TWI797622B - Method and system for testing an integrated circuit - Google Patents
Method and system for testing an integrated circuit Download PDFInfo
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- TWI797622B TWI797622B TW110117474A TW110117474A TWI797622B TW I797622 B TWI797622 B TW I797622B TW 110117474 A TW110117474 A TW 110117474A TW 110117474 A TW110117474 A TW 110117474A TW I797622 B TWI797622 B TW I797622B
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- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
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- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/12015—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details comprising clock generation or timing circuitry
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- G—PHYSICS
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- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
- G11C29/30—Accessing single arrays
- G11C29/32—Serial access; Scan testing
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- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/48—Arrangements in static stores specially adapted for testing by means external to the store, e.g. using direct memory access [DMA] or using auxiliary access paths
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/50—Marginal testing, e.g. race, voltage or current testing
- G11C29/50012—Marginal testing, e.g. race, voltage or current testing of timing
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- G—PHYSICS
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- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
- G11C29/56012—Timing aspects, clock generation, synchronisation
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C2029/0401—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals in embedded memories
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- G—PHYSICS
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- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C2029/0403—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals during or with feedback to manufacture
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- G—PHYSICS
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- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
- G11C2029/1802—Address decoder
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
- G11C29/30—Accessing single arrays
- G11C2029/3202—Scan chain
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
- G11C2029/5602—Interface to device under test
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
- G11C2029/5606—Error catch memory
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/003—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation in serial memories
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/006—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation at wafer scale level, i.e. wafer scale integration [WSI]
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
- G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
- G11C29/46—Test trigger logic
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Abstract
Description
本發明係有關於一種用於測試配置在矽晶圓上之積體電路的方法及系統。The present invention relates to a method and system for testing integrated circuits disposed on silicon wafers.
在矽晶圓上製造積體電路。 矽晶圓包括大量的積體電路,通常是數千個。Fabricate integrated circuits on silicon wafers. A silicon wafer contains a large number of integrated circuits, often thousands.
測試積體電路包括藉由確保電晶體正確連接在一起以形成所尋求的功能來檢查其功能性。製造積體電路的過程可能會在一個或多個電晶體上或在連接處引起各種故障。必須偵測這些故障,因為它們可能會損害積體電路的性能。Testing integrated circuits involves checking their functionality by ensuring that transistors are connected together correctly to form the desired function. The process of making an integrated circuit can cause various failures on one or more transistors or at the connections. These faults must be detected because they may impair the performance of the integrated circuit.
一些積體電路由邏輯閘、邏輯正反器及至少一個可重寫記憶體(例如,快閃記憶體)組成。Some integrated circuits are composed of logic gates, logic flip-flops, and at least one rewritable memory (eg, flash memory).
一些積體電路具有可選擇地參數化之內部時脈,內部時脈由邏輯閘使用,並且用於對所有邏輯正反器及可重寫記憶體的運作進行定時。Some ICs have optionally parameterizable internal clocks used by logic gates and used to time the operation of all logic flip-flops and rewritable memories.
可重寫記憶體的存取時間係必須被測試及證明合格的重要元素。通常,增加可重寫記憶體的時脈頻率,直到在可重寫記憶體的輸出處獲得與期望內容不對應的資料為止。The access time of the rewritable memory is an important element that must be tested and qualified. Typically, the clock frequency of the rewritable memory is increased until data not corresponding to the desired content is obtained at the output of the rewritable memory.
當在整個積體電路中使用相同的內部時脈時,無法增加時脈頻率以表徵可重寫記憶體的存取時間,因為這樣的內部時脈的頻率之增加亦可能導致邏輯閘或正反器的故障失效,這會使可重寫記憶體的存取時間之合格性的結果是錯誤的。When the same internal clock is used throughout the integrated circuit, it is impossible to increase the clock frequency to characterize the access time of the rewritable memory, because such an increase in the frequency of the internal clock may also cause logic gates to be reversed. failure of the device, which will make the eligibility results of the access time of the rewritable memory erroneous.
本發明旨在可判定由內部時脈來進行定時之包含在積體電路中之可重寫記憶體的存取時間,所述積體電路亦由邏輯正反器及邏輯閘組成。The present invention aims to determine the access time of a rewritable memory included in an integrated circuit, which is also composed of logic flip-flops and logic gates, which is clocked by an internal clock.
為此,依據第一態樣,本發明提出一種用於測試積體電路的系統,該積體電路包括邏輯閘、邏輯正反器及一可重寫記憶體,該積體電路包括一內部時脈,該內部時脈由該等邏輯閘使用來對所有該等邏輯閘及該可重寫記憶體的運作進行定時,該積體電路可配置成處於稱為掃描鏈(scan chain)模式的一操作模式中,其中該等正反器的所有部件一個接一個地連成一串,以便測試該等邏輯閘及該等正反器的操作,其特徵在於該系統包括: 用於將該積體電路置於該掃描鏈模式中的手段; 用於使該可重寫記憶體與該等邏輯閘及該等邏輯正反器隔離; 用於藉由一外部時脈對用於使該可重寫記憶體與該等邏輯閘及該等邏輯正反器隔離的手段進行定時; 用於改變該外部時脈的週期性的手段; 用於讀取該可重寫記憶體的內容並且用於將該數值與一預定數值進行比較的手段; 用於依據該比較的結果來判定該可重寫記憶體的存取時間的手段。Therefore, according to the first aspect, the present invention proposes a system for testing an integrated circuit, the integrated circuit includes logic gates, logic flip-flops and a rewritable memory, the integrated circuit includes an internal clock The internal clock is used by the logic gates to time the operation of all the logic gates and the rewritable memory. The integrated circuit can be configured in a mode known as a scan chain (scan chain) mode of operation in which all parts of the flip-flops are connected in series one after the other in order to test the operation of the logic gates and the flip-flops, characterized in that the system comprises: means for placing the integrated circuit in the scan chain mode; for isolating the rewritable memory from the logic gates and the logic flip-flops; means for timing the means for isolating the rewritable memory from the logic gates and the logic flip-flops by an external clock; means for varying the periodicity of the external clock; means for reading the contents of the rewritable memory and for comparing the value with a predetermined value; A means for determining the access time of the rewritable memory according to the comparison result.
本發明亦有關於一種用於測試積體電路的方法,該積體電路包括邏輯閘、邏輯正反器及一可重寫記憶體,該積體電路包括一內部時脈,該內部時脈由該等邏輯閘使用且用於對所有該等邏輯正反器及該可重寫記憶體的操作進行定時,該積體電路可配置成處於稱為掃描鏈模式的一操作模式中,其中該等正反器的所有部件一個接一個地連成一串,以便測試該等邏輯閘及該等正反器的操作,其特徵在於該方法包括下列步驟: 將該積體電路置於該掃描鏈模式中; 使該可重寫記憶體與該等邏輯閘及該等邏輯正反器隔離; 藉由一外部時脈對用於使該可重寫記憶體與該等邏輯閘及該等邏輯正反器隔離的裝置進行定時; 改變該外部時脈的週期性; 讀取該可重寫記憶體的內容並將該數值與一預定數值進行比較; 依據該比較的結果來判定該可重寫記憶體的存取時間。The present invention also relates to a method for testing an integrated circuit, the integrated circuit includes logic gates, logic flip-flops and a rewritable memory, the integrated circuit includes an internal clock, the internal clock is controlled by The logic gates are used and used to time the operation of all the logic flip-flops and the rewritable memory, the integrated circuit can be configured in a mode of operation called scan chain mode, wherein the All parts of the flip-flop are connected in series one after the other in order to test the operation of the logic gates and the flip-flops, characterized in that the method comprises the following steps: placing the integrated circuit in the scan chain mode; isolating the rewritable memory from the logic gates and the logic flip-flops; clocking means for isolating the rewritable memory from the logic gates and the logic flip-flops by an external clock; change the periodicity of the external clock; reading the content of the rewritable memory and comparing the value with a predetermined value; The access time of the rewritable memory is determined according to the comparison result.
因此,可以藉由利用該掃描鏈模式來判定該可重寫記憶體的存取時間,同時從而避免必須添加一專用系統。Therefore, the access time of the rewritable memory can be determined by utilizing the scan chain mode, and at the same time, it is possible to avoid having to add a dedicated system.
依據本發明的特定實施例,該隔離手段由設置在用於控制該可重寫記憶體的定址之至少一個暫存器及用於控制該可重寫記憶體的讀取之一暫存器的輸入及輸出處的多工器組成。因此,取決於該常用掃描鏈模式或讀取該存取時間測量模式的週期是在操作中,該可重寫記憶體的輸入分別與該電路的其餘部分隔離或連接至該等控制暫存器。依據本發明的特定實施例,控制該可重寫記憶體的定址之該暫存器的輸出連接至設置在該可重寫記憶體的一輸入處之該多工器的一輸入。According to a particular embodiment of the invention, the isolation means are provided in at least one register for controlling the addressing of the rewritable memory and a register for controlling the reading of the rewritable memory Multiplexers at the input and output. Thus, depending on whether the normal scan chain mode or the period of reading the access time measurement mode is in operation, the input of the rewritable memory is isolated from the rest of the circuit or connected to the control registers respectively . According to a particular embodiment of the invention, the output of the register controlling the addressing of the rewritable memory is connected to an input of the multiplexer arranged at an input of the rewritable memory.
因此,在該讀取週期期間,保持先前載入該定址控制暫存器中之數值。在此模式中,它是可判定之與該讀取控制暫存器的啟動有關之存取時間。Therefore, during the read cycle, the value previously loaded into the address control register is maintained. In this mode, it is determinable about the access time associated with the activation of the read control register.
依據本發明的特定實施例,控制該可重寫記憶體的定址之該暫存器的輸出連接至一反相器,該反相器的輸出連接至設置在該可重寫記憶體的一輸入處之該多工器的一輸入。According to a particular embodiment of the invention, the output of the register controlling the addressing of the rewritable memory is connected to an inverter, the output of which is connected to an input provided on the rewritable memory to an input of the multiplexer.
因此,在該讀取週期期間,使先前載入該定址控制暫存器中之數值成倒數。在此模式中,它是可判定之與該定址控制暫存器的啟動有關之存取時間及與該讀取控制暫存器有關的存取時間。Thus, during the read cycle, the value previously loaded into the address control register is inverted. In this mode, it is determinable the access time associated with the activation of the address control register and the access time associated with the read control register.
依據本發明的特定實施例,設置在該等控制暫存器的輸入處之該等多工器由一第一邏輯信號來進行控制,並且設置在該等控制暫存器的輸出處之該等多工器由與該第一邏輯信號不同的一第二邏輯信號來進行控制。According to a particular embodiment of the invention, the multiplexers arranged at the inputs of the control registers are controlled by a first logic signal, and the multiplexers arranged at the outputs of the control registers The multiplexer is controlled by a second logic signal different from the first logic signal.
因此,設置在該等控制暫存器的輸出處之該等多工器係被使用於在簡單掃描鏈模式中,使該可重寫記憶體與該電路的其餘部分隔離,並且被使用於在存取時間測量模式中之讀取週期期間,使該可重寫暫存器連接至該等控制暫存器。設置在該等控制暫存器的輸入處之該等多工器僅在存取時間測量模式中使用,以在該讀取週期期間控制該等暫存器的內容。Therefore, the multiplexers placed at the outputs of the control registers are used in simple scan chain mode to isolate the rewritable memory from the rest of the circuit and are used in The rewritable register is connected to the control registers during a read cycle in access time measurement mode. The multiplexers provided at the inputs of the control registers are only used in access time measurement mode to control the contents of the registers during the read cycle.
依據本發明的特定實施例,該可重寫記憶體的輸出連接至另一個多工器,而該另一個多工器連接至一輸出暫存器。According to a specific embodiment of the present invention, the output of the rewritable memory is connected to another multiplexer, and the other multiplexer is connected to an output register.
因此,可捕獲在該可重寫記憶體中讀取的數值,以便接下來將其傳送至測試器,測試器能夠將其與期望數值進行比較。Thus, the value read in this rewritable memory can be captured for subsequent transfer to the tester, which can compare it with the expected value.
本發明亦有關於儲存在一資訊載體上之電腦程式,該等程式包括在該等程式被載入一電腦系統並由該電腦系統執行時用於使用該等前述方法之指令。The invention also relates to computer programs stored on an information carrier, the programs comprising instructions for using the aforementioned methods when the programs are loaded into and executed by a computer system.
圖1顯示用於測試矽晶圓上之積體電路的系統。Figure 1 shows a system for testing integrated circuits on silicon wafers.
在圖1中,測試器Te使用與同時被測試的一組積體電路之矩形區域接觸的複數個探針卡來測試矽晶圓DUT的積體電路CI。In FIG. 1 , the tester Te tests the ICs CI of the silicon wafer DUT by using a plurality of probe cards which are in contact with a rectangular area of a group of ICs to be tested at the same time.
測試器Te例如是用於控制一個或多個探針卡的電腦。測試器Te測試積體電路是否符合規格,並且可以配置及調整積體電路的參數。The tester Te is, for example, a computer for controlling one or more probe cards. The tester Te tests whether the integrated circuit meets the specifications, and can configure and adjust parameters of the integrated circuit.
每個積體電路具有至少兩個接觸區域,每個接觸區域在圖1中用黑色正方形來表示,所述接觸區域用於測試積體電路。測試器Te使用一個探針來控制各種測試,並且使用一個探針來提供外部時脈,以表徵包含在積體電路中之可重寫記憶體的存取時間。在圖1中,藉由包括探針Cp1a、Cp1b、Cp2a及Cpt2c的探針卡來同時測試兩個積體電路。當然,同時測試大量的積體電路,圖1中的範例僅僅是對實際狀況的簡化。同樣地,出於簡化的原因,在圖1中僅顯示七個積體電路。當然,在矽晶圓DUT上存在大量的積體電路。Each integrated circuit has at least two contact areas, each of which is represented by a black square in FIG. 1 , which are used for testing the integrated circuit. The tester Te uses a probe to control various tests and uses a probe to provide an external clock to characterize the access time of the rewritable memory included in the IC. In FIG. 1, two integrated circuits are tested simultaneously by a probe card including probes Cp1a, Cp1b, Cp2a, and Cpt2c. Of course, testing a large number of integrated circuits at the same time, the example in Figure 1 is only a simplification of the actual situation. Likewise, only seven integrated circuits are shown in FIG. 1 for reasons of simplicity. Of course, there are a large number of integrated circuits on a silicon wafer DUT.
為了偵測積體電路中的故障,必須要檢查積體電路功能的性能。功能由一組邏輯閘及連接來執行。功能的性能由其輸入端的信號來判定。一種方法包括在積體電路的一個特定狀態下將積體電路之一個或多個功能的所有或一些正反器一個接一個地連成一串。這種分組稱為「掃描鏈」。由於是正反器的情況,例如,它們將在每個時脈的事件下進行更新。因此,正反器將更新其後面的正反器,並將由其前面的正反器來進行更新:此動作將稱為「掃描載入(scan loading)」。藉由固定正反器的數值,可以固定積體電路之各種組合雲(combinatorial clouds)的輸入。一組合雲由一組不執行開關功能的邏輯閘組成。In order to detect faults in an integrated circuit, it is necessary to check the functional performance of the integrated circuit. Functions are performed by a set of logic gates and connections. The performance of a function is determined by the signal at its input. One method involves connecting all or some of the flip-flops of one or more functions of the integrated circuit in a string one after the other in a particular state of the integrated circuit. This grouping is called a "scan chain". As is the case with flip-flops, for example, they will be updated on every clock event. Thus, the flip-flop will update the flip-flop behind it, and will be updated by the flip-flop in front of it: this action will be called "scan loading". By fixing the value of flip-flops, the inputs of various combinatorial clouds of integrated circuits can be fixed. A composite cloud consists of a group of logic gates that do not perform switching functions.
為了捕獲組合雲的輸出,可停用正反器的連鎖,使得其輸入直接連接至組合雲的輸出。藉由將一個事件(例如,一個時脈)施加至所有正反器,更新所有正反器:此動作將稱為「掃描捕獲(scan capture)」。In order to capture the output of the combined cloud, the interlocking of the flip-flops can be deactivated so that their input is directly connected to the output of the combined cloud. Update all flip-flops by applying an event (eg a clock) to all flip-flops: this action will be called "scan capture".
為了擷取更新後之正反器的內容,重新啟動其連鎖,並且將與正反器一樣多的事件施加至「掃描鏈」:此動作將稱為「掃描卸載(scan discharging)」。在此應該注意,掃描卸載可以對應於隨後的掃描鏈之掃描裝載。To retrieve the contents of the updated flip-flop, its chain is restarted and as many events as flip-flops are applied to the "scan chain": this action will be called "scan discharging". It should be noted here that a scan unload may correspond to a scan load of a subsequent scan chain.
自動產生測試向量的工具(ATPG,自動測試圖案產生器)提供在「掃描裝載」期間所施加的數值、「掃描捕獲」應用的時刻以及「掃描卸載」期間的期望值。The tool for automatic test pattern generation (ATPG, Automatic Test Pattern Generator) provides the values applied during "scan loading", the moment of application of "scan capture" and the expected values during "scan unloading".
圖2顯示依據本發明之測試裝置或測試器的架構。測試器Te包括:
處理器、微處理器或微控制器200;
揮發性記憶體203;
ROM記憶體202;
介面205,其包括至少一個探針卡;
通信匯流排201,其將處理器200連接至ROM記憶體202、RAM記憶體203及介面205。Figure 2 shows the architecture of a testing device or tester according to the present invention. Tester Te includes:
processor, microprocessor or
處理器200能夠執行從ROM記憶體202、外部記憶體(未顯示)或儲存媒體載入揮發性記憶體203中之指令。當啟動測試器Te時,處理器200能夠從揮發性記憶體203讀取指令並執行它們。這些指令構成電腦程式,所述電腦程式使處理器200實施積體電路測試程式。The
測試程式的全部或部分可以藉由由可程式機器(例如,DSP(數位信號處理器)或微控制器)執行一組指令來以軟體形式實施,亦可以藉由機器或專用組件(例如,FPGA(現場可程式閘陣列)或ASIC(特定應用積體電路))來以硬體形式實施。All or part of the test program can be implemented in software by executing a set of instructions on a programmable machine (for example, a DSP (Digital Signal Processor) or a microcontroller), or it can be implemented by a machine or a dedicated component (for example, an FPGA) (Field Programmable Gate Array) or ASIC (Application Specific Integrated Circuit)) to be implemented in hardware.
圖3顯示依據本發明的積體電路架構。積體電路CI包括連接至控制模組300的輸入/輸出Cp1a。FIG. 3 shows an integrated circuit architecture according to the present invention. The integrated circuit CI includes an input/output Cp1a connected to the
控制模組300藉由輸入/輸出Cp1a從測試器Te接收命令,並且藉由輸入Cp1b接收測試器Te的外部時脈。The
針對用於隔離及測試可重寫記憶體的模組310,控制模組300根據接收到的命令產生表示為Eq1、Eq2、ScMo、Sch的信號及外部時脈Clk。For the
控制模組300配置成從用於隔離及測試可重寫記憶體的模組310接收資料。The
積體電路CI包括一組邏輯閘及正反器320。The integrated circuit CI includes a set of logic gates and flip-
在積體電路CI的常用操作期間,可重寫記憶體連接至這組邏輯閘及正反器320。在測試可重寫記憶體的存取時間期間,依據本發明,使可重寫記憶體與所有邏輯閘及正反器320隔離。During normal operation of the integrated circuit CI, the rewritable memory is connected to the set of logic gates and flip-
控制模組300能夠讀取指令並執行它們。這些指令構成電腦程式,所述電腦程式使控制模組300實施關於圖8所描述之方法的全部或部分。The
關於圖8所描述之方法的全部或部分可以藉由由可程式機器(例如,DSP(數位信號處理器)或微控制器)執行一組指令來以軟體形式實施,或者可以藉由機器或專用組件來以硬體形式實施。All or part of the method described with respect to FIG. 8 may be implemented in software by executing a set of instructions on a programmable machine (for example, a DSP (Digital Signal Processor) or microcontroller), or may be implemented by a machine or dedicated components to be implemented in hardware.
圖4顯示依據本發明之用於隔離及測試可重寫記憶體的模組之架構的第一範例。FIG. 4 shows a first example of the architecture of a module for isolating and testing rewritable memories according to the present invention.
用於隔離及測試可重寫記憶體的模組310包括多工器400、401、402、403及404,其在表徵可重寫記憶體410的存取時間期間隔離可重寫記憶體410。
多工器400及401由信號Eq2控制。當信號ScMo處於高位準時,當稱為「Scan_taa」的信號處於高位準時,並且當稱為捕獲的信號處於高位準時,信號Eq2處於高位準。The
信號ScMo係控制掃描鏈模式的信號。The signal ScMo is a signal controlling the scan chain mode.
捕獲信號係常用的掃描捕獲信號。The capture signal is a commonly used scanning capture signal.
信號scan_taa係在希望表徵可重寫記憶體410的存取時間時依據本發明使用的信號。The signal scan_taa is the signal used according to the present invention when it is desired to characterize the access time of the
用於隔離及測試可重寫記憶體的模組310包括三個控制暫存器420、421及422。The
控制暫存器420係可以程式化、抹除可重寫記憶體410並且可以將可重寫記憶體410置於低功耗模式及可重寫記憶體410的內部測試模式中之暫存器。The
控制暫存器420係控制可重寫記憶體410的定址之暫存器。The
控制暫存器422係控制可重寫記憶體410的讀取之暫存器。The
多工器400的輸出連接至控制暫存器421的輸入。控制暫存器421的輸出連接至多工器403的第一輸入及多工器400的第一輸入。The output of the
當信號Eq2處於高位準時,控制暫存器420的輸出被導向控制暫存器421的輸入。當信號Eq2處於低位準時,連接至多工器400的第二輸入之表示為Fon1的信號被導向控制暫存器421的輸入。When the signal Eq2 is at a high level, the output of the
信號Fon1表示在積體電路的常用操作期間(亦即,當可重寫記憶體410非正在測試的存取時間時)施加在控制暫存器421的輸入上之信號。Signal Fon1 represents the signal applied to the input of
多工器401的輸出連接至控制暫存器422。控制暫存器422的輸出連接至多工器404的第一輸入。The output of the
當信號Eq2處於高位準時,連接至多工器401的第一輸入之信號Act被導向控制暫存器422的輸入。當信號Eq2處於低位準時,連接至多工器401的第二輸入之表示為Fon2的信號被導向控制暫存器422的輸入。When the signal Eq2 is at a high level, the signal Act connected to the first input of the
信號Act係啟動可重寫記憶體410的控制以在控制暫存器421所提供的記憶體位址處讀取其內容的信號。The signal Act is a signal to enable the control of the
信號Fon2表示在積體電路的常用操作期間(亦即,當可重寫記憶體410非正在測試的存取時間時)施加在控制暫存器422的輸入上之信號。Signal Fon2 represents the signal applied to the input of
外部時脈Clk及信號Sch被傳送至控制暫存器420、421及422。The external clock Clk and the signal Sch are sent to the control registers 420 , 421 and 422 .
信號Sch係用於藉由掃描鏈將所需數值加載至控制暫存器420、421及422的信號。The signal Sch is a signal used to load required values into the control registers 420 , 421 and 422 through the scan chain.
多工器402、403及404的第二個輸入連接至表示為In的信號。信號In的功能係停用功能。The second input of the
多工器402由信號ScMo控制,而多工器403及404由信號Eq1控制。The
當信號ScMo處於高電位準時,並且當信號「Scan_taa」處於低位準時或者當捕獲信號處於低位準時,信號Eq1處於高位準。When the signal ScMo is at a high level, and when the signal “Scan_taa” is at a low level or when the capture signal is at a low level, the signal Eq1 is at a high level.
捕獲信號係用於控制掃描鏈的捕獲之常用信號。The capture signal is a common signal used to control the capture of the scan chain.
多工器402、403及404的輸出連接至可重寫記憶體410。The outputs of the
當信號Eq1處於高位準時,信號In被導向可重寫記憶體410。當信號Eq1處於低位準時,控制暫存器421的輸出被導向可重寫記憶體410。When the signal Eq1 is at a high level, the signal In is directed to the
當信號Eq1處於高位準時,信號In被導向可重寫記憶體410。當信號Eq1處於低位準時,控制暫存器422的輸出被導向可重寫記憶體410。When the signal Eq1 is at a high level, the signal In is directed to the
當信號ScMo處於高位準時,信號In被導向可重寫記憶體410。當信號ScMo處於低位準時,控制暫存器420的輸出被導向可重寫記憶體410。When the signal ScMo is at a high level, the signal In is directed to the
可重寫記憶體410的輸出連接至多工器405的第一輸入。多工器405的第二輸入連接至表示為Otr的信號。The output of the
在常用掃描鏈模式中使用的情況下,可重寫記憶體410的輸出不能連接至掃描鏈,因為不可能預測其數值。信號Otr可以將已知且可控制的資料重新導向輸出暫存器430。In the case of use in the usual scan chain mode, the output of the
多工器405的輸出連接至輸出暫存器430的輸入,輸出暫存器430由外部時脈Clk來控制。The output of the
在對可重寫記憶體410的存取時間進行測試期間,將從控制暫存器輸出的資料傳送至控制模組300。During testing the access time of the
圖5顯示在依據本發明的第一示範實施例中由用於隔離及測試可重寫記憶體的模組所使用之信號的時序圖。FIG. 5 shows a timing diagram of signals used by a module for isolating and testing a rewritable memory in a first exemplary embodiment according to the present invention.
圖5顯示來自外部時脈Clk的信號、信號Eq1及Eq2、從控制暫存器421輸出的信號421_out、從控制暫存器422輸出的信號422_out、從多工器403輸出的信號403_out、從多工器404輸出的信號404_out、從可重寫記憶體410輸出的信號410_out以及從輸出暫存器430輸出的信號Do。5 shows the signal from the external clock Clk, the signal Eq1 and Eq2, the signal 421_out output from the
控制暫存器421由時脈Clk的上升邊緣來觸發,控制暫存器422由時脈Clk的下降邊緣來觸發。The
從控制暫存器421輸出的位址係預定位址ADD1。 當信號Eq1變為低位準且信號Eq2變為高位準時,只要信號Eq1保持在低位準且信號Eq2保持在高位準,信號403_out就變成有效的且表示位址ADD1。可重寫記憶體410的位址ADD1被定址。The address output from the
當信號Eq1變為低位準且信號Eq2變為高位準時,信號404_out在外部時脈Clk的下一個上升邊緣時變成有效的且表示在位址ADD1處讀取可重寫記憶體410的內容之命令,並且只要信號Eq1保持在低位準且信號Eq2保持在高位準,就會保持在有效狀態中。When the signal Eq1 goes low and the signal Eq2 goes high, the signal 404_out becomes valid on the next rising edge of the external clock Clk and represents a command to read the contents of the
在位址ADD1處之可重寫記憶體410的內容D在表示可重寫記憶體410的存取時間之延遲Ta下出現在輸出410_out處。The content D of the
然後,資料D在時脈Clk的下一個上升邊緣時出現在輸出暫存器430的輸出Do。Then, the data D appears at the output Do of the
因此,當外部時脈Clk的週期Pe變成小於可重寫記憶體410的存取時間時,在位址ADD1處之可重寫記憶體410的內容D不再出現在可重寫記憶體410的輸出,並且資料D在時脈Clk的下一個上升邊緣時不再出現在輸出暫存器430的輸出Do。Therefore, when the period Pe of the external clock Clk becomes shorter than the access time of the
圖6顯示依據本發明之用於隔離及測試可重寫記憶體的模組之架構的第二範例。FIG. 6 shows a second example of the architecture of a module for isolating and testing rewritable memories according to the present invention.
用於隔離及測試可重寫記憶體的模組310包括多工器600、601、602、603及604,其在表徵可重寫記憶體610的存取時間期間隔離可重寫記憶體610。
多工器600及601由信號Eq2控制。當信號ScMo處於高位準時,當稱為「Scan_taa」的信號處於高位準時,並且當稱為捕獲的信號處於高位準時,信號Eq2處於高位準。The
信號ScMo係控制掃描鏈模式的信號。The signal ScMo is a signal controlling the scan chain mode.
捕獲信號係常用掃描捕獲信號。The capture signal is a commonly used scanning capture signal.
信號scan_taa係在希望表徵可重寫記憶體610的存取時間時依據本發明使用的信號。The signal scan_taa is the signal used according to the present invention when it is desired to characterize the access time of the
用於隔離及測試可重寫記憶體的模組310包括三個控制暫存器620、621及622。The
控制暫存器620係可以程式化、抹除可重寫記憶體610並且可以將可重寫記憶體610置於低功耗模式及用於可重寫記憶體610的內部測試之模式中的暫存器。The
控制暫存器621係控制可重寫記憶體610的定址之暫存器。The
控制暫存器622係控制可重寫記憶體610的讀取之暫存器。The
多工器600的輸出連接至控制暫存器621。控制暫存器621的輸出連接至多工器603的第一輸入及反相器640的輸入,反相器640的輸出連接至多工器600的第一輸入。The output of the
當信號Eq2處於高位準時,控制暫存器621的反相輸出被導向控制暫存器621的輸入。當信號Eq2處於低位準時,連接至多工器600的第二輸入之表示為Fon1的信號被導向控制暫存器621的輸入。When the signal Eq2 is at a high level, the inverted output of the
信號Fon1表示在積體電路的常用操作期間(亦即,當可重寫記憶體620非正在測試的存取時間時)施加至控制暫存器621的輸入之信號。多工器601的輸出連接至控制暫存器622。控制暫存器622的輸出連接至多工器604的第一輸入。The signal Fon1 represents the signal applied to the input of the
當信號Eq2處於高位準時,連接至多工器601的第一輸入之信號Act被導向控制暫存器622的輸入。當信號Eq2處於低位準時,連接至多工器601的第二輸入之表示為Fon2的信號被導向控制暫存器622的輸入。When the signal Eq2 is at a high level, the signal Act connected to the first input of the
信號Act係啟動可重寫記憶體610的控制以在控制暫存器621所提供的記憶體位址處讀取其內容的信號。The signal Act is a signal to enable the control of the
信號Fon2表示在積體電路的常用操作期間(亦即,當可重寫記憶體610非正在測試的存取時間時)施加至控制暫存器621的輸入之信號。外部時脈Clk及信號Sch被傳送至控制暫存器620、621及622。The signal Fon2 represents the signal applied to the input of the
信號Sch係用於藉由掃描鏈將所需數值加載至控制暫存器620、621及622的信號。The signal Sch is a signal used to load required values into the control registers 620 , 621 and 622 through the scan chain.
多工器602、603及604的第二個輸入連接至表示為In的信號。信號In的功能係停用功能。The second input of
多工器602由信號ScMo控制,而多工器603及604由信號Eq1控制。The
當信號ScMo處於高電位準時,並且當信號「Scan_taa」處於低位準時或者當捕獲信號處於低位準時,信號Eq1處於高位準。When the signal ScMo is at a high level, and when the signal “Scan_taa” is at a low level or when the capture signal is at a low level, the signal Eq1 is at a high level.
捕獲信號係用於控制掃描鏈的捕獲之常用信號。The capture signal is a common signal used to control the capture of the scan chain.
多工器602、603及604的輸出連接至可重寫記憶體610。The outputs of the
當信號Eq1處於高位準時,信號In被導向可重寫記憶體610。當信號Eq1處於低位準時,控制暫存器621的輸出被導向可重寫記憶體610。When the signal Eq1 is at a high level, the signal In is directed to the
當信號Eq1處於高位準時,信號In被導向可重寫記憶體610。當信號Eq1處於低位準時,控制暫存器622的輸出被導向可重寫記憶體610。When the signal Eq1 is at a high level, the signal In is directed to the
當信號ScMo處於高位準時,信號In被導向可重寫記憶體610。當信號ScMo處於低位準時,控制暫存器620的輸出被導向可重寫記憶體610。When the signal ScMo is at a high level, the signal In is directed to the
可重寫記憶體610的輸出連接至多工器605的第一輸入。多工器605的第二輸入連接至表示為Otr的信號。The output of the
在常用掃描鏈模式中使用的情況下,可重寫記憶體610的輸出不能連接至掃描鏈,因為不可能預測其數值。信號Otr可以將已知且可控制的資料重新導向輸出暫存器630。In case of use in normal scan chain mode, the output of the
多工器605的輸出連接至輸出暫存器630的輸入,輸出暫存器630由外部時脈Clk來控制。The output of the
在對可重寫記憶體610的存取時間進行測試期間,將從控制暫存器輸出的資料傳送至控制模組300。During testing the access time of the
圖7顯示在依據本發明的第二示範實施例中由用於隔離及測試可重寫記憶體的模組所使用之信號的時序圖。FIG. 7 shows a timing diagram of signals used by a module for isolating and testing a rewritable memory in a second exemplary embodiment according to the present invention.
圖7顯示外部時脈信號Clk、信號Eq1及Eq2、從控制暫存器621輸出的信號621_out、從控制暫存器622輸出的信號622_out、從多工器603輸出的信號603_out、從多工器604輸出的信號604_out、從可重寫記憶體610輸出的信號610_out以及從輸出暫存器630輸出的信號Do。7 shows the external clock signal Clk, signals Eq1 and Eq2, the signal 621_out output from the
控制暫存器621由時脈Clk的上升邊緣來觸發,控制暫存器622由時脈Clk的下降邊緣來觸發。The
當信號Eq2處於位準1時,控制暫存器621的輸出藉由反相器閘640連接至其輸入,從控制暫存器621輸出的位址在每個上升邊緣處從位址AD1改變為位址AD1的補數,或在每個上升邊緣處從位址AD1的補數改變為位址AD1。When signal Eq2 is at
從控制暫存器621輸出的位址係預定位址AD1或其補數!AD1。當信號Eq1變為低位準且信號Eq2變為高位準時,只要信號Eq1保持在低位準且信號Eq2保持在高位準,信號603_out就變成有效的且表示位址AD1或其補數!AD1。可重寫記憶體610的位址AD1及位址!AD1被定址。The address output from the
這種配置可以在存取時間為最大的配置中測試可重寫記憶體610的存取時間。This configuration can test the access time of the
當信號Eq1變為低位準且信號Eq2變為高位準時,信號604_out在外部時脈Clk的下一個上升邊緣時變成有效的且表示在位址!AD1處及在隨後的上升邊緣時在位址AD1處讀取可重寫記憶體610的內容之命令,並且只要信號Eq1保持在低位準且信號Eq2保持在高位準,就會保持在有效狀態中。When signal Eq1 goes low and signal Eq2 goes high, signal 604_out becomes active on the next rising edge of external clock Clk and is represented at address !AD1 and at address AD1 on subsequent rising edges A command to read the content of the
在位址!AD1處之可重寫記憶體610的內容!D在表示可重寫記憶體610的存取時間之延遲Ta下出現在輸出610_out處,並且在時脈Clk的隨後上升邊緣時,在位址AD1處之可重寫記憶體610的內容D在表示可重寫記憶體610的存取時間之相同的延遲Ta’下出現在輸出610_out處。The content of
然後,資料項D或!D在時脈Clk的下一個上升邊緣時出現在輸出暫存器430的輸出Do。Then, the data item D or !D appears at the output Do of the
因此,當外部時脈Clk的週期Pe變成小於可重寫記憶體410的存取時間時,在位址AD1處之可重寫記憶體410的內容D不再出現在可重寫記憶體410的輸出,並且資料項D在時脈Clk的下一個上升邊緣時不再出現在輸出暫存器630的輸出Do。Therefore, when the period Pe of the external clock Clk becomes shorter than the access time of the
圖8顯示依據本發明之用於隔離及測試可重寫記憶體的模組之架構的第三範例。FIG. 8 shows a third example of the architecture of a module for isolating and testing rewritable memories according to the present invention.
用於隔離及測試可重寫記憶體的模組310包括內部測試模組840及多工器850、800、801、802、803及804,其在表徵可重寫記憶體810的存取時間期間隔離可重寫記憶體810。用於隔離及測試可重寫記憶體的模組310包括三個控制暫存器820、821及822。
內部測試模組840可以表徵由控制暫存器820、821及822傳送之每個資料項對可重寫記憶體810的存取時間之影響。內部測試模組840由信號Eq2控制。當信號ScMo處於高位準時,當稱為「Scan_taa」的信號處於高位準時,並且當稱為捕獲的信號處於高位準時,信號Eq2處於高位準。The
多工器850、800及801由信號Eq2控制。The
信號ScMo係控制掃描鏈模式的信號。The signal ScMo is a signal controlling the scan chain mode.
捕獲信號係常用掃描捕獲信號。The capture signal is a commonly used scanning capture signal.
信號scan_taa係在希望表徵可重寫記憶體810的存取時間時依據本發明使用的信號。The signal scan_taa is the signal used according to the present invention when it is desired to characterize the access time of the
控制暫存器820係可以程式化、抹除可重寫記憶體810並且可以將可重寫記憶體810置於低功耗模式及用於可重寫記憶體810的內部測試之模式中的暫存器。The
多工器850的輸出連接至控制暫存器820。控制暫存器820的輸出連接至多工器802的第一輸入。The output of the
多工器850的第一輸入連接至內部測試模組840的輸出846,而多工器850的第二輸入連接至信號Fon1。A first input of the
當信號Eq2處於高位準時,內部測試模組840的輸出846連接至控制暫存器820的輸入。當信號Eq2處於低位準時,表示為Fon1的信號被導向控制暫存器820的輸入。When the signal Eq2 is at a high level, the
信號Fon1表示在積體電路的常用操作期間(亦即,當可重寫記憶體810非正在測試的存取時間時)施加在控制暫存器820的輸入上之信號。Signal Fon1 represents the signal applied to the input of
多工器801的輸出連接至控制暫存器822。控制暫存器822的輸出連接至多工器804的第一輸入。The output of the
多工器800的輸出連接至控制暫存器821。控制暫存器821的輸出連接至多工器803的第一輸入。The output of the
當信號Eq2處於高位準時,內部測試模組840的輸出844連接至控制暫存器821的輸入。當信號Eq2處於高位準時,連接至多工器800的第二輸入之表示為Fon1的信號被導向控制暫存器821的輸入。When the signal Eq2 is at a high level, the
信號Fon1表示在積體電路的常用操作期間(亦即,當可重寫記憶體810非正在測試的存取時間時)施加在控制暫存器821的輸入上之信號。Signal Fon1 represents the signal applied to the input of
多工器801的輸出連接至控制暫存器822。控制暫存器822的輸出連接至多工器804的第一輸入。The output of the
當信號Eq2處於高位準時,內部測試模組840的輸出842連接至控制暫存器822的輸入。當信號Eq2處於低位準時,連接至多工器801的第二輸入之表示為Fon2的信號被導向控制暫存器822的輸入。When the signal Eq2 is at a high level, the
輸出842係啟動可重寫記憶體810的控制以在控制暫存器821所提供的記憶體位址處讀取其內容的信號。The
信號Fon2表示在積體電路的常用操作期間(亦即,當可重寫記憶體810非正在測試的存取時間時)施加在控制暫存器821的輸入上之信號。外部時脈Clk及信號Sch被傳送至控制暫存器820、821及822。Signal Fon2 represents the signal applied to the input of
信號Sch係用於通過掃描鏈將所需數值加載至控制暫存器820、821及822的信號。The signal Sch is used to load the required values into the control registers 820 , 821 and 822 through the scan chain.
多工器802、803及804的第二個輸入連接至表示為In的信號。信號In的功能係停用功能。The second input of
多工器802由信號ScMo控制,而多工器803及804由信號Eq1控制。The
當信號ScMo處於高電位準時,並且當信號「Scan_taa」處於低位準時或者當捕獲信號處於低位準時,信號Eq1處於高位準。When the signal ScMo is at a high level, and when the signal “Scan_taa” is at a low level or when the capture signal is at a low level, the signal Eq1 is at a high level.
捕獲信號係用於控制掃描鏈的捕獲之常用信號。The capture signal is a common signal used to control the capture of the scan chain.
多工器802、803及804的輸出連接至可重寫記憶體810。The outputs of the
當信號Eq1處於高位準時,信號In被導向可重寫記憶體810。當信號Eq1處於低位準時,控制暫存器821的輸出被導向可重寫記憶體810。When the signal Eq1 is at a high level, the signal In is directed to the
當信號Eq1處於高位準時,信號In被導向可重寫記憶體810。當信號Eq1處於低位準時,控制暫存器822的輸出被導向可重寫記憶體810。When the signal Eq1 is at a high level, the signal In is directed to the
當信號ScMo處於高位準時,信號In被導向可重寫記憶體810。當信號ScMo處於低位準時,控制暫存器820的輸出被導向可重寫記憶體810。When the signal ScMo is high, the signal In is directed to the
可重寫記憶體810的輸出連接至多工器805的第一輸入。多工器805的第二輸入連接至表示為Otr的信號。The output of the
在常用掃描鏈模式中使用的情況下,可重寫記憶體810的輸出不能連接至掃描鏈,因為不可能預測其數值。信號Otr可以將已知且可控制的資料重新導向輸出暫存器830。In the case of use in the usual scan chain mode, the output of the
多工器805的輸出連接至輸出暫存器830的輸入,輸出暫存器830由外部時脈Clk來控制。The output of the
在對可重寫記憶體810的存取時間進行測試期間,將從控制暫存器輸出的資料傳送至內部測試模組840。During the test of the access time of the
圖9顯示依據本發明的第三示範實施例中由用於隔離及測試可重寫記憶體的模組所使用之信號的時序圖。FIG. 9 shows a timing diagram of signals used by a module for isolating and testing a rewritable memory according to a third exemplary embodiment of the present invention.
圖9顯示來自外部時脈Clk的信號、信號Eq1及Eq2、從控制暫存器821輸出的信號821_out、從控制暫存器822輸出的信號822_out、從多工器803輸出的信號803_out、從多工器804輸出的信號804_out、從可重寫記憶體810輸出的信號810_out以及從輸出暫存器830輸出的信號Do。9 shows the signal from the external clock Clk, the signals Eq1 and Eq2, the signal 821_out output from the
控制暫存器821由時脈Clk的上升邊緣來觸發,控制暫存器822由時脈Clk的下降邊緣來觸發。The
根據內部測試模組所提供的信號844,從控制暫存器421輸出的位址從A1變化至An。當信號Eq1變為低位準而信號Eq2變為高位準時,只要信號Eq1保持在低位準且信號Eq2保持在高位準,信號803_out就會變成有效狀態且表示位址A1至An。可重寫記憶體810的位址A1至An在時脈Clk的每個拍子(beat)處被依序地定址。According to the
當信號Eq1變為低位準且信號Eq2變為高位準時,信號804_out在外部時脈Clk的下一個上升邊緣處變成有效的及表示在連續的位址A1至An處讀取可重寫記憶體810的內容之命令,並且只要信號Eq1保持在低位準且信號Eq2保持在高位準,就會保持在有效狀態中。When the signal Eq1 goes low and the signal Eq2 goes high, the signal 804_out becomes active at the next rising edge of the external clock Clk and indicates that the
在位址A1至An處之可重寫記憶體810的內容d1至dn在表示可重寫記憶體810的存取時間之延遲下依序地出現在輸出810_out中。The contents d1 to dn of the
然後,資料dl至dn在時脈Clk的下一個上升邊緣時出現在輸出暫存器830的輸出Do處。Then, the data d1 to dn appear at the output Do of the
因此,當外部時脈Clk的週期Pe變成小於可重寫記憶體810的存取時間時,可重寫記憶體810的內容不再出現在可重寫記憶體810的輸出處,並且資料項在時脈Clk的下一個上升邊緣時不再出現在在輸出暫存器830的輸出Do處。Therefore, when the period Pe of the external clock Clk becomes smaller than the access time of the
圖10顯示依據本發明之演算法的範例。Fig. 10 shows an example of an algorithm according to the present invention.
在步驟E100中,控制模組300進入掃描鏈模式。In step E100, the
在步驟E101中,由測試器Te根據預定參數來決定外部時脈的週期性:開始週期、每次重複時的減少。In step E101, the periodicity of the external clock is determined by the tester Te according to predetermined parameters: the initial period, the decrease at each repetition.
在步驟E102中,控制模組300產成信號Eq1及Eq2。信號Eq1被設定為低位準,而信號Eq2被設定為高位準。這具有將可重寫記憶體與所有邏輯閘及正反器320隔離的效果。In step E102, the
在步驟E103中,控制模組300依據參考圖4所述之第一實施例等待外部時脈Clk的兩個上升邊緣或依據參考圖6所述之第二實施例等待外部時脈Clk的三個上升邊緣。In step E103, the
在步驟E104中,控制模組300將信號Eq1設定為高位準,而將信號Eq2設定為低位準。In step E104 , the
在步驟E105中,控制模組300讀取輸出暫存器的輸出Do。In step E105, the
在步驟E106中,測試器Te檢查在輸出Do處讀取的資料項是否等於在可重寫記憶體的位址Add1或AD1處儲存的資料項。In step E106 , the tester Te checks whether the data item read at the output Do is equal to the data item stored at the address Add1 or AD1 of the rewritable memory.
如果是,則在步驟E107中儲存外部時脈Clk的週期,並且所述方法返回至步驟E101,或者減小外部時脈的週期性。If yes, the period of the external clock Clk is stored in step E107 and the method returns to step E101, or the period of the external clock is reduced.
如果不是,則所述方法前進至步驟E108,並且可重寫記憶體的取存時間被認為等於所儲存之時脈Clk的最後週期。If not, the method proceeds to step E108, and the access time of the rewritable memory is considered equal to the last period of the stored clock Clk.
200:處理器 201:通信匯流排 202:ROM記憶體 203:揮發性記憶體 205:介面 300:控制模組 310:用於隔離及測試可重寫記憶體的模組 320:邏輯閘及正反器 400:多工器 401:多工器 402:多工器 403:多工器 404:多工器 410:可重寫記憶體 420:控制暫存器 421:控制暫存器 422:控制暫存器 430:輸出暫存器 403_out:信號 404_out:信號 410_out:信號 421_out:信號 422_out:信號 600:多工器 601:多工器 602:多工器 603:多工器 604:多工器 603_out:信號 604_out:信號 610_out:信號 610:可重寫記憶體 620:控制暫存器 621:控制暫存器 622:控制暫存器 630:輸出暫存器 640:反相器 800:多工器 801:多工器 802:多工器 803:多工器 804:多工器 810:可重寫記憶體 820:控制暫存器 821:控制暫存器 822:控制暫存器 830:輸出暫存器 840:內部測試模組 803_out:信號 804_out:信號 810_out:信號 821_out:信號 822_out:信號 842:內部測試模組840的輸出 844:內部測試模組840的輸出 846:內部測試模組840的輸出 850:多工器 !AD1:補數 !D1:內容 Act:信號 AD1:位址 Add1:位址 ADD1:預定位址 AN:位址 CI:積體電路 Clk:外部時脈 Cp1a:探針 Cp1b:探針 Cp2a:探針 Cp2b:探針 D:內容 Do:信號 DUT:矽晶圓 E100:步驟 E101:步驟 E102:步驟 E103:步驟 E104:步驟 E105:步驟 E106:步驟 E107:步驟 E108:步驟 Eq1:信號 Eq2:信號 Fon1:信號 Fon2:信號 In:信號 Otr:信號 Pe:週期 scan_taa:信號 Sch:信號 ScMo:信號 Ta:延遲 Ta’:延遲 Te:測試器200: Processor 201: communication bus 202: ROM memory 203: Volatile memory 205: interface 300: control module 310:Module for isolating and testing rewritable memory 320:Logic gate and flip-flop 400: multiplexer 401: multiplexer 402: multiplexer 403: multiplexer 404: multiplexer 410: rewritable memory 420: Control register 421: Control register 422: Control register 430: output register 403_out: signal 404_out: signal 410_out: signal 421_out: signal 422_out: signal 600: multiplexer 601: multiplexer 602: multiplexer 603: multiplexer 604: multiplexer 603_out: signal 604_out: signal 610_out: signal 610: rewritable memory 620: Control register 621: Control register 622: Control register 630: output register 640: Inverter 800: multiplexer 801: multiplexer 802: multiplexer 803: multiplexer 804: multiplexer 810: rewritable memory 820: Control register 821: Control register 822: Control register 830: output register 840:Internal test module 803_out: signal 804_out: signal 810_out: signal 821_out: signal 822_out: signal 842: Output of internal test module 840 844: Output of internal test module 840 846: Output of internal test module 840 850: multiplexer !AD1: complement !D1: content Act: signal AD1: address Add1: address ADD1: predetermined address AN: address CI: integrated circuit Clk: external clock Cp1a:probe Cp1b:probe Cp2a:probe Cp2b:probe D: content Do: signal DUT: silicon wafer E100: Steps E101: Steps E102: Steps E103: Steps E104: Steps E105: Steps E106: Steps E107: Steps E108: Steps Eq1: signal Eq2: Signal Fon1: signal Fon2: signal In: signal Otr: signal Pe: period scan_taa: signal Sch: signal ScMo: signal Ta: Delay Ta': Delay Te: tester
通過閱讀以下示範實施例的說明,上述本發明的特徵以及其它特徵將變得更加清楚,其中該說明是相對於附圖進行的,其中: 圖1顯示用於測試矽晶圓上之積體電路的系統; 圖2顯示依據本發明之測試裝置的架構; 圖3顯示依據本發明之積體電路的架構; 圖4顯示依據本發明之用於隔離及測試可重寫記憶體的模組之架構的第一範例; 圖5顯示依據本發明的第一示範實施例中由用於隔離及測試可重寫記憶體的模組所使用之信號的時序圖; 圖6顯示依據本發明之用於隔離及測試可重寫記憶體的模組之架構的第二範例; 圖7顯示依據本發明的第二示範實施例中由用於隔離及測試可重寫記憶體的模組所使用之信號的時序圖; 圖8顯示依據本發明之用於隔離及測試可重寫記憶體的模組之架構的第三範例; 圖9顯示依據本發明的第三示範實施例中由用於隔離及測試可重寫記憶體的模組所使用之信號的時序圖; 圖10顯示依據本發明之演算法的範例。The features of the invention described above, as well as other features, will become more apparent from a reading of the following description of exemplary embodiments, which is made with respect to the accompanying drawings, in which: Figure 1 shows a system for testing integrated circuits on silicon wafers; Figure 2 shows the architecture of the testing device according to the present invention; FIG. 3 shows the architecture of an integrated circuit according to the present invention; FIG. 4 shows a first example of the architecture of a module for isolating and testing rewritable memories according to the present invention; FIG. 5 shows a timing diagram of signals used by a module for isolating and testing a rewritable memory according to a first exemplary embodiment of the present invention; 6 shows a second example of the architecture of a module for isolating and testing a rewritable memory according to the present invention; FIG. 7 shows a timing diagram of signals used by a module for isolating and testing a rewritable memory according to a second exemplary embodiment of the present invention; FIG. 8 shows a third example of the architecture of a module for isolating and testing a rewritable memory according to the present invention; 9 shows a timing diagram of signals used by a module for isolating and testing a rewritable memory according to a third exemplary embodiment of the present invention; Fig. 10 shows an example of an algorithm according to the present invention.
300:控制模組 300: control module
310:用於隔離及測試可重寫記憶體的模組 310:Module for isolating and testing rewritable memory
320:邏輯閘及正反器 320:Logic gate and flip-flop
CI:積體電路 CI: integrated circuit
Clk:外部時脈 Clk: external clock
Cp1a:探針 Cp1a:probe
Cp1b:探針 Cp1b:probe
Do:信號 Do: signal
Eq1:信號 Eq1: signal
Eq2:信號 Eq2: Signal
Sch:信號 Sch: signal
ScMo:信號 ScMo: signal
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TW201809710A (en) * | 2016-08-05 | 2018-03-16 | 國立成功大學 | Automatic-test architecture of integrated circuit capable of storing test data in scan chains and method thereof |
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