TWI812197B - Vapor chamber and electronic device using same - Google Patents
Vapor chamber and electronic device using same Download PDFInfo
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- TWI812197B TWI812197B TW111116464A TW111116464A TWI812197B TW I812197 B TWI812197 B TW I812197B TW 111116464 A TW111116464 A TW 111116464A TW 111116464 A TW111116464 A TW 111116464A TW I812197 B TWI812197 B TW I812197B
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 59
- 239000002184 metal Substances 0.000 claims abstract description 59
- 239000012530 fluid Substances 0.000 claims abstract description 26
- 238000003466 welding Methods 0.000 claims abstract description 12
- 238000010146 3D printing Methods 0.000 claims description 3
- 238000010147 laser engraving Methods 0.000 claims description 3
- 238000010329 laser etching Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
一種均溫板，具有：一金屬殼體，係由一第一金屬板體和一第二金屬板體結合而成，且其內部具有一蒸氣室以容置一工作流體，其中，該第二金屬板體的內表面開設有多條導流開槽以引導該工作流體在該第二金屬板體的該內表面上的流向；以及一多層毛細結構，容置於該蒸氣室內且係以多點間隔碰焊的方式固接於該第二金屬板體，其中，該多層毛細結構具有多條開口紋路以加快該多層毛細結構下方之該工作流體所蒸發之氣體進入該多層毛細結構上方之該蒸氣室中。A vapor chamber has: a metal shell, which is combined with a first metal plate body and a second metal plate body, and has a vapor chamber inside to accommodate a working fluid, wherein the second The inner surface of the metal plate body is provided with a plurality of flow guide slots to guide the flow direction of the working fluid on the inner surface of the second metal plate body; and a multi-layer capillary structure is accommodated in the vapor chamber and connected with It is fixed to the second metal plate body by multi-point spaced butt welding, wherein the multi-layer capillary structure has a plurality of opening lines to accelerate the gas evaporated by the working fluid below the multi-layer capillary structure to enter the gas above the multi-layer capillary structure. in the steam chamber.
Description
本發明係有關於一種均溫板，特別是一種可為其內之氣態工作流體和液態工作流體提供導流路徑以降低其散熱循環之熱阻抗的均溫板。The present invention relates to a vapor chamber, particularly a vapor chamber that can provide a flow guide path for the gaseous working fluid and the liquid working fluid inside to reduce the thermal resistance of the heat dissipation cycle.
均溫板的工作原理是透過在均溫板內形成一空腔室，並於該空腔室內填充一工作流體(如：水、冷卻液)後密封此空腔室，嗣再藉由工作流體於空腔室內持續地進行蒸發及凝結的循環，而達到快速導熱的效果。The working principle of the vapor chamber is to form an empty chamber in the vapor chamber, fill the empty chamber with a working fluid (such as water, coolant), seal the empty chamber, and then use the working fluid to The evaporation and condensation cycle continues in the cavity to achieve rapid heat conduction.
更具體而言，均溫板內之工作流體從一蒸發部接收一發熱器件產生之熱能而蒸發成為蒸氣，蒸氣接著移動至遠離該蒸發部之一冷凝部被冷卻成為液態。此液態工作流體藉著均溫板內設置的毛細結構層流向該蒸發部，並再次於該蒸發部接收熱而蒸發。以此方式，亦即藉著工作流體反覆進行相變及於均溫板腔內循環，均溫板即可將該發熱器件的潛熱快速帶走。More specifically, the working fluid in the vapor chamber receives thermal energy generated by a heating device from an evaporation part and evaporates into vapor. The vapor then moves to a condensation part away from the evaporation part and is cooled into a liquid state. The liquid working fluid flows to the evaporation part through the capillary structure layer provided in the vapor chamber, and receives heat in the evaporation part again to evaporate. In this way, that is, by the working fluid repeatedly undergoing phase changes and circulating in the chamber of the vapor chamber, the vapor chamber can quickly take away the latent heat of the heating device.
然而，在電子產品的外觀朝輕、薄、短、小的趨勢發展的情況下，均溫板的厚度也愈來愈薄，致使均溫板的散熱設計愈來愈具挑戰性。However, as the appearance of electronic products tends to be lighter, thinner, shorter, and smaller, the thickness of the vapor chamber is also getting thinner, making the heat dissipation design of the vapor chamber increasingly challenging.
因此，本領域亟需一種新穎的均溫板結構。Therefore, a novel vapor chamber structure is urgently needed in this field.
本發明之一目的在於揭露一種均溫板，其可藉由內部一複合式毛細結構的連續碰焊及開口紋路增進內部氣態工作流體的導流效果，從而提升其散熱性能。One purpose of the present invention is to disclose a vapor chamber that can enhance the flow conduction effect of the internal gaseous working fluid through continuous welding and opening patterns of an internal composite capillary structure, thereby improving its heat dissipation performance.
本發明之另一目的在於揭露一種均溫板，其可藉由在金屬殼體的下半部的內表面開設多條導流開槽增進內部液態工作流體的導流效果，從而提升其散熱性能。Another object of the present invention is to disclose a vapor chamber that can improve the flow diversion effect of the internal liquid working fluid by opening a plurality of flow guide slots on the inner surface of the lower half of the metal case, thereby improving its heat dissipation performance. .
為達前述目的，一種 均溫板 乃被提出，其具有：In order to achieve the aforementioned purpose, a vapor chamber is proposed, which has:
一金屬殼體，係由一第一金屬板體和一第二金屬板體結合而成，且其內部具有一蒸氣室以容置一工作流體，其中，該第二金屬板體的內表面開設有多條導流開槽以引導該工作流體在該第二金屬板體的該內表面上的流向；以及A metal shell is composed of a first metal plate body and a second metal plate body, and has a vapor chamber inside to accommodate a working fluid, wherein the inner surface of the second metal plate body has an opening There are a plurality of flow guide slots to guide the flow direction of the working fluid on the inner surface of the second metal plate body; and
一多層毛細結構，容置於該蒸氣室內且係以多點間隔碰焊的方式固接於該第二金屬板體，其中，該多層毛細結構具有多條開口紋路以加快該多層毛細結構下方之該工作流體所蒸發之氣體進入該多層毛細結構上方之該蒸氣室中。A multi-layer capillary structure is housed in the steam chamber and is fixed to the second metal plate body by multi-point spaced butt welding. The multi-layer capillary structure has a plurality of opening lines to accelerate the movement of the bottom of the multi-layer capillary structure. The gas evaporated by the working fluid enters the vapor chamber above the multi-layer capillary structure.
在一實施例中，所述之均溫板其多層毛細結構具有多個碰焊點，且各該條開口紋路之至少一側具有與其相鄰之一條所述碰焊點。In one embodiment, the multi-layer capillary structure of the vapor chamber has a plurality of welding points, and at least one side of each opening line has one of the welding points adjacent to it.
在一實施例中，所述之均溫板其多條導流開槽係以雷射雕刻的方式形成。In one embodiment, the plurality of flow guide grooves of the vapor chamber are formed by laser engraving.
在一實施例中，所述之均溫板其多條導流開槽係以蝕刻的方式形成。In one embodiment, the plurality of flow guide grooves of the vapor chamber are formed by etching.
在一實施例中，所述之均溫板其多條導流開槽係以3D列印的方式形成。In one embodiment, the multiple flow guide slots of the vapor chamber are formed by 3D printing.
在一實施例中，所述之均溫板其第一金屬板體之外表面具有至少一冷源區以與至少一冷源貼合，該第二金屬板體之外表面具有一熱源區以與一熱源貼合，且該些條開口紋路係在該多層毛細結構中由該熱源區之對應處延伸至所述至少一冷源區之對應處。In one embodiment, the outer surface of the first metal plate body of the vapor chamber has at least one cold source area to fit with at least one cold source, and the outer surface of the second metal plate body has a heat source area to It is attached to a heat source, and the opening lines extend from the corresponding place of the heat source area to the corresponding place of the at least one cold source area in the multi-layer capillary structure.
在一實施例中，所述之均溫板其第一金屬板體之外表面具有至少一冷源區以與至少一冷源貼合，該第二金屬板體之外表面具有一熱源區以與一熱源貼合，且該些條導流開槽係在該第二金屬板體中由所述至少一冷源區之對應處延伸至該熱源區之對應處。In one embodiment, the outer surface of the first metal plate body of the vapor chamber has at least one cold source area to fit with at least one cold source, and the outer surface of the second metal plate body has a heat source area to It is attached to a heat source, and the flow guide slots extend from the corresponding place of the at least one cold source area to the corresponding place of the heat source area in the second metal plate body.
在一實施例中，所述之均溫板其開口紋路係與該些條導流開槽交錯排列。In one embodiment, the opening patterns of the vapor chamber are staggered with the flow guide slots.
為達前述目的，本發明進一步提出一種電子裝置，其具有一電路板及如前述的均溫板，該均溫板係用以對該電路板進行散熱。In order to achieve the above object, the present invention further proposes an electronic device, which has a circuit board and a vapor chamber as mentioned above. The vapor chamber is used to dissipate heat from the circuit board.
在可能的實施例中，所述之電子裝置可為一筆記型電腦、一平板電腦、一智慧型手持裝置，或一伺服器。In possible embodiments, the electronic device may be a notebook computer, a tablet computer, a smart handheld device, or a server.
為使 貴審查委員能進一步瞭解本發明之結構、特徵及其目的，茲附以圖式及較佳具體實施例之詳細說明如後。In order to enable the review committee to further understand the structure, characteristics and purpose of the present invention, drawings and detailed descriptions of preferred embodiments are attached as follows.
請一併參照圖1至3，其中，圖1為本發明之均溫板之一實施例之一外觀示意圖；圖2為圖1之均溫板之一分解圖；以及圖3為圖1之均溫板之另一分解圖。Please refer to FIGS. 1 to 3 together. FIG. 1 is a schematic view of the appearance of an embodiment of the vapor chamber of the present invention; FIG. 2 is an exploded view of the vapor chamber of FIG. 1 ; and FIG. 3 is an exploded view of the vapor chamber of FIG. 1 . Another exploded view of the vapor chamber.
如圖1至3所示，該均溫板包括一金屬殼體10及一多層毛細結構20。As shown in FIGS. 1 to 3 , the vapor chamber includes a
金屬殼體10係由一第一金屬板體11和一第二金屬板體12結合而成，且其內部具有一蒸氣室101以容置一工作流體(未示於圖中)，在本發明中，該工作流體可為水或一冷卻液。The
第二金屬板體12的內表面開設有多條導流開槽121以引導該工作流體在第二金屬板體12的該內表面上的流向。具體而言，該些條導流開槽121可以雷射雕刻、蝕刻或3D列印的方式形成。A plurality of
另外，第一金屬板體11和一第二金屬板體12可由銅、不鏽鋼或鈦金屬製成。In addition, the first
多層毛細結構20，可由金屬網製成，係容置於蒸氣室101內，且係以多點間隔碰焊的方式固接於第二金屬板體12上，其中，多層毛細結構20係由多層板體21疊接而成，且其具有多條開口紋路22以加快多層毛細結構20下方之該工作流體所蒸發之氣體進入多層毛細結構20上方之該蒸氣室101中；及多層毛細結構20具有多個碰焊點23，各該條開口紋路22之至少一側具有與其相鄰之一條所述碰焊點23，且該些條開口紋路22係與該些條導流開槽121交錯排列。The multi-layer
另外，該些條導流開槽121的深度可為10-40µm，且間距(Pitch) 可為250-500µm以使該些條導流開槽121提供虹吸作用，而具有多個開口(opening)之各該條開口紋路22則可確保氣流的走向，從而合以加速熱量之轉移。In addition, the depth of the
另外，第一金屬板體11之外表面具有至少一冷源區(未示於圖中)以與至少一冷源(未示於圖中)貼合，該冷源可為一散熱裝置(未示於圖中)，且第二金屬板體12之外表面具有一熱源區(未示於圖中)以與一熱源(未示於圖中)貼合，該熱源可為一電子裝置之電路板(未示於圖中)，其中，該些條開口紋路22係在多層毛細結構20中由該熱源區之對應處延伸至所述至少一冷源區之對應處；且該些條導流開槽121係在第二金屬板體12中由所述至少一冷源區之對應處延伸至該熱源區之對應處。在此實施例中，該熱源係位於第二金屬板體12之中間區域，而所述冷源則係位於第一金屬板體11之周邊區域。另外，雖然在此實施例中，該熱源係位於第二金屬板體12之中間區域，而所述冷源則係位於第一金屬板體11之周邊區域，但本發明並不以此為限。例如，該熱源可位於第二金屬板體12之一周邊局部區域，所述冷源可位於第一金屬板體11之另一周邊局部區域，在此情況下，該些條開口紋路22係在多層毛細結構20中由第二金屬板體12之該周邊局部區域之對應處延伸至第一金屬板體11之該另一周邊局部區域之對應處；且該些條導流開槽121係在第二金屬板體12中由第一金屬板體11之該另一周邊局部區域之對應處延伸至第二金屬板體12之該周邊局部區域。In addition, the outer surface of the first
藉上述之安排，本發明之均溫板即可增進內部液態工作流體及氣態工作流體的導流效果，從而提升其散熱性能。Through the above arrangement, the vapor chamber of the present invention can enhance the flow conduction effect of the internal liquid working fluid and gaseous working fluid, thereby improving its heat dissipation performance.
依上述的說明，本發明進一步提出一種電子裝置。請參照圖4，其為本發明之電子裝置之一實施例之方塊圖。如圖4所示，一電子裝置200具有一電路板210及一均溫板220，其中，均溫板220係由圖1所揭之均溫板實現以對電路板210進行散熱，且電子裝置200可為一筆記型電腦、一平板電腦、一智慧型手持裝置、或一伺服器。該均溫板係用以對該電子裝置之電路板進行散熱。According to the above description, the present invention further provides an electronic device. Please refer to FIG. 4 , which is a block diagram of an embodiment of the electronic device of the present invention. As shown in FIG. 4 , an
藉由前述所揭露的設計，本發明乃具有以下的優點：Through the design disclosed above, the present invention has the following advantages:
1、本發明的均溫板可藉由內部一複合式毛細結構的連續碰焊及開口紋路增進內部氣態工作流體的導流效果，從而提升其散熱性能。1. The vapor chamber of the present invention can improve the conduction effect of the internal gaseous working fluid through the continuous butt welding and opening lines of a composite capillary structure inside, thereby improving its heat dissipation performance.
2、本發明的均溫板可藉由在金屬殼體的下半部的內表面開設多條導流開槽增進內部液態工作流體的導流效果，從而提升其散熱性能。2. The vapor chamber of the present invention can improve the diversion effect of the internal liquid working fluid by opening a plurality of guide grooves on the inner surface of the lower half of the metal shell, thereby improving its heat dissipation performance.
本案所揭示者，乃較佳實施例，舉凡局部之變更或修飾而源於本案之技術思想而為熟習該項技藝之人所易於推知者，俱不脫本案之專利權範疇。What is disclosed in this case is a preferred embodiment. Any partial changes or modifications derived from the technical ideas of this case and easily inferred by those familiar with the art will not deviate from the scope of the patent rights of this case.
綜上所陳，本案無論目的、手段與功效，皆顯示其迥異於習知技術，且其首先創作合於實用，確實符合發明之專利要件，懇請 貴審查委員明察，並早日賜予專利俾嘉惠社會，是為至禱。To sum up, regardless of the purpose, means and effects of this case, it shows that it is completely different from the conventional technology, and that its first creation is practical and indeed meets the patent requirements for inventions. I sincerely ask the review committee to take a clear look and grant the patent as soon as possible for your benefit. Society is a prayer for the Supreme Being.
10:金屬殼體10:Metal shell
11:第一金屬板體11: First metal plate body
12:第二金屬板體12: Second metal plate body
101:蒸氣室101:Steam room
121:導流開槽121: Diversion slotting
20:多層毛細結構20:Multilayer capillary structure
21:板體21:Plate body
22:開口紋路22:Opening texture
23:碰焊點23: Touch solder joint
200:電子裝置200:Electronic devices
210:電路板210:Circuit board
220:均溫板220:Vapor chamber
圖1為本發明之均溫板之一實施例之一外觀示意圖。 圖2為圖1之均溫板之一分解圖。 圖3為圖1之均溫板之另一分解圖。 圖4為本發明之電子裝置之一實施例之方塊圖。 Figure 1 is a schematic view of the appearance of an embodiment of the vapor chamber of the present invention. Figure 2 is an exploded view of the vapor chamber of Figure 1. FIG. 3 is another exploded view of the vapor chamber of FIG. 1 . FIG. 4 is a block diagram of an embodiment of the electronic device of the present invention.
11:第一金屬板體 11: First metal plate body
12:第二金屬板體 12: Second metal plate body
121:導流開槽 121: Diversion slotting
20:多層毛細結構 20:Multilayer capillary structure
21:板體 21:Plate body
22:開口紋路 22:Opening texture
23:碰焊點 23: Touch solder joint
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107421364A (en) * | 2017-06-09 | 2017-12-01 | 陈翠敏 | Equalizing plate structure and its manufacture method |
| TW202118987A (en) * | 2019-10-31 | 2021-05-16 | 建準電機工業股份有限公司 | Temperature-uniformizing Board |
| TW202202795A (en) * | 2020-07-08 | 2022-01-16 | 雙鴻科技股份有限公司 | Vapor chamber |
| WO2022057938A1 (en) * | 2020-09-19 | 2022-03-24 | 华为技术有限公司 | Temperature equalization chamber, electronic device, and temperature equalization chamber production method |
-
2022
- 2022-04-29 TW TW111116464A patent/TWI812197B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107421364A (en) * | 2017-06-09 | 2017-12-01 | 陈翠敏 | Equalizing plate structure and its manufacture method |
| TW202118987A (en) * | 2019-10-31 | 2021-05-16 | 建準電機工業股份有限公司 | Temperature-uniformizing Board |
| TW202202795A (en) * | 2020-07-08 | 2022-01-16 | 雙鴻科技股份有限公司 | Vapor chamber |
| WO2022057938A1 (en) * | 2020-09-19 | 2022-03-24 | 华为技术有限公司 | Temperature equalization chamber, electronic device, and temperature equalization chamber production method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202342933A (en) | 2023-11-01 |
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