TWI820052B - Wireless device - Google Patents
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- 239000002184 metal Substances 0.000 claims abstract description 160
- 239000004020 conductor Substances 0.000 claims description 51
- 238000004891 communication Methods 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 34
- 239000000758 substrate Substances 0.000 description 15
- 238000000926 separation method Methods 0.000 description 12
- 238000013461 design Methods 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002707 nanocrystalline material Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
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Abstract
Description
本揭露係關於一種無線裝置，特別係關於一種具有兩層金屬導線之無線裝置。The present disclosure relates to a wireless device, and in particular to a wireless device having two layers of metal wires.
隨著科技的發展，現今許多電子裝置（例如平板電腦或智慧型手機）皆具有無線充電的功能。使用者可以將電子裝置放置在一無線充電發射端上，以使電子裝置中的無線充電接收端利用電磁感應方式或電磁共振方式產生電流來對電池進行充電。由於無線充電的便利性，使得具有無線充電模組的電子裝置也逐漸受到大眾的喜愛。With the development of technology, many electronic devices (such as tablets or smartphones) now have wireless charging capabilities. The user can place the electronic device on a wireless charging transmitter, so that the wireless charging receiver in the electronic device uses electromagnetic induction or electromagnetic resonance to generate current to charge the battery. Due to the convenience of wireless charging, electronic devices with wireless charging modules are gradually becoming popular among the public.
一般而言，無線充電裝置都會包括一個導磁性基板，承載一線圈。其中，當線圈通電而操作於一無線充電模式或者是一無線通訊模式時，導磁性基板可以使得線圈發出的磁力線更為集中，以獲得更好的效能。然而，現有的線圈的繞線方式並無法滿足對於無線裝置的各種要求，例如需要更好的充電、通訊效能與更小的厚度。Generally speaking, a wireless charging device will include a magnetically conductive substrate carrying a coil. Among them, when the coil is energized and operated in a wireless charging mode or a wireless communication mode, the magnetic conductive substrate can make the magnetic lines of force emitted by the coil more concentrated to obtain better performance. However, existing coil winding methods cannot meet various requirements for wireless devices, such as better charging, communication performance and smaller thickness.
因此，如何設計出可滿足使用者各種需求的無線裝置，便是現今值得探討與解決之課題。Therefore, how to design a wireless device that can meet the various needs of users is a topic worthy of discussion and solution today.
有鑑於此，本揭露提出一種無線裝置，以解決上述之問題。In view of this, the present disclosure proposes a wireless device to solve the above problems.
本揭露提供了一種無線裝置，包括一第一線圈以及至少一導通組件。第一線圈包括一第一金屬導線以及一第二金屬導線，第一金屬導線是設置於一第一平面，具有一第一螺旋結構。第二金屬導線是設置於一第二平面，具有一第二螺旋結構，且第二金屬導線是電性連接第一金屬導線。導通組件具有至少一金屬連接件，其中導通組件設置於第一螺旋結構與第二螺旋結構之最內圈。The present disclosure provides a wireless device, including a first coil and at least one conductive component. The first coil includes a first metal conductor and a second metal conductor. The first metal conductor is disposed on a first plane and has a first spiral structure. The second metal conductor is disposed on a second plane, has a second spiral structure, and is electrically connected to the first metal conductor. The conductive component has at least one metal connecting piece, wherein the conductive component is disposed on the innermost ring of the first spiral structure and the second spiral structure.
根據本揭露一些實施例，無線裝置更包括至少三個導通組件，設置於第一螺旋結構以及第二螺旋結構之倒數第二圈。According to some embodiments of the present disclosure, the wireless device further includes at least three conductive components disposed on the penultimate turn of the first spiral structure and the second spiral structure.
根據本揭露一些實施例，在同一個導通組件中的這些金屬連接件之間的距離大致上相等。According to some embodiments of the present disclosure, the distances between the metal connectors in the same conductive component are substantially equal.
根據本揭露一些實施例，無線裝置更包括一第一連接件，分離於第二螺旋結構。According to some embodiments of the present disclosure, the wireless device further includes a first connecting member separated from the second spiral structure.
根據本揭露一些實施例，第一金屬導線更包括一分離導線，並且分離導線係分離於第一螺旋結構。According to some embodiments of the present disclosure, the first metal conductor further includes a separation conductor, and the separation conductor is separated from the first spiral structure.
根據本揭露一些實施例，分離導線具有一長條形結構，第一螺旋結構之最內圈具有一末端段，並且末端段的延伸方向不同於分離導線之延伸方向。According to some embodiments of the present disclosure, the separation conductor has a long strip structure, the innermost ring of the first spiral structure has an end section, and the extension direction of the end section is different from the extension direction of the separation conductor.
根據本揭露一些實施例，第一螺旋結構係依序經由第二螺旋結構、分離導線耦接於第一連接件。According to some embodiments of the present disclosure, the first spiral structure is coupled to the first connector through the second spiral structure and the separate wire in sequence.
根據本揭露一些實施例，第一連接件之長度大於第二螺旋結構中每一圈寬度之總和。According to some embodiments of the present disclosure, the length of the first connecting member is greater than the sum of the widths of each turn in the second spiral structure.
根據本揭露一些實施例，第二金屬導線包括複數個直線區段與複數個彎曲區段，第一連接件截斷這些彎曲區段之一部分。According to some embodiments of the present disclosure, the second metal conductor includes a plurality of straight sections and a plurality of curved sections, and the first connector cuts off part of the curved sections.
根據本揭露一些實施例，由垂直於第一平面之一方向觀看時，第一連接件與第一螺旋結構之末端形成一中空區域。According to some embodiments of the present disclosure, when viewed from a direction perpendicular to the first plane, the first connecting member and the end of the first spiral structure form a hollow area.
根據本揭露一些實施例，無線裝置更包括一第一連接件，並且第一連接件未截斷第二螺旋結構之一部分。According to some embodiments of the present disclosure, the wireless device further includes a first connecting member, and the first connecting member does not cut off a part of the second spiral structure.
根據本揭露一些實施例，第一連接件未截斷第二螺旋結構之最內圈。According to some embodiments of the present disclosure, the first connecting member does not cut off the innermost ring of the second helical structure.
根據本揭露一些實施例，第一螺旋結構之最內圈的寬度較第一螺旋結構之最外圈的寬度窄。According to some embodiments of the present disclosure, the width of the innermost ring of the first helical structure is narrower than the width of the outermost ring of the first helical structure.
根據本揭露一些實施例，第一螺旋結構具有一中間圈，設置於最內圈以及最外圈之間，其中在中間圈上形成有一第一狹縫，第一狹縫將中間圈分割為一左半部以及一右半部，並且左半部或右半部之寬度小於第一螺旋結構之最內圈的寬度。According to some embodiments of the present disclosure, the first spiral structure has a middle ring disposed between the innermost ring and the outermost ring, wherein a first slit is formed on the middle ring, and the first slit divides the middle ring into A left half and a right half, and the width of the left half or the right half is smaller than the width of the innermost ring of the first spiral structure.
根據本揭露一些實施例，第一螺旋結構由內朝外的每一圈的寬度為漸增。According to some embodiments of the present disclosure, the width of each turn of the first spiral structure gradually increases from the inside to the outside.
根據本揭露一些實施例，第一螺旋結構包括複數個直線區段以及複數個彎曲區段，每一彎曲區段之寬度大於與其相連之直線區段之寬度。According to some embodiments of the present disclosure, the first spiral structure includes a plurality of straight sections and a plurality of curved sections, and the width of each curved section is greater than the width of the straight section connected to it.
根據本揭露一些實施例，第一金屬導線形成有複數個狹縫，分別形成於這些彎曲區段上。According to some embodiments of the present disclosure, the first metal wire is formed with a plurality of slits, respectively formed on the curved sections.
根據本揭露一些實施例，無線裝置更包括一電性連接部，連接於第一螺旋結構之最內圈的末端。According to some embodiments of the present disclosure, the wireless device further includes an electrical connection portion connected to an end of the innermost ring of the first spiral structure.
根據本揭露一些實施例，無線裝置更包括一第一連接件，連接於第二螺旋結構之倒數第二圈；以及一電性連接部，連接於第二螺旋結構之倒數第一圈。According to some embodiments of the present disclosure, the wireless device further includes a first connecting member connected to the penultimate turn of the second spiral structure; and an electrical connection part connected to the penultimate turn of the second spiral structure.
根據本揭露一些實施例，無線裝置更包括一第一連接件，連接於第二螺旋結構之倒數第二圈，並且由垂直於第一平面之一方向觀看時，第一螺旋結構之最內圈與第二螺旋結構之倒數第二圈部分不重疊。According to some embodiments of the present disclosure, the wireless device further includes a first connecting member connected to the penultimate turn of the second spiral structure, and when viewed from a direction perpendicular to the first plane, the innermost turn of the first spiral structure It does not overlap with the penultimate turn of the second spiral structure.
根據本揭露一些實施例，無線裝置更包括一第二線圈，並且第二線圈包括一第三金屬導線，設置於第一平面且環繞第一金屬導線；以及一第四金屬導線，設置於第二平面且環繞第二金屬導線。第一線圈操作在一近場通訊頻帶，並且第二線圈操作為電力傳輸之一發射端或一接收端。According to some embodiments of the present disclosure, the wireless device further includes a second coil, and the second coil includes a third metal wire disposed on the first plane and surrounding the first metal wire; and a fourth metal wire disposed on the second planar and surrounding the second metal conductor. The first coil operates in a near field communication frequency band, and the second coil operates as a transmitting end or a receiving end of power transmission.
本揭露提供一種無線裝置，包括一線圈單元。在一些實施例中，線圈單元可包括一第一線圈，第一線圈可進一步包括第一金屬導線以及第二金屬導線，第二金屬導線是藉由至少一導通組件電性連接於第一金屬導線，並且導通組件可以設置於第一金屬導線以及第二金屬導線的最內圈，使線圈單元的電流密度可以更均勻的分布，使電流不易集中於特定部分而產生不必要的熱能，進而提升整體效率。The present disclosure provides a wireless device including a coil unit. In some embodiments, the coil unit may include a first coil. The first coil may further include a first metal wire and a second metal wire. The second metal wire is electrically connected to the first metal wire through at least one conductive component. , and the conductive component can be arranged on the innermost ring of the first metal wire and the second metal wire, so that the current density of the coil unit can be more evenly distributed, so that the current is not easy to concentrate on specific parts and generate unnecessary heat energy, thereby improving the overall efficiency.
另外，在一些實施例中，線圈單元可更包括一第二線圈，其中第一線圈是可操作在一近場通訊（NFC）頻帶，並且第二線圈是可操作為電力傳輸之一發射端或一接收端，以執行無線充電的功能。因此可以使得無線裝置同時進行無線通訊以及無線充電的功能。In addition, in some embodiments, the coil unit may further include a second coil, wherein the first coil is operable in a near field communication (NFC) frequency band, and the second coil is operable as a transmitter for power transmission or A receiving end to perform the wireless charging function. Therefore, the wireless device can perform wireless communication and wireless charging functions at the same time.
為了讓本揭露之目的、特徵、及優點能更明顯易懂，下文特舉實施例，並配合所附圖示做詳細說明。其中，實施例中的各元件之配置係為說明之用，並非用以限制本揭露。且實施例中圖式標號之部分重複，係為了簡化說明，並非意指不同實施例之間的關聯性。以下實施例中所提到的方向用語，例如：上、下、左、右、前或後等，僅是參考附加圖式的方向。因此，使用的方向用語是用來說明並非用來限制本揭露。In order to make the purpose, features, and advantages of the present disclosure more obvious and understandable, embodiments are given below and explained in detail with the accompanying figures. The configuration of each component in the embodiment is for illustrative purposes and is not intended to limit the disclosure. In addition, the partial repetition of numbers in the figures in the embodiments is for simplifying the description and does not imply the correlation between different embodiments. Directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only for reference to the directions in the attached drawings. Accordingly, the directional terms used are intended to illustrate and not to limit the disclosure.
必需了解的是，為特別描述或圖示之元件可以此技術人士所熟知之各種形式存在。此外，當某層在其它層或基板「上」時，有可能是指「直接」在其它層或基板上，或指某層在其它層或基板上，或指其它層或基板之間夾設其它層。It is to be understood that elements specifically described or illustrated may exist in a variety of forms known to those skilled in the art. In addition, when a layer is "on" other layers or substrates, it may mean "directly" on other layers or substrates, or it may mean that a layer is on other layers or substrates, or it may mean that it is sandwiched between other layers or substrates. other layers.
此外，實施例中可能使用相對性的用語，例如「較低」或「底部」及「較高」或「頂部」，以描述圖示的一個元件對於另一元件的相對關係。能理解的是，如果將圖示的裝置翻轉使其上下顛倒，則所敘述在「較低」側的元件將會成為在「較高」側的元件。In addition, relative terms, such as "lower" or "bottom" and "higher" or "top" may be used in the embodiments to describe the relative relationship of one element to another element in the figures. It will be understood that if the illustrated device was turned upside down, elements described as being on the "lower" side would become elements described as being on the "higher" side.
在此，「約」、「大約」之用語通常表示在一給定值或範圍的20%之內，較佳是10%之內，且更佳是5%之內。在此給定的數量為大約的數量，意即在沒有特定說明的情況下，仍可隱含「約」、「大約」之含義。Here, the terms "about" and "approximately" usually mean within 20% of a given value or range, preferably within 10%, and more preferably within 5%. The quantities given here are approximate quantities, which means that without specific explanation, the meaning of "approximately" or "approximately" can still be implied.
請參考第1圖，第1圖為根據本揭露一實施例之一無線裝置100之***圖。如第1圖所示，無線裝置100可包括一線圈單元102、一黏著層104、以及一導磁板106。於此實施例中，線圈單元102是設置於導磁板106上，並且線圈單元102是可利用黏著層104連接於導磁板106。其中，黏著層104可為膠帶或其他任何可用於連接之材料。Please refer to FIG. 1 , which is an exploded view of a wireless device 100 according to an embodiment of the present disclosure. As shown in FIG. 1 , the wireless device 100 may include a coil unit 102 , an adhesive layer 104 , and a magnetic conductive plate 106 . In this embodiment, the coil unit 102 is disposed on the magnetic conductive plate 106, and the coil unit 102 can be connected to the magnetic conductive plate 106 using the adhesive layer 104. The adhesive layer 104 can be tape or any other material that can be used for connection.
另外，於此實施例中，導磁板106可為一鐵氧體（Ferrite），但不限於此。舉例來說，於其他實施例中導磁板106也可包括奈米晶材料。導磁板106可具有一導磁率，對應於線圈單元102，使得線圈單元102的電磁波更為集中。In addition, in this embodiment, the magnetic conductive plate 106 can be a ferrite, but is not limited thereto. For example, in other embodiments, the magnetically conductive plate 106 may also include nanocrystalline materials. The magnetic permeable plate 106 may have a magnetic permeability corresponding to the coil unit 102, so that the electromagnetic waves of the coil unit 102 are more concentrated.
如第1圖所示，線圈單元102包括一基板108以及一線圈結構110，並且線圈結構110是形成於基板108上。於此實施例中，基板108是一軟性電路板，但不限於此，只要是任何可用於形成線圈結構110的基板皆符合本揭露之範疇。再者，線圈單元102可作為一充電線圈，用以對一外部電子裝置（例如平板電腦或智慧型手機）進行無線充電。As shown in FIG. 1 , the coil unit 102 includes a substrate 108 and a coil structure 110 , and the coil structure 110 is formed on the substrate 108 . In this embodiment, the substrate 108 is a flexible circuit board, but it is not limited thereto. Any substrate that can be used to form the coil structure 110 is within the scope of this disclosure. Furthermore, the coil unit 102 can be used as a charging coil to wirelessly charge an external electronic device (such as a tablet computer or a smart phone).
舉例來說，線圈單元102的線圈結構110可基於無線充電聯盟（Alliance for Wireless Power；A4WP）的標準作為一共振式充電線圈，但不限於此。另外，線圈結構110是可基於無線電力聯盟（Wireless Power Consortium，WPC）的標準，例如Qi標準，以作為一感應式充電線圈。因此，此實施方式可使無線裝置100能同時對應不同形式的充電方式，以增加可應用的範圍。舉例來說，在近距離（例如1cm以下）時，使用感應式操作；而在遠距離時，使用共振式操作。For example, the coil structure 110 of the coil unit 102 can be a resonant charging coil based on the Alliance for Wireless Power (A4WP) standard, but is not limited thereto. In addition, the coil structure 110 can be based on a Wireless Power Consortium (WPC) standard, such as the Qi standard, to serve as an inductive charging coil. Therefore, this implementation mode can enable the wireless device 100 to support different forms of charging methods at the same time, thereby increasing the applicable range. For example, at short distances (for example, less than 1cm), inductive operation is used; while at long distances, resonance operation is used.
接著請參考第2圖至第4圖，第2圖為根據本揭露一實施例之線圈單元102的上視示意圖，第3圖為根據本揭露一實施例之線圈單元102在一第一平面1021的上層結構的示意圖，並且第4圖為根據本揭露此實施例之線圈單元102在一第二平面1022的下層結構之示意圖。要注意的是，第4圖中線圈結構應位於第二平面1022的下方，但為了清楚說明的緣故，第4圖中的線圈結構仍以實線表示。Next, please refer to Figures 2 to 4. Figure 2 is a top view of the coil unit 102 according to an embodiment of the present disclosure. Figure 3 is a first plane 1021 of the coil unit 102 according to an embodiment of the present disclosure. , and FIG. 4 is a schematic diagram of the lower structure of the coil unit 102 in a second plane 1022 according to this embodiment of the present disclosure. It should be noted that the coil structure in Figure 4 should be located below the second plane 1022, but for the sake of clarity, the coil structure in Figure 4 is still represented by a solid line.
如第3圖與第4圖所示，線圈單元102的線圈結構110（第一線圈）可包括一第一金屬導線111以及一第二金屬導線112，第一金屬導線111是設置於第一平面1021上，並且第二金屬導線112是設置於第二平面1022上。如第3圖所示，線圈單元102具有一第一終端接點103以及一第二終端接點105，配置以電性連接於一外部電路，例如一控制晶片。As shown in FIGS. 3 and 4 , the coil structure 110 (first coil) of the coil unit 102 may include a first metal wire 111 and a second metal wire 112 . The first metal wire 111 is disposed on the first plane. 1021, and the second metal wire 112 is disposed on the second plane 1022. As shown in FIG. 3 , the coil unit 102 has a first terminal contact 103 and a second terminal contact 105 configured to be electrically connected to an external circuit, such as a control chip.
接著，如第3圖與第4圖所示，第一金屬導線111形成有一第一螺旋結構，而第二金屬導線112形成有一第二螺旋結構，大致上對應於第一螺旋結構的形狀與寬度。第一金屬導線111是配置以連接於第一終端接點103，第二金屬導線112是配置以電性連接於第二終端接點105，並且第二金屬導線112是配置以電性連接於第一金屬導線111。Next, as shown in FIGS. 3 and 4 , the first metal conductor 111 forms a first spiral structure, and the second metal conductor 112 forms a second spiral structure, substantially corresponding to the shape and width of the first spiral structure. . The first metal conductor 111 is configured to be connected to the first terminal contact 103, the second metal conductor 112 is configured to be electrically connected to the second terminal contact 105, and the second metal conductor 112 is configured to be electrically connected to the second terminal contact 103. A metal wire 111.
再者，線圈單元102可更包括一或多個導通組件，每一導通組件包括複數個金屬連接件MC（也可稱為導通孔，via），配置以貫穿基板108以連接第一金屬導線111以及第二金屬導線112。舉例來說，如第2圖至第4圖所示，線圈單元102具有一導通組件CA1以及一導通組件CA2，設置於第一、第二螺旋結構之最內圈，配置以連接第一金屬導線111以及第二金屬導線112。藉由設置多個金屬連接件MC，可以使線圈單元102的電流密度更均勻的分布，使電流不易集中於特定部分而產生不必要的熱能，進而提升整體效率。Furthermore, the coil unit 102 may further include one or more conductive components, each conductive component including a plurality of metal connectors MC (also called vias, via) configured to penetrate the substrate 108 to connect the first metal wire 111 and a second metal wire 112 . For example, as shown in Figures 2 to 4, the coil unit 102 has a conductive component CA1 and a conductive component CA2, which are disposed in the innermost circles of the first and second spiral structures and configured to connect the first metal wire. 111 and the second metal wire 112. By arranging multiple metal connectors MC, the current density of the coil unit 102 can be distributed more evenly, so that the current is less likely to be concentrated in specific parts and generate unnecessary heat energy, thereby improving the overall efficiency.
如第3圖所示，第一金屬導線111更包括一分離導線113，並且分離導線113是位於第一金屬導線111的第一螺旋結構內且分離於第一螺旋結構。再者，如第4圖所示，第二金屬導線112可包括複數個直線區段SS與複數個彎曲區段CS。於此實施例中，每一彎曲區段CS之寬度大於相連接之直線區段SS之寬度。舉例來說，如第3圖所示，最外側的直線區段SS具有一寬度W1，而與其連接之彎曲區段CS具有一寬度W2，並且寬度W2大於寬度W1。藉由這樣的結構設計，可以使線圈單元102的面積縮小，以達到無線裝置100微型化的目的。As shown in FIG. 3 , the first metal conductor 111 further includes a separation conductor 113 , and the separation conductor 113 is located in the first spiral structure of the first metal conductor 111 and is separated from the first spiral structure. Furthermore, as shown in FIG. 4 , the second metal wire 112 may include a plurality of straight sections SS and a plurality of curved sections CS. In this embodiment, the width of each curved section CS is greater than the width of the connected straight section SS. For example, as shown in Figure 3, the outermost straight section SS has a width W1, and the curved section CS connected thereto has a width W2, and the width W2 is greater than the width W1. Through such a structural design, the area of the coil unit 102 can be reduced to achieve the purpose of miniaturization of the wireless device 100 .
值得注意的是，如第2圖至第4圖所示，線圈單元102更包括一第一連接件114，第一連接件114是分離於前述第二螺旋結構，並且第一螺旋結構是依序經由導通組件CA1、第二螺旋結構、分離導線113、導通組件CA2而耦接於第一連接件114（其耦接的順序也可為相反）。It is worth noting that, as shown in Figures 2 to 4, the coil unit 102 further includes a first connecting member 114. The first connecting member 114 is separated from the aforementioned second spiral structure, and the first spiral structure is sequentially It is coupled to the first connector 114 via the conductive component CA1, the second spiral structure, the separation wire 113, and the conductive component CA2 (the order of coupling may also be reversed).
再者，如第4圖所示，第一連接件114具有一長度L1，而第二螺旋結構中每一圈的寬度之總和為WT（沿著第一連接件114的延伸方向），其中長度L1大於寬度總和WT，使得線圈結構110不易因製造時的誤差造成不良的問題（例如短路）。此外，於此實施例中，如第4圖所示，第一連接件114是由第二螺旋結構的內側延伸至第二螺旋結構的外側並截斷這些彎曲區段CS之一部分。Furthermore, as shown in Figure 4, the first connecting member 114 has a length L1, and the sum of the widths of each turn in the second spiral structure is WT (along the extending direction of the first connecting member 114), where the length L1 is larger than the total width WT, so that the coil structure 110 is less likely to cause problems (such as short circuit) due to manufacturing errors. In addition, in this embodiment, as shown in FIG. 4 , the first connecting member 114 extends from the inside of the second spiral structure to the outside of the second spiral structure and cuts off part of the curved sections CS.
另外，請參考第2圖與第5圖，第5圖為根據本揭露實施例之第2圖中線段A-A’之剖面示意圖。於此實施例中，如第2圖所示，線圈單元102可更包括多個導通組件，設置於第一連接件114之兩側。如第2圖與第5圖所示，導通組件CA3以及導通組件CA4可使第一金屬導線111的第一螺旋結構與第二金屬導線112的第二螺旋結構之一部分並聯，因此可以達到降低線圈單元102整體阻抗的效果，並且也可以增加線圈單元102的線圈結構110的圈數。In addition, please refer to Figures 2 and 5. Figure 5 is a schematic cross-sectional view of the line segment A-A' in Figure 2 according to an embodiment of the present disclosure. In this embodiment, as shown in FIG. 2 , the coil unit 102 may further include a plurality of conductive components disposed on both sides of the first connecting member 114 . As shown in Figures 2 and 5, the conductive component CA3 and the conductive component CA4 can connect part of the first spiral structure of the first metal conductor 111 and the second spiral structure of the second metal conductor 112 in parallel, so that the coil can be reduced. The effect of the overall impedance of the unit 102, and the number of turns of the coil structure 110 of the coil unit 102 can also be increased.
再者，如第2圖所示，每一導通組件所包括的多個金屬連接件MC是沿著第一金屬導線111的方向排列設置。舉例來說，導通組件CA3中的金屬連接件MC是兩兩沿著第一金屬導線111的延伸方向排列設置。Furthermore, as shown in FIG. 2 , each conductive component includes a plurality of metal connectors MC arranged in an array along the direction of the first metal conductor 111 . For example, the metal connectors MC in the conductive component CA3 are arranged in pairs along the extension direction of the first metal wire 111 .
接著請參考第6圖，第6圖為根據本揭露實施例之第2圖中的區域X的放大圖。如第6圖所示，第一螺旋結構具有一最內圈116、一第一中間圈118、一第二中間圈120以及一最外圈122。其中，最內圈116具有一寬度WA，最外圈122具有一寬度WX，並且最內圈116的寬度WA較最外圈122的寬度WX為窄。於本揭露的各個實施例中，可根據磁場強度對應地改變第一金屬導線111中不同圈的寬度。舉例來說，對應較強磁場時使用較窄的寬度，使得電阻值較高，因此可降低因渦電流造成的損耗。Next, please refer to Figure 6, which is an enlarged view of the area X in Figure 2 according to an embodiment of the present disclosure. As shown in FIG. 6 , the first spiral structure has an innermost ring 116 , a first middle ring 118 , a second middle ring 120 and an outermost ring 122 . The innermost ring 116 has a width WA, the outermost ring 122 has a width WX, and the width WA of the innermost ring 116 is narrower than the width WX of the outermost ring 122 . In various embodiments of the present disclosure, the widths of different turns in the first metal wire 111 can be changed accordingly according to the strength of the magnetic field. For example, using a narrower width when corresponding to a stronger magnetic field results in a higher resistance value, thus reducing losses due to eddy currents.
於此實施例中，第一金屬導線111的第一螺旋結構上可形成有複數個狹縫，分別是形成於彎曲區段CS上。具體而言，如第6圖所示，第一中間圈118與第二中間圈120是設置於最內圈116以及最外圈122之間，並且第二中間圈120上形成有一第一狹縫120S，且第一狹縫120S將第二中間圈120分割為一左半部1201以及一右半部1202。左半部1201及右半部1202分別具有一寬度WC，並且寬度WC是小於第一螺旋結構之最內圈116的寬度WA。In this embodiment, a plurality of slits may be formed on the first spiral structure of the first metal wire 111, respectively formed on the curved section CS. Specifically, as shown in Figure 6, the first intermediate ring 118 and the second intermediate ring 120 are disposed between the innermost ring 116 and the outermost ring 122, and a first slit is formed on the second intermediate ring 120. 120S, and the first slit 120S divides the second middle circle 120 into a left half 1201 and a right half 1202. The left half 1201 and the right half 1202 each have a width WC, and the width WC is smaller than the width WA of the innermost ring 116 of the first spiral structure.
再者，於此實施例中，第一螺旋結構由內朝外每一圈的寬度可為漸增。意即，寬度WA小於第一中間圈118的一寬度WB，寬度WB小於最外圈122的寬度WX，而寬度WC又小於寬度WA。基於此實施例的結構配置，可以降低渦電流的損耗並且也可以使電流密度更為平均。Furthermore, in this embodiment, the width of each turn of the first spiral structure may gradually increase from the inside to the outside. That is, the width WA is smaller than a width WB of the first middle ring 118 , the width WB is smaller than the width WX of the outermost ring 122 , and the width WC is smaller than the width WA. Based on the structural configuration of this embodiment, the loss of eddy current can be reduced and the current density can also be made more even.
另外，在本揭露的某些實施例中，如第2圖與第3圖所示，為了增加線圈單元102的整體強度，線圈單元102可更包括複數條擬似金屬導線，設置於第一平面1021。於此實施例中，線圈單元102包括複數個擬似金屬導線1023以及擬似金屬導線1024，並且擬似金屬導線1024是鄰近於第一終端接點103與第二終端接點105。其中，擬似金屬導線1023與擬似金屬導線1024是電性獨立於第一金屬導線111以及第二金屬導線112，並且多條擬似金屬導線1023與多條擬似金屬導線1024彼此皆電性獨立。In addition, in some embodiments of the present disclosure, as shown in FIGS. 2 and 3 , in order to increase the overall strength of the coil unit 102 , the coil unit 102 may further include a plurality of pseudo-metal wires disposed on the first plane 1021 . In this embodiment, the coil unit 102 includes a plurality of pseudo-metal wires 1023 and pseudo-metal wires 1024 , and the pseudo-metal wires 1024 are adjacent to the first terminal contact 103 and the second terminal contact 105 . The pseudo metal wires 1023 and 1024 are electrically independent of the first metal wire 111 and the second metal wire 112 , and the plurality of pseudo metal wires 1023 and the plurality of pseudo metal wires 1024 are electrically independent of each other.
藉由設置擬似金屬導線1023以及擬似金屬導線1024，可以使基板108局部的硬度上升，並且可利用此擬似金屬導線1023以及擬似金屬導線1024協助基板108的定位，以提升定位精度以及組裝的方便性。於此實施例中，擬似金屬導線1023以及擬似金屬導線1024是以線狀實現，但不限於此，例如也可於其他實施例中以圓形或矩形等形狀實現。By providing the pseudo-metal wire 1023 and the pseudo-metal wire 1024, the local hardness of the substrate 108 can be increased, and the pseudo-metal wire 1023 and the pseudo-metal wire 1024 can be used to assist in positioning the substrate 108 to improve positioning accuracy and ease of assembly. . In this embodiment, the pseudo metal wires 1023 and the pseudo metal wires 1024 are implemented in a linear shape, but are not limited thereto. For example, they may also be implemented in a circular or rectangular shape in other embodiments.
在第3圖中，線圈單元102可更包括一金屬區塊1025，設置於第一平面1021，以進一步增加線圈單元102的整體強度。再者，多條擬似金屬導線1024是環繞金屬區塊1025且與金屬區塊1025電性獨立。In FIG. 3 , the coil unit 102 may further include a metal block 1025 disposed on the first plane 1021 to further increase the overall strength of the coil unit 102 . Furthermore, a plurality of pseudo-metal wires 1024 surround the metal block 1025 and are electrically independent from the metal block 1025 .
再者，在本揭露的第4圖的實施例中，無線裝置100可更包括至少一電子元件50，設置於第二平面1022，電子元件50是配置以電性連接於兩個電性接點EC。電子元件50的設置位置是對應於設置在第一平面1021的金屬區塊1025以及部分的擬似金屬導線1024之位置。因此，與電子元件50焊接的電性接點EC在受到衝擊便不會輕易地損壞，進而提升無線裝置100的可靠性。Furthermore, in the embodiment of FIG. 4 of the present disclosure, the wireless device 100 may further include at least one electronic component 50 disposed on the second plane 1022. The electronic component 50 is configured to be electrically connected to two electrical contacts. EC. The electronic component 50 is disposed at a position corresponding to the metal block 1025 disposed on the first plane 1021 and a portion of the pseudo-metal wire 1024 . Therefore, the electrical contact EC soldered to the electronic component 50 will not be easily damaged when subjected to impact, thereby improving the reliability of the wireless device 100 .
請參考第7圖，第7圖為根據本揭露另一實施例之一線圈單元102A在第二平面1022之示意圖。線圈單元102A與第4圖的線圈單元102相似，差異在於此實施例之線圈單元102A包括至少有三個導通組件係設置於第一、第二螺旋結構之倒數第二圈，配置以電性連接於第一螺旋結構與第二螺旋結構。（第一螺旋結構與第3圖相同，故在此省略）。Please refer to FIG. 7 , which is a schematic diagram of a coil unit 102A on the second plane 1022 according to another embodiment of the present disclosure. The coil unit 102A is similar to the coil unit 102 in FIG. 4 . The difference is that the coil unit 102A in this embodiment includes at least three conductive components disposed on the penultimate turns of the first and second spiral structures and configured to be electrically connected to The first helical structure and the second helical structure. (The first helical structure is the same as that in Figure 3, so it is omitted here).
具體而言，於此實施例中，如第7圖所示，線圈單元102A包括兩個導通組件CA5、兩個導通組件CA6以及兩個導通組件CA7。其中，設置於最內圈的導通組件CA5可包括有五個金屬連接件MC，並且這些金屬連接件MC之間的距離大致上相等。另外，導通組件CA5、導通組件CA6與導通組件CA7是沿著第二金屬導線112的延伸方向上以等距離設置，因此可以提升線圈單元102A的結構強度，並且也可使電流密度更均勻。Specifically, in this embodiment, as shown in FIG. 7 , the coil unit 102A includes two conductive components CA5, two conductive components CA6, and two conductive components CA7. Among them, the conductive component CA5 disposed in the innermost ring may include five metal connectors MC, and the distances between these metal connectors MC are substantially equal. In addition, the conductive components CA5, CA6 and CA7 are arranged at equal distances along the extension direction of the second metal wire 112, so the structural strength of the coil unit 102A can be improved and the current density can be made more uniform.
藉由此實施例的結構設計，可以增加線圈單元102A的結構強度，並且也可以使得電流密度更均勻。Through the structural design of this embodiment, the structural strength of the coil unit 102A can be increased, and the current density can also be made more uniform.
請參考第8圖至第10圖，第8圖為根據本揭露另一實施例之無線裝置的一線圈單元202的上視示意圖，第9圖為根據本揭露實施例之線圈單元202在一第一平面2021的上層結構的示意圖，並且第10圖為根據本揭露此實施例之線圈單元202在一第二平面2022的下層結構之示意圖。於此實施例中，線圈單元202包括一第一金屬導線211以及一第二金屬導線212，分別設置於第一平面2021以及第二平面2022，並且第一金屬導線211以及第二金屬導線212分別形成一第一螺旋結構以及一第二螺旋結構。Please refer to Figures 8 to 10. Figure 8 is a top view of a coil unit 202 of a wireless device according to another embodiment of the present disclosure. Figure 9 is a schematic diagram of a coil unit 202 of a wireless device according to another embodiment of the present disclosure. A schematic diagram of the upper structure of a plane 2021, and FIG. 10 is a schematic diagram of the lower structure of the coil unit 202 according to this embodiment of the present disclosure. In this embodiment, the coil unit 202 includes a first metal wire 211 and a second metal wire 212, which are respectively disposed on the first plane 2021 and the second plane 2022, and the first metal wire 211 and the second metal wire 212 are respectively A first helical structure and a second helical structure are formed.
如第10圖所示，線圈單元202更包括一第一連接件214，分離於第二螺旋結構。再者，如第8圖所示，第一金屬導線211更包括一分離導線224，配置以藉由金屬連接件MC連接第一連接件214以及第二金屬導線212。於此實施例中，如第9圖所示，分離導線224具有一長條形結構，第一螺旋結構之最內圈具有一末端段2111，並且末端段2111的延伸方向不同於分離導線224的延伸方向。於此實施例中，末端段2111的延伸方向實質地垂直於分離導線224的延伸方向，但不限於此實施例。As shown in FIG. 10 , the coil unit 202 further includes a first connecting member 214 separated from the second spiral structure. Furthermore, as shown in FIG. 8 , the first metal conductor 211 further includes a separate conductor 224 configured to connect the first connector 214 and the second metal conductor 212 through the metal connector MC. In this embodiment, as shown in FIG. 9 , the separation wire 224 has a long strip structure. The innermost ring of the first spiral structure has an end section 2111 , and the extension direction of the end section 2111 is different from that of the separation wire 224 . extension direction. In this embodiment, the extension direction of the end section 2111 is substantially perpendicular to the extension direction of the separation wire 224, but it is not limited to this embodiment.
藉由末端段2111以及分離導線224分別往不同方向延伸的設計，可以增加線圈單元202與其他元件的接觸面積，進而提升散熱效果。另外，如第10圖所示，第二金屬導線212也可設置一非平行區段2121，使散熱效果進一步提升。再者，可藉由對應的電磁場強度來調整線圈之間之間隙大小，來最佳化線圈的工作效率。Through the design of the end section 2111 and the separated wire 224 extending in different directions, the contact area between the coil unit 202 and other components can be increased, thereby improving the heat dissipation effect. In addition, as shown in FIG. 10 , the second metal wire 212 can also be provided with a non-parallel section 2121 to further improve the heat dissipation effect. Furthermore, the working efficiency of the coils can be optimized by adjusting the gap size between the coils according to the corresponding electromagnetic field intensity.
請參考第11圖至第13圖，第11圖為根據本揭露另一實施例之無線裝置的一線圈單元202A的上視示意圖，第12圖為根據本揭露實施例之線圈單元202A在第一平面2021的上層結構的示意圖，並且第13圖為根據本揭露此實施例之線圈單元202A在第二平面2022的下層結構之示意圖。Please refer to Figures 11 to 13. Figure 11 is a schematic top view of a coil unit 202A of a wireless device according to another embodiment of the present disclosure. Figure 12 is a schematic diagram of the coil unit 202A of the first embodiment of the present disclosure. A schematic diagram of the upper structure of the plane 2021, and Figure 13 is a schematic diagram of the lower structure of the coil unit 202A on the second plane 2022 according to this embodiment of the present disclosure.
此實施例的線圈單元202A與線圈單元202相似，差異在於此實施例中，由垂直於第一平面2021之一方向觀看時，如第11圖所示，第一連接件214A與第一金屬導線211的第一螺旋結構之一末端2111形成一中空區域HA。基於此實施例的結構設計，可以提升線圈單元202A的感應效率以及散熱效率。The coil unit 202A of this embodiment is similar to the coil unit 202 . The difference is that in this embodiment, when viewed from a direction perpendicular to the first plane 2021 , as shown in FIG. 11 , the first connecting member 214A and the first metal wire One end 2111 of the first helical structure 211 forms a hollow area HA. Based on the structural design of this embodiment, the induction efficiency and heat dissipation efficiency of the coil unit 202A can be improved.
請參考第14圖至第16圖，第14圖為根據本揭露另一實施例之無線裝置的一線圈單元202B的上視示意圖，第15圖為根據本揭露實施例之線圈單元202B在第一平面2021的上層結構的示意圖，並且第16圖為根據本揭露此實施例之線圈單元202B在第二平面2022的下層結構之示意圖。Please refer to Figures 14 to 16. Figure 14 is a top view of a coil unit 202B of a wireless device according to another embodiment of the present disclosure. Figure 15 is a first view of the coil unit 202B of a wireless device according to another embodiment of the present disclosure. 16 is a schematic diagram of the lower structure of the coil unit 202B in the second plane 2022 according to this embodiment of the present disclosure.
此實施例的線圈單元202B與前述之線圈單元202A相似，差異在於此實施例中，線圈單元202B更包括一電性連接部225，連接於第一金屬導線211的第一螺旋結構之最內圈的末端。基於此實施例的結構設計，線圈單元202B可以藉由電性連接部225直接與一外部電路進行電性連接，以增加測試線圈單元202B的便利性。The coil unit 202B of this embodiment is similar to the aforementioned coil unit 202A. The difference is that in this embodiment, the coil unit 202B further includes an electrical connection part 225 connected to the innermost ring of the first spiral structure of the first metal conductor 211 end. Based on the structural design of this embodiment, the coil unit 202B can be directly electrically connected to an external circuit through the electrical connection portion 225 to increase the convenience of testing the coil unit 202B.
請參考第17圖至第19圖，第17圖為根據本揭露另一實施例之無線裝置的一線圈單元202C的上視示意圖，第18圖為根據本揭露實施例之線圈單元202C在第一平面2021的上層結構的示意圖，並且第19圖為根據本揭露此實施例之線圈單元202C在第二平面2022的下層結構之示意圖。Please refer to Figures 17 to 19. Figure 17 is a top view of a coil unit 202C of a wireless device according to another embodiment of the present disclosure. Figure 18 is a first view of the coil unit 202C according to an embodiment of the present disclosure. A schematic diagram of the upper structure of the plane 2021, and FIG. 19 is a schematic diagram of the lower structure of the coil unit 202C on the second plane 2022 according to this embodiment of the present disclosure.
此實施例的線圈單元202C與前述之線圈單元202B相似，差異在於此實施例中，線圈單元202C具有一電性連接部226，連接於第二金屬導線212的第二螺旋結構之倒數第一圈。另外，線圈單元202C更包括一第一連接件214C，並且第一連接件214C未截斷第二螺旋結構之一部分。具體而言，第一連接件214C未截斷第二螺旋結構之最內圈（倒數第一圈），並且第一連接件214C是連接於第二螺旋結構之倒數第二圈。The coil unit 202C of this embodiment is similar to the aforementioned coil unit 202B. The difference is that in this embodiment, the coil unit 202C has an electrical connection part 226 connected to the penultimate turn of the second spiral structure of the second metal wire 212 . In addition, the coil unit 202C further includes a first connecting member 214C, and the first connecting member 214C does not cut off a part of the second spiral structure. Specifically, the first connecting member 214C does not cut off the innermost turn (the penultimate turn) of the second helical structure, and the first connecting member 214C is connected to the penultimate turn of the second helical structure.
基於此實施例的結構設計，線圈單元202C可以藉由電性連接部226直接地與一外部電路進行電性連接，例如連接一測試裝置，以增加測試線圈單元202C的便利性。另外，也可使多個線圈單元202C經由各自的電性連接部226連接至一控制晶片，並且控制晶片可控制多個線圈單元202C之間的連接方式，例如以串聯或是以並聯方式連接。Based on the structural design of this embodiment, the coil unit 202C can be directly electrically connected to an external circuit, such as a testing device, through the electrical connection portion 226 to increase the convenience of testing the coil unit 202C. In addition, the plurality of coil units 202C can also be connected to a control chip through respective electrical connection portions 226, and the control chip can control the connection mode between the plurality of coil units 202C, such as being connected in series or in parallel.
請參考第20圖至第22圖，第20圖為根據本揭露另一實施例之無線裝置的一線圈單元202D的上視示意圖，第21圖為根據本揭露實施例之線圈單元202D在第一平面2021的上層結構的示意圖，並且第22圖為根據本揭露此實施例之線圈單元202D在第二平面2022的下層結構之示意圖。Please refer to Figures 20 to 22. Figure 20 is a top view of a coil unit 202D of a wireless device according to another embodiment of the present disclosure. Figure 21 is a first view of the coil unit 202D of a wireless device according to another embodiment of the present disclosure. A schematic diagram of the upper structure of the plane 2021, and Figure 22 is a schematic diagram of the lower structure of the coil unit 202D on the second plane 2022 according to this embodiment of the present disclosure.
此實施例的線圈單元202D與前述之線圈單元202C相似，其中線圈單元202D的一第一連接件214D是連接於第二金屬導線212的第二螺旋結構之倒數第二圈2122(如第22圖所示)。值得注意的是，此實施例與前述實施例的差異在於，如第20圖所示，當由垂直於第一平面2021之一方向觀看時，第一金屬導線211的第一螺旋結構之最內圈2112與第二螺旋結構之倒數第二圈2122部分不重疊。The coil unit 202D of this embodiment is similar to the aforementioned coil unit 202C, in which a first connecting member 214D of the coil unit 202D is connected to the penultimate turn 2122 of the second spiral structure of the second metal wire 212 (as shown in Figure 22 shown). It is worth noting that the difference between this embodiment and the previous embodiment is that, as shown in FIG. 20 , when viewed from a direction perpendicular to the first plane 2021 , the innermost part of the first spiral structure of the first metal conductor 211 The loop 2112 does not partially overlap with the penultimate loop 2122 of the second spiral structure.
於此實施例中，第二金屬導線212的一最內圈2123與第一金屬導線211的最內圈2112是以串聯方式連接，因此可以降低線圈單元202D整體的電阻，進而可降低因渦電流而造成的損耗。In this embodiment, an innermost ring 2123 of the second metal wire 212 and the innermost ring 2112 of the first metal wire 211 are connected in series, so the overall resistance of the coil unit 202D can be reduced, thereby reducing the eddy current. the losses caused.
請參考第23圖至第25圖，第23圖為根據本揭露另一實施例之無線裝置的一線圈單元302的上視示意圖，第24圖為根據本揭露實施例之線圈單元302在一第一平面3021的上層結構的示意圖，並且第25圖為根據本揭露此實施例之線圈單元302在一第二平面3022的下層結構之示意圖。Please refer to Figures 23 to 25. Figure 23 is a schematic top view of a coil unit 302 of a wireless device according to another embodiment of the present disclosure. Figure 24 is a schematic diagram of a coil unit 302 of a wireless device according to another embodiment of the present disclosure. A schematic diagram of the upper structure of a plane 3021, and Figure 25 is a schematic diagram of the lower structure of the coil unit 302 according to this embodiment of the present disclosure.
於此實施例中，無線裝置的線圈單元302包括一第一線圈以及一第二線圈，第一線圈包括一第一金屬導線304以及一第二金屬導線306，分別設置於第一平面3021與第二平面3022。另外，第二線圈包括有一第三金屬導線308以及一第四金屬導線310，其中第三金屬導線308是設置於第一平面3021且環繞第一金屬導線304，並且第四金屬導線310是設置於第二平面3022且環繞第二金屬導線306。In this embodiment, the coil unit 302 of the wireless device includes a first coil and a second coil. The first coil includes a first metal wire 304 and a second metal wire 306, which are respectively disposed on the first plane 3021 and the second metal wire. Two planes 3022. In addition, the second coil includes a third metal conductor 308 and a fourth metal conductor 310, wherein the third metal conductor 308 is disposed on the first plane 3021 and surrounds the first metal conductor 304, and the fourth metal conductor 310 is disposed on the first plane 3021. The second plane 3022 surrounds the second metal wire 306 .
於此實施例中，第一金屬導線304是可藉由多個導通組件CA與第二金屬導線306電性連接，並且第二金屬導線306是藉由兩個導通組件CA電性連接於一電性接點EC1以及一電性接點EC2，以使第一線圈經由電性接點EC1以及電性接點EC2電性連接於一外部電路。第三金屬導線308是可藉由多個導通組件CA與第四金屬導線310電性連接。再者，第三金屬導線308是電性連接於一電性接點EC3，第四金屬導線310是藉由導通組件CA電性連接於一電性接點EC4，以使第二線圈電性連接於一外部電路。In this embodiment, the first metal wire 304 can be electrically connected to the second metal wire 306 through a plurality of conductive components CA, and the second metal wire 306 can be electrically connected to an electrical circuit through two conductive components CA. electrical contact EC1 and an electrical contact EC2, so that the first coil is electrically connected to an external circuit through the electrical contact EC1 and the electrical contact EC2. The third metal wire 308 can be electrically connected to the fourth metal wire 310 through a plurality of conductive components CA. Furthermore, the third metal wire 308 is electrically connected to an electrical contact EC3, and the fourth metal wire 310 is electrically connected to an electrical contact EC4 through the conductive component CA, so that the second coil is electrically connected. to an external circuit.
值得注意的是，於此實施例中，所述第一線圈是可操作在一近場通訊（NFC）頻帶，並且所述第二線圈是可操作為電力傳輸之一發射端或一接收端，以執行無線充電的功能。It is worth noting that in this embodiment, the first coil is operable in a near field communication (NFC) frequency band, and the second coil is operable as a transmitter or a receiver of power transmission, to perform wireless charging function.
基於線圈單元302的結構設計，可以使得無線裝置同時進行無線通訊以及無線充電的功能，並且也可以使無線裝置達成微型化的目的。Based on the structural design of the coil unit 302, the wireless device can perform wireless communication and wireless charging functions at the same time, and the wireless device can also be miniaturized.
請參考第26圖至第28圖，第26圖為根據本揭露另一實施例之無線裝置的一線圈單元302A的上視示意圖，第27圖為根據本揭露實施例之線圈單元302A在第一平面3021的上層結構的示意圖，並且第28圖為根據本揭露此實施例之線圈單元302A在第二平面3022的下層結構之示意圖。Please refer to Figures 26 to 28. Figure 26 is a top view of a coil unit 302A of a wireless device according to another embodiment of the present disclosure. Figure 27 is a first view of the coil unit 302A of a wireless device according to another embodiment of the present disclosure. A schematic diagram of the upper structure of the plane 3021, and Figure 28 is a schematic diagram of the lower structure of the coil unit 302A on the second plane 3022 according to this embodiment of the disclosure.
相似於線圈單元302，於此實施例中，無線裝置的線圈單元302A包括一第一線圈以及一第二線圈，第一線圈包括一第一金屬導線312，設置於第一平面3021上。第二線圈包括有一第二金屬導線314，設置於第一平面3021且環繞第一金屬導線312，並且第二金屬導線314電性連接於電性接點EC1以及電性接點EC2。線圈單元302A與線圈單元302的差異在於，線圈單元302A包括多條連接導線316，設置於第二平面3022上。於此實施例中，兩條連接導線316是配置以將第一金屬導線312連接至兩個電性接點EC，另外三條連接導線316是配置以連接於第二金屬導線314或第一金屬導線312中不同圈的導線。Similar to the coil unit 302 , in this embodiment, the coil unit 302A of the wireless device includes a first coil and a second coil. The first coil includes a first metal wire 312 and is disposed on the first plane 3021 . The second coil includes a second metal wire 314 disposed on the first plane 3021 and surrounding the first metal wire 312, and the second metal wire 314 is electrically connected to the electrical contact EC1 and the electrical contact EC2. The difference between the coil unit 302A and the coil unit 302 is that the coil unit 302A includes a plurality of connecting wires 316 disposed on the second plane 3022 . In this embodiment, two connecting wires 316 are configured to connect the first metal wire 312 to the two electrical contacts EC, and the other three connecting wires 316 are configured to connect to the second metal wire 314 or the first metal wire. Different turns of wire in 312.
基於這樣的結構配置，可以簡化線圈單元302A在第二平面3022上的繞線布局（wire layout）。Based on such a structural configuration, the wire layout of the coil unit 302A on the second plane 3022 can be simplified.
本揭露提供一種無線裝置，包括一線圈單元。在一些實施例中，線圈單元可包括一第一線圈，第一線圈可進一步包括第一金屬導線以及第二金屬導線，第二金屬導線是藉由至少一導通組件電性連接於第一金屬導線，並且導通組件可以設置於第一金屬導線以及第二金屬導線的最內圈，使線圈單元的電流密度可以更均勻的分布，使電流不易集中於特定部分而產生不必要的熱能，進而提升整體效率。The present disclosure provides a wireless device including a coil unit. In some embodiments, the coil unit may include a first coil. The first coil may further include a first metal wire and a second metal wire. The second metal wire is electrically connected to the first metal wire through at least one conductive component. , and the conductive component can be arranged on the innermost ring of the first metal wire and the second metal wire, so that the current density of the coil unit can be more evenly distributed, so that the current is not easy to concentrate on specific parts and generate unnecessary heat energy, thereby improving the overall efficiency.
另外，在一些實施例中，線圈單元可更包括一第二線圈，其中第一線圈是可操作在一近場通訊（NFC）頻帶，並且第二線圈是可操作為電力傳輸之一發射端或一接收端，以執行無線充電的功能。因此可以使得無線裝置同時進行無線通訊以及無線充電的功能。In addition, in some embodiments, the coil unit may further include a second coil, wherein the first coil is operable in a near field communication (NFC) frequency band, and the second coil is operable as a transmitter for power transmission or A receiving end to perform the wireless charging function. Therefore, the wireless device can perform wireless communication and wireless charging functions at the same time.
雖然本揭露的實施例及其優點已揭露如上，但應該瞭解的是，任何所屬技術領域中具有通常知識者，在不脫離本揭露之精神和範圍內，當可作更動、替代與潤飾。此外，本揭露之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步驟，任何所屬技術領域中具有通常知識者可從本揭露揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟，只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本揭露使用。因此，本揭露之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外，每一申請專利範圍構成個別的實施例，且本揭露之保護範圍也包括各個申請專利範圍及實施例的組合。Although the embodiments and their advantages of the present disclosure have been disclosed above, it should be understood that anyone with ordinary skill in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure. In addition, the protection scope of the present disclosure is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Anyone with ordinary knowledge in the relevant technical field can learn from the disclosure It is understood that processes, machines, manufacturing, material compositions, devices, methods and steps currently or developed in the future can be used according to the present disclosure as long as they can perform substantially the same functions or obtain substantially the same results in the embodiments described herein. Therefore, the protection scope of the present disclosure includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. In addition, each claimed patent scope constitutes an individual embodiment, and the protection scope of the present disclosure also includes the combination of each claimed patent scope and embodiments.
50‧‧‧電子元件100‧‧‧無線裝置102‧‧‧線圈單元102A‧‧‧線圈單元1021‧‧‧第一平面1022‧‧‧第二平面1023‧‧‧擬似金屬導線1024‧‧‧擬似金屬導線1025‧‧‧金屬區塊103‧‧‧第一終端接點104‧‧‧黏著層105‧‧‧第二終端接點106‧‧‧導磁板108‧‧‧基板110‧‧‧線圈結構111‧‧‧第一金屬導線112‧‧‧第二金屬導線113‧‧‧分離導線114‧‧‧第一連接件116‧‧‧最內圈118‧‧‧第一中間圈120‧‧‧第二中間圈1201‧‧‧左半部1202‧‧‧右半部120S‧‧‧第一狹縫122‧‧‧最外圈202‧‧‧線圈單元2021‧‧‧第一平面2022‧‧‧第二平面202A‧‧‧線圈單元202B‧‧‧線圈單元202C‧‧‧線圈單元202D‧‧‧線圈單元211‧‧‧第一金屬導線2111‧‧‧末端段2112‧‧‧最內圈212‧‧‧第二金屬導線2121‧‧‧非平行區段2122‧‧‧倒數第二圈214‧‧‧第一連接件214A‧‧‧第一連接件214C‧‧‧第一連接件224‧‧‧分離導線225‧‧‧電性連接部226‧‧‧電性連接部302‧‧‧線圈單元302A‧‧‧線圈單元3021‧‧‧第一平面3022‧‧‧第二平面304‧‧‧第一金屬導線306‧‧‧第二金屬導線308‧‧‧第三金屬導線310‧‧‧第四金屬導線312‧‧‧第一金屬導線314‧‧‧第二金屬導線316‧‧‧連接導線402‧‧‧線圈單元4021‧‧‧第一平面4022‧‧‧第二平面404‧‧‧第一金屬導線4041‧‧‧第一傾斜區段406‧‧‧第二金屬導線4061‧‧‧第二傾斜區段408‧‧‧第一分離部410‧‧‧第二分離部CA1、CA2、CA3、CA4、CA5、CA6、CA7‧‧‧導通組件CS‧‧‧彎曲區段EC、EC1、EC2、EC3、EC4‧‧‧電性接點L1‧‧‧長度MC‧‧‧金屬連接件SS‧‧‧直線區段WT‧‧‧寬度總和W1‧‧‧寬度W2、WA、WB、WC、WX‧‧‧寬度50‧‧‧Electronic component 100‧‧‧Wireless device 102‧‧‧Coil unit 102A‧‧‧Coil unit 1021‧‧‧First plane 1022‧‧‧Second plane 1023‧‧‧imitating metal wire 1024‧‧‧imitating Metal wire 1025‧‧‧Metal block 103‧‧‧First terminal contact 104‧‧‧Adhesive layer 105‧‧‧Second terminal contact 106‧‧‧Magnetic plate 108‧‧‧Substrate 110‧‧‧Coil Structure 111‧‧‧First metal conductor 112‧‧‧Second metal conductor 113‧‧‧Separate conductor 114‧‧‧First connecting piece 116‧‧‧Innermost ring 118‧‧‧First middle ring 120‧‧‧ Second middle ring 1201‧‧‧Left half 1202‧‧‧Right half 120S‧‧‧First slit 122‧‧‧Outermost ring 202‧‧‧Coil unit 2021‧‧‧First plane 2022‧‧‧ Second plane 202A‧‧‧coil unit 202B‧‧‧coil unit 202C‧‧‧coil unit 202D‧‧‧coil unit 211‧‧‧first metal wire 2111‧‧‧end section 2112‧‧‧innermost ring 212‧ ‧‧Second metal wire 2121‧‧‧Non-parallel section 2122‧‧‧Penultimate circle 214‧‧‧First connecting piece 214A‧‧‧First connecting piece 214C‧‧‧First connecting piece 224‧‧‧ Separate wire 225‧‧‧Electrical connection part 226‧‧‧Electrical connection part 302‧‧‧Coil unit 302A‧‧‧Coil unit 3021‧‧‧First plane 3022‧‧‧Second plane 304‧‧‧First Metal wire 306‧‧‧Second metal wire 308‧‧‧Third metal wire 310‧‧‧Fourth metal wire 312‧‧‧First metal wire 314‧‧‧Second metal wire 316‧‧‧Connecting wire 402‧ ‧‧Coil unit 4021‧‧‧First plane 4022‧‧‧Second plane 404‧‧‧First metal wire 4041‧‧‧First inclined section 406‧‧‧Second metal wire 4061‧‧‧Second tilt Section 408‧‧‧First separation part 410‧‧‧Second separation part CA1, CA2, CA3, CA4, CA5, CA6, CA7‧‧‧Conduction component CS‧‧‧Bent sections EC, EC1, EC2, EC3 , EC4‧‧‧Electrical contact L1‧‧‧Length MC‧‧‧Metal connector SS‧‧‧Linear section WT‧‧‧Sum of width W1‧‧‧Width W2, WA, WB, WC, WX‧‧ ‧Width
本揭露可藉由之後的詳細說明並配合圖示而得到清楚的了解。要強調的是，按照業界的標準做法，各種特徵並沒有按比例繪製，並且僅用於說明之目的。事實上，為了能夠清楚的說明，因此各種特徵的尺寸可能會任意地放大或者縮小。 第1圖為根據本揭露一實施例之一無線裝置之***圖。 第2圖為根據本揭露一實施例之線圈單元的上視示意圖。 第3圖為根據本揭露一實施例之線圈單元在一第一平面的上層結構的示意圖。 第4圖為根據本揭露此實施例之線圈單元在一第二平面的下層結構之示意圖。 第5圖為根據本揭露實施例之第2圖中線段A-A’之剖面示意圖。 第6圖為根據本揭露實施例之第2圖中的區域X的放大圖。 第7圖為根據本揭露另一實施例之一線圈單元在第二平面之示意圖。 第8圖為根據本揭露另一實施例之無線裝置的一線圈單元的上視示意圖。 第9圖為根據本揭露實施例之線圈單元在一第一平面的上層結構的示意圖。 第10圖為根據本揭露此實施例之線圈單元在一第二平面的下層結構之示意圖。 第11圖為根據本揭露另一實施例之無線裝置的一線圈單元的上視示意圖。 第12圖為根據本揭露實施例之線圈單元在第一平面的上層結構的示意圖。 第13圖為根據本揭露此實施例之線圈單元在第二平面的下層結構之示意圖。 第14圖為根據本揭露另一實施例之無線裝置的一線圈單元的上視示意圖。 第15圖為根據本揭露實施例之線圈單元在第一平面的上層結構的示意圖。 第16圖為根據本揭露此實施例之線圈單元在第二平面的下層結構之示意圖。 第17圖為根據本揭露另一實施例之無線裝置的一線圈單元的上視示意圖。 第18圖為根據本揭露實施例之線圈單元在第一平面的上層結構的示意圖。 第19圖為根據本揭露此實施例之線圈單元在第二平面的下層結構之示意圖。 第20圖為根據本揭露另一實施例之無線裝置的一線圈單元的上視示意圖。 第21圖為根據本揭露實施例之線圈單元在第一平面的上層結構的示意圖。 第22圖為根據本揭露此實施例之線圈單元在第二平面的下層結構之示意圖。 第23圖為根據本揭露另一實施例之無線裝置的一線圈單元的上視示意圖。 第24圖為根據本揭露實施例之線圈單元在一第一平面的上層結構的示意圖。 第25圖為根據本揭露此實施例之線圈單元在一第二平面的下層結構之示意圖。 第26圖為根據本揭露另一實施例之無線裝置的一線圈單元的上視示意圖。 第27圖為根據本揭露實施例之線圈單元在第一平面的上層結構的示意圖。 第28圖為根據本揭露此實施例之線圈單元在第二平面的下層結構之示意圖。This disclosure can be clearly understood through the following detailed description and accompanying illustrations. It is emphasized that, in accordance with standard practice in the industry, various features are not drawn to scale and are used for illustration purposes only. In fact, the dimensions of the various features may be arbitrarily exaggerated or reduced for clarity of illustration. Figure 1 is an exploded view of a wireless device according to an embodiment of the present disclosure. Figure 2 is a schematic top view of a coil unit according to an embodiment of the present disclosure. Figure 3 is a schematic diagram of the upper structure of a coil unit in a first plane according to an embodiment of the present disclosure. FIG. 4 is a schematic diagram of the lower structure of the coil unit in a second plane according to this embodiment of the present disclosure. Figure 5 is a schematic cross-sectional view of line segment A-A' in Figure 2 according to an embodiment of the present disclosure. FIG. 6 is an enlarged view of the area X in FIG. 2 according to an embodiment of the present disclosure. FIG. 7 is a schematic view of a coil unit in a second plane according to another embodiment of the present disclosure. FIG. 8 is a schematic top view of a coil unit of a wireless device according to another embodiment of the present disclosure. Figure 9 is a schematic diagram of the upper structure of a coil unit in a first plane according to an embodiment of the present disclosure. FIG. 10 is a schematic diagram of the lower structure of the coil unit in a second plane according to this embodiment of the present disclosure. FIG. 11 is a schematic top view of a coil unit of a wireless device according to another embodiment of the present disclosure. FIG. 12 is a schematic diagram of the superstructure of the coil unit on the first plane according to the embodiment of the present disclosure. FIG. 13 is a schematic diagram of the lower structure of the coil unit in the second plane according to this embodiment of the present disclosure. FIG. 14 is a schematic top view of a coil unit of a wireless device according to another embodiment of the present disclosure. Figure 15 is a schematic diagram of the superstructure of the coil unit on the first plane according to the embodiment of the present disclosure. FIG. 16 is a schematic diagram of the lower structure of the coil unit in the second plane according to this embodiment of the present disclosure. Figure 17 is a schematic top view of a coil unit of a wireless device according to another embodiment of the present disclosure. Figure 18 is a schematic diagram of the superstructure of the coil unit on the first plane according to the embodiment of the present disclosure. FIG. 19 is a schematic diagram of the lower structure of the coil unit in the second plane according to this embodiment of the present disclosure. Figure 20 is a schematic top view of a coil unit of a wireless device according to another embodiment of the present disclosure. Figure 21 is a schematic diagram of the superstructure of the coil unit on the first plane according to the embodiment of the present disclosure. FIG. 22 is a schematic diagram of the lower structure of the coil unit in the second plane according to this embodiment of the present disclosure. Figure 23 is a schematic top view of a coil unit of a wireless device according to another embodiment of the present disclosure. Figure 24 is a schematic diagram of the upper structure of a coil unit in a first plane according to an embodiment of the present disclosure. Figure 25 is a schematic diagram of the lower structure of the coil unit in a second plane according to this embodiment of the present disclosure. Figure 26 is a schematic top view of a coil unit of a wireless device according to another embodiment of the present disclosure. Figure 27 is a schematic diagram of the upper structure of the coil unit on the first plane according to the embodiment of the present disclosure. Figure 28 is a schematic diagram of the lower structure of the coil unit in the second plane according to this embodiment of the present disclosure.
100‧‧‧無線裝置 100‧‧‧Wireless devices
102‧‧‧線圈單元 102‧‧‧Coil unit
104‧‧‧黏著層 104‧‧‧Adhesive layer
106‧‧‧導磁板 106‧‧‧Magnetic conductive plate
108‧‧‧基板 108‧‧‧Substrate
110‧‧‧線圈結構 110‧‧‧Coil structure
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762589305P | 2017-11-21 | 2017-11-21 | |
| US62/589,305 | 2017-11-21 | ||
| US201762595820P | 2017-12-07 | 2017-12-07 | |
| US62/595,820 | 2017-12-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201937517A TW201937517A (en) | 2019-09-16 |
| TWI820052B true TWI820052B (en) | 2023-11-01 |
Family
ID=66859081
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107139631A TWI820052B (en) | 2017-11-21 | 2018-11-08 | Wireless device |
| TW107139614A TWI794327B (en) | 2017-11-21 | 2018-11-08 | Wireless device |
| TW107140335A TWI784081B (en) | 2017-11-21 | 2018-11-14 | Wireless system and wireless device |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107139614A TWI794327B (en) | 2017-11-21 | 2018-11-08 | Wireless device |
| TW107140335A TWI784081B (en) | 2017-11-21 | 2018-11-14 | Wireless system and wireless device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7169172B2 (en) |
| CN (4) | CN209170059U (en) |
| TW (3) | TWI820052B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115955016A (en) * | 2022-01-20 | 2023-04-11 | 荣耀终端有限公司 | Wireless charging transmitting terminal, charging base and system |
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| JP6485336B2 (en) | 2015-11-25 | 2019-03-20 | 株式会社ダイフク | electric circuit |
| WO2017119215A1 (en) | 2016-01-07 | 2017-07-13 | 株式会社村田製作所 | Composite antenna and electronic apparatus |
| KR102527794B1 (en) * | 2016-02-04 | 2023-05-03 | 삼성전자주식회사 | Electronic device comprising coil |
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| US20150269474A1 (en) * | 2011-08-08 | 2015-09-24 | David Finn | Rfid transponder chip modules |
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| CN209266128U (en) | 2019-08-16 |
| TW201926854A (en) | 2019-07-01 |
| TWI794327B (en) | 2023-03-01 |
| TW201937829A (en) | 2019-09-16 |
| JP2019097168A (en) | 2019-06-20 |
| JP7169172B2 (en) | 2022-11-10 |
| TWI784081B (en) | 2022-11-21 |
| CN209170059U (en) | 2019-07-26 |
| CN209169985U (en) | 2019-07-26 |
| TW201937517A (en) | 2019-09-16 |
| CN109830999A (en) | 2019-05-31 |
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