TWI798763B - Electronic device and method of manufacturing the same - Google Patents
Electronic device and method of manufacturing the same Download PDFInfo
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Description
本揭露是有關於一種電子裝置及其製造方法。The disclosure relates to an electronic device and a manufacturing method thereof.
由於液晶顯示器(LCD)為非自發光性的顯示裝置，因此必須藉助於外部光源達到顯示效果。背光模組的功能即在於供應充足的亮度與分布均勻的光源，讓液晶面板能正常顯示影像。Since a liquid crystal display (LCD) is a non-self-illuminating display device, an external light source must be used to achieve a display effect. The function of the backlight module is to supply sufficient brightness and evenly distributed light source so that the LCD panel can display images normally.
根據光源在背光模組內的擺設位置可分為直下式(direct backlight type)和側光式(side backlight type)。直下式背光模組之光源設置於液晶面板下方。光線可直接進入或間接反射到上方光學膜上。側光式背光模組之光源設置於背光模組側邊。光線從側面進入導光板後，經由反射板反射至上方光學膜上。According to the arrangement position of the light source in the backlight module, it can be divided into direct backlight type and side backlight type. The light source of the direct type backlight module is arranged under the liquid crystal panel. Light can enter directly or reflect indirectly to the optical film above. The light source of the edge-lit backlight module is arranged on the side of the backlight module. After the light enters the light guide plate from the side, it is reflected to the upper optical film through the reflection plate.
然而，現有採用側光式背光模組之觸控顯示模組有以下限制：(1) 需使用多層光學膠貼合，導致成本及貼合作業難度增加；(2) 因多層結構之限制，背光模組的厚度較厚；以及(3) 背光模組需有較大的框邊結構固定，無法實現窄邊框結構。中國專利公告號CN 100378541C使用框件卡扣顯示屏，其框件設計不利於窄邊框。However, the existing touch display modules using edge-lit backlight modules have the following limitations: (1) multi-layer optical adhesive is required for bonding, which increases the cost and difficulty of bonding operations; (2) due to the limitation of the multi-layer structure, the backlight The thickness of the module is relatively thick; and (3) the backlight module needs to be fixed with a larger frame structure, and a narrow frame structure cannot be realized. Chinese patent announcement number CN 100378541C uses a frame to buckle the display screen, and its frame design is not conducive to a narrow frame.
因此，如何提出一種可解決上述問題的電子裝置，是目前業界亟欲投入研發資源解決的問題之一。Therefore, how to propose an electronic device that can solve the above-mentioned problems is one of the problems that the industry is eager to devote research and development resources to solve.
有鑑於此，本揭露之一目的在於提出一種可有解決上述問題的電子裝置與電子裝置及其製造方法。In view of this, one purpose of the present disclosure is to provide an electronic device, an electronic device and a manufacturing method thereof that can solve the above problems.
為了達到上述目的，依據本揭露之一實施方式，一種電子裝置包含外殼、觸控顯示模組以及至少一光學組件。外殼具有容置部以及卡合部。觸控顯示模組設置於容置部內並與卡合部卡合。觸控顯示模組包含薄膜電晶體基板、彩色濾光片基板以及觸控電極層。彩色濾光片基板設置於薄膜電晶體基板朝向外殼的一側。觸控電極層設置於薄膜電晶體基板與彩色濾光片基板中之一者的一表面上。光學組件設置於彩色濾光片基板遠離薄膜電晶體基板的一側。In order to achieve the above object, according to an embodiment of the present disclosure, an electronic device includes a housing, a touch display module and at least one optical component. The shell has an accommodating portion and an engaging portion. The touch display module is arranged in the accommodating part and engaged with the engaging part. The touch display module includes a thin film transistor substrate, a color filter substrate and a touch electrode layer. The color filter substrate is arranged on the side of the thin film transistor substrate facing the shell. The touch electrode layer is disposed on a surface of one of the thin film transistor substrate and the color filter substrate. The optical component is arranged on the side of the color filter substrate away from the TFT substrate.
於本揭露的一或多個實施方式中，薄膜電晶體基板相對於彩色濾光片基板向外延伸至少一延伸部。延伸部與卡合部卡合。In one or more embodiments of the present disclosure, the thin film transistor substrate extends outward relative to the color filter substrate by at least one extension portion. The extension part is engaged with the engaging part.
於本揭露的一或多個實施方式中，電子裝置進一步包含壓敏膠層。壓敏膠層設置且接觸於延伸部與卡合部之間。In one or more embodiments of the present disclosure, the electronic device further includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer is disposed and contacts between the extension part and the engaging part.
於本揭露的一或多個實施方式中，觸控顯示模組進一步包含偏光片。偏光片設置且接觸於薄膜電晶體基板遠離外殼的一側。In one or more embodiments of the present disclosure, the touch display module further includes a polarizer. The polarizer is arranged and in contact with the side of the thin film transistor substrate away from the shell.
於本揭露的一或多個實施方式中，偏光片構成電子裝置的外觀面的一部分。In one or more embodiments of the present disclosure, the polarizer constitutes a part of the appearance surface of the electronic device.
於本揭露的一或多個實施方式中，觸控顯示模組進一步包含遮光層。遮光層設置於偏光片上。In one or more implementations of the present disclosure, the touch display module further includes a light-shielding layer. The light-shielding layer is arranged on the polarizer.
於本揭露的一或多個實施方式中，觸控顯示模組進一步包含偏光片。偏光片設置於彩色濾光片基板遠離薄膜電晶體基板的該側。光學組件係直接設置於偏光片遠離彩色濾光片基板的一側。In one or more embodiments of the present disclosure, the touch display module further includes a polarizer. The polarizer is arranged on the side of the color filter substrate away from the TFT substrate. The optical component is directly arranged on the side of the polarizer away from the color filter substrate.
於本揭露的一或多個實施方式中，光學組件包含增光膜、擴散膜以及反射片中之一者或其組合。In one or more embodiments of the present disclosure, the optical component includes one or a combination of a brightness enhancement film, a diffusion film, and a reflection sheet.
於本揭露的一或多個實施方式中，光學組件直接接觸容置部的內底面。In one or more embodiments of the present disclosure, the optical component directly contacts the inner bottom surface of the accommodating portion.
於本揭露的一或多個實施方式中，電子裝置進一步包含背光組件。背光組件設置於容置部內並與光學組件疊合。In one or more embodiments of the present disclosure, the electronic device further includes a backlight assembly. The backlight assembly is arranged in the accommodating part and overlapped with the optical assembly.
於本揭露的一或多個實施方式中，背光組件為側光式背光組件或直下式背光組件。In one or more embodiments of the present disclosure, the backlight unit is an edge-lit backlight unit or a direct-lit backlight unit.
於本揭露的一或多個實施方式中，直下式背光組件包含次毫米發光二極體。In one or more embodiments of the present disclosure, the direct type backlight assembly includes submillimeter light emitting diodes.
於本揭露的一或多個實施方式中，卡合部為位於容置部內的台階結構。In one or more embodiments of the present disclosure, the engaging portion is a stepped structure located in the accommodating portion.
為了達到上述目的，依據本揭露之一實施方式，一種電子裝置包含外殼、觸控顯示模組、背光模組、第一壓敏膠層以及第二壓敏膠層。外殼具有容置部。觸控顯示模組設置於容置部內，並包含薄膜電晶體基板、彩色濾光片基板以及觸控電極層。彩色濾光片基板設置於薄膜電晶體基板朝向外殼的一側。觸控電極層設置於彩色濾光片基板面向或遠離薄膜電晶體基板的一表面上。背光模組設置於容置部內，並位於外殼與觸控顯示模組之間。第一壓敏膠層設置且接觸於彩色濾光片基板與背光模組之間。第二壓敏膠層設置且接觸於背光模組與容置部的內底面之間。In order to achieve the above object, according to an embodiment of the present disclosure, an electronic device includes a casing, a touch display module, a backlight module, a first pressure-sensitive adhesive layer, and a second pressure-sensitive adhesive layer. The shell has an accommodating portion. The touch display module is arranged in the accommodating part, and includes a thin film transistor substrate, a color filter substrate and a touch electrode layer. The color filter substrate is arranged on the side of the thin film transistor substrate facing the shell. The touch electrode layer is disposed on a surface of the color filter substrate facing or away from the TFT substrate. The backlight module is arranged in the accommodating part, and is located between the casing and the touch display module. The first pressure-sensitive adhesive layer is arranged and contacted between the color filter substrate and the backlight module. The second pressure-sensitive adhesive layer is arranged and contacts between the backlight module and the inner bottom surface of the accommodating part.
於本揭露的一或多個實施方式中，觸控顯示模組進一步包含偏光片。偏光片設置且接觸於薄膜電晶體基板遠離該外殼的一側。In one or more embodiments of the present disclosure, the touch display module further includes a polarizer. The polarizer is arranged and in contact with the side of the thin film transistor substrate away from the casing.
於本揭露的一或多個實施方式中，偏光片構成電子裝置的外觀面的一部分。In one or more embodiments of the present disclosure, the polarizer constitutes a part of the appearance surface of the electronic device.
於本揭露的一或多個實施方式中，觸控顯示模組進一步包含遮光層。遮光層設置於偏光片上。In one or more implementations of the present disclosure, the touch display module further includes a light-shielding layer. The light-shielding layer is arranged on the polarizer.
為了達到上述目的，依據本揭露之一實施方式，一種電子裝置之製造方法包含：疊合薄膜電晶體基板與彩色濾光片基板；在彩色濾光片基板或薄膜電晶體基板的一表面上設置觸控電極層；形成遮光層於偏光片上；將偏光片疊合於薄膜電晶體基板遠離彩色濾光片基板的一側；切割偏光片，使得經切割之偏光片的邊緣與薄膜電晶體基板的邊緣切齊，其中薄膜電晶體基板、彩色濾光片基板、偏光片與遮光層構成觸控顯示模組的至少一部分；以及將觸控顯示模組容置於外殼的容置部內，致使偏光片構成電子裝置的外觀面的一部分。In order to achieve the above object, according to an embodiment of the present disclosure, a method of manufacturing an electronic device includes: laminating a thin film transistor substrate and a color filter substrate; The touch electrode layer; forming a light-shielding layer on the polarizer; laminating the polarizer on the side of the thin film transistor substrate away from the color filter substrate; cutting the polarizer so that the edge of the cut polarizer is in line with the edge of the thin film transistor substrate The edges are aligned, wherein the thin film transistor substrate, the color filter substrate, the polarizer and the light-shielding layer constitute at least a part of the touch display module; It constitutes a part of the exterior surface of the electronic device.
綜上所述，於本揭露的電子裝置中，觸控顯示模組係以薄膜電晶體基板與彩色濾光片基板分別背對與面向外殼的方式組裝至外殼的容置部內，並以薄膜電晶體基板邊緣的延伸部固定至外殼的卡合部。換言之，本揭露的電子裝置係以薄膜電晶體基板作為固定結構並取代習知的玻璃蓋板，因此可減少電子裝置的厚度。另外，背光模組的各元件係直接疊合在外殼的容置部內，省去習知背光模組使用的鐵件和塑膠件，因此亦可減少電子裝置的厚度。To sum up, in the electronic device disclosed in the present disclosure, the touch display module is assembled into the accommodating part of the housing with the thin film transistor substrate and the color filter substrate facing away from and facing the housing respectively, and the thin film transistor The extension portion of the edge of the crystal substrate is fixed to the engaging portion of the housing. In other words, the electronic device of the present disclosure uses the thin film transistor substrate as a fixed structure and replaces the conventional glass cover, so the thickness of the electronic device can be reduced. In addition, each component of the backlight module is directly stacked in the housing portion, which saves the iron and plastic parts used in the conventional backlight module, thus reducing the thickness of the electronic device.
以上所述僅係用以闡述本揭露所欲解決的問題、解決問題的技術手段、及其產生的功效等等，本揭露之具體細節將在下文的實施方式及相關圖式中詳細介紹。The above description is only used to explain the problems to be solved by the present disclosure, the technical means to solve the problems, and the effects thereof, etc. The specific details of the present disclosure will be introduced in detail in the following implementation methods and related drawings.
以下將以圖式揭露本揭露之複數個實施方式，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本揭露。也就是說，在本揭露部分實施方式中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。The following will disclose multiple implementations of the present disclosure with diagrams, and for the sake of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present disclosure. That is to say, in some embodiments of the present disclosure, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some well-known structures and components will be shown in a simple and schematic manner in the drawings.
請參照第1圖，其為繪示根據本揭露一實施方式之電子裝置100的示意圖。如第1圖所示，於本實施方式中，電子裝置100包含外殼110、觸控顯示模組120以及背光模組130。外殼110具有容置部111以及卡合部112。觸控顯示模組120設置於容置部111內並與卡合部112卡合。觸控顯示模組120包含薄膜電晶體基板121、彩色濾光片基板122以及觸控電極層123（先參閱第4圖及第5圖）。彩色濾光片基板122設置於薄膜電晶體基板121朝向外殼110的一側。觸控電極層123設置於薄膜電晶體基板121與彩色濾光片基板122中之一者的一表面上。背光模組130設置於彩色濾光片基板122遠離薄膜電晶體基板121的一側。背光模組130包含光學組件131以及背光組件132。光學組件131與背光組件132於容置部111內相互疊合。Please refer to FIG. 1 , which is a schematic diagram illustrating an
具體來說，薄膜電晶體基板121相對於彩色濾光片基板122向外延伸延伸部121a。延伸部121a與外殼110的卡合部112卡合。藉由前述結構配置，本實施方式的電子裝置100可以薄膜電晶體基板121作為固定結構並取代習知的玻璃蓋板，因此可減少電子裝置100的厚度。Specifically, the thin
如第1圖所示，於本實施方式中，電子裝置100進一步包含壓敏膠層140。壓敏膠層140設置且接觸於薄膜電晶體基板121的延伸部121a與外殼110的卡合部112之間。壓敏膠層140具有較好的黏固特性，並且適於重工。As shown in FIG. 1 , in this embodiment, the
於一些實施方式中，薄膜電晶體基板121具有複數個延伸部121a，分別由薄膜電晶體基板121的複數個邊緣相對於彩色濾光片基板122向外延伸而出。In some implementations, the thin
如第1圖所示，於本實施方式中，外殼110的卡合部112為位於容置部111的內側壁上的台階結構。As shown in FIG. 1 , in this embodiment, the engaging
如第1圖所示，於本實施方式中，電子裝置100進一步包含兩偏光片124a、124b。偏光片124a設置且接觸於薄膜電晶體基板121遠離外殼110的一側。偏光片124a構成電子裝置100的外觀面的一部分。偏光片124b設置於彩色濾光片基板122遠離薄膜電晶體基板121的一側。背光模組130係直接設置於偏光片124b遠離彩色濾光片基板122的一側。需說明的是，在此所稱之「直接設置」係指採用不經由其他元件的輔助的設置方式。因此，背光模組130的各元件係直接疊合在外殼110的容置部111內，省去習知背光模組使用的鐵件和塑膠件，進而可進一步減少電子裝置100的厚度。As shown in FIG. 1 , in this embodiment, the
詳細來說，背光模組130的光學組件131包含增光膜131a1、131a2、擴散膜131b以及反射片131c，其中，反射片131c係直接接觸容置部111的內底面。背光模組130的背光組件132包含導光板132a以及光源132b。增光膜131a1、131a2、擴散膜131b、導光板132a與反射片131c由上而下依序疊合於容置部111內。光源132b所發射的光線由導光板132a的側表面進入導光板132a內，並可由反射片131c反射而由導光板132a的上表面離開。離開導光板132a的光線可依序通過擴散膜131b、增光膜131a2、131a1、偏光片124b、彩色濾光片基板122、薄膜電晶體基板121與偏光片124a而離開電子裝置100。本實施方式之背光組件132可稱為側光式(side backlight type)背光組件。In detail, the
請參照第2圖，其為繪示根據本揭露一實施方式之電子裝置之製造方法的流程圖。本實施方式之電子裝置之製造方法主要包含步驟S101至步驟S106，並可配合參照第1圖及第3圖至第8圖。第3圖及第6圖至第8圖為分別繪示第1圖中之電子裝置100的不同製造階段的示意圖。Please refer to FIG. 2 , which is a flowchart illustrating a manufacturing method of an electronic device according to an embodiment of the present disclosure. The manufacturing method of the electronic device in this embodiment mainly includes step S101 to step S106 , and reference may be made to FIG. 1 and FIG. 3 to FIG. 8 . FIG. 3 and FIG. 6 to FIG. 8 are schematic diagrams showing different manufacturing stages of the
步驟S101（請配合參照第3圖）：疊合薄膜電晶體基板121與彩色濾光片基板122。如第3圖所示，薄膜電晶體基板121相對於彩色濾光片基板122向外延伸延伸部121a。Step S101 (please refer to FIG. 3 ): laminating the
步驟S102：將觸控電極層123設置在彩色濾光片基板122或薄膜電晶體基板121的一表面上。請配合參照第4圖與第5圖。第4圖為繪示根據本揭露一實施方式之觸控顯示模組120的部分元件的示意圖。第5圖為繪示根據本揭露另一實施方式之觸控顯示模組120的部分元件的示意圖。Step S102 : disposing the
於第4圖所示的實施方式中，觸控電極層123設置在彩色濾光片基板122面向薄膜電晶體基板121的一表面上，並位於薄膜電晶體基板121與彩色濾光片基板122之間（亦即，觸控電極層123係嵌入到液晶像素中）。第4圖所示的結構可稱為In-Cell式觸控顯示面板。In the embodiment shown in FIG. 4, the
於第5圖所示的實施方式中，觸控電極層123設置在彩色濾光片基板122遠離薄膜電晶體基板121的一表面上（亦即，觸控電極層123係嵌入到彩色濾光片基板122與偏光片124b之間）。第5圖所示的結構可稱為On-Cell式觸控顯示面板。於其他一些實施方式中，觸控電極層123亦可設置在薄膜電晶體基板121遠離彩色濾光片基板122的一表面上（亦即，觸控電極層123係嵌入到薄膜電晶體基板121與偏光片124a之間）。In the embodiment shown in FIG. 5, the
步驟S103（請配合參照第6圖）：形成遮光層125於偏光片124a上。Step S103 (please refer to FIG. 6 ): forming a light-
於一些實施方式中，遮光層125係由黑色油墨經由例如印刷製程印刷於偏光片124a上，但本揭露並不以此為限。In some embodiments, the light-
步驟S104（請配合參照第6圖）：偏光片124a疊合於薄膜電晶體基板121遠離彩色濾光片基板122的一側。Step S104 (please refer to FIG. 6 ): the
於一些實施方式中，偏光片124a遠離薄膜電晶體基板121的表面有經過防刮處理。In some embodiments, the surface of the
步驟S105（請配合參照第7圖）：切割偏光片124a，使得經切割之偏光片124a的邊緣與薄膜電晶體基板121的邊緣切齊，其中薄膜電晶體基板121、彩色濾光片基板122、偏光片124a與遮光層125構成觸控顯示模組120的至少一部分。需留意，於邊緣切齊製程中，偏光片124a及薄膜電晶體基板121可以存在0毫米(mm)至0.1毫米(mm)切割誤差。前述帶有極小切割誤差亦屬於邊緣切齊所界定範疇。Step S105 (please refer to Figure 7): cutting the
於一些實施方式中，偏光片124a的切割係利用雷射切割加工技術，但本揭露並不以此為限。In some embodiments, the cutting of the
需說明的是，由於本實施方式之電子裝置100之製造方法係先將偏光片124a貼附於薄膜電晶體基板121上，再將偏光片124a超出薄膜電晶體基板121的邊緣的部分切除，因此可有效解決偏光片124a與薄膜電晶體基板121之間的對位問題，且可達到偏光片124a全貼合在薄膜電晶體基板121上（即兩者之間無間隙）。It should be noted that, since the manufacturing method of the
步驟S106（請配合參照第8圖）：將觸控顯示模組120容置於外殼110的容置部111內，致使偏光片124a構成電子裝置100的外觀面的一部分。Step S106 (please refer to FIG. 8 ): place the
在執行步驟S106時，可先將壓敏膠層140設置於外殼110的卡合部112，再將薄膜電晶體基板121的延伸部121a壓合在壓敏膠層140，以完成觸控顯示模組120組裝至外殼110的製造程序。When performing step S106, the pressure-
於一些實施方式中，在步驟S105之後以及步驟S106之前，可將偏光片124b疊合於彩色濾光片基板122遠離薄膜電晶體基板121的一側。In some implementations, after the step S105 and before the step S106, the
於一些實施方式中，在步驟S105之後以及步驟S106之前，可將背光模組130直接設置於外殼110的容置部111內。In some embodiments, after the step S105 and before the step S106, the
在完成上述步驟之後，即可獲得第1圖所示之電子裝置100。After completing the above steps, the
請參照第9圖，為繪示根據本揭露另一實施方式之電子裝置200的示意圖。如第9圖所示，於本實施方式中，電子裝置200包含外殼110、觸控顯示模組120以及背光模組230，其中外殼110與觸控顯示模組120相同或相似於第1圖所示之實施方式，因此這些部件的相關說明可參照前文，在此恕不贅述。相較於第1圖所示之實施方式，本實施方式係提供修改後的背光模組230。具體來說，於本實施方式中，背光模組230包含光學組件231以及背光組件232。光學組件231包含增光膜131a1、131a2與光學膜片231b。背光組件232包含複數個光源232b。這些光源232b均勻地設置於容置部111的內底面上。光學組件231的增光膜131a1、131a2與光學膜片231b由上而下依序疊合於背光組件232上。本實施方式之背光組件232可稱為直下式(direct backlight type)背光組件。Please refer to FIG. 9 , which is a schematic diagram illustrating an
於一些實施方式中，光源232b為次毫米發光二極體（Mini LED），但本揭露並不以此為限。於一些實施方式中，次毫米發光二極體的尺寸在約50 µm（微米）至約200 µm之間。In some embodiments, the
請參照第10圖以及第11圖。第10圖為繪示根據本揭露另一實施方式之電子裝置300的示意圖。第11圖為繪示第10圖中之電子裝置300的一製造階段的示意圖。如第10圖與第11圖所示，於本實施方式中，電子裝置300包含外殼310、觸控顯示模組120以及背光模組330。觸控顯示模組120包含薄膜電晶體基板121、彩色濾光片基板122以及觸控電極層123。彩色濾光片基板122設置於薄膜電晶體基板121朝向外殼310的一側。觸控電極層123設置於薄膜電晶體基板121與彩色濾光片基板122中之一者的一表面上。背光模組330設置於彩色濾光片基板122遠離薄膜電晶體基板121的一側。電子裝置300進一步包含兩偏光片124a、124b。偏光片124a設置且接觸於薄膜電晶體基板121遠離外殼310的一側。偏光片124a構成電子裝置300的外觀面的一部分。偏光片124b設置於彩色濾光片基板122遠離薄膜電晶體基板121的一側。背光模組330係直接設置於偏光片124b遠離彩色濾光片基板122的一側。需說明的是，在此所稱之「直接設置」係指採用不經由其他元件的輔助的設置方式。Please refer to Figure 10 and Figure 11. FIG. 10 is a schematic diagram illustrating an
相較於第1圖所示之實施方式，本實施方式係提供修改後的外殼310與背光模組330。具體來說，於本實施方式中，外殼310具有容置部311。背光模組330的各元件係直接疊合在外殼310的容置部311內，省去習知背光模組使用的鐵件和塑膠件，進而可進一步減少電子裝置300的厚度。另外，電子裝置300進一步包含第一壓敏膠層340a以及第二壓敏膠層340b。第一壓敏膠層340a設置且接觸於彩色濾光片基板122與背光模組330之間。第二壓敏膠層340b設置且接觸於背光模組330與容置部311的內底面之間。第一壓敏膠層340a與第二壓敏膠層340b具有較好的黏固特性，並且適於重工。Compared with the embodiment shown in FIG. 1 , this embodiment provides a modified
藉由前述結構配置，本實施方式的電子裝置300可以薄膜電晶體基板121取代習知的玻璃蓋板，因此可減少電子裝置300的厚度。不僅如此，於本實施方式的電子裝置300中，觸控顯示模組120與背光模組330係由上而下依序且直接疊合於容置部311的內底面上，因此可使電子裝置300達到極窄邊框的目的。With the aforementioned structural configuration, the
另外，第10圖所示之本實施方式之電子裝置300亦可經由第2圖所示之步驟S101至步驟S106而製成。需說明的是，於一些實施方式中，在步驟S105之後以及步驟S106之前，可將偏光片124b疊合於彩色濾光片基板122遠離薄膜電晶體基板121的一側。In addition, the
於一些實施方式中（請配合參照第11圖所示），在執行步驟S106時，可利用第一壓敏膠層340a先將觸控顯示模組120與背光模組330貼合，再利用第二壓敏膠層340b將背光模組330與容置部311的內底面貼合。In some implementations (please refer to FIG. 11 ), when step S106 is performed, the
在完成上述步驟之後，即可獲得第10圖所示之電子裝置300。After completing the above steps, the
由以上對於本揭露之具體實施方式之詳述，可以明顯地看出，於本揭露的電子裝置中，觸控顯示模組係以薄膜電晶體基板與彩色濾光片基板分別背對與面向外殼的方式組裝至外殼的容置部內，並以薄膜電晶體基板邊緣的延伸部固定至外殼的卡合部。換言之，本揭露的電子裝置係以薄膜電晶體基板作為固定結構並取代習知的玻璃蓋板，因此可減少電子裝置的厚度。另外，背光模組的各元件係直接疊合在外殼的容置部內，省去習知背光模組使用的鐵件和塑膠件，因此亦可減少電子裝置的厚度。From the above detailed description of the specific implementation of the present disclosure, it can be clearly seen that in the electronic device of the present disclosure, the touch display module has a thin film transistor substrate and a color filter substrate facing away from and facing the housing respectively. Assembled into the accommodating part of the housing in a manner, and fixed to the engaging part of the housing by the extension part of the edge of the thin film transistor substrate. In other words, the electronic device of the present disclosure uses the thin film transistor substrate as a fixed structure and replaces the conventional glass cover, so the thickness of the electronic device can be reduced. In addition, each component of the backlight module is directly stacked in the housing portion, which saves the iron and plastic parts used in the conventional backlight module, thus reducing the thickness of the electronic device.
雖然本揭露已以實施方式揭露如上，然其並不用以限定本揭露，任何熟習此技藝者，在不脫離本揭露的精神和範圍內，當可作各種的更動與潤飾，因此本揭露的保護範圍當視後附的申請專利範圍所界定者為準。Although the present disclosure has been disclosed above in terms of implementation, it is not intended to limit this disclosure. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of this disclosure. Therefore, the protection of this disclosure The scope shall be defined by the scope of the appended patent application.
100,200,300:電子裝置
110,310:外殼
111,311:容置部
112:卡合部
120:觸控顯示模組
121:薄膜電晶體基板
121a:延伸部
122:彩色濾光片基板
123:觸控電極層
124a,124b:偏光片
125:遮光層
130,230,330:背光模組
131,231:光學組件
131a1,131a2:增光膜
131b:擴散膜
131c:反射片
132,232:背光組件
132a:導光板
132b,232b:光源
140,340a,340b:壓敏膠層
231b:光學膜片
S101~S106:步驟
100,200,300: electronic devices
110,310: shell
111,311:Accommodating part
112: engaging part
120:Touch display module
121: Thin
為讓本揭露之上述和其他目的、特徵、優點與實施例能更明顯易懂，所附圖式之說明如下： 第1圖為繪示根據本揭露一實施方式之電子裝置的示意圖。 第2圖為繪示根據本揭露一實施方式之電子裝置之製造方法的流程圖。 第3圖為繪示第1圖中之電子裝置的一製造階段的示意圖。 第4圖為繪示根據本揭露一實施方式之觸控顯示模組的部分元件的示意圖。 第5圖為繪示根據本揭露另一實施方式之觸控顯示模組的部分元件的示意圖。 第6圖為繪示第1圖中之電子裝置的一製造階段的示意圖。 第7圖為繪示第1圖中之電子裝置的一製造階段的示意圖。 第8圖為繪示第1圖中之電子裝置的一製造階段的示意圖。 第9圖為繪示根據本揭露另一實施方式之電子裝置的示意圖。 第10圖為繪示根據本揭露另一實施方式之電子裝置的示意圖。 第11圖為繪示第10圖中之電子裝置的一製造階段的示意圖。 In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more comprehensible, the accompanying drawings are described as follows: FIG. 1 is a schematic diagram illustrating an electronic device according to an embodiment of the present disclosure. FIG. 2 is a flowchart illustrating a manufacturing method of an electronic device according to an embodiment of the present disclosure. FIG. 3 is a schematic diagram illustrating a manufacturing stage of the electronic device in FIG. 1 . FIG. 4 is a schematic diagram illustrating some components of a touch display module according to an embodiment of the present disclosure. FIG. 5 is a schematic diagram illustrating some components of a touch display module according to another embodiment of the present disclosure. FIG. 6 is a schematic diagram illustrating a manufacturing stage of the electronic device in FIG. 1 . FIG. 7 is a schematic diagram illustrating a manufacturing stage of the electronic device in FIG. 1 . FIG. 8 is a schematic diagram illustrating a manufacturing stage of the electronic device in FIG. 1 . FIG. 9 is a schematic diagram illustrating an electronic device according to another embodiment of the present disclosure. FIG. 10 is a schematic diagram illustrating an electronic device according to another embodiment of the present disclosure. FIG. 11 is a schematic diagram illustrating a manufacturing stage of the electronic device in FIG. 10 .
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none
100:電子裝置
110:外殼
111:容置部
112:卡合部
120:觸控顯示模組
121:薄膜電晶體基板
121a:延伸部
122:彩色濾光片基板
124a,124b:偏光片
130:背光模組
131:光學組件
131a1,131a2:增光膜
131b:擴散膜
131c:反射片
132:背光組件
132a:導光板
132b:光源
140:壓敏膠層
100: Electronic device
110: shell
111:Accommodating part
112: engaging part
120:Touch display module
121: Thin
Claims (17)
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201545016A (en) * | 2014-05-30 | 2015-12-01 | Tpk Touch Solutions Xiamen Inc | Touching display device and production method thereof |
| TWM532598U (en) * | 2016-07-05 | 2016-11-21 | 速博思股份有限公司 | In-cell touch display with transparent mesh-like touch electrodes |
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2021
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201545016A (en) * | 2014-05-30 | 2015-12-01 | Tpk Touch Solutions Xiamen Inc | Touching display device and production method thereof |
| TWM532598U (en) * | 2016-07-05 | 2016-11-21 | 速博思股份有限公司 | In-cell touch display with transparent mesh-like touch electrodes |
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