TWI817277B - Resin supply mechanism and resin sealing device provided with same - Google Patents
Resin supply mechanism and resin sealing device provided with same Download PDFInfo
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- TWI817277B TWI817277B TW110145365A TW110145365A TWI817277B TW I817277 B TWI817277 B TW I817277B TW 110145365 A TW110145365 A TW 110145365A TW 110145365 A TW110145365 A TW 110145365A TW I817277 B TWI817277 B TW I817277B
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- Prior art keywords
- resin
- supply mechanism
- block
- piece
- workpiece
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- 239000011347 resin Substances 0.000 title claims abstract description 264
- 229920005989 resin Polymers 0.000 title claims abstract description 264
- 238000007789 sealing Methods 0.000 title claims abstract description 103
- 230000007246 mechanism Effects 0.000 title claims abstract description 61
- 238000001816 cooling Methods 0.000 claims description 21
- 230000007257 malfunction Effects 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- 239000002826 coolant Substances 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 230000032258 transport Effects 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
本發明提供一種能夠抑制動作不良的樹脂供給機構及具備其的樹脂封裝裝置。一種樹脂供給機構（123），向利用樹脂對工件進行樹脂封裝的樹脂封裝模具供給樹脂料片，且包括：塊體（130），形成有對樹脂料片（P）進行保持的筒狀的料片保持孔（125）；及推杆（135），在料片保持孔（125）的內周自樹脂料片（P）的保持位置的上方滑動；塊體（130）構成為能夠藉由介質的流動來冷卻。The present invention provides a resin supply mechanism capable of suppressing malfunction and a resin sealing device provided with the same. A resin supply mechanism (123) supplies resin pieces to a resin sealing mold that encapsulates workpieces with resin, and includes a block (130) formed with a cylindrical material holding the resin piece (P). The piece holding hole (125); and the push rod (135) slide from above the holding position of the resin piece (P) on the inner circumference of the piece holding hole (125); the block (130) is configured to be able to pass through the medium flow to cool.
Description
本發明是有關於一種樹脂供給機構及具備其的樹脂封裝裝置。 The present invention relates to a resin supply mechanism and a resin packaging device provided with the same.
在利用樹脂對工件進行樹脂封裝的樹脂封裝裝置中，樹脂料片例如藉由裝載機機械手所包括的樹脂供給機構而供給至樹脂封裝模具。 In a resin sealing device that seals a workpiece with resin, the resin piece is supplied to the resin sealing mold by, for example, a resin supply mechanism included in a loader robot.
在專利文獻1中公開了一種樹脂供給機構，其包括：料片保持孔，將上表面開口而形成；及遮門，控制料片保持孔內部的樹脂材料的排出，在料片保持孔的側壁面的周圍形成有冷卻用介質的流路。 Patent Document 1 discloses a resin supply mechanism that includes: a tablet holding hole formed by opening an upper surface; and a shutter that controls the discharge of the resin material inside the tablet holding hole. A flow path for cooling medium is formed around the wall surface.
[現有技術文獻] [Prior art documents]
[專利文獻] [Patent Document]
[專利文獻1]日本專利特開2002-127186號公報 [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-127186
然而，在專利文獻1中記載的樹脂供給機構中，在加熱後的樹脂固化而附著於料片保持孔的內壁的情況下，有時阻礙樹脂向樹脂封裝模具的供給。 However, in the resin supply mechanism described in Patent Document 1, when the heated resin solidifies and adheres to the inner wall of the tablet holding hole, supply of the resin to the resin sealing mold may be hindered.
本發明是鑒於此種情況而成，本發明的目的為提供一種能夠抑制動作不良的樹脂供給機構及具備其的樹脂封裝裝置。 The present invention has been made in view of such circumstances, and an object of the present invention is to provide a resin supply mechanism capable of suppressing malfunction and a resin sealing device provided with the same.
本發明的一形態的樹脂供給機構是向利用樹脂對工件進行樹脂封裝的樹脂封裝模具供給樹脂料片的樹脂供給機構，且包括：塊體，形成有對樹脂料片進行保持的筒狀的料片保持孔；及推杆，在料片保持孔的內周自樹脂料片的保持位置的上方滑動；塊體構成為能夠藉由介質的流動來冷卻。 A resin supply mechanism according to one aspect of the present invention is a resin supply mechanism that supplies a resin tablet to a resin sealing mold that seals a workpiece with resin, and includes a block formed with a cylindrical material holding the resin tablet. The piece holding hole; and the push rod slide on the inner periphery of the piece holding hole from above the holding position of the resin piece; the block is configured to be cooled by the flow of the medium.
根據本發明，可提供一種能夠抑制動作不良的樹脂供給機構及具備其的樹脂封裝裝置。 According to the present invention, it is possible to provide a resin supply mechanism capable of suppressing malfunction and a resin sealing device provided with the same.
1:樹脂封裝裝置 1: Resin packaging device
10:內模組 10: Internal module
13:索引部 13:Index Department
15:供給料盒 15: Supply box
17:料片供給部 17: Film supply department
19:工件加熱部 19: Workpiece heating part
20~50:壓制模組 20~50: Suppression module
21~51:樹脂封裝模具(模制模具) 21~51: Resin packaging mold (molding mold)
90:外模組 90:Outer module
91:去廢料機託盤 91:Remove scrap machine tray
93:去廢料機機械手 93: Waste removal machine manipulator
95:收納料盒 95: Storage box
100:裝載機 100:Loader
120:裝載機機械手 120:Loader manipulator
121、122:工件保持部 121, 122: Workpiece holding part
123:樹脂供給機構 123: Resin supply mechanism
125:料片保持孔 125: Piece holding hole
127:遮門 127: Cover the door
130:塊體 130:Block
131、132:側壁部 131, 132: Side wall part
133、134、233、234、333、334、433、434、533、534、633、634:管路 133, 134, 233, 234, 333, 334, 433, 434, 533, 534, 633, 634: pipeline
133in、134in、333in、334in、433in、633in、634in:入口 133in, 134in, 333in, 334in, 433in, 633in, 634in: entrance
133out、134out、333out、334out、433out、633out、634out:出口 133out, 134out, 333out, 334out, 433out, 633out, 634out: exit
135:推杆 135:Putter
139:熱交換部 139:Heat exchange department
139a、139b:路徑 139a, 139b: path
200:卸載機 200:Unloader
223、323、423、523、623:樹脂供給機構 223, 323, 423, 523, 623: Resin supply mechanism
300:引導部 300: Guidance Department
P:樹脂料片 P:Resin sheet
W:工件 W: workpiece
圖1是概略地表示第一實施方式的樹脂封裝裝置的結構的平面圖。 FIG. 1 is a plan view schematically showing the structure of the resin sealing device according to the first embodiment.
圖2是概略地表示第一實施方式的裝載機的結構的剖面圖。 FIG. 2 is a cross-sectional view schematically showing the structure of the loader according to the first embodiment.
圖3是沿著圖2所示的樹脂供給機構的III-III線的剖面圖。 FIG. 3 is a cross-sectional view taken along line III-III of the resin supply mechanism shown in FIG. 2 .
圖4是概略地表示冷卻用介質的流動的圖。 FIG. 4 is a diagram schematically showing the flow of the cooling medium.
圖5是概略地表示第二實施方式的樹脂供給機構的結構的剖面圖。 FIG. 5 is a cross-sectional view schematically showing the structure of the resin supply mechanism of the second embodiment.
圖6是概略地表示第三實施方式的樹脂供給機構的結構的剖面圖。 6 is a cross-sectional view schematically showing the structure of a resin supply mechanism according to the third embodiment.
圖7是概略地表示第四實施方式的樹脂供給機構的結構的剖面圖。 7 is a cross-sectional view schematically showing the structure of a resin supply mechanism according to the fourth embodiment.
圖8是概略地表示第五實施方式的樹脂供給機構的結構的剖 面圖。 8 is a cross-section schematically showing the structure of the resin supply mechanism of the fifth embodiment. Surface diagram.
圖9是概略地表示第六實施方式的樹脂供給機構的結構的剖面圖。 9 is a cross-sectional view schematically showing the structure of a resin supply mechanism according to the sixth embodiment.
以下，參照附圖對本發明的實施方式進行說明。各實施方式的附圖是例示，各部的尺寸或形狀是示意性的，不應將本申請發明的技術範圍限定於所述實施方式來解釋。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings of each embodiment are illustrative, and the size or shape of each part is schematic, and the technical scope of the present invention should not be construed as being limited to the embodiment.
<第一實施方式> <First Embodiment>
參照圖1~圖3對本發明的實施方式的樹脂封裝裝置1的結構進行說明。圖1是概略地表示第一實施方式的樹脂封裝裝置的結構的平面圖。圖2是概略地表示第一實施方式的裝載機的結構的剖面圖。圖3是沿著圖2所示的樹脂供給機構的III-III線的剖面圖。 The structure of the resin sealing device 1 according to the embodiment of the present invention will be described with reference to FIGS. 1 to 3 . FIG. 1 is a plan view schematically showing the structure of the resin sealing device according to the first embodiment. FIG. 2 is a cross-sectional view schematically showing the structure of the loader according to the first embodiment. FIG. 3 is a cross-sectional view taken along line III-III of the resin supply mechanism shown in FIG. 2 .
在各個附圖中，為了明確各個附圖彼此的關係並有助於理解各構件的位置關係，有時為了方便而標注包含X軸、Y軸及Z軸的正交坐標系。將包含X軸及Y軸的面設為“XY面”，將Z軸的箭頭所朝的方向設為上方向，將與Z軸的箭頭朝向相反的方向設為下方向。 In each drawing, in order to clarify the relationship between the drawings and to help understand the positional relationship of each component, an orthogonal coordinate system including the X-axis, Y-axis, and Z-axis is sometimes labeled for convenience. Let the plane including the X-axis and the Y-axis be called the "XY plane", let the direction in which the arrow of the Z-axis points is called the upward direction, and let the direction opposite to the direction of the arrow of the Z-axis be called the downward direction.
樹脂封裝裝置1用於利用樹脂對工件W進行樹脂封裝(模製成形)。如圖1所示，樹脂封裝裝置1包括：內模組10，供給樹脂封裝前的工件W；壓制模組20、壓制模組30、壓制模組40、壓制模組50，利用樹脂對工件W進行樹脂封裝；以及外模組90，回收樹脂封裝後的工件W。另外，樹脂封裝裝置1包括遍及內模組10、壓制模組20~壓制模組50及外模組90設置的搬送機構。 The resin sealing device 1 is used for resin sealing (molding) the workpiece W with resin. As shown in Figure 1, the resin encapsulating device 1 includes: an inner mold set 10 that supplies workpieces W before resin encapsulation; a pressing module 20, a pressing module 30, a pressing module 40, and a pressing module 50 that use resin to seal the workpiece W. Resin encapsulation is performed; and the outer mold set 90 recovers the resin-encapsulated workpiece W. In addition, the resin sealing device 1 includes a conveyance mechanism provided throughout the inner mold set 10 , the pressing mold sets 20 to 50 , and the outer mold set 90 .
在圖1所示的例子中構成為，內模組10、壓制模組20~壓制模組50及外模組90分別在X軸方向上排列配置，裝載機100及卸載機200能夠沿著遍及所述各模組延伸的引導部300移動。 In the example shown in FIG. 1 , the inner module 10 , the pressing modules 20 to 50 , and the external module 90 are respectively arranged in the X-axis direction, and the loader 100 and the unloader 200 can move along the entire The extended guide portion 300 of each module moves.
樹脂封裝裝置1利用樹脂對工件W進行樹脂封裝。樹脂封裝裝置1例如是藉由注入至閉合的樹脂封裝模具(模制模具)21~樹脂封裝模具(模制模具)51的型腔中的樹脂的填充壓力對工件W進行樹脂封裝的轉移成形機。此外，在以下所示的例子中，作為樹脂封裝裝置的一例，說明包括對工件W進行樹脂封裝的壓制模組20~壓制模組50的裝置整體，但本發明的樹脂封裝裝置未必限於包括壓制模組。本發明的樹脂封裝裝置只要是具有本實施方式的樹脂供給機構的裝置(例如，裝載機、裝載機機械手等)且用於工件的樹脂封裝即可。 The resin sealing device 1 resin seals the workpiece W with resin. The resin sealing device 1 is, for example, a transfer molding machine that resin seals the workpiece W by the filling pressure of the resin injected into the cavities of the closed resin sealing molds (molding molds) 21 to 51 . In addition, in the example shown below, as an example of a resin sealing apparatus, the entire apparatus including the press module 20 to the press module 50 for resin-sealing the workpiece W will be described. However, the resin sealing device of the present invention is not necessarily limited to the device including the press module 20 to the press module 50 . Mods. The resin sealing device of the present invention may be a device (for example, a loader, a loader robot, etc.) having the resin supply mechanism of the present embodiment and used for resin sealing of workpieces.
樹脂封裝裝置1例如是對半導體元件進行樹脂封裝的半導體樹脂封裝裝置。在此情況下，工件W例如包括半導體元件及半導體元件的支撐體。工件W並無限定，例如可為裝設有半導體元件的引線框架、裝設有半導體元件的仲介層(interposer)基板、或者暫時貼合有半導體元件的帶有粘著片的載體板(carrier plate)等。另外，樹脂封裝裝置1並不限定於用於半導體模制裝置中，也可用於對例如微機電系統(Micro-Electro-Mechanical System，MEMS)晶片、電子器件或這些的組合進行樹脂封裝的樹脂封裝裝置中。 The resin sealing device 1 is, for example, a semiconductor resin sealing device that seals a semiconductor element with resin. In this case, the workpiece W includes, for example, a semiconductor element and a support for the semiconductor element. The workpiece W is not limited, and may be, for example, a lead frame on which semiconductor elements are mounted, an interposer substrate on which semiconductor elements are mounted, or a carrier plate with an adhesive sheet on which semiconductor elements are temporarily bonded. )wait. In addition, the resin sealing device 1 is not limited to being used in a semiconductor molding device, but may also be used for resin sealing, for example, a micro-electro-mechanical system (MEMS) chip, an electronic device, or a combination thereof. device.
以下，對圖1所示的各模組的結構進行說明。 Next, the structure of each module shown in Figure 1 will be described.
內模組10包括供給料盒(magazine)15、索引(index)部13、料片供給部17以及工件加熱部19。多個樹脂封裝前的工件W以在Z軸方 向上重疊的方式收納於供給料盒15中。在向索引部13供給工件W的工件供給部排列有多個供給料盒15。索引部13對工件W的朝向進行定位。例如，索引部13是能夠旋轉地設置的台，使自供給料盒15接收的兩個工件W以彼此的相同邊相向的方式排列。索引部13將排列好的兩個工件W供給至工件加熱部19。料片供給部17將排列好的多個樹脂料片P供給至裝載機機械手120。樹脂料片P例如是將樹脂的粉末或顆粒等呈柱體狀壓固而成，或者是將樹脂呈柱體狀成形而成。工件加熱部19在將工件W搬入樹脂封裝模具21~樹脂封裝模具51前進行預備加熱(以下，設為“預熱”)，來減小工件W與樹脂封裝模具21~樹脂封裝模具51的溫度差。工件加熱部19構成為能夠自索引部13直接接收工件W。 The inner mold set 10 includes a magazine 15 , an index part 13 , a piece supply part 17 and a workpiece heating part 19 . The workpiece W before multiple resin encapsulation is in the Z-axis direction It is stored in the supply box 15 in an upward overlapping manner. A plurality of supply cassettes 15 are arranged in a workpiece supply unit that supplies workpieces W to the index unit 13 . The index portion 13 positions the direction of the workpiece W. For example, the index unit 13 is a rotatably provided table, and arranges two workpieces W received from the supply cassette 15 so that the same sides of each other face each other. The index unit 13 supplies the two aligned workpieces W to the workpiece heating unit 19 . The tablet supply unit 17 supplies the plurality of aligned resin tablets P to the loader robot 120 . The resin tablet P is, for example, a resin powder or granule that is pressed into a columnar shape, or a resin that is formed into a columnar shape. The workpiece heating unit 19 performs preliminary heating (hereinafter referred to as “preheating”) before moving the workpiece W into the resin sealing mold 21 to the resin sealing mold 51 to reduce the temperature of the workpiece W and the resin sealing mold 21 to the resin sealing mold 51 Difference. The workpiece heating unit 19 is configured to receive the workpiece W directly from the index unit 13 .
壓制模組20、壓制模組30、壓制模組40、壓制模組50分別包括樹脂封裝模具21、樹脂封裝模具31、樹脂封裝模具41、樹脂封裝模具51。壓制模組20~壓制模組50在X軸方向上排列，樹脂封裝模具21~樹脂封裝模具51也在X軸方向上排列。樹脂封裝模具21~樹脂封裝模具51分別是例如包含下模具及上模具的能夠開閉的一對模具。壓制模組20~壓制模組50分別能夠將工件W保持在形成於樹脂封裝模具21~樹脂封裝模具51各自的內部(下模具與上模具之間)的型腔中。而且，壓制模組20~壓制模組50分別藉由將樹脂注入至所述型腔中而對工件W進行樹脂封裝。注入至型腔中的樹脂是使樹脂料片P在樹脂封裝模具21~樹脂封裝模具51各自的內部液化而成。在本實施方式中，樹脂封裝裝置1例如包括四個壓制模組，但壓制模組的數量能夠適當變更。 The pressing module 20 , the pressing module 30 , the pressing module 40 , and the pressing module 50 respectively include a resin sealing mold 21 , a resin sealing mold 31 , a resin sealing mold 41 , and a resin sealing mold 51 . The pressing modules 20 to 50 are arranged in the X-axis direction, and the resin sealing molds 21 to 51 are also arranged in the X-axis direction. The resin sealing mold 21 to the resin sealing mold 51 are, for example, a pair of openable and closable molds including a lower mold and an upper mold. The pressing die sets 20 to 50 can hold the workpiece W in a cavity formed inside each of the resin sealing molds 21 to 51 (between the lower mold and the upper mold). Furthermore, the pressing modules 20 to 50 respectively inject resin into the mold cavity to resin-encapsulate the workpiece W. The resin injected into the cavity is obtained by liquefying the resin piece P inside each of the resin sealing mold 21 to the resin sealing mold 51 . In the present embodiment, the resin sealing device 1 includes, for example, four press die sets, but the number of press die sets can be changed appropriately.
外模組90包括去廢料機託盤(degate pallet)91、去廢料機機械 手(degate hand)93及收納料盒95。去廢料機託盤91自卸載機200接收連接了無用樹脂的狀態的工件W，並搬送至去廢料機機械手93的下方。去廢料機機械手93自所搬送的工件W中分離無用樹脂。分離出的無用樹脂被回收至廢料箱中。分離出的工件W被收納於收納料盒95中。多個模製成形完畢的工件W在Z軸方向上堆積收納於收納料盒95中。在回收工件W的工件收納部排列有多個收納料盒95。自壓制模組20~壓制模組50觀察，外模組90設置於與內模組10相反的一側。但是，各模組的配置並不限定於所述，內模組10及外模組90也可設置於自壓制模組20~壓制模組50觀察時相同的一側。 The outer module 90 includes a degate pallet 91 and a degate machine. Degate hand 93 and storage box 95. The scraper tray 91 receives the workpiece W with the useless resin connected thereto from the unloader 200 , and transports it to the bottom of the scraper robot 93 . The scrapper robot 93 separates useless resin from the conveyed workpiece W. The separated useless resin is recycled into the waste bin. The separated workpiece W is stored in the storage box 95 . A plurality of molded workpieces W are stacked and stored in the storage box 95 in the Z-axis direction. A plurality of storage boxes 95 are arranged in a workpiece storage portion where the workpieces W are collected. Viewed from the pressing module 20 to the pressing module 50 , the outer module 90 is disposed on the opposite side to the internal module 10 . However, the arrangement of each module is not limited to the above. The inner module 10 and the external module 90 may also be disposed on the same side when viewed from the pressing module 20 to the pressing module 50 .
搬送機構具有引導部300、裝載機100及卸載機200。引導部300以橫穿內模組10、壓制模組20~壓制模組50及外模組90的方式在X軸方向上延伸。裝載機100及卸載機200各自的基座部分構成為能夠沿著引導部300在X軸方向上移動。裝載機100的裝載機機械手120構成為能夠相對於基座部分在Y軸方向上移動。即，裝載機機械手120構成為能夠進入樹脂封裝模具21~樹脂封裝模具51的內部。卸載機200的卸載機機械手也同樣地構成為能夠進入樹脂封裝模具21~樹脂封裝模具51的內部。 The conveyance mechanism has a guide part 300, a loader 100, and an unloader 200. The guide part 300 extends in the X-axis direction across the inner mold set 10 , the pressing mold sets 20 to 50 , and the outer mold set 90 . The base portions of the loader 100 and the unloader 200 are configured to be movable in the X-axis direction along the guide portion 300 . The loader robot 120 of the loader 100 is configured to be movable in the Y-axis direction relative to the base portion. That is, the loader robot 120 is configured to be able to enter the inside of the resin sealing mold 21 to the resin sealing mold 51 . The unloader robot of the unloader 200 is similarly configured to be able to enter the inside of the resin sealing mold 21 to the resin sealing mold 51 .
搬送機構對工件W及樹脂料片P進行搬送。具體而言，裝載機100將工件W及樹脂料片P自內模組10搬送至壓制模組20~壓制模組50，裝載機100的裝載機機械手120將工件W及樹脂料片P搬入樹脂封裝模具21~樹脂封裝模具51。卸載機200的卸載機機械手自樹脂封裝模具21~樹脂封裝模具51搬出樹脂封裝完畢的工件W，卸載機200將樹脂封裝完畢的工件W自壓制模組20~壓制模組50搬送至外模組90。 The conveyance mechanism conveys the workpiece W and the resin piece P. Specifically, the loader 100 transports the workpiece W and the resin piece P from the inner module 10 to the pressing module 20 to the pressing module 50, and the loader robot 120 of the loader 100 carries the workpiece W and the resin piece P in. Resin sealing mold 21~resin sealing mold 51. The unloader robot of the unloader 200 unloads the resin-sealed workpiece W from the resin sealing mold 21 to the resin sealing mold 51 , and the unloader 200 transports the resin-sealed workpiece W from the pressing module 20 to the pressing module 50 to the outer mold. Group 90.
如圖2所示，裝載機機械手120包括：工件保持部121、工件保持部122，對工件W進行保持；及樹脂供給機構123，將樹脂料片P供給至樹脂封裝模具21~樹脂封裝模具51。 As shown in FIG. 2 , the loader robot 120 includes: a workpiece holding part 121 and a workpiece holding part 122 for holding the workpiece W; and a resin supply mechanism 123 for supplying the resin piece P to the resin sealing mold 21 ~ the resin sealing mold. 51.
工件保持部121、工件保持部122在X軸方向上排列設置。工件保持部121、工件保持部122是為了將由工件加熱部19加熱後的工件W搬送至樹脂封裝模具21~樹脂封裝模具51的各個而進行保持。裝載機機械手120將被工件保持部121、工件保持部122保持的兩個工件W一體地搬入樹脂封裝模具21~樹脂封裝模具51的內部，並交付給例如下模具的上表面。 The workpiece holding part 121 and the workpiece holding part 122 are arranged side by side in the X-axis direction. The workpiece holding parts 121 and 122 hold the workpiece W heated by the workpiece heating part 19 to each of the resin sealing mold 21 to the resin sealing mold 51 . The loader robot 120 integrally carries the two workpieces W held by the workpiece holding parts 121 and 122 into the resin sealing molds 21 to 51 and delivers them to, for example, the upper surface of the lower mold.
樹脂供給機構123設置於工件保持部121與工件保持部122之間。樹脂供給機構123具有：塊體130，形成有對樹脂料片P進行保持的料片保持孔125；遮門127，構成為能夠對料片保持孔125的下方進行開閉；及推杆135，在料片保持孔125的內周自樹脂料片P的保持位置的上方滑動。此推杆135構成為在上方與一個塊體一體地連結，能夠藉由利用未圖示的驅動源驅動此塊體來升降。樹脂供給機構123將樹脂料片P搬入樹脂封裝模具21~樹脂封裝模具51的內部，並交付給下模具的罐(未圖示)。 The resin supply mechanism 123 is provided between the workpiece holding part 121 and the workpiece holding part 122. The resin supply mechanism 123 includes a block 130 formed with a piece holding hole 125 for holding the resin piece P, a shutter 127 configured to open and close below the piece holding hole 125, and a push rod 135. The inner periphery of the tablet holding hole 125 slides from above the holding position of the resin tablet P. This push rod 135 is configured to be integrally connected to a block above, and can be raised and lowered by driving the block using a drive source (not shown). The resin supply mechanism 123 carries the resin piece P into the inside of the resin sealing mold 21 to the resin sealing mold 51, and delivers it to the tank of the lower mold (not shown).
料片保持孔125是為了將樹脂料片P搬送至樹脂封裝模具21~樹脂封裝模具51而進行保持。具體而言，料片保持孔125收容自料片供給部17接收的樹脂料片P。料片保持孔125在下側具有開口端，由推杆135堵塞上側。料片保持孔125的保持樹脂料片P的位置的剖面形狀例如可與樹脂料片P的剖面形狀(外周形狀)大致一致。為了順利地收容樹脂料片P並加以供給，料片保持孔125的形狀理想為圓孔。此外，由於料片保持孔 125的內周的形狀只要可穩定地保持樹脂料片P的外形即可，因此也可並非支撐樹脂料片P的整周的結構。在此情況下，也可設為突起成在圓周方向上以一定間隔沿著樹脂料片P的外周的結構。在圖示的例子中，多個料片保持孔125在Y軸方向上排列成一列。但是，多個料片保持孔125的排列方式並不限定於此，也可以形成多個列的方式排列。 The tablet holding hole 125 is used to transport and hold the resin tablet P to the resin sealing mold 21 to the resin sealing mold 51 . Specifically, the tablet holding hole 125 accommodates the resin tablet P received from the tablet supply part 17 . The tablet holding hole 125 has an open end on the lower side, and the upper side is blocked by the push rod 135 . The cross-sectional shape of the position where the resin tablet P is held in the tablet holding hole 125 may be substantially consistent with the cross-sectional shape (outer peripheral shape) of the resin tablet P, for example. In order to smoothly accommodate and supply the resin tablet P, the shape of the tablet holding hole 125 is preferably a circular hole. In addition, due to the sheet holding holes The shape of the inner circumference of 125 only needs to be able to stably maintain the outer shape of the resin piece P, so it does not have to be a structure that supports the entire circumference of the resin piece P. In this case, a structure may be adopted in which protrusions are formed along the outer circumference of the resin piece P at regular intervals in the circumferential direction. In the illustrated example, the plurality of tablet holding holes 125 are arranged in a row in the Y-axis direction. However, the arrangement of the plurality of tablet holding holes 125 is not limited to this, and may also be arranged in a plurality of rows.
塊體130構成為能夠藉由介質的流動來冷卻。具體而言，在塊體130的內部形成有供冷卻用介質流動的多個管路(管路133及管路134)。管路133形成於塊體130中位於相對於多個料片保持孔125而言的工件保持部121側(一側)的側壁部131。管路134形成於塊體130中位於相對於多個料片保持孔125而言的工件保持部122側(另一側)的側壁部132。管路134的一部分在X軸方向上隔著多個料片保持孔125而與管路133的一部分相向。即，管路133與管路134相當於形成為彼此的至少一部分隔著多個料片保持孔125而相向的一對管路。管路133相當於第一管路，管路134相當於第二管路。在管路133及管路134的內部流動的冷卻用介質例如是空氣，但並不限定於此。冷卻用介質也可為空氣以外的氣體，也可為液體。 The block 130 is configured to be cooled by the flow of a medium. Specifically, a plurality of pipe lines (pipe lines 133 and 134 ) through which the cooling medium flows are formed inside the block 130 . The pipe 133 is formed in the side wall portion 131 of the block 130 located on the workpiece holding portion 121 side (one side) with respect to the plurality of blank holding holes 125 . The pipe 134 is formed in the side wall portion 132 of the block 130 located on the workpiece holding portion 122 side (the other side) with respect to the plurality of blank holding holes 125 . A part of the pipe 134 faces a part of the pipe 133 via the plurality of tablet holding holes 125 in the X-axis direction. That is, the pipe line 133 and the pipe line 134 correspond to a pair of pipe lines formed so that at least part of each other faces each other across the plurality of tablet holding holes 125 . The pipeline 133 corresponds to the first pipeline, and the pipeline 134 corresponds to the second pipeline. The cooling medium flowing inside the pipe line 133 and the pipe line 134 is, for example, air, but is not limited thereto. The cooling medium may be a gas other than air or a liquid.
此外，供冷卻塊體130的介質流動的管路可為一根。此種管路可僅形成於側壁部131及側壁部132的任一個內部，也可形成為介質通過兩者的內部。在多個料片保持孔125以形成多個列的方式排列的情況下，也可在各個列之間(在X軸方向上相鄰的料片保持孔125彼此之間)形成管路。另外，也可在Y軸方向上相鄰的料片保持孔125彼此之間形成管路。 In addition, there may be only one pipeline for the medium flowing in the cooling block 130 . This type of pipeline may be formed only inside either the side wall part 131 or the side wall part 132, or may be formed so that the medium passes through both of them. When a plurality of tablet holding holes 125 are arranged to form a plurality of rows, pipes may be formed between rows (between adjacent tablet holding holes 125 in the X-axis direction). In addition, a pipeline may be formed between the adjacent piece holding holes 125 in the Y-axis direction.
在管路133的內部流動的介質自入口133in朝向出口133out流 動。在管路134的內部流動的介質自入口134in朝向出口134out流動。如圖3所示，管路133的入口133in相對於多個料片保持孔125而形成於Y軸的箭頭朝向的方向(以下，設為“Y軸正方向”)的一側。管路133的出口133out相對於多個料片保持孔125而形成於Y軸的箭頭朝向的方向的相反方向(以下，設為“Y軸負方向”)一側。與管路133相反，管路134的入口134in相對於多個料片保持孔125而形成於Y軸負方向的一側，管路134的出口134out相對於多個料片保持孔125而形成于Y軸正方向的一側。例如，管路133的入口133in與管路134的出口134out在X軸方向上相向，管路133的出口133out與管路134的入口134in在X軸方向上相向。 The medium flowing inside the pipe 133 flows from the inlet 133in toward the outlet 133out. move. The medium flowing inside the pipe 134 flows from the inlet 134in toward the outlet 134out. As shown in FIG. 3 , the inlet 133in of the pipe line 133 is formed on one side of the plurality of tablet holding holes 125 in the direction in which the arrow of the Y-axis points (hereinafter, referred to as the “Y-axis positive direction”). The outlet 133out of the pipe 133 is formed on the opposite direction (hereinafter, referred to as the “Y-axis negative direction”) side to the direction in which the arrow of the Y-axis points with respect to the plurality of tablet holding holes 125 . Contrary to the pipe 133, the inlet 134in of the pipe 134 is formed on one side in the negative direction of the Y-axis relative to the plurality of tablet holding holes 125, and the outlet 134out of the pipe 134 is formed on the plurality of tablet holding holes 125. The side in the positive direction of the Y-axis. For example, the inlet 133in of the pipeline 133 and the outlet 134out of the pipeline 134 are opposite to each other in the X-axis direction, and the outlet 133out of the pipeline 133 and the inlet 134in of the pipeline 134 are opposite to each other in the X-axis direction.
冷卻用介質向管路133的供給方向與冷卻用介質向管路134的供給方向在Y軸方向上是彼此相反的方向。即，冷卻用介質自入口133in流入管路133的方向是Y軸負方向，相對於此，冷卻用介質自入口134in流入管路134的方向是Y軸正方向。同樣地，來自管路133的冷卻用介質的排出方向與來自管路134的冷卻用介質的排出方向在Y軸方向上是彼此相反的方向。即，冷卻用介質自管路133向出口133out流出的方向是Y軸負方向，相對於此，冷卻用介質自管路134向出口134out流出的方向是Y軸正方向。 The supply direction of the cooling medium to the pipe line 133 and the supply direction of the cooling medium to the pipe line 134 are opposite to each other in the Y-axis direction. That is, the direction in which the cooling medium flows into the pipe 133 from the inlet 133in is the negative Y-axis direction, whereas the direction in which the cooling medium flows into the pipe 134 from the inlet 134in is the positive Y-axis direction. Similarly, the discharge direction of the cooling medium from the pipe line 133 and the discharge direction of the cooling medium from the pipe line 134 are opposite to each other in the Y-axis direction. That is, the direction in which the cooling medium flows out from the pipe line 133 to the outlet 133out is the negative Y-axis direction, whereas the direction in which the cooling medium flows out from the pipe line 134 toward the outlet 134out is the positive Y-axis direction.
管路133具有第一去路、第一回路及第二去路，且成為它們在上下方向(Z軸方向)上折返兩次的結構。第一去路與入口133in連接，在Y軸方向上延伸。第一回路與第一去路折返連接，在Y軸方向上延伸。第二去路與第一回路折返連接，在Y軸方向上延伸，並與出口133out連接。第一去路、第一回路及第二去路分別配置成自X軸方向觀察時與多個料片 保持孔125的各個交叉。第一回路位於第一去路的下方，第二回路位於第一回路的下方。 The pipe 133 has a first forward path, a first return path, and a second forward path, and has a structure in which they are folded twice in the up-and-down direction (Z-axis direction). The first outlet is connected to the entrance 133in and extends in the Y-axis direction. The first loop is connected to the first outbound route in a reciprocal manner and extends in the Y-axis direction. The second outgoing path is connected to the first return path, extends in the Y-axis direction, and is connected to the outlet 133out. The first outgoing path, the first return path and the second outgoing path are respectively arranged to be connected to a plurality of pieces when viewed from the X-axis direction. Each intersection of holes 125 is maintained. The first loop is located below the first outgoing route, and the second loop is located below the first loop.
與管路133同樣地，管路134具有：第三去路，與入口134in連接，在Y軸方向上延伸；第二回路，與第三去路折返連接；及第四去路，與第二回路折返連接，在Y軸方向上延伸，並與出口134out連接。管路134的第三去路設置於隔著料片保持孔125與管路133的第一去路對應的位置，管路134的第二回路設置於隔著料片保持孔125與管路133的第一回路對應的位置，管路134的第四去路設置於隔著料片保持孔125與管路133的第二去路對應的位置。管路133、管路134分別具有在Y軸方向上延伸的去路及回路，由此可延長塊體130內的距離而有效率地冷卻。 Like the pipeline 133, the pipeline 134 has a third outward path connected to the inlet 134in and extending in the Y-axis direction; a second return path connected to the third outward path in a loop; and a fourth outward path connected to the second loop in a loop. , extending in the Y-axis direction and connected with outlet 134out. The third outlet of the pipeline 134 is provided at a position corresponding to the first outlet of the pipeline 133 across the piece holding hole 125 , and the second loop of the pipeline 134 is provided at a position corresponding to the first outlet of the pipeline 133 across the piece holding hole 125 . Corresponding to the position of the primary circuit, the fourth outlet of the pipe 134 is provided at a position corresponding to the second outlet of the pipe 133 across the piece holding hole 125 . The pipeline 133 and the pipeline 134 respectively have an outgoing path and a return path extending in the Y-axis direction, thereby extending the distance within the block 130 and cooling efficiently.
在管路133與管路134的彼此于X軸方向上相向的部分中，介質在彼此相反的方向上流動。即，管路134的第三去路中的介質的流動方向與管路133的第一去路中的介質的流動方向是相反的方向。第二回路與第一回路中的介質的流動方向也是相反的方向，第四去路與第二去路中的介質的流動方向也是相反的方向。如上所述，藉由隔著料片保持孔125在管路133與管路134中反向流動，可防止塊體130在Y軸方向上不均勻地冷卻。 In the portions of the pipe 133 and the pipe 134 facing each other in the X-axis direction, the media flow in opposite directions to each other. That is, the flow direction of the medium in the third forward path of the pipe line 134 is opposite to the flow direction of the medium in the first forward path of the pipe line 133 . The flow directions of the medium in the second loop and the first loop are also in opposite directions, and the flow directions of the medium in the fourth and second outgoing paths are also in opposite directions. As described above, by reversely flowing in the pipe 133 and the pipe 134 across the piece holding hole 125, the block 130 can be prevented from being cooled unevenly in the Y-axis direction.
此外，管路133、管路134各自的去路及回路的結構並不限定於所述結構，例如，第二回路也可位於第三去路的上方，第四去路也可位於第二回路的上方。即，管路134的第三去路也可與管路133的第二去路在X軸方向上相向，管路134的第四去路也可與管路133的第一去路在X軸方向上相向。另外，第一回路也可位於第一去路的上方，第二去路也可位於 第一回路的上方。另外，管路133、管路134分別也可還具有去路及回路。 In addition, the structures of the outlet and return paths of the pipelines 133 and 134 are not limited to the above structures. For example, the second loop may be located above the third outlet, and the fourth outlet may be located above the second loop. That is, the third outlet of the pipe 134 may be opposite to the second outlet of the pipe 133 in the X-axis direction, and the fourth outlet of the pipe 134 may be opposite to the first outlet of the pipe 133 in the X-axis direction. In addition, the first return path can also be located above the first outgoing path, and the second outgoing path can also be located above Above the first circuit. In addition, the pipeline 133 and the pipeline 134 may each have an outgoing path and a return path.
如圖4所示，管路133、管路134分別自一個路徑分支。具體而言，管路133的入口133in及管路134的入口134in分別連接於與熱交換部139連接的一個路徑139a。另外，管路133的出口133out及管路134的出口134out分別連接於與熱交換部139連接的一個路徑139b。熱交換部139自路徑139b取入冷卻塊體130而升溫的製冷劑，進行冷卻而供給至路徑139a。熱交換部139包括使製冷劑在路徑139a或路徑139b中循環的泵。即，冷卻塊體130的製冷劑不被排出地進行循環。就防止樹脂片等塵埃散亂的觀點而言，熱交換部139理想為構成為不在樹脂封裝模具21~樹脂封裝模具51的內部進行排氣。 As shown in FIG. 4 , the pipeline 133 and the pipeline 134 each branch from one path. Specifically, the inlet 133in of the pipe 133 and the inlet 134in of the pipe 134 are each connected to one path 139a connected to the heat exchange part 139. In addition, the outlet 133out of the pipe 133 and the outlet 134out of the pipe 134 are respectively connected to one path 139b connected to the heat exchange part 139. The heat exchange part 139 takes in the refrigerant heated by the cooling block 130 from the path 139b, cools it, and supplies it to the path 139a. The heat exchange part 139 includes a pump that circulates the refrigerant in the path 139a or the path 139b. That is, the refrigerant cooling block 130 circulates without being discharged. From the viewpoint of preventing dust such as resin sheets from scattering, the heat exchange part 139 is preferably configured so as not to exhaust gas inside the resin sealing mold 21 to the resin sealing mold 51 .
遮門127例如構成為能夠在Y軸方向上移動，在將樹脂料片P收容於料片保持孔125的時間點或自料片保持孔125放出樹脂料片P的時間點開放料片保持孔125。另外，遮門127在將樹脂料片P保持於料片保持孔125中的期間關閉料片保持孔125，從而防止樹脂料片P的落下。 The shutter 127 is configured to be movable in the Y-axis direction, for example, and to open the tablet holding hole when the resin tablet P is accommodated in the tablet holding hole 125 or when the resin tablet P is released from the tablet holding hole 125 . 125. In addition, the shutter 127 closes the tablet holding hole 125 while holding the resin tablet P in the tablet holding hole 125, thereby preventing the resin tablet P from falling.
推杆135構成為能夠沿著料片保持孔125的內周面在Z軸方向上上下移動。推杆135的外周面以能夠滑動的方式與料片保持孔125的內周面相接。推杆135具有擠出樹脂料片P的功能、及將附著於料片保持孔125的內周面的樹脂片(樹脂粉)去除的功能。例如，在僅藉由樹脂料片P軟化而附著於料片保持孔125的內周面來開放遮門127時樹脂料片P難以落下的情況下，推杆135將樹脂料片P擠出，促使向樹脂封裝模具21~樹脂封裝模具51的各個供給樹脂料片P。另外，在樹脂料片P的一部分附著於料片保持孔125的內周面的情況下，推杆135擠出阻礙樹脂供給機構123 的動作的樹脂附著物並加以去除。 The push rod 135 is configured to be movable up and down in the Z-axis direction along the inner peripheral surface of the tablet holding hole 125 . The outer peripheral surface of the push rod 135 is slidably connected to the inner peripheral surface of the piece holding hole 125 . The push rod 135 has the function of extruding the resin tablet P and the function of removing the resin tablet (resin powder) adhered to the inner peripheral surface of the tablet holding hole 125 . For example, when the resin piece P is difficult to fall when the shutter 127 is opened only because the resin piece P is softened and adheres to the inner peripheral surface of the piece holding hole 125, the push rod 135 extrudes the resin piece P. The supply of the resin piece P to each of the resin sealing mold 21 to the resin sealing mold 51 is prompted. In addition, when a part of the resin tablet P adheres to the inner peripheral surface of the tablet holding hole 125 , the push rod 135 is extruded and hinders the resin supply mechanism 123 The action of the resin attachment and remove it.
此種樹脂附著物的去除可在樹脂封裝模具21~樹脂封裝模具51各自的內部進行，也可在樹脂封裝模具21~樹脂封裝模具51各自的外部進行。例如，在樹脂附著物劣化，供給至樹脂封裝模具21~樹脂封裝模具51後成為不良品的產生要因的情況下，樹脂附著物(例如硬化物或碳化物)的去除是在樹脂封裝模具21~樹脂封裝模具51各自的外部進行。在樹脂附著物尚未劣化的情況下，樹脂附著物(例如微粉)的去除是在樹脂封裝模具21~樹脂封裝模具51各自的內部進行，樹脂附著物也可用作樹脂封裝的材料。 Such resin attachments may be removed inside the resin sealing mold 21 to the resin sealing mold 51 , or may be removed from the outside of the resin sealing mold 21 to the resin sealing mold 51 . For example, when the resin deposits deteriorate and become a cause of defective products after being supplied to the resin sealing molds 21 to 51 , the resin deposits (such as hardened substances or carbides) are removed in the resin sealing molds 21 to 51 . Resin sealing is performed on the respective outsides of the molds 51 . When the resin attachment has not deteriorated, the resin attachment (for example, fine powder) is removed inside each of the resin sealing mold 21 to the resin sealing mold 51 . The resin attachment may also be used as a material for the resin sealing.
推杆135除了具有在料片保持孔125的內周滑動的滑動部分之外，還可具有自滑動部分向下方突起的突起部分。在此情況下，擠出樹脂料片P的功能是突起部分承擔，將附著於料片保持孔125的內周面的樹脂片去除的功能是滑動部分承擔。如上所述，根據推杆135具有突起部分的結構，可減低推杆135與樹脂料片P的接觸面積，並抑制經由推杆135的樹脂料片P的加熱。 The push rod 135 may have a protruding portion protruding downward from the sliding portion in addition to a sliding portion that slides on the inner periphery of the tablet holding hole 125 . In this case, the function of extruding the resin tablet P is assumed by the protruding portion, and the function of removing the resin tablet attached to the inner peripheral surface of the tablet holding hole 125 is assumed by the sliding portion. As described above, according to the structure in which the push rod 135 has the protruding portion, the contact area between the push rod 135 and the resin piece P can be reduced, and the heating of the resin piece P via the push rod 135 can be suppressed.
如上所述，樹脂供給機構123包括：塊體130，形成有對樹脂料片P進行保持的料片保持孔125；及推杆135，在料片保持孔125的內周自樹脂料片P的保持位置的上方滑動，塊體130構成為能夠藉由介質的流動來冷卻。 As described above, the resin supply mechanism 123 includes: the block 130 having the tablet holding hole 125 for holding the resin tablet P; and the push rod 135 extending from the inner circumference of the tablet holding hole 125 from the resin tablet P. Sliding upward while maintaining the position, the block 130 is configured to be cooled by the flow of the medium.
據此，可藉由塊體130的冷卻來抑制樹脂附著於料片保持孔125，即便樹脂附著，也可藉由推杆135來去除。因此，可抑制樹脂供給機構123的動作不良。 Accordingly, the cooling of the block 130 can prevent resin from adhering to the piece holding hole 125 , and even if the resin adheres, it can be removed by the push rod 135 . Therefore, malfunction of the resin supply mechanism 123 can be suppressed.
另外，冷卻塊體130的介質是空氣。 In addition, the medium for cooling the block 130 is air.
據此，與使用其他介質的結構相比，介質的補充或塊體130的整備中的作業性提高。 This improves workability in replenishing the medium and maintaining the block 130 compared to a structure using other media.
另外，在塊體130的內部形成有供介質流動的多個管路133、管路134。 In addition, a plurality of pipes 133 and 134 through which the medium flows are formed inside the block 130 .
據此，可自內部冷卻塊體130，因此冷卻效率提高。另外，與自外部冷卻塊體130的結構相比，能夠對更靠近料片保持孔125的區域進行冷卻，因此可更有效率地抑制樹脂附著於料片保持孔125。 According to this, the block 130 can be cooled from the inside, so the cooling efficiency is improved. In addition, compared with a structure in which the block 130 is cooled from the outside, a region closer to the tablet holding hole 125 can be cooled, so that adhesion of resin to the tablet holding hole 125 can be suppressed more efficiently.
另外，在塊體130中形成有彼此的至少一部分隔著多個料片保持孔125而相向的一對管路133、134，管路133形成於多個料片保持孔125的一側，管路134形成於多個料片保持孔125的另一側。 In addition, a pair of pipes 133 and 134 are formed in the block 130 and at least part of them face each other across the plurality of tablet holding holes 125. The pipe 133 is formed on one side of the plurality of tablet holding holes 125. A path 134 is formed on the other side of the plurality of tablet holding holes 125 .
據此，塊體130中與多個料片保持孔125的各個靠近的區域自其中一側及另一側此兩側被冷卻，因此可更有效率地抑制樹脂附著於料片保持孔125。另外，可以塊體130中與多個料片保持孔125的各個靠近的區域的溫度差變小的方式進行冷卻。 Accordingly, the area in the block 130 that is close to each of the plurality of tablet holding holes 125 is cooled from one side and the other side, so that the adhesion of resin to the tablet holding holes 125 can be more efficiently suppressed. In addition, cooling can be performed so that the temperature difference between the block 130 and the regions close to each of the plurality of tablet holding holes 125 becomes small.
另外，介質向管路133的供給方向與介質向管路134的供給方向是彼此相反的方向。 In addition, the supply direction of the medium to the pipe line 133 and the supply direction of the medium to the pipe line 134 are opposite directions to each other.
據此，可以塊體130中與多個料片保持孔125的各個靠近的區域的溫度差進一步變小的方式進行冷卻。 Accordingly, cooling can be performed so that the temperature difference in the area close to each of the plurality of tablet holding holes 125 in the block 130 is further reduced.
另外，管路133、管路134分別自一個路徑分支。 In addition, the pipeline 133 and the pipeline 134 each branch from one path.
據此，供給至管路133的介質的溫度與供給至管路134的介質的溫度大致相同，可以塊體130中與多個料片保持孔125的各個靠近的區域的溫 度差進一步變小的方式進行冷卻。 Accordingly, the temperature of the medium supplied to the pipeline 133 is substantially the same as the temperature of the medium supplied to the pipeline 134 , and the temperature of the area in the block 130 close to each of the plurality of tablet holding holes 125 can be adjusted. Cooling is performed in such a way that the temperature difference becomes smaller.
另外，樹脂供給機構123還包括熱交換部139，所述熱交換部139自冷卻塊體130的介質吸取熱，冷卻塊體130的介質進行循環。 In addition, the resin supply mechanism 123 further includes a heat exchange part 139 that absorbs heat from the medium that cools the block 130 and circulates the medium that cools the block 130 .
據此，可防止樹脂片等塵埃因排氣而在樹脂封裝模具21~樹脂封裝模具51的內部散亂。 Accordingly, it is possible to prevent dust such as resin sheets from being scattered inside the resin sealing mold 21 to the resin sealing mold 51 due to exhaust gas.
此外，在第一實施方式中，列舉轉移成形機為例進行了說明，但本發明的實施方式的樹脂封裝裝置1只要是使用樹脂供給機構123來供給樹脂料片P的裝置，則並無限定。例如，樹脂封裝裝置1也可為與樹脂封裝模具的合模聯動地對供給至打開狀態的樹脂封裝模具的樹脂進行加壓的壓縮成形機。 In addition, in the first embodiment, a transfer molding machine is taken as an example. However, the resin sealing device 1 according to the embodiment of the present invention is not limited as long as it uses the resin supply mechanism 123 to supply the resin tablet P. . For example, the resin sealing apparatus 1 may be a compression molding machine that pressurizes resin supplied to an opened resin sealing mold in conjunction with mold closing of the resin sealing mold.
以下，對本發明的其他實施方式的樹脂封裝裝置1的結構進行說明。此外，在下述實施方式中，關於與所述第一實施方式共通的事項，省略敘述，僅對不同的方面進行說明。特別是，不依次提及由相同的結構帶來的相同的作用效果。 Hereinafter, the structure of the resin sealing device 1 according to another embodiment of the present invention will be described. In the following embodiments, descriptions of matters common to those of the first embodiment will be omitted, and only differences will be described. In particular, the same effects brought about by the same structure are not mentioned sequentially.
<第二實施方式> <Second Embodiment>
參照圖5對第二實施方式的樹脂供給機構223的結構進行說明。圖5是概略地表示第二實施方式的樹脂供給機構的結構的剖面圖。 The structure of the resin supply mechanism 223 of the second embodiment will be described with reference to FIG. 5 . FIG. 5 is a cross-sectional view schematically showing the structure of the resin supply mechanism of the second embodiment.
在塊體130中形成有相當於第一管路的管路233與相當於第二管路的管路234。管路233、管路234分別形成為在塊體130的上端部與下端部之間多次往返。管路233、管路234分別具有在Z軸方向上延伸並在Y軸方向上排列的多個直線狀部分、及將鄰接的直線狀部分彼此連接的多個折返部分。管路233與管路234彼此的大致整體在X軸方向上相向。 A pipe 233 corresponding to the first pipe and a pipe 234 corresponding to the second pipe are formed in the block 130 . The pipeline 233 and the pipeline 234 are respectively formed to reciprocate multiple times between the upper end and the lower end of the block 130 . The pipes 233 and 234 each have a plurality of linear portions extending in the Z-axis direction and arranged in the Y-axis direction, and a plurality of turn-back portions connecting adjacent linear portions to each other. Substantially the entire pipe line 233 and the pipe line 234 face each other in the X-axis direction.
據此，在塊體130中多個料片保持孔125各自的附近，可減低Z軸方向上的溫度不均。 Accordingly, temperature unevenness in the Z-axis direction can be reduced near each of the plurality of tablet holding holes 125 in the block 130 .
<第三實施方式> <Third Embodiment>
參照圖6對第三實施方式的樹脂供給機構323的結構進行說明。圖6是概略地表示第三實施方式的樹脂供給機構的結構的剖面圖。 The structure of the resin supply mechanism 323 of the third embodiment will be described with reference to FIG. 6 . 6 is a cross-sectional view schematically showing the structure of a resin supply mechanism according to the third embodiment.
在塊體130中形成有相當於第一管路的管路333與相當於第二管路的管路334。管路333、管路334分別分支成在Y軸方向上延伸並在Z軸方向上排列的三個通路。管路333、管路334分別相對於多個料片保持孔125在入口333in、入口334in側分支，相對於多個料片保持孔125在出口333out、出口334out側合流。管路333與管路334彼此的大致整體在X軸方向上相向。即，管路333的三個通路與管路334的三個通路隔著多個料片保持孔125的各個而在X軸方向上相向。 A pipe 333 corresponding to the first pipe and a pipe 334 corresponding to the second pipe are formed in the block 130 . The pipeline 333 and the pipeline 334 each branch into three passages extending in the Y-axis direction and arranged in the Z-axis direction. The pipes 333 and 334 branch off on the inlet 333in and 334in sides of the plurality of tablet holding holes 125 respectively, and merge on the outlets 333out and 334out sides of the plurality of tablet holding holes 125 . The pipe line 333 and the pipe line 334 are substantially entirely opposite to each other in the X-axis direction. That is, the three passages of the duct 333 and the three passages of the duct 334 face each other in the X-axis direction via each of the plurality of tablet holding holes 125 .
據此，在介質的溫度上升而失去充分的冷卻能力前，可使介質自入口333in、入口334in的各個流動至出口333out、出口334out的各個。 According to this, the medium can be caused to flow from each of the inlets 333in and 334in to each of the outlets 333out and 334out before the temperature of the medium rises and the sufficient cooling capability is lost.
<第四實施方式> <Fourth Embodiment>
參照圖7對第四實施方式的樹脂供給機構423的結構進行說明。圖7是概略地表示第四實施方式的樹脂供給機構的結構的剖面圖。 The structure of the resin supply mechanism 423 of the fourth embodiment will be described with reference to FIG. 7 . 7 is a cross-sectional view schematically showing the structure of a resin supply mechanism according to the fourth embodiment.
在塊體130中形成有相當於第一管路的管路433與相當於第二管路的管路434。管路433、管路434各自的Z軸方向的寬度在與多個料片保持孔125在X軸方向上相向的部分中擴大。具體而言，管路433中與多個料片保持孔125在X軸方向上相向的部分的Z軸方向的寬度大於入口433in及出口433out處的管路433的Z軸方向的寬度。管路434也同樣如 此。管路433與管路434彼此的大致整體在X軸方向上相向。 A pipe 433 corresponding to the first pipe and a pipe 434 corresponding to the second pipe are formed in the block 130 . The widths of the pipe lines 433 and 434 in the Z-axis direction are enlarged in portions facing the plurality of tablet holding holes 125 in the X-axis direction. Specifically, the Z-axis direction width of the portion of the pipe 433 that faces the plurality of tablet holding holes 125 in the X-axis direction is larger than the Z-axis direction width of the pipe 433 at the inlet 433in and the outlet 433out. The same goes for pipeline 434. this. The pipe line 433 and the pipe line 434 are substantially entirely opposite to each other in the X-axis direction.
據此，冷卻用介質與塊體130接觸的面積增大，冷卻效率提高。此外，一對管路中，與在Y軸方向上相鄰的料片保持孔125之間的區域在X軸方向上相向的部分的寬度也可小於與多個料片保持孔125的各個在X軸方向上相向的部分的寬度。 Accordingly, the contact area between the cooling medium and the block 130 is increased, and the cooling efficiency is improved. In addition, in a pair of pipes, the width of the portion facing the X-axis direction between the area between the piece holding holes 125 adjacent in the Y-axis direction may be smaller than that of each of the plurality of piece holding holes 125. The width of the parts facing each other in the X-axis direction.
<第五實施方式> <Fifth Embodiment>
參照圖8對第五實施方式的樹脂供給機構523的結構進行說明。圖8是概略地表示第五實施方式的樹脂供給機構的結構的剖面圖。 The structure of the resin supply mechanism 523 of the fifth embodiment will be described with reference to FIG. 8 . 8 is a cross-sectional view schematically showing the structure of a resin supply mechanism according to the fifth embodiment.
在塊體130中形成有相當於第一管路的管路533與相當於第二管路的管路534。管路533、管路534分別在塊體130的下端部形成為直線狀。管路533與管路534隔著多個料片保持孔125各自中的樹脂料片P的保持位置而在X軸方向上彼此相向。管路533與管路534彼此的大致整體在X軸方向上相向。 A pipe 533 corresponding to the first pipe and a pipe 534 corresponding to the second pipe are formed in the block 130 . The pipe 533 and the pipe 534 are each formed in a linear shape at the lower end of the block 130 . The pipe 533 and the pipe 534 face each other in the X-axis direction via the holding position of the resin tablet P in each of the plurality of tablet holding holes 125 . Substantially the entire pipe line 533 and the pipe line 534 face each other in the X-axis direction.
據此，藉由有效率地冷卻塊體130的下端部，可抑制來自樹脂封裝模具21~樹脂封裝模具51(特別是下模具)的受熱並抑制塊體130的加熱，從而抑制樹脂料片P的加熱。 Accordingly, by efficiently cooling the lower end of the block 130, the heat from the resin sealing mold 21 to the resin sealing mold 51 (especially the lower mold) can be suppressed and the heating of the block 130 can be suppressed, thereby suppressing the resin piece P of heating.
<第六實施方式> <Sixth Embodiment>
參照圖9對第六實施方式的樹脂供給機構623的結構進行說明。圖9是概略地表示第六實施方式的樹脂供給機構的結構的剖面圖。 The structure of the resin supply mechanism 623 of the sixth embodiment will be described with reference to FIG. 9 . 9 is a cross-sectional view schematically showing the structure of a resin supply mechanism according to the sixth embodiment.
在塊體130中形成有相當於第一管路的管路633與相當於第二管路的管路634。管路633、管路634分別形成為U字狀。管路633的入口633in及出口633out此兩者均相對於多個料片保持孔125形成于Y軸正方 向的一側，並在Z軸方向上排列。出口633out位於例如入口633in的上方，但入口633in與出口633out的位置關係也可相反。管路633具有與入口633in連接並在Y軸方向上延伸的去路、與出口633out連接並在Y軸方向上延伸的回路、及相對於多個料片保持孔125在Y軸負方向的一側將去路與回路連接的折返部分。管路634的入口634in及出口634out此兩者均相對於多個料片保持孔125形成於Y軸負方向的一側，並在Z軸方向上排列。與管路633同樣地，管路634具有去路、回路及折返部分。管路633、管路634各自的去路隔著多個料片保持孔125在X軸方向上彼此相向。管路633、管路634各自的回路也同樣如此。 A pipe 633 corresponding to the first pipe and a pipe 634 corresponding to the second pipe are formed in the block 130 . The pipe 633 and the pipe 634 are each formed in a U shape. Both the inlet 633in and the outlet 633out of the pipe 633 are formed squarely on the Y-axis relative to the plurality of sheet holding holes 125. to one side and arranged in the Z-axis direction. For example, the outlet 633out is located above the inlet 633in, but the positional relationship between the inlet 633in and the outlet 633out may be reversed. The pipe 633 has an outgoing path connected to the inlet 633in and extending in the Y-axis direction, a loop connected to the outlet 633out and extending in the Y-axis direction, and one side in the negative Y-axis direction relative to the plurality of piece holding holes 125. The turnaround section that connects the outgoing route with the returning route. Both the inlet 634in and the outlet 634out of the pipe 634 are formed on one side in the negative Y-axis direction with respect to the plurality of tablet holding holes 125, and are arranged in the Z-axis direction. Like the pipeline 633, the pipeline 634 has an outgoing path, a return path, and a return portion. The respective outgoing paths of the pipes 633 and 634 face each other in the X-axis direction via the plurality of tablet holding holes 125 . The same applies to the respective circuits of the pipeline 633 and the pipeline 634.
如上所述，管路633、管路634分別具有在Y軸方向上延伸的去路及回路，也可為出口與入口形成於同一側的結構，即折返為奇數次的結構。 As mentioned above, the pipe 633 and the pipe 634 respectively have an outgoing path and a return path extending in the Y-axis direction. They may also have a structure in which the outlet and the inlet are formed on the same side, that is, a structure in which they are folded an odd number of times.
以下，附注本發明的實施方式的一部分或全部，並說明其效果。此外，本發明並不限定於以下的附注。 Hereinafter, part or all of the embodiments of the present invention will be appended and the effects thereof will be described. In addition, the present invention is not limited to the following appendices.
根據本發明的一形態，可提供一種樹脂供給機構，其向利用樹脂對工件進行樹脂封裝的樹脂封裝模具供給樹脂料片，所述樹脂供給機構包括：塊體，形成有對樹脂料片進行保持的筒狀的料片保持孔；及推杆，在料片保持孔的內周自樹脂料片的保持位置的上方滑動，塊體構成為能夠藉由介質的流動來冷卻。 According to one aspect of the present invention, it is possible to provide a resin supply mechanism that supplies a resin piece to a resin sealing mold that seals a workpiece with resin, the resin supply mechanism including a block formed to hold the resin piece. a cylindrical piece holding hole; and a push rod that slides on the inner periphery of the piece holding hole from above the holding position of the resin piece, and the block is configured to be cooled by the flow of the medium.
據此，可藉由塊體的冷卻來抑制樹脂附著於料片保持孔，即便樹脂附著，也可藉由推杆來去除。因此，可抑制樹脂供給機構123的動作不良。 Accordingly, the cooling of the block can prevent resin from adhering to the piece holding hole, and even if the resin adheres, it can be removed by the push rod. Therefore, malfunction of the resin supply mechanism 123 can be suppressed.
作為一形態，冷卻塊體的介質是空氣。 As a form, the medium cooling the block is air.
據此，與使用其他介質的結構相比，介質的補充或塊體130的整備中的作業性提高。 This improves workability in replenishing the medium and maintaining the block 130 compared to a structure using other media.
作為一形態，在塊體的內部形成有供介質流動的多個管路。 As one form, a plurality of pipes through which the medium flows are formed inside the block.
據此，可自內部冷卻塊體，因此冷卻效率提高。另外，與自外部冷卻塊體的結構相比，能夠對更靠近料片保持孔的區域進行冷卻，因此可更有效率地抑制樹脂附著於料片保持孔。 According to this, the block can be cooled from the inside, so the cooling efficiency is improved. In addition, compared with a structure in which the block is cooled from the outside, a region closer to the tablet holding hole can be cooled, so that adhesion of resin to the tablet holding hole can be suppressed more efficiently.
作為一形態，在塊體中形成有多個料片保持孔，多個管路具有彼此的至少一部分隔著多個料片保持孔而相向的一對管路，一對管路中第一管路形成於多個料片保持孔各自的一側，一對管路中第二管路形成於多個料片保持孔各自的另一側。 As one form, a plurality of tablet holding holes are formed in the block, and the plurality of pipes include a pair of pipes facing each other with at least part of the plurality of tablet holding holes interposed therebetween. The first pipe in the pair of pipes is The pipeline is formed on one side of each of the plurality of tablet holding holes, and the second pipeline in the pair of pipelines is formed on the other side of each of the plurality of tablet holding holes.
據此，塊體中與多個料片保持孔的各個靠近的區域自其中一側及另一側此兩側被冷卻，因此可更有效率地抑制樹脂附著於料片保持孔。另外，可以塊體中與多個料片保持孔的各個靠近的區域的溫度差變小的方式進行冷卻。 According to this, the area in the block close to each of the plurality of tablet holding holes is cooled from one side and the other side, so that the adhesion of resin to the tablet holding holes can be suppressed more efficiently. In addition, the cooling can be performed so that the temperature difference between the regions in the block and close to each of the plurality of tablet holding holes becomes small.
作為一形態，介質向第一管路的供給方向與介質向第二管路的供給方向是彼此相反的方向。 As one aspect, the supply direction of the medium to the first pipeline and the supply direction of the medium to the second pipeline are opposite directions to each other.
據此，可以塊體中與多個料片保持孔的各個靠近的區域的溫度差進一步變小的方式進行冷卻。 Accordingly, cooling can be performed so that the temperature difference between the regions in the block and close to each of the plurality of tablet holding holes is further reduced.
作為一形態，一對管路分別自一個路徑分支。 As a form, a pair of pipes each branch from a path.
據此，供給至第一管路的介質的溫度與供給至第二管路的介質的溫度大致相同，可以塊體中與多個料片保持孔的各個靠近的區域的溫度差進一步變小的方式進行冷卻。 According to this, the temperature of the medium supplied to the first pipeline is substantially the same as the temperature of the medium supplied to the second pipeline, and the temperature difference in the area in the block close to each of the plurality of tablet holding holes can be further reduced. way to cool down.
作為一形態，樹脂供給機構還包括熱交換部，所述熱交換部自冷卻塊體的介質吸取熱，冷卻塊體的介質進行循環。 As one aspect, the resin supply mechanism further includes a heat exchange unit that absorbs heat from a medium that cools the block and circulates the medium that cools the block.
據此，可防止樹脂片等塵埃因排氣而在樹脂封裝模具的內部散亂。 This can prevent dust such as resin sheets from being scattered inside the resin sealing mold due to exhaust gas.
可提供一種樹脂封裝裝置，其用於利用樹脂對工件進行樹脂封裝，所述樹脂封裝裝置包括：所述任一樹脂供給機構；及工件保持部，為了將預熱後的工件搬送至樹脂封裝模具而進行保持，樹脂供給機構與工件保持部構成為能夠一體地進入樹脂封裝模具的內部。 It is possible to provide a resin sealing device for sealing a workpiece with resin, the resin sealing device including: any one of the resin supply mechanisms; and a workpiece holding portion for transporting the preheated workpiece to a resin sealing mold. For holding, the resin supply mechanism and the workpiece holding part are configured to be able to integrally enter the inside of the resin sealing mold.
據此，可提供一種能夠抑制因樹脂供給機構的清掃或整備所引起的樹脂封裝品的生產能力的降低的樹脂封裝裝置。此外，此處所述的樹脂封裝裝置只要是具有本發明的一形態的樹脂供給機構的裝置且用於工件的樹脂封裝的裝置即可。例如，樹脂封裝裝置也可為將工件與樹脂料片自內模組搬送至壓制模組的裝載機。另外，樹脂封裝裝置也可為作為裝載機的一部分的、構成為能夠進入樹脂封裝模具的內部，將工件與樹脂料片搬入樹脂封裝模具的裝載機機械手。樹脂封裝裝置也可為包括內模組、壓制模組及裝載機的裝置。 Accordingly, it is possible to provide a resin sealing device capable of suppressing a decrease in the productivity of resin-sealed products due to cleaning or maintenance of the resin supply mechanism. In addition, the resin sealing device described here only needs to be a device having a resin supply mechanism according to one aspect of the present invention and used for resin sealing of workpieces. For example, the resin sealing device may be a loader that transports the workpiece and the resin piece from the inner die set to the pressing die set. In addition, the resin sealing device may be a loader robot that is part of a loader and is configured to be able to enter the inside of the resin sealing mold and carry the workpiece and the resin blank into the resin sealing mold. The resin encapsulating device may also be a device including an inner module, a pressing module, and a loader.
如以上所說明那樣，根據本發明的一形態，可提供一種能夠抑制動作不良的樹脂供給機構及具備其的樹脂封裝裝置。 As described above, according to one aspect of the present invention, it is possible to provide a resin supply mechanism capable of suppressing malfunction and a resin sealing device provided with the same.
以上所說明的實施方式是用於容易理解本發明，並非用於限定性地解釋本發明。實施方式所包括的各要素及其配置、材料、條件、形狀及尺寸等並不限定於例示的內容，可適當變更。另外，能夠將不同的實施方式中示出的結構彼此部分地置換或組合。 The above-described embodiments are provided to facilitate understanding of the present invention and are not intended to limitively interpret the present invention. Each element included in the embodiment, their arrangement, materials, conditions, shapes, dimensions, etc. are not limited to the illustrated contents and can be changed appropriately. In addition, structures shown in different embodiments can be partially replaced or combined with each other.
120:裝載機機械手 120:Loader manipulator
121、122:工件保持部 121, 122: Workpiece holding part
123:樹脂供給機構 123: Resin supply mechanism
125:料片保持孔 125: Piece holding hole
127:遮門 127: Cover the door
130:塊體 130:Block
131、132:側壁部 131, 132: Side wall part
133、134:管路 133, 134: Pipeline
135:推杆 135:Putter
P:樹脂料片 P:Resin sheet
Claims (6)
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| TW110145365A TWI817277B (en) | 2021-12-03 | 2021-12-03 | Resin supply mechanism and resin sealing device provided with same |
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| TW110145365A TWI817277B (en) | 2021-12-03 | 2021-12-03 | Resin supply mechanism and resin sealing device provided with same |
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Citations (5)
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| JP2014192362A (en) * | 2013-03-27 | 2014-10-06 | Towa Corp | Molding production apparatus, molding production method, and molding |
| JP2014222711A (en) * | 2013-05-13 | 2014-11-27 | アピックヤマダ株式会社 | Resin molding device and resin molding method |
| CN207711308U (en) * | 2017-12-19 | 2018-08-10 | 瑞鼎机电科技（昆山）有限公司 | Mold heat sink |
| TW202136014A (en) * | 2019-07-22 | 2021-10-01 | 日商山田尖端科技股份有限公司 | Workpiece move-out device and resin molding device for reducing cost and molding products in high quality |
| CN113478766A (en) * | 2021-07-15 | 2021-10-08 | 积康螺杆制造（上海）股份有限公司 | Water-cooled pneumatic silica gel nozzle |
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- 2021-12-03 TW TW110145365A patent/TWI817277B/en active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014192362A (en) * | 2013-03-27 | 2014-10-06 | Towa Corp | Molding production apparatus, molding production method, and molding |
| JP2014222711A (en) * | 2013-05-13 | 2014-11-27 | アピックヤマダ株式会社 | Resin molding device and resin molding method |
| CN207711308U (en) * | 2017-12-19 | 2018-08-10 | 瑞鼎机电科技（昆山）有限公司 | Mold heat sink |
| TW202136014A (en) * | 2019-07-22 | 2021-10-01 | 日商山田尖端科技股份有限公司 | Workpiece move-out device and resin molding device for reducing cost and molding products in high quality |
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