TWI799827B - 異方性導電膠及貼合方法 - Google Patents

異方性導電膠及貼合方法 Download PDF

Info

Publication number
TWI799827B
TWI799827B TW110111689A TW110111689A TWI799827B TW I799827 B TWI799827 B TW I799827B TW 110111689 A TW110111689 A TW 110111689A TW 110111689 A TW110111689 A TW 110111689A TW I799827 B TWI799827 B TW I799827B
Authority
TW
Taiwan
Prior art keywords
conductive adhesive
anisotropic conductive
bonding method
bonding
anisotropic
Prior art date
Application number
TW110111689A
Other languages
English (en)
Other versions
TW202237781A (zh
Inventor
張天宇
許家漢
Original Assignee
大陸商業成科技（成都）有限公司
大陸商業成光電（深圳）有限公司
大陸商業成光電（無錫）有限公司
英特盛科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商業成科技（成都）有限公司, 大陸商業成光電（深圳）有限公司, 大陸商業成光電（無錫）有限公司, 英特盛科技股份有限公司 filed Critical 大陸商業成科技（成都）有限公司
Publication of TW202237781A publication Critical patent/TW202237781A/zh
Application granted granted Critical
Publication of TWI799827B publication Critical patent/TWI799827B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Position Input By Displaying (AREA)
  • Combinations Of Printed Boards (AREA)
TW110111689A 2021-03-23 2021-03-30 異方性導電膠及貼合方法 TWI799827B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110308593.8 2021-03-23
CN202110308593.8A CN113046004A (zh) 2021-03-23 2021-03-23 异方性导电胶及贴合方法

Publications (2)

Publication Number Publication Date
TW202237781A TW202237781A (zh) 2022-10-01
TWI799827B true TWI799827B (zh) 2023-04-21

Family

ID=76514484

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110111689A TWI799827B (zh) 2021-03-23 2021-03-30 異方性導電膠及貼合方法

Country Status (2)

Country Link
CN (1) CN113046004A (zh)
TW (1) TWI799827B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114635219B (zh) * 2022-03-31 2023-09-05 业成科技（成都）有限公司 缓冲材料层、模压治具和压合工艺方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM513539U (zh) * 2015-06-16 2015-12-01 Emerging Display Tech Corp 可提高與基板黏著性與導電性的軟性印刷電路板
TW201840418A (zh) * 2017-03-06 2018-11-16 日商迪睿合股份有限公司 樹脂組成物、樹脂組成物之製造方法及構造體

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100381918C (zh) * 2003-09-30 2008-04-16 友达光电股份有限公司 确认异方性导电胶贴附位置的方法
CN101504921A (zh) * 2009-03-03 2009-08-12 友达光电（苏州）有限公司 显示装置的组装方法
TWM395185U (en) * 2010-06-11 2010-12-21 Emerging Display Tech Corp Preventing electrostatic destruction shielding layer of touch panel
TW201415495A (zh) * 2012-10-12 2014-04-16 Hon Hai Prec Ind Co Ltd 異方性導電膜及其製備方法
CN103412663B (zh) * 2013-03-30 2014-10-29 深圳欧菲光科技股份有限公司 金手指及触摸屏
WO2014208947A1 (ko) * 2013-06-24 2014-12-31 주식회사 티메이 터치 스크린 패널
CN104342058B (zh) * 2014-10-25 2016-08-24 深圳飞世尔新材料股份有限公司 一种光固化异方性导电膜的制备方法
CN105974695B (zh) * 2016-07-01 2019-05-31 深圳市华星光电技术有限公司 异方性导电胶膜及其贴附方法
CN106653808B (zh) * 2016-12-08 2019-12-24 武汉华星光电技术有限公司 基板与外接电路的绑定方法
CN108668432B (zh) * 2017-03-28 2021-02-09 宏启胜精密电子(秦皇岛)有限公司 可挠性电路板及其制作方法
CN107452438B (zh) * 2017-07-27 2019-10-11 京东方科技集团股份有限公司 一种各向异性导电胶带及胶带卷、绑定结构及显示装置
US10411218B2 (en) * 2017-10-30 2019-09-10 Wuhun China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Quasi crystalline conductive particles between a substrate and IC chip
CN107731702A (zh) * 2017-11-01 2018-02-23 昆山龙腾光电有限公司 模组绑定方法
CN108882552A (zh) * 2018-08-10 2018-11-23 武汉华星光电半导体显示技术有限公司 导电胶及电路板的邦定方法
CN110391039A (zh) * 2019-07-25 2019-10-29 深圳市华星光电半导体显示技术有限公司 异方性导电胶膜、显示面板及显示面板的制作方法
CN111303795A (zh) * 2020-02-14 2020-06-19 维沃移动通信有限公司 一种异方性导电胶膜及其制备方法和显示装置
CN111574937B (zh) * 2020-05-15 2021-10-08 武汉华星光电半导体显示技术有限公司 一种异方性导电胶、显示面板及显示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM513539U (zh) * 2015-06-16 2015-12-01 Emerging Display Tech Corp 可提高與基板黏著性與導電性的軟性印刷電路板
TW201840418A (zh) * 2017-03-06 2018-11-16 日商迪睿合股份有限公司 樹脂組成物、樹脂組成物之製造方法及構造體

Also Published As

Publication number Publication date
CN113046004A (zh) 2021-06-29
TW202237781A (zh) 2022-10-01

Similar Documents

Publication Publication Date Title
EP3742474A4 (en) CONNECTION SYSTEM AND CONNECTION METHOD
TWI347348B (en) Anisotropic conductive adhesive and connecting method of electrodes using the same
EP4057602A4 (en) INTERFACE DISPLAY METHOD AND ELECTRONIC DEVICE
EP4084050A4 (en) BONDING METHOD, RELATED ARTICLE AND BONDING DEVICE
EP3778069A4 (en) COPPER PASTE, GLUING METHOD AND GLUED BODY PRODUCTION METHOD
EP3957694A4 (en) ADHESIVE FILM AND ELECTRONIC DEVICE COMPRISING IT
EP4271006A4 (en) CONNECTION ESTABLISHMENT METHOD AND ELECTRONIC DEVICE
EP4105344A4 (en) BOUND COMPONENT AND METHOD OF PRODUCING THE SAME
TWI799827B (zh) 異方性導電膠及貼合方法
EP4141085A4 (en) ADHESIVE SET, FILM, CONNECTED BODY AND METHOD FOR SEPARATING JOINED PARTS
EP3835382A4 (en) COMPOSITION OF THERMOFUSIBLE ADHESIVE RESIN AND LAMINATE OF THERMOFUSIBLE ADHESIVE RESIN
EP3646963A4 (en) ELEMENT TYING PROCEDURE AND BONDED BODY
EP4141078A4 (en) ADHESIVE PATTERN, ADHESIVE BODY AND METHOD OF MANUFACTURE THEREOF
EP4227979A4 (en) CONNECTION SYSTEM AND CONNECTION PROCEDURE
EP3950175A4 (en) CONNECTING MATERIAL AND CONNECTING STRUCTURE
EP3796483A4 (en) CONNECTOR AND SECOND ELECTRONIC DEVICE INCLUDING LEDIT CONNECTOR
EP3932587A4 (en) TIGHTNESS CONFIRMATION METHOD AND TIGHTNESS CONFIRMATION DEVICE
EP3950185A4 (en) COMPRESSION CONNECTION COMPOSITION AND CONNECTED STRUCTURE OF CONDUCTIVE BODIES AND METHOD OF MANUFACTURE THEREOF
EP3786246A4 (en) SELF-ADHESIVE FILM AND ELECTRONIC DEVICE PRODUCTION METHOD
EP4131908A4 (en) INTERFACE DISPLAY METHOD AND ELECTRONIC DEVICE
EP4216524A4 (en) INTERFACE DISPLAY METHOD AND ELECTRONIC DEVICE
EP4090302A4 (en) ADHESIVE DRESSING AND METHOD OF MANUFACTURE THEREOF
EP4036186A4 (en) ADHESIVE COMPOSITION AND BONDING METHOD
EP3960445A4 (en) ADHESIVE FILM AND METHOD OF MAKING AN ELECTRONIC DEVICE
EP3862403A4 (en) ADHESIVE FILM AND METHOD OF MAKING AN ELECTRONIC DEVICE