TWI799827B - 異方性導電膠及貼合方法 - Google Patents
異方性導電膠及貼合方法 Download PDFInfo
- Publication number
- TWI799827B TWI799827B TW110111689A TW110111689A TWI799827B TW I799827 B TWI799827 B TW I799827B TW 110111689 A TW110111689 A TW 110111689A TW 110111689 A TW110111689 A TW 110111689A TW I799827 B TWI799827 B TW I799827B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive adhesive
- anisotropic conductive
- bonding method
- bonding
- anisotropic
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Position Input By Displaying (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110308593.8 | 2021-03-23 | ||
CN202110308593.8A CN113046004A (zh) | 2021-03-23 | 2021-03-23 | 异方性导电胶及贴合方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202237781A TW202237781A (zh) | 2022-10-01 |
TWI799827B true TWI799827B (zh) | 2023-04-21 |
Family
ID=76514484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110111689A TWI799827B (zh) | 2021-03-23 | 2021-03-30 | 異方性導電膠及貼合方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN113046004A (zh) |
TW (1) | TWI799827B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114635219B (zh) * | 2022-03-31 | 2023-09-05 | 业成科技(成都)有限公司 | 缓冲材料层、模压治具和压合工艺方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM513539U (zh) * | 2015-06-16 | 2015-12-01 | Emerging Display Tech Corp | 可提高與基板黏著性與導電性的軟性印刷電路板 |
TW201840418A (zh) * | 2017-03-06 | 2018-11-16 | 日商迪睿合股份有限公司 | 樹脂組成物、樹脂組成物之製造方法及構造體 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100381918C (zh) * | 2003-09-30 | 2008-04-16 | 友达光电股份有限公司 | 确认异方性导电胶贴附位置的方法 |
CN101504921A (zh) * | 2009-03-03 | 2009-08-12 | 友达光电(苏州)有限公司 | 显示装置的组装方法 |
TWM395185U (en) * | 2010-06-11 | 2010-12-21 | Emerging Display Tech Corp | Preventing electrostatic destruction shielding layer of touch panel |
TW201415495A (zh) * | 2012-10-12 | 2014-04-16 | Hon Hai Prec Ind Co Ltd | 異方性導電膜及其製備方法 |
CN103412663B (zh) * | 2013-03-30 | 2014-10-29 | 深圳欧菲光科技股份有限公司 | 金手指及触摸屏 |
WO2014208947A1 (ko) * | 2013-06-24 | 2014-12-31 | 주식회사 티메이 | 터치 스크린 패널 |
CN104342058B (zh) * | 2014-10-25 | 2016-08-24 | 深圳飞世尔新材料股份有限公司 | 一种光固化异方性导电膜的制备方法 |
CN105974695B (zh) * | 2016-07-01 | 2019-05-31 | 深圳市华星光电技术有限公司 | 异方性导电胶膜及其贴附方法 |
CN106653808B (zh) * | 2016-12-08 | 2019-12-24 | 武汉华星光电技术有限公司 | 基板与外接电路的绑定方法 |
CN108668432B (zh) * | 2017-03-28 | 2021-02-09 | 宏启胜精密电子(秦皇岛)有限公司 | 可挠性电路板及其制作方法 |
CN107452438B (zh) * | 2017-07-27 | 2019-10-11 | 京东方科技集团股份有限公司 | 一种各向异性导电胶带及胶带卷、绑定结构及显示装置 |
US10411218B2 (en) * | 2017-10-30 | 2019-09-10 | Wuhun China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Quasi crystalline conductive particles between a substrate and IC chip |
CN107731702A (zh) * | 2017-11-01 | 2018-02-23 | 昆山龙腾光电有限公司 | 模组绑定方法 |
CN108882552A (zh) * | 2018-08-10 | 2018-11-23 | 武汉华星光电半导体显示技术有限公司 | 导电胶及电路板的邦定方法 |
CN110391039A (zh) * | 2019-07-25 | 2019-10-29 | 深圳市华星光电半导体显示技术有限公司 | 异方性导电胶膜、显示面板及显示面板的制作方法 |
CN111303795A (zh) * | 2020-02-14 | 2020-06-19 | 维沃移动通信有限公司 | 一种异方性导电胶膜及其制备方法和显示装置 |
CN111574937B (zh) * | 2020-05-15 | 2021-10-08 | 武汉华星光电半导体显示技术有限公司 | 一种异方性导电胶、显示面板及显示装置 |
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2021
- 2021-03-23 CN CN202110308593.8A patent/CN113046004A/zh active Pending
- 2021-03-30 TW TW110111689A patent/TWI799827B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM513539U (zh) * | 2015-06-16 | 2015-12-01 | Emerging Display Tech Corp | 可提高與基板黏著性與導電性的軟性印刷電路板 |
TW201840418A (zh) * | 2017-03-06 | 2018-11-16 | 日商迪睿合股份有限公司 | 樹脂組成物、樹脂組成物之製造方法及構造體 |
Also Published As
Publication number | Publication date |
---|---|
CN113046004A (zh) | 2021-06-29 |
TW202237781A (zh) | 2022-10-01 |
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