TWI818692B - Driving backplane - Google Patents
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- TWI818692B TWI818692B TW111131943A TW111131943A TWI818692B TW I818692 B TWI818692 B TW I818692B TW 111131943 A TW111131943 A TW 111131943A TW 111131943 A TW111131943 A TW 111131943A TW I818692 B TWI818692 B TW I818692B
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- pattern layer
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- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000010410 layer Substances 0.000 description 172
- 238000009413 insulation Methods 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 239000010408 film Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000011229 interlayer Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- RQIPKMUHKBASFK-UHFFFAOYSA-N [O-2].[Zn+2].[Ge+2].[In+3] Chemical compound [O-2].[Zn+2].[Ge+2].[In+3] RQIPKMUHKBASFK-UHFFFAOYSA-N 0.000 description 1
- -1 aluminum tin oxide Chemical compound 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Plural Heterocyclic Compounds (AREA)
- Saccharide Compounds (AREA)
Abstract
Description
本發明是有關於一種驅動背板。 The invention relates to a driving backplane.
發光二極體顯示面板包括驅動背板及被轉置於驅動背板上的多個發光二極體元件。繼承發光二極體的特性,發光二極體顯示面板具有省電、高效率、高亮度及反應時間快等優點。此外,相較於有機發光二極體顯示面板,發光二極體顯示面板還具有色彩易調校、發光壽命長、無影像烙印等優勢。因此,發光二極體顯示面板被視為下一世代的顯示技術。然而,光線會穿過驅動背板之正面上的多個膜層並傳遞至驅動背板之背面上的背面線路。光線會被背面線路反射,而讓使用者看到背面線路,影響發光二極體顯示面板的視覺效果。 The light-emitting diode display panel includes a driving backplane and a plurality of light-emitting diode elements transferred on the driving backplane. Inheriting the characteristics of light-emitting diodes, light-emitting diode display panels have the advantages of power saving, high efficiency, high brightness and fast response time. In addition, compared with organic light-emitting diode display panels, light-emitting diode display panels also have the advantages of easy color adjustment, long luminous life, and no image imprinting. Therefore, light-emitting diode display panels are regarded as the next generation of display technology. However, the light passes through multiple film layers on the front side of the driving backplane and is transmitted to the backside circuits on the back side of the driving backplane. Light will be reflected by the circuits on the back, allowing users to see the circuits on the back, affecting the visual effect of the LED display panel.
本發明提供一種驅動背板,視覺效果佳。 The invention provides a driving backplane with good visual effects.
本發明的驅動背板,包括基板、遮光圖案層、第一絕緣層、第一導電圖案層、第二絕緣層及第二導電圖案層。基板具有 正面,其中正面包括接合區。遮光圖案層設置於基板的正面上。第一絕緣層設置於遮光圖案層上。第一導電圖案層設置於第一絕緣層上。第二絕緣層設置於第一導電圖案層上。第二導電圖案層設置於第二絕緣層上。在驅動背板的俯視圖中,於接合區內,第一導電圖案層與第二導電圖案層具有共同開口區,而遮光圖案層完全地遮蔽共同開口區。 The driving backplane of the present invention includes a substrate, a light-shielding pattern layer, a first insulating layer, a first conductive pattern layer, a second insulating layer and a second conductive pattern layer. The substrate has The front side includes the joint area. The light-shielding pattern layer is disposed on the front side of the substrate. The first insulation layer is disposed on the light-shielding pattern layer. The first conductive pattern layer is disposed on the first insulation layer. The second insulation layer is disposed on the first conductive pattern layer. The second conductive pattern layer is disposed on the second insulation layer. In the top view of the driving backplane, in the joint area, the first conductive pattern layer and the second conductive pattern layer have a common opening area, and the light-shielding pattern layer completely blocks the common opening area.
10:驅動背板 10:Drive backplane
110:基板 110:Substrate
112:正面 112:front
112a:接合區 112a:Joint area
112a-1:第一邊界 112a-1: First boundary
112a-2:第二邊界 112a-2: Second boundary
112a-3:第三邊界 112a-3: Third boundary
112a-4:第四邊界 112a-4: Fourth boundary
114:背面 114:Back
120:遮光圖案層 120:Light-shielding pattern layer
130:緩衝層 130:Buffer layer
140:閘絕緣層 140: Gate insulation layer
150:層間介電層 150: Interlayer dielectric layer
160:第一絕緣層 160: First insulation layer
170:第一導電圖案層 170: First conductive pattern layer
170a:第一開口 170a: First opening
171、191、211:第一導電區塊 171, 191, 211: first conductive block
172、192、212:第二導電區塊 172, 192, 212: Second conductive block
180:第二絕緣層 180: Second insulation layer
190:第二導電圖案層 190: Second conductive pattern layer
190a:第二開口 190a:Second opening
200:第三絕緣層 200:Third insulation layer
210:第三導電圖案層 210: The third conductive pattern layer
210a:第三開口 210a: Third opening
211a、212a:接墊 211a, 212a: pad
220:透明導電圖案層 220:Transparent conductive pattern layer
221、222:透明導電圖案 221, 222: Transparent conductive pattern
230:第四絕緣層 230:Fourth insulation layer
231、231a、232、232a:貫孔 231, 231a, 232, 232a: through hole
240:背面線路 240:Back line
A1、A2、A3、A4:距離 A1, A2, A3, A4: distance
O:共同開口區 O: Common opening area
W、Wx、Wy:寬度 W, Wx, Wy: Width
x:第一方向 x: first direction
y:第二方向 y: second direction
I-I’:剖線 I-I’: section line
圖1為本發明一實施例之驅動背板10的剖面示意圖。 FIG. 1 is a schematic cross-sectional view of a driving backplane 10 according to an embodiment of the present invention.
圖2為本發明一實施例之驅動背板10的俯視示意圖。 FIG. 2 is a schematic top view of the driving backplane 10 according to an embodiment of the present invention.
圖3為本發明一實施例之驅動背板10的遮光圖案層120的俯視示意圖。 FIG. 3 is a schematic top view of the light-shielding pattern layer 120 of the driving backplane 10 according to an embodiment of the present invention.
圖4為本發明一實施例之驅動背板10的第一導電圖案層170的俯視示意圖。 FIG. 4 is a schematic top view of the first conductive pattern layer 170 of the driving backplane 10 according to an embodiment of the present invention.
圖5為本發明一實施例之驅動背板10的第二導電圖案層190的俯視示意圖。 FIG. 5 is a schematic top view of the second conductive pattern layer 190 of the driving backplane 10 according to an embodiment of the present invention.
圖6為本發明一實施例之驅動背板10的第三導電圖案層210的俯視示意圖。 FIG. 6 is a schematic top view of the third conductive pattern layer 210 of the driving backplane 10 according to an embodiment of the present invention.
圖7為本發明一實施例之驅動背板10的透明導電圖案層220及第四絕緣層230的俯視示意圖。 FIG. 7 is a schematic top view of the transparent conductive pattern layer 220 and the fourth insulating layer 230 of the driving backplane 10 according to an embodiment of the present invention.
現將詳細地參考本發明的示範性實施例,示範性實施例的實例說明於附圖中。只要有可能,相同元件符號在圖式和描述中用來表示相同或相似部分。 Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numbers are used in the drawings and descriptions to refer to the same or similar parts.
應當理解,當諸如層、膜、區域或基板的元件被稱為在另一元件“上”或“連接到”另一元件時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反,當元件被稱為“直接在另一元件上”或“直接連接到”另一元件時,不存在中間元件。如本文所使用的,“連接”可以指物理及/或電性連接。再者,“電性連接”或“耦合”可以是二元件間存在其它元件。 It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and/or electrical connection. Furthermore, "electrical connection" or "coupling" may mean the presence of other components between two components.
本文使用的“約”、“近似”、或“實質上”包括所述值和在本領域普通技術人員確定的特定值的可接受的偏差範圍內的平均值,考慮到所討論的測量和與測量相關的誤差的特定數量(即,測量系統的限制)。例如,“約”可以表示在所述值的一個或多個標準偏差內,或±30%、±20%、±10%、±5%內。再者,本文使用的“約”、“近似”或“實質上”可依光學性質、蝕刻性質或其它性質,來選擇較可接受的偏差範圍或標準偏差,而可不用一個標準偏差適用全部性質。 As used herein, "about," "approximately," or "substantially" includes the stated value and the average within an acceptable range of deviations from the particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and the A specific amount of error associated with a measurement (i.e., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the terms "about", "approximately" or "substantially" used herein may be used to select a more acceptable deviation range or standard deviation based on optical properties, etching properties or other properties, and one standard deviation may not apply to all properties. .
除非另有定義,本文使用的所有術語(包括技術和科學術語)具有與本發明所屬領域的普通技術人員通常理解的相同的含義。將進一步理解的是,諸如在通常使用的字典中定義的那些術語應當被解釋為具有與它們在相關技術和本發明的上下文中的 含義一致的含義,並且將不被解釋為理想化的或過度正式的意義,除非本文中明確地這樣定義。 Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed to have the same meaning as they have in the context of the relevant technology and the present invention. Consistent meaning and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
圖1為本發明一實施例之驅動背板10的剖面示意圖。圖2為本發明一實施例之驅動背板10的俯視示意圖。圖3為本發明一實施例之驅動背板10的遮光圖案層120的俯視示意圖。圖4為本發明一實施例之驅動背板10的第一導電圖案層170的俯視示意圖。圖5為本發明一實施例之驅動背板10的第二導電圖案層190的俯視示意圖。圖6為本發明一實施例之驅動背板10的第三導電圖案層210的俯視示意圖。圖7為本發明一實施例之驅動背板10的透明導電圖案層220及第四絕緣層230的俯視示意圖。圖1對應圖2至圖7的剖線I-I’。 FIG. 1 is a schematic cross-sectional view of a driving backplane 10 according to an embodiment of the present invention. FIG. 2 is a schematic top view of the driving backplane 10 according to an embodiment of the present invention. FIG. 3 is a schematic top view of the light-shielding pattern layer 120 of the driving backplane 10 according to an embodiment of the present invention. FIG. 4 is a schematic top view of the first conductive pattern layer 170 of the driving backplane 10 according to an embodiment of the present invention. FIG. 5 is a schematic top view of the second conductive pattern layer 190 of the driving backplane 10 according to an embodiment of the present invention. FIG. 6 is a schematic top view of the third conductive pattern layer 210 of the driving backplane 10 according to an embodiment of the present invention. FIG. 7 is a schematic top view of the transparent conductive pattern layer 220 and the fourth insulating layer 230 of the driving backplane 10 according to an embodiment of the present invention. Figure 1 corresponds to the cross-section line I-I' of Figures 2 to 7.
請參照圖1及圖2,驅動背板10包括基板110,具有正面112及相對於正面112的背面114。基板110的正面112包括接合區112a。在本實施例中,基板110可透光。舉例而言,在本實施例中,基板110的材質可為玻璃、石英、有機聚合物或是其它可適用的材料。 Referring to FIGS. 1 and 2 , the driving backplane 10 includes a substrate 110 having a front surface 112 and a back surface 114 opposite to the front surface 112 . Front surface 112 of substrate 110 includes bonding area 112a. In this embodiment, the substrate 110 is light-transmissive. For example, in this embodiment, the material of the substrate 110 may be glass, quartz, organic polymer, or other applicable materials.
請參照圖1、圖2及圖3,驅動背板10還包括遮光圖案層120,設置於基板110的正面112上。在本實施例中,遮光圖案層120的材料例如是金屬,但本發明不以此為限。在本實施例中,遮光圖案層120可選擇性地浮置(floating),但本發明不以此為限。 Please refer to FIG. 1 , FIG. 2 and FIG. 3 , the driving backplane 10 further includes a light-shielding pattern layer 120 disposed on the front surface 112 of the substrate 110 . In this embodiment, the material of the light-shielding pattern layer 120 is, for example, metal, but the invention is not limited thereto. In this embodiment, the light-shielding pattern layer 120 can be selectively floating, but the invention is not limited thereto.
請參照圖1,驅動背板10還包括第一絕緣層160,設置 於遮光圖案層120上。第一絕緣層160可以由單一膜層或相堆疊的多個膜層組成。在本實施例中,驅動背板10還可包括設置於遮光圖案層120上的緩衝層130、設置於緩衝層130上的半導體圖案層(未繪示)、設置於所述半導體圖案層上的閘絕緣層140、設置於閘絕緣層140上的第一金屬層(未繪示)、設置於所述第一金屬層上的層間介電層150及設置於層間介電層150上的第二金屬層(未繪示),其中所述半導體圖案層可包括薄膜電晶體的通道,所述第一金屬層可包括所述薄膜電晶體的閘極,所述第二金屬層可包括所述薄膜電晶體的源極與汲極,第一絕緣層160可設置於層間介電層150上且覆蓋所述第二金屬層,但本發明不以此為限。 Please refer to Figure 1, the driving backplane 10 also includes a first insulating layer 160, configured on the light-shielding pattern layer 120 . The first insulating layer 160 may be composed of a single film layer or multiple stacked film layers. In this embodiment, the driving backplane 10 may further include a buffer layer 130 disposed on the light-shielding pattern layer 120, a semiconductor pattern layer (not shown) disposed on the buffer layer 130, and a semiconductor pattern layer disposed on the semiconductor pattern layer. The gate insulating layer 140, a first metal layer (not shown) disposed on the gate insulating layer 140, an interlayer dielectric layer 150 disposed on the first metal layer, and a second interlayer dielectric layer 150 disposed on the gate insulating layer 140. A metal layer (not shown), wherein the semiconductor pattern layer may include a channel of a thin film transistor, the first metal layer may include a gate of the thin film transistor, and the second metal layer may include the thin film For the source and drain of the transistor, the first insulating layer 160 can be disposed on the interlayer dielectric layer 150 and cover the second metal layer, but the invention is not limited thereto.
請參照圖1、圖2及圖3,驅動背板10還包括第一導電圖案層170,設置於第一絕緣層160上。第一導電圖案層170可擋光。在本實施例中,第一導電圖案層170的材質可為金屬,而第一導電圖案層170也可稱第三金屬層,但本發明不以此為限。請參照圖1及圖4,在本實施例中,第一導電圖案層170可包括第一導電區塊171及第二導電區塊172,其中第一導電圖案層170的第一導電區塊171與第二導電區塊172之間存在第一開口170a。在本實施例中,第一導電區塊171及第二導電區塊172大致上在同一方向(即,第二方向y)上延伸且彼此隔開,以定義條狀的第一開口170a。在本實施例中,第一導電圖案層170可包括脈衝寬度調制(Pulse Width Modulation)電路的至少一部分, 其中所述脈衝寬度調制電路可控制電流開關時間長短以決定灰階亮度,但本發明不以此為限。 Please refer to FIG. 1 , FIG. 2 and FIG. 3 , the driving backplane 10 further includes a first conductive pattern layer 170 disposed on the first insulating layer 160 . The first conductive pattern layer 170 can block light. In this embodiment, the material of the first conductive pattern layer 170 can be metal, and the first conductive pattern layer 170 can also be called a third metal layer, but the invention is not limited thereto. Please refer to FIGS. 1 and 4 . In this embodiment, the first conductive pattern layer 170 may include a first conductive block 171 and a second conductive block 172 , wherein the first conductive block 171 of the first conductive pattern layer 170 There is a first opening 170a between the second conductive block 172 and the second conductive block 172 . In this embodiment, the first conductive block 171 and the second conductive block 172 extend substantially in the same direction (ie, the second direction y) and are spaced apart from each other to define the strip-shaped first opening 170a. In this embodiment, the first conductive pattern layer 170 may include at least part of a pulse width modulation (Pulse Width Modulation) circuit, The pulse width modulation circuit can control the current switching time to determine the gray-scale brightness, but the invention is not limited to this.
請參照圖1,驅動背板10還包括第二絕緣層180,設置於第一導電圖案層170上。第二絕緣層180可由單一膜層或相堆疊的多個膜層組成。 Please refer to FIG. 1 , the driving backplane 10 further includes a second insulating layer 180 disposed on the first conductive pattern layer 170 . The second insulating layer 180 may be composed of a single film layer or multiple stacked film layers.
請參照圖1、圖2及圖5,驅動背板10還包括第二導電圖案層190,設置於第二絕緣層180上。第二導電圖案層190可擋光。在本實施例中,第二導電圖案層190的材質可為金屬,而第二導電圖案層190也可稱第四金屬層,但本發明不以此為限。 Referring to FIG. 1 , FIG. 2 and FIG. 5 , the driving backplane 10 further includes a second conductive pattern layer 190 disposed on the second insulating layer 180 . The second conductive pattern layer 190 can block light. In this embodiment, the material of the second conductive pattern layer 190 can be metal, and the second conductive pattern layer 190 can also be called a fourth metal layer, but the invention is not limited thereto.
請參照圖1及圖5,在本實施例中,第二導電圖案層190可包括第一導電區塊191及第二導電區塊192,其中第二導電圖案層190的第一導電區塊191與第二導電區塊192之間存在第二開口190a。在本實施例中,第一導電區塊191可圍繞第二導電區塊192,且第一導電區塊191與第二導電區塊192彼此隔開,以定義環狀的第二開口190a。在本實施例中,第二導電圖案層190可包括脈衝振幅調制(Pulse Amplitude Modulation)電路的至少一部分,其中所述脈衝振幅調制電路可控制電流振幅大小決定灰階亮度。 Please refer to FIGS. 1 and 5 . In this embodiment, the second conductive pattern layer 190 may include a first conductive block 191 and a second conductive block 192 , wherein the first conductive block 191 of the second conductive pattern layer 190 There is a second opening 190a between the second conductive block 192 and the second opening 190a. In this embodiment, the first conductive block 191 may surround the second conductive block 192, and the first conductive block 191 and the second conductive block 192 are spaced apart from each other to define an annular second opening 190a. In this embodiment, the second conductive pattern layer 190 may include at least part of a pulse amplitude modulation (Pulse Amplitude Modulation) circuit, wherein the pulse amplitude modulation circuit may control the current amplitude to determine the gray-scale brightness.
請參照圖1,在本實施例中,驅動背板10還可包括第三絕緣層200,設置於第二導電圖案層190上。第三絕緣層200可由單一膜層或相堆疊的多個膜層組成。 Please refer to FIG. 1 . In this embodiment, the driving backplane 10 may further include a third insulating layer 200 disposed on the second conductive pattern layer 190 . The third insulating layer 200 may be composed of a single film layer or multiple stacked film layers.
請參照圖1、圖2及圖6,在本實施例中,驅動背板10 還可包括第三導電圖案層210,設置於第三絕緣層200上。第三導電圖案層210可擋光。在本實施例中,第三導電圖案層210的材質可為金屬,而第三導電圖案層210也可稱第五金屬層,但本發明不以此為限。 Please refer to Figure 1, Figure 2 and Figure 6. In this embodiment, the driving backplane 10 It may also include a third conductive pattern layer 210 disposed on the third insulating layer 200 . The third conductive pattern layer 210 can block light. In this embodiment, the material of the third conductive pattern layer 210 can be metal, and the third conductive pattern layer 210 can also be called a fifth metal layer, but the invention is not limited thereto.
請參照圖1及圖6,在本實施例中,第三導電圖案層210可包括第一導電區塊211及第二導電區塊212,其中第三導電圖案層210的第一導電區塊211與第三導電圖案層210的第二導電區塊212之間存在第三開口210a。在本實施例中,第三導電圖案層210的第一導電區塊211圍繞第三導電圖案層210的第二導電區塊212,第三導電圖案層210的第一導電區塊211與第三導電圖案層210的第二導電區塊212彼此隔開,以定義第三開口210a。第三導電圖案層210具有多個接墊211a、212a。每一接墊212a可以是呈島狀的第二導電區塊212。每一接墊211a可以是凸伸於第二導電區塊212旁的第一導電區塊211的一部分。舉例而言,在本實施例中,接墊212a可用以與發光二極體元件(未繪示)的陽極電性連接,另一接墊211a可具有接地電位且用以與發光二極體元件的陰極電性連接。 Please refer to FIGS. 1 and 6 . In this embodiment, the third conductive pattern layer 210 may include a first conductive block 211 and a second conductive block 212 , wherein the first conductive block 211 of the third conductive pattern layer 210 There is a third opening 210a between the third conductive pattern layer 210 and the second conductive block 212 . In this embodiment, the first conductive block 211 of the third conductive pattern layer 210 surrounds the second conductive block 212 of the third conductive pattern layer 210, and the first conductive block 211 of the third conductive pattern layer 210 is connected to the third conductive block 211 of the third conductive pattern layer 210. The second conductive areas 212 of the conductive pattern layer 210 are spaced apart from each other to define the third opening 210a. The third conductive pattern layer 210 has a plurality of contact pads 211a and 212a. Each pad 212a may be an island-shaped second conductive block 212. Each pad 211a may be a part of the first conductive block 211 protruding next to the second conductive block 212. For example, in this embodiment, the pad 212a can be used to be electrically connected to the anode of the light-emitting diode element (not shown), and the other pad 211a can have a ground potential and be used to be electrically connected to the light-emitting diode element. The cathode is electrically connected.
請參照圖1、圖2、圖6及圖7,在本實施例中,驅動背板10還可包括透明導電圖案層220,設置於第三導電圖案層210上。請參照圖1、圖6及圖7,在本實施例中,透明導電圖案層220可直接地設置於第三導電圖案層210上而與第三導電圖案層210電性連接。詳細而言,在本實施例中,透明導電圖案層220 具有多個透明導電圖案221、222,其中多個透明導電圖案221、222分別設置於第三導電圖案層210的多個接墊211a、212a上且分別與第三導電圖案層210的多個接墊211a、212a電性連接。舉例而言,在本實施例中,透明導電圖案層220可包括金屬氧化物,例如:銦錫氧化物、銦鋅氧化物、鋁錫氧化物、鋁鋅氧化物、銦鍺鋅氧化物、其它合適的氧化物、或者是上述至少二者之堆疊層,但本發明不以此為限。 Please refer to FIGS. 1 , 2 , 6 and 7 . In this embodiment, the driving backplane 10 may further include a transparent conductive pattern layer 220 disposed on the third conductive pattern layer 210 . Please refer to FIGS. 1 , 6 and 7 . In this embodiment, the transparent conductive pattern layer 220 can be directly disposed on the third conductive pattern layer 210 and be electrically connected to the third conductive pattern layer 210 . In detail, in this embodiment, the transparent conductive pattern layer 220 There are a plurality of transparent conductive patterns 221 and 222, wherein the plurality of transparent conductive patterns 221 and 222 are respectively disposed on the plurality of pads 211a and 212a of the third conductive pattern layer 210 and are respectively connected to the plurality of contacts of the third conductive pattern layer 210. Pads 211a and 212a are electrically connected. For example, in this embodiment, the transparent conductive pattern layer 220 may include metal oxides, such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium germanium zinc oxide, and others. A suitable oxide, or a stacked layer of at least two of the above, but the present invention is not limited thereto.
請參照圖1、圖2、圖6及圖7,在本實施例中,驅動背板10還可包括第四絕緣層230,設置於透明導電圖案層220上,且具有多個貫孔231、232,其中第四絕緣層230的多個貫孔231、232且分別重疊於多個透明導電圖案221、222。被第四絕緣層230之多個貫孔231、232暴露出的多個透明導電圖案221、222及多個透明導電圖案221、222下的多個接墊211a、212a係用以與發光二極體元件(未繪示)接合,進而形成顯示裝置。 Please refer to Figures 1, 2, 6 and 7. In this embodiment, the driving backplane 10 may further include a fourth insulating layer 230, which is disposed on the transparent conductive pattern layer 220 and has a plurality of through holes 231. 232, wherein the plurality of through holes 231 and 232 of the fourth insulating layer 230 overlap with the plurality of transparent conductive patterns 221 and 222 respectively. The plurality of transparent conductive patterns 221 and 222 exposed by the plurality of through holes 231 and 232 of the fourth insulating layer 230 and the plurality of contact pads 211a and 212a under the plurality of transparent conductive patterns 221 and 222 are used to communicate with the light emitting diodes. Body components (not shown) are joined to form a display device.
請參照圖1,在本實施例中,驅動背板10更包括背面線路240,設置於基板110的背面114上。背面線路240可透過設置於基板110之側壁(未繪示)上的側邊走線、貫穿基板110的導電通孔(未繪示)或其它導電元件與設置於基板110之正面112上的第一導電圖案層170、第二導電圖案層190及/或第三導電圖案層210電性連接。在本實施例中,背面線路240會反光。舉例而言,在本實施例中,背面線路240的材質可為金屬,但本發明不以此為限。 Please refer to FIG. 1 . In this embodiment, the driving backplane 10 further includes a backside circuit 240 disposed on the backside 114 of the substrate 110 . The backside circuit 240 can be connected to the third circuit breaker provided on the front surface 112 of the substrate 110 through side traces provided on the sidewalls (not shown) of the substrate 110 , conductive vias (not shown) penetrating the substrate 110 or other conductive elements. A conductive pattern layer 170, a second conductive pattern layer 190 and/or a third conductive pattern layer 210 are electrically connected. In this embodiment, the backside traces 240 are reflective. For example, in this embodiment, the material of the backside circuit 240 may be metal, but the invention is not limited thereto.
請參照圖1、圖2、圖3及圖4,在驅動背板10的俯視圖中,於接合區112a內,第一導電圖案層170與第二導電圖案層190具有共同開口區O,共同開口區O即第一導電圖案層170的第一開口170a與第二導電圖案層190的第二開口190a相重疊處,而遮光圖案層120完全地遮蔽共同開口區O。 Please refer to FIG. 1, FIG. 2, FIG. 3 and FIG. 4. In the top view of the driving backplane 10, in the joint area 112a, the first conductive pattern layer 170 and the second conductive pattern layer 190 have a common opening area O, and the common opening is The area O is where the first opening 170a of the first conductive pattern layer 170 and the second opening 190a of the second conductive pattern layer 190 overlap, and the light-shielding pattern layer 120 completely blocks the common opening area O.
在本實施例中,第一導電圖案層170與第二導電圖案層190的共同開口區O重疊於遮光圖案層120及背面線路240的一部分。也就是說,遮光圖案層120遮蔽了背面線路240未被第一導電圖案層170及第二導電圖案層190遮蔽的地方。藉此,光束(未繪示)不易從正面112傳遞至背面線路240而被背面線路240反射。如此一來,使用者便不容易從正面112上看到背面線路240,從而提升包括驅動背板10之顯示裝置的視覺效果。 In this embodiment, the common opening area O of the first conductive pattern layer 170 and the second conductive pattern layer 190 overlaps a part of the light-shielding pattern layer 120 and the backside circuit 240 . That is to say, the light-shielding pattern layer 120 blocks the parts of the backside circuit 240 that are not blocked by the first conductive pattern layer 170 and the second conductive pattern layer 190 . Thereby, the light beam (not shown) is not easily transmitted from the front surface 112 to the back circuit 240 and is reflected by the back circuit 240 . In this way, the user cannot easily see the rear circuit 240 from the front 112 , thereby improving the visual effect of the display device including the driving backplane 10 .
請參照圖1、圖3、圖4及圖5,在本實施例中,第一導電圖案層170的第一開口170a與第二導電圖案層190的第二開口190a互相交錯,以定義第一導電圖案層170與第二導電圖案層190的共同開口區O。詳細而言,在本實施例中,第一導電圖案層170的第一開口170a呈條狀且大致上在第二方向y上延伸,第二導電圖案層190的第二開口190a呈環狀,環狀之第二開口190a的其中一段在第一方向x上延伸,呈條狀的第一導電圖案層170的第一開口170a與呈環狀的第二導電圖案層190的第二開口190a的其中一段相交錯,以定義共同開口區O,但本發明不以此為限。 Please refer to FIGS. 1 , 3 , 4 and 5 . In this embodiment, the first opening 170 a of the first conductive pattern layer 170 and the second opening 190 a of the second conductive pattern layer 190 are interlaced with each other to define the first opening 170 a of the second conductive pattern layer 190 . The common opening area O of the conductive pattern layer 170 and the second conductive pattern layer 190 . Specifically, in this embodiment, the first opening 170a of the first conductive pattern layer 170 is in a strip shape and extends substantially in the second direction y, and the second opening 190a of the second conductive pattern layer 190 is in a ring shape. One section of the annular second opening 190a extends in the first direction x, and the first opening 170a of the strip-shaped first conductive pattern layer 170 and the second opening 190a of the annular second conductive pattern layer 190 are One section is staggered to define a common opening area O, but the invention is not limited thereto.
請參照圖1、圖3、圖4、圖5及圖6,在本實施例中,在驅動背板10的俯視圖中,於接合區112a內,第一導電圖案層170、第二導電圖案層190及第三導電圖案層210具有共同開口區O。第三導電圖案層210的第三開口210a與第一導電圖案層170的第一開口170a相交錯且與第二導電圖案層190的第二開口190a重疊,以定義第一導電圖案層170、第二導電圖案層190及第三導電圖案層210的共同開口區O。 Please refer to Figures 1, 3, 4, 5 and 6. In this embodiment, in the top view of the driving backplane 10, in the joint area 112a, the first conductive pattern layer 170 and the second conductive pattern layer 190 and the third conductive pattern layer 210 have a common opening area O. The third openings 210a of the third conductive pattern layer 210 intersect with the first openings 170a of the first conductive pattern layer 170 and overlap with the second openings 190a of the second conductive pattern layer 190 to define the first conductive pattern layer 170, The common opening area O of the two conductive pattern layers 190 and the third conductive pattern layer 210.
請參照圖7,在本實施例中,接合區112a具有第一邊界112a-1、第二邊界112a-2、第三邊界112a-3及第四邊界112a-4,第一邊界112a-1相對於第二邊界112a-2,第三邊界112a-3連接於第一邊界112a-1與第二邊界112a-2之間,且第四邊界112a-4相對於第三邊界112a-3且連接於第一邊界112a-1與第二邊界112a-2之間;第四絕緣層230的多個貫孔231、232位於接合區112a內;多個貫孔231、232包括分別靠近第一邊界112a-1及第二邊界112a-2的第一貫孔232a及第二貫孔231a;多個貫孔231、232在第一方向x上排列,多個貫孔231、232的每一者在與第一方向x實質上垂直的第二方向y上具寬度W,第一貫孔232a與接合區112a的第一邊界112a-1在第一方向x上具有距離A1,第二貫孔231a與接合區112a的第二邊界112a-2在第一方向x上具有距離A2,第一貫孔232a與接合區112a的第三邊界112a-3在第二方向y上具有距離A3,第一貫孔232a與接合區112a的第四邊界112a-4在第二方向y上具有距離A4, 0.25WA10.75W,0.25WA20.75W,0.35WA30.85W,且0.35WA40.85W。舉例而言,在本實施例中,寬度W、距離A1、距離A2、距離A3及距離A2可分別為85μm、50μm、50μm、55μm及60μm,但本發明不以此為限。另外,在本實施例中,接合區112a在第一方向x上的寬度Wx及在第二方向y上的寬度Wy可分別為400μm及200μm;但本發明不以此為限。 Please refer to Figure 7. In this embodiment, the joint area 112a has a first boundary 112a-1, a second boundary 112a-2, a third boundary 112a-3 and a fourth boundary 112a-4. The first boundary 112a-1 is opposite to At the second boundary 112a-2, the third boundary 112a-3 is connected between the first boundary 112a-1 and the second boundary 112a-2, and the fourth boundary 112a-4 is relative to the third boundary 112a-3 and connected to Between the first boundary 112a-1 and the second boundary 112a-2; the plurality of through-holes 231, 232 of the fourth insulating layer 230 are located in the joint area 112a; the plurality of through-holes 231, 232 include areas respectively close to the first boundary 112a- 1 and the first through hole 232a and the second through hole 231a of the second boundary 112a-2; the plurality of through holes 231 and 232 are arranged in the first direction x, and each of the plurality of through holes 231 and 232 is in contact with the A direction x is substantially vertical and a second direction y has a width W. The first through hole 232a and the first boundary 112a-1 of the joint area 112a have a distance A1 in the first direction x. The second through hole 231a and the joint area 112a have a width W. The second boundary 112a-2 of 112a has a distance A2 in the first direction x. The first through hole 232a and the third boundary 112a-3 of the joint area 112a have a distance A3 in the second direction y. The fourth boundary 112a-4 of the bonding area 112a has a distance A4, 0.25W in the second direction y A1 0.75W, 0.25W A2 0.75W, 0.35W A3 0.85W, and 0.35W A4 0.85W. For example, in this embodiment, the width W, distance A1, distance A2, distance A3 and distance A2 may be 85 μm, 50 μm, 50 μm, 55 μm and 60 μm respectively, but the invention is not limited thereto. In addition, in this embodiment, the width Wx of the bonding area 112a in the first direction x and the width Wy in the second direction y may be 400 μm and 200 μm respectively; however, the invention is not limited thereto.
10:驅動背板 10:Drive backplane
110:基板 110:Substrate
112:正面 112:front
114:背面 114:Back
120:遮光圖案層 120:Light-shielding pattern layer
130:緩衝層 130:Buffer layer
140:閘絕緣層 140: Gate insulation layer
150:層間介電層 150: Interlayer dielectric layer
160:第一絕緣層 160: First insulation layer
170:第一導電圖案層 170: First conductive pattern layer
170a:第一開口 170a: First opening
171、191、211:第一導電區塊 171, 191, 211: first conductive block
172:第二導電區塊 172: Second conductive block
180:第二絕緣層 180: Second insulation layer
190:第二導電圖案層 190: Second conductive pattern layer
190a:第二開口 190a:Second opening
200:第三絕緣層 200:Third insulation layer
210:第三導電圖案層 210: The third conductive pattern layer
210a:第三開口 210a: Third opening
230:第四絕緣層 230:Fourth insulation layer
240:背面線路 240:Back line
O:共同開口區 O: Common opening area
I-I’:剖線 I-I’: section line
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TW202209282A (en) * | 2020-08-24 | 2022-03-01 | 錼創顯示科技股份有限公司 | Display apparatus and method of fabricating the same |
TW202215652A (en) * | 2020-10-14 | 2022-04-16 | 友達光電股份有限公司 | Display panel and method for manufacturing the same |
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