TWI814905B - 切晶黏晶膜 - Google Patents

切晶黏晶膜 Download PDF

Info

Publication number
TWI814905B
TWI814905B TW108133774A TW108133774A TWI814905B TW I814905 B TWI814905 B TW I814905B TW 108133774 A TW108133774 A TW 108133774A TW 108133774 A TW108133774 A TW 108133774A TW I814905 B TWI814905 B TW I814905B
Authority
TW
Taiwan
Prior art keywords
adhesive layer
die
adhesive
semiconductor wafer
film
Prior art date
Application number
TW108133774A
Other languages
English (en)
Chinese (zh)
Other versions
TW202020996A (zh
Inventor
杉村敏正
大西謙司
高本尚英
戶崎裕
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=70111487&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI814905(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202020996A publication Critical patent/TW202020996A/zh
Application granted granted Critical
Publication of TWI814905B publication Critical patent/TWI814905B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
TW108133774A 2018-10-05 2019-09-19 切晶黏晶膜 TWI814905B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018190407A JP7075326B2 (ja) 2018-10-05 2018-10-05 ダイシングダイボンドフィルム
JP2018-190407 2018-10-05

Publications (2)

Publication Number Publication Date
TW202020996A TW202020996A (zh) 2020-06-01
TWI814905B true TWI814905B (zh) 2023-09-11

Family

ID=70111487

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108133774A TWI814905B (zh) 2018-10-05 2019-09-19 切晶黏晶膜

Country Status (4)

Country Link
JP (1) JP7075326B2 (ja)
KR (1) KR102675702B1 (ja)
CN (1) CN111004588A (ja)
TW (1) TWI814905B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022024510A1 (ja) * 2020-07-30 2022-02-03 古河電気工業株式会社 接着剤用組成物及びフィルム状接着剤、並びに、フィルム状接着剤を用いた半導体パッケージ及びその製造方法
KR20220072634A (ko) * 2020-11-25 2022-06-02 (주)이녹스첨단소재 스페이서용 다층 필름 및 이를 이용한 스페이서 형성 방법
JP2022116799A (ja) * 2021-01-29 2022-08-10 日東電工株式会社 電子部品転写用粘着シートおよび電子部品転写用粘着シートを用いた電子部品の加工方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201443193A (zh) * 2013-04-05 2014-11-16 Nitto Denko Corp 黏著帶
JP2017034117A (ja) * 2015-08-03 2017-02-09 日立化成株式会社 ダイシング・ダイボンディング一体型テープ
JP2017066395A (ja) * 2015-09-30 2017-04-06 東レ株式会社 積層体
TW201816866A (zh) * 2016-10-03 2018-05-01 日東電工股份有限公司 切割帶一體型接著片
TW201816862A (zh) * 2016-07-29 2018-05-01 日商日東電工股份有限公司 切割帶一體型半導體背面用膜、及半導體裝置之製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4876451B2 (ja) 2005-06-27 2012-02-15 日立化成工業株式会社 接着シート
JP5255465B2 (ja) 2009-01-29 2013-08-07 古河電気工業株式会社 ウエハ加工用テープ
JP2011187571A (ja) * 2010-03-05 2011-09-22 Nitto Denko Corp ダイシング・ダイボンドフィルム
JP2012069586A (ja) * 2010-09-21 2012-04-05 Nitto Denko Corp ダイシング・ダイボンドフィルム、ダイシング・ダイボンドフィルムの製造方法、及び、半導体装置の製造方法
WO2014142194A1 (ja) * 2013-03-15 2014-09-18 日東電工株式会社 粘着シート
JP2014082498A (ja) * 2013-11-11 2014-05-08 Nitto Denko Corp ダイシング・ダイボンドフィルムの製造方法
JP6379389B2 (ja) 2014-12-15 2018-08-29 リンテック株式会社 ダイシングダイボンディングシート
JP2017183705A (ja) * 2016-03-24 2017-10-05 日東電工株式会社 ダイシングダイボンドフィルム、及び、半導体装置の製造方法
JP6339619B2 (ja) * 2016-03-31 2018-06-06 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP6712916B2 (ja) * 2016-07-11 2020-06-24 日東電工株式会社 粘着シート

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201443193A (zh) * 2013-04-05 2014-11-16 Nitto Denko Corp 黏著帶
JP2017034117A (ja) * 2015-08-03 2017-02-09 日立化成株式会社 ダイシング・ダイボンディング一体型テープ
JP2017066395A (ja) * 2015-09-30 2017-04-06 東レ株式会社 積層体
TW201816862A (zh) * 2016-07-29 2018-05-01 日商日東電工股份有限公司 切割帶一體型半導體背面用膜、及半導體裝置之製造方法
TW201816866A (zh) * 2016-10-03 2018-05-01 日東電工股份有限公司 切割帶一體型接著片

Also Published As

Publication number Publication date
KR20200039567A (ko) 2020-04-16
TW202020996A (zh) 2020-06-01
CN111004588A (zh) 2020-04-14
JP7075326B2 (ja) 2022-05-25
KR102675702B1 (ko) 2024-06-19
JP2020061423A (ja) 2020-04-16

Similar Documents

Publication Publication Date Title
TWI769242B (zh) 切晶黏晶膜
CN109111867B (zh) 切割芯片接合薄膜
TW201923868A (zh) 黏晶膜、切晶黏晶膜及半導體裝置製造方法
CN108727999B (zh) 切割芯片接合薄膜
TW201907470A (zh) 切晶帶、切晶黏晶膜、及半導體裝置之製造方法
TWI814821B (zh) 切晶黏晶膜及半導體裝置製造方法
TW201908438A (zh) 切晶帶、切晶黏晶膜、及半導體裝置製造方法
TWI814905B (zh) 切晶黏晶膜
TW201843270A (zh) 切晶黏晶膜
TW202035605A (zh) 接著膜、附有切晶帶之接著膜、及半導體裝置製造方法
TW201916132A (zh) 切晶帶及切晶黏晶膜
TW202013534A (zh) 切晶黏晶膜
TW201843269A (zh) 切晶黏晶膜
TWI817969B (zh) 切晶黏晶膜
TW202100690A (zh) 切晶黏晶膜
TW201842120A (zh) 切晶黏晶膜
CN108728000B (zh) 切割芯片接合薄膜
TWI811452B (zh) 切晶黏晶膜
JP7224231B2 (ja) ダイシングダイボンドフィルム
JP7381315B2 (ja) ダイシングテープ付き接着フィルム
CN108735650B (zh) 切割芯片接合薄膜
TW202028392A (zh) 切晶黏晶膜