TWI798612B - Data signal transmission connector and manufacturing method for socket assembly of data signal transmission connector - Google Patents
Data signal transmission connector and manufacturing method for socket assembly of data signal transmission connector Download PDFInfo
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- TWI798612B TWI798612B TW109146165A TW109146165A TWI798612B TW I798612 B TWI798612 B TW I798612B TW 109146165 A TW109146165 A TW 109146165A TW 109146165 A TW109146165 A TW 109146165A TW I798612 B TWI798612 B TW I798612B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/82—Coupling devices connected with low or zero insertion force
- H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
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- Manufacturing Of Electrical Connectors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
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Abstract
本發明提供一種不發生信號的衰減和障礙,在信號傳送時不發生信號干擾而適合於高速信號傳送的結構的信號傳送連接器及信號傳送連接器用插座元件的製造方法。本發明的信號傳送連接器,作為將形成有第一電極的第一電子部件與形成有第二電極的第二電子部件電性連接的信號傳送連接器,包括:基架,其由金屬形成,與所述第一電子部件結合並具有多個基架孔;連接插座,其包括分別向所述多個基架孔***的多個信號傳送部,並且,所述信號傳送部包括在彈性絕緣物質內包括多個導電粒子的導電部和由彈性絕緣物質形成並將所述導電部從所述基架分隔地支撐的絕緣部;及蓋座,其與所述基架結合,將置於所述基架上的所述第二電子部件向所述連接插座側加壓,而使得所述導電部的下端與所述第一電極緊貼,所述第二電極與所述導電部的上端緊貼。The present invention provides a signal transmission connector and a method of manufacturing a signal transmission connector receptacle component with a structure suitable for high-speed signal transmission without signal attenuation or disturbance and without signal interference during signal transmission. The signal transmission connector of the present invention, as a signal transmission connector for electrically connecting a first electronic component formed with a first electrode and a second electronic component formed with a second electrode, includes: a base frame formed of metal, It is combined with the first electronic component and has a plurality of pedestal holes; a connection socket, which includes a plurality of signal transmission parts respectively inserted into the plurality of pedestal holes, and the signal transmission part is included in an elastic insulating material A conductive part including a plurality of conductive particles and an insulating part formed of an elastic insulating substance and supporting the conductive part separately from the base frame; and a cover, which is combined with the base frame, will be placed on the The second electronic component on the base frame pressurizes the connection socket side, so that the lower end of the conductive part is in close contact with the first electrode, and the second electrode is in close contact with the upper end of the conductive part. .
Description
本發明係有關於信號傳送連接器,更詳細地,係有關於一種能夠將第一電子部件與第二電子部件能夠以高速傳送信號地進行連接的信號傳送連接器及信號傳送連接器用插座元件的製造方法。The present invention relates to a signal transmission connector, and more specifically, to a signal transmission connector capable of connecting a first electronic component and a second electronic component so that signals can be transmitted at high speed, and a socket element for the signal transmission connector. Manufacturing method.
最近,隨著無人駕駛汽車、大資料、雲盤等四次工業革命技術的正規化,開始進行了 5G常用化服務,由此,需要高速信號傳送用連接器。Recently, with the regularization of technologies of the four industrial revolutions such as self-driving cars, big data, and cloud disks, 5G services have been widely used, and connectors for high-speed signal transmission are required.
信號傳送連接器是用於收發電線、電纜等連接的必需用品,不能發生信號的衰減和障礙,並且,在信號傳送時不能有信號干擾。Signal transmission connectors are necessary supplies for the connection of sending and receiving wires, cables, etc., and signal attenuation and obstacles cannot occur, and there must be no signal interference during signal transmission.
目前用於智慧手機等的信號傳送連接器較多使用BTB型的連接器。BTB型的連接器是將信號傳送用銷以U形狀彎曲而將母部件與公部件結合的結構。最近,BTB型的連接器為了傳送1~2GHz左右的信號而在信號傳送用銷的外廓用金屬進行遮罩處理,並在信號傳送用銷之間形成接地線,而減少信號損失或干擾。At present, signal transmission connectors used in smartphones and the like mostly use BTB-type connectors. The BTB-type connector is a structure in which a signal transmission pin is bent in a U shape to connect a female part and a male part. Recently, in order to transmit signals of about 1 to 2 GHz, BTB-type connectors use a metal shielding treatment on the outer shell of the signal transmission pins, and form a ground line between the signal transmission pins to reduce signal loss or interference.
但,在傳送如5G通信等頻率達到3.5~60GHz的超高速信號時,以往BTB型的連接器存在難以表現收發信號所需的特性的問題。However, when transmitting ultra-high-speed signals with a frequency of 3.5 to 60 GHz, such as 5G communications, conventional BTB-type connectors have the problem of being difficult to express the characteristics required for sending and receiving signals.
即,以往的BTB型的連接器在信號傳送用銷的以U字形狀彎曲的部分無法避免信號損失和障礙。並且,以往的BTB型的連接器的以U字形狀彎曲的信號傳送用銷的長度相對較長,因此,其結構上無法避免信號損失。並且,以往的BTB型的連接器是母部件和公部件結合的結構,因此,其結構上根據母部件和公部件接觸的部分的位置必然發生信號傳送的差異。That is, in the conventional BTB-type connector, signal loss and failure cannot be avoided at the U-shaped portion of the signal transmission pin. Furthermore, in the conventional BTB-type connector, the length of the signal transmission pin bent in a U-shape is relatively long, so signal loss cannot be avoided structurally. Furthermore, the conventional BTB-type connector has a structure in which a female part and a male part are combined, and therefore, structurally, a difference in signal transmission inevitably occurs depending on the position of the contact part of the female part and the male part.
[先行技術文獻][Prior Art Literature]
[專利文獻][Patent Document]
公開專利公報第2018-0037955號(2018.04.13)Patent Publication No. 2018-0037955 (2018.04.13)
解決課題:Solve the problem:
本發明考慮到上述的問題而提供,其目的為提供一種能夠防止信號的衰減和障礙,並且,在傳送信號時不發生信號干擾,因此,對於高速信號傳送有利的結構的信號傳送連接器及信號傳送連接器用插座元件的製造方法。The present invention is provided in consideration of the above-mentioned problems, and its purpose is to provide a signal transmission connector and a signal transmission connector and a signal transmission connector with an advantageous structure for high-speed signal transmission, which can prevent signal attenuation and obstacles, and do not cause signal interference when transmitting signals. A method of manufacturing a receptacle component for a transmission connector.
本發明的技術方案在於:Technical scheme of the present invention is:
為了實現上述目的,本發明的信號傳送連接器作為將形成有第一電極的第一電子部件與形成有第二電極的第二電子部件電性連接的信號傳送連接器,包括:基架,其由金屬形成,與所述第一電子部件結合並具有多個基架孔;連接插座,其包括分別向所述多個基架孔***的多個信號傳送部,並且,所述信號傳送部包括在彈性絕緣物質內包括多個導電粒子的導電部和由彈性絕緣物質形成並將所述導電部從所述基架分隔地支撐的絕緣部;及蓋座,其與所述基架結合,將置於所述基架上的所述第二電子部件向所述連接插座側加壓,而使得所述導電部的下端與所述第一電極緊貼,所述第二電極與所述導電部的上端緊貼。In order to achieve the above object, the signal transmission connector of the present invention, as a signal transmission connector for electrically connecting the first electronic component formed with the first electrode and the second electronic component formed with the second electrode, includes: a base frame, which Formed from metal, combined with the first electronic component and having a plurality of pedestal holes; a connection socket, which includes a plurality of signal transmission parts respectively inserted into the plurality of pedestal holes, and the signal transmission part includes A conductive part including a plurality of conductive particles in an elastic insulating substance and an insulating part formed of an elastic insulating substance and supporting the conductive part separately from the base frame; and a cover seat combined with the base frame to place The second electronic component placed on the base frame pressurizes the connection socket side, so that the lower end of the conductive part is in close contact with the first electrode, and the second electrode is in contact with the conductive part. The upper end is attached closely.
所述基架由選自鈹銅(BeCu)、磷青銅、黃銅、不銹鋼中的金屬形成。The base frame is formed of a metal selected from beryllium copper (BeCu), phosphor bronze, brass, and stainless steel.
本發明的信號傳送連接器, 包括:在所述基架的至少一面層積的電鍍層。The signal transmission connector of the present invention includes: an electroplating layer laminated on at least one side of the base frame.
所述導電部的上端及下端中的至少一個從所述基架孔突出。At least one of the upper end and the lower end of the conductive part protrudes from the base frame hole.
本發明的信號傳送連接器, 包括:絕緣薄膜,其與所述基架的上面結合,形成有在與所述多個信號傳送部對應的位置形成的多個絕緣薄膜孔,並且,將所述第二電子部件從所述基架的上面分隔地支撐。The signal transmission connector of the present invention includes: an insulating film, which is combined with the upper surface of the base frame, and a plurality of insulating film holes formed at positions corresponding to the plurality of signal transmission parts are formed, and the The second electronic component is separately supported from above the base frame.
所述基架包括:清洗孔,其由厚度方向貫通所述基架而形成,用於排出位於所述基架與所述第一電子部件之間的異物。The base frame includes: a cleaning hole, which is formed through the base frame in a thickness direction, and is used for discharging foreign matters located between the base frame and the first electronic component.
本發明的信號傳送連接器, 包括:連接基板,其在所述基架的下面結合而能夠焊接在所述第一電子部件,並且,形成有與所述導電部的下端相接而將所述導電部與所述第一電極電性連接的多個連接基板電極。The signal transmission connector of the present invention includes: a connection substrate, which is combined under the base frame and can be soldered to the first electronic component, and is formed with a bottom end connected to the conductive part to connect the The conductive part is a plurality of connecting substrate electrodes electrically connected to the first electrodes.
所述連接基板由軟性電路基板形成。The connection substrate is formed of a flexible circuit substrate.
在所述基架的兩側形成有用於固定所述蓋座的固定部,在所述蓋座的兩側形成有能夠與所述固定部嚙合的結合凸起。Fixing parts for fixing the cover are formed on both sides of the base frame, and coupling protrusions capable of engaging with the fixing parts are formed on both sides of the cover.
所述基架包括:基架底部,其形成有所述多個基架孔;一對基架側壁部,其對於所述基架底部豎立地配置在所述基架底部的兩側而相對,所述固定部分別配置在所述一對基架側壁部。The pedestal includes: a pedestal bottom formed with the plurality of pedestal holes; a pair of pedestal sidewalls facing the pedestal bottom vertically arranged on both sides of the pedestal bottom, The fixing parts are respectively disposed on the pair of base frame side wall parts.
所述固定部包括:結合槽,其形成於所述基架側壁部,用於***所述結合凸起。The fixing part includes: a coupling groove formed on the side wall of the base frame for inserting the coupling protrusion.
所述固定部包括:掛接凸起,其從所述基架側壁部向所述基架的內側突出,並且,所述蓋座的上面相比所述基架側壁部的上端更低,而將所述第二電子部件向所述連接插座側加壓。The fixing part includes: a hooking protrusion protruding from the side wall part of the base frame to the inside of the base frame, and the top of the cover is lower than the upper end of the side wall part of the base frame, and The second electronic component is pressurized toward the connection socket side.
所述蓋座包括:蓋座主體,其將置於所述連接插座上的所述第二電子部件向所述連接插座側加壓;一對連接部,其分別從所述蓋座主體的兩側向下側方向延伸,所述結合凸起分別形成於所述一對連接部。The cover includes: a cover main body, which presses the second electronic component placed on the connection socket to the side of the connection socket; The sides extend in a downward direction, and the coupling protrusions are respectively formed on the pair of connection parts.
所述蓋座包括:蓋座主體,其將置於所述連接插座上的所述第二電子部件向所述連接插座側加壓;位置決定部,其與所述第二電子部件嚙合,而能夠將所述第二電子部件整列在所述蓋座主體上的既定的位置。The cover includes: a cover main body that presses the second electronic component placed on the connection socket toward the connection socket side; a position determining portion that engages with the second electronic component, and The second electronic component can be aligned at a predetermined position on the cover main body.
並且,為了實現上述目的,本發明的信號傳送連接器用插座元件的製造方法,作為將具有第一電極的第一電子部件和具有第二電極的第二電子部件電性連接的信號傳送連接器用插座元件的製造方法, 包括如下步驟:(a)準備形成有多個基架孔的金屬的基架的步驟;(b) 在所述多個基架孔分別設置導電部和信號傳送部的步驟,該導電部為了兩端部分別與所述第二電極及所述第一電極電性連接而在彈性絕緣物質內包括多個導電粒子,該信號傳送部形成有由彈性絕緣物質形成並將所述導電部從所述基架分隔地支撐的絕緣部;及(c)將所述基架的兩側邊緣彎曲,而將所述基架成型為包括形成有所述多個基架孔的基架底部和對於所述基架底部豎立地配置在所述基架底部的兩側而相對的一對基架側壁部的形狀的步驟。And, in order to achieve the above object, the method of manufacturing a socket component for a signal transmission connector of the present invention is a socket for a signal transmission connector that electrically connects a first electronic component having a first electrode and a second electronic component having a second electrode. The manufacturing method of the element includes the following steps: (a) the step of preparing a metal pedestal formed with a plurality of pedestal holes; (b) the step of respectively arranging a conductive part and a signal transmission part in the plurality of pedestal holes, The conductive part includes a plurality of conductive particles in the elastic insulating material so that both ends thereof are electrically connected to the second electrode and the first electrode, and the signal transmission part is formed of the elastic insulating material and the an insulating portion separately supported by the conductive portion from the base frame; and (c) bending both side edges of the base frame to form the base frame to include a base frame formed with the plurality of base frame holes The shape of the bottom and a pair of base frame side wall parts which are vertically arranged on both sides of the base bottom with respect to the base frame bottom and face each other.
本發明的信號傳送連接器用插座元件的製造方法,所述(a)步驟之後包括如下步驟:(d)將形成有與所述第一電極電性連接的多個連接基板電極的連接基板配置在所述基架的下面,而使得所述多個連接基板電極分別與所述多個基架孔匹配。The method of manufacturing a socket component for a signal transmission connector according to the present invention includes the following step after the step (a): (d) arranging a connection substrate on which a plurality of connection substrate electrodes electrically connected to the first electrodes are formed on The lower surface of the pedestal, so that the plurality of connection substrate electrodes are respectively matched with the plurality of pedestal holes.
以下,參照附圖詳細說明本發明的信號傳送連接器及信號傳送連接器用插座元件的製造方法。Hereinafter, the method of manufacturing the signal transmission connector and the socket component for the signal transmission connector of the present invention will be described in detail with reference to the drawings.
圖1及圖2為表示本發明的一實施例的信號傳送連接器的立體圖;圖3為表示本發明的一實施例的信號傳送連接器的截面圖;圖4及圖5為分離表示本發明的一實施例的信號傳送連接器用插座元件和蓋座的附圖;1 and 2 are perspective views showing a signal transmission connector according to an embodiment of the present invention; FIG. 3 is a cross-sectional view showing a signal transmission connector according to an embodiment of the present invention; FIG. 4 and FIG. 5 are separate representations of the present invention A drawing of a socket element and a cover for a signal transmission connector according to an embodiment of the present invention;
如圖所示,本發明的一實施例的信號傳送連接器100是用於將第一電子部件10與第二電子部件20電性地連接,包括:插座元件110,其安裝在第一電子部件10而與第一電子部件10電性連接;蓋座140,其與第二電子部件20結合,而將第二電子部件20固定在插座元件110。在此,第一電子部件10為具有能夠傳送電信號的第一電極11的各種結構的電子部件。並且,第二電子部件20為具有能夠傳送電信號的第二電極21的各種結構的電子部件。例如,第一電子部件10可為安裝在智慧手機或筆記型電腦的PCB,第二電子部件20為軟性電路基板(FPCB)或天線、電纜等。As shown in the figure, the
插座元件110包括:基架112,其與第一電子部件10結合;連接插座120及連接基板125,其用於將第一電子部件10的第一電極11與第二電子部件20的第二電極21電性連接。The
基架112包括:基架底部113,其在第一電子部件10的上面與第一電子部件10的上面平行地放置;基架壁部114和一對基架側壁部115,其在基架底部113的邊緣對於基架底部113豎立地形成。如圖所示,在四角形基架112的四個邊緣中的一個邊緣未形成有基架壁部114或基架側壁部115。基架壁部114形成於基架底部113的四個邊緣中的一個邊緣。一對基架側壁部115在基架底部113的四個邊緣中的兩個邊緣相對地配置。The
在基架底部113的上側形成有被基架壁部114和一對基架側壁部115圍繞的空間,在該空間可容納蓋座140及第二電子部件20。在未形成有基架壁部114或基架側壁部115的基架底部113的一側邊緣可安置第二電子部件20,從而,能夠防止將第二電子部件20安置在基架112時發生彎曲。並且,此類結構有利於減少信號傳送連接器100的安裝厚度。A space surrounded by a
如圖所示,較佳地,被基架壁部114和一對基架側壁部115圍繞的部分的形狀形成與蓋座140的蓋座主體141形狀對應的形狀。此時,蓋座140可與基架112上的固定位置結合,因此,有利於將與蓋座140結合的第二電子部件20的第二電極21與形成於基架112的導電部122匹配。As shown in the figure, preferably, the shape of the portion surrounded by the base
在基架底部113形成有向厚度方向貫通基架底部113的多個基架孔116。多個基架孔116根據在第一電子部件10形成的第一電極11的配置形狀或在第二電子部件20形成的第二電極21的配置形狀等形成不同的個數和各種形狀。較佳地,為了信號傳送部121的特性阻抗匹配,基架底部113具有+/-10um以下的厚度公差。A plurality of
在基架112的兩側分別形成有用於固定蓋座140的固定部117。固定部117包括在基架側壁部115形成的結合槽118。在蓋座140的兩側形成的結合凸起142向結合槽118***而能夠將蓋座140固定在基架112上。
Fixing
基架112由具有彈性的金屬形成。從而,將蓋座140與基架112結合時,基架側壁部115彈性變形而使得蓋座140順利地與基架112結合。並且,金屬的基架112可作為阻斷連接插座120周邊的其他空中波或障礙信號的遮蔽部而作用,因此,有利於提高連接插座120的信號傳送效率。並且,金屬的基架112是通電的,因此,可作為接地部。
The
較佳地,基架112由金屬中鈹銅(BeCu)、磷青銅、黃銅等銅合金、不銹鋼等非磁性或弱磁性特性的金屬形成。由具有非磁性或弱磁性特性的金屬形成的基架112,在基架孔116內形成信號傳送部121的過程中將形成導電部122的導電粒子向基架112的厚度方向均勻地整列時起到有利作用。在基架孔116內形成信號傳送部121的過程將在下面進行說明。
Preferably, the
基架112除了圖示的結構之外還可變更為能夠支撐連接插座120並結合蓋座140的各種不同的其他結構。
In addition to the illustrated structure, the
連接插座120包括分別向多個基架孔116***的多個信號傳送部121。信號傳送部121包括:在彈性絕緣物質內包括多個導電粒子的導電部122;由彈性絕緣物質形成而將導電部122絕緣地支撐的絕緣部123。絕緣部123與基架112相接地配置在基架孔116內,而將導電部122從基架112分隔。
The
導電部122的上端從基架112的上面突出,而能夠順利地與在基架112上安置的第二電子部件20的第二電極21接觸。構成導電部122的彈性絕緣物質可利用橋樑結構的耐熱性的高分子物質,例如,矽膠、有規立構橡膠、天然橡膠、聚異戊二烯橡膠、丁苯共聚物橡膠、丙烯腈共聚物橡膠、丁苯二烯嵌段共聚物橡膠、苯乙烯嵌段共聚物橡膠、聚氨酯橡膠、聚酯橡膠、表氯醇橡膠、乙丙共聚物橡膠、三元乙丙共聚物橡膠、軟質液狀環氧基橡膠等。The upper end of the
並且,構成導電部122的導電粒子可利用通過磁場發生反應的磁性的物質。例如,作為導電粒子可利用鐵、鎳、鈷等具有磁性的金屬粒子,或其合金粒子,或含有該金屬的粒子,或將該粒子作為核心粒子並在其核心粒子的表面塗覆金、銀、鈀、鐳等導電性良好的金屬的,或非磁性金屬粒子、玻璃微珠等無機物質粒子、聚合物粒子作為核心粒子並並在該核心粒子的表面塗覆鎳及鈷等導電性磁體的,或在核心粒子上塗覆導電性磁體及導電性良好的金屬的物質等。In addition, the conductive particles constituting the
絕緣部123由與導電部122的彈性絕緣物質相同的彈性絕緣物質形成。The insulating
信號傳送部121配置在基架孔116內而被金屬的基架112圍繞,因此,可形成有利於高速信號傳送的同軸電纜結構。即,如圖8所示,絕緣部123 包裹導電部122,金屬的基架112包裹絕緣部123,從而,在通過信號傳送部121傳送信號時,能夠阻斷障礙信號並最小化信號傳送的損失。The
如圖8所示,為了高速信號傳送的特性阻抗匹配,信號傳送部121的從基架112至導電部122的邊緣的距離d要均勻。本發明的一實施例的信號傳送連接器100形成在金屬的基架112形成基架孔116,在基架孔116內形成導電部122的結構。因此,有利於使從基架112至導電部122的邊緣的距離d均勻,並且,容易匹配信號傳送部121的特性阻抗。As shown in FIG. 8 , for characteristic impedance matching of high-speed signal transmission, the distance d of the
連接基板125在基架112的下面結合。連接基板125包括:與導電部122的下端相接的多個連接基板電極126;將多個連接基板電極126相互分隔地支撐的連接基板絕緣部127。連接基板電極126的上端與導電部122的下端相接,下端與第一電極11相接,從而,能夠將導電部122與第一電極11電性連接。連接基板125可通過形成連接插座120的絕緣部123被固定在基架112,或通過粘接方式或其他各種方式被固定在基架112上。The
如圖6所示,連接基板125在第一電子部件10的上面焊接。連接基板125通過焊料(S)被焊接在第一電子部件10的上面,從而,能夠將插座元件110堅固地固定在第一電子部件10上。As shown in FIG. 6 , the
通過將連接基板125與連接插座120電性連接地配置,而能夠將連接基板125作為用於連接插座120與第一電子部件10的焊接的介質。由此,能夠順利地進行使用SMT等焊接方式的連接插座120的粘接。By arranging the
連接基板125可形成軟性電路基板(FPCB)形狀,或將連接插座120的導電部122與第一電子部件10的第一電極11電性連接的各種形狀。The
蓋座140與基架112結合,起到將置於基架112上的第二電子部件20向連接插座120側加壓的作用。蓋座140包括:與第二電子部件20的上面相接而能夠加壓第二電子部件20的蓋座主體141;從蓋座主體141的兩側向外側突出的一對結合凸起142;用於與第二電子部件20的結合的位置決定部144。結合凸起142向112的結合槽118***。蓋座140以與第二電子部件20結合的狀態組裝於插座元件110。The
蓋座140可通過粘接方式等各種方式與第二電子部件20結合。在蓋座140與第二電子部件20結合時,使得第二電子部件20的結合部22與蓋座140的位置決定部144嚙合,而能夠將第二電子部件20整列在蓋座主體141上的既定位置。如圖所示,位置決定部144形成從蓋座主體141的下面突出的凸起形狀,而能夠向形成於第二電子部件20的凹槽形狀的結合部22***。如上述地,利用位置決定部144將第二電子部件20以既定的姿勢結合于蓋座140上的既定的位置,從而,將蓋座140與基架112結合時,第二電子部件20的第二端子21與連接插座130的導電部122精密地匹配。The
位置決定部144除了圖示的凸起形狀之外,還可變更為與第二電子部件20嚙合的各種不同的結構。The
第二電子部件20也可未與蓋座140結合而只是與蓋座140相接地配置。The second
如圖6及圖7所示,將插座元件110焊接在第一電子部件10後,通過將結合有第二電子部件20的蓋座140對著基架112上按壓的簡單方式固定在基架112。將蓋座140對著基架112上按壓時,一對結合凸起142向分別在一對基架側壁部115形成的結合槽118內***,而使得蓋座140被固定在基架112。為了使結合凸起142推動基架側壁部115的同時容易地向結合槽118內進入,如圖所示,結合凸起142可形成錐子形狀。As shown in FIG. 6 and FIG. 7, after the
如上述地,本發明的一實施例的信號傳送連接器100,形成有在彈性絕緣物質內具有多個導電粒子的導電部122及支撐導電部122的絕緣部123的連接插座120與金屬的基架112結合,並且,連接插座120以連接基板125為介質被焊接在第一電子部件10。並且,蓋座140被固定在基架112而將置於連接插座120上的第二電子部件20向連接插座120側加壓。從而,通過連接插座120的導電部122將第一電子部件10與第二電子部件20電性連接,並且,不發生信號的衰減和障礙,不發生信號干擾,而能夠傳送高速信號。As mentioned above, the
並且,本發明的一實施例的信號傳送連接器100的蓋座140位於相比基架112的上端更低的位置而加壓第二電子部件20,因此,安裝厚度較薄,且能夠緊湊地安裝。In addition, the
以下,說明製造本發明的一實施例的信號傳送連接器100的插座元件110的方法。Hereinafter, a method of manufacturing the
圖9簡略表示製造插座元件110的過程。FIG. 9 schematically shows the process of manufacturing the
首先,如圖9的(a)所示,準備形成有多個基架孔116及一對結合槽118的金屬的基架112。多個基架孔116在基架112的中央部分形成,一對結合槽118可傾向基架112的兩側邊緣側地設置。該步驟中,基架112由鈹銅(BeCu)、磷青銅、黃銅等銅合金或不銹鋼等具有非磁性或弱磁性特性的金屬以+/-10um以下的厚度公差製造。First, as shown in FIG. 9( a ), a
然後,如圖9的b所示,形成包括分別向多個基架孔116***的多個信號傳送部121的連接插座120。如上述說明,信號傳送部121包括:在彈性絕緣物質內具有多個導電粒子的導電部122和由彈性絕緣物質形成且將導電部122從基架112分隔地支撐的絕緣部123。Then, as shown in b of FIG. 9 , the
在形成信號傳送部121的步驟中可適用公知的各種方法。Various known methods can be applied to the step of forming the
例如,可適用如下方法:將在遊動性的彈性絕緣物質內含有導電粒子的導電粒子混合物向基架孔116內填充,並嚮導電性混合物供應磁場而形成導電部122後將彈性絕緣物質固型化的方法。For example, the method of filling the
此時,基架112由具有非磁性或弱磁性特性的金屬形成,因此,利用磁鐵向填充于基架孔116內的導電粒子混合物供應磁場的過程中,嚮導電粒子混合物提供的磁場幾乎不受基架112的影響。如果基架由強磁性金屬形成,基架對於嚮導電粒子混合物提供的磁場方向產生較大影響。因此,嚮導電粒子混合物提供磁場的過程中,導電粒子被牽引至強磁性金屬的基架側等,而導致不易進行在導電粒子混合物中含有的導電粒子的整列。相反地,本發明基架112對於嚮導電粒子混合物提供的磁場幾乎不產生影響。從而,在提供磁場時導電粒子穩定地聚集在基架孔116的中央部分,並且,能夠將導電粒子由基架112的厚度方向均勻地整列。At this time, the
並且,在形成信號傳送部121的過程中,可採用向基架孔116內填充具有遊動性的彈性絕緣物質並固型化,由此,首先形成絕緣部123,並在絕緣部123穿孔後在絕緣部123內形成導電部122的方法。此時,可在絕緣部123的孔填充漿料形狀的導電粒子混合物並將其固型化,而形成導電部122。In addition, in the process of forming the
此外,利用磁鐵向填充於絕緣部123的內側的導電粒子混合物供應磁場而能夠將導電粒子由基架112的厚度方向整列。在上述過程中,由非磁性或弱磁性特性的金屬形成的基架112對於嚮導電粒子混合物提供的磁場幾乎不產生影響,因此,能夠將導電粒子在絕緣部123內側均勻地整列,從而,能夠形成具有良好的信號傳送特性的導電部122。In addition, the conductive particles can be aligned in the thickness direction of the
然後,如圖9的(c)所示,將基架112的兩側邊緣彎曲而形成具有結合槽118的一對基架側壁部115。如上述地彎曲基架112,而將基架112以包括形成有多個基架孔116的基架底部113和對於基架底部113豎立而相對的一對基架側壁部115的形狀成型。Then, as shown in FIG. 9( c), the side edges of the
雖未圖示,將基架112彎曲成型後,將形成有多個連接基板電極126的連接基板125與基架112的下面結合。Although not shown in the figure, after the
並且,圖10至圖17表示本發明的信號傳送連接器的各種變形例。10 to 17 show various modifications of the signal transmission connector of the present invention.
首先,在圖10及圖11所示的信號傳送連接器200用於將第一電子部件10與第二電子部件20電性連接,包括:安裝在第一電子部件10而與第一電子部件10電性連接的插座元件210;與第二電子部件20結合而將第二電子部件20固定在插座元件210的蓋座140。插座元件210包括基架112和連接插座120。First, the
上述的信號傳送連接器200相比上面說明的信號傳送連接器100省卻了連接基板125,基架112和連接插座120及蓋座140與上述的相同。如圖所示,連接插座120的導電部122的上端從基架底部113的上面向上側突出,其下端從基架底部113的下面向下側突出。Compared with the
插座元件210的基架112可通過SMT等焊接方式被焊接在第一電子部件10而固定在第一電子部件10。The
如圖11所示,基架112通過焊料S被固定在第一電子部件10,從而,能夠維持連接插座120的導電部122下端與第一電子部件10的第一電極11接觸的狀態。在該狀態下,結合有第二電子部件20的蓋座140與基架112結合時,第二電子部件20的第二電極21與導電部122的上端相接,由此,能夠將第一電極11與第二電極21通過導電部122電性連接。As shown in FIG. 11 , the
上述的信號傳送連接器200,包括在彈性絕緣物質內含有多個導電粒子的導電部122及支撐導電部122的絕緣部123的連接插座120與基架112結合,並且,蓋座140固定在基架112,而將置於連接插座120上的第二電子部件20向連接插座120側加壓。從而,導電部122與第一電子部件10的第一電極11及第二電子部件20的第二電極22接觸,而在第一電子部件10與第二電子部件20之間無信號干擾地傳送高速信號。The above-mentioned
並且,如圖12及圖13所示的信號傳送連接器300是用於將第一電子部件10與第二電子部件20電性連接,包括:安裝在第一電子部件10而與第一電子部件10電性連接的插座元件310;與第二電子部件20結合而將第二電子部件20固定在插座元件310的蓋座140。插座元件310包括基架312和連接插座120。Moreover, the
上述的信號傳送連接器300與上面說明的信號傳送連接器200比較,基架312的結構發生了變形。
In the
基架312在基架底部113的一側包括由厚度方向貫通基架底部113的清洗孔313。清洗孔313用於排出位於基架底部113與第一電子部件10之間的異物。
The
如圖13所示,為了將基架312焊接在第一電子部件10,在第一電子部件10的上面可放置釺劑F。釺劑(F)具有遊動性,因此,能夠向第一電極11與導電部122之間浸透。此時,在第一電極11與導電部122之間阻抗增大,而第一電極11與導電部122之間的電性連接受到壞影響。因此,較佳地,去除第一電子部件10與基架312之間的釺劑(F)。
As shown in FIG. 13 , in order to solder the
如果在在第一電子部件10與基架312之間存在釺劑(F)等異物時,可利用能夠吸收異物的工具(T),通過基架312的清洗孔313將釺劑F等異物從第一電子部件10與基架312之間排出。
If there is foreign matter such as agarose (F) between the first
清洗孔313的個數或形成位置可不同地變更。 The number and formation positions of the cleaning holes 313 can be changed variously.
並且,圖14所示的信號傳送連接器400與圖10所示的信號傳送連接器200比較,還包括電鍍層410、420,基架112和連接插座120及蓋座140與上述的相同。
Moreover, the
電鍍層410、420是為了連接插座120的特性阻抗匹配,或為了將基架112焊接在第一電子部件10,可通過金(Au)、鎳(Ni)、錫(Sn)等金屬在基架底部113的至少一面形成。
The electroplating layers 410, 420 are for matching the characteristic impedance of the
基架底部113上面的電鍍層410是為了連接插座120的特性阻抗匹配而形成。用於特性阻抗匹配的電鍍層410可由金Au或導電性優秀的金屬形成。
The
基架底部113下面的電鍍層420是為了基架112的焊接而形成。用於焊接的電鍍層420可由鎳Ni或錫Sn等適合焊接的金屬形成。
The
在附圖中表示了在基架底部113的上下面都形成了電鍍層410、420,但,電鍍層可只形成於基架底部113的一面。
The drawings show that the electroplating layers 410 and 420 are formed on both the upper and lower sides of the
圖15所示的信號傳送連接器500包括:與第一電子部件10電性連接的插座元件510;與第二電子部件20結合而將第二電子部件20固定在插座元件510的蓋座520。插座元件510包括基架512、連接插座120、絕緣薄膜530。連接插座120包括多個信號傳送部121,其詳細構成如上述的相同。
The
基架512包括具有多個基架孔515的基架底部513;在基架底部513的邊緣相對地配置的一對基架側壁部514。在基架側壁部514形成有用於固定蓋座520的固定部516。固定部516包括從基架側壁部514向基架512的內側突出的掛接凸起517。如圖所示,掛接凸起517可形成上側部分傾斜的形狀。
The
蓋座520包括蓋座主體521;從蓋座主體521的兩側向外側突出的一對結合凸起522。蓋座520以使得結合凸起522掛接在基架512的掛接凸起517的方式,以將第二電子部件20向基架512側加壓的狀態固定在基架512。蓋座520被固定在基架512時蓋座主體521的上面低於固定部516的末端,而能夠將第二電子部件20向基架112側加壓。The
絕緣薄膜530與基架512的上面結合而將第二電子部件20從基架512的上面分隔地支撐。絕緣薄膜530形成有與多個導電部122對應的位置形成的多個絕緣薄膜孔531。通過絕緣薄膜孔531將導電部122與第二電子部件20的第二電極21接通。絕緣薄膜530由絕緣性材料形成。絕緣薄膜530可通過粘接方式等各種方式與基架512結合。The insulating
本實施例的信號傳送連接器500的蓋座520位置低於基架512的上端而能夠加壓第二電子部件20,因此,安裝厚度較薄,並能夠緊湊地安裝。The position of the
圖16所示的信號傳送連接器600包括:與第一電子部件10電性連接的插座元件610;與第二電子部件20結合而將第二電子部件20固定在插座元件110的蓋座620。插座元件610包括基架612和連接插座120。連接插座120包括多個信號傳送部121,其詳細構成與上述的相同。The
在基架612形成有配置信號傳送部121的多個基架孔614。在基架612的兩側形成有用於固定蓋座620的固定部616。固定部616包括用於掛接蓋座620的掛接凸起617。A plurality of base frame holes 614 in which the
蓋座620包括:蓋座主體621;從蓋座主體621的兩側分別向下側方向延伸的一對連接部622;分別形成於一對連接部622的結合凸起623。結合凸起623從連接部622的末端向蓋座620的內側方向突出,以便被掛接在基架612的掛接凸起617。蓋座620將基架612的一部分包裹並使結合凸起623掛接在掛接凸起617的方式被固定在基架612。The
圖17所示的信號傳送連接器700包括:與第一電子部件10電性連接的插座元件710;與第二電子部件20結合而將第二電子部件20固定在插座元件710的蓋座720。插座元件710包括基架712和連接插座120。連接插座120包括多個信號傳送部121,其詳細構成與上述的相同。The
基架712包括:形成有多個基架孔715的基架底部713;在基架底部713的邊緣相互相對地配置的一對基架側壁部714。在基架側壁部714形成有用於固定蓋座720的固定部716。固定部716包括從基架側壁部714向基架712的內側突出的掛接凸起717。The
蓋座720包括:蓋座主體721;從蓋座主體721的兩側向外側突出的一對結合凸起722。蓋座720通過使結合凸起722被掛接在基架712的掛接凸起717的方式被固定在基架712。The
圖18所示的信號傳送連接器800包括:安裝在第一電子部件10而與第一電子部件10電性連接的插座元件810;與第二電子部件20結合而將第二電子部件20固定在插座元件810的蓋座840。The
插座元件810包括:與第一電子部件10結合的基架812;用於將第一電子部件10的第一電極11與第二電子部件20的第二電極21電性連接的連接插座120。在此,連接插座120包括貫通基架812形成的多個信號傳送部121,其詳細構成與上述的相同。The
基架812包括:在第一電子部件10的上面與第一電子部件10的上面平行地放置的基架底部813;在基架底部813的邊緣對於基架底部813豎立地形成的基架壁部814及一對基架側壁部815。The
在基架底部813的上側形成有通過基架壁部814和一對基架側壁部815圍繞的空間,在該空間可容納蓋座840及第二電子部件20。在未形成有基架壁部814或基架側壁部815的基架底部813的一側邊緣側可安置第二電子部件20,因此,將第二電子部件20安置在基架812上時不發生彎曲變形。A space surrounded by a
在基架底部813形成有由厚度方向貫通基架底部813的多個基架孔816。在基架孔816上配置連接插座120的信號傳送部121。A plurality of base holes 816 penetrating through the
在基架812的兩側分別形成有用於固定蓋座840的固定部817。固定部817包括形成於基架側壁部815的結合槽818。形成于蓋座840的兩側的結合凸起842向結合槽818***,而使蓋座840被固定在基架812。Fixing
蓋座840的作用是與基架812結合而將置於基架812上的第二電子部件20向連接插座820側加壓。蓋座840包括:與第二電子部件20的上面相接而加壓第二電子部件20的蓋座主體841;從蓋座主體841的兩側向外側突出的一對結合凸起842;用於與第二電子部件20結合的位置決定部844。結合凸起842向基架812的結合槽818***。蓋座840以與第二電子部件20結合的狀態在插座元件810 安裝。The function of the
蓋座840可通過粘接方式等各種方式與第二電子部件20結合。在蓋座840與第二電子部件20的結合時,使第二電子部件20的結合部22與蓋座840的位置決定部844嚙合,而能夠將第二電子部件20整列在蓋座主體841上的既定的位置。如圖所示,位置決定部844形成可向形成於第二電子部件20的凹槽形狀的結合部22***的凸起形狀形成。如上述地,利用位置決定部844以既定的姿勢將第二電子部件20結合于蓋座840上的既定的位置,從而,當蓋座840與基架812結合時,能夠將第二電子部件20的第二端子21與連接插座830的導電部822精密地匹配。The
除了圖示的結構之外,位置決定部844可以與形成於第二電子部件20的結合部或第二電子部件20的邊緣嚙合的各種其他結構變更。In addition to the illustrated structure, the
以上以較佳的示例說明了本發明,但,本發明的範圍並非限定於上面說明並圖示的形狀。The present invention has been described above with preferred examples, but the scope of the present invention is not limited to the shapes described and illustrated above.
例如,為了基架與蓋座之間的結合而形成於基架的固定部和形成于蓋座的結合凸起的結構並非限定於圖示,可不同地變更。For example, the structures of the fixing portion formed on the base frame and the coupling protrusion formed on the cover for coupling between the base frame and the cover are not limited to those shown in the drawings, and may be variously changed.
以上以用於示例本發明的原理的較佳實施例說明了本發明,但,本發明並非限定於上面圖示並說明的構成和作用。本發明的技術領域的普通技術人員應當理解在不脫離附加的權利要求書的思想和範圍的前提下,可對於本發明進行各種變更和修改。The present invention has been described above with preferred embodiments for illustrating the principles of the present invention, but the present invention is not limited to the structures and functions illustrated and described above. Those skilled in the technical field of the present invention should understand that various changes and modifications can be made to the present invention without departing from the spirit and scope of the appended claims.
本發明的有益效果在於:The beneficial effects of the present invention are:
本發明的信號傳送連接器,形成有在彈性絕緣物質內包括多個導電粒子的導電部及支撐導電部的絕緣部的連接插座與金屬的基架結合,並且,導電部與第一電子部件的第一電極連接,蓋座被固定在基架而將置於連接插座上的第二電子部件向連接插座側加壓。從而,通過連接插座的導電部將第一電子部件與第二電子部件電性連接,並且,不發生信號的衰減和障礙。In the signal transmission connector of the present invention, a connection socket formed with a conductive part including a plurality of conductive particles in an elastic insulating material and an insulating part supporting the conductive part is combined with a metal base frame, and the conductive part is connected to the first electronic component. The first electrode is connected, and the cover is fixed to the base frame to pressurize the second electronic component placed on the connection socket toward the connection socket side. Therefore, the first electronic component is electrically connected to the second electronic component through the conductive portion of the connection socket, and signal attenuation and obstruction do not occur.
並且,本發明的信號傳送連接器中支撐多個導電部的基架由金屬形成而起到能夠阻斷周邊的其他空中波或障礙信號的遮蔽部的作用,因此,有利於高速信號傳送。Furthermore, the base frame supporting the plurality of conductive parts in the signal transmission connector of the present invention is made of metal and functions as a shielding part capable of blocking other surrounding air waves or obstacle signals, thus facilitating high-speed signal transmission.
並且,本發明的信號傳送連接器,與第一電子部件結合的基架上,結合有第二電子部件的蓋座通過簡單的按壓方式固定在基架。因此,容易組裝,並且,能夠簡單迅速地進行將第一電子部件與第二電子部件電性連接的作業。Furthermore, in the signal transmission connector of the present invention, on the base frame combined with the first electronic component, the cover seat combined with the second electronic component is fixed on the base frame by simple pressing. Therefore, assembly is easy, and the work of electrically connecting the first electronic component and the second electronic component can be performed simply and quickly.
並且,本發明的信號傳送連接器相比以往的BTB型連接器可以較薄的厚度製造,因此,佔據的安裝空間較小。從而,廣泛地適用于智慧手機或平板電腦、手提電腦等厚度較薄、小型的電子設備。Moreover, the signal transmission connector of the present invention can be manufactured with a thinner thickness than the conventional BTB type connector, and therefore occupies less installation space. Therefore, it is widely applicable to thin and small electronic devices such as smart phones, tablet computers, and laptop computers.
20:第二電子部件 100,200,300,400,500,600,700,800:信號傳送連接器 110,210,310,510,610,710,810:插座元件 112,312,512,612,712,812:基架 113,513,713,813:基架底部 115,514,714,815:基架側壁部 117,516,616,716,817:固定部 120:連接插座 121:信號傳送部 122:導電部 123:絕緣部 125:連接基板 126:連接基板電極 140,520,620,720,840:蓋座 141,521,621,721,841:蓋座主體 142,522,623,722,842:結合凸起 313:清洗孔 410,420:電鍍層 530:絕緣薄膜20: Second electronic component 100,200,300,400,500,600,700,800: signal transmission connector 110,210,310,510,610,710,810: socket components 112,312,512,612,712,812: base frame 113,513,713,813: Base frame bottom 115,514,714,815: pedestal side wall 117,516,616,716,817: fixed part 120:Connect socket 121: Signal transmission department 122: Conductive part 123: insulation part 125: Connecting the substrate 126: Connect the substrate electrodes 140,520,620,720,840: cover seat 141,521,621,721,841: Cover body 142,522,623,722,842: combined bumps 313: cleaning hole 410,420: Plating layer 530: insulating film
圖1及圖2為表示本發明的一實施例的信號傳送連接器的立體圖;1 and 2 are perspective views showing a signal transmission connector according to an embodiment of the present invention;
圖3為表示本發明的一實施例的信號傳送連接器的截面圖;3 is a sectional view showing a signal transmission connector according to an embodiment of the present invention;
圖4及圖5為分離表示本發明的一實施例的信號傳送連接器用插座元件和蓋座的附圖;4 and 5 are separate drawings showing a socket element and a cover for a signal transmission connector according to an embodiment of the present invention;
圖6表示將本發明的一實施例的信號傳送連接器用插座元件安裝在第一電子部件的狀態;FIG. 6 shows a state in which a socket element for a signal transmission connector according to an embodiment of the present invention is mounted on a first electronic component;
圖7表示本發明的一實施例的信號傳送連接器將第一電子部件與第二電子部件連接的狀態;FIG. 7 shows a state where a signal transmission connector according to an embodiment of the present invention connects a first electronic component to a second electronic component;
圖8為表示本發明的一實施例的信號傳送連接器用插座元件的一部分的平面圖;8 is a plan view showing part of a socket element for a signal transmission connector according to an embodiment of the present invention;
圖9表示本發明的一實施例的信號傳送連接器用插座元件的製造過程;FIG. 9 shows a manufacturing process of a socket element for a signal transmission connector according to an embodiment of the present invention;
圖10至圖18表示本發明的信號傳送連接器的各種變形例。10 to 18 show various modifications of the signal transmission connector of the present invention.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none
20:第二電子部件 20: Second electronic component
100:信號傳送連接器 100: Signal transmission connector
110:插座元件 110: socket element
140:蓋座 140: cover seat
Claims (10)
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KR1020200044854A KR102349967B1 (en) | 2020-02-21 | 2020-04-13 | Data signal transmission connector and manufacturing method for socket assembly of data signal transmission connector |
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JP2001188071A (en) * | 1999-12-28 | 2001-07-10 | Jsr Corp | Connector device |
TWI451637B (en) * | 2012-05-25 | 2014-09-01 | Supermax Co Ltd | Demagnetization connector and its magnetic component construction |
CN104285151A (en) * | 2012-04-27 | 2015-01-14 | 株式会社Isc | Test socket which allows for ease of alignment |
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JP2002076207A (en) * | 2000-08-25 | 2002-03-15 | D D K Ltd | Bga chip and cleaning system of socket connector using the bga chip |
KR101032646B1 (en) * | 2008-08-21 | 2011-05-06 | 주식회사 아이에스시테크놀러지 | Thin film connector |
JP4863130B2 (en) * | 2009-05-22 | 2012-01-25 | 山一電機株式会社 | Board connector, semiconductor device socket including the same, cable connector, and board-to-board connector |
KR101526536B1 (en) * | 2013-12-27 | 2015-06-10 | 주식회사 아이에스시 | Conductive elastic member, fabrication method thereof and electrical test socket |
DE202015005722U1 (en) | 2015-08-13 | 2015-09-02 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Board-to-board connector for signal-transmitting connection of two printed circuit boards |
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JP2001188071A (en) * | 1999-12-28 | 2001-07-10 | Jsr Corp | Connector device |
CN104285151A (en) * | 2012-04-27 | 2015-01-14 | 株式会社Isc | Test socket which allows for ease of alignment |
TWI451637B (en) * | 2012-05-25 | 2014-09-01 | Supermax Co Ltd | Demagnetization connector and its magnetic component construction |
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