TWI808967B

TWI808967B - Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle

Info

Publication number: TWI808967B
Application number: TW107113735A
Authority: TW
Inventors: 威廉吉爾伯特比恩甘; 克里斯霍夫邁斯特; 約翰泰迪
Original assignee: 美商維克儀器公司
Priority date: 2017-04-25
Filing date: 2018-04-23
Publication date: 2023-07-21
Also published as: WO2018200401A1; TW201906656A

Abstract

The wafer processing system includes a rotatable wafer support member for supporting a wafer and a plurality of collections trays disposed about a peripheral edge of the wafer support member. The collection trays are arranged in a stacked configuration, each collection tray having an inner wall portion and an outer wall portion that converge to define a trough section for collecting fluid. The system includes a chamber exhaust outlet that is formed in the housing for venting gas from the interior of the housing outside of the collection trays and a chemical exhaust outlet that is formed in the housing for venting gas that flows through the collection chamber to the chemical exhaust outlet. The chemical exhaust outlet can be fluidly isolated from the chamber exhaust outlet.

Description

於半導體晶圓處理循環中分離多種液體之收集室設備 Collection Chamber Equipment for Separation of Multiple Liquids in Semiconductor Wafer Processing Cycles

本發明一般有關於晶圓處理裝置，尤其關於提供一種於晶圓處理期間分離並收集多種不同流體以供再使用的手段。 The present invention relates generally to wafer processing apparatus, and more particularly to providing a means of separating and collecting various fluids during wafer processing for reuse.

本發明尤其有關於矽晶圓處理，其中在清理、蝕刻或進行其他濕式製程操作的製程期間使用多種流體。流體時常很昂貴並希望能夠再使用它們直到耗盡為止。 In particular, the present invention relates to silicon wafer processing in which various fluids are used during processes for cleaning, etching, or performing other wet process operations. Fluids are often expensive and it is desirable to be able to reuse them until exhausted.

正常的晶圓處理利用一個收集室以從廢水排放分離出一種特殊流體並允許流體的再循環。 Normal wafer processing utilizes a collection chamber to separate a specific fluid from the waste water discharge and to allow recirculation of the fluid.

本發明之目的在於擁有多個獨立的收集室，具有能夠分離多種不同流體以供再循環及再使用。 It is an object of the present invention to have multiple independent collection chambers with the ability to separate multiple different fluids for recirculation and reuse.

一種晶圓處理系統包括一腔室外殼。系統亦包括用於支撐一晶圓之一可旋轉晶圓支撐件，以及圍繞該晶圓支撐件的外圍邊緣設置之複數個可獨立移動的收集盤。該等收集盤以一堆疊組態配置，其中各收集盤具有用於收集流體的一收集區。該等收集盤的至少一者具有與用於排出收集到的流體之該收集區流體連通的一排水口。 A wafer processing system includes a chamber enclosure. The system also includes a rotatable wafer support for supporting a wafer, and a plurality of independently movable catch trays disposed around the peripheral edge of the wafer support. The collection trays are arranged in a stacked configuration, wherein each collection tray has a collection area for collecting fluid. At least one of the collection pans has a drain in fluid communication with the collection area for draining collected fluid.

設置一驅動機構，其用於選擇性並獨立移動該等收集盤中之一或多者至該晶圓支撐件上方的一升起位置，以界定形成在該至少一升起的收集盤與一降下的收集盤之間的一收集室。該收集室係經配置以收集於晶圓處理期間自該晶圓排出的流體，並將該收集到的流體導送通過該降下的收集盤之該排水口。 A drive mechanism is provided for selectively and independently moving one or more of the catch trays to a raised position above the wafer support to define the at least one raised catch tray and a A collection chamber between lowered collection pans. The collection chamber is configured to collect fluid drained from the wafer during wafer processing and to direct the collected fluid through the drain port of the lowered collection tray.

系統包括形成在該外殼中以將氣體從該外殼內部排出到該等收集盤之外的一腔室排氣口，以及形成在該外殼中以排出流經該收集室至該化學排氣口之氣體之一化學排氣口。該化學排氣口與該腔室排氣口流體隔離。 The system includes a chamber exhaust formed in the housing to exhaust gases from inside the housing to outside the collection trays, and a chamber exhaust formed in the housing to exhaust gas flowing through the collection chamber to the chemical exhaust port. One of the gas chemical vents. The chemical vent is fluidly isolated from the chamber vent.

根據本發明的另一態樣，收集室設備(流體收集裝置)以多個(n+1)圓形收集盤構成，在不使用時其彼此堆疊且密封，並依需要形成多個(n)獨特的收集室及排水系統。 According to another aspect of the present invention, the collection chamber device (fluid collection device) is composed of multiple (n+1) circular collection trays, which are stacked and sealed when not in use, and multiple (n) circular collection trays are formed as required. Unique collection chamber and drainage system.

根據一實施例，一種晶圓處理系統包括組態成在晶圓處理期間分離並收集多種流體以供再使用之一流體收集設備。該晶圓處理系統包括用於支撐一晶圓之一可旋轉晶圓支撐件，以及圍繞該晶圓支撐件的外圍邊緣設置之複數個可獨立移動的收集盤。該等收集盤以一堆疊組態配置，各收集盤具有一內壁部及一外壁部，其匯聚以界定用於收集流體之一槽區。該內壁部比該外壁部更接近該晶圓支撐件。收集盤的至少一些具有與用於排放收集到的流體之槽區流體連通之一出口，其中槽區的最底緣(A)界定該收集盤的最底點，該內壁部具有一頂緣(B)且該外壁部具有一頂緣(C)。 According to one embodiment, a wafer processing system includes a fluid collection device configured to separate and collect fluids during wafer processing for reuse. The wafer processing system includes a rotatable wafer support for supporting a wafer, and a plurality of independently movable collection trays disposed around the peripheral edge of the wafer support. The collection trays are arranged in a stacked configuration, each collection tray having an inner wall portion and an outer wall portion that converge to define a trough for collecting fluid. The inner wall portion is closer to the wafer support than the outer wall portion. At least some of the collection pans have an outlet in fluid communication with a sump for discharging collected fluid, wherein the bottommost edge (A) of the sump defines the bottommost point of the collection pan, and the inner wall portion has a top edge (B) and the outer wall portion has a top edge (C).

設置一驅動機構，其用於選擇性動該等收集盤中之一或多者至該晶圓支撐件上方的一升起位置，以界定形成在該升起的收集盤與降下的收集盤之間的一收集室。該收集室係經配置以收集於晶圓處理期間自該晶圓排出的流體，並將該收集到的流體導送通過該降下的收集盤之該出口。 A driving mechanism is provided for selectively moving one or more of the collection trays to a raised position above the wafer support to define a gap formed between the raised collection tray and the lowered collection tray. A collection room. The collection chamber is configured to collect during wafer processing from the Wafer draining fluid and directing the collected fluid through the outlet of the lowered collection tray.

為了消除或大幅減少來自驅逐到收集室的流體之潑濺，該升起的收集盤之該底緣(A)低於該降下的收集盤的該內壁部之該頂緣(B)，且該升起的收集盤之該底緣(A)係位於等於或低於該降下的收集盤之外壁部之頂緣(C)的高度處。 To eliminate or substantially reduce splashing from fluid expelled into the collection chamber, the bottom edge (A) of the raised collection pan is lower than the top edge (B) of the inner wall portion of the lowered collection pan, and The bottom edge (A) of the raised collection tray is at a level equal to or lower than the top edge (C) of the outer wall portion of the lowered collection tray.

1:收集室 1: collection room

2:收集室 2: collection room

22:多餘的流體 22: excess fluid

23:流體 23: Fluid

24:滴槽 24: drip groove

25:路徑 25: path

26:流體 26: Fluid

29:承座 29: seat

28:銷 28: pin

30:路徑 30: path

32:流體 32: Fluid

33:位置 33: position

34:間隙 34: Gap

36:第二收集室(間隙) 36: Second collection chamber (gap)

37:第三收集室(間隙) 37: Third collection chamber (gap)

42:路徑 42: path

100:收集室設備 100: Collection room equipment

110:旋轉卡盤 110: Rotary Chuck

112:馬達 112: motor

115:晶圓 115: Wafer

119:流體 119: fluid

120:配送臂 120: distribution arm

130、140、150、160:收集盤 130, 140, 150, 160: collection tray

131、141、151、161:中央開口 131, 141, 151, 161: central opening

132、142、152、162:收集軌道 132, 142, 152, 162: Collect tracks

133、143、153、163:凸緣區 133, 143, 153, 163: flange area

134、144、154、164:開口 134, 144, 154, 164: opening

135、145、155、165:開口 135, 145, 155, 165: opening

136、146、156、166:出口 136, 146, 156, 166: exit

147、157、167:流體導管件 147, 157, 167: fluid conduit parts

199:流體池 199: Fluid pool

200:歧管 200: Manifold

201、202、203:入口 201, 202, 203: Entrance

210:排水管 210: drain pipe

260:排水渠 260: Drain

300:活塞 300: Piston

307、308:肩部 307, 308: shoulder

310:活塞 310: Piston

320:活塞 320: Piston

321:止件 321: stop piece

400:收集盤配置 400: Collection disk configuration

401:第一收集室 401: The first collection room

405:收集蓋 405: collection cover

413、423、433、443:內壁部 413, 423, 433, 443: inner wall

414、424、434、444:外壁部 414, 424, 434, 444: outer wall

415、425、435、445:槽 415, 425, 435, 445: groove

410:第一收集盤 410: The first collection plate

420:第二收集盤 420: the second collection plate

427:內頂緣 427: inner top edge

428:外頂緣 428: outer top edge

430:第三收集盤 430: The third collection plate

440:第四收集盤 440: The fourth collection plate

450:收集盤外殼 450: collection tray housing

452:分隔壁 452: partition wall

454:頂緣 454: top edge

457:底壁 457: bottom wall

460:第一隔間 460: first compartment

462:內壁 462: inner wall

463:頂緣 463: top edge

470:第二隔間 470: second compartment

472:外壁 472: outer wall

476:頂壁部 476: top wall

480:第一開口或通道 480: First opening or passage

490:第二開口或通道 490: Second opening or passage

500:收集盤配置 500: Collection disk configuration

501:收集盤外殼 501: collection tray shell

503:防濺擋板 503: splashback

510:第一收集盤 510: The first collection plate

515:外蓋部 515: Outer cover

520:第二收集盤 520: the second collection plate

530:第三收集盤 530: The third collection plate

540:第四收集盤 540: The fourth collection plate

550:內壁部 550: inner wall

555:槽 555: Slot

551:內頂緣 551: inner top edge

560:外壁部 560: Outer wall

561:外頂緣 561: outer top edge

600:收集盤配置 600: Collection disk configuration

601:收集盤外殼 601: collection tray housing

602:內壁 602: inner wall

603:分隔壁 603: partition wall

604:頂緣 604: top edge

605:第一隔間 605: first compartment

606:底壁 606: bottom wall

607:第二隔間 607: second compartment

608:外壁 608: outer wall

609:頂壁部 609: top wall

610:第一收集盤 610: The first collection plate

613:凸部 613: convex part

615:外蓋部 615: Outer cover

620:第二收集盤 620: the second collection plate

630:第三收集盤 630: The third collection plate

640:第四收集盤 640: The fourth collection plate

650:內壁部 650: inner wall

655:槽 655: slot

657:排水導管(管) 657: drain conduit (pipe)

660:外壁部 660: Outer wall

659:直立內壁 659: upright inner wall

700:收集盤配置 700: Collection disk configuration

701:收集盤外殼 701: collection tray housing

703:分隔壁 703: partition wall

705:第一隔間 705: first compartment

706:底壁 706: bottom wall

707:第二隔間 707: second compartment

708:外壁 708: outer wall

709:頂壁部 709: top wall

710:第一收集盤 710: The first collection plate

715:外蓋部 715: Outer cover

720:第二收集盤 720: the second collection plate

730:第三收集盤 730: The third collection plate

750:內壁部 750: inner wall

755:槽 755: slot

760:外壁部 760: Outer wall

800:收集盤配置 800: Collection disk configuration

801:收集盤外殼 801: collection tray housing

803:分隔壁 803: partition wall

805:第一隔間 805: first compartment

806:底壁 806: bottom wall

807:第二隔間 807: second compartment

808:外壁 808: outer wall

809:頂壁部 809: top wall

810:第一收集盤 810: The first collection plate

815:外蓋部 815: Outer cover

820:第二收集盤 820: the second collection plate

830:第三收集盤 830: The third collection plate

840:第四收集盤 840: The fourth collection plate

850:內壁部 850: inner wall

851:內頂緣 851: inner top edge

855:槽 855: slot

860:外壁部 860: Outer wall

861:外頂緣 861: outer top edge

900:收集盤配置 900: Collection disk configuration

901:收集盤外殼 901: collection tray housing

903:分隔壁 903: partition wall

905:第一隔間 905: first compartment

906:底壁 906: bottom wall

907:第二隔間 907: second compartment

908:外壁 908: outer wall

909:頂壁部 909: top wall

910:第一收集盤 910: The first collection plate

915:外蓋部 915: Outer cover

920:第二收集盤 920: the second collection plate

930:第三收集盤 930: The third collection plate

940:第四收集盤 940: The fourth collection plate

950:內壁部 950: inner wall

955:槽 955: slot

960:外壁部 960: Outer wall

1000:晶圓處理室 1000: Wafer processing chamber

1010:外殼 1010: shell

1011:底板 1011: bottom plate

1012:下壁 1012: lower wall

1014:上壁 1014: upper wall

1016:側壁 1016: side wall

1020:過濾器風扇單元 1020:Filter fan unit

1030:旋轉屏蔽 1030: rotating shield

1035:擴散器 1035: Diffuser

1040:旋轉卡盤 1040: Rotary Chuck

1050:防濺擋板 1050: Splash guard

1060:流體收集器 1060: Fluid Collector

1061:外蓋 1061: outer cover

1070:腔室排氣口 1070: chamber vent

1080:化學排氣口 1080: chemical vent

1100:收集盤配置 1100: Collection disk configuration

1102:防濺擋板 1102: splash guard

1104:外壁 1104: outer wall

1105:內壁 1105: inner wall

1106:向內傾斜壁 1106: Inward sloped wall

1120:第一收集盤(杯) 1120: the first collection plate (cup)

1122:外壁 1122: outer wall

1123:內壁 1123: inner wall

1125:第一槽區 1125: the first slot area

1126:底部 1126: bottom

1127:傾斜底板壁 1127: Inclined floor wall

1130:第二收集盤(杯) 1130: the second collection tray (cup)

1132、1134、1136:壁 1132, 1134, 1136: wall

1135:第二槽區 1135: the second slot area

1140:第三收集盤(杯) 1140: the third collection plate (cup)

1142、1144:壁 1142, 1144: wall

1145:第三槽區 1145: The third slot area

1200:收集盤配置 1200: Collection disk configuration

1202:收集蓋 1202: collection cover

1204:外壁 1204: outer wall

1205:內壁 1205: inner wall

1206:向內傾斜壁 1206: Inward sloped wall

1220:第一收集盤 1220: The first collection plate

1222:外壁 1222: outer wall

1223:內壁 1223: inner wall

1225:第一槽區 1225: the first slot area

1226:底部 1226: bottom

1230:多室收集盤 1230: Multi-chamber collection tray

1232、1234、1236:壁 1232, 1234, 1236: wall

1235:第二槽區 1235: the second slot area

1237:第三槽區 1237: The third slot

1240:內環 1240: inner ring

1900:排氣系統 1900: Exhaust system

1910:排氣導管 1910: Exhaust Duct

1920:防濺擋板 1920: Splashback

1922:頂傾斜壁 1922: top sloping wall

1924:垂直外壁 1924: Vertical outer wall

1930:收集蓋 1930: Collection cover

1940:第一收集杯 1940: First collection cup

1950:第二收集杯 1950: Second collection cup

1960:第三收集杯 1960: The third collection cup

1970:排氣通道 1970: Exhaust channels

V1:第一閥件 V1: the first valve

V2:第二閥件 V2: the second valve

第1圖為根據發明之收集室設備的等軸測視圖；第2A圖為顯示在堆疊載入晶圓位置中的設備之四個收集盤的透視圖；第2B圖為設備的頂部平面圖；第2C圖為沿第2B圖之線A-A所取之剖面圖；第2D圖為第2C圖中所示之堆疊收集盤的一部分之放大剖面；第2E圖為沿第2B圖之線B-B所取之剖面圖；第3A圖為貫穿設備之剖面圖，具有在第一流體收集位置之收集室；第3B圖為貫穿在與第3A圖相同位置中之收集室的排水渠之剖面，描畫出一界定的流動路徑；第3C圖為如第3A圖之相同剖面，顯示用於導送流體之一替代流動路徑及多個下側滴槽；第3D圖為顯示侷限收集盤之移動的升降桿以及收集盤可座落於上的支件之剖面；第4圖顯示在第二流體收集位置中的收集盤之剖面；第5圖顯示在第三流體收集位置中的收集盤之剖面；第6圖顯示貫穿氣缸及收集盤之剖面，描繪一個氣缸如何將兩個盤子升到預定位置並提供界定收集室空間之正確的室間隙；第7圖為堆疊收集盤的放大剖面圖，其包括保留在收集盤之間的凹部以減少收集盤閉合時流體潑濺；第8圖為顯示在第一流體收集位置中之設備的透視圖；第9圖為顯示在第二流體收集位置中之設備的透視圖；第10圖為顯示在第三流體收集位置中之設備的透視圖；第11圖為根據另一實施例的一示範半導體晶圓處理室之剖面側視圖；第12A圖為在第一操作位置中之第11圖的處理室之剖面側視圖；第12B圖為在第二操作位置中之第11圖的處理室之剖面側視圖；第12C圖為在第三操作位置中之第11圖的處理室之剖面側視圖；第12D圖為在第四操作位置中之第11圖的處理室之剖面側視圖；第13A圖為可堆疊收集盤(杯)之一示範配置的頂部平面圖，繪示其排水特徵；第13B圖為可堆疊收集盤(杯)之底部平面圖，繪示其排水特徵；第14A圖為根據本發明之另一實施例的由複數個收集盤所界定的收集室設備的一部分之剖面圖，顯示在升起位置(第一流體收集位置)中之上外蓋及第一收集盤；第14B圖為在閉合位置(降下位置)中之第14A圖的上外蓋及收集盤之剖面圖；第15圖為根據本發明之另一實施例的由複數個收集盤所界定的收集室設備的一部分之剖面圖，顯示在閉合位置(降下位置)中之上外蓋及第一收集盤；第16A圖為根據本發明之另一實施例的由複數個收集盤所界定的收集室設備的一部分之剖面圖，顯示在升起位置(第一流體收集位置)中之上外蓋及第一收集盤；第16B圖為在閉合位置(降下位置)中之第16A圖的上外蓋及收集盤之剖面圖；第17A圖為根據本發明之另一實施例的由複數個收集盤所界定的收集室設備的一部分之剖面圖，顯示在升起位置(第一流體收集位置)中之上外蓋及第一收集盤；第17B圖為在閉合位置(降下位置)中之第17A圖的上外蓋及收集盤之剖面圖；第18A圖為根據本發明之另一實施例的由複數個收集盤所界定的收集室設備的一部分之剖面圖，顯示在升起位置(第一流體收集位置)中之上外蓋及第一收集盤；第18B圖為在閉合位置(降下位置)中之第18A圖的上外蓋及收集盤之剖面圖；第19A圖為根據本發明之另一實施例的由複數個收集盤所界定的收集室設備的一部分之剖面圖，顯示在升起位置(第一流體收集位置)中之上外蓋及第一收集盤；第19B圖為在閉合位置(降下位置)中之第19A圖的上外蓋及收集盤之剖面圖；第20圖為一示範收集盤的頂部平面圖，顯示與槽關聯之變化曲率半徑；第21圖為又一盤配置之部分剖面圖；第22A至22D圖為以不同位置顯示的另一盤配置之部分剖面圖；第23A圖為一替代排氣系統的剖面圖，其中僅顯示一排氣口及在打開位置中之防濺擋板，以允許空氣繞過防濺擋板到排氣口內；以及第23B圖為第23A圖之排氣系統的剖面圖，其中防濺擋板在閉合位置中。 Fig. 1 is an isometric view of a collection chamber apparatus according to the invention; Fig. 2A is a perspective view showing four collection trays of the apparatus in a stacked loading wafer position; Fig. 2B is a top plan view of the apparatus; Fig. Figure 2C is a section taken along line A-A of Figure 2B; Figure 2D is an enlarged section of a part of the stacked collection tray shown in Figure 2C; Figure 2E is a section taken along line B-B of Figure 2B Sectional view; Figure 3A is a section through the device, with a collection chamber at the first fluid collection location; Figure 3B is a section through the drain channel through the collection chamber in the same position as Figure 3A, depicting a delimitation Figure 3C is the same cross-section as Figure 3A, showing an alternate flow path and multiple underside drip troughs for conveying fluid; Figure 3D shows the lifting rod and the collection plate to limit the movement of the collection tray A section of the support on which the tray can be seated; Figure 4 shows a section of the collection tray in the second fluid collection position; Figure 5 shows a section of the collection tray in the third fluid collection location; Figure 6 shows a section through the cylinder and collection tray, depicting how one cylinder lifts the two trays to the desired position and provides the correct chamber gap to define the collection chamber space; Figure 7 is an enlarged section view of the stacked collection tray, which includes A recess is left between the collection trays to reduce fluid splashing when the collection trays are closed; Figure 8 is a perspective view of the device shown in the first fluid collection position; Figure 9 is the device shown in the second fluid collection position Figure 10 is a perspective view of the apparatus shown in a third fluid collection position; Figure 11 is a cross-sectional side view of an exemplary semiconductor wafer processing chamber according to another embodiment; Figure 12A is A sectional side view of the processing chamber of Fig. 11 in an operating position; Fig. 12B is a sectional side view of the processing chamber of Fig. 11 in a second operating position; Fig. 12C is a sectional side view of the processing chamber of Fig. 11 in a third operating position 11 is a cutaway side view of the processing chamber of FIG. 11; FIG. 12D is a cutaway side view of the processing chamber of FIG. 11 in a fourth operating position; FIG. 13A is a top plan view of an exemplary configuration of stackable collection trays (cups) , depicting its drainage characteristics; Figure 13B is a bottom plan view of a stackable collection tray (cup), illustrating its drainage characteristics; Figure 14A is a collection defined by a plurality of collection trays according to another embodiment of the present invention A cutaway view of a portion of chamber equipment showing the upper cover and first collection tray in a raised position (first fluid collection position); Figure 14B is a cross-sectional view of the upper cover and collection tray of Figure 14A in the closed position (down position); Figure 15 is a collection chamber defined by a plurality of collection trays according to another embodiment of the present invention Sectional view of a portion of the device showing the upper cover and the first collection tray in the closed position (lowered position); Fig. 16A is a collection chamber device defined by a plurality of collection trays according to another embodiment of the present invention A cutaway view of a portion of Figure 16B showing the upper cover and first collection tray in the raised position (first fluid collection position); Figure 16B is the upper cover and first collection tray of Figure 16A in the closed position (lower position) Sectional view of collection tray; Figure 17A is a section view of a portion of a collection chamber apparatus defined by a plurality of collection trays according to another embodiment of the present invention, shown in a raised position (first fluid collection position) Upper outer cover and first collecting tray; Figure 17B is a cross-sectional view of the upper outer cover and collecting tray of Figure 17A in the closed position (down position); Figure 18A is a sectional view of the upper outer cover and collecting tray according to another embodiment of the present invention Sectional view of a portion of the collection chamber apparatus defined by a plurality of collection trays, showing the upper cover and first collection tray in the raised position (first fluid collection position); Figure 18B in the closed position (lowered position) Among them, the sectional view of the upper outer cover and the collection tray of Fig. 18A; Fig. 19A is a sectional view of a part of the collection chamber equipment defined by a plurality of collection trays according to another embodiment of the present invention, showing that it is raised position (first fluid collection position) with the upper cover and first collection tray; Figure 19B is the upper cover of Figure 19A in the closed position (lowered position) Figure 20 is a top plan view of an exemplary collection pan showing the varying radii of curvature associated with the grooves; Figure 21 is a partial cross-sectional view of yet another pan configuration; Figures 22A to 22D are views in different positions Partial cutaway view of another pan configuration shown; Figure 23A is a cutaway view of an alternative exhaust system showing only one exhaust port and the splash guard in the open position to allow air to bypass the splash guard plate into the exhaust port; and Figure 23B is a cross-sectional view of the exhaust system of Figure 23A with the splash guard in the closed position.

第1圖為本發明之收集室設備100的概觀，顯示在堆疊載入晶圓位置33中的收集盤130、140、150、160(更多細節請參見第2及2A圖)，其中可添加或移除晶圓115。這四個盤子圍繞著晶圓115。應可了解到接下來的討論僅為本發明的一種實作之範例且不限制本發明的範疇，因為可有如後所討論之其他實作。如本文中所述，藉由創造相對於彼此可為密封之離散型的收集室，可在不同的室內收集來自不同處理化學物質之任何噴霧。例如，提供用於收集第一化學物質之收集室；提供用於收集第二化學物質之收集室等等。由於每一個收集室相對於其他為密封，避免化學物質的交叉污染。 Figure 1 is an overview of the collection chamber apparatus 100 of the present invention, showing collection trays 130, 140, 150, 160 in a stacked wafer position 33 (see Figures 2 and 2A for more details), where additional Or remove the wafer 115 . These four plates surround wafer 115 . It should be understood that the ensuing discussion is merely an example of one implementation of the invention and does not limit the scope of the invention, as other implementations are possible as discussed subsequently. As described herein, by creating discrete collection chambers that can be sealed relative to each other, any spray from different treatment chemicals can be collected in different chambers. For example, providing a collection chamber for collecting a first chemical substance; providing a collection chamber for collecting a second chemical substance, and so on. Since each collection chamber is sealed relative to the others, cross-contamination of chemicals is avoided.

第一流體分離位置將作為針對三種流體之各者的典型操作之說明的範例。參考第3及6圖並根據一種操作模式，一對活塞300(如氣缸)(一種驅動機構)使收集盤130及140上升而形成由間隙34(亦即板子之間的間隙(距離))辨識之第一收集室。第6圖更詳細顯示獨特的活塞設計，兩者皆使盤130及140上升至垂直水平38並透過肩部307及308形成希望的收集室間隙34。尤其，當活塞300被致動時，其之第一區域穿過形成在收集盤中的全部對劑之開口134、144、154、164；其之第二區域僅穿過開口144、154、164；而其之第三區域僅穿過開口154、164。當活塞300完成其延伸行程時，收集盤130的下側座落在肩部307上且收集盤140的下側座落在肩部308上。可透過肩部307及308之間的距離和盤子的厚度控制並界定間隙34(收集室)，且進一步地，如下所討論，可由銷28控制並界定間隙距離。 The first fluid separation location will serve as an example for illustration of typical operation for each of the three fluids. Referring to Figures 3 and 6 and according to one mode of operation, a pair of pistons 300 (such as air cylinders) (a drive mechanism) raises the collection pans 130 and 140 to form a gap 34 (i.e., the gap (distance) between the plates). The first collection room. Figure 6 shows the unique piston design in more detail, Both raise discs 130 and 140 to vertical level 38 and form desired collection chamber gap 34 through shoulders 307 and 308 . In particular, when the piston 300 is actuated, its first region passes through all the openings 134, 144, 154, 164 formed in the collection tray; its second region passes through only the openings 144, 154, 164. ; and its third region only passes through the openings 154,164. When the piston 300 completes its extended stroke, the underside of the catch pan 130 seats on the shoulder 307 and the underside of the catch pan 140 sits on the shoulder 308 . Gap 34 (collection chamber) can be controlled and defined by the distance between shoulders 307 and 308 and the thickness of the plate, and further, the gap distance can be controlled and defined by pin 28 as discussed below.

接下來，參照回到第3A圖，馬達112旋轉位在旋轉卡盤110上的晶圓115，配送臂120接著置中在晶圓115上方並配送第一流體到製程中。馬達112增加每分鐘轉數以將流體分散於晶圓表面上，多餘的流體會被離心力甩到旋轉卡盤110的外圍邊緣並到盤130之斜壁的下側上，參考第3B圖。針對流動路徑22，重力使流體掉落到收集盤140中(例如到其之收集軌道中)，自該處流入出口146及流體導管件147，最終進入歧管200之中。流體自該處流入排水管210並到達一離散的槽(未圖示)以供儲存及再使用，在下一次晶圓週期中自該處加以配送。 Next, referring back to FIG. 3A, the motor 112 rotates the wafer 115 on the spin chuck 110, and the dispensing arm 120 is then centered over the wafer 115 and dispenses the first fluid into the process. The motor 112 increases RPM to spread the fluid over the wafer surface, excess fluid is thrown by centrifugal force to the peripheral edge of the spin chuck 110 and onto the underside of the sloped wall of the disc 130, see FIG. 3B. With respect to flow path 22 , gravity causes the fluid to drop into collection tray 140 (eg, into its collection track), from where it flows into outlet 146 and fluid conduit 147 , and ultimately into manifold 200 . From there, the fluid flows into drain 210 and to a discrete tank (not shown) for storage and reuse, from where it is dispensed during the next wafer cycle.

第3C圖顯示一替代的流動路徑30，其中流體23可順著盤130的下側流下，且包括多個滴槽24以停止流動並將流體向下導入希望的收集盤140(其位在盤130下方)。 Figure 3C shows an alternative flow path 30 in which the fluid 23 can flow down the underside of the pan 130, and includes a plurality of drip grooves 24 to stop the flow and direct the fluid down to the desired collection pan 140 (which is located in the pan 140). 130 below).

第3D圖顯示一上升銷28之剖面圖。一對銷28延伸穿過收集盤的相對凸緣部之開口135、145、155、165。銷28係經配置以使底部的盤150及160上升離開一承座29並抵住收集盤140以密封它們而不受到潑濺，同時仍保持室間隙34。銷28因此設計成將最底部的收集盤保持成接觸其他盤以在彼此接觸之收集盤之間提供密封。如所示，銷28在底端或其附近(亦在頂端或其附近)包括徑向突出部或之類，其支撐最底部的盤。 FIG. 3D shows a cross-sectional view of a riser pin 28 . A pair of pins 28 extend through openings 135, 145, 155, 165 of opposing flange portions of the collection tray. Pin 28 is configured to lift bottom pans 150 and 160 off a seat 29 and against collection pan 140 to seal them from splashes while still maintaining chamber gap 34 . The pins 28 are thus designed to hold the bottommost collection pan in contact with the other pans to provide a seal between the collection pans in contact with each other. As shown, the pin 28 includes a radial protrusion or the like at or near the bottom end (and also at or near the top end) which supports the bottommost disc.

第4及9圖顯示具有盤130、140、150、160之設備100，形成由一對活塞310(第二活塞)結合該對活塞300(第一活塞)所定位的第二收集室36(間隙)，活塞對300亦被致動且處於其之完全延伸狀態中。當活塞310被致動並往上移動時，活塞310之階梯構造會使收集盤130及140被活塞310的第一肩部支撐(導致盤130及140處於互相密封狀態)且盤150及160坐抵在活塞310的第二肩部。如所示，活塞320並未被致動。第二離散流體26流經室36，跟隨正常路徑25，其中流體流到出口156以及流體導管件157並最終進入到歧管200中。流體從該處流到排水管210中並到達一離散的池(未圖示)以供儲存及再使用，在下一次晶圓週期中自該處予以配送。 Figures 4 and 9 show an apparatus 100 with discs 130, 140, 150, 160 forming a second collection chamber 36 (gap) positioned by a pair of pistons 310 (second piston) in conjunction with the pair of pistons 300 (first piston). ), the piston pair 300 is also actuated and in its fully extended state. When the piston 310 is actuated and moved upwards, the stepped configuration of the piston 310 causes the collection pans 130 and 140 to be supported by the first shoulder of the piston 310 (causing the pans 130 and 140 to seal against each other) and the pans 150 and 160 to sit against the second shoulder of the piston 310 . As shown, piston 320 is not actuated. The second discrete fluid 26 flows through the chamber 36 , following the normal path 25 , where the fluid flows to the outlet 156 and fluid conduit 157 and finally into the manifold 200 . From there the fluid flows into drain 210 and to a discrete pool (not shown) for storage and reuse, from where it is dispensed in the next wafer cycle.

第5及10圖顯示具有盤130、140、150、160之設備100，形成由一活塞對320(第三活塞)結合活塞對300及310(第一及第二活塞)所定位的第三收集室37(間隙)，活塞對300及310亦被致動且處於其之完全延伸狀態中。當活塞320被致動並往上移動時，活塞320之階梯構造會使收集盤130、140、150(最上面的三個盤)被活塞320的第一肩部支撐(導致盤130、140、150處於互相密封狀態)且盤160(最下面的盤)坐抵在活塞320的第二肩部。第三離散流體32流經室37，跟隨正常路徑42，其中流體流到出口166以及流體導管件167並最終進入到歧管200中。流體從該處流到排水管210中並到達一離散的槽(未圖示)以供儲存及再使用，在下一次晶圓週期中自該處予以配送。 Figures 5 and 10 show an apparatus 100 with discs 130, 140, 150, 160 forming a third collection positioned by a piston pair 320 (third piston) in conjunction with piston pairs 300 and 310 (first and second pistons). Chamber 37 (gap), piston pair 300 and 310 is also actuated and in its fully extended state. When the piston 320 is actuated and moves upward, the stepped configuration of the piston 320 causes the collection pans 130, 140, 150 (the top three pans) to be supported by the first shoulder of the piston 320 (causing the pans 130, 140, 150 are in mutual sealing state) and disc 160 (lowermost disc) sits against the second shoulder of piston 320 . The third discrete fluid 32 flows through the chamber 37 , following the normal path 42 , where the fluid flows to the outlet 166 and fluid conduit 167 and finally into the manifold 200 . From there the fluid flows into drain 210 and to a discrete tank (not shown) for storage and reuse, from where it is dispensed in the next wafer cycle.

界定一特定選定的收集室之兩個收集盤間的距離保持相同，無論是哪兩個收集盤130、140、150、160界定那個收集室。這是活塞之構造(如形成於其中之肩部)及其受控的行程距離所致。 The distance between two collection trays defining a particular selected collection chamber remains the same regardless of which two collection trays 130, 140, 150, 160 define that collection chamber. This is due to the configuration of the piston, such as the shoulder formed in it, and its controlled travel distance.

如第8~10圖中所示，每一個活塞300的頂端各包括具有突出部形式之止件321以限制收集盤130(最上面的收集盤)往上方向的移動。將可了解到收集盤130之最往上的位置會使收集盤130坐抵此止件321。止件321因而幫助將收集盤組合件保持在一起。 As shown in FIGS. 8-10 , the top end of each piston 300 includes a stopper 321 in the form of a protrusion to limit the upward movement of the collecting tray 130 (the uppermost collecting tray). It will be understood that the uppermost position of the collecting tray 130 will cause the collecting tray 130 to sit against the stopper 321 . The stops 321 thus help hold the collection tray assembly together.

本發明之額外的細節與優點包括但不限於：(1)收集設備能夠收集多種不同的流體而不會有彼此的交叉污染，並將每一種流體導向一個別的排水渠、(2)其含有由流體數量加一所判定之多個收集盤、(3)收集盤具有互相堆疊的能力，防止其他流體潑濺入其之中，故免除交叉污染、(4)具有肩部的氣缸設計成垂直定位並設定兩盤間的間隙，藉此形成各收集室、(5)在每個盤的下側內設計多個滴槽，以將流體導入想要的較低盤之排水渠、(6)當收集盤堆疊在一起時，上下盤之間留有間隙，以保留空間給尚未流出盤外的流體，藉此防止流體的潑濺、以及(7)各流體排放到一獨特的排水渠。 Additional details and advantages of the present invention include, but are not limited to: (1) the collection device is capable of collecting multiple different fluids without cross-contamination of each other and directing each fluid to a separate drain, (2) it contains The number of collection trays determined by the amount of fluid plus one, (3) The collection trays have the ability to stack each other to prevent other fluids from splashing into them, so cross-contamination is avoided, (4) The cylinder with shoulders is designed to be vertical Locate and set the gap between the two pans, thereby forming the collection chambers, (5) design multiple drip grooves in the underside of each pan to direct the fluid into the desired drain of the lower pan, (6) When the collection trays are stacked together, there is a gap between the upper and lower trays to reserve space for fluids that have not flowed out of the trays, thereby preventing splashing of fluids, and (7) each fluid is discharged to a unique drain.

再次參考第1~10圖且進一步參考上述討論，可理解到收集室設備100包括如下說明之若干可致動的工作構件，以將收集室設備100置於不同的操作位置中，且詳言之，創造界定的收集室及對應界定的流體流動路徑，其允許收集在晶圓處理中所用之液體。 Referring again to FIGS. 1-10 and with further reference to the above discussion, it will be appreciated that the collection chamber device 100 includes a number of actuatable working members as described below to place the collection chamber device 100 in different operating positions, and in detail , creating a defined collection chamber and a correspondingly defined fluid flow path that allows for the collection of liquids used in wafer processing.

收集室設備100包括晶圓支撐件110，於處理晶圓期間其上置有晶圓115。晶圓支撐件也稱為旋轉卡盤並且將使用此用語來指代。旋轉卡盤110操作性連接至馬達112，其係經配置成以選定的速度(每分鐘轉速(RPM))旋轉旋轉卡盤110。旋轉卡盤110之操作係透過傳統方法。 The collection chamber apparatus 100 includes a wafer support 110 on which a wafer 115 is placed during wafer processing. A wafer support is also known as a spin chuck and will be referred to using this term. The spin chuck 110 is operatively connected to a motor 112 that is configured to rotate the spin chuck 110 at a selected speed in revolutions per minute (RPM). The spin chuck 110 is operated by conventional methods.

流體配送臂120代表用以配送流體119到晶圓115上的一種手段。流體配送臂120可為任何數量之不同類型的傳統流體配送件，包括圖中所示的臂120。如本文中所述，於晶圓處理期間，將液體配送到晶圓115的表面上，且在晶圓115旋轉期間，流體會被離心力徑向往外推送並離開晶圓115。 Fluid dispensing arm 120 represents one means for dispensing fluid 119 onto wafer 115 . The fluid dispensing arm 120 can be any number of different types of conventional fluid dispensing components, including the arm 120 shown in the figures. As described herein, during wafer processing, fluid is dispensed onto the surface of wafer 115 , and during rotation of wafer 115 , the fluid is forced radially outward and away from wafer 115 by centrifugal force.

根據本發明，沿著旋轉卡盤110的圓周設置設備100之收集室組合件，因此係沿著晶圓115的圓周設置。如上述，收集室構件包含複數收集盤，其不光用來收集在處理期間自晶圓115徑向往外推出之流體，還將流體導送到一出口以促成流體的收集。 According to the present invention, the collection chamber assemblies of the apparatus 100 are arranged along the circumference of the spin chuck 110 and thus along the circumference of the wafer 115 . As noted above, the collection chamber components include a plurality of collection trays that not only collect fluid that is pushed radially outward from the wafer 115 during processing, but also direct the fluid to an outlet to facilitate collection of the fluid.

在所示的實施例中，其本質為示範性，有以堆疊組態配置之四個不同的收集盤130、140、150、160。然而，可了解到在設備100中可使用少於或多於四個的收集盤。可理解到一個收集盤的增加會造成用於收集流體之分離的收集室之相應的增加。可從下列討論及圖示中輕易了解此態樣。 In the illustrated embodiment, which is exemplary in nature, there are four different collection trays 130, 140, 150, 160 arranged in a stacked configuration. However, it is understood that fewer or more than four collection trays may be used in apparatus 100 . It will be appreciated that the addition of a collection pan will result in a corresponding increase in the number of separate collection chambers for collecting fluid. This aspect can be easily understood from the following discussion and illustrations.

收集盤130、140、150、160可具有與圖中所示相同或類似的基本設計。在所示的實施例中，收集盤130一般為環形，具有收容旋轉卡盤110和晶圓115的中央開口131。收集盤130具有主要區，其界定一環型收集軌道132，該軌道則由一底板及與底板相鄰並自其向上傾斜的一對斜面側壁所界定。同樣可能有替代的底板設計，且所示的設計本質上僅為示範性。 The collection trays 130, 140, 150, 160 may have the same or similar basic design as shown in the figures. In the illustrated embodiment, the collection tray 130 is generally annular with a central opening 131 that receives the spin chuck 110 and the wafer 115 . The collection pan 130 has a main area that defines an annular collection track 132 defined by a base plate and a pair of ramped side walls adjacent to the base plate and sloping upwardly therefrom. Alternative chassis designs are also possible and the designs shown are merely exemplary in nature.

如第1圖中所示，收集盤130亦具有一對向外延伸的凸緣區133。凸緣區133較佳彼此相對設置(如相隔180度)並具有形成於其中的複數開口134。開口134沿著凸緣區在其側壁之間間隔設置。在所示的實施例中，有收容如下述的工作活塞(如氣動(氣)缸之端部)的三個開口134。亦有形成在各凸緣區133中的一額外的開口135。開口134及135可配置成使得兩個開口134彼此相鄰而第三開口134與這對開口134隔開，其中開口135設置在該對開口134與隔開的第三開口134之間。 As shown in FIG. 1 , the collection tray 130 also has a pair of outwardly extending flange areas 133 . The flange areas 133 are preferably disposed opposite each other (eg, 180 degrees apart) and have a plurality of openings 134 formed therein. Openings 134 are spaced along the flange region between its sidewalls. In the illustrated embodiment, there are three openings 134 which receive a working piston (eg, the end of a pneumatic (air) cylinder) as described below. There is also an additional opening 135 formed in each flange area 133 . The openings 134 and 135 may be configured such that the two openings 134 are adjacent to each other and the third opening 134 is spaced apart from the pair of openings 134 , wherein the opening 135 is disposed between the pair of openings 134 and the spaced third opening 134 .

收集盤130還包括出口136，其與流體收集軌道132流體連通。出口136可具有流出槽的形式，其自凸緣區133之間的主要區徑向往外延伸。在所示的實施例中，出口136一般為V形並自主要區往外延伸，因此提供收集到的流體可沿著其流動的槽。出口136的底部與流體收集軌道132之底部(底板)流體連通，故流體可從流體收集軌道132流到出口136中。將於下說明，各收集盤的出口與歧管結構200流體連通以導送已收集的流體。 Collection tray 130 also includes an outlet 136 that is in fluid communication with fluid collection track 132 . The outlet 136 may be in the form of an outflow slot extending radially outward from the main area between the flange areas 133 . In the illustrated embodiment, the outlet 136 is generally V-shaped and extends outwardly from the main region, thus A groove is provided along which the collected fluid may flow. The bottom of outlet 136 is in fluid communication with the bottom (floor) of fluid collection track 132 so fluid can flow from fluid collection track 132 into outlet 136 . As will be described below, the outlet of each collection tray is in fluid communication with the manifold structure 200 for channeling the collected fluid.

收集盤140與收集盤130類似且一般為環形，具有收容旋轉卡盤110和晶圓115的中央開口141。收集盤140具有主要區，其界定一環型收集軌道142，該軌道則由一底板及與底板相鄰並自其向上傾斜的一對斜面側壁所界定。 The collection tray 140 is similar to the collection tray 130 and is generally ring-shaped, having a central opening 141 for receiving the spin chuck 110 and the wafer 115 . The collection pan 140 has a main area that defines an annular collection track 142 defined by a base plate and a pair of ramped side walls adjacent to the base plate and sloping upwardly therefrom.

收集盤140亦具有一對向外延伸的凸緣區143。凸緣區143較佳彼此相對設置(如相隔180度)並具有形成於其中的複數開口144。開口144沿著凸緣區在其側壁之間間隔設置。在所示的實施例中，有收容如下述的工作活塞(如氣動(氣)缸之端部)的三個開口144。亦有形成在各凸緣區143中的一額外的開口145。開口144及145可配置成使得兩個開口144彼此相鄰而第三開口144與這對開口144隔開，其中開口145設置在該對開口144與隔開的第三開口144之間。 The collecting tray 140 also has a pair of flange areas 143 extending outward. The flange areas 143 are preferably disposed opposite each other (eg, 180 degrees apart) and have a plurality of openings 144 formed therein. Openings 144 are spaced along the flange region between its sidewalls. In the illustrated embodiment, there are three openings 144 which receive a working piston (eg, the end of a pneumatic (air) cylinder) as described below. There is also an additional opening 145 formed in each flange area 143 . The openings 144 and 145 may be configured such that the two openings 144 are adjacent to each other and the third opening 144 is spaced from the pair of openings 144 , wherein the opening 145 is disposed between the pair of openings 144 and the spaced third opening 144 .

收集盤140還包括出口146，其與流體收集軌道142流體連通。出口146可具有流出槽的形式，其自凸緣區133之間的主要區徑向往外延伸。在所示的實施例中，出口146一般為V形並自主要區往外延伸，因此提供收集到的流體可沿著其流動的槽。出口146的底部與流體收集軌道142之底部(底板)流體連通，故流體可從流體收集軌道142流到出口146中。 Collection tray 140 also includes an outlet 146 that is in fluid communication with fluid collection track 142 . The outlet 146 may be in the form of an outflow slot extending radially outward from the main area between the flange areas 133 . In the illustrated embodiment, the outlet 146 is generally V-shaped and extends outwardly from the main region, thus providing a channel along which collected fluid can flow. The bottom of outlet 146 is in fluid communication with the bottom (floor) of fluid collection track 142 so fluid can flow from fluid collection track 142 into outlet 146 .

收集盤150與其他收集盤類似，且一般為環形，具有收容旋轉卡盤110和晶圓115的中央開口151。收集盤150具有主要區，其界定一環型收集軌道152，該軌道則由一底板及與底板相鄰並自其向上傾斜的一對斜面側壁所界定。 The collection tray 150 is similar to other collection trays and is generally ring-shaped with a central opening 151 for receiving the spin chuck 110 and the wafer 115 . The collection tray 150 has a main area that defines an annular collection track 152 defined by a base plate and a pair of ramped side walls adjacent to the base plate and sloping upwardly therefrom.

收集盤150亦具有一對向外延伸的凸緣區153。凸緣區153較佳彼此相對設置(如相隔180度)並具有形成於其中的複數開口154。開口154沿著凸緣區在其側壁之間間隔設置。在所示的實施例中，有收容如下述的工作活塞(如氣動(氣)缸之端部)的三個開口154。亦有形成在各凸緣區153中的一額外的開口155。開口154及155可配置成使得兩個開口154彼此相鄰而第三開口154與這對開口154隔開，其中開口155設置在該對開口154與隔開的第三開口154之間。 The collecting tray 150 also has a pair of flange areas 153 extending outward. The flange regions 153 are preferably disposed opposite each other (eg, 180 degrees apart) and have a plurality of openings 154 formed therein. Openings 154 are spaced along the flange region between its sidewalls. In the illustrated embodiment, there are three openings 154 that receive a working piston (eg, the end of a pneumatic (air) cylinder) as described below. There is also an additional opening 155 formed in each flange area 153 . The openings 154 and 155 may be configured such that the two openings 154 are adjacent to each other and the third opening 154 is spaced from the pair of openings 154 , wherein the opening 155 is disposed between the pair of openings 154 and the spaced third opening 154 .

收集盤150還包括出口156，其與流體收集軌道152流體連通。出口156可具有流出槽的形式，其自凸緣區153之間的主要區徑向往外延伸。在所示的實施例中，出口156一般為V形並自主要區往外延伸，因此提供收集到的流體可沿著其流動的槽。出口156的底部與流體收集軌道152之底部(底板)流體連通，故流體可從流體收集軌道152流到出口156中。 Collection tray 150 also includes an outlet 156 that is in fluid communication with fluid collection track 152 . The outlet 156 may be in the form of an outflow slot extending radially outward from the main area between the flange areas 153 . In the illustrated embodiment, the outlet 156 is generally V-shaped and extends outwardly from the main region, thus providing a channel along which collected fluid may flow. The bottom of outlet 156 is in fluid communication with the bottom (floor) of fluid collection track 152 so fluid can flow from fluid collection track 152 into outlet 156 .

收集盤160一般為環形，具有收容旋轉卡盤110和晶圓115的中央開口161。收集盤160具有主要區，其界定一環型收集軌道162，該軌道則由一底板及與底板相鄰並自其向上傾斜的一對斜面側壁所界定。 The collecting tray 160 is generally ring-shaped and has a central opening 161 for receiving the spin chuck 110 and the wafer 115 . The collection tray 160 has a main area that defines an annular collection track 162 defined by a base plate and a pair of ramped side walls adjacent to the base plate and sloping upwardly therefrom.

收集盤160亦具有一對向外延伸的凸緣區163。凸緣區163較佳彼此相對設置(如相隔180度)並具有形成於其中的複數開口164。開口164沿著凸緣區在其側壁之間間隔設置。在所示的實施例中，有收容如下述的工作活塞(如氣動(氣)缸之端部)的三個開口164。亦有形成在各凸緣區163中的一額外的開口165。開口164及165可配置成使得兩個開口164彼此相鄰而第三開口164與這對開口154隔開，其中開口165設置在該對開口164與隔開的第三開口164之間。 The collecting tray 160 also has a pair of flange areas 163 extending outward. The flange regions 163 are preferably disposed opposite each other (eg, 180 degrees apart) and have a plurality of openings 164 formed therein. Openings 164 are spaced along the flange region between its sidewalls. In the illustrated embodiment, there are three openings 164 that receive a working piston (eg, the end of a pneumatic (air) cylinder) as described below. There is also an additional opening 165 formed in each flange area 163 . The openings 164 and 165 may be configured such that the two openings 164 are adjacent to each other and the third opening 164 is spaced from the pair of openings 154 , wherein the opening 165 is disposed between the pair of openings 164 and the spaced third opening 164 .

收集盤160還包括出口166，其與流體收集軌道162流體連通。出口166可具有流出槽的形式，其自凸緣區163之間的主要區徑向往外延伸。在所示的實施例中，出口166一般為V形並自主要區往外延伸，因此提供收集到的流體可沿著其流動的槽。出口166的底部與流體收集軌道162之底部(底板)流體連通，故流體可從流體收集軌道162流到出口166中。 Collection tray 160 also includes an outlet 166 that is in fluid communication with fluid collection track 162 . The outlet 166 may be in the form of an outflow slot radially outward from the main area between the flange areas 163 extend. In the illustrated embodiment, the outlet 166 is generally V-shaped and extends outwardly from the main region, thus providing a channel along which collected fluid may flow. The bottom of outlet 166 is in fluid communication with the bottom (floor) of fluid collection track 162 so fluid can flow from fluid collection track 162 into outlet 166 .

如上所述，在堆疊組態中配置收集盤130、140、150、160，因此個別的凸緣區堆疊在彼此的頂部並經配置成彼此配合，且個別的出口設置在彼此的頂部，如所示般。 As noted above, the collection trays 130, 140, 150, 160 are configured in a stacked configuration so that individual flange areas are stacked on top of each other and are configured to mate with each other and individual outlets are positioned on top of each other as shown. Show like.

出口136、146、156、166因此類似傾斜槽/流出槽，其允許流體藉由重力往下流動。最佳如第3A及3B圖中所示，出口146、156及166各分別包括自其往下降的流體導管件147、157、167。如所示，流體導管件147、157、167可各具有管狀結構，其在頂部開口端與各自出口的底部連通。流體導管件147、157、167可垂直定位，故流體會從各自的出口藉由重力流到一分離的歧管200。如第4及5圖中所示，流體導管件147、157、167滑動式收容在歧管的個別之入口201、202、203以建立流體連結。歧管200包括與流體導管件的各者流體連通之排水管210，因此流經流體導管件的流體流入歧管並流入排水管210中。排水管210導送流體到預定的位置，例如設有用於收集流體的收集池之位置。 The outlets 136, 146, 156, 166 thus resemble inclined troughs/outflows which allow fluid to flow downward by gravity. As best shown in Figures 3A and 3B, the outlets 146, 156 and 166 each include a fluid conduit member 147, 157, 167 descending therefrom, respectively. As shown, the fluid conduit members 147, 157, 167 may each have a tubular structure that communicates at the top open end with the bottom of the respective outlet. The fluid conduits 147 , 157 , 167 can be positioned vertically so that fluid flows from the respective outlets to a separate manifold 200 by gravity. As shown in Figures 4 and 5, fluid conduit members 147, 157, 167 are slidably received in respective inlets 201, 202, 203 of the manifold to establish fluid connections. The manifold 200 includes a drain 210 in fluid communication with each of the fluid conduits so that fluid flowing through the fluid conduits flows into the manifold and into the drain 210 . The drain pipe 210 guides the fluid to a predetermined location, such as a location where a collection tank for collecting the fluid is provided.

設備100的收集態樣係基於後述之事實：個別的收集盤130、140、150、160可各自移動到預定的位置以界定一離散的收集室，其係經配置以收集於處理期間往外推離晶圓之流體。可理解到可使用用於移動收集盤之不同的手段，且本文所述者本質上僅為示範性。在所示的實施例中，氣動裝置用來控制盤子的移動，尤其使用具有氣缸形式的活塞。欲移動多個(如4個)收集盤，有多個活塞，尤其根據一實施例，當設備包括n個收集盤時，有2*(n-1)個活塞。此外，可理解到每一個盤子可藉由一或多個活塞移動，因此雖所示的實施例顯示成對配置的活塞，同樣可有其他變異。例如，可使用三個一組的活塞來移動收集盤。欲提供恰當的支撐，希望有至少兩個用於移動一個別的收集盤之活塞(例如，如所述，針對每個收集盤可使用三或更多個活塞)。 The collection aspect of the apparatus 100 is based on the fact that the individual collection trays 130, 140, 150, 160 can each be moved to a predetermined position to define a discrete collection chamber configured to collect and push out during processing. Wafer Fluid. It will be appreciated that different means for moving the collection tray may be used and that described herein is merely exemplary in nature. In the embodiment shown, pneumatic means are used to control the movement of the plates, in particular using pistons in the form of cylinders. To move several (eg 4) collecting trays, there are several pistons, in particular according to one embodiment, 2*(n-1) pistons when the device comprises n collecting trays. Furthermore, it will be appreciated that each plate may be moved by one or more pistons, so while the illustrated embodiment shows pistons arranged in pairs, other variations are equally possible. For example, a triplet of pistons may be used to move the collection pan. To provide proper support, it is desirable to have at least two pistons for moving an individual collection pan (eg, three or more pistons can be used for each collection pan, as described).

如所示，有一對第一活塞300、一對第二活塞310、及一對第三活塞320。活塞300、310、320配置在收集盤的凸緣區下並與開口134、144、154、164的選定者軸對準。開口134、144、154、164彼此軸對準且尺寸(亦即直徑)相異，藉此允許活塞的至少一部分穿過選定的開口。各活塞300、310、320包括階梯式構造以造成與盤子之選擇的干擾，進而造成選定盤子的上升。 As shown, there is a pair of first pistons 300 , a pair of second pistons 310 , and a pair of third pistons 320 . Pistons 300 , 310 , 320 are disposed under the flanged area of the collection pan and are axially aligned with selected ones of openings 134 , 144 , 154 , 164 . The openings 134, 144, 154, 164 are axially aligned with one another and differ in size (ie, diameter) thereby allowing at least a portion of the piston to pass through selected openings. Each piston 300, 310, 320 includes a stepped configuration to cause interference with the selection of a plate, thereby causing the selected plate to rise.

為了闡明且如下所述，第一對活塞300設計成使收集盤130及140上升；第二對活塞300設計成使收集盤140及150上升；且第三對活塞300設計成使收集盤150及160上升。換言之，每一對活塞設計成使兩個收集盤上升；然而，結合被致動的其他對活塞，移動超過兩個收集盤。 To illustrate and as described below, a first pair of pistons 300 is designed to raise collection pans 130 and 140; a second pair of pistons 300 is designed to raise collection pans 140 and 150; and a third pair of pistons 300 is designed to lift collection pans 150 and 150. 160 up. In other words, each pair of pistons is designed to raise two catch pans; however, in conjunction with other pairs of pistons being actuated, move beyond two catch pans.

最佳如第6圖所示，第一活塞300的階梯式構造係由第一肩部307和第二肩部308界定。第二肩部308的外直徑大於第一肩部307。活塞300因此具有變化的直徑，尤其包括介於第一肩部307與之間並具有第一外直徑的頂端的第一區域、介於兩個肩部之間並具有第二外直徑的第二區域、及在第二肩部308下方並具有第三直徑的第三區域，其中第一外直徑<第二外直徑<第三外直徑。有目的的設計開口134、144、154、164的尺寸，使得僅一或多個區域可自由穿過它們，且肩部307及308造成用於升高選定的收集盤之上升表面。 As best shown in FIG. 6 , the stepped configuration of the first piston 300 is defined by a first shoulder 307 and a second shoulder 308 . The second shoulder 308 has a larger outer diameter than the first shoulder 307 . Piston 300 thus has a varying diameter, in particular comprising a first region of the top end between the first shoulder 307 and having a first outer diameter, a second region between the two shoulders and having a second outer diameter. region, and a third region below the second shoulder 308 and having a third diameter, wherein the first outer diameter<second outer diameter<third outer diameter. The openings 134, 144, 154, 164 are purposefully sized so that only one or more regions are free to pass through them, and the shoulders 307 and 308 create rising surfaces for raising selected collection pans.

如第7圖中所示，收集盤係經配置以包括防潑濺特徵。詳言之，在相鄰閉合的收集盤之間形成流體池199以減少當閉合收集盤時流體潑濺。詳言之，當收疊起兩個盤子時，一收集盤的下側與其正下方的收集盤之上側會在其之間留有流體池199。流體池防止當閉合盤子時流體被擠出或潑出盤子間。第7圖顯示在閉合位置中的收集盤130、140、150，其中收集盤130及140之間形成一流體池199且收集盤140及150之間形成另一流體池199。 As shown in Figure 7, the collection tray is configured to include a splash-proof feature. In particular, a fluid pool 199 is formed between adjacent closed collection pans to reduce fluid splashing when closing the collection pans. In detail, when two plates are stacked, the underside of a collection tray and the collection tray directly below The upper side will leave a fluid pool 199 therebetween. The fluid pool prevents fluid from being squeezed or spilled between the plates when the plates are closed. FIG. 7 shows the collection trays 130 , 140 , 150 in the closed position, with one fluid pool 199 formed between the collection trays 130 and 140 and another fluid pool 199 formed between the collection trays 140 and 150 .

第14A及14B圖繪示根據本發明的另一示範實施例之收集室設備。可理解到第14A及14B圖僅繪示為收集室設備的一部分之收集盤的配置之剖面局部圖。第14A及14B圖所示的收集盤可因此實施在與第1~10圖中揭露者類似的收集室設備中。詳言之且如下詳述，收集室設備包括以受控方式獨立可移動並圍繞置於可旋轉卡盤上之晶圓的收集盤之配置。 Figures 14A and 14B illustrate a collection chamber apparatus according to another exemplary embodiment of the present invention. It will be appreciated that Figures 14A and 14B are only partial cross-sectional views of the arrangement of the collection trays which are part of the collection chamber apparatus. The collection trays shown in Figures 14A and 14B can thus be implemented in collection chamber devices similar to those disclosed in Figures 1-10. In particular and as detailed below, the collection chamber apparatus includes an arrangement of collection trays that are independently moveable in a controlled manner around a wafer placed on a rotatable chuck.

如先前實施例般，藉由創造可相對於彼此密封之離散收集室，可在不同的收集室中收集來自不同處理化學物質之任何噴霧。例如，收集室1設置用來收集第一化學物質，收集室2設置用來收集第二化學物質，諸如此類。由於各收集室相對於彼此為密封，避免化學物質的交叉污染。 As in the previous embodiments, by creating discrete collection chambers that can be sealed relative to each other, any sprays from different treatment chemistries can be collected in different collection chambers. For example, collection chamber 1 is configured to collect a first chemical species, collection chamber 2 is configured to collect a second chemical species, and so on. Since the collection chambers are sealed relative to each other, cross-contamination of chemicals is avoided.

第11圖為晶圓處理裝置之概觀，其係經配置成針對片狀物品(亦即晶圓)之濕處理，尤其，繪示由外殼1010界定之半導體晶圓處理室1000。外殼1010具有中空內部，其中設置本文討論之晶圓處理裝置的工作構件。外殼1010因此由下壁(底板)1012、相對的上壁1014、及延伸於下壁1012及上壁1014間的側壁1016界定。外殼1010可為正方形或矩形，且因此包括四個側壁1016。外殼1010包括若干如本文所討論之用於散佈並排出氣體之排氣特徵。 FIG. 11 is an overview of a wafer processing apparatus configured for wet processing of sheet-like items (ie, wafers), and in particular, shows a semiconductor wafer processing chamber 1000 defined by an enclosure 1010 . Housing 1010 has a hollow interior in which the working components of the wafer processing apparatus discussed herein are located. Housing 1010 is thus bounded by a lower wall (floor) 1012 , an opposing upper wall 1014 , and side walls 1016 extending between lower wall 1012 and upper wall 1014 . Housing 1010 may be square or rectangular, and thus includes four side walls 1016 . Housing 1010 includes several venting features as discussed herein for dispersing and venting gases.

外殼1010可包括沿著外殼1010的上壁1014設置之過濾器風扇單元(FFU-ULPA)1020，其與外殼1010之中空內部流體連通。過濾器風扇單元1020係經配置以在中空內部內產生氣流，故為如下說明之排氣/通風系統的一部分。過濾器風扇單元1020較佳利用具有ISO等級1輸出的目標與ISO等級1000的入口供應空氣之ULPA過濾。換言之，過濾器風扇單元1020具有過濾構件及風扇構件。風扇構件為可變速風扇，配合排氣節流閥，使外殼相較於周遭環境維持在淨正或負壓。過濾器風扇單元1020具有壓力偵測特徵，指示何時需要更換過濾器媒介或有故障。尤其，操作性連接至過濾器風扇單元1020的電腦模組監測不同壓力以偵測何時需要更換過濾器媒介或有系統故障。差壓傳送器連接於過濾器風扇單元內部與室(外殼1010)內部之間。 The housing 1010 may include a filter fan unit (FFU-ULPA) 1020 disposed along the upper wall 1014 of the housing 1010 in fluid communication with the hollow interior of the housing 1010 . The filter fan unit 1020 is configured to generate airflow within the hollow interior, so exhaust/ventilation as described below part of the system. The filter fan unit 1020 preferably utilizes ULPA filtration with an ISO Class 1 output target and an ISO Class 1000 inlet supply air. In other words, filter fan unit 1020 has a filter member and a fan member. The fan unit is a variable speed fan, in conjunction with an exhaust throttle valve, to maintain the enclosure at a net positive or negative pressure relative to the surrounding environment. The filter fan unit 1020 has a pressure detection feature that indicates when the filter media needs to be replaced or is faulty. In particular, a computer module operatively connected to the filter fan unit 1020 monitors the various pressures to detect when the filter media needs to be replaced or there is a system failure. A differential pressure transmitter is connected between the interior of the filter fan unit and the interior of the chamber (housing 1010).

同樣也示於圖中，擴散器1035可設置在過濾器風扇單元1020下方。擴散器1035可由一板子及在板子與過濾器風扇單元1020之間圍繞周邊邊緣的清洗噴嘴(如環境去離子(DI)水)所構成，目的在於將室1000之外壁的整個內部表面沖洗乾淨。擴散器1035亦可容納相機之座架。 Also shown in the figures, a diffuser 1035 may be positioned below the filter fan unit 1020 . The diffuser 1035 may consist of a plate and cleaning nozzles (eg, ambient deionized (DI) water) around the perimeter edge between the plate and the filter fan unit 1020 for the purpose of rinsing the entire interior surface of the outer walls of the chamber 1000 clean. The diffuser 1035 can also accommodate the mount of the camera.

半導體晶圓處理室1000亦包括可旋轉式之旋轉卡盤1040。可根據本發明使用任何數量的不同旋轉卡盤1040，因此旋轉卡盤1040的結構會隨著所實施之旋轉卡盤1040的種類而變。例如，旋轉卡盤1040經配置成保持並旋轉晶圓，並包括用以將氣體導向面向旋轉卡盤的晶圓面之氣體供應手段，其中氣體供應手段包含與旋轉卡盤一起旋轉的氣體噴嘴，用於在片狀物品與旋轉卡盤之間提供氣墊。這種卡盤常稱為伯努利(Bernoulli)卡盤，因為片狀物品會藉由稱為伯努利效應的氣動悖論而產生之真空貝拉向卡盤。這種伯努利卡盤包含可徑向移動的銷，其中銷穩固地保持住片狀物品，即使無加壓氣體提供伯努利效應。 The semiconductor wafer processing chamber 1000 also includes a rotatable spin chuck 1040 . Any number of different spin chucks 1040 may be used in accordance with the present invention, and thus the configuration of the spin chuck 1040 will vary with the type of spin chuck 1040 implemented. For example, the spin chuck 1040 is configured to hold and rotate the wafer and includes gas supply means for directing gas to the wafer side facing the spin chuck, wherein the gas supply means includes gas nozzles that rotate with the spin chuck, Used to provide an air cushion between sheet goods and the rotary chuck. Such chucks are often referred to as Bernoulli chucks because sheet-like items are pulled toward the chuck by a vacuum created by an aerodynamic paradox known as the Bernoulli effect. Such Bernoulli chucks consist of radially movable pins which firmly hold the sheet even without pressurized gas to provide the Bernoulli effect.

可了解到可使用其他種類的旋轉卡盤1040，包括但不限於空氣軸承、氣密、底座(pedestal)及真空卡盤。 It is understood that other types of spin chucks 1040 may be used including, but not limited to, air bearing, hermetic, pedestal, and vacuum chucks.

旋轉卡盤1040置中設置在外殼1010內於旋轉屏蔽1030下方，且在伯努利型卡盤的情況中，如所示，流體連接至一或多種流體(氣體及/或液體)。設置一主軸且與旋轉卡盤1040操作性耦合以在馬達動作下控制卡盤的旋轉，馬達例如為無框三相伺服馬達，具有直接耦合至旋轉卡盤1040的轉子。旋轉屏蔽1030用來防止流體再沈積於旋轉卡盤1040上。旋轉屏蔽1030不僅可定位於完全升起位置及完全下降位置中，還可置於部分升起位置中。 The spin chuck 1040 is centered in the housing 1010 under the spin shield 1030 Square, and in the case of a Bernoulli-type chuck, as shown, fluidly connected to one or more fluids (gas and/or liquid). A spindle is provided and operatively coupled to the spin chuck 1040 to control the chuck's rotation under the action of a motor, such as a frameless three-phase servo motor, with a rotor directly coupled to the spin chuck 1040 . The spin shield 1030 is used to prevent redeposition of fluid on the spin chuck 1040 . The rotating shield 1030 can be positioned not only in the fully raised and fully lowered positions, but also in the partially raised position.

半導體晶圓處理室1000較佳亦包括可移動防濺擋板1050。防濺擋板1050設置在旋轉卡盤1040外部，尤其，防濺擋板1050環繞旋轉卡盤1040。 The semiconductor wafer processing chamber 1000 preferably also includes a movable splash guard 1050 . The splash guard 1050 is disposed outside the spin chuck 1040 , in particular, the splash guard 1050 surrounds the spin chuck 1040 .

防濺擋板1050操作性耦合至一致動器以允許防濺擋板1050之受控升起及下降。換言之，防濺擋板1050在外殼1010內以垂直方向在升起位置與收回位置之間移動。防濺擋板1050因此可具有外壁部及向內傾斜頂壁部。向內傾斜頂壁部之自由端設置在旋轉卡盤1040的外緣附近。 Splash guard 1050 is operatively coupled to an actuator to allow controlled raising and lowering of splash guard 1050 . In other words, the splash guard 1050 moves within the housing 1010 in a vertical direction between a raised position and a retracted position. The splashback 1050 may thus have an outer wall portion and an inwardly sloped top wall portion. The free end of the inwardly inclined top wall portion is disposed near the outer edge of the spin chuck 1040 .

防濺擋板1050亦在外殼1010內的流體流動力學佔有一角，如下所述，即室內部內的氣體流動路徑至少部分取決於防濺擋板1050的位置。尤其，在外殼內部可有兩個分別的流動路徑，用於排出於晶圓處理期間在外殼內部產生的氣體(煙塵)。希望能夠排出此氣體，因為外殼內部內不想要的氣體累積可能會導致晶圓上形成凝結。於說明這兩個分別的氣體流動路徑。 The splash guard 1050 also plays a role in the dynamics of fluid flow within the housing 1010, as described below, ie, the gas flow path within the chamber interior is at least partially determined by the position of the splash guard 1050. In particular, there may be two separate flow paths inside the enclosure for exhausting gases (fumes) generated inside the enclosure during wafer processing. It is desirable to be able to vent this gas, as unwanted gas buildup inside the enclosure may cause condensation to form on the wafer. to illustrate the two separate gas flow paths.

半導體收集室設備100亦較佳包括複數個流體收集器1060，其可具有流體收集(盤)杯的形式，經配置成收集從旋轉晶圓之頂部因離心力而排放的流體(化學物質)。流體收集器1060一般具有堆疊環形收集器的形式，其具有如槽之收集空間，並可在升起位置與下降位置之間獨立移動。流體收集器1060係經配置以相互嵌套，如所示般。一流體收集室界定在一或多個升起的流體收集器1060及一或多個下降的流體收集器1060之間。流體收集器1060環繞旋轉卡盤1040並設置在防濺擋板1050之間。流體收集器1060各包括一或多個排水口，其允許已收集的流體被導送離開流體收集器1060，且詳言之，離開收集室以供收集並再使用等等。 The semiconductor collection chamber apparatus 100 also preferably includes a plurality of fluid collectors 1060, which may be in the form of fluid collection (disk) cups, configured to collect fluid (chemicals) discharged from the top of the spinning wafer due to centrifugal force. The fluid collector 1060 is generally in the form of a stacked ring collector having a collection space like a trough and independently movable between a raised position and a lowered position. Fluid collectors 1060 are configured to nest within each other, as shown. A fluid collection chamber is defined Between one or more raised fluid collectors 1060 and one or more lowered fluid collectors 1060 . Fluid collector 1060 surrounds spin chuck 1040 and is disposed between splash guards 1050 . Fluid collectors 1060 each include one or more drains that allow collected fluid to be channeled away from fluid collectors 1060, and in particular, out of a collection chamber for collection and reuse, among other things.

亦可有流體收集器外蓋1061，其設置在最上面的流體收集器1060上方並蓋住其之槽區。在一實施例中，有兩或更多個流體收集器1060，尤其，有三或更多個流體收集器1060(如四個流體收集器)。亦可了解到流體收集室可界定在外蓋1061與最上面的流體收集器1060之間。 There may also be a fluid collector cover 1061 that is positioned over the uppermost fluid collector 1060 and covers its basin area. In one embodiment, there are two or more fluid collectors 1060, in particular, there are three or more fluid collectors 1060 (eg, four fluid collectors). It can also be appreciated that a fluid collection chamber can be defined between the outer cover 1061 and the uppermost fluid collector 1060 .

可使用任何數量的技術獨立移動外蓋1061及流體收集器1060，包括但不限於相關於第1~10圖所述之驅動機構。驅動機構可因此具有獨立引導步階器驅動的導螺桿的形式，其具有位置反饋編碼器。當致動時，驅動機構導致一或多個流體收集器1060的受控升起。如所述，流體收集器1060可相互嵌套，使得後一個流體收集器1060致動時，其往上推並使前一個流體收集器1060脫離其各自的致動器。嵌套使得流體收集器1060中或在流體收集器1060之排水位置不會發生過噴(overspray)。在使用三個流體收集器1060的情況中，較低及較高的流體收集器1060設有再循環，而居中的流體收集器1060用於步驟間的化學物質清洗。 Any number of techniques may be used to independently move the outer cover 1061 and fluid collector 1060, including but not limited to the drive mechanisms described with respect to FIGS. 1-10. The drive mechanism may thus be in the form of an independently guided stepper-driven lead screw with a position feedback encoder. When actuated, the drive mechanism results in the controlled lifting of one or more fluid collectors 1060 . As noted, the fluid collectors 1060 can be nested such that when the latter fluid collector 1060 is actuated, it pushes up and disengages the previous fluid collector 1060 from its respective actuator. The nesting allows no overspray to occur in the fluid collector 1060 or at the location where the fluid collector 1060 drains. Where three fluid collectors 1060 are used, the lower and upper fluid collectors 1060 are provided with recirculation, while the middle fluid collector 1060 is used for chemical purge between steps.

半導體晶圓處理室1000包括可獨立節流的兩個分別的排氣口，亦即，腔室排氣口1070及化學排氣口1080。藉由防濺擋板1050以及一防濺擋板迷路分開該腔室排氣口1070及化學排氣口1080，以在室內部內創造分別且獨立的流動路徑。藉由將閥件納入腔室排氣口1070及化學排氣口1080的各者之中，可變更各自的流速。 The semiconductor wafer processing chamber 1000 includes two separate exhaust ports, namely, a chamber exhaust port 1070 and a chemical exhaust port 1080 , which can be throttled independently. The chamber exhaust 1070 and chemical exhaust 1080 are separated by a splash guard 1050 and a splash guard stray to create separate and independent flow paths within the chamber interior. By incorporating valves into each of the chamber vent 1070 and chemical vent 1080, the respective flow rates can be varied.

腔室排氣口1070位在室之外圓周，並排放空氣通過在下降且收起位置中之化學配送臂(未圖示)。可理解到，化學配送臂係經配置以於晶圓處理操作期間分配流體到晶圓表面上。如第11圖中所示，腔室排氣口1070可具有在防濺擋板1050外面的位置於外殼1010的側壁中之開口的形式。如本文中所述，藉由流升並繞過防濺擋板1050至一專用的排氣口1070，流體流動至該腔室排氣口1070。沿著外殼1010的側壁可形成多個腔室排氣口。或者，可如本文中相關於其他實施例(如第23A及23B圖中所揭露者)所述般提供單一排氣口。可理解到腔室排氣口1070不僅包括形成在外殼1010中之出口，還包括可沿著外殼1010之內部設置的外導管。 Chamber exhaust 1070 is located at the outer circumference of the chamber and exhausts air through the chemical dispensing arm (not shown) in the lowered and stowed position. It will be appreciated that the chemical dispensing arm is configured to Fluid is dispensed onto the wafer surface during wafer processing operations. As shown in FIG. 11 , the chamber exhaust 1070 may be in the form of an opening in the sidewall of the housing 1010 at a location outside the splash guard 1050 . Fluid flows to the chamber exhaust port 1070 by flowing up and around the splash guard 1050 to a dedicated exhaust port 1070 as described herein. A plurality of chamber exhaust ports may be formed along the sidewall of the housing 1010 . Alternatively, a single vent may be provided as described herein with respect to other embodiments, such as those disclosed in Figures 23A and 23B. It is understood that the chamber exhaust port 1070 includes not only an outlet formed in the housing 1010 , but also an outer conduit that may be disposed along the interior of the housing 1010 .

腔室排氣口1070包括獨立第一閥件V1，其係經配置以控制通過腔室排氣口1070之流動。可使用任何數量的不同類型之閥作為第一閥件V1。例如，第一閥件V1可具有蝶閥或節流閥的形式。 The chamber exhaust port 1070 includes an independent first valve member V1 configured to control flow through the chamber exhaust port 1070 . Any number of different types of valves may be used as the first valve member V1. For example, the first valve member V1 may have the form of a butterfly valve or a throttle valve.

腔室排氣口1070因此排放室內來自大致在流體收集器1060外部之區域的氣體。 The chamber vent 1070 thus vents gas within the chamber from a region generally outside of the fluid collector 1060 .

化學排氣口1080排放流經防濺擋板1050及化學收集器(杯子)之氣體至化學排氣口(出口)，其可沿著外殼1010的側壁形成但與腔室排氣口1070流體隔離。化學排氣口1080可位在腔室排氣口1070旁邊。如所示，外殼1010內的底板1011可分離各個腔室排氣口1070與各個化學排氣口1080。尤其，僅藉由在防濺擋板1050內部流動及/或藉由在流體收集器1060內部流動才得以到達化學排氣口1080。化學排氣口1080因此排出可能累積於防濺擋板及/或流體收集器區域中的氣體。 Chemical vent 1080 vents gas flowing through splash guard 1050 and chemical collector (cup) to a chemical vent (outlet), which may be formed along the sidewall of enclosure 1010 but is fluidly isolated from chamber vent 1070 . The chemical exhaust port 1080 may be located next to the chamber exhaust port 1070 . As shown, a floor 1011 within housing 1010 may separate each chamber exhaust port 1070 from each chemical exhaust port 1080 . In particular, chemical vent 1080 is only reached by flow inside splash guard 1050 and/or by flow inside fluid collector 1060 . The chemical vent 1080 thus vents gases that may accumulate in the splash guard and/or fluid collector area.

化學排氣口1080包括一獨立第二閥件V2，其係經配置以控制通過化學排氣口1080之流動。可使用任何數量的不同類型之閥作為第二閥件V2。例如，第二閥件V2可具有蝶閥或節流閥的形式。閥V1及V2可相同或相異。可替代地且如第23A及23B圖中所示，並未設置化學排氣口也未設置具有相對於防濺擋板徑向往外的環狀圈形式之迷路。在此實施例中，可調整防濺擋板的高度以節流來自防濺擋板之外部及具有收集杯之防濺擋板的內部通過排氣口。 The chemical vent 1080 includes an independent second valve member V2 configured to control flow through the chemical vent 1080 . Any number of different types of valves can be used as the second valve member V2. For example, the second valve member V2 may have the form of a butterfly valve or a throttle valve. Valves V1 and V2 can be the same or different. Alternatively and as shown in Figures 23A and 23B, no chemical vent is provided nor is there a labyrinth in the form of an annular ring radially outward relative to the splash guard. In this example, the The height of the splash guard is adjusted to throttle flow from the outside of the splash guard and the inside of the splash guard with the collection cup through the exhaust port.

第12A~12D圖顯示根據防濺擋板1050及流體收集器1060的各種位置之各種廢氣流動形態。第12A圖顯示在收回(下降)位置中之防濺擋板1050以及在下降位置中的外蓋1061及流體收集器1060。由表明流體流動之箭頭所示，流體(空氣)藉由流過收回的配送臂(參見第11圖：臂1、2、3、4)及防濺擋板1050至腔室排氣口1070而加以排放。由於收回收集器外蓋1061，連同所有的收集器1060，及防濺擋板1050，流體不會流入流體收集器1060中而至化學排氣口1080。第12B圖顯示在升起位置中的防濺擋板1050以及在收回(下降)位置中的外蓋1061及流體收集器1060。如所示，一部分的廢氣(空氣)流升經過防濺擋板1050而至腔室排氣口1070，而另一部份的廢氣則被引入防濺擋板1050與外蓋1061間的空間中，並從該處流至化學排氣口1080。第12C圖顯示在升起位置中的防濺擋板1050及收集器外蓋1061，而流體收集器1060則在下降位置中。一部分的廢氣(空氣)流升經過防濺擋板1050而至腔室排氣口1070，且另一部份的廢氣則被引入收集器外蓋1061與最上面的流體收集器1060之間的空間(第一收集室)中，並接著從該處流至化學排氣口1080。應理解到防濺擋板1050升起的程度會影響氣體流到化學排氣口1080的量。第12D圖顯示其中防濺擋板1050、收集器外蓋1061、及四個流體收集器1060中的三個在升起位置中的位置。只有代表最下面的流體收集器之第四流體收集器1060在收回(下降)位置中，藉此界定用於收集從旋轉晶圓驅離之流體的流體室。一部分的廢氣(空氣)流升經過防濺擋板1050而至腔室排氣口1070，且另一部份的廢氣則被引入第四收集室(界定於第三與第四流體收集器之間)中，並接著從該處流至化學排氣口1080。 12A-12D show various exhaust gas flow patterns according to various positions of splash guard 1050 and fluid collector 1060 . Figure 12A shows the splash guard 1050 in the retracted (lowered) position and the outer cover 1061 and fluid collector 1060 in the lowered position. As indicated by the arrows indicating fluid flow, the fluid (air) is released by flowing through the retracted dispensing arms (see FIG. be discharged. With the collector cover 1061 retracted, along with all collectors 1060 , and splash guard 1050 , fluid does not flow into fluid collector 1060 to chemical vent 1080 . Figure 12B shows splash guard 1050 in a raised position and outer cover 1061 and fluid collector 1060 in a retracted (lowered) position. As shown, a part of the exhaust gas (air) flows up through the splash guard 1050 to the chamber exhaust port 1070, while another part of the exhaust gas is introduced into the space between the splash guard 1050 and the outer cover 1061 , and from there to the chemical vent 1080. Figure 12C shows the splash guard 1050 and collector cover 1061 in a raised position with the fluid collector 1060 in a lowered position. A part of the exhaust gas (air) flows up through the splash guard 1050 to the chamber exhaust port 1070, and another part of the exhaust gas is introduced into the space between the collector cover 1061 and the uppermost fluid collector 1060 (first collection chamber), and then flow from there to the chemical exhaust port 1080. It will be appreciated that the degree to which the splash guard 1050 is raised affects the amount of gas flow to the chemical exhaust port 1080 . Figure 12D shows the position with splash guard 1050, collector cover 1061, and three of the four fluid collectors 1060 in the raised position. Only the fourth fluid collector 1060, representing the lowermost fluid collector, is in the retracted (descended) position, thereby defining a fluid chamber for collecting fluid expelled from the spinning wafer. A part of the exhaust gas (air) flows up through the splash guard 1050 to the chamber exhaust port 1070, and another part of the exhaust gas is introduced into the fourth collection chamber (defined between the third and fourth fluid collectors ), and then flow from there to chemical vent 1080.

如第12A~12D圖中所示，室可包括位在整個室內(包括在腔室排氣口1070及化學排氣口1080或其附近的位置)之複數個壓力傳感器(P)。壓力傳感器的量測值可用為監測內部氣流並控制閥件V1及V2之運作的製程之一部分。另外，來自壓力傳感器的反饋可用來控制過濾器風扇單元1020的速度。 As shown in Figures 12A-12D, the chamber may include a plurality of pressure sensors (P) located throughout the chamber, including at or near the chamber exhaust port 1070 and the chemical exhaust port 1080. The pressure sensor measurements can be used as part of the process to monitor the internal airflow and control the operation of valves V1 and V2. Additionally, feedback from the pressure sensor can be used to control the speed of the filter fan unit 1020 .

也應可了解透過這兩個排氣口1070及1080排放的氣體源可為經由過濾器風扇單元1020或可單純為室周圍的環境空氣(當沒有過濾器風扇單元1020而僅為下方的室)。請注意氣體源可為空氣或任何適當氣體，比如經過濾的空氣或氮氣或其他氣體。 It should also be appreciated that the source of gas exhausted through these two exhaust ports 1070 and 1080 could be through the filter fan unit 1020 or could simply be ambient air around the room (only the room below when there is no filter fan unit 1020) . Note that the gas source can be air or any suitable gas such as filtered air or nitrogen or other gases.

如上關於第1~10圖的實施例所討論，當馬達112旋轉位在旋轉卡盤110上之晶圓115時，配送臂120接著置中於晶圓115上方並配送製程中的第一流體。馬達112增加每分鐘轉速以將流體分散於晶圓表面上，多餘的流體22則被離心離甩到旋轉卡盤110的的外圍邊緣並到一個收集盤130之的下側上，重力使流體掉落到下方的收集盤中，並自該處流入出口中且最終流入歧管200中。流體自該處流入排水管210並到達一離散的槽(未圖示)以供儲存及再使用，並在下一次晶圓週期中自該處加以配送。雖第1~10圖中所示的實施例以令人滿意的方式執行，有時候，流體仍可能會濺出至間隔的收集盤之間。例如，在第3A圖中所示的收集盤位置中，流體可能在升起的收集盤與下方疊起的收集盤之間橫向行進並潑濺出收集盤的外圍邊緣。這不僅導致潛在凌亂的情況也導致流體浪費。 As discussed above with respect to the embodiments of FIGS. 1-10 , when the motor 112 rotates the wafer 115 on the spin chuck 110 , the dispensing arm 120 is then centered over the wafer 115 and dispenses the first fluid in process. The motor 112 increases RPM to disperse the fluid over the wafer surface. Excess fluid 22 is centrifuged to the peripheral edge of the spin chuck 110 and onto the underside of a collection tray 130 where gravity causes the fluid to fall. It falls into the collection pan below and from there flows into the outlet and eventually into the manifold 200 . From there, the fluid flows into drain 210 and to a discrete tank (not shown) for storage and reuse, and from where it is distributed during the next wafer cycle. Although the embodiments shown in Figures 1-10 perform satisfactorily, at times, fluid may still be splashed between the spaced collection pans. For example, in the collection pan position shown in Figure 3A, fluid may travel laterally between the raised collection pan and the stacked collection pan below and splash off the peripheral edge of the collection pan. This not only leads to a potentially messy situation but also to wasted fluid.

第13A、13B、14A、及14B圖提供上述缺點的一個解決方法。第13A圖顯示複數個堆疊的流體收集器(收集盤或杯)的上視圖，並顯示排水特徵。在第1~10圖中所示的實施例中，排水管道的形式為各收集盤具有自收集盤的凸緣區之間的主要區徑向往外延伸出口(流出槽)。在第13A及 13B圖中所示的實施例中，每一個收集盤的排水管道(排水導管)以切線方式延伸而非如第1~10圖中所示般徑向方式延伸。收集盤的排水管道(排水導管)仍可在堆疊關係中；然而，如所示般各沿著收集盤的主要區之圓周弧形延伸。另外不像第1~10圖中所示的實施例，每一個排水導管由外邊緣(E2)界定，該外邊緣的高度與收集盤的主要區之外邊緣(E1)的高度相同。此關係確保從收集盤到排水導管的流體不會濺出。 Figures 13A, 13B, 14A, and 14B provide a solution to the above disadvantages. Figure 13A shows a top view of a plurality of stacked fluid collectors (collection trays or cups) showing the drainage features. In the embodiments shown in Figures 1-10, the drainage conduits are in the form of each collecting pan having an outlet (outflow slot) extending radially outward from the main area between the flange areas of the collecting pan. In 13A and In the embodiment shown in FIG. 13B, the drain pipe (drain conduit) of each collecting tray extends tangentially rather than radially as shown in FIGS. 1-10. The drainage channels (drain conduits) of the collection pans may still be in stacked relationship; however, each arc along the circumference of the main area of the collection pan as shown. Also unlike the embodiments shown in Figures 1-10, each drain duct is bounded by an outer edge (E2) having the same height as the outer edge (E1) of the main area of the collecting pan. This relationship ensures that fluid does not spill from the catch pan to the drain conduit.

第11、12A、及12B圖概略顯示可任何數量的不同形式之流體收集器1060，包括有關第1~10圖所討論的收集盤。另外，流體收集器1060可具有如第14A~20圖中所示的流體收集器(收集盤或杯)的形式，容後敘述。 Figures 11, 12A, and 12B schematically show fluid collector 1060 in any number of different forms, including the collection trays discussed with respect to Figures 1-10. In addition, the fluid collector 1060 can be in the form of a fluid collector (collection tray or cup) as shown in FIGS. 14A-20 , which will be described later.

第14A及14B圖繪示半導體晶圓處理室(如晶圓處理室1000(第11圖))之一局部化部分。如所示，可看見卡盤1040的外圍邊緣。此實施例的收集室設備包括收集盤配置或裝配400以及其中設置收集盤配置400之外收集盤外殼450。收集盤外殼450為圓周式圍繞卡盤1040之中空部。如所示，收集盤外殼450可包括內分隔壁452，其將收集盤外殼450之中空內部空間隔成第一隔間460和自第一隔間460徑向往外設置之第二隔間470(第一隔間460因此位在卡盤1040的外圍邊緣旁，而第二隔間470則自其徑向間隔)。應可理解到收集盤外殼450因而具有環形且第一及第二隔間460及470皆具有環形。 14A and 14B illustrate a localized portion of a semiconductor wafer processing chamber, such as wafer processing chamber 1000 (FIG. 11 ). As shown, the peripheral edge of the chuck 1040 can be seen. The collection chamber apparatus of this embodiment includes a collection tray arrangement or assembly 400 and a collection tray housing 450 in which the collection tray arrangement 400 is disposed. The collecting tray housing 450 surrounds the hollow portion of the chuck 1040 in a circumferential manner. As shown, the collection tray housing 450 can include an inner divider wall 452 that divides the hollow interior of the collection tray housing 450 into a first compartment 460 and a second compartment 470 disposed radially outward from the first compartment 460 ( The first compartment 460 is thus located beside the peripheral edge of the chuck 1040, while the second compartment 470 is spaced radially therefrom). It should be appreciated that the collection tray housing 450 thus has an annular shape and that both the first and second compartments 460 and 470 have an annular shape.

第一隔間460係經配置成以一種方式支撐收集盤配置400，如下所述，而得以移動(亦即升起或降下)各收集盤。雖第一隔間460顯示成具有比第二隔間470更大的面積，這僅為一示範實施例，且應可了解這兩個隔間460及470的形狀和相對大小不限於圖中所示。如所示，由在晶圓115之外緣附近並止於頂緣463的內壁462界定第一隔間460。分隔壁452的高度小於內壁462的高度，因此頂緣454低於頂緣463。頂緣454及463可如所示般為斜面或可為平面。底壁457界定隔間的底部，因此作為底板。 The first compartment 460 is configured to support the collection pan arrangement 400 in a manner, as described below, to enable movement (ie, raising or lowering) of each collection pan. Although the first compartment 460 is shown to have a larger area than the second compartment 470, this is only an exemplary embodiment, and it should be understood that the shapes and relative sizes of the two compartments 460 and 470 are not limited to those shown in the figures. Show. As shown, the first compartment 460 is bounded by an inner wall 462 near the outer edge of the wafer 115 and terminating at a top edge 463 . The height of the partition wall 452 is small At the height of the inner wall 462 , the top edge 454 is lower than the top edge 463 . Top edges 454 and 463 may be beveled as shown or may be flat. The bottom wall 457 defines the bottom of the compartment, thus acting as a floor.

由外壁472及分隔壁452界定第二隔間470，並由底壁457界定第二隔間470的底部。外壁472與分隔壁452平行。亦由頂壁部476界定第二隔間470，該頂壁部具有朝第一隔間460延伸的第一腳以及介於外壁472與分隔壁452間與之平行的第二腳。頂壁部476組態並定位成界定第一開口或第一通道480及第二開口或第二通道490。第一開口480界定在頂壁部476的第一腳與分隔壁452的頂緣454之間，因此界定出從第一隔間460到第二隔間470的一條流動路徑。 The second compartment 470 is defined by the outer wall 472 and the partition wall 452 , and the bottom of the second compartment 470 is defined by the bottom wall 457 . The outer wall 472 is parallel to the partition wall 452 . The second compartment 470 is also defined by a top wall portion 476 having a first leg extending toward the first compartment 460 and a second leg parallel thereto between the outer wall 472 and the partition wall 452 . Top wall portion 476 is configured and positioned to define a first opening or channel 480 and a second opening or channel 490 . The first opening 480 is defined between the first foot of the top wall portion 476 and the top edge 454 of the divider wall 452 , thereby defining a flow path from the first compartment 460 to the second compartment 470 .

第二開口490界定在頂壁部476的第二腳與外壁472之間並界定自第二隔間470之出口或離開口。 A second opening 490 is defined between the second foot of the top wall portion 476 and the outer wall 472 and defines an exit or exit opening from the second compartment 470 .

收集盤配置400與有關第1~10圖所述者類似，其中配置400由複數個堆疊的收集盤(收集杯)界定，這些收集盤建構成允許彼此嵌套。詳言之，收集盤的各者係經配置以可在第一隔間460內加以控制並獨立地升起或降下。收集盤不僅用來收集於晶圓處理期間徑向推離出晶圓115的流體，還導送流體到出口以促成流體之收集。 The collection tray configuration 400 is similar to that described with respect to FIGS. 1-10 in that the configuration 400 is defined by a plurality of stacked collection trays (cups) constructed to allow nesting within each other. In particular, each of the collection trays is configured to be controllable within the first compartment 460 and to be raised or lowered independently. The collection tray not only serves to collect fluid that is pushed radially off the wafer 115 during wafer processing, but also directs the fluid to the outlet to facilitate collection of the fluid.

在所示的實施例中，其本質上為示範性，有四個不同的收集盤，亦即，以堆疊型態配置的第一收集盤410、第二收集盤420、第三收集盤430、及第四收集盤440。然而，應可了解到在設備中可使用少於或多於四個的收集盤。應可理解到增加一個收集盤會相應地增加一個用於收集流體之分別的收集室。從下列討論及附圖可輕易了解此態樣。 In the illustrated embodiment, which is exemplary in nature, there are four different collection trays, namely, a first collection tray 410, a second collection tray 420, a third collection tray 430, And the fourth collection tray 440. However, it should be appreciated that fewer or more than four collection trays may be used in the apparatus. It will be appreciated that adding a collection pan will correspondingly add a separate collection chamber for collecting fluid. This aspect can be easily understood from the following discussion and accompanying drawings.

收集盤410、420、430、及440可具有與圖中所示相同或類似的基本設計。在所示的實施例中，第一收集盤410為大致環形，並具有用於收容旋轉卡盤110和晶圓115的中央開口。第一收集盤410具有界定一環形收集軌道之主要區，該軌道係由內壁部413及外壁部414界定，該兩壁部彼此相交而界定一槽415。如第14A及14B圖中所示，第一收集盤410的主收集部大致呈V形。 The collection trays 410, 420, 430, and 440 may have the same or similar basic design as shown in the figures. In the illustrated embodiment, the first collection tray 410 is generally annular and has a central opening for receiving the spin chuck 110 and the wafer 115 . The first collection tray 410 has a ring that defines a collection The main area of the collection track is defined by an inner wall portion 413 and an outer wall portion 414 that intersect each other to define a groove 415 . As shown in FIGS. 14A and 14B , the main collecting portion of the first collecting tray 410 is roughly V-shaped.

如圖中所標示，槽415的底部由點A界定，且內壁部413之內頂緣由點B界定，且外壁部414之外頂緣由點C界定。點A因此代表第一收集盤410的最低點。點A、B、及C之間的關係為此實施例的一個重要態樣。如所見，內壁部413可具有比外壁部414更大的尺寸，詳言之，內壁部413可具有比外壁部414更大的寬度，且更重要地，內壁部413可具有比外壁部414更大的高度。 The bottom of the groove 415 is bounded by point A, the inner top edge of the inner wall portion 413 is bounded by point B, and the outer top edge of the outer wall portion 414 is bounded by point C, as indicated in the figure. Point A thus represents the lowest point of the first collection pan 410 . The relationship between points A, B, and C is an important aspect of this embodiment. As seen, the inner wall portion 413 may have a larger size than the outer wall portion 414, in detail, the inner wall portion 413 may have a larger width than the outer wall portion 414, and more importantly, the inner wall portion 413 may have a larger width than the outer wall portion 414. Section 414 is greater in height.

如圖中所示，收集蓋405覆蓋第一收集盤410的環形凹陷流體收集軌道(其界定在內壁部413與外壁部414間)。收集蓋405因此具有向下延伸的凸部，設置在第一收集盤410的這個環形凹陷流體收集軌道內。收集蓋405因此有效覆蓋槽415並防止任何流體流入槽415中。雖收集蓋405與第一收集盤410之間在一外徑向位置中可有空間，可見到沿著最接近晶圓的最內部的邊緣，收集蓋405與第一收集盤410之間是沒有空間的，因此防止從晶圓115排出的流體流進到它們之間。 As shown in the figure, the collecting cover 405 covers the annular concave fluid collecting track (defined between the inner wall portion 413 and the outer wall portion 414 ) of the first collecting tray 410 . The collecting cap 405 thus has a downwardly extending protrusion, which is arranged within this annular recessed fluid collecting track of the first collecting pan 410 . Collection cap 405 thus effectively covers groove 415 and prevents any fluid from flowing into groove 415 . While there may be space between the collection cover 405 and the first collection tray 410 in an outer radial position, it can be seen that along the innermost edge closest to the wafer, there is no space between the collection cover 405 and the first collection tray 410. Spatial, thus preventing the fluid drained from the wafer 115 from flowing between them.

如圖中所示，第一收集盤包括一喉部，其具有懸垂部的形式，可在收集盤閉合時密封收集器(杯)，藉此防止液體進入收集室(杯)中。如所示，喉部向下傾斜並具有一尖端部，座抵下方收集杯的內緣。應可了解到其他收集盤具有類似的喉部，雖並未以參考字符特別標示。 As shown in the figure, the first collection tray includes a throat in the form of an overhang that seals the collector (cup) when the collection tray is closed, thereby preventing liquid from entering the collection chamber (cup). As shown, the throat slopes downward and has a pointed portion that seats against the inner rim of the lower collection cup. It should be appreciated that other collection pans have similar throats, although not specifically identified with reference characters.

如同各收集盤，可相較於收集盤獨立移動收集蓋405。 As with each collection tray, the collection cover 405 is independently movable relative to the collection tray.

也應可理解到，在流體收集室界定於升起的收集蓋405與降下的第一收集盤410之間的情況中，收集蓋405的底點亦等同於為點A。相關的點B及C為第一收集盤410的一部分。 It should also be understood that the bottom point of the collection cover 405 is also equivalent to point A in the case where the fluid collection chamber is defined between the raised collection cover 405 and the lowered first collection tray 410 . Relevant points B and C are part of the first collection tray 410 .

雖未於第14A及14B圖的剖面圖中顯示，第一收集盤410可具有一對往外延伸的凸緣區，與收集盤130之往外延伸的該對凸緣區133(第10圖)類似。凸緣區較佳相對設置(如相隔180度)並具有形成於其中之複數個開口(如開口134)。開口沿著凸緣區在其側壁之間間隔設置。在一所示實施例中，有接收工作活塞(如氣動(空氣)缸之端部)之三個開口，如參考第1~10圖之實施例所述般。 Although not shown in the cross-sectional view of FIGS. 14A and 14B, the first collection pan 410 may have a pair of outwardly extending flange areas similar to the pair of outwardly extending flange areas 133 of the collection pan 130 (FIG. 10). . The flange regions are preferably oppositely disposed (eg, 180 degrees apart) and have a plurality of openings (eg, opening 134 ) formed therein. Openings are spaced along the flange region between its sidewalls. In one illustrated embodiment, there are three openings for receiving working pistons, such as the ends of pneumatic (air) cylinders, as described with reference to the embodiment of FIGS. 1-10.

在每一個凸緣區中還形成一額外的開口。這些開口的配置可與第1~10圖之開口134及135的配置相同或類似。 An additional opening is also formed in each flange area. The configuration of these openings may be the same as or similar to the configuration of the openings 134 and 135 in FIGS. 1-10 .

收集盤140包括形成在其之一位置的出口(排水導管)，尤其，出口可與收集盤130的出口136類似。如此，出口與槽415流體連通。出口可具有流出槽或排水導管的形式，如上述，沿著收集盤的圓周長度以切線方式延伸，如第13圖所示。出口位在收集盤的一低點，使收集盤的槽部415中的流體流到出口。 The collecting pan 140 includes an outlet (drain conduit) formed at one of its positions, and particularly, the outlet may be similar to the outlet 136 of the collecting pan 130 . As such, the outlet is in fluid communication with the slot 415 . The outlet may be in the form of an outflow trough or a drain conduit, as described above, extending tangentially along the circumferential length of the collecting pan, as shown in FIG. 13 . The outlet is located at a low point of the collecting pan, allowing the fluid in the groove 415 of the collecting pan to flow to the outlet.

出口(排水導管)可提供另一槽，收集到的流體可沿此流動。如第1~10圖的實施例中般，各收集盤的出口可與歧管結構流體連通，如第1~10圖之歧管結構200，以將收集到的流體導離卡盤。 An outlet (drain conduit) may provide another channel along which collected fluid may flow. As in the embodiment of FIGS. 1-10, the outlet of each collection tray may be in fluid communication with a manifold structure, such as manifold structure 200 of FIGS. 1-10, to direct collected fluid away from the chuck.

第二收集盤420與第一收集盤410類似且大致為環形，並具有用於收容旋轉卡盤110和晶圓115的中央開口。第二收集盤420具有界定一環形收集軌道之主要區，該軌道係由內壁部423及外壁部424界定，該兩壁部彼此相交而界定一槽425。如第14A及14B圖中所示，第二收集盤420的主收集部大致呈V形，且具有與第一收集盤410互補的形狀以允許與其嵌套。 The second collection tray 420 is similar to the first collection tray 410 and has a substantially ring shape, and has a central opening for receiving the spin chuck 110 and the wafer 115 . The second collecting pan 420 has a main area defining an annular collecting track, which is defined by an inner wall portion 423 and an outer wall portion 424 which meet each other to define a slot 425 . As shown in Figures 14A and 14B, the main collection portion of the second collection pan 420 is generally V-shaped and has a complementary shape to the first collection pan 410 to allow nesting therewith.

如圖中所標示，槽425的底部由點A界定，且內壁部423之內頂緣427由點B界定，且外壁部424之外頂緣428由點C界定。點A因此代表第二收集盤420的最低點。點A、B、及C之間的關係為此實施例的一個重要態樣。如所見，內壁部423可具有比外壁部424更大的尺寸，詳言之，內壁部423可具有比外壁部424更大的寬度，且更重要地，內壁部423可具有比外壁部424更大的高度。 The bottom of the slot 425 is bounded by point A, the inner top edge 427 of the inner wall portion 423 is bounded by point B, and the outer top edge 428 of the outer wall portion 424 is bounded by point C, as indicated in the figure. Point A thus represents the lowest point of the second collection pan 420 . The relationship between points A, B, and C is an important aspect of this embodiment Sample. As can be seen, the inner wall portion 423 may have a larger size than the outer wall portion 424, in detail, the inner wall portion 423 may have a larger width than the outer wall portion 424, and more importantly, the inner wall portion 423 may have a larger width than the outer wall portion 424. Section 424 is greater in height.

就像第一收集盤410一樣，第二收集盤420可具有相同往外延伸的凸緣區，以允許第二收集盤420之受控的升起與下降。第二收集盤420也如同第一收集盤410般具有出口以允許排出收集到的流體。 Like the first collection pan 410 , the second collection pan 420 may have the same outwardly extending flange area to allow controlled raising and lowering of the second collection pan 420 . The second collection pan 420 also has an outlet like the first collection pan 410 to allow the collected fluid to drain.

如所示，第二收集盤420位在第一收集盤410正下方。 As shown, the second collection pan 420 is located directly below the first collection pan 410 .

第三收集盤430與第二收集盤420相同或類似且大致為環形，並具有用於收容旋轉卡盤110和晶圓115的中央開口。第三收集盤430具有界定一環形收集軌道之主要區，該軌道係由內壁部433及外壁部434界定，該兩壁部彼此相交而界定一槽435。如第14A及14B圖中所示，第三收集盤430的主收集部大致呈V形，且具有與第二收集盤420互補的形狀以允許與其嵌套。 The third collecting tray 430 is the same or similar to the second collecting tray 420 and has a substantially ring shape, and has a central opening for receiving the spin chuck 110 and the wafer 115 . The third collecting pan 430 has a main area defining an annular collecting track defined by an inner wall portion 433 and an outer wall portion 434 which intersect each other to define a slot 435 . As shown in Figures 14A and 14B, the main collection portion of the third collection pan 430 is generally V-shaped and has a complementary shape to the second collection pan 420 to allow nesting therewith.

如圖中所標示，槽435的底部由點A界定，且內壁部433之內頂緣由點B界定，且外壁部434之外頂緣由點C界定。點A因此代表第三收集盤430的最低點。點A、B、及C之間的關係為此實施例的一個重要態樣。如所見，內壁部433可具有比外壁部434更大的尺寸，詳言之，內壁部433可具有比外壁部434更大的寬度，且更重要地，內壁部433可具有比外壁部434更大的高度。 As indicated in the figure, the bottom of the groove 435 is bounded by point A, and the inner top edge of the inner wall portion 433 is bounded by point B, and the outer top edge of the outer wall portion 434 is bounded by point C. Point A thus represents the lowest point of the third collection pan 430 . The relationship between points A, B, and C is an important aspect of this embodiment. As can be seen, the inner wall portion 433 may have a larger size than the outer wall portion 434, in detail, the inner wall portion 433 may have a larger width than the outer wall portion 434, and more importantly, the inner wall portion 433 may have a larger width than the outer wall portion 434. Section 434 is greater in height.

就像其他收集盤一樣，第三收集盤430可具有相同往外延伸的凸緣區，以允許第三收集盤430之受控的升起與下降。第三收集盤430也如同其他收集盤般具有出口以排出收集到的流體。第三收集盤430位在第二收集盤420正下方。 Like the other catch pans, the third catch pan 430 may have the same outwardly extending flange area to allow controlled raising and lowering of the third catch pan 430 . The third collection tray 430 also has an outlet like the other collection trays to drain the collected fluid. The third collecting tray 430 is directly below the second collecting tray 420 .

第四收集盤440與第二及第三收集盤420及430類似且大致為環形，並具有用於收容旋轉卡盤110和晶圓115的中央開口。第四收集盤440具有界定一環形收集軌道之主要區，該軌道係由內壁部443及外壁部444界定，該兩壁部彼此相交而界定一槽445。如第14A及14B圖中所示，第四收集盤440的主收集部大致呈V形，且具有與第三收集盤430互補的形狀以允許與其嵌套。 The fourth collection tray 440 is similar to the second and third collection trays 420 and 430 and is approximately It is ring-shaped and has a central opening for accommodating the spin chuck 110 and the wafer 115 . The fourth collecting pan 440 has a main area defining an annular collecting track defined by an inner wall portion 443 and an outer wall portion 444 which intersect each other to define a slot 445 . As shown in Figures 14A and 14B, the main collection portion of the fourth collection pan 440 is generally V-shaped and has a complementary shape to the third collection pan 430 to allow nesting therewith.

如圖中所標示，槽445的底部由點A界定，且內壁部443之內頂緣由點B界定，且外壁部444之外頂緣由點C界定。點A因此代表第四收集盤440的最低點。點A、B、及C之間的關係為此實施例的一個重要態樣。如所見，內壁部443可具有比外壁部444更大的尺寸，詳言之，內壁部443可具有比外壁部444更大的寬度，且更重要地，內壁部443可具有比外壁部444更大的高度。 The bottom of the groove 445 is bounded by point A, the inner top edge of the inner wall portion 443 is bounded by point B, and the outer top edge of the outer wall portion 444 is bounded by point C, as indicated in the figure. Point A thus represents the lowest point of the fourth collection pan 440 . The relationship between points A, B, and C is an important aspect of this embodiment. As can be seen, the inner wall portion 443 may have a larger size than the outer wall portion 444, in detail, the inner wall portion 443 may have a larger width than the outer wall portion 444, and more importantly, the inner wall portion 443 may have a larger width than the outer wall portion 444. Section 444 is greater in height.

就像其他收集盤一樣，第四收集盤440可具有相同往外延伸的凸緣區，以允許第四收集盤440之受控的升起與下降。第四收集盤440也如同其他收集盤般具有出口以排出收集到的流體。 Like the other collection pans, the fourth collection pan 440 may have the same outwardly extending flange area to allow controlled raising and lowering of the fourth collection pan 440 . The fourth collection tray 440 also has an outlet like the other collection trays to drain the collected fluid.

如同第1~10圖的實施例般，第一、第二、第三、及第四收集盤410、420、430、及440界定數個離散的收集室，可於其中捕捉並收集在晶圓旋轉期間脫離之流體，藉此避免流體的飛濺。 As in the embodiment of FIGS. 1-10, the first, second, third, and fourth collection trays 410, 420, 430, and 440 define discrete collection chambers in which wafers can be captured and collected. Fluid breaks away during rotation, thereby avoiding splashing of fluid.

第14A圖顯示界定在升起的外蓋405/第一收集盤410與降下的第二、第三、及第四收集盤420、430、及440之間的第一收集室401。也應可了解到第一收集室可事實上設置在升起的外蓋405與降下的第一收集盤410之間；然而，僅為了討論，將第一收集室敘述成形成於第一收集盤410與第二收集盤420之間。 FIG. 14A shows the first collection chamber 401 defined between the raised outer cover 405 /first collection pan 410 and the lowered second, third, and fourth collection pans 420 , 430 , and 440 . It should also be appreciated that the first collection chamber may in fact be disposed between the raised outer cover 405 and the lowered first collection pan 410; however, for purposes of discussion only, the first collection chamber will be described as being formed on the first collection pan 410 and the second collection tray 420.

可從第14A圖中見到，當外蓋405及第一收集盤上升到升起位置時，外壁部414設置在頂壁部476的第一腳附近，藉此界定第一通道 480，使第一收集室與第二隔間470流體連通。第二通道490可充當排氣導管，其中吸引廢氣(氣體，如空氣)通過第一收集室(通過收集盤界定的空間)通過第一通道480至第二隔間470，並接著經由第二通道490離開，從該處廢氣可被導送至化學排氣口1080(第11圖)。故可牽引空氣通過收集盤(收集杯)作為通風處理的一部分。同時，腔室排氣口1070(第11圖)可設置成把氣排到收集室外面。 As can be seen from Figure 14A, when the outer cover 405 and the first collection tray are raised to the raised position, the outer wall portion 414 is disposed near the first foot of the top wall portion 476, thereby defining the first channel 480. Putting the first collection chamber in fluid communication with the second compartment 470. The second channel 490 may act as an exhaust conduit in which exhaust gas (gas, such as air) is drawn through the first collection chamber (the space bounded by the collection pan) through the first channel 480 to the second compartment 470 and then through the second channel 490 exits from where the exhaust may be directed to chemical exhaust 1080 (FIG. 11). Air can therefore be drawn through the collection pan (collection cup) as part of the ventilation process. Also, a chamber vent 1070 (FIG. 11) may be provided to vent gas outside the collection chamber.

應可了解到第一收集室401透過與第二收集盤420的槽425連同之排水渠(出口)排水。第13圖顯示一示範排水導管。 It should be appreciated that the first collection chamber 401 is drained through the drain (outlet) in conjunction with the groove 425 of the second collection pan 420 . Figure 13 shows an exemplary drain conduit.

根據本發明，升起的第一收集盤410之槽415的底部(點A)的位置低於第二收集盤420的點B(內壁部423的內頂緣)且點A較佳與點C(外壁部424的頂邊緣)相同高度或低於其。發明人發現上述點(區域)A、B、C之關係去除或大幅減少潑濺到第一收集室401外的任何噴霧。此配置針對收集盤之其他位置也成立，其中升起的收集盤之點A低於正下方的降下收集盤的點B且升起的收集盤之點A具有與點C相等或較小的高度。 According to the present invention, the position of the bottom (point A) of the groove 415 of the first collecting tray 410 raised is lower than the point B (inner top edge of the inner wall portion 423) of the second collecting tray 420 and point A is preferably the same as point A. C (the top edge of the outer wall portion 424) is at the same height or lower. The inventors have found that the above relationship of points (areas) A, B, C removes or substantially reduces any spray splashing outside the first collection chamber 401 . This configuration is also true for other positions of the catch pan where point A of the raised catch pan is lower than point B of the lowered catch pan directly below and point A of the raised catch pan has an equal or smaller height to point C .

如先前第1~10圖的實施例般，將第二收集盤420上升到接觸升起的第一收集盤410同時第三及第四收集盤430及440在降下位置中界定出用以收集從晶圓排出的流體(如與用於第一收集室不同的流體(化學物質))之第二收集室。將第三收集盤430上升到接觸升起的第二收集盤420同時第四收集盤440在降下位置中界定出用以收集從晶圓排出的流體(如與用於第一及第二收集室不同的流體(化學物質))之第三收集室。 As in the previous embodiments of FIGS. 1-10 , the second collection tray 420 is raised to contact the raised first collection tray 410 while the third and fourth collection trays 430 and 440 are in the lowered position to define a trap for collecting the A second collection chamber for wafer exhaust fluid (eg, a different fluid (chemical) than that used in the first collection chamber). Raising the third collection pan 430 into contact with the raised second collection pan 420 while the fourth collection pan 440 in the lowered position defines a fluid for collecting fluid drained from the wafer (as used for the first and second collection chambers). A third collection chamber for different fluids (chemicals).

應可了解到可使用用以升起及降下收集盤410、420、430、440的任何數量的不同手段，包括使用控制地升起構造上與活塞300類似的不同導件之步進馬達，以允許每一個導件之受控獨立的升起及降下。另外，有關第1~10圖所討論的氣動活塞配置可同樣用來升起及降下每一個收集盤 (藉由接合盤的凸緣部)以界定各個收集室。 It should be appreciated that any number of different means for raising and lowering the collection trays 410, 420, 430, 440 may be used, including the use of stepper motors that controllably raise different guides similar in construction to the piston 300, to Allows controlled independent raising and lowering of each guide. Alternatively, the pneumatic piston arrangement discussed with respect to Figures 1-10 can also be used to raise and lower each collection pan (by engaging the flange portion of the disc) to define each collection chamber.

當創造第二及第三收集室兩者時，廢氣(氣流)被允許流經(通過)個別的收集室，經過第一通道480至第二隔間470，然後經由第二通道490離開。 When both the second and third collection chambers are created, exhaust gas (air flow) is allowed to flow through (through) the respective collection chamber, through the first channel 480 to the second compartment 470 , and then exit through the second channel 490 .

另外，亦可與第14A及14B圖的收集盤配置一起使用移動防濺擋板。防濺擋板可相對收集盤配置降下及升高。 Additionally, a movable splash guard may also be used with the collection pan configuration of Figures 14A and 14B. The splash guard can be lowered and raised relative to the collection pan configuration.

第14B圖顯示外蓋405及所有四個收集盤410、420、430、440都在降下位置中。廢氣(空氣氣體)可流經收集盤外殼450的頂部，經過第一通道480至第二隔間470，然後經由第二通道490離開至化學排氣口1080(第11圖)。 Figure 14B shows the outer cover 405 and all four collection trays 410, 420, 430, 440 in the lowered position. Exhaust gas (air gas) may flow through the top of the collection pan housing 450, through the first channel 480 to the second compartment 470, and then exit through the second channel 490 to the chemical exhaust port 1080 (FIG. 11).

茲參照第14A~14B及20圖，其中繪示本發明的另一態樣。第20圖顯示一收集盤(410、420、430、440)的概略示意圖(上視圖)。收集盤包括互相間隔之第一及第二排水渠D1及D2(如D1及D2間隔180度)。如上所述，排水渠D1及D2與形成在收集盤中的槽流體連通以排出收集到的流體。如前述，收集盤具有環形且在兩個排水渠D1及D2之間有第一環形區以及在兩個排水渠D1及D2之間有相對的第二環形區。第一及第二環形區各建構成具有變化的曲率半徑，詳言之，內壁部與外壁部之間的角度沿著環形區在朝排水渠D1及D2之一的方向中變化。例如，最大半徑(R1)可位在排水渠D1及D2之間(如與排水渠D1及D2等距離)而減少的半徑(R2)位在最大半徑(R1)的區域與一排水渠D1及D2之間。藉由在各排水渠D1及D2旁提供減少半徑(R2)的區域，流體會從最大半徑(R1)的區域自然地流至排水渠D1及D2(歸因於收集盤坡度的改變一其漏斗式引導流體至排水渠D1及D2)。此構造因此確保流體在收集室的槽內流動至排水渠D1及D2。然而，應可理解到不需變化的半徑，其中橫截面可維持相同並僅需改變標高來驅使流體至排水渠。並且，這也可以單一排水渠以及杯槽相對側之較高的標高來達成，促使流體受重力驅使至排水渠。舉例來說，若第11圖的收集杯之槽/基部的半徑從大變小的話，則會造成標高的變化。相反地，若第22A~B圖的收集杯之槽/基部的半徑從大變小的話，則不會造成標高的變化，因為底板標高並未改變，在此情況中，需將底板加工成從較厚到排水渠處較薄，以將液體從杯子的相對側引導至排水渠。 Reference is now made to Figures 14A-14B and Figure 20, which illustrate another aspect of the present invention. Figure 20 shows a schematic diagram (top view) of a collection tray (410, 420, 430, 440). The collecting tray includes first and second drains D1 and D2 spaced apart from each other (for example, D1 and D2 are separated by 180 degrees). As mentioned above, drains D1 and D2 are in fluid communication with grooves formed in the collection pan to drain collected fluid. As before, the collecting pan has an annular shape with a first annular area between the two drains D1 and D2 and an opposite second annular area between the two drains D1 and D2. The first and second annular regions are each constructed with a varying radius of curvature, in particular the angle between the inner wall portion and the outer wall portion varies along the annular region in the direction towards one of the drains D1 and D2. For example, the largest radius (R1) can be located between (eg, equidistant from) drains D1 and D2 and the reduced radius (R2) is located in the area of largest radius (R1) in relation to a drain D1 and Between D2. By providing an area of reduced radius (R2) next to each drain D1 and D2, fluid will flow naturally from the area of maximum radius (R1) to drains D1 and D2 (due to the change in slope of the collection pan - its funnel direct the fluid to drains D1 and D2). This configuration thus ensures fluid flow within the grooves of the collection chamber to the drains D1 and D2. However, it should be understood that no changing radius is required, where the cross-section can remain the same and only the elevation needs to be changed to drive fluid to drain. Also, this can be achieved with a single drain and a higher elevation on the opposite side of the cup trough, causing the fluid to be gravity driven to the drain. For example, if the radius of the groove/base of the collection cup in Fig. 11 is changed from large to small, it will cause a change in elevation. Conversely, if the radius of the groove/base of the collection cup in Fig. 22A~B is changed from larger to smaller, there will be no change in elevation, because the elevation of the bottom plate has not changed. In this case, the bottom plate needs to be machined from Thicker to the drain and thinner to direct liquid from the opposite side of the cup to the drain.

亦可了解到雖第20圖顯示一對排水渠D1及D2，可有單一排水渠D1，在此情況中，與單一排水渠D1正對面之收集盤的區域代表槽區之高點，且接近排水渠D1之區域代表低點，以使流體朝排水渠D1流動並至其。在收集盤中可形成超過兩個排水渠。 It will also be appreciated that although Figure 20 shows a pair of drains D1 and D2, there may be a single drain D1, in which case the area of the collection pan directly opposite the single drain D1 represents the high point of the tank area and is close to The area of drain D1 represents a low point for fluid to flow towards and to drain D1. More than two drains may be formed in the collection pan.

第15圖繪示與先前類似的另一種收集盤設備之局部化部分，因此並未敘述及繪示所有構件。如所示，可見到卡盤110的外圍邊緣。此實施例的收集室設備包括收集盤配置或裝配500及其中設置收集盤配置500的外收集盤外殼501。可移動式防濺擋板503設置在外殼501內並可以垂直方向從升起位置移動至降下位置(其顯示在第15圖中)。 Figure 15 shows a localized portion of another collection tray apparatus similar to the previous one, so not all components are described and shown. As shown, the peripheral edge of the chuck 110 is visible. The collection chamber apparatus of this embodiment comprises a collection tray arrangement or assembly 500 and an outer collection tray housing 501 in which the collection tray arrangement 500 is disposed. A movable splash guard 503 is disposed within the housing 501 and is vertically movable from a raised position to a lowered position (shown in Figure 15).

在所示的實施例中，其本質上為示範性，有四個不同的收集盤，亦即，以堆疊型態配置的第一收集盤510、第二收集盤520、第三收集盤530、及第四收集盤540。然而，應可了解到在設備中可使用少於或多於四個的收集盤。應可理解到增加一個收集盤會相應地增加一個用於收集流體之分別的收集室。從下列討論及附圖可輕易了解此態樣。 In the illustrated embodiment, which is exemplary in nature, there are four different collection trays, namely, a first collection tray 510, a second collection tray 520, a third collection tray 530, And the fourth collection tray 540. However, it should be appreciated that fewer or more than four collection trays may be used in the apparatus. It will be appreciated that adding a collection pan will correspondingly add a separate collection chamber for collecting fluid. This aspect can be easily understood from the following discussion and accompanying drawings.

收集盤510、520、530、及540可具有與圖中所示相同或類似的基本設計。在所示的實施例中，收集盤510、520、530、及540的各者為大致環形，並具有用於收容旋轉卡盤110和晶圓115的中央開口。每一個收集盤具有界定一環形收集軌道之主要區，該軌道係由內壁部550及外壁部 560界定，該兩壁部彼此相交而界定一槽555。如第15圖中所示，收集盤的主收集部大致呈V形。 Collection trays 510, 520, 530, and 540 may have the same or similar basic design as shown in the figures. In the illustrated embodiment, each of the collection trays 510 , 520 , 530 , and 540 is generally ring-shaped and has a central opening for receiving the spin chuck 110 and the wafer 115 . Each collection tray has a main area defining an annular collection track defined by an inner wall portion 550 and an outer wall portion 560 , the two wall portions intersect each other to define a groove 555 . As shown in Figure 15, the main collection portion of the collection tray is generally V-shaped.

如圖中所標示，槽555的底部由點A界定，且內壁部550之內頂緣551由點B界定，且外壁部560之外頂緣561由點C界定。點A因此代表給定收集盤的最低點。點A、B、及C之間的關係為此實施例的一個重要態樣。 The bottom of the groove 555 is bounded by point A, the inner top edge 551 of the inner wall portion 550 is bounded by point B, and the outer top edge 561 of the outer wall portion 560 is bounded by point C, as indicated in the figure. Point A thus represents the lowest point of a given collection pan. The relationship between points A, B, and C is an important aspect of this embodiment.

如圖中所示，第一收集盤510亦包括外蓋部515，其覆蓋界定在內壁部550與外壁部560之間的環形凹陷流體收集軌道。外蓋部515因此具有向下延伸的凸部，設置在第一收集盤510的這個環形凹陷流體收集軌道內。外蓋部515因此有效覆蓋槽555並防止任何流體流入槽555中。 As shown in the figure, the first collection tray 510 also includes an outer cover portion 515 covering the annular recessed fluid collection track defined between the inner wall portion 550 and the outer wall portion 560 . The outer cover part 515 thus has a downwardly extending protrusion arranged within this annular recessed fluid collecting track of the first collecting pan 510 . The outer cover portion 515 thus effectively covers the slot 555 and prevents any fluid from flowing into the slot 555 .

雖未於第15圖的剖面圖中顯示，各收集盤可具有一對往外延伸的凸緣區，與收集盤130之往外延伸的該對凸緣區133類似。凸緣區較佳彼此相對設置(如相隔180度)並具有形成於其中之複數個開口(如開口134)。開口沿著凸緣區在其側壁之間間隔設置。在一所示實施例中，有接收工作活塞(如氣動(空氣)缸之端部)之三個開口，如參考第1~10圖之實施例所述般。在每一個凸緣區中還形成一額外的開口。這些開口的配置可與第1~10圖之開口134及135的配置相同或類似。 Although not shown in the cross-sectional view of FIG. 15 , each collection pan may have a pair of outwardly extending flange areas similar to the pair of outwardly extending flange areas 133 of collection pan 130 . The flange regions are preferably disposed opposite each other (eg, 180 degrees apart) and have a plurality of openings (eg, opening 134 ) formed therein. Openings are spaced along the flange region between its sidewalls. In one illustrated embodiment, there are three openings for receiving working pistons, such as the ends of pneumatic (air) cylinders, as described with reference to the embodiment of FIGS. 1-10. An additional opening is also formed in each flange area. The configuration of these openings may be the same as or similar to the configuration of the openings 134 and 135 in FIGS. 1-10 .

收集盤各包括形成在其之一位置的出口(排水導管)，尤其，出口可與收集盤130的出口136類似。如此，出口與槽555流體連通。出口可具有流出槽或排水導管的形式，如上述，沿著收集盤的圓周長度以切線方式延伸(見第13圖)。出口可提供另一槽，收集到的流體可沿此流動。出口的底部可與槽555的底部(底板)流體連通，因此流體可從槽555流到出口中。各收集盤的出口可與歧管結構流體連通，如第1~10圖之歧管結構200，以將收集到的流體導離卡盤。 The collecting trays each include an outlet (drainage conduit) formed at one of its positions, and in particular, the outlet may be similar to the outlet 136 of the collecting tray 130 . As such, the outlet is in fluid communication with the slot 555 . The outlet may be in the form of an outflow trough or a drain conduit, as described above, extending tangentially along the circumferential length of the collecting pan (see Figure 13). The outlet can provide another channel along which the collected fluid can flow. The bottom of the outlet can be in fluid communication with the bottom (floor) of the groove 555 so fluid can flow from the groove 555 into the outlet. The outlet of each collection tray can be in fluid communication with a manifold structure, such as the manifold structure 200 in FIGS. 1-10, so as to guide the collected fluid away from the chuck.

根據本發明，升起的第一收集盤510之槽555的底部(點A) 的位置低於第二收集盤520的點B(內壁部550的內頂緣)且點A較佳與點C(外壁部560的頂邊緣)相同高度或低於其。發明人發現上述點(區域)A、B、C之關係去除或大幅減少潑濺到第一收集室501外的任何噴霧。此配置針對收集盤之其他位置也成立，其中升起的收集盤之點A低於正下方的降下收集盤的點B且升起的收集盤之點A具有與點C相等或較小的高度。 According to the present invention, the bottom of the groove 555 of the raised first collection tray 510 (point A) is lower than point B (the inner top edge of the inner wall portion 550 ) of the second collecting tray 520 and point A is preferably at the same height as or lower than point C (the top edge of the outer wall portion 560 ). The inventors have found that the relationship of points (areas) A, B, C described above eliminates or substantially reduces any spray splashing outside the first collection chamber 501 . This configuration is also true for other positions of the catch pan where point A of the raised catch pan is lower than point B of the lowered catch pan directly below and point A of the raised catch pan has an equal or smaller height to point C .

如先前第1~10圖的實施例般，將第二收集盤520上升到接觸升起的第一收集盤510同時第三及第四收集盤530及540在降下位置中界定出用以收集從晶圓排出的流體(如與用於第一收集室不同的流體(化學物質))之第二收集室。將第三收集盤530上升到接觸升起的第二收集盤520同時第四收集盤540在降下位置中界定出用以收集從晶圓排出的流體(如與用於第一及第二收集室不同的流體(化學物質))之第三收集室。 As in the previous embodiments of FIGS. 1-10 , the second collection tray 520 is raised to contact the raised first collection tray 510 while the third and fourth collection trays 530 and 540 are in the lowered position to define a trap for collecting the A second collection chamber for wafer exhaust fluid (eg, a different fluid (chemical) than that used in the first collection chamber). Raising the third collection pan 530 into contact with the raised second collection pan 520 while the fourth collection pan 540 is in the lowered position defines a fluid drain from the wafer (as used for the first and second collection chambers). A third collection chamber for different fluids (chemicals).

可使用本文中所述的機構之一來個別且獨立地升起及降下收集盤510、520、530、540。 The collection trays 510, 520, 530, 540 may be individually and independently raised and lowered using one of the mechanisms described herein.

廢氣(空氣)可牽引經過收集室並沿著防濺擋板503往下引導至廢氣口/通風口，比如化學排氣口1070(第11圖)。 Exhaust (air) may be drawn through the collection chamber and directed down the splash guard 503 to an exhaust/vent such as chemical exhaust 1070 (FIG. 11).

也應可理解收集盤510、520、530、540可具有如第20圖中所示的構造，其中半徑沿著收集盤的圓周變化以產生至排水渠D1及D2的流動。 It should also be understood that the collection pans 510, 520, 530, 540 may have a configuration as shown in Figure 20, wherein the radius varies along the circumference of the collection pans to create flow to drains D1 and D2.

當防濺擋板503在降下位置中時，廢氣可經由腔室排氣口1070排出(第11圖)。 When the splash guard 503 is in the lowered position, exhaust gases can be exhausted through the chamber exhaust port 1070 (FIG. 11).

第16A及16B圖繪示與先前所述類似的另一種收集盤設備之局部化部分，且因此並未敘述及繪示所有構件。如所示，可見到卡盤1040的外圍邊緣。此實施例的收集室設備包括收集盤配置或裝配600及其中設置收集盤配置600的外收集盤外殼601。 Figures 16A and 16B show a localized portion of another catch tray apparatus similar to that previously described, and therefore not all components are described and shown. As shown, the peripheral edge of the chuck 1040 is visible. The collection chamber apparatus of this embodiment comprises a collection tray arrangement or assembly 600 and an outer collection tray housing 601 in which the collection tray arrangement 600 is disposed.

收集盤外殼601具有沿圓周圍繞卡盤1040及晶圓115的中空部。如所示，收集盤外殼601可包括內分隔壁603，其將收集盤外殼601之中空內部空間隔成第一隔間605和自第一隔間605徑向往外設置之第二隔間607(第一隔間605因此位在晶圓115的外圍邊緣旁，而第二隔間607則自其徑向間隔)。應可理解到收集盤外殼601因而具有環形且第一及第二隔間605及607皆具有環形。 The catch tray housing 601 has a hollow that circumferentially surrounds the chuck 1040 and the wafer 115 . As shown, the collection tray housing 601 may include an inner divider wall 603 that divides the hollow interior of the collection tray housing 601 into a first compartment 605 and a second compartment 607 disposed radially outward from the first compartment 605 ( The first compartment 605 is thus located by the peripheral edge of the wafer 115, while the second compartment 607 is spaced radially therefrom). It should be appreciated that the collection tray housing 601 thus has an annular shape and that both the first and second compartments 605 and 607 have an annular shape.

第一隔間605係經配置成以一種方式支撐收集盤配置600，如下所述，而得以移動(亦即升起或降下)各收集盤。雖第一隔間605顯示成具有比第二隔間607更大的面積，這僅為一示範實施例，且應可了解這兩個隔間605及607的形狀和相對大小不限於圖中所示。如所示，由在晶圓115之外緣附近並止於頂緣604的內壁602界定第一隔間605。分隔壁603的高度小於內壁602的高度，因此分隔壁603的頂緣低於頂緣604。底壁606界定隔間的底部，因此作為底板。 The first compartment 605 is configured to support the collection tray arrangement 600 in a manner, as described below, to enable movement (ie, raising or lowering) of each collection tray. Although the first compartment 605 is shown to have a larger area than the second compartment 607, this is only an exemplary embodiment, and it should be understood that the shapes and relative sizes of the two compartments 605 and 607 are not limited to those shown in the figures. Show. As shown, the first compartment 605 is bounded by an inner wall 602 near the outer edge of the wafer 115 and terminating at a top edge 604 . The height of the partition wall 603 is smaller than that of the inner wall 602 , so the top edge of the partition wall 603 is lower than the top edge 604 . The bottom wall 606 defines the bottom of the compartment, thus acting as a floor.

由外壁608及分隔壁603界定第二隔間607，並由底壁606界定第二隔間607的底部。外壁608與分隔壁603平行。亦由頂壁部609界定第二隔間607，該頂壁部具有朝第一隔間延伸的第一腳以及介於外壁與分隔壁603間與之平行的第二腳。頂壁部609組態並定位成界定第一開口或第一通道及第二開口或第二通道。第一通道界定在頂壁部609的第一腳與分隔壁603的頂緣之間，因此界定出從第一隔間到第二隔間的一條流動路徑。第二通道界定在頂壁部609的第二腳與外壁608之間並界定自第二隔間之出口或離開口，並且較佳導至化學排氣口1080(第11圖)。 The second compartment 607 is defined by the outer wall 608 and the partition wall 603 , and the bottom of the second compartment 607 is defined by the bottom wall 606 . The outer wall 608 is parallel to the partition wall 603 . The second compartment 607 is also defined by a top wall portion 609 having a first leg extending toward the first compartment and a second leg parallel thereto between the outer wall and the partition wall 603 . The top wall portion 609 is configured and positioned to define a first opening or channel and a second opening or channel. The first channel is defined between the first foot of the top wall portion 609 and the top edge of the partition wall 603, thus defining a flow path from the first compartment to the second compartment. A second channel is defined between the second foot of the top wall portion 609 and the outer wall 608 and defines an exit or exit opening from the second compartment and preferably leads to a chemical exhaust port 1080 (FIG. 11).

底壁606包括複數個孔或開口以收容與個別收集盤關聯的排水管，如下說明。每一個孔以密封方式收容一排水管，同時允許排水管的垂直移動。 The bottom wall 606 includes a plurality of holes or openings to accommodate drains associated with individual collection trays, as described below. Each hole receives a drain tube in a sealed manner while allowing vertical movement of the drain tube.

在所示的實施例中，其本質上為示範性，有四個不同的收集盤，亦即，以堆疊型態配置的第一收集盤610、第二收集盤620、第三收集盤630、及第四收集盤640。然而，應可了解到在設備中可使用少於或多於四個的收集盤。應可理解到增加一個收集盤會相應地增加一個用於收集流體之分別的收集室。從下列討論及附圖可輕易了解此態樣。 In the illustrated embodiment, which is exemplary in nature, there are four different collection trays, namely, a first collection tray 610, a second collection tray 620, a third collection tray 630, And the fourth collection tray 640. However, it should be appreciated that fewer or more than four collection trays may be used in the apparatus. It will be appreciated that adding a collection pan will correspondingly add a separate collection chamber for collecting fluid. This aspect can be easily understood from the following discussion and accompanying drawings.

收集盤610、620、630、及640可具有與圖中所示相同或類似的基本設計。在所示的實施例中，收集盤610、620、630、及640的每一個為大致環形，並具有用於收容旋轉卡盤1040和晶圓115的中央開口。每一個收集盤具有界定一環形收集軌道之主要區，該軌道係由內壁部650及外壁部660界定，該兩壁部彼此相交而界定一槽655。如第16A及16B圖中所示，槽655具有開口，其與穿過開口的排水導管(管)657流體連接。 The collection trays 610, 620, 630, and 640 may have the same or similar basic design as shown in the figures. In the illustrated embodiment, each of collection trays 610 , 620 , 630 , and 640 is generally annular and has a central opening for receiving spin chuck 1040 and wafer 115 . Each collection tray has a main area defining an annular collection track defined by an inner wall portion 650 and an outer wall portion 660 that meet each other to define a slot 655 . As shown in Figures 16A and 16B, the slot 655 has an opening fluidly connected to a drain conduit (pipe) 657 passing through the opening.

沿著各收集盤的下側有圍繞該孔的向下延伸凸部613。第二、第三、及第四收集盤620、630、及640還各包括收容並允許排水管657通過的一開口。圍繞槽中的開口是一直立內壁659，其圍繞該開口並防止流體流入開口中。如所示，當收集盤彼此嵌套時，直立內壁659收容在向下延伸的凸部613內。 Along the underside of each collection tray there is a downwardly extending protrusion 613 surrounding the aperture. The second, third, and fourth collection trays 620, 630, and 640 also each include an opening for receiving and allowing the drain pipe 657 to pass through. Surrounding the opening in the slot is an upstanding inner wall 659 which surrounds the opening and prevents fluid from flowing into the opening. As shown, the upstanding inner walls 659 are received within the downwardly extending protrusions 613 when the collection trays are nested within one another.

如圖中所標示，槽655的底部由點A界定，且內壁部650之內頂緣由點B界定，且外壁部660之外頂緣由點C界定。點A因此代表第一給定收集盤的最低點。點A、B、及C之間的關係為此實施例的一個重要態樣。 The bottom of the groove 655 is bounded by point A, the inner top edge of the inner wall portion 650 is bounded by point B, and the outer top edge of the outer wall portion 660 is bounded by point C, as indicated in the figure. Point A thus represents the lowest point of the first given collection pan. The relationship between points A, B, and C is an important aspect of this embodiment.

如圖中所示，第一收集盤610亦包括外蓋部615，其覆蓋界定在內壁部650與外壁部660之間的環形凹陷流體收集軌道。外蓋部615因此具有向下延伸的凸部，設置在第一收集盤610的這個環形凹陷流體收集軌道內。外蓋部615因此有效覆蓋槽655並防止任何流體流入槽655中。 As shown in the figure, the first collection tray 610 also includes an outer cover portion 615 covering the annular recessed fluid collection track defined between the inner wall portion 650 and the outer wall portion 660 . The outer cover part 615 thus has a downwardly extending protrusion arranged within this annular recessed fluid collecting track of the first collecting pan 610 . The outer cover portion 615 thus effectively covers the slot 655 and prevents any fluid from flowing into the slot 655 .

雖未於第16A及16B圖的剖面圖中顯示，各收集盤可具有一對往外延伸的凸緣區，與收集盤130之往外延伸的該對凸緣區133類似。凸緣區較佳彼此相對設置(如相隔180度)並具有形成於其中之複數個開口(如開口134)。開口沿著凸緣區在其側壁之間間隔設置。在一所示實施例中，有接收工作活塞(如氣動(空氣)缸之端部)之三個開口，如參考第1~10圖之實施例所述般。在每一個凸緣區中還形成一額外的開口。這些開口的配置可與第1~10圖之開口134及135的配置相同或類似。 Although not shown in the cross-sectional views of Figures 16A and 16B, each collection tray may have a The outwardly extending flange areas are similar to the pair of outwardly extending flange areas 133 of the collecting tray 130 . The flange regions are preferably disposed opposite each other (eg, 180 degrees apart) and have a plurality of openings (eg, opening 134 ) formed therein. Openings are spaced along the flange region between its sidewalls. In one illustrated embodiment, there are three openings for receiving working pistons, such as the ends of pneumatic (air) cylinders, as described with reference to the embodiment of FIGS. 1-10. An additional opening is also formed in each flange area. The configuration of these openings may be the same as or similar to the configuration of the openings 134 and 135 in FIGS. 1-10 .

收集盤各包括形成在其之一位置的出口(排水導管)，尤其，各收集盤包括將收集在收集盤的槽中之流體排出的一或多個排水管。如所示，下面的收集盤具有開口形成於其之槽區以讓與上面的收集盤關聯之排水管通過。排水管因此彼此沿圓周間隔且每一個收集盤可包括兩個互相相對設置的排水管。 The collecting trays each include an outlet (drainage conduit) formed at one of their positions, and in particular, each collecting tray includes one or more drains for discharging the fluid collected in the grooves of the collecting tray. As shown, the lower collection pan has a trough area with openings formed therein to allow passage of the drain associated with the upper collection pan. The drains are thus circumferentially spaced from each other and each collecting tray may comprise two drains arranged opposite each other.

第16A圖顯示在升起位置中之第一收集盤610及外蓋部615，以及界定在升起的第一收集盤610與降下的第二收集盤620之間的第一收集室。如同前一個實施例，廢氣(空氣)可流經第一收集室經過第一通道到第二隔間607，然後經由第二通道離開。 FIG. 16A shows the first collection pan 610 and the outer cover portion 615 in the raised position, and the first collection chamber defined between the raised first collection pan 610 and the lowered second collection pan 620 . As with the previous embodiment, exhaust gas (air) may flow through the first collection chamber through the first channel to the second compartment 607 and then exit through the second channel.

第16圖顯示所有的收集盤及外蓋部615都在降下位置中。廢氣(空氣)仍可流經外蓋部615上方、經過第一通道到第二隔間607中，然後經由第二通道離開。廢氣因此繞過排水管657並可流到化學排氣口1080(第11圖)。 Figure 16 shows all collection trays and outer cover portion 615 in the lowered position. Exhaust gas (air) can still flow over the outer cover portion 615, through the first channel into the second compartment 607, and then exit through the second channel. Exhaust gases thus bypass drain 657 and can flow to chemical vent 1080 (FIG. 11).

根據本發明，升起的第一收集盤610之槽655的底部(點A)位置低於第二收集盤620的點B(內壁部650的內頂緣)且點A較佳與點C(外壁部660的頂邊緣)相同高度或低於其。發明人發現上述點(區域)A、B、C之關係去除或大幅減少潑濺到第一收集室外的任何噴霧。此配置針對收集盤之其他位置也成立，其中升起的收集盤之點A低於正下方的降下收集盤的點B且升起的收集盤之點A具有與點C相等或較小的高度。 According to the present invention, the bottom (point A) of the groove 655 of the raised first collecting tray 610 is lower than the point B (the inner top edge of the inner wall portion 650) of the second collecting tray 620, and point A is preferably the same as point C (the top edge of the outer wall portion 660) the same height or lower than it. The inventors have found that the above relationship of points (areas) A, B, C removes or substantially reduces any spray splashed outside the first collection chamber. This configuration is also true for other positions of the catch pan, where point A of the raised catch pan is lower than that of the lowered catch pan directly below. Point B and point A of the raised collecting pan have an equal or smaller height to point C.

如先前第1~10圖的實施例般，將第二收集盤620上升到接觸升起的第一收集盤610同時第三及第四收集盤630及640在降下位置中界定出用以收集從晶圓排出的流體(如與用於第一收集室不同的流體(化學物質))之第二收集室。將第三收集盤630上升到接觸升起的第二收集盤620同時第四收集盤640在降下位置中界定出用以收集從晶圓排出的流體(如與用於第一及第二收集室不同的流體(化學物質))之第三收集室。 As in the previous embodiments of FIGS. 1-10 , the second collection tray 620 is raised to contact the raised first collection tray 610 while the third and fourth collection trays 630 and 640 are in the lowered position to define a trap for collecting the A second collection chamber for wafer exhaust fluid (eg, a different fluid (chemical) than that used in the first collection chamber). Raising the third collection pan 630 into contact with the raised second collection pan 620 while the fourth collection pan 640 in the lowered position defines a fluid for collecting fluid drained from the wafer (as used for the first and second collection chambers). A third collection chamber for different fluids (chemicals).

可使用本文中所述的機構之一來個別且獨立地升起及降下收集盤610、620、630、640。 The collection trays 610, 620, 630, 640 may be individually and independently raised and lowered using one of the mechanisms described herein.

也應可理解收集盤610、620、630、640可具有如第20圖中所示的構造，其中半徑沿著收集盤的圓周變化以產生至排水渠D1及D2的流動。 It should also be understood that the collection pans 610, 620, 630, 640 may have a configuration as shown in Figure 20, wherein the radius varies along the circumference of the collection pans to create flow to drains D1 and D2.

第17A及17B圖繪示與先前所述類似的另一種收集盤設備之局部化部分，且因此並未敘述及繪示所有構件。如所示，可見到卡盤1040的外圍邊緣。此實施例的收集室設備包括收集盤配置或裝配700及其中設置收集盤配置700的外收集盤外殼701。 Figures 17A and 17B show a localized portion of another catch tray apparatus similar to that previously described, and therefore not all components are described and shown. As shown, the peripheral edge of the chuck 1040 is visible. The collection chamber apparatus of this embodiment includes a collection tray arrangement or assembly 700 and an outer collection tray housing 701 in which the collection tray arrangement 700 is disposed.

收集盤外殼701具有沿圓周圍繞卡盤110及晶圓115的中空部。如所示，收集盤外殼701可包括內分隔壁703，其將收集盤外殼701之中空內部空間隔成第一隔間705和自第一隔間705徑向往外設置之第二隔間707(第一隔間705因此位在卡盤110及晶圓115的外圍邊緣旁，而第二隔間707則自其徑向間隔)。應可理解到收集盤外殼701因而具有環形且第一及第二隔間705及707皆具有環形。 The catch tray housing 701 has a hollow that circumferentially surrounds the chuck 110 and the wafer 115 . As shown, the collection tray housing 701 can include an inner divider wall 703 that divides the hollow interior of the collection tray housing 701 into a first compartment 705 and a second compartment 707 disposed radially outward from the first compartment 705 ( The first compartment 705 is thus located beside the peripheral edge of the chuck 110 and wafer 115, while the second compartment 707 is spaced radially therefrom). It should be appreciated that the collection tray housing 701 thus has an annular shape and that both the first and second compartments 705 and 707 have an annular shape.

第一隔間705係經配置成以一種方式支撐收集盤配置700，如下所述，而得以移動(亦即升起或降下)各收集盤。雖第一隔間705顯示成具有比第二隔間707更大的面積，這僅為一示範實施例，且應可了解這兩個隔間705及707的形狀和相對大小不限於圖中所示。由外壁708及分隔壁703界定第二隔間707，並由底壁706界定第二隔間707的底部。外壁708與分隔壁703平行。亦由頂壁部709界定第二隔間707，該頂壁部具有朝第一隔間延伸的第一腳以及介於外壁與分隔壁703間與之平行的第二腳。頂壁部709組態並定位成界定第一開口或第一通道及第二開口或第二通道。第一通道界定在頂壁部709的第一腳與分隔壁703的頂緣之間，因此界定出從第一隔間到第二隔間的一條流動路徑。第二通道界定在頂壁部709的第二腳與外壁708之間並界定自第二隔間之出口或離開口。 The first compartment 705 is configured to support the collection tray arrangement 700 in a manner, as described below, to enable movement (ie, raising or lowering) of each collection tray. Although the first compartment 705 is shown as Having a larger area than the second compartment 707 is only an exemplary embodiment, and it should be understood that the shapes and relative sizes of the two compartments 705 and 707 are not limited to what is shown in the figure. The second compartment 707 is defined by the outer wall 708 and the partition wall 703 , and the bottom of the second compartment 707 is defined by the bottom wall 706 . The outer wall 708 is parallel to the partition wall 703 . The second compartment 707 is also defined by a top wall portion 709 having a first leg extending toward the first compartment and a second leg parallel thereto between the outer wall and the partition wall 703 . The top wall portion 709 is configured and positioned to define a first opening or channel and a second opening or channel. The first channel is defined between the first foot of the top wall portion 709 and the top edge of the partition wall 703, thus defining a flow path from the first compartment to the second compartment. A second channel is defined between the second foot of the top wall portion 709 and the outer wall 708 and defines an exit or exit opening from the second compartment.

在所示的實施例中，其本質上為示範性，有三個不同的收集盤，亦即，以堆疊型態配置的第一收集盤710、第二收集盤720、及第三收集盤730。然而，應可了解到在設備中可使用少於或多於四個的收集盤。應可理解到增加一個收集盤會相應地增加一個用於收集流體之分別的收集室。從下列討論及附圖可輕易了解此態樣。 In the illustrated embodiment, which is exemplary in nature, there are three different collection trays, namely, a first collection tray 710, a second collection tray 720, and a third collection tray 730 arranged in a stacked configuration. However, it should be appreciated that fewer or more than four collection trays may be used in the apparatus. It will be appreciated that adding a collection pan will correspondingly add a separate collection chamber for collecting fluid. This aspect can be easily understood from the following discussion and accompanying drawings.

收集盤710、720、及730可具有與圖中所示相同或類似的基本設計。在所示的實施例中，收集盤710、720、及730的每一個為大致環形，並具有用於收容旋轉卡盤1040和晶圓115的中央開口。每一個收集盤具有界定一環形收集軌道之主要區，該軌道係由內壁部750及外壁部760界定，該兩壁部彼此相交而界定一槽755。如第17A及17B圖中所示，槽755具有流體連接至排水渠的一或多個排水口。 Collection trays 710, 720, and 730 may have the same or similar basic design as shown in the figures. In the illustrated embodiment, each of collection trays 710 , 720 , and 730 is generally ring-shaped and has a central opening for receiving spin chuck 1040 and wafer 115 . Each collection pan has a main area defining an annular collection track defined by an inner wall portion 750 and an outer wall portion 760 that meet each other to define a slot 755 . As shown in Figures 17A and 17B, the tank 755 has one or more drain ports fluidly connected to a drain.

如圖中所標示，槽755的底部由點A界定，且內壁部750之內頂緣由點B界定，且外壁部760之外頂緣由點C界定。點A因此代表第一給定收集盤的最低點。點A、B、及C之間的關係為此實施例的一個重要態樣。 The bottom of the groove 755 is bounded by point A, the inner top edge of the inner wall portion 750 is bounded by point B, and the outer top edge of the outer wall portion 760 is bounded by point C, as indicated in the figure. Point A thus represents the lowest point of the first given collection pan. The relationship between points A, B, and C is an important aspect of this embodiment.

如圖中所示，第一收集盤610亦包括外蓋部715，其覆蓋界定在內壁部750與外壁部760之間的環形凹陷流體收集軌道。外蓋部715因此具有向下延伸的凸部，設置在第一收集盤710的這個環形凹陷流體收集軌道內。外蓋部715因此有效覆蓋槽755並防止任何流體流入槽755中。 As shown in the figure, the first collecting tray 610 also includes an outer cover portion 715, which covers and defines An annular recessed fluid collection track between the inner wall portion 750 and the outer wall portion 760 . The outer cover part 715 thus has a downwardly extending protrusion which is arranged within this annular recessed fluid collecting track of the first collecting pan 710 . The outer cover portion 715 thus effectively covers the slot 755 and prevents any fluid from flowing into the slot 755 .

雖未於第17A及17B圖的剖面圖中顯示，各收集盤可具有一對往外延伸的凸緣區，與收集盤130之往外延伸的該對凸緣區133類似。凸緣區較佳彼此相對設置(如相隔180度)並具有形成於其中之複數個開口(如開口134)。開口沿著凸緣區在其側壁之間間隔設置。在一所示實施例中，有接收工作活塞(如氣動(空氣)缸之端部)之三個開口，如參考第1~10圖之實施例所述般。 Although not shown in cross-section in FIGS. 17A and 17B , each collection pan may have a pair of outwardly extending flange areas similar to the pair of outwardly extending flange areas 133 of collection pan 130 . The flange regions are preferably disposed opposite each other (eg, 180 degrees apart) and have a plurality of openings (eg, opening 134 ) formed therein. Openings are spaced along the flange region between its sidewalls. In one illustrated embodiment, there are three openings for receiving working pistons, such as the ends of pneumatic (air) cylinders, as described with reference to the embodiment of FIGS. 1-10.

第17A圖顯示在升起位置中之第一收集盤710及外蓋部715，以及界定在升起的第一收集盤710與降下的第二收集盤720之間的第一收集室。如同前一個實施例，廢氣(空氣)可流經第一收集室經過第一通道到第二隔間707，然後經由第二通道離開。 FIG. 17A shows the first collection pan 710 and the outer cover portion 715 in the raised position, and the first collection chamber defined between the raised first collection pan 710 and the lowered second collection pan 720 . As with the previous embodiment, exhaust gas (air) may flow through the first collection chamber through the first channel to the second compartment 707 and then exit through the second channel.

第17B圖顯示所有的收集盤及外蓋部715都在降下位置中。廢氣(空氣)仍可流經外蓋部715上方、經過第一通道到第二隔間707中，然後經由第二通道離開。 Figure 17B shows all collection trays and outer cover portion 715 in the lowered position. Exhaust gas (air) can still flow over the outer cover portion 715, through the first channel into the second compartment 707, and then exit through the second channel.

根據本發明，升起的第一收集盤710之槽755的底部(點A)位置低於第二收集盤720的點B(內壁部750的內頂緣)且點A較佳與點C(外壁部760的頂邊緣)相同高度或低於其。發明人發現上述點(區域)A、B、C之關係去除或大幅減少潑濺到第一收集室外的任何噴霧。此配置針對收集盤之其他位置也成立，其中升起的收集盤之點A低於正下方的降下收集盤的點B且升起的收集盤之點A具有與點C相等或較小的高度。 According to the present invention, the position of the bottom (point A) of the groove 755 of the raised first collection tray 710 is lower than the point B (inner top edge of the inner wall portion 750) of the second collection tray 720 and point A is preferably the same as point C (the top edge of the outer wall portion 760) the same height or lower than it. The inventors have found that the above relationship of points (areas) A, B, C removes or substantially reduces any spray splashed outside the first collection chamber. This configuration is also true for other positions of the catch pan where point A of the raised catch pan is lower than point B of the lowered catch pan directly below and point A of the raised catch pan has an equal or smaller height to point C .

如先前第1~10圖的實施例般，將第二收集盤720上升到接觸升起的第一收集盤710同時第三及第四收集盤730及740在降下位置中界定出用以收集從晶圓排出的流體(如與用於第一收集室不同的流體(化學物質))之第二收集室。 As in the previous embodiments of FIGS. 1-10 , the second collection tray 720 is raised to contact the raised first collection tray 710 while the third and fourth collection trays 730 and 740 are in the lowered position to define a trap for collecting the A second collection chamber for wafer exhaust fluid (eg, a different fluid (chemical) than that used in the first collection chamber).

可使用本文中所述的機構之一來個別且獨立地升起及降下收集盤710、720、及730。 Collection trays 710, 720, and 730 may be individually and independently raised and lowered using one of the mechanisms described herein.

也應可理解收集盤710、720、及730可具有如第20圖中所示的構造，其中半徑沿著收集盤的圓周變化以產生至排水渠D1及D2的流動。 It should also be appreciated that collection pans 710, 720, and 730 may have a configuration as shown in FIG. 20, wherein the radius varies along the circumference of the collection pans to create flow to drains D1 and D2.

第18A及18B圖繪示與先前所述類似的另一種收集盤設備之局部化部分，且因此並未敘述及繪示所有構件。如所示，可見到卡盤1040的外圍邊緣。此實施例的收集室設備包括收集盤配置或裝配800及其中設置收集盤配置800的外收集盤外殼801。 Figures 18A and 18B show a localized portion of another catch tray apparatus similar to that previously described, and therefore not all components are described and shown. As shown, the peripheral edge of the chuck 1040 is visible. The collection chamber apparatus of this embodiment includes a collection tray arrangement or assembly 800 and an outer collection tray housing 801 in which the collection tray arrangement 800 is disposed.

收集盤外殼801具有沿圓周圍繞卡盤110及晶圓115的中空部。如所示，收集盤外殼801可包括內分隔壁803，其將收集盤外殼801之中空內部空間隔成第一隔間805和自第一隔間805徑向往外設置之第二隔間807(第一隔間805因此位在卡盤1040及晶圓115的外圍邊緣旁，而第二隔間807則自其徑向間隔)。應可理解到收集盤外殼801因而具有環形且第一及第二隔間805及807皆具有環形。 The catch tray housing 801 has a hollow that circumferentially surrounds the chuck 110 and the wafer 115 . As shown, the collection tray housing 801 can include an inner divider wall 803 that divides the hollow interior of the collection tray housing 801 into a first compartment 805 and a second compartment 807 disposed radially outward from the first compartment 805 ( The first compartment 805 is thus located alongside the peripheral edge of the chuck 1040 and wafer 115, while the second compartment 807 is spaced radially therefrom). It should be appreciated that the collection tray housing 801 thus has an annular shape and that both the first and second compartments 805 and 807 have an annular shape.

第一隔間805係經配置成以一種方式支撐收集盤配置800，如下所述，而得以移動(亦即升起或降下)各收集盤。雖第一隔間805顯示成具有比第二隔間807更大的面積，這僅為一示範實施例，且應可了解這兩個隔間805及807的形狀和相對大小不限於圖中所示。由外壁808及分隔壁803界定第二隔間807，並由底壁806界定第二隔間807的底部。外壁808與分隔壁803平行。亦由頂壁部809界定第二隔間807，該頂壁部具有朝第一隔間延伸的第一腳以及介於外壁與分隔壁803間與之平行的第二腳。頂壁部809組態並定位成界定第一開口或第一通道及第二開口或第二通道。第一通道界定在頂壁部809的第一腳與分隔壁803的頂緣之間，因此界定出從第一隔間到第二隔間的一條流動路徑。第二通道界定在頂壁部809的第二腳與外壁808之間並界定自第二隔間之出口或離開口。 The first compartment 805 is configured to support the collection tray arrangement 800 in a manner, as described below, that enables movement (ie, raising or lowering) of each collection tray. Although the first compartment 805 is shown to have a larger area than the second compartment 807, this is only an exemplary embodiment, and it should be understood that the shapes and relative sizes of the two compartments 805 and 807 are not limited to those shown in the figures. Show. The second compartment 807 is defined by the outer wall 808 and the partition wall 803 , and the bottom of the second compartment 807 is defined by the bottom wall 806 . The outer wall 808 is parallel to the partition wall 803 . The second compartment 807 is also delimited by a top wall portion 809 having a The extended first leg and the second leg between the outer wall and the partition wall 803 are parallel to it. The top wall portion 809 is configured and positioned to define a first opening or channel and a second opening or channel. The first channel is defined between the first foot of the top wall portion 809 and the top edge of the partition wall 803, thus defining a flow path from the first compartment to the second compartment. A second channel is defined between the second foot of the top wall portion 809 and the outer wall 808 and defines an exit or exit opening from the second compartment.

在所示的實施例中，其本質上為示範性，有四個不同的收集盤，亦即，以堆疊型態配置的第一收集盤810、第二收集盤820、第三收集盤830、及第四收集盤840。然而，應可了解到在設備中可使用少於或多於四個的收集盤。應可理解到增加一個收集盤會相應地增加一個用於收集流體之分別的收集室。從下列討論及附圖可輕易了解此態樣。 In the illustrated embodiment, which is exemplary in nature, there are four different collection trays, namely, a first collection tray 810, a second collection tray 820, a third collection tray 830, And the fourth collection tray 840. However, it should be appreciated that fewer or more than four collection trays may be used in the apparatus. It will be appreciated that adding a collection pan will correspondingly add a separate collection chamber for collecting fluid. This aspect can be easily understood from the following discussion and accompanying drawings.

收集盤810、820、830、及840可具有與圖中所示相同或類似的基本設計。在所示的實施例中，收集盤810、820、830、及840的每一個為大致環形，並具有用於收容旋轉卡盤1040和晶圓115的中央開口。每一個收集盤具有界定一環形收集軌道之主要區，該軌道係由內壁部850及外壁部860界定，該兩壁部彼此相交而界定一槽855。如第18A及18B圖中所示，槽855具有流體連接至排水渠的一或多個排水口。 Collection trays 810, 820, 830, and 840 may have the same or similar basic design as shown in the figures. In the illustrated embodiment, each of collection trays 810 , 820 , 830 , and 840 is generally ring-shaped and has a central opening for receiving spin chuck 1040 and wafer 115 . Each collection pan has a main area defining an annular collection track defined by an inner wall portion 850 and an outer wall portion 860 that meet each other to define a slot 855 . As shown in Figures 18A and 18B, the tank 855 has one or more drains fluidly connected to a drain.

如圖中所標示，槽855的底部由點A界定，且內壁部850之內頂緣由點B界定，且外壁部860之外頂緣由點C界定。點A因此代表第一給定收集盤的最低點。點A、B、及C之間的關係為此實施例的一個重要態樣。 As indicated in the figure, the bottom of the slot 855 is bounded by point A, and the inner top edge of the inner wall portion 850 is bounded by point B, and the outer top edge of the outer wall portion 860 is bounded by point C. Point A thus represents the lowest point of the first given collection pan. The relationship between points A, B, and C is an important aspect of this embodiment.

如圖中所示，第一收集盤810亦包括外蓋部815，其覆蓋界定在內壁部850與外壁部860之間的環形凹陷流體收集軌道。外蓋部815因此具有向下延伸的凸部，設置在第一收集盤810的這個環形凹陷流體收集軌道內。外蓋部815因此有效覆蓋槽855並防止任何流體流入槽855中。 As shown in the figure, the first collection tray 810 also includes an outer cover portion 815 covering the annular recessed fluid collection track defined between the inner wall portion 850 and the outer wall portion 860 . The outer cover part 815 thus has a downwardly extending protrusion arranged within this annular recessed fluid collecting track of the first collecting pan 810 . The outer cover portion 815 thus effectively covers the slot 855 and prevents any fluid from flowing into the slot 855 .

雖未於第18A及18B圖的剖面圖中顯示，各收集盤可具有一對往外延伸的凸緣區，與收集盤130之往外延伸的該對凸緣區133類似。凸緣區較佳彼此相對設置(如相隔180度)並具有形成於其中之複數個開口(如開口134)。開口沿著凸緣區在其側壁之間間隔設置。在一所示實施例中，有接收工作活塞(如氣動(空氣)缸之端部)之三個開口，如參考第1~10圖之實施例所述般。在每一個凸緣區中還形成一額外的開口。這些開口的配置可與第1~10圖之開口134及135的配置相同或類似。 Although not shown in the cross-sectional views of Figures 18A and 18B, each collection tray may have a The outwardly extending flange areas are similar to the pair of outwardly extending flange areas 133 of the collecting tray 130 . The flange regions are preferably disposed opposite each other (eg, 180 degrees apart) and have a plurality of openings (eg, opening 134 ) formed therein. Openings are spaced along the flange region between its sidewalls. In one illustrated embodiment, there are three openings for receiving working pistons, such as the ends of pneumatic (air) cylinders, as described with reference to the embodiment of FIGS. 1-10. An additional opening is also formed in each flange area. The configuration of these openings may be the same as or similar to the configuration of the openings 134 and 135 in FIGS. 1-10 .

第18A圖顯示在升起位置中之第一收集盤810及外蓋部815，以及界定在升起的第一收集盤810/外蓋部815與降下的收集盤820、830、及840之間的第一收集室。如同前一個實施例，廢氣(空氣)可流經第一收集室經過第一通道到第二隔間807，然後經由第二通道離開。 Figure 18A shows the first collection tray 810 and outer cover portion 815 in the raised position, and defined between the raised first collection tray 810/outer cover portion 815 and the lowered collection trays 820, 830, and 840 The first collection room. As with the previous embodiment, exhaust gas (air) may flow through the first collection chamber through the first channel to the second compartment 807 and then exit through the second channel.

第18B圖顯示所有的收集盤及外蓋部815都在降下位置中。廢氣(空氣)仍可流經外蓋部815上方、經過第一通道到第二隔間807中，然後經由第二通道離開至化學排氣口1080(第11圖)。 Figure 18B shows all collection trays and outer cover portion 815 in the lowered position. Exhaust gases (air) can still flow over the outer cover portion 815, through the first channel into the second compartment 807, and then exit through the second channel to the chemical exhaust port 1080 (FIG. 11).

根據本發明，升起的第一收集盤810之槽855的底部(點A)位置低於第二收集盤820的點B(內壁部850的內頂緣851)且點A較佳與點C(外壁部860的頂邊緣861)相同高度或低於其。發明人發現上述點(區域)A、B、C之關係去除或大幅減少潑濺到第一收集室外的任何噴霧。此配置針對收集盤之其他位置也成立，其中升起的收集盤之點A低於正下方的降下收集盤的點B且升起的收集盤之點A具有與點C相等或較小的高度。 According to the present invention, the position of the bottom (point A) of the groove 855 of the first collecting tray 810 raised is lower than the point B (the inner top edge 851 of the inner wall portion 850) of the second collecting tray 820 and point A is preferably the same as point A. C (the top edge 861 of the outer wall portion 860) is at the same height or lower. The inventors have found that the above relationship of points (areas) A, B, C removes or substantially reduces any spray splashed outside the first collection chamber. This configuration is also true for other positions of the catch pan where point A of the raised catch pan is lower than point B of the lowered catch pan directly below and point A of the raised catch pan has an equal or smaller height to point C .

如先前第1~10圖的實施例般，將第二收集盤820上升到接觸升起的第一收集盤810同時第三及第四收集盤830及840在降下位置中界定出用以收集從晶圓排出的流體(如與用於第一收集室不同的流體(化學物質))之第二收集室。可在升起的盤810、820、及830與降下的第四收集盤840之間界定第三收集室。 As in the previous embodiments of FIGS. 1-10, the second collection tray 820 is raised to contact the raised first collection tray 810 while the third and fourth collection trays 830 and 840 are defined in the lowered position for collecting A second collection chamber for wafer exhaust fluid (eg, a different fluid (chemical) than that used in the first collection chamber). A third collection chamber may be defined between the raised trays 810 , 820 , and 830 and the lowered fourth collection tray 840 .

可使用本文中所述的機構之一來個別且獨立地升起及降下收集盤810、820、830、及840。 Collection trays 810, 820, 830, and 840 may be individually and independently raised and lowered using one of the mechanisms described herein.

也應可理解收集盤810、820、830、及840可具有如第20圖中所示的構造，其中半徑沿著收集盤的圓周變化以產生至排水渠D1及D2的流動。 It should also be appreciated that collection pans 810, 820, 830, and 840 may have a configuration as shown in Figure 20, wherein the radius varies along the circumference of the collection pans to create flow to drains D1 and D2.

第19A及19B圖繪示與先前所述類似的另一種收集盤設備之局部化部分，且因此並未敘述及繪示所有構件。如所示，可見到卡盤1040的外圍邊緣。此實施例的收集室設備包括收集盤配置或裝配900及其中設置收集盤配置900的外收集盤外殼901。 Figures 19A and 19B show a localized portion of another catch tray apparatus similar to that previously described, and therefore not all components are described and shown. As shown, the peripheral edge of the chuck 1040 is visible. The collection chamber apparatus of this embodiment comprises a collection tray arrangement or assembly 900 and an outer collection tray housing 901 in which the collection tray arrangement 900 is disposed.

收集盤外殼901具有沿圓周圍繞卡盤110及晶圓115的中空部。如所示，收集盤外殼901可包括內分隔壁903，其將收集盤外殼901之中空內部空間隔成第一隔間905和自第一隔間905徑向往外設置之第二隔間907(第一隔間905因此位在卡盤110及晶圓115的外圍邊緣旁，而第二隔間907則自其徑向間隔)。應可理解到收集盤外殼901因而具有環形且第一及第二隔間905及907皆具有環形。 The catch tray housing 901 has a hollow that circumferentially surrounds the chuck 110 and the wafer 115 . As shown, the collection tray housing 901 can include an inner divider wall 903 that divides the hollow interior of the collection tray housing 901 into a first compartment 905 and a second compartment 907 disposed radially outward from the first compartment 905 ( The first compartment 905 is thus located beside the peripheral edge of the chuck 110 and the wafer 115, while the second compartment 907 is spaced radially therefrom). It should be appreciated that the collection tray housing 901 thus has an annular shape and that both the first and second compartments 905 and 907 have an annular shape.

第一隔間905係經配置成以一種方式支撐收集盤配置900，如下所述，而得以移動(亦即升起或降下)各收集盤。雖第一隔間905顯示成具有比第二隔間807更大的面積，這僅為一示範實施例，且應可了解這兩個隔間905及907的形狀和相對大小不限於圖中所示。由外壁908及分隔壁903界定第二隔間907，並由底壁906界定第二隔間907的底部。外壁808與分隔壁803平行。亦由頂壁部909界定第二隔間907，該頂壁部具有朝第一隔間延伸的第一腳以及介於外壁與分隔壁903間與之平行的第二腳。頂壁部909組態並定位成界定第一開口或第一通道及第二開口或第二通道。第一通道界定在頂壁部909的第一腳與分隔壁903的頂緣之間，因此界定出從第一隔間到第二隔間的一條流動路徑。第二通道界定在頂壁部909的第二腳與外壁908之間並界定自第二隔間之出口或離開口。 The first compartment 905 is configured to support the collection tray arrangement 900 in a manner, as described below, to enable movement (ie, raising or lowering) of each collection tray. Although the first compartment 905 is shown to have a larger area than the second compartment 807, this is only an exemplary embodiment, and it should be understood that the shapes and relative sizes of the two compartments 905 and 907 are not limited to those shown in the figures. Show. The second compartment 907 is defined by the outer wall 908 and the partition wall 903 , and the bottom of the second compartment 907 is defined by the bottom wall 906 . The outer wall 808 is parallel to the partition wall 803 . The second compartment 907 is also defined by a top wall portion 909 having a first leg extending toward the first compartment and a second leg parallel thereto between the outer wall and the partition wall 903 . The top wall portion 909 is configured and positioned to define a first opening or channel and a second opening or channel. The first channel is defined between the first foot of the top wall portion 909 and the top edge of the partition wall 903, thus defining a channel from the first compartment One flow path to the second compartment. A second channel is defined between the second foot of the top wall portion 909 and the outer wall 908 and defines an exit or exit opening from the second compartment.

在所示的實施例中，其本質上為示範性，有四個不同的收集盤，亦即，以堆疊型態配置的第一收集盤910、第二收集盤920、第三收集盤930、及第四收集盤940。然而，應可了解到在設備中可使用少於或多於四個的收集盤。應可理解到增加一個收集盤會相應地增加一個用於收集流體之分別的收集室。從下列討論及附圖可輕易了解此態樣。 In the illustrated embodiment, which is exemplary in nature, there are four different collection trays, namely, a first collection tray 910, a second collection tray 920, a third collection tray 930, And the fourth collection tray 940. However, it should be appreciated that fewer or more than four collection trays may be used in the apparatus. It will be appreciated that adding a collection pan will correspondingly add a separate collection chamber for collecting fluid. This aspect can be easily understood from the following discussion and accompanying drawings.

收集盤910、920、930、及940可具有與圖中所示相同或類似的基本設計。在所示的實施例中，收集盤910、920、930、及940的每一個為大致環形，並具有用於收容旋轉卡盤1040和晶圓115的中央開口。每一個收集盤具有界定一環形收集軌道之主要區，該軌道係由內壁部950及外壁部960界定，該兩壁部彼此相交而界定一槽955。如第19A及19B圖中所示，槽955具有一或多個排水口，其流體連接至排水渠並得以導送收集到的流體離開收集盤。 Collection trays 910, 920, 930, and 940 may have the same or similar basic design as shown in the figures. In the illustrated embodiment, each of collection trays 910 , 920 , 930 , and 940 is generally annular and has a central opening for receiving spin chuck 1040 and wafer 115 . Each collection pan has a main area defining an annular collection track defined by an inner wall portion 950 and an outer wall portion 960 that meet each other to define a slot 955 . As shown in Figures 19A and 19B, the tank 955 has one or more drain ports that are fluidly connected to a drain and channel the collected fluid away from the collection pan.

如圖中所標示，槽955的底部由點A界定，且內壁部950之內頂緣由點B界定，且外壁部960之外頂緣由點C界定。點A因此代表第一給定收集盤的最低點。點A、B、及C之間的關係為此實施例的一個重要態樣。 The bottom of the groove 955 is bounded by point A, the inner top edge of the inner wall portion 950 is bounded by point B, and the outer top edge of the outer wall portion 960 is bounded by point C, as indicated in the figure. Point A thus represents the lowest point of the first given collection pan. The relationship between points A, B, and C is an important aspect of this embodiment.

如圖中所示，第一收集盤910亦包括外蓋部915，其覆蓋界定在內壁部950與外壁部960之間的環形凹陷流體收集軌道。外蓋部915因此具有向下延伸的凸部，設置在第一收集盤910的這個環形凹陷流體收集軌道內。外蓋部915因此有效覆蓋槽955並防止任何流體流入槽955中。 As shown in the figure, the first collection tray 910 also includes an outer cover portion 915 covering the annular recessed fluid collection track defined between the inner wall portion 950 and the outer wall portion 960 . The outer cover part 915 thus has a downwardly extending protrusion, which is arranged within this annular recessed fluid collecting track of the first collecting pan 910 . The outer cover portion 915 thus effectively covers the slot 955 and prevents any fluid from flowing into the slot 955 .

雖未於第19A及19B圖的剖面圖中顯示，各收集盤可具有一對往外延伸的凸緣區，與收集盤130之往外延伸的該對凸緣區133類似。凸緣區較佳彼此相對設置(如相隔180度)並具有形成於其中之複數個開口(如開口134)。開口沿著凸緣區在其側壁之間間隔設置。在一所示實施例中，有接收工作活塞(如氣動(空氣)缸之端部)之三個開口，如參考第1~10圖之實施例所述般。在每一個凸緣區中還形成一額外的開口。這些開口的配置可與第1~10圖之開口134及135的配置相同或類似。 Although not shown in cross-section in FIGS. 19A and 19B , each collection pan may have a pair of outwardly extending flange areas similar to the pair of outwardly extending flange areas 133 of collection pan 130 . The flange areas are preferably positioned opposite each other (eg, 180 degrees apart) and have a plurality of openings (eg, 180 degrees apart) formed therein. opening 134). Openings are spaced along the flange region between its sidewalls. In one illustrated embodiment, there are three openings for receiving working pistons, such as the ends of pneumatic (air) cylinders, as described with reference to the embodiment of FIGS. 1-10. An additional opening is also formed in each flange area. The configuration of these openings may be the same as or similar to the configuration of the openings 134 and 135 in FIGS. 1-10 .

第19A圖顯示在升起位置中之第一收集盤910及外蓋部915，以及界定在升起的第一收集盤910/外蓋部915與降下的收集盤920、930、及940之間的第一收集室。如同前一個實施例，廢氣(空氣)可流經第一收集室經過第一通道到第二隔間907，然後經由第二通道離開至化學排氣口1080(第11圖)。 FIG. 19A shows first collection tray 910 and outer cover portion 915 in a raised position, and defined between raised first collection tray 910/outer cover portion 915 and lowered collection trays 920, 930, and 940 The first collection room. As in the previous embodiment, exhaust gas (air) may flow through the first collection chamber through the first channel to the second compartment 907, and then exit through the second channel to the chemical exhaust port 1080 (FIG. 11).

第19B圖顯示所有的收集盤及外蓋部915都在降下位置中。廢氣(空氣)仍可流經外蓋部915上方、經過第一通道到第二隔間907中，然後經由第二通道離開至化學排氣口1080(第11圖)。 Figure 19B shows all collection trays and outer cover portion 915 in the lowered position. Exhaust gases (air) can still flow over the outer cover portion 915, through the first channel into the second compartment 907, and then exit through the second channel to the chemical exhaust port 1080 (FIG. 11).

根據本發明，升起的第一收集盤910之槽955的底部(點A)位置低於第二收集盤920的點B(內壁部950的內頂緣)且點A較佳與點C(外壁部960的頂邊緣)相同高度或低於其。發明人發現上述點(區域)A、B、C之關係去除或大幅減少潑濺到第一收集室外的任何噴霧。此配置針對收集盤之其他位置也成立，其中升起的收集盤之點A低於正下方的降下收集盤的點B且升起的收集盤之點A具有與點C相等或較小的高度。 According to the present invention, the bottom (point A) of the groove 955 of the raised first collecting tray 910 is lower than the point B (the inner top edge of the inner wall portion 950) of the second collecting tray 920, and point A is preferably the same as point C. (the top edge of the outer wall portion 960) the same height or lower than it. The inventors have found that the above relationship of points (areas) A, B, C removes or substantially reduces any spray splashed outside the first collection chamber. This configuration is also true for other positions of the catch pan where point A of the raised catch pan is lower than point B of the lowered catch pan directly below and point A of the raised catch pan has an equal or smaller height to point C .

如先前第1~10圖的實施例般，將第二收集盤920上升到接觸升起的第一收集盤910同時第三及第四收集盤930及940在降下位置中界定出用以收集從晶圓排出的流體(如與用於第一收集室不同的流體(化學物質))之第二收集室。可在升起的盤910、920、及930與降下的第四收集盤940之間界定第三收集室。 As in the previous embodiments of FIGS. 1-10 , the second collection tray 920 is raised to contact the raised first collection tray 910 while the third and fourth collection trays 930 and 940 are in the lowered position to define a trap for collecting the A second collection chamber for wafer exhaust fluid (eg, a different fluid (chemical) than that used in the first collection chamber). A third collection chamber may be defined between the raised trays 910 , 920 , and 930 and the lowered fourth collection tray 940 .

可使用本文中所述的機構之一來個別且獨立地升起及降下收集盤810、820、830、及840。 Can be individually and independently raised and lowered using one of the mechanisms described herein Collection trays 810, 820, 830, and 840.

也應可理解收集盤910、920、930、及940可具有如第20圖中所示的構造，其中半徑沿著收集盤的圓周變化以產生至排水渠D1及D2的流動。 It should also be appreciated that collection pans 910, 920, 930, and 940 may have a configuration as shown in Figure 20, wherein the radius varies along the circumference of the collection pans to create flow to drains D1 and D2.

第14A至19B圖因此繪示可移動收集盤的各種構造，其包括用於排放收集到的流體之排水特徵(開口或排水管)並還具有點A、B、及C之間的關係，如本文中所表明，以防止流體潑濺到界定在升起的收集盤與正下方的另一個收集盤之間的收集室之外。事實上，藉由造成降下的收集盤之最內緣(點B)高於升起的收集盤之最底點A(在槽的區域)，橫向進入收集室流體會撞擊升起的收集盤之向下延伸的槽部，這阻擋收集到的流體沿著收集盤的外緣離開收集盤。升起的收集盤之向下延伸的槽(點A)作為進入收集室之流體的偏轉件或阻擋件，並界定迂迴流動路徑，使進入收集室的流體無法直接從入口跨到出口。如同先前的實施例般，設置具有類似或相同構造的多個收集室以收集於晶圓處理期間所用之不同的流體(不同的化學物質)。以控制方式(比如有關第1~10圖的實施例所述之方法)執行界定各個收集室之收集盤的升起及下降。尤其，可設置兩個氣動活塞以升起及降下各收集盤，且較低收集盤包括讓作用於位在上方之收集盤的氣動活塞通過之開口(比如在凸緣區)。 Figures 14A to 19B thus illustrate various configurations of removable collection pans that include drainage features (openings or drains) for draining collected fluid and also have relationships between points A, B, and C, such as Indicated herein to prevent fluid from splashing out of the collection chamber defined between a raised collection pan and another collection pan directly below. In fact, by causing the innermost edge (point B) of the lowered collection pan to be higher than the lowest point A (in the area of the trough) of the raised collection pan, fluid entering the chamber laterally will impinge on the raised collection pan. A downwardly extending groove that blocks collected fluid from exiting the collection pan along the outer edge of the collection pan. The downwardly extending groove of the raised collection pan (point A) acts as a deflector or barrier for fluid entering the collection chamber and defines a circuitous flow path so that fluid entering the collection chamber cannot cross directly from the inlet to the outlet. As with the previous embodiments, multiple collection chambers of similar or identical configuration are provided to collect different fluids (different chemicals) used during wafer processing. The raising and lowering of the collection trays defining the individual collection chambers is performed in a controlled manner, such as the method described in connection with the embodiment of FIGS. 1-10. In particular, two pneumatic pistons may be provided for raising and lowering each collection pan, and the lower collection pan comprises openings (for example in the flange area) through which the pneumatic pistons acting on the upper collection pans pass.

在所有的實施例中，當收集盤在降下位置中時，收集盤的頂緣會低於卡盤110。相反地，當收集盤在升起位置中時，收集盤的頂緣會高於卡盤110。另外，設有廢氣通道，且其在形成收集室時保持暢通。 In all embodiments, the top edge of the collection tray is lower than the chuck 110 when the collection tray is in the lowered position. Conversely, when the collection tray is in the raised position, the top edge of the collection tray will be higher than the chuck 110 . In addition, an exhaust gas channel is provided and remains unobstructed while forming the collection chamber.

茲參照第14A~12B及20圖，其中繪示本發明的另一態樣。第20圖顯示收集盤(410、420、430、440)的概略示意圖(上視圖)。收集盤包括互相間隔之第一及第二排水渠D1及D2(如D1及D2間隔180度)。如上所述，排水渠D1及D2與形成在收集盤中的槽流體連通以排出收集到的流體。如前述，收集盤具有環形且在兩個排水渠D1及D2之間有第一環形區以及在兩個排水渠D1及D2之間有相對的第二環形區。第一及第二環形區各建構成具有變化的曲率半徑，詳言之，內壁部443與外壁部444之間的角度沿著環形區在朝排水渠D1及D2之一的方向中變化。例如，最大半徑(R1)可位在排水渠D1及D2之間(如與排水渠D1及D2等距離)而減少的半徑(R2)位在最大半徑(R1)的區域與一排水渠D1及D2之間。第18A圖顯示在R1區域中之收集盤(壁之間較大角度)，而第18B圖顯示在R2區域中之收集盤(壁之間較小角度)。藉由在各排水渠D1及D2旁提供減少半徑(R2)的區域，流體會從最大半徑(R1)的區域自然地流至排水渠D1及D2(歸因於收集盤坡度的改變一其漏斗式引導流體至排水渠D1及D2)。此構造因此確保流體在收集室的槽內流動至排水渠D1及D2。 Reference is now made to Figures 14A-12B and Figure 20, which illustrate another aspect of the present invention. Figure 20 shows a schematic diagram (top view) of a collection tray (410, 420, 430, 440). The collecting tray includes first and second drains D1 and D2 spaced apart from each other (for example, D1 and D2 are separated by 180 degrees). as above As described above, drains D1 and D2 are in fluid communication with grooves formed in the collection pan to drain collected fluid. As before, the collecting pan has an annular shape with a first annular area between the two drains D1 and D2 and an opposite second annular area between the two drains D1 and D2. Each of the first and second annular regions is configured to have a varying radius of curvature, in particular, the angle between the inner wall portion 443 and the outer wall portion 444 varies along the annular region in a direction toward one of the drains D1 and D2. For example, the largest radius (R1) can be located between (eg, equidistant from) drains D1 and D2 and the reduced radius (R2) is located in the area of largest radius (R1) in relation to a drain D1 and Between D2. Figure 18A shows the collection tray in the R1 region (larger angle between walls), while Figure 18B shows the collection tray in the R2 region (smaller angle between walls). By providing an area of reduced radius (R2) next to each drain D1 and D2, fluid will flow naturally from the area of maximum radius (R1) to drains D1 and D2 (due to the change in slope of the collection pan - its funnel direct the fluid to drains D1 and D2). This configuration thus ensures fluid flow within the grooves of the collection chamber to the drains D1 and D2.

最大半徑(R1)的一示範區域係由以約70°的角度所形成之槽內壁部和以約60°的角度所形成之槽外壁部所界定。減少半徑(R2)的一示範區域係由以約75°的角度所形成之槽內壁部和以約70°的角度所形成之槽外壁部所界定。 An exemplary region of maximum radius (R1) is bounded by groove inner wall portions formed at an angle of about 70° and groove outer wall portions formed at an angle of about 60°. An exemplary region of reduced radius (R2) is bounded by groove inner wall portions formed at an angle of about 75° and groove outer wall portions formed at an angle of about 70°.

第21圖繪示根據另一替代實施例之收集盤(杯)配置1100並反映混合設計，其中堆疊至少兩個收集室(槽)，且至少一收集室與其他者同心但不堆疊，如下所示。配置1100與本文中所述的其他配置類似。尤其，收集盤配置1100包括可在完全升起位置與完全降下位置之間(還有在這兩者之間的位置)移動的可移動防濺擋板1102。如同其他實施例般，防濺擋板1102具有一垂直外壁1104及一向內傾斜壁1106。防濺擋板1102還具有向下延伸內壁1105，其與外壁1104隔開以在兩者間界定一空間。 Figure 21 shows a collection tray (cup) configuration 1100 according to another alternative embodiment and reflects a hybrid design where at least two collection chambers (troughs) are stacked and at least one collection chamber is concentric with the others but not stacked, as follows Show. Configuration 1100 is similar to other configurations described herein. In particular, the catch pan configuration 1100 includes a movable splash guard 1102 that is movable between a fully raised position and a fully lowered position (and positions in between). Like the other embodiments, the splashback 1102 has a vertical outer wall 1104 and an inwardly sloping wall 1106 . The splashback 1102 also has a downwardly extending inner wall 1105 that is spaced from the outer wall 1104 to define a space therebetween.

亦設置一大致上呈Y形之可移動第一收集盤(杯)1120。該第一收集盤1120包括經配置成收容在內壁1105與外壁1104間的空間內的外壁1122。第一收集盤1120還具有與外壁1122隔開之內壁1123。第一槽區1125形成在外壁1122與內壁1123之間。內壁1123具有延伸至第一槽區1125下方之底部1126。不像某些其他實施例，第一槽區1125並無圓角或實質上平坦的底板，而是較V形並包括傾斜底板壁1127。如所示，在此傾斜底板壁1127內可形成導至排水渠260之開口。此開口因此呈現一角度設置。 A substantially Y-shaped movable first collecting tray (cup) 1120 is also provided. Should The first collection tray 1120 includes an outer wall 1122 configured to be received in the space between the inner wall 1105 and the outer wall 1104 . The first collection tray 1120 also has an inner wall 1123 spaced from the outer wall 1122 . The first groove area 1125 is formed between the outer wall 1122 and the inner wall 1123 . The inner wall 1123 has a bottom 1126 extending below the first groove area 1125 . Unlike some other embodiments, the first well 1125 does not have rounded corners or a substantially flat floor, but is rather V-shaped and includes sloped floor walls 1127 . As shown, an opening leading to the drain 260 may be formed in this sloped floor wall 1127 . The opening thus assumes an angular arrangement.

可移動第二收集盤(杯)1130位在在第一收集盤1120徑向內部。可移動第二收集盤1130包括第一向上延伸外壁1132及中間壁1134，和界定在壁1132及1134之間的第二槽區1135。盤1130包括向下延伸內壁1136，與中間壁1134相隔一開放空間，其界定在內壁1136與中間壁1134之間。第二槽區1135部分界定第二收集室。 The movable second collecting tray (cup) 1130 is located radially inward of the first collecting tray 1120 . The movable second collecting tray 1130 includes a first upwardly extending outer wall 1132 and a middle wall 1134 , and a second tank area 1135 defined between the walls 1132 and 1134 . The tray 1130 includes a downwardly extending inner wall 1136 separated from the middle wall 1134 by an open space defined between the inner wall 1136 and the middle wall 1134 . The second tank area 1135 partially defines the second collection chamber.

如所示，第一收集杯1120的底部1126設置在第二槽區1135的空間內。 As shown, the bottom 1126 of the first collection cup 1120 is disposed within the space of the second well 1135 .

可移動第三收集盤(杯)1140設置於並位在第二收集盤1130徑向內部。可移動第三收集盤1140包括向上延伸外壁1142及與外壁1142隔開之向上延伸內壁1144，以界定第三槽區1145。第三槽區1145部分界定第三收集室。 The movable third collecting tray (cup) 1140 is disposed and located radially inside the second collecting tray 1130 . The movable third collecting tray 1140 includes an upwardly extending outer wall 1142 and an upwardly extending inner wall 1144 separated from the outer wall 1142 to define a third tank area 1145 . The third tank area 1145 partially defines a third collection chamber.

如所示，第二收集盤1130的內壁1136設置在第三槽區1145內。不像第一收集盤1120的傾斜槽區1125，第二槽區1135及第三槽區1145與先前實施例的槽較相似，其不以一角度設置。排水渠260與第二槽區1135及第三槽區1145流體連通。 As shown, the inner wall 1136 of the second collection pan 1130 is disposed within the third well 1145 . Unlike the inclined trough 1125 of the first collecting tray 1120, the second trough 1135 and the third trough 1145 are more similar to the troughs of the previous embodiment, which are not arranged at an angle. The drain 260 is in fluid communication with the second tank area 1135 and the third tank area 1145 .

如同先前的實施例般，個別杯及收集外蓋的表面設計成在個別杯打開並從旋轉的晶圓收集流體時防止外漏。尤其，內壁1105及外壁1122定向成當外蓋1102升起且流體進入第一槽1125中時，內壁1105的向下傾斜的本質以及其相對於外壁1122的位置有效防止從此收集槽(杯)外漏。同樣地，內壁1126與外壁1132之間還有內壁1136與外壁1142之間存在相同的關係。如前述，配置1100為混合設計，其中第一收集盤1120及第二收集盤1130為堆疊(彼此嵌套)，這可見於第一收集盤1120相對於第二收集盤1130在不同高度且第一槽(第一收集室)1125位在第二槽(第二收集室)上方，藉此形成堆疊型收集盤配置。相反地，第三收集盤1140相對第二收集盤1130及第一收集盤1120以非堆疊方式同心設置，使第三槽(第三收集室)1145並未相對於另外兩個收集室堆疊，這可由在收集室閉合位置中第三收集室並非位在第二收集室1135下方而係與其同心且徑向偏移所證明。 As with the previous embodiments, the surfaces of the individual cups and collection cover are designed to prevent leakage when the individual cups are open and collect fluid from the spinning wafer. In particular, inner wall 1105 and outer wall 1122 are oriented such that when outer cover 1102 is raised and fluid enters first groove 1125, the downward slope of inner wall 1105 The nature and its position relative to the outer wall 1122 effectively prevents leakage from this collection trough (cup). Likewise, the same relationship exists between inner wall 1126 and outer wall 1132 and between inner wall 1136 and outer wall 1142 . As previously mentioned, the configuration 1100 is a hybrid design in which the first collection tray 1120 and the second collection tray 1130 are stacked (nested within each other), which can be seen in the fact that the first collection tray 1120 is at a different height relative to the second collection tray 1130 and that the first The tank (first collection chamber) 1125 is located above the second tank (second collection chamber), thereby forming a stacked collection tray configuration. On the contrary, the third collection tray 1140 is arranged concentrically with respect to the second collection tray 1130 and the first collection tray 1120 in a non-stacked manner, so that the third groove (the third collection chamber) 1145 is not stacked relative to the other two collection chambers, which This is evidenced by the fact that the third collection chamber is not located below the second collection chamber 1135 but is concentric and radially offset therewith in the collection chamber closed position.

茲參照第22A至22D圖，其中繪示根據另一替代實施例之收集盤(杯)配置1200並反映一種混合設計，其中堆疊至少兩個收集室(槽)，且至少一收集室與其他收集室同心但不堆疊，如下所示。如先前實施例般，個別杯及收集蓋的表面設計成在個別杯打開並從旋轉的晶圓收集流體時防止外漏。 Reference is now made to Figures 22A to 22D, which illustrate a collection tray (cup) configuration 1200 according to another alternative embodiment and reflect a hybrid design in which at least two collection chambers (troughs) are stacked, and at least one collection chamber is integrated with the other collection chambers. The chambers are concentric but not stacked, as shown below. As with previous embodiments, the surfaces of the individual cups and collection caps are designed to prevent leakage when the individual cups are open and collect fluid from the spinning wafer.

如下所述，收集盤配置1200具有三個分別的收集室(流體收集槽)，第22A繪示閉合位置；第22B圖繪示第一收集室打開，同時第二及第三收集室閉合；第22C圖繪示第二收集室打開，同時第一及第三收集室閉合；以及第22D圖繪示第三收集室打開，同時第一及第二收集室閉合。 As described below, the collection tray configuration 1200 has three separate collection chambers (fluid collection tanks), Figure 22A shows the closed position; Figure 22B shows the first collection chamber open while the second and third collection chambers are closed; Figure 22C shows the second collection chamber open while the first and third collection chambers are closed; and Figure 22D shows the third collection chamber open while the first and second collection chambers are closed.

該收集盤配置1200與本文所述的配置1100類似。尤其，收集盤配置1200包括可在完全升起位置與完全降下位置之間(還有在這兩者之間的位置)移動的可移動收集蓋1202。如同其他實施例般，收集蓋1202具有一垂直外壁1204及一向內傾斜壁1206。收集蓋1202還具有向下延伸內壁1205，其與外壁1204隔開以在兩者間界定一空間。 The collection tray configuration 1200 is similar to the configuration 1100 described herein. In particular, collection tray arrangement 1200 includes a movable collection cover 1202 that is movable between a fully raised position and a fully lowered position (and positions in between). Like the other embodiments, the collection cap 1202 has a vertical outer wall 1204 and an inwardly inclined wall 1206 . Collection cap 1202 also has a downwardly extending inner wall 1205 that is spaced from outer wall 1204 to define a space therebetween.

亦設置一大致上呈Y形之可移動第一收集盤(杯)1220。該第一收集盤1220包括經配置以收容在內壁1205與外壁1204間的空間內的外壁1222。第一收集盤1220還具有與外壁1222隔開之內壁1223。第一槽區1225形成在外壁1222與內壁1223之間。內壁1223具有延伸至第一槽區1225下方之底部1226。如同其他實施例般，第一槽區1225具有導至排水渠之至少一開口。 A substantially Y-shaped movable first collecting tray (cup) 1220 is also provided. Should The first collection tray 1220 includes an outer wall 1222 configured to be received in the space between the inner wall 1205 and the outer wall 1204 . The first collection tray 1220 also has an inner wall 1223 spaced from the outer wall 1222 . The first groove area 1225 is formed between the outer wall 1222 and the inner wall 1223 . The inner wall 1223 has a bottom 1226 extending below the first groove area 1225 . As with other embodiments, the first tank area 1225 has at least one opening leading to a drain.

一可移動多收集盤(杯)1230係設在第一收集盤1220的徑向內側。該第一收集盤1230包括第一向上延伸外壁1232及中間壁1234，和界定在壁1232及1234之間的第二槽區1235。第一收集盤1230包括向上延伸內壁1236，與中間壁1234相隔一開放空間，並第三槽區1237。因此由相同的盤1230界定兩槽區(兩收集室)，不像先前實施例般，其中一個收集盤僅包括一個收集室(槽)。第二及第三槽區1235及1237因此以並排方式定向。如其他實施例般，每一個收集室包括導至排水渠之至少一排水口。 A movable multi-collection tray (cup) 1230 is arranged radially inside the first collection tray 1220 . The first collecting tray 1230 includes a first upwardly extending outer wall 1232 and a middle wall 1234 , and a second tank area 1235 defined between the walls 1232 and 1234 . The first collecting tray 1230 includes an inner wall 1236 extending upwards, separated from the middle wall 1234 by an open space, and a third tank area 1237 . Two tank areas (two collection chambers) are thus delimited by the same disc 1230, unlike the previous embodiment where one collection disc only includes one collection chamber (slot). The second and third tubs 1235 and 1237 are thus oriented side-by-side. As with other embodiments, each collection chamber includes at least one drain leading to a drain.

內環1240位在盤1230的徑向內部並代表如下所述的固定且經配置以閉合第三槽1237之環形結構。 Inner ring 1240 is located radially inward of disc 1230 and represents an annular structure fixed and configured to close third groove 1237 as described below.

排水渠，如排水渠260，與槽1225、1235、及1237連通。 A drain, such as drain 260 , communicates with tanks 1225 , 1235 , and 1237 .

如前述，該收集盤配置1200為混合設計，其中第一收集盤1220及盤1230為堆疊(彼此嵌套)，這可見於第一收集盤1220相對於收集盤1230在不同高度且第一槽(第一收集室)1225位在第二槽(第二收集室)1235上方，藉此形成堆疊型收集盤配置。同時，第三槽1237相對第二槽1235為同心定向且事實上可與其平面。槽1235及1237因此未彼此堆疊而係彼此同心且徑向偏移。 As previously mentioned, the collection tray configuration 1200 is a hybrid design in which the first collection tray 1220 and the trays 1230 are stacked (nested into each other), which can be seen in the fact that the first collection tray 1220 is at a different height relative to the collection tray 1230 and that the first slot ( The first collection chamber) 1225 is located above the second tank (second collection chamber) 1235, thereby forming a stacked collection tray configuration. At the same time, the third slot 1237 is oriented concentrically with respect to the second slot 1235 and may in fact be planar therewith. Slots 1235 and 1237 are thus not stacked on top of each other but are concentric and radially offset from each other.

第22A圖繪示收集蓋1202、第一收集盤1220和多室收集盤1230及環1240處於閉合位置，藉此沒有一個收集室(槽1225、1235、1237)為打開。第22B圖繪示相對第一收集盤1220、多室收集盤1230及環1240，收集蓋1202為升起，藉此打開第一收集室(第一槽1225)，而其他收集室為閉合。流體收集在第一槽1225中並從該處排離。應可見到外壁1232不會干擾第一槽1225的排水。第22C圖繪示相對多室收集盤1230及環1240，收集蓋1202及第一收集盤1220為升起，藉此打開第二收集室(第二槽1235)，而其他收集室為閉合。流體收集在第二槽1235中並從該處排離。第22D圖繪示相對環1240，收集蓋1202、第一收集盤1220、及多室收集盤1230及為升起，藉此打開第三收集室(第三槽1237)，而其他收集室為閉合。流體收集在第三槽1237中並從該處排離。 Figure 22A shows the collection cover 1202, first collection tray 1220 and multi-chambered collection tray 1230 and ring 1240 in a closed position whereby none of the collection chambers (slots 1225, 1235, 1237) are open. Fig. 22B shows relative to the first collection tray 1220, the multi-chamber collection tray 1230 and the ring 1240, the collection The collection cover 1202 is raised, thereby opening the first collection chamber (first groove 1225), while the other collection chambers are closed. Fluid collects in the first tank 1225 and drains therefrom. It should be seen that the outer wall 1232 does not interfere with the drainage of the first slot 1225 . Figure 22C shows the collection cover 1202 and the first collection tray 1220 raised relative to the multi-chamber collection tray 1230 and ring 1240, thereby opening the second collection chamber (second slot 1235), while the other collection chambers are closed. Fluid collects in the second tank 1235 and drains therefrom. Figure 22D shows the collection cover 1202, the first collection tray 1220, and the multi-chamber collection tray 1230 raised relative to the ring 1240, thereby opening the third collection chamber (third groove 1237), while the other collection chambers are closed . Fluid collects in third tank 1237 and drains therefrom.

在第22A~22D圖的實施例中，收集盤以堆疊組態配置且本實施例與其他實施例的一個差別在於從卡盤驅離的流體全都會被收集盤(杯)所捕捉。尤其，如第6圖中所示，在打開的收集杯上方的杯子並未延伸到打開的杯子中。這與第21圖的實施例不同，其中特徵1105、1135、及1136阻止流體被驅離或如其中上方杯子延伸到下方杯子之中的其他實施例中所揭露般。 In the embodiment of FIGS. 22A-22D , the collection trays are configured in a stacked configuration and one difference between this embodiment and the other embodiments is that all fluid dislodged from the chucks is captured by the collection trays (cups). In particular, as shown in Figure 6, the cup above the open collection cup does not extend into the open cup. This is in contrast to the embodiment of Fig. 21, where features 1105, 1135, and 1136 prevent fluid from being driven away or as disclosed in other embodiments where the upper cup extends into the lower cup.

第23A及23B圖顯示一替代排氣系統1900，其僅包括單一個排氣口而與先前實施例的至少一些(其中顯示兩個排氣系統)不同。尤其，單一排氣口與前面有關其他實施例所述之化學排氣口類似。應可理解到所示之收集杯配置本質上僅示範性且單一排氣系統1900可與本文中揭露的任何其他收集杯配置一起使用。 Figures 23A and 23B show an alternative exhaust system 1900 that includes only a single exhaust port as opposed to at least some of the previous embodiments (where two exhaust systems are shown). In particular, the single vent is similar to the chemical vent described above with respect to other embodiments. It should be understood that the collection cup configuration shown is merely exemplary in nature and that the single exhaust system 1900 may be used with any other collection cup configuration disclosed herein.

在1910顯示單一排氣導管，且同樣地與本文中所揭露的化學排氣配置類似。排氣導管1910可包含任何數量之不同的結構，包括如圖中所示的通道或導管。如下所述，排氣導管1910接收廢氣並將之導離晶圓處理裝置。 A single exhaust conduit is shown at 1910, and is likewise similar to the chemical exhaust configuration disclosed herein. Exhaust conduit 1910 may comprise any number of different structures, including channels or conduits as shown. Exhaust conduit 1910 receives exhaust gas and directs it away from the wafer processing apparatus, as described below.

顯示防濺擋板1920且其與本文中所述的類似。防濺擋板1920 具有頂傾斜壁1922及垂直外壁1924。防濺擋板1920垂直移動於第23A圖中所示的打開位置與第23B圖中所示的閉合(降下)位置之間。 A splashback 1920 is shown and is similar to that described herein. Splashback 1920 It has a top inclined wall 1922 and a vertical outer wall 1924 . The splash guard 1920 moves vertically between an open position shown in Figure 23A and a closed (lowered) position shown in Figure 23B.

如上所述，防濺擋板1920圍繞一收集杯配置，其可具有任何數量的不同形式，包括本文中所述的那些。僅為了例示，收集杯配置顯示成包含收集蓋1930、第一收集杯1940、第二收集杯1950、及第三收集杯1960。這些元件可具有本文針對其他收集杯配置所揭露之特支。 As noted above, the splash guard 1920 is configured around a collection cup, which can take any number of different forms, including those described herein. For illustration only, a collection cup configuration is shown including a collection cap 1930 , a first collection cup 1940 , a second collection cup 1950 , and a third collection cup 1960 . These elements may have the characteristics disclosed herein for other collection cup configurations.

根據本發明，在防濺擋板1920的打開位置中，排氣通道1970打開。透過其廢氣可流到排氣導管1910。排氣通道1970與排氣導管1910的內部流體連通，因此當防濺擋板1920在打開位置中時，廢氣可行經防濺擋板，沿著外壁1924，然後到達通道1970，接著最後進入排氣導管1910中。廢氣亦可通過收集杯配置所創造之打開的收集室，然後流到通道1970中。換言之，當防濺擋板1920在打開位置中時，空氣(廢氣)可流過防濺擋板並透過通道1970流入排氣導管1910。 According to the invention, in the open position of the splash guard 1920 the exhaust channel 1970 is open. Exhaust gas can flow through it to the exhaust duct 1910 . Exhaust passage 1970 is in fluid communication with the interior of exhaust conduit 1910 so that when splash guard 1920 is in the open position, exhaust gases can pass through the splash guard, along outer wall 1924, then to passage 1970, and finally into the exhaust Catheter 1910. Exhaust gases can also pass through the open collection chamber created by the collection cup configuration and then flow into channel 1970 . In other words, when the splash guard 1920 is in the open position, air (exhaust) can flow through the splash guard and into the exhaust conduit 1910 through the passage 1970 .

相反地，如第23B圖中所示，當防濺擋板1920在閉合位置中時，降下的防濺擋板1920關閉排氣通道1970，因而限制廢氣流入排氣導管1910中。 Conversely, as shown in FIG. 23B , when the splash guard 1920 is in the closed position, the lowered splash guard 1920 closes the exhaust passage 1970 , thereby restricting the flow of exhaust gas into the exhaust conduit 1910 .

因此熟悉此技藝者應可理解防濺擋板1920升起的程度會界定廢氣可流入排氣導管1910並從該處抽離的量。因此，使用者可藉由將防濺擋板1920定位在完全打開位置(第23A圖)與完全打開位置(第23B圖)之間的一希望的位置來有效「節流」所抽離之廢氣量。這允許控制本發明之排氣系統。 Those skilled in the art will therefore appreciate that the degree to which the splash guard 1920 is raised defines the amount of exhaust gas that can flow into the exhaust duct 1910 and be drawn away therefrom. Thus, the user can effectively "throttle" the extracted exhaust by positioning the splash guard 1920 at a desired position between the fully open position (FIG. 23A) and the fully open position (FIG. 23B). quantity. This allows control of the exhaust system of the invention.

注意到上述圖示及範例不意在將本發明的範圍限制於單一實施例，透過交換所述或所示之元件的一些或全部可有其他實施例。此外，在可使用已知構件部分或全部實施本發明的某些元件之情況中，僅敘述為了了解本發明所需之這種已知構件的那些部分，並省略這種已知構件的其他部分之詳細說明以避免混淆本發明。在本說明書中，顯示單一構件的實施例不絕對限於包括複數個該相同構件的其他實施例，反之亦然，除非本文中另有所指。此外，申請人不欲使說明書或專利範圍中的任何術語有罕見或特別意思，除非另有提出。另外，本發明藉由舉例涵蓋本文中所參照的已知構件之目前及未來已知的等效者。 Note that the above illustrations and examples are not intended to limit the scope of the invention to a single embodiment, and that other embodiments are possible by interchange of some or all of the elements described or illustrated. Furthermore, in cases where certain elements of the present invention can be partially or fully implemented using known components, it is only described as Those parts of such known components are necessary to understand the present invention, and detailed descriptions of other parts of such known components are omitted to avoid obscuring the present invention. In this specification, an embodiment showing a single component is not absolutely limited to other embodiments comprising a plurality of that same component, and vice versa, unless otherwise indicated herein. Furthermore, applicants do not intend for any term in the specification or claims to be ascribed an uncommon or special meaning unless otherwise indicated. Additionally, the present invention encompasses, by way of example, present and future known equivalents to known elements referred to herein.

特定實施例之前述說明如此完整地揭露本發明之上位本質，致使他人應用相關技藝之技術內的知識(包括本文中索引用且包括之文獻內容)可在無須過度實驗下針對各種應用輕易變更並/或調適這種特定實施例，而不背離本發明之上位概念。基於本文所呈現之教示及引導，這種調適及變更因此應落在所揭露實施例之意義及等效範圍內。應了解到本文中的用語或術語僅作為說明而非限制用，故應由熟悉技藝者鑑於本文所呈現之教示及引導並結合熟悉此技藝者之知識來解釋本說明書之用語或術語。 The foregoing descriptions of specific embodiments so fully disclose the general nature of the invention that others using knowledge in the art of the relevant art (including the contents of the documents referenced and included herein) can be readily modified and adapted for various applications without undue experimentation. and/or adapt such specific embodiments without departing from the overarching concept of the invention. Such adaptations and changes are therefore intended to be within the meaning and range of equivalents of the disclosed embodiments, based on the teaching and guidance presented herein. It should be understood that the terminology or terminology herein is only used for illustration rather than limitation, and therefore, the terminology or terminology in this specification should be interpreted by those skilled in the art in light of the teaching and guidance presented herein and in combination with the knowledge of those skilled in the art.

雖已於上說明了本發明的各種實施例，應可了解到是以舉例而非限制方式來呈現這些實施例。熟悉此技藝人士顯然可做出形式與細節上的各種改變而不背離本發明的精神及範疇。故本發明不應受限於任何上述的示範實施例，而僅應根據下列申請專利範圍及其等效者而定。 While various embodiments of the invention have been described above, it should be understood that these embodiments have been presented by way of example, and not limitation. It will be apparent to those skilled in the art that various changes in form and detail can be made without departing from the spirit and scope of the invention. Therefore, the present invention should not be limited to any of the above-mentioned exemplary embodiments, but should only be determined according to the following claims and their equivalents.

34‧‧‧間隙 34‧‧‧Gap

110‧‧‧旋轉卡盤 110‧‧‧rotary chuck

112‧‧‧馬達 112‧‧‧motor

115‧‧‧晶圓 115‧‧‧Wafer

120‧‧‧配送臂 120‧‧‧Distribution arm

130、140‧‧‧收集盤 130, 140‧‧‧collection plate

200‧‧‧歧管 200‧‧‧manifold

300‧‧‧活塞 300‧‧‧Pistons

Claims

一種晶圓處理系統，包含：一腔室外殼；一可旋轉晶圓支撐件，用於支撐一晶圓；複數個可獨立移動的收集盤，其係圍繞該晶圓支撐件的外圍邊緣設置，該等收集盤係以一堆疊組態配置，各收集盤具有一用於收集流體的收集區，其中該等收集盤中的至少一者具有一與該用於排出收集到的流體之收集區流體連通的排水口；以及一驅動機構，用於選擇性地且獨立地移動該等收集盤中之一或多者至該晶圓支撐件上方的一升起位置，以界定一形成在該至少一升起的收集盤與一降下的收集盤之間的收集室，該收集室係經配置以收集於晶圓處理期間自該晶圓排出的流體，並將該收集到的流體導送通過該降下的收集盤之排水口；一腔室排氣口，其係形成在該外殼中以將氣體從該外殼內部排出到該等收集盤之外，其中該化學排氣口係自該複數個收集盤徑向往外設置；以及一化學排氣口，其係形成在該外殼中以將流經該收集室至該化學排氣口之氣體排出；其中該化學排氣口與該腔室排氣口流體隔離，且該複數個收集盤界定出與該化學排氣口流體連通之複數個化學排氣流動路徑。 A wafer processing system comprising: a chamber housing; a rotatable wafer support for supporting a wafer; a plurality of independently movable collection trays disposed around a peripheral edge of the wafer support, The collection trays are arranged in a stacked configuration, each collection tray having a collection area for collecting fluid, wherein at least one of the collection trays has a collection area fluid with the collection area for draining the collected fluid a communicating drain; and a drive mechanism for selectively and independently moving one or more of the collection trays to a raised position above the wafer support to define a A collection chamber between a raised collection tray and a lowered collection tray, the collection chamber being configured to collect fluid drained from the wafer during wafer processing and directing the collected fluid through the lowered collection tray the drain of the collection pan; a chamber vent formed in the housing to discharge gas from the interior of the housing to outside the collection pans, wherein the chemical vent is from the plurality of collection pans radially outwardly disposed; and a chemical vent formed in the housing to discharge gas flowing through the collection chamber to the chemical vent; wherein the chemical vent is fluidly connected to the chamber vent isolated, and the plurality of collection pans define a plurality of chemical exhaust flow paths in fluid communication with the chemical exhaust port.

如申請專利範圍第1項之晶圓處理系統，進一步包括：一防濺擋板，其係圍繞該晶圓支撐件的外圍邊緣設置，並可在一升起位置與一降下位置之間移動；其中該化學排氣口亦將沿著界定在於該升起位置中之該防濺擋板與該降下位置中之該等收集盤之間的一流動路徑所流動的氣體排出。 The wafer processing system according to claim 1 of the scope of the patent application further includes: a splash guard, which is arranged around the peripheral edge of the wafer support and can move between a raised position and a lowered position; wherein the chemical vent will also be along the splash guard defined in the raised position Gas flowing in a flow path with the collection pans in the lowered position is exhausted.

如申請專利範圍第1項之晶圓處理系統，其中該驅動機構包含設置在該等收集盤下方的至少一第一對活塞，各活塞可移動於一收起位置與一延伸位置之間，在該收起位置中所有該等收集盤彼此密切接觸，且在該延伸位置中至少一收集盤係移至該升起位置並在其之間形成該收集室。 For example, the wafer processing system of claim 1, wherein the drive mechanism includes at least one first pair of pistons arranged under the collection trays, each piston can move between a retracted position and an extended position, in In the stowed position all the collection trays are in intimate contact with each other, and in the extended position at least one collection tray is moved to the raised position and forms the collection chamber therebetween.

如申請專利範圍第3項之晶圓處理系統，其中該收集室係界定在所述升起的收集盤之一下側與位在該升起的收集盤正下方之所述降下的收集盤之一上表面之間。 The wafer processing system according to claim 3 of the patent application, wherein the collection chamber is defined on the underside of one of the raised collection trays and one of the lowered collection trays directly below the raised collection trays between the upper surfaces.

如申請專利範圍第1項之晶圓處理系統，其中該複數個收集盤包含至少三個收集盤，其界定彼此分離之至少兩個不同的收集室。 The wafer processing system according to claim 1, wherein the plurality of collection trays comprises at least three collection trays defining at least two different collection chambers separated from each other.

如申請專利範圍第1項之晶圓處理系統，其中該複數個收集盤包含至少四個收集盤，其界定彼此分離之至少三個不同的收集室。 The wafer processing system according to claim 1, wherein the plurality of collection trays comprises at least four collection trays defining at least three different collection chambers separated from each other.

如申請專利範圍第1項之晶圓處理系統，其中各收集盤的主收集部具有V形。 For example, the wafer processing system of item 1 of the scope of the patent application, wherein the main collection part of each collection plate has a V shape.

如申請專利範圍第1項之晶圓處理系統，其中各收集盤具有一內壁部及一外壁部，其匯聚以界定一用於收集流體之槽區，該內壁部比該外壁部更接近該晶圓支撐件，該收集盤具有一與該槽區流體連通並用於排放收集到的流體之出口，其中該槽區的一底緣(A)界定該收集盤的最底點，該內壁部具有一頂緣(B)且該外壁部具有一頂緣(C)；其中該升起的收集盤之底緣(A)係低於所述降下的收集盤之內壁部之頂緣(B)，且該升起的收集盤之底緣(A)係位於一等於或低於該外壁部之頂緣(C)的高度處。 Such as the wafer processing system of claim 1, wherein each collecting tray has an inner wall portion and an outer wall portion that converge to define a tank area for collecting fluid, and the inner wall portion is closer to the outer wall portion The wafer support, the collection tray has an outlet in fluid communication with the trough for discharging collected fluid, wherein a bottom edge (A) of the trough defines the lowest point of the collection tray, the inner wall portion has a top edge (B) and the outer wall portion has a top edge (C); wherein the bottom edge (A) of the raised collection tray is lower than the top edge of the inner wall portion of the lowered collection tray ( B) and the bottom edge (A) of the raised collecting tray is at a height equal to or lower than the top edge (C) of the outer wall.

如申請專利範圍第8項之晶圓處理系統，其中該內壁部的寬度大於該外壁部的寬度。 The wafer processing system according to claim 8 of the patent application, wherein the width of the inner wall is greater than the width of the outer wall.

一種晶圓處理系統，包含：一腔室外殼；一可旋轉晶圓支撐件，用於支撐一晶圓；複數個可獨立移動的收集盤，其係圍繞該晶圓支撐件的外圍邊緣設置，該等收集盤係以一堆疊組態配置，各收集盤具有一用於收集流體的收集區，其中該等收集盤中的至少一者具有一與該用於排出收集到的流體之收集區流體連通的排水口；一驅動機構，用於選擇性地且獨立地移動該等收集盤中之一或多者至該晶圓支撐件上方的一升起位置，以界定一形成在該至少一升起的收集盤與一降下的收集盤之間的收集室，該收集室係經配置以收集於晶圓處理期間自該晶圓排出的流體，並將該收集到的流體導送通過該降下的收集盤之排水口；一化學排氣口，其係形成在該外殼中以將流經該收集室至該化學排氣口之氣體排出；以及一圍繞該晶圓支撐件之收集盤外殼，且其中設置複數個收集盤，該收集盤外殼界定一與該化學排氣口流體連通之排氣口，以允許吸引氣體經過該收集室至該化學排氣口。 A wafer processing system comprising: a chamber housing; a rotatable wafer support for supporting a wafer; a plurality of independently movable collection trays disposed around a peripheral edge of the wafer support, The collection trays are arranged in a stacked configuration, each collection tray having a collection area for collecting fluid, wherein at least one of the collection trays has a collection area fluid with the collection area for draining the collected fluid a communicating drain; a drive mechanism for selectively and independently moving one or more of the collection trays to a raised position above the wafer support to define a A collection chamber between a raised collection tray and a lowered collection tray, the collection chamber configured to collect fluid drained from the wafer during wafer processing and direct the collected fluid through the lowered collection tray a drain of the collection tray; a chemical exhaust port formed in the housing to exhaust gases flowing through the collection chamber to the chemical exhaust port; and a collection tray housing surrounding the wafer support, and A plurality of collection pans are provided, and the collection pan housing defines an exhaust port in fluid communication with the chemical exhaust port to allow gas to be drawn through the collection chamber to the chemical exhaust port.

如申請專利範圍第10項之晶圓處理系統，其中該收集盤外殼包括一內分隔壁，其將該收集盤外殼分隔成其中設置該複數個收集盤的一第一隔室以及自該第一隔室徑向往外設置並包括該排氣口的一第二隔室。 Such as the wafer processing system of claim 10, wherein the collection tray housing includes an inner partition wall, which separates the collection tray housing into a first compartment in which the plurality of collection trays are arranged and from the first The compartment is disposed radially outwardly and includes a second compartment of the vent.

如申請專利範圍第11項之晶圓處理系統，其中由該內分隔壁係界定一第一通道以因該收集室對該第一通道開放而讓氣體從該第一隔室流到該第二隔室，且該第二隔室包括一導向該排氣口之第二通道。 A wafer processing system as claimed in claim 11, wherein a first channel is defined by the inner partition wall to allow gas to flow from the first compartment to the second channel because the collection chamber is open to the first channel compartment, and the second compartment includes a second passage leading to the exhaust port.

如申請專利範圍第12項之晶圓處理系統，其中當該複數個收集盤皆在降下位置時，氣體係經由該第一通道流過一最上面的收集盤到該第二隔室，並從該處沿著該第二通道流至該排出口。 Such as the wafer processing system of item 12 of the scope of the patent application, wherein when the plurality of collection trays are all falling In the down position, the gas system flows through the first channel through an uppermost collecting tray to the second compartment, and from there flows along the second channel to the discharge port.

一種晶圓處理系統，包含：一腔室外殼；一可旋轉晶圓支撐件，用於支撐一晶圓；複數個可獨立移動的收集盤，其係圍繞該晶圓支撐件的外圍邊緣設置，該等收集盤係以一堆疊組態配置，各收集盤具有一用於收集流體的收集區，其中該等收集盤中的至少一者具有一與該用於排出收集到的流體之收集區流體連通的排水口；一驅動機構，用於選擇性地且獨立地移動該等收集盤中之一或多者至該晶圓支撐件上方的一升起位置，以界定一形成在該至少一升起的收集盤與一降下的收集盤之間的收集室，該收集室係經配置以收集於晶圓處理期間自該晶圓排出的流體，並將該收集到的流體導送通過該降下的收集盤之排水口；以及一化學排氣口，其係形成在該外殼中以將流經該收集室至該化學排氣口之氣體排出；其中各收集盤為環形並包括一第一出口(D1)及一與該第一出口(D1)隔開之第二出口(D2)，其中該收集盤的一第一弧形部(AR1)係界定在該第一出口(D1)與該第二出口(D2)之間的一側上，且該收集盤的一第二弧形部(AR2)界定在該第一出口(D1)與該第二出口(D2)之間的另一側上，其中該槽區的曲率半徑在該第一及第二弧形部(AR1及AR2)的各者內係沿著其之長度而改變；且其中該第一及第二弧形部(AR1及AR2)的各者之一中央部具有比接近該第一出口(D1)與該第二出口(D2)的各者之區域更大的曲率半徑，以促進流體以朝向該第一出口(D1)與該第二出口(D2)之一的方向流動。 A wafer processing system comprising: a chamber housing; a rotatable wafer support for supporting a wafer; a plurality of independently movable collection trays disposed around a peripheral edge of the wafer support, The collection trays are arranged in a stacked configuration, each collection tray having a collection area for collecting fluid, wherein at least one of the collection trays has a collection area fluid with the collection area for draining the collected fluid a communicating drain; a drive mechanism for selectively and independently moving one or more of the collection trays to a raised position above the wafer support to define a A collection chamber between a raised collection tray and a lowered collection tray, the collection chamber configured to collect fluid drained from the wafer during wafer processing and direct the collected fluid through the lowered collection tray the drain of the collection pan; and a chemical vent formed in the housing to discharge the gas flowing through the collection chamber to the chemical vent; wherein each collection pan is annular and includes a first outlet ( D1) and a second outlet (D2) separated from the first outlet (D1), wherein a first arc portion (AR1) of the collection tray is defined between the first outlet (D1) and the second on one side between the outlets (D2), and a second arc portion (AR2) of the collecting tray is defined on the other side between the first outlet (D1) and the second outlet (D2), wherein the radius of curvature of the groove varies within each of the first and second arcs (AR1 and AR2) along its length; and wherein the first and second arcs (AR1 and AR2 ) has a greater curvature than the area near each of the first outlet (D1) and the second outlet (D2) radius to facilitate fluid flow in a direction toward one of the first outlet (D1) and the second outlet (D2).

如申請專利範圍第1項之晶圓處理系統，其中該收集區包含一由一平底盤所界定之槽區，且該出口包含一設在該平底盤中之開孔，其導至與該槽區一體成形並自其向下懸垂之一排水管。 For the wafer processing system of claim 1, wherein the collection area includes a tank area defined by a flat chassis, and the outlet includes an opening in the flat chassis leading to the tank area A drain pipe is integrally formed and depends downwardly therefrom.

如申請專利範圍第15項之晶圓處理系統，其中在一最上面之收集盤下方的各收集盤係包括形成於該槽區中之一或多個開口以允許與一或多個上覆的收集盤相關聯之排水管通過。 A wafer processing system as claimed in claim 15, wherein each collection tray below an uppermost collection tray includes one or more openings formed in the trough to allow contact with one or more overlying The drain pipe associated with the collecting tray passes through.

如申請專利範圍第15項之晶圓處理系統，其中各收集盤包括一自該槽區的一下側往外延伸並圍繞該開孔之第一凸部，且在一最上面之收集盤下方的各收集盤係包括一自該槽區的一頂表面往外延伸並圍繞及界定該開孔之第二凸部，其中在該降下位置中，該第二凸部係容置在一上覆的收集盤之第一凸部之間。 Such as the wafer processing system of claim 15 of the scope of the patent application, wherein each collection tray includes a first protrusion extending outward from the lower side of the tank area and surrounding the opening, and each of the collection trays below an uppermost collection tray The collection pan includes a second protrusion extending outwardly from a top surface of the trough and surrounding and defining the opening, wherein in the lowered position the second protrusion is received in an overlying collection pan between the first protrusions.

如申請專利範圍第8項之晶圓處理系統，其中該複數個收集盤包含一第一收集盤及一位在該第一收集盤下方之第二收集盤，該第一收集盤之槽區係自該第二收集盤之槽區橫向偏移並徑向往外。 Such as the wafer processing system of item 8 of the scope of the patent application, wherein the plurality of collection trays include a first collection tray and a second collection tray below the first collection tray, and the groove area of the first collection tray is The trough is offset laterally and radially outwardly from the second collection pan.

如申請專利範圍第18項之晶圓處理系統，其中當該第一及第二收集盤在該降下位置時，該第一收集盤之底緣(A)係設置於該第二收集盤的外壁部上方並抵靠其上。 The wafer processing system according to claim 18 of the scope of the patent application, wherein when the first and second collection trays are in the lowered position, the bottom edge (A) of the first collection tray is arranged on the outer wall of the second collection tray over and against it.

如申請專利範圍第19項之晶圓處理系統，其中該內壁部終止於該頂緣(B)的一頂緣部為彎曲的，且該外壁部終止於該頂緣(C)的一頂緣部為斜面。 A wafer processing system as claimed in claim 19, wherein the inner wall portion terminates at a top edge of the top edge (B) is curved, and the outer wall portion terminates at a top of the top edge (C) The edge is beveled.

如申請專利範圍第1項之晶圓處理系統，其中該驅動機構包含下列之一：(a)複數個步進馬達以及(b)複數個氣動活塞。 For example, the wafer processing system of claim 1, wherein the drive mechanism includes one of the following: (a) a plurality of stepping motors and (b) a plurality of pneumatic pistons.

如申請專利範圍第1項之晶圓處理系統，其中該內壁部包含一第一傾斜壁，且該外壁部包含一第二傾斜壁，該等第一及第二傾斜壁相交於一點，該槽區形成在該處。 Such as the wafer processing system of item 1 of the scope of application, wherein the inner wall portion includes a first inclined wall, and the outer wall portion includes a second inclined wall, and the first and second inclined walls intersect at one point, the A trough is formed there.