TWI800558B - 用於電鍍鈷之包含調平劑之組成物 - Google Patents

用於電鍍鈷之包含調平劑之組成物 Download PDF

Info

Publication number
TWI800558B
TWI800558B TW107141016A TW107141016A TWI800558B TW I800558 B TWI800558 B TW I800558B TW 107141016 A TW107141016 A TW 107141016A TW 107141016 A TW107141016 A TW 107141016A TW I800558 B TWI800558 B TW I800558B
Authority
TW
Taiwan
Prior art keywords
composition
leveling agent
cobalt electroplating
electroplating
cobalt
Prior art date
Application number
TW107141016A
Other languages
English (en)
Other versions
TW201923154A (zh
Inventor
納迪尼 安傑哈德特
迪耶特 邁爾
馬可 亞諾
亞歷山大 福路格
夏洛特 艾姆尼
盧卡斯 班傑明 漢恩德森
Original Assignee
德商巴斯夫歐洲公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德商巴斯夫歐洲公司 filed Critical 德商巴斯夫歐洲公司
Publication of TW201923154A publication Critical patent/TW201923154A/zh
Application granted granted Critical
Publication of TWI800558B publication Critical patent/TWI800558B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/18—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/16—Acetylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW107141016A 2017-11-20 2018-11-20 用於電鍍鈷之包含調平劑之組成物 TWI800558B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
??17202568.6 2017-11-20
EP17202568.6 2017-11-20
EP17202568 2017-11-20

Publications (2)

Publication Number Publication Date
TW201923154A TW201923154A (zh) 2019-06-16
TWI800558B true TWI800558B (zh) 2023-05-01

Family

ID=60409228

Family Applications (2)

Application Number Title Priority Date Filing Date
TW112112867A TW202334510A (zh) 2017-11-20 2018-11-20 用於電鍍鈷之包含調平劑之組成物
TW107141016A TWI800558B (zh) 2017-11-20 2018-11-20 用於電鍍鈷之包含調平劑之組成物

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW112112867A TW202334510A (zh) 2017-11-20 2018-11-20 用於電鍍鈷之包含調平劑之組成物

Country Status (8)

Country Link
US (2) US11377748B2 (zh)
EP (1) EP3714085B1 (zh)
JP (1) JP2021503560A (zh)
KR (1) KR102647950B1 (zh)
CN (1) CN111344438A (zh)
IL (1) IL274486A (zh)
TW (2) TW202334510A (zh)
WO (1) WO2019097044A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020126687A1 (en) * 2018-12-21 2020-06-25 Basf Se Composition for cobalt plating comprising additive for void-free submicron feature filling
US11230778B2 (en) 2019-12-13 2022-01-25 Macdermid Enthone Inc. Cobalt chemistry for smooth topology
US20240124999A1 (en) * 2022-09-26 2024-04-18 Rohm And Haas Electronic Materials Llc Nickel electroplating compositions for rough nickel

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002063070A1 (en) * 2001-02-08 2002-08-15 The University Of Alabama In Huntsville Nickel cobalt phosphorous low stress electroplating
TW200707640A (en) * 2005-03-18 2007-02-16 Applied Materials Inc Contact metallization scheme using a barrier layer over a silicide layer
TW201631108A (zh) * 2014-07-09 2016-09-01 Hitachi Chemical Co Ltd Cmp用研磨液及研磨方法

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1283417A (en) * 1968-10-24 1972-07-26 Kewanee Oil Co High speed electrodeposition of nickel and/or cobalt
JPS5424971B1 (zh) * 1970-12-10 1979-08-24
DE2100971B2 (de) * 1971-01-11 1975-04-17 Langbein-Pfanhauser Werke Ag, 4040 Neuss Verfahren und Bad zur Erzeugung mikrorissiger Chromschichten über Zwischenschichten
FR2472621A3 (fr) * 1979-12-28 1981-07-03 Xantia National Corp Procede pour l'obtention de depots metalliques brillants d'au moins un element du groupe fer-nickel-cobalt ou d'un alliage d'un ou de plusieurs de ces elements avec le chrome
US4425198A (en) 1981-06-16 1984-01-10 Omi International Corporation Brightening composition for zinc alloy electroplating bath and its method of use
AU726422B2 (en) * 1996-06-03 2000-11-09 Ebara-Udylite Co. Ltd. Electroless copper plating solution and method for electroless copper plating
US6508924B1 (en) * 2000-05-31 2003-01-21 Shipley Company L.L.C. Control of breakdown products in electroplating baths
JP4128005B2 (ja) 2001-12-28 2008-07-30 日本リーロナール有限会社 電気ニッケルめっき液
ES2271848T3 (es) 2003-02-24 2007-04-16 Basf Aktiengesellschaft Polimeros que contienen carboxilato para el tratamiento de superficies metalicas.
DE102005038608A1 (de) * 2005-08-16 2007-02-22 Basf Ag Polymerzusammensetzung für den Korrosionsschutz
TWI328622B (en) * 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds
JP5201315B2 (ja) * 2007-09-26 2013-06-05 上村工業株式会社 電気めっき方法
US20090188805A1 (en) 2008-01-25 2009-07-30 Government Of The United States Of America, As Represented By The Superconformal electrodeposition of nickel iron and cobalt magnetic alloys
MY157126A (en) * 2009-07-30 2016-05-13 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
US9617647B2 (en) * 2009-07-30 2017-04-11 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
US8691687B2 (en) 2010-01-07 2014-04-08 International Business Machines Corporation Superfilled metal contact vias for semiconductor devices
KR101780085B1 (ko) * 2010-03-18 2017-09-20 바스프 에스이 레벨링제를 포함하는 금속 전기도금용 조성물
EP2392692A1 (en) * 2010-06-01 2011-12-07 Basf Se Composition for metal electroplating comprising leveling agent
US20130264213A1 (en) * 2010-12-21 2013-10-10 Basf Se Composition for metal electroplating comprising leveling agent
SG194983A1 (en) * 2011-06-01 2013-12-30 Basf Se Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features
EP2530102A1 (en) * 2011-06-01 2012-12-05 Basf Se Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias
US9514983B2 (en) 2012-12-28 2016-12-06 Intel Corporation Cobalt based interconnects and methods of fabrication thereof
EP2801640A1 (en) * 2013-05-08 2014-11-12 ATOTECH Deutschland GmbH Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy
US20150071980A1 (en) * 2013-09-06 2015-03-12 Savannah River Nuclear Solutions, Llc Formation of nanosized metal particles on a titanate carrier
US9777386B2 (en) 2015-03-19 2017-10-03 Lam Research Corporation Chemistry additives and process for cobalt film electrodeposition
CN113215626A (zh) 2015-06-30 2021-08-06 麦德美乐思公司 微电子电路中的互连部的钴填充
US20170067173A1 (en) * 2015-09-09 2017-03-09 Rohm And Haas Electronic Materials Llc Acid copper electroplating bath and method for electroplating low internal stress and good ductility copper deposits
US20190226107A1 (en) 2016-07-18 2019-07-25 Basf Se Composition for cobalt plating comprising additive for void-free submicron feature filling
US10329683B2 (en) * 2016-11-03 2019-06-25 Lam Research Corporation Process for optimizing cobalt electrofill using sacrificial oxidants
US11035048B2 (en) * 2017-07-05 2021-06-15 Macdermid Enthone Inc. Cobalt filling of interconnects
CN111630211B (zh) * 2017-11-01 2024-05-24 朗姆研究公司 控制在电化学镀敷设备上的镀敷电解液浓度
CN112154228A (zh) 2018-04-19 2020-12-29 巴斯夫欧洲公司 用于钴或钴合金电镀的组合物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002063070A1 (en) * 2001-02-08 2002-08-15 The University Of Alabama In Huntsville Nickel cobalt phosphorous low stress electroplating
TW200707640A (en) * 2005-03-18 2007-02-16 Applied Materials Inc Contact metallization scheme using a barrier layer over a silicide layer
TW201631108A (zh) * 2014-07-09 2016-09-01 Hitachi Chemical Co Ltd Cmp用研磨液及研磨方法

Also Published As

Publication number Publication date
US11377748B2 (en) 2022-07-05
JP2021503560A (ja) 2021-02-12
KR102647950B1 (ko) 2024-03-14
TW202334510A (zh) 2023-09-01
KR20200089697A (ko) 2020-07-27
CN111344438A (zh) 2020-06-26
TW201923154A (zh) 2019-06-16
WO2019097044A1 (en) 2019-05-23
US20220298664A1 (en) 2022-09-22
US20200347503A1 (en) 2020-11-05
EP3714085B1 (en) 2023-08-09
IL274486A (en) 2020-06-30
EP3714085A1 (en) 2020-09-30

Similar Documents

Publication Publication Date Title
EP3697376B8 (en) Composition
EP3722358A4 (en) COMPOSITION
GB2565890B (en) Chromic compositions
EP3622034A4 (en) COATING COMPOSITION (S)
EP3588499A4 (en) PHOTOPOLYMER COMPOSITION
EP3514627A4 (en) PHOTO POLYMER COMPOSITION
EP3584364A4 (en) COMPOSITION
EP3630078A4 (en) AGENTS FOR CHEMIOEMBOLIZATION
EP3704958A4 (en) COMPOSITION FOR INCREASING MUSCLE MASS
IL276921A (en) Methods for changing body composition
IL274486A (en) A preparation for electroplating with cobalt containing an equalizing factor
EP3704757A4 (en) ELECTROLYTE COMPOSITION
EP3368620A4 (en) POLYURETHANE COATING COMPOSITION
EP3604462A4 (en) COATING COMPOSITION
EP3584279A4 (en) RUBBER COMPOSITION
EP3632429A4 (en) AGENT FOR REDUCING AMYLOID PROTEIN CONTENT
EP3543260A4 (en) PHOTO POLYMER COMPOSITION
HUE053711T2 (hu) Mikrobaellenes szer bevonókészítmény
EP3617262A4 (en) RUBBER COMPOSITION
EP3617263A4 (en) RUBBER COMPOSITION
EP3578624A4 (en) LUBRICANT COMPOSITION
EP3730547A4 (en) RUBBER COMPOSITION
EP3640307A4 (en) COATING COMPOSITION
EP3572485A4 (en) LUBRICANT COMPOSITION
EP3466998A4 (en) POLYURETHANE COMPOSITION