TWI811664B - Vibration collection device - Google Patents
Vibration collection device Download PDFInfo
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- TWI811664B TWI811664B TW110113781A TW110113781A TWI811664B TW I811664 B TWI811664 B TW I811664B TW 110113781 A TW110113781 A TW 110113781A TW 110113781 A TW110113781 A TW 110113781A TW I811664 B TWI811664 B TW I811664B
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Abstract
Description
本發明涉及一種振動採集裝置,尤指一種可同時具備減少雜訊及提高訊號接收靈敏度之振動採集裝置。 The present invention relates to a vibration collection device, and in particular, to a vibration collection device that can simultaneously reduce noise and improve signal receiving sensitivity.
現有的壓電式振動感測器中,必須透過設置在其內部的質量塊(seismic mass)來獲得壓電訊號。例如,將感測器設置在待測物上,待測物之振動可傳遞至感測器內部之質量塊,使得質量塊因振動產生之機械能,可以經過壓電效應轉換為電能,並從中獲得壓電訊號。為了降低壓電訊號中的雜訊量,質量塊通常是整個貼附在壓電片上,這使得壓電片會因為質量塊太重而無法偵測到細微之振動,進而無法將現有的壓電式振動感測器加以活用至其他領域。 In existing piezoelectric vibration sensors, piezoelectric signals must be obtained through a seismic mass installed inside the sensor. For example, if a sensor is placed on the object to be measured, the vibration of the object to be measured can be transmitted to the mass block inside the sensor, so that the mechanical energy generated by the vibration of the mass block can be converted into electrical energy through the piezoelectric effect, and from there Obtain piezoelectric signals. In order to reduce the amount of noise in the piezoelectric signal, the mass block is usually completely attached to the piezoelectric sheet. This makes the piezoelectric sheet unable to detect subtle vibrations due to the mass block being too heavy, and thus the existing piezoelectric sheet cannot be used. Vibration sensors can be used in other fields.
因此,有必要提供一種新的振動採集裝置,以解決上述課題之其中之一。 Therefore, it is necessary to provide a new vibration collecting device to solve one of the above problems.
本發明之主要目的在於提供一種振動採集裝置,包括:殼體,用以接觸振動源,且內部具有支撐部;振動感測單元,設於該支撐部上,用以感 測該振動源所產生並經由該支撐部所傳遞之振動,以生成振動訊號;以及質量塊,設於該殼體與該振動感測單元之間,且具有凸部以控制該振動訊號之品質。 The main purpose of the present invention is to provide a vibration collecting device, which includes: a housing used to contact the vibration source and having a support part inside; a vibration sensing unit located on the support part for sensing Measure the vibration generated by the vibration source and transmitted through the support part to generate a vibration signal; and a mass block is provided between the housing and the vibration sensing unit and has a convex portion to control the quality of the vibration signal .
前述之振動採集裝置中,該質量塊藉由該凸部而部分接觸該振動感測單元。 In the aforementioned vibration collecting device, the mass block partially contacts the vibration sensing unit through the convex portion.
前述之振動採集裝置中,該凸部係接觸於該振動感測單元之邊緣。 In the aforementioned vibration collecting device, the convex portion is in contact with the edge of the vibration sensing unit.
前述之振動採集裝置中,該支撐部之設置位置係對應於該凸部,以使該振動感測單元之中央部位未受該凸部及該支撐部接觸而呈現自由狀態。 In the aforementioned vibration collecting device, the position of the supporting part is corresponding to the convex part, so that the central part of the vibration sensing unit is not in contact with the convex part and the supporting part and is in a free state.
前述之振動採集裝置中,該質量塊未接觸該振動感測單元。 In the aforementioned vibration collecting device, the mass block does not contact the vibration sensing unit.
前述之振動採集裝置中,該凸部為環形。 In the aforementioned vibration collecting device, the convex portion is annular.
前述之振動採集裝置中,該振動感測單元為圓形結構或多邊形結構(例如三角形結構、矩形結構)。 In the aforementioned vibration collection device, the vibration sensing unit is a circular structure or a polygonal structure (such as a triangular structure, a rectangular structure).
前述之振動採集裝置中,該振動感測單元為壓電材料所製成之感測器。 In the aforementioned vibration collecting device, the vibration sensing unit is a sensor made of piezoelectric material.
前述之振動採集裝置中,該振動為機械運動振動或聲音振動。 In the aforementioned vibration collecting device, the vibration is mechanical motion vibration or sound vibration.
前述之振動採集裝置中,更包括控制件,係穿設該殼體並連接該質量塊,用以移動該質量塊以控制該質量塊是否接觸該振動感測單元以及該質量塊接觸該振動感測單元之壓力大小。 The aforementioned vibration acquisition device further includes a control component that is passed through the housing and connected to the mass block for moving the mass block to control whether the mass block contacts the vibration sensing unit and whether the mass block contacts the vibration sensor. Measure the pressure of the unit.
1:振動採集裝置 1: Vibration collection device
10:殼體 10: Shell
101:支撐部 101:Support part
11:振動感測單元 11:Vibration sensing unit
111:中央部位 111:Central part
12:質量塊 12: Mass block
121:凸部 121:convex part
13:控制件 13:Control parts
2:振動源 2: Vibration source
圖1為本發明之振動採集裝置之一實施例之剖面示意圖。 Figure 1 is a schematic cross-sectional view of an embodiment of the vibration collecting device of the present invention.
圖2為本發明之振動採集裝置之另一實施例之剖面示意圖。 Figure 2 is a schematic cross-sectional view of another embodiment of the vibration collecting device of the present invention.
圖3為本發明之振動採集裝置中振動感測單元及質量塊之立體分解圖。 Figure 3 is a three-dimensional exploded view of the vibration sensing unit and the mass block in the vibration collection device of the present invention.
以下藉由特定之具體實施例加以說明本發明之實施方式,而熟悉此技術之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點和功效,亦可藉由其他不同的具體實施例加以施行或應用。 The following describes the implementation of the present invention through specific embodiments, and those familiar with the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification, and can also use other different specific embodiments. carry out or apply.
請參閱圖1,其為本發明之振動採集裝置之一實施例之剖面示意圖。本發明之振動採集裝置1包括殼體10、振動感測單元11以及質量塊12。殼體10用以接觸振動源2,而殼體10具體為中空狀,其內部可具有支撐部101,例如殼體10在接觸振動源2之一表面的相對內表面上可設有支撐部101。
Please refer to FIG. 1 , which is a schematic cross-sectional view of an embodiment of the vibration collecting device of the present invention. The vibration collecting
振動感測單元11可設於支撐部101上,用以感測振動源2所產生並經由支撐部101所傳遞之振動,而質量塊12可設於殼體10與振動感測單元11之間。具體而言,在圖1之實施例中,質量塊12可具有凸部121,並藉由凸部121而部分接觸振動感測單元11,例如,如圖3所示,質量塊12可為圓形,且凸部121為環形,且振動感測單元11為可對應該環形的圓形結構,使得凸部121可部分接觸振動感測單元11之邊緣。另外,支撐部101之設置位置亦可對應凸部121,例如支撐部101亦可為環形,以使得振動感測單元11之中央部位111未受凸部121及支撐部101接觸而呈現自由狀態。如此一來,當殼體10接觸振動源2時,振動源2所產生之振動經由支撐部101傳遞至振動感測單元11及質量塊12,使得質量塊12因振動產生之機械能可藉由所接觸之振動感測單元11之部分而轉換成電能,進而產生一第一訊號。另外,振動感測單元之中央部位111因未受凸部121及支撐
部101所接觸,故在振動源2所產生之振動傳遞至振動感測單元11時,中央部位111會因為振動而會上下運動,進而產生一第二訊號。此時第一訊號及第二訊號即可分別作為不同之振動訊號加以輸出,或是組合成單一之振動訊號來加以輸出。
The
於一實施例中,質量塊12可為除了圓形以外之形狀,例如三角形、正方形或多邊形,而凸部121則可為相對應之三角環形、正方環形或多邊環形結構,而振動感測單元11及支撐部101亦可為相對應之結構(例如為三角形結構、矩形結構等多邊形結構),以與凸部121對接,但本發明並不以此為限。
In one embodiment, the
請參閱圖2,其為本發明之振動採集裝置之另一實施例之剖面示意圖。與前述之實施例相較,本實施例之不同處在於質量塊12未接觸振動感測單元11。雖然質量塊12未接觸振動感測單元11,但是振動源2所產生之振動仍可經由支撐部101傳遞至振動感測單元11,使得振動感測單元11之中央部位111會因為振動而會上下運動,進而產生振動訊號。
Please refer to FIG. 2 , which is a schematic cross-sectional view of another embodiment of the vibration collecting device of the present invention. Compared with the previous embodiment, the difference of this embodiment is that the
圖2之實施例與圖1之實施例皆因為振動感測單元11之中央部位111呈現自由狀態,而可具備有較靈敏之感測能力,而圖1之實施例可將質量塊12部分接觸振動感測單元11,更可具備減少接收雜訊之功效。
Both the embodiment of FIG. 2 and the embodiment of FIG. 1 can have a more sensitive sensing capability because the
請同時參閱圖1及圖2,本發明之振動採集裝置1更包括控制件13,控制件13穿設殼體10並連接質量塊12,且可用以移動質量塊12,例如,控制件13可控制質量塊12接觸振動感測單元11(如圖1所示),亦可控制質量塊12未接觸振動感測單元11(如圖2所示),甚至可在質量塊12接觸振動感測單元11時控制質量塊12接觸振動感測單元11之壓力大小,以控制雜訊之減少量以及所
生成之振動訊號之品質。於一實施例中,使用者可根據需求來操作該控制件13以得到不同品質之振動訊號。
Please refer to Figure 1 and Figure 2 at the same time. The vibration collecting
於一實施例中,振動感測單元11可為壓電材料(晶體或陶瓷)所製成之感測器,但本發明並不以此為限。
In one embodiment, the
於一實施例中,振動源2所產生之振動可為機械運動振動或聲音振動,使用者可將本發明之振動採集裝置1直接貼附在所欲偵測之位置,例如物品上,或是音響、喇叭之出聲處等等,並可將本發明之振動採集裝置1所輸出之振動訊號轉換成如物品之振動頻率或聲音之振動頻率等易於使用者判讀之顯示模式。
In one embodiment, the vibration generated by the
綜上所述,藉由本發明之振動採集裝置中振動感測單元與質量塊之間的結構設計,可使振動感測單元之中央部位呈現自由狀態而可具備較為靈敏之感測能力,並可藉由質量塊部分接觸振動感測單元而可具備減少接收雜訊之效果。因此,本發明之振動採集裝置不僅可偵測一般機械振動之外,亦可偵測如聲音、脈搏、心率等細微之振動,而可擴大應用領域。 To sum up, through the structural design between the vibration sensing unit and the mass block in the vibration collection device of the present invention, the central part of the vibration sensing unit can be presented in a free state and have a more sensitive sensing capability, and can By partially contacting the vibration sensing unit with the mass block, the effect of receiving noise can be reduced. Therefore, the vibration collecting device of the present invention can not only detect general mechanical vibrations, but also detect subtle vibrations such as sound, pulse, heart rate, etc., thereby expanding the application field.
上述實施形態僅為例示性說明本發明之技術原理、特點及其功效,並非用以限制本發明之可實施範疇,任何熟習此技術之人士均可在不違背本發明之精神與範疇下,對上述實施形態進行修飾與改變。然任何運用本發明所教示內容而完成之等效修飾及改變,均仍應為下述之申請專利範圍所涵蓋。而本發明之權利保護範圍,應如下述之申請專利範圍所列。 The above embodiments are only for illustrating the technical principles, characteristics and effects of the present invention, and are not intended to limit the scope of the present invention. Anyone familiar with this technology can implement the present invention without violating the spirit and scope of the present invention. Modifications and changes are made to the above embodiments. However, any equivalent modifications and changes accomplished by applying the teachings of the present invention should still be covered by the following patent application scope. The scope of protection of the rights of the present invention shall be as listed in the following patent application scope.
1:振動採集裝置 1: Vibration collection device
10:殼體 10: Shell
101:支撐部 101:Support part
11:振動感測單元 11:Vibration sensing unit
111:中央部位 111:Central part
12:質量塊 12: Mass block
121:凸部 121:convex part
13:控制件 13:Control parts
2:振動源 2: Vibration source
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CN202111055017.3A CN114184273A (en) | 2020-09-14 | 2021-09-09 | Vibration collection device |
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US202063077763P | 2020-09-14 | 2020-09-14 | |
US63/077,763 | 2020-09-14 |
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Citations (2)
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TW200937477A (en) * | 2007-11-22 | 2009-09-01 | Panasonic Elec Works Co Ltd | Infrared sensor switch |
TWM562892U (en) * | 2018-03-30 | 2018-07-01 | 研能科技股份有限公司 | Gas detecting module |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200937477A (en) * | 2007-11-22 | 2009-09-01 | Panasonic Elec Works Co Ltd | Infrared sensor switch |
TWM562892U (en) * | 2018-03-30 | 2018-07-01 | 研能科技股份有限公司 | Gas detecting module |
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