發明所欲解決之問題 [0005] 不過，流通於玻璃基板的製造工程之母玻璃板或玻璃基板中，可能存在氣泡或異物等缺陷。而為了不讓這樣的缺陷肇生電子機器的不良，玻璃基板的製造工程中，會進行母玻璃板或玻璃基板的檢查。然而，即使是通過這樣的檢查而完成了的玻璃基板，在電子機器的製造工程中仍有肇生缺陷所引起的問題之可能性。 [0006] 本發明有鑑於上述情事，其技術性課題在於製造一種在電子機器的製造工程中盡可能地不肇生問題之玻璃基板。 解決問題之技術手段 [0007] 為解決前述問題而創作之本發明之玻璃基板的製造方法，其特徵為，包含從母玻璃板製造玻璃基板之工程，前述製造玻璃基板之工程中，從前述母玻璃板檢測出由在規定的判定基準下被訂為合格之合格缺陷及在前述判定基準下被訂為不合格之不合格缺陷所組成的總合缺陷之後，以複數片前述母玻璃板來形成1個批次，基於對前述批次算出之前述母玻璃板每1片的前述總合缺陷或前述合格缺陷的平均個數，來判定前述批次的合格與否。此處，所謂批次，係複數個母玻璃板的集合體，為進行搬運、製造處理等之單位(以下同)。 [0008] 合格缺陷，為電子機器中肇生致命性不良之可能性低的缺陷，不合格缺陷，為電子機器中肇生致命性不良之可能性高的缺陷。不合格缺陷，相當於習知的缺陷用檢查中被訂為不合格之缺陷，合格缺陷，相當於習知的缺陷用檢查中被訂為合格之缺陷。亦即，通過了習知的缺陷用檢查之玻璃基板中，包含不合格缺陷之玻璃基板會被除去，因此電子機器的製造工程中有肇生問題之可能性的缺陷，多為合格缺陷之情形。按照上述構成，基於總合缺陷(合格缺陷及不合格缺陷)的母玻璃板每1片的平均個數，來判定批次的合格與否時，雖為合格缺陷但每一批次的缺陷個數會受到限制，因此不單能夠抑制電子機器的製造工程中發生不合格缺陷所引起之問題，也能抑制發生合格缺陷所引起之問題。此外，上述構成中，基於合格缺陷的基板每1片的平均個數，來判定批次的合格與否時，說法亦通用。也就是說，按照本發明之玻璃基板的製造方法，能夠製造在電子機器的製造工程中盡可能地不肇生問題之玻璃基板。 [0009] 上述構成中，較佳是，將沒有前述不合格缺陷的前述母玻璃板判定為合格，並且將有前述不合格缺陷的前述母玻璃板判定為不合格，僅以被判定為合格的前述母玻璃板來形成前述批次，當判定前述批次的合格與否時，使用對前述批次算出之前述母玻璃板每1片的前述合格缺陷的平均個數。 [0010] 若為此構成，則批次的母玻璃板中不存在不合格缺陷，故針對批次的母玻璃板便無需考量不合格缺陷導致發生電子機器的製造工程所造成之致命性缺陷。 [0011] 上述構成中，判定前述批次的合格與否時，從由可從前述母玻璃板採取的前述玻璃板的品種所組成之群組中，基於前述母玻璃板每1片的前述合格缺陷的平均個數，來選擇滿足前述品種的判定基準之前述品種亦可。此處，所謂品種，係依尺寸或用途等而決定之玻璃基板的種類(以下同)。 [0012] 對於該品種之判定基準係依每一品種而設定，批次，可能有在某品種下成為不合格但在其他品種下成為合格之情形。是故，若選擇品種，則可使批次的合格增加。如此一來，便可有效活用批次的母玻璃板。 [0013] 上述構成中，依據基於前述母玻璃板每1片的前述合格缺陷的平均個數而算出之前述玻璃基板每1片的合格缺陷的平均個數，來選擇前述品種亦可。 [0014] 若為此構成，則會使用基於母玻璃板每1片的合格缺陷的平均個數而算出之玻璃基板每1片的合格缺陷的平均個數，故可更適當地進行品種之選擇。 [0015] 上述構成中，前述群組，包含可從1片前述母玻璃板製造之最大尺寸的品種、及比前述最大尺寸還小之尺寸的品種亦可。 [0016] 當為比最大尺寸還小尺寸的品種(裁減尺寸(downsize)品種)的情形下，批次成為合格的可能性高，可使批次的合格增加。如此一來，便可更有效活用批次的母玻璃板。 [0017] 上述構成中，當前述母玻璃板中前述合格缺陷的分布有偏頗(bias)的情形下，選擇僅使用前述合格缺陷少的區域之品種亦可。 [0018] 若為此構成，則即使是基於母玻璃板每1片的合格缺陷的平均個數而被訂為不合格之批次，藉由選擇品種也可能成為合格。是故，可使批次的合格增加，可有效活用批次的母玻璃板。 [0019] 上述構成中，當前述母玻璃板的前述合格缺陷的個數增加了的情形下，將前述合格缺陷與前述不合格缺陷之判定基準趨嚴亦可。 [0020] 若為此構成，則能抑制批次的母玻璃板的合格缺陷的個數增加，如此一來，能夠抑制母玻璃板每1片的合格缺陷的平均個數增加。是故，能夠抑制基於母玻璃板每1片的合格缺陷的平均個數之批次的不合格增加。 發明之功效 [0021] 如以上般，按照本發明，能夠製造一種在電子機器的製造工程中盡可能地不肇生問題之玻璃基板。Problems to be Solved by the Invention [0005] However, there may be defects such as air bubbles or foreign matter in the mother glass plate or glass substrate circulated in the manufacturing process of the glass substrate. In order to prevent such defects from causing defects in electronic equipment, mother glass plates or glass substrates are inspected during the manufacturing process of glass substrates. However, even for a glass substrate completed through such an inspection, problems due to defects may still occur in the manufacturing process of electronic devices. The present invention is in view of above-mentioned situation, and its technical subject is to manufacture a kind of glass substrate that does not cause problems as much as possible in the manufacturing process of electronic equipment. Technical means to solve the problem [0007] In order to solve the aforementioned problems, the manufacturing method of the glass substrate of the present invention is characterized in that it includes the process of manufacturing the glass substrate from the mother glass plate, and in the aforementioned process of manufacturing the glass substrate, the After the glass plate detects the total defect consisting of qualified defects classified as qualified under the specified judgment standard and unqualified defects classified as unqualified under the aforementioned judgment standard, it is formed with a plurality of the above-mentioned mother glass plates For one lot, the pass or fail of the aforementioned lot is determined based on the average number of the aforementioned total defects or the aforementioned acceptable defects per one piece of the aforementioned mother glass plate calculated for the aforementioned lot. Here, the term "lot" refers to an aggregate of a plurality of mother glass plates, and is a unit for carrying out transportation, manufacturing processes, etc. (hereinafter the same). [0008] A qualified defect is a defect with a low probability of causing a fatal defect in an electronic device, and an unqualified defect is a defect with a high probability of causing a fatal defect in an electronic device. Unqualified defects are equivalent to defects that are classified as unqualified in the inspection of conventional defects, and defects that are qualified are equivalent to defects that are classified as qualified in the inspection of conventional defects. In other words, among the glass substrates that have passed the conventional inspection for defects, glass substrates containing unacceptable defects are removed. Therefore, defects that may cause problems in the manufacturing process of electronic equipment are mostly acceptable defects. . According to the above-mentioned configuration, when determining the pass or fail of a lot based on the average number of total defects (acceptable defects and unacceptable defects) per mother glass plate, the number of defects per batch is The number will be limited, so not only the problems caused by unqualified defects in the manufacturing process of electronic equipment can be suppressed, but also the problems caused by acceptable defects can be suppressed. In addition, in the above-mentioned configuration, when the pass/fail of a lot is judged based on the average number of pass/defect substrates per sheet, the term is also commonly used. That is, according to the manufacturing method of the glass substrate of this invention, the glass substrate which does not cause a problem as much as possible in the manufacturing process of an electronic device can be manufactured. In the above-mentioned composition, preferably, the aforementioned mother glass plate without the aforementioned unqualified defect is judged as qualified, and the aforementioned mother glass plate with the aforementioned unqualified defect is judged as unqualified, and only those judged as qualified The mother glass plate is used to form the lot, and the average number of acceptable defects per one piece of the mother glass plate calculated for the lot is used when determining whether the lot is acceptable or not. [0010] If this is constituted, there will be no unqualified defects in the mother glass plates of the batch, so there is no need to consider the fatal defects caused by the manufacturing process of electronic equipment due to unqualified defects for the mother glass plates of the batch. In the above-mentioned constitution, when judging whether the aforementioned batch is qualified or not, from the group formed by the kind of the aforementioned glass plate that can be taken from the aforementioned mother glass plate, based on the aforementioned qualification of each piece of the aforementioned mother glass plate The average number of defects may be used to select the aforementioned type that satisfies the criteria for the aforementioned type. Here, the term "type" refers to the type of the glass substrate determined according to the size, use, etc. (hereinafter the same). [0012] The judgment standard for this variety is set according to each variety, and the batch may become unqualified under a certain variety but qualified under other varieties. Therefore, if you choose a variety, you can increase the qualification of the batch. In this way, the batches of mother glass plates can be effectively utilized. [0013] In the above configuration, the variety may be selected based on the average number of acceptable defects per piece of the glass substrate calculated based on the average number of acceptable defects per piece of the mother glass plate. If constituted for this purpose, the average number of acceptable defects per piece of glass substrate calculated based on the average number of acceptable defects per piece of mother glass plate can be used, so the selection of varieties can be carried out more appropriately . [0015] In the above configuration, the aforementioned group may include a variety of the largest size that can be manufactured from one piece of the aforementioned mother glass plate, and a variety of a size smaller than the aforementioned largest size. [0016] In the case of a variety smaller than the maximum size (cut size (downsize) variety), there is a high probability that the batch will become qualified, and the qualifiedness of the batch can be increased. In this way, batches of mother glass plates can be utilized more effectively. [0017] In the above configuration, when the distribution of the above-mentioned acceptable defects in the aforementioned mother glass sheet is biased, it is also possible to select a variety that only uses the aforementioned regions with few acceptable defects. [0018] If constituted in this way, even a batch that is classified as unqualified based on the average number of acceptable defects per piece of mother glass plate may become qualified by selecting a variety. Therefore, the acceptance rate of the lot can be increased, and the mother glass plate of the lot can be effectively utilized. [0019] In the above configuration, when the number of the above-mentioned acceptable defects of the aforementioned mother glass plate increases, the criteria for judging the aforementioned acceptable defects and the aforementioned unqualified defects may be made stricter. [0020] If constituted in this way, it is possible to suppress the increase in the number of qualified defects of the mother glass plate of the batch, and in this way, it is possible to suppress the increase in the average number of acceptable defects per one mother glass plate. Therefore, it is possible to suppress the increase in batch failure based on the average number of acceptable defects per one mother glass plate. Effects of the Invention [0021] As above, according to the present invention, it is possible to manufacture a glass substrate that causes as few problems as possible in the manufacturing process of electronic equipment.
[0023] 以下，基於圖面說明本實施方式。 [0024] 圖1為本發明實施形態之玻璃基板的製造方法所包含之製造玻璃基板3的工程1的概略示意流程圖。此外，圖2A～圖2F為母玻璃板2上的玻璃基板3的配置示意概略平面圖。本發明實施形態之玻璃基板的製造方法，包含由母玻璃板2製造玻璃基板3之工程1。作為前工程，亦可包含藉由下引(down draw)法或浮式(float)法等將玻璃帶(ribbon)成形，再由該玻璃帶製造母玻璃板2之工程。 [0025] 玻璃基板3，是藉由從母玻璃板2切割出而被製造。此時，從1片母玻璃板2切割出的玻璃基板3的尺寸或張數，會依玻璃基板3的品種而異。 [0026] 例如，圖2A所示之玻璃基板3，為可從母玻璃板2採取的最大尺寸的品種(以下稱最大尺寸品種3a)。此外，圖2B～圖2F所示之玻璃基板3，為比圖2A的玻璃基板3還小尺寸之裁減尺寸品種3b。 [0027] 此外，圖2A及圖2B所示之玻璃基板3，從1片母玻璃板2切割出的玻璃基板3為1片。圖2C～圖2F所示之玻璃基板3，從1片母玻璃板2切割出的片數，分別為2片、3片、4片、3片。 [0028] 此外，圖2C～圖2E所示之玻璃基板3，從1片母玻璃板2切割出的玻璃基板3，係同一尺寸(同一品種)，圖2F所示之玻璃基板3，從1片母玻璃板2切割出的玻璃基板3，係相異尺寸(相異品種)。像這樣可從1片母玻璃板2採取之品種有複數種，較佳是預先形成由該些品種所組成之群組(group)，而鑑於需求動向或製造產線的運轉狀況等來選擇。 [0029] 如圖1所示，製造玻璃基板之工程1，具備缺陷檢測工程S1、母玻璃板判定工程S2、批次形成工程S3、資料算出工程S4、批次判定工程S5。 [0030] 缺陷檢測工程S1中，藉由周知的圖像檢查裝置，檢測存在於母玻璃板2上之缺陷。此缺陷，例如為氣泡、異物等，由在規定的判定基準下被判定為合格之合格缺陷、及在前述判定基準下被判定為不合格之不合格缺陷所組成。本實施形態之判定基準，為規定的缺陷尺寸，未滿此尺寸的缺陷為合格缺陷，此尺寸以上的缺陷則為不合格缺陷。作為此判定基準之缺陷尺寸，是因應品種而適當設定，例如若缺陷為氣泡則是50μm～1000μm，若缺陷為異物則是20μm～300μm。另，圖像檢查裝置中，例如若為氣泡，則10數μm以上者會被檢測成為缺陷，若為異物則數μm以上者會被檢測成為缺陷。 [0031] 此外，缺陷檢測工程S1中，係取得藉由周知的圖像檢查裝置檢測出之缺陷種類(氣泡、異物等)、個數、尺寸、座標等資料。 [0032] 母玻璃板判定工程S2，是基於缺陷檢測工程S1中檢測出的不合格缺陷的個數，而1片片地判定母玻璃板2的合格與否。例如，若不合格缺陷的個數為規定的閾值以下，則該母玻璃板2被判定為合格，進入批次形成工程S3。而若不合格缺陷的個數比規定的閾值還多，則該母玻璃板2被判定為不合格，受到處理。另，母玻璃板2的合格與否的判定材料中，亦可加上缺陷檢測工程S1中取得之其他資料(氣泡、異物等不合格缺陷的種類、不合格缺陷的座標等)。不合格缺陷的規定的閾值，例如為每一母玻璃基板為0(零)個，在此情形下，是以不合格缺陷的有無來判定合格與否，無不合格缺陷的母玻璃板2成為合格，有不合格缺陷的母玻璃板2成為不合格。 [0033] 批次形成工程S3中，將僅母玻璃板判定工程S2中被判定為合格之母玻璃板2予以聚集複數片而形成1個批次。 [0034] 資料算出工程S4中，由缺陷檢測工程S1中取得的缺陷的資料，算出批次判定工程S5中受使用之批次判定用資料。此批次判定用資料中，作為主要者，有「1個批次中的母玻璃板2的每1片的缺陷的平均個數」、及「1個批次中的玻璃基板3的每1片的缺陷的平均個數」。該些缺陷的平均個數中，可將合格缺陷及不合格缺陷雙方(總合缺陷)訂為對象，亦可僅將合格缺陷訂為對象。此處，1片母玻璃板中包含之不合格缺陷的個數，相較於合格缺陷的個數而言有較少的傾向。因此，即使是包含不合格缺陷之缺陷平均個數，因合格缺陷占的比例大，能夠評估合格缺陷的個數，而能抑制電子機器的製造工程中發生合格缺陷所引起之問題。 [0035] 「1個批次中的母玻璃板2的每1片的缺陷的平均個數」中，有第1平均個數及第2平均個數。第1平均個數，為對缺陷的全種類的個數而言算出者。第2平均個數，為對缺陷當中特定的種類的個數而言算出者。本實施形態中，第2平均個數，係對「氣泡」而言者及對「異物」而言者這2種類，但亦可為1種類，亦可為3種類以上。 [0036] 「1個批次中的玻璃基板3的每1片的缺陷的平均個數」(以下稱第3平均個數)，是基於第1平均個數而依玻璃基板3的每一裁減尺寸品種3b算出。例如，第3平均個數，當將母玻璃板2的面積訂為Sm，將玻璃基板3的面積訂為Sb的情形下，是由第3平均個數＝第1平均個數×Sb/Sm這一式子算出。 [0037] 批次判定工程S5中，基於對1個批次算出之母玻璃板2的每1片的缺陷的平均個數(第1平均個數)，判定該批次的合格與否。 [0038] 此外，批次判定工程S5中，當母玻璃板2中合格缺陷的分布有偏頗(bias)的情形下，會選擇僅使用合格缺陷少的區域之裁減尺寸品種3b。 [0039] 此外，批次判定工程S5中，由品種的群組，基於第1平均個數，選擇從批次的母玻璃板2製造之玻璃基板3的品種。在此情形下品種的群組中，會包含最大尺寸品種3a及裁減尺寸品種3b。在此情形下的裁減尺寸品種3b，是基於第3平均個數來選擇。另，批次判定工程S5中作為選擇候補之裁減尺寸品種3b，是鑑於需求動向或製造產線的運轉狀況等來選擇。 [0040] 批次判定工程S5中，被判定為合格之批次，會被搬運至切斷產線，受選擇的品種的玻璃基板3，從該批次的母玻璃板2切割出而被製造。另一方面，批次判定工程S5中，被判定為不合格之批次，受到廢棄處分。 [0041] 另，本實施形態中，最大尺寸品種3a的玻璃基板3的判定基準和裁減尺寸品種3b的玻璃基板3的判定基準，可訂為同一，亦可相異。最大尺寸品種3a及裁減尺寸品種3b的判定基準，能夠藉由閾值(缺陷的容許個數)來設定。當將以全種類的合格缺陷為對象之第1平均個數用於判定的情形下，閾值例如能夠訂為0.1～5個。 [0042] 裁減尺寸品種3b中，相較於最大尺寸品種3a，玻璃基板3的面積會減少，因此第3平均個數(玻璃基板3的每1片的缺陷的平均個數)亦減少。同樣地，裁減尺寸品種3中，玻璃基板3的面積愈小之品種，第3平均個數愈減少。是故，若在最大尺寸品種3a和各裁減尺寸品種3b中閾值相同，則玻璃基板3的面積愈小之品種，愈容易滿足品種的判定基準，也就是說，裁減尺寸品種愈能夠滿足判定基準的閾值。 [0043] 接著，基於圖3詳細說明批次判定工程S5。 [0044] 最初，步驟S51中，判定合格缺陷的分布是否有偏頗。當合格缺陷的分布有偏頗的情形下，進入步驟S52，當合格缺陷的分布無偏頗的情形下，進入步驟S53。 [0045] 步驟S52中，判定2種類的第2平均個數(氣泡的平均個數及異物的平均個數)的各者是否滿足最大尺寸品種3a之判定基準。具體而言，當雙方的第2平均個數為規定的閾值以下的情形下，選擇最大尺寸品種3a來作為使用該批次之品種(步驟S54)，將該批次訂為合格(步驟S55)。當任一第2平均個數超過規定的閾值的情形下，進入步驟S56。 [0046] 步驟S56中，判定是否有如圖4所示使用母玻璃板2中僅合格缺陷d少的區域之裁減尺寸品種3b。 [0047] 另，圖4所示的品種(圖2B的品種)中，從母玻璃板2得到的玻璃基板3為1片，但亦可為複數片，此外，亦可為複數片當中僅1片為使用母玻璃板2中僅合格缺陷d少的區域者。此外，本實施形態中，僅使用合格缺陷d少的區域之品種，為裁減尺寸品種3b，但亦可為最大尺寸品種3a。 [0048] 步驟S56中，當有使用母玻璃板2中僅合格缺陷d少的區域之裁減尺寸品種3b的情形下，選擇該裁減尺寸品種3b來作為使用此批次之品種(步驟S57)，將此批次訂為合格(步驟S58)。另，當使用母玻璃板2中僅合格缺陷d少的區域之裁減尺寸品種3b有複數種的情形下，選擇它們當中優先順位最高者。此優先順位，是藉由需求動向或製造產線的運轉狀況等而預先設定。 [0049] 步驟S56中，當沒有使用母玻璃板2中僅合格缺陷d少的區域之裁減尺寸品種3b的情形下，將此批次訂為不合格(步驟S59)。 [0050] 另一方面，步驟S53中，判定第1平均個數(全種類的缺陷的平均個數)是否滿足最大尺寸品種3a之判定基準。具體而言，當第1平均個數為規定的閾值以下的情形下，選擇最大尺寸品種3a來作為使用此批次之品種(步驟S60)，將此批次訂為合格(步驟S61)。當第1平均個數超過規定的閾值的情形下，進入步驟S62。 [0051] 步驟S62中，判定是否有滿足判定基準之裁減尺寸品種3b。此判定，是將第3平均個數假定為玻璃基板3的製造後的缺陷的個數來進行。 [0052] 詳言之，是將每一品種(玻璃基板3)的第3平均個數、和每一品種的判定基準即閾值(缺陷的容許個數)予以比較，判定是否有第3平均個數為判定基準的閾值以下之裁減尺寸品種3b。 [0053] 步驟S62中，當有滿足判定基準之裁減尺寸品種3b的情形下，選擇該裁減尺寸品種3b來作為使用此批次之品種(步驟S63)，將此批次訂為合格(步驟S64)。另，當滿足判定基準之裁減尺寸品種3b有複數種的情形下，選擇它們當中優先順位最高者。此優先順位，是鑑於需求動向或製造產線的運轉狀況等而選擇。 [0054] 步驟S62中，當沒有滿足判定基準之裁減尺寸品種3b的情形下，將此批次訂為不合格(步驟S65)。 [0055] 另一方面，圖5為缺陷檢測工程S1中檢測出的缺陷的尺寸與累積檢測數之關係示意曲線。橫軸為缺陷的尺寸，縱軸為將規定片數的母玻璃板2的缺陷的檢測數予以累積而成者。又，曲線A表示通常的情形，曲線B表示缺陷被連續檢測出多量的情形。 [0056] 如圖5中曲線B所示，當缺陷被連續檢測出多量的情形下，母玻璃板2的缺陷的個數亦當然增加，不僅是不合格缺陷增加，合格缺陷亦增加，若不研擬任何對策，則批次判定工程S5中，第1及第2平均個數會變高，被訂為不合格之批次有增大的可能性。為了避免這樣的事態，當缺陷被檢測出多量的情形下，判別合格缺陷與不合格缺陷之判定基準b，會訂得比通常的情形下判別合格缺陷與不合格缺陷之判定基準a還嚴格(b＜a)。也就是說，當缺陷被檢測出多量的情形下會將判別合格缺陷與不合格缺陷之閾值縮小而變更至嚴格側。 [0057] 進一步，會將判定基準b(閾值)設定成，使得當缺陷被檢測出多量的情形下之第1及第2平均個數成為和通常的情形下近乎同等。詳言之，是將判定基準b設定成使得區域R2的面積成為和區域R1的面積近乎同等。區域R1，為比曲線A還下側而比a還左側之區域。區域R2，為比曲線B還下側而比b還左側之區域。 [0058] 區域R1的面積，表示通常的判定基準a下之缺陷的個數的總數。此外，區域R2的面積，表示當缺陷被檢測出多量的情形的判定基準b下之缺陷的個數的總數。是故，若將區域R2的面積設為和區域R1的面積成為同等，則能夠使得當缺陷被檢測出多量的情形之第1及第2平均個數成為和通常的場合近乎同等。 [0059] 如以上般構成之本實施形態之玻璃基板的製造方法1，能夠享受以下的效果。 [0060] 基於缺陷的平均個數(第1平均個數)，來判定批次的合格與否，因此能夠抑制電子機器的製造工程中發生合格缺陷所引起之問題。也就是說，按照本實施形態之玻璃基板的製造方法1，能夠製造在電子機器的製造工程中盡可能地不肇生問題之玻璃基板3。 [0061] 本發明並非限定於上述實施形態，於其技術性思想之範圍內可做各種變形。例如，上述實施形態的批次判定工程S5中，當母玻璃板2中合格缺陷的分布有偏頗的情形下，會在步驟S52中進行第2平均個數之判定，但亦可省略步驟S52。[0023] Hereinafter, this embodiment will be described based on the drawings. 1 is a schematic flow chart of process 1 of manufacturing a glass substrate 3 included in a method for manufacturing a glass substrate according to an embodiment of the present invention. 2A to 2F are schematic plan views showing the arrangement of the glass substrate 3 on the mother glass plate 2 . The method of manufacturing a glass substrate according to the embodiment of the present invention includes the process 1 of manufacturing a glass substrate 3 from a mother glass plate 2 . As a previous process, the process of forming a glass ribbon (ribbon) by a down draw method, a float method, etc., and manufacturing the mother glass plate 2 from this glass ribbon may also be included. [0025] The glass substrate 3 is manufactured by cutting out the mother glass plate 2. At this time, the size and number of glass substrates 3 cut out from one mother glass plate 2 vary depending on the type of glass substrate 3 . [0026] For example, the glass substrate 3 shown in FIG. 2A is the largest size variety that can be taken from the mother glass plate 2 (hereinafter referred to as the largest size variety 3a). In addition, the glass substrate 3 shown in FIG. 2B-FIG. 2F is a cut-size type 3b smaller than the glass substrate 3 of FIG. 2A. [0027] In addition, for the glass substrate 3 shown in FIG. 2A and FIG. 2B, the glass substrate 3 cut out from one mother glass plate 2 is one piece. The number of glass substrates 3 shown in FIGS. 2C to 2F cut out from one mother glass plate 2 is 2, 3, 4, and 3, respectively. In addition, the glass substrate 3 shown in Fig. 2C～Fig. 2E, the glass substrate 3 that cuts out from 1 mother glass plate 2, is the same size (same kind), the glass substrate 3 shown in Fig. 2F, from 1 The glass substrates 3 cut from the mother glass plate 2 are of different sizes (different types). There are a plurality of types that can be taken from one mother glass plate 2 in this way, and it is preferable to form a group (group) consisting of these types in advance and select them in view of demand trends or operating conditions of production lines. [0029] As shown in Figure 1, the process 1 of manufacturing glass substrates includes a defect detection process S1, a mother glass plate determination process S2, a batch formation process S3, a data calculation process S4, and a batch determination process S5. [0030] In the defect detection process S1, defects existing on the mother glass plate 2 are detected by a known image inspection device. This defect, such as air bubbles, foreign matter, etc., consists of acceptable defects judged to be acceptable under the specified judgment criteria, and unqualified defects judged to be unqualified under the aforementioned judgment criteria. The judgment standard of this embodiment is the specified defect size, the defect smaller than this size is a qualified defect, and the defect larger than this size is an unacceptable defect. The defect size used as the criterion for this judgment is appropriately set according to the type, for example, if the defect is a bubble, it is 50 μm to 1000 μm, and if the defect is a foreign object, it is 20 μm to 300 μm. In addition, in the image inspection apparatus, for example, air bubbles are detected as defects having a thickness of several μm or more, and foreign objects having a size of several μm or more are detected as defects. [0031] In addition, in defect detection process S1, data such as defect types (bubbles, foreign matter, etc.), number, size, and coordinates detected by known image inspection devices are obtained. [0032] The mother glass plate judging process S2 is based on the number of unqualified defects detected in the defect detection process S1, and judges whether the mother glass plate 2 is qualified or not piece by piece. For example, if the number of unacceptable defects is equal to or less than a predetermined threshold value, the mother glass plate 2 is judged as acceptable, and the process proceeds to the lot forming process S3. On the other hand, if the number of unacceptable defects exceeds a predetermined threshold value, the mother glass plate 2 is judged as unacceptable and processed. In addition, other data obtained in the defect detection process S1 (types of defective defects such as air bubbles and foreign matter, coordinates of defective defects, etc.) may also be added to the pass/fail judgment material of the mother glass plate 2 . The predetermined threshold value of unacceptable defects is, for example, 0 (zero) per mother glass substrate. In this case, whether the unqualified defect is used to determine whether it is acceptable or not, the mother glass plate 2 without unacceptable defects becomes Passed, mother glass plate 2 with unacceptable defects becomes unqualified. [0033] In the batch forming process S3, only the mother glass plates 2 judged to be acceptable in the mother glass plate judging process S2 are gathered into a plurality of sheets to form a batch. [0034] In the data calculation process S4, the data for batch determination used in the batch determination process S5 is calculated from the defect data obtained in the defect detection process S1. Among the data for lot determination, the main ones are "the average number of defects per piece of mother glass plate 2 in one lot" and "the number of defects per one piece of glass substrate 3 in one lot". The average number of defects in the chip". Among the average number of these defects, both acceptable defects and unqualified defects (total defects) may be targeted, or only acceptable defects may be targeted. Here, the number of defective defects included in one mother glass plate tends to be smaller than the number of acceptable defects. Therefore, even if the average number of defects including unacceptable defects is large, the number of acceptable defects can be evaluated because the proportion of acceptable defects is large, and problems caused by acceptable defects in the manufacturing process of electronic equipment can be suppressed. [0035] In "the average number of defects per piece of mother glass plate 2 in one batch", there are a first average number and a second average number. The first average number is calculated for the number of all kinds of defects. The second average number is calculated for the number of objects of a specific type among defects. In the present embodiment, the second average number refers to two types of "air bubbles" and "foreign matter", but it may be one type, or may be three or more types. "The average number of defects per piece of glass substrate 3 in one batch" (hereinafter referred to as the third average number) is based on the first average number for each cut of the glass substrate 3 Size variety 3b is calculated. For example, the third average number, when the area of the mother glass plate 2 is defined as Sm, and the area of the glass substrate 3 is defined as Sb, the result is that the third average number=the first average number×Sb/Sm calculated by this formula. [0037] In the batch judgment process S5, based on the average number of defects per one mother glass plate 2 (first average number) calculated for one batch, whether the batch is acceptable or not is judged. [0038] In addition, in the batch judgment process S5, when the distribution of acceptable defects in the mother glass plate 2 is biased, the cut-size variety 3b that only uses areas with fewer acceptable defects will be selected. [0039] In addition, in the batch determination process S5, the type of the glass substrate 3 manufactured from the mother glass plate 2 of the batch is selected based on the first average number by the group of types. In this case, the category group includes the maximum size category 3a and the cut size category 3b. In this case, the cut size item 3b is selected based on the third average number. In addition, the cut size item 3b as a selection candidate in the lot determination process S5 is selected in consideration of the demand trend, the operation status of the manufacturing line, and the like. In the batch judgment process S5, the batches judged to be qualified will be transported to the cutting production line, and the glass substrate 3 of the selected variety will be cut out from the mother glass plate 2 of the batch to be manufactured. . On the other hand, in the lot judging process S5, the lot judged to be unqualified is disposed of. [0041] In addition, in the present embodiment, the judging criteria of the glass substrate 3 of the maximum size type 3a and the judging criteria of the glass substrate 3 of the cut size type 3b can be set as the same or different. The criteria for judging the maximum size type 3a and the cut size type 3b can be set by a threshold value (the allowable number of defects). When the first average number of acceptable defects of all types is used for determination, the threshold can be set at, for example, 0.1 to 5. [0042] In the cut size type 3b, compared with the maximum size type 3a, the area of the glass substrate 3 is reduced, so the third average number (the average number of defects per glass substrate 3) is also reduced. Similarly, among the cut size types 3, the smaller the area of the glass substrate 3, the smaller the third average number. Therefore, if the threshold value is the same in the largest size variety 3a and each cut size variety 3b, then the variety with a smaller area of the glass substrate 3 is more likely to meet the judgment criteria of the variety, that is to say, the cut size variety is more able to meet the judgment criteria. threshold. [0043] Next, the batch determination process S5 will be described in detail based on FIG. 3 . [0044] Initially, in step S51, it is determined whether the distribution of acceptable defects is biased. When the distribution of qualified defects is biased, go to step S52, and when the distribution of qualified defects is not biased, go to step S53. [0045] In step S52, it is determined whether each of the second average numbers of the two types (the average number of air bubbles and the average number of foreign objects) satisfies the criteria for judging the largest size category 3a. Specifically, when the second average number of both parties is below the predetermined threshold, select the largest size variety 3a as the variety used in the lot (step S54), and set the lot as qualified (step S55) . When any of the second average numbers exceeds the predetermined threshold, the process proceeds to step S56. [0046] In the step S56, it is determined whether there is a cut-size variety 3b using only areas with few qualified defects d in the mother glass plate 2 as shown in FIG. 4 . In addition, in the variety shown in FIG. 4 (the variety in FIG. 2B ), the glass substrate 3 obtained from the mother glass plate 2 is one, but it can also be a plurality of sheets, and in addition, only one of the plurality of sheets can also be used. The sheet used only the region with few acceptable defects d in the mother glass plate 2 . In addition, in the present embodiment, only the product in the region with few acceptable defects d is used, which is the reduced size product 3b, but the maximum size product 3a may also be used. In step S56, when there is the cut size variety 3b in the area with only qualified defects d in the mother glass plate 2, select the cut size variety 3b as the kind using this batch (step S57), This batch is set as qualified (step S58). In addition, when there are plural types of cut size items 3b using areas with only few acceptable defects d in the mother glass plate 2, the one with the highest priority among them is selected. This priority is preset based on demand trends or operating conditions of manufacturing lines. [0049] In step S56, when not using the cut size variety 3b in the mother glass plate 2 that has only a few regions with qualified defects d, this batch is set as unqualified (step S59). [0050] On the other hand, in step S53, it is judged whether the first average number (the average number of defects of all types) satisfies the judgment criterion of the largest size variety 3a. Specifically, when the first average number is equal to or less than the predetermined threshold, the largest size item 3a is selected as the item to be used in the lot (step S60), and the lot is rated as acceptable (step S61). When the first average number exceeds the predetermined threshold, the process proceeds to step S62. [0051] In step S62, it is judged whether there is a cut size variety 3b that satisfies the judgment criterion. This determination is performed assuming the third average number of objects as the number of objects of defects after the production of the glass substrate 3 . Specifically, the third average number of each type (glass substrate 3) is compared with the threshold value (allowable number of defects) of each type, and it is determined whether there is a third average number of defects. The number is the cut size type 3b below the threshold value of the judgment standard. In step S62, when there is the situation of the cut size variety 3b that satisfies the judgment criterion, select the cut size kind 3b as the kind that uses this batch (step S63), and this batch is set as qualified (step S64 ). Also, when there are a plurality of cut size items 3b satisfying the judgment criteria, the one with the highest priority among them is selected. This priority is selected in view of the demand trend or the operation status of the manufacturing line. [0054] In the step S62, when there is no cut size variety 3b that satisfies the judgment criterion, this batch is set as unqualified (step S65). [0055] On the other hand, FIG. 5 is a schematic curve showing the relationship between the size of defects detected in the defect detection project S1 and the cumulative number of detections. The horizontal axis represents the size of the defect, and the vertical axis represents the accumulation of the detected number of defects in a predetermined number of mother glass plates 2 . In addition, curve A shows a normal situation, and curve B shows a situation in which a large number of defects are continuously detected. As shown in curve B in Figure 5, when a large number of defects are continuously detected, the number of defects in the mother glass plate 2 will naturally increase, not only the increase of unqualified defects, but also the increase of qualified defects. If any countermeasures are developed, the number of the first and second averages in the batch judgment process S5 will increase, and the possibility of increasing the number of batches that are classified as unqualified. In order to avoid such a situation, when a large number of defects are detected, the judgment standard b for judging qualified defects and unqualified defects will be set stricter than the judgment standard a for judging qualified defects and unqualified defects under normal circumstances ( b<a). In other words, when a large number of defects are detected, the threshold value for judging acceptable defects and unqualified defects will be narrowed and changed to the strict side. [0057] Furthermore, the criterion b (threshold) is set such that the first and second average numbers are nearly equal to those in normal situations when a large number of defects are detected. More specifically, the criterion b is set so that the area of the region R2 becomes approximately equal to the area of the region R1. Region R1 is a region below the curve A and on the left side of a. The region R2 is a region below the curve B and on the left side of the curve b. [0058] The area of the region R1 represents the total number of defects under the usual criterion a. In addition, the area of the region R2 represents the total number of objects of defects under the criterion b when a large number of defects are detected. Therefore, if the area of the region R2 is made equal to the area of the region R1, the first and second average numbers when a large number of defects are detected can be made nearly equal to those in the normal case. [0059] The glass substrate manufacturing method 1 of the present embodiment constituted as above can enjoy the following effects. [0060] Based on the average number of defects (the first average number), it is judged whether the batch is qualified or not, so problems caused by qualified defects in the manufacturing process of electronic equipment can be suppressed. That is, according to the manufacturing method 1 of the glass substrate of this embodiment, the glass substrate 3 which does not cause a problem as much as possible in the manufacturing process of an electronic device can be manufactured. [0061] The present invention is not limited to the above-mentioned embodiments, and various modifications can be made within the scope of its technical ideas. For example, in the batch judgment process S5 of the above embodiment, when the distribution of acceptable defects in the mother glass plate 2 is biased, the second average number of judgments will be performed in step S52, but step S52 can also be omitted.
