TWI799893B - 度量衡參數判定及度量衡配方選擇 - Google Patents
度量衡參數判定及度量衡配方選擇 Download PDFInfo
- Publication number
- TWI799893B TWI799893B TW110121915A TW110121915A TWI799893B TW I799893 B TWI799893 B TW I799893B TW 110121915 A TW110121915 A TW 110121915A TW 110121915 A TW110121915 A TW 110121915A TW I799893 B TWI799893 B TW I799893B
- Authority
- TW
- Taiwan
- Prior art keywords
- metrology
- parameter determination
- recipe selection
- selection
- metrology recipe
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0242—Testing optical properties by measuring geometrical properties or aberrations
- G01M11/0257—Testing optical properties by measuring geometrical properties or aberrations by analyzing the image formed by the object to be tested
- G01M11/0264—Testing optical properties by measuring geometrical properties or aberrations by analyzing the image formed by the object to be tested by using targets or reference patterns
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Geometry (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762501047P | 2017-05-03 | 2017-05-03 | |
US62/501,047 | 2017-05-03 | ||
EPEP18152479 | 2018-01-19 | ||
EP18152479 | 2018-01-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202212987A TW202212987A (zh) | 2022-04-01 |
TWI799893B true TWI799893B (zh) | 2023-04-21 |
Family
ID=61899316
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110121915A TWI799893B (zh) | 2017-05-03 | 2018-04-30 | 度量衡參數判定及度量衡配方選擇 |
TW107114625A TWI756417B (zh) | 2017-05-03 | 2018-04-30 | 度量衡參數判定及度量衡配方選擇 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107114625A TWI756417B (zh) | 2017-05-03 | 2018-04-30 | 度量衡參數判定及度量衡配方選擇 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7000454B2 (zh) |
KR (1) | KR102326192B1 (zh) |
CN (1) | CN110603490B (zh) |
IL (1) | IL270315B2 (zh) |
TW (2) | TWI799893B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11333982B2 (en) * | 2019-01-28 | 2022-05-17 | Kla Corporation | Scaling metric for quantifying metrology sensitivity to process variation |
CN113906345A (zh) * | 2019-05-03 | 2022-01-07 | Asml荷兰有限公司 | 基于倾斜拟合技术来确定对准模型的方法 |
JP7365510B2 (ja) * | 2020-01-29 | 2023-10-19 | エーエスエムエル ネザーランズ ビー.ブイ. | 基板上の周期構造を測定するための計測方法およびデバイス |
CN115777084A (zh) | 2020-07-09 | 2023-03-10 | Asml荷兰有限公司 | 量测方法、设备和计算机程序 |
US20240036484A1 (en) * | 2020-12-08 | 2024-02-01 | Asml Netherlands B.V. | Method of metrology and associated apparatuses |
CN117516882B (zh) * | 2023-11-08 | 2024-07-02 | 上海市第一人民医院 | 便携式视光学棱镜度检测装置及方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050018164A1 (en) * | 2003-02-11 | 2005-01-27 | Asml Netherlands B.V. | Exposure with intensity balancing to mimic complex illuminator shape |
US7245356B2 (en) * | 2003-02-11 | 2007-07-17 | Asml Netherlands B.V. | Lithographic apparatus and method for optimizing illumination using a photolithographic simulation |
US7279258B2 (en) * | 2004-03-12 | 2007-10-09 | Infineon Technologies Richmond, Lp | Method and arrangement for controlling focus parameters of an exposure tool |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7791727B2 (en) * | 2004-08-16 | 2010-09-07 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US7564555B2 (en) | 2006-08-15 | 2009-07-21 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
US9223227B2 (en) * | 2011-02-11 | 2015-12-29 | Asml Netherlands B.V. | Inspection apparatus and method, lithographic apparatus, lithographic processing cell and device manufacturing method |
NL2010717A (en) * | 2012-05-21 | 2013-11-25 | Asml Netherlands Bv | Determining a structural parameter and correcting an asymmetry property. |
NL2010988A (en) | 2012-07-05 | 2014-01-07 | Asml Netherlands Bv | Metrology method and apparatus, lithographic system, device manufacturing method and substrate. |
KR101860038B1 (ko) | 2013-12-30 | 2018-05-21 | 에이에스엠엘 네델란즈 비.브이. | 메트롤로지 타겟의 디자인을 위한 방법 및 장치 |
JP6524256B2 (ja) * | 2015-04-21 | 2019-06-05 | エーエスエムエル ネザーランズ ビー.ブイ. | メトロロジ方法及び装置、コンピュータプログラム、並びにリソグラフィシステム |
-
2018
- 2018-04-10 IL IL270315A patent/IL270315B2/en unknown
- 2018-04-10 KR KR1020197035138A patent/KR102326192B1/ko active IP Right Grant
- 2018-04-10 CN CN201880029637.XA patent/CN110603490B/zh active Active
- 2018-04-10 JP JP2019557563A patent/JP7000454B2/ja active Active
- 2018-04-30 TW TW110121915A patent/TWI799893B/zh active
- 2018-04-30 TW TW107114625A patent/TWI756417B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050018164A1 (en) * | 2003-02-11 | 2005-01-27 | Asml Netherlands B.V. | Exposure with intensity balancing to mimic complex illuminator shape |
US7180576B2 (en) * | 2003-02-11 | 2007-02-20 | Asml Netherlands B.V. | Exposure with intensity balancing to mimic complex illuminator shape |
US7245356B2 (en) * | 2003-02-11 | 2007-07-17 | Asml Netherlands B.V. | Lithographic apparatus and method for optimizing illumination using a photolithographic simulation |
US7279258B2 (en) * | 2004-03-12 | 2007-10-09 | Infineon Technologies Richmond, Lp | Method and arrangement for controlling focus parameters of an exposure tool |
Also Published As
Publication number | Publication date |
---|---|
IL270315A (zh) | 2019-12-31 |
TWI756417B (zh) | 2022-03-01 |
KR102326192B1 (ko) | 2021-11-15 |
IL270315B1 (en) | 2023-08-01 |
JP7000454B2 (ja) | 2022-02-04 |
JP2020518848A (ja) | 2020-06-25 |
IL270315B2 (en) | 2023-12-01 |
TW201843534A (zh) | 2018-12-16 |
TW202212987A (zh) | 2022-04-01 |
CN110603490A (zh) | 2019-12-20 |
CN110603490B (zh) | 2022-12-30 |
KR20190142390A (ko) | 2019-12-26 |
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