TWI808046B - Substrate transfer system - Google Patents
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- TWI808046B TWI808046B TW111150539A TW111150539A TWI808046B TW I808046 B TWI808046 B TW I808046B TW 111150539 A TW111150539 A TW 111150539A TW 111150539 A TW111150539 A TW 111150539A TW I808046 B TWI808046 B TW I808046B
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Abstract
本發明公開一種基板傳送系統,所述基板傳送系統係關於能夠精密調節基板的移動方向和位置,從而可以在為傳送晶圓等基板而透過基板傳送機器人將基板容納到搬運容器(FOUP等)或從搬運容器中取出的過程中防止基板表面受損的技術。 The present invention discloses a substrate transfer system. The substrate transfer system relates to a technology capable of finely adjusting the movement direction and position of a substrate, thereby preventing the surface of the substrate from being damaged during the process of storing the substrate in or taking it out of a transfer container (FOUP, etc.) through a substrate transfer robot to transfer a substrate such as a wafer.
Description
本發明係關於一種基板傳送系統,更具體地,係關於能夠精密地測量和控制基板與基板傳送機器人的手之間的間距、移動方向及位置的技術,即,透過提供能夠精密地測量和資料化基板傳送機器人的基板傳送狀態以穩定地傳送半導體晶圓等基板的高精度定位技術,能夠在為傳送晶圓等基板而使用基板傳送機器人將基板容納到搬運容器(FOUP等)或從搬運容器(FOUP等)中取出的過程中防止基板表面受損。 The present invention relates to a substrate transfer system, and more specifically, to a technology capable of precisely measuring and controlling the distance, moving direction, and position between a substrate and a hand of a substrate transfer robot, that is, by providing a high-precision positioning technology capable of precisely measuring and dataizing the substrate transfer state of a substrate transfer robot to stably transfer a substrate such as a semiconductor wafer, it is possible to prevent damage to the surface of the substrate when a substrate transfer robot is used to transfer a substrate such as a wafer into or out of a transfer container (FOUP, etc.).
在半導體產品的生產製程中,要經過無數道工序才能製造出成品,並且,在執行半導體製造製程的過程中,會產生數十萬次的物流移動。 In the production process of semiconductor products, it is necessary to go through countless processes to manufacture finished products, and in the process of executing the semiconductor manufacturing process, hundreds of thousands of logistics movements will occur.
尤其,晶圓等基板採用將多個基板容納到前開式晶圓傳送盒(FOUP,front opening unified pod)或前開式晶圓出貨盒(FOSB,front opening shipping box)等搬運容器並透過空中走行式無人搬運車(OHT,Overhead Hoist Transfer)將搬運容器從任意端口(port)傳送到目的端口(port)的物流傳送系統。 In particular, substrates such as wafers use a logistics delivery system that accommodates multiple substrates in a transport container such as a front opening unified pod (FOUP) or a front opening shipping box (FOSB) and transfers the transport container from any port to a destination port through an overhead hoist transfer (OHT).
透過基板傳送機器人將特定端口的基板容納到搬運容器或者從搬運容器中取出基板時,會導致基板表面損傷。 When a substrate at a specific port is accommodated in or taken out of a transport container by a substrate transfer robot, the surface of the substrate may be damaged.
例如,當基板傳送機器人的末端執行器(End Effector)上的基板安置位置、末端執行器的運動、搬運容器的基板安置槽上的基板安置位置等各種因素未被精密地調整時,可能會導致基板表面損傷。 For example, when various factors such as the substrate setting position on the end effector (End Effector) of the substrate transfer robot, the movement of the end effector, and the substrate setting position on the substrate setting groove of the transfer container are not adjusted precisely, the substrate surface may be damaged.
對於透過超精細製程來生產的半導體元件來說,這種基板表面的微細的損傷會直接導致產品缺陷,因此會造成整個半導體製造製程良率下降的問題。 For semiconductor devices produced through an ultra-fine process, such microscopic damage on the surface of the substrate will directly lead to product defects, thus causing a decrease in the yield of the entire semiconductor manufacturing process.
因此,需要進行更精密的測量和控制,以防止在晶圓等基板的傳送過程中損傷基板表面。 Therefore, more precise measurement and control are required to prevent damage to the substrate surface during transfer of substrates such as wafers.
為了解決這些問題,現有技術提出了使用專用夾具檢測晶圓等基板是否放置在搬運容器內部的準確位置並由此校正傳送機器人的操作(Manipulation)位置以測量準確位置的方法。然而,夾具環境與實際製程環境可能存在差異,因此在檢測出基板傳送機器人的末端執行器在傳送晶圓等基板的過程中可能出現的誤差原因方面存在侷限性。即,應該儘可能地能夠在實際製程環境中操作,然而,在動態運動過程中也需要觀察誤差時,現有技術存在侷限性。 In order to solve these problems, the prior art proposes a method of using a special jig to detect whether a substrate such as a wafer is placed at an accurate position inside a handling container and thereby correcting the manipulation position of the transfer robot to measure the exact position. However, there may be differences between the fixture environment and the actual process environment, so there are limitations in detecting the cause of errors that may occur when the end effector of the substrate transfer robot is transferring substrates such as wafers. That is, it should be able to operate in the actual process environment as much as possible. However, when errors need to be observed during dynamic motion, the existing technology has limitations.
本發明為了解決如上所述的現有技術的問題而提出,目的在於提供一種在透過基板傳送機器人從搬運容器中取出晶圓等基板或將晶圓等基板容納到搬運容器的過程中檢測基板或末端執行器的運動,並透過對其進行精密測量和控制來防止在傳送基板時導致基板表面損傷的技術。 The present invention is made to solve the problems of the prior art as described above, and an object of the present invention is to provide a technology that detects the movement of a substrate or an end effector during the process of taking out a substrate such as a wafer from a transfer container by a substrate transfer robot or storing a substrate such as a wafer in a transfer container, and prevents damage to the surface of the substrate when transferring the substrate by precisely measuring and controlling the movement of the substrate.
尤其,本發明的目的在於解決在透過基板傳送機器人將基板容納到搬運容器或從搬運容器中取出基板時,由於基板傳送機器人的末端執行器上的基板安置位置、末端執行器的運動、搬運容器的基板安置槽上的基板安置位置等各種因素未被精密調節,而導致基板表面損傷的問題。 In particular, an object of the present invention is to solve the problem that the surface of the substrate is damaged due to various factors such as the substrate placement position on the end effector of the substrate transfer robot, the movement of the end effector, and the substrate placement position on the substrate placement groove of the transfer container when the substrate is accommodated in or taken out of the transfer container by the substrate transfer robot.
進一步地,本發明的目的在於解決由於透過超精細製程來生產的半導體元件的基板表面的微小損傷而導致產品缺陷且造成整個半導體製造製程良率下降的問題。 Further, the purpose of the present invention is to solve the problem of product defects caused by microscopic damages on the substrate surface of the semiconductor element produced through the ultra-fine process and resulting in a decrease in the yield of the entire semiconductor manufacturing process.
本發明的目的不限於上述內容,本發明的未提及的其他目的和優點可以透過下面的描述來理解。 The purpose of the present invention is not limited to the above, and other unmentioned purposes and advantages of the present invention can be understood through the following description.
根據本發明的基板傳送系統的一個實施例,所述基板傳送系統可以包括:搬運容器,具有用於儲存基板的內部空間;基板傳送機器人,包括用於安置基板的末端執行器(End Effector),用於將基板容納到所述搬運容器或從所述搬運容器中取出基板;測量單元,設置在所述搬運容器的內部空間的上側或下側,用於測量基板和所述末端執行器的運動;以及控制單元,基於所述測量單元的測量值控制所述基板傳送機器人。 According to an embodiment of the substrate transfer system of the present invention, the substrate transfer system may include: a transfer container having an internal space for storing substrates; a substrate transfer robot including an end effector for arranging a substrate, for accommodating a substrate into the transfer container or taking out a substrate from the transfer container; a measurement unit disposed on an upper side or a lower side of the inner space of the transfer container for measuring the movement of the substrate and the end effector; and a control unit that controls the substrate transfer robot based on a measurement value of the measurement unit.
較佳地,所述測量單元可以包括:至少兩個攝影鏡頭,彼此間隔開且用於拍攝基板或所述末端執行器的運動;以及測距感測器,用於測量與基板或所述末端執行器的距離。 Preferably, the measurement unit may include: at least two photographic lenses, spaced apart from each other, for photographing the movement of the substrate or the end effector; and a distance measuring sensor, for measuring the distance to the substrate or the end effector.
作為示例,所述測量單元可以包括:第一攝影鏡頭,用於追蹤所述末端執行器的末端的運動;第二攝影鏡頭,用於追蹤基板的運動;以及雷射測距感測器,用於測量在所述搬運容器的內部空間中的與基板或所述末端執行器的間隔距離和變化量。 As an example, the measuring unit may include: a first photographic lens for tracking the movement of the end of the end effector; a second photographic lens for tracking the movement of the substrate; and a laser ranging sensor for measuring the separation distance and variation from the substrate or the end effector in the inner space of the transport container.
進一步地,所述控制單元可以透過所述測量單元來測量透過所述基板傳送機器人將與待傳送基板對應的基準基板容納到所述搬運容器的內部 空間或從所述搬運容器中取出的運動,並且,獲取關於所述末端執行器的位置和方向以及所述基準基板的位置和方向的三維傳送坐標資料並基於所述三維傳送坐標資料來獲取用於基板傳送的教示資料。 Further, the control unit may measure, through the measuring unit, that the reference substrate corresponding to the substrate to be transferred is accommodated in the transport container by the substrate transfer robot. space or movement taken out from the transfer container, and acquiring three-dimensional transfer coordinate data about the position and orientation of the end effector and the position and orientation of the reference substrate and acquiring teaching data for substrate transfer based on the three-dimensional transfer coordinate data.
作為示例,所述基準基板的表面設置有具有識別標識的多個標記,所述第一攝影鏡頭在所述基準基板即將被安置前獲取所述末端執行器的末端的第一拍攝圖像,所述第二攝影鏡頭獲取設置在所述基準基板上的至少一個標記的第二拍攝圖像,所述雷射測距感測器在所述搬運容器的內部空間測量基板或所述末端執行器的高度和高度變化量,所述控制單元透過從所述第一拍攝圖像中提取基於所述末端執行器的末端的ROI並從所述第二拍攝圖像中提取基於所述基準基板的標記的ROI來獲取X軸和Y軸的傳送坐標資料,並基於所述高度和高度變化量來獲取Z軸的傳送坐標資料,並且基於獲取的傳送坐標資料來收集用於基板傳送的三維傳送坐標資料。 As an example, the surface of the reference substrate is provided with a plurality of marks with identification marks, the first photographic lens acquires a first photographed image of the end of the end effector immediately before the reference substrate is placed, the second photographic lens acquires a second photographed image of at least one mark disposed on the reference substrate, the laser ranging sensor measures the height and height change of the substrate or the end effector in the internal space of the transport container, and the control unit extracts the ROI based on the end of the end effector from the first photographed image and extracts the ROI based on the end of the end effector from the second photographed image. Obtaining the transfer coordinate data of the X-axis and the Y-axis based on the marked ROI of the substrate, and obtaining the transfer coordinate data of the Z-axis based on the height and the height change amount, and collecting three-dimensional transfer coordinate data for substrate transfer based on the obtained transfer coordinate data.
作為示例,所述控制單元可以基於收集的三維傳送坐標資料計算模型超平面(Hyper-plane),並透過估計所述基準基板在模型超平面上的位置和方向來獲取教示資料。 As an example, the control unit may calculate a model hyper-plane based on the collected 3D transmission coordinate data, and obtain teaching data by estimating the position and orientation of the reference substrate on the model hyper-plane.
作為示例,所述控制單元可以從所述第一拍攝圖像中提取特徵點並透過特徵點之間的匹配來估計變換矩陣,並且透過對矩陣的坐標變換來確定所述基準基板與所述基準基板之間的幾何關係並基於所述幾何關係獲取教示資料。 As an example, the control unit may extract feature points from the first captured image and estimate a transformation matrix through matching between feature points, and determine a geometric relationship between the reference substrate and the reference substrate through coordinate transformation of the matrix, and acquire teaching data based on the geometric relationship.
根據如上所述的本發明,能夠在透過基板傳送機器人從搬運容器中取出晶圓等基板或將晶圓等基板容納到搬運容器的過程中,檢測並精密控制基板和末端執行器的運動,從而可以防止在傳送基板時導致基板表面受損。 According to the present invention as described above, the movement of the substrate and the end effector can be detected and precisely controlled during the process of taking out a substrate such as a wafer from a transfer container by a substrate transfer robot or storing a substrate such as a wafer in a transfer container, thereby preventing damage to the surface of the substrate during transfer of the substrate.
尤其,在透過基板傳送機器人將基板容納到搬運容器中或從搬運容器中取出基板時,透過精密測量和控制基板傳送機器人的末端執行器上的 基板安置位置、末端執行器的運動、搬運容器的基板安置槽上的基板安置位置等各種因素,能夠穩定地傳送基板而不損傷基板表面。 In particular, when a substrate is accommodated in or taken out of a transfer container by a substrate transfer robot, the temperature on the end effector of the substrate transfer robot is precisely measured and controlled. Various factors such as the substrate setting position, the movement of the end effector, the substrate setting position on the substrate setting groove of the transfer container, etc., can stably transfer the substrate without damaging the substrate surface.
進一步地,透過解決經過超精細製程來生產的半導體元件的基板表面由於微小損傷而產出大量瑕疵品的問題,能夠提高整體製程良率。 Furthermore, by solving the problem that a large number of defective products are produced due to small damage on the substrate surface of the semiconductor element produced through the ultra-fine process, the overall process yield can be improved.
本發明的效果不限於上述效果,未提及的其他效果將透過以下記載而被本發明所屬技術領域的通常知識者清楚地理解。 The effects of the present invention are not limited to the above effects, and other effects not mentioned will be clearly understood by those skilled in the art to which the present invention pertains through the following description.
100:搬運容器 100: Handling Containers
110:容器主體 110: container body
111:內部空間 111: Internal space
113:插槽 113: slot
150:測量單元 150: Measuring unit
151:主體 151: subject
153:攝影鏡頭 153: photographic lens
153a:第一攝影鏡頭 153a: The first camera lens
153b:第二攝影鏡頭 153b: Second camera lens
155:測距感測器 155: Ranging sensor
200:基板傳送機器人 200: substrate transfer robot
210:末端執行器 210: End effector
211:末端 211: end
211a:末端 211a: end
211b:末端 211b: end
220:臂 220: arm
300:控制單元 300: control unit
400:基準基板 400: reference substrate
401:標記 401: mark
401a:標記 401a: mark
401b:標記 401b: tagged
401c:標記 401c: tagged
401d:標記 401d: mark
410:標記 410: mark
420:ROI(注意區域) 420: ROI (Region of Attention)
450:虛擬基準基板 450: Virtual Reference Substrate
460:基準基板 460: Reference Substrate
C0:坐標資訊 C0: coordinate information
C1:坐標資訊 C1: Coordinate information
C2:坐標資訊 C2: Coordinate information
C3:坐標資訊 C3: Coordinate information
C4:坐標資訊 C4: Coordinate Information
ID:標記 ID: tag
ID0~ID9:標記 ID0~ID9: mark
R,t:移動和旋轉坐標資料 R,t: move and rotate coordinate data
ROI:注意區域 ROI: Region of Attention
W:基板 W: Substrate
X:X坐標資料 X: X coordinate data
Xref:基準位置X坐標資料 Xref: reference position X coordinate data
Y:Y坐標資料 Y: Y coordinate data
Yref:基準位置Y坐標資料 Yref: Reference position Y coordinate data
Z:Z坐標資料 Z: Z coordinate data
S110~S170:步驟 S110~S170: steps
S210~S270:步驟 S210~S270: steps
圖1示出了根據本發明的基板傳送系統的一個實施例的示意性結構圖。 FIG. 1 shows a schematic structure diagram of an embodiment of a substrate transfer system according to the present invention.
圖2示出了本發明的設置在搬運容器中的測量單元的一個實施例。 FIG. 2 shows an embodiment of the measuring unit of the invention arranged in a handling container.
圖3示出了在本發明中透過基板傳送機器人傳送基板時利用測量單元測量基板和末端執行器的位置和方向的示例。 FIG. 3 shows an example of measuring the positions and orientations of a substrate and an end effector using a measurement unit when transferring a substrate through a substrate transfer robot in the present invention.
圖4示出了本發明中為了獲取教示資料而使用的基準基板和拍攝圖像的ROI的示例。 FIG. 4 shows an example of a reference substrate and an ROI of a captured image used for acquiring teaching materials in the present invention.
圖5和圖6示出了在根據本發明的基板傳送系統中透過估計基準基板的位置和方向來獲取教示資料的示例。 5 and 6 illustrate examples of acquiring teaching data by estimating the position and orientation of a reference substrate in the substrate transfer system according to the present invention.
圖7和圖8示出了在根據本發明的基板傳送系統中透過估計末端執行器的位置和方向來獲取教示資料的示例。 7 and 8 illustrate examples of acquiring teaching data by estimating the position and orientation of an end effector in a substrate transfer system according to the present invention.
以下,將參照附圖詳細描述本發明的較佳實施例,然而本發明不限於這些實施例。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, however, the present invention is not limited to these embodiments.
為了描述本發明及本發明的操作上的優點和透過本發明的實施例所實現的目的,在下文中,將示出本發明的較佳實施例並結合較佳實施例來說明本發明。 In order to describe the present invention and its operational advantages and objectives achieved by the embodiments of the present invention, preferred embodiments of the present invention will be shown and described in conjunction with the preferred embodiments below.
首先,本發明中所使用的術語僅用於描述具體實施例,而非限制本發明,除非上下文另有明確規定,否則單數表述可以包括複數表述。此外,應當理解,在本發明中,諸如“包含”或“具有”等術語意在表示具有說明書中記載的特徵、數字、步驟、操作、組件、配件或其組合,而不排除具有或添加至少一個其他特徵、數字、步驟、操作、組件、配件或其組合的可能性。 First of all, the terms used in the present invention are only used to describe specific embodiments, not to limit the present invention, and unless the context clearly stipulates otherwise, singular expressions may include plural expressions. In addition, it should be understood that in the present invention, terms such as "comprising" or "having" are intended to indicate having the features, numbers, steps, operations, components, accessories or combinations thereof described in the specification, without excluding the possibility of having or adding at least one other feature, numbers, steps, operations, components, accessories or combinations thereof.
在描述本發明時,如果對於相關的已知結構或功能的具體描述被認為是偏離本發明的主旨,則會省略其詳細描述。 In describing the present invention, if a detailed description of a related known structure or function is considered to deviate from the gist of the present invention, its detailed description will be omitted.
本發明提供一種能夠精密測量和控制基板的移動方向和位置,從而可以在為傳送晶圓等基板而透過基板傳送機器人將基板容納到搬運容器(FOUP等)或從搬運容器中取出的過程中防止基板表面受損的技術。 The present invention provides a technology capable of precisely measuring and controlling the moving direction and position of a substrate, thereby preventing damage to the surface of the substrate during the process of storing or removing the substrate into or out of a transfer container (FOUP, etc.) through a substrate transfer robot for transferring a substrate such as a wafer.
尤其,在本發明中,透過估計基準基板和末端執行器的位置和方向來獲取三維傳送坐標資料,並且基於所述三維傳送坐標資料執行用於實際基板傳送的教示,從而能夠精密控制傳送基板時的傳送位置和方向。 In particular, in the present invention, three-dimensional transfer coordinate data is obtained by estimating the positions and directions of a reference substrate and an end effector, and teaching for actual substrate transfer is performed based on the three-dimensional transfer coordinate data, so that the transfer position and direction when transferring a substrate can be precisely controlled.
圖1示出了根據本發明的基板傳送系統的一個實施例的示意性結構圖。 FIG. 1 shows a schematic structure diagram of an embodiment of a substrate transfer system according to the present invention.
基板傳送系統可以包括搬運容器100、測量單元150、基板傳送機器人200和控制單元300等。 The substrate transfer system may include a transfer container 100, a measurement unit 150, a substrate transfer robot 200, a control unit 300, and the like.
搬運容器100可以儲存晶圓等待傳送基板,基板傳送機器人200可以被驅動以將待傳送基板容納到搬運容器100或從搬運容器100中取出。此時,測量單元150可以測量基板W和基板傳送機器人200的運動。 The transfer container 100 may store wafers waiting to transfer substrates, and the substrate transfer robot 200 may be driven to accommodate or remove substrates to be transferred into the transfer container 100 . At this time, the measurement unit 150 may measure motions of the substrate W and the substrate transfer robot 200 .
基板傳送機器人200可以包括能夠進行多級操作的臂220和設置在臂220的末端以將基板W安置在其上的末端執行器210。 The substrate transfer robot 200 may include an arm 220 capable of multi-stage operations and an end effector 210 provided at an end of the arm 220 to place the substrate W thereon.
基板傳送機器人200可以透過臂220的操作將安置在末端執行器210上的基板W容納到搬運容器100中,或者在將儲存在搬運容器100中的基板W安置在末端執行器210的狀態下取出。 The substrate transfer robot 200 can accommodate the substrate W mounted on the end effector 210 into the transfer container 100 through the operation of the arm 220 or take out the substrate W stored in the transfer container 100 while being mounted on the end effector 210 .
控制單元300可以基於測量單元150的測量值來控制基板傳送機器人200的操作。 The control unit 300 may control the operation of the substrate transfer robot 200 based on the measurement value of the measurement unit 150 .
尤其,控制單元300可以使用基準基板獲取用於基板傳送機器人200的操作的三維傳送坐標資料,並且可以基於三維傳送坐標資料執行用於基板傳送的教示。 In particular, the control unit 300 may acquire three-dimensional transfer coordinate data for operation of the substrate transfer robot 200 using a reference substrate, and may perform teaching for substrate transfer based on the three-dimensional transfer coordinate data.
關於搬運容器100和測量單元150,圖2示出了本發明的設置在搬運容器中的測量單元的一個實施例。 Regarding the handling container 100 and the measuring unit 150 , FIG. 2 shows an embodiment of the measuring unit of the present invention arranged in the handling container.
在本實施例中,透過例舉前開式晶圓傳送盒(FOUP,front opening unified pod)來描述搬運容器100,然而本發明不限於此,並且可以應用於傳送各種搬運容器。 In this embodiment, the handling container 100 is described by taking a front opening unified pod (FOUP) as an example, however, the present invention is not limited thereto, and can be applied to transfer various handling containers.
半導體製造製程中使用的晶圓等具有由國際半導體產業協會(SEMI,Semiconductor Equipment and Materials International)規定的標準化尺寸,因此,諸如前開式晶圓傳送盒(FOUP,front opening unified pod)和前開式晶圓出貨盒(FOSB,front opening shipping box)等的搬運容器100的尺寸也可以根據要傳送的晶圓尺寸相應地進行標準化。本發明理所當然地還可以應用於非標準化的搬運容器的搬運。 The wafers used in the semiconductor manufacturing process have standardized sizes specified by the International Semiconductor Industry Association (SEMI, SEMINDUCTOR EQUIPMENT and Materials International). Therefore, such as FRONT Opening UNIFIED POD) And the size of the carpool 100 of the front -type wafer shipment box (FOSB, Front Opening Shipping Box), etc., can be standardized accordingly according to the size of the wafer to the wafer to be transmitted. The invention can of course also be applied to the handling of non-standardized handling containers.
搬運容器100包括容器主體110和容器門(未圖示),容器主體110內設置有內部空間111,用於儲存晶圓等搬運物。作為示例,可以在用於儲存晶圓的搬運容器100的內部空間111的側壁上設置多個插槽113,多個晶圓能 夠被依序***並堆疊在所述多個插槽113中。容器主體110的前部可以透過容器門(未圖示)打開或關閉。 The transport container 100 includes a container body 110 and a container door (not shown), and an inner space 111 is provided in the container body 110 for storing transported items such as wafers. As an example, a plurality of slots 113 can be provided on the sidewall of the inner space 111 of the handling container 100 for storing wafers, and a plurality of wafers can be can be sequentially inserted and stacked in the plurality of slots 113. The front of the container body 110 can be opened or closed through a container door (not shown).
這種搬運容器100可以透過空中走行式無人搬運車(OHT,Overhead Hoist Transfer)等傳送。 Such a transport container 100 can be transported by an overhead hoist transfer vehicle (OHT, Overhead Hoist Transfer) or the like.
搬運容器100可以包括測量單元150,測量單元150可以設置在搬運容器100的內部空間111的下側。根據情況,測量單元150也可以設置在搬運容器100的內部空間111的上側或側面。 The shipping container 100 may include a measurement unit 150 that may be disposed at a lower side of the inner space 111 of the shipping container 100 . According to circumstances, the measuring unit 150 may also be disposed on the upper side or the side of the inner space 111 of the transport container 100 .
測量單元150的主體151可以包括兩個或更多個攝影鏡頭153和測距感測器155等。 The main body 151 of the measurement unit 150 may include two or more photographic lenses 153, a range sensor 155, and the like.
攝影鏡頭153可以包括聚焦模組,所述聚焦模組包括拍攝鏡頭和用於調節聚焦的馬達和控制器。 The photographic lens 153 may include a focus module including a photographic lens, a motor and a controller for adjusting focus.
作為示例,第一攝影鏡頭153a可以設置為與基板傳送機器人200的末端執行器的末端對應,並且透過拍攝末端執行器的末端來提供追蹤末端執行器的末端的運動的第一拍攝圖像。 As an example, the first photographing lens 153a may be disposed corresponding to the end of the end effector of the substrate transfer robot 200 and provide a first captured image tracking the motion of the end effector by photographing the end of the end effector.
並且,第二攝影鏡頭153b可以設置為與基板的未被末端執行器覆蓋的部分對應,並且透過拍攝基板來提供追蹤基板的運動的第二拍攝圖像。 Also, the second photographing lens 153b may be disposed corresponding to a portion of the substrate not covered by the end effector, and provide a second photographed image tracking the movement of the substrate through photographing the substrate.
另外,測距感測器155可以測量與基板或末端執行器的距離,例如,透過應用雷射測距感測器來測量在搬運容器100的內部空間111的與基板或末端執行器之間的間隔距離或變化量。 In addition, the ranging sensor 155 can measure the distance to the substrate or the end effector, for example, by using a laser ranging sensor to measure the distance or variation between the inner space 111 of the handling container 100 and the substrate or the end effector.
設置在測量單元150的攝影鏡頭153的數量和布置位置可以根據需要改變,測距感測器155的數量和布置位置也可以根據需要改變。 The number and arrangement positions of the photographic lenses 153 provided in the measuring unit 150 can be changed as required, and the number and arrangement positions of the distance measuring sensors 155 can also be changed as required.
圖3示出了在本發明中透過基板傳送機器人傳送基板時利用測量單元來測量基板和末端執行器的位置和方向的示例。 FIG. 3 shows an example of measuring the position and orientation of a substrate and an end effector using a measurement unit when transferring a substrate through a substrate transfer robot in the present invention.
測量單元150的第一攝影鏡頭153a可以在基板W即將被安置在末端執行器210之前的狀態下的獲取末端執行器210的末端211a和211b的第一拍攝圖像。在本實施例中,測量單元150上設置有一個第一攝影鏡頭153a,用於獲取末端執行器210的一個末端211a的第一拍攝圖像,然而,可以設置兩個第一攝影鏡頭以分別獲取末端執行器210的兩個末端211a和211b的第一拍攝圖像。 The first photographic lens 153 a of the measurement unit 150 may acquire a first photographed image of the ends 211 a and 211 b of the end effector 210 in a state where the substrate W is immediately before being placed on the end effector 210 . In this embodiment, the measuring unit 150 is provided with a first photographic lens 153a for acquiring the first photographed image of one end 211a of the end effector 210, however, two first photographic lenses may be provided for acquiring the first photographed images of the two ends 211a and 211b of the end effector 210 respectively.
另外,測量單元150的第二攝影鏡頭153b可以在基板W即將被安置在末端執行器210的狀態下拍攝未被末端執行器210覆蓋的基板W部分以獲取基板W的第二拍攝圖像。 In addition, the second photographing lens 153b of the measurement unit 150 may capture a portion of the substrate W not covered by the end effector 210 to obtain a second captured image of the substrate W when the substrate W is about to be placed on the end effector 210 .
並且,測量單元150的測距感測器155能夠測量在搬運容器100的內部空間111的基板W安置在末端執行器210之前或在移動狀態下的與基板或末端執行器的間隔距離和變化量。 Also, the distance measuring sensor 155 of the measurement unit 150 can measure the distance and variation between the substrate W in the inner space 111 of the transport container 100 before the end effector 210 or in a moving state from the substrate or the end effector.
在本發明中,可以透過這種測量單元150的配置來測量基板和末端執行器的運動以進行精密控制,即,可以透過在傳送實際的待傳送基板之前使用基準基板來獲取用於基板傳送的三維傳送坐標資料並基於三維傳送坐標資料進行教示。 In the present invention, the movement of the substrate and the end effector can be measured for precise control through the configuration of the measurement unit 150, that is, the three-dimensional transfer coordinate data for substrate transfer can be obtained by using the reference substrate before transferring the actual substrate to be transferred and taught based on the three-dimensional transfer coordinate data.
圖4示出了本發明中為了獲取教示資料而使用的基準基板和拍攝圖像的ROI的示例。 FIG. 4 shows an example of a reference substrate and an ROI of a captured image used for acquiring teaching materials in the present invention.
基準基板400具有與待傳送基板相同的規格,並且可以被製造為具有低反射特性,以便恰當地執行光學測量。 The reference substrate 400 has the same specifications as the substrate to be transferred, and may be manufactured to have low reflection characteristics in order to properly perform optical measurement.
可以在基準基板400的表面設置用於辨識的多個標記401。 A plurality of marks 401 for identification may be provided on the surface of the reference substrate 400 .
多個標記401中的每一個在基準基板400上有確定好的位置,因此可以透過標記401的識別標記來判斷相應標記401在基準基板400上的位置。 Each of the plurality of marks 401 has a determined position on the reference substrate 400 , so the position of the corresponding mark 401 on the reference substrate 400 can be determined through the identification marks of the marks 401 .
基板傳送機器人可以在傳送基準基板400時透過第一攝影鏡頭獲取末端執行器的末端的第一拍攝圖像,並且可以從第一拍攝圖像提取基於末端執行器的末端的ROI420。 The substrate transfer robot may acquire a first captured image of the end of the end effector through the first photographic lens while transferring the reference substrate 400 , and may extract the ROI 420 based on the end of the end effector from the first captured image.
並且,可以透過測量單元的第二攝影鏡頭獲取基準基板400的第二拍攝圖像,並且可以從第二拍攝圖像中提取包括多個標記401的ROI420。較佳地,可以將ROI420調整為能夠檢測出至少三個標記401,以便準確地判斷基準基板的位置。可以透過識別ROI420上的標記401的識別標識來判斷該標記410處於基準基板400上的位置,並且透過識別三個或更多個標記410,可以準確地判斷基準基板400的方向和位置。 Also, a second captured image of the reference substrate 400 may be acquired through a second photographic lens of the measurement unit, and the ROI 420 including the plurality of marks 401 may be extracted from the second captured image. Preferably, the ROI 420 can be adjusted to be able to detect at least three marks 401 so as to accurately determine the position of the reference substrate. The position of the mark 410 on the reference substrate 400 can be determined by identifying the identification mark of the mark 401 on the ROI 420 , and the direction and position of the reference substrate 400 can be accurately determined by identifying three or more marks 410 .
在本發明中,控制單元可以利用以上描述的基準基板獲取三維傳送坐標資料,並基於該三維傳送坐標資料執行基板傳送的教示,下面將結合本發明的基板傳送系統的實施例了解獲取教示資料的過程。 In the present invention, the control unit can use the above-described reference substrate to obtain 3D transfer coordinate data, and perform teaching of substrate transfer based on the 3D transfer coordinate data. The process of obtaining teaching data will be understood below in conjunction with the embodiment of the substrate transfer system of the present invention.
以下描述的實施例以透過測量單元來測量透過基板傳送機器人將與待傳送基板對應的基準基板容納到搬運容器的內部空間或從所述搬運容器中取出的運動作為前提。 Embodiments described below are premised on the measurement of a movement of a reference substrate corresponding to a substrate to be transferred by a substrate transfer robot into or taken out from an inner space of a transfer container by a transfer measurement unit.
圖5和圖6示出了在根據本發明的基板傳送系統中透過估計基準基板的位置和方向來獲取教示資料的示例。 5 and 6 illustrate examples of acquiring teaching data by estimating the position and orientation of a reference substrate in the substrate transfer system according to the present invention.
測量單元150可以在基板傳送機器人200即將傳送基準基板400前獲取基準基板400的第二拍攝圖像。另外,控制單元300可以從第二拍攝圖像中提取包括多個標記401的ROI,並且在ROI上檢測出至少三個標記401(步驟S110)。 The measurement unit 150 may acquire a second captured image of the reference substrate 400 immediately before the substrate transfer robot 200 transfers the reference substrate 400 . In addition, the control unit 300 may extract an ROI including a plurality of markers 401 from the second captured image, and detect at least three markers 401 on the ROI (step S110 ).
控制單元300可以識別檢測到的標記401的識別標識,並透過預設的標記輪廓來識別基準基板的特定基準位置的X坐標和Y坐標的位置(步驟S120)。 The control unit 300 can identify the identification mark of the detected mark 401 , and identify the X-coordinate and Y-coordinate position of the specific reference position of the reference substrate through the preset mark outline (step S120 ).
並且,由於標記401的尺寸是預設的,因此控制單元300可以在ROI上根據標記401的相對尺寸來判斷高度距離Z坐標,進一步地,可以基於測量單元150的測距感測器所測量的測量值來判斷高度距離Z坐標(步驟S130)。 And, since the size of the mark 401 is preset, the control unit 300 can determine the height distance Z coordinate on the ROI according to the relative size of the mark 401, and further, can judge the height distance Z coordinate based on the measured value measured by the range sensor of the measuring unit 150 (step S130).
控制單元300可以收集關於各個標記401的X坐標值、Y坐標值和Z坐標值的資料(步驟S140),並且基於收集的資料計算出模型超平面(Hyper-plane)(步驟S150)。 The control unit 300 may collect data about the X-coordinate, Y-coordinate and Z-coordinate of each marker 401 (step S140), and calculate a model hyper-plane based on the collected data (step S150).
例如,可以收集三個或更多個標記的三維資料,並且將每個標記的位置表示為三維空間的一個點。並且,可以透過任意二維平面的法向量大小最小的平面計算出每個點的超平面。 For example, three-dimensional profiles of three or more markers may be collected and the position of each marker represented as a point in three-dimensional space. Moreover, the hyperplane of each point can be calculated through the plane with the smallest normal vector of any two-dimensional plane.
進一步地,由於超平面是二維平面,因此可以應用普通最小二乘法(OLS,Ordinary Least Square)等各種線性回歸(Linear Regression)方法。 Furthermore, since the hyperplane is a two-dimensional plane, various linear regression (Linear Regression) methods such as ordinary least squares (OLS, Ordinary Least Square) can be applied.
可以假設基準基板在超平面上移動,並且可以推測基準基板在超平面上的實際位置和方向(步驟S160),即估計其姿態。其中,可以根據投影(Projection)在超平面的X-Y平面上的點來推測基準基板的位置和方向。 It can be assumed that the reference substrate is moving on the hyperplane, and the actual position and orientation of the reference substrate on the hyperplane can be inferred (step S160), that is, its pose is estimated. Wherein, the position and direction of the reference substrate can be estimated according to the points projected on the X-Y plane of the hyperplane.
基準基板的每個標記在基準基板的相應位置上的參考坐標已被預先確定,因此可以透過在超平面上基於標記的位置分析標記的移動和旋轉關係來獲取有關基板傳送的坐標資料。此時,可以透過兩組點的重心之間的距離來確定標記的移動,並且可以透過用三角函數(arctan)計算中心點之間的角度或透過應用諸如Kabsch算法的基於最小二乘法(Least Square Method)獲得最優旋轉矩陣的算法等來計算標記的移動。 The reference coordinates of each mark on the reference substrate at the corresponding position of the reference substrate have been predetermined, so the coordinate information about the substrate transfer can be obtained by analyzing the movement and rotation relationship of the mark based on the position of the mark on the hyperplane. At this time, the movement of the marker can be determined by the distance between the centers of gravity of the two sets of points, and the movement of the marker can be calculated by calculating the angle between the center points using a trigonometric function (arctan) or by applying an algorithm such as the Kabsch algorithm based on the least square method (Least Square Method) to obtain an optimal rotation matrix.
例如,如圖6所示,可以在超平面確定包括在ROI中的四個標記ID0至ID3(401a、401b、401c、401d)的移動和旋轉關係,並由此確定對於虛擬基準基板450的預估的基準基板460位置和方向。 For example, as shown in FIG. 6 , the movement and rotation relationship of the four markers ID0 to ID3 (401a, 401b, 401c, 401d) included in the ROI can be determined on the hyperplane, and thus the estimated position and direction of the reference substrate 460 for the virtual reference substrate 450 can be determined.
透過這些過程,可以確認基準基板所具有的各個標記的基準坐標和測量坐標之間的移動和旋轉,並且由此推測基準基板的位置和方向。 Through these processes, the movement and rotation between the reference coordinates and the measurement coordinates of each mark possessed by the reference substrate can be confirmed, and the position and direction of the reference substrate can be estimated from this.
另外,控制單元300可以將基準基板的預估坐標應用為教示資料(步驟S170)。 In addition, the control unit 300 may apply the estimated coordinates of the reference substrate as teaching material (step S170).
圖7和圖8示出了在根據本發明的基板傳送系統中透過估計末端執行器的位置和方向來獲取教示資料的示例。 7 and 8 illustrate examples of acquiring teaching data by estimating the position and orientation of an end effector in a substrate transfer system according to the present invention.
測量單元150可以在基板傳送機器人200傳送基準基板400時獲取關於末端執行器210的第一拍攝圖像。另外,控制單元300可以從第一拍攝圖像中提取包括末端執行器210的末端的ROI。 The measurement unit 150 may acquire a first captured image with respect to the end effector 210 when the substrate transfer robot 200 transfers the reference substrate 400 . In addition, the control unit 300 may extract an ROI including the tip of the end effector 210 from the first captured image.
控制單元300對提取的ROI進行圖像預處理(步驟S210),作為示例,可以基於攝影鏡頭參數校正圖像的失真並檢測末端執行器的輪廓。 The control unit 300 performs image preprocessing on the extracted ROI (step S210 ). As an example, image distortion may be corrected based on photographic lens parameters and the contour of the end effector may be detected.
另外,控制單元300可以從預處理圖像中提取用於識別末端執行器的特徵點(步驟S220),並且對預設的末端執行器的輪廓資料(步驟S230)與提取的特徵點進行匹配(步驟S240)。 In addition, the control unit 300 may extract feature points for identifying the end effector from the preprocessed image (step S220), and match the preset profile data of the end effector (step S230) with the extracted feature points (step S240).
其中,進行特徵點的匹配時,可以透過特徵點之間的匹配(pair-wise)來推測變換矩陣,但是由於作為比較對象的圖像的特徵點不一定彼此1:1地匹配,因此也可以透過應用諸如ORB、SURF、SIFT或BRISK等的區域特徵點提取方法來進行匹配。此外,也可以透過應用暴力破解匹配器(BF,Brute-Force Matcher)或快速最近鄰逼近搜索函數庫(FLANN,Fast Library for Approximate Nearest Neighbors Matching)等各種算法來進行特徵點匹配。 Among them, when performing feature point matching, the transformation matrix can be estimated through the matching between feature points (pair-wise). However, since the feature points of the images to be compared do not necessarily match each other 1:1, it is also possible to perform matching by applying regional feature point extraction methods such as ORB, SURF, SIFT, or BRISK. In addition, feature point matching can also be performed by applying various algorithms such as Brute-Force Matcher (BF, Brute-Force Matcher) or FLANN (Fast Library for Approximate Nearest Neighbors Matching).
此外,控制單元300可以對提取的特徵點執行坐標變換(步驟S250)以確定幾何關係。 In addition, the control unit 300 may perform coordinate transformation on the extracted feature points (step S250) to determine a geometric relationship.
在確定特徵點的坐標時,由於末端執行器沒有參考坐標,因此可以使用透過基準基板預估的坐標。 When determining the coordinates of the feature points, since the end effector has no reference coordinates, the coordinates estimated through the reference substrate can be used.
例如,如圖8所示,測量單元150的中心點、第一攝影鏡頭153a和第二攝影鏡頭153b的位置固定,因此可以知道其坐標資訊C0、C1、C2,並且可以透過上述估計基準基板的位置和方向的步驟來獲知基準基板的預估坐標C4。 For example, as shown in FIG. 8, the positions of the center point of the measurement unit 150, the first photographic lens 153a and the second photographic lens 153b are fixed, so its coordinate information C0, C1, and C2 can be known, and the estimated coordinate C4 of the reference substrate can be known through the above steps of estimating the position and direction of the reference substrate.
控制單元300可以透過預先確定的坐標資訊C0、C1、C2和C4和有關末端執行器的相對位置的幾何關係來確定末端執行器的坐標資訊C3。 The control unit 300 can determine the coordinate information C3 of the end effector through the predetermined coordinate information C0 , C1 , C2 and C4 and the geometric relationship related to the relative position of the end effector.
控制單元300可以基於所確定的末端執行器的坐標資訊來預估末端執行器的位置和方向(步驟S260)。 The control unit 300 may estimate the position and orientation of the end effector based on the determined coordinate information of the end effector (step S260).
另外,控制單元300可以將預估的末端執行器的坐標應用為教示資料(S270)。 In addition, the control unit 300 may apply the estimated coordinates of the end effector as teaching material (S270).
根據本發明的基板傳送系統可以透過以上描述的技術配置來獲取基板傳送機器人將晶圓等基板容納到搬運容器中或從搬運容器中取出晶圓等基板時所需的教示資料,並且基於教示資料來執行教示。 The substrate transfer system according to the present invention can acquire the teaching data required for the substrate transfer robot to store or take out substrates such as wafers into and out of the transfer container through the technical configuration described above, and perform teaching based on the teaching data.
尤其,本發明能夠在透過基板傳送機器人從搬運容器中取出晶圓等基板或將晶圓等基板容納到搬運容器的過程中檢測並精密控制基板和末端執行器的運動,從而可以防止在傳送基板時導致基板表面受損。 In particular, the present invention can detect and precisely control the movement of the substrate and the end effector during the process of taking out a substrate such as a wafer from a transfer container by a substrate transfer robot or storing a substrate such as a wafer in a transfer container, thereby preventing damage to the surface of the substrate when transferring the substrate.
進一步地,透過解決經過超精細製程來生產的半導體元件的基板表面由於微小損傷而產出大量瑕疵品的問題,能夠提高整體製程良率。 Furthermore, by solving the problem that a large number of defective products are produced due to small damage on the substrate surface of the semiconductor element produced through the ultra-fine process, the overall process yield can be improved.
以上的描述僅為本發明技術思想的示例性描述,對於本發明所屬技術領域的通常知識者而言,在不脫離本發明的本質特徵的情況下,可以做出各種修改和改變。因此,本發明中記載的實施例僅用於描述本發明,而非旨在限制本發明的技術精神,並且本發明的技術精神不受這些實施例的限制。本發明的保護範圍應以所附申請專利範圍為準,凡在等同範圍內的所有技術思想均應視為包括在本發明的範圍內。 The above description is only an exemplary description of the technical idea of the present invention, and those skilled in the art of the present invention can make various modifications and changes without departing from the essential features of the present invention. Therefore, the embodiments described in the present invention are only for describing the present invention and are not intended to limit the technical spirit of the present invention, and the technical spirit of the present invention is not limited by these Examples. The scope of protection of the present invention shall be subject to the scope of the appended patent application, and all technical ideas within the equivalent scope shall be deemed to be included in the scope of the present invention.
100:搬運容器 100: Handling Containers
110:容器主體 110: container body
150:測量單元 150: Measuring unit
200:基板傳送機器人 200: substrate transfer robot
210:末端執行器 210: End effector
220:臂 220: arm
300:控制單元 300: control unit
W:基板 W: Substrate
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KR10-2022-0107302 | 2022-08-26 |
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CN110577082A (en) * | 2018-06-08 | 2019-12-17 | 徽拓真空阀门有限公司 | Wafer transfer unit and wafer transfer system |
US20200090966A1 (en) * | 2018-09-19 | 2020-03-19 | Applied Materials, Inc. | Processing system having a front opening unified pod (foup) load lock |
TW202035260A (en) * | 2018-11-05 | 2020-10-01 | 美商蘭姆研究公司 | Enhanced automatic wafer centering system and techniques for same |
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CN110577082A (en) * | 2018-06-08 | 2019-12-17 | 徽拓真空阀门有限公司 | Wafer transfer unit and wafer transfer system |
US20200090966A1 (en) * | 2018-09-19 | 2020-03-19 | Applied Materials, Inc. | Processing system having a front opening unified pod (foup) load lock |
TW202035260A (en) * | 2018-11-05 | 2020-10-01 | 美商蘭姆研究公司 | Enhanced automatic wafer centering system and techniques for same |
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