1 where the upper push pin 24 is located by the pickup device 20 and the supply device 10, so that the opposing surface 201a of the pickup collet 200 faces the upper push pin 24 (step S01). At this time, pressurized gas is supplied to the porous member 201 via the gas supply hole 202a, and the gas is blown out from the opposing surface 201a. Moreover, at this time, exhaust is not performed from the exhaust hole 202b, and suction is not performed from the opening 201d.

另一方面，供給裝置10使供給載台12移動，如圖11的（A）所示，使作為拾取對象的電子零件2位於供給位置P1（步驟S02）。然後，相向面201a的表面被供給了氣體的拾取筒夾200與拾取頭21一起下降，而接近電子零件2。此時，如圖11的（B）所示，為了避免導引部203與周圍的電子零件2相撞，而根據導引部203從相向面201a的突出量，在拾取筒夾200開始下降的同時，上推銷24上升而將作為拾取對象的電子零件2上推，由此使作為拾取對象的電子零件2上升至導引部203不會與周圍的電子零件2相撞的高度。On the other hand, the supply device 10 moves the supply stage 12 so that the electronic component 2 to be picked up is located at the supply position P1 as shown in (A) of FIG. 11 (step S02 ). Then, the pickup collet 200 to which the gas is supplied to the surface of the opposing surface 201 a descends together with the pickup head 21 and approaches the electronic component 2 . At this time, as shown in FIG. 11(B) , in order to prevent the guide part 203 from colliding with the surrounding electronic components 2 , the pickup collet 200 starts to descend based on the protrusion amount of the guide part 203 from the opposing surface 201 a. At the same time, the push-up pusher 24 rises to push up the electronic component 2 to be picked up, thereby raising the electronic component 2 to be picked up to a height where the guide portion 203 does not collide with the surrounding electronic components 2 .

當下降的拾取筒夾200接近電子零件2時，供給至相向面201a的表面的氣體被相向面201a與電子零件2所夾持，而形成氣體層。認為此時被夾持的氣體層成為粘性流層。因此，氣體層自身的氣體G的流動性非常差，幾乎不發生由來自後述的排氣孔202b的排氣引起的抽吸、從氣體層外緣部的流出。然後，拾取筒夾200通過未進一步壓縮的氣體層停止相對於電子零件2的下降（步驟S03）。此時，如上所述，作為拾取對象的電子零件2相較於周圍的電子零件2有所上升，因此導引部203不會與片材11上的拾取對象周圍的電子零件2接觸。When the descending pickup collet 200 approaches the electronic component 2 , the gas supplied to the surface of the opposing surface 201 a is sandwiched between the opposing surface 201 a and the electronic component 2 to form a gas layer. The trapped gas layer at this time is considered to be a viscous flow layer. Therefore, the fluidity of the gas G in the gas layer itself is very poor, and the suction caused by the exhaust gas from the exhaust hole 202b described later and the outflow from the outer edge of the gas layer hardly occur. Then, the pickup collet 200 stops descending relative to the electronic component 2 through the gas layer that is not further compressed (step S03 ). At this time, as described above, the electronic components 2 to be picked up are raised compared to the surrounding electronic components 2 , so the guide portion 203 does not come into contact with the electronic components 2 around the pickup target on the sheet 11 .

即使拾取筒夾200相對於電子零件2的下降停止，由於拾取筒夾200由拾取頭21所彈性支撐，故而拾取頭21仍繼續下降，拾取頭21相對於拾取筒夾200滑動移動。若利用感測器檢測所述滑動，則拾取控制部53識別出拾取筒夾200到達電子零件2，而停止拾取頭21的下降。Even if the pickup collet 200 stops falling relative to the electronic component 2, the pickup head 21 continues to descend because the pickup collet 200 is elastically supported by the pickup head 21, and the pickup head 21 slides relative to the pickup collet 200. When the sensor detects the sliding, the pickup control unit 53 recognizes that the pickup collet 200 has reached the electronic component 2 and stops the descent of the pickup head 21 .

如上所述，在拾取頭21停止時，拾取筒夾200如上所述在相向面201a與電子零件2之間形成氣體層，經由所述氣體層，相向面201a停止，不再進一步靠近電子零件2。因此，拾取筒夾200未與電子零件2直接接觸。此時的拾取筒夾200的高度位置成為接近位置H1（參照圖9）。As described above, when the pickup head 21 stops, the pickup collet 200 forms a gas layer between the opposing surface 201a and the electronic component 2 as described above. Through the gas layer, the opposing surface 201a stops and does not come closer to the electronic component 2. . Therefore, the pickup collet 200 is not in direct contact with the electronic component 2 . The height position of the pickup collet 200 at this time becomes the approach position H1 (see FIG. 9 ).

這樣，拾取筒夾200經由氣體層停止，進而在拾取頭21停止的狀態下，通過從排氣孔202b排氣，而開始利用抽吸孔201c進行抽吸（步驟S04）。即，如圖11的（C）所示，在拾取筒夾200經由氣體層將電子零件2壓抵於由支承體241支撐的片材11的狀態、即在與支承體241之間夾持片材11及電子零件2的狀態下，開始抽吸。In this way, the pick-up collet 200 stops via the gas layer, and further exhausts air from the exhaust hole 202b while the pickup head 21 is stopped, thereby starting suction using the suction hole 201c (step S04). That is, as shown in FIG. 11(C) , the pick-up collet 200 presses the electronic component 2 against the sheet 11 supported by the support 241 via the gas layer, that is, the pick-up collet 200 holds the sheet between the support 241 and the support 241 . With the material 11 and electronic component 2 in the state, start pumping.

在所述狀態下，拾取筒夾200上升，並且與此同步地，上推銷24進一步上升，上升預先設定的規定量後停止（步驟S05）。然後，如圖11的（D）所示，通過進一步上升的拾取筒夾200，在維持由氣體的層形成的間隙的狀態下通過負壓被抽吸至拾取筒夾200的電子零件2被從片材11剝離，由此被拾取（步驟S06）。電子零件2被這樣完全剝離的高度位置為剝離位置H2。In this state, the pickup collet 200 rises, and in synchronization with this, the push pin 24 further rises, rises by a preset predetermined amount, and then stops (step S05 ). Then, as shown in (D) of FIG. 11 , the electronic components 2 sucked to the pickup collet 200 by the negative pressure are removed from the pickup collet 200 while maintaining the gap formed by the gas layer. The sheet 11 is peeled off and picked up (step S06 ). The height position at which the electronic component 2 is completely peeled off is the peeling position H2.

如圖7的（B）所示，方向變更部23的角度變更部232變更拾取筒夾200的角度（步驟S07）。然後，方向變更部23的旋轉部231使拾取筒夾200反轉（步驟S08）。即，使拾取筒夾200的朝向在上下方向上旋轉180°，使拾取筒夾200的相向面201a朝向上方。另外，此處，步驟S07的反轉動作在剛拾取電子零件2後進行，但也可以在供給位置P1至交接位置P2之間的任意地點進行。As shown in (B) of FIG. 7 , the angle changing unit 232 of the direction changing unit 23 changes the angle of the pickup collet 200 (step S07 ). Then, the rotation unit 231 of the direction changing unit 23 reverses the pickup collet 200 (step S08 ). That is, the direction of the pickup collet 200 is rotated 180° in the up-down direction, and the opposing surface 201a of the pickup collet 200 is directed upward. In addition, here, although the reversal operation of step S07 is performed immediately after picking up the electronic component 2, it may be performed at any place between the supply position P1 and the delivery position P2.

另外，在反轉後，在移動至交接位置P2的情況下，對電子零件2施加的反轉或水平的移動所伴隨的力被分散，因此可降低從拾取筒夾200脫落的危險性。在一邊反轉一邊移動的情況下，反轉與水平移動的力配合作用，因此脫落的可能性提高，但可縮短節拍時間，生產性提高。脫落的可能性根據電子零件2的尺寸（大小、厚度等）而變化，因此優選根據電子零件2適當選擇動作。In addition, when moving to the transfer position P2 after reversal, the force accompanying the reversal or horizontal movement applied to the electronic component 2 is dispersed, so the risk of falling off from the pickup collet 200 can be reduced. In the case of reversing and moving at the same time, the force of reversal and horizontal movement cooperates, so the possibility of falling off increases, but the cycle time can be shortened and productivity can be improved. The possibility of falling off changes depending on the size (size, thickness, etc.) of the electronic component 2 , so it is preferable to appropriately select the action according to the electronic component 2 .

在所述反轉過程中，如圖7的（C）所示，電子零件2移動至導引部203K、導引部203L所沿著的相向面201a的角落。然後，拾取筒夾200在反轉位置的近側減速後，在反轉位置處停止旋轉。如圖7的（D）所示，電子零件2維持被定位於導引部203K、導引部203L所沿著的相向面201a的角落的狀態。進而，如圖7的（E）所示，方向變更部23使拾取筒夾200恢復為原來的角度（參照圖7的（A））（步驟S09）。During the reversal process, as shown in (C) of FIG. 7 , the electronic component 2 moves to the corner of the opposing surface 201 a along which the guide portions 203K and 203L follow. Then, the pickup collet 200 decelerates near the reverse position, and then stops rotating at the reverse position. As shown in (D) of FIG. 7 , the electronic component 2 remains positioned at the corner of the opposing surface 201 a along which the guide portions 203K and 203L lie. Furthermore, as shown in (E) of FIG. 7 , the direction changing unit 23 returns the pickup collet 200 to its original angle (see (A) of FIG. 7 ) (step S09 ).

接著，拾取裝置20利用筒夾移動機構22使拾取的電子零件2移動至交接位置P2（步驟S10）。在交接位置P2，搭載裝置30的接合頭31待機，隔著電子零件2而與拾取筒夾200的相向面201a相向。Next, the pickup device 20 moves the picked-up electronic component 2 to the transfer position P2 using the collet moving mechanism 22 (step S10 ). At the delivery position P2, the bonding head 31 of the mounting device 30 is on standby and faces the facing surface 201a of the pickup collet 200 with the electronic component 2 interposed therebetween.

使接合頭31朝向位於交接位置P2的拾取筒夾200下降，由接合頭31保持電子零件2後，拾取筒夾200解除負壓，由此將電子零件2從拾取筒夾200向接合頭31交接（步驟S11）。另外，然後，接合頭31以離開拾取筒夾200的方式上升，向安裝位置P3移動，將電子零件2安裝於基板。The bonding head 31 is lowered toward the pickup collet 200 located at the transfer position P2, and after the electronic component 2 is held by the bonding head 31, the pickup collet 200 releases the negative pressure, thereby transferring the electronic component 2 from the pickup collet 200 to the bonding head 31. (Step S11). Then, the bonding head 31 rises away from the pickup collet 200, moves to the mounting position P3, and mounts the electronic component 2 on the substrate.

[效果] （1）本實施方式是一種拾取裝置20，具有矩形外緣，且抽吸保持並拾取電子零件2，所述拾取裝置20具有抽吸保持電子零件2的拾取筒夾200、及改變拾取筒夾200的朝向的方向變更部23。 [Effect] (1) This embodiment is a pickup device 20 that has a rectangular outer edge and sucks, holds and picks up electronic components 2. The pickup device 20 has a pickup collet 200 that sucks and holds electronic components 2, and a changing pickup collet. The direction changing part 23 of the direction of 200.

拾取筒夾200中，具有多孔質構件201，所述多孔質構件201具有通氣性，經由與電子零件2相向的相向面201a的細孔將被供給至內部的氣體呈面狀噴出，在多孔質構件201設置有抽吸孔201c，所述抽吸孔201c在相向面201a具有開口201d，通過負壓抽吸電子零件2，設置有導引部203，所述導引部203以沿著電子零件2的外緣的方式配置，對由相向面201a保持的電子零件2的移動進行限制。The pickup collet 200 is provided with a porous member 201 having air permeability, and the gas supplied to the inside is ejected in a planar shape through the pores of the opposing surface 201 a facing the electronic component 2. The member 201 is provided with a suction hole 201c, which has an opening 201d on the opposing surface 201a, to suck the electronic components 2 through negative pressure, and is provided with a guide portion 203 to follow the electronic components. 2 to restrict the movement of the electronic component 2 held by the opposing surface 201a.

方向變更部23具有：旋轉部231，以相向面201a從電子零件2的供給位置P1反轉的方式使拾取筒夾200旋轉；及角度變更部232，沿著與相向面201a平行的面變更拾取筒夾200的角度。The direction changing unit 23 includes a rotation unit 231 that rotates the pickup collet 200 so that the opposing surface 201 a is reversed from the supply position P1 of the electronic component 2 , and an angle changing unit 232 that changes the pickup along a surface parallel to the opposing surface 201 a. Collet 200° angle.

而且，本實施方式的拾取筒夾200將拾取並反轉的電子零件2交接至安裝於基板的搭載裝置30。Furthermore, the pickup collet 200 of this embodiment delivers the electronic component 2 picked up and reversed to the mounting device 30 mounted on the substrate.

進而，本實施方式的安裝裝置100具有：拾取裝置20；接合頭31，以相對於拾取筒夾200能夠相對移動的方式設置，從拾取筒夾200的前端接收電子零件2；及搭載裝置30，將由接合頭31保持的電子零件2移送至基板並予以安裝。Furthermore, the mounting device 100 of this embodiment includes: a pick-up device 20; a bonding head 31 which is disposed movably relative to the pick-up collet 200 and receives the electronic component 2 from the front end of the pick-up collet 200; and a mounting device 30, The electronic component 2 held by the bonding head 31 is transferred to the substrate and mounted thereon.

因此，在通過來自抽吸孔201c的抽吸拾取電子零件2時，可通過自多孔質構件201的細孔排出的氣體的層使電子零件2與相向面201a不接觸，而可抑制對電子零件2造成損壞。而且，在電子零件2的移送時，也可以降低與相向面201a接觸而對電子零件2造成損壞的可能性，並且保持電子零件2而防止掉落等。Therefore, when the electronic component 2 is picked up by suction from the suction hole 201c, the layer of gas discharged from the pores of the porous member 201 can prevent the electronic component 2 from contacting the opposing surface 201a, thereby suppressing damage to the electronic component. 2 cause damage. Furthermore, when the electronic component 2 is transferred, the possibility of damage to the electronic component 2 due to contact with the opposing surface 201a can be reduced, and the electronic component 2 can be held to prevent falling.

並且，即使在反轉時等電子零件2的移動所伴隨的慣性力導致電子零件2隔著氣體層在以非接觸的方式保持的相向面201a上水平移動，也能夠通過導引部203來防止脫離拾取筒夾200。Furthermore, even if the inertial force accompanying the movement of the electronic component 2 during reversal causes the electronic component 2 to move horizontally through the gas layer on the opposing surface 201 a held in a non-contact manner, this can be prevented by the guide portion 203 Disengage the pickup collet 200.

進而，在反轉時，通過利用角度變更部232改變拾取筒夾200的角度，可定位於由正交的導引部203K、導引部203L、或正交的導引部203M、導引部203N所沿著的平面形成的角落。即，可由兩條正交的邊決定XY平面上的位置。因此，在拾取電子零件2時，即使由相向面201a保持的電子零件2的平面方向的位置、角度等產生不均，在適當位置（包括下文所述的容許範圍）處，也可以交接至接合頭31，而能夠減少安裝時的偏移等。而且，在定位時，電子零件2沿著與相向面201a平行的方向移動，但如上所述，由於電子零件2不與相向面201a接觸，故而可防止摩擦電子零件2產生的損傷。另外，在由導引部203包圍的區域內，即使電子零件2的位置發生偏移，只要開口201d的抽吸在電子零件2的投影面內，則不論開口201d的位置如何，都能夠抽吸保持。假設在不改變拾取筒夾200的角度的情況下，也存在反轉使得電子零件2靠近拾取筒夾200的一條邊的情況。但是，由於僅決定XY平面上的一個方向的位置的可能性高，故而在經交接的電子零件2的位置識別中，存在花費時間、或修正量大而誤差增加的可能性。Furthermore, at the time of reversal, by changing the angle of the pickup collet 200 using the angle changing part 232, the positioning can be made by the orthogonal guide part 203K, the guide part 203L, or the orthogonal guide part 203M, the guide part The corner formed by the plane along which 203N lies. That is, the position on the XY plane can be determined by two orthogonal sides. Therefore, when the electronic component 2 is picked up, even if the position, angle, etc. in the planar direction of the electronic component 2 held by the facing surface 201a is uneven, it can be handed over to the joint at an appropriate position (including the allowable range described below). The head 31 can reduce the offset during installation. Furthermore, during positioning, the electronic component 2 moves in a direction parallel to the opposing surface 201a. However, as mentioned above, since the electronic component 2 does not come into contact with the opposing surface 201a, damage caused by friction on the electronic component 2 can be prevented. In addition, in the area surrounded by the guide part 203, even if the position of the electronic component 2 is shifted, as long as the suction of the opening 201d is within the projection plane of the electronic component 2, the suction can be performed regardless of the position of the opening 201d. Keep. Assume that without changing the angle of the pickup collet 200 , there is also a case where the electronic component 2 is reversed and brought closer to one side of the pickup collet 200 . However, since there is a high possibility that the position in only one direction on the XY plane is determined, position recognition of the handed over electronic component 2 may take time or may require a large amount of correction, resulting in an increase in errors.

另外，在將電子零件2暫時靠近導引部203K、導引部203L所沿著的相向面201a的角落後定位於導引部203M、導引部203N的情況下，定位成為從確定了一次電子零件2的姿勢的狀態起定位的兩個階段，因此能夠更確實地進行電子零件2的定位。尤其是在停止時電子零件2在對角線上移動即可，因此定位的精度提高。In addition, when the electronic component 2 is temporarily brought close to the corner of the opposing surface 201a along which the guide portions 203K and 203L are positioned and then positioned on the guide portions 203M and 203N, the positioning becomes such that the primary electrons are determined. The posture state of the component 2 constitutes two stages of positioning, so the electronic component 2 can be positioned more reliably. Especially when stopped, the electronic component 2 only needs to move diagonally, so the positioning accuracy is improved.

此處，對在如本實施方式那樣以非接觸的方式保持電子零件2的拾取筒夾200的情況下如上所述的導引部203及定位有效的理由進一步詳細說明。即，由於電子零件2隔著氣體層以非接觸的方式由拾取筒夾200保持，故而能夠容易地在水平方向上移動。因此，存在因拾取筒夾200向交接位置P2的移動或反轉動作產生的作用於電子零件2的慣性力，導致電子零件2在拾取筒夾200的相向面201a上移動的情況。即使發生這種移動，也可通過導引部203將電子零件2的移動限制於規定的區域，因此可防止電子零件2從拾取筒夾200脫落。Here, the reason why the guide portion 203 and positioning as described above are effective when the pickup collet 200 holding the electronic component 2 in a non-contact manner as in this embodiment will be described in further detail. That is, since the electronic component 2 is held by the pickup collet 200 in a non-contact manner via the gas layer, it can be easily moved in the horizontal direction. Therefore, the electronic component 2 may move on the opposing surface 201 a of the pickup collet 200 due to the inertial force acting on the electronic component 2 due to the movement or reversal operation of the pickup collet 200 to the transfer position P2. Even if such movement occurs, the movement of the electronic component 2 can be restricted to a predetermined area by the guide portion 203, so that the electronic component 2 can be prevented from falling off the pickup collet 200.

此外，為了避免從片材11拾取時與電子零件2接觸，導引部203的相向的間隔需要設定為大於電子零件2的大小。因此，在由拾取筒夾200抽吸保持的電子零件2與導引部203之間設置間隙。因此，在發生如上所述的電子零件2的移動的情況下，存在電子零件2的位置或角度的保持姿勢在所述間隙量的範圍內移動的情況。這種保持姿勢的狀態的不均大。若存在這種保持姿勢的不均，則交接至接合頭31的電子零件2的保持姿勢也相對於成為定位基準的基準位置（適當位置）發生不均，在利用未圖示的拍攝裝置等拍攝所述電子零件2的保持位置並識別位置時，因花費時間或位置的修正量大，導致修正時的移動誤差變大。在本實施方式中，如上所述，能夠相對於相向面201a而始終定位於適當位置，因此可抑制保持姿勢的不均，減小位置的修正量或修正時的移動誤差。In addition, in order to avoid contact with the electronic components 2 when picking up the sheet 11 , the opposing distance between the guide portions 203 needs to be set larger than the size of the electronic components 2 . Therefore, a gap is provided between the electronic component 2 sucked and held by the pickup collet 200 and the guide portion 203 . Therefore, when the electronic component 2 moves as described above, the position or angle of the electronic component 2 may be held in a position within the range of the gap amount. This state of maintaining posture is highly uneven. If there is such unevenness in the holding posture, the holding posture of the electronic component 2 delivered to the bonding head 31 will also be uneven with respect to the reference position (appropriate position) that serves as the positioning reference. When photographing using an imaging device not shown, etc. When the position of the electronic component 2 is held and the position is recognized, it takes time or the amount of position correction is large, resulting in a large movement error during correction. In this embodiment, as described above, it is possible to always position the device at an appropriate position with respect to the opposing surface 201a. Therefore, unevenness in the holding posture can be suppressed, and the amount of correction of the position or the movement error during correction can be reduced.

另外，所謂適當位置，是以電子零件2被拾取筒夾200保持的狀態大致直接交接至接合頭31的保持姿勢，也相當於用來將電子零件2安裝於基板的基準位置。適當位置在利用照相機拍攝並進行位置識別時，即使電子零件2相對於基準位置的保持姿勢發生不均，只要為所容許的識別時間、修正移動中的移動誤差，則包括所容許的範圍內的保持姿勢的不均。In addition, the appropriate position is a holding posture in which the electronic component 2 is almost directly transferred to the bonding head 31 while being held by the pickup collet 200 , and is also equivalent to the reference position for mounting the electronic component 2 on the substrate. When the appropriate position is photographed with a camera and the position is recognized, even if the holding posture of the electronic component 2 relative to the reference position is uneven, it is included in the allowable range as long as the allowable recognition time is used and the movement error during movement is corrected. Keep your posture uneven.

而且，考慮到如下情況：在電子零件2和與電子零件2相向的面之間流通從所述空間排出的氣體，由此通過利用由大量氣流產生的負壓產生抽吸力的伯努利吸盤來保持電子零件2。在所述情況下，抽吸力非常弱，即使可在與筒夾相距一定距離的狀態下保持電子零件2，也無法獲得將粘著於片材11的電子零件2剝離的吸附力。而且，為了獲得伯努利效應，需要使每單位時間的氣體的流量非常多，因此用於一邊維持非接觸一邊保持的抽吸力的調整非常困難。進而，有大量的氣體被吹出至拾取部位的周圍導致產生顆粒的擔心。Furthermore, it is considered that the gas discharged from the space flows between the electronic component 2 and the surface facing the electronic component 2, thereby generating a suction force using a Bernoulli suction cup using negative pressure generated by a large amount of air flow. To keep electronic parts 2. In this case, the suction force is very weak, and even if the electronic component 2 can be held at a certain distance from the collet, the suction force cannot be obtained to peel off the electronic component 2 adhered to the sheet 11 . Furthermore, in order to obtain the Bernoulli effect, the gas flow rate per unit time needs to be very high, so it is very difficult to adjust the suction force while maintaining non-contact. Furthermore, there is a concern that a large amount of gas is blown out around the pickup site, causing particles to be generated.

而且，在筒夾的與電子零件2相向的面上設置尺寸與抽吸孔相等的氣體的噴出孔而非如多孔質構件201那樣的細孔，向電子零件2噴射氣體使電子零件2懸浮，在要對抗由所述噴射產生的電子零件2的懸浮力而通過抽吸孔抽吸電子零件2的情況下，也與所述同樣，用於一般維持非接觸（懸浮）一邊保持的抽吸力的調整非常困難，有大量的氣體被吹出至拾取部位的周圍導致產生顆粒的擔心。Furthermore, a gas ejection hole with the same size as the suction hole is provided on the surface of the collet facing the electronic component 2 instead of a fine hole like the porous member 201, and the gas is sprayed toward the electronic component 2 to levitate the electronic component 2. When the electronic components 2 are suctioned through the suction hole against the levitation force of the electronic components 2 generated by the injection, the same suction force is used to generally maintain the non-contact (floating) side as described above. The adjustment is very difficult, and a large amount of gas is blown out around the pickup part, causing concerns about the generation of particles.

與此相對，在本實施方式中，經由相向面201a的微細的孔而從相向面201a的整體呈面狀吹出的氣體的流量極少。因此，無產生顆粒的擔心。從相向面201a吹出並非積極地使電子零件2懸浮，而是在相向面201a與電子零件2接近時形成粘性流的氣體的層。因此，抽吸力越強，越容易將相向面201a與電子零件2保持為非接觸狀態，即使將來自抽吸孔201c的由負壓產生的抽吸力設為足以將電子零件2從片材11剝離的力，也能夠通過相向面201a與電子零件2之間的氣體的層來防止接觸，因此不論是獲得強抽吸力還是抽吸力的調整均變得容易。On the other hand, in this embodiment, the flow rate of the gas blown out in a planar shape from the entire opposing surface 201a through the fine holes of the opposing surface 201a is extremely small. Therefore, there is no worry about particles being generated. A layer of gas that does not actively levitate the electronic components 2 but forms a viscous flow when the opposing surface 201 a approaches the electronic components 2 is blown out from the opposing surface 201 a. Therefore, the stronger the suction force is, the easier it is to keep the opposing surface 201a and the electronic component 2 in a non-contact state, even if the suction force caused by the negative pressure from the suction hole 201c is set to be sufficient to remove the electronic component 2 from the sheet. The force of peeling off can also be prevented by the gas layer between the opposing surface 201a and the electronic component 2, so it becomes easy to obtain a strong suction force and adjust the suction force.

例如，若為以下條件，則可獲得通過拾取筒夾200可維持與電子零件2的非接觸並且抽吸保持的結果。作為多孔質構件201，使用通氣率例如在供給壓力為0.3 MPa時從多孔質構件201流出的氣體的流量為0.7 L/min左右的構件。向多孔質構件201供給的氣體（氮氣）的壓力可為0.1 MPa～0.7 MPa左右的範圍，此時，經由多孔質構件201流通的氣體的流量為0.3 L/min～1.5 L/min左右的範圍，能夠確實地維持拾取筒夾200與電子零件2的非接觸。而且，作為抽吸的壓力，為-10 kPa～-90 kPa的範圍，能夠確實地從片材11拾取電子零件2。此時，電子零件2與相向面201a之間的氣體層中的壓力為0.1 MPa～0.5 MPa。For example, under the following conditions, it is possible to obtain a result in which the pickup collet 200 can maintain non-contact with the electronic component 2 and maintain the suction hold. As the porous member 201, a member with a ventilation rate of about 0.7 L/min is used, for example, when the supply pressure is 0.3 MPa. The pressure of the gas (nitrogen) supplied to the porous member 201 can be in the range of about 0.1 MPa to 0.7 MPa. At this time, the flow rate of the gas flowing through the porous member 201 is in the range of about 0.3 L/min to 1.5 L/min. , the non-contact between the pickup collet 200 and the electronic component 2 can be reliably maintained. Furthermore, the suction pressure is in the range of -10 kPa to -90 kPa, and the electronic component 2 can be reliably picked up from the sheet 11 . At this time, the pressure in the gas layer between the electronic component 2 and the opposing surface 201a is 0.1 MPa to 0.5 MPa.

（2）利用角度變更部232進行的角度變更是通過反轉使電子零件2朝向相向面201a的角落移動的角度。由此，若在拾取後反轉，則電子零件2被定位於相向面201a的角落。(2) The angle change performed by the angle changing unit 232 is an angle at which the electronic component 2 is moved toward the corner of the opposing surface 201 a by inversion. Therefore, if it is reversed after picking up, the electronic component 2 will be positioned at the corner of the opposing surface 201a.

（3）旋轉部231從拾取電子零件2的位置起開始旋轉，在相向面201a反轉的位置處停止。因此，若利用角度變更部232變更角度，則可通過電子零件2要繼續移動的慣性定位於正交的導引部203K、導引部203L所沿著的相向面201a的角落、或正交的導引部203M、導引部203N所沿著的相向面201a的角落。因此，無需另外準備使電子零件2移動的機構，可通過簡單的結構來構成不易發生異常、低成本的裝置。(3) The rotating part 231 starts rotating from the position where the electronic component 2 is picked up, and stops at the position where the opposing surface 201 a is reversed. Therefore, when the angle is changed by the angle changing part 232, the electronic component 2 can be positioned at the corner of the orthogonal guide part 203K, the opposing surface 201a along which the guide part 203L is along, or the orthogonal position by the inertia of the electronic component 2 to continue moving. The corners of the opposing surface 201a along which the guide portions 203M and 203N follow. Therefore, there is no need to prepare a separate mechanism for moving the electronic component 2, and a low-cost device that is less prone to abnormality can be configured with a simple structure.

[變形例] 本發明不限定於所述實施方式。基本結構與所述實施方式相同，如以下那樣的變形例也可應用。 [Modification] The present invention is not limited to the above-described embodiment. The basic structure is the same as that of the above-described embodiment, and the following modifications are also applicable.

（1）如上所述，利用角度變更部232形成的拾取筒夾200的變更角度為通過反轉使電子零件2朝向相向面201a的角落移動的角度即可。這樣，若導引部203相對於旋轉軌跡RT而傾斜，則可實現如上所述的定位。因此，例如，變更角度可在10°～80°的範圍內設定。容易移動的角度根據電子零件2的尺寸、縱橫邊的比等而也有不同，因此優選根據電子零件2適當選擇。視需要也可以通過實驗等求出。但，若一對正交的導引部203的其中一者的變更角度過大，則不易沿著導引部203移動。因此，將兩者設為相同的45°左右，從而相對於旋轉軌跡RT而言，一對正交的導引部203各自的角度相等而無偏向，可順利地進行使電子零件2靠近角落的動作。(1) As described above, the changing angle of the pickup collet 200 formed by the angle changing portion 232 may be an angle at which the electronic component 2 moves toward the corner of the opposing surface 201 a by inversion. In this way, if the guide part 203 is inclined relative to the rotation trajectory RT, the above-mentioned positioning can be achieved. Therefore, for example, the change angle can be set in the range of 10° to 80°. The easy-to-move angle differs depending on the size of the electronic component 2, the ratio of the vertical and horizontal sides, etc., so it is preferable to select it appropriately according to the electronic component 2. It can also be obtained through experiments if necessary. However, if the change angle of one of the pair of orthogonal guide parts 203 is too large, it will be difficult to move along the guide parts 203 . Therefore, by setting both to the same angle of about 45°, the angles of the pair of orthogonal guide portions 203 with respect to the rotation trajectory RT are equal without deviation, and the electronic component 2 can be smoothly moved toward the corner. action.

（2）在利用旋轉部231使拾取筒夾200反轉時，無需一定從旋轉開始起在旋轉角度成為180°時停止。例如，也可以為旋轉部231從拾取電子零件2的位置起開始旋轉，在相向面201a超過反轉位置（旋轉角度180°）後返回到反轉的位置而停止。即，如圖12的（A）～圖12的（C）所示，旋轉部231與圖7的（A）～圖7的（C）同樣地開始反轉動作後，如圖12的（D）所示，在超過180°的位置處停止旋轉。這樣，除了慣性力以外還有重力使得電子零件2靠近導引部203M、導引部203N所沿著的相向面201a的角落。如圖12的（E）所示，旋轉部231從所述狀態起以低於反轉動作時的速度使拾取筒夾200返回到反轉位置而停止。然後，如圖12的（F）所示，角度變更部232以使拾取筒夾200恢復為原來的角度的方式使其轉動。(2) When the pickup collet 200 is reversely rotated by the rotation unit 231, it is not necessary to stop when the rotation angle reaches 180° from the start of the rotation. For example, the rotating unit 231 may start rotating from the position where the electronic component 2 is picked up, and then return to the reversed position and stop when the facing surface 201 a exceeds the inverted position (rotation angle 180°). That is, as shown in FIGS. 12(A) to 12(C) , after the rotating part 231 starts the reversing operation in the same manner as in FIGS. 7(A) to 7(C) , as shown in FIG. 12(D ) ), the rotation stops at a position exceeding 180°. In this way, in addition to the inertial force and gravity, the electronic component 2 approaches the corner of the opposing surface 201a along which the guide portions 203M and 203N lie. As shown in FIG. 12(E) , the rotation unit 231 returns the pickup collet 200 to the reverse rotation position at a speed lower than that during the reverse rotation operation from the above state, and stops the pickup collet 200 . Then, as shown in FIG. 12(F) , the angle changing unit 232 rotates the pickup collet 200 so as to return it to the original angle.

此處，在拾取筒夾200從旋轉開始起在旋轉角度成為180°時停止的情況下，也考慮到電子零件2從導引部203K、導引部203L脫離移動，定位的狀態崩解。而且，在以利用導引部203M、導引部203N積極地定位電子零件2的方式使其移動的情況下，也擔心當電子零件2的側面與導引部203M、導引部203N接觸時，電子零件2發生回彈、或電子零件2的移動量少而無法到達導引部203M、導引部203N，從而未定位於角落。但是，在所述形態中，通過使其轉動並超過反轉的位置，除了慣性力以外還有重力可使得電子零件2靠近相向面201a的角落，因此可提高能夠定位的可能性。在圖12所示的形態中，利用導引部203M、導引部203N定位電子零件2。而且，如上所述，在從超過反轉位置的位置起使拾取筒夾200返回時，通過降低返回移動的加速度或減速度，相對於返回到反轉的位置而停止的拾取筒夾200，可防止慣性導致電子零件2從角落脫離移動。Here, when the pickup collet 200 stops when the rotation angle reaches 180° from the start of rotation, it is also considered that the electronic component 2 moves away from the guide portions 203K and 203L and collapses in the positioned state. Furthermore, when the electronic component 2 is moved so as to be actively positioned using the guide portions 203M and 203N, there is also a concern that when the side surface of the electronic component 2 comes into contact with the guide portions 203M and 203N, The electronic component 2 rebounds, or the electronic component 2 moves so little that it cannot reach the guide portion 203M or the guide portion 203N, and is not positioned at the corner. However, in this form, by rotating it beyond the reversed position, the electronic component 2 can be brought closer to the corner of the opposing surface 201a by gravity in addition to the inertial force, thereby increasing the possibility of positioning. In the form shown in FIG. 12 , the electronic component 2 is positioned using the guide portion 203M and the guide portion 203N. Furthermore, as described above, when the pickup collet 200 is returned from a position beyond the reversed position, by reducing the acceleration or deceleration of the return movement, the pickup collet 200 can be stopped after returning to the reversed position. Prevent inertia from causing the electronic component 2 to move away from corners.

另外，在所述情況下，需要暫時超出反轉位置的懸伸（overhanging）時間、返回到反轉位置的時間，並且若降低加速度或減速度而慢慢返回，則節拍時間變長。因此，通過一邊從懸伸位置返回一邊恢復變更角度而進行角度變更，由此可抑制節拍時間變長。在所述情況下，若慢慢進行角度變更的恢復，則也可以抑制變更角度的恢復引起的電子零件2的偏移的發生。In addition, in this case, an overhanging time to temporarily exceed the reverse position and time to return to the reverse position are required, and if the acceleration or deceleration is reduced and the return is made slowly, the takt time becomes longer. Therefore, by performing the angle change while returning from the overhang position, the takt time can be suppressed from becoming longer. In such a case, if the angle change is restored gradually, the occurrence of deviation of the electronic component 2 caused by the angle change being restored can also be suppressed.

而且，在旋轉角度為180°的情況下，即在拾取筒夾200在反轉的位置處停止旋轉時，電子零件2成為水平狀態，因此作用於電子零件2的慣性力被分為水平方向與豎直方向的力。因此，朝嚮導引部203M、導引部203N的水平力減弱。而且，沿著豎直方向作用的慣性力成為向水平方向移動的阻力。因此，沿著水平方向作用的慣性力進一步減弱。因此，相較於電子零件2與導引部203M、導引部203N相撞而回彈的可能性，更應該考慮電子零件2未到達導引部203M、導引部203N的可能性。Furthermore, when the rotation angle is 180°, that is, when the pickup collet 200 stops rotating at the reversed position, the electronic component 2 becomes a horizontal state, so the inertial force acting on the electronic component 2 is divided into a horizontal direction and a horizontal direction. vertical force. Therefore, the horizontal force toward the guide portion 203M and the guide portion 203N is weakened. Furthermore, the inertial force acting in the vertical direction acts as a resistance to movement in the horizontal direction. Therefore, the inertial force acting in the horizontal direction is further weakened. Therefore, rather than the possibility that the electronic component 2 collides with the guide portions 203M and 203N and rebounds, the possibility that the electronic component 2 does not reach the guide portions 203M and 203N should be considered.

另一方面，在進行懸伸並暫時停止的情況下，由於也施加離心力或重力的分力，故而會補償電子零件2進行移動的力。而且，慣性力與重力的合力相對於筒夾面的分力發揮作用的角度也變小，因此阻力分量也減弱。因此，可提高能夠定位的可能性。On the other hand, when the electronic component 2 is suspended and temporarily stopped, a component force of centrifugal force or gravity is also applied, so the force for moving the electronic component 2 is compensated. Furthermore, the angle at which the resultant force of inertial force and gravity acts relative to the component force on the collet surface also becomes smaller, so the resistance component also weakens. Therefore, the possibility of being able to locate can be increased.

（3）拾取筒夾200的角度變更與反轉的開始時機不限定於所述形態。例如，在圖7、圖12的形態中，變更角度後開始進行反轉的旋轉，但也可以在開始進行反轉的旋轉後進行角度變更。由此，可使角度變更的時間與反轉轉動的時間重疊，因此可抑制節拍時間的增大。(3) The timing of starting the angle change and reversal of the pickup collet 200 is not limited to the above-described form. For example, in the forms of FIGS. 7 and 12 , the reverse rotation is started after the angle is changed, but the angle may be changed after the reverse rotation is started. This allows the time of angle change and the time of reverse rotation to overlap, thereby suppressing an increase in the takt time.

另外，在拾取筒夾200的角度變更中，在與相向面201a平行的方向上產生使電子零件2旋轉的力。即，在拾取時，電子零件2位於導引部203之間的大致中央。但是，由於拾取筒夾200的角度變更，電子零件2雖想要維持姿勢，但導引部203旋轉。因此，存在電子零件2與導引部203相撞的可能性。In addition, when the angle of the pickup collet 200 is changed, a force that rotates the electronic component 2 is generated in a direction parallel to the opposing surface 201a. That is, when picking up, the electronic component 2 is located substantially in the center between the guide portions 203 . However, due to the change in angle of the pickup collet 200, the guide part 203 rotates even though the electronic component 2 attempts to maintain its posture. Therefore, there is a possibility that the electronic component 2 collides with the guide portion 203 .

而且，若為了反轉而開始旋轉，則同樣地，電子零件2會與導引部203相撞。另外，在所述過程中，電子零件2靠近導引部203K、導引部203L。Moreover, if rotation is started for reverse direction, the electronic component 2 will collide with the guide part 203 similarly. In addition, during the above process, the electronic component 2 approaches the guide portion 203K and the guide portion 203L.

但是，若一邊進行角度變更一邊進行用於反轉的旋轉，則兩者的移動所伴隨的合力導致導引部203K、導引部203L與電子零件2相撞，因此存在相撞時的衝擊增大的可能性。因此，缺損或破損、脫落的危險性也變高。但是，這種危險性是由電子零件2的尺寸、重量所決定，因此根據電子零件2來適當決定是否重疊進行角度變更與反轉即可。另外，如下文所述，只要通過從導引部203噴出氣體等來避免碰撞，則重疊進行動作時會縮短節拍時間。However, if the rotation for reversal is performed while changing the angle, the resultant force accompanying the movement of the two causes the guide portion 203K, the guide portion 203L to collide with the electronic component 2, so there is an increase in the impact during the collision. Big possibility. Therefore, the risk of chipping, breakage, or falling off also increases. However, this risk is determined by the size and weight of the electronic component 2. Therefore, it is sufficient to appropriately determine whether to overlap and perform angle change and reversal according to the electronic component 2. In addition, as described below, as long as collision is avoided by blowing gas or the like from the guide portion 203, the takt time can be shortened when the operations are overlapped.

（4）角度變更部232可變更所拾取的電子零件2的角度，並在相向面201a進行用於反轉的旋轉的狀態下，恢復所變更的角度。即，不論是否進行懸伸，在反轉旋轉動作途中均可恢復角度。由此，通過使恢復時間與轉動動作重疊來改變拾取筒夾200的角度，可抑制節拍時間延長。(4) The angle changing unit 232 can change the angle of the picked-up electronic component 2 and restore the changed angle in a state where the opposing surface 201 a is rotated for inversion. That is, regardless of whether the overhang is performed or not, the angle can be restored during the reverse rotation operation. Accordingly, by changing the angle of the pickup collet 200 by overlapping the recovery time with the rotation operation, it is possible to suppress an increase in the takt time.

在進行懸伸的情況下，若設為在返回反轉位置的旋轉期間中也要恢復角度，則作用於電子零件2的力減小，可抑制電子零件2從角落或其附近位置偏移。When overhanging is performed, if the angle is restored even during the rotation period when returning to the reverse position, the force acting on the electronic component 2 is reduced, and the electronic component 2 can be suppressed from shifting from the corner or its vicinity.

在不進行懸伸的情況下，在朝向停止的減速期間恢復角度。在不進行懸伸且在靠近了通過反轉時的加速所靠近的角落的狀態下使其停止的情況下，直接在減速中恢復角度。在不進行懸伸且通過停止時的減速產生的慣性力而從通過反轉時的加速所靠近的角落向相向的角落靠近並停止的情況下，在靠近相向的角落後恢復角度。Without overhang, the angle is restored during deceleration toward stop. When the vehicle is stopped while approaching the corner approached by acceleration during reversal without overhanging, the angle is restored directly during deceleration. When the vehicle approaches and stops from the corner approached by acceleration during reversal without overhanging and by the inertial force generated by deceleration during stop, the angle is restored after approaching the opposite corner.

（5）所述使拾取筒夾200懸伸後恢復的動作可重複多次。即，可為拾取筒夾200到達反轉位置後，以反轉位置為中心，在超過反轉位置的位置與反轉位置近側的位置之間往返，以這種方式驅動方向變更部23的旋轉部231。通過以拾取筒夾200往返的方式使其擺動，拾取筒夾200沿著上下方向傾斜，慣性力與重力作用於電子零件2，而可使電子零件2靠近拾取筒夾200的角落。在所述情況下，通過逐漸減慢擺動的速度，可使其靠近角落。而且，也可以逐漸減小擺動幅度。即使存在通過反轉動作或懸伸動作未使電子零件2完全靠近拾取筒夾200的角落、即未與正交的導引部203相接的情況，也可以通過進一步靠近的動作而更確實地定位電子零件2。(5) The action of restoring the pickup collet 200 after being suspended can be repeated multiple times. That is, after the pick-up collet 200 reaches the reverse position, the direction changing portion 23 can be driven in such a way that the pickup collet 200 moves back and forth between a position beyond the reverse position and a position near the reverse position with the reverse position as the center. Rotating part 231. By swinging the pick-up collet 200 back and forth, the pick-up collet 200 tilts in the up-and-down direction, and the inertial force and gravity act on the electronic component 2, so that the electronic component 2 can be brought close to the corner of the pick-up collet 200. In this case, by gradually slowing down the speed of the swing, it can be brought closer to the corner. Furthermore, the swing amplitude can also be gradually reduced. Even if the electronic component 2 is not completely brought close to the corner of the pickup collet 200 by the reversing action or the hanging action, that is, it is not in contact with the orthogonal guide part 203, it can be more reliably achieved by further approaching the corner of the pickup collet 200. Locating electronic parts2.

（6）也可以將角度變更部232以能夠上下變更角度的方式設置，使拾取筒夾200沿著上下方向傾斜，由此使電子零件2靠近相向面201a的角落。例如，在反轉位置處沿著上下方向傾斜而非使其懸伸，由此可將電子零件2定位。即使存在通過反轉動作未使電子零件2完全靠近拾取筒夾200的角落的情況，也可以通過進一步靠近的動作而更確實地定位電子零件2。當然，也可以與懸伸一起進行。而且，可重複多次沿著上下方向傾斜。(6) The angle changing portion 232 may be provided so as to be able to change the angle up and down, and the electronic component 2 may be brought closer to the corner of the opposing surface 201 a by inclining the pickup collet 200 in the up and down direction. For example, the electronic component 2 can be positioned by tilting it in the up-and-down direction in the inverted position rather than overhanging it. Even if the electronic component 2 is not completely brought close to the corner of the pickup collet 200 by the reversing operation, the electronic component 2 can be positioned more reliably by the further approaching operation. Of course, this can also be done with overhanging. Furthermore, the tilting in the up and down direction can be repeated multiple times.

（7）在所述形態中，拾取電子零件2後通過角度變更部232變更拾取筒夾200的角度，也可以在電子零件2的水平方向的角度傾斜的狀態下拾取，在交接至接合頭31之前，角度變更部232將角度恢復。(7) In the above mode, after the electronic components 2 are picked up, the angle of the pickup collet 200 is changed by the angle changing unit 232. Alternatively, the electronic components 2 may be picked up in a state where the angle in the horizontal direction is inclined, and then transferred to the bonding head 31. Previously, the angle changing unit 232 restored the angle.

（8）如圖13及圖14所示，可在四個導引部203中相向的兩個導引部203的其中一個設置通氣部203a。設置通氣部203a的導引部203設置於相向面201a的相鄰的兩邊。如下文所述，可從通氣部203a向相向的導引部203噴出氣體。即，如圖13的（A）、圖14的（A）所示，可設置通氣部203a，使四個角中的一個角中正交的其中一正交的導引部203M、導引部203N（圖13的（A）及圖13的（B）中成為裡側而隱藏）側相較於對角的角中的另一正交的導引部203K、導引部203L側而成為相對正壓。通氣部203a經由未圖示的配管連接於氣體的供給回路，由控制裝置50所控制。通過使其中一正交的導引部203M、導引部203N側相較於另一正交的導引部203K、導引部203L側而成為相對正壓，可將靠近導引部203K、導引部203L側的電子零件2留在導引部203K、導引部203L側，防止旋轉停止時的慣性力導致其嚮導引部203M、導引部203N側移動。因此，可增大停止旋轉時的減速度，實現時間縮短、防止電子零件2的碰撞引起的回彈。(8) As shown in FIGS. 13 and 14 , the ventilation part 203 a may be provided in one of the two opposite guide parts 203 among the four guide parts 203 . The guide portion 203 for providing the ventilation portion 203a is provided on both adjacent sides of the opposing surface 201a. As described below, gas can be blown from the ventilation part 203a to the opposite guide part 203. That is, as shown in FIG. 13(A) and FIG. 14(A) , the ventilation part 203a may be provided such that one of the orthogonal guide parts 203M and the guide part are orthogonal to one of the four corners. The 203N side (which is the inner side and hidden in FIGS. 13(A) and 13(B) ) is opposite to the other orthogonal guide part 203K and guide part 203L sides in the diagonal corners. Positive pressure. The ventilation unit 203a is connected to a gas supply circuit via a pipe (not shown) and is controlled by the control device 50 . By making one of the orthogonal guide portions 203M and 203N have a relatively positive pressure compared to the other orthogonal guide portion 203K and guide portion 203L, it is possible to move closer to the guide portions 203K and 203L. The electronic component 2 on the guide portion 203L side remains on the guide portion 203K and guide portion 203L sides to prevent the electronic component 2 from moving to the guide portion 203M and guide portion 203N sides due to the inertial force when the rotation is stopped. Therefore, the deceleration when stopping the rotation can be increased, thereby shortening the time and preventing the electronic component 2 from rebounding due to collision.

而且，如圖13的（B）、圖14的（B）所示，可設置通氣部203a，使四個角中的一個角中正交的其中一正交的導引部203K、導引部203L（圖13中成為裡側而隱藏）側相較於對角的角中的另一正交的導引部203M、導引部203N側而成為相對正壓。通過使其中一正交的導引部203K、導引部203L側相較於另一正交的導引部203M、導引部203N側而成為相對正壓，除了拾取筒夾200的反轉停止時的離心力、慣性力或重力以外，電子零件2更確實地靠近相對成為負壓側的另一正交的導引部203M、導引部203N側，而能夠將電子零件2定位於另一正交的導引部203M、導引部203N所沿著的相向面201a的角落。Furthermore, as shown in FIG. 13(B) and FIG. 14(B) , the ventilation part 203a may be provided such that one of the orthogonal guide parts 203K and the guide part 203K are orthogonal to one of the four corners. The side 203L (hidden as the inner side in FIG. 13 ) has a relatively positive pressure compared to the other orthogonal guide portion 203M and guide portion 203N sides at the diagonal corners. By causing one of the orthogonal guide portions 203K and 203L to have a relatively positive pressure compared to the other orthogonal guide portion 203M and 203N, the reverse rotation of the pickup collet 200 is stopped. In addition to the centrifugal force, inertial force or gravity, the electronic component 2 is more reliably close to the other orthogonal guide portion 203M and the guide portion 203N that is the negative pressure side, so that the electronic component 2 can be positioned on the other positive side. The corner of the opposing surface 201a along which the guide portion 203M and the guide portion 203N intersect.

通氣部203a以將外部與由相向面201a保持的電子零件2的周圍連通的方式設置於導引部203的內部。所述通氣部203a經由未圖示的配管連接於氣體的供給回路。通氣部203a的端部成為與電子零件2的其中兩個側面相向的噴出口203b。因此，可從噴出口203b向電子零件2的側面噴出氣體。The ventilation part 203a is provided inside the guide part 203 so that the outside may communicate with the periphery of the electronic component 2 held by the opposing surface 201a. The ventilation part 203a is connected to a gas supply circuit via a pipe (not shown). The end portion of the ventilation portion 203a serves as an ejection port 203b facing two side surfaces of the electronic component 2. Therefore, the gas can be ejected from the ejection port 203b to the side surface of the electronic component 2 .

如圖14的（A）、圖14的（B）所示，相對於如上所述那樣由相向面201a保持的電子零件2的其中一正交的兩個側面，在拾取筒夾200反轉時，經由噴出口203b從其中一正交的導引部203的通氣部203a噴出氣體。這樣，電子零件2的另一正交的兩個側面被壓抵於另一正交的導引部203的內壁。由此，可防止暫時定位的電子零件2的移動、或者反轉時的電子零件2的移動不足或回彈，而能夠定位於相向面201a中的角落。As shown in FIGS. 14(A) and 14(B) , when the pickup collet 200 is reversed with respect to two orthogonal side surfaces of the electronic component 2 held by the opposing surface 201 a as described above, , the gas is ejected from the ventilation part 203a of one of the orthogonal guide parts 203 through the ejection port 203b. In this way, the other two orthogonal side surfaces of the electronic component 2 are pressed against the inner wall of the other orthogonal guide portion 203 . Thereby, it is possible to prevent the temporarily positioned electronic component 2 from moving, or from insufficient movement or rebound of the electronic component 2 during inversion, and can position the electronic component 2 at a corner in the opposing surface 201a.

而且，如圖15的（A）所示，不僅從其中一正交的導引部203K、導引部203L，而且也從另一正交的導引部203M、導引部203N的與通氣部203a連通的噴出口203b向電子零件2的另一正交的兩個側面噴出氣體，由此能夠抑制移動中或反轉時的電子零件2的偏移或偏離、與電子零件2的接觸。關於所述通氣部203a，也經由未圖示的配管連接於氣體的供給回路，由控制裝置50所控制。在所述情況下，在定位時，也如圖15的（B）所示，停止從另一正交的導引部203M、導引部203L噴出氣體，僅從其中一正交的導引部203K、導引部203L噴出氣體，由此使其中一正交的導引部203K、導引部203L側成為相對正壓，而能夠進行定位。另外，在所述情況下，可通過將導引部203K、導引部203L側設為正壓，或將導引部203M、導引部203N側設為正壓，而選擇定位於哪一側。Furthermore, as shown in FIG. 15(A) , not only one of the orthogonal guide parts 203K and 203L, but also the other orthogonal guide part 203M and 203N are connected to the ventilation part. The ejection port 203b communicating with the electronic component 203a ejects gas to the other two orthogonal side surfaces of the electronic component 2, thereby suppressing the shift or deviation of the electronic component 2 during movement or reversal, and the contact with the electronic component 2. The vent part 203a is also connected to a gas supply circuit via a pipe (not shown), and is controlled by the control device 50. In this case, during positioning, as shown in FIG. 15(B) , the gas injection from the other orthogonal guide part 203M and the guide part 203L is stopped, and only one of the orthogonal guide parts is ejected. 203K and the guide part 203L eject gas, so that one of the orthogonal guide parts 203K and 203L has a relatively positive pressure, thereby enabling positioning. In addition, in this case, it is possible to select which side to position by setting the positive pressure on the guide portion 203K and guide portion 203L sides, or setting the positive pressure on the guide portion 203M and guide portion 203N sides. .

（9）如圖16所示，通氣部203a也可設置為能夠從導引部203的另一正交的兩邊側抽吸氣體。例如，在另一正交的導引部203M、導引部203N的內部，以將外部與由相向面201a保持的電子零件2的周圍連通的方式，設置通氣部203a。所述通氣部203a經由未圖示的配管連接於氣體的排氣回路（負壓產生回路），而由控制裝置50控制排氣回路。通氣部203a的端部成為與電子零件2的另兩個側面相向的抽吸口203d。因此，能夠從抽吸口203d抽吸電子零件2的側面。由此，由於其中一正交的導引部203K、導引部203L側相較於另一正交的導引部203M、導引部203N側成為相對正壓，故而電子零件2與所述同樣地被定位於適當位置的角落。另外，在所述情況下，可在其中一正交的導引部203K、導引部203L設置通氣部203a，也可不設置。而且，可在其中一正交的導引部203K、導引部203L設置用於抽吸的通氣部203a，也可設為能夠與所述反方向地定位的結構。(9) As shown in FIG. 16 , the ventilation part 203 a may be provided so that gas can be sucked from the other two orthogonal sides of the guide part 203 . For example, the ventilation part 203a is provided inside the other orthogonal guide part 203M and the guide part 203N so that the outside may communicate with the surroundings of the electronic component 2 held by the opposing surface 201a. The ventilation part 203 a is connected to a gas exhaust circuit (negative pressure generating circuit) via a pipe (not shown), and the exhaust circuit is controlled by the control device 50 . The end portion of the ventilation portion 203a becomes a suction port 203d facing the other two side surfaces of the electronic component 2. Therefore, the side surface of the electronic component 2 can be sucked from the suction port 203d. Therefore, since one of the orthogonal guide portions 203K and 203L has a relatively positive pressure compared to the other orthogonal guide portion 203M and 203N, the electronic component 2 is the same as described above. The ground was positioned in the corners of the appropriate location. In addition, in this case, the ventilation part 203a may be provided in one of the orthogonal guide parts 203K and 203L, or may not be provided. Furthermore, a ventilation part 203a for suction may be provided in one of the orthogonal guide parts 203K and 203L, or may be configured to be positionable in the opposite direction.

（10）如上所述，若電子零件2與其中一正交的導引部203K、導引部203L、另一正交的導引部203M、導引部203N接觸，則有電子零件2受到影響的可能性。因此，通過導引部203K、導引部203L、導引部203M、導引部203N噴出氣體來避免與電子零件2接觸，由此可防止電子零件2從拾取筒夾200脫離，並且進行定位，不再發生與導引部203K、導引部203L、導引部203M、導引部203N的接觸對電子零件2造成的損壞。在所述情況下，也可以通過將導引部203K、導引部203L側設為正壓，或者將導引部203M、導引部203N側設為正壓，而使其靠近任一側進行定位。(10) As mentioned above, if the electronic component 2 comes into contact with one of the orthogonal guide portions 203K and 203L and the other orthogonal guide portion 203M and 203N, some of the electronic components 2 will be affected. possibility. Therefore, the guide portion 203K, the guide portion 203L, the guide portion 203M, and the guide portion 203N eject gas to avoid contact with the electronic component 2, thereby preventing the electronic component 2 from being detached from the pickup collet 200 and positioning it. Damage to the electronic component 2 caused by contact with the guide portion 203K, the guide portion 203L, the guide portion 203M, and the guide portion 203N no longer occurs. In this case, the guide part 203K and the guide part 203L side may be set to a positive pressure, or the guide part 203M and the guide part 203N side may be set to a positive pressure, and it may be carried out close to either side. position.

（11）而且，例如，如圖17所示，通氣部203a可設置為能夠經由導引用的多孔質構件203c從另一正交的導引部203M、導引部203N噴出氣體。即，在另一正交的導引部203M、導引部203N中的突出部分與電子零件2的側面相向的位置設置導引用的多孔質構件203c。在導引部203M、導引部203N的內部設置有將外部與導引用的多孔質構件203c連通的通氣部203a。通氣部203a經由未圖示的配管連接於氣體的供給回路，由控制裝置50所控制。(11) Furthermore, for example, as shown in FIG. 17 , the ventilation part 203a may be provided so that gas can be ejected from the other orthogonal guide parts 203M and 203N via the guide porous member 203c. That is, the porous member 203c for the guide is provided at the position where the protruding portion of the other orthogonal guide portion 203M or the guide portion 203N faces the side surface of the electronic component 2 . A ventilation part 203a is provided inside the guide part 203M and the guide part 203N, which connects the outside with the porous member 203c for guide. The ventilation unit 203a is connected to a gas supply circuit via a pipe (not shown) and is controlled by the control device 50 .

導引部203M、導引部203N經由導引用的多孔質構件203c噴出氣體。由此，沿著導引部203M、導引部203N的側面形成氣體的層，因此在電子零件2為了定位而移動至另一正交的導引部203M、導引部203N側的情況下，相對於導引部203M、導引部203N也能夠維持電子零件2的非接觸。因此，電子零件2經由氣體層而被定位，並且電子零件2的缺損、破裂減少，也能夠抑制接觸引起的顆粒的產生。氣體的噴出量也為少量即可，因此也能夠抑制氣流引起的顆粒的產生。進而，也能夠減少移送時電子零件2的偏移或掉落。另外，如圖18所示，導引部203M、導引部203N也可以能夠經由導引用的多孔質構件203c噴出氣體的方式設置。由此，在用於反轉的旋轉的途中，在電子零件2因重力而移動至導引部203M、導引部203N側的情況下，也能夠維持電子零件2的側面與導引部203M、導引部203N的不接觸，而能夠降低電子零件2所受到的影響。The guide portions 203M and 203N eject gas through the porous member 203c for guidance. As a result, a gas layer is formed along the side surfaces of the guide portions 203M and 203N. Therefore, when the electronic component 2 moves to the other orthogonal guide portions 203M and 203N for positioning, Non-contact of the electronic component 2 can also be maintained with respect to the guide portion 203M and the guide portion 203N. Therefore, the electronic components 2 are positioned via the gas layer, defects and cracks of the electronic components 2 are reduced, and the generation of particles due to contact can also be suppressed. Since the amount of gas ejected is only a small amount, the generation of particles caused by the air flow can also be suppressed. Furthermore, it is also possible to reduce shifting or falling of the electronic component 2 during transfer. In addition, as shown in FIG. 18 , the guide portion 203M and the guide portion 203N may be provided so that gas can be ejected through the porous member 203c for the guide. Therefore, even when the electronic component 2 moves to the guide portion 203M or the guide portion 203N side due to gravity during the rotation for reversal, the side surface of the electronic component 2 and the guide portion 203M or the guide portion 203N can be maintained. The guide portion 203N is non-contact and can reduce the influence on the electronic component 2 .

（12）如上所述的導引部203以能夠限制電子零件2的移動的方式沿著相向面201a的外緣設置即可。因此，可設置於相向面201a的整周，也可以設置於一部分。例如，如圖19的（A）那樣隔著角部或如圖19的（B）那樣沿著角部連續配置導引部203，使其中一正交的導引部203側成為相對正壓，由此可實現電子零件2的定位。另外，如圖19的（B）所示，也存在其中一正交的導引部203與另一正交的導引部203連續的情況。(12) The guide portion 203 as described above only needs to be provided along the outer edge of the facing surface 201 a so as to restrict the movement of the electronic component 2 . Therefore, it may be provided on the entire circumference of the facing surface 201a, or it may be provided on a part. For example, the guide portions 203 are continuously arranged across the corners as shown in FIG. 19(A) or along the corners as shown in FIG. 19(B) so that one of the orthogonal guide portions 203 side has a relatively positive pressure. This enables the electronic component 2 to be positioned. In addition, as shown in (B) of FIG. 19 , one of the orthogonal guide portions 203 may be continuous with the other orthogonal guide portion 203 .

（13）抽吸孔201c、開口201d、噴出口203b、抽吸口203d的數量或尺寸不限定於所述形態。可通過多孔質構件201的相向面201a中電子零件2由氣體的層支撐的面積與開口201d的總面積的平衡來實現抽吸保持狀態與非接觸狀態的維持。而且，以能夠定位於另一正交的導引部203的方式確定噴出口203b、或抽吸口203d的數量或尺寸即可。(13) The number or size of the suction holes 201c, the opening 201d, the ejection port 203b, and the suction port 203d are not limited to the above-mentioned forms. The suction holding state and the non-contact state can be maintained by balancing the area of the facing surface 201a of the porous member 201 where the electronic component 2 is supported by the gas layer and the total area of the opening 201d. Furthermore, the number or size of the ejection ports 203b or the suction ports 203d may be determined so that they can be positioned on the other orthogonal guide part 203.

（14）抽吸孔201c、開口201d、噴出口203b、抽吸口203d的位置或形狀也不限定於所述形態。例如，開口201d的形狀可如上所述為圓形、矩形，也可以為其他橢圓形、多邊形、圓角多邊形、星形等。(14) The positions and shapes of the suction hole 201c, the opening 201d, the discharge port 203b, and the suction port 203d are not limited to the above-mentioned forms. For example, the shape of the opening 201d may be circular or rectangular as mentioned above, or may be other ellipse, polygon, rounded polygon, star, etc. shapes.

（15）通過將拾取筒夾200設置為可更換，而能夠根據電子零件2的形狀、尺寸來更換。作為所述可更換的結構，可通過磁鐵來抽吸保持的結構簡單，更換作業也變得容易。但，只要為能夠更換拾取筒夾200的結構即可。例如，可為使用負壓的吸附保持，也可為以機械的方式保持的結構。(15) By making the pickup collet 200 replaceable, it can be replaced according to the shape and size of the electronic component 2 . As the replaceable structure, the structure that can be sucked and held by magnets is simple, and the replacement operation is also easy. However, it only needs to be a structure in which the pickup collet 200 can be replaced. For example, it may be adsorption holding using negative pressure or a mechanical holding structure.

（16）拾取筒夾200的外緣不限定於矩形。而且，導引部203的配置也是只要以沿著電子零件2的外緣的方式配置即可，也無需如上所述設置於拾取筒夾200的外緣。例如，如圖20所示，可為具有筒狀等外緣為曲面的基座202的拾取筒夾200，且為在底面配置有導引部203的形態。另外，相向面201a也不限定於矩形。(16) The outer edge of the pickup collet 200 is not limited to a rectangular shape. Furthermore, the guide portion 203 only needs to be disposed along the outer edge of the electronic component 2 and does not need to be provided on the outer edge of the pickup collet 200 as described above. For example, as shown in FIG. 20 , the pickup collet 200 may have a base 202 with a curved outer edge such as a cylinder shape, and the guide part 203 may be arranged on the bottom surface. In addition, the opposing surface 201a is not limited to a rectangular shape.

[其他實施方式] 本發明並不限定於所述實施方式，在實施階段，可在不脫離其主旨的範圍內使結構要素變形並具體化。而且，可通過所述實施方式所公開的多個結構要素的適當組合來形成各種發明。例如，可從實施方式所示的全部結構要素中刪除若干結構要素。進而，也可以將不同實施方式中的結構要素適當加以組合。 [Other embodiments] The present invention is not limited to the above-described embodiments, and at the implementation stage, the structural elements can be modified and embodied within the scope that does not deviate from the gist of the invention. Furthermore, various inventions can be formed by appropriate combinations of the plurality of structural elements disclosed in the embodiments. For example, some structural elements may be deleted from all the structural elements shown in the embodiments. Furthermore, structural elements in different embodiments may be combined appropriately.

1:移送裝置 2:電子零件 10:供給裝置 11:片材 12:供給載台 13、61:載台移動機構 20:拾取裝置 21:拾取頭 22:筒夾移動機構 23:方向變更部 24:上推銷 30:搭載裝置 31:接合頭 31a:噴嘴 32:頭移動機構 50:控制裝置 51:供給裝置控制部 52:上推銷控制部 53:拾取控制部 54:接合頭控制部 56:基板載台控制部 57:儲存部 60:基板載台 100:安裝裝置 200:拾取筒夾 201:多孔質構件 201a:相向面 201b:背面 201c:抽吸孔 201d:開口 202:基座 202a:供氣孔 202b:排氣孔 202c:安裝孔 203、203K～203N:導引部 203a:通氣部 203b:噴出口 203c:導引用的多孔質構件 203d:抽吸口 221、321:滑動機構 221a、321a:支撐框架 221b、321b:軌道 221c、321c:滑動器 222、322:升降機構 222a:臂 222b:裝卸部 222c:銷 231:旋轉部 231a、232a:驅動源 232:角度變更部 241:支承體 G:氣體 P1:供給位置 P2:交接位置 P3:安裝位置 RT:旋轉軌跡 X、Y、Z:軸方向 θx、θz:方向 1: Transfer device 2: Electronic parts 10: Supply device 11:Sheet 12: Supply carrier 13. 61: Carrier moving mechanism 20: Pickup device 21: Pickup head 22:Collet moving mechanism 23: Direction Change Department 24: Promotion on the Internet 30: Mounted device 31:joint head 31a:Nozzle 32: Head moving mechanism 50:Control device 51: Supply device control department 52: Go to the sales control department 53: Pickup Control Department 54: Joint head control part 56:Substrate stage control section 57:Storage Department 60: Substrate carrier 100: Installation device 200: Pick up collet 201:Porous components 201a: Opposite side 201b: back 201c:Suction hole 201d:Open your mouth 202:Pedestal 202a: Air supply hole 202b:Exhaust hole 202c:Mounting hole 203, 203K～203N: Guidance Department 203a: Ventilation Department 203b: spout 203c: Porous components for guidance 203d: Suction port 221, 321: Sliding mechanism 221a, 321a: Support frame 221b, 321b: Orbit 221c, 321c: slider 222, 322: Lifting mechanism 222a:Arm 222b: Loading and unloading department 222c: pin 231:Rotation part 231a, 232a: driving source 232:Angle change department 241:Support G: gas P1: supply position P2: handover position P3: Installation location RT: rotation trajectory X, Y, Z: axis direction θx, θz: direction

圖1是表示實施方式的移送裝置及安裝裝置的正面圖。 圖2是表示實施方式的移送裝置及安裝裝置的平面圖。 圖3的（A）是表示利用拾取筒夾保持電子零件的原理的剖面示意圖，圖3（B）是表示基座的底面側立體圖。 圖4是表示拾取筒夾及裝卸部的底面側立體圖。 圖5是表示拾取筒夾及裝卸部的上表面側立體圖。 圖6是表示方向變更部的立體圖。 圖7的（A）～圖7的（E）是表示通過變更拾取筒夾的朝向所進行的電子零件的定位動作的說明圖，左側為側面圖，右側為拾取筒夾的底視圖。 圖8的（A）～圖8的（E）是表示通過變更拾取筒夾的朝向所進行的電子零件的定位動作的其他形態的說明圖，左側為側面圖，右側為拾取筒夾的底視圖。 圖9是表示移送裝置及安裝裝置的控制裝置的框圖。 圖10是表示實施方式的拾取動作的順序的流程圖。 圖11的（A）～圖11的（D）是表示實施方式的拾取動作的說明圖。 圖12的（A）～圖12的（F）是表示通過變更拾取筒夾的朝向所進行的電子零件的定位動作的其他示例的說明，左側為側面圖，右側為拾取筒夾的底視圖。 圖13的（A）及圖13的（B）是表示設置有具有噴出口的導引部的變形例的剖面示意圖。 圖14的（A）及圖14的（B）是表示利用氣體的噴出進行的電子零件的定位的原理的底面示意圖。 圖15的（A）及圖15的（B）是表示設置有具有噴出口的導引部的其他變形例的剖面示意圖。 圖16是表示設置有具有抽吸口的導引部的變形例的剖面示意圖。 圖17是表示設置有具有導引用多孔質構件的導引部的變形例的剖面示意圖。 圖18是表示設置有具有導引用的多孔質構件的導引部的其他變形例的剖面示意圖。 圖19的（A）及圖19的（B）是表示導引部的配置的變形例的底視圖。 圖20的（A）及圖20的（B）是表示拾取筒夾的變形例的底面側立體圖（A）、底視圖（B）。 FIG. 1 is a front view showing a transfer device and a mounting device according to the embodiment. FIG. 2 is a plan view showing the transfer device and the mounting device according to the embodiment. FIG. 3(A) is a schematic cross-sectional view showing the principle of holding electronic components using a pickup collet, and FIG. 3(B) is a bottom perspective view of the base. Fig. 4 is a bottom perspective view showing the pickup collet and the attachment and detachment portion. Fig. 5 is an upper surface side perspective view showing the pickup collet and the attachment and detachment portion. FIG. 6 is a perspective view showing the direction changing unit. 7(A) to 7(E) are explanatory diagrams showing the positioning operation of electronic components by changing the orientation of the pickup collet. The left side is a side view and the right side is a bottom view of the pickup collet. 8(A) to 8(E) are explanatory diagrams showing other forms of positioning operations of electronic components by changing the orientation of the pickup collet. The left side is a side view, and the right side is a bottom view of the pickup collet. . FIG. 9 is a block diagram showing a control device of the transfer device and the mounting device. FIG. 10 is a flowchart showing the sequence of the pickup operation according to the embodiment. 11(A) to 11(D) are explanatory diagrams showing the pickup operation according to the embodiment. 12(A) to 12(F) are illustrations showing other examples of the positioning operation of electronic components by changing the orientation of the pickup collet. The left side is a side view and the right side is a bottom view of the pickup collet. 13(A) and 13(B) are schematic cross-sectional views showing a modification in which a guide portion having a discharge port is provided. 14(A) and 14(B) are schematic bottom views showing the principle of positioning electronic components by ejection of gas. 15(A) and 15(B) are schematic cross-sectional views showing another modification in which a guide portion having a discharge port is provided. FIG. 16 is a schematic cross-sectional view showing a modification in which a guide portion having a suction port is provided. FIG. 17 is a schematic cross-sectional view showing a modification in which a guide portion having a guide porous member is provided. 18 is a schematic cross-sectional view showing another modified example of a guide portion provided with a porous member having a guide member. 19(A) and 19(B) are bottom views showing modifications of the arrangement of the guide portion. 20(A) and 20(B) are a bottom perspective view (A) and a bottom view (B) showing a modification of the pickup collet.

21:拾取頭 21: Pickup head

23:方向變更部 23: Direction Change Department

200:拾取筒夾 200: Pick up collet

202:基座 202:Pedestal

203K~203N:導引部 203K~203N: Guidance Department

221c:滑動器 221c:Slider

222:升降機構 222:Lifting mechanism

222a:臂 222a:Arm

222b:裝卸部 222b: Loading and unloading department

231:旋轉部 231:Rotation part

231a、232a:驅動源 231a, 232a: driving source

232:角度變更部 232:Angle change department

X、Y、Z:軸方向 X, Y, Z: axis direction

θx、θz:方向 θx, θz: direction

Claims (13)

一種拾取裝置，具有矩形外緣，且拾取電子零件， 所述拾取裝置的特徵在於，具有： 拾取筒夾，抽吸保持所述電子零件；及 方向變更部，改變所述拾取筒夾的朝向， 所述拾取筒夾中， 具有多孔質構件，所述多孔質構件具有通氣性，經由與所述電子零件相向的相向面的細孔將被供給至內部的氣體呈面狀噴出， 在所述多孔質構件設置有抽吸孔，所述抽吸孔在所述相向面具有開口，通過負壓抽吸所述電子零件， 設置有導引部，所述導引部以沿著所述電子零件的外緣的方式配置，對由所述相向面保持的所述電子零件的移動進行限制， 所述方向變更部具有： 旋轉部，以所述相向面從所述電子零件的供給位置反轉的方式，使所述拾取筒夾旋轉；及 角度變更部，沿著與所述相向面平行的面，變更所述拾取筒夾的角度。 A picking device has a rectangular outer edge and picks up electronic parts, The pickup device is characterized by: Pick up the collet and suction and hold the electronic parts; and a direction changing part that changes the direction of the pickup collet, In the pick-up collet, It has a porous member having air permeability, and the gas supplied to the inside is ejected in a planar shape through pores on a surface facing the electronic component, The porous member is provided with a suction hole having an opening on the opposing surface to suck the electronic component by negative pressure. A guide portion is provided along the outer edge of the electronic component to restrict movement of the electronic component held by the opposing surface, The direction changing part has: a rotating part that rotates the pickup collet in such a manner that the opposing surface is reversed from the supply position of the electronic component; and The angle changing unit changes the angle of the pickup collet along a surface parallel to the opposing surface. 如請求項1所述的拾取裝置，其特徵在於，利用所述角度變更部形成的變更角度為通過反轉使所述電子零件朝向所述相向面的角落移動的角度。The pickup device according to claim 1, wherein the changing angle formed by the angle changing unit is an angle at which the electronic component moves toward a corner of the facing surface by inversion. 如請求項1所述的拾取裝置，其特徵在於，所述旋轉部從拾取所述電子零件的位置起開始旋轉，在所述相向面反轉的位置處停止。The pick-up device according to claim 1, wherein the rotating portion starts rotating from a position where the electronic component is picked up and stops at a position where the opposing surfaces are reversed. 如請求項1所述的拾取裝置，其特徵在於，所述旋轉部在停止於所述相向面反轉的位置處之前，在超過所述相向面反轉的位置後返回到所述反轉的位置。The pickup device according to claim 1, wherein the rotating portion returns to the inverted position after passing the reversed position of the opposing surface before stopping at the position where the opposing surface is reversed. Location. 如請求項1所述的拾取裝置，其特徵在於，所述角度變更部在拾取所述電子零件後進行角度變更，在停止於所述相向面反轉的位置處之後恢復角度。The pick-up device according to claim 1, wherein the angle changing unit changes the angle after picking up the electronic component, and then restores the angle after stopping at a position where the opposing surfaces are reversed. 如請求項1所述的拾取裝置，其特徵在於，所述角度變更部變更所拾取的所述電子零件的角度，在所述相向面為了反轉而旋轉的狀態下恢復所變更的角度。The pick-up device according to claim 1, wherein the angle changing unit changes the angle of the picked-up electronic component and restores the changed angle in a state where the opposing surface is rotated for reversal. 如請求項1所述的拾取裝置，其特徵在於，所述導引部中設置有通氣部，所述通氣部使一正交的所述導引部側相較於另一正交的所述導引部側成為相對正壓。The pick-up device according to claim 1, characterized in that a ventilation part is provided in the guide part, and the ventilation part makes one orthogonal side of the guide part better than the other orthogonal side of the guide part. The guide portion side becomes relatively positive pressure. 如請求項7所述的拾取裝置，其特徵在於，所述通氣部以能夠從其中一正交的所述導引部噴出氣體的方式設置。The pickup device according to claim 7, wherein the ventilation part is provided in such a manner that gas can be ejected from one of the orthogonal guide parts. 如請求項7所述的拾取裝置，其中所述通氣部以能夠從另一正交的所述導引部側抽吸氣體的方式設置。The pickup device according to claim 7, wherein the ventilation part is provided in a manner capable of sucking gas from another orthogonal side of the guide part. 如請求項1所述的拾取裝置，其特徵在於，所述拾取筒夾以能夠經由導引用的所述多孔質構件從至少其中一正交的所述導引部噴出氣體的方式設置。The pickup device according to claim 1, wherein the pickup collet is disposed in such a manner that gas can be ejected from at least one of the orthogonal guide portions via the porous member of the guide. 如請求項1所述的拾取裝置，其特徵在於，具有筒夾移動機構，所述筒夾移動機構使所述拾取筒夾接近貼附有所述電子零件的片材中能夠抽吸保持所述電子零件的位置，能夠將所抽吸保持的所述電子零件從所述片材剝離並予以移送。The pick-up device according to claim 1, further comprising a collet moving mechanism capable of sucking and holding the pick-up collet close to the sheet to which the electronic component is attached. The position of the electronic component allows the suctioned and held electronic component to be peeled off from the sheet and transferred. 如請求項1所述的拾取裝置，其特徵在於，具有控制裝置， 所述控制裝置 使所述拾取筒夾抽吸保持所述電子零件， 使所述角度變更部變更抽吸保持有所述電子零件的所述拾取筒夾的角度， 使所述旋轉部通過旋轉而使抽吸保持有所述電子零件的所述拾取筒夾反轉。 The pickup device according to claim 1, characterized in that it has a control device, The control device causing the pick-up collet to suction-hold the electronic part, causing the angle changing unit to change the angle at which the pickup collet holding the electronic component is sucked, The rotation part rotates to reverse the pickup collet holding the electronic component by suction. 一種安裝裝置，將電子零件安裝於基板，其特徵在於，具有： 如請求項1至請求項12中任一項所述的拾取裝置； 接合頭，以相對於所述拾取筒夾能夠相對移動的方式設置，從所述拾取筒夾接收所述電子零件；及 搭載裝置，將由所述接合頭保持的所述電子零件移送至所述基板並予以安裝。 A mounting device for mounting electronic components on a substrate, characterized by: The pickup device according to any one of claims 1 to 12; a bonding head, disposed movably relative to the pickup collet, and receiving the electronic component from the pickup collet; and A mounting device transfers the electronic component held by the bonding head to the substrate and mounts it.
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CN112397417A (en) * 2019-08-14 2021-02-23 普因特工程有限公司 Micro light-emitting diode transfer head

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