TWI800565B - 塑膠膜之雷射加工方法及塑膠膜 - Google Patents

塑膠膜之雷射加工方法及塑膠膜 Download PDF

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Publication number
TWI800565B
TWI800565B TW107142216A TW107142216A TWI800565B TW I800565 B TWI800565 B TW I800565B TW 107142216 A TW107142216 A TW 107142216A TW 107142216 A TW107142216 A TW 107142216A TW I800565 B TWI800565 B TW I800565B
Authority
TW
Taiwan
Prior art keywords
plastic film
processing method
laser processing
plastic
film
Prior art date
Application number
TW107142216A
Other languages
English (en)
Other versions
TW201924836A (zh
Inventor
松尾直之
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW201924836A publication Critical patent/TW201924836A/zh
Application granted granted Critical
Publication of TWI800565B publication Critical patent/TWI800565B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/009—Using laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2793/00—Shaping techniques involving a cutting or machining operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW107142216A 2017-11-27 2018-11-27 塑膠膜之雷射加工方法及塑膠膜 TWI800565B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017226441 2017-11-27
JP2017-226441 2017-11-27

Publications (2)

Publication Number Publication Date
TW201924836A TW201924836A (zh) 2019-07-01
TWI800565B true TWI800565B (zh) 2023-05-01

Family

ID=66631510

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107142216A TWI800565B (zh) 2017-11-27 2018-11-27 塑膠膜之雷射加工方法及塑膠膜

Country Status (6)

Country Link
US (1) US20200353563A1 (zh)
JP (1) JP2019093449A (zh)
KR (1) KR102629386B1 (zh)
CN (1) CN111386172B (zh)
TW (1) TWI800565B (zh)
WO (1) WO2019103137A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200127078A (ko) * 2019-04-30 2020-11-10 세메스 주식회사 기판 처리 방법, 기판 처리 장치 및 기판 처리 설비
KR102441540B1 (ko) * 2020-11-19 2022-09-07 정라파엘 레이저 커팅 방법
KR20240107107A (ko) * 2021-11-08 2024-07-08 닛토덴코 가부시키가이샤 점착제층을 갖는 적층 필름의 제조 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002001560A (ja) * 2000-06-20 2002-01-08 Nippon Steel Chem Co Ltd 樹脂フィルムのレーザ加工方法
JP2006192478A (ja) * 2005-01-14 2006-07-27 Nitto Denko Corp レーザー加工品の製造方法及びレーザー加工用保護シート
US20070181543A1 (en) * 2003-12-25 2007-08-09 Masakatsu Urairi Protective sheet for laser processing and manufacturing method of laser processed parts
TW200916245A (en) * 2007-06-06 2009-04-16 Nitto Denko Corp Laser processing method and laser processed article
CN101505909A (zh) * 2006-08-23 2009-08-12 日东电工株式会社 光学膜的切割方法及光学膜
CN106238919A (zh) * 2015-06-12 2016-12-21 住华科技股份有限公司 光学膜片的加工方法

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JP2000216129A (ja) * 1999-01-26 2000-08-04 Matsushita Electric Ind Co Ltd 膜表面浄化方法及びその装置
IE20000618A1 (en) * 1999-08-03 2001-03-07 Xsil Technology Ltd A circuit singulation system and method
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JP2004322157A (ja) * 2003-04-25 2004-11-18 Nitto Denko Corp 被加工物の加工方法、及びこれに用いる粘着シート
DE102006012232B4 (de) * 2006-02-20 2008-01-24 Siemens Ag Verfahren zur selektiven Herstellung von Folienlaminaten zum Packaging und zur Isolation von ungehäusten elektronischen Bauelementen und Leiterbahnen
JP2007260745A (ja) * 2006-03-29 2007-10-11 Nippon Steel Chem Co Ltd プラスチックシートの加工方法
JP2008246537A (ja) * 2007-03-30 2008-10-16 Toray Ind Inc レーザー穿孔性フィルムおよび孔版印刷用原紙
JP5800486B2 (ja) * 2010-10-06 2015-10-28 住友化学株式会社 レーザー切断装置、これを備えるスリッター機、およびレーザー切断方法
JP5971498B2 (ja) * 2011-08-19 2016-08-17 エルジー・ケム・リミテッド 偏光板
US9174308B2 (en) * 2012-08-30 2015-11-03 Preco, Inc. Laser scoring of metal/polymer structures
JP2014191051A (ja) * 2013-03-26 2014-10-06 Nitto Denko Corp 偏光子のレーザー加工方法
JP2016528029A (ja) * 2013-07-05 2016-09-15 日東電工株式会社 光触媒シート
WO2015072259A1 (ja) * 2013-11-14 2015-05-21 三菱電機株式会社 レーザ加工方法およびレーザ加工装置
US20150165563A1 (en) * 2013-12-17 2015-06-18 Corning Incorporated Stacked transparent material cutting with ultrafast laser beam optics, disruptive layers and other layers
KR101817388B1 (ko) * 2014-09-30 2018-01-10 주식회사 엘지화학 편광판의 절단 방법 및 이를 이용하여 절단된 편광판
JP6580315B2 (ja) * 2014-10-15 2019-09-25 日東電工株式会社 両面粘着剤付き光学フィルム、およびそれを用いた画像表示装置の製造方法、ならびに両面粘着剤付き光学フィルムのカール抑制方法
EP3012288A1 (en) * 2014-10-21 2016-04-27 Nitto Denko Corporation Pressure-sensitive adhesive film for laser beam cutting applications
JP6452483B2 (ja) * 2015-02-16 2019-01-16 日東電工株式会社 粘着剤付き光学フィルムおよび画像表示装置
KR20160126175A (ko) * 2015-04-22 2016-11-02 삼성디스플레이 주식회사 기판 절단 방법 및 표시 장치 제조 방법
US11014816B2 (en) * 2016-06-21 2021-05-25 William Marsh Rice University Laser-induced graphene (LIG) and laser induced graphene scrolls (LIGS) materials

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002001560A (ja) * 2000-06-20 2002-01-08 Nippon Steel Chem Co Ltd 樹脂フィルムのレーザ加工方法
US20070181543A1 (en) * 2003-12-25 2007-08-09 Masakatsu Urairi Protective sheet for laser processing and manufacturing method of laser processed parts
JP2006192478A (ja) * 2005-01-14 2006-07-27 Nitto Denko Corp レーザー加工品の製造方法及びレーザー加工用保護シート
CN101505909A (zh) * 2006-08-23 2009-08-12 日东电工株式会社 光学膜的切割方法及光学膜
TW200916245A (en) * 2007-06-06 2009-04-16 Nitto Denko Corp Laser processing method and laser processed article
CN106238919A (zh) * 2015-06-12 2016-12-21 住华科技股份有限公司 光学膜片的加工方法

Also Published As

Publication number Publication date
KR20200089268A (ko) 2020-07-24
US20200353563A1 (en) 2020-11-12
KR102629386B1 (ko) 2024-01-29
CN111386172A (zh) 2020-07-07
WO2019103137A1 (ja) 2019-05-31
TW201924836A (zh) 2019-07-01
JP2019093449A (ja) 2019-06-20
CN111386172B (zh) 2022-06-17

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