TWI804158B

TWI804158B - Card structure

Info

Publication number: TWI804158B
Application number: TW111101777A
Authority: TW
Inventors: 黃文賢; 劉啟光; 陳岱頤; 林詩宗
Original assignee: 宏通數碼科技股份有限公司
Priority date: 2022-01-17
Filing date: 2022-01-17
Publication date: 2023-06-01
Also published as: TW202330255A

Abstract

A card structure is provided. The card structure includes a plate body, a chip, and a power transmission component. The plate body includes a first material plate, a second material plate, and a third material plate. The third material plate is located between the first material plate and the second material plate. The first material plate, the second material plate, and the third material plate are connected in parallel; materials of the plate body includes a first material and a second material. The first material is different from the second material and is plant fiber. The chip is disposed in the plate body, and the power transmission component is disposed in the third plate and electrically connected to the chip.

Description

卡片結構card structure

本發明是有關於一種卡片結構，特別是有關於一種環保卡片結構。The present invention relates to a card structure, in particular to an environment-friendly card structure.

可攜式卡片廣泛用於現今日常生活中例如消費、身分識別、交通、財務管理等各種領域。習知卡片的材料多為聚氯乙烯等塑料，強韌度及耐用性無虞。然聚氯乙烯除難以分解之外，燃燒時還可能產生有毒物質，對環境及健康都有不良的影響。Portable cards are widely used in various fields such as consumption, identification, transportation, financial management, etc. in today's daily life. Conventional cards are mostly made of plastics such as polyvinyl chloride, which have no worries about their strength, toughness and durability. However, in addition to being difficult to decompose, PVC may also produce toxic substances when burned, which has adverse effects on the environment and health.

本發明提供一種卡片結構，採用相對天然之材料，符合減塑及環保的訴求。The present invention provides a card structure, which uses relatively natural materials and meets the requirements of plastic reduction and environmental protection.

本發明所提供的卡片結構包括板體、晶片以及電力傳輸元件。板體包含第一板材、第二板材以及第三板材。第三板材位於第一板材與第二板材間，且第一板材、第二板材以及第三板材平行相疊連接；其中板體之材料包含第一材料以及第二材料，第一材料與第二材料不同，且第一材料為植物纖維。晶片設置於板體內，電力傳輸元件設置於第三板材且與晶片電性連接。The card structure provided by the invention includes a board body, a chip and a power transmission element. The board body includes a first board, a second board and a third board. The third plate is located between the first plate and the second plate, and the first plate, the second plate and the third plate are connected in parallel; wherein the material of the plate includes the first material and the second material, and the first material and the second The materials are different, and the first material is plant fiber. The chip is arranged in the board body, and the power transmission element is arranged in the third board and electrically connected with the chip.

在本發明的一實施例中，上述之植物纖維構成至少一植物纖維層，且第一板材、第二板材以及第三板材中之至少之一由至少一植物纖維層所構成。In an embodiment of the present invention, the above-mentioned plant fibers constitute at least one plant fiber layer, and at least one of the first board, the second board and the third board is constituted by at least one plant fiber layer.

在本發明的一實施例中，上述之第二材料為聚合材料；聚合材料構成至少一聚合材料層，且第一板材、第二板材以及第三板材中之至少之一由至少一聚合材料層所構成。In an embodiment of the present invention, the above-mentioned second material is a polymeric material; the polymeric material constitutes at least one polymeric material layer, and at least one of the first board, the second board and the third board is composed of at least one polymeric material layer constituted.

在本發明的一實施例中，上述之至少一植物纖維層及至少一聚合材料層相疊設置且透過壓合步驟而連接。In an embodiment of the present invention, the above-mentioned at least one plant fiber layer and at least one polymer material layer are stacked and connected through a pressing step.

在本發明的一實施例中，上述之卡片結構更包含多個植物纖維層以及多個聚合材料層；多個植物纖維層以及多個聚合材料層交互堆疊設置且構成第三板材。In an embodiment of the present invention, the above card structure further includes a plurality of plant fiber layers and a plurality of polymer material layers; the plurality of plant fiber layers and the plurality of polymer material layers are stacked alternately to form a third board.

在本發明的一實施例中，上述之第二材料為碳酸鈣；碳酸鈣構成至少一碳酸鈣層，且第一板材、第二板材以及第三板材中之至少之一由至少一碳酸鈣層所構成。In one embodiment of the present invention, the above-mentioned second material is calcium carbonate; calcium carbonate constitutes at least one calcium carbonate layer, and at least one of the first plate, the second plate and the third plate is composed of at least one calcium carbonate layer constituted.

在本發明的一實施例中，上述之板體之材料更包含第三材料；第三材料為碳酸鈣；碳酸鈣構成至少一碳酸鈣層，且第一板材、第二板材以及第三板材中之至少之一由至少一碳酸鈣層所構成。In an embodiment of the present invention, the material of the above board body further includes a third material; the third material is calcium carbonate; calcium carbonate constitutes at least one calcium carbonate layer, and the first board, the second board and the third board At least one of them is composed of at least one calcium carbonate layer.

在本發明的一實施例中，上述之植物纖維層與至少一碳酸鈣層或至少一聚合材料層相疊設置且透過壓合步驟而連接。In an embodiment of the present invention, the above-mentioned plant fiber layer and at least one calcium carbonate layer or at least one polymer material layer are stacked and connected through a pressing step.

在本發明的一實施例中，上述之至少一植物纖維層更透過佈膠步驟以與至少一聚合材料層或至少一碳酸鈣層壓合而連接。In an embodiment of the present invention, the above-mentioned at least one plant fiber layer is further connected to at least one polymer material layer or at least one calcium carbonate layer by lamination through a glue laying step.

在本發明的一實施例中，上述之第一板材更包括第一印刷層，而第二板材更包括第二印刷層。In an embodiment of the present invention, the above-mentioned first board further includes a first printing layer, and the second board further includes a second printing layer.

在本發明的一實施例中，上述之板體形成有容置槽；容置槽開口於板體之表面，且晶片設置於容置槽內。In an embodiment of the present invention, the above-mentioned board body is formed with an accommodating groove; the accommodating groove is opened on the surface of the board body, and the chip is arranged in the accommodating groove.

本發明因採用植物纖維，因此板體之材料較為天然、對環境友善，且有助減低塑膠之使用。Because the present invention uses plant fibers, the material of the board body is more natural, friendly to the environment, and helps to reduce the use of plastics.

為讓本發明之上述和其他目的、特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式，作詳細說明如下。In order to make the above and other objects, features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

本發明之卡片結構適用於例如會員卡、名片、廣告小卡、金融卡、***、儲值卡、交通卡、門禁卡、健保卡及自然人憑證等，但不以此為限。此外本發明之卡片結構可為非接觸式或接觸式卡片，前者透過例如與讀寫裝置間的感應生電進行資訊的讀取或寫入，後者透過例如金屬觸點、晶片接點或磁條來實現電力供給並完成通訊。The card structure of the present invention is applicable to, for example, membership cards, business cards, advertising small cards, financial cards, credit cards, stored-value cards, traffic cards, access control cards, health insurance cards, and certificates for natural persons, but not limited thereto. In addition, the card structure of the present invention can be a non-contact or contact card. The former reads or writes information through, for example, inductive electricity between the read-write device, and the latter through, for example, metal contacts, chip contacts or magnetic strips. To achieve power supply and complete communication.

圖1是本發明之一實施例的卡片結構的立體示意圖，圖2是圖1的分解圖。請參照圖1及圖2，本實施例之卡片結構1包括板體10、晶片200以及電力傳輸元件300。板體10包含第一板材110、第二板材120以及第三板材130。第三板材130位於第一板材110與第二板材120間，且第一板材110、第二板材120與第三板材130相疊連接。電力傳輸元件300例如為天線。晶片200以及電力傳輸元件300設置於板體10內，且電力傳輸元件300與晶片200電性連接。如圖2所示，電力傳輸元件300進一步設置於板體10的第三板材130，而晶片200可設置於第一板材110及第三板材130、或第二板材120及第三板材130。在本發明較佳實施例中，晶片200較佳裸露於第一板材110或第二板材120的表面，且可用以接觸通訊。本發明可更包括多個晶片以及電力傳輸元件。晶片200與電力傳輸元件300以外之其餘晶片與電力傳輸元件亦可分別相互搭配及電性連接。FIG. 1 is a schematic perspective view of a card structure according to an embodiment of the present invention, and FIG. 2 is an exploded view of FIG. 1 . Please refer to FIG. 1 and FIG. 2 , the card structure 1 of this embodiment includes a board body 10 , a chip 200 and a power transmission element 300 . The board body 10 includes a first board 110 , a second board 120 and a third board 130 . The third plate 130 is located between the first plate 110 and the second plate 120 , and the first plate 110 , the second plate 120 and the third plate 130 are stacked and connected. The power transmission element 300 is, for example, an antenna. The chip 200 and the power transmission element 300 are disposed in the board body 10 , and the power transmission element 300 is electrically connected to the chip 200 . As shown in FIG. 2 , the power transmission element 300 is further disposed on the third board 130 of the board body 10 , and the chip 200 can be disposed on the first board 110 and the third board 130 , or the second board 120 and the third board 130 . In a preferred embodiment of the present invention, the chip 200 is preferably exposed on the surface of the first plate 110 or the second plate 120 and can be used for contact communication. The invention may further include multiple chips and power delivery elements. Other chips and power transmission elements other than the chip 200 and the power transmission element 300 can also be matched and electrically connected to each other respectively.

板體10的材料包含第一材料以及第二材料，第一材料與第二材料不同，且第一材料為植物纖維。較佳而言，植物纖維構成至少一植物纖維層，而至少一植物纖維層構成第一板材110、第二板材120及/或第三板材130中之至少之一。植物纖維的來源可為例如木材、稻草、蔗渣、蘆葦、廢紙等，且可進一步來自木漿或紙漿。在本發明若干實施例中，是以例如白牛皮紙作為植物纖維層。白牛皮紙可直接購自廠商，或基於本發明而特別訂製。一張白牛皮紙可作為一層的植物纖維層，然亦可為多張紙（不限為白牛皮紙）相疊連接以形成一層的植物纖維層。在若干實施例中，舉例來說，第一板材110、第二板材120或第三板材130是由多個層所構成，且多個層中至少之一為植物纖維層。The material of the plate body 10 includes a first material and a second material, the first material is different from the second material, and the first material is plant fiber. Preferably, the plant fibers constitute at least one plant fiber layer, and at least one plant fiber layer constitutes at least one of the first board 110 , the second board 120 and/or the third board 130 . The source of plant fibers can be, for example, wood, straw, bagasse, reed, waste paper, etc., and can further be derived from wood pulp or paper pulp. In several embodiments of the present invention, for example, white kraft paper is used as the plant fiber layer. White kraft paper can be purchased directly from the manufacturer, or it can be specially ordered based on the present invention. A piece of white kraft paper can be used as one layer of plant fiber layer, but also multiple sheets of paper (not limited to white kraft paper) can be stacked and connected to form a layer of plant fiber layer. In several embodiments, for example, the first board 110 , the second board 120 or the third board 130 is composed of multiple layers, and at least one of the multiple layers is a plant fiber layer.

第二材料可為聚合材料。較佳而言，聚合材料構成至少一聚合材料層，而至少一聚合材料層構成第一板材110、第二板材120及/或第三板材130中之至少之一。聚合材料可為例如聚對苯二甲酸乙二醇酯-1,4環己烷二甲醇酯 (PETG)、聚碳酸酯 (PC)、聚氯乙烯 (PVC)、聚對苯二甲酸乙二酯 (PET)以及丙烯腈-丁二烯-苯乙烯共聚物(ABS)、聚甲基丙烯酸甲酯 (PMMA)或選自其的組合，以及生物可分解者如脂肪族聚酯 (Aliphatic polyesters)、脂肪族－芳香族共聚合物 (Aliphatic-aromatic polyester copolymers)聚乳酸─脂肪族聚酯共聚合物 (CPLA, Polylactide aliphatic polyester copolymers) 或選自其的組合。在本發明較佳實施例中，第二材料較佳為PETG。The second material may be a polymeric material. Preferably, the polymeric material constitutes at least one polymeric material layer, and the at least one polymeric material layer constitutes at least one of the first sheet 110 , the second sheet 120 and/or the third sheet 130 . The polymeric material may be, for example, polyethylene terephthalate-1,4-cyclohexanedimethanol (PETG), polycarbonate (PC), polyvinyl chloride (PVC), polyethylene terephthalate (PET) and acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA) or a combination selected from it, and biodegradable ones such as aliphatic polyesters (Aliphatic polyesters), Aliphatic-aromatic copolymers (Aliphatic-aromatic polyester copolymers), polylactic acid-aliphatic polyester copolymers (CPLA, Polylactide aliphatic polyester copolymers), or a combination selected from them. In a preferred embodiment of the present invention, the second material is preferably PETG.

多個聚合材料層間可相疊設置並連接，多個植物纖維層間亦可相疊設置並連接，而聚合材料層亦可與植物纖維層交疊設置並連接。所述設置及連接可進一步構成第一板材110、第二板材120或第三板材130。然而，所述設置及連接亦可發生於相鄰的板材間。舉例來說，屬於第一板材110的聚合材料層與屬於第三板材130的聚合材料層相疊連接。Multiple polymeric material layers can be stacked and connected, multiple plant fiber layers can be stacked and connected, and polymeric material layers can be stacked and connected with plant fiber layers. The arrangement and connection can further constitute the first board 110 , the second board 120 or the third board 130 . However, the arrangement and connection can also take place between adjacent panels. For example, the polymer material layer belonging to the first board 110 is stacked and connected to the polymer material layer belonging to the third board 130 .

圖3所示為本發明另一實施例的剖視示意圖。在圖3之實施例中，板體10具有多個植物纖維層400以及多個聚合材料層500。多個植物纖維層400更包含第一植物纖維層410以及第二植物纖維420，而多個聚合材料層500包含第一聚合材料層510a～510b、第二聚合材料層520a～520b以及第三聚合材料層530a～530c。如圖所示，第一植物纖維層410、第二植物纖維420與第三聚合材料層530a～530b交互堆疊、連接並構成第三板材130，且電力傳輸元件300設置於其中之第三聚合材料層530b。第一聚合材料層510a與510b構成第一板材110，第二聚合材料層520a與520b構成第二板材120，第一聚合材料層510b及第二聚合材料層520b並分別與第三板材130中的第三聚合材料層530a、530c連接而構成板體10。所構成之板體10的厚度較佳為0.68～0.80 mm。FIG. 3 is a schematic cross-sectional view of another embodiment of the present invention. In the embodiment of FIG. 3 , the board body 10 has a plurality of plant fiber layers 400 and a plurality of polymer material layers 500 . The multiple plant fiber layers 400 further include a first plant fiber layer 410 and a second plant fiber 420, and the multiple polymer material layers 500 include first polymer material layers 510a-510b, second polymer material layers 520a-520b, and a third polymer material layer. Material layers 530a-530c. As shown in the figure, the first plant fiber layer 410, the second plant fiber 420 and the third polymer material layers 530a-530b are alternately stacked and connected to form the third plate 130, and the third polymer material in which the power transmission element 300 is disposed. layer 530b. The first polymeric material layers 510a and 510b form the first sheet 110, the second polymeric material layers 520a and 520b form the second sheet 120, and the first polymeric material layer 510b and the second polymeric material layer 520b are respectively connected with the third sheet 130. The third polymer material layers 530a, 530c are connected to form the plate body 10 . The thickness of the formed plate body 10 is preferably 0.68-0.80 mm.

前述多個聚合材料層500間、多個植物纖維層400間，以及聚合材料層500與植物纖維層400間的連接可透過壓合步驟達成。當進行多個聚合材料層500的壓合時，壓合之條件例如為：操作壓力20～50 bar 、操作溫度100～200℃以及持續時間15～30分鐘（於本文又稱熱壓合）；操作壓力20～100 bar 、操作溫度10～40℃以及持續時間15～30分鐘（於本文又稱冷壓合）。當進行多個植物纖維層400間或聚合材料層500與植物纖維層400的壓合時，較佳更先執行佈膠步驟，而使相鄰兩層間透過膠材連接。佈膠步驟所用之膠材，舉例來說，可以是環氧樹脂膠，然不以此為限。佈膠可以例如浸泡的方式進行，而使膠材滲入整層的植物纖維中。The aforementioned connections between the multiple polymeric material layers 500 , between the multiple plant fiber layers 400 , and between the polymeric material layers 500 and the plant fiber layers 400 can be achieved through a pressing step. When performing lamination of multiple polymeric material layers 500, the lamination conditions are, for example: operating pressure of 20-50 bar, operating temperature of 100-200° C., and duration of 15-30 minutes (also referred to as thermal lamination herein); The operating pressure is 20-100 bar, the operating temperature is 10-40°C, and the duration is 15-30 minutes (also called cold pressing in this article). When performing lamination between multiple plant fiber layers 400 or between the polymer material layer 500 and the plant fiber layer 400 , it is preferable to perform the glue laying step first, so that two adjacent layers are connected through the glue material. The glue material used in the glue laying step, for example, can be epoxy resin glue, but it is not limited thereto. Cloth glue can be carried out, for example, by soaking, so that the glue material penetrates into the whole layer of plant fibers.

以下透過圖3之實施例舉例說明壓合步驟的進行。如圖3所示，進行壓合步驟前可對第一植物纖維層410以及第二植物纖維層420作泡膠處理。接著依序將第一聚合材料層510a～510b、第三聚合材料層530a、第一植物纖維層410、第三聚合材料層530b、第二植物纖維層420、第三聚合材料層530c以及第二聚合材料層520b、520a相疊設置，然後以20～50 bar 的操作壓力、100～200℃的操作溫度以及15～30分鐘的持續時間進行壓合。此外亦可在熱壓合後，再行冷壓合。The following uses the embodiment of FIG. 3 as an example to illustrate the pressing step. As shown in FIG. 3 , before the pressing step, the first plant fiber layer 410 and the second plant fiber layer 420 can be treated with foam. Next, the first polymer material layer 510a-510b, the third polymer material layer 530a, the first plant fiber layer 410, the third polymer material layer 530b, the second plant fiber layer 420, the third polymer material layer 530c and the second The polymeric material layers 520b and 520a are stacked one on top of the other, and then pressed together at an operating pressure of 20-50 bar, at an operating temperature of 100-200° C., and for a duration of 15-30 minutes. In addition, cold pressing can also be performed after hot pressing.

再以圖3之實施例為例，壓合步驟或可以兩次進行。舉例來說，以如前述之熱壓合及冷壓合進行第一植物纖維層410、第二植物纖維420與第三聚合材料層530a～530b的壓合並形成第三板材130，接著再進行第一聚合材料層510a～510b、第三板材130以及第二聚合材料層520a～520b的壓合（包含熱壓合及冷壓合），並形成板體10。Taking the embodiment of FIG. 3 as an example, the pressing step may be performed twice. For example, the first plant fiber layer 410, the second plant fiber 420, and the third polymeric material layers 530a-530b are pressed together to form the third board 130 by means of hot pressing and cold pressing as described above, and then the second The first polymer material layer 510 a - 510 b , the third plate 130 , and the second polymer material layer 520 a - 520 b are laminated (including hot pressing and cold pressing) to form the plate body 10 .

如圖1～3所示，卡片結構1之板體10可形成有容置槽800。容置槽800開口於板體10的表面，形狀與晶片200之形狀相應，且深度可達第三板材130。容置槽800可於前述壓合步驟之後再於板體10上挖設而得，然不限於此。容置槽800之設置可以任何合理的方式達成，於此不贅述。晶片200可嵌設於容置槽800內並與第三板材130的電力傳輸元件300接觸。晶片200之嵌設與固定可以任何合理的方式達成，於此不贅述。As shown in FIGS. 1-3 , the plate body 10 of the card structure 1 can be formed with a receiving groove 800 . The accommodating groove 800 is opened on the surface of the plate body 10 , has a shape corresponding to the shape of the chip 200 , and has a depth reaching the third plate 130 . The accommodating groove 800 can be excavated on the board body 10 after the aforementioned pressing step, but is not limited thereto. The accommodating groove 800 can be arranged in any reasonable manner, which will not be repeated here. The chip 200 can be embedded in the receiving groove 800 and be in contact with the power transmission element 300 of the third plate 130 . The embedding and fixing of the chip 200 can be achieved in any reasonable way, which will not be repeated here.

在本發明若干實施例中，第二材料可為碳酸鈣。較佳而言，碳酸鈣構成至少一碳酸鈣層，而至少一碳酸鈣層構成第一板材110、第二板材120及/或第三板材130中之至少之一。然碳酸鈣層的成分並不限於僅為碳酸鈣。在本發明若干實施例中，是以例如石頭紙作為碳酸鈣層。石頭紙可直接購自廠商，或因本發明而特別訂製。一張石頭紙可作為一層的碳酸鈣層，然亦可為多張石頭紙相疊連接以形成一層的碳酸鈣層。舉例來說，第一板材110、第二板材120或第三板材130可完全是以多張石頭紙相疊連接所構成。In several embodiments of the invention, the second material may be calcium carbonate. Preferably, calcium carbonate constitutes at least one calcium carbonate layer, and at least one calcium carbonate layer constitutes at least one of the first plate 110 , the second plate 120 and/or the third plate 130 . However, the composition of the calcium carbonate layer is not limited to only calcium carbonate. In several embodiments of the present invention, for example, stone paper is used as the calcium carbonate layer. Stone paper can be purchased directly from the manufacturer, or it can be specially ordered for this invention. A piece of stone paper can be used as one layer of calcium carbonate layer, but also can be stacked and connected to form a layer of calcium carbonate layer. For example, the first board 110 , the second board 120 or the third board 130 can be composed entirely of stacked and connected pieces of stone paper.

石頭紙的主要成分包括石頭粉，石頭粉的成分包含碳酸鈣。石頭紙還可進一步含有其他成分例如聚合物、膠合劑、添加劑等，其中聚合物可為塑膠如聚乙烯或生物可分解聚合物例如聚乳酸。本發明不限制石頭紙之來源或成分規格。The main ingredient of stone paper includes stone powder, and the ingredient of stone powder contains calcium carbonate. Stone paper may further contain other components such as polymers, binders, additives, etc., wherein the polymers may be plastics such as polyethylene or biodegradable polymers such as polylactic acid. The invention does not limit the source or composition specification of the stone paper.

在本發明若干實施例中，如圖4所示，板體10a的材料更包含第三材料。第三材料與第一、第二材料都不同。舉例來說，第三材料為碳酸鈣且構成至少一碳酸鈣層，第一及第二材料分別為如前述之植物纖維以及聚合材料。如圖4所示，板體10a包含碳酸鈣層600。碳酸鈣層600包含例如第一碳酸鈣層610以及第二碳酸鈣層620。第一碳酸鈣層610與第一聚合材料層510a構成第一板材110a，第二碳酸鈣層620與第二聚合材料層520a構成第二板材120a。第三板材130a的構成可如前述第三板材130而包含例如第一植物纖維層410、第二植物纖維層420與第三聚合材料層530a～530c。然可以理解的是，第三板材130a亦可由植物纖維與碳酸鈣構成。In several embodiments of the present invention, as shown in FIG. 4 , the material of the plate body 10 a further includes a third material. The third material is different from both the first and second materials. For example, the third material is calcium carbonate and constitutes at least one calcium carbonate layer, and the first and second materials are respectively the aforementioned plant fibers and polymeric materials. As shown in FIG. 4 , the plate body 10 a includes a calcium carbonate layer 600 . The calcium carbonate layer 600 includes, for example, a first calcium carbonate layer 610 and a second calcium carbonate layer 620 . The first calcium carbonate layer 610 and the first polymeric material layer 510a form the first board 110a, and the second calcium carbonate layer 620 and the second polymeric material layer 520a form the second board 120a. The third board 130 a can be composed like the aforementioned third board 130 , including, for example, the first plant fiber layer 410 , the second plant fiber layer 420 and the third polymer material layers 530 a - 530 c. However, it can be understood that the third board 130a can also be made of plant fiber and calcium carbonate.

碳酸鈣層600之間以及碳酸鈣層600與聚合材料層500或植物纖維層400間的連接亦可透過壓合步驟達成，壓合之條件可參前述。此外當進行碳酸鈣層600之壓合時，較佳亦先行佈膠。碳酸鈣層600所用之膠材，舉例來說，可以是熱熔膠、環氧樹脂膠、厭氧膠，然不以此為限。The connection between the calcium carbonate layers 600 and the connection between the calcium carbonate layer 600 and the polymeric material layer 500 or the plant fiber layer 400 can also be achieved through a pressing step, and the conditions of the pressing can be referred to above. In addition, when laminating the calcium carbonate layer 600, it is preferable to apply glue first. The adhesive used for the calcium carbonate layer 600 can be, for example, hot melt adhesive, epoxy resin adhesive, anaerobic adhesive, but not limited thereto.

圖5所示為本發明另一實施例的剖視示意圖。如圖5所示，板體10b可包含印刷層700。印刷層700較佳設置於第一板材110b、第二板材120b之至少之一。在圖5之實施例中，第一板材110b 包含第一印刷層710，第二板材120b包含第二印刷層720。第一印刷層710及第二印刷層720上有顏料形成之色塊、圖案、文字或其組合，其中顏料可透過任何方式分配其上。FIG. 5 is a schematic cross-sectional view of another embodiment of the present invention. As shown in FIG. 5 , the board body 10 b may include a printing layer 700 . The printing layer 700 is preferably disposed on at least one of the first plate 110b and the second plate 120b. In the embodiment of FIG. 5 , the first board 110 b includes a first printing layer 710 , and the second board 120 b includes a second printing layer 720 . The first printing layer 710 and the second printing layer 720 have color blocks, patterns, characters or combinations thereof formed by pigments, wherein the pigments can be distributed thereon by any means.

印刷層700的材料可為例如碳酸鈣、聚合材料、植物纖維。如圖3實施例中之第一聚合物層510b、第二聚合物層520b，圖4實施例中第一碳酸鈣層610、第二碳酸鈣層620都可進一步作為印刷層700。在圖5之實施例中，當第一板材110b（第二板材120b）具有印刷層700，第一板材110b（第二板材120b）較佳更有至少一聚合材料層500b。聚合材料層500b可保護印刷層700，其並且透光而可顯露印刷層700之色塊、圖案、文字。The material of the printing layer 700 may be, for example, calcium carbonate, polymeric material, plant fiber. As shown in the first polymer layer 510b and the second polymer layer 520b in the embodiment of FIG. 3 , the first calcium carbonate layer 610 and the second calcium carbonate layer 620 in the embodiment of FIG. 4 can be further used as the printing layer 700 . In the embodiment of FIG. 5 , when the first board 110b (the second board 120b ) has the printing layer 700 , the first board 110b (the second board 120b ) preferably further has at least one polymeric material layer 500b. The polymeric material layer 500 b can protect the printing layer 700 , and it is transparent to reveal the color blocks, patterns and characters of the printing layer 700 .

本發明不限制碳酸鈣層、聚合材料層以及植物纖維層的層數及厚度。舉例來說，當層厚較厚或者成分密度較高，則層數亦可較少。較佳而言，所有層堆疊連接所形成之板體的厚度為0.68～0.80 mm，且經撓曲測試後，板體可以回復至測試前的平整狀態，符合例如ISO/IEC FDIS7810的標準。而因植物纖維等成分相對天然，因此本發明有助於減塑且具環境友善之特性。The present invention does not limit the number and thickness of the calcium carbonate layer, the polymer material layer and the plant fiber layer. For example, when the layer thickness is thicker or the component density is higher, the number of layers may be less. Preferably, the thickness of the board body formed by stacking and connecting all layers is 0.68-0.80 mm, and after the bending test, the board body can return to the flat state before the test, which meets the standard of ISO/IEC FDIS7810. And because the components such as plant fibers are relatively natural, the present invention helps to reduce plastic and has the characteristics of environmental friendliness.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field of the present invention can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application.

1、1a、1b:卡片結構 10、10a、10b:板體 110、110a、110b:第一板材 120、120a、120b:第二板材 130、130a、130b:第三板材 200:晶片 300:電力傳輸元件 400:植物纖維層 410:第一植物纖維層 420:第二植物纖維層 500、500b:聚合材料層 510a、510b:第一聚合材料層 520a、520b:第二聚合材料層 530a、530b、530c:第三聚合材料層 600:碳酸鈣層 610:第一碳酸鈣層 620:第二碳酸鈣層 700:印刷層 710:第一印刷層 720:第二印刷層 800:容置槽 1, 1a, 1b: card structure 10, 10a, 10b: plate body 110, 110a, 110b: first plate 120, 120a, 120b: the second plate 130, 130a, 130b: the third plate 200: chip 300: Power transmission components 400: plant fiber layer 410: the first plant fiber layer 420: the second plant fiber layer 500, 500b: layer of polymeric material 510a, 510b: first layer of polymeric material 520a, 520b: Second layer of polymeric material 530a, 530b, 530c: third layer of polymeric material 600: calcium carbonate layer 610: first calcium carbonate layer 620: second calcium carbonate layer 700: printing layer 710: first printing layer 720: second printing layer 800: holding tank

圖1所示為本發明之一實施例的卡片結構的立體示意圖。圖2所示為圖1之分解示意圖。圖3為本發明之另一實施例的卡片結構的剖視示意圖。圖4為本發明之另一實施例的卡片結構的剖視示意圖。圖5為本發明之另一實施例的卡片結構的剖視示意圖。 FIG. 1 is a three-dimensional schematic diagram of a card structure according to an embodiment of the present invention. FIG. 2 is an exploded schematic view of FIG. 1 . FIG. 3 is a schematic cross-sectional view of a card structure according to another embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of a card structure according to another embodiment of the present invention. FIG. 5 is a schematic cross-sectional view of a card structure according to another embodiment of the present invention.

1:卡片結構 1: Card structure

10:板體 10: board body

110:第一板材 110: The first plate

120:第二板材 120: Second plate

130:第三板材 130: the third plate

200:晶片 200: chip

300:電力傳輸元件 300: Power transmission components

400:植物纖維層 400: plant fiber layer

410:第一植物纖維層 410: the first plant fiber layer

420:第二植物纖維層 420: the second plant fiber layer

500:聚合材料層 500: polymer material layer

510a、510b:第一聚合材料層 510a, 510b: first layer of polymeric material

520a、520b:第二聚合材料層 520a, 520b: Second layer of polymeric material

530a、530b、530c:第三聚合材料層 530a, 530b, 530c: third layer of polymeric material

Claims

一種卡片結構，包括：一板體，包含：一第一板材、一第二板材以及一第三板材，該第三板材位於該第一板材與該第二板材間，且該第一板材、該第二板材以及該第三板材平行相疊連接；其中該板體由多個材料層相疊設置而構成，且該材料包含一植物纖維材料以及一聚合材料；其中：該植物纖維構材料構成至少一植物纖維層，且該第一板材、該第二板材以及該第三板材中之至少之一由該至少一植物纖維層所構成；該聚合材料構成至少一聚合材料層，且該第三板材至少由該至少一聚合材料層所構成；一膠材，配置於該至少一植物纖維層上，用以使該至少一植物纖維層與相鄰之該些材料層透過一壓合步驟而連接；其中該壓合步驟包含壓力20~50bar以及溫度100~200℃的壓合條件；一晶片，設置於該板體內；以及一電力傳輸元件，設置於該第三板材的該至少一聚合材料層，且與該晶片電性連接。 A card structure, comprising: a plate body, including: a first plate, a second plate and a third plate, the third plate is located between the first plate and the second plate, and the first plate, the The second plate and the third plate are stacked and connected in parallel; wherein the plate body is formed by stacking multiple material layers, and the material includes a plant fiber material and a polymer material; wherein: the plant fiber structure material constitutes at least A plant fiber layer, and at least one of the first plate, the second plate and the third plate is composed of the at least one plant fiber layer; the polymer material constitutes at least one polymer material layer, and the third plate Consisting of at least one polymeric material layer; a glue material, arranged on the at least one plant fiber layer, for connecting the at least one plant fiber layer and the adjacent material layers through a pressing step; Wherein the pressing step includes pressing conditions of a pressure of 20-50 bar and a temperature of 100-200°C; a chip disposed in the board; and a power transmission element disposed in the at least one polymeric material layer of the third board, And it is electrically connected with the chip.

如請求項1所述之卡片結構，其中該第一板材以及該第二板材中之至少之一由該至少一聚合材料層所構成。 The card structure according to claim 1, wherein at least one of the first sheet and the second sheet is composed of the at least one polymeric material layer.

如請求項1所述之卡片結構，其中該些材料層相疊設置且透過一壓合步驟而連接。 The card structure according to claim 1, wherein the material layers are stacked and connected through a pressing step.

如請求項1所述之卡片結構，更包含多個植物纖維層以及多個聚合材料層；該些植物纖維層以及該些聚合材料層交互堆疊設置且構成該第三板材。 The card structure according to Claim 1 further comprises a plurality of plant fiber layers and a plurality of polymer material layers; the plant fiber layers and the polymer material layers are stacked alternately to form the third board.

如請求項1所述之卡片結構，其中該第一板材更包括一第一印刷層，而該第二板材更包括一第二印刷層。 The card structure according to claim 1, wherein the first board further includes a first printing layer, and the second board further includes a second printing layer.

如請求項1所述之卡片結構，其中該板體形成有一容置槽；該容置槽開口於該板體之表面，且該晶片設置於該容置槽內。 The card structure according to claim 1, wherein the board body is formed with a receiving groove; the receiving groove is opened on the surface of the board body, and the chip is arranged in the receiving groove.