TWI806567B - Electrical device - Google Patents

Abstract

An electrical device includes a container, an outer cover, an inner cover and a conversion unit. The container includes a bottom surface and an inner wall which jointly define an accommodating channel. An inlet of the accommodating channel is opposite to the bottom surface. The conversion unit is disposed within the accommodating channel. The outer cover covers the inlet. The inner cover is located in the accommodating channel, between the conversion unit and the outer cover. The inner cover includes a cover body and an opening formed on the cover body. A part of the conversion unit extends to the opening, and an outer edge of the cover body is connected to the inner wall of the container.

Description

電子裝置 electronic device

本發明有關於一種電子裝置，尤指一種同時含有內蓋及外蓋之電子裝置。 The invention relates to an electronic device, especially an electronic device including an inner cover and an outer cover.

一般而言，電子產品包含電子電路及外殼。外殼以供放置電子電路，以遮蔽電子電路。 Generally speaking, electronic products include electronic circuits and casings. The housing is used to place the electronic circuit to cover the electronic circuit.

然而，若上述電子產品之外殼之結構強度不佳，勢必導致使用上安全疑慮及消費者信心不足之問題發生。 However, if the structural strength of the shell of the above-mentioned electronic product is not good, it will inevitably lead to safety doubts in use and lack of consumer confidence.

由此可見，上述技術顯然仍存在不便與缺陷，乃為此業界亟待解決的問題。 It can be seen that there are obviously still inconveniences and defects in the above-mentioned technologies, which are problems to be solved urgently in the industry.

本發明之一目的在於提供一種電子裝置，用以解決以上先前技術所提到的困難。 An object of the present invention is to provide an electronic device to solve the above mentioned difficulties in the prior art.

本發明之一實施例提供一種電子裝置。電子裝置包含一容器、一外蓋、一內蓋與一轉換單元。容器具有一內底面與至少一內壁，內底面與內壁共同定義出一容置通道，容置通道之入口相對內底面。轉換單元設置於容置通道內。外蓋覆蓋入口。內蓋位於容置通道內，介於轉換單元與外 蓋之間，內蓋包含一蓋體及一開口，開口開設於蓋體上，轉換單元的一部分延伸至開口，蓋體之至少一外側緣連接所述內壁。 An embodiment of the invention provides an electronic device. The electronic device includes a container, an outer cover, an inner cover and a conversion unit. The container has an inner bottom surface and at least one inner wall. The inner bottom surface and the inner wall jointly define an accommodating passage, and the entrance of the accommodating passage is opposite to the inner bottom surface. The conversion unit is arranged in the accommodating channel. The outer cover covers the inlet. The inner cover is located in the accommodating channel, between the conversion unit and the outer Between the covers, the inner cover includes a cover body and an opening, the opening is opened on the cover body, a part of the conversion unit extends to the opening, and at least one outer edge of the cover body is connected to the inner wall.

依據一或多個實施例，在上述電子裝置中，容器包含至少一第一凸緣及至少一第二凸緣。第一凸緣位於內壁上，用以承載外蓋。第二凸緣位於內壁上，介於第一凸緣與內底面之間，用以承載內蓋。 According to one or more embodiments, in the above electronic device, the container includes at least one first flange and at least one second flange. The first flange is located on the inner wall for supporting the outer cover. The second flange is located on the inner wall, between the first flange and the inner bottom surface, and is used for supporting the inner cover.

依據一或多個實施例，在上述電子裝置中，內蓋透過一第一連接層固定於第一凸緣上，外蓋透過一第二連接層固定於第二凸緣上。 According to one or more embodiments, in the above electronic device, the inner cover is fixed on the first flange through a first connecting layer, and the outer cover is fixed on the second flange through a second connecting layer.

依據一或多個實施例，在上述電子裝置中，外蓋與內蓋之間具有一間隙，開口接通間隙及容置通道，轉換單元之此部分經開口伸入間隙。 According to one or more embodiments, in the above-mentioned electronic device, there is a gap between the outer cover and the inner cover, the opening connects the gap and the accommodating passage, and the part of the conversion unit extends into the gap through the opening.

依據一或多個實施例，在上述電子裝置中，更包含一連接單元，內蓋具有一第一穿孔，外蓋具有一第二穿孔，第二穿孔對應第一穿孔，且透過第一穿孔接通容置通道，連接單元穿過第一穿孔及第二穿孔。 According to one or more embodiments, the above-mentioned electronic device further includes a connection unit, the inner cover has a first through hole, the outer cover has a second through hole, the second through hole corresponds to the first through hole, and is connected through the first through hole. Through the accommodating channel, the connecting unit passes through the first through hole and the second through hole.

依據一或多個實施例，在上述電子裝置中，外蓋的一部分連接伸入此開口之轉換單元的此部分。 According to one or more embodiments, in the above electronic device, a part of the cover is connected to the part of the conversion unit protruding into the opening.

依據一或多個實施例，在上述電子裝置中，轉換單元包含一電路板。電路板固定於內壁及蓋體，電路板之一部分為轉換單元的此部分。 According to one or more embodiments, in the above electronic device, the conversion unit includes a circuit board. The circuit board is fixed on the inner wall and the cover, and a part of the circuit board is the part of the conversion unit.

依據一或多個實施例，在上述電子裝置中，內蓋包含一網狀區，網狀區形成於蓋體上。 According to one or more embodiments, in the above electronic device, the inner cover includes a mesh area, and the mesh area is formed on the cover body.

依據一或多個實施例，在上述電子裝置中，內蓋之覆蓋面積與容置通道之截面積的比例為70%~95%。 According to one or more embodiments, in the above electronic device, the ratio of the covered area of the inner cover to the cross-sectional area of the accommodating channel is 70%-95%.

本發明之一實施例提供一種電子裝置。電子裝置包含一容器、一外蓋、一內蓋與一轉換單元。容器具有一內底面與至少一內壁，內底面與內壁共同定義出一容置通道，容置通道之入口相對內底面。轉換單元具有一設置於容置通道內之高壓側電壓單元。外蓋覆蓋入口。內蓋位於容置通道內，介於轉換單元與外蓋之間。內蓋包含一蓋體及一開口。蓋體遮蔽高壓側電壓單元，開口開設於蓋體上。蓋體之至少一外側緣連接所述內壁。 An embodiment of the invention provides an electronic device. The electronic device includes a container, an outer cover, an inner cover and a conversion unit. The container has an inner bottom surface and at least one inner wall. The inner bottom surface and the inner wall jointly define an accommodating passage, and the entrance of the accommodating passage is opposite to the inner bottom surface. The conversion unit has a high voltage side voltage unit arranged in the accommodating channel. The outer cover covers the inlet. The inner cover is located in the accommodating channel, between the conversion unit and the outer cover. The inner cover includes a cover body and an opening. The cover body shields the high-voltage side voltage unit, and the opening is opened on the cover body. At least one outer edge of the cover is connected to the inner wall.

依據一或多個實施例，在上述電子裝置中，容器包含至少一第一凸緣及至少一第二凸緣。第一凸緣位於內壁上，用以承載外蓋，第二凸緣位於內壁上，介於第一凸緣與內底面之間，用以承載內蓋。 According to one or more embodiments, in the above electronic device, the container includes at least one first flange and at least one second flange. The first flange is located on the inner wall for bearing the outer cover, and the second flange is located on the inner wall between the first flange and the inner bottom surface and used for bearing the inner cover.

依據一或多個實施例，在上述電子裝置中，外蓋與內蓋之間具有一間隙。內蓋更包含一凸部及一凹槽，凸部從蓋體之一面伸入間隙，凹槽對應凸部，且從蓋體之另面朝凸部之方向凹陷，其中轉換單元之一部分位於凹槽內。 According to one or more embodiments, in the above electronic device, there is a gap between the outer cover and the inner cover. The inner cover further includes a protrusion and a groove, the protrusion extends into the gap from one side of the cover, the groove corresponds to the protrusion, and is recessed from the other side of the cover toward the protrusion, wherein a part of the conversion unit is located in the recess in the slot.

依據一或多個實施例，上述電子裝置更包含一連接單元。內蓋具有一第一穿孔，外蓋具有一第二穿孔，第二穿孔對應第一穿孔，且透過第一穿孔接通容置通道。連接單元穿過第一穿孔及第二穿孔。 According to one or more embodiments, the above-mentioned electronic device further includes a connection unit. The inner cover has a first through hole, the outer cover has a second through hole, the second through hole corresponds to the first through hole, and is connected to the accommodating channel through the first through hole. The connecting unit passes through the first through hole and the second through hole.

依據一或多個實施例，在上述電子裝置中，內蓋之覆蓋面積與容置通道之截面積的比例為70%~95%。 According to one or more embodiments, in the above electronic device, the ratio of the covered area of the inner cover to the cross-sectional area of the accommodating channel is 70%-95%.

依據一或多個實施例，在上述電子裝置中，內蓋包含一網狀區，網狀區形成於蓋體上，且與高壓側電壓單元相互重疊。 According to one or more embodiments, in the above-mentioned electronic device, the inner cover includes a mesh area formed on the cover body and overlapping with the high-voltage side voltage unit.

本發明之一實施例提供一種電子裝置。電子裝置包含一容器、一外蓋、一內蓋與一轉換單元。容器具有一內底面與至少一內壁，內底面與內壁共同定義出一容置通道，容置通道之入口相對內底面。內底面或內壁具有一側壁開口。轉換單元設置於容置通道內。外蓋覆蓋入口。內蓋位於容置通道內，介於轉換單元與外蓋之間，內蓋包含一蓋體，蓋體完全遮蔽轉換單元，內蓋之至少一外側緣連接容器之所述內壁。 An embodiment of the invention provides an electronic device. The electronic device includes a container, an outer cover, an inner cover and a conversion unit. The container has an inner bottom surface and at least one inner wall. The inner bottom surface and the inner wall jointly define an accommodating passage, and the entrance of the accommodating passage is opposite to the inner bottom surface. The inner bottom surface or the inner wall has a side wall opening. The conversion unit is arranged in the accommodating channel. The outer cover covers the inlet. The inner cover is located in the accommodating channel between the conversion unit and the outer cover. The inner cover includes a cover body which completely covers the conversion unit. At least one outer edge of the inner cover is connected to the inner wall of the container.

依據一或多個實施例，在上述電子裝置中，容器包含至少一第一凸緣及至少一第二凸緣。第一凸緣位於內壁上，用以承載外蓋。第二凸緣位於內壁上，介於第一凸緣與內底面之間，用以承載內蓋。 According to one or more embodiments, in the above electronic device, the container includes at least one first flange and at least one second flange. The first flange is located on the inner wall for supporting the outer cover. The second flange is located on the inner wall, between the first flange and the inner bottom surface, and is used for supporting the inner cover.

依據一或多個實施例，在上述電子裝置中，內蓋透過一第一連接層固定於第一凸緣上，外蓋透過一第二連接層固定於第二凸緣上。 According to one or more embodiments, in the above electronic device, the inner cover is fixed on the first flange through a first connecting layer, and the outer cover is fixed on the second flange through a second connecting layer.

依據一或多個實施例，在上述電子裝置中，外蓋與內蓋之間具有一間隙，內蓋更包含一凸部及一凹槽，凸部從蓋體之一面伸入間隙。凹槽對應凸部，且從蓋體之另面朝凸部之方向凹陷。轉換單元之一部分位於凹槽內。 According to one or more embodiments, in the above-mentioned electronic device, there is a gap between the outer cover and the inner cover, and the inner cover further includes a protrusion and a groove, and the protrusion extends from one surface of the cover into the gap. The groove corresponds to the convex part, and is recessed from the other side of the cover towards the convex part. A part of the conversion unit is located in the groove.

依據一或多個實施例，在上述電子裝置中，蓋體包含一網狀區，網狀區與轉換單元相互重疊。 According to one or more embodiments, in the above electronic device, the cover body includes a mesh area, and the mesh area overlaps with the conversion unit.

如此，透過以上架構，不僅能夠提高電子裝置之結構強度，更能夠降低其內電子元件對外暴露而帶來之安全疑慮。 In this way, through the above structure, not only the structural strength of the electronic device can be improved, but also the safety concerns caused by the exposure of the electronic components inside can be reduced.

以上所述僅係用以闡述本發明所欲解決的問題、解決問題的技術手段、及其產生的功效等等，本發明之具體細節將在下文的實施方式及相關圖式中詳細介紹。 The above description is only used to illustrate the problem to be solved by the present invention, the technical means for solving the problem, and the effects thereof, etc. The specific details of the present invention will be described in detail in the following implementation methods and related drawings.

10、11、12、13、14:電子裝置 10, 11, 12, 13, 14: Electronics

100、101:容器 100, 101: container

110:內底面 110: inner bottom surface

120:內壁 120: inner wall

130:第一凸緣 130: first flange

140:第二凸緣 140: second flange

150:容置通道 150: storage channel

151:入口 151: Entrance

152:間隙 152: Gap

153:分隔區域 153: separate area

160:開口 160: opening

170:外側壁 170: outer wall

200、202、203、204、205:內蓋 200, 202, 203, 204, 205: inner cover

201:外側緣 201: outer edge

210:蓋體 210: cover body

211:開口 211: opening

212:開口 212: opening

213:網狀區 213: Reticular area

220:第一蓋體 220: the first cover

230:第一穿孔 230: First piercing

240:凸部 240: convex part

250:凹槽 250: Groove

300、301、302:外蓋 300, 301, 302: outer cover

310:第二蓋體 310: the second cover

320:第二穿孔 320: second perforation

330:超音波熔接部 330: Ultrasonic welding department

400、401、402、403:轉換單元 400, 401, 402, 403: conversion unit

410:電路板 410: circuit board

411、412:延伸部分 411, 412: extension part

420:高壓側電壓單元 420: High voltage side voltage unit

421:部分 421: part

430:連接單元 430: connection unit

AA、BB:線段 AA, BB: line segment

B:螺柱 B: stud

C:線材 C: wire

L:長軸方向 L: Long axis direction

S1:第一連接層 S1: first connection layer

S2:第二連接層 S2: second connection layer

為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之說明如下：第1圖為本發明一實施例之電子裝置的立體圖；第2圖為第1圖之電子裝置沿線段AA所製成之剖視圖；第3圖為第2圖之電子裝置之分解圖；第4圖為第1圖之電子裝置沿線段BB所製成之剖視圖；第5圖為本發明一實施例之電子裝置之剖視圖，其剖面位置與第2圖相同；第6圖為第5圖之內蓋之上視圖；第7圖為本發明一實施例之電子裝置之剖視圖，其剖面位置與第4圖相同；第8圖為本發明一實施例之電子裝置之局部剖視圖；第9圖為本發明一實施例之電子裝置之剖視圖，其剖面位置與第4圖相同；第10圖為本發明一實施例之內蓋之上視圖；以及第11圖為本發明一實施例之電子裝置的立體圖。 In order to make the above-mentioned and other purposes, features, advantages and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows: Fig. 1 is a perspective view of an electronic device according to an embodiment of the present invention; Fig. 2 is a perspective view of an electronic device according to an embodiment of the present invention; Figure 1 is a cross-sectional view of the electronic device along line AA; Figure 3 is an exploded view of the electronic device in Figure 2; Figure 4 is a cross-sectional view of the electronic device in Figure 1 along line BB; Figure 5 It is a cross-sectional view of an electronic device according to an embodiment of the present invention, and its cross-sectional position is the same as that in Figure 2; Figure 6 is a top view of the inner cover in Figure 5; Figure 7 is a cross-sectional view of an electronic device according to an embodiment of the present invention, Its cross-sectional position is the same as Fig. 4; Fig. 8 is a partial cross-sectional view of an electronic device according to an embodiment of the present invention; Fig. 9 is a cross-sectional view of an electronic device according to an embodiment of the present invention, and its cross-sectional position is the same as Fig. 4; FIG. 10 is a top view of an inner cover according to an embodiment of the present invention; and FIG. 11 is a perspective view of an electronic device according to an embodiment of the present invention.

以下將以圖式揭露本發明之複數個實施例，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本發明。也就是說，在本發明各實施例中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 A plurality of embodiments of the present invention will be disclosed with figures below. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in various embodiments of the invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some well-known structures and components will be shown in a simple and schematic manner in the drawings.

第1圖為本發明一實施例之電子裝置10的立體圖、第2圖為第1圖之電子裝置10沿線段AA所製成之剖視圖及第3圖為第2圖之電子裝置10之分解圖。第4圖為第1圖之電子裝置沿線段BB所製成之剖視圖。 Figure 1 is a perspective view of an electronic device 10 according to an embodiment of the present invention, Figure 2 is a cross-sectional view of the electronic device 10 in Figure 1 along line AA, and Figure 3 is an exploded view of the electronic device 10 in Figure 2 . Fig. 4 is a cross-sectional view of the electronic device in Fig. 1 along line BB.

如第1圖與第2圖所示，在本實施例中，電子裝置10包含一容器100、一內蓋200、一外蓋300與轉換單元400。容器100具有一內底面110與多個內壁120，這些內壁120圍繞且鄰接內底面110，使得這些內壁120與底面共同定義出一容置通道150。容置通道150具有相對內底面110之入口151。在本實施例中，外蓋300覆蓋入口151。內蓋200位於容置通道150內，介於轉換單元400與外蓋300之間，其中內蓋200與外蓋300之間具有一間隙152(例如空氣間隙)，內蓋200與內底面110之間具有一分隔區域153，分隔區域153用以容置所述轉換單元400。轉換單元400具有變壓功能，轉換單元400例如是交流直流轉換器(AC to DC converter)、可連 接市電並對負載輸出直流電源的適配器(Adapter)或充電器(Charger)。轉換單元400也可以是直流交流轉換器(DC to AC converter)，例如逆變器(Inverter)，將直流電源轉換為交流電源饋入至市電。此外，轉換單元400也可能例如是交流轉換器(AC to AC converter)或直流轉換器(DC to DC converter)，然而，本發明並不加以限定。在本實施例中，轉換單元400具有一電路板410與一高壓側電壓單元420。電路板410固定地配置於容器100之內底面110，且高壓側電壓單元420設置於電路板410上，完全位於分隔區域153內，以便能夠讓高壓側電壓單元420從外界隔離。上述之高壓側電壓單元420是指對於轉換單元所具有的一次側及二次側的電路元件及繞組，其中相對高電壓那一側的電路元件及繞組。以用於手機充電的適配器為例，相對高電壓的市電交流電輸入源輸入至一次側電路元件及繞組，並經由二次側的繞組和電路元件輸出相對低電壓的直流電，高壓側電壓單元420即為一次側的電路元件及繞組。相反的，若以應用於太陽能發電並將低壓直流電轉為高壓交流電的逆變器為例，逆變器的一次側電路元件及繞組接收相對低電壓的直流電，並經由二次側的繞組和電路元件輸出相對高電壓的交流電至市電網路中，則此時的高壓側電壓單元420即為二次側的繞組和電路元件。要說明的是，與高壓側電壓單元420相對的低壓側電壓單元(圖未示)，可以依使用者需求自行配置位置，並未加以限定。 As shown in FIG. 1 and FIG. 2 , in this embodiment, the electronic device 10 includes a container 100 , an inner cover 200 , an outer cover 300 and a conversion unit 400 . The container 100 has an inner bottom surface 110 and a plurality of inner walls 120 surrounding and adjoining the inner bottom surface 110 , such that the inner walls 120 and the bottom surface jointly define an accommodating channel 150 . The accommodating channel 150 has an entrance 151 opposite to the inner bottom surface 110 . In this embodiment, the outer cover 300 covers the inlet 151 . The inner cover 200 is located in the accommodating channel 150 , between the conversion unit 400 and the outer cover 300 , wherein there is a gap 152 (such as an air gap) between the inner cover 200 and the outer cover 300 , between the inner cover 200 and the inner bottom surface 110 There is a separation area 153 between them, and the separation area 153 is used for accommodating the conversion unit 400 . The conversion unit 400 has a voltage transformation function, and the conversion unit 400 is, for example, an AC to DC converter (AC to DC converter), which can be connected An adapter (Adapter) or charger (Charger) that is connected to the mains and outputs DC power to the load. The conversion unit 400 may also be a DC to AC converter, such as an inverter, which converts the DC power into AC power and feeds it to the mains. In addition, the conversion unit 400 may also be, for example, an AC converter (AC to AC converter) or a DC converter (DC to DC converter), however, the present invention is not limited thereto. In this embodiment, the conversion unit 400 has a circuit board 410 and a high voltage side voltage unit 420 . The circuit board 410 is fixedly disposed on the inner bottom surface 110 of the container 100 , and the high voltage side voltage unit 420 is disposed on the circuit board 410 completely within the separation area 153 so as to isolate the high voltage side voltage unit 420 from the outside. The above-mentioned high-voltage side voltage unit 420 refers to the circuit elements and windings on the primary side and secondary side of the conversion unit, and the circuit elements and windings on the side of the relatively high voltage side. Taking an adapter for mobile phone charging as an example, a relatively high-voltage mains AC input source is input to the primary-side circuit components and windings, and a relatively low-voltage DC is output through the secondary-side windings and circuit components. The high-voltage side voltage unit 420 is It is the circuit element and winding on the primary side. On the contrary, if an inverter applied to solar power generation and converts low-voltage direct current into high-voltage alternating current is taken as an example, the primary-side circuit components and windings of the inverter receive relatively low-voltage direct current, and pass through the secondary-side windings and circuits. The element outputs relatively high-voltage alternating current to the mains network, and the high-voltage side voltage unit 420 at this time is the winding and circuit element of the secondary side. It should be noted that the low-voltage side voltage unit (not shown) opposite to the high-voltage side voltage unit 420 can be arranged according to the user's needs, and is not limited.

內蓋200之外側緣201分別連接這些內壁120，且密閉地覆蓋分隔區域153。舉例來說，內蓋200之外側緣201具有圍繞內蓋200且朝外伸出之凸緣，然而，本發明不限於此。內蓋200覆蓋且遮蔽電路板410及高壓側電壓單元420。內蓋200之覆蓋面積大致等於分隔區域153之截面積，使得內蓋200完全遮蔽分隔區域153內之所述轉換單元400。此外，要說明的是，在內底面110上還能設置側壁開口(圖未示)，讓連接線材經過側壁開口與轉換單元400連接。在本實施例中，內蓋200與外蓋300均無開口。 The outer edge 201 of the inner cover 200 is respectively connected to the inner walls 120 and covers the partition area 153 hermetically. For example, the outer edge 201 of the inner cover 200 has a flange surrounding the inner cover 200 and protruding outward, however, the present invention is not limited thereto. The inner cover 200 covers and shields the circuit board 410 and the high voltage side voltage unit 420 . The covering area of the inner cover 200 is approximately equal to the cross-sectional area of the partition area 153 , so that the inner cover 200 completely covers the conversion unit 400 in the partition area 153 . In addition, it should be noted that a side wall opening (not shown) can also be provided on the inner bottom surface 110 , so that the connecting wire can be connected to the conversion unit 400 through the side wall opening. In this embodiment, neither the inner cover 200 nor the outer cover 300 has openings.

更具體地，如第2圖至第4圖所示，容器100更包含多個第一凸緣130及多個第二凸緣140。這些第一凸緣130呈階梯狀，形成於內壁120上，且共同圍繞容置通道150之入口151。這些第一凸緣130能夠承載外蓋300，使得外蓋300定位於入口151處，不致落入容置通道150內。這些第二凸緣140呈階梯狀，位於第一凸緣130與內底面110之間，且共同圍繞容置通道150。這些第二凸緣140能夠承載內蓋200，使得內蓋200定位於容置通道150之特定位置。 More specifically, as shown in FIGS. 2 to 4 , the container 100 further includes a plurality of first flanges 130 and a plurality of second flanges 140 . The first flanges 130 are stepped, formed on the inner wall 120 , and jointly surround the entrance 151 of the accommodating channel 150 . These first flanges 130 can carry the outer cover 300 so that the outer cover 300 is positioned at the entrance 151 and will not fall into the accommodating channel 150 . The second flanges 140 are stepped, located between the first flange 130 and the inner bottom surface 110 , and jointly surround the accommodating channel 150 . These second flanges 140 can carry the inner cover 200 so that the inner cover 200 is positioned at a specific position of the accommodating channel 150 .

此外，內蓋200透過一第一連接層S1固定於第一凸緣130上，且外蓋300透過一第二連接層S2固定於第二凸緣140上。舉例來說，內蓋200與外蓋300透過超音波熔接方式分別耦接於第一凸緣130與第二凸緣140上，意即，第一連接層S1及第二連接層S2分別為超音波 熔接部。 In addition, the inner cover 200 is fixed on the first flange 130 through a first connection layer S1 , and the outer cover 300 is fixed on the second flange 140 through a second connection layer S2 . For example, the inner cover 200 and the outer cover 300 are respectively coupled to the first flange 130 and the second flange 140 by means of ultrasonic welding, that is, the first connection layer S1 and the second connection layer S2 are respectively ultra-sonic. sound wave welding part.

然而，本發明不限於此，其他實施例中，內蓋200也可能透過點膠層與鎖固螺絲其中之一固定於第一凸緣130上，以及外蓋300也可能透過點膠層與鎖固螺絲其中之一固定於第二凸緣140上，以配合需求而提高靈活度。 However, the present invention is not limited thereto. In other embodiments, the inner cover 200 may also be fixed on the first flange 130 through one of the adhesive layer and the locking screw, and the outer cover 300 may also be fixed on the first flange 130 through the adhesive layer and the lock. One of the fastening screws is fixed on the second flange 140 to improve the flexibility according to requirements.

須了解到，在本實施例中，舉例來說，所述轉換單元400固定地配置於容器100之內底面110上。然而，本發明不限於此，其他實施例中，所述轉換單元400也可能配置於容器100之內壁120上。 It should be understood that in this embodiment, for example, the conversion unit 400 is fixedly disposed on the inner bottom surface 110 of the container 100 . However, the present invention is not limited thereto. In other embodiments, the conversion unit 400 may also be disposed on the inner wall 120 of the container 100 .

此外，在本實施例中，舉例來說，容器100為矩形體，然而，本發明不限於此，其他實施例中，容器100也可能為具有單一內壁120之圓柱形。在本實施例中，內蓋200可為塑膠射出件，並具有高精度、低價格及高量產性等優點，然而，本發明不限於此。 In addition, in this embodiment, for example, the container 100 is rectangular, however, the present invention is not limited thereto. In other embodiments, the container 100 may also be cylindrical with a single inner wall 120 . In this embodiment, the inner cover 200 can be a plastic injection part, which has the advantages of high precision, low price and high mass production. However, the present invention is not limited thereto.

然而，本發明之其他實施例中，也可能讓內蓋200與外蓋300之間無間隙。 However, in other embodiments of the present invention, there may be no gap between the inner cover 200 and the outer cover 300 .

在本實施例中，上述之電子裝置10不限為移動式設備、戶外用品、電子產品等類似產品。 In this embodiment, the above-mentioned electronic device 10 is not limited to mobile equipment, outdoor products, electronic products and similar products.

第5圖為本發明一實施例之電子裝置11之剖視圖，其剖面位置與第4圖相同。第6圖為第5圖之內蓋202之上視圖。如第5圖與第6圖所示，本實施例之電子裝置11與第2圖之電子裝置10大致相同，其差異為：相較於第2圖之內蓋202並無任何開口，第6圖之內蓋202包含一蓋體210及一開口211。蓋體210覆蓋分隔區域153，開 口211貫穿蓋體210，且分別接通間隙152及分隔區域153。所述轉換單元401之電路板410固定地配置於容器100之內壁120，電路板410例如透過螺柱B固定於容器100之內壁120。高壓側電壓單元420設置於電路板410相對內壁120之一面上。舉例來說，電路板410之一延伸部分411能夠從分隔區域153經由開口211伸入間隙152內，以活用電子裝置11之配置空間。然而，本發明不限於此，電路板410也可能不伸入間隙152內。 FIG. 5 is a cross-sectional view of an electronic device 11 according to an embodiment of the present invention, and its cross-sectional position is the same as that in FIG. 4 . Fig. 6 is a top view of the inner cover 202 in Fig. 5 . As shown in FIG. 5 and FIG. 6, the electronic device 11 of this embodiment is substantially the same as the electronic device 10 in FIG. The inner cover 202 in the figure includes a cover body 210 and an opening 211 . The cover body 210 covers the partition area 153, and the The opening 211 passes through the cover body 210 and connects to the gap 152 and the separation area 153 respectively. The circuit board 410 of the conversion unit 401 is fixedly disposed on the inner wall 120 of the container 100 , and the circuit board 410 is fixed on the inner wall 120 of the container 100 through the stud B, for example. The high voltage side voltage unit 420 is disposed on a surface of the circuit board 410 opposite to the inner wall 120 . For example, an extension portion 411 of the circuit board 410 can protrude into the gap 152 from the separation area 153 through the opening 211 , so as to utilize the configuration space of the electronic device 11 . However, the present invention is not limited thereto, and the circuit board 410 may not protrude into the gap 152 .

第7圖為本發明一實施例之電子裝置12之剖視圖，其剖面位置與第4圖相同。如第7圖所示，本實施例之電子裝置12與第5圖之電子裝置11大致相同，其差異為：本實施例之所述轉換單元402中存在有非為高壓側電壓單元420的其他元件伸出外蓋301外。 FIG. 7 is a cross-sectional view of an electronic device 12 according to an embodiment of the present invention, and its cross-sectional position is the same as that in FIG. 4 . As shown in FIG. 7, the electronic device 12 of this embodiment is substantially the same as the electronic device 11 of FIG. 5, the difference being that there are other components other than the high voltage side voltage unit 420 in the conversion unit 402 of this embodiment. The components protrude from the outer cover 301 .

具體來說，內蓋203具有一第一蓋體220與一第一穿孔230，第一穿孔230貫設於第一蓋體220上。外蓋301具有一第二蓋體310與一第二穿孔320，第二穿孔320貫設於第二蓋體310上，對應第一穿孔230，且透過第一穿孔230接通分隔區域153。所述轉換單元402更包含一連接單元430。所述電路板410固定於內壁120及內蓋203，且電路板410之長軸方向L平行容置通道150之長軸方向L。連接單元430設置於電路板410上，伸入第一穿孔230及第二穿孔320內，以供連接一位於外蓋301之外的外部裝置(圖中未示)。舉例來說，連接單元430為USB連接單元或是AC端線材或端子(市電端)。其他實 施例中，連接單元430也可以是不突出外蓋301，而僅延伸至第二穿孔內。然而，本發明不限於此，其他實施例中，所述轉換單元402也可能只固定至內壁120或第一蓋體220上，其他實施例中，所述內蓋203亦可作為線材(圖中未示)的固定用途，增加穩定性，從而增加連接單元430或線材的搖擺等測試強度。 Specifically, the inner cover 203 has a first cover body 220 and a first through hole 230 , and the first through hole 230 is provided through the first cover body 220 . The outer cover 301 has a second cover body 310 and a second through hole 320 , the second through hole 320 is formed through the second cover body 310 , corresponds to the first through hole 230 , and connects to the separation area 153 through the first through hole 230 . The converting unit 402 further includes a connecting unit 430 . The circuit board 410 is fixed on the inner wall 120 and the inner cover 203 , and the long axis direction L of the circuit board 410 is parallel to the long axis direction L of the accommodating channel 150 . The connection unit 430 is disposed on the circuit board 410 and extends into the first through hole 230 and the second through hole 320 for connecting an external device (not shown) outside the outer cover 301 . For example, the connection unit 430 is a USB connection unit or an AC end wire or terminal (mains end). other real In an embodiment, the connection unit 430 may also not protrude from the outer cover 301, but only extend into the second through hole. However, the present invention is not limited thereto. In other embodiments, the conversion unit 402 may only be fixed to the inner wall 120 or the first cover 220. In other embodiments, the inner cover 203 may also be used as a wire (Fig. (not shown in ) to increase the stability, thereby increasing the test strength of the connection unit 430 or the swing of the wire.

第8圖為本發明一實施例之電子裝置13之局部剖視圖。如第6圖與第8圖所示，本實施例之電子裝置13與第7圖之電子裝置12大致相同，其差異為：內蓋202更具有另一開口212，開口212貫設於蓋體210上且接通分隔區域153。外蓋302更具有至少一超音波熔接部330。超音波熔接部330呈三角狀，且超音波熔接部330凸設於第二蓋體310面向蓋體210之一面，且對應地伸入上述之開口212。 FIG. 8 is a partial cross-sectional view of an electronic device 13 according to an embodiment of the present invention. As shown in FIG. 6 and FIG. 8, the electronic device 13 of this embodiment is substantially the same as the electronic device 12 in FIG. 210 and connected to the separation area 153 . The outer cover 302 further has at least one ultrasonic welding portion 330 . The ultrasonic welding part 330 is triangular in shape, and the ultrasonic welding part 330 protrudes from the side of the second cover 310 facing the cover 210 , and extends into the opening 212 correspondingly.

在將轉換單元402、內蓋202及外蓋302組合至容器100之後，轉換單元402之電路板410之另一延伸部分411伸入開口212，但未伸入所述之間隙152內。接著，透過超音波熔接技術之實行，電路板410之另一延伸部分411能夠與超音波熔接部330熔接，從而固接於外蓋302，以強化電路板410的固定程度。在其他實施例中，超音波熔接部330也能伸入開口212，並與電路板410透過超音波熔接而固接；或者是電路板410伸入所述之間隙152內，與超音波熔接部330透過超音波熔接而固接；或者，超音波熔接部330從開口212伸入所述分隔區域 153，並與電路板410透過超音波熔接而固接，然而，本發明並不加以限制。 After the conversion unit 402 , the inner cover 202 and the outer cover 302 are assembled to the container 100 , another extension 411 of the circuit board 410 of the conversion unit 402 extends into the opening 212 but not into the gap 152 . Then, through the implementation of the ultrasonic welding technology, another extension portion 411 of the circuit board 410 can be welded with the ultrasonic welding portion 330 to be fixed to the outer cover 302 to strengthen the fixing degree of the circuit board 410 . In other embodiments, the ultrasonic welding part 330 can also extend into the opening 212, and be fixedly connected with the circuit board 410 through ultrasonic welding; 330 is fixed through ultrasonic welding; or, the ultrasonic welding part 330 extends into the separation area from the opening 212 153, and is fixed with the circuit board 410 through ultrasonic welding, however, the present invention is not limited thereto.

第9圖為本發明一實施例之電子裝置13之剖視圖，其剖面位置與第4圖相同。如第9圖所示，本實施例之電子裝置13與第2圖之電子裝置10大致相同，其差異為：內蓋204包含一蓋體210、一凸部240及一凹槽250。凸部240從蓋體210之一面伸入間隙152，凹槽250對應凸部240，且從蓋體210之另面朝凸部240之方向凹陷，轉換單元403之一部分位於凹槽250內。在本實施例中，蓋體210、凸部240與凹槽250一體成形，然而，本發明不限於此。 FIG. 9 is a cross-sectional view of an electronic device 13 according to an embodiment of the present invention, and its cross-sectional position is the same as that in FIG. 4 . As shown in FIG. 9 , the electronic device 13 of this embodiment is substantially the same as the electronic device 10 in FIG. 2 , the difference being that the inner cover 204 includes a cover body 210 , a protrusion 240 and a groove 250 . The protrusion 240 extends into the gap 152 from one side of the cover 210 , the groove 250 corresponds to the protrusion 240 , and is recessed from the other side of the cover 210 toward the protrusion 240 , and a part of the conversion unit 403 is located in the groove 250 . In this embodiment, the cover 210 , the protrusion 240 and the groove 250 are integrally formed, however, the present invention is not limited thereto.

具體來說，舉例來說，高壓側電壓單元420之一部分421能夠從分隔區域153伸入凹槽250內，以活用電子裝置13之配置空間。然而，本發明不限於此，其他實施例中，高壓側電壓單元之一部分也可以不伸入凹槽內。 Specifically, for example, a part 421 of the high voltage side voltage unit 420 can protrude from the separation area 153 into the groove 250 to utilize the configuration space of the electronic device 13 . However, the present invention is not limited thereto, and in other embodiments, a part of the high voltage side voltage unit may not protrude into the groove.

第10圖為本發明一實施例之內蓋205之上視圖。本實施例之電子裝置13與第2圖之電子裝置10大致相同，其差異在於，相較於第2圖之內蓋200是完全實體的，在本實施例中，如第2圖與第10圖所示，內蓋205用以遮蔽轉換單元400之部分也可以呈網狀，透過隔離網的方式分隔轉換單元400與外蓋300(參考第2圖)。 FIG. 10 is a top view of the inner cover 205 according to an embodiment of the present invention. The electronic device 13 in this embodiment is substantially the same as the electronic device 10 in FIG. 2, the difference is that the inner cover 200 is completely solid compared to FIG. 2. In this embodiment, as shown in FIG. 2 and FIG. 10 As shown in the figure, the part of the inner cover 205 used to shield the conversion unit 400 may also be in the shape of a net, and the conversion unit 400 and the outer cover 300 are separated by means of an isolation net (refer to FIG. 2 ).

更具體地，如第10圖所示，內蓋205更包含一網狀區213。網狀區213形成於蓋體210上，與於下方之高壓側電壓單元420相互重疊，且讓分隔區域153與間隙 152之間的空氣能夠相互流通(參考第2圖)。如此，使用者不須移除內蓋205，仍能夠透過網狀區213觀看分隔區域153內之轉換單元400，並且同時仍能有隔離效果。 More specifically, as shown in FIG. 10 , the inner cover 205 further includes a mesh area 213 . The mesh area 213 is formed on the cover body 210 and overlaps with the high-voltage side voltage unit 420 below, and makes the separation area 153 and the gap The air between 152 can communicate with each other (refer to Fig. 2). In this way, the user does not need to remove the inner cover 205, and can still view the conversion unit 400 in the partition area 153 through the mesh area 213, and at the same time, the isolation effect can still be achieved.

第11圖為本發明一實施例之電子裝置14的立體圖。如第11圖所示，本實施例之電子裝置14與第2圖之電子裝置10大致相同，其差異在於，相較於第2圖之容器100，本實施例之容器101還具有至少一側壁開口160。側壁開口160開設於容器101之外側壁170，且與容置通道150彼此相通，以供電子裝置14之線材C透過側壁開口160連接至其內之轉換單元400(參考第2圖)。 FIG. 11 is a perspective view of an electronic device 14 according to an embodiment of the present invention. As shown in FIG. 11, the electronic device 14 of this embodiment is substantially the same as the electronic device 10 of FIG. 2, the difference being that, compared with the container 100 of FIG. 2, the container 101 of this embodiment also has at least one side wall Opening 160. The sidewall opening 160 is opened on the outer sidewall 170 of the container 101 and communicates with the accommodating passage 150 for the wires C of the electronic device 14 to be connected to the conversion unit 400 therein through the sidewall opening 160 (refer to FIG. 2 ).

綜上所述，由於上述各實施例之內蓋可能具有破口(如開口或穿孔)或不具有破口，舉例來說，內蓋之覆蓋面積與容置通道之截面積的比例為99%~100%；或為70%~95%，不僅可以調整內蓋之重量，也可以調整容置通道內之氣流大小。此外，上述各實施例之外蓋與內蓋彼此獨立存在且不致彼此連動。 In summary, since the inner cover of each of the above embodiments may have a breach (such as an opening or perforation) or not have a breach, for example, the ratio of the covered area of the inner cover to the cross-sectional area of the accommodating channel is 99%. ~100%; or 70%~95%, not only can adjust the weight of the inner cover, but also can adjust the size of the airflow in the accommodating channel. In addition, the outer cover and the inner cover of the above-mentioned embodiments exist independently of each other and do not interlock with each other.

如此，透過以上各實施例之架構，不僅能夠提高電子裝置之結構強度，使電子裝置之結構不易受外力形變，即便電子裝置之外蓋脫離容器之入口，藉由內蓋之配置，可避免消費者誤觸容器內之轉換單元的特定部分，從而降低衍生安全性問題之機會。 In this way, through the structures of the above embodiments, not only the structural strength of the electronic device can be improved, but the structure of the electronic device is not easily deformed by external force. Or mistakenly touch a specific part of the conversion unit in the container, thereby reducing the chance of deriving safety problems.

最後，上述所揭露之各實施例中，並非用以限定本發明，任何熟習此技藝者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾，皆可被保護於本發明中。 因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Finally, the above-disclosed embodiments are not intended to limit the present invention. Anyone who is skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and all of them can be protected by this invention. inventing. Therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application.

100:容器 100: container

110:內底面 110: inner bottom surface

120:內壁 120: inner wall

150:容置通道 150: storage channel

151:入口 151: Entrance

152:間隙 152: Gap

153:分隔區域 153: separate area

200:內蓋 200: inner cover

201:外側緣 201: outer edge

300:外蓋 300: outer cover

400:轉換單元 400: conversion unit

410:電路板 410: circuit board

420:高壓側電壓單元 420: High voltage side voltage unit

L:長軸方向 L: Long axis direction

S1:第一連接層 S1: first connection layer

S2:第二連接層 S2: second connection layer

AA:線段 AA: line segment

Claims (16)

一種電子裝置，包含：一容器，具有一內底面與至少一內壁，該內底面與該至少一內壁共同定義出一容置通道，該容置通道之一入口相對該內底面；一轉換單元，設置於該容置通道內；一外蓋，覆蓋該入口；以及一內蓋，位於該容置通道內，介於該轉換單元與該外蓋之間，該內蓋與該外蓋之間具有一間隙，該內蓋包含一蓋體及一開口，該開口開設於該蓋體上，接通該間隙及該容置通道，該轉換單元的一部分延伸至該開口，其中該蓋體之至少一外側緣連接該至少一內壁，該轉換單元之該部分經該開口伸入該間隙。 An electronic device, comprising: a container having an inner bottom surface and at least one inner wall, the inner bottom surface and the at least one inner wall jointly define an accommodating passage, and an entrance of the accommodating passage is opposite to the inner bottom surface; a switch A unit is arranged in the accommodating channel; an outer cover covers the entrance; and an inner cover is located in the accommodating channel, between the conversion unit and the outer cover, and the inner cover and the outer cover There is a gap between them, the inner cover includes a cover body and an opening, the opening is opened on the cover body, connects the gap and the accommodating channel, a part of the conversion unit extends to the opening, and the cover body At least one outer edge is connected to the at least one inner wall, and the part of the conversion unit extends into the gap through the opening. 如請求項1所述之電子裝置，其中該容器包含至少一第一凸緣及至少一第二凸緣，該至少一第一凸緣位於該至少一內壁上，用以承載該外蓋，該第二凸緣位於該至少一內壁上，介於該至少一第一凸緣與該內底面之間，用以承載該內蓋。 The electronic device according to claim 1, wherein the container comprises at least one first flange and at least one second flange, and the at least one first flange is located on the at least one inner wall for carrying the outer cover, The second flange is located on the at least one inner wall, between the at least one first flange and the inner bottom surface, and is used for supporting the inner cover. 如請求項2所述之電子裝置，其中該內蓋透過一第一連接層固定於該至少一第一凸緣上，該外蓋透過一第二連接層固定於該至少一第二凸緣上。 The electronic device according to claim 2, wherein the inner cover is fixed on the at least one first flange through a first connection layer, and the outer cover is fixed on the at least one second flange through a second connection layer . 如請求項1所述之電子裝置，其中該內底面或該至少一內壁具有一側壁開口。 The electronic device according to claim 1, wherein the inner bottom surface or the at least one inner wall has a side wall opening. 如請求項1所述之電子裝置，更包含一連接單元，其中該內蓋具有一第一穿孔，該外蓋具有一第二穿孔，該第二穿孔對應該第一穿孔，且透過該第一穿孔接通該容置通道，該連接單元穿過該第一穿孔及該第二穿孔。 The electronic device according to claim 1, further comprising a connection unit, wherein the inner cover has a first through hole, the outer cover has a second through hole, the second through hole corresponds to the first through hole, and passes through the first through hole The through hole is connected to the accommodating channel, and the connecting unit passes through the first through hole and the second through hole. 如請求項1所述之電子裝置，其中該外蓋的一部分連接伸入該開口之該轉換單元的該部分。 The electronic device as claimed in claim 1, wherein a part of the cover is connected to the part of the conversion unit protruding into the opening. 如請求項1所述之電子裝置，其中該轉換單元包含：一電路板，固定於該至少一內壁及該蓋體，該電路板之一部分為該轉換單元的該部分。 The electronic device according to claim 1, wherein the conversion unit includes: a circuit board fixed on the at least one inner wall and the cover, and a part of the circuit board is the part of the conversion unit. 如請求項1所述之電子裝置，其中該內蓋包含一網狀區，該網狀區形成於該蓋體上。 The electronic device according to claim 1, wherein the inner cover includes a mesh area formed on the cover body. 如請求項1所述之電子裝置，其中該內蓋之覆蓋面積與該容置通道之截面積的比例為70%~95%。 The electronic device according to claim 1, wherein the ratio of the covered area of the inner cover to the cross-sectional area of the accommodating channel is 70%-95%. 一種電子裝置，包含：一容器，具有一內底面與至少一內壁，該內底面與該 至少一內壁共同定義出一容置通道，該容置通道之一入口相對該內底面；一轉換單元，具有一設置於該容置通道內之高壓側電壓單元；一外蓋，覆蓋該入口；以及一內蓋，位於該容置通道內，介於該轉換單元與該外蓋之間，該外蓋與該內蓋之間具有一間隙，該內蓋包含一蓋體及一開口，該蓋體遮蔽該高壓側電壓單元，該開口開設於該蓋體上，其中該蓋體之至少一外側緣連接該至少一內壁，且該轉換單元之一部分經該開口伸入該間隙。 An electronic device, comprising: a container having an inner bottom surface and at least one inner wall, the inner bottom surface and the At least one inner wall jointly defines an accommodating passage, and an entrance of the accommodating passage is opposite to the inner bottom surface; a conversion unit has a high-voltage side voltage unit arranged in the accommodating passage; an outer cover covers the entrance ; and an inner cover, located in the accommodating channel, between the conversion unit and the outer cover, there is a gap between the outer cover and the inner cover, the inner cover includes a cover body and an opening, the The cover covers the high-voltage side voltage unit, the opening is opened on the cover, wherein at least one outer edge of the cover is connected to the at least one inner wall, and a part of the conversion unit extends into the gap through the opening. 如請求項10所述之電子裝置，其中該容器包含至少一第一凸緣及至少一第二凸緣，該至少一第一凸緣位於該至少一內壁上，用以承載該外蓋，該第二凸緣位於該至少一內壁上，介於該至少一第一凸緣與該內底面之間，用以承載該內蓋。 The electronic device according to claim 10, wherein the container comprises at least one first flange and at least one second flange, and the at least one first flange is located on the at least one inner wall for supporting the outer cover, The second flange is located on the at least one inner wall, between the at least one first flange and the inner bottom surface, and is used for supporting the inner cover. 如請求項10所述之電子裝置，其中該內蓋更包含一凸部及一凹槽，該凸部從該蓋體之一面伸入該間隙，該凹槽對應該凸部，且從該蓋體之另面朝該凸部之方向凹陷，其中該轉換單元之一部分位於該凹槽內。 The electronic device according to claim 10, wherein the inner cover further includes a protrusion and a groove, the protrusion extends from one surface of the cover into the gap, the groove corresponds to the protrusion, and extends from the cover The other side of the body is recessed towards the direction of the protrusion, wherein a part of the conversion unit is located in the groove. 如請求項10所述之電子裝置，更包含一連接單元，其中該內蓋具有一第一穿孔，該外蓋具有一第二 穿孔，該第二穿孔對應該第一穿孔，且透過該第一穿孔接通該容置通道，該連接單元穿過該第一穿孔及該第二穿孔。 The electronic device as described in claim 10 further comprises a connection unit, wherein the inner cover has a first through hole, and the outer cover has a second A through hole, the second through hole corresponds to the first through hole, and connects to the accommodating channel through the first through hole, and the connecting unit passes through the first through hole and the second through hole. 如請求項10所述之電子裝置，其中該內蓋之覆蓋面積與該容置通道之截面積的比例為70%~95%。 The electronic device according to claim 10, wherein the ratio of the covered area of the inner cover to the cross-sectional area of the accommodating channel is 70%-95%. 如請求項10所述之電子裝置，其中該內蓋包含一網狀區，該網狀區形成於該蓋體上，且與該高壓側電壓單元相互重疊。 The electronic device according to claim 10, wherein the inner cover includes a mesh area formed on the cover body and overlapping with the high voltage side voltage unit. 如請求項10所述之電子裝置，其中該內底面或該至少一內壁具有一側壁開口。 The electronic device according to claim 10, wherein the inner bottom surface or the at least one inner wall has a side wall opening.

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