TWI794050B - Assembly method of electronic device - Google Patents
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本揭露係關於一種電子裝置的組裝方法。The disclosure relates to an assembly method of an electronic device.
一般來說，中央處理器(Central Processing Unit, CPU)係藉由中央處理器插座(central processing unit socket)而安裝於電路板。然而，在生產線測試完中央處理器的效能後，重新組裝獨立加載機構保護蓋(Independent Loading Mechanism Cover，ILM Cover)的過程中，有很大的機率會干涉到錫膏保護蓋或散熱元件而無法進行組裝，使得中央處理器插座的針腳缺乏保護。若錫膏保護蓋脫落或有異物掉落至中央處理器插座的針腳，則會導致可能要更換整組中央處理器插座。Generally, a central processing unit (CPU) is mounted on a circuit board through a central processing unit socket. However, after the performance of the central processing unit is tested on the production line, during the process of reassembling the Independent Loading Mechanism Cover (ILM Cover), there is a high probability that the solder paste protection cover or the heat dissipation element will be interfered and cannot Assemble so that the CPU socket pins are unprotected. If the solder paste protection cover falls off or foreign objects fall into the pins of the CPU socket, the entire CPU socket may need to be replaced.
本揭露提供一種電子裝置的組裝方法。組裝方法包括：開啟位於電路板上的加載機構的上蓋，其中上蓋具有開口，於上蓋處於一閉闔狀態下，開口曝露出位於電路板上的中央處理器插座；透過彈片的多個卡扣部位將彈片卡扣至上蓋的開口的內緣的相對兩側；以及閉闔加載機構的上蓋以使得彈片的彈片本體覆蓋中央處理器插座。The disclosure provides an assembly method of an electronic device. The assembly method includes: opening the upper cover of the loading mechanism on the circuit board, wherein the upper cover has an opening, and when the upper cover is in a closed state, the opening exposes the CPU socket on the circuit board; Fasten the elastic piece to opposite sides of the inner edge of the opening of the upper cover; and close the upper cover of the loading mechanism so that the elastic piece body of the elastic piece covers the CPU socket.
於一些實施方式中，彈片的多個卡扣部位各包含自彈片本體的邊緣突出的第一限位片以及第二限位片。第一限位片自邊緣突出的第一長度，係小於第二限位片自邊緣突出的第二長度。In some embodiments, each of the plurality of buckling positions of the elastic sheet includes a first limiting piece and a second limiting piece protruding from the edge of the elastic piece body. The first length protruding from the edge of the first limiting piece is smaller than the second length protruding from the edge of the second limiting piece.
於一些實施方式中，第二限位片圍繞第一限位片，且分離於第一限位片。In some embodiments, the second limiting piece surrounds the first limiting piece and is separated from the first limiting piece.
於一些實施方式中，第二限位片具有一缺口。於第一限位片自邊緣突出的一突出方向上，第一限位片對齊缺口。In some embodiments, the second limiting piece has a notch. In a protruding direction in which the first limiting piece protrudes from the edge, the first limiting piece is aligned with the notch.
於一些實施方式中，彈片的彈片本體的一輪廓相符於上蓋的開口的內緣。In some embodiments, a contour of the elastic body of the elastic sheet conforms to the inner edge of the opening of the upper cover.
於一些實施方式中，彈片的彈片本體的邊緣具有一U型槽。In some embodiments, the edge of the elastic body of the elastic sheet has a U-shaped groove.
於一些實施方式中，彈片的彈片本體具有一通孔。通孔位於彈片的多個卡扣部位之間。In some embodiments, the body of the elastic piece has a through hole. The through holes are located between the multiple snapping parts of the elastic piece.
於一些實施方式中，彈片的材質不同於上蓋的材質。In some embodiments, the material of the elastic piece is different from that of the upper cover.
於一些實施方式中，電子裝置的組裝方法進一步包括：將一錫膏保護蓋固定於加載機構上，其中錫膏保護蓋覆蓋彈片。In some embodiments, the method for assembling the electronic device further includes: fixing a solder paste protection cover on the loading mechanism, wherein the solder paste protection cover covers the elastic piece.
於一些實施方式中，電子裝置的組裝方法進一步包括：將一散熱元件固定於錫膏保護蓋上。In some embodiments, the method for assembling the electronic device further includes: fixing a heat dissipation element on the solder paste protection cover.
以下揭示內容提供用於實施所提供標的物的不同特徵的許多不同實施方式、或實例。下文描述組件及配置的特定實例以簡化本揭露。當然，這些僅為實例且非意欲為限制性的。舉例而言，在以下描述中第一特徵於第二特徵上方或上的形成可包括第一特徵與第二特徵直接接觸地形成的實施方式，且亦可包括額外特徵可形成於第一特徵與第二特徵之間使得第一特徵與第二特徵可不直接接觸的實施方式。此外，本揭露在各種實例中可重複參考數字及/或字母。此重複係出於簡單及清楚之目的，且本身且不指明所論述之各種實施方式及/或組態之間的關係。The following disclosure provides many different implementations, or examples, for implementing different features of the provided subject matter. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, the formation of a first feature on or over a second feature in the following description may include embodiments where the first feature is formed in direct contact with the second feature, and may also include that additional features may be formed on the first feature and the second feature. An embodiment in which the first feature and the second feature may not be in direct contact between the second features. Additionally, the present disclosure may repeat reference numbers and/or letters in various instances. This repetition is for simplicity and clarity and by itself does not indicate a relationship between the various implementations and/or configurations discussed.
此外，為了便於描述，在本文中可使用空間相對術語，諸如「在……下面」、「在……之下」、「下部」、「在……之上」、「上部」及類似者，來描述諸圖中圖示之一個元件或特徵與另一（多個）元件或特徵之關係。空間相對術語意欲涵蓋除了諸圖中所描繪的定向以外的裝置在使用或操作時的不同定向。裝置可另外定向（旋轉90度或處於其他定向），且本文中所使用之空間相對描述符可類似地加以相應解釋。In addition, for ease of description, spatially relative terms may be used herein, such as "below," "beneath," "lower," "above," "upper," and the like, To describe the relationship between one element or feature shown in the figures and another (multiple) element or feature. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein similarly interpreted accordingly.
如本文中所使用，「大約」、「約」、「大致」、或「大體上」應通常指給定值或範圍之20%內、或10%內、或5%內。然而，熟習此項技術者將認識到，在整個描述中所引用的值或範圍僅係實例，且可隨著積體電路的規模縮小而減小。本文中給定之數量為近似值，從而意謂術語「大約」、「約」「大致」、或「大體上」在並未明確陳述情況下可予以推斷。As used herein, "about," "approximately," "approximately," or "substantially" shall generally mean within 20%, or within 10%, or within 5% of a given value or range. However, those skilled in the art will recognize that values or ranges cited throughout the description are examples only and may decrease as the scale of integrated circuits decreases. Quantities given herein are approximate, meaning that the terms "approximately," "about," "approximately," or "substantially" can be inferred where not expressly stated.
請參見第1圖。第1圖係根據本揭露的一些實施方式的電子裝置10的立體***圖。如第1圖所示，由下至上，電子裝置10依序包含獨立加載機構(independent loading mechanism, ILM)110的背板111、電路板100、中央處理器插座(central processing unit socket)102、中央處理器(central processing unit, CPU)(圖未示)、獨立加載機構110的上蓋112、彈片120、錫膏保護蓋130以及散熱元件140。See Figure 1. FIG. 1 is a perspective exploded view of an
於第1圖中，獨立加載機構110包含背板111以及上蓋112。獨立加載機構110的背板111係用以自電路板100的下表面將中央處理器插座102固定至電路板100的上表面。中央處理器(圖未示)可配置以安裝於中央處理器插座102上並位於獨立加載機構110中。獨立加載機構110可用以保護中央處理器插座102及/或中央處理器。獨立加載機構110的上蓋112具有開口O1。於本實施方式中，彈片120卡扣至獨立加載機構110的上蓋112以覆蓋開口O1。錫膏保護蓋130固定至獨立加載機構110上。散熱元件140固定至錫膏保護蓋130上。彈片120可避免後續在組裝錫膏保護蓋130至獨立加載機構110的過程中，錫膏保護蓋130可能會脫落而損壞位於獨立加載機構110的上蓋112下方的中央處理器插座102的針腳。彈片120也可避免異物掉落至獨立加載機構110中而損壞位於上蓋112下方的中央處理器插座102的針腳。In FIG. 1 , the
請參見第2圖。第2圖描述了根據一些實施方式之用於組裝電子裝置10的例示性方法M的流程圖。組裝方法M包括整個組裝流程的相關部分。應理解，可在第2圖中所示的操作之前、期間以及之後提供額外操作，且對於前述組裝方法的額外實施例，可替換或消除下面描述的一些操作。操作/組裝的次序可互換。方法M包括組裝電子裝置10。然而，電子裝置10的組裝僅係用於描述根據本揭露的一些實施例的組裝流程之一實施例。See Figure 2. FIG. 2 depicts a flowchart of an exemplary method M for assembling
第3圖、第4圖、第5A圖、第6圖係根據本揭露的一些實施方式的於各個階段的電子裝置10的組裝方法。於一些實施方式中，請參照第3圖，第3圖係獨立加載機構110的上蓋112處於一閉闔狀態下。上蓋112的開口O1曝露出位於電路板100(見第1圖)上的中央處理器插座102(見第1圖)。此時，中央處理器(圖未示)、彈片120(見第1圖)、錫膏保護蓋130(見第1圖)以及散熱元件140(見第1圖)尚未組裝至電子裝置10中。FIG. 3 , FIG. 4 , FIG. 5A , and FIG. 6 are the assembly methods of the
組裝方法M開始於步驟S101。請參照第4圖，在步驟S101的一些實施方式中，開啟位於電路板100上的獨立加載機構110的上蓋112。The assembly method M starts at step S101. Please refer to FIG. 4 , in some embodiments of step S101 , the
請返回參照第2圖，組裝方法M接著進行至步驟S102，步驟S102，係透過彈片的多個卡扣部位將彈片卡扣至上蓋的開口的內緣的相對兩側。請參照第5A圖，係透過彈片120的多個卡扣部位122將彈片120卡扣至上蓋112的開口O1的內緣I1的相對兩側。請參照第5B圖、第5C圖以及第5D圖。第5B圖、第5C圖以及第5D圖係根據本揭露的一些實施方式的於各個階段的電子裝置10的組裝方法。為了能更詳細描述本揭露，第5B圖僅繪示獨立加載機構110上蓋112、第5C圖僅繪示彈片120，而第5D圖僅繪示上蓋112以及彈片120。Please refer back to FIG. 2 , the assembly method M then proceeds to step S102 , and step S102 is to buckle the elastic piece to opposite sides of the inner edge of the opening of the upper cover through a plurality of buckling positions of the elastic piece. Please refer to FIG. 5A , the
如第5B圖所示，上蓋112的開口O1的內緣I1具有相對的兩第一邊緣E1以及相對的兩第二邊緣E2。獨立加載機構110的上蓋112包含有凸出部113以及凹陷部114。舉例來說，凸出部113自開口O1的第一邊緣E1凸出。凹陷部114位於凸出部113的兩側。開口O1的第二邊緣E2為直線邊緣。第一邊緣E1與第二邊緣E2的相連處具有圓弧狀倒角V1，但本揭露不以此為限。As shown in FIG. 5B , the inner edge I1 of the opening O1 of the
如第5C圖所示，彈片120包含彈片本體121以及位於彈片本體121相對兩側的卡扣部位122。彈片本體121透過卡扣部位122而卡扣至上蓋112的相對的兩第一邊緣E1(見第5B圖)。詳細而言，彈片120的彈片本體121的輪廓C1實質上相符於上蓋112的開口O1的內緣I1(見第5D圖)。彈片本體121的輪廓C1與上蓋112的開口O1的內緣I1之間具有一間隔G1而相距一距離D1(見第5D圖)，距離D1係設計為可避免物體自間隔G1掉落至獨立加載機構110中而落於中央處理器插座102(見第1圖)上。As shown in FIG. 5C , the
於一些實施方式中，距離D1(見第5D圖)可為約0.5 mm至約0.9mm之間，但本揭露不以此為限。舉例而言，距離D1可為約0.5、0.6、0.7、0.8或0.9 mm。在如第5D圖的組裝狀態下，彈片120的彈片本體121具有實質上沿著開口O1的邊緣E1的延伸方向上延伸的邊緣E4，且具有實質上沿著開口O1的邊緣E2的延伸方向上延伸的邊緣E3。邊緣E4可具有一第一尺寸W1，而邊緣E3可具有一第二尺寸W2。於一些實施方式中，第一尺寸W1係大於第二尺寸W2。於一些實施方式中，第一尺寸W1為約39.24 mm至約47.96 mm之間，而第二尺寸W2為約29.52 mm至約36.08 mm之間，但本揭露不以此為限。舉例而言，第一尺寸W1可為約43.6 mm，而第二尺寸W2可為約32.8 mm。In some embodiments, the distance D1 (see FIG. 5D ) may be between about 0.5 mm and about 0.9 mm, but the present disclosure is not limited thereto. For example, distance D1 may be about 0.5, 0.6, 0.7, 0.8 or 0.9 mm. In the assembled state as shown in FIG. 5D, the
於第5C圖中，彈片120的彈片本體121的邊緣E3具有U型凹槽G2。彈片120的彈片本體121具有通孔O2。通孔O2位於彈片120的多個卡扣部位122之間。藉此，位於彈片本體121上的U型凹槽G2以及通孔O2可增加彈片本體121的彈性，以利將彈片120組裝至獨立加載機構110的上蓋112。此外，在將彈片120組裝至獨立加載機構110的上蓋112的過程中，U型凹槽G2也可降低彈片120與上蓋112於結構上的干涉，以利將彈片120組裝至獨立加載機構110。於一些實施方式中，通孔O2可為方形通孔，但本揭露不以此為限。於一些實施方式中，通孔O2可為圓形通孔、多邊形通孔或任何適當的形狀。In FIG. 5C, the edge E3 of the
於一些實施方式中，在如第5D圖的組裝狀態下，彈片120於沿著開口O1的邊緣E2的延伸方向上具有一第三尺寸W3。於一些實施方式中，第三尺寸W3係為約41.4 mm至約50.6 mm之間，但本揭露不以此為限。舉例而言，第三尺寸W3可為約46 mm。In some embodiments, in the assembled state as shown in FIG. 5D , the
於一些實施方式中，在如第5D圖的組裝狀態下，U型凹槽G2於沿著開口O1的邊緣E2的延伸方向上具有一第四尺寸W4，而沿著開口O1的邊緣E1的延伸方向上具有一第五尺寸W5。於一些實施方式中，第四尺寸W4係大於第五尺寸W5。於一些實施方式中，第四尺寸W4為約2.7mm至約3.3mm之間，而第五尺寸W5為約1.35mm至約1.65mm之間，但本揭露不以此為限。舉例而言，第四尺寸W4可為約3mm，而第五尺寸W5可為約1.5mm。於一些實施方式中，在如第5D圖的組裝狀態下，通孔O2於沿著開口O1的邊緣E2的延伸方向上具有一第六尺寸W6，而沿著開口O1的邊緣E1的延伸方向上具有一第七尺寸W7。於一些實施方式中，第六尺寸W6係實質上相同於第七尺寸W7，但本揭露不以此為限。於一些實施方式中，第六尺寸W6可大於或小於第七尺寸W7。於一些實施方式中，第六尺寸W6為約3.15mm至約3.85mm之間，而第七尺寸W7為約3.15mm至約3.85mm之間，但本揭露不以此為限。舉例而言，第六尺寸W6可為約3.5mm，而第七尺寸W7可為約3.5mm。 In some embodiments, in the assembled state as shown in FIG. 5D, the U-shaped groove G2 has a fourth dimension W4 along the extending direction of the edge E2 of the opening O1, and along the extending direction of the edge E1 of the opening O1 The direction has a fifth dimension W5. In some embodiments, the fourth dimension W4 is greater than the fifth dimension W5. In some embodiments, the fourth dimension W4 is between about 2.7 mm and about 3.3 mm, and the fifth dimension W5 is between about 1.35 mm and about 1.65 mm, but the disclosure is not limited thereto. For example, the fourth dimension W4 may be about 3 mm, and the fifth dimension W5 may be about 1.5 mm. In some embodiments, in the assembled state as shown in FIG. 5D, the through hole O2 has a sixth dimension W6 along the extending direction of the edge E2 of the opening O1, and a sixth dimension W6 along the extending direction of the edge E1 of the opening O1. has a seventh dimension W7. In some embodiments, the sixth dimension W6 is substantially the same as the seventh dimension W7, but the disclosure is not limited thereto. In some embodiments, the sixth dimension W6 may be larger or smaller than the seventh dimension W7. In some embodiments, the sixth dimension W6 is between about 3.15 mm and about 3.85 mm, and the seventh dimension W7 is between about 3.15 mm and about 3.85 mm, but the disclosure is not limited thereto. For example, the sixth dimension W6 may be about 3.5 mm, and the seventh dimension W7 may be about 3.5 mm.
於第5C圖中，卡扣部位122包含自彈片本體121的邊緣E4突出的第一限位片126以及第二限位片128。第一限位片126自邊緣E4凸出。第二限位片128圍繞第一限位片126，且分離於第一限位片126。第二限位片128具有一缺口G3，在第一限位片126的凸出方向上，缺口G3對齊第一限位片126。於一些實施方式中，在如第5D圖的組裝狀態下，第一限位片126具有自邊緣E4沿著開口O1的邊緣E2的延伸方向上突出的第一長度L1，第二限位片128具有自邊緣E4且沿著開口O1的邊緣E2的延伸方向上突出的第二長度L2。第一限位片126的第一長度L1，係小於第二限位片128的第二長度L2。於一些實施方式中，第二限位片128的第二長度L2係為約3.6 mm至約4.4 mm之間，但本揭露不以此為限。舉例而言，第二長度L2可為約4 mm。In FIG. 5C , the buckling
如第5D圖所示，在將彈片120卡扣至上蓋112的過程中，係先將彈片120置於上蓋112的第一表面S1並對準上蓋112的開口O1，其中彈片本體121的邊緣E3對應於開口O1的第二邊緣E2，而彈片120的卡扣部位122的第一限位片126抵靠於上蓋112的凸出部113。接著，壓抵彈片120的彈片本體121，此時，前述之壓抵會造成彈片本體121發生形變而朝向相對於第一表面S1之第二表面S2(見第5A圖)彎曲。彈片本體121的形變會帶動卡扣部位122同時壓抵上蓋112。當於適當的力量下壓抵彈片本體121時，第一限位片126會因為壓抵上蓋112而產生形變，並通過上蓋112的凸出部113，進而移動到上蓋112的第二表面S2的一側。然而，前述壓抵的力量係不以讓第二限位片128產生足夠的形變而通過上蓋112，因而維持在第一表面S1的一側。因此，在前述的過程下完成了將彈片120卡扣至上蓋112。於一些實施方式中，彈片120的第一限位片126也可稱之為卡扣結構，而第二限位片128也可稱之為彈力結構。As shown in Figure 5D, in the process of buckling the
彈片120的材質不同於上蓋112的材質。彈片120的材質可包含具有彈性性質的材料。舉例而言，彈片120的材質可包含麥拉(Mylar)，但本揭露不以此為限。於一些實施方式中，彈片120的材質可為黑色麥拉。於一些實施方式中，彈片120的材質可為透明麥拉，藉此可在不移除彈片120的狀態下來檢查中央處理器插座102的狀態。於一些實施方式中，彈片120的厚度可約小於0.375 mm，但本揭露不以此為限。舉例而言，彈片120的厚度可為約0.25 mm。於一些實施方式中，當彈片120的厚度在約0.37 5 mm以下時，彈片120可保護熱模組的彈性臂以及後續組裝的錫膏保護蓋130(見第1圖)不會因為組裝過程中的壓力而產生形變而影響電子裝置10於使用上的效能。The material of the
彈片120可避免後續在組裝錫膏保護蓋130至獨立加載機構110的過程中，錫膏保護蓋130可能會脫落而損壞位於獨立加載機構110下方的中央處理器插座102的針腳。彈片120也可避免異物掉落至獨立加載機構110中而損壞位於上蓋112下方的中央處理器插座102的針腳。本揭露利用卡扣的方式將彈片120固定至獨立加載機構110而不需利用螺絲將彈片120固定至獨立加載機構110的上蓋112，因而彈片120容易裝配至獨立加載機構110或自獨立加載機構110拔除。再者，本揭露的彈片120的結構精簡而可適用於各種尺寸的獨立加載機構110，且卡扣部位122具有防呆造型，卡扣部位122的第二限位片128可作為彈性結構以創造導引支點並同時兼顧彈片120保護強度與彈片120於組裝時的流暢。The
請返回參照第2圖，組裝方法M接著進行至步驟S103，步驟S103，係閉闔加載機構的上蓋以使得彈片的彈片本體覆蓋中央處理器插座。請參照第6圖，獨立加載機構110的上蓋112被閉闔，使得彈片120的彈片本體121覆蓋中央處理器插座102(見第1圖)。Please refer back to FIG. 2 , the assembly method M then proceeds to step S103 , and step S103 is to close the upper cover of the loading mechanism so that the spring body of the spring covers the CPU socket. Please refer to FIG. 6 , the
請返回參照第2圖，組裝方法M接著進行至步驟S104，步驟S104，係將一保護蓋固定於加載機構上，其中保護蓋覆蓋彈片。請參照第1圖，錫膏保護蓋130可被組裝而固定於獨立加載機構110上。在前述的組裝之後，錫膏保護蓋130覆蓋彈片120。Please refer back to FIG. 2 , the assembly method M then proceeds to step S104 , and step S104 is to fix a protective cover on the loading mechanism, wherein the protective cover covers the elastic piece. Referring to FIG. 1 , the solder
請返回參照第2圖，組裝方法M接著進行至步驟S105，步驟S105，係將一散熱元件固定於錫膏保護蓋上。請參照第1圖，散熱元件140可被組裝而固定於錫膏保護蓋130上。Please refer back to FIG. 2 , the assembly method M then proceeds to step S105 , and step S105 is to fix a heat dissipation element on the solder paste protection cover. Referring to FIG. 1 , the
因此，基於上述討論，可看出本揭露具有優點。然而應理解，其他實施方式也可提供額外的優點，且並非所有的優點都必須在本文中揭示。此外，沒有特定的優點需要用於所有的實施方式中。在各種實施方式中，本揭露提供了一種電子裝置的組裝方法。本案的電子裝置的組裝的組裝過程中，將彈片卡扣至加載機構的上蓋以覆蓋位於上蓋的開口。藉此，彈片可避免後續在組裝錫膏保護蓋至加載機構的過程中，錫膏保護蓋可能會脫落而損壞位於加載機構下方的中央處理器插座的針腳。彈片也可避免異物掉落至加載機構中而損壞位於加載機構下方的中央處理器插座的針腳。Therefore, based on the above discussion, it can be seen that the present disclosure has advantages. It should be understood, however, that other embodiments may provide additional advantages, and not all advantages must necessarily be disclosed herein. Furthermore, no particular advantage needs to be used in all embodiments. In various embodiments, the present disclosure provides a method of assembling an electronic device. During the assembling process of the electronic device in this case, the elastic sheet is snapped to the upper cover of the loading mechanism to cover the opening on the upper cover. Thereby, the shrapnel can prevent the solder paste protection cover from falling off during subsequent assembly of the solder paste protection cover to the loading mechanism, thereby damaging the pins of the CPU socket located under the loading mechanism. The shrapnel can also prevent foreign objects from falling into the loading mechanism and damage the pins of the socket of the CPU located below the loading mechanism.
前述內容概述若干實施方式的特徵，使得熟習此項技術者可更佳地理解本揭露的態樣。熟習此項技術者應瞭解，其可易於使用本揭露作為用於設計或修改用於實施本文中引入之實施方式之相同目的及/或達成相同優勢之其他製程及結構的基礎。熟習此項技術者亦應認識到，此類等效構造並不偏離本揭露的精神及範疇，且此類等效構造可在本文中進行各種改變、取代、及替代而不偏離本揭露的精神及範疇。The foregoing summary summarizes features of several embodiments so that those skilled in the art may better understand aspects of the present disclosure. Those skilled in the art should appreciate that they can readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and substitutions can be made herein without departing from the spirit and scope of the present disclosure. and categories.
10:電子裝置 100:電路板 102:中央處理器插座 110:獨立加載機構 111:背板 112:上蓋 113:凸出部 114:凹陷部 120:彈片 121:彈片本體 122:卡扣部位 126:第一限位片 128:第二限位片 130:錫膏保護蓋 140:散熱元件 C1:輪廓 D1:距離 E1:邊緣 E2:邊緣 E3:邊緣 E4:邊緣 G1:間隔 G2:凹槽 G3:缺口 I1:內緣 L1:第一長度 L2:第二長度 M:方法 O1:開口 O2:通孔 S1:第一表面 S2:第二表面 S101:步驟 S102:步驟 S103:步驟 S104:步驟 S105:步驟 V1:倒角 W1:第一尺寸 W2:第二尺寸 W3:第三尺寸 W4:第四尺寸 W5:第五尺寸 W6:第六尺寸 W7:第七尺寸 10: Electronic device 100: circuit board 102: CPU socket 110: Independent loading mechanism 111: Backplane 112: top cover 113: protruding part 114: depression 120: shrapnel 121: shrapnel body 122: buckle part 126: The first limit piece 128: The second limiting piece 130: Solder paste protection cover 140: cooling element C1: Contour D1: distance E1: edge E2: edge E3: Edge E4: edge G1: Interval G2: Groove G3: Gap I1: inner edge L1: first length L2: second length M: Method O1: Open O2: through hole S1: first surface S2: second surface S101: step S102: step S103: step S104: step S105: step V1: Chamfer W1: first size W2: second size W3: third size W4: Fourth size W5: fifth size W6: Sixth size W7: seventh size
本揭露的態樣在與隨附圖式一起研讀時自以下詳細描述內容可最佳地理解。應注意，根據行業中的標準規範，各種特徵未按比例繪製。實際上，各種特徵的尺寸可為了論述清楚經任意地增大或減小。 第1圖係根據本揭露的一些實施方式的電子裝置的立體***圖。 第2圖係根據本揭露的一些實施方式的電子裝置的組裝方法的流程圖。 第3圖至第6圖係根據本揭露的一些實施方式的於各個階段的電子裝置的組裝方法。 Aspects of the present disclosure are best understood from the following Detailed Description when read with the accompanying drawings. It should be noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or decreased for clarity of discussion. FIG. 1 is a three-dimensional exploded view of an electronic device according to some embodiments of the present disclosure. FIG. 2 is a flowchart of a method for assembling an electronic device according to some embodiments of the present disclosure. 3 to 6 are the assembly methods of the electronic device at various stages according to some embodiments of the present disclosure.
M:組裝方法 M: Assembly method
S101:步驟 S101: step
S102:步驟 S102: step
S103:步驟 S103: step
S104:步驟 S104: step
S105:步驟 S105: step
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| US9466900B1 (en) * | 2015-10-07 | 2016-10-11 | Advanced Micro Devices, Inc. | Circuit board socket with rail frame |
| TWI573905B (en) * | 2009-02-27 | 2017-03-11 | 巴斯夫歐洲公司 | Process for porducing carbon nanofibres and/or carbon nanotubes |
| CN109390717A (en) * | 2017-08-11 | 2019-02-26 | 富士康(昆山)电脑接插件有限公司 | Electric connector and its clamping piece |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI573905B (en) * | 2009-02-27 | 2017-03-11 | 巴斯夫歐洲公司 | Process for porducing carbon nanofibres and/or carbon nanotubes |
| US9466900B1 (en) * | 2015-10-07 | 2016-10-11 | Advanced Micro Devices, Inc. | Circuit board socket with rail frame |
| CN109390717A (en) * | 2017-08-11 | 2019-02-26 | 富士康(昆山)电脑接插件有限公司 | Electric connector and its clamping piece |
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