TWI797130B - Additive manufacturing systems and methods of fabricating polishing pads using the same - Google Patents

Additive manufacturing systems and methods of fabricating polishing pads using the same Download PDF

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TWI797130B
TWI797130B TW107117867A TW107117867A TWI797130B TW I797130 B TWI797130 B TW I797130B TW 107117867 A TW107117867 A TW 107117867A TW 107117867 A TW107117867 A TW 107117867A TW I797130 B TWI797130 B TW I797130B
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polishing pad
continuous layers
polishing
layer
layers
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TW201900426A (en
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丹尼爾 瑞特法德
家祥 馮
麻由費利西亞 山村
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美商應用材料股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Abstract

Data indicative of a desired shape of the polishing pad to be fabricated by droplet ejection by the additive manufacturing system is received. The data includes a desired shape defining a desired profile including a polishing surface having one or more partitions separated by one or more grooves on the polishing pad. Data indicative of distortions from the desired profile caused by dispensing of layers by droplet ejection by the additive manufacturing system is generated. Data indicative of an initial layer to dispense by droplet ejection is generated to at least partially compensate for the distortions from the desired profile. The initial layer is dispensed on a support by droplet ejection. Overlying layers are dispensed on the initial layer by droplet ejection by the additive manufacturing system to form the polishing pad.

Description

積層製造系統及使用其製造拋光墊的方法 Additive manufacturing system and method of manufacturing polishing pad using same

本說明書關於積層製造，特別是化學機械拋光墊的積層製造。 This specification is about additive manufacturing, and in particular additive manufacturing of chemical mechanical polishing pads.

通常藉由在矽晶圓上順序沉積導電，半導電或絕緣層來在基板上形成積體電路。各種製造處理需要在基板上的層的平面化。對於某些應用而言(如，拋光金屬層以在圖案化層的溝槽中形成通孔、插塞和線)，將覆蓋層平坦化直到圖案化層的頂表面曝露。在其它應用中(如，用於光刻的介電層的平面化)，覆蓋層被拋光直到期望厚度保留在下面的層之上。 Integrated circuits are typically formed on a substrate by sequentially depositing conductive, semiconductive or insulating layers on a silicon wafer. Various fabrication processes require planarization of layers on a substrate. For some applications (eg, polishing the metal layer to form vias, plugs, and lines in trenches in the patterned layer), the cover layer is planarized until the top surface of the patterned layer is exposed. In other applications (eg, planarization of dielectric layers for lithography), the capping layer is polished until a desired thickness remains above the underlying layer.

化學機械拋光(CMP)是一種公認的平面化方法。此種平面化方法通常要求基板被安裝在載體頭上。基板的曝露表面通常抵靠著旋轉的拋光墊而放置。載體頭在基板上提供可控負載，以將其推抵靠在拋光墊上。通常將拋光液(諸如具有磨粒的漿液)供應到拋光墊的表面。 Chemical mechanical polishing (CMP) is a well-established planarization method. Such planarization methods typically require the substrate to be mounted on a carrier head. The exposed surface of the substrate is typically placed against a rotating polishing pad. The carrier head provides a controlled load on the substrate to push it against the polishing pad. A polishing fluid, such as a slurry with abrasive particles, is typically supplied to the surface of the polishing pad.

化學機械拋光處理的一個目標是拋光均勻性。若基板上的不同區域以不同的速率拋光，則基板的一些區域可能會有太多的材料被移除(「過度拋光」)或太少的材料被移除（「欠拋光」）。除了平面化之外，拋光墊可用於諸如磨光（buffing）的修整操作。One goal of a chemical mechanical polishing process is polishing uniformity. If different areas on the substrate are polished at different rates, some areas of the substrate may have too much material removed ("overpolished") or too little material removed ("underpolished"). In addition to planarization, polishing pads can be used for conditioning operations such as buffing.

拋光墊通常藉由模製，鑄造或燒結聚氨酯材料而製成。在模製的情況下，拋光墊可一次製成一個，如藉由注入成型。在鑄造的情況下，將液體前驅物鑄造並固化成塊狀物，隨後將其切成單獨的墊片。接著可將此等墊片加工成最終厚度。凹槽可加工到拋光表面中，或可形成為注入成型處理的一部分。Polishing pads are usually made by molding, casting or sintering polyurethane materials. In the case of molding, the polishing pads can be made one at a time, such as by injection molding. In the case of casting, a liquid precursor is cast and solidified into a block, which is subsequently cut into individual pads. These shims can then be machined to their final thickness. Grooves can be machined into the polished surface, or can be formed as part of an injection molding process.

本揭露書描述了具有積層製造系統的製造拋光墊。This disclosure describes manufacturing polishing pads with an additive manufacturing system.

在一個態樣中，一種使用積層製造系統製造拋光墊的方法包括以下步驟：接收指示由積層製造系統藉由液滴噴射而製造的拋光墊的期望形狀的數據。數據包括界定期望輪廓的期望形狀，期望輪廓包括具有由拋光墊上的一或多個凹槽而分開的一或多個分隔部的拋光表面。產生指示由積層製造系統藉由液滴噴射而分配層所導致的期望輪廓的失真的數據。產生指示由液滴噴射分配的初始層的數據，以至少部分地補償來自期望輪廓的失真。初始層藉由液滴噴射而分配在支撐件上。由積層製造系統藉由液滴噴射將覆蓋層分配在初始層上，以形成拋光墊。In one aspect, a method of manufacturing a polishing pad using an additive manufacturing system includes receiving data indicative of a desired shape of a polishing pad manufactured by droplet ejection by the additive manufacturing system. The data includes a desired shape defining a desired profile including a polishing surface having one or more partitions separated by one or more grooves on the polishing pad. Data is generated indicative of a distortion of a desired profile caused by the additive manufacturing system dispensing layers by drop ejection. Data indicative of the initial layer dispensed by the droplet ejection is generated to at least partially compensate for distortion from the desired profile. The initial layer is dispensed on the support by droplet ejection. The coating layer is dispensed on the initial layer by droplet jetting by an additive manufacturing system to form a polishing pad.

實現可包括以下特徵的一或多個。Implementations may include one or more of the following features.

拋光墊可包括初始層。拋光墊可包括支撐件。拋光墊可從支撐件移除。失真可包括預期相對於期望輪廓較薄的區域。初始層可包括對應於區域的體素，如，由對應於區域的體素組成。區域可對應於一或多個分隔部的邊緣。The polishing pad can include an initial layer. The polishing pad can include a support. The polishing pad is removable from the support. Distortions may include regions that are expected to be thinner relative to the desired profile. The initial layer may include, eg, consist of voxels corresponding to the region. A region may correspond to an edge of one or more partitions.

初始層可對應於分隔部的邊緣，且分配複數個覆蓋層可覆蓋初始層的至少一部分並填充在邊緣之間的區域。分配初始層之步驟可包括分配第一成分的第一材料，且分配複數個覆蓋層之步驟包括分配不同的第二成分的第二材料。初始層可為分隔部的底層。The initial layer may correspond to edges of the partition, and assigning a plurality of covering layers may cover at least a portion of the initial layer and fill an area between the edges. The step of dispensing an initial layer may comprise dispensing a first material of a first composition, and the step of dispensing a plurality of cover layers comprises dispensing a second material of a different second composition. The initial layer may be the bottom layer of the partition.

在另一態樣中，一種電腦程式產品可包括電腦可讀介質，電腦可讀介質編碼有指令，以使得一或多個處理器：接收指示由積層製造系統藉由液滴噴射而製造的拋光墊的期望形狀的數據，期望形狀界定期望輪廓，期望輪廓包括具有由拋光墊上的一或多個凹槽而分開的一或多個分隔部的拋光表面；產生指示由積層製造系統藉由液滴噴射而分配複數個層所導致的期望輪廓的失真的數據；產生指示藉由液滴噴射分配的初始層的數據，以至少部分地補償來自期望輪廓的失真；使得積層製造系統藉由液滴噴射將初始層分配在支撐件上；及使得積層製造系統藉由積層製造系統的液滴噴射而分配複數個覆蓋層在初始層上，以形成拋光墊。In another aspect, a computer program product may include a computer-readable medium encoded with instructions to cause one or more processors to: receive instructions indicating a polishing process to be produced by droplet ejection by an additive manufacturing system data of a desired shape of the pad, the desired shape defining a desired profile comprising a polishing surface having one or more partitions separated by one or more grooves in the polishing pad; generating indications by an additive manufacturing system via droplet dispensing data of a desired profile resulting from dispensing a plurality of layers by jetting; generating data indicative of an initial layer dispensed by droplet jetting to at least partially compensate for distortion from the desired profile; enabling an additive manufacturing system to be distorted by droplet jetting Distributing the initial layer on the support; and causing the additive manufacturing system to distribute a plurality of covering layers on the initial layer by the droplet spraying of the additive manufacturing system to form a polishing pad.

實現可能包括以下特徵的一或多個。Implementations may include one or more of the following features.

用以產生指示失真的數據的指令可包括用以識別預期相對於期望輪廓較薄的區域的指令。用以產生指示初始層的數據的指令可包括用以將對應於區域的體素指定給初始層的指令。The instructions to generate data indicative of distortion may include instructions to identify regions that are expected to be thinner relative to an expected profile. The instructions to generate data indicative of the initial layer may include instructions to assign voxels corresponding to the region to the initial layer.

在另一態樣中，一種積層製造系統包括支撐件、經配置以藉由液滴噴射將進料材料的複數層輸送到支撐件上的分配器及控制器。控制器經配置以接收指示藉由液滴噴射而製造的物體的期望形狀的數據，期望形狀界定期望輪廓，期望輪廓包括具有由一或多個凹部所分開的一或多個凸起部分的表面；產生指示由藉由積層製造系統的液滴噴射而分配複數個層所導致的期望輪廓的失真的數據；產生指示由分配器藉由液滴噴射分配的初始層的數據，以至少部分地補償來自期望輪廓的失真；使得分配器藉由液滴噴射將初始層分配在支撐件上；及使得分配器藉由積層製造系統的液滴噴射而分配複數個覆蓋層在初始層上，以形成物體。In another aspect, an additive manufacturing system includes a support, a dispenser configured to deliver a plurality of layers of feed material onto the support by droplet ejection, and a controller. The controller is configured to receive data indicative of a desired shape of an object fabricated by droplet ejection, the desired shape defining a desired profile comprising a surface having one or more raised portions separated by one or more recesses generating data indicative of the distortion of the desired profile caused by dispensing the plurality of layers by droplet ejection of the additive manufacturing system; generating data indicative of the initial layer dispensed by the dispenser by droplet ejection to at least partially compensate Distortion from the desired profile; causing the dispenser to dispense the initial layer on the support by droplet ejection; and causing the dispenser to dispense a plurality of covering layers on the initial layer by droplet ejection of an additive manufacturing system to form an object .

實現可能包括以下特徵的一或多個。Implementations may include one or more of the following features.

控制器可經配置以藉由識別預期相對於期望輪廓較薄的區域而產生指示失真的數據。控制器可經配置以藉由將對應於區域的體素指定給初始層而產生指示初始層的數據。The controller may be configured to generate data indicative of distortion by identifying regions that are expected to be thinner relative to an expected profile. The controller may be configured to generate data indicative of the initial layer by assigning voxels corresponding to the region to the initial layer.

分配器可包括第一噴嘴和第二噴嘴，第一噴嘴經配置以輸送具有第一成分的第一材料，以及第二噴嘴經配置以輸送具有不同的第二成分的第二材料。控制器可經配置以使得分配器輸送第一材料以形成初始層並輸送第二材料以形成複數個覆蓋層。分配器可包括經配置以在支撐件之上橫向移動的複數個噴嘴。The dispenser may include a first nozzle configured to deliver a first material having a first composition and a second nozzle configured to deliver a second material having a second, different composition. The controller may be configured such that the dispenser delivers the first material to form the initial layer and the second material to form the plurality of cover layers. The dispenser may include a plurality of nozzles configured to move laterally over the support.

在另一態樣中，一種使用積層製造系統製造物體的方法包括以下步驟：接收指示由積層製造系統藉由液滴噴射而製造的物體的期望形狀的數據，期望形狀界定期望輪廓，期望輪廓包括具有藉由一或多個凹部所分開的一或多個突起的表面；產生指示由積層製造系統藉由液滴噴射分配複數個層導致的期望輪廓的失真的數據；產生指示藉由液滴噴射分配的初始層的數據，以至少部分地補償來自期望輪廓的失真；藉由液滴噴射將初始層分配在支撐件上；及由積層製造系統藉由液滴噴射而分配複數個覆蓋層在初始層上，以形成物體。In another aspect, a method of manufacturing an object using an additive manufacturing system includes the step of receiving data indicative of a desired shape of an object manufactured by the additive manufacturing system by droplet ejection, the desired shape defining a desired profile, the desired profile comprising A surface having one or more protrusions separated by one or more recesses; generating data indicative of a distortion of a desired profile caused by an additive manufacturing system dispensing a plurality of layers by droplet ejection; generating data indicative of a distortion by droplet ejection Distributed initial layer data to at least partially compensate for distortion from the desired profile; Distribute the initial layer on the support by droplet jetting; and Distribute a plurality of cover layers by droplet jetting at the initial layers to form objects.

在另一態樣中，一種使用積層製造系統製造拋光墊的方法包括以下步驟：藉由液滴噴射沉積連續層，以形成拋光墊。拋光墊包括拋光表面，拋光表面具有由一或多個凹槽分開的一或多個分隔部。沉積連續層的一層之步驟包括藉由第一液滴噴射處理而分配對應於一或多個分隔部的邊緣的第一區域。在固化第一區域之後，藉由不同的第二液滴噴射處理在邊緣之間分配對應於一或多個分隔部的內部的第二區域。In another aspect, a method of manufacturing a polishing pad using an additive manufacturing system includes depositing successive layers by droplet jetting to form the polishing pad. The polishing pad includes a polishing surface having one or more partitions separated by one or more grooves. The step of depositing one layer of the continuous layer includes allocating, by a first droplet ejection process, a first area corresponding to an edge of the one or more partitions. After curing the first region, a second region corresponding to the interior of the one or more partitions is distributed between the edges by a second, different droplet ejection process.

實現可能包括以下特徵的一或多個。第一液滴噴射處理可包括第一聚合物且第二液滴噴射處理可包括具有不同成分的第二聚合物。第一液滴噴射處理可包括第一固化輻射，且第二液滴噴射處理可包括第二固化輻射，第二固化輻射比第一固化輻射更慢地固化層。第一固化輻射和第二固化輻射可處於不同的波長。第一固化輻射可具有比第二固化輻射更高的強度。不必將液滴噴射到對應於凹槽的區域中。Implementations may include one or more of the following features. The first drop ejection process may include a first polymer and the second drop ejection process may include a second polymer having a different composition. The first drop ejection process may include a first curing radiation and the second drop ejection process may include a second curing radiation that cures the layer more slowly than the first curing radiation. The first curing radiation and the second curing radiation may be at different wavelengths. The first curing radiation may have a higher intensity than the second curing radiation. It is not necessary to eject liquid droplets into the areas corresponding to the grooves.

在另一態樣中，一種使用積層製造系統製造拋光墊的方法包括以下步驟：藉由液滴噴射將第一組連續層沉積到支撐件上。沉積第一組連續層之步驟包括將拋光墊前驅物分配至對應於拋光墊的分隔部的第一區域，並將犧牲材料分配至對應於拋光墊的凹槽的第二區域。第二組連續層藉由液滴噴射而沉積在第一組連續層之上。第二組連續層對應於拋光墊的下部。第一組連續層和第二組連續層提供主體。主體從支撐件上移除。從主體移除犧牲材料為拋光墊提供拋光表面，拋光表面具有由凹槽分離的分隔部。In another aspect, a method of manufacturing a polishing pad using an additive manufacturing system includes depositing a first set of successive layers onto a support by droplet jetting. Depositing the first set of successive layers includes dispensing a polishing pad precursor to a first region corresponding to the partitions of the polishing pad, and dispensing a sacrificial material to a second region corresponding to the grooves of the polishing pad. A second set of continuous layers is deposited over the first set of continuous layers by droplet ejection. The second set of consecutive layers corresponds to the lower portion of the polishing pad. The first set of successive layers and the second set of successive layers provide the body. The body is removed from the support. Removing the sacrificial material from the body provides a polishing pad with a polishing surface having partitions separated by grooves.

實現可能包括以下特徵的一或多個。沉積第二組連續層之步驟可包括分配拋光墊前驅物。第二組連續層可對應於拋光層的下部。第三組連續層可藉由液滴噴射而沉積在第二組連續層之上。第三組連續層可具有與第二組連續層不同的成分。第二組連續層可對應於拋光層的子墊。第二組連續層可跨越第一區域和第二區域兩者。Implementations may include one or more of the following features. The step of depositing a second set of successive layers may include dispensing a polishing pad precursor. The second set of continuous layers may correspond to the lower portion of the polishing layer. A third set of continuous layers can be deposited over the second set of continuous layers by droplet spraying. The third set of continuous layers may have a different composition than the second set of continuous layers. The second set of consecutive layers may correspond to subpads of the polishing layer. The second set of continuous layers may span both the first region and the second region.

前述的優點可包括（但不限於）以下。拋光墊的幾何形狀可更精確地控制，從而改善拋光墊的拋光效率。此外，藉由調整積層製造設備用以形成製品（如，拋光墊）的數據而不是在最初形成物品之後移除材料，校正輪廓可補償潛在的失真。可減少由積層製造設備形成製品之後的製品的後處理量。結果，可減少進料浪費的量，並可增加產出和產量。可消除對二次加工步驟的需求。當表面被移除並且凹槽深度減小時，拋光墊的漿料捕獲容積的變化可減小，從而改善晶圓對晶圓的均勻性。也可通過選擇性蝕刻處理而移除捕獲材料，以僅留下期望的材料，這在用於形成CMP窗口的光學透明材料和固定研磨的輥格式墊設計的情況下可能是有利的。The foregoing advantages may include (but are not limited to) the following. The geometry of the polishing pad can be more precisely controlled, thereby improving the polishing efficiency of the polishing pad. In addition, correcting the profile can compensate for potential distortions by adjusting the data that additive manufacturing equipment uses to form an article (eg, a polishing pad) rather than removing material after the article is initially formed. The amount of post-processing of the product after it is formed by the build-up manufacturing equipment can be reduced. As a result, the amount of wasted feed can be reduced, and output and throughput can be increased. The need for secondary processing steps can be eliminated. When the surface is removed and the groove depth is reduced, the variation in the slurry capture volume of the polishing pad can be reduced, thereby improving wafer-to-wafer uniformity. Capture material can also be removed by a selective etch process to leave only the desired material, which may be advantageous in the case of optically transparent materials used to form the CMP windows and fixed abrasive roll format pad designs.

在本說明書中描述的標的的一或多個實現的細節在附隨的圖式和下面的實施方式中闡述。從實施方式、圖式和申請專利範圍中，其他潛在的特徵、態樣和優點將變得顯而易見。Details of one or more implementations of the subject matter described in this specification are set forth in the accompanying drawings and the description below. Other potential features, aspects, and advantages will become apparent from the description, drawings, and claims.

可使用積層製造設備以形成拋光墊。積層製造設備可設置有初始圖案，以分配進料進料材料。初始圖案對應於待形成的拋光墊的期望形狀。遺憾的是，當拋光墊由使用初始圖案的積層製造設備而形成時，拋光墊的實際形狀可能包括相對於拋光墊的期望形狀的失真。然而，可使用幾種技術來補償此種失真。Additive manufacturing equipment can be used to form the polishing pad. Additive manufacturing equipment may be provided with an initial pattern to dispense incoming feed material. The initial pattern corresponds to the desired shape of the polishing pad to be formed. Unfortunately, when the polishing pad is formed by additive manufacturing equipment using an initial pattern, the actual shape of the polishing pad may include distortions relative to the desired shape of the polishing pad. However, several techniques can be used to compensate for this distortion.

提供給積層製造設備的初始圖案可藉由校正輪廓來修改以產生修改圖案，以至少部分地補償此等失真。使用修改圖案而形成的所得形狀可因此更接近地匹配拋光墊的期望形狀。修改圖案可包括附加層沉積於上的初始層。The initial pattern provided to the additive manufacturing device can be modified by the correction profile to produce a modified pattern to at least partially compensate for these distortions. The resulting shape formed using the modified pattern can thus more closely match the desired shape of the polishing pad. Modifying the pattern may include the initial layer upon which additional layers are deposited.

對應於分隔部的邊緣的拋光墊的部分可藉由與分隔部的中心不同的技術來沉積，（如）以提供改進的側壁的垂直度。The portion of the polishing pad corresponding to the edge of the divider may be deposited by a different technique than the center of the divider, eg, to provide improved verticality of the sidewalls.

可沉積犧牲材料，且墊的層可沉積在犧牲層之間和之上。接著可移除此犧牲材料以提供凹槽、表面紋理以減少磨合時間，並且以卷對卷的形式製造拋光墊。Sacrificial material can be deposited, and layers of pads can be deposited between and over the sacrificial layers. This sacrificial material can then be removed to provide grooves, surface texture to reduce break-in time, and the polishing pad to be manufactured in a roll-to-roll fashion.

現在轉到第1圖，拋光系統100包括可用以拋光一或多個基板104的拋光墊102。拋光系統100可包括可旋轉的台板106，拋光墊102放置在可旋轉的台板106上。在拋光步驟期間，可藉由漿料供應埠或組合的漿料/漂洗臂110將拋光液體108（如，拋光漿料）供應到拋光墊102的拋光表面103。拋光液體108可含有拋光顆粒， pH調節劑，或化學活性組分。Turning now to FIG. 1 , a polishing system 100 includes a polishing pad 102 operable to polish one or more substrates 104 . The polishing system 100 can include a rotatable platen 106 on which the polishing pad 102 is placed. During a polishing step, a polishing liquid 108 (eg, polishing slurry) may be supplied to the polishing surface 103 of the polishing pad 102 via a slurry supply port or a combined slurry/rinse arm 110 . The polishing liquid 108 may contain polishing particles, pH adjusters, or chemically active components.

基板104藉由載體頭112保持抵靠於拋光墊102。載體頭112懸掛在諸如圓盤輸送帶的支撐結構上，並藉由載體驅動軸114而連接到載體頭旋轉馬達，使得載體頭可繞軸線116旋轉。拋光墊102和基板104在拋光液體108存在下的相對運動導致基板104的拋光。The substrate 104 is held against the polishing pad 102 by the carrier head 112 . The carrier head 112 is suspended from a support structure, such as a carousel, and is connected by a carrier drive shaft 114 to a carrier head rotation motor such that the carrier head is rotatable about an axis 116 . The relative movement of polishing pad 102 and substrate 104 in the presence of polishing liquid 108 results in polishing of substrate 104 .

參照第2圖，在一些實例中，可使用分配進料材料的連續層的積層製造設備120來形成拋光墊102。參照第1和2圖，操作積層製造設備120以至少形成拋光墊102的拋光層122。在製造處理中，逐漸分配和固化進料材料的薄層。例如，進料材料（如，拋光墊前驅物材料）的液滴124可從分配器128（如，液滴噴射印刷機）的噴嘴126噴出，以形成進料材料的層130。分配器128類似於噴墨印刷機，但使用進料材料來形成拋光墊102而不是墨水。Referring to FIG. 2, in some examples, the polishing pad 102 may be formed using an additive manufacturing apparatus 120 that dispenses successive layers of feed materials. Referring to FIGS. 1 and 2 , the build-up fabrication apparatus 120 is operated to form at least the polishing layer 122 of the polishing pad 102 . During the fabrication process, thin layers of feed material are gradually dispensed and solidified. For example, droplets 124 of a feed material (eg, polishing pad precursor material) may be ejected from nozzles 126 of a dispenser 128 (eg, a drop jet printer) to form a layer 130 of the feed material. Dispenser 128 is similar to an inkjet printer, but uses feed material to form polishing pad 102 instead of ink.

控制器129可操作以控制分配器128的分配操作，且若適用的話，使用諸如燈或雷射的能量源131來控制固化操作。噴嘴126越過支撐件134而平移（由箭頭A顯示）以在支撐件134上的構建區域的任何部分處分配進料材料。The controller 129 is operable to control the dispensing operation of the dispenser 128 and, if applicable, the curing operation using an energy source 131 such as a lamp or laser. Nozzle 126 translates across support 134 (shown by arrow A) to dispense feed material at any portion of the build area on support 134 .

在一些實現中，當噴嘴126平移越過支撐件134時，能量源131尾隨著噴嘴126，使得通過噴嘴126分配的進料材料可被立即固化。在一些實現中，當噴嘴126在第一掃描方向上平移越過支撐件134同時分配進料材料時，能量源131引導噴嘴126。當能量源131越過支撐件134掃描時（如，在與第一掃描方向相反的第二掃描方向上），能量源131可固化此分配的進料材料，從而提供進料材料額外的時間，以在曝露到能量源131的輻射之前達到穩定狀態。在一些實現中，當噴嘴126在第一掃描方向上平移越過支撐件134時，能量源131引導噴嘴126，且當能量源在第一掃描方向上掃描時，能量源131用以將分配的進料材料固化。因此，先前分配的進料材料的層幾乎可在另一層通過噴嘴126分配之前立即被固化。在一些實現中，存在有多個能量源，具有尾隨著噴嘴126的能量源131和引導噴嘴126的能量源131。 In some implementations, energy source 131 trails nozzle 126 as it translates across support 134 such that feed material dispensed through nozzle 126 may be immediately cured. In some implementations, the energy source 131 directs the nozzle 126 as the nozzle 126 translates across the support 134 in the first scan direction while dispensing the feed material. As the energy source 131 scans across the support 134 (e.g., in a second scan direction opposite the first scan direction), the energy source 131 can cure the dispensed feed material, thereby providing the feed material additional time to A steady state is reached prior to exposure to radiation from the energy source 131 . In some implementations, the energy source 131 directs the nozzle 126 as the nozzle 126 translates across the support 134 in the first scan direction, and the energy source 131 is used to direct the dispensed process as the energy source scans in the first scan direction. The material solidifies. Thus, a previously dispensed layer of feed material may be cured almost immediately before another layer is dispensed through nozzle 126 . In some implementations, there are multiple energy sources, with energy source 131 trailing nozzle 126 and energy source 131 leading nozzle 126 .

對於沉積的第一層130a而言，噴嘴126可將進料材料噴射到支撐件134上。對於隨後沉積的層130b而言，噴嘴126可噴射到已經固化的進料材料132上。在每個層130固化之後，新層接著沉積在先前沉積的層之上，直到製造完整的三維拋光層122。每個層由噴嘴126以儲存在電腦上運行的3D繪圖電腦程式中的圖案而施加。每個層130小於拋光層122的總厚度的50%，如，小於10%，如，小於5%，如，小於1%。 For the deposited first layer 130 a , the nozzle 126 may spray the feed material onto the support 134 . For a subsequently deposited layer 130b, nozzle 126 may spray onto feed material 132 that has solidified. After each layer 130 is cured, new layers are then deposited on top of the previously deposited layers until the complete three-dimensional polishing layer 122 is produced. Each layer is applied by nozzle 126 in a pattern stored in a 3D graphics computer program running on a computer. Each layer 130 is less than 50%, such as less than 10%, such as less than 5%, such as less than 1%, of the total thickness of polishing layer 122.

拋光層122可形成在支撐件134上。在一些實例中，支撐件134包括剛性基座，或包括撓性膜，如，聚四氟乙烯(PTFE)層。若支撐件134包括撓性膜，則支撐件134形成拋光墊102的一部分。例如，支撐件134可包括拋光墊102的背襯層136(第1圖所示)或位於背襯層和拋光層122之間的層。若支撐件134包括拋光墊102的背襯層136，則在拋光墊102的製造完成之後，支撐件134不會從拋光墊102移除。參照第1圖，拋光墊102被安裝到拋光系統100，其中背襯層136(如，支撐件134)面向可旋轉台板106。 The polishing layer 122 may be formed on the support 134 . In some examples, support 134 includes a rigid base, or includes a flexible membrane, such as a layer of polytetrafluoroethylene (PTFE). If support 134 comprises a flexible membrane, support 134 forms part of polishing pad 102 . For example, support 134 may include backing layer 136 (shown in FIG. 1 ) of polishing pad 102 or a layer positioned between the backing layer and polishing layer 122 . If support 134 includes backing layer 136 of polishing pad 102 , support 134 is not removed from polishing pad 102 after fabrication of polishing pad 102 is complete. Referring to FIG. 1 , polishing pad 102 is mounted to polishing system 100 with backing layer 136 (eg, support 134 ) facing rotatable platen 106 .

若支撐件134不包括拋光墊102的背襯層136，則可在拋光墊102的製造完成之後將拋光層122從支撐件134移除。在一些實現中，支撐件134可包括被保護膜覆蓋的剛性基座。拋光墊102可製造在保護膜上。此後，可在剛性基座上更換保護膜，並在新保護膜上製造新的拋光墊。保護膜可從拋光墊上移除，如，當拋光墊被移除時，保護膜可保留在剛性基座上，或保護膜可從剛性基座分離，並接著從拋光墊上剝離。If support 134 does not include backing layer 136 of polishing pad 102 , polishing layer 122 may be removed from support 134 after fabrication of polishing pad 102 is complete. In some implementations, the support 134 can include a rigid base covered by a protective film. The polishing pad 102 can be fabricated on the protective film. Thereafter, the protective film can be replaced on the rigid base and a new polishing pad fabricated on the new protective film. The protective film can be removed from the polishing pad, eg, the protective film can remain on the rigid base when the polishing pad is removed, or the protective film can be detached from the rigid base and then peeled off the polishing pad.

進料材料的層130的固化可藉由聚合來完成。例如，進料材料的層130可為單體，且單體可藉由紫外線（UV）固化而原位聚合。進料材料可在沉積後立即有效固化，或可沉積墊前驅物材料的整個層130，並接著整個層130同時固化。替代地，液滴124可為在冷卻時固化的聚合物熔體。在另一實現中，設備120藉由散佈粉末層並將黏合劑材料的液滴噴射到粉末層上來產生拋光層122。在這種情況下，粉末可包括積層劑，如，磨粒。Curing of the layer 130 of feed material may be accomplished by polymerization. For example, the layer 130 of feed material can be a monomer, and the monomer can be polymerized in situ by ultraviolet (UV) curing. The feed material can be effectively cured immediately after deposition, or the entire layer 130 of the pad precursor material can be deposited, and then the entire layer 130 is cured simultaneously. Alternatively, droplets 124 may be a polymer melt that solidifies upon cooling. In another implementation, apparatus 120 produces polishing layer 122 by spreading a powder layer and spraying droplets of a binder material onto the powder layer. In this case, the powder may include a layering agent, such as abrasive grains.

在一些實現中，背襯層136也可藉由3D印刷處理而製造。例如，背襯層136和拋光層122可由設備120以不間斷的操作而製造。藉由使用不同的固化量（如，不同強度的紫外線輻射），或使用不同的材料，可向背襯層136提供不同於拋光層122的硬度。在其它實現中，背襯層136藉由傳統處理而製造，並接著固定到拋光層122。例如，拋光層122可藉由薄的黏合劑層（如，作為壓敏黏合劑）而固定到背襯層136。In some implementations, the backing layer 136 can also be fabricated by a 3D printing process. For example, backing layer 136 and polishing layer 122 may be fabricated by apparatus 120 in uninterrupted operation. Backing layer 136 may be provided with a different hardness than polishing layer 122 by using a different amount of curing (eg, a different intensity of ultraviolet radiation), or by using a different material. In other implementations, backing layer 136 is fabricated by conventional processing and then secured to polishing layer 122 . For example, polishing layer 122 may be secured to backing layer 136 by a thin layer of adhesive (eg, as a pressure sensitive adhesive).

在一些實現中，參照第2、3A和3B圖，當形成拋光層122時，設備120可選擇性地分配及/或選擇性地固化進料材料的一部分，以在拋光層122中形成凹槽138。凹槽138可承載拋光液體108 （顯示於第1圖中）。凹槽138可具有幾乎任何圖案，諸如同心圓、直線、交叉影線、螺旋及類似者。假設存在凹槽，在凹槽138之間的分隔部140界定拋光表面103。拋光表面103（如，包括在凹槽138之間的分隔部140）可為拋光墊102的總水平表面積的約25-90％（如，70-90％）。因此，凹槽138可佔據拋光墊102的總水平表面積的10％-75％（如，10-30％）。在凹槽138之間的分隔部可具有約0.1至2.5mm的橫向寬度。In some implementations, referring to Figures 2, 3A and 3B, when forming the polishing layer 122, the apparatus 120 can selectively dispense and/or selectively solidify a portion of the feed material to form grooves in the polishing layer 122 138. Recess 138 can hold polishing liquid 108 (shown in FIG. 1 ). The grooves 138 may have almost any pattern, such as concentric circles, straight lines, cross-hatching, spirals, and the like. Given the presence of grooves, the partitions 140 between the grooves 138 define the polishing surface 103 . Polishing surface 103 (eg, including dividers 140 between grooves 138 ) may be about 25-90% (eg, 70-90%) of the total horizontal surface area of polishing pad 102 . Accordingly, grooves 138 may occupy 10%-75% (eg, 10-30%) of the total horizontal surface area of polishing pad 102 . The partitions between the grooves 138 may have a lateral width of about 0.1 to 2.5 mm.

參照第3A和3B圖所示的實例，在一些實現中，凹槽138包括同心圓形凹槽。這些凹槽138可以間距P而均勻地間隔開。間距P是在相鄰凹槽138之間的徑向距離。在凹槽138之間的分隔部140具有寬度Wp 。每個凹槽138由側壁142界定，側壁142從凹槽138的底表面144延伸並終止於拋光表面103處，如，在分隔部140處。每個凹槽138可具有深度Dg 和寬度Wg 。Referring to the example shown in FIGS. 3A and 3B , in some implementations, grooves 138 comprise concentric circular grooves. The grooves 138 may be evenly spaced at a pitch P. Pitch P is the radial distance between adjacent grooves 138 . The partitions 140 between the grooves 138 have a width Wp . Each groove 138 is bounded by a sidewall 142 extending from a bottom surface 144 of groove 138 and terminating at polishing surface 103 , eg, at partition 140 . Each groove 138 may have a depth D g and a width W g .

側壁142可從拋光表面103向下延伸且大致垂直於拋光表面103。在這方面，側壁基本上垂直於分配在支撐件134上的進料材料的層130。此外，分隔部140基本平行地延伸到分配在支撐件134上的進料材料的層130。The sidewall 142 may extend downward from the polishing surface 103 and be substantially perpendicular to the polishing surface 103 . In this respect, the side walls are substantially perpendicular to the layer 130 of feed material dispensed on the support 134 . Furthermore, the partition 140 extends substantially parallel to the layer 130 of feed material distributed on the support 134 .

每個拋光週期導致拋光墊102的磨損，通常以當拋光表面103磨耗時使拋光墊102變薄的形式。具有基本上垂直的側壁142的凹槽的寬度Wg 不會隨著拋光墊磨損而改變。因此，大致垂直的側壁142確保拋光墊102在其操作壽命期間具有基本均勻的表面積。如於此所述，用以形成拋光墊102的製造處理可包括補償操作，以防止拋光表面103為非平面的，如，用以確保拋光表面103的平面性或平坦性，並用以製造如垂直於拋光表面103的側壁142。Each polishing cycle results in wear of the polishing pad 102, typically in the form of thinning the polishing pad 102 as the polishing surface 103 wears away. The width W g of the grooves with substantially vertical sidewalls 142 does not change as the polishing pad wears. Thus, the substantially vertical sidewalls 142 ensure that the polishing pad 102 has a substantially uniform surface area over its operational life. As described herein, the manufacturing process used to form polishing pad 102 may include compensating operations to prevent polishing surface 103 from being non-planar, e.g., to ensure planarity or flatness of polishing surface 103, and to on the sidewall 142 of the polishing surface 103 .

凹槽138可具有約0.34mm的最小寬度Wg 。每個凹槽138可具有在0.34mm與2.71mm之間的寬度Wg ，如，在約0.38mm與1.02mm之間。具體而言，凹槽138可具有大約0.51mm或0.68mm的寬度Wg 。在凹槽138之間的間距P可在約0.68和6.10mm之間，如，在約2.29mm和5.40mm之間。具體而言，間距可為大約2.03或3.05mm。在凹槽138之間的每個分隔部140可具有至少0.34mm的寬度Wp 。凹槽寬度Wg 與分隔部寬度Wp 的比例可選擇在約0.10和0.4之間。該比例可為大約0.2或0.3。Groove 138 may have a minimum width W g of about 0.34 mm. Each groove 138 may have a width W g of between 0.34 mm and 2.71 mm, eg, between about 0.38 mm and 1.02 mm. Specifically, groove 138 may have a width W g of approximately 0.51 mm or 0.68 mm. The pitch P between grooves 138 may be between about 0.68 and 6.10 mm, eg, between about 2.29 mm and 5.40 mm. Specifically, the pitch may be approximately 2.03 or 3.05 mm. Each partition 140 between grooves 138 may have a width W p of at least 0.34 mm. The ratio of the groove width W g to the partition width W p can be selected between approximately 0.10 and 0.4. This ratio may be about 0.2 or 0.3.

在一些實現中，若拋光墊102包括背襯層136，則凹槽138可完全延伸穿過拋光層122。在一些實現中，凹槽138可延伸穿過拋光層122的厚度約20-80％，如40％。凹槽138的深度Dg 可為0.25至1mm。拋光層122可具有在約1mm與3mm之間的厚度T。應該選擇厚度T，使得在凹槽138的底表面144和背襯層136之間的距離Dp 在約0.5mm和4mm之間。具體而言，距離Dp 可為約1或2mm。In some implementations, grooves 138 may extend completely through polishing layer 122 if polishing pad 102 includes backing layer 136 . In some implementations, grooves 138 may extend about 20-80%, such as 40%, through the thickness of polishing layer 122 . The depth D g of the groove 138 may be 0.25 to 1 mm. The polishing layer 122 may have a thickness T of between about 1 mm and 3 mm. The thickness T should be selected such that the distance D p between the bottom surface 144 of the groove 138 and the backing layer 136 is between about 0.5 mm and 4 mm. Specifically, the distance D p may be about 1 or 2 mm.

參照第4圖，顯示了用以形成拋光墊102的製造處理200。例如，包括控制器129的積層製造設備120可執行製造處理200的操作。Referring to FIG. 4 , a fabrication process 200 for forming the polishing pad 102 is shown. For example, additive manufacturing facility 120 including controller 129 may perform the operations of manufacturing process 200 .

接收指示待製造的拋光墊102的期望形狀的數據（202）。指示形狀的數據（包括指示期望形狀的數據）可由二維或三維位圖來界定。例如，每個位元可指示材料是否應該存在於物體中的對應體素中。在一些實現中，形狀數據包括表示電腦輔助設計（CAD）模型的數據。例如，若形狀數據對應於指示期望形狀的數據，則CAD模型可表示待製造的拋光墊102。Data indicative of a desired shape of the polishing pad 102 to be manufactured is received ( 202 ). Data indicative of a shape, including data indicative of a desired shape, may be defined by a two-dimensional or three-dimensional bitmap. For example, each bit may indicate whether material should be present in the corresponding voxel in the object. In some implementations, the shape data includes data representing a computer-aided design (CAD) model. For example, a CAD model may represent polishing pad 102 to be manufactured if the shape data corresponds to data indicative of a desired shape.

在一些實例中，參照第5圖，期望形狀包括期望特徵300。當積層製造設備120形成期望形狀時，沒有指示期望形狀的數據的進一步操縱，如，分配進料材料並固化或允許進料材料固化，以形成期望形狀，可基於指示包括期望特徵300的期望形狀的數據來形成實際特徵310。例如，為了形成矩形的期望特徵300，控制分配器128以分配平行的進料材料的層130。對於每一層而言，固化具有與矩形的期望特徵300的寬度相對應的具有均勻寬度的進料材料的選定部分。藉由簡單地不將任何進料材料分配到物體（如，拋光墊）上的相應區域中而可提供凹部（如，凹槽）。In some examples, referring to FIG. 5 , the desired shape includes a desired feature 300 . When the additive manufacturing apparatus 120 forms the desired shape, no further manipulation of the data indicative of the desired shape, e.g., dispensing feed material and curing or allowing the feed material to cure to form the desired shape, may be based on indicating the desired shape including the desired feature 300 data to form actual features 310 . For example, to form a rectangular desired feature 300, the dispenser 128 is controlled to dispense parallel layers 130 of feed material. For each layer, a selected portion of the feed material having a uniform width corresponding to the width of the rectangular desired feature 300 is cured. Recesses (eg, grooves) may be provided by simply not dispensing any feed material into corresponding areas on the object (eg, polishing pad).

在此分配和固化處理期間，進料材料的材料性質和積層製造設備120的沉積技術可能導致實際特徵310的邊緣變得非期望地被倒圓或倒角。具體而言，若根據基於指示期望形狀的數據而確定的原始圖案來分配進料材料的層130，則所得到的形狀包括如關於實際特徵310所描繪的倒圓或倒角。During this dispensing and curing process, the material properties of the feed material and the deposition technique of the build-up fabrication tool 120 may cause the edges of the actual features 310 to become undesirably rounded or chamfered. Specifically, if the layer 130 of feed material is dispensed according to an original pattern determined based on data indicative of the desired shape, the resulting shape includes rounding or chamfering as depicted with respect to the actual feature 310 .

例如，如第5圖所示，儘管期望特徵300的頂表面302是平面的，但實際特徵310的對應頂表面312是非平面的。由於頂表面312上的倒角效應，期望特徵300的橫向邊緣304a、304b具有比由積層製造設備120所形成的實際特徵的實際橫向邊緣314a、314b更大的長度。期望特徵300可對應於在凹槽138之間的分隔部140（顯示於第3A圖和第3B圖中）。在這方面，頂表面312上的倒圓或倒角效應可使得由分隔部140界定的拋光表面103變成非平面。不限於任何特定理論，噴射到先前沉積的層上的進料材料（如，液體墊前驅物材料）的液滴可（如，由於潤濕）而擴散並沿特徵300的側面向下流動，導致倒圓。For example, as shown in FIG. 5, although the top surface 302 of the desired feature 300 is planar, the corresponding top surface 312 of the actual feature 310 is non-planar. Due to the chamfer effect on the top surface 312 , it is desired that the lateral edges 304 a , 304 b of the feature 300 have a greater length than the actual lateral edges 314 a , 314 b of the actual feature formed by the build-up fabrication apparatus 120 . Desirable feature 300 may correspond to divider 140 (shown in FIGS. 3A and 3B ) between grooves 138 . In this regard, the rounding or chamfering effect on top surface 312 may cause polished surface 103 bounded by divider 140 to become non-planar. Without being bound by any particular theory, droplets of feed material (e.g., liquid pad precursor material) sprayed onto a previously deposited layer may spread (e.g., due to wetting) and flow down the sides of feature 300, resulting in rounded.

回頭參照第4圖，產生指示來自期望輪廓（由藉由積層製造系統的液滴噴射分配多層引起）的失真的數據（204）。也就是說，產生了預期的失真輪廓。為了減少倒圓或倒角效應（用預期的失真輪廓預測），可修改指示所需形狀的數據。在這方面，產生或接收指示分配進料材料以補償拋光墊失真的修改圖案的數據（206）。失真包括拋光墊102的拋光表面103的失真。在一些情況下，這些失真由積層製造設備120引起，如於此所述。修改後的圖案不同於分配進料材料的原始圖案，因為修改的圖案說明了實際特徵310相對於期望特徵的失真。在這方面，在一些實現中，基於在實際特徵310與期望特徵300之間的相對差異來確定指示修改圖案的數據。 Referring back to FIG. 4 , data indicative of distortion from a desired profile (caused by dispensing multiple layers by droplet jetting of an additive manufacturing system) is generated ( 204 ). That is, the expected distortion profile is produced. To reduce rounding or chamfering effects (predicted with expected distortion profiles), the data indicating the desired shape can be modified. In this regard, data indicative of a modified pattern for dispensing feed material to compensate for polishing pad distortion is generated or received (206). The distortion includes distortion of the polishing surface 103 of the polishing pad 102 . In some cases, these distortions are caused by additive manufacturing equipment 120, as described herein. The modified pattern differs from the original pattern from which the feed material was dispensed because the modified pattern accounts for the distortion of the actual features 310 relative to the desired features. In this regard, in some implementations, the data indicative of the modification pattern is determined based on the relative difference between the actual feature 310 and the desired feature 300 .

例如，如第6圖所示，指示修改形狀的數據包括指示修改特徵320的數據。即使期望特徵300的頂表面302是平面的，修改特徵320的頂表面322也是非平面的，以補償由原始圖案所形成的實際特徵310的頂表面312的失真。基於在期望特徵300和實際特徵310之間的相對差異來確定修改特徵320。修改特徵320的頂表面322是凹的，以補償實際特徵310的頂表面312的凸起。在這方面，基於指示期望形狀的數據和指示使用原始圖案形成的實際形狀的數據的組合來確定指示修改形狀的數據。 For example, as shown in FIG. 6 , the data indicative of a modified shape includes data indicative of a modified feature 320 . Even though the top surface 302 of the desired feature 300 is planar, the top surface 322 of the modified feature 320 is non-planar to compensate for the distortion of the top surface 312 of the actual feature 310 formed by the original pattern. Modified features 320 are determined based on the relative difference between desired features 300 and actual features 310 . The top surface 322 of the modified feature 320 is concave to compensate for the convexity of the top surface 312 of the actual feature 310 . In this regard, the data indicative of the modified shape is determined based on a combination of the data indicative of the desired shape and the data indicative of the actual shape formed using the original pattern.

回頭參照第4圖，根據修改的圖案藉由液滴噴射而分配進料材料的初始層(208)。基於指示用以分配進料材料之修改的圖案的數據而形成得到的實際特徵330，修改的圖案基於指示修改形狀的數據來確定。 Referring back to FIG. 4, an initial layer of feed material is dispensed by droplet ejection according to the modified pattern (208). The resulting actual feature 330 is formed based on data indicative of a modified pattern for dispensing the feed material, the modified pattern being determined based on the data indicative of a modified shape.

當根據指示修改圖案的數據控制分配器128以分配進料材料的層130(210)時，固化的進料材料的層130的選定部分的尺寸和形狀可通過特徵的高度而變化。這與形成實際特徵310的處理形成對比，其中固化的進料材料的選定部分在層與層之間是一致的，因為期望特徵300的寬度在層與層之間是一致的。When the dispenser 128 is controlled to dispense the layer 130 of feed material according to the data indicative of the modified pattern (210), the size and shape of selected portions of the layer 130 of cured feed material may be varied by the height of the features. This is in contrast to the process of forming actual features 310 where selected portions of the cured feed material are consistent from layer to layer, since it is desired that the width of feature 300 is consistent from layer to layer.

修改特徵320包括具有隨層而變的寬度的凹入部分326。分配進料材料以形成凹入部分326的修改圖案與用以形成期望特徵300的頂部部分的原始圖案的對應部分不同，因為用於修改圖案的進料材料的層130的選定固化部分具有不同的寬度和形狀。這些變化的寬度和形狀補償了存在於實際特徵310中的失真，使得與使用原始圖案而形成的實際特徵310相比，使用修改圖案而形成的所得實際特徵330具有減小的凸度。例如，與實際特徵310的頂表面312相比，實際特徵330的頂表面332具有增加的平面性和平坦性。藉由有意地控制進料材料在哪裡被分配和固化，由修改圖案所界定的此校正可更好地使得到的拋光墊102的形狀與拋光墊102的原始期望形狀匹配。The modifying feature 320 includes a concave portion 326 having a width that varies with the layer. The modified pattern in which the feed material is dispensed to form the recessed portions 326 is different from the corresponding portion of the original pattern used to form the top portion of the desired feature 300 because the selected cured portion of the layer 130 of feed material used to modify the pattern has a different width and shape. These varying widths and shapes compensate for distortions present in the actual feature 310 such that the resulting actual feature 330 formed using the modified pattern has reduced convexity compared to the actual feature 310 formed using the original pattern. For example, top surface 332 of actual feature 330 has increased planarity and flatness compared to top surface 312 of actual feature 310 . This correction, defined by the modified pattern, can better match the resulting shape of the polishing pad 102 to the original desired shape of the polishing pad 102 by deliberately controlling where the feed material is dispensed and solidified.

例如，控制器129可接收初始數據目標，如，指定待製造的物體的初始或預期形狀的電腦輔助設計（CAD）相容檔案，如，位圖。數據目標可儲存在非暫時性電腦可讀介質上。控制器129可經程式化以產生修改的數據目標，如，修改的位圖，其包括用於減少倒圓或倒角的特徵。修改的數據目標可基於由初始數據目標所指示的預期形狀及指示由積層製造程序引入的預期形狀的變化的數據。因此，當使用修改的數據目標（如，修改的位圖）製造拋光墊102時，它更接近地匹配期望設計。For example, controller 129 may receive an initial data object, such as a computer-aided design (CAD) compatible file, such as a bitmap, specifying an initial or intended shape of an object to be manufactured. Data objects may be stored on non-transitory computer readable media. Controller 129 may be programmed to generate a modified data object, eg, a modified bitmap, that includes features for reducing rounding or chamfering. The modified data object may be based on the expected shape indicated by the initial data object and data indicative of changes in the expected shape introduced by the additive manufacturing process. Thus, when polishing pad 102 is fabricated using a modified data object (eg, a modified bitmap), it more closely matches the desired design.

第7圖顯示了期望特徵400和根據指示期望特徵400的數據而確定的分配和固化圖案所形成的實際特徵410的另一個實例。在此特定實例中，期望特徵400具有680μm的寬度和500μm的高度，但其他尺寸在實施處理中是適當的。如圖所示，實際特徵410具有非平面的頂表面和傾斜的側壁。FIG. 7 shows another example of a desired feature 400 and an actual feature 410 formed from a dispensing and curing pattern determined from data indicative of the desired feature 400 . In this particular example, it is desired that the features 400 have a width of 680 μm and a height of 500 μm, but other dimensions are suitable in implementing the process. As shown, actual feature 410 has a non-planar top surface and sloped sidewalls.

期望特徵400是恆定寬度的特徵，如，分離拋光墊102的凹槽138的分隔部140。分隔部140的恆定寬度可改善晶圓對晶圓的拋光均勻性。此外，拋光墊102的拋光功效可取決於拋光表面103的平面性。使用於此所述的處理，可產生指示修改圖案的數據，使得使用修改圖案而形成的所得實際特徵更接近地匹配期望特徵400。特別地，修改圖案對應於具有使用於此所述的處理而確定的附加校正輪廓的原始圖案。附加校正輪廓補償使用原始圖案而形成的實際特徵410的失真。It is desirable that feature 400 is a constant width feature, such as divider 140 separating groove 138 of polishing pad 102 . The constant width of the partitions 140 may improve wafer-to-wafer polishing uniformity. Additionally, the polishing efficacy of polishing pad 102 may depend on the planarity of polishing surface 103 . Using the processes described herein, data indicative of a modified pattern may be generated such that the resulting actual feature formed using the modified pattern more closely matches the desired feature 400 . In particular, the modified pattern corresponds to the original pattern with an additional correction profile determined using the process described herein. The additional correction profile compensates for the distortion of the actual feature 410 formed using the original pattern.

第8A-8C圖的實例是由製造設備120分配和固化的層的橫截面。在一些實現中，指示於此描述的形狀的數據包括待形成的形狀或所形成的形狀的位圖表示。位圖的每個位元可對應於待形成的拋光墊102的特徵的體素。The examples of FIGS. 8A-8C are cross-sections of layers dispensed and cured by fabrication equipment 120 . In some implementations, the data indicative of the shapes described herein includes a bitmap representation of the shape to be formed or the shape formed. Each bit of the bitmap may correspond to a voxel of a feature of polishing pad 102 to be formed.

例如，第8A圖顯示待沉積以形成期望特徵400的第一層804。為了補償失真，沿著特徵的兩個相對邊緣的分隔部806的兩個外部區域被分配並沉積以形成分隔部806的周邊。兩個外部區域可由提供與第一邊緣相鄰的第一區域的第一組體素802a和提供與第二邊緣相鄰的第二區域的第二組體素802b來界定。For example, FIG. 8A shows a first layer 804 to be deposited to form the desired feature 400 . To compensate for the distortion, the two outer regions of the divider 806 along the two opposing edges of the feature are apportioned and deposited to form the perimeter of the divider 806 . The two outer regions may be bounded by a first set of voxels 802a providing a first region adjacent to a first edge and a second set of voxels 802b providing a second region adjacent to a second edge.

如第8B圖所示，在固化第一邊緣802a和第二邊緣802b之後，連續層808沉積在初始層804的頂上。連續層808具有足夠的材料以填充在提供邊緣的第一組體素802a與第二組體素802b之間的分隔部806的剩餘部分，並在第一組體素802a和第二組體素802b的頂上沉積附加層。所形成的凹入形狀至少部分地補償由於沉積複數個連續層而導致的期望特徵的失真。 After curing the first edge 802a and the second edge 802b, a continuous layer 808 is deposited on top of the initial layer 804, as shown in FIG. 8B. The continuous layer 808 has sufficient material to fill the remainder of the partition 806 between the first set of voxels 802a and the second set of voxels 802b providing the edge, and between the first set of voxels 802a and the second set of voxels 802b Additional layers are deposited on top of 802b. The resulting concave shape at least partially compensates for the distortion of the desired feature caused by depositing successive layers.

如第8C圖所示，在沉積複數個連續層810之後，所得特徵(如，分隔部806)可具有頂表面812，頂表面812帶有較少遭受倒圓及/或其他形式的失真的邊緣814。 As shown in FIG. 8C, after depositing a plurality of successive layers 810, the resulting features (e.g., partitions 806) may have top surfaces 812 with edges that are less subject to rounding and/or other forms of distortion. 814.

初始數據目標不需要包括初始層，而修改數據目標包含初始層。特別地，控制器可確定正在製造的物體會發生的失真，並接著產生初始層，以補償此等失真。例如，控制器可識別預期相對於期望輪廓而言很薄的區域。藉由將對應於區域的體素分配給初始層，可使此等區域更厚。 The original data object does not need to include the original layer, while the modified data object includes the original layer. In particular, the controller can determine distortions that will occur to the object being fabricated and then generate initial layers to compensate for these distortions. For example, the controller may identify regions that are expected to be thin relative to the desired profile. These regions can be made thicker by assigning voxels corresponding to the regions to the initial layer.

替代地，初始數據目標可包括初始層，而修改後數據目標包括修改初始層。例如，藉由修改對應於初始層中的區域的體素，以沉積更多材料，以便使彼等區域中的初始層更厚，可使得相對於期望輪廓預期變薄的區域更厚。 Alternatively, the original data object may include the original layer, and the modified data object includes the modified original layer. For example, regions that are expected to be thinner relative to the desired profile can be made thicker by modifying the voxels corresponding to regions in the initial layer to deposit more material so that the initial layer is thicker in those regions.

在一些實現中，第二層808可藉由不同的第二液滴噴射處理而形成。例如，第一層804可藉由噴射具有 第一成分的液滴而形成，且第二層可藉由噴射具有不同的第二成分的液滴而形成。例如，第一材料可為第一聚合物，而第二層808可為第二聚合物。第一材料可為在其他類似環境條件下比第二材料更快固化的組合物。 In some implementations, the second layer 808 can be formed by a second, different droplet ejection process. For example, the first layer 804 can be sprayed with Droplets of a first composition are formed, and the second layer may be formed by spraying droplets of a second, different composition. For example, the first material can be a first polymer and the second layer 808 can be a second polymer. The first material may be a composition that cures faster than the second material under otherwise similar environmental conditions.

作為另一個實例，沉積第一層804之步驟可包括將第一固化輻射施加到第一層804，而沉積第二層808之步驟可包括施加第二固化輻射，第二固化輻射固化第二層808比第一固化輻射固化第一層804更慢。在一些實現中，第一固化輻射和第二固化輻射在噴射液滴和施加相應的固化輻射之間具有不同的波長，不同的強度，或不同的延遲。 As another example, the step of depositing the first layer 804 may include applying first curing radiation to the first layer 804, and the step of depositing the second layer 808 may include applying a second curing radiation that cures the second layer. 808 cures the first layer 804 more slowly than the first curing radiation. In some implementations, the first curing radiation and the second curing radiation have different wavelengths, different intensities, or different delays between ejecting the droplet and applying the corresponding curing radiation.

儘管第8A-8C圖顯示了直接沉積在支撐件134上的第一層804，如第8D圖所示，第一層804可形成在形成將製造的物體的主體(如，拋光墊的主體)的複數個層820之上。在這種情況下，第一層820是突出於主體之上方的特徵的第一層(如，分隔部)。在這種情況下，層804仍然位於分隔部806的周邊處。 Although Figures 8A-8C show the first layer 804 deposited directly on the support 134, as shown in Figure 8D, the first layer 804 may be formed on the body of the object to be manufactured (e.g., the body of a polishing pad). on a plurality of layers 820 of . In this case, the first layer 820 is the first layer of features (eg, partitions) that protrude above the body. In this case, layer 804 is still located at the perimeter of divider 806 .

第9A-9C圖的實例是由積層製造設備120分配和固化的層的橫截面。在一些實現中，指示於此描述的形狀的數據包括待形成的形狀或所形成的形狀的位圖表示。位圖的每個位元可對應於待形成的拋光墊102的特徵的體素。 The examples of FIGS. 9A-9C are cross-sections of layers dispensed and cured by the build-up manufacturing equipment 120 . In some implementations, the data indicative of the shapes described herein includes a bitmap representation of the shape to be formed or the shape formed. Each bit of the bitmap may correspond to a voxel of a feature of polishing pad 102 to be formed.

例如，第9A圖顯示待沉積以形成期望特徵400的第一層904。為了補償失真，分配和沉積兩個外部 區域(包括與第一邊緣相鄰的第一區域和與第二邊緣相鄰的第二區域)，以形成分隔部906的周邊。第一組體素902a可提供第一區域，而第二組體素902b可提供第二區域。 For example, FIG. 9A shows a first layer 904 to be deposited to form the desired feature 400 . To compensate for distortion, distribute and deposit two external area (including a first area adjacent to the first edge and a second area adjacent to the second edge) to form the perimeter of the partition 906 . A first set of voxels 902a may provide a first region, while a second set of voxels 902b may provide a second region.

如第9B圖所示，在固化第一組體素902a和第二組體素902b之後，第三組體素908沉積在由第一層904形成的邊界之間。也就是說，連續層908具有足夠的材料來填充分隔部906的剩餘部分及在第一組體素902a與第二組體素902b之間的沉積區域。在此實例中，形成很少甚至沒有凹入形狀。相反地，邊緣部分(902a和902b)藉由更好地保持側壁的垂直性的處理而形成。這至少部分地補償了實際特徵410的失真。實際上，邊緣部分(902a和902b)用作壁，以保留將形成分隔部908的中心部分的拋光墊前驅物的其餘部分。 As shown in FIG. 9B , after curing the first set of voxels 902 a and the second set of voxels 902 b , a third set of voxels 908 is deposited between the boundaries formed by the first layer 904 . That is, the continuous layer 908 has sufficient material to fill the remainder of the partition 906 and the deposition area between the first set of voxels 902a and the second set of voxels 902b. In this example, little to no concave shape is formed. Instead, the edge portions (902a and 902b) are formed by processing to better maintain the verticality of the sidewalls. This at least partially compensates for the distortion of the actual feature 410 . In effect, edge portions ( 902 a and 902 b ) serve as walls to retain the remainder of the polishing pad precursor that will form the central portion of partition 908 .

在一些實現中，可藉由不同的第二液滴噴射處理來沉積第三組體素908。例如，第一組體素902a和第二組體素902b可使用比用於形成第三組體素908的液滴的材料(如，第二聚合物)更快固化的材料(諸如第一聚合物)的液滴而形成。 In some implementations, the third set of voxels 908 can be deposited by a second, different droplet ejection process. For example, the first set of voxels 902a and the second set of voxels 902b may use a faster-curing material (such as the first polymer) than the material (e.g., the second polymer) used to form the droplets of the third set of voxels 908. matter) droplets are formed.

在一些實現中，沉積第一組體素902a和第二組體素902b之步驟可包括第一固化輻射，而沉積第三組體素908之步驟可包括第二固化輻射，第二固化輻射固化第三組體素908比第一固化輻射固化第一組體素902a和第二組體素902b更慢。在此種實現中，第一固化輻射和 第二固化輻射可處於不同的波長或不同的強度。設備可包括不同的能量源(如，不同的UV光)，以提供不同的波長或強度。替代地，可在不同的功率水平下驅動相同的能量源，以提供不同的強度。 In some implementations, the step of depositing the first set of voxels 902a and the second set of voxels 902b can include a first curing radiation, while the step of depositing the third set of voxels 908 can include a second curing radiation that cures The third set of voxels 908 is slower than the first curing radiation to cure the first set of voxels 902a and the second set of voxels 902b. In this implementation, the first curing radiation and The second curing radiation can be at a different wavelength or a different intensity. Devices may include different energy sources (eg, different UV light) to provide different wavelengths or intensities. Alternatively, the same energy source can be driven at different power levels to provide different intensities.

如第9C圖所示，此處理可重複，直到沉積複數個連續層910。邊緣部分902a、902b用於形成提供分隔部906的垂直外表面的壁，其中分隔部的內部由第三組體素908提供。假定捕獲材料未被移除並提供了拋光墊的一部分，則邊緣部分902a、902b將是分隔部的周邊內部並鄰接分隔部的周邊的區域。控制器可經程式化以從數據檔案確定這些區域。 As shown in Figure 9C, this process can be repeated until a plurality of successive layers 910 are deposited. The edge portions 902 a , 902 b are used to form walls providing the vertical outer surface of the partition 906 , wherein the interior of the partition is provided by the third set of voxels 908 . Assuming the capture material is not removed and a portion of the polishing pad is provided, the edge portions 902a, 902b will be the areas inside and adjoining the perimeter of the divider. The controller can be programmed to determine these areas from a data file.

如第9D圖所示，在一些實現中，可(如，通過選擇性蝕刻處理)移除捕獲材料(亦即，第一組體素902a和第二組體素902b的材料)。這只留下第三組體素908的材料殘留。在此種情況下，邊緣部分902a、902b將是分隔部的周邊外且鄰接分隔部的周邊的區域。再次地，控制器可經程式化以從數據檔案確定這些區域。 As shown in Figure 9D, in some implementations, the capture material (ie, the material of the first set of voxels 902a and the second set of voxels 902b) can be removed (eg, by a selective etch process). This leaves only the material of the third group of voxels 908 remaining. In such a case, the edge portions 902a, 902b would be the areas outside and adjacent to the perimeter of the partition. Again, the controller can be programmed to determine these areas from the data file.

若第三組體素908由光學透明材料(如，用於形成CMP窗口)所形成，則此種技術可能是有利的。此種技術對於固定磨料輥格式的襯墊設計也是有利的。此種技術也可用於第三組體素908的二次聚合物固化，其中體素902a和902b的材料被用作遮罩。 This technique may be advantageous if the third group of voxels 908 is formed from an optically transparent material (eg, used to form a CMP window). This technique is also advantageous for pad designs for fixed abrasive roll formats. This technique can also be used for secondary polymer curing of the third set of voxels 908, where the material of voxels 902a and 902b is used as a mask.

在一些實現中，分隔部的至少中心部分(亦即，第三組體素)經歷二次聚合物固化處理。捕獲材料(亦 即，第一組體素902a和第二組體素902b的材料)可在二次固化之後被移除。 In some implementations, at least a central portion of the partition (ie, the third set of voxels) undergoes a secondary polymer curing process. capture material (also That is, the material of the first set of voxels 902a and the second set of voxels 902b) may be removed after post-curing.

儘管第9A-9C圖顯示了直接沉積在支撐件134上的層910，如第9E圖所示，提供分隔部的複數個層910可形成在形成正在製造的物體的主體(如，拋光墊的主體)的複數個層920之上。在此種情況下，第一層904是突出於主體之上方的特徵(如，分隔部)的第一層。 Although FIGS. 9A-9C show layer 910 deposited directly on support 134, as shown in FIG. 9E, a plurality of layers 910 providing spacers may be formed on the body of the object being fabricated (e.g., a polishing pad). on the plurality of layers 920 of the main body). In this case, the first layer 904 is the first layer of features (eg, partitions) that protrude above the body.

第10圖顯示了藉由液滴噴射將第一組連續層1010沉積到支撐件134上的示例性處理。沉積第一組連續層1010之步驟包括將拋光墊前驅物1008a從第一噴射器1006a分配到第一組區域，諸如區域1004b，對應於拋光墊的分隔部。另外，沉積第一組連續層1010之步驟包括將犧牲材料1008b從第二噴射器1006b分配到一組第二區域，諸如區域1004a，對應於與拋光墊的凹槽。第一噴射器1006a和第二噴射器1006b可從不同的進料材料源抽取。特別地，犧牲材料1008b可與墊前驅物1008a同時沉積。同時沉積允許用第一噴射器1006a和第二噴射器1006b的一個單程來沉積整個層。犧牲材料1008b至少部分地減少了若藉由在固化之前和固化期間將沉積的墊前驅物1008a保持就位而自行沉積墊前驅物1008a可能發生的失真。 Figure 10 shows an exemplary process for depositing a first set of continuous layers 1010 onto a support 134 by droplet jetting. The step of depositing a first set of continuous layers 1010 includes dispensing a polishing pad precursor 1008a from a first injector 1006a to a first set of regions, such as regions 1004b, corresponding to partitions of the polishing pad. Additionally, the step of depositing the first set of continuous layers 1010 includes dispensing the sacrificial material 1008b from the second injector 1006b to a set of second regions, such as regions 1004a, corresponding to the grooves of the polishing pad. The first injector 1006a and the second injector 1006b may draw from different sources of feed material. In particular, sacrificial material 1008b may be deposited simultaneously with pad precursor 1008a. Simultaneous deposition allows an entire layer to be deposited with one single pass of the first injector 1006a and the second injector 1006b. The sacrificial material 1008b at least partially reduces distortion that may occur if the pad precursor 1008a is self-deposited by holding the deposited pad precursor 1008a in place before and during curing.

在第一組連續層1010被沉積之後，藉由液滴噴射在第一組連續層1010上沉積複數個第二連續層1012。第二組連續層1012跨越第一區域1004b和第二 區域1004a兩者。在一些實現中，第二組連續層1012的一些或全部對應於拋光墊的拋光層的下部並且由拋光墊前驅物1008a形成。在一些實現中，第二組連續層1012的一些或全部被形成為具有與第一組連續層1010不同的材料成分，並可對應於拋光墊的背襯層(如，子墊)。此種層可由不同的材料(如，不同的前驅物)形成，或可噴射相同的前驅物，但是不同地處理，如，經受更多或更少的固化，以提供不同程度的聚合並因此具有不同的硬度。 After the first set of continuous layers 1010 are deposited, a plurality of second continuous layers 1012 are deposited on the first set of continuous layers 1010 by droplet spraying. The second set of continuous layers 1012 spans the first region 1004b and the second Region 1004a both. In some implementations, some or all of the second set of continuous layers 1012 corresponds to the lower portion of the polishing layer of the polishing pad and is formed from the polishing pad precursor 1008a. In some implementations, some or all of the second set of continuous layers 1012 are formed to have a different material composition than the first set of continuous layers 1010, and may correspond to a backing layer (eg, a subpad) of a polishing pad. Such layers may be formed from different materials (e.g., different precursors), or the same precursor may be sprayed, but processed differently, e.g., subjected to more or less curing, to provide different degrees of polymerization and thus have different hardness.

在此種實現中，拋光墊是顛倒製造的。也就是說沉積材料的最上層對應於拋光墊的基座或下部。第一組連續層1010和第二組連續層1012提供拋光墊的主體。 In this implementation, the polishing pad is fabricated upside down. That is, the uppermost layer of deposited material corresponds to the base or lower portion of the polishing pad. The first set of continuous layers 1010 and the second set of continuous layers 1012 provide the body of the polishing pad.

一旦拋光墊材料的沉積完成，則將拋光墊的主體從支撐件134移除。犧牲材料1008b從主體移除，如，藉由選擇性地蝕刻犧牲材料，或藉由提起拋光墊的主體同時犧牲材料保留在支撐件上，以提供具有拋光表面的拋光墊，拋光表面具有由凹槽分隔的分隔部。 Once the deposition of the polishing pad material is complete, the body of the polishing pad is removed from the support 134 . The sacrificial material 1008b is removed from the body, e.g., by selectively etching the sacrificial material, or by lifting the body of the polishing pad while the sacrificial material remains on the support, to provide the polishing pad with a polishing surface defined by concave Slot-separated divider.

在一些實現中，第三組連續層藉由液滴噴射而沉積在第二組連續層1012之上。第三組連續層可具有與第二組連續層1012不同的成分。第二組連續層1012可對應於拋光墊的下部(也被稱為拋光層的子墊)。 In some implementations, the third set of contiguous layers is deposited over the second set of contiguous layers 1012 by droplet ejection. The third set of continuous layers may have a different composition than the second set of continuous layers 1012 . The second set of continuous layers 1012 may correspond to the lower portion of the polishing pad (also referred to as a sub-pad of the polishing layer).

參照第11A圖，在一些實現中，支撐件134的頂表面包括紋理(如，突起1100)，且拋光墊前驅物1108被噴射以填充在突起之間的空間，以便在拋光墊上 產生互補紋理，如，凹槽。特定地，沉積第一組連續層1110包括從噴射器1106分配拋光墊前驅物1108，以形成第一組區域，諸如，區域1104，對應於拋光墊的分隔部。在第一組連續層1110被沉積之後，複數個第二連續層1112被沉積在第一組連續層1010之上。第二組連續層1112跨越第一區域1004和突起1110兩者。 Referring to FIG. 11A, in some implementations, the top surface of the support 134 includes a texture (e.g., protrusions 1100), and a polishing pad precursor 1108 is sprayed to fill the spaces between the protrusions so that the polishing pad Create complementary textures, eg grooves. In particular, depositing first set of continuous layers 1110 includes dispensing polishing pad precursor 1108 from injector 1106 to form a first set of regions, such as regions 1104 , corresponding to partitions of the polishing pad. After the first set of continuous layers 1110 is deposited, a plurality of second continuous layers 1112 are deposited over the first set of continuous layers 1010 . The second set of continuous layers 1112 spans both the first region 1004 and the protrusion 1110 .

在一些實現中，第二組連續層1112的一些或全部對應於拋光墊的拋光層的下部並且由拋光墊前驅物1108形成。在一些實現中，第二組連續層1112的一些或全部形成為具有與第一組連續層1110不同的材料成分，並且可對應於拋光墊的背襯層(如，子墊)。此種層可由不同的材料(如，不同的前驅物)形成，或可噴射相同的前驅物，但是不同地處理，如，經受更多或更少的固化以提供不同程度的聚合並因此具有不同的硬度。 In some implementations, some or all of the second set of continuous layers 1112 corresponds to the lower portion of the polishing layer of the polishing pad and is formed from the polishing pad precursor 1108 . In some implementations, some or all of the second set of continuous layers 1112 are formed to have a different material composition than the first set of continuous layers 1110, and may correspond to a backing layer (eg, a subpad) of a polishing pad. Such layers may be formed from different materials (e.g., different precursors), or the same precursor may be sprayed, but processed differently, e.g., subjected to more or less curing to provide different degrees of polymerization and thus have different hardness.

參照第11B圖，不是在支撐件134中形成紋理，而是可藉由放置在支撐件134上的膜1120來提供紋理。在此種情況下，拋光墊前驅物被噴射到膜1120上，且膜1120在製造之後從拋光墊移除。 Referring to FIG. 11B , instead of forming the texture in the support 134 , the texture can be provided by a film 1120 placed on the support 134 . In this case, the polishing pad precursor is sprayed onto the film 1120, and the film 1120 is removed from the polishing pad after fabrication.

對於上面論述的各種實現的任一種而言，代替分配器128在支撐件134之上掃描，支撐件可為可移動的。例如，參照第12圖，支撐件134可為連續的帶。帶134可由驅動輪160驅動，驅動輪160由一或多個致動器供電以移動帶(如箭頭B所示)，以將分配的拋光墊前驅物運送到能量源131下方，以固化前驅物以形成拋光墊為 片。儘管僅顯示了一個分配器128和能量源131，但可存在有多個分配器和能量源沿著帶134串聯佈置，使得多個層可連續地形成在帶上，以形成拋光墊的整個厚度。接著可將固化的拋光墊片162從帶134提起並纏繞在接收輥164上。 For any of the various implementations discussed above, instead of the dispenser 128 scanning over the support 134, the support may be movable. For example, referring to FIG. 12, the support 134 may be a continuous belt. The belt 134 can be driven by drive wheels 160 powered by one or more actuators to move the belt (as indicated by arrow B) to deliver the dispensed polishing pad precursor under the energy source 131 to cure the precursor to form a polishing pad for piece. Although only one dispenser 128 and energy source 131 are shown, there may be multiple dispensers and energy sources arranged in series along the belt 134 such that multiple layers may be formed successively on the belt to form the entire thickness of the polishing pad . Cured polishing pad 162 may then be lifted from belt 134 and wound onto take-up roll 164 .

控制器(如，控制器129)可用數位電子電路或電腦軟體，韌體或硬體，或其組合來實現。控制器可包括一或多個電腦程式產品，亦即，有形地實施在資訊載體中的一或多個電腦程式，如，在非暫時性機器可讀儲存介質中或在傳播信號中，以藉由數據處理設備(如，可程式化處理器，電腦，或多個處理器或電腦)執行，或控制數據處理設備的操作。電腦程式(也稱為程式，軟體，軟體應用程式，或代碼)可用任何形式的程式語言編寫，包括編譯或解譯語言，且可以任何形式進行部署，包括作為獨立程式或作為模組，部件，子常式，或適用於計算環境的其他單元。電腦程式可部署在一台電腦上或多台電腦上在一個站點處或分佈在多個站點處並藉由通訊網路互連而執行。 The controller (eg, controller 129 ) can be implemented with digital electronic circuits or computer software, firmware or hardware, or a combination thereof. The controller may include one or more computer program products, that is, one or more computer programs tangibly embodied in an information carrier, such as in a non-transitory machine-readable storage medium or in a propagated signal, by To be executed by, or to control the operation of, data processing equipment (eg, a programmable processor, computer, or multiple processors or computers). A computer program (also known as a program, software, software application, or code) may be written in any form of programming language, including compiled or interpreted languages, and may be deployed in any form, including as a stand-alone program or as a module, component, Subroutine, or other unit as appropriate for the computing environment. A computer program can be deployed on one computer or executed on multiple computers at one site or distributed across multiple sites and interconnected by a communication network.

在本說明書中描述的處理和邏輯流程可由執行一或多個電腦程式的一或多個可程式化處理器執行，以藉由對輸入數據進行操作並產生輸出來執行功能。處理和邏輯流程也可由專用邏輯電路(如，FPGA(現場可程式閘陣列)或ASIC(專用積體電路))執行，且設備也可實現為專用邏輯電路。 The processes and logic flows described in this specification can be performed by one or more programmable processors executing one or more computer programs to perform functions by operating on input data and generating output. Processes and logic flows can also be performed by, and devices can be implemented as, special purpose logic circuitry, such as an FPGA (Field Programmable Gate Array) or an ASIC (Application Specific Integrated Circuit).

所描述的系統的控制器129和其他計算裝置部分可包括用以儲存數據目標(如，電腦輔助設計(CAD)兼容檔案)的非暫時性電腦可讀介質，檔案標識進料材料應被形成於每一層的圖案。例如，數據目標可為STL格式的檔案，3D製造格式(3MF)的檔案或積層製造檔案格式(AMF)的檔案。例如，控制器可從遠端電腦接收數據目標。控制器129中的處理器(如，由韌體或軟體控制)可解釋從電腦接收的數據目標，以產生用以控制積層製造設備120的部件所需的信號集合，而以期望的圖案來沉積及/或固化每個層。 The controller 129 and other computing device portions of the described system may include non-transitory computer-readable media for storing data objects (e.g., computer-aided design (CAD) compatible files) that identify feed materials that should be formed in Patterns for each layer. For example, the data object may be a file in STL format, a file in 3D Manufacturing Format (3MF) or a file in Additive Manufacturing File Format (AMF). For example, the controller can receive data objects from a remote computer. A processor in controller 129 (e.g., controlled by firmware or software) can interpret data objects received from the computer to generate the set of signals needed to control the components of additive manufacturing apparatus 120 to deposit the desired pattern and/or cure each layer.

已經描述了許多實現。然而，將理解可進行各種修改。 A number of implementations have been described. However, it will be understood that various modifications may be made.

第6圖所示的方式是沉積進料材料的一或多個額外層，以補償小於期望值的特徵的高度。例如，進料材料的一或多個額外層可沉積在發生倒圓或倒角的區域中。然而，替代地或附加地，沉積在層中的進料材料的量可補償小於期望值的高度特徵。例如，可針對位於高度特徵小於期望值之區域(如，發生倒圓或倒角的區域)中的體素，增加液滴的尺寸或噴射的液滴的數量。 The approach shown in Figure 6 is to deposit one or more additional layers of feed material to compensate for feature heights that are less than desired. For example, one or more additional layers of feed material may be deposited in areas where rounding or chamfering occurs. However, alternatively or additionally, the amount of feed material deposited in the layer may compensate for height features that are less than desired. For example, the size of the droplets or the number of droplets ejected may be increased for voxels located in regions where the height characteristics are smaller than desired (eg, regions where rounding or chamfering occurs).

在一些實現中，取決於待分配液滴124的位置來改變進料材料的容積的分佈。進料材料的液滴124的容積在分配操作期間變化。例如，回頭參照第6圖，用於形成特徵的邊緣322a、322b的液滴124的容積可小於用於形成特徵的內部部分322c的液滴124的容積。控制器 129基於進料材料的材料性質確定用於形成邊緣322a、322b的適當重量和用於形成內部部分322c的重量。分配器128可分配較少的進料材料，以最小化進料材料的滾落。當分配器128移動以形成特徵的內部部分322c時，液滴的容積增加。在一些實現中，液滴124的容積界定從特徵的邊緣322a、322b到中心的梯度。取決於進料材料的潤濕效果，當能量源131(若存在的話)***作時，此種類型的容積控制可用以調節固化的進料材料的量。例如，若能量源131跨越支撐件134掃描以固化所分配的進料材料的不同部分，則對於能量源131的每一程而言，液滴容積控制可允許較少的進料材料滾落，同時將更多的進料材料注入在特徵的邊緣322a、322b處，以減小於此描述的倒角效果。 In some implementations, the distribution of the volume of feed material is varied depending on the location of the droplet 124 to be dispensed. The volume of the droplets 124 of the feed material varies during the dispensing operation. For example, referring back to FIG. 6, the volume of the droplets 124 used to form the edges 322a, 322b of the feature may be smaller than the volume of the droplets 124 used to form the interior portion 322c of the feature. controller 129 Determine the appropriate weight for forming the edges 322a, 322b and the weight for forming the inner portion 322c based on the material properties of the feed material. The dispenser 128 can dispense less feed material to minimize tumble of the feed material. As the dispenser 128 moves to form the interior portion 322c of the feature, the volume of the droplet increases. In some implementations, the volume of the droplet 124 defines a gradient from the edges 322a, 322b of the feature to the center. Depending on the wetting effect of the feed material, this type of volume control can be used to regulate the amount of feed material that solidifies when the energy source 131 (if present) is operated. For example, if the energy source 131 is scanned across the support 134 to solidify different portions of the dispensed feed material, then for each pass of the energy source 131, droplet volume control may allow less feed material to roll off while simultaneously More feed material is injected at the edges 322a, 322b of the features to reduce the chamfering effect described herein.

在一些實現中，分配多種類型的進料材料。積層製造設備120包括(例如)兩個或更多個分配器，每個分配器分配不同類型的進料材料。在一些情況下，單個分配器(如，分配器128)接收多種類型的進料材料並分配多種類型的進料材料的混合物。因為第一類型的進料材料的性質可能與第二類型的進料材料的性質不同，所以對分配第一類型的進料材料的原始圖案的修改可包括比對原始圖案的修改更大或更小的縮放量，以分配第二類型的進料材料。替代地，若控制液滴重量，則可將第一類型的進料材料的液滴的重量控制為高於或低於第二類型的進料材料的液滴的重量。在一些情況下，第一類型的進料材料 的液滴的尺寸可被控制為大於或小於第二類型的進料材料的液滴的尺寸。 In some implementations, multiple types of feed material are dispensed. Additive manufacturing device 120 includes, for example, two or more dispensers, each dispenser dispensing a different type of feed material. In some cases, a single dispenser (eg, dispenser 128 ) receives multiple types of feed materials and dispenses a mixture of the multiple types of feed materials. Because the properties of the first type of feed material may be different from the properties of the second type of feed material, the modification to the original pattern of dispensing the first type of feed material may include greater or greater modifications than the original pattern. A small amount of scaling to dispense the second type of feed material. Alternatively, if the droplet weight is controlled, the weight of the droplets of the first type of feed material can be controlled to be higher or lower than the weight of the droplets of the second type of feed material. In some cases, the first type of feed material The size of the droplets can be controlled to be larger or smaller than the size of the droplets of the second type of feed material.

在一些實現中，多種類型的進料材料形成拋光墊102的不同部分，(例如)用以形成拋光層122和背襯層136，或用以形成拋光層122的不同部分，(如)以提供具有跨越拋光表面橫向變化的拋光性質的拋光層。第二類型的進料材料可包括具有積層劑的第一類型的進料材料，積層劑相對於第一類型的進料材料改變第二類型的進料材料的性質。積層劑包括(例如)可調節未固化進料材料的性質的表面活性劑，該性質例如ζ電位、親水性等 In some implementations, multiple types of feed materials form different portions of polishing pad 102, such as to form polishing layer 122 and backing layer 136, or to form different portions of polishing layer 122, such as to provide A polishing layer having polishing properties that vary laterally across the polishing surface. The second type of feed material may comprise the first type of feed material with a layering agent that modifies the properties of the second type of feed material relative to the first type of feed material. Laminating agents include, for example, surfactants that can adjust properties of the uncured feed material, such as zeta potential, hydrophilicity, etc.

進料材料的層的每一層的厚度和體素的每一個的尺寸可隨實現而變化。在一些實現中，當分配在支撐件134上時，每個體素可具有(例如)10μm至50μm(如，10μm至30μm，20μm至40μm，30μm至50μm，大約20μm，大約30μm，或大約50μm)的寬度。每層可具有預定的厚度。厚度可為(例如)1至80μm(如，2至40μm(如，2μm至4μm，5μm至7μm，10μm至20μm，25μm至40μm))。 The thickness of each of the layers of feed material and the size of each of the voxels may vary from implementation to implementation. In some implementations, each voxel can have a thickness of, for example, 10 μm to 50 μm (e.g., 10 μm to 30 μm, 20 μm to 40 μm, 30 μm to 50 μm, about 20 μm, about 30 μm, or about 50 μm) when distributed on support 134 . width. Each layer may have a predetermined thickness. The thickness can be, for example, 1 to 80 μm (eg, 2 to 40 μm (eg, 2 μm to 4 μm, 5 μm to 7 μm, 10 μm to 20 μm, 25 μm to 40 μm)).

儘管已經在製造拋光墊的上下文中描述了方法和設備，但方法和設備可適用於藉由積層製造來製造其他製品。在此情況下，除了拋光表面之外，將會簡單地存在有待製造的物體的頂表面，且頂表面中將存在有凹部。修改後的圖案可至少部分地補償由積層製造系統引起的失真。 Although the methods and apparatus have been described in the context of making polishing pads, the methods and apparatus are applicable to making other articles by additive manufacturing. In this case, in addition to the polished surface, there will simply be the top surface of the object to be manufactured, and there will be recesses in the top surface. The modified pattern can at least partially compensate for distortions caused by the additive manufacturing system.

另外，儘管已經在藉由液滴噴射製造的上下文中描述了方法和設備，但方法及設備可適於藉由其他積層製造技術而製造，該等其他積層製造技術如，選擇性粉末分配，接著燒結。 Additionally, although the methods and apparatus have been described in the context of fabrication by droplet ejection, the methods and apparatus may be adapted for fabrication by other additive manufacturing techniques such as selective powder dispensing followed by sintering.

因此，其他實現在申請專利範圍的範圍內。 Accordingly, other implementations are within the scope of this patent application.

100:拋光系統 100: Polishing system

102:拋光墊 102: Polishing pad

103:拋光表面 103: polished surface

104:基板 104: Substrate

106:台板 106: Platen

108:拋光液體 108: polishing liquid

110:漿料/漂洗臂 110: Slurry/rinse arm

112:載體頭 112: carrier head

114:載體驅動軸 114: carrier drive shaft

116:軸線 116: axis

120:積層製造設備/設備 120: Additive manufacturing equipment/equipment

122:拋光層 122: Polishing layer

124:液滴 124: droplet

126:噴嘴 126: Nozzle

128:分配器 128:Distributor

129:控制器 129: Controller

130:層 130: layer

130a:第一層 130a: first floor

130b:隨後沉積的層 130b: Subsequent Deposited Layers

131:能量源 131: energy source

132:進料材料 132: Feed material

134:支撐件/帶 134: support/belt

136:背襯層 136: backing layer

138:凹槽 138: Groove

140:分隔部 140: Partition

142:側壁 142: side wall

144:底表面 144: bottom surface

160:驅動輪 160: drive wheel

162:拋光墊片 162: Polishing gasket

164:接收輥 164: receiving roller

200:製造處理 200: Manufacturing processing

202:接收指示待製造的拋光墊的期望形狀的數據 202: Receive data indicative of desired shape of polishing pad to be manufactured

204:產生指示來自期望輪廓的失真的數據 204: Generate data indicative of distortion from desired profile

206:產生或接收指示補償拋光墊失真的分配進料材料的修改圖案的數據 206: Generate or Receive Data Indicative of Modified Pattern of Dispensed Feed Material Compensating for Polishing Pad Distortion

208:藉由液滴噴射而分配進料材料的初始層 208: Distributing an initial layer of feed material by droplet ejection

210:根據指示修改圖案的數據控制分配器128以分配進料材料的層130 210: Control the dispenser 128 to dispense the layer 130 of the feed material according to the data indicating the modified pattern

300:期望特徵/特徵 300: Desired Features/Characteristics

302:頂表面 302: top surface

304a:橫向邊緣 304a: Horizontal edge

304b:橫向邊緣 304b: Horizontal edge

310:實際特徵 310: Actual Features

312:頂表面 312: top surface

314a:橫向邊緣 314a: Horizontal edge

314b:橫向邊緣 314b: Horizontal edge

320:修改特徵 320: Modify features

322:頂表面 322: top surface

322a:邊緣 322a: edge

322b:邊緣 322b: edge

322c:內部部分 322c: Internal part

326:凹入部分 326: concave part

330:實際特徵 330: Actual Features

332:頂表面 332: top surface

802a:第一組體素/第一邊緣 802a: First set of voxels/first edge

802b:第二組體素/第二邊緣 802b: Second set of voxels/second edge

804:第一層/初始層/層 804: first layer/initial layer/layer

806:分隔部 806: Partition

808:連續層/第二層 808: Continuous layer/Second layer

810:連續層 810: continuous layer

812:頂表面 812: top surface

814:邊緣 814: edge

820:複數個層/第一層 820: plural layers/first layer

902a:第一組體素/邊緣部分 902a: First group of voxels/edge parts

902b:第二組體素/邊緣部分 902b: second set of voxels/edge parts

904:第一層 904: first floor

906:分隔部 906: Partition

908:第三組體素/分隔部/連續層 908: The third set of voxels/partitions/continuous layers

910:層 910: layer

920:複數個層 920: Multiple layers

1004a:區域 1004a: area

1004b:區域 1004b: area

1006a:第一噴射器 1006a: First injector

1006b:第二噴射器 1006b: Second injector

1008a:墊前驅物 1008a: pad precursor

1008b:犧牲材料 1008b: Sacrificial material

1010:第一組連續層 1010: The first set of continuous layers

1012:第二連續層/第二組連續層 1012: the second continuous layer/the second group of continuous layers

1100:突起 1100:Protrusion

1104:區域 1104: area

1106:噴射器 1106: Injector

1108:拋光墊前驅物 1108: Polishing pad precursor

1110:第一組連續層/突起 1110: First set of consecutive layers/protrusions

1112:第二連續層/第二組連續層 1112: second continuous layer/second group of continuous layers

1120:膜 1120: Membrane

第1圖是拋光系統的示意性側視圖。Figure 1 is a schematic side view of a polishing system.

第2圖是積層製造設備的示意性側視圖。Fig. 2 is a schematic side view of an additive manufacturing facility.

第3A圖是拋光墊的實例的頂視圖。Figure 3A is a top view of an example of a polishing pad.

第3B圖是第3A圖的拋光墊的側視圖。Figure 3B is a side view of the polishing pad of Figure 3A.

第4圖是用以形成製品的處理的流程圖。Figure 4 is a flowchart of a process to form an article.

第5圖顯示了基於期望形狀而形成的實際形狀的實例。Figure 5 shows an example of the actual shape formed based on the desired shape.

第6圖顯示了基於第5圖的期望形狀的修改而形成的實際形狀。Figure 6 shows the actual shape formed based on the modification of the desired shape from Figure 5.

第7圖顯示了基於期望的形狀而形成的實際形狀的另一實例。Fig. 7 shows another example of the actual shape formed based on the desired shape.

第8A-8D圖是用於沉積的示例性圖案和方法的側視圖表示。Figures 8A-8D are side view representations of exemplary patterns and methods for deposition.

第9A-9E圖是用於沉積的示例性圖案和方法的側視圖表示。Figures 9A-9E are side view representations of exemplary patterns and methods for deposition.

第10圖是積層製造設備的另一實現的示意性側視圖。Figure 10 is a schematic side view of another implementation of an additive manufacturing apparatus.

第11A圖是積層製造設備的另一實現的示意性側視圖。FIG. 11A is a schematic side view of another implementation of an additive manufacturing apparatus.

第11B圖是積層製造設備的另一實現的示意性側視圖。Figure 1 IB is a schematic side view of another implementation of an additive manufacturing apparatus.

第12圖是積層製造設備的另一實現的示意性側視圖。Figure 12 is a schematic side view of another implementation of an additive manufacturing apparatus.

在各個圖式中類似的元件符號和標記表示類似的元件。Like reference numerals and labels denote like elements in the various drawings.

120:積層製造設備 120:Laminated manufacturing equipment

122:拋光層 122: Polishing layer

124:液滴 124: droplet

126:噴嘴 126: Nozzle

128:分配器 128:Distributor

129:控制器 129: Controller

130:層 130: layer

130a:第一層 130a: first floor

130b:隨後沉積的層 130b: Subsequent Deposited Layers

131:能量源 131: energy source

132:進料材料 132: Feed material

134:支撐件/帶 134: support/belt

138:凹槽 138: Groove

Claims (20)

一種使用一積層製造系統製造一拋光墊的方法，該方法包含以下步驟：藉由液滴噴射將複數個第一連續層沉積到一支撐件上，其中沉積該複數個第一連續層之步驟包括以下步驟將一拋光墊前驅物分配至對應於該拋光墊的多個分隔部的多個第一區域，及將一犧牲材料分配至對應於該拋光墊的多個凹槽的多個第二區域；藉由液滴噴射將複數個第二連續層沉積在該複數個第一連續層之上，該複數個第二連續層對應於該拋光墊的一下部，該複數個第一連續層和該複數個第二連續層提供一主體；從該支撐件移除該主體；及從該主體移除該犧牲材料，以提供該拋光墊，該拋光墊包含一拋光表面，該拋光表面具有由該等凹槽分離的該等分隔部。 A method of manufacturing a polishing pad using an additive manufacturing system, the method comprising the steps of: depositing a plurality of first continuous layers onto a support by droplet jetting, wherein the step of depositing the plurality of first continuous layers comprises Dispensing a polishing pad precursor to a plurality of first regions corresponding to a plurality of partitions of the polishing pad, and dispensing a sacrificial material to a plurality of second regions corresponding to a plurality of grooves of the polishing pad Depositing a plurality of second continuous layers on the plurality of first continuous layers by droplet jetting, the plurality of second continuous layers corresponding to the lower portion of the polishing pad, the plurality of first continuous layers and the plurality of first continuous layers a plurality of second continuous layers providing a body; removing the body from the support; and removing the sacrificial material from the body to provide the polishing pad comprising a polishing surface having the polishing surface composed of the The partitions are separated by grooves. 如請求項1所述之方法，包含以下步驟：固化該拋光墊前驅物。 The method as claimed in claim 1, comprising the following steps: curing the polishing pad precursor. 如請求項1所述之方法，其中該拋光墊前驅物包含一第一聚合物前驅物且該犧牲材料包含不同成 分的一第二聚合物前驅物。 The method of claim 1, wherein the polishing pad precursor comprises a first polymer precursor and the sacrificial material comprises different compositions A second polymer precursor is divided. 如請求項1所述之方法，其中移除該犧牲材料之步驟包含：將該犧牲材料蝕刻掉或提升該拋光墊離開該犧牲材料。 The method of claim 1, wherein the step of removing the sacrificial material comprises: etching the sacrificial material away or lifting the polishing pad away from the sacrificial material. 如請求項1所述之方法，其中沉積該複數個第二連續層之步驟包含：分配該拋光墊前驅物。 The method of claim 1, wherein the step of depositing the plurality of second continuous layers comprises: dispensing the polishing pad precursor. 一種積層製造系統，該系統包含：一支撐件；一第一分配器，經配置以藉由液滴噴射分配一拋光墊前驅物；一第二分配器，經配置以分配一犧牲材料；至少一個能量源；及一控制器，經配置以接收指示由該積層製造系統藉由液滴噴射而製造的一拋光墊的一期望形狀的數據，該拋光墊包含一拋光表面，該拋光表面具有由一或多個凹槽分開的一或多個分隔部，及使得該第一分配器與該第二分配器藉由液滴噴射在一支撐件之上沉積複數個第一連續層，其中該控制器經配置以使得該第一分配器將該拋光墊前驅物分配到與該拋光墊的多個分隔部相對應的多個第一區 域，及使得該第二分配器將該犧牲材料分配到與該拋光墊的多個凹槽相對應的多個第二區域，及使得一分配器藉由液滴噴射在該複數個第一連續層之上沉積複數個第二連續層，該複數個第二連續層對應於該拋光墊的一下部，該複數個第一連續層和該複數個第二連續層提供一主體，該主體經配置而自該支撐件移除。 An additive manufacturing system comprising: a support; a first dispenser configured to dispense a polishing pad precursor by droplet jetting; a second dispenser configured to dispense a sacrificial material; at least one an energy source; and a controller configured to receive data indicative of a desired shape of a polishing pad manufactured by the additive manufacturing system by droplet ejection, the polishing pad comprising a polishing surface having a one or more partitions separated by one or more grooves, and enabling the first distributor and the second distributor to deposit a plurality of first continuous layers on a support by droplet spraying, wherein the controller configured such that the first dispenser distributes the polishing pad precursor to first zones corresponding to partitions of the polishing pad domain, and causing the second dispenser to distribute the sacrificial material to a plurality of second areas corresponding to the plurality of grooves of the polishing pad, and causing a dispenser to spray droplets on the plurality of first continuous A plurality of second continuous layers are deposited on the layer, the plurality of second continuous layers correspond to the lower portion of the polishing pad, the plurality of first continuous layers and the plurality of second continuous layers provide a body, the body is configured and removed from the support. 如請求項6所述之系統，其中該控制器經配置以使得該分配器沉積該複數個第二連續層以跨越該等第一區域和該等第二區域兩者。 The system of claim 6, wherein the controller is configured such that the dispenser deposits the plurality of second continuous layers to span both the first regions and the second regions. 如請求項6所述之系統，其中該控制器經配置以使得該第一分配器沉積該複數個第二連續層。 The system of claim 6, wherein the controller is configured such that the first dispenser deposits the plurality of second consecutive layers. 如請求項6所述之系統，其中該控制器經配置以使得一第三分配器藉由液滴噴射而在該複數個第二連續層之上沉積複數個第三連續層，該複數個第三連續層具有與該複數個第二連續層不同的一成分。 The system of claim 6, wherein the controller is configured such that a third dispenser deposits the plurality of third continuous layers on the plurality of second continuous layers by droplet ejection, the plurality of first continuous layers The three continuous layers have a different composition than the plurality of second continuous layers. 如請求項6所述之系統，包含一UV光源以固化該拋光墊前驅物。 The system of claim 6, comprising a UV light source for curing the polishing pad precursor. 一種使用一積層製造系統製造一拋光墊的方法，該方法包含以下步驟：藉由液滴噴射將複數個第一連續層沉積到一支撐件 上，該複數個第一連續層對應於該拋光墊的一下部；藉由液滴噴射將複數個第二連續層沉積到拋光墊的該下部上，其中沉積該複數個第二連續層之步驟包括以下步驟藉由液滴噴射將一拋光墊前驅物分配至對應於該拋光墊的多個分隔部的多個第一區域，及將一犧牲材料分配至鄰接該等第一區域的多個第二區域以形成加襯於該等分隔部的垂直表面的多個壁，其中相鄰分隔部之間的多個間隙對應於該拋光墊中的多個凹槽，其中該複數個第一連續層與該複數個第二連續層提供一主體，及該複數個第一連續層跨越該等分隔部與該等分隔部之間的該等凹槽；及將該主體從該支撐件移除及將該犧牲材料從該主體移除，以提供包含拋光表面的該拋光墊，該拋光表面具有藉由該等凹槽分開的該等分隔部。 A method of manufacturing a polishing pad using an additive manufacturing system, the method comprising the steps of: depositing a plurality of first successive layers onto a support by droplet jetting On, the plurality of first continuous layers correspond to the lower portion of the polishing pad; the plurality of second continuous layers are deposited onto the lower portion of the polishing pad by droplet spraying, wherein the step of depositing the plurality of second continuous layers comprising the steps of dispensing a polishing pad precursor to a plurality of first regions corresponding to a plurality of partitions of the polishing pad by droplet ejection, and dispensing a sacrificial material to a plurality of first regions adjacent to the first regions two regions to form walls lining the vertical surfaces of the partitions, wherein gaps between adjacent partitions correspond to grooves in the polishing pad, wherein the plurality of first continuous layers providing a body with the plurality of second continuous layers, and the plurality of first continuous layers spanning the partitions and the grooves between the partitions; and removing the body from the support and The sacrificial material is removed from the body to provide the polishing pad comprising a polishing surface having the partitions separated by the grooves. 如請求項11所述之方法，其中分配該犧牲材料包含液滴噴射。 The method of claim 11, wherein dispensing the sacrificial material comprises droplet ejection. 如請求項11所述之方法，包含固化該拋光墊前驅物。 The method of claim 11, comprising curing the polishing pad precursor. 如請求項11所述之方法，其中該拋光墊前驅物包含一第一聚合物前驅物，及該犧牲材料包含不 同成分的一第二聚合物前驅物。 The method of claim 11, wherein the polishing pad precursor comprises a first polymer precursor, and the sacrificial material comprises A second polymer precursor of the same composition. 如請求項11所述之方法，其中移除該犧牲材料包含蝕刻。 The method of claim 11, wherein removing the sacrificial material comprises etching. 一種積層製造系統，該系統包含：一支撐件；一第一分配器，經配置以藉由液滴噴射分配一拋光墊前驅物；一第二分配器，經配置以分配一犧牲材料；至少一個能量源；及一控制器，經配置以接收指示由該積層製造系統藉由液滴噴射而製造的一拋光墊的一期望形狀的數據，該拋光墊包含一拋光表面，該拋光表面具有由一或多個凹槽分開的一或多個分隔部，及使得該第一分配器藉由液滴噴射在該拋光墊的一下部上沉積複數個連續層，其中該控制器經配置以使得該第一分配器將該拋光墊前驅物輸送到與該拋光墊的該等分隔部相對應的多個第一區域，及使得該第二分配器將該犧牲材料輸送到鄰接該等第一區域的多個第二區域以形成加襯於該等分 隔部的垂直表面的多個壁，其中相鄰分隔部之間的多個間隙對應於該拋光墊中的該等凹槽。 An additive manufacturing system comprising: a support; a first dispenser configured to dispense a polishing pad precursor by droplet jetting; a second dispenser configured to dispense a sacrificial material; at least one an energy source; and a controller configured to receive data indicative of a desired shape of a polishing pad manufactured by droplet ejection by the additive manufacturing system, the polishing pad comprising a polishing surface having a one or more partitions separated by one or more grooves, and the first dispenser deposits a plurality of continuous layers on the lower portion of the polishing pad by spraying droplets, wherein the controller is configured such that the first A dispenser delivers the polishing pad precursor to first regions corresponding to the partitions of the polishing pad, and causes the second dispenser to deliver the sacrificial material to multiple first regions adjacent to the first regions. a second area to form a lining to the bisection Walls of the vertical surface of the partitions, wherein the gaps between adjacent partitions correspond to the grooves in the polishing pad. 如請求項16所述之積層製造系統，其中該控制器經配置以使得一分配器藉由液滴噴射沉積複數個第一連續層以形成該拋光墊的一下部，及沉積在該拋光墊的該下部上的複數個連續層提供複數個第二連續層。 The additive manufacturing system of claim 16, wherein the controller is configured such that a dispenser deposits a plurality of first continuous layers by droplet jetting to form a lower portion of the polishing pad, and deposits on the polishing pad The plurality of continuous layers on the lower portion provides a plurality of second continuous layers. 如請求項16所述之積層製造系統，包含一第三分配器，經配置以藉由液滴噴射分配一第二拋光墊前驅物。 The additive manufacturing system of claim 16, comprising a third dispenser configured to dispense a second polishing pad precursor by droplet ejection. 如請求項16所述之積層製造系統，其中該第二分配器經配置以藉由液滴噴射分配該犧牲材料。 The additive manufacturing system of claim 16, wherein the second dispenser is configured to dispense the sacrificial material by droplet jetting. 如請求項16所述之積層製造系統，其中第一能量源包含一UV光源。 The additive manufacturing system as claimed in claim 16, wherein the first energy source includes a UV light source.
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