TWI799505B - Polyimide resin composition and polyimide film - Google Patents

Polyimide resin composition and polyimide film Download PDF

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Publication number
TWI799505B
TWI799505B TW108103991A TW108103991A TWI799505B TW I799505 B TWI799505 B TW I799505B TW 108103991 A TW108103991 A TW 108103991A TW 108103991 A TW108103991 A TW 108103991A TW I799505 B TWI799505 B TW I799505B
Authority
TW
Taiwan
Prior art keywords
polyimide
resin composition
film
polyimide film
polyimide resin
Prior art date
Application number
TW108103991A
Other languages
Chinese (zh)
Other versions
TW201934617A (en
Inventor
安孫子洋平
岡弘明
末永修也
高田貴文
針生智大
Original Assignee
日商三菱瓦斯化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三菱瓦斯化學股份有限公司 filed Critical 日商三菱瓦斯化學股份有限公司
Publication of TW201934617A publication Critical patent/TW201934617A/en
Application granted granted Critical
Publication of TWI799505B publication Critical patent/TWI799505B/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/353—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW108103991A 2018-02-05 2019-02-01 Polyimide resin composition and polyimide film TWI799505B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-018307 2018-02-05
JP2018018307 2018-02-05

Publications (2)

Publication Number Publication Date
TW201934617A TW201934617A (en) 2019-09-01
TWI799505B true TWI799505B (en) 2023-04-21

Family

ID=67478242

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108103991A TWI799505B (en) 2018-02-05 2019-02-01 Polyimide resin composition and polyimide film

Country Status (5)

Country Link
JP (1) JP7180617B2 (en)
KR (1) KR102663662B1 (en)
CN (1) CN111683992B (en)
TW (1) TWI799505B (en)
WO (1) WO2019151336A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021033544A1 (en) * 2019-08-20 2021-02-25
WO2021070912A1 (en) * 2019-10-11 2021-04-15 三菱瓦斯化学株式会社 Polyimide resin composition, polyimide varnish, and polyimide film
WO2021153696A1 (en) * 2020-01-29 2021-08-05 富士フイルム株式会社 Polarizing plate and display device
US11572442B2 (en) 2020-04-14 2023-02-07 International Business Machines Corporation Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component
WO2022098042A1 (en) * 2020-11-04 2022-05-12 피아이첨단소재 주식회사 Polyimide film having high dimensional stability, and method for manufacturing same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201302859A (en) * 2011-06-13 2013-01-16 Kaneka Corp Polyamic acid, polyimide, polyamic acid solution, polyimide solution, polyimide film prepared from these solutions, and use of polyimide film
JP2016222797A (en) * 2015-05-29 2016-12-28 三菱瓦斯化学株式会社 Polyimide resin composition
TW201739793A (en) * 2016-05-06 2017-11-16 三菱瓦斯化學股份有限公司 Polyimide resin

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6174580U (en) 1984-10-22 1986-05-20
EP2744851B1 (en) * 2011-08-19 2018-09-19 Akron Polymer Systems, Inc. Thermally stable, low birefringent copolyimide films
JP5985977B2 (en) * 2012-12-18 2016-09-06 株式会社カネカ Polyimide resin solution
JP6394045B2 (en) * 2014-04-25 2018-09-26 日本ゼオン株式会社 Polyimide, laminated film, retardation film, and laminated film manufacturing method
JP2017119821A (en) * 2015-12-28 2017-07-06 宇部興産株式会社 Polyimide material and method for producing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201302859A (en) * 2011-06-13 2013-01-16 Kaneka Corp Polyamic acid, polyimide, polyamic acid solution, polyimide solution, polyimide film prepared from these solutions, and use of polyimide film
JP2016222797A (en) * 2015-05-29 2016-12-28 三菱瓦斯化学株式会社 Polyimide resin composition
TW201739793A (en) * 2016-05-06 2017-11-16 三菱瓦斯化學股份有限公司 Polyimide resin

Also Published As

Publication number Publication date
JP7180617B2 (en) 2022-11-30
CN111683992A (en) 2020-09-18
KR102663662B1 (en) 2024-05-08
JPWO2019151336A1 (en) 2021-01-14
WO2019151336A1 (en) 2019-08-08
KR20200118027A (en) 2020-10-14
TW201934617A (en) 2019-09-01
CN111683992B (en) 2023-05-05

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