TWI794219B - Optical waveguide component connector set and method for manufacturing optical waveguide component connector - Google Patents

Optical waveguide component connector set and method for manufacturing optical waveguide component connector Download PDF

Info

Publication number
TWI794219B
TWI794219B TW107111271A TW107111271A TWI794219B TW I794219 B TWI794219 B TW I794219B TW 107111271 A TW107111271 A TW 107111271A TW 107111271 A TW107111271 A TW 107111271A TW I794219 B TWI794219 B TW I794219B
Authority
TW
Taiwan
Prior art keywords
groove
optical waveguide
connector
opening
longitudinal groove
Prior art date
Application number
TW107111271A
Other languages
Chinese (zh)
Other versions
TW201842369A (en
Inventor
人
辻田雄一
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW201842369A publication Critical patent/TW201842369A/en
Application granted granted Critical
Publication of TWI794219B publication Critical patent/TWI794219B/en

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3608—Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/381—Dismountable connectors, i.e. comprising plugs of the ferrule type, e.g. fibre ends embedded in ferrules, connecting a pair of fibres
    • G02B6/3817—Dismountable connectors, i.e. comprising plugs of the ferrule type, e.g. fibre ends embedded in ferrules, connecting a pair of fibres containing optical and electrical conductors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3873—Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
    • G02B6/3885—Multicore or multichannel optical connectors, i.e. one single ferrule containing more than one fibre, e.g. ribbon type

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Mechanical Coupling Of Light Guides (AREA)

Abstract

一種光波導構件連接器組，具備光波導構件及連接器，該光波導構件具備光波導，該連接器具有可以容置光波導構件的容置空間，連接器具有在光波導構件已容置於容置空間時，從連接器的外部到達光波導構件的開口部，光波導構件及連接器的至少一者具有溝，該溝是在光波導構件已容置於容置空間時連通於開口部，且面對光波導構件及連接器的至少另一者。 An optical waveguide component connector set, comprising an optical waveguide component and a connector, the optical waveguide component has an optical waveguide, the connector has an accommodation space for accommodating the optical waveguide component, and the connector has an optical waveguide component that has been accommodated in When the accommodating space reaches the opening of the optical waveguide member from the outside of the connector, at least one of the optical waveguide member and the connector has a groove that communicates with the opening when the optical waveguide member is accommodated in the accommodating space , and face at least the other of the optical waveguide member and the connector.

Description

光波導構件連接器組及光波導構件連接器的製造方法 Optical waveguide component connector set and method for manufacturing optical waveguide component connector

發明領域 field of invention

本發明是有關於一種光波導構件連接器組、光波導構件連接器及其製造方法，詳而言之，是有關於光波導構件連接器組、使用該光波導構件連接器組的光波導構件連接器的製造方法、以及藉該製造方法所製造的光波導構件連接器。 The present invention relates to an optical waveguide component connector set, an optical waveguide component connector and a manufacturing method thereof, and more specifically, relates to an optical waveguide component connector set and an optical waveguide component using the optical waveguide component connector set A manufacturing method of a connector, and an optical waveguide member connector manufactured by the manufacturing method.

發明背景 Background of the invention

以往以來，將光波導容置於連接器以製造光波導連接器之作法是已知的。 Conventionally, it is known to accommodate an optical waveguide in a connector to manufacture an optical waveguide connector.

已有下述方法被提出：將光波導沿著前後方向***具有於前後方向上貫通之貫通溝、及於上下方向上連通之窗部的光波導用連接器的貫通溝，之後，於窗部充填固定用樹脂材料，以將光波導固定於光波導用連接器(參照例如專利文獻1)。 A method has been proposed in which an optical waveguide is inserted along the front-rear direction into a through-groove of a connector for an optical waveguide having a through-groove penetrating in the front-rear direction and a window portion communicating in the up-down direction, and then inserting the optical waveguide in the window portion A fixing resin material is filled to fix the optical waveguide to the optical waveguide connector (see, for example, Patent Document 1).

先前技術文獻 prior art literature

專利文獻 patent documents

專利文獻1：日本專利特開2011-48157號公報 Patent Document 1: Japanese Patent Laid-Open No. 2011-48157

發明概要 Summary of the invention

但是，在專利文獻1的方法中，是僅藉由充填至窗部的固定用樹脂材料，使光波導接著於光波導用連接器，而有光波導與光波導用連接器的接著並不充分這樣的不良狀況。 However, in the method of Patent Document 1, the optical waveguide is bonded to the optical waveguide connector only by filling the fixing resin material in the window portion, and the bonding between the optical waveguide and the optical waveguide connector is not sufficient. Such bad condition.

本發明是提供一種可以提升光波導對連接器之接著力的光波導構件連接器組、光波導構件連接器及其製造方法。 The present invention provides an optical waveguide component connector group, an optical waveguide component connector and a manufacturing method thereof that can improve the bonding force of the optical waveguide to the connector.

本發明(1)包含一種光波導構件連接器組，其具備：光波導構件，具備光波導；及連接器，具有可以容置前述光波導構件的容置空間，前述連接器具有在前述光波導構件已容置於前述容置空間時，從前述連接器的外部到達前述光波導構件的開口部，前述光波導構件及前述連接器的至少一者具有溝，該溝是在前述光波導構件已容置於前述容置空間時，連通於前述開口部，且面對前述光波導構件及連接器的至少另一者。 The present invention (1) includes an optical waveguide member connector set comprising: an optical waveguide member having an optical waveguide; and a connector having a housing space capable of accommodating the aforementioned optical waveguide member. When the member is accommodated in the accommodating space, it reaches the opening of the optical waveguide member from the outside of the connector, and at least one of the optical waveguide member and the connector has a groove formed on the surface of the optical waveguide member. When accommodated in the accommodating space, it communicates with the opening and faces at least the other of the optical waveguide member and the connector.

在該光波導構件連接器組中，光波導及連接器的至少一者中具有溝，該溝是在光波導已容置於容置空間時，連通於開口部，且面對光波導及連接器的至少另一者。因此，只要將接著劑注入開口部，接著劑即從開口部流入溝中。其結果，可對開口部、還有溝皆充填接著劑。 由於已充填至溝中的接著劑，會面對光波導構件及連接器的至少另一者，所以可以提升光波導構件對連接器的接著力。 In this optical waveguide member connector group, at least one of the optical waveguide and the connector has a groove, which communicates with the opening when the optical waveguide is accommodated in the accommodation space, and faces the optical waveguide and the connector. at least another one of the devices. Therefore, as long as the adhesive is injected into the opening, the adhesive flows into the groove from the opening. As a result, both the opening and the groove can be filled with the adhesive. Since the adhesive filled in the groove faces at least the other of the optical waveguide member and the connector, the adhesive force of the optical waveguide member to the connector can be improved.

本發明(2)包含(1)所記載之光波導構件連接器組，其中前述開口部有複數個，而在前述光波導構件已容置於前述容置空間時，透過前述溝來互相連通。 The present invention (2) includes the optical waveguide member connector set described in (1), wherein the openings are plural and communicate with each other through the groove when the optical waveguide members are housed in the accommodating space.

當溝中殘留有空氣時，會使接著劑變得難以流入溝中，但在該光波導構件連接器組中，只要使接著劑從複數個開口部當中的一個開口部流入溝中，即可以讓空氣從其他開口部逸散。因此，可以將接著劑有效率地充填至溝中。其結果，可進一步提升光波導構件對連接器的接著力。 When air remains in the groove, it will be difficult for the adhesive to flow into the groove. However, in this optical waveguide connector set, the adhesive can be flowed into the groove from one of the plurality of openings. Allow air to escape through other openings. Therefore, the adhesive can be efficiently filled into the groove. As a result, the adhesive force of the optical waveguide member to the connector can be further improved.

本發明(3)包含如(1)或(2)所記載之光波導構件連接器組，其中前述連接器具備：具有壁之本體；及蓋件，在前述光波導構件已容置於前述容置空間時，與前述壁一起夾住前述光波導構件。 The present invention (3) includes the optical waveguide component connector set as described in (1) or (2), wherein the aforementioned connector has: a body with a wall; When placing in a space, the aforementioned optical waveguide member is clamped together with the aforementioned wall.

在該光波導構件連接器組中，由於連接器具備具有壁之本體、及蓋件，所以可以在光波導已容置於容置空間時，藉由壁與蓋件夾住光波導，以將光波導相對於連接器定位。因此，可以精度良好地接著光波導及連接器。 In this optical waveguide member connector set, since the connector has a body having walls and a cover, the optical waveguide can be clamped by the walls and the cover when the optical waveguide is accommodated in the accommodation space, so as to The optical waveguide is positioned relative to the connector. Therefore, the optical waveguide and the connector can be bonded with high precision.

本發明(4)包含如(1)至(3)中任一項所記載之光波導構件連接器組，其中前述光波導構件是更具備電路基板的光電混合基板。 The present invention (4) includes the optical waveguide member connector set described in any one of (1) to (3), wherein the optical waveguide member is an optoelectronic hybrid board further provided with a circuit board.

在該光波導構件連接器組中，可以提升光電 混合基板對連接器的接著力。 In this optical waveguide component connector group, the optoelectronic Adhesion of hybrid substrates to connectors.

本發明(5)包含一種光波導構件連接器的製造方法，其具備：第1步驟，將如(1)至(4)中任一項所記載之光波導構件連接器組中的前述光波導構件容置於前述容置空間；及第2步驟，在前述第1步驟之後，將具有流動性的接著劑注入前述開口部，使前述接著劑從前述開口部流入前述溝，藉此將前述光波導構件接著於前述連接器。 (5) of the present invention includes a method of manufacturing an optical waveguide component connector, which includes: a first step, the aforementioned optical waveguide in the optical waveguide component connector set described in any one of (1) to (4) The component is accommodated in the aforementioned accommodating space; and the second step is, after the aforementioned first step, injecting a fluid adhesive into the aforementioned opening, so that the aforementioned adhesive flows into the aforementioned groove from the aforementioned opening, whereby the aforementioned light The waveguide component is followed by the aforementioned connector.

在該光波導構件連接器的製造方法中，由於可以在第2步驟中，對開口部並且也對溝充填接著劑，所以可以提升光波導構件對連接器的接著力。 In this method of manufacturing the optical waveguide member connector, since the opening and also the groove can be filled with an adhesive in the second step, the adhesive force of the optical waveguide member to the connector can be improved.

本發明(6)包含一種光波導構件連接器，其具備光波導構件、及容置前述光波導構件的連接器，前述連接器具有從前述連接器的外部到達前述光波導構件的開口部，前述光波導構件及前述連接器的至少一者具有溝，該溝是連通於前述開口部，且面對前述光波導構件及連接器的至少另一者，且於前述開口部及前述溝中充填有接著劑。 The present invention (6) includes an optical waveguide member connector comprising an optical waveguide member and a connector for accommodating the optical waveguide member, the connector having an opening reaching the optical waveguide member from the outside of the connector, the At least one of the optical waveguide member and the connector has a groove that communicates with the opening and faces at least the other of the optical waveguide member and the connector, and the opening and the groove are filled with Adhesive.

在該光波導構件連接器中，是在開口部並且也在溝中充填有接著劑。因此，可以提升光波導構件對連接器的接著力。 In this optical waveguide member connector, the opening and also the groove are filled with an adhesive. Therefore, the adhesive force of the optical waveguide member to the connector can be improved.

根據本發明之光波導構件連接器組、光波導構件連接器及其製造方法，可以提升光波導構件對連接器的接著力。 According to the optical waveguide component connector set, the optical waveguide component connector and the manufacturing method thereof of the present invention, the adhesive force of the optical waveguide component to the connector can be improved.

1:連接器組 1: Connector set

2:光電混合基板 2: Photoelectric hybrid substrate

3:連接器 3: Connector

4:電路基板 4: Circuit board

5:光波導 5: Optical waveguide

6:金屬支持層 6: Metal support layer

7:基底絕緣層 7: base insulating layer

8:導體層 8: Conductor layer

9:覆蓋絕緣層 9: Cover the insulating layer

10:下包覆層 10: Lower cladding layer

11:芯材層 11: Core material layer

12:上包覆層 12: Upper cladding layer

13:裝設部 13: Installation Department

14:基板突出部 14: Protruding part of substrate

15:第1前嵌合面 15: The first front fitting surface

16:第1後嵌合面 16: 1st back fitting surface

17:第1連結面 17: The first connecting surface

18:光電混合基板連接器 18: Optical hybrid substrate connector

19:護緣部 19: Edge guard

19:接著劑 19: adhesive

21:本體 21: Ontology

22:蓋件 22: cover

23:底壁 23: bottom wall

24:延伸壁 24: Extension wall

25:本體凹部 25: Body recess

26:第2前嵌合面 26: The second front fitting surface

27:第2後嵌合面 27: The second posterior fitting surface

28:第2連結面 28: The second connecting surface

29:容置空間 29:Accommodating space

30:蓋件突出部 30: Cover protrusion

31:第3前嵌合面 31: The 3rd front fitting surface

32:第3後嵌合面 32: 3rd posterior fitting surface

33:第3連結面 33: The third connection surface

34:蓋件凹部 34: Cover recess

35:基板凹部 35: Substrate recess

40:中央横溝 40: Central horizontal groove

41:第1横溝 41: 1st horizontal groove

42:第2横溝 42: The second horizontal groove

43:第3横溝 43: 3rd horizontal groove

44:第4横溝 44: The 4th horizontal groove

45:第5横溝 45:5th horizontal groove

50:後縱溝 50: Rear longitudinal groove

51:第1後縱溝 51: 1st rear longitudinal groove

52:第2後縱溝 52: The second rear longitudinal groove

53:第3後縱溝 53: 3rd rear longitudinal groove

54:第4後縱溝 54: The 4th rear longitudinal groove

55:縱溝 55: Longitudinal groove

60:前縱溝 60: front longitudinal groove

61:第1前縱溝 61: The first front longitudinal groove

62:第2前縱溝 62: The second front longitudinal groove

63:第3前縱溝 63: The 3rd front longitudinal groove

64:第4前縱溝 64: The 4th front longitudinal groove

66:前下開口 66: front lower opening

67:前上開口 67: Front upper opening

70:開口部 70: Opening

71:中央下開口 71:Central lower opening

72:中央上開口 72: central upper opening

73:第3開口部 73: The third opening

74:第4開口部 74: 4th opening

75:第5開口部 75: 5th opening

76:第6開口部 76: 6th opening

77:第1側開口部 77: 1st side opening

78:第2側開口部 78: Second side opening

80:前橫溝 80: front transverse groove

81:第1前橫溝 81: The first front transverse groove

82:第2前橫溝 82: The second front transverse groove

83:第3前橫溝 83: The 3rd front transverse groove

84:第4前橫溝 84: The 4th front transverse groove

85:上下溝 85: upper and lower ditch

88:光波導連接器 88:Optical waveguide connector

90:配線 90: Wiring

91:端子部 91: Terminal part

92:鏡面 92:Mirror

圖1A~圖1C是本發明之第1實施形態的連接器組的立體圖，圖1A顯示蓋件，圖1B顯示光電混合基板，圖1C顯示本體。 1A to 1C are perspective views of the connector set according to the first embodiment of the present invention. FIG. 1A shows the cover, FIG. 1B shows the photoelectric hybrid substrate, and FIG. 1C shows the body.

圖2A~圖2D為圖1A~圖1C所示之光電混合基板連接器組的平面圖及仰視圖，圖2A顯示蓋件的仰視圖，圖2B顯示光電混合基板的平面圖，圖2C顯示光電混合基板的仰視圖，圖2D顯示本體的平面圖。 2A to 2D are the plan view and bottom view of the photoelectric hybrid substrate connector group shown in Fig. 1A to Fig. 1C, Fig. 2A shows the bottom view of the cover, Fig. 2B shows the plan view of the photoelectric hybrid substrate, and Fig. 2C shows the photoelectric hybrid substrate The bottom view of Figure 2D shows the plan view of the body.

圖3是顯示由圖1A~圖2D所示之光電混合基板連接器組所製造的光電混合基板連接器的立體圖。 FIG. 3 is a perspective view showing an opto-hybrid connector manufactured by the opto-hybrid connector group shown in FIG. 1A to FIG. 2D .

圖4是顯示圖3所示之光電混合基板連接器的平面圖。 FIG. 4 is a plan view showing the photoelectric hybrid board connector shown in FIG. 3 .

圖5是圖4所示的光電混合基板連接器，圖5A顯示沿著a-a線的截面圖，圖5B顯示前視圖。 Fig. 5 is the photoelectric hybrid substrate connector shown in Fig. 4, Fig. 5A shows a cross-sectional view along line a-a, and Fig. 5B shows a front view.

圖6是顯示圖4之光電混合基板連接器沿著b-b線的截面圖。 FIG. 6 is a cross-sectional view showing the opto-electric hybrid substrate connector of FIG. 4 along line b-b.

圖7是顯示圖3所示之光電混合基板連接器之變形例的立體圖。 FIG. 7 is a perspective view showing a modified example of the opto-electric hybrid board connector shown in FIG. 3 .

圖8A~圖8D是本發明之第2實施形態及變形例的光電混合基板連接器組的立體圖，圖8A顯示蓋件的仰視圖，圖8B顯示光電混合基板的平面圖，圖8C顯示光電混合基板的仰視圖，圖8D顯示本體的平面圖，圖8E為圖8D之以假想線表示的變形例，且顯示沿著圖8D之a-a線的截面圖。 8A to 8D are perspective views of the photoelectric hybrid substrate connector group according to the second embodiment and modification of the present invention. FIG. 8A shows a bottom view of the cover, FIG. 8B shows a plan view of the photoelectric hybrid substrate, and FIG. 8C shows the photoelectric hybrid substrate. Fig. 8D shows a plan view of the main body, and Fig. 8E is a modified example of Fig. 8D indicated by phantom lines, and shows a cross-sectional view along line a-a of Fig. 8D.

圖9是顯示由圖8A~圖8C所示之光電混合基板連接器組所製造的光電混合基板連接器之對應於圖8D之a-a線的截面圖。 FIG. 9 is a cross-sectional view corresponding to line a-a of FIG. 8D , showing an opto-hybrid substrate connector manufactured by the opto-hybrid substrate connector group shown in FIGS. 8A to 8C .

圖10是顯示沿著圖9所示之光電混合基板連接器的長邊方向的截面圖。 FIG. 10 is a cross-sectional view along the longitudinal direction of the opto-electric hybrid substrate connector shown in FIG. 9 .

圖11是顯示從後方下側觀看圖9及圖10所示之光電混合基板連接器的立體圖。 FIG. 11 is a perspective view showing the photoelectric hybrid board connector shown in FIGS. 9 and 10 viewed from the rear lower side.

圖12A~圖12D是本發明之第3實施形態的光電混合基板連接器組的平面圖及仰視圖，圖12A顯示蓋件的仰視圖，圖12B顯示光電混合基板的平面圖，圖12C顯示光電混合基板的仰視圖，圖12D顯示本體的平面圖。 12A to 12D are the plan view and bottom view of the photoelectric hybrid substrate connector group according to the third embodiment of the present invention. FIG. 12A shows the bottom view of the cover, FIG. 12B shows the plan view of the photoelectric hybrid substrate, and FIG. 12C shows the photoelectric hybrid substrate Figure 12D shows a plan view of the body.

圖13是顯示由圖12A~圖12C所示之光電混合基板連接器組所製造的光電混合基板連接器之對應於圖12A~圖12D之a-a線的截面圖。 FIG. 13 is a cross-sectional view corresponding to line a-a in FIG. 12A to FIG. 12D , showing the optoelectronic hybrid substrate connector manufactured by the optoelectronic hybrid substrate connector group shown in FIGS. 12A to 12C .

圖14是顯示從圖13所示之光電混合基板連接器的後方上側觀看的立體圖。 FIG. 14 is a perspective view showing the optical hybrid board connector shown in FIG. 13 viewed from the rear upper side.

圖15A~圖15E是本發明之第3實施形態及變形例的光電混合基板連接器組的平面圖及仰視圖，圖15A顯示蓋件的仰視圖，圖15B顯示光電混合基板的平面圖，圖15C顯示光電混合基板的仰視圖，圖15D顯示本體的平面圖，圖15E為圖15D之以假想線表示的變形例，且顯示沿著圖15D之a-a線的截面圖。 15A to 15E are the plan view and bottom view of the photoelectric hybrid substrate connector group of the third embodiment and modification of the present invention, FIG. 15A shows the bottom view of the cover, FIG. 15B shows the plan view of the photoelectric hybrid substrate, and FIG. 15C shows The bottom view of the photoelectric hybrid substrate, FIG. 15D shows a plan view of the main body, and FIG. 15E is a modified example of FIG. 15D indicated by phantom lines, and shows a cross-sectional view along line a-a of FIG. 15D.

圖16是顯示從上方前側觀看由圖15~圖15E所示之光電混合基板連接器組所製造的光電混合基板連接器的立體圖。 FIG. 16 is a perspective view showing an opto-hybrid substrate connector manufactured by the opto-hybrid substrate connector group shown in FIGS. 15 to 15E viewed from the upper front side.

圖17A~圖17D是本發明之第3實施形態之變形例的光電混合基板連接器組的平面圖及仰視圖，圖17A顯示蓋件 的仰視圖，圖17B顯示光電混合基板的平面圖，圖17C顯示光電混合基板的仰視圖，圖17D顯示本體的平面圖。 17A to 17D are plan views and bottom views of the photoelectric hybrid substrate connector group according to the modified example of the third embodiment of the present invention, and FIG. 17A shows the cover Figure 17B shows a plan view of the optoelectronic hybrid substrate, Figure 17C shows a bottom view of the optoelectronic hybrid substrate, and Figure 17D shows a plan view of the main body.

圖18A~圖18D是進一步形成之變形例的光電混合基板連接器組的平面圖及仰視圖，圖18A顯示蓋件的仰視圖，圖18B顯示光電混合基板的平面圖，圖18C顯示光電混合基板的仰視圖，圖18D顯示本體的平面圖。 18A to 18D are the plan view and bottom view of the photoelectric hybrid substrate connector group of the further modified example, FIG. 18A shows the bottom view of the cover, FIG. 18B shows the plan view of the photoelectric hybrid substrate, and FIG. 18C shows the bottom view of the photoelectric hybrid substrate Fig. 18D shows a plan view of the body.

圖19A~圖19D是進一步形成之變形例的光電混合基板連接器組的平面圖及仰視圖，圖19A顯示蓋件的仰視圖，圖19B顯示光電混合基板的平面圖，圖19C顯示光電混合基板的仰視圖，圖19D顯示本體的平面圖。 19A to 19D are the plan view and bottom view of the photoelectric hybrid substrate connector group of the further modified example, FIG. 19A shows the bottom view of the cover, FIG. 19B shows the plan view of the photoelectric hybrid substrate, and FIG. 19C shows the bottom view of the photoelectric hybrid substrate Figure, Figure 19D shows a plan view of the body.

圖20A~圖20C是本發明之具體例1的光電混合基板連接器組的平面圖及仰視圖，圖20A顯示蓋件的仰視圖，圖20B顯示光電混合基板的平面圖，圖20C顯示光電混合基板的仰視圖，圖20D顯示本體的平面圖。 20A to 20C are the plan view and bottom view of the photoelectric hybrid substrate connector group of the specific example 1 of the present invention. FIG. 20A shows the bottom view of the cover, FIG. 20B shows the plan view of the photoelectric hybrid substrate, and FIG. 20C shows the photoelectric hybrid substrate. Bottom view, Figure 20D shows a plan view of the body.

圖21A~圖21C是由圖20A~圖20D所示之光電混合基板連接器組所製造的光電混合基板連接器的截面圖，圖21A顯示沿著a-a線的截面圖，圖21B顯示沿著b-b線的截面圖，圖21A顯示沿著c-c線的截面圖。 21A to 21C are cross-sectional views of the photoelectric hybrid substrate connector manufactured by the photoelectric hybrid substrate connector group shown in FIGS. 20A to 20D. FIG. 21A shows a cross-sectional view along line a-a, and FIG. 21B shows a cross-sectional view along b-b A cross-sectional view of the line, Figure 21A shows a cross-sectional view along line c-c.

圖22是顯示由圖20A~圖20D所示之光電混合基板連接器組所製造的光電混合基板連接器之沿著d-d線的截面圖。 FIG. 22 is a cross-sectional view along line d-d showing an opto-electric hybrid substrate connector manufactured by the opto-electric hybrid substrate connector group shown in FIGS. 20A to 20D .

圖23是圖20A~圖20D所示之光電混合基板連接器組的立體圖，圖23A顯示蓋件，圖23B顯示光電混合基板，圖23C顯示本體。 FIG. 23 is a perspective view of the photoelectric hybrid substrate connector group shown in FIGS. 20A to 20D . FIG. 23A shows the cover, FIG. 23B shows the photoelectric hybrid substrate, and FIG. 23C shows the body.

圖24是顯示由圖23A~圖23C所示之光電混合基板連接器組所製造的光電混合基板連接器的立體圖。 FIG. 24 is a perspective view showing an opto-hybrid substrate connector manufactured by the opto-hybrid substrate connector group shown in FIG. 23A to FIG. 23C .

圖25是顯示由本發明之具體例2的光電混合基板連接器組所製造的光電混合基板連接器之沿著長邊方向的截面圖。 FIG. 25 is a cross-sectional view along the longitudinal direction of an opto-hybrid connector manufactured by the opto-hybrid connector set of Embodiment 2 of the present invention.

圖26A~圖26C是本發明之具體例3的光電混合基板連接器組的平面圖及仰視圖，圖26A顯示蓋件的仰視圖，圖26B顯示光電混合基板的平面圖，圖26C顯示光電混合基板的仰視圖，圖26D顯示本體的平面圖。 26A to 26C are the plan view and bottom view of the photoelectric hybrid substrate connector group of the specific example 3 of the present invention. FIG. 26A shows the bottom view of the cover, FIG. 26B shows the plan view of the photoelectric hybrid substrate, and FIG. 26C shows the photoelectric hybrid substrate. Bottom view, Figure 26D shows a plan view of the body.

圖27A~圖27C是由圖26A~圖26D所示之光電混合基板連接器組所製造的光電混合基板連接器的截面圖，圖27A顯示沿著a-a線的截面圖，圖27B顯示沿著b-b線的截面圖，圖27A顯示沿著c-c線的截面圖。 27A to 27C are cross-sectional views of the photoelectric hybrid substrate connector manufactured by the photoelectric hybrid substrate connector group shown in FIGS. 26A to 26D. FIG. 27A shows a cross-sectional view along line a-a, and FIG. 27B shows a cross-sectional view along b-b A cross-sectional view of the line, Figure 27A shows a cross-sectional view along line c-c.

圖28是顯示由圖26A~圖26D所示之光電混合基板連接器組所製造的光電混合基板連接器之沿著d-d線的截面圖。 FIG. 28 is a cross-sectional view along line d-d showing an opto-electric hybrid substrate connector manufactured by the opto-electric hybrid substrate connector group shown in FIGS. 26A to 26D .

用以實施發明之形態 form for carrying out the invention

在圖2A~圖2D中，紙面左右方向為前後方向(長邊方向，第1方向)。紙面右側為前側(長邊方向一側，第1方向一側)，紙面左側為後側(長邊方向另一側，第1方向另一側)。 In FIGS. 2A to 2D , the left-right direction on the paper is the front-rear direction (the long-side direction, the first direction). The right side of the paper is the front side (one side in the longitudinal direction and the first direction side), and the left side of the paper is the rear side (the other side in the long side direction and the other side in the first direction).

在圖2A~圖2D中，紙面上下方向為左右方向(寬度方向，與第1方向正交的第2方向)。紙面上側為右側 (寬度方向一側為第2方向一側)，紙面下側為左側(寬度方向另一側為第2方向另一側)。 In FIGS. 2A to 2D , the vertical direction on the paper is the left-right direction (the width direction, the second direction perpendicular to the first direction). The upper side of the paper is the right side (One side in the width direction is the second direction side), and the lower side of the paper is the left side (the other side in the width direction is the other side in the second direction).

在圖2A~圖2D中，紙面紙厚方向為上下方向(厚度方向，與第1方向及第2方向正交的第3方向)。紙面近前側為上側(厚度方向一側，第3方向一側)，紙面裏側為下側(厚度方向另一側，第3方向另一側)。 In FIGS. 2A to 2D , the sheet thickness direction is the up-down direction (thickness direction, third direction perpendicular to the first direction and the second direction). The front side of the paper is the upper side (one side in the thickness direction, one side in the third direction), and the back side in the paper is the lower side (the other side in the thickness direction, the other side in the third direction).

具體而言，方向是遵循各圖之方向箭號。 Specifically, the directions follow the direction arrows of the respective figures.

並無以該方向之定義來限定後述之連接器組1及光電混合基板連接器18(後述)的製造時及使用時的方向之用意。 The definition of this direction is not intended to limit the directions during manufacture and use of the connector set 1 and the photoelectric hybrid board connector 18 (described later) described later.

再者，在圖4中，為了明確顯示中央横溝40(後述)的形狀以及配置，而省略接著劑19(後述)。又，在各立體圖中，將基底絕緣層7、覆蓋絕緣層9、下包覆層10、芯材層11及上包覆層12(後述)省略，以明確顯示包含其等之電路基板4及光波導5的形狀及配置。 In addition, in FIG. 4 , in order to clearly show the shape and arrangement of the central lateral groove 40 (described later), the adhesive 19 (described later) is omitted. In addition, in each perspective view, the insulating base layer 7, the insulating cover layer 9, the lower cladding layer 10, the core material layer 11, and the upper cladding layer 12 (described later) are omitted to clearly show the circuit board 4 and the circuit board 4 including them. The shape and arrangement of the optical waveguide 5 .

(第1實施形態) (first embodiment)

(光電混合基板連接器組1的基本構成) (Basic configuration of opto-electrical hybrid board connector set 1)

如圖1~圖3所示，該光電混合基板連接器組1是用於將作為光波導構件之一例的光電混合基板2裝設於連接器3，以製造作為光波導構件連接器之一例的光電混合基板連接器18的連接器組。具體而言，連接器組1以分開方式具備光電混合基板2與連接器3。 As shown in FIGS. 1 to 3 , this photoelectric hybrid board connector set 1 is used to mount an photoelectric hybrid board 2 as an example of an optical waveguide member to a connector 3 to manufacture a connector as an example of an optical waveguide member. Connector set of opto-electrical hybrid board connector 18 . Specifically, the connector set 1 includes an opto-electric hybrid board 2 and a connector 3 separately.

再者，光電混合基板連接器組1並非光電混合基板連接器18的完成品，而是零件的套組，且可將連接 器2及光電混合基板3成套販售。 Furthermore, the photoelectric hybrid substrate connector set 1 is not a finished product of the photoelectric hybrid substrate connector 18, but a set of parts, and the connection The device 2 and the photoelectric hybrid board 3 are sold as a set.

在以下的說明中，光電混合基板連接器組1有時是簡稱為連接器組1。 In the following description, the opto-electric hybrid board connector set 1 is sometimes simply referred to as the connector set 1 .

如圖1A、圖2B及圖2C所示，光電混合基板2具有在前後方向上延伸的大致平板形狀。又，光電混合基板2具有例如可撓性(撓曲性或可塑性)。光電混合基板2具有例如下述的平面視角下形狀：後端部及前端部(相當於後述之裝設部13)的寬度方向兩端緣，相對於其等以外的寬度方向兩端緣位於外側。如圖5A、圖5B及圖6所示，光電混合基板2是朝向上側依序具備電路基板4、及光波導5，將在之後詳細敘述。 As shown in FIGS. 1A , 2B, and 2C, the opto-electric hybrid substrate 2 has a substantially flat plate shape extending in the front-rear direction. In addition, the photoelectric hybrid substrate 2 has, for example, flexibility (flexibility or plasticity). The opto-electric hybrid board 2 has, for example, a shape in plan view in which both ends in the width direction of the rear end portion and the front end portion (corresponding to the mounting portion 13 described later) are located on the outside with respect to the other end edges in the width direction. . As shown in FIG. 5A , FIG. 5B and FIG. 6 , the photoelectric hybrid board 2 includes a circuit board 4 and an optical waveguide 5 sequentially facing upward, which will be described in detail later.

電路基板4是形成光電混合基板2的下表面。 The circuit board 4 forms the lower surface of the photoelectric hybrid board 2 .

電路基板4是朝向厚度方向下側而依序具備金屬支撐層6、基底絕緣層7、導體層8、及覆蓋絕緣層9。 The circuit board 4 includes a metal supporting layer 6 , an insulating base layer 7 , a conductor layer 8 , and an insulating cover layer 9 in this order toward the lower side in the thickness direction.

金屬支撐層6是支撐導體層8。金屬支撐層6是設於電路基板4的後端部，且進行接著說明的基底絕緣層7的前端部及前後方向途中部的下表面的露出。 The metal support layer 6 is a support conductor layer 8 . The metal support layer 6 is provided at the rear end portion of the circuit board 4 , and exposes the lower surface of the front end portion and the middle portion in the front-back direction of the insulating base layer 7 , which will be described later.

基底絕緣層7是使金屬支撐層6與導體層8絕緣。基底絕緣層7是設於電路基板4的整個區域。作為基底絕緣層7的材料，可列舉例如聚醯亞胺等的樹脂。基底絕緣層7的厚度為例如2μm以上、且60μm以下。 The insulating base layer 7 insulates the metal support layer 6 from the conductor layer 8 . The insulating base layer 7 is provided over the entire area of the circuit board 4 . Examples of the material of the insulating base layer 7 include resins such as polyimide. The thickness of the insulating base layer 7 is, for example, not less than 2 μm and not more than 60 μm.

導體層8是設於電路基板4中的至少後端部。又，導體層8是在寬度方向上隔著間隔而成行配置有複數個。導體層8包含配線90與設於其後端部的端子部 91。作為導體層8的材料，可列舉例如導體。導體層8的厚度為例如2μm以上，且為例如100μm以下。 Conductive layer 8 is provided on at least the rear end portion of circuit board 4 . Moreover, a plurality of conductive layers 8 are arranged in a row at intervals in the width direction. The conductor layer 8 includes wiring 90 and a terminal portion provided at the rear end thereof. 91. As a material of the conductor layer 8, a conductor is mentioned, for example. The thickness of the conductive layer 8 is, for example, 2 μm or more and, for example, 100 μm or less.

覆蓋絕緣層9是被覆配線90以進行保護的保護層。另一方面，覆蓋絕緣層9會使端子部91露出。覆蓋絕緣層9的材料與基底絕緣層7的材料是同樣的。覆蓋絕緣層9的厚度為例如2μm以上、且60μm以下。 The insulating cover layer 9 is a protective layer covering and protecting the wiring 90 . On the other hand, covering the insulating layer 9 exposes the terminal portion 91 . The material of the insulating cover layer 9 is the same as that of the insulating base layer 7 . The thickness of the insulating cover layer 9 is, for example, not less than 2 μm and not more than 60 μm.

光波導5是形成光電混合基板2的上表面。光波導5是位於電路基板4之上。光波導5是長條型光波導，且具體而言，是朝上側而依序具備下包覆層10、芯材層11、及上包覆層12。 The optical waveguide 5 forms the upper surface of the photoelectric hybrid substrate 2 . The optical waveguide 5 is located on the circuit substrate 4 . The optical waveguide 5 is an elongated optical waveguide, and specifically, includes a lower cladding layer 10 , a core material layer 11 , and an upper cladding layer 12 in this order facing upward.

下包覆層10具有與光波導5相同的平面視角下形狀之大致板形狀。下包覆層10是設於金屬支撐層6及基底絕緣層7的上表面。 The lower cladding layer 10 has a substantially plate shape having the same planar view shape as the optical waveguide 5 . The lower cladding layer 10 is disposed on the upper surfaces of the metal supporting layer 6 and the insulating base layer 7 .

芯材層11是設於下包覆層10的上表面。芯材層11是在寬度方向上互相隔著間隔而配置有複數個。複數個芯材層11具有沿著前後方向的直線形狀。再者，芯材層11在其後端部具有鏡面92。 The core material layer 11 is disposed on the upper surface of the lower cladding layer 10 . A plurality of core material layers 11 are arranged at intervals in the width direction. The plurality of core material layers 11 have a linear shape along the front-back direction. Furthermore, the core layer 11 has a mirror surface 92 at its rear end.

上包覆層12是設置成在下包覆層10的上表面被覆芯材層11。上包覆層12具有與下包覆層10相同的平面視角下形狀之大致板形狀。 The upper cladding layer 12 is provided so as to cover the core material layer 11 on the upper surface of the lower cladding layer 10 . The upper cladding layer 12 has a substantially plate shape having the same planar view shape as that of the lower cladding layer 10 .

作為下包覆層10、芯材層11及上包覆層12的材料，可列舉例如環氧樹脂等的透明性樹脂。下包覆層10、芯材層11及上包覆層12當中，相對於下包覆層10及上包覆層12的折射率，芯材層11的折射率較高。 Examples of materials for the lower cladding layer 10, the core material layer 11, and the upper cladding layer 12 include transparent resins such as epoxy resins. Among the lower cladding layer 10 , the core material layer 11 and the upper cladding layer 12 , the refractive index of the core material layer 11 is higher than that of the lower cladding layer 10 and the upper cladding layer 12 .

並且，該光電混合基板2的前端部是設為裝設於連接器3的裝設部13。 In addition, the front end portion of the opto-electric hybrid board 2 is provided as the mounting portion 13 mounted on the connector 3 .

如圖1B、圖2B及圖2C所示，裝設部13之寬度方向兩端緣的前後方向中央部，是比裝設部13之寬度方向兩端緣的前後兩端部更位於寬度方向兩外側。因此，裝設部13包含前後方向中央部朝寬度方向兩外側突出的2個基板突出部14。 As shown in Fig. 1B, Fig. 2B and Fig. 2C, the central part of the front and back direction of the two ends of the width direction of the installation part 13 is located on the two ends of the width direction of the installation part 13 than the front and rear ends of the two ends of the width direction of the installation part 13. outside. Therefore, the mounting portion 13 includes two substrate protruding portions 14 whose central portion in the front-rear direction protrudes toward both outer sides in the width direction.

2個基板突出部14在平面視角下具有大致矩形狀。具體而言，2個基板突出部14的每一個具有：第1前嵌合面15，在寬度方向上延伸；第1後嵌合面16，隔著間隔而相向配置於第1前嵌合面15的後側；及第1連結面17，連結第1前嵌合面15及第1後嵌合面16的寬度方向外側端緣。 The two substrate protrusions 14 have a substantially rectangular shape in plan view. Specifically, each of the two substrate protrusions 14 has: a first front fitting surface 15 extending in the width direction; and a first rear fitting surface 16 disposed opposite to the first front fitting surface with a gap therebetween. 15 rear side; and the first connection surface 17, which connects the width direction outer edge of the first front fitting surface 15 and the first rear fitting surface 16.

第1前嵌合面15及第1後嵌合面16的寬度方向長度(基板突出部14的突出長度)為例如0.01mm以上，較佳為0.05mm以上，又，為例如1mm以下，較佳為0.5mm以下。第1連結面17的前後方向長度(第1前嵌合面15及第1後嵌合面16之間的長度)為例如0.01mm以上，較佳為0.1mm以上，又，為例如5mm以下，較佳為1mm以下。 The length in the width direction of the first front fitting surface 15 and the first rear fitting surface 16 (the protruding length of the substrate protrusion 14 ) is, for example, 0.01 mm or more, preferably 0.05 mm or more, and is, for example, 1 mm or less, preferably 1 mm or less. 0.5mm or less. The length in the front-rear direction of the first connecting surface 17 (the length between the first front fitting surface 15 and the first rear fitting surface 16) is, for example, 0.01 mm or more, preferably 0.1 mm or more, and is, for example, 5 mm or less. Preferably it is 1 mm or less.

在該電路基板4上設有將在後續詳述的2個中央横溝40。 Two central lateral grooves 40 , which will be described in detail later, are provided on the circuit board 4 .

如圖1A及圖1C所示，在連接器3中，除了後述之開口部70(參照圖3及圖4)及溝30以外的基本構成，與符合於例如JPCA規格(PMT光學連接器的詳細規格， JPCA-PE03-01-07S-2006，社團法人日本電子電路工業會)的PMT光學連接器相同。 As shown in FIG. 1A and FIG. 1C, in the connector 3, except for the opening 70 (refer to FIG. 3 and FIG. 4) and the groove 30 described later, the basic configuration conforms to, for example, the JPCA standard (PMT optical connector specification). Specification, The PMT optical connector of JPCA-PE03-01-07S-2006, Japan Electronic Circuit Industry Association) is the same.

具體而言，連接器3是以分開方式具備本體21與蓋件22。 Specifically, the connector 3 is provided with a main body 21 and a cover 22 in a separate manner.

如圖1C、圖2D及圖5B所示，本體21具有朝上側開放之前視視角下的「ㄈ」字形狀。因此，本體21在其內側具有容置空間29。本體21是一體地具備作為壁之一例的底壁23、及2個延伸壁24。 As shown in FIG. 1C , FIG. 2D and FIG. 5B , the main body 21 has a "ㄈ" shape in the front view angle when it opens upward. Therefore, the body 21 has an accommodating space 29 inside it. The main body 21 integrally includes a bottom wall 23 as an example of a wall, and two extension walls 24 .

底壁23具有在左右方向上延伸之大致矩形平板形狀。 The bottom wall 23 has a substantially rectangular flat plate shape extending in the left-right direction.

延伸壁24具有從底壁23的左右兩端緣朝上側延伸的形狀。2個延伸壁24的每一個具有在上下方向上延伸之大致矩形平板形狀。再者，2個延伸壁24的內表面與底壁23的底面一起區隔出用於容置光電混合基板2的容置空間29。 The extension wall 24 has a shape extending upward from the left and right end edges of the bottom wall 23 . Each of the two extension walls 24 has a substantially rectangular flat plate shape extending in the vertical direction. Furthermore, the inner surfaces of the two extension walls 24 and the bottom surface of the bottom wall 23 together define an accommodating space 29 for accommodating the optoelectronic hybrid substrate 2 .

延伸壁24之內表面的前後方向中央部是相對於延伸壁24之內表面的前後兩端部而位於寬度方向外側。藉此，延伸壁24之內表面的前後方向中央部包含朝寬度方向兩外側凹陷的本體凹部25。本體凹部25是藉由在延伸壁24中將內表面(面向容置空間29的內表面)朝向寬度方向兩外側凹陷所形成。 The front-rear central portion of the inner surface of the extension wall 24 is located on the outer side in the width direction with respect to the front and rear end portions of the inner surface of the extension wall 24 . Thereby, the central portion in the front-rear direction of the inner surface of the extension wall 24 includes body recesses 25 that are recessed toward both outer sides in the width direction. The body recess 25 is formed by denting the inner surface (the inner surface facing the accommodating space 29 ) in the extension wall 24 toward both outer sides in the width direction.

本體凹部25具有：第2前嵌合面26，在寬度方向上延伸；第2後嵌合面27，隔著間隔而相向配置於第2前嵌合面26的後側；及第2連結面28，連結第2前嵌合面26 及第2後嵌合面27的寬度方向外側端緣。 The body recess 25 has: a second front fitting surface 26 extending in the width direction; a second rear fitting surface 27 disposed opposite to the rear side of the second front fitting surface 26 with a gap therebetween; and a second connecting surface 28, connect the second front fitting surface 26 And the width direction outer edge of the second rear fitting surface 27 .

如圖3、圖4及圖5A所示，第2前嵌合面26及第2後嵌合面27是構成為在光電混合基板2容置於容置空間29時，可以與光電混合基板2的第1前嵌合面15及第1後嵌合面16各自嵌合(接觸)。具體而言，第2連結面28的長度(第1前嵌合面15及第1連結面17之間的長度)是與第1連結面17的長度相同。 As shown in Fig. 3, Fig. 4 and Fig. 5A, the second front mating surface 26 and the second rear mating surface 27 are configured so that when the photoelectric hybrid substrate 2 is accommodated in the accommodating space 29, they can be connected with the photoelectric hybrid substrate 2. The first front fitting surface 15 and the first rear fitting surface 16 are fitted (contacted) respectively. Specifically, the length of the second connection surface 28 (the length between the first front fitting surface 15 and the first connection surface 17 ) is the same as the length of the first connection surface 17 .

又，第2連結面28是構成為在光電混合基板2容置於容置空間29時，可以和光電混合基板2的第1連結面17、與第2前嵌合面26及第2後嵌合面27的寬度方向兩外側部分一起形成開口部70。具體而言，第2前嵌合面26及第2後嵌合面27的長度(本體凹部25的深度)是超過第1前嵌合面15及第1後嵌合面16的長度(基板突出部14的突出長度)。再者，第2連結面28的全部是用於形成開口部70(後述之中央下開口71及中央上開口72)的開口部形成面。另一方面，第1連結面17的全部，也是用於形成中央下開口71的開口部形成面。 Again, the second connection surface 28 is configured so that when the photoelectric hybrid substrate 2 is accommodated in the accommodating space 29, it can be fitted with the first connection surface 17 of the photoelectric hybrid substrate 2, with the second front fitting surface 26 and the second rear fitting surface. Both outer portions in the width direction of the joining surface 27 together form an opening 70 . Specifically, the length of the second front fitting surface 26 and the second rear fitting surface 27 (the depth of the main body recess 25) is longer than the length of the first front fitting surface 15 and the first rear fitting surface 16 (the base plate protrudes). protruding length of part 14). In addition, the whole of the second connection surface 28 is an opening forming surface for forming the opening 70 (the central lower opening 71 and the central upper opening 72 which will be described later). On the other hand, the entire first connection surface 17 is also an opening forming surface for forming the central lower opening 71 .

再者，於延伸壁24的後端部設有朝寬度方向兩外側突出的護緣部19。 Furthermore, the rear end portion of the extension wall 24 is provided with guard portions 19 protruding toward both outer sides in the width direction.

如圖1A、圖2A及圖4所示，蓋件22具有在前後方向上延伸之大致矩形平板形狀。 As shown in FIGS. 1A , 2A and 4 , the cover member 22 has a substantially rectangular flat plate shape extending in the front-rear direction.

又，蓋件22之寬度方向兩端緣的前後方向中央部是相對於蓋件22之寬度方向兩端緣的前後兩端部，位於寬度方向兩外側。藉此，蓋件22包含前後方向中央部朝 寬度方向兩外側突出的2個蓋件突出部30。蓋件突出部30具有：第3前嵌合面31，在寬度方向上延伸；第3後嵌合面32，隔著間隔而相向配置於第3前嵌合面31的後側；及第3連結面33，連結第3前嵌合面31及第3後嵌合面32的寬度方向外側端緣。 Also, the front-back central portions of the widthwise end edges of the cover member 22 are located on both widthwise outer sides with respect to the front-rear end portions of the widthwise end edges of the cover member 22 . Thereby, the cover member 22 includes the center portion in the front-rear direction toward the Two cover protrusions 30 protrude on both outer sides in the width direction. The cover protruding part 30 has: the 3rd front fitting surface 31, extends in the width direction; The connecting surface 33 connects the widthwise outer end edges of the third front fitting surface 31 and the third rear fitting surface 32 .

第3前嵌合面31及第3後嵌合面32，在蓋件22安裝於本體21時，可以與本體21的第2前嵌合面26及第2後嵌合面27各自嵌合(接觸)。又，第3前嵌合面31及第3後嵌合面32的每一個，在光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，是位於與光電混合基板2的第1前嵌合面15及第1後嵌合面16相同的位置上。 The 3rd front fitting surface 31 and the 3rd rear fitting surface 32, when the cover 22 is mounted on the body 21, can be respectively fitted with the 2nd front fitting surface 26 and the 2nd rear fitting surface 27 of the body 21 ( touch). Also, each of the 3rd front fitting surface 31 and the 3rd rear fitting surface 32, when the photoelectric hybrid substrate 2 is housed in the accommodating space 29, and the cover 22 is mounted on the main body 21, is located on the side of the photoelectric hybrid substrate. 2 on the same position as the first front fitting surface 15 and the first rear fitting surface 16.

第3連結面33是構成為在蓋件22安裝於本體21時，可以和本體21的第2連結面28、與本體21的第2前嵌合面26及第2後嵌合面27一起形成開口部70。具體而言，第3前嵌合面31及第3後嵌合面32的長度(蓋件突出部30的突出長度)是短於第2前嵌合面26及第2後嵌合面27的長度。再者，第3連結面33的長度是與第2連結面28的長度、及基板突出部14的突出長度各自相同。 The third connecting surface 33 is configured to form together with the second connecting surface 28 of the main body 21 and the second front fitting surface 26 and the second rear fitting surface 27 of the main body 21 when the cover 22 is mounted on the main body 21. opening 70 . Specifically, the length of the third front fitting surface 31 and the third rear fitting surface 32 (the protruding length of the cover protrusion 30 ) is shorter than that of the second front fitting surface 26 and the second rear fitting surface 27. length. In addition, the length of the 3rd connection surface 33 is the same as the length of the 2nd connection surface 28, and the protrusion length of the board|substrate protrusion part 14, respectively.

第3連結面33是用於形成中央上開口72的開口部形成面。 The third connecting surface 33 is an opening forming surface for forming the central upper opening 72 .

蓋件22的前後方向長度是與本體21的前後方向長度相同。 The length in the front-back direction of the cover member 22 is the same as the length in the front-back direction of the main body 21 .

連接器3為例如硬質，具體而言，是如後述，具有可以將蓋件22相對於光電混合基板2來按壓，而可以 讓本體21被蓋件22按壓的剛性。 The connector 3 is, for example, hard, and specifically, as will be described later, it has the ability to press the cover 22 against the opto-electric hybrid board 2, and can Rigidity to allow the body 21 to be pressed by the cover 22 .

作為連接器3的材料，只要可精度良好地形成上述本體21及蓋件22的形狀，且更具有可承受按壓的機械強度，進而在與接著劑19(後述)的接合性(親和性)上優異即可，並無特別限定，可列舉例如樹脂、金屬，較佳為樹脂，更佳為硬質的樹脂。 As the material of the connector 3, as long as it can form the shape of the above-mentioned body 21 and cover 22 with high precision, and has a mechanical strength that can withstand pressing, and further has an adhesiveness (affinity) with the adhesive 19 (described later). It is not particularly limited as long as it is excellent, and examples thereof include resins and metals, preferably resins, more preferably hard resins.

(中央横溝) (Central horizontal groove)

接著，如圖1A~圖2D所示，連接器組1具備中央横溝40。 Next, as shown in FIGS. 1A to 2D , the connector set 1 has a central lateral groove 40 .

例如，中央横溝40是設置於連接器組1中的光電混合基板2、本體21及/或蓋件22上。例如，中央横溝40具備下述至少任一者：設置於光電混合基板2的第1横溝41及第2横溝42；設置於本體21的第3横溝43；及設置於蓋件22的第4横溝44。 For example, the central transverse groove 40 is disposed on the optoelectronic hybrid substrate 2 , the body 21 and/or the cover 22 in the connector set 1 . For example, the central lateral groove 40 has at least one of the following: a first lateral groove 41 and a second lateral groove 42 provided on the opto-electric hybrid substrate 2; a third lateral groove 43 provided on the body 21; and a fourth lateral groove provided on the cover 22. 44.

接著，說明中央横溝40具備第1横溝41、第2横溝42、第3横溝43、及第4横溝44的全部(4個)的例子。 Next, an example in which the central lateral groove 40 includes all (four) of the first lateral groove 41 , the second lateral groove 42 , the third lateral groove 43 , and the fourth lateral groove 44 will be described.

再者，針對第2横溝42、第3横溝43、及第4横溝44，對於與第1横溝41同樣的構成，將省略其說明。 Note that the description of the second lateral groove 42 , the third lateral groove 43 , and the fourth lateral groove 44 has the same configuration as that of the first lateral groove 41 will be omitted.

如圖1B、圖2B及圖6所示，第1横溝41是設於光電混合基板2的上表面。具體而言，第1横溝41是設於裝設部13中的光波導5的上表面。詳而言之，第1横溝41是設於裝設部13中的上包覆層12的上表面，且具有沿著寬度方向延伸的形狀。第1横溝41具有跨越2個第1連結面17的前後方向中央部之間而延伸之平面視角下的大致直線形 狀。第1横溝41的寬度方向兩端緣的每一個是露出於2個第1連結面17的每一個。 As shown in FIG. 1B , FIG. 2B and FIG. 6 , the first lateral groove 41 is provided on the upper surface of the photoelectric hybrid substrate 2 . Specifically, the first lateral groove 41 is provided on the upper surface of the optical waveguide 5 in the mounting portion 13 . Specifically, the first lateral groove 41 is provided on the upper surface of the upper cladding layer 12 in the mounting portion 13 and has a shape extending in the width direction. The first lateral groove 41 has a substantially linear shape in a planar view and extends across the front-to-rear central portion of the two first connecting surfaces 17 . shape. Each of the widthwise end edges of the first lateral groove 41 is exposed to each of the two first connecting surfaces 17 .

又，在平面視角下，第1横溝41是延伸成橫越芯材層11。又，第1横溝41具有例如將上包覆層12的上表面切出截面大致矩形狀之缺口的形狀。但是，第1横溝41的厚度(深度)是設定為未到達芯材層11。亦即，第1横溝41是不使芯材層11露出(不切斷)，而與芯材層11隔著間隔。 In addition, the first lateral groove 41 extends across the core material layer 11 in a planar view. Furthermore, the first lateral groove 41 has, for example, a shape in which the upper surface of the upper cladding layer 12 is notched with a substantially rectangular cross-section. However, the thickness (depth) of the first lateral groove 41 is set so as not to reach the core material layer 11 . That is, the first lateral groove 41 does not expose the core material layer 11 (is not cut), but is spaced apart from the core material layer 11 .

第1横溝41的深度為例如0.003mm以上，且宜為0.005mm以上，較佳為0.01mm以上，更佳為0.1mm以上，又，為例如1mm以下，且宜為0.5mm以下。第1横溝41的寬度(前後方向長度)為例如0.003mm以上，且宜為0.005mm以上，較佳為0.01mm以上，更佳為0.1mm以上，又，為例如10mm以下，且宜為3mm以下。 The depth of the first lateral groove 41 is, for example, 0.003 mm or more, preferably 0.005 mm or more, preferably 0.01 mm or more, more preferably 0.1 mm or more, and for example, 1 mm or less, preferably 0.5 mm or less. The width (length in the front-back direction) of the first lateral groove 41 is, for example, 0.003 mm or more, preferably 0.005 mm or more, preferably 0.01 mm or more, more preferably 0.1 mm or more, and for example, 10 mm or less, preferably 3 mm or less. .

如圖2C及圖6所示，第2横溝42是設於光電混合基板2的下表面。具體而言，是設於裝設部13中的電路基板4的下表面，且具有沿著寬度方向延伸的形狀。第2横溝42具有跨越2個第1連結面17的前後方向中央部之間而延伸之平面視角下的大致直線形狀。第2横溝42的寬度方向兩端緣的每一個是露出於2個第1連結面17的每一個。在平面視角下，第2横溝42是延伸成橫越配線90(導體層8)。又，第2横溝42具有例如將覆蓋絕緣層9的下表面切出截面大致矩形狀之缺口的形狀。但是，第2横溝42的厚度(深度)是設定為未到達配線90。亦即，第2横溝42是不 使配線90露出(不切斷)，而與配線90隔著間隔。 As shown in FIG. 2C and FIG. 6 , the second lateral groove 42 is provided on the lower surface of the photoelectric hybrid substrate 2 . Specifically, it is provided on the lower surface of the circuit board 4 in the mounting portion 13 and has a shape extending in the width direction. The second lateral groove 42 has a substantially linear shape in plan view and extends across the center portions in the front-rear direction of the two first connecting surfaces 17 . Each of the widthwise end edges of the second lateral groove 42 is exposed to each of the two first connecting surfaces 17 . In a plan view, the second lateral groove 42 extends across the wiring 90 (conductive layer 8 ). Also, the second lateral groove 42 has, for example, a shape in which the lower surface of the insulating cover layer 9 is notched with a substantially rectangular cross-section. However, the thickness (depth) of the second lateral groove 42 is set so as not to reach the wiring 90 . That is, the second lateral groove 42 is not The wiring 90 is exposed (not cut), and the wiring 90 is spaced apart.

第2横溝42在平面視角下的配置及寬度，是與第1横溝41的配置及寬度相同。再者，第2横溝42的深度為例如0.003mm以上，且宜為0.005mm以上，較佳為0.01mm以上，更佳為0.1mm以上，又，為例如1mm以下，且宜為0.5mm以下。 The arrangement and width of the second lateral grooves 42 in plan view are the same as those of the first lateral grooves 41 . Furthermore, the depth of the second lateral groove 42 is, for example, 0.003 mm or more, preferably 0.005 mm or more, preferably 0.01 mm or more, more preferably 0.1 mm or more, and for example, 1 mm or less, preferably 0.5 mm or less.

如圖1C、圖2D及圖6所示，第3横溝43是設於本體21。具體而言，第3横溝43是設於底壁23的底面。第3横溝43具有跨越2個第2連結面28的前後方向中央部之間而延伸之平面視角下的大致直線形狀。第3横溝43的截面形狀、深度及寬度，是與第1横溝41的截面形狀、深度及寬度相同。 As shown in FIG. 1C , FIG. 2D and FIG. 6 , the third lateral groove 43 is provided on the main body 21 . Specifically, the third lateral groove 43 is provided on the bottom surface of the bottom wall 23 . The third lateral groove 43 has a substantially linear shape in plan view and extends across the center portions in the front-rear direction of the two second connecting surfaces 28 . The cross-sectional shape, depth, and width of the third lateral groove 43 are the same as those of the first lateral groove 41 .

如圖2A及圖6所示，第4横溝44是設於蓋件22的下表面。具體而言，第4横溝44具備跨越2個第3連結面33的前後方向中央部之間而延伸之平面視角下的大致直線形狀。第4横溝44在平面視角下的配置，與第2横溝42的配置相同。 As shown in FIGS. 2A and 6 , the fourth lateral groove 44 is provided on the lower surface of the cover member 22 . Specifically, the fourth lateral groove 44 has a substantially linear shape in plan view and extends across the center portions in the front-rear direction of the two third connecting surfaces 33 . The arrangement of the fourth lateral grooves 44 in plan view is the same as that of the second lateral grooves 42 .

第1横溝41、第2横溝42、第3横溝43及第4横溝44，在光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，會在前後方向上完全地重複。 The first transverse groove 41, the second transverse groove 42, the third transverse groove 43, and the fourth transverse groove 44, when the photoelectric hybrid substrate 2 is accommodated in the accommodation space 29, and the cover 22 is installed on the main body 21, will be completely in the front-rear direction. repeat.

(光電混合基板連接器的製造方法) (Manufacturing method of photoelectric hybrid board connector)

接著，說明使用連接器組1來製造光電混合基板連接器18的方法。 Next, a method of manufacturing the opto-electric hybrid board connector 18 using the connector set 1 will be described.

為了製造連接器組1，如圖1A~圖1C所示， 首先，是準備上述之光電混合基板2及上述連接器3。 In order to manufacture the connector set 1, as shown in Fig. 1A ~ Fig. 1C, First, the above-mentioned photoelectric hybrid board 2 and the above-mentioned connector 3 are prepared.

接著，將光電混合基板2裝設於連接器3。具體而言，是將光電混合基板2的裝設部13容置於連接器3的容置空間29(第1步驟)。 Next, the photoelectric hybrid substrate 2 is mounted on the connector 3 . Specifically, the mounting portion 13 of the photoelectric hybrid board 2 is housed in the housing space 29 of the connector 3 (first step).

在第1步驟中，首先，是在設成電路基板4朝下、光波導5朝上的狀態下，將光電混合基板2載置到本體21的底壁23。 In the first step, first, the photoelectric hybrid substrate 2 is placed on the bottom wall 23 of the main body 21 in a state where the circuit board 4 faces downward and the optical waveguide 5 faces upward.

參照圖1B、圖1C及圖3，此時，將基板突出部14容置於(嵌入)本體凹部25的寬度方向內側部分，以使基板突出部14的第1前嵌合面15及第1後嵌合面16的每一個與本體凹部25的第2前嵌合面26及第2後嵌合面27的每一個相嵌合(面接觸)。另一方面，如圖4所示，基板突出部14的第1連結面17與本體凹部25的第2連結面28之間會隔著間隔，藉此，如圖5A所示，形成中央下開口71。 Referring to FIG. 1B, FIG. 1C and FIG. 3, at this time, the substrate protrusion 14 is accommodated (embedded) in the width direction inner part of the body recess 25, so that the first front fitting surface 15 of the substrate protrusion 14 and the first Each of the rear fitting surfaces 16 is fitted (surface contact) with each of the second front fitting surface 26 and the second rear fitting surface 27 of the main body recess 25 . On the other hand, as shown in FIG. 4 , there is a gap between the first connecting surface 17 of the substrate protrusion 14 and the second connecting surface 28 of the main body recess 25, whereby, as shown in FIG. 5A , a central lower opening is formed. 71.

此外，如圖5B所示，在裝設部13中基板突出部14以外之部分的寬度方向兩側面，是接觸於本體21之延伸壁24的內表面。 In addition, as shown in FIG. 5B , the two side surfaces in the width direction of the portion of the mounting portion 13 other than the substrate protruding portion 14 are in contact with the inner surface of the extension wall 24 of the main body 21 .

之後，將蓋件22按壓於光電混合基板2。 Afterwards, the cover 22 is pressed against the photoelectric hybrid substrate 2 .

此時，如圖1A~圖1C及圖5A所示，將蓋件突出部30容置於(嵌入)本體凹部25的寬度方向內側部分，以使蓋件突出部30的第3前嵌合面31及第3後嵌合面32的每一個，與本體凹部25的第2前嵌合面26及第2後嵌合面27的每一個相嵌合(面接觸)。另一方面，蓋件突出部30的第3連結面33與本體凹部25的第2連結面28之間會隔著間 隔，藉此，形成中央上開口72。 At this time, as shown in FIG. 1A to FIG. 1C and FIG. 5A, the cover protruding portion 30 is accommodated (embedded) in the width direction inner part of the body recess 25 so that the third front fitting surface of the cover protruding portion 30 31 and the third rear fitting surface 32 are fitted (surface contact) with each of the second front fitting surface 26 and the second rear fitting surface 27 of the body recess 25 . On the other hand, there will be a gap between the third connecting surface 33 of the cover protrusion 30 and the second connecting surface 28 of the main body recess 25. The partition, whereby the central upper opening 72 is formed.

接著，中央下開口71及中央上開口72是形成開口部70。藉由中央下開口71及中央上開口72上下連通，開口部70具有在上下方向上延伸的形狀。具體而言，開口部70是作為用於將接著劑19從外部注入至到達光電混合基板2及連接器3的本體21之接著劑注入孔。 Next, the central lower opening 71 and the central upper opening 72 form the opening portion 70 . Since the lower central opening 71 and the upper central opening 72 communicate vertically, the opening 70 has a shape extending in the vertical direction. Specifically, the opening 70 serves as an adhesive injection hole for injecting the adhesive 19 from the outside into the body 21 of the opto-electric hybrid board 2 and the connector 3 .

如圖4所示，開口部70是對應於2個第3連結面33、2個第1連結面17、及2個第2連結面28，而在蓋件突出部30的左右兩側設置2個。 As shown in Figure 4, the opening 70 corresponds to the two third connecting surfaces 33, the two first connecting surfaces 17, and the two second connecting surfaces 28, and two openings are provided on the left and right sides of the cover protrusion 30. indivual.

如此進行，中央横溝40即連通於2個開口部70。 In this way, the central lateral groove 40 communicates with the two openings 70 .

具體而言，是使第1横溝41及第2横溝42的寬度方向兩端緣的每一個，從2個第1連結面17的每一個連通於2個開口部70的每一個。 Specifically, each of the widthwise end edges of the first lateral groove 41 and the second lateral groove 42 communicates with each of the two openings 70 from each of the two first connecting surfaces 17 .

第3横溝43的寬度方向兩端緣的每一個，從底壁23的底面連通於2個開口部70的每一個。 Each of the widthwise end edges of the third lateral groove 43 communicates with each of the two openings 70 from the bottom surface of the bottom wall 23 .

第4横溝44的寬度方向兩端緣的每一個，從蓋件22的下表面連通於2個開口部70的每一個。 Each of the widthwise end edges of the fourth lateral groove 44 communicates with each of the two openings 70 from the lower surface of the cover member 22 .

如圖6所示，第1横溝41是面對於蓋件22。更具體而言，第1横溝41是面對第4横溝44。 As shown in FIG. 6 , the first lateral groove 41 faces the cover member 22 . More specifically, the first lateral groove 41 faces the fourth lateral groove 44 .

另一方面，第4横溝44是面對光波導5(光電混合基板2)。 On the other hand, the fourth lateral groove 44 faces the optical waveguide 5 (optical hybrid substrate 2 ).

又，第2横溝42是面對本體21(底壁23)。更具體而言，第2横溝42是面對第3横溝43。 Also, the second lateral groove 42 faces the main body 21 (bottom wall 23). More specifically, the second lateral groove 42 faces the third lateral groove 43 .

另一方面，第3横溝43是面對電路基板4(光電混合基板2)。蓋件22對光電混合基板2的按壓之壓力，是設定在不會讓光電混合基板2相對於本體21及蓋件22相對移動的程度。 On the other hand, the third lateral groove 43 faces the circuit board 4 (optical hybrid board 2 ). The pressing force of the cover 22 against the opto-electric hybrid substrate 2 is set at such a level that the opto-electric hybrid substrate 2 will not move relative to the main body 21 and the cover 22 .

藉由蓋件22對光電混合基板2的按壓，可將光電混合基板2相對於本體21定位並暫時固定。此時，光電混合基板2在基於可撓性而具有歪斜(撓曲或翹曲等)的情況下，可藉由上述按壓而進行塑性變形，並成為沿著面方向的平板形狀。 By pressing the cover 22 against the photoelectric hybrid substrate 2 , the photoelectric hybrid substrate 2 can be positioned and temporarily fixed relative to the main body 21 . At this time, when the opto-electric hybrid board 2 has distortion (bending, warping, etc.) due to its flexibility, it can be plastically deformed by the above-mentioned pressing to become a flat plate shape along the plane direction.

之後，如圖5所示，僅對2個開口部70當中的左側的開口部70注入具有流動性的接著劑19，以使接著劑19從開口部70流入中央横溝40(第2步驟)。 Then, as shown in FIG. 5 , only the left opening 70 of the two openings 70 is injected with fluid adhesive 19 so that the adhesive 19 flows from the opening 70 into the central lateral groove 40 (second step).

接著劑19為例如液態或半固態。從得到中央横溝40中的優異之流動性的觀點來看，較佳為液態。又，接著劑19可列舉例如硬化型、感壓接著型，從得到優異之流動性(未硬化時的優異之流動性)、高接著性的觀點來看，較佳是列舉硬化型。 The adhesive 19 is, for example, liquid or semisolid. From the viewpoint of obtaining excellent fluidity in the central lateral groove 40, it is preferably in a liquid state. In addition, the adhesive 19 includes, for example, a hardening type and a pressure-sensitive adhesive type, and a hardening type is preferably used from the viewpoint of obtaining excellent fluidity (excellent fluidity when not hardened) and high adhesiveness.

當將接著劑19從上側注入左側的開口部70時，會從左側的開口部70流入4個中央横溝40。並且，充填於4個中央横溝40。具體而言，接著劑19是從左側的開口部70邊充填邊通過4個中央横溝40，之後，到達右側的開口部70。再者，接著劑19亦部分地或完全地充填於右側的開口部70。 When the adhesive 19 is poured into the left opening 70 from above, it flows into the four central lateral grooves 40 from the left opening 70 . And, the four central lateral grooves 40 are filled. Specifically, the adhesive 19 passes through the four central lateral grooves 40 while being filled from the left opening 70 , and then reaches the right opening 70 . Furthermore, the adhesive 19 is also partially or completely filled in the opening 70 on the right side.

如圖6所示，已充填於第1横溝41及第4横溝 44的接著劑19，會接觸(密合)於光電混合基板2及蓋件22之雙方。已充填於第2横溝42及第3横溝43的接著劑19，會接觸(密合)於光電混合基板2及本體21之雙方。 As shown in Figure 6, the first horizontal groove 41 and the fourth horizontal groove have been filled The adhesive 19 at 44 is in contact with (closely bonded to) both of the photoelectric hybrid substrate 2 and the cover 22 . The adhesive 19 filled in the second lateral groove 42 and the third lateral groove 43 contacts (adhesively) both of the opto-electric hybrid substrate 2 and the main body 21 .

接著，接著劑19若為硬化型，則使其硬化。 Next, if the adhesive 19 is a curing type, it is cured.

藉由接著劑19，可將光電混合基板2接著並固定於本體21及蓋件22(連接器3)(第2步驟)。 The photoelectric hybrid substrate 2 can be bonded and fixed to the main body 21 and the cover 22 (connector 3 ) by the adhesive 19 (second step).

藉此，製造具備光電混合基板2及容置其之連接器3，且於中央横溝40及開口部70充填有接著劑19的光電混合基板連接器18。 Thereby, the opto-electric hybrid board connector 18 comprising the opto-electric hybrid board 2 and the connector 3 accommodating it, and having the adhesive 19 filled in the central lateral groove 40 and the opening 70 is manufactured.

之後，將光電混合基板連接器18中的芯材層11對其他的光波導或光纜等光學構件進行光連接。 Thereafter, the core material layer 11 in the photoelectric hybrid board connector 18 is optically connected to another optical member such as an optical waveguide or an optical cable.

並且，在該連接器組1中，在光電混合基板2已容置於容置空間29時，光電混合基板2及連接器3具有連通於開口部70、且面對光電混合基板2及連接器3之雙方的中央横溝40。因此，只要將接著劑19注入開口部70，接著劑19即從開口部70流入中央横溝40。其結果，可對開口部70，還有中央横溝40皆充填接著劑19。由於已充填至中央横溝40的接著劑19，是面對光電混合基板2及連接器3之雙方，所以可以提升光電混合基板2對連接器3的接著力。 And, in the connector group 1, when the opto-electric hybrid substrate 2 has been accommodated in the accommodating space 29, the opto-electric hybrid substrate 2 and the connector 3 have a structure that communicates with the opening 70 and faces the opto-electric hybrid substrate 2 and the connector. 3, the central horizontal groove 40 of both sides. Therefore, as long as the adhesive 19 is injected into the opening 70 , the adhesive 19 flows into the central lateral groove 40 from the opening 70 . As a result, both the opening 70 and the central lateral groove 40 can be filled with the adhesive 19 . Since the adhesive 19 filled into the central lateral groove 40 faces both the opto-electric hybrid substrate 2 and the connector 3, the adhesive force of the opto-electric hybrid substrate 2 to the connector 3 can be improved.

當空氣殘留於中央横溝40時，會使接著劑19變得難以流入中央横溝40，但由於在該連接器組1中，是例如使接著劑19從2個開口部70當中的左側的開口部70流入中央横溝40，所以可以使空氣從右側的開口部70逸散。因此，可以有效率地將接著劑19充填於中央横溝40。其結 果，可以進一步提升光電混合基板2對連接器3的接著力。 When air remains in the central lateral groove 40 , it will be difficult for the adhesive 19 to flow into the central lateral groove 40 . 70 flows into the central lateral groove 40, so the air can escape from the opening 70 on the right. Therefore, the adhesive 19 can be efficiently filled in the central lateral groove 40 . its knot As a result, the adhesive force of the opto-electric hybrid substrate 2 to the connector 3 can be further improved.

由於連接器3具備底壁23與蓋件22，所以在光電混合基板2已容置於容置空間29時，可以藉由底壁23與蓋件22在上下方向上施加壓力並且夾住光電混合基板2，以將光電混合基板2相對於連接器3定位。因此，可以精度良好地接著光電混合基板2及連接器3。 Since the connector 3 has a bottom wall 23 and a cover 22, when the photoelectric hybrid substrate 2 has been accommodated in the accommodating space 29, the bottom wall 23 and the cover 22 can apply pressure in the vertical direction and sandwich the photoelectric hybrid. substrate 2 to position the optoelectronic hybrid substrate 2 relative to the connector 3 . Therefore, the opto-electric hybrid board 2 and the connector 3 can be bonded with high precision.

在該連接器組1中，可以提升光電混合基板2對連接器3的接著力。 In this connector set 1, the adhesive force of the photoelectric hybrid board 2 to the connector 3 can be improved.

根據該光電混合基板連接器18的製造方法，由於可以在第2步驟中，對開口部70並且也對中央横溝40充填接著劑19，所以可以提升光電混合基板2對連接器3的接著力。 According to this method of manufacturing the opto-hybrid board connector 18 , since the opening 70 and also the central lateral groove 40 can be filled with the adhesive 19 in the second step, the adhesive force of the opto-hybrid board 2 to the connector 3 can be improved.

在該光電混合基板連接器18中，是在開口部70並且也在中央横溝40中也充填有接著劑19。因此，可以提升光電混合基板2對連接器3的接著力。 In this photoelectric hybrid board connector 18 , the adhesive 19 is filled in the opening 70 and also in the central lateral groove 40 . Therefore, the adhesive force of the photoelectric hybrid substrate 2 to the connector 3 can be improved.

(變形例) (Modification)

接著，說明第1實施形態的變形例。在以下的各變形例中，針對與上述之第1實施形態同樣的構件及步驟，是附加相同的參照符號，而省略其詳細的說明。又，可以適當地組合各變形例。再者，除了特別記載以外，各變形例可以發揮與第1實施形態同樣的作用效果。 Next, a modified example of the first embodiment will be described. In each of the following modifications, the same members and steps as those of the above-mentioned first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. In addition, various modified examples can be combined appropriately. In addition, unless otherwise stated, each modification can exhibit the same operation and effect as that of the first embodiment.

如圖2A~圖2D所示，第1實施形態的連接器組1是使中央横溝40具備：第1横溝41、第2横溝42、第3横溝43及第4横溝44。但是，中央横溝40並不限定於此。 例如，可以從由第1横溝41、第2横溝42、第3横溝43及第4横溝44所構成之群組中選擇並具備任3個、或任2個、甚或任1個。 As shown in FIGS. 2A to 2D , the connector set 1 according to the first embodiment has a central lateral groove 40 with a first lateral groove 41 , a second lateral groove 42 , a third lateral groove 43 and a fourth lateral groove 44 . However, the central lateral groove 40 is not limited to this. For example, any three, or any two, or even any one may be selected from the group consisting of the first lateral groove 41 , the second lateral groove 42 , the third lateral groove 43 , and the fourth lateral groove 44 .

又，各中央横溝40，亦即第1横溝41、第2横溝42、第3横溝43及第4横溝44的每一種均為1個，但其數量並不限定於此，亦可為複數個。 Also, each of the central lateral grooves 40, that is, the first lateral groove 41, the second lateral groove 42, the third lateral groove 43, and the fourth lateral groove 44 is one, but the number is not limited thereto, and may be plural. .

在第1實施形態中，如圖6的實線所示，在沿著厚度方向及前後方向的截面中，是將4個中央横溝40在前後方向上配置於相同位置。 In the first embodiment, as shown by the solid line in FIG. 6 , the four central lateral grooves 40 are arranged at the same position in the front-rear direction in the cross-section along the thickness direction and the front-rear direction.

但是，如圖6的假想線所示，也可以將4個中央横溝40例如部分地或完全地錯開。 However, as shown by phantom lines in FIG. 6 , the four central lateral grooves 40 may be partially or completely shifted, for example.

例如，在光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，可將第4横溝44例如相對於第1横溝41而隔著間隔配置於前側。藉此，第1横溝41及第4横溝44在前後方向上錯開。在此情況下，第1横溝41是面對蓋件22中的第4横溝44以外的下表面，另一方面，第4横溝44是面對光電混合基板2中的第1横溝41以外的上表面。 For example, when the opto-electric hybrid substrate 2 is accommodated in the accommodation space 29 and the cover 22 is attached to the main body 21 , the fourth lateral groove 44 can be arranged on the front side with a gap between the first lateral groove 41 , for example. Thereby, the first lateral groove 41 and the fourth lateral groove 44 are shifted in the front-rear direction. In this case, the first lateral groove 41 faces the lower surface of the cover member 22 other than the fourth lateral groove 44 , while the fourth lateral groove 44 faces the upper surface of the photoelectric hybrid substrate 2 other than the first lateral groove 41 . surface.

另一方面，如圖6的實線所示，在將第1横溝41及第4横溝44在前後方向上配置於相同位置的情況下，會使第1横溝41及第4横溝44相連通。充填至所述的(交界部分)的接著劑19，不會接觸於光電混合基板2及蓋件22的任一個。 On the other hand, as shown by the solid line in FIG. 6 , when the first lateral groove 41 and the fourth lateral groove 44 are arranged at the same position in the front-rear direction, the first lateral groove 41 and the fourth lateral groove 44 are communicated. The adhesive 19 filled to the above-mentioned (interface portion) does not contact any one of the photoelectric hybrid substrate 2 and the cover member 22 .

另一方面，如圖6的假想線所示，若將第1横 溝41及第4横溝44在前後方向上錯開，充填於第1横溝41的接著劑19會接觸於蓋件22中的上述之下表面，充填於第4横溝44的接著劑19會接觸於光電混合基板2中的上述之上表面。因此，可以增加接著劑19對蓋件22及光電混合基板2的接觸面積。其結果，可以進一步提升蓋件22與光電混合基板2的接著力。 On the other hand, as shown by the imaginary line in Fig. 6, if the first horizontal The groove 41 and the fourth transverse groove 44 are staggered in the front-rear direction, the adhesive 19 filled in the first transverse groove 41 will contact the above-mentioned lower surface of the cover 22, and the adhesive 19 filled in the fourth transverse groove 44 will contact the photoelectric The above-mentioned upper surface in the hybrid substrate 2 . Therefore, the contact area of the adhesive 19 to the cover member 22 and the photoelectric hybrid substrate 2 can be increased. As a result, the adhesive force between the cover member 22 and the photoelectric hybrid substrate 2 can be further improved.

又，在光電混合基板2容置於容置空間29，且蓋件22安裝於本體21時，第2横溝42是例如相對於第3横溝43而隔著間隔配置於後側。藉此，第2横溝42及第3横溝43在前後方向上完全地錯開。 Also, when the opto-electric hybrid substrate 2 is housed in the housing space 29 and the cover 22 is attached to the main body 21 , the second lateral groove 42 is arranged behind the third lateral groove 43 at a distance, for example. Thereby, the 2nd lateral groove 42 and the 3rd lateral groove 43 are completely deviated in the front-back direction.

在此情況下，第2横溝42是面對本體21中的第3横溝43以外的上表面(底壁23的底面)，另一方面，第3横溝43是面對光電混合基板2中的第2横溝42以外的下表面。 In this case, the second lateral groove 42 faces the upper surface (the bottom surface of the bottom wall 23 ) other than the third lateral groove 43 in the main body 21 , while the third lateral groove 43 faces the first horizontal groove 43 in the photoelectric hybrid substrate 2 . 2 The lower surface other than the lateral groove 42.

另一方面，如圖6的實線所示，在將第2横溝42及第3横溝43在前後方向上配置於相同位置的情況下，會使第2横溝42及第3横溝43相連通。充填至所述的(交界部分)的接著劑19，不會接觸於光電混合基板2及蓋件22的任一個。 On the other hand, as shown by the solid line in FIG. 6 , when the second lateral groove 42 and the third lateral groove 43 are arranged at the same position in the front-rear direction, the second lateral groove 42 and the third lateral groove 43 are communicated. The adhesive 19 filled to the above-mentioned (interface portion) does not contact any one of the photoelectric hybrid substrate 2 and the cover member 22 .

另一方面，如圖6的假想線所示，若將第2横溝42及第3横溝43在前後方向上錯開，充填於第2横溝42的接著劑19會接觸於本體21中的上述之上表面，充填於第3横溝43的接著劑19會接觸於光電混合基板2中的上述之下表面。因此，可以增加接著劑19對本體21及光電混合基板2的接觸面積。其結果，可以進一步提升本體21與光電 混合基板2的接著力。 On the other hand, as shown by the imaginary line in FIG. 6, if the second lateral groove 42 and the third lateral groove 43 are shifted in the front-rear direction, the adhesive 19 filled in the second lateral groove 42 will contact the above-mentioned upper part of the main body 21. On the surface, the adhesive 19 filled in the third lateral groove 43 is in contact with the above-mentioned lower surface of the optoelectronic hybrid substrate 2 . Therefore, the contact area of the adhesive 19 to the main body 21 and the photoelectric hybrid substrate 2 can be increased. As a result, it is possible to further enhance the Adhesion of hybrid substrate 2.

如圖4所示，在第1實施形態中，開口部70是藉由第2連結面28的前後方向的整個面而形成。但是，如圖2A~圖2C的假想線及圖7的實線所示，也可以藉由將第2連結面28之前後方向的一部分設為開口部形成面，而形成開口部70。 As shown in FIG. 4 , in the first embodiment, the opening 70 is formed by the entire surface of the second connection surface 28 in the front-rear direction. However, as shown by the phantom lines in FIGS. 2A to 2C and the solid line in FIG. 7 , the opening 70 may be formed by making a part of the second connecting surface 28 in the front-rear direction an opening-forming surface.

2個蓋件突出部30的每一個，會包含在其前後方向中央部中朝向內側凹陷的蓋件凹部34。蓋件凹部34是從第3連結面33朝內側凹陷成在平面視角下大致矩形狀，並且沿著厚度方向形成缺口。另一方面，在蓋件22安裝於本體21時，在第3連結面33中位於比蓋件凹部34更靠近前後兩側的部分是接觸於第2連結面28。藉此，在蓋件22安裝於本體21時，第2連結面28的前後方向中央部與蓋件凹部34的內表面會形成中央上開口72(開口部70)。 Each of the two cover protrusions 30 includes a cover recess 34 that is recessed inward in the center portion in the front-rear direction. The cover recess 34 is recessed inwardly from the third connection surface 33 in a substantially rectangular shape in planar view, and is notched along the thickness direction. On the other hand, when the cover 22 is attached to the main body 21 , the portions of the third connection surface 33 located closer to the front and rear sides than the cover recess 34 are in contact with the second connection surface 28 . Thereby, when the cover 22 is attached to the main body 21 , the center portion in the front-rear direction of the second connecting surface 28 and the inner surface of the cover recess 34 form an upper central opening 72 (opening 70 ).

又，在蓋件22未設置蓋件突出部30的情形下，可以藉由本體凹部25的第2連結面28形成開口部70。在此情況下，蓋件22的寬度方向兩端面在平面視角下為大致直線形狀。 Also, when the cover 22 is not provided with the cover protrusion 30 , the opening 70 can be formed by the second connection surface 28 of the main body recess 25 . In this case, both end surfaces in the width direction of the cover member 22 are substantially linear in plan view.

又，也可以在裝設部13未設置基板突出部14的情形下，將裝設部13容置於容置空間29。在此情況下，裝設部13的寬度方向兩端面在平面視角下為大致直線形狀。 In addition, when the substrate protruding portion 14 is not provided on the mounting portion 13 , the mounting portion 13 may be accommodated in the accommodation space 29 . In this case, both end surfaces in the width direction of the mounting portion 13 have a substantially linear shape in a planar view.

較佳的是，於裝設部13設置基板突出部14。基板突出部14的第1前嵌合面15及第1後嵌合面16，可以與 本體凹部25的第2前嵌合面26及第2後嵌合面27嵌合，以實施裝設部13相對於本體21之前後方向上的定位。 Preferably, the substrate protruding portion 14 is provided on the mounting portion 13 . The first front fitting surface 15 and the first rear fitting surface 16 of the substrate protruding portion 14 can be combined with The second front fitting surface 26 and the second rear fitting surface 27 of the main body concave portion 25 are fitted to implement positioning of the mounting portion 13 relative to the main body 21 in the front and rear direction.

又，如圖2A~圖2D的假想線所示，2個基板突出部14可以包含與蓋件凹部34相同形狀的基板凹部35。在此情況下，在光電混合基板2容置於容置空間29時，第2連結面28的前後方向中央部與基板凹部35的內面會形成中央下開口71(開口部70)。 In addition, as shown by phantom lines in FIGS. 2A to 2D , the two substrate protrusions 14 may include a substrate recess 35 having the same shape as the lid recess 34 . In this case, when the opto-electric hybrid substrate 2 is accommodated in the accommodation space 29 , the central lower opening 71 (opening 70 ) is formed at the front-rear central portion of the second connection surface 28 and the inner surface of the substrate recess 35 .

如圖5A的箭頭所示，在第1實施形態中，是將接著劑19注入左側的開口部70。但是，並不限定於此，也可以例如將接著劑19朝左右兩側的開口部70注入。 As shown by the arrows in FIG. 5A , in the first embodiment, the adhesive 19 is injected into the left opening 70 . However, the present invention is not limited thereto, and for example, the adhesive 19 may be poured into the openings 70 on the left and right sides.

較佳的是，將接著劑19朝2個開口部70當中一側的開口部70注入。藉此，可以將另一側的開口部70作為殘留於中央横溝40之空氣的逸散通道(逸散通路)、或是作為確認已通過中央横溝40之接著劑19的前端的確認窗來使用。 Preferably, the adhesive 19 is injected toward one opening 70 among the two openings 70 . Thereby, the opening 70 on the other side can be used as an escape channel (escape channel) for the air remaining in the central lateral groove 40 or as a confirmation window for confirming the tip of the adhesive 19 that has passed through the central lateral groove 40 .

如圖3及圖4所示，在第1實施形態中開口部70是設置有2個。但是，其數量並無限定。雖然圖未示，但是開口部70亦可為左右任1個。 As shown in FIGS. 3 and 4 , in the first embodiment, two openings 70 are provided. However, the number thereof is not limited. Although not shown in the figure, the opening 70 may be either left or right.

較佳的是，設置複數個(2個)開口部70。藉此，可將一側作為注入用的開口來使用，並將剩餘的(另一側)作為上述之空氣的逸散通道、或是確認窗來使用。 Preferably, a plurality of (two) openings 70 are provided. Thereby, one side can be used as an opening for injection, and the rest (the other side) can be used as the above-mentioned air escape channel or a confirmation window.

又，如圖7的假想線所示，也可以將第1側開口部77設置於延伸壁24。 In addition, as shown by phantom lines in FIG. 7 , the first side opening 77 may be provided in the extension wall 24 .

在此情況下，在將蓋件22安裝於本體21時， 本體21的整個第2連結面28與蓋件22的整個第3連結面33是完全地接觸。藉此，基於本體21及蓋件22的接觸之中央上開口72(參照圖5)即可不形成。 In this case, when the cover 22 is attached to the main body 21, The entire second connecting surface 28 of the main body 21 is in complete contact with the entire third connecting surface 33 of the cover 22 . Thereby, the central upper opening 72 (refer to FIG. 5 ) based on the contact between the main body 21 and the cover 22 can be omitted.

並且，第1側開口部77是僅由本體21所形成的開口，具體而言，是貫通延伸壁24之厚度方向(本體21的寬度方向)的貫通孔。第1側開口部77是讓外部與開口部70相連通。 Furthermore, the first side opening 77 is an opening formed only by the main body 21 , and specifically, is a through-hole penetrating through the extension wall 24 in the thickness direction (the width direction of the main body 21 ). The first side opening 77 allows the outside to communicate with the opening 70 .

如圖27A所示，分別在左右兩側而有2個的第1側開口部77，亦可為在上下方向中的位置不同，或如參照圖27B(的符號28)，亦可在相同位置。 As shown in FIG. 27A, there are two first side openings 77 on the left and right sides respectively, and the positions in the vertical direction may be different, or as shown in FIG. 27B (symbol 28), they may be at the same position. .

若2個第1側開口部77在相同位置，會使本體21的成形變得容易。 If the two first side openings 77 are at the same position, the molding of the main body 21 will be facilitated.

另一方面，如圖27A所示，若2個第1側開口部77的上下方向位置不同，則在第2步驟中，從位於較高位置的第1側開口部77注入接著劑19，之後，使其充填並且流入中央横溝40後，可容許接著劑19從位於較低位置的第1側開口部77溢出(漏出)接著劑19的前端之情形，而可以進一步確認該情形。因此，可以簡單地確認接著劑19對中央横溝40的充填。 On the other hand, as shown in FIG. 27A, if the vertical positions of the two first side openings 77 are different, in the second step, the adhesive 19 is injected from the first side opening 77 at a higher position, and then After filling and flowing into the central lateral groove 40, the adhesive agent 19 can be allowed to overflow (leak out) from the front end of the adhesive agent 19 from the lower first side opening 77, and this situation can be further confirmed. Therefore, filling of the central lateral groove 40 with the adhesive 19 can be easily confirmed.

又，在第1實施形態中，電路基板4是朝向下側而依序具備金屬支撐層6、基底絕緣層7、導體層8、及覆蓋絕緣層9，雖然圖未示，也可以例如朝向上側而依序具備該等層。 In addition, in the first embodiment, the circuit board 4 is provided with the metal supporting layer 6, the base insulating layer 7, the conductor layer 8, and the cover insulating layer 9 in order facing the lower side, although not shown in the figure, it may be directed to the upper side, for example. And have these layers in sequence.

又，在第1實施形態中，光波導5是朝向上側 而依序具備下包覆層10、芯材層11、及上包覆層12，雖然圖未示，也可以例如朝向下側而依序具備該等層。 Also, in the first embodiment, the optical waveguide 5 faces upward The lower cladding layer 10 , the core material layer 11 , and the upper cladding layer 12 are sequentially provided. Although not shown in the figure, these layers may be sequentially provided, for example, toward the lower side.

又，在第1實施形態中，光電混合基板2是朝向上側而依序具備電路基板4、及光波導5，雖然圖未示，也可以例如朝向下側而依序具備該等構件。 Also, in the first embodiment, the opto-electric hybrid substrate 2 includes the circuit board 4 and the optical waveguide 5 sequentially facing upward, but although not shown in the figure, these members may be provided sequentially facing downward, for example.

(第2實施形態) (Second Embodiment)

接著，說明第2實施形態。在第2實施形態中，針對與上述之第1實施形態同樣的構件及步驟，是附加相同的參照符號，而省略其詳細的說明。又，除了特別記載以外，第2實施形態可以發揮與第1實施形態同樣的作用效果。 Next, a second embodiment will be described. In the second embodiment, the same members and steps as those in the above-mentioned first embodiment are denoted by the same reference numerals, and their detailed descriptions are omitted. In addition, the second embodiment can exhibit the same effects as those of the first embodiment unless otherwise specified.

如圖8A~圖8D及圖9所示，連接器組1更具備後縱溝50(配置於第1方向另一側的第1方向另一側溝之一例)。後縱溝50可設置於例如光電混合基板2、本體21及/或蓋件22。具體而言，後縱溝50可具備例如下述之至少任一者：設置於光電混合基板2的第1後縱溝51及第2後縱溝52；設置於本體21的第3後縱溝53；及設置於蓋件22的第4後縱溝54。 As shown in FIG. 8A to FIG. 8D and FIG. 9 , the connector set 1 further includes a rear vertical groove 50 (an example of a groove on the other side in the first direction arranged on the other side in the first direction). The rear vertical groove 50 can be disposed on, for example, the optoelectronic hybrid substrate 2 , the body 21 and/or the cover 22 . Specifically, the rear vertical groove 50 may include, for example, at least any one of the following: the first rear vertical groove 51 and the second rear vertical groove 52 provided on the optoelectronic hybrid substrate 2; the third rear vertical groove provided on the main body 21 53; and the fourth rear longitudinal groove 54 provided on the cover member 22.

接著，說明後縱溝50具備第1後縱溝51、第2後縱溝52、第3後縱溝53、及第4後縱溝54全部(4個)之例子。 Next, an example in which the rear longitudinal groove 50 includes all (four) of the first rear longitudinal groove 51 , the second rear longitudinal groove 52 , the third rear longitudinal groove 53 , and the fourth rear longitudinal groove 54 will be described.

第1後縱溝51、第2後縱溝52、第3後縱溝53、及第4後縱溝54，皆具有在前後方向上延伸的形狀。 The first rear longitudinal groove 51 , the second rear longitudinal groove 52 , the third rear longitudinal groove 53 , and the fourth rear longitudinal groove 54 all have shapes extending in the front-rear direction.

以下，依序說明第1後縱溝51、第2後縱溝52、第3後縱溝53、及第4後縱溝54。再者，針對第2後縱 溝52、第3後縱溝53、及第4後縱溝54，對於與第1後縱溝51同樣的構成等，將省略其說明。 Hereinafter, the first rear longitudinal groove 51 , the second rear longitudinal groove 52 , the third rear longitudinal groove 53 , and the fourth rear longitudinal groove 54 will be described in order. Furthermore, for the second rear longitudinal The groove 52 , the third rear vertical groove 53 , and the fourth rear vertical groove 54 have the same configuration as the first rear vertical groove 51 , and description thereof will be omitted.

如圖8B、圖9及圖10所示，第1後縱溝51是設於光電混合基板2的上表面。具體而言，第1後縱溝51是設於裝設部13及緊接其後側之光波導5的上表面。第1後縱溝51具有從裝設部13的中央部延伸至後方之平面視角下的大致直線形狀。第1後縱溝51的前端部是連通於第1横溝41。另一方面，第1後縱溝51的後端部是從蓋件22的後端面配置到後側。在平面視角下，第1後縱溝51是平行於芯材層11。第1後縱溝51的厚度(深度)，與第1横溝41的厚度(深度)相同。 As shown in FIG. 8B , FIG. 9 and FIG. 10 , the first rear vertical groove 51 is provided on the upper surface of the photoelectric hybrid substrate 2 . Specifically, the first rear vertical groove 51 is provided on the upper surface of the mounting portion 13 and the optical waveguide 5 immediately behind it. The first rear longitudinal groove 51 has a substantially linear shape in a planar view extending from the central portion of the mounting portion 13 to the rear. The front end portion of the first rear longitudinal groove 51 communicates with the first lateral groove 41 . On the other hand, the rear end portion of the first rear longitudinal groove 51 is arranged from the rear end surface of the cover member 22 to the rear side. In a plane view, the first rear longitudinal groove 51 is parallel to the core material layer 11 . The thickness (depth) of the first rear longitudinal groove 51 is the same as the thickness (depth) of the first lateral groove 41 .

如圖8C、圖9及圖10所示，第2後縱溝52是設於光電混合基板2的下表面。第2後縱溝52是設於裝設部13及緊接其後側之光波導5的下表面。第2後縱溝52具有從裝設部13的中央部延伸至後方之平面視角下的大致直線形狀。第2後縱溝52的前端部是連通於第2横溝42。另一方面，第2後縱溝52的後端部是從本體21的後端面配置到後側。在平面視角下，第2後縱溝52是平行於芯材層11及配線90。總而言之，第2後縱溝52是相對於沿著光電混合基板2之上下方向中心的假想面而以面對稱的方式配置及形成。 As shown in FIG. 8C , FIG. 9 and FIG. 10 , the second rear vertical groove 52 is provided on the lower surface of the photoelectric hybrid substrate 2 . The second rear vertical groove 52 is provided on the lower surface of the mounting portion 13 and the optical waveguide 5 immediately behind it. The second rear vertical groove 52 has a substantially linear shape in a planar view extending from the central portion of the mounting portion 13 to the rear. The front end portion of the second rear longitudinal groove 52 communicates with the second lateral groove 42 . On the other hand, the rear end portion of the second rear longitudinal groove 52 is arranged from the rear end surface of the main body 21 to the rear side. From a plan view, the second rear longitudinal groove 52 is parallel to the core material layer 11 and the wiring 90 . In short, the second rear vertical groove 52 is arranged and formed plane-symmetrically with respect to a virtual plane along the vertical center of the opto-electric hybrid substrate 2 .

如圖8D、圖9及圖10所示，第3後縱溝53是設於本體21。具體而言，第3後縱溝53是設於底壁23的底面。具體而言，第3後縱溝53具有從底壁23的中央部延伸 至後方之平面視角下的大致直線形狀。第3後縱溝53的前端部是連通於第3横溝43。另一方面，第3後縱溝53的後端緣是從底壁23的後端面露出。第3後縱溝53在光電混合基板2容置於容置空間29時，在平面視角下是平行於芯材層11。第3後縱溝53的截面形狀、深度及寬度，與第1後縱溝51的截面形狀、深度及寬度相同。 As shown in FIG. 8D , FIG. 9 and FIG. 10 , the third rear longitudinal groove 53 is provided on the main body 21 . Specifically, the third rear vertical groove 53 is provided on the bottom surface of the bottom wall 23 . Specifically, the third rear vertical groove 53 has a shape extending from the central portion of the bottom wall 23 . Roughly rectilinear shape in plan view to the rear. The front end portion of the third rear longitudinal groove 53 communicates with the third lateral groove 43 . On the other hand, the rear edge of the third rear vertical groove 53 is exposed from the rear end surface of the bottom wall 23 . The third rear longitudinal groove 53 is parallel to the core material layer 11 when the optoelectronic hybrid substrate 2 is accommodated in the accommodating space 29 . The cross-sectional shape, depth and width of the third rear longitudinal groove 53 are the same as the cross-sectional shape, depth and width of the first rear longitudinal groove 51 .

如圖8A、圖9及圖10所示，第4後縱溝54是設於蓋件22的下表面。具體而言，第4後縱溝54具有從蓋件22的中央部延伸至後側之平面視角下的大致直線形狀。第4後縱溝54的後端部是露出於蓋件22的後端面。第4後縱溝54的前端部是連通於第4横溝44。第4後縱溝54的截面形狀、深度及寬度，與第1後縱溝51的截面形狀、深度及寬度相同。 As shown in FIG. 8A , FIG. 9 and FIG. 10 , the fourth rear longitudinal groove 54 is provided on the lower surface of the cover member 22 . Specifically, the fourth rear vertical groove 54 has a substantially linear shape in plan view extending from the center portion of the cover 22 to the rear side. The rear end portion of the fourth rear vertical groove 54 is exposed on the rear end surface of the cover member 22 . The front end portion of the fourth rear longitudinal groove 54 communicates with the fourth lateral groove 44 . The cross-sectional shape, depth and width of the fourth rear longitudinal groove 54 are the same as the cross-sectional shape, depth and width of the first rear longitudinal groove 51 .

如圖9及圖10所示，第1後縱溝51、第2後縱溝52、第3後縱溝53及第4後縱溝54，在光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，會在寬度方向上完全地重複。 As shown in FIGS. 9 and 10, the first rear longitudinal groove 51, the second rear longitudinal groove 52, the third rear longitudinal groove 53, and the fourth rear longitudinal groove 54 are accommodated in the accommodating space 29, And when the cover 22 is installed on the main body 21 , it will completely repeat in the width direction.

另一方面，如圖10所示，第1後縱溝51的後端部會從蓋件22朝向上側露出。第2後縱溝52的後端部會從本體21朝向下側露出。 On the other hand, as shown in FIG. 10 , the rear end portion of the first rear vertical groove 51 is exposed upward from the cover member 22 . The rear end portion of the second rear longitudinal groove 52 is exposed downward from the main body 21 .

在第2實施形態中，是在第2步驟中，使接著劑19透過開口部70及中央横溝40而流入後縱溝50。詳而言之，接著劑19是從中央横溝40的寬度方向中央部到達後縱溝50的前端部，之後，接著劑19是邊充填於後縱溝50邊朝 向後側行進。 In the second embodiment, in the second step, the adhesive 19 is made to flow into the rear vertical groove 50 through the opening 70 and the central lateral groove 40 . Specifically, the adhesive 19 reaches the front end of the rear longitudinal groove 50 from the central portion in the width direction of the central lateral groove 40 , and then the adhesive 19 is filled in the rear longitudinal groove 50 toward the front end of the rear longitudinal groove 50 . Go backwards.

之後，即使過剩的接著劑19從第4後縱溝54及第1後縱溝51的後端緣溢出(逸散)，由於光電混合基板2及蓋件22的前端面與另外的光學構件相連接，另一方面，蓋件22的後端部並未用於上述之連接，所以那樣的溢出(逸散)並不會被覆(污染)光波導5的前端面。 Afterwards, even if the excess adhesive 19 overflows (dissipates) from the rear end edges of the fourth rear longitudinal groove 54 and the first rear longitudinal groove 51, since the front end surfaces of the photoelectric hybrid substrate 2 and the cover member 22 are in contact with other optical members, Connection, on the other hand, the rear end portion of the cover member 22 is not used for the above-mentioned connection, so such overflow (scattering) does not coat (contaminate) the front end surface of the optical waveguide 5 .

又，即使過剩的接著劑19從第2後縱溝52及第3後縱溝53的後端緣溢出(逸散)，由於光電混合基板2及本體21的前端面與另外的光學構件相連接，另一方面，本體21的後端部並未用於上述之連接，所以那樣的溢出(逸散)並不會被覆(污染)光波導5的前端面。 Also, even if the excess adhesive 19 overflows (dissipates) from the rear end edges of the second rear longitudinal groove 52 and the third rear longitudinal groove 53, since the front end surfaces of the optoelectronic hybrid substrate 2 and the main body 21 are connected to other optical components , on the other hand, the rear end of the body 21 is not used for the above-mentioned connection, so such overflow (scattering) will not coat (contaminate) the front end of the optical waveguide 5.

根據第2實施形態，即使將超過連接器3及光電混合基板2之接著所需要之量(必要量)的過剩的接著劑19注入開口部70、中央横溝40及後縱溝50，仍可容許過剩之接著劑19的上述之溢出。因此，可以將必要量充填於後縱溝50。其結果，可以牢固地接著連接器3及光電混合基板2。 According to the second embodiment, even if excess adhesive agent 19 is injected into the opening 70, the central lateral groove 40, and the rear vertical groove 50 exceeding the amount (necessary amount) required for bonding the connector 3 and the opto-electric hybrid board 2, it is still acceptable. The above-mentioned overflow of excess adhesive 19. Therefore, the necessary amount can be filled in the rear vertical groove 50 . As a result, the connector 3 and the photoelectric hybrid board 2 can be firmly bonded.

(變形例) (Modification)

接著，說明第2實施形態的變形例。在以下的各變形例中，針對與上述之第2實施形態同樣的構件及步驟，是附加相同的參照符號，而省略其詳細的說明。又，可以適當地組合各變形例。再者，除了特別記載以外，各變形例可以發揮與第2實施形態同樣的作用效果。 Next, a modified example of the second embodiment will be described. In the following modified examples, the same members and steps as those of the above-mentioned second embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. In addition, various modified examples can be combined appropriately. In addition, unless otherwise stated, each modified example can exhibit the same effect as that of the second embodiment.

如圖8A~圖8D所示，第2實施形態的連接器 組1是使後縱溝50具備：第1後縱溝51、第2後縱溝52、第3後縱溝53及第4後縱溝54。但是，後縱溝50並不限定於此。例如，可以從由第1後縱溝51、第2後縱溝52、第3後縱溝53及第4後縱溝54所構成之群組中選擇並具備任3個、或任2個、甚或任1個。 As shown in Figure 8A ~ Figure 8D, the connector of the second embodiment In group 1, the rear longitudinal groove 50 includes a first rear longitudinal groove 51 , a second rear longitudinal groove 52 , a third rear longitudinal groove 53 , and a fourth rear longitudinal groove 54 . However, the rear vertical groove 50 is not limited to this. For example, any three or any two may be selected from the group consisting of the first rear longitudinal groove 51, the second rear longitudinal groove 52, the third rear longitudinal groove 53, and the fourth rear longitudinal groove 54, Or even any one.

又，各後縱溝50，亦即，第1後縱溝51、第2後縱溝52、第3後縱溝53及第4後縱溝54的每一種均為1個，但其數量並不限定於此，亦可為複數個。 Also, each of the rear longitudinal grooves 50, that is, each of the first rear longitudinal groove 51, the second rear longitudinal groove 52, the third rear longitudinal groove 53, and the fourth rear longitudinal groove 54 is one, but the number is different. It is not limited to this, and may be plural.

又，在第2實施形態中，如圖9所示，在沿著厚度方向及寬度方向的截面中，是將4個後縱溝50在寬度方向上配置於相同位置。 In addition, in the second embodiment, as shown in FIG. 9 , four rear vertical grooves 50 are arranged at the same position in the width direction in a cross section along the thickness direction and the width direction.

但是，如圖9的假想線所示，也可以例如部分地或完全地錯開。 However, as shown by the imaginary lines in FIG. 9 , it is also possible, for example, to partially or completely shift them.

例如，在光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，可將第4後縱溝54例如相對於第1後縱溝51而隔著間隔配置於右側。藉此，第1後縱溝51及第4後縱溝54在左右(寬度)方向上錯開。在此情況下，第1後縱溝51是面對蓋件22中的第4後縱溝54以外的下表面，另一方面，第4後縱溝54是面對光電混合基板2中的第1後縱溝51以外的上表面。 For example, when the optoelectronic hybrid board 2 is housed in the housing space 29 and the cover 22 is mounted on the main body 21 , the fourth rear vertical groove 54 can be arranged on the right side with a gap between the first rear vertical groove 51 , for example. Thereby, the first rear vertical groove 51 and the fourth rear vertical groove 54 are shifted in the left-right (width) direction. In this case, the first rear longitudinal groove 51 faces the lower surface of the cover member 22 other than the fourth rear longitudinal groove 54 , while the fourth rear longitudinal groove 54 faces the fourth rear longitudinal groove 54 of the photoelectric hybrid substrate 2 . 1. The upper surface other than the rear longitudinal groove 51.

另一方面，如圖9的實線所示，第1後縱溝51及第4後縱溝54在寬度方向上配置於相同位置的情況下，會使第1後縱溝51及第4後縱溝54相連通。 On the other hand, as shown by the solid line in FIG. 9, when the first rear longitudinal groove 51 and the fourth rear longitudinal groove 54 are arranged at the same position in the width direction, the first rear longitudinal groove 51 and the fourth rear longitudinal groove The vertical grooves 54 are connected.

充填至所述的(交界部分)的接著劑19，不會接觸於光 電混合基板2及蓋件22的任一個。 Adhesive 19 filled to the above (junction portion) will not be exposed to light Any one of the electric hybrid substrate 2 and the cover 22 .

另一方面，如圖9的假想線所示，若第1後縱溝51及第4後縱溝54在寬度方向上錯開，充填於第1後縱溝51的接著劑19會接觸於蓋件22中的上述之下表面，充填於第4後縱溝54的接著劑19會接觸於光電混合基板2中的上述之上表面。因此，可以增加接著劑19對蓋件22及光電混合基板2的接觸面積。其結果，可以進一步提升蓋件22與光電混合基板2的接著力。 On the other hand, as shown by the imaginary line in FIG. 9, if the first rear longitudinal groove 51 and the fourth rear longitudinal groove 54 are staggered in the width direction, the adhesive 19 filled in the first rear longitudinal groove 51 will contact the cover member. 22 , the adhesive 19 filled in the fourth rear vertical groove 54 is in contact with the above-mentioned upper surface of the optoelectronic hybrid substrate 2 . Therefore, the contact area of the adhesive 19 to the cover member 22 and the photoelectric hybrid substrate 2 can be increased. As a result, the adhesive force between the cover member 22 and the photoelectric hybrid substrate 2 can be further improved.

又，在光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，可將第2後縱溝52例如相對於第3後縱溝53而隔著間隔配置於左側。藉此，第2後縱溝52及第3後縱溝53在左右(寬度)方向上完全地錯開。在此情況下，第2後縱溝52是面對本體21中的第3後縱溝53以外的上表面(底壁23的底面)，另一方面，第3後縱溝53是面對光電混合基板2中的第2後縱溝52以外的下表面。 In addition, when the opto-electric hybrid board 2 is housed in the housing space 29 and the cover 22 is mounted on the main body 21 , the second rear vertical groove 52 can be arranged on the left side with a gap between the third rear vertical groove 53 , for example. Thereby, the second rear vertical groove 52 and the third rear vertical groove 53 are completely shifted in the left-right (width) direction. In this case, the second rear longitudinal groove 52 faces the upper surface (the bottom surface of the bottom wall 23 ) other than the third rear longitudinal groove 53 in the main body 21 , and on the other hand, the third rear longitudinal groove 53 faces the photoelectric The lower surface of the hybrid substrate 2 other than the second rear vertical groove 52 .

另一方面，如圖9的實線所示，第2後縱溝52及第3後縱溝53在前後方向上配置於相同位置的情況下，會使第2後縱溝52及第3後縱溝53相連通。充填至所述的(交界部分)的接著劑19，不會接觸於光電混合基板2及蓋件22的任一個。 On the other hand, as shown by the solid line in FIG. 9, when the second rear longitudinal groove 52 and the third rear longitudinal groove 53 are arranged at the same position in the front-rear direction, the second rear longitudinal groove 52 and the third rear longitudinal groove The vertical grooves 53 are connected. The adhesive 19 filled to the above-mentioned (interface portion) does not contact any one of the photoelectric hybrid substrate 2 and the cover member 22 .

另一方面，如圖9的假想線所示，若將第2後縱溝52及第3後縱溝53在前後方向上錯開，充填於第2後縱溝52的接著劑19會接觸於本體21中的上述之上表面，充填於第3後縱溝53的接著劑19會接觸於光電混合基板2中的 上述之下表面。因此，可以增加接著劑19對本體21及光電混合基板2的接觸面積。其結果，可以進一步提升本體21與光電混合基板2的接著力。 On the other hand, as shown by the imaginary line in FIG. 9, if the second rear longitudinal groove 52 and the third rear longitudinal groove 53 are shifted in the front-rear direction, the adhesive 19 filled in the second rear longitudinal groove 52 will contact the main body. 21, the adhesive 19 filled in the third rear vertical groove 53 will be in contact with the photoelectric hybrid substrate 2. above the lower surface. Therefore, the contact area of the adhesive 19 to the main body 21 and the photoelectric hybrid substrate 2 can be increased. As a result, the adhesive force between the main body 21 and the photoelectric hybrid substrate 2 can be further improved.

如圖8D的實線所示，在第2步驟中，第3後縱溝53是設於底壁23。但是，如圖8D的假想線及圖8E的實線所示，亦可將第3後縱溝53設於延伸壁24。 As shown by the solid line in FIG. 8D , in the second step, the third rear vertical groove 53 is formed on the bottom wall 23 . However, as shown by the imaginary line in FIG. 8D and the solid line in FIG. 8E , the third rear vertical groove 53 may also be provided in the extension wall 24 .

第3後縱溝53是設於2個延伸壁24的每一個的內表面。 The third rear vertical groove 53 is provided on the inner surface of each of the two extension walls 24 .

又，在將第3後縱溝53設於延伸壁24，且進一步使第3後縱溝53的厚度(高度)相較於裝設部13(光電混合基板2)的厚度更厚或相同的情況下，可以在第1步驟中，形成將本體21及蓋件22一體地形成的連接器3。在此情況下，是將裝設部13的左右兩端部從後側朝向前側來***第3後縱溝53。 In addition, when the third rear vertical groove 53 is provided on the extension wall 24, and the thickness (height) of the third rear vertical groove 53 is thicker or the same as that of the mounting portion 13 (electrical hybrid board 2 ), In this case, the connector 3 in which the main body 21 and the cover 22 are integrally formed may be formed in the first step. In this case, the left and right end portions of the mounting portion 13 are inserted into the third rear longitudinal groove 53 from the rear side toward the front side.

較佳的是，將本體21及蓋件22以分開方式來構成連接器3。藉此，由於可以藉由蓋件22來按壓裝設部13，所以可以抑制裝設部13相對於本體21的位置偏離，以將光電混合基板2精度良好地接著於連接器3而進行裝設。 Preferably, the body 21 and the cover 22 are separated to form the connector 3 . Thereby, since the mounting portion 13 can be pressed by the cover member 22, the positional deviation of the mounting portion 13 relative to the main body 21 can be suppressed, so that the opto-electric hybrid substrate 2 can be mounted on the connector 3 with good precision. .

又，在第2實施形態中是使連接器3具備中央横溝40。 Also, in the second embodiment, the connector 3 is provided with the central lateral groove 40 .

但是，如圖12A~圖14所示，連接器3也可以具備第3開口部73來代替中央横溝40。第3開口部73是在光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，連通於後縱溝50的前端部。第3開口部73包含第4開口 部74及第5開口部75。 However, as shown in FIGS. 12A to 14 , the connector 3 may include a third opening 73 instead of the central lateral groove 40 . The third opening 73 communicates with the front end of the rear longitudinal groove 50 when the opto-electric hybrid substrate 2 is housed in the housing space 29 and the cover 22 is mounted on the main body 21 . The third opening 73 includes the fourth opening part 74 and the fifth opening part 75.

第4開口部74是設於光電混合基板2。第4開口部74是在光電混合基板2的裝設部13中的中央部，並將光電混合基板2在厚度方向上貫通的貫通孔。第4開口部74是相對於裝設部13的寬度方向兩端緣隔著間隔在寬度方向內側。第4開口部74具有在平面視角下的大致矩形狀。第4開口部74是連接於第1後縱溝51及第2後縱溝52的前端部。 The fourth opening 74 is provided in the opto-electric hybrid substrate 2 . The fourth opening 74 is a through hole formed in the center of the mount portion 13 of the opto-electric hybrid board 2 and penetrating the opto-hybrid board 2 in the thickness direction. The fourth opening 74 is located on the inner side in the width direction with a gap between both end edges in the width direction of the mounting portion 13 . The fourth opening 74 has a substantially rectangular shape in plan view. The fourth opening 74 is connected to the front ends of the first rear longitudinal groove 51 and the second rear longitudinal groove 52 .

第5開口部75是設於蓋件22。第5開口部75是在蓋件22中的中央部，並將蓋件22在厚度方向上貫通的貫通孔。第5開口部75是相對於蓋件22的寬度方向兩端緣隔著間隔在寬度方向內側。第5開口部75在光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，在平面視角下，包含第4開口部74，且具有相對於第4開口部74較大之平面視角下的大致矩形狀。 The fifth opening 75 is provided in the cover 22 . The fifth opening 75 is a through hole formed in the center of the cover 22 and penetrating the cover 22 in the thickness direction. The fifth opening 75 is located on the inner side in the width direction with a gap between both end edges in the width direction of the cover member 22 . The fifth opening 75 includes the fourth opening 74 when the opto-electric hybrid substrate 2 is accommodated in the accommodation space 29 and the cover 22 is installed on the main body 21 in a plane view, and has a smaller diameter than the fourth opening 74. Roughly rectangular when viewed from a large plane.

第5開口部75是連接於第4後縱溝54的前端部。 The fifth opening 75 is connected to the front end of the fourth rear longitudinal groove 54 .

並且，第3開口部73在光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，是連通於後縱溝50。 Furthermore, the third opening 73 communicates with the rear longitudinal groove 50 when the opto-electric hybrid substrate 2 is housed in the housing space 29 and the cover 22 is mounted on the main body 21 .

在該變形例中，是在第2步驟中將接著劑19注入第3開口部73。如此一來，接著劑19會從第3開口部73流入後縱溝50。 In this modified example, the adhesive 19 is injected into the third opening 73 in the second step. In this way, the adhesive 19 flows into the rear vertical groove 50 from the third opening 73 .

再者，第3開口部73的形狀並無特別限定，亦可為例如，在平面視角下的大致圓形狀。 In addition, the shape of the 3rd opening part 73 is not specifically limited, For example, it may be a substantially circular shape in plan view.

在上述的變形例中，如圖12A~圖14所示，是將第3開口部73設於蓋件22，雖然圖未示，但是也可以例如設於底壁23。設於底壁23的第3開口部73(在圖12A~圖14中未圖示)會成為第7開口部。第7開口部是與光電混合基板2的第4開口部74一起包含於第3開口部73。亦即，第3開口部73具備第7開口部(圖未示)及第4開口部74。 In the modification described above, as shown in FIGS. 12A to 14 , the third opening 73 is provided on the cover 22 , although not shown, it may be provided on the bottom wall 23 , for example. The third opening 73 (not shown in FIGS. 12A to 14 ) provided in the bottom wall 23 becomes a seventh opening. The seventh opening is included in the third opening 73 together with the fourth opening 74 of the opto-electric hybrid board 2 . That is, the third opening 73 includes a seventh opening (not shown) and a fourth opening 74 .

第7開口部是在底壁23中的中央部，並將底壁23在厚度方向上貫通的貫通孔。第7開口部在光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，在平面視角下，包含第4開口部74，且具有相對於第4開口部74較大之平面視角下的大致矩形狀。第7開口部是連接於圖12D所示之第3後縱溝53的前端部。第7開口部會使光電混合基板2中的第2後縱溝52的前端部露出於下側。 The seventh opening is a through hole formed in the center of the bottom wall 23 and penetrating the bottom wall 23 in the thickness direction. When the photoelectric hybrid substrate 2 is accommodated in the accommodation space 29 and the cover 22 is mounted on the main body 21, the seventh opening includes the fourth opening 74 in a plane view and has a larger diameter than the fourth opening 74. Roughly rectangular in plan view. The seventh opening is connected to the front end of the third rear longitudinal groove 53 shown in FIG. 12D. The seventh opening exposes the front end of the second rear vertical groove 52 in the opto-electric hybrid board 2 to the lower side.

另一方面，在蓋件22上未設有第3開口部73。因此，蓋件22是將光電混合基板2從上側封閉。 On the other hand, the third opening 73 is not provided in the cover 22 . Therefore, the cover 22 closes the photoelectric hybrid substrate 2 from above.

在該變形例中，接著劑19是透過第7開口部，流入底壁23的第3後縱溝53、光電混合基板2的第1後縱溝51及第2後縱溝52、及蓋件22的第4後縱溝54。 In this modified example, the adhesive 19 passes through the seventh opening and flows into the third rear vertical groove 53 of the bottom wall 23, the first rear vertical groove 51 and the second rear vertical groove 52 of the optoelectronic hybrid substrate 2, and the cover member. 22 of the 4th rear longitudinal groove 54.

再者，第3開口部73亦可不具備第4開口部74，而僅由第7開口部所構成。此情況下，接著劑19是透過第7開口部，流入底壁23的第3後縱溝53、及光電混合基板2的第1後縱溝51。 In addition, the 3rd opening part 73 does not have the 4th opening part 74, and may consist only of the 7th opening part. In this case, the adhesive 19 passes through the seventh opening and flows into the third rear vertical groove 53 of the bottom wall 23 and the first rear vertical groove 51 of the photoelectric hybrid substrate 2 .

又，也可以僅設置第1後縱溝51及第3後縱溝53之任一者，並使接著劑19透過第7開口部流入該任一者。 In addition, only any one of the first rear vertical groove 51 and the third rear vertical groove 53 may be provided, and the adhesive 19 may flow into either one through the seventh opening.

(第3實施形態) (third embodiment)

接著，說明第3實施形態。在第3實施形態中，針對與上述之第1及第2實施形態同樣的構件及步驟，是附加相同的參照符號，而省略其詳細的說明。又，除了特別記載以外，第3實施形態可以發揮與第1及第2實施形態同樣的作用效果。 Next, a third embodiment will be described. In the third embodiment, the same members and steps as those in the above-mentioned first and second embodiments are denoted by the same reference numerals, and their detailed descriptions are omitted. In addition, unless otherwise specified, the third embodiment can exhibit the same effects as those of the first and second embodiments.

再者，在圖15A~圖15D中，為了明確地顯示中央横溝40、前縱溝60、前橫溝80(後述)的配置及形狀，而省略芯材層11。 In addition, in FIGS. 15A to 15D , in order to clearly show the arrangement and shape of the central lateral groove 40 , the front longitudinal groove 60 , and the front lateral groove 80 (described later), the core material layer 11 is omitted.

如圖15A~圖15D所示，連接器組1是具備前縱溝60(配置於第1方向一側的第1方向一側溝之一例)來代替後縱溝50。 As shown in FIGS. 15A to 15D , the connector set 1 is provided with a front vertical groove 60 (an example of a first-direction-side groove disposed on one side in the first direction) instead of the rear vertical groove 50 .

前縱溝60是設置於光電混合基板2、本體21及/或蓋件22。前縱溝60具備下述之至少任一者：設置於光電混合基板2的第1前縱溝61及第2前縱溝62；設置於本體21的第3前縱溝63；及設置於蓋件22的第4前縱溝64。 The front longitudinal groove 60 is provided on the opto-electric hybrid substrate 2 , the body 21 and/or the cover 22 . The front longitudinal groove 60 has at least one of the following: the first front longitudinal groove 61 and the second front longitudinal groove 62 provided on the optoelectronic hybrid substrate 2; the third front longitudinal groove 63 provided on the main body 21; and the front longitudinal groove 63 provided on the cover. The fourth front longitudinal groove 64 of the member 22.

接著，說明前縱溝60具備第1前縱溝61、第2前縱溝62、第3前縱溝63、及第4前縱溝64全部(4個)的例子。 Next, an example in which the front longitudinal groove 60 includes all (four) of the first front longitudinal groove 61 , the second front longitudinal groove 62 , the third front longitudinal groove 63 , and the fourth front longitudinal groove 64 will be described.

第1前縱溝61、第2前縱溝62、第3前縱溝63、及第4前縱溝64，皆具有在前後方向上延伸的形狀。 The first front longitudinal groove 61 , the second front longitudinal groove 62 , the third front longitudinal groove 63 , and the fourth front longitudinal groove 64 all have shapes extending in the front-rear direction.

以下，依序說明第1前縱溝61、第2前縱溝62、第3前縱溝63、及第4前縱溝64。此外，針對第2前縱溝62、第3前縱溝63、第4前縱溝64，對於與第1前縱溝61 同樣的構成等，將省略其說明。 Hereinafter, the first front longitudinal groove 61 , the second front longitudinal groove 62 , the third front longitudinal groove 63 , and the fourth front longitudinal groove 64 will be described in order. In addition, for the second front longitudinal groove 62 , the third front longitudinal groove 63 , and the fourth front longitudinal groove 64 , for the first front longitudinal groove 61 The description of the same configuration and the like will be omitted.

第1前縱溝61是設於光電混合基板2的上表面。第1前縱溝61的後端部是位於裝設部13的中央部。藉此，第1前縱溝61的後端部會連通於第1横溝41。另一方面，第1前縱溝61的前端部是位於裝設部13的前端部且快要到達前端緣的位置。亦即，第1前縱溝61的前端部是與裝設部13的前端面在前後方向上隔著間隔。總而言之，第1前縱溝61是從裝設部13的中央部延伸至快要到達前端緣為止，並未到達裝設部13的前端面。第1前縱溝61的截面形狀是與第1横溝41的截面形狀相同。 The first front vertical groove 61 is provided on the upper surface of the opto-electric hybrid substrate 2 . The rear end portion of the first front longitudinal groove 61 is located in the center portion of the mounting portion 13 . Thereby, the rear end portion of the first front longitudinal groove 61 communicates with the first lateral groove 41 . On the other hand, the front end portion of the first front longitudinal groove 61 is located at the front end portion of the mounting portion 13 and almost reaches the front end edge. That is, the front end portion of the first front longitudinal groove 61 is separated from the front end surface of the mounting portion 13 in the front-rear direction. In short, the first front longitudinal groove 61 extends from the central portion of the installation portion 13 until it reaches the front end edge, and does not reach the front end surface of the installation portion 13 . The cross-sectional shape of the first front longitudinal groove 61 is the same as that of the first lateral groove 41 .

第2前縱溝62是設於光電混合基板2的下表面。第2前縱溝62的後端部是位於裝設部13的中央部。藉此，第2前縱溝62的後端部會連通於第2横溝42。另一方面，第2前縱溝62的前端部是位於裝設部13的前端部且快要到達前端緣的位置。亦即，第2前縱溝62的前端部是與裝設部13的前端面在前後方向上隔著間隔。第2前縱溝62是從裝設部13的中央部延伸至快要到達前端緣為止，並未到達裝設部13的前端面。總而言之，第2前縱溝62是相對於沿著光電混合基板2的上下方向中心的假想面而以面對稱的方式配置及形成。 The second front vertical groove 62 is provided on the lower surface of the opto-electric hybrid substrate 2 . The rear end portion of the second front longitudinal groove 62 is located in the center portion of the mounting portion 13 . Thereby, the rear end portion of the second front longitudinal groove 62 communicates with the second lateral groove 42 . On the other hand, the front end portion of the second front longitudinal groove 62 is located at the front end portion of the mounting portion 13 and almost reaches the front end edge. That is, the front end portion of the second front longitudinal groove 62 is separated from the front end surface of the mounting portion 13 in the front-rear direction. The second front longitudinal groove 62 extends from the central portion of the installation portion 13 to almost the front end edge, and does not reach the front end surface of the installation portion 13 . In short, the second front vertical groove 62 is arranged and formed plane-symmetrically with respect to a virtual plane along the vertical center of the opto-electric hybrid substrate 2 .

第3前縱溝63是設於底壁23的底面。第3前縱溝63的後端部是連通於第3横溝43。另一方面，第3前縱溝63的前端部在光電混合基板2容置於容置空間29時，是隔著間隔配置於裝設部13之前端緣的後側。總而言之，第3 前縱溝63具有在光電混合基板2容置於容置空間29時，在平面視角下與第2前縱溝62重複的形狀。第3前縱溝63的截面形狀是與第1前縱溝61的截面形狀相同。 The third front vertical groove 63 is provided on the bottom surface of the bottom wall 23 . The rear end portion of the third front longitudinal groove 63 communicates with the third lateral groove 43 . On the other hand, the front end portion of the third front vertical groove 63 is arranged behind the front end edge of the mounting portion 13 with a gap therebetween when the opto-electric hybrid board 2 is housed in the housing space 29 . All in all, the 3rd The front vertical groove 63 has a shape overlapping with the second front vertical groove 62 in a plan view when the opto-electric hybrid substrate 2 is accommodated in the accommodation space 29 . The cross-sectional shape of the third front longitudinal groove 63 is the same as that of the first front longitudinal groove 61 .

第4前縱溝64是設於蓋件22的下表面。第4前縱溝64的後端部是連通於第4横溝44。另一方面，第4前縱溝64的前端部在光電混合基板2及本體21容置於容置空間29時，是隔著間隔配置於裝設部13之前端緣的後側。總而言之，第4前縱溝64具有在光電混合基板2及本體21容置於容置空間29時，在平面視角下與第3前縱溝63重複的形狀。第4前縱溝64的截面形狀是與第2前縱溝62的截面形狀相同。 The fourth front vertical groove 64 is provided on the lower surface of the cover 22 . The rear end portion of the fourth front longitudinal groove 64 communicates with the fourth lateral groove 44 . On the other hand, the front end portion of the fourth front longitudinal groove 64 is disposed behind the front end edge of the mounting portion 13 with a gap therebetween when the opto-electric hybrid board 2 and the main body 21 are accommodated in the accommodation space 29 . In a word, the fourth front longitudinal groove 64 has a shape overlapping with the third front longitudinal groove 63 when the optoelectronic hybrid substrate 2 and the main body 21 are accommodated in the accommodating space 29 . The cross-sectional shape of the fourth front longitudinal groove 64 is the same as that of the second front longitudinal groove 62 .

在第3實施形態中，是在第2步驟中，使接著劑19透過開口部70及中央横溝40而流入前縱溝60。詳而言之，接著劑19是從中央横溝40的寬度方向中央部到達前縱溝60的前端部，藉此，將接著劑19充填於前縱溝60。 In the third embodiment, in the second step, the adhesive 19 is made to flow into the front vertical groove 60 through the opening 70 and the central lateral groove 40 . Specifically, the adhesive agent 19 is filled in the front longitudinal groove 60 by the adhesive agent 19 reaching from the center portion in the width direction of the central lateral groove 40 to the front end portion of the front longitudinal groove 60 .

但是，在第1前縱溝61及第4前縱溝64的前端部與裝設部13的前端面、與第2前縱溝62及第3前縱溝63的前端部與裝設部13的前端面上，是分別在前後方向上隔著間隔，在該等間隔中是使光電混合基板2的上表面以及蓋件22的下表面相接觸，並使光電混合基板2的下表面以及本體21的上表面相接觸。因此，可限制接著劑19污染光波導5的前端面之情形。 However, between the front end portions of the first front longitudinal groove 61 and the fourth front longitudinal groove 64 and the front end surfaces of the installation portion 13 , and the front end portions of the second front longitudinal groove 62 and the third front longitudinal groove 63 and the installation portion 13 On the front end surface of the front end, there are intervals in the front and rear directions, and in the equal intervals, the upper surface of the photoelectric hybrid substrate 2 and the lower surface of the cover 22 are in contact, and the lower surface of the photoelectric hybrid substrate 2 and the body The upper surface of 21 is in contact. Therefore, it is possible to limit the contamination of the front end surface of the optical waveguide 5 by the adhesive 19 .

又，前縱溝60也可以在光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，與光電混合基 板2的前端面重複。例如，也可以使第2前縱溝62及第3前縱溝63的前端部從光電混合基板2的前端面露出。又，也可以使第1前縱溝61及第4前縱溝64的前端緣位於比光電混合基板2的前端面更前側。 Moreover, the front longitudinal groove 60 can also be integrated with the photoelectric hybrid substrate when the photoelectric hybrid substrate 2 is accommodated in the accommodating space 29 and the cover 22 is installed on the main body 21. Repeat for the front face of plate 2. For example, the front ends of the second front vertical groove 62 and the third front vertical groove 63 may be exposed from the front end surface of the opto-electric hybrid board 2 . In addition, the front end edges of the first front vertical groove 61 and the fourth front vertical groove 64 may be located on the front side of the front end surface of the opto-electric hybrid board 2 .

較佳的是，前縱溝60的前端部位於比光電混合基板2的前端面更後側。藉此，可以防止上述之接著劑19對光波導5之前端面的污染。 Preferably, the front end of the front vertical groove 60 is located on the rear side of the front end of the optoelectronic hybrid substrate 2 . Thereby, the above-mentioned adhesive agent 19 can be prevented from contaminating the front end surface of the optical waveguide 5 .

又，可以藉由基於蓋件22對光電混合基板2的按壓之蓋件22、光電混合基板2及本體21的密合，來進一步防止上述之污染。 Furthermore, the above-mentioned contamination can be further prevented by the close contact between the cover 22 , the opto-electric hybrid substrate 2 and the main body 21 based on the pressing of the cover 22 against the opto-electric hybrid substrate 2 .

再者，在第2步驟中，也可以在不藉由蓋件22按壓光電混合基板2的情形下，將接著劑19注入開口部70。 Furthermore, in the second step, the adhesive 19 may be injected into the opening 70 without pressing the photoelectric hybrid board 2 with the cover 22 .

較佳的是，藉由蓋件22按壓光電混合基板2。藉此，可以讓蓋件22、光電混合基板2及本體21密合，以進一步防止上述之接著劑19往前側的溢出。 Preferably, the photoelectric hybrid substrate 2 is pressed by the cover 22 . Thereby, the cover 22 , the photoelectric hybrid substrate 2 , and the main body 21 can be closely bonded to further prevent the above-mentioned adhesive 19 from overflowing to the front side.

(變形例) (Modification)

接著，說明第3實施形態的變形例。在以下的各變形例中，針對與上述之第3實施形態同樣的構件及步驟，是附加相同的參照符號，而省略其詳細的說明。又，可以適當地組合各變形例。再者，除了特別記載以外，各變形例可以發揮與第3實施形態同樣的作用效果。 Next, a modified example of the third embodiment will be described. In each of the following modified examples, the same reference numerals are assigned to the same components and steps as those of the above-mentioned third embodiment, and detailed description thereof will be omitted. In addition, various modified examples can be combined appropriately. In addition, unless otherwise stated, each modification can exhibit the same effect as that of the third embodiment.

如圖15A~圖15D所示，第3實施形態的連接器組1是使前縱溝60具備：第1前縱溝61、第2前縱溝62、 第3前縱溝63及第4前縱溝64。但是，前縱溝60並不限定於此。例如，可以從由第1前縱溝61、第2前縱溝62、第3前縱溝63及第4前縱溝64所構成之群組中選擇並具備任3個、或任2個、甚或任1個。 As shown in FIGS. 15A to 15D, the connector group 1 according to the third embodiment has the front longitudinal groove 60 equipped with: a first front longitudinal groove 61, a second front longitudinal groove 62, The third front longitudinal groove 63 and the fourth front longitudinal groove 64 . However, the front longitudinal groove 60 is not limited to this. For example, any three or two may be selected from the group consisting of the first front longitudinal groove 61, the second front longitudinal groove 62, the third front longitudinal groove 63, and the fourth front longitudinal groove 64, Or even any one.

又，各前縱溝60，亦即，第1前縱溝61、第2前縱溝62、第3前縱溝63及第4前縱溝64的每一種均為1個，但其數量並不限定於此，亦可為複數個。 Also, each of the front longitudinal grooves 60, that is, each of the first front longitudinal groove 61, the second front longitudinal groove 62, the third front longitudinal groove 63, and the fourth front longitudinal groove 64 is one, but the number is different. It is not limited to this, and may be plural.

在沿著厚度方向及寬度方向的截面中，是將4個前縱溝60在寬度方向上配置於相同位置，但是也可以例如部分地或完全地錯開。 In the cross section along the thickness direction and the width direction, the four front vertical grooves 60 are arranged at the same position in the width direction, but they may be partially or completely shifted, for example.

例如，如圖9所示，在光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，可將第4前縱溝64例如相對於第1前縱溝61而隔著間隔配置於右側。藉此，使第1前縱溝61及第4前縱溝64在左右(寬度)方向上錯開。在此情況下，第1前縱溝61是面對蓋件22中的第4前縱溝64以外的下表面，另一方面，第4前縱溝64是面對光電混合基板2中的第1前縱溝61以外的上表面。 For example, as shown in FIG. 9 , when the optoelectronic hybrid substrate 2 is housed in the housing space 29 and the cover 22 is mounted on the body 21 , the fourth front longitudinal groove 64 can be separated from the first front longitudinal groove 61 , for example. The gap is arranged on the right side. Thereby, the first front longitudinal groove 61 and the fourth front longitudinal groove 64 are shifted in the left-right (width) direction. In this case, the first front longitudinal groove 61 faces the lower surface of the cover member 22 other than the fourth front longitudinal groove 64 , while the fourth front longitudinal groove 64 faces the fourth front longitudinal groove 64 of the photoelectric hybrid substrate 2 . 1 The upper surface other than the front longitudinal groove 61.

另一方面，第1前縱溝61及第4前縱溝64在寬度方向上配置於相同位置的情況下，會使第1前縱溝61及第4前縱溝64相連通。充填至所述的(交界部分)的接著劑19，不會接觸於光電混合基板2及蓋件22的任一個。 On the other hand, when the first front longitudinal groove 61 and the fourth front longitudinal groove 64 are arranged at the same position in the width direction, the first front longitudinal groove 61 and the fourth front longitudinal groove 64 communicate with each other. The adhesive 19 filled to the above-mentioned (interface portion) does not contact any one of the photoelectric hybrid substrate 2 and the cover member 22 .

另一方面，若第1前縱溝61及第4前縱溝64在寬度方向上錯開，充填於第1前縱溝61的接著劑19會接觸於蓋件22中的上述之下表面，充填於第4前縱溝64的接 著劑19會接觸於光電混合基板2中的上述之上表面。因此，可以增加接著劑19對蓋件22及光電混合基板2的接觸面積。其結果，可以進一步提升蓋件22與光電混合基板2的接著力。 On the other hand, if the first front longitudinal groove 61 and the fourth front longitudinal groove 64 are staggered in the width direction, the adhesive 19 filled in the first front longitudinal groove 61 will contact the above-mentioned lower surface of the cover member 22, and the adhesive agent 19 will be filled. Connecting to the 4th front longitudinal groove 64 The adhesive 19 is in contact with the above-mentioned upper surface of the photoelectric hybrid substrate 2 . Therefore, the contact area of the adhesive 19 to the cover member 22 and the photoelectric hybrid substrate 2 can be increased. As a result, the adhesive force between the cover member 22 and the photoelectric hybrid substrate 2 can be further improved.

又，在光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，可將第2前縱溝62例如相對於第3前縱溝63而隔著間隔配置於左側。藉此，使第2前縱溝62及第3前縱溝63在左右(寬度)方向上完全地錯開。在此情況下，第2前縱溝62是面對本體21中的第3前縱溝63以外的上表面(底壁23的底面)，另一方面，第3前縱溝63是面對光電混合基板2中的第2前縱溝62以外的下表面。 Also, when the opto-electric hybrid board 2 is housed in the housing space 29 and the cover 22 is mounted on the main body 21 , the second front vertical groove 62 can be arranged on the left side with a gap between the third front vertical groove 63 , for example. Thereby, the second front longitudinal groove 62 and the third front longitudinal groove 63 are completely shifted in the left-right (width) direction. In this case, the second front longitudinal groove 62 is facing the upper surface (the bottom surface of the bottom wall 23 ) other than the third front longitudinal groove 63 in the main body 21 , and on the other hand, the third front longitudinal groove 63 is facing the photoelectric The lower surface of the hybrid substrate 2 other than the second front vertical groove 62 .

另一方面，第2前縱溝62及第3前縱溝63在前後方向上配置於相同位置的情況下，會使第2前縱溝62及第3前縱溝63相連通。充填至所述的(交界部分)的接著劑19，不會接觸於光電混合基板2及蓋件22的任一個。 On the other hand, when the second front longitudinal groove 62 and the third front longitudinal groove 63 are arranged at the same position in the front-rear direction, the second front longitudinal groove 62 and the third front longitudinal groove 63 communicate with each other. The adhesive 19 filled to the above-mentioned (interface portion) does not contact any one of the photoelectric hybrid substrate 2 and the cover member 22 .

另一方面，若第2前縱溝62及第3前縱溝63在前後方向上錯開，充填於第2前縱溝62的接著劑19會接觸於本體21中的上述之上表面，充填於第3前縱溝63接著劑19會接觸於光電混合基板2中的上述之下表面。因此，可以增加接著劑19對本體21及光電混合基板2的接觸面積。其結果，可以進一步提升本體21與光電混合基板2的接著力。 On the other hand, if the second front longitudinal groove 62 and the third front longitudinal groove 63 are staggered in the front-rear direction, the adhesive 19 filled in the second front longitudinal groove 62 will contact the above-mentioned upper surface of the main body 21 and be filled in the upper surface of the main body 21. The adhesive agent 19 of the third front vertical groove 63 is in contact with the above-mentioned lower surface of the optoelectronic hybrid substrate 2 . Therefore, the contact area of the adhesive 19 to the main body 21 and the photoelectric hybrid substrate 2 can be increased. As a result, the adhesive force between the main body 21 and the photoelectric hybrid substrate 2 can be further improved.

如圖15A~圖15D的粗線的假想線及圖15E的實線所示，也可以在前縱溝60的前端部設置與其相連通 的前橫溝80。 As shown by the thick imaginary lines in Figures 15A to 15D and the solid lines in Figure 15E, a front end portion of the front longitudinal groove 60 may also be provided with a The front transverse ditch 80.

前橫溝80是沿著寬度方向的溝，且具有與中央横溝40同樣的截面形狀。前橫溝80是設於前縱溝60的前端部。前橫溝80具備下述之至少任一者：設於光電混合基板2之上表面的第1前橫溝81；設於光電混合基板2之下表面的第2前橫溝82；設於本體21的底壁23之上表面的第3前橫溝83；及設於蓋件22之下表面的第4前橫溝84。 The front lateral groove 80 is a groove along the width direction and has the same cross-sectional shape as the central lateral groove 40 . The front lateral groove 80 is provided at the front end portion of the front vertical groove 60 . The front transverse groove 80 has at least one of the following: a first front transverse groove 81 provided on the upper surface of the optoelectronic hybrid substrate 2; a second front transverse groove 82 provided on the lower surface of the optoelectronic hybrid substrate 2; The third front transverse groove 83 on the upper surface of the bottom wall 23 of 21; and the fourth front transverse groove 84 on the lower surface of the cover member 22.

此外，也可以如圖15E的假想線所示，於延伸壁24的內表面，以接續到第3前橫溝83的下端部的方式設置上下溝85。 Further, as shown by phantom lines in FIG. 15E , upper and lower grooves 85 may be provided on the inner surface of the extension wall 24 so as to continue to the lower end portion of the third front lateral groove 83 .

上下溝85是在上下方向上延伸，並如圖16所示，露出於延伸壁24的上表面。 The upper and lower grooves 85 extend in the vertical direction, and are exposed on the upper surface of the extension wall 24 as shown in FIG. 16 .

根據該變形例，已到達前縱溝60的前端的接著劑19，會接著流入前橫溝80。之後，可以於前橫溝80朝上側行進(上升)。 According to this modified example, the adhesive 19 that has reached the front end of the front longitudinal groove 60 flows into the front lateral groove 80 next. Thereafter, the front lateral groove 80 can move upward (ascend).

如圖17A~圖17C所示，也可以具備第3開口部73來代替中央横溝40。再者，在圖17A~圖17C中，為了明確地顯示中央横溝40及後縱溝50的配置及形狀，而省略芯材層11。 As shown in FIGS. 17A to 17C , instead of the central lateral groove 40 , a third opening 73 may be provided. In addition, in FIGS. 17A to 17C , in order to clearly show the arrangement and shape of the central lateral groove 40 and the rear longitudinal groove 50 , the core material layer 11 is omitted.

此外，也可以如圖15A~圖15C的細線的假想線所示，於前縱溝60的前端部設置第6開口部76。 In addition, as shown by the thin phantom lines in FIGS. 15A to 15C , a sixth opening 76 may be provided at the front end portion of the front longitudinal groove 60 .

第6開口部76設置於蓋件22及/或光電混合基板2。例如，第6開口部76具備包含於光電混合基板2的前下開口66、及設置於蓋件22的前上開口67之至少任一 者。 The sixth opening 76 is provided in the cover 22 and/or the photoelectric hybrid substrate 2 . For example, the sixth opening 76 includes at least one of the lower front opening 66 included in the opto-electric hybrid board 2 and the upper front opening 67 provided in the cover 22 . By.

前下開口66是設於光電混合基板2的前端部。前下開口66是貫通於光電混合基板2的厚度方向，且是在平面視角下大致矩形狀的貫通孔。前下開口66是連通於第2前縱溝62及第3前縱溝63的前端部。 The lower front opening 66 is provided at the front end of the opto-electric hybrid substrate 2 . The front lower opening 66 is a through hole penetrating in the thickness direction of the opto-electric hybrid board 2 and having a substantially rectangular shape in a plan view. The front lower opening 66 communicates with the front ends of the second front longitudinal groove 62 and the third front longitudinal groove 63 .

前上開口67是設於蓋件22的前端部。前上開口67是在厚度方向上貫通於蓋件22，且是在平面視角下大致矩形狀的貫通孔。前上開口67是連通於第4前縱溝64的前端部。 The upper front opening 67 is provided at the front end of the cover 22 . The upper front opening 67 penetrates through the cover 22 in the thickness direction, and is a substantially rectangular through hole in a planar view. The upper front opening 67 communicates with the front end of the fourth front longitudinal groove 64 .

又，也可以如圖17A~圖17C的假想線所示，設置第3開口部73與第6開口部76之雙方。 In addition, as shown by the phantom lines in FIGS. 17A to 17C , both the third opening 73 and the sixth opening 76 may be provided.

說明另外的變形例。以下，針對與上述之第1~第3實施形態及其等的變形例同樣的構件及步驟，是附加相同的參照符號，而省略其詳細的說明。又，可以適當地組合各變形例。此外，除了特別記載以外，以下的變形例也可以發揮與第1~第3實施形態及其等之變形例同樣的作用效果。 Another modified example will be described. Hereinafter, the same members and steps as those of the above-mentioned first to third embodiments and their modifications are denoted by the same reference numerals, and their detailed descriptions are omitted. In addition, various modified examples can be combined appropriately. In addition, unless otherwise specified, the following modified examples can also exhibit the same operational effects as those of the first to third embodiments and other modified examples.

如圖18A及圖18C所示，中央横溝40也可以彎曲。 As shown in FIGS. 18A and 18C , the central lateral groove 40 may be curved.

如圖18A所示，第4横溝44(中央横溝40)是例如包含於蓋件22，且具有彎曲點相對於蓋件突出部30位於前側之平面視角下的大致L字形狀。在此情況下，由於中央横溝40在光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，彎曲點在比光電混合基板2的前端面更 後側隔著間隔，所以可以發揮與圖15A所示，在第3實施形態中所例示之第4前縱溝64(前縱溝60)同樣的作用。 As shown in FIG. 18A , the fourth lateral groove 44 (central lateral groove 40 ) is included, for example, in the cover 22 and has a substantially L-shape in plan view with the bending point located on the front side with respect to the cover protrusion 30 . In this case, since the central transverse groove 40 is placed in the accommodating space 29 and the cover 22 is mounted on the main body 21 when the optoelectronic hybrid substrate 2 is accommodated, the bending point is located further than the front end surface of the optoelectronic hybrid substrate 2. Since there is a space on the rear side, the same function as that of the fourth front vertical groove 64 (front vertical groove 60 ) exemplified in the third embodiment shown in FIG. 15A can be exhibited.

又，如圖18C所示，也可以使中央横溝40的彎曲點相對於基板突出部14而位於後側。 Also, as shown in FIG. 18C , the bending point of the central lateral groove 40 may be located on the rear side with respect to the substrate protruding portion 14 .

此外，也可以如圖18D所示，中央横溝40的彎曲點在朝寬度方向投影時，與本體凹部25重複，且後端部露出於本體21的後端面。因此，中央横溝40，可發揮與圖8D所示，在第2實施形態中所例示之第3後縱溝53(後縱溝50)同樣的作用。 In addition, as shown in FIG. 18D , the bending point of the central lateral groove 40 may overlap with the body recess 25 when projected in the width direction, and the rear end portion may be exposed on the rear end surface of the body 21 . Therefore, the central lateral groove 40 can exert the same function as that of the third rear vertical groove 53 (rear vertical groove 50 ) exemplified in the second embodiment shown in FIG. 8D .

如圖18B所示，也可以使後縱溝50及前縱溝60在前後方向上接續，以形成縱溝55。 As shown in FIG. 18B , the rear vertical groove 50 and the front vertical groove 60 may be continuous in the front-rear direction to form the vertical groove 55 .

縱溝55在光電混合基板2中，於光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，其前端部是位於快要到達光電混合基板2之前端面的後側的位置，且其後端部是位於快要到達連接器3的後端面(或是裝設部13的後端緣)的後面的位置。 The longitudinal groove 55 is in the photoelectric hybrid substrate 2, when the photoelectric hybrid substrate 2 is housed in the accommodating space 29, and the cover 22 is mounted on the body 21, its front end is located at the rear side of the front end surface of the photoelectric hybrid substrate 2. position, and its rear end portion is located at a position almost reaching the rear end surface of the connector 3 (or the rear end edge of the mounting portion 13).

如圖19A所示，亦可以寬度較寬的方式形成前縱溝60(第4前縱溝64，參照圖15A)。 As shown in FIG. 19A , the front vertical groove 60 (fourth front vertical groove 64 , see FIG. 15A ) may also be formed to have a wider width.

如圖19B所示，亦可以寬度較寬的方式形成後縱溝50(第1後縱溝51，參照圖8B)。 As shown in FIG. 19B , the rear vertical groove 50 (the first rear vertical groove 51 , see FIG. 8B ) may also be formed to have a wider width.

如圖19C及圖19D所示，可以使中央横溝40(第2横溝42，參照圖18A)具有複數個彎曲點。中央横溝40具有複數個(4個)彎曲點，且具有在平面視角下蜿蜒的形狀。 As shown in FIGS. 19C and 19D , the central lateral groove 40 (second lateral groove 42 , see FIG. 18A ) may have a plurality of bending points. The central lateral groove 40 has a plurality of (4) bending points, and has a meandering shape in a plan view.

如圖19C所示，彎曲點在朝寬度方向投影時，位於與基板突出部14重複的位置、以及相對於其在前側的位置。 As shown in FIG. 19C , when projected in the width direction, the inflection point is located at a position overlapping with the substrate protruding portion 14 and at a position on the front side relative to it.

另一方面，如圖19C所示，彎曲點在投影於寬度方向時，位於與本體凹部25重複的位置、以及相對於其在後側的位置。 On the other hand, as shown in FIG. 19C , when projected in the width direction, the bending point is located at a position overlapping with the main body concave portion 25 and at a position on the rear side relative thereto.

(具體例) (specific example)

亦可從上述之各實施形態及各變形例之任一個中以任意方式組合。 It is also possible to combine any one of the above-mentioned embodiments and modifications in any manner.

將其較佳的具體例顯示如下。 Preferable specific examples thereof are shown below.

(具體例1) (Example 1)

如圖20A~圖23C所示，連接器組1具備：縱溝55、第3横溝43、第3後縱溝53、及第4横溝44。 As shown in FIGS. 20A to 23C , the connector set 1 includes a vertical groove 55 , a third horizontal groove 43 , a third rear vertical groove 53 , and a fourth horizontal groove 44 .

縱溝55是設置於光電混合基板2的上表面。再者，光電混合基板2的下表面不具備溝。 The vertical groove 55 is provided on the upper surface of the optoelectronic hybrid substrate 2 . In addition, the lower surface of the photoelectric hybrid board 2 does not have a groove.

第3横溝43及第3後縱溝53是設置於底壁23。 The third lateral groove 43 and the third rear vertical groove 53 are provided on the bottom wall 23 .

第4横溝44是設置於蓋件22。 The fourth lateral groove 44 is provided in the cover member 22 .

並且，在該具體例1中，在第1步驟中，當光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，第3横溝43的左右兩端部的每一個是連通於2個開口部70的每一個，並且第4横溝44的左右兩端部的每一個是連通於2個開口部70的每一個。又，於第4横溝44中是與縱溝55的前後方向中央部相連通。此外，於第3橫溝43中是與第3後縱溝53的前端部相連通。 In addition, in this specific example 1, in the first step, when the optoelectronic hybrid substrate 2 is accommodated in the accommodation space 29 and the cover member 22 is installed on the main body 21, each of the left and right ends of the third lateral groove 43 It communicates with each of the two openings 70 , and each of the left and right end portions of the fourth lateral groove 44 communicates with each of the two openings 70 . In addition, the fourth lateral groove 44 communicates with the central portion of the longitudinal groove 55 in the front-rear direction. In addition, the third lateral groove 43 communicates with the front end portion of the third rear vertical groove 53 .

在第2步驟中，當將接著劑19注入左側的開口部70時，會從第4横溝44及第3横溝43的每一個的左端部到達第4横溝44及第3横溝43的每一個的內部，接著，充填並通過第4横溝44及第3横溝43的每一個，之後，到達右側的開口部70。 In the second step, when the adhesive 19 is poured into the opening 70 on the left side, it reaches the end of each of the fourth lateral groove 44 and the third lateral groove 43 from the left end of each of the fourth lateral groove 44 and the third lateral groove 43 . Next, the inside is filled and passes through each of the fourth lateral groove 44 and the third lateral groove 43 , and then reaches the opening 70 on the right side.

另一方面，充填至第4横溝44的接著劑19會到達縱溝55的前後方向中央部，然後，從縱溝55的前後方向中央部在前後方向上分歧而朝向前後兩側，且一邊充填縱溝55一邊行進，以到達縱溝55的前後兩端部。特別的是，在縱溝55的後端部中，可容許接著劑19從蓋件22的後端面溢出。但是，接著劑19並不會污染光電混合基板2的前端面。 On the other hand, the adhesive 19 filled in the fourth transverse groove 44 reaches the center portion of the longitudinal groove 55 in the front-rear direction, and then diverges in the front-rear direction from the center portion of the longitudinal groove 55 in the front-rear direction, and is filled while being filled. The longitudinal groove 55 advances so as to reach both front and rear ends of the longitudinal groove 55 . In particular, in the rear end portion of the longitudinal groove 55 , the adhesive 19 is allowed to overflow from the rear end surface of the cover member 22 . However, the adhesive 19 does not contaminate the front end surface of the photoelectric hybrid substrate 2 .

另一方面，已充填於第3横溝43的接著劑19是從第3後縱溝53的前端部朝後側，一邊充填於第3後縱溝53一邊行進，而到達第3後縱溝53的後端部。此時，在第3後縱溝53的後端部中，可容許接著劑19從本體21的後端面溢出。 On the other hand, the adhesive 19 filled in the third lateral groove 43 travels from the front end of the third rear longitudinal groove 53 toward the rear side while filling the third rear longitudinal groove 53 , and reaches the third rear longitudinal groove 53 . of the rear end. At this time, in the rear end portion of the third rear longitudinal groove 53 , the adhesive 19 is allowed to overflow from the rear end surface of the main body 21 .

又，也可以如圖20A、圖23A及圖24的假想線所示，進一步於蓋件22設置2個蓋件凹部34、及第5横溝45。 In addition, as shown by phantom lines in FIGS. 20A , 23A, and 24 , two cover recesses 34 and a fifth lateral groove 45 may be further provided on the cover 22 .

第5横溝45是在光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，位於與縱溝55的前端部重複的位置。 The fifth horizontal groove 45 is located at a position overlapping with the front end of the vertical groove 55 when the opto-electric hybrid substrate 2 is accommodated in the accommodating space 29 and the cover 22 is mounted on the main body 21 .

2個蓋件凹部34是接續於第5横溝45的左右 兩端部。 The two cover recesses 34 are connected to the left and right sides of the fifth transverse groove 45 both ends.

在此情況下，在第1步驟中，當光電混合基板2容置於容置空間29、且蓋件22安裝於本體21時，縱溝55的前端部即連通於第5横溝45。第5横溝45是透過蓋件凹部34而連通至外部。 In this case, in the first step, when the optoelectronic hybrid substrate 2 is accommodated in the accommodating space 29 and the cover 22 is installed on the main body 21 , the front end of the vertical groove 55 communicates with the fifth transverse groove 45 . The fifth lateral groove 45 communicates to the outside through the cover recess 34 .

在第2步驟中，接著劑19是通過縱溝55的前端部而到達第5横溝45。亦即，接著劑19是完全地充填縱溝55的前端部。 In the second step, the adhesive 19 reaches the fifth lateral groove 45 through the front end of the vertical groove 55 . That is, the adhesive 19 completely fills the front end of the vertical groove 55 .

接著，接著劑19在第5横溝45的左右兩側(以分歧的方式)行進，以一邊充填於蓋件凹部34內一邊上升。 Next, the adhesive agent 19 advances on both sides of the fifth horizontal groove 45 (in a branching manner), and rises while being filled in the lid concave portion 34 .

藉由這種構成，可增加接著劑19對光電混合基板2及連接器3的接觸面積，並且提升光電混合基板2及連接器3的接著力。 With this configuration, the contact area of the adhesive 19 on the opto-electric hybrid board 2 and the connector 3 can be increased, and the adhesive force between the opto-electric hybrid board 2 and the connector 3 can be improved.

(具體例2) (Specific example 2)

如圖22所示，在具體例1中，雖然例示有作為光波導構件之一例的光電混合基板2，但是例如，在具體的2中，是如圖25所示，光波導構件之一例不具備電路基板4，而具備光波導5。較佳的是，光波導構件之一例為僅由光波導5所構成。 As shown in FIG. 22, in concrete example 1, although the photoelectric hybrid substrate 2 as an example of the optical waveguide member is illustrated, for example, in concrete example 2, as shown in FIG. 25, one example of the optical waveguide member does not have The circuit board 4 includes an optical waveguide 5 . An example of the optical waveguide member is preferably constituted by only the optical waveguide 5 .

光波導5與容置光波導5的連接器3，是設置於光波導連接器88。較佳的是，光波導連接器88為僅由光波導5、連接器3、及接著劑19所構成。 The optical waveguide 5 and the connector 3 accommodating the optical waveguide 5 are provided on the optical waveguide connector 88 . Preferably, the optical waveguide connector 88 is only composed of the optical waveguide 5 , the connector 3 , and the adhesive 19 .

(具體例3) (Example 3)

如圖26A~圖28所示，連接器組1具備：第1横溝41、 第1後縱溝51、第3横溝43、及第3前縱溝63。又，連接器組1具備第1側開口部77。此外，連接器組1具備前橫溝80及上下溝85。再者，蓋件22不具備溝。 As shown in Figures 26A to 28, the connector set 1 is provided with: a first transverse groove 41, The first rear longitudinal groove 51 , the third lateral groove 43 , and the third front longitudinal groove 63 . In addition, the connector set 1 includes a first side opening 77 . Furthermore, the connector set 1 includes a front lateral groove 80 and an upper and lower groove 85 . In addition, the cover 22 does not have a groove.

第1横溝41與第1後縱溝51，是設置於光電混合基板2的上表面。再者，光電混合基板2的下表面不具有溝。 The first lateral groove 41 and the first rear vertical groove 51 are provided on the upper surface of the optoelectronic hybrid substrate 2 . In addition, the lower surface of the photoelectric hybrid board 2 does not have a groove.

第3前縱溝63與第3横溝43，是設置於本體21的底壁23的底面。 The third front vertical groove 63 and the third lateral groove 43 are provided on the bottom surface of the bottom wall 23 of the main body 21 .

第1側開口部77、第3前橫溝83及上下溝85，是設置於本體21的延伸壁24。 The first side opening 77 , the third front lateral groove 83 , and the upper and lower grooves 85 are provided on the extension wall 24 of the main body 21 .

又，如圖26D的假想線及圖27B的假想線所示，於延伸壁24上，可以除了第1側開口部77以外，還設置第2側開口部78。 Moreover, as shown by the imaginary line in FIG. 26D and the imaginary line in FIG. 27B , the extension wall 24 may be provided with a second side opening 78 in addition to the first side opening 77 .

第2側開口部78是以露出於2個上下溝85的上下方向中央部的方式設置2個。在朝左右方向投影時，2個第2側開口部78會重複。 Two second side openings 78 are provided so as to be exposed at the center portions in the vertical direction of the two vertical grooves 85 . When projected in the left-right direction, the two second side openings 78 overlap.

並且，在該具體例3中，在第1步驟中，當光電混合基板2容置於容置空間29、且蓋件22安裝於本體21，第1横溝41的左右兩端部的每一個是連通於2個開口部70的每一個，並且第3横溝43的左右兩端部的每一個是連通於2個開口部70的每一個。又，於第1橫溝41中是與第1後縱溝51的前端部相連通。於第3橫溝43中是與第3前縱溝63的後端部相連通。 And, in this specific example 3, in the first step, when the photoelectric hybrid substrate 2 is accommodated in the accommodation space 29 and the cover 22 is installed on the body 21, each of the left and right ends of the first transverse groove 41 is It communicates with each of the two openings 70 , and each of the left and right end portions of the third lateral groove 43 communicates with each of the two openings 70 . In addition, the first lateral groove 41 communicates with the front end portion of the first rear vertical groove 51 . The third lateral groove 43 communicates with the rear end portion of the third front longitudinal groove 63 .

又，第3前縱溝63的前端部是連通於第3前橫溝83。第 3前橫溝83是在其上端部連通至外部。再者，開口部70是透過2個第2側開口部78而連通至外部。第3前橫溝83是透過上下溝85而連通至外部。 Also, the front end portion of the third front longitudinal groove 63 communicates with the third front lateral groove 83 . No. 3. The front lateral groove 83 communicates with the outside at its upper end. Furthermore, the opening 70 communicates with the outside through the two second side openings 78 . The third front lateral groove 83 communicates with the outside through the upper and lower grooves 85 .

並且，在第2步驟中，當將接著劑19注入位於較高的位置的右側的第1側開口部77時，會從第3横溝43及第1横溝41的每一個的右端部到達第3横溝43及第1横溝41的每一個的內部，接著，充填並通過第3横溝43及第1横溝41的每一個，之後，到達位於較低的位置的左側的第1側開口部77。此時，可容許接著劑19從左側的第1側開口部77溢出到外部。 And, in the second step, when the adhesive 19 is injected into the first side opening 77 on the right side at a higher position, it will reach the third lateral groove 43 and the first lateral groove 41 from the right end of each of the third horizontal groove 41. Each of the lateral groove 43 and the first lateral groove 41 then fills and passes through each of the third lateral groove 43 and the first lateral groove 41 , and then reaches the lower left first side opening 77 . At this time, the adhesive agent 19 can be allowed to overflow to the outside from the left first side opening 77 .

另一方面，充填至第3横溝43的接著劑19是從第3前縱溝63的後端部朝前側，一邊充填第3前縱溝63一邊行進，而到達第3前縱溝63的前端部。但是，接著劑19並不會污染光電混合基板2的前端面。又，接著劑19是從第3前縱溝63的前端部到達第3前橫溝83，並朝第3前橫溝83的左右兩側(以分歧的方式)行進，以到達第3前橫溝83的左右兩端部。接著，接著劑19是進入上下溝85的下端部，而在上下溝85內上升。 On the other hand, the adhesive 19 filled in the third transverse groove 43 travels from the rear end portion of the third front longitudinal groove 63 toward the front side while filling the third front longitudinal groove 63 , and reaches the front end of the third front longitudinal groove 63 . department. However, the adhesive 19 does not contaminate the front end surface of the photoelectric hybrid substrate 2 . Also, the adhesive 19 reaches the third front lateral groove 83 from the front end of the third front longitudinal groove 63, and travels toward the left and right sides of the third front lateral groove 83 (in a branching manner) to reach the third front lateral groove 83. The left and right ends of the groove 83 . Next, the adhesive 19 enters the lower end of the upper and lower grooves 85 and rises in the upper and lower grooves 85 .

另一方面，充填至第1横溝41的接著劑19會到達第1後縱溝51的前端部，並且從第1後縱溝51的前端部朝向後側，一邊充填第1後縱溝51一邊行進，而到達第1後縱溝51的後部。特別的是，在第1後縱溝51的後端部中，可容許接著劑19從本體21的後端面溢出。 On the other hand, the adhesive 19 filled in the first lateral groove 41 reaches the front end of the first rear longitudinal groove 51 , and fills the first rear longitudinal groove 51 from the front end of the first rear longitudinal groove 51 toward the rear side. advance to reach the rear of the first rear longitudinal groove 51. In particular, in the rear end portion of the first rear longitudinal groove 51 , the adhesive 19 is allowed to overflow from the rear end surface of the main body 21 .

藉由這種構成，增加接著劑19對光電混合基 板2及連接器3的接觸面積，並且提升光電混合基板2及連接器3的接著力。 With this composition, the adhesive 19 is added to the photoelectric hybrid base The contact area between the board 2 and the connector 3 is improved, and the bonding force between the optoelectronic hybrid substrate 2 and the connector 3 is improved.

再者，上述發明雖然是作為本發明的例示之實施形態而提供，但其只不過是例示，並不是要限定地進行解釋。對該技術領域之通常知識者來說可明瞭之本發明的變形例均可包含在後述申請專利範圍中。 In addition, although the said invention was provided as embodiment of the illustration of this invention, it is only an illustration, and it does not intend to interpret it limitedly. Modifications of the present invention that are obvious to those skilled in the art can be included in the scope of the patent application described later.

產業上之可利用性 Industrial availability

可將光電混合基板連接器組使用於光電混合基板連接器之製造上。 The photoelectric hybrid substrate connector group can be used in the manufacture of the photoelectric hybrid substrate connector.

1:連接器組 1: Connector set

2:光電混合基板 2: Photoelectric hybrid substrate

3:連接器 3: Connector

4:電路基板 4: Circuit board

5:光波導 5: Optical waveguide

13:裝設部 13: Installation Department

14:基板突出部 14: Protruding part of substrate

15:第1前嵌合面 15: The first front fitting surface

16:第1後嵌合面 16: 1st back fitting surface

17:第1連結面 17: The first connecting surface

19:護緣部 19: Edge guard

21:本體 21: Ontology

22:蓋件 22: cover

23:底壁 23: bottom wall

24:延伸壁 24: Extension wall

25:本體凹部 25: Body recess

26:第2前嵌合面 26: The second front fitting surface

27:第2後嵌合面 27: The second posterior fitting surface

28:第2連結面 28: The second connecting surface

29:容置空間 29:Accommodating space

30:蓋件突出部 30: Cover protrusion

31:第3前嵌合面 31: The 3rd front fitting surface

32:第3後嵌合面 32: 3rd posterior fitting surface

33:第3連結面 33: The third connection surface

40:中央横溝 40: Central horizontal groove

41:第1横溝 41: 1st horizontal groove

42:第2横溝 42: The second horizontal groove

44:第4横溝 44: The 4th horizontal groove

Claims (4)

一種光波導構件連接器組，其具備：光波導構件，具備光波導；及連接器，具有可以容置前述光波導構件的容置空間，前述連接器具備：具有壁之本體；及蓋件，在前述光波導構件已容置於前述容置空間時，與前述壁一起夾住前述光波導構件，前述連接器具有在前述光波導構件已容置於前述容置空間，且前述蓋件安裝於前述本體時，從前述連接器的外部到達前述光波導構件的開口部，前述光波導構件及前述連接器的至少一者具有溝，該溝是在前述光波導構件已容置於前述容置空間時，連通於前述開口部，且面對前述光波導構件及連接器的至少另一者，前述開口部是用於注入接著劑的接著劑注入孔。 An optical waveguide component connector set, which comprises: an optical waveguide component having an optical waveguide; and a connector having an accommodating space for accommodating the aforementioned optical waveguide component, the aforementioned connector comprising: a body having a wall; and a cover, When the aforementioned optical waveguide member has been accommodated in the aforementioned accommodating space, the aforementioned optical waveguide member is clamped together with the aforementioned wall, and the aforementioned connector has the function of when the aforementioned optical waveguide member has been accommodated in the aforementioned accommodating space, and the aforementioned cover is mounted on When the body reaches the opening of the optical waveguide member from the outside of the connector, at least one of the optical waveguide member and the connector has a groove, and the groove is formed when the optical waveguide member is housed in the accommodation space. , communicate with the opening and face at least the other one of the optical waveguide member and the connector, and the opening is an adhesive injection hole for injecting an adhesive. 如請求項1之光波導構件連接器組，其中前述開口部有複數個，而在前述光波導構件已容置於前述容置空間時，透過前述溝來互相連通。 The optical waveguide component connector set according to claim 1, wherein there are a plurality of openings, and when the optical waveguide components are accommodated in the accommodating space, they communicate with each other through the grooves. 如請求項1之光波導構件連接器組，其中前述光波導構件是更具備電路基板的光電混合基板。 The optical waveguide component connector set according to claim 1, wherein the aforementioned optical waveguide component is an optoelectronic hybrid substrate further provided with a circuit substrate. 一種光波導構件連接器的製造方法，其具備：第1步驟，將光波導構件連接器組中的光波導構件容 置於容置空間，前述光波導構件連接器組具備：前述光波導構件，具備光波導；及連接器，具有可以容置前述光波導構件的前述容置空間，前述連接器具備：具有壁之本體；及蓋件，在前述光波導構件已容置於前述容置空間時，與前述壁一起夾住前述光波導構件，前述連接器具有在前述光波導構件已容置於前述容置空間，且前述蓋件安裝於前述本體時，從前述連接器的外部到達前述光波導構件的開口部，前述光波導構件及前述連接器的至少一者具有溝，該溝是在前述光波導構件已容置於前述容置空間時，連通於前述開口部，且面對前述光波導構件及連接器的至少另一者，前述開口部是用於注入接著劑的接著劑注入孔；及第2步驟，在前述第1步驟之後，將具有流動性的接著劑注入前述開口部，使前述接著劑從前述開口部流入前述溝，藉此將前述光波導構件接著於前述連接器。 A method for manufacturing an optical waveguide component connector, which comprises: a first step of accommodating the optical waveguide components in the optical waveguide component connector group Placed in the accommodating space, the aforementioned optical waveguide member connector set includes: the aforementioned optical waveguide member having an optical waveguide; and a connector having the aforementioned accommodating space capable of accommodating the aforementioned optical waveguide member. a main body; and a cover, clamping the optical waveguide member together with the wall when the optical waveguide member is accommodated in the accommodating space, the connector having a function when the optical waveguide member is accommodated in the accommodating space, And when the aforementioned cover is installed on the aforementioned body, it reaches the opening of the aforementioned optical waveguide member from the outside of the aforementioned connector. When placed in the accommodating space, it communicates with the opening and faces at least the other one of the optical waveguide member and the connector, and the opening is an adhesive injection hole for injecting an adhesive; and the second step, After the first step, a fluid adhesive is injected into the opening, and the adhesive flows from the opening into the groove, thereby bonding the optical waveguide member to the connector.
TW107111271A 2017-03-31 2018-03-30 Optical waveguide component connector set and method for manufacturing optical waveguide component connector TWI794219B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017070935 2017-03-31
JP2017-070935 2017-03-31
JP2018-063651 2018-03-29
JP2018063651A JP7203508B2 (en) 2017-03-31 2018-03-29 Optical waveguide member connector kit, optical waveguide member connector, and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW201842369A TW201842369A (en) 2018-12-01
TWI794219B true TWI794219B (en) 2023-03-01

Family

ID=64108620

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107111271A TWI794219B (en) 2017-03-31 2018-03-30 Optical waveguide component connector set and method for manufacturing optical waveguide component connector

Country Status (4)

Country Link
US (1) US11016244B2 (en)
JP (1) JP7203508B2 (en)
CN (1) CN110476098B (en)
TW (1) TWI794219B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019078840A (en) 2017-10-23 2019-05-23 日東電工株式会社 Optical waveguide member connector and method of manufacturing the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0452605A (en) * 1990-06-21 1992-02-20 Mitsubishi Cable Ind Ltd Multifiber integral connecting device and multifiber integral connecting method for optical fiber
TW201229596A (en) * 2010-12-07 2012-07-16 Tyco Electronics Nl B V Optical connector
EP2804033A1 (en) * 2012-01-10 2014-11-19 Hitachi Chemical Co., Ltd. Optical waveguide with mirror, optical fiber connector, and manufacturing method thereof
CN105612448A (en) * 2013-10-10 2016-05-25 住友电木株式会社 Connector housing and optical waveguide assembled body

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5689599A (en) * 1994-08-15 1997-11-18 Lucent Technologies, Inc. Optical fiber connector with enhanced bonding
JP4045677B2 (en) * 1998-03-05 2008-02-13 住友電気工業株式会社 Optical fiber mounting method
JP5165872B2 (en) * 2006-10-11 2013-03-21 住友電気工業株式会社 Ferrule, optical waveguide connector manufacturing method using the ferrule, and optical waveguide connector
US20100067852A1 (en) * 2008-09-18 2010-03-18 International Business Machines Corporation Method for assembling a furrule for an optical wave guide connector, ferrule, wave guide ribbon and tool for assembling the ferrule
JP2011048157A (en) 2009-08-27 2011-03-10 Fujikura Ltd Ferrule and method for manufacturing multi-fiber optical connector
JP2012168294A (en) * 2011-02-10 2012-09-06 Nitto Denko Corp Manufacturing method of optical connector
CN103472541A (en) * 2012-06-08 2013-12-25 富士康(昆山)电脑接插件有限公司 Waveguide connector and manufacturing method thereof
JP2014106409A (en) * 2012-11-28 2014-06-09 International Business Maschines Corporation Connector for multilayered optical waveguide
JP6557052B2 (en) 2015-04-30 2019-08-07 三和電気工業株式会社 Optical connector ferrule
JP2017049446A (en) * 2015-09-02 2017-03-09 住友ベークライト株式会社 Multilayer optical waveguide with optical connector, and method of manufacturing multilayer optical waveguide with optical connector

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0452605A (en) * 1990-06-21 1992-02-20 Mitsubishi Cable Ind Ltd Multifiber integral connecting device and multifiber integral connecting method for optical fiber
TW201229596A (en) * 2010-12-07 2012-07-16 Tyco Electronics Nl B V Optical connector
EP2804033A1 (en) * 2012-01-10 2014-11-19 Hitachi Chemical Co., Ltd. Optical waveguide with mirror, optical fiber connector, and manufacturing method thereof
CN105612448A (en) * 2013-10-10 2016-05-25 住友电木株式会社 Connector housing and optical waveguide assembled body

Also Published As

Publication number Publication date
JP2018173635A (en) 2018-11-08
TW201842369A (en) 2018-12-01
JP7203508B2 (en) 2023-01-13
CN110476098B (en) 2022-04-29
US20210033786A1 (en) 2021-02-04
CN110476098A (en) 2019-11-19
US11016244B2 (en) 2021-05-25

Similar Documents

Publication Publication Date Title
EP2772779B1 (en) Optical module
KR20220024331A (en) Connector
EP3467557B1 (en) Optical connector
TWI794219B (en) Optical waveguide component connector set and method for manufacturing optical waveguide component connector
JP2007233144A (en) Multi-mold optical fiber and optical interconnection method and optical circuit device
TWI536058B (en) Optical fiber connector
JP4749317B2 (en) Optical path conversion type optical connector and circuit board using the same
KR20190132373A (en) Optoelectronic Hybrid Substrate and Optoelectronic Hybrid Substrate Assembly
JP2008122721A (en) Substrate for optical element
JP7033394B2 (en) Photoelectric mixed board, connector kit and its manufacturing method
JP2008122756A (en) Substrate for optical element
WO2018181729A1 (en) Optical waveguide member connector kit, optical waveguide member connector, and method for producing same
US20160223760A1 (en) Optical connector
EP2156224B1 (en) Surface egress and/or ingress housing
CN111247467B (en) Optical waveguide component connector and manufacturing method thereof
TWI781162B (en) Photoelectric hybrid substrate, connector group and manufacturing method thereof
JP2013152287A (en) Optical module and manufacturing method of the same
JP2013097064A (en) Optical connector and manufacturing method of optical connector
KR20020095866A (en) Optical fiber array
JP4931764B2 (en) Optical connector
CN111919155B (en) Opto-electric hybrid board, connector kit, and method for manufacturing connector kit
JP2008122741A (en) Substrate for optical element
JP7361229B2 (en) ferrule structure
WO2022158019A1 (en) Boot, ferrule structure, and method for manufacturing ferrule-equipped fiber
TW202011064A (en) Optical waveguide member connector and method therefor