TWI800963B - Method for manufacturing heat-dissipation device with patterned surface layer for vehicle - Google Patents

Method for manufacturing heat-dissipation device with patterned surface layer for vehicle Download PDF

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Publication number
TWI800963B
TWI800963B TW110140236A TW110140236A TWI800963B TW I800963 B TWI800963 B TW I800963B TW 110140236 A TW110140236 A TW 110140236A TW 110140236 A TW110140236 A TW 110140236A TW I800963 B TWI800963 B TW I800963B
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TW
Taiwan
Prior art keywords
vehicle
surface layer
dissipation device
patterned surface
manufacturing heat
Prior art date
Application number
TW110140236A
Other languages
Chinese (zh)
Other versions
TW202318594A (en
Inventor
黃奕鑫
楊景明
葉子暘
Original Assignee
艾姆勒科技股份有限公司
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Application filed by 艾姆勒科技股份有限公司 filed Critical 艾姆勒科技股份有限公司
Priority to TW110140236A priority Critical patent/TWI800963B/en
Application granted granted Critical
Publication of TWI800963B publication Critical patent/TWI800963B/en
Publication of TW202318594A publication Critical patent/TW202318594A/en

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TW110140236A 2021-10-29 2021-10-29 Method for manufacturing heat-dissipation device with patterned surface layer for vehicle TWI800963B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW110140236A TWI800963B (en) 2021-10-29 2021-10-29 Method for manufacturing heat-dissipation device with patterned surface layer for vehicle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110140236A TWI800963B (en) 2021-10-29 2021-10-29 Method for manufacturing heat-dissipation device with patterned surface layer for vehicle

Publications (2)

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TWI800963B true TWI800963B (en) 2023-05-01
TW202318594A TW202318594A (en) 2023-05-01

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Application Number Title Priority Date Filing Date
TW110140236A TWI800963B (en) 2021-10-29 2021-10-29 Method for manufacturing heat-dissipation device with patterned surface layer for vehicle

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TW (1) TWI800963B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080079021A1 (en) * 2006-09-29 2008-04-03 Reinhold Bayerer Arrangement for cooling a power semiconductor module
TWM612230U (en) * 2021-01-08 2021-05-21 艾姆勒車電股份有限公司 Heat dissipating substrate with sputtered layer
TWM624077U (en) * 2021-10-29 2022-03-01 艾姆勒車電股份有限公司 Heat-dissipation device with patterned surface layer for vehicle

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080079021A1 (en) * 2006-09-29 2008-04-03 Reinhold Bayerer Arrangement for cooling a power semiconductor module
TWM612230U (en) * 2021-01-08 2021-05-21 艾姆勒車電股份有限公司 Heat dissipating substrate with sputtered layer
TWM624077U (en) * 2021-10-29 2022-03-01 艾姆勒車電股份有限公司 Heat-dissipation device with patterned surface layer for vehicle

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Publication number Publication date
TW202318594A (en) 2023-05-01

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