TWI821348B - Automatic optical detection system for measuring a hole-like structure - Google Patents
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Description
本發明係有關於一種自動光學檢測系統，特別是指一種量測孔狀結構的自動光學檢測系統。The present invention relates to an automatic optical detection system, in particular to an automatic optical detection system for measuring hole-like structures.
自動光學檢查(Automated Optical Inspection, AOI)，係運用機器視覺做為檢測標準技術，透過機器視覺取代傳統人眼辨識以達到高精密度及高效率的檢測，作為改良傳統上以人力使用光學儀器進行檢測的缺點，應用層面包括從高科技產業之研發、製造品管、國防、民生、醫療、環保、電力等領域。Automated Optical Inspection (AOI) uses machine vision as the standard inspection technology. It uses machine vision to replace traditional human eye recognition to achieve high-precision and efficient inspection. As an improvement, it is traditionally performed manually using optical instruments. The application level of detecting shortcomings includes research and development, manufacturing quality control, national defense, people's livelihood, medical care, environmental protection, electric power and other fields in high-tech industries.
在光學檢測領域中，複雜表面的檢測相對平滑表面較為困難，針對平面不可視的缺陷(例如盲孔、穿孔的內側壁面缺陷)，難以由傳統的光學方式(例如平面拍攝)進行檢測，這類的缺陷通常需要針對影像擷取裝置的相對位置及拍攝角度進行調整，且必須針對每一個目標區域逐一進行拍攝，以致於在進行這類的檢測時非常的耗時耗功，難以達到相應的效率。In the field of optical inspection, it is more difficult to detect complex surfaces than smooth surfaces. It is difficult to detect defects that are not visible on the plane (such as blind holes and inner wall defects of perforations) using traditional optical methods (such as plane shooting). Defects usually require adjustments to the relative position and shooting angle of the image capture device, and each target area must be photographed one by one, making this type of inspection very time-consuming and power-consuming, making it difficult to achieve corresponding efficiency.
本發明的主要目的，在於提供一種透過雙色效應量測孔狀結構的自動光學檢測系統，包括一光源裝置、一遠心鏡頭攝影機、以及一影像處理裝置。該光源裝置提供至一待測物的一孔狀結構，其中該孔狀結構包括一壁特性區域與一面特性區域。該遠心鏡頭攝影機朝向該孔狀結構，用以獲得孔狀結構的影像，其中該遠心鏡頭攝影機具有一收光錐角。該影像處理裝置根據該孔狀結構的影像的影像特徵差異，判斷該孔狀結構影像上的該壁特性區域與該面特性區域。The main purpose of the present invention is to provide an automatic optical inspection system for measuring hole-like structures through a two-color effect, which includes a light source device, a telecentric lens camera, and an image processing device. The light source device provides a hole-like structure to an object to be measured, wherein the hole-like structure includes a wall characteristic area and a surface characteristic area. The telecentric lens camera faces the hole-like structure to obtain an image of the hole-like structure, wherein the telecentric lens camera has a light collection cone angle. The image processing device determines the wall characteristic area and the surface characteristic area on the hole structure image based on the difference in image characteristics of the hole structure image.
本發明可以利用孔狀結構的面特性區域或壁特性區域的差異，透過調整鏡頭的數值孔徑，在影像上會產生不同的亮度差異，因此可以觀察出側壁與孔底/新生截面。This invention can make use of the difference in the surface characteristic area or wall characteristic area of the hole structure. By adjusting the numerical aperture of the lens, different brightness differences will be produced in the image, so the side wall and hole bottom/new cross-section can be observed.
本發明透過遠心鏡頭攝影機拍攝待測物孔狀結構的影像，用以獲得等倍率的孔狀結構的影像，避免拍攝孔狀結構時因距離不同產生的影像畸變的問題，降低演算的難度。This invention uses a telecentric lens camera to capture images of the hole-like structure of the object to be measured, so as to obtain images of the hole-like structure at equal magnifications, avoid image distortion problems caused by different distances when photographing the hole-like structure, and reduce the difficulty of calculations.
本發明透過遠心鏡頭攝影機拍攝待測物孔狀結構的影像時，可以解決待測物影像因視角因素導致的不對稱、以及待測物遠近造成放大倍率不一致的問題，藉此攝影機不管在左右上下拍攝都可以獲得一致的影像。When the present invention uses a telecentric lens camera to capture an image of the hole-like structure of the object to be measured, it can solve the problem of asymmetry in the image of the object to be measured due to viewing angle factors, as well as the inconsistency in magnification caused by the distance of the object to be measured. By doing this, the camera can be used regardless of whether it is left, right, up or down. You can get consistent images every time you shoot.
有關本發明之詳細說明及技術內容，現就配合圖式說明如下。再者，本發明中之圖式，為說明方便，其比例未必照實際比例繪製，該等圖式及其比例並非用以限制本發明之範圍，在此先行敘明。The detailed description and technical content of the present invention are described below with reference to the drawings. Furthermore, for the convenience of explanation, the proportions of the drawings in the present invention may not be drawn according to the actual proportions. The drawings and their proportions are not intended to limit the scope of the present invention and are explained here.
以下係舉一具體實施例就本發明的技術內容提出詳細的說明，請參閱「圖1」，為本發明中自動光學檢測系統的方塊示意圖。 The following is a detailed description of the technical content of the present invention using a specific embodiment. Please refer to "Figure 1", which is a block diagram of the automatic optical detection system in the present invention.
本實施例係提供一種自動光學檢測系統100，該自動光學檢測系統主要包括光源裝置10、遠心鏡頭攝影機20、以及影像處理裝置30。
This embodiment provides an automatic
所述的光源裝置10用以產生一光源，以提供至待測物P的孔狀結構H，其中該孔狀結構H包括至少一壁特性區域H1與至少一面特性區域H2(如圖4所示)。根據光源裝置10以及遠心鏡頭攝影機20的收光錐角/數值孔徑的配合，可以凸顯影像中壁特性區域H1與面特性區域H2之間的影像特徵差異。該面特性區域H2例如包含該孔狀結構H的一孔底區域及/或一新生截面區域。孔底區域為孔狀結構H中的底側平面，新生截面區域則為壁特性區域H1或面特性區域H2上各類瑕疵所造成與側壁結構不同的區域(例如不規則、或傾斜角度不同)。於一實施例中，該光源裝置10包含一提供至該孔狀結構H的具準直特性光源11及/或一具漫射特性光源22(如圖2~3所述)，於本發明中不予以限制。於一可行的實施態樣中，該孔狀結構可以為盲孔或通孔，於本發明中不予以限制。
The
所述的遠心鏡頭攝影機20朝向該孔狀結構H用以獲得孔狀結構H的影像。於一具體實施例中，該遠心鏡頭攝影機20係包括有一遠心鏡頭21(Telecentric lens)、以及一與該遠心鏡頭21連接之感光元件22。其中該遠心鏡頭21係影像擷取物件，並於於感光元件22上成像。於較佳實施例，包含但不限於，感光元件22為光電耦合元件(CCD)或互補金屬氧化物半導體(CMOS)等裝置。於一較佳實施態樣中，該待測物P包括印刷電路板，其中該遠心鏡頭攝影機20的收光錐角/數值孔徑係可由人員或系統調整。透過遠心鏡頭攝影機20解決待測物影像因視角因素導致的不對稱、以及待測物P遠近造成放大倍率不一致的問題，藉此讓攝影機不管在左右上下任何位置拍攝都可以獲得一致的影像，使實際圖像與預期圖像變化率縮減至最低，讓所拍攝到的圖像容易正規化。
The
該待測物P，包含但不限於可為具有一個或多個孔狀結構H的工件，例如可為具有多個盲孔或通孔的平面工件，於本發明中不予以限制。 The object P to be tested includes, but is not limited to, a workpiece having one or more hole-like structures H, such as a planar workpiece having multiple blind holes or through holes, which is not limited in the present invention.
所述的影像處理裝置30連接至該遠心鏡頭攝影機20，根據該孔狀結構H的影像的影像特徵差異，判斷該孔狀結構H影像上的該壁特性區域H1與該面特性區域H2。於一較佳實施例中，包含但不限於，該影像處理裝置30根據該影像特徵差異，判斷該孔狀結構H的影像上的該壁特性區域H1的面積與位置，以及該面特性區域H2的面積與位置，並依此產生一影像檢測結果。具體而言，該影像處理裝置30係可以載入儲存單元(圖未式)存取程式，並依據該程式執行影像分析的過程。具體而言，影像分析程式例如可以為影像前處理程式、影像分割與定位、缺陷偵測(梯度化、區域成長、成長補償等)、機器學習系統(Machine Learning)、深度學習系統(Deep Learning)等，於本發明中不予以限制。
The
於一較佳實施例中，包含但不限於，所述的影像特徵差異例如包括亮度特徵差異或/及色度特徵差異，該光源裝置10包含一具準直特性光源11及/或一具漫射特性光源12，透過提供不同特性的光源，於影像中可進一步產生亮度特徵差異，以區隔壁特性區域H1與面特性區域H2。於本案說明書中所謂的「具準直特性光源11」、「具漫射特性光源12」所指的是其光源的成分絕大部分具有準值性質或漫射性質的光源。於另一較佳實施例中，包含但不限於，該光源裝置10包含兩種或兩種以上具有不同光波長的光源(例如第一光源、一第二光源)。於影像中可進一步產生亮度特徵差異及色度特徵差異區隔壁特性區域H1與面特性區域H2。除上述的方式外，亦可以同時混合搭配不同特性及不同光波長的光源，進一步提升孔狀結構H的壁特性區域H1與面特性區域H2的影像特徵差異，於本發明中不予以限制。
In a preferred embodiment, including but not limited to, the image characteristic differences include, for example, brightness characteristic differences and/or chromaticity characteristic differences. The
所測量到的影像檢測結果包括孔口形狀檢測、孔底品質檢測、孔壁品質檢測、或孔底與孔壁連接處品質檢測，判斷該孔狀結構H是否出現該新 生截面區域、或判斷該新生截面區域的高度等。 The measured image inspection results include orifice shape inspection, hole bottom quality inspection, hole wall quality inspection, or hole bottom and hole wall connection quality inspection, to determine whether the new hole structure H appears. Create a new cross-section area, or determine the height of the new cross-section area, etc.
於一實施例中，請參閱「圖2」，係本發明第一實施例的外觀示意圖，如圖所示：該具準直特性光源11包括一發光單元111以及一分光鏡112，該發光單元111輸出準直光，該分光鏡112係設置於遠心鏡頭攝影機20的取像方向上，並具有一傾斜角(通常為45度角)，以令該發光單元111送出的平行光轉折90度而與遠心鏡頭攝影機20同軸，該分光鏡112供部分光束穿過以令該遠心鏡頭攝影機20獲得孔狀結構H的影像。
In one embodiment, please refer to "Figure 2", which is a schematic diagram of the appearance of the first embodiment of the present invention. As shown in the figure: the
具體而言，該具漫射特性光源12包括一個或多個發光單元121以及一燈罩122。該燈罩122設置於該發光單元121外側，其中為了輸出均光源至該孔狀結構H，該燈罩122的反射面具有漫反射結構或漫反射材料，用以提供該漫射光線至該孔狀結構H。於一較佳實施例中，包含但不限於，該燈罩122係為穹形燈罩，該穹形燈罩的反射面係具有漫反射結構或為漫反射材料，該發光單元121的光入射至該穹形燈罩後，經由該穹形燈罩反射至該孔狀結構H上。該漫反射結構例如可以為不均勻微結構，該漫反射材料例如可以為光擴散粉、擴散塑膠粒等等，於本發明中不予以限制。為了避免發光單元121直接照射至待測物P，該發光單元121係環設至該穹形燈罩外周緣朝向內側(反射面)的位置上。
Specifically, the
於另一實施例中，請一併參閱「圖3」，係本發明第二實施例的外觀示意圖，如圖所示：該燈罩122除了可以為穹形燈罩外，亦可以經由其他的均等裝置取代。例如於一較佳實施例中，包含但不限於，該燈罩122亦可以為設置於該發光單元124外側的傾斜均光罩123，該傾斜均光罩123於發光單元124的出光面上係設置有均光板，並於該均光板上具有傾斜面，同樣亦可達到相同的均光效果。
In another embodiment, please also refer to "Fig. 3", which is a schematic diagram of the appearance of the second embodiment of the present invention. As shown in the figure: in addition to the dome-shaped lampshade, the
為了在影像處理中，凸顯孔狀結構H中壁特性區域H1與面特性區域H2之間的影像特徵差異，藉以進一步分離影像並凸顯缺陷，該準直光線與
該漫射光線的光波長不同。於一較佳實施例中，包含但不限於，例如底面及側壁的材料均為銅，此時該準直光線較佳可以為藍色光，該漫射光線較佳係可以為紅色光。在兩種光源的混光下，孔狀結構H的壁特性區域H1、面特性區域H2將分別由不同波長的光所凸顯而產生明顯的邊界(如圖3所示)，影像處理裝置30可較容易擷取出影像中的缺陷。於一較佳實施例中，包含但不限於，該準直光線及漫射光線於波長上差距，包含但不限於，超過100nm以上，但實際上該波長的差距應視材料與實際應用而定。
In order to highlight the difference in image characteristics between the wall characteristic area H1 and the surface characteristic area H2 in the hole-like structure H during image processing, so as to further separate the image and highlight defects, the collimated light and
The diffuse light has different light wavelengths. In a preferred embodiment, including but not limited to, for example, the materials of the bottom surface and side walls are copper. In this case, the collimated light is preferably blue light, and the diffuse light is preferably red light. Under the mixed light of the two light sources, the wall characteristic area H1 and the surface characteristic area H2 of the hole-shaped structure H will be highlighted by light of different wavelengths to produce obvious boundaries (as shown in Figure 3). The
於一較佳實施例中，包含但不限於，透過以下的光源進行搭配，均可以有效的加強影像差異特徵，進一步於影像中區隔孔狀結構H的壁特性區域H1與面特性區域H2，以下表列示之：
請先一併參閱「圖4」至「圖7」，係為於一實施例，待測物孔狀結構的影像示意圖(一)、影像示意圖(二)、影像示意圖(三)、以及影像示意圖(四)，如圖所示： Please refer to "Figure 4" to "Figure 7" together, which are schematic images (1), schematic images (2), schematic images (3), and schematic images of the pore structure of the object to be tested in one embodiment. (4), as shown in the figure:
如圖4所示，待測物為一電路板上的孔狀結構H，其可能因為電鍍不均而產生新生截面區域，造成孔洞的內側斷路。如圖4所示，可以看出當面特性區域H2(孔底區域)的範圍到達預設面積時，新生截面區域H3儼然已造成斷路，確認是否產生新生截面區域H3，可以透過測量孔底區域的面特性區域H2直徑，或是以疊圖影像處理將拍到的影像與良品的影像重疊後取得新生截面區域H3。As shown in Figure 4, the object to be tested is a hole-shaped structure H on a circuit board, which may produce a new cross-sectional area due to uneven plating, causing an open circuit inside the hole. As shown in Figure 4, it can be seen that when the range of the surface characteristic area H2 (the hole bottom area) reaches the preset area, the new cross-section area H3 seems to have caused an open circuit. To confirm whether the new cross-section area H3 is generated, you can measure the area at the bottom of the hole. The diameter of the surface characteristic area H2, or the new cross-sectional area H3 is obtained by overlapping the captured image with the image of the good product through overlay image processing.
另一種情況如圖5所示，孔狀結構H除了於孔底區域形成新生截面區域H3之外，缺陷亦可能形成於壁特性區域H1上而產生新生截面區域H4。新生截面區域H4由於與壁特性區域H1的角度不同，於影像中兩者具有差異特徵影像。In another situation, as shown in Figure 5, in addition to forming a new cross-sectional area H3 in the hole bottom area, defects may also be formed in the wall characteristic area H1 to generate a new cross-sectional area H4 in the hole-like structure H. Due to the different angles between the new cross-section area H4 and the wall characteristic area H1, the two have different characteristic images in the image.
又一種情況如圖6所示，如果新生截面區域H5僅形成於面特性區域H2的一側，而使得面特性區域H2為單側橢圓時，可判斷缺陷僅存在於一側的孔壁。是否構成斷路與新生截面區域的高度之間有正相關性，意即少鍍了多少銅的厚度，因此經由缺陷的高度，可預先確認斷路的可能性。In another situation, as shown in Figure 6, if the new cross-sectional area H5 is formed only on one side of the surface characteristic area H2, and the surface characteristic area H2 is a one-sided ellipse, it can be judged that the defect only exists on one side of the hole wall. There is a positive correlation between whether a break is formed and the height of the new cross-section area, which means how much copper thickness is missing. Therefore, the possibility of a break can be confirmed in advance through the height of the defect.
又一種情況如圖7所示，於孔狀結構H為通孔的情況下，可以看出於通孔底側的周圍將長出新生截面區域H6，可以透過與壁特性區域H1的影像差異特徵(例如預設面積或直徑等)確認斷路的可能性。Another situation is shown in Figure 7. When the hole structure H is a through hole, it can be seen that a new cross-sectional area H6 will grow around the bottom side of the through hole, and the image difference characteristics with the wall characteristic area H1 can be seen through (such as preset area or diameter, etc.) to confirm the possibility of circuit breakage.
有關於缺陷高度的取得方式，請一併參閱「圖8」，係為孔狀結構的局部放大示意圖。Regarding how to obtain the defect height, please also refer to "Figure 8", which is a partially enlarged schematic diagram of the hole-like structure.
為了計算取得缺陷於實際空間中的高度，取像視角及影像中孔壁的傾斜度必須一併考量修正，始能透過影像中缺陷的長度經由計算後獲得正確的高度。In order to calculate the height of the defect in the actual space, the imaging angle and the inclination of the hole wall in the image must be considered and corrected together, so that the correct height can be obtained through calculation of the length of the defect in the image.
就已知的條件中，孔內側壁的傾斜角度是固定的(預期是固定的)，在拍攝影像後經由計算可獲得影像中新生截面區域的長度。由於遠心鏡頭所拍攝到的影像可以省略經由攝影機視角所產生的視角因素。因此於運算起始，吾人可以預期先得到二組參數：孔壁傾斜角度、以及孔壁與孔底之間的新生截面區域長度。Under the known conditions, the inclination angle of the inner wall of the hole is fixed (expected to be fixed), and the length of the new cross-sectional area in the image can be obtained by calculation after taking the image. Because the image captured by the telecentric lens can omit the perspective factor caused by the camera's perspective. Therefore, at the beginning of the operation, we can expect to obtain two sets of parameters: the hole wall inclination angle , and the length of the new cross-sectional area between the hole wall and the hole bottom .
由於在計算初始時，孔壁傾斜角度是確定的，經由三角函數轉換的關係，可以確定新生截面區域長度將與新生截面區域高度呈現固定的三角比例關係，符合下列的簡式：；Since in the initial calculation, the hole wall inclination angle is determined. Through the relationship of trigonometric function conversion, the length of the new cross-section area can be determined. will be the same as the height of the new section area It presents a fixed triangular proportion relationship and conforms to the following simplified formula: ;
新生截面區域高度，經由孔壁傾斜角度、以及新生截面區域長度兩組參數便可以簡單獲得，簡式轉換如下：；New section area height , via the inclination angle of the hole wall , and the length of the new cross-section area Two sets of parameters can be easily obtained, and the simplified conversion is as follows: ;
在上述方程式中，將可以獲得新生截面區域高度GPH，經由新生截面區域高度GPH可以預先確認斷路的可能性。In the above equation, the new cross-sectional area height GPH will be obtained, and the possibility of circuit breakage can be confirmed in advance through the new cross-sectional area height GPH.
除了獲得新生截面區域高度GPH外，於另一實施例中，經由影像分析的結果，該影像檢測結果可以更進一步包括孔壁缺陷寬度、以及鍍金不連續尺寸等。In addition to obtaining the height GPH of the new cross-sectional area, in another embodiment, through the results of image analysis, the image detection results can further include the width of hole wall defects, the size of gold plating discontinuities, etc.
該影像處理裝置30除了可以依據上述的方式獲得該新生截面區域高度GPH外，如圖4-7所示，尚可以獲得例如包括新生截面區域總體寬度GPW或新生截面區域總體長度GPL、該壁特性區域的面積H1A與位置，以及該面特性區域的面積H2A與位置等。In addition to obtaining the new cross-sectional area height GPH according to the above method, as shown in Figures 4-7, the
綜上所述，本發明利用孔狀結構的面特性區域或壁特性區域的差異，根據攝影機鏡頭的收光錐角/數值孔徑的調整，在影像上會產生不同的亮度差異，因此可以觀察出側壁與孔底/新生截面。To sum up, the present invention uses the difference in the surface characteristic area or wall characteristic area of the hole structure to produce different brightness differences in the image according to the adjustment of the light collection cone angle/numerical aperture of the camera lens, so it can be observed Side wall and hole bottom/new section.
以上已將本發明做一詳細說明，惟以上所述者，僅為本發明之一實施例而已，當不能以此限定本發明實施之範圍，即凡依本發明申請專利範圍所作之均等變化與修飾，皆應仍屬本發明之專利涵蓋範圍內。The present invention has been described in detail above. However, the above description is only an embodiment of the present invention. It should not be used to limit the scope of the present invention. That is, any equal changes made according to the scope of the patent application of the present invention and Modifications should still fall within the scope of the patent of the present invention.
100:自動光學檢測系統 10:光源裝置 11:具準直特性光源 111:發光單元 112:分光鏡 12:具漫射特性光源 121:發光單元 122:燈罩 123:傾斜均光罩 124:發光單元 20:遠心鏡頭攝影機 21:遠心鏡頭 22:感光元件 30:影像處理裝置 P:待測物 H:孔狀結構 H1:壁特性區域 H1A:壁特性區域的面積 H2:面特性區域 H2A:面特性區域的面積 H3:新生截面區域 H4:新生截面區域 H5:新生截面區域 H6:新生截面區域:孔壁傾斜角度:新生截面區域長度:新生截面區域高度 GPW:新生截面區域總體寬度 GPL:新生截面區域總體長度100: Automatic optical detection system 10: Light source device 11: Light source with collimation characteristics 111: Light-emitting unit 112: Beam splitter 12: Light source with diffusion characteristics 121: Light-emitting unit 122: Lampshade 123: Inclined uniform light cover 124: Light-emitting unit 20 : Telecentric lens camera 21: Telecentric lens 22: Photosensitive element 30: Image processing device P: Object to be measured H: Hole structure H1: Wall characteristic area H1A: Area of wall characteristic area H2: Surface characteristic area H2A: Surface characteristic area Area H3: New cross-section area H4: New cross-section area H5: New cross-section area H6: New cross-section area :hole wall inclination angle :Length of new section area :height of new cross-section area GPW:overall width of new cross-section areaGPL:overall length of new cross-section area
圖1，為本發明中自動光學檢測系統的方塊示意圖。Figure 1 is a block diagram of the automatic optical detection system in the present invention.
圖2，為本發明中第一實施例的外觀示意圖。Figure 2 is a schematic diagram of the appearance of the first embodiment of the present invention.
圖3，為本發明中第二實施例的外觀示意圖。Figure 3 is a schematic diagram of the appearance of the second embodiment of the present invention.
圖4，為待測物孔狀結構的影像示意圖(一)。Figure 4 is a schematic image of the pore structure of the object to be tested (1).
圖5，為待測物孔狀結構的影像示意圖(二)。Figure 5 is a schematic image (2) of the pore structure of the object to be tested.
圖6，為待測物孔狀結構的影像示意圖(三)。Figure 6 is a schematic image (3) of the pore structure of the object to be tested.
圖7，為待測物孔狀結構的影像示意圖(四)。Figure 7 is a schematic image (4) of the pore structure of the object to be tested.
圖8，為孔狀結構的局部放大示意圖。Figure 8 is a partial enlarged schematic diagram of the hole-like structure.
100:自動光學檢測系統 100:Automatic optical inspection system
10:光源裝置 10:Light source device
20:遠心鏡頭攝影機 20:Telecentric lens camera
21:遠心鏡頭 21: Telecentric lens
22:感光元件 22: Photosensitive element
30:影像處理裝置 30:Image processing device
P:待測物 P: Test object
H:孔狀結構 H: Porous structure
Claims (16)
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| TW108127400A TWI821348B (en) | 2019-08-01 | 2019-08-01 | Automatic optical detection system for measuring a hole-like structure |
| CN202010042222.5A CN111521614B (en) | 2019-02-01 | 2020-01-15 | Automatic optical detection system for measuring hole-shaped structure |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0459489A2 (en) * | 1990-05-30 | 1991-12-04 | Dainippon Screen Mfg. Co., Ltd. | Method of reading optical image of inspected surface and image reading system employable therein |
| US6486965B1 (en) * | 1999-05-25 | 2002-11-26 | Hyundai Electronics Industries Co., Ltd. | Apparatus for measuring depth and gradient of trench in semiconductor device and method thereof |
| US6697154B2 (en) * | 1999-05-14 | 2004-02-24 | Mv Research Limited | Microvia inspection system |
| JP2007127486A (en) * | 2005-11-02 | 2007-05-24 | Cabin Industrial Co Ltd | Through hole wall surface defect inspection device of printed board |
| US8699037B2 (en) * | 2010-10-15 | 2014-04-15 | Rolls-Royce Plc | Hole inspection |
| CN102892223B (en) * | 2011-07-21 | 2016-08-17 | 罗姆股份有限公司 | Illuminator |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0459489A2 (en) * | 1990-05-30 | 1991-12-04 | Dainippon Screen Mfg. Co., Ltd. | Method of reading optical image of inspected surface and image reading system employable therein |
| US6697154B2 (en) * | 1999-05-14 | 2004-02-24 | Mv Research Limited | Microvia inspection system |
| US6486965B1 (en) * | 1999-05-25 | 2002-11-26 | Hyundai Electronics Industries Co., Ltd. | Apparatus for measuring depth and gradient of trench in semiconductor device and method thereof |
| JP2007127486A (en) * | 2005-11-02 | 2007-05-24 | Cabin Industrial Co Ltd | Through hole wall surface defect inspection device of printed board |
| US8699037B2 (en) * | 2010-10-15 | 2014-04-15 | Rolls-Royce Plc | Hole inspection |
| CN102892223B (en) * | 2011-07-21 | 2016-08-17 | 罗姆股份有限公司 | Illuminator |
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