TWI813142B - Lifting pin holder, lifting pin assembly and plasma processing device - Google Patents
Lifting pin holder, lifting pin assembly and plasma processing device Download PDFInfo
- Publication number
- TWI813142B TWI813142B TW111103111A TW111103111A TWI813142B TW I813142 B TWI813142 B TW I813142B TW 111103111 A TW111103111 A TW 111103111A TW 111103111 A TW111103111 A TW 111103111A TW I813142 B TWI813142 B TW I813142B
- Authority
- TW
- Taiwan
- Prior art keywords
- lifting pin
- lifting
- petal
- pin holder
- tightening member
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims abstract description 22
- 238000003780 insertion Methods 0.000 claims abstract description 27
- 230000037431 insertion Effects 0.000 claims abstract description 27
- 238000006243 chemical reaction Methods 0.000 claims description 26
- 239000013013 elastic material Substances 0.000 claims description 3
- 229920001973 fluoroelastomer Polymers 0.000 claims description 2
- 238000007373 indentation Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 26
- 238000010586 diagram Methods 0.000 description 17
- 239000007789 gas Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920006169 Perfluoroelastomer Polymers 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Arc Welding In General (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
- Plasma Technology (AREA)
- Treatment Of Fiber Materials (AREA)
Abstract
本發明提供了一種升降銷的固定器、升降銷組件及等離子體處理裝置，包括主體、瓣狀件和第一緊箍件，實現升降銷的***空間的內部直徑可彈性變化以適應升降銷的活動調節，並且結合緊箍件對瓣狀件的束縛，起到對升降銷穩定夾持的作用，在瓣狀件上還設置有凹痕，用於固定緊箍件的位置，防止緊箍件的滑動造成束縛程度的波動，在瓣狀件外側設置複數個緊箍件用於加強束縛效果，此外，在分割瓣狀件的槽下部設置有緩衝孔，提高瓣狀件的彈性，同時可用於***空間的抽真空。 The invention provides a lifting pin holder, a lifting pin assembly and a plasma processing device, which include a main body, a petal-shaped member and a first tightening member, so that the internal diameter of the insertion space of the lifting pin can be elastically changed to adapt to the lifting pin. It is movable to adjust, and combined with the binding of the clamping member to the petal-shaped member, it plays a role in stably clamping the lifting pin. There are also indentations on the petal-shaped member to fix the position of the clamping member and prevent the clamping member from The sliding movement causes fluctuations in the degree of restraint. A plurality of tight hoops are set outside the petals to enhance the restraint effect. In addition, a buffer hole is provided at the lower part of the groove that divides the petals to improve the elasticity of the petals and can also be used for Vacuuming of the insertion space.
Description
本發明涉及等離子體蝕刻技術領域，尤其涉及一種升降銷固定器、升降銷組件及等離子體處理裝置技術領域。 The present invention relates to the technical field of plasma etching, and in particular to the technical field of a lifting pin holder, a lifting pin assembly and a plasma processing device.
對半導體基片或襯底的微加工是一種眾所周知的技術，可以用來製造例如，半導體、平板顯示器、發光二極管(LED)、太陽能電池等。微加工製造的一個重要步驟為等離子體處理製程步驟，該製程步驟在一反應室內部進行。 Micromachining of semiconductor substrates or substrates is a well-known technology that can be used to manufacture, for example, semiconductors, flat panel displays, light emitting diodes (LEDs), solar cells, etc. An important step in micromachining manufacturing is the plasma treatment process step, which is performed inside a reaction chamber.
在半導體處理中，升降銷用於支撐基片上下移動，在反應前，機械臂托著基片送入反應室放在處於高位的升降銷上，機械臂撤出，升降銷降落到低位將基片放在靜電夾盤上。在等離子體對基片處理後，升降銷再次上升到高位將基片頂起，機械臂重新***基片下方將基片取出反應室。 In semiconductor processing, the lifting pin is used to support the substrate to move up and down. Before the reaction, the robot arm carries the substrate into the reaction chamber and places it on the lifting pin at a high position. The robot arm withdraws and the lifting pin drops to a low position to lift the substrate. Place the piece on the electrostatic chuck. After the substrate is processed by plasma, the lifting pin rises to a high position again to lift the substrate, and the mechanical arm is re-inserted under the substrate to take the substrate out of the reaction chamber.
升降銷在低位時頂部的大部分位於靜電夾盤的基座中，當升降銷頻繁的與基座中的側壁摩擦時，容易發生豎直方向的偏移，進一步導致摩擦更劇烈，一方面會產生顆粒污染物，更嚴重的一方面是複數個升降銷在高位時伸出靜電夾盤的高度不一致，會造成基片托舉不穩，在低位時不能降到靜電夾盤表面以下而頂破基片。 When the lifting pin is in the low position, most of the top part is located in the base of the electrostatic chuck. When the lifting pin frequently rubs against the side wall in the base, it is easy to deflect in the vertical direction, further causing the friction to become more severe. On the one hand, it will Particulate contamination is generated. The more serious aspect is that the heights of the plurality of lifting pins extending out of the electrostatic chuck are inconsistent when they are in the high position, which will cause the substrate to be unstable. When it is in the low position, it cannot be lowered below the surface of the electrostatic chuck and breaks. substrate.
為了解決上述技術問題，本發明提供一種升降銷固定器，包括：主體，所述主體頂部設置有複數個瓣狀件；***口，所述***口位於複數個所述瓣狀件之間，且向主體內部延伸，用於容納所述升降銷；第一緊箍件，可活動設置於所述瓣狀件的外側，用於使複數個所述瓣狀件至少部分貼緊所述升降銷。 In order to solve the above technical problems, the present invention provides a lifting pin fixator, which includes: a main body, a plurality of petals are provided on the top of the body; an insertion port, the insertion port is located between the plurality of petals, and Extending toward the inside of the main body, it is used to accommodate the lifting pin; the first clamping member is movably arranged on the outside of the petal-shaped member, and is used to make a plurality of the petal-shaped members at least partially close to the lifting pin.
可選地，所述瓣狀件為4個。 Optionally, there are four petals.
可選地，所述***口的內部直徑小於等於所述升降銷的直徑。 Optionally, the inner diameter of the insertion opening is less than or equal to the diameter of the lifting pin.
可選地，所述***口的內部直徑大於所述升降銷的直徑，所述瓣狀件的內側包括複數個突起。 Optionally, the inner diameter of the insertion opening is larger than the diameter of the lifting pin, and the inner side of the petal-shaped member includes a plurality of protrusions.
可選地，複數個所述瓣狀件藉由槽分隔開。 Optionally, a plurality of said petals are separated by slots.
可選地，所述主體的側壁設置有複數個緩衝孔，所述緩衝孔位於所述槽的底部。 Optionally, the side wall of the main body is provided with a plurality of buffer holes, and the buffer holes are located at the bottom of the groove.
可選地，所述***口向主體內部延伸的長度大於等於所述升降銷長度的三分之一。 Optionally, the length of the insertion opening extending into the main body is greater than or equal to one-third of the length of the lifting pin.
可選地，還包括第二緊箍件，位於所述第一緊箍件的下方。 Optionally, a second tightening member is also included, located below the first tightening member.
可選地，所述瓣狀件的外側設置有凹痕，用於固定所述第一緊箍件的位置。 Optionally, an indentation is provided on the outside of the petal-shaped member for fixing the position of the first tightening member.
可選地，所述第一緊箍件和第二緊箍件為彈性材料。 Optionally, the first tightening member and the second tightening member are made of elastic material.
可選地，所述第一緊箍件和第二緊箍件為氟橡膠或全氟橡膠。 Optionally, the first tightening member and the second tightening member are fluororubber or perfluororubber.
可選地，所述主體為圓柱狀結構。 Optionally, the main body is a cylindrical structure.
可選地，所述***口的內部設置有內螺紋，所述升降銷的外側壁設置有外螺紋。 Optionally, the interior of the insertion opening is provided with internal threads, and the outer side wall of the lifting pin is provided with external threads.
進一步地，本發明還提供了一種升降銷組件，包括：底座；複數個如上述任一項所述的升降銷固定器，所述升降銷固定器與底座連接；複數個升降銷，所述升降銷與所述升降銷固定器對應，且升降銷的底部部分***升降銷固定器內。 Further, the present invention also provides a lifting pin assembly, including: a base; a plurality of lifting pin holders as described in any one of the above, the lifting pin holders are connected to the base; a plurality of lifting pins, the lifting pins are The pin corresponds to the lift pin holder, and the bottom portion of the lift pin is inserted into the lift pin holder.
進一步地，本發明還提供了一種等離子體處理裝置，包括：反應腔；位於反應腔內的靜電夾盤，所述靜電夾盤內包括複數個套管；如上述的升降銷組件，所述升降銷可以在所述套管中上下活動。 Further, the present invention also provides a plasma processing device, including: a reaction chamber; an electrostatic chuck located in the reaction chamber, and the electrostatic chuck includes a plurality of sleeves; such as the above-mentioned lifting pin assembly, the lifting pin assembly The pin can move up and down in the sleeve.
本發明的優點在於：本發明提供了一種升降銷的固定器，藉由將固定主體的頂端設置成分割的瓣狀結構實現升降銷的***空間的內部直徑可彈性變化以適應升降銷的活動調節，並且結合緊箍件對瓣狀件的束縛，起到對升降銷穩定夾持的作用，在瓣狀件上還設置有凹痕，用於固定緊箍件的位置，防止緊箍件的滑動造成束縛程度的波動，在瓣狀件外側設置複數個緊箍件用於加強束縛效果，此外，在分割瓣狀件的槽下部設置有緩衝孔，提高瓣狀件的彈性，同時可用於***空間的抽真空。 The advantage of the present invention is that the present invention provides a holder for a lifting pin. By arranging the top end of the fixing body into a divided petal-like structure, the inner diameter of the insertion space of the lifting pin can be elastically changed to adapt to the movable adjustment of the lifting pin. , and combined with the binding of the clamping member to the petal member, it plays a role in stably clamping the lifting pin. There are also indentations on the petal member to fix the position of the clamping member and prevent the sliding of the clamping member. To cause fluctuations in the degree of restraint, a plurality of tight hoops are set outside the petals to enhance the restraint effect. In addition, a buffer hole is provided at the lower part of the groove that divides the petals to improve the elasticity of the petals and can be used for insertion into the space. of vacuuming.
100:反應腔 100:Reaction chamber
110:外壁 110:Outer wall
111:傳片口 111: Film transfer port
120:氣體噴淋頭 120:Gas sprinkler head
130:氣體供應裝置 130:Gas supply device
140:分子泵 140: Molecular pump
150:靜電夾盤 150:Electrostatic chuck
151:升降銷 151: Lift pin
152:套管 152:casing
153:基座 153:Pedestal
200:底座 200: base
210:固定裝置 210: Fixtures
300:升降銷固定器 300: Lift pin retainer
310:主體 310:Subject
320:瓣狀件 320: petals
321:凹痕 321:Dent
322:槽 322:Slot
323:緩衝孔 323: Buffer hole
324:突起 324:Protrusion
331:第一緊箍件 331:First tightening piece
332:第二緊箍件 332: Second tightening piece
340:***口 340: Insertion port
h:高度 h: height
為了更清楚地說明本發明實施例或習知技術中的技術方案，下面將對實施例或習知技術描述中所需要使用的附圖作簡單地介紹，顯而易見地， 下面描述中的附圖僅僅是本發明的一些實施例，對於本領域普通技術人員來講，在不付出創造性勞動的前提下，還可以根據這些附圖獲得其他的附圖。 In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the conventional technology, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the conventional technology. Obviously, The drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without exerting creative efforts.
圖1為一種等離子體處理裝置的結構示意圖；圖2A為習知技術升降銷固定器及升降銷組合結構示意圖；圖2B為習知技術升降銷固定器及升降銷組合結構剖面圖；圖3A為本發明的一個實施例的升降銷固定器及升降銷結構示意圖；圖3B為本發明的一個實施例的升降銷固定器及升降銷結構剖面圖；圖3C為本發明的一個實施例的升降銷固定器及升降銷結構變化狀態圖；圖3D為本發明的一個實施例的升降銷固定器結構俯視圖；圖4為本發明的另一個實施例的升降銷固定器結構示意圖；圖5為本發明的另一個實施例的升降銷固定器結構示意圖；圖6為本發明的另一個實施例的升降銷固定器結構示意圖；圖7為本發明的另一個實施例的升降銷固定器結構示意圖；圖8為本發明的另一個實施例的升降銷固定器及升降銷結構剖面圖；圖9為本發明的一個實施例的升降銷組件結構示意圖。 Figure 1 is a schematic structural diagram of a plasma processing device; Figure 2A is a schematic structural diagram of a lifting pin holder and a lifting pin combination in the prior art; Figure 2B is a sectional view of a lifting pin holder and a lifting pin combination in the prior art; Figure 3A is a schematic structural diagram of a lifting pin holder and a lifting pin combination in the prior art. A schematic structural diagram of the lifting pin holder and the lifting pin according to one embodiment of the present invention; Figure 3B is a cross-sectional view of the lifting pin holder and the lifting pin structure according to one embodiment of the present invention; Figure 3C is a schematic diagram of the lifting pin according to one embodiment of the present invention. Structural change state diagram of the holder and lifting pin; Figure 3D is a structural top view of the lifting pin holder according to one embodiment of the present invention; Figure 4 is a structural schematic diagram of the lifting pin holder according to another embodiment of the present invention; Figure 5 is a schematic diagram of the structure of the lifting pin holder according to another embodiment of the present invention; Figure 6 is a schematic structural diagram of a lifting pin holder according to another embodiment of the present invention; Figure 7 is a schematic structural diagram of a lifting pin holder according to another embodiment of the present invention; Figure 8 is a structural cross-sectional view of a lifting pin holder and a lifting pin according to another embodiment of the present invention; FIG. 9 is a schematic structural diagram of a lifting pin assembly according to one embodiment of the present invention.
為使本發明實施例的目的、技術方案和優點更加清楚，下面將結合本發明實施例中的附圖，對本發明實施例中的技術方案進行清楚、完整地描述，顯然，所描述的實施例是本發明一部分實施例，而不是全部的實施例。基於本發明中的實施例，本領域普通技術人員在沒有做出創造性勞動前提下所獲得的所有其他實施例，都屬於本發明保護的範圍。 In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.
圖1示出一種電容耦合等離子體處理裝置示意圖，包括一由外壁110圍成的可抽真空的反應腔100。反應腔100用於對基片進行處理。反應腔100內部包括一氣體噴淋頭120，用於將氣體供應裝置130中的製程氣體引入所述反應腔，進入反應腔100內部的反應氣體藉由位於腔體底部的分子泵140抽走，形成在反應腔100內部的氣體循環，以保證等離子體的反應濃度。與氣體噴淋頭120相對應處設置有一個靜電夾盤150，用於對基片進行支撐的同時實現對基片溫度及電場等影響基片處理因素的控制。靜電夾盤150包括基座153，基座153內設溫度控制裝置，用於實現對上方基片的溫度控制，靜電夾盤150內部設置直流電極，藉由該直流電極在基片背面和靜電夾盤150承載面之間產生直流吸附以實現對基片的固定。一高頻射頻功率源施加高頻射頻訊號至所述氣體噴淋頭120或基座153至少之一，以在所述氣體噴淋頭120和所述基座153之間形成射頻電場，將反應腔內的製程氣體激發為等離子體，實現等離子體對待處理基片的處理。 FIG. 1 shows a schematic diagram of a capacitively coupled plasma processing device, which includes an evacuable reaction chamber 100 surrounded by an outer wall 110 . The reaction chamber 100 is used to process substrates. The reaction chamber 100 includes a gas shower head 120 inside, which is used to introduce the process gas in the gas supply device 130 into the reaction chamber. The reaction gas entering the reaction chamber 100 is pumped away by the molecular pump 140 located at the bottom of the chamber. Gas circulation is formed inside the reaction chamber 100 to ensure the reaction concentration of the plasma. An electrostatic chuck 150 is provided corresponding to the gas shower head 120 for supporting the substrate while controlling factors such as substrate temperature and electric field that affect substrate processing. The electrostatic chuck 150 includes a base 153. The base 153 is equipped with a temperature control device for controlling the temperature of the upper substrate. A DC electrode is provided inside the electrostatic chuck 150, and the DC electrode is used to connect the back surface of the substrate and the electrostatic clamp. DC adsorption is generated between the bearing surfaces of the disk 150 to achieve fixation of the substrate. A high-frequency radio frequency power source applies a high-frequency radio frequency signal to at least one of the gas shower head 120 or the base 153 to form a radio frequency electric field between the gas shower head 120 and the base 153 to react. The process gas in the cavity is excited into plasma to realize plasma processing of the substrate to be processed.
在等離子體反應前，外壁110上的傳片口111打開，機械臂將基片送入反應腔100，放在位於高位的升降銷151上，之後機械臂抽離反應腔100，傳片口111關閉，底座200帶動升降銷151下降到低位，使升降銷151的上表面完全位於靜電夾盤150的上表面之下，基片平穩安置在靜電夾盤150上。當反應結束後，底座200帶動升降銷151上升到高位，頂起基片，傳片口111打開，機械臂***到基片下方，隨著升降銷151下降，基片傳遞到機械臂上，被機械臂帶出反應腔100。 Before the plasma reaction, the chip transfer port 111 on the outer wall 110 is opened, and the robot arm sends the substrate into the reaction chamber 100 and places it on the lifting pin 151 at a high position. Then the robot arm withdraws from the reaction chamber 100 and the chip transfer port 111 is closed. The base 200 drives the lifting pin 151 to drop to a low position, so that the upper surface of the lifting pin 151 is completely below the upper surface of the electrostatic chuck 150 , and the substrate is stably placed on the electrostatic chuck 150 . When the reaction is completed, the base 200 drives the lifting pin 151 to rise to a high position, lifting the substrate, the film transfer port 111 is opened, and the robotic arm is inserted under the substrate. As the lifting pin 151 descends, the substrate is transferred to the robotic arm and is mechanically The arm is brought out of the reaction chamber 100 .
如圖2A所示為習知技術中用於固定升降銷的固定裝置210，通常固定裝置210的一端與圖1中底座200固定連接，其另一端供升降銷151***，為了便於更換和調整，升降銷151與固定裝置210並不是一體化設計的，如圖2B剖面圖所示，升降銷151與固定裝置210靠比較弱的摩擦力連接在一起。當升降銷151在圖1中的靜電夾盤150中往返運動時，升降銷151會和靜電夾盤中的升降銷 孔的側壁摩擦，為了避免孔隙中發生電弧放電，升降銷孔的直徑也很小，非常容易產生升降銷151在運動過程中，與升降銷孔的摩擦力偶爾大於與固定裝置210的摩擦力，導致升降銷被部分拔出固定裝置210，由此多根升降銷151產生高度差，影響對基片的托舉。此外，在對升降銷151和固定裝置210加工時，難免產生微小誤差，造成升降銷151和固定裝置210內壁的摩擦力不同，這也增加了不同升降銷151產生高度偏差的機率。 As shown in Figure 2A, a fixing device 210 is used to fix the lifting pin in the conventional technology. Usually, one end of the fixing device 210 is fixedly connected to the base 200 in Figure 1, and the other end of the fixing device 210 is for the lifting pin 151 to be inserted. In order to facilitate replacement and adjustment, The lifting pin 151 and the fixing device 210 are not integrally designed. As shown in the cross-sectional view of FIG. 2B , the lifting pin 151 and the fixing device 210 are connected together by relatively weak friction. When the lifting pin 151 moves back and forth in the electrostatic chuck 150 in Figure 1, the lifting pin 151 will interact with the lifting pin in the electrostatic chuck. The side wall of the hole rubs against each other. In order to avoid arc discharge in the hole, the diameter of the lifting pin hole is also very small. It is very easy for the friction between the lifting pin 151 and the lifting pin hole to occasionally be greater than the friction with the fixing device 210 during the movement of the lifting pin 151. As a result, the lifting pins are partially pulled out of the fixing device 210 , thereby creating a height difference among the plurality of lifting pins 151 , which affects the lifting of the substrate. In addition, when processing the lifting pin 151 and the fixing device 210, slight errors are inevitable, resulting in different friction between the lifting pin 151 and the inner wall of the fixing device 210, which also increases the probability of height deviations of different lifting pins 151.
如圖3A所示為本發明的一個實施例的升降銷固定器300和升降銷151的組合狀態圖，本發明的升降銷固定器300包括主體310，位於主體上方的複數個瓣狀件320，在一些實施例中，主體310可以是圓柱狀，便於加工，不會因存在棱角而易於產生顆粒污染物。瓣狀件320可以和主體310分開加工後組合在一起，也可以是從主體310頂部向上延伸形成的一體化裝置，在本實施例中，瓣狀件320的數量為兩個。如圖3D所示，瓣狀件320之間設置有***口340，其向主體310方向延伸形成一空間，用於容納升降銷151，如圖3A所示，升降銷固定器300還包括位於瓣狀件320外側的第一緊箍件331，在一些實施例中，第一緊箍件331位於瓣狀件320上部，如圖3B所示的本實施例的剖視圖，升降銷151***升降銷固定器300後，因複數個瓣狀件320的側壁之間具有間隔，所以當第一緊箍件331套在瓣狀件320外側時，可以迫使瓣狀件320向升降銷151聚攏，如本實施例中分別與主體310相連，且互相之間不連接的瓣狀件320，其頂端對升降銷151的壓力最大，向下因受到主體310固定，壓力會遞減。 3A is a combined state diagram of a lifting pin holder 300 and a lifting pin 151 according to an embodiment of the present invention. The lifting pin holder 300 of the present invention includes a main body 310 and a plurality of petals 320 located above the main body. In some embodiments, the main body 310 may be cylindrical, which facilitates processing and does not easily generate particulate contaminants due to the presence of edges and corners. The petals 320 can be processed separately from the main body 310 and then combined together, or they can be an integrated device extending upward from the top of the main body 310. In this embodiment, the number of the petals 320 is two. As shown in Figure 3D, an insertion opening 340 is provided between the petals 320, which extends toward the main body 310 to form a space for accommodating the lifting pin 151. As shown in Figure 3A, the lifting pin holder 300 also includes an insertion opening 340 located on the petals. The first tightening member 331 outside the petal-shaped member 320. In some embodiments, the first tightening member 331 is located on the upper part of the petal-shaped member 320. As shown in the cross-sectional view of this embodiment in Figure 3B, the lifting pin 151 is inserted into the lifting pin to fix it. After the device 300 is installed, since there are gaps between the side walls of the plurality of petal-shaped members 320, when the first tightening member 331 is placed outside the petal-shaped member 320, the petal-shaped member 320 can be forced to gather toward the lifting pin 151, as in this embodiment. In this example, the tops of the petals 320 that are connected to the main body 310 and are not connected to each other have the greatest pressure on the lifting pin 151. Since they are fixed by the main body 310 downwards, the pressure will decrease.
在一些實施例中，***口340的內側直徑小於等於升降銷151的直徑，這樣可以對升降銷151側壁實現更大的壓力，進而提高摩擦力使升降銷151被固定，避免升降銷151與升降銷固定器300產生垂直或水平的相對運動。在另一些實施例中，***口340的內側壁設置有內螺紋，升降銷151的外側壁設置有外螺紋，外螺紋可以是覆蓋整個外側壁；也可以是只存在升降銷151的底部，螺 紋長度與***口340向內延伸的長度相同。在第一緊箍件331取下的狀態旋進***銷151至合適高度，然後安裝第一緊箍件331，使升降銷151與***口的內側壁緊密結合，靠螺紋的壓力極大的限制升降銷151上下的位移。如圖3C所示，在安裝時，可以拿掉第一緊箍件331，根據加工誤差調整高度h，使複數個升降銷151在升到高位時上表面位於同一水平面，在降到低位時，上表面位於靜電夾盤之下，在等離子體處理裝置中，升降銷需要頻繁升降，第一緊箍件331可以保持每次調整後高度h的穩定，不會在與基片背面多次的接觸後改變大小。 In some embodiments, the inner diameter of the insertion opening 340 is less than or equal to the diameter of the lifting pin 151 , which can achieve greater pressure on the side wall of the lifting pin 151 , thereby increasing the friction to fix the lifting pin 151 and preventing the lifting pin 151 from interfacing with the lifting pin 151 . The pin retainer 300 produces vertical or horizontal relative movement. In other embodiments, the inner side wall of the insertion port 340 is provided with internal threads, and the outer side wall of the lifting pin 151 is provided with external threads. The external threads may cover the entire outer side wall; or there may be only the bottom of the lifting pin 151, and the threads may The length of the groove is the same as the length of the insertion opening 340 extending inward. With the first tightening piece 331 removed, screw the insertion pin 151 to a suitable height, and then install the first tightening piece 331 so that the lifting pin 151 is closely combined with the inner wall of the insertion port, and the pressure of the thread greatly limits the lifting. The displacement of pin 151 up and down. As shown in Figure 3C, during installation, the first tightening member 331 can be removed, and the height h is adjusted according to the processing error, so that the upper surfaces of the plurality of lifting pins 151 are on the same level when they are raised to the high position, and when they are lowered to the low position, The upper surface is located under the electrostatic chuck. In the plasma processing device, the lifting pin needs to be raised and lowered frequently. The first clamping member 331 can maintain the stability of the height h after each adjustment and will not contact the back of the substrate multiple times. Then change the size.
在一些實施例中，***口340向主體310方向延伸的長度大於等於升降銷151長度的三分之一，以提供足夠多的調整距離，等離子體反應腔內，空間有限，而且升降銷的通孔不能過粗，導致升降銷的固定件不能***升降銷的通孔，只能藉由對升降銷少部分的夾持來維持升降銷的固定，本發明的升降銷固定器，藉由瓣狀件320和第一緊箍件331的配合，可以將升降銷固定器做成接近升降銷的直徑，而且僅藉由對升降銷的少部分夾持即可達到固定升降銷的目的，不過多佔用反應腔內的空間。 In some embodiments, the length of the insertion opening 340 extending toward the main body 310 is greater than or equal to one-third of the length of the lifting pin 151 to provide a sufficient adjustment distance. The space in the plasma reaction chamber is limited, and the passage of the lifting pin 151 is limited. The hole cannot be too thick, so that the fixing member of the lifting pin cannot be inserted into the through hole of the lifting pin. The lifting pin can only be maintained fixed by clamping a small part of the lifting pin. The lifting pin holder of the present invention uses a petal-shaped The cooperation of the member 320 and the first tightening member 331 allows the lifting pin holder to be made close to the diameter of the lifting pin, and the purpose of fixing the lifting pin can be achieved by only clamping a small part of the lifting pin without taking up too much space. space within the reaction chamber.
如圖4所示為本發明的另一個實施例示意圖，與上述實施例的區別在於還包括第二緊箍件332，第二緊箍件332位於第一緊箍件331下方，可以設置於瓣狀件320的中部，以提供更大的壓力。在一些實施例中，第一和第二緊箍件為彈性的圓環，例如選擇氟橡膠或全氟橡膠材料。在其他實施例中，第一和第二緊箍件也可以不選擇彈性材料，而藉由瓣狀件外側的直徑向下遞增的方式，使第一和第二緊箍件從上向下移動至夾緊位置。 Figure 4 shows a schematic diagram of another embodiment of the present invention. The difference from the above embodiment is that it also includes a second tightening member 332. The second tightening member 332 is located below the first tightening member 331 and can be disposed on the valve. The middle part of the shape member 320 to provide greater pressure. In some embodiments, the first and second tightening members are elastic rings, such as fluorine rubber or perfluoroelastomer. In other embodiments, the first and second tightening members may not be made of elastic material, but the first and second tightening members may be moved from top to bottom by increasing the diameter of the outside of the petal member downwards. to the clamping position.
如圖5所示為本發明的另一個實施例示意圖，與上述實施例的區別在於，瓣狀件320的外側設置有凹痕321，用於固定第一緊箍件331的位置，防止其上下移動，例如第一緊箍件331如果從與水平較大角度處移動到水平，會對夾持度產生波動，如果在升降過程中，第一緊箍件331碰到其他部件則可能發生 上述情況，也即凹痕321還可以保護第一緊箍件331，使其避免突出而與其他部件發生碰撞移位。凹痕321可以設置成如圖5所示的水平半圓形凹痕，使第一緊箍件331對瓣狀件320在豎直方向產生分佈均勻的壓力。在一些實施例中，第二緊箍件332處也設置有凹痕。 Figure 5 is a schematic diagram of another embodiment of the present invention. The difference from the above embodiment is that an indentation 321 is provided on the outside of the petal-shaped member 320 to fix the position of the first tightening member 331 and prevent it from moving up and down. Movement, for example, if the first tightening member 331 moves from a large angle to the horizontal, the clamping degree will fluctuate. This may occur if the first tightening member 331 hits other components during the lifting process. The above situation, that is, the indentation 321 can also protect the first tightening member 331 from protruding and causing collision and displacement with other components. The indentation 321 can be configured as a horizontal semicircular indentation as shown in FIG. 5 , so that the first tightening member 331 exerts evenly distributed pressure on the petal member 320 in the vertical direction. In some embodiments, the second tightening member 332 is also provided with an indentation.
如圖6為本發明的另一個實施例示意圖，與上述實施例的區別在於，複數個瓣狀件320之間藉由槽322分隔開，槽322的形狀可以如圖6所示為豎直條狀，也可以為不規則的曲線形狀，在槽的底部設置有緩衝孔323，緩衝孔323可以使瓣狀件320有更大的形變空間，並且，緩衝孔323可以用於升降銷固定器300內部空間的抽真空。在其他一些實施例中，如圖7所示，瓣狀件的數量為4個，4個緩衝孔323均勻分佈於瓣狀件320側壁的圓周上。 Figure 6 is a schematic diagram of another embodiment of the present invention. The difference from the above embodiment is that a plurality of petals 320 are separated by grooves 322. The shape of the grooves 322 can be vertical as shown in Figure 6 A strip shape or an irregular curve shape is provided. A buffer hole 323 is provided at the bottom of the groove. The buffer hole 323 can allow the petal 320 to have a larger deformation space, and the buffer hole 323 can be used as a lifting pin holder. 300 vacuum of internal space. In some other embodiments, as shown in FIG. 7 , the number of petals is four, and the four buffer holes 323 are evenly distributed on the circumference of the side wall of the petals 320 .
如圖8為本發明的另一個實施例示意圖，與上述實施例的區別在於，***口340的內側直徑大於升降銷151的直徑，在瓣狀件320的內側壁上設置有複數個突起324，當第一緊箍件331套設在瓣狀件320外側時，複數個突起324可以貼緊升降銷151，提高瓣狀件320與升降銷151的摩擦力。 Figure 8 is a schematic diagram of another embodiment of the present invention. The difference from the above embodiment is that the inner diameter of the insertion opening 340 is larger than the diameter of the lifting pin 151, and a plurality of protrusions 324 are provided on the inner wall of the petal 320. When the first tightening member 331 is sleeved on the outside of the petal member 320, the plurality of protrusions 324 can be close to the lifting pin 151 to increase the friction between the petal member 320 and the lifting pin 151.
本發明還提供了一種升降銷組件，如圖9所示，其包括底座200，底座200可以是圓盤形，也可以是三角形，和均勻固定於底座200不同方向上的複數個上述升降銷固定器300，在本實施例中，升降銷固定器300的數量為3個，以及對應數量的升降銷151。 The present invention also provides a lifting pin assembly, as shown in Figure 9, which includes a base 200. The base 200 can be disc-shaped or triangular, and is fixed with a plurality of the above-mentioned lifting pins evenly fixed on the base 200 in different directions. 300 , in this embodiment, the number of lifting pin holders 300 is three, and the corresponding number of lifting pins 151 .
本發明還提供了一種等離子體處理裝置，其可以是如圖1所示的電容耦合等離子體處理裝置，包括反應腔100，靜電夾盤150，以及位於靜電夾盤中的套管152，套管152可以是單獨的圓管，也可以是基座153中的貫通孔。如上述的升降銷組件可以帶動升降銷151藉由套管152上下運動。 The present invention also provides a plasma processing device, which can be a capacitively coupled plasma processing device as shown in Figure 1, including a reaction chamber 100, an electrostatic chuck 150, and a sleeve 152 located in the electrostatic chuck. 152 can be a separate circular tube or a through hole in the base 153 . The above-mentioned lifting pin assembly can drive the lifting pin 151 to move up and down through the sleeve 152 .
本發明的等離子體處理裝置也可以是電感耦合等離子體處理裝置，包括一反應腔和靜電夾盤，以及位於靜電夾盤中的套管，套管可以是單獨 的圓管，也可以是基座中的貫通孔。如上述的升降銷組件可以帶動升降銷藉由套管上下運動，與電容耦合等離子體處理裝置的區別在於，電感耦合等離子體處理裝置由位於反應腔外部上方的電感線圈激發腔內的反應氣體形成等離子體。 The plasma processing device of the present invention can also be an inductively coupled plasma processing device, including a reaction chamber and an electrostatic chuck, as well as a sleeve located in the electrostatic chuck. The sleeve can be a separate The round tube can also be a through hole in the base. The above-mentioned lifting pin assembly can drive the lifting pin to move up and down through the casing. The difference from the capacitively coupled plasma processing device is that the inductively coupled plasma processing device is formed by an inductive coil located above the outside of the reaction chamber to excite the reaction gas in the chamber. Plasma.
本發明提供了一種升降銷的固定器，藉由將固定主體的頂端設置成分割的瓣狀結構實現升降銷的***空間的內部直徑可彈性變化以適應升降銷的活動調節，並且結合緊箍件對瓣狀件的束縛，起到對升降銷穩定夾持的作用，在瓣狀件上還設置有凹痕，用於固定緊箍件的位置，防止緊箍件的滑動造成束縛程度的波動，在瓣狀件外側設置複數個緊箍件用於加強束縛效果，此外，在分割瓣狀件的槽下部設置有緩衝孔，提高瓣狀件的彈性，同時可用於***空間的抽真空。 The present invention provides a holder for a lifting pin. By arranging the top end of the fixing body into a divided petal-like structure, the inner diameter of the insertion space of the lifting pin can be elastically changed to adapt to the movable adjustment of the lifting pin, and combined with a tightening member The restraint of the petal-shaped member plays a role in stably clamping the lifting pin. There are also indentations on the petal-shaped member to fix the position of the clamping member and prevent the sliding of the clamping member from causing fluctuations in the degree of restraint. A plurality of tight hoops are provided on the outside of the petal to enhance the binding effect. In addition, a buffer hole is provided at the lower part of the groove that divides the petal to improve the elasticity of the petal and can be used for vacuuming the insertion space.
本發明公開的升降銷固定器不限於應用於上述實施例的等離子體處理裝置，在其他等離子體處理裝置中也可以適用，此處不再贅述。 The lifting pin holder disclosed in the present invention is not limited to being applied to the plasma processing device of the above embodiment, but can also be applied to other plasma processing devices, and will not be described again here.
儘管本發明的內容已經藉由上述較佳實施例作了詳細介紹，但應當認識到上述的描述不應被認為是對本發明的限制。在本領域技術人員閱讀了上述內容後，對於本發明的多種修改和替代都將是顯而易見的。因此，本發明的保護範圍應由所附的申請專利範圍來限定。 Although the content of the present invention has been described in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as limiting the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above. Therefore, the protection scope of the present invention should be limited by the appended patent application scope.
151:升降銷 151: Lift pin
200:底座 200: base
300:升降銷固定器 300: Lift pin retainer
Claims (15)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110143441.7A CN114843164A (en) | 2021-02-02 | 2021-02-02 | Lift pin holder, lift pin assembly, and plasma processing apparatus |
| CN202110143441.7 | 2021-02-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202244980A TW202244980A (en) | 2022-11-16 |
| TWI813142B true TWI813142B (en) | 2023-08-21 |
Family
ID=82560722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111103111A TWI813142B (en) | 2021-02-02 | 2022-01-25 | Lifting pin holder, lifting pin assembly and plasma processing device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114843164A (en) |
| TW (1) | TWI813142B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030205329A1 (en) * | 2000-02-28 | 2003-11-06 | Rudolf Gujer | Semiconductor wafer support lift-pin assembly |
| US20090124029A1 (en) * | 1997-07-15 | 2009-05-14 | Silverbrook Research Pty Ltd. | Method of fabricating resistor and proximate drive transistor for a printhead |
| CN101630623A (en) * | 2003-05-09 | 2010-01-20 | 株式会社荏原制作所 | Inspection apparatus by charged particle beam and method for manufacturing device using inspection apparatus |
| TW201633852A (en) * | 2014-11-12 | 2016-09-16 | 蘭姆研究公司 | Adjustment of VUV emission of a plasma via collisional resonant energy transfer to an energy absorber gas |
-
2021
- 2021-02-02 CN CN202110143441.7A patent/CN114843164A/en active Pending
-
2022
- 2022-01-25 TW TW111103111A patent/TWI813142B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090124029A1 (en) * | 1997-07-15 | 2009-05-14 | Silverbrook Research Pty Ltd. | Method of fabricating resistor and proximate drive transistor for a printhead |
| US20030205329A1 (en) * | 2000-02-28 | 2003-11-06 | Rudolf Gujer | Semiconductor wafer support lift-pin assembly |
| CN101630623A (en) * | 2003-05-09 | 2010-01-20 | 株式会社荏原制作所 | Inspection apparatus by charged particle beam and method for manufacturing device using inspection apparatus |
| TW201633852A (en) * | 2014-11-12 | 2016-09-16 | 蘭姆研究公司 | Adjustment of VUV emission of a plasma via collisional resonant energy transfer to an energy absorber gas |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114843164A (en) | 2022-08-02 |
| TW202244980A (en) | 2022-11-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102434559B1 (en) | Mounting table and plasma processing apparatus | |
| TWI493650B (en) | Pin lifting system | |
| JP4836512B2 (en) | Substrate lifting apparatus and substrate processing apparatus | |
| JP6650841B2 (en) | Substrate lifting mechanism, substrate mounting table and substrate processing device | |
| CN111430232A (en) | Plasma processing apparatus and mounting table of plasma processing apparatus | |
| KR20190029365A (en) | Lift pin assembly, substrate support apparatus and substrate processing apparatus having the same | |
| TWI836026B (en) | Substrate lifting mechanism, substrate supporter and substrate processing device | |
| US10195704B2 (en) | Lift pin for substrate processing | |
| KR102102033B1 (en) | Substrate processing apparatus and substrate holding device | |
| JP2017098330A (en) | Substrate holding device | |
| JP7004589B2 (en) | Elevating mechanism, mounting table and plasma processing device | |
| TWI813142B (en) | Lifting pin holder, lifting pin assembly and plasma processing device | |
| CN110265333A (en) | Bogey and processing chamber | |
| KR101235623B1 (en) | Lift Pin Assembly and Plasma Processingg Apparatus | |
| KR20070069493A (en) | Lift pin module of fpd manufacturing machine | |
| CN213905289U (en) | Lift pin holder, lift pin assembly, and plasma processing apparatus | |
| KR101207771B1 (en) | Lift pin holder reducing friction force | |
| KR20070007415A (en) | Substrate supporting device comprising member of going up and down | |
| JP7021969B2 (en) | Vacuum suction member and vacuum suction method | |
| KR20070048866A (en) | Lift pin assembly | |
| TWI727610B (en) | Electrostatic chuck and its plasma processing device | |
| KR100888551B1 (en) | Chuck assembly for supporting wafer | |
| KR100596328B1 (en) | Lift pin module of fpd manufacturing machine | |
| TWI761916B (en) | Assembly for supporting substrate and apparatus for processing substrate | |
| JP2009206360A (en) | Substrate processing device |