TWI806937B - 樹脂組合物及光纖 - Google Patents
樹脂組合物及光纖 Download PDFInfo
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- TWI806937B TWI806937B TW107144304A TW107144304A TWI806937B TW I806937 B TWI806937 B TW I806937B TW 107144304 A TW107144304 A TW 107144304A TW 107144304 A TW107144304 A TW 107144304A TW I806937 B TWI806937 B TW I806937B
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- Prior art keywords
- meth
- resin composition
- acrylate
- resin layer
- resin
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- 239000011342 resin composition Substances 0.000 title claims abstract description 82
- 239000013307 optical fiber Substances 0.000 title claims description 30
- 239000011347 resin Substances 0.000 claims abstract description 88
- 229920005989 resin Polymers 0.000 claims abstract description 88
- 229910052809 inorganic oxide Inorganic materials 0.000 claims abstract description 54
- 239000000178 monomer Substances 0.000 claims abstract description 22
- 239000003999 initiator Substances 0.000 claims abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 34
- 239000011164 primary particle Substances 0.000 claims description 22
- 239000003365 glass fiber Substances 0.000 claims description 16
- 238000005253 cladding Methods 0.000 claims description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 3
- 229910001887 tin oxide Inorganic materials 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract description 87
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 63
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 27
- -1 polytetramethylene Polymers 0.000 description 24
- 239000002612 dispersion medium Substances 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 16
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 230000002209 hydrophobic effect Effects 0.000 description 9
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Natural products C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000006087 Silane Coupling Agent Substances 0.000 description 5
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 5
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 5
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- 229920001223 polyethylene glycol Polymers 0.000 description 5
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 4
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- 230000002776 aggregation Effects 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- QPRQEDXDYOZYLA-UHFFFAOYSA-N 2-methylbutan-1-ol Chemical compound CCC(C)CO QPRQEDXDYOZYLA-UHFFFAOYSA-N 0.000 description 3
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
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- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
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- 230000015572 biosynthetic process Effects 0.000 description 3
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- 125000001165 hydrophobic group Chemical group 0.000 description 3
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- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- PGMMMHFNKZSYEP-UHFFFAOYSA-N 1,20-Eicosanediol Chemical compound OCCCCCCCCCCCCCCCCCCCCO PGMMMHFNKZSYEP-UHFFFAOYSA-N 0.000 description 2
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 2
- MXLMTQWGSQIYOW-UHFFFAOYSA-N 3-methyl-2-butanol Chemical compound CC(C)C(C)O MXLMTQWGSQIYOW-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
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- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- GJBXIPOYHVMPQJ-UHFFFAOYSA-N hexadecane-1,16-diol Chemical compound OCCCCCCCCCCCCCCCCO GJBXIPOYHVMPQJ-UHFFFAOYSA-N 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- PHTQWCKDNZKARW-UHFFFAOYSA-N isoamylol Chemical compound CC(C)CCO PHTQWCKDNZKARW-UHFFFAOYSA-N 0.000 description 2
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- 238000004519 manufacturing process Methods 0.000 description 2
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- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 2
- JYVLIDXNZAXMDK-UHFFFAOYSA-N pentan-2-ol Chemical compound CCCC(C)O JYVLIDXNZAXMDK-UHFFFAOYSA-N 0.000 description 2
- AQIXEPGDORPWBJ-UHFFFAOYSA-N pentan-3-ol Chemical compound CCC(O)CC AQIXEPGDORPWBJ-UHFFFAOYSA-N 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
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- 229920005862 polyol Polymers 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
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- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- ZBBLRPRYYSJUCZ-GRHBHMESSA-L (z)-but-2-enedioate;dibutyltin(2+) Chemical compound [O-]C(=O)\C=C/C([O-])=O.CCCC[Sn+2]CCCC ZBBLRPRYYSJUCZ-GRHBHMESSA-L 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
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- RESPXSHDJQUNTN-UHFFFAOYSA-N 1-piperidin-1-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCCCC1 RESPXSHDJQUNTN-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- CZZVAVMGKRNEAT-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)CO.OCC(C)(C)C(O)=O CZZVAVMGKRNEAT-UHFFFAOYSA-N 0.000 description 1
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 1
- IAMASUILMZETHW-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenoxyethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.OCCOCC(O)OC1=CC=CC=C1 IAMASUILMZETHW-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- PRIUALOJYOZZOJ-UHFFFAOYSA-L 2-ethylhexyl 2-[dibutyl-[2-(2-ethylhexoxy)-2-oxoethyl]sulfanylstannyl]sulfanylacetate Chemical compound CCCCC(CC)COC(=O)CS[Sn](CCCC)(CCCC)SCC(=O)OCC(CC)CCCC PRIUALOJYOZZOJ-UHFFFAOYSA-L 0.000 description 1
- HHKAGFTWEFVXET-UHFFFAOYSA-N 2-heptyl-2-(hydroxymethyl)propane-1,3-diol Chemical compound CCCCCCCC(CO)(CO)CO HHKAGFTWEFVXET-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- RASDUGQQSMMINZ-UHFFFAOYSA-N 2-methyl-1-piperidin-1-ylprop-2-en-1-one Chemical compound CC(=C)C(=O)N1CCCCC1 RASDUGQQSMMINZ-UHFFFAOYSA-N 0.000 description 1
- HFGLXKZGFFRQAR-UHFFFAOYSA-N 3-(1,3-benzothiazol-2-yltetrasulfanyl)propyl-trimethoxysilane Chemical compound C1=CC=C2SC(SSSSCCC[Si](OC)(OC)OC)=NC2=C1 HFGLXKZGFFRQAR-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- SEGKJLWPIPSYSC-UHFFFAOYSA-N 3-ethyloctane-1,8-diol Chemical compound OCCC(CC)CCCCCO SEGKJLWPIPSYSC-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- QCXHIOBCJCKFCK-UHFFFAOYSA-N 4-tert-butylcyclohexane-1,1-diol Chemical compound CC(C)(C)C1CCC(O)(O)CC1 QCXHIOBCJCKFCK-UHFFFAOYSA-N 0.000 description 1
- ZYUVGYBAPZYKSA-UHFFFAOYSA-N 5-(3-hydroxybutan-2-yl)-4-methylbenzene-1,3-diol Chemical compound CC(O)C(C)C1=CC(O)=CC(O)=C1C ZYUVGYBAPZYKSA-UHFFFAOYSA-N 0.000 description 1
- VNPRJHMMOKDEDZ-UHFFFAOYSA-L 6-methylheptyl 2-[dibutyl-[2-(6-methylheptoxy)-2-oxoethyl]sulfanylstannyl]sulfanylacetate Chemical compound CC(C)CCCCCOC(=O)CS[Sn](CCCC)(CCCC)SCC(=O)OCCCCCC(C)C VNPRJHMMOKDEDZ-UHFFFAOYSA-L 0.000 description 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
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- LFOXEOLGJPJZAA-UHFFFAOYSA-N [(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)phosphoryl]-(2,6-dimethoxyphenyl)methanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(CC(C)CC(C)(C)C)C(=O)C1=C(OC)C=CC=C1OC LFOXEOLGJPJZAA-UHFFFAOYSA-N 0.000 description 1
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- 239000005456 alcohol based solvent Substances 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000004103 aminoalkyl group Chemical group 0.000 description 1
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- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
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- 125000004432 carbon atom Chemical group C* 0.000 description 1
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- 238000012360 testing method Methods 0.000 description 1
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- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
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- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
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- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical class O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
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- C03C25/465—Coatings containing composite materials
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Abstract
本發明之樹脂組合物包含:含有(甲基)丙烯酸胺基甲酸酯低聚物、單體及光聚合起始劑之基礎樹脂;及經疏水處理之球狀無機氧化物,且無機氧化物分散於樹脂組合物中,以樹脂組合物之總量為基準,無機氧化物之含量為1~60質量%。
Description
本發明係關於一種樹脂組合物及光纖。
本申請案主張基於在2017年12月11日提出申請之日本專利申請案第2017-236688號之優先權,係引用上述日本專利申請案所記載之全部記載內容者。
一般而言,光纖具有用以保護作為光傳輸體之玻璃纖維之被覆樹脂層。光纖為了減小由對於光纖施加側壓時發生之微小彎曲所誘發之傳輸損失之增加,而要求側壓特性優異。
例如,於專利文獻1中進行了如下研究:藉由使用含有以合成石英為原料之填料之紫外線硬化型樹脂組合物形成樹脂層而改善光纖之側壓特性。
[先前技術文獻]
[專利文獻]
專利文獻1:日本專利特開2014-219550號公報
本發明之一態樣之樹脂組合物包含:含有(甲基)丙烯酸胺基甲酸酯低聚物、單體及光聚合起始劑之基礎樹脂;及經疏水處理之球狀無機氧化物,且無機氧化物分散於樹脂組合物中,以樹脂組合物之總量為基準,無機氧化物之含量為1~60質量%。
[本發明所欲解決之問題]
於含有填料之樹脂組合物之情形時,存在如下情況:填料沈澱而樹脂組合物之保存穩定性降低,又,填料凝聚而無法形成平滑之樹脂層,且樹脂層之一部分剝落。
本發明之目的在於提供一種保存穩定性優異,可形成平滑之樹脂層,並且可製作側壓特性優異之光纖之樹脂組合物;及側壓特性優異之光纖。
[本發明之效果]
根據本發明,可提供一種保存穩定性優異,可形成平滑之樹脂層,並且可製作側壓特性優異之光纖之樹脂組合物;及側壓特性優異之光纖。
[本發明之實施形態之說明]
首先,列舉本發明之實施形態之內容來進行說明。本發明之一態樣之樹脂組合物包含:含有(甲基)丙烯酸胺基甲酸酯低聚物、單體及光聚合起始劑之基礎樹脂;及經疏水處理之球狀無機氧化物,且無機氧化物分散於樹脂組合物中,以樹脂組合物之總量為基準,無機氧化物之含量為1~60質量%。
藉由於特定之範圍含有上述無機氧化物,樹脂組合物之保存穩定性優異,可形成平滑之樹脂層。又,藉由將本實施形態之樹脂組合物用作光纖被覆用之紫外線硬化型樹脂組合物,可製作側壓特性優異之光纖。
就於樹脂組合物中之分散性優異,易形成平滑之樹脂層之方面而言,上述無機氧化物亦可為選自由二氧化矽、二氧化鋯、氧化鋁、氧化鎂、氧化鈦、氧化錫及氧化鋅所組成之群中之至少1種。
就形成楊氏模數較高之樹脂層之觀點而言,無機氧化物之平均一次粒徑亦可為200 nm以下。
本發明之一態樣之光纖具備包含纖芯及披覆層之玻璃纖維、與玻璃纖維相接且覆蓋該玻璃纖維之第1樹脂層、及覆蓋第1樹脂層之第2樹脂層,第2樹脂層包含上述樹脂組合物之硬化物。藉由將本實施形態之樹脂組合物適用於第2樹脂層,可提高光纖之側壓特性。
[本發明之實施形態之詳情]
視需要,一面參照圖式一面對本發明之實施形態之樹脂組合物及光纖之具體例進行說明。再者,本發明並不限定於該等例示,意圖包含專利申請範圍所表示之與專利申請範圍均等之含義及於範圍內的全部變更。於以下之說明中,於圖式說明中對相同元件附加相同符號,省略重複之說明。
<樹脂組合物>
本實施形態之樹脂組合物包含:含有(甲基)丙烯酸胺基甲酸酯低聚物、單體及光聚合起始劑之基礎樹脂;及經疏水處理之球狀無機氧化物。
此處,(甲基)丙烯酸酯係指丙烯酸酯或與其對應之甲基丙烯酸酯。(甲基)丙烯酸亦相同。
(無機氧化物)
本實施形態之無機氧化物為球狀粒子,且其表面經疏水處理。無機氧化物亦可為金屬氧化物。本實施形態之疏水處理係指對無機氧化物之表面導入疏水性基。導入有疏水性基之無機氧化物係於樹脂組合物中之分散性優異。疏水性基亦可為(甲基)丙烯醯基等反應性基、或烴基等非反應性基。於無機氧化物具有反應性基之情形時,易形成楊氏模數較高之樹脂層。
本實施形態之無機氧化物分散於分散介質中。藉由使用分散於分散介質之無機氧化物,可使無機氧化物均勻地分散於樹脂組合物中,可提高樹脂組合物之保存穩定性。作為分散介質,只要不阻礙樹脂組合物之硬化,則無特別限定。分散介質可為反應性,亦可為非反應性。作為反應性之分散介質,亦可使用(甲基)丙烯醯基化合物、環氧化合物等單體。作為非反應性之分散介質,亦可使用甲基乙基酮(MEK)等酮系溶劑,丙二醇單甲醚(PGME)等醇系溶劑,或丙二醇單甲醚乙酸酯(PGMEA)等酯系溶劑。於非反應性之分散介質之情形時,亦可將基礎樹脂與分散於分散介質之無機氧化物混合後,去除分散介質之一部分而製備樹脂組合物。與分散於反應性之分散介質之無機氧化物相比,分散於非反應性之分散介質之無機氧化物變得容易降低樹脂組合物之硬化收縮。藉由光學顯微鏡(倍率約100倍)觀察包含無機氧化物之分散介質,於未觀察到粒子之情形時,可謂無機氧化物經一次粒子分散。
作為(甲基)丙烯醯基化合物,例如可列舉:1,6-己二醇二(甲基)丙烯酸酯、EO(ethylene oxide,環氧乙烷)改性雙酚A二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、PO(Propylene oxide,環氧丙烷)改性雙酚A二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯及聚四亞甲基二醇二(甲基)丙烯酸酯。作為(甲基)丙烯醯基化合物,亦可使用下述單體所例示之化合物。
就於樹脂組合物中之分散性優異,易形成平滑之樹脂層之方面而言,上述無機氧化物較佳為選自由二氧化矽(silica)、二氧化鋯(zirconia)、氧化鋁(alumina)、氧化鎂(magnesia)、氧化鈦(titania)、氧化錫及氧化鋅所組成之群中之至少1種。就廉價性優異、易進行表面處理、具有紫外線透過性、易賦予樹脂層適度之硬度等觀點而言,作為本實施形態之無機氧化物,更佳為使用經表面處理之二氧化矽。
就提高樹脂層之楊氏模數之觀點而言,無機氧化物之平均一次粒徑較佳為200 nm以下,更佳為10~200 nm,進而較佳為10~150 nm。平均一次粒徑例如可藉由電子顯微鏡照相之圖像解析、光散射法等進行測定。分散有無機氧化物之一次粒子之分散介質於一次粒子之粒徑較小之情形時在目視下透明可見。於一次粒子之粒徑較大(40 nm以上)之情形時,分散有一次粒子之分散介質可見白濁,但未觀察到沈澱物。
關於無機氧化物之含量,以樹脂組合物之總量為基準,為1~60質量%,較佳為7~50質量%,更佳為9~40質量%,進而較佳為10~40質量%。若無機氧化物之含量為1質量%以上,則變得容易形成側壓特性優異之樹脂層。若無機氧化物之含量為60質量%以下,則樹脂組合物之保存穩定性優異,可形成強韌之樹脂層。
(基礎樹脂)
本實施形態之基礎樹脂含有(甲基)丙烯酸胺基甲酸酯低聚物、單體及光聚合起始劑。
作為(甲基)丙烯酸胺基甲酸酯低聚物,可使用使多元醇化合物、聚異氰酸酯化合物及含羥基之(甲基)丙烯酸酯化合物反應所得之低聚物。
作為多元醇化合物,例如可列舉:聚四亞甲基二醇、聚丙二醇及雙酚A・環氧乙烷加成二醇。作為聚異氰酸酯化合物,例如可列舉:2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、異佛爾酮二異氰酸酯及二環己基甲烷4,4'-二異氰酸酯。作為含羥基之(甲基)丙烯酸酯化合物,例如可列舉(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丁酯、1,6-己二醇單(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、(甲基)丙烯酸2-羥基丙酯及三丙二醇單(甲基)丙烯酸酯。
作為合成(甲基)丙烯酸胺基甲酸酯低聚物時之觸媒,通常使用有機錫化合物。作為有機錫化合物,例如可列舉:二月桂酸二丁基錫、二乙酸二丁基錫、順丁烯二酸二丁基錫、雙(巰基乙酸2-乙基己酯)二丁基錫、雙(巰基乙酸異辛酯)二丁基錫及氧化二丁基錫。就易獲得性或觸媒性能之方面而言,較佳為使用二月桂酸二丁基錫或二乙酸二丁基錫作為觸媒。
於合成(甲基)丙烯酸胺基甲酸酯低聚物時亦可使用碳數5以下之低級醇。作為低級醇,例如可列舉甲醇、乙醇、1-丙醇、2-丙醇、1-丁醇、2-丁醇、2-甲基-2-丙醇、1-戊醇、2-戊醇、3-戊醇、2-甲基-1-丁醇、3-甲基-1-丁醇、2-甲基-2-丁醇、3-甲基-2-丁醇及2,2-二甲基-1-丙醇。
作為單體,可使用具有1個聚合性基之單官能單體、具有2個以上聚合性基之多官能單體。單體亦可混合2種以上使用。
作為單官能單體,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸正戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸3-苯氧基苄酯、苯氧基二乙二醇丙烯酸酯、苯氧基聚乙二醇(甲基)丙烯酸酯、4-第三丁基環己二醇(甲基)丙烯酸酯、(甲基)丙烯酸四氫呋喃甲酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸二環戊烯氧基乙酯、(甲基)丙烯酸二環戊酯、壬基苯酚聚乙二醇(甲基)丙烯酸酯、壬基苯氧基聚乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸異酯等(甲基)丙烯酸酯系單體;(甲基)丙烯酸、(甲基)丙烯酸二聚物、(甲基)丙烯酸羧基乙酯、(甲基)丙烯酸羧基戊酯、ω-羧基-聚己內酯(甲基)丙烯酸酯等含羧基單體;N-(甲基)丙烯醯啉、N-乙烯基吡咯啶酮、N-乙烯基己內醯胺、N-丙烯醯基哌啶、N-甲基丙烯醯哌啶、N-(甲基)丙烯醯基吡咯啶、3-(3-吡啶)(甲基)丙烯酸丙酯、環狀三羥甲基丙烷縮甲醛丙烯酸酯等含雜環(甲基)丙烯酸酯;順丁烯二醯亞胺、N-環己基順丁烯二醯亞胺、N-苯基順丁烯二醯亞胺等順丁烯二醯亞胺系單體;(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N-己基(甲基)丙烯醯胺、N-甲基(甲基)丙烯醯胺、N-異丙基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-羥甲基丙烷(甲基)丙烯醯胺等醯胺系單體;(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸胺基丙酯、(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸第三丁基胺基乙酯等(甲基)丙烯酸胺基烷基酯系單體;N-(甲基)丙烯醯氧基亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-6-氧基六亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-8-氧基八亞甲基琥珀醯亞胺等琥珀醯亞胺系單體。
作為多官能單體,例如可列舉:乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、雙酚A之環氧烷加成物之二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、羥基新戊酸新戊二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、1,12-十二烷二醇二(甲基)丙烯酸酯、1,14-十四烷二醇二(甲基)丙烯酸酯、1,16-十六烷二醇二(甲基)丙烯酸酯、1,20-二十烷二醇二(甲基)丙烯酸酯、異戊二醇二(甲基)丙烯酸酯、3-乙基-1,8-辛烷二醇二(甲基)丙烯酸酯、雙酚A之EO加成物二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、三羥甲基辛烷三(甲基)丙烯酸酯、三羥甲基丙烷聚乙氧基三(甲基)丙烯酸酯、三羥甲基丙烷聚丙氧基三(甲基)丙烯酸酯、三羥甲基丙烷聚乙氧基聚丙氧基三(甲基)丙烯酸酯、三[(甲基)丙烯醯氧基乙基]異氰尿酸酯、季戊四醇三(甲基)丙烯酸酯、聚乙氧基季戊四醇四(甲基)丙烯酸酯、聚丙氧基季戊四醇四(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二-三羥甲基丙烷四(甲基)丙烯酸酯、二季戊四醇四(甲基)丙烯酸酯、二季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯及己內酯改性之三[(甲基)丙烯醯氧基乙基]異氰尿酸酯。
作為光聚合起始劑,可自公知之自由基光聚合起始劑中適當選擇而使用。作為光聚合起始劑,例如可列舉:1-羥基環己基苯基酮、2,2-二甲氧基-2-苯基苯乙酮、1-(4-異丙基苯基)-2-羥基-2-甲基丙烷-1-酮、雙(2,6-二甲氧基苯甲醯基)-2,4,4-三甲基戊基氧化膦、2-甲基-1-[4-(甲硫基)苯基]-2-啉基-丙烷-1-酮(Omnirad 907,IGM Resins公司製造)、2,4,6-三甲基苯甲醯基二苯基氧化膦(Omnirad TPO,IGM Resins公司製造)及雙(2,4,6-三甲基苯甲醯基)苯基氧化膦(Omnirad 819,IGM Resins公司製造)。
樹脂組合物亦可進而含有矽烷偶合劑、光酸產生劑、調平劑、消泡劑、抗氧化劑等。
作為矽烷偶合劑,只要不阻礙樹脂組合物硬化,則無特別限定。作為矽烷偶合劑,例如可列舉:矽酸四甲酯、矽酸四乙酯、巰丙基三甲氧基矽烷、乙烯基三氯矽烷、乙烯基三乙氧基矽烷、乙烯基三(β-甲氧基-乙氧基)矽烷、β-(3,4-環氧環己基)-乙基三甲氧基矽烷、二甲氧基二甲基矽烷、二乙氧基二甲基矽烷、3-丙烯醯氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基甲基二乙氧基矽烷、γ-甲基丙烯醯氧基丙基三甲氧基矽烷、N-(β-胺基乙基)-γ-胺基丙基三甲氧基矽烷、N-(β-胺基乙基)-γ-胺基丙基三甲基二甲氧基矽烷、N-苯基-γ-胺基丙基三甲氧基矽烷、γ-氯丙基三甲氧基矽烷、γ-巰丙基三甲氧基矽烷、γ-胺基丙基三甲氧基矽烷、雙-[3-(三乙氧基矽烷基)丙基]四硫醚、雙-[3-(三乙氧基矽烷基)丙基]二硫醚、γ-三甲氧基矽烷基丙基二甲硫基胺甲醯基四硫醚及γ-三甲氧基矽烷基丙基苯并噻唑基四硫醚。
作為光酸產生劑,亦可使用形成有A+
B-
結構之鎓鹽。作為光酸產生劑,例如可列舉UVACURE1590(Daicel・Cytec製造)、CPI-100P、110P(San-Apro製造)等鋶鹽,Omnicat 250(IGM Regins公司製造)、WPI-113(富士膠片和光純藥製造)、Rp-2074(Rhodia・Japan製造)等錪鹽。
<光纖>
圖1係表示本實施形態之光纖之一例之概略剖視圖。光纖10具備包含纖芯11及披覆層12之玻璃纖維13、包含設置於玻璃纖維13之外周之第1樹脂層14及第2樹脂層15之被覆樹脂層16。
披覆層12包圍纖芯11。纖芯11及披覆層12主要包含石英玻璃等玻璃,例如,纖芯11可使用添加有鍺之石英,披覆層12可使用純石英或添加有氟之石英。
於圖1中,例如玻璃纖維13之外徑(D2)為125 μm左右,構成玻璃纖維13之纖芯11之直徑(D1)為7~15 μm左右。
被覆樹脂層16之厚度通常為60~70 μm左右。第1樹脂層14及第2樹脂層15之各層之厚度可為10~50 μm左右,例如亦可第1樹脂層14之厚度為35 μm,第2樹脂層15之厚度為25 μm。光纖10之外徑亦可為245~265 μm左右。
本實施形態之樹脂組合物可適用於第2樹脂層。第2樹脂層可使包含上述基礎樹脂及無機氧化物之樹脂組合物硬化而形成。藉此,可提高光纖之側壓特性。
第2樹脂層之楊氏模數於23℃下較佳為1300 MPa以上,更佳為1300~2600 MPa,進而較佳為1300~2500 MPa。若第2樹脂層之楊氏模數為1300 MPa以上,則容易提高側壓特性,若為2600 MPa以下,則可對第2樹脂層賦予適度之韌性,因此第2樹脂層不易發生破裂等。
分散於分散介質之無機氧化物於樹脂層硬化後亦以分散於樹脂層中之狀態存在。於使用反應性之分散介質之情形時,無機氧化物係連同分散介質一起混合於樹脂組合物中,且於維持了分散狀態之情況下被納入至樹脂層中。於使用非反應性之分散介質之情形時,分散介質至少一部分自樹脂組合物揮發而消失,但無機氧化物以分散狀態直接殘留於樹脂組合物中,即便於硬化後之樹脂層中亦以分散之狀態存在。關於存在於樹脂層中之無機氧化物,於藉由電子顯微鏡觀察之情形時,觀察到一次粒子已分散之狀態。
第1樹脂層14例如可使包含(甲基)丙烯酸胺基甲酸酯低聚物、單體、光聚合起始劑及矽烷偶合劑之樹脂組合物硬化所形成。第1樹脂層用之樹脂組合物可使用先前公知之技術。作為(甲基)丙烯酸胺基甲酸酯低聚物、單體、光聚合起始劑及矽烷偶合劑,亦可適當地選自上述基礎樹脂中所例示之化合物。但是,形成第1樹脂層之樹脂組合物具有與形成第2樹脂層之基礎樹脂不同之組成。
[實施例]
以下,表示使用本發明之實施例及比較例之評估試驗之結果,進一步詳細地說明本發明。再者,本發明並不限定於該等實施例。
(基礎樹脂)
將藉由使分子量1000之聚丙二醇、2,4-甲苯二異氰酸酯及丙烯酸羥基乙酯反應所得之丙烯酸胺基甲酸酯低聚物50質量份、環氧丙烯酸酯28質量份、丙烯酸異酯20質量份、2,4,6-三甲基苯甲醯基二苯基氧化膦2質量份進行混合,製備基礎樹脂。
[樹脂組合物之製作]
(實施例1)
使用分散於1,6-己二醇二丙烯酸酯(HDDA),且具有反應性基(甲基丙烯醯基)之球狀疏水性二氧化矽粒子(平均一次粒徑:100~200 nm)作為無機氧化物。以樹脂組合物中之二氧化矽粒子之含量成為30質量%之方式與基礎樹脂混合,製備樹脂組合物。
(實施例2)
使用分散於甲基乙基酮(MEK),且具有反應性基之球狀疏水性二氧化矽粒子(平均一次粒徑:70~100 nm)作為無機氧化物。將基礎樹脂與二氧化矽粒子混合後,減壓去除大部分MEK,以樹脂組合物中之二氧化矽粒子之含量成為30質量%之方式製備樹脂組合物。再者,樹脂組合物中之MEK之含量為1質量%以下。
(實施例3)
使用分散於MEK,且具有反應性基之球狀疏水性二氧化矽粒子(平均一次粒徑:40~60 nm)作為無機氧化物,除此以外,以與實施例2相同之方式製備樹脂組合物。
(實施例4)
使用分散於MEK,且具有反應性基之球狀疏水性二氧化矽粒子(平均一次粒徑:10~15 nm)作為無機氧化物,除此以外,以與實施例2相同之方式製備樹脂組合物。
(實施例5)
使用分散於MEK,且不具有反應性基之(非反應性)球狀疏水性二氧化矽粒子(平均一次粒徑:10~15 nm)作為無機氧化物,除此以外,以與實施例2相同之方式製備樹脂組合物。
(實施例6)
以樹脂組合物中之二氧化矽粒子之含量成為1質量%之方式與基礎樹脂混合,除此以外,以與實施例4相同之方式製備樹脂組合物。
(比較例1)
使用粉體(不定形)之親水性二氧化矽粒子(合成石英玻璃炱,平均一次粒徑:500 nm)作為無機氧化物,且以樹脂組合物中之二氧化矽粒子之含量成為10質量%之方式與基礎樹脂混合,製備樹脂組合物。
(比較例2)
使用不具有反應性基之粉體(球狀)疏水性二氧化矽粒子(平均一次粒徑:110 nm)作為無機氧化物,除此以外,以與比較例1相同之方式製備樹脂組合物。該二氧化矽粒子係複數個一次粒子凝聚而成者。
(比較例3)
使用不具有反應性基之粉體(球狀)疏水性二氧化矽粒子(平均一次粒徑:300 nm)作為無機氧化物,除此以外,以與比較例1相同之方式製備樹脂組合物。該二氧化矽粒子係複數個一次粒子凝聚而成者。
(比較例4)
使用分散於甲醇(MeOH)之球狀親水性二氧化矽粒子(平均一次粒徑:10~15 nm)作為無機氧化物,除此以外,以與比較例1相同之方式製備樹脂組合物。所獲得之樹脂組合物黏度較高,且發生白濁,而無法進行評估。
(比較例5)
以樹脂組合物中之二氧化矽粒子之含量成為0.5質量%之方式與基礎樹脂混合,除此以外,以與實施例4相同之方式製備樹脂組合物。
(比較例6)
以樹脂組合物中之二氧化矽粒子之含量成為61質量%之方式與基礎樹脂混合,除此以外,以與實施例4相同之方式製備樹脂組合物。
(比較例7)
使用基礎樹脂作為樹脂組合物。
使用實施例及比較例中所獲得之樹脂組合物,進行以下之評估。將結果示於表1及表2。
(樹脂組合物中之二次粒子)
藉由光學顯微鏡(100倍)觀察樹脂組合物,若觀察到粒子,則判斷為存在二次粒子(一次粒子凝聚而成者)。
(樹脂組合物之穩定性)
一面於45℃下對實施例及比較例中所得之樹脂組合物加熱30分鐘,一面進行攪拌後,於室溫下靜置1小時,藉由目視確認外觀。
[樹脂膜之製作]
使用旋轉塗佈機,將實施例或比較例中所得之樹脂組合物塗佈於聚對苯二甲酸乙二酯(PET)膜上後,使用Heraeus制之無電極UV(ultraviolet,紫外線)燈系統「VPS600(D燈泡)」,於1000±100 mJ/cm2
之條件下使其硬化,於PET膜上形成厚度200±20 μm之樹脂層。自PET膜剝下樹脂層,獲得樹脂膜。
(樹脂層之表面狀態)
藉由目視觀察所形成之樹脂層之表面狀態。表1及2中,「凝聚」表示觀察到認為來自無機氧化物之凝聚物(細小之點)。「破裂」表示觀察到破裂。「平滑」表示凝聚物與破裂均無法觀察到,而觀察到平滑之表面。
(楊氏模數)
將樹脂膜沖裁成JIS K 7127 類型5之啞鈴形狀,於23±2℃、50±10%RH(Relative Humidity,相對濕度)之條件下,使用拉力試驗機,於1 mm/分鐘之拉伸速度,標線間25 mm之條件下進行拉伸,而獲得應力-應變曲線。藉由2.5%割線求得楊氏模數。
[光纖之製作]
將藉由使分子量2000之聚丙二醇、2,4-甲苯二異氰酸酯及丙烯酸羥基乙酯反應所獲得之丙烯酸胺基甲酸酯低聚物75質量份、壬基苯酚EO改性丙烯酸酯12質量份、N-乙烯基己內醯胺6質量份、1,6-己二醇二丙烯酸酯2質量份、2,4,6-三甲基苯甲醯基二苯基氧化膦(Omnirad TPO)1質量份、3-巰丙基三甲氧基矽烷(MPTS)1質量份混合,獲得樹脂組合物A1。
於包含纖芯及披覆層之直徑125 μm之玻璃纖維之外周使用樹脂組合物A1形成厚度35 μm之第1樹脂層,進而於其外周使用實施例或比較例中所製作之樹脂組合物形成厚度25 μm之第2樹脂層,獲得直徑245 μm之光纖。線速度係設為1500 m/分鐘。
(側壓特性)
藉由OTDR(Optical Time Domain Reflectometer,光時域反射計)法,對將光纖10單層狀地捲繞至表面由砂紙覆蓋之直徑280 mm之卷線軸時的1550 nm波長之光之傳輸損失進行測定。又,藉由OTDR法,對將光纖10單層狀地捲繞至無砂紙之直徑280 mm之卷線軸時的1550 nm波長之光之傳輸損失進行測定。求出所測得之傳輸損失之差,將傳輸損失差為0.6 dB/km以下之情形判斷為側壓特性「OK」,將傳輸損失差超過0.6 dB/km之情形判斷為側壓特性「NG」。再者,於比較例6中,於將光纖捲取至卷線軸時,樹脂層產生龜裂,無法評估側壓特性。
[表1]
[表2]
確認到實施例之樹脂組合物其保存穩定性優異,可形成平滑之樹脂層,並且可製作側壓特性優異之光纖。
10‧‧‧光纖
11‧‧‧纖芯
12‧‧‧披覆層
13‧‧‧玻璃纖維
14‧‧‧第1樹脂層
15‧‧‧第2樹脂層
16‧‧‧被覆樹脂層
D1‧‧‧纖芯之直徑
D2‧‧‧玻璃纖維之外徑
圖1係表示本實施形態之光纖之一例之概略剖視圖。
10‧‧‧光纖
11‧‧‧纖芯
12‧‧‧披覆層
13‧‧‧玻璃纖維
14‧‧‧第1樹脂層
15‧‧‧第2樹脂層
16‧‧‧被覆樹脂層
D1‧‧‧纖芯之直徑
D2‧‧‧玻璃纖維之外徑
Claims (5)
- 一種樹脂組合物,其係包含:含有(甲基)丙烯酸胺基甲酸酯低聚物、單體及光聚合起始劑之基礎樹脂;及經疏水處理之球狀無機氧化物者;上述無機氧化物分散於上述樹脂組合物中,以上述樹脂組合物之總量為基準,上述無機氧化物之含量為1~60質量%,上述無機氧化物具有(甲基)丙烯醯基作為疏水性基,上述單體至少包含(甲基)丙烯酸酯系單體或作為單體使用之(甲基)丙烯醯基化合物。
- 如請求項1之樹脂組合物,其中上述無機氧化物為選自由二氧化矽、二氧化鋯、氧化鋁、氧化鎂、氧化鈦、氧化錫及氧化鋅所組成之群中之至少1種。
- 如請求項1或2之樹脂組合物,其中上述無機氧化物之平均一次粒徑為200nm以下。
- 一種光纖,其具備:包含纖芯及披覆層之玻璃纖維;與上述玻璃纖維相接且覆蓋該玻璃纖維之第1樹脂層;及覆蓋上述第1樹脂層之第2樹脂層,且上述第2樹脂層包含如請求項1至3中任一項之樹脂組合物之硬化物。
- 如請求項4之光纖,其中上述第2樹脂層之楊氏模數於23℃下為1300~2600MPa。
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NL2022158A (en) | 2019-06-19 |
JPWO2019116967A1 (ja) | 2021-01-21 |
GB2582075A (en) | 2020-09-09 |
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