TWI793810B - Shielding mechanism and thin-film-deposition equipment using the same - Google Patents
Shielding mechanism and thin-film-deposition equipment using the same Download PDFInfo
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本發明有關於一種雙開式遮蔽機構，主要於遮板板上設置至少一凹槽，以減少第一及第二遮蔽板的重量，並減輕驅動馬達承載及驅動第一及第二遮蔽板的負擔。The present invention relates to a double-opening shielding mechanism. At least one groove is provided on the shielding plate to reduce the weight of the first and second shielding plates, and reduce the load of the driving motor to carry and drive the first and second shielding plates. .
化學氣相沉積(CVD)、物理氣相沉積(PVD)及原子層沉積(ALD)皆是常用的薄膜沉積設備，並普遍被使用在積體電路、發光二極體及顯示器等製程中。Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD) and Atomic Layer Deposition (ALD) are commonly used thin film deposition equipment, and are widely used in the manufacturing processes of integrated circuits, light-emitting diodes and displays.
沉積設備主要包括一腔體及一晶圓承載盤，其中晶圓承載盤位於腔體內，並用以承載至少一晶圓。以物理氣相沉積為例，腔體內需要設置一靶材，其中靶材面對晶圓承載盤上的晶圓。在進行物理氣相沉積時，可將惰性氣體及/或反應氣體輸送至腔體內，分別對靶材及晶圓承載盤施加偏壓，並透過晶圓承載盤加熱承載的晶圓。The deposition equipment mainly includes a cavity and a wafer carrier, wherein the wafer carrier is located in the cavity and is used to carry at least one wafer. Taking physical vapor deposition as an example, a target needs to be set in the chamber, wherein the target faces the wafer on the wafer carrier. During physical vapor deposition, the inert gas and/or reaction gas can be delivered into the chamber to apply bias voltage to the target material and the wafer carrier plate respectively, and heat the wafer carried by the wafer carrier plate.
腔體內的惰性氣體因為高壓電場的作用，形成離子化的惰性氣體，離子化的惰性氣體會受到靶材上的偏壓吸引而轟擊靶材。從靶材濺出的靶材原子或分子受到晶圓承載盤上的偏壓吸引，並沉積在加熱的晶圓的表面，以在晶圓的表面形成薄膜。The inert gas in the cavity forms ionized inert gas due to the action of high-voltage electric field, and the ionized inert gas will be attracted by the bias voltage on the target and bombard the target. Target atoms or molecules sputtered from the target are attracted by the bias voltage on the wafer carrier plate and deposited on the surface of the heated wafer to form a thin film on the surface of the wafer.
在經過一段時間的使用後，腔體的內表面會形成沉積薄膜，因此需要週期性的清潔腔體，以避免沉積薄膜在製程中掉落，進而汙染晶圓。此外靶材的表面亦可能形成氧化物或其他汙染物，因此同樣需要週期性的清潔靶材。一般而言，通常會透過預燒(burn-in)製程，以電漿離子撞擊腔體內的靶材，以去除靶材表面的氧化物或其他汙染物。After a period of use, a deposited film will be formed on the inner surface of the chamber, so the chamber needs to be cleaned periodically to prevent the deposited film from falling during the process and contaminating the wafer. In addition, oxides or other pollutants may also be formed on the surface of the target, so the target needs to be cleaned periodically. Generally speaking, a burn-in process is usually used to impinge the target in the cavity with plasma ions to remove oxides or other pollutants on the surface of the target.
在進行上述清潔腔體及靶材時，需要將腔體內的晶圓承載盤及晶圓取出，或者隔離晶圓承載盤，以避免清潔過程中汙染晶圓承載盤及晶圓。When cleaning the cavity and the target, it is necessary to take out the wafer carrier and the wafer in the cavity, or isolate the wafer carrier to avoid contamination of the wafer carrier and the wafer during the cleaning process.
薄膜沉積機台在經過一段時間的使用後，通常需要進行清潔，以去除腔室內沉積的薄膜及靶材上的氧化物或氮化物。在清潔的過程中產生的微粒會汙染承載盤，因此需要隔離承載盤及汙染物。本發明提出一種雙開式遮蔽機構及具有雙開式遮蔽機構的薄膜沉積機台，主要透過驅動裝置帶動兩個遮蔽板朝相反方向擺動，使得兩個遮蔽板在開啟狀態及遮蔽狀態之間切換。After a period of use, the thin film deposition machine usually needs to be cleaned to remove the thin film deposited in the chamber and the oxide or nitride on the target. Particles generated during the cleaning process will contaminate the susceptor, so it is necessary to isolate the susceptor from the contaminants. The present invention proposes a double-opening shielding mechanism and a film deposition machine with a double-opening shielding mechanism. The two shielding plates are mainly driven to swing in opposite directions through a driving device, so that the two shielding plates are switched between the open state and the shielding state.
在清潔反應腔體時，驅動裝置帶動兩個遮蔽板以擺動的方式相互靠近，使得兩個遮蔽板相靠近並遮擋容置空間內的承載盤，以避免清潔過程中使用的電漿或產生的污染接觸承載盤及/或其承載的基板。在進行沉積製程時，驅動裝置帶動兩個遮蔽板以擺動的方式相互遠離，以對反應腔體內的基板進行薄膜沉積。When cleaning the reaction chamber, the driving device drives the two shielding plates to approach each other in a swinging manner, so that the two shielding plates are close to each other and shield the carrier plate in the accommodating space, so as to avoid the plasma used in the cleaning process or generated Contamination contacts the carrier tray and/or the substrate it carries. During the deposition process, the driving device drives the two shielding plates away from each other in a swinging manner, so as to deposit the thin film on the substrate in the reaction chamber.
本發明的一目的，在於提供一種具有雙開式遮蔽機構的薄膜沉積機台，主要包括一反應腔體、一承載盤及一雙開式遮蔽機構。雙開式遮蔽機構包括一驅動裝置及兩個遮蔽板，其中驅動裝置連接並驅動兩個遮蔽板分別朝相反方向擺動，使得兩個遮蔽板操作在一開啟狀態及一遮蔽狀態。An object of the present invention is to provide a thin film deposition machine with a double-opening shielding mechanism, which mainly includes a reaction chamber, a carrier plate and a double-opening shielding mechanism. The double-opening shielding mechanism includes a driving device and two shielding plates, wherein the driving device is connected and drives the two shielding plates to swing in opposite directions, so that the two shielding plates operate in an open state and a shielding state.
兩個遮蔽板面對承載盤的表面上設置至少一凹槽，可在不影響遮蔽板的遮蔽效果的前提下，減少遮蔽板的重量。透過減少遮蔽板的重量，將有利於減輕驅動裝置驅動遮蔽板轉動的負擔。At least one groove is provided on the surface of the two shielding boards facing the bearing tray, which can reduce the weight of the shielding boards without affecting the shielding effect of the shielding boards. By reducing the weight of the shielding plate, it is beneficial to reduce the burden of the driving device to drive the shielding plate to rotate.
具體而言，驅動裝置透過兩個連接臂分別連接並承載兩個遮蔽板，透過在遮蔽板上設置至少一凹槽，可減少連接臂承載遮蔽板的負擔。此外可進一步在連接臂上設置至少一穿孔部，可在不影響連接臂的結構強度的前提下減少連接臂的重量，並有利於驅動裝置透過兩個連接臂分別驅動兩個遮蔽板朝相反方向擺動。Specifically, the driving device connects and supports the two shielding plates respectively through the two connecting arms, and by providing at least one groove on the shielding plate, the load of the connecting arms carrying the shielding plate can be reduced. In addition, at least one perforated portion can be further provided on the connecting arm, which can reduce the weight of the connecting arm without affecting the structural strength of the connecting arm, and facilitate the driving device to drive the two shielding plates in opposite directions through the two connecting arms. swing.
本發明的一目的，在於提供一種具有雙開式遮蔽機構的薄膜沉積機台，包括一驅動裝置、兩個遮蔽板、兩個連接臂及兩個距離感測單元，其中驅動裝置透過兩個連接臂分別連接兩個遮蔽板。遮蔽板的表面上設置少一凹槽，而連接臂上則設置至少一穿孔部，以減少遮蔽板及連接臂的重量。An object of the present invention is to provide a thin film deposition machine with a double-opening shielding mechanism, which includes a driving device, two shielding plates, two connecting arms and two distance sensing units, wherein the driving device passes through the two connecting arms Connect the two shielding plates separately. A groove is provided on the surface of the shielding plate, and at least one perforation is provided on the connecting arm, so as to reduce the weight of the shielding plate and the connecting arm.
此外兩個連接臂上分別設置一反射面，當兩個連接臂操作在遮蔽狀態時，兩個距離感測單元發出的感測光束會投射在兩個連接臂的反射面上，並量測兩個連接臂與兩個距離感測單元之間的距離，以確定兩個連接臂操作在遮蔽狀態。In addition, a reflective surface is respectively arranged on the two connecting arms. When the two connecting arms are operated in the shielding state, the sensing light beams emitted by the two distance sensing units will be projected on the reflecting surfaces of the two connecting arms, and the two distance sensing units will be measured. The distance between a connecting arm and the two distance sensing units is used to determine that the two connecting arms are operating in a shielded state.
本發明的一目的，在於提供一種具有雙開式遮蔽機構的薄膜沉積機台，主要包括一反應腔體、一承載盤及一雙開式遮蔽機構。雙開式遮蔽機構包括一驅動裝置及兩個遮蔽板，其中驅動裝置包括一軸封裝置及一驅動馬達。An object of the present invention is to provide a thin film deposition machine with a double-opening shielding mechanism, which mainly includes a reaction chamber, a carrier plate and a double-opening shielding mechanism. The double-opening shielding mechanism includes a driving device and two shielding plates, wherein the driving device includes a shaft sealing device and a driving motor.
驅動馬達分別透過軸封裝置的外管體及軸體連接兩個驅動板，其中外管體及/或軸體的側邊設置兩個感測單元，用以確認外管體及/或軸體轉動的角度，並由外管體及/或軸體的角度判斷兩個遮蔽板操作在遮蔽狀態或開啟狀態。The drive motor is connected to the two drive plates through the outer tube body and the shaft body of the shaft seal device respectively, wherein two sensing units are arranged on the side of the outer tube body and/or the shaft body to confirm the outer tube body and/or shaft body Rotation angle, and judging from the angle of the outer tube body and/or shaft body whether the two shielding plates are operating in a shielding state or an open state.
為了達到上述的目的，本發明提出一種薄膜沉積機台，包括：一反應腔體，包括一容置空間；一承載盤，位於容置空間內，並用以承載至少一基板；及一雙開式遮蔽機構，包括：一第一遮蔽板，位於容置空間內；一第二遮蔽板，位於容置空間內，其中第一遮蔽板及第二遮蔽板皆包括至少一凹槽，朝向承載盤的方向；及一驅動裝置，包括：一軸封裝置，連接第一遮蔽板及第二遮蔽板；至少一驅動馬達，連接軸封裝置，並經由軸封裝置分別驅動第一遮蔽板及第二遮蔽板朝相反的方向擺動，使得第一遮蔽板及第二遮蔽板在一開啟狀態及一遮蔽狀態之間切換，其中操作在開啟狀態的第一遮蔽板及第二遮蔽板之間會形成一間隔空間，而操作在遮蔽狀態的第一遮蔽板及第二遮蔽板會相互靠近，並用以遮擋承載盤。In order to achieve the above object, the present invention proposes a thin film deposition machine, comprising: a reaction chamber, including an accommodating space; a carrier plate, located in the accommodating space, and used to carry at least one substrate; and a double-opening shield The mechanism includes: a first shielding plate located in the accommodating space; a second shielding plate located in the accommodating space, wherein both the first shielding plate and the second shielding plate include at least one groove facing the direction of the carrying tray ; and a driving device, comprising: a shaft sealing device, connected to the first shielding plate and the second shielding plate; at least one driving motor, connected to the shaft sealing device, and driving the first shielding plate and the second shielding plate towards Swing in the opposite direction, so that the first shielding plate and the second shielding plate are switched between an open state and a shielding state, wherein a space is formed between the first shielding plate and the second shielding plate operating in the open state, The first shielding plate and the second shielding plate operating in the shielding state are close to each other and are used to shield the carrier tray.
本發明提出一種雙開式遮蔽機構，適用於一薄膜沉積機台，包括：一第一遮蔽板；一第二遮蔽板，其中第一遮蔽板及第二遮蔽板皆包括至少一凹槽，設置在第一遮蔽板及第二遮蔽板的一下表面；及一驅動裝置，包括：一軸封裝置，連接第一遮蔽板及第二遮蔽板；至少一驅動馬達，連接軸封裝置，並經由軸封裝置分別驅動第一遮蔽板及第二遮蔽板朝相反的方向擺動，使得第一遮蔽板及第二遮蔽板在一開啟狀態及一遮蔽狀態之間切換，其中操作在開啟狀態的第一遮蔽板及部分第二遮蔽板之間會形成一間隔空間，而操作在遮蔽狀態的第一遮蔽板及第二遮蔽板會相互靠近，並形成一遮蔽件。The present invention proposes a double-opening shielding mechanism, which is suitable for a thin film deposition machine, including: a first shielding plate; a second shielding plate, wherein both the first shielding plate and the second shielding plate include at least one groove, and are arranged on the The lower surface of the first shielding plate and the second shielding plate; and a driving device, including: a shaft sealing device, connected to the first shielding plate and the second shielding plate; at least one driving motor, connected to the shaft sealing device, and through the shaft sealing device Drive the first shielding plate and the second shielding plate to swing in opposite directions respectively, so that the first shielding plate and the second shielding plate switch between an open state and a shielding state, wherein the first shielding plate and the second shielding plate operating in the open state A space is formed between some of the second shielding plates, and the first shielding plate and the second shielding plate operating in a shielding state are close to each other to form a shielding member.
所述的薄膜沉積機台及雙開式遮蔽機構，其中軸封裝置包括一外管體及一軸體，外管體包括一空間用以容置軸體，驅動馬達透過軸體連接第一遮蔽板，透過外管體連接第二遮蔽板，並同步驅動軸體及外管體朝相反的方向轉動。The thin film deposition machine and the double-opening shielding mechanism, wherein the shaft sealing device includes an outer tube body and a shaft body, the outer tube body includes a space for accommodating the shaft body, and the driving motor is connected to the first shielding plate through the shaft body, The second shielding plate is connected through the outer tube body, and the shaft body and the outer tube body are synchronously driven to rotate in opposite directions.
所述的薄膜沉積機台及雙開式遮蔽機構，包括兩個感測單元與外管體相鄰，兩個感測單元之間具有一間距，並分別用以感測外管體轉動至一第一位置及一第二位置，其中外管體轉動至第一位置時，第二遮蔽板操作在開啟狀態，而外管體轉動至第二位置時，第二遮蔽板操作在遮蔽狀態。The thin film deposition machine and the double-opening shielding mechanism include two sensing units adjacent to the outer tube body, and there is a distance between the two sensing units, which are used to sense the rotation of the outer tube body to a first A position and a second position, wherein when the outer tube body rotates to the first position, the second shielding plate operates in an open state, and when the outer tube body rotates to the second position, the second shielding plate operates in a shielding state.
所述的薄膜沉積機台及雙開式遮蔽機構，包括一第一連接臂及一第二連接臂，軸體透過第一連接臂連接第一遮蔽板，而外管體則透過第二連接臂連接第二遮蔽板，第一連接臂及第二連接臂上設置至少一穿孔部。The film deposition machine and the double-opening shielding mechanism include a first connecting arm and a second connecting arm, the shaft body is connected to the first shielding plate through the first connecting arm, and the outer tube is connected to the first shielding plate through the second connecting arm. At least one perforation portion is arranged on the second shielding plate, the first connecting arm and the second connecting arm.
所述的薄膜沉積機台及雙開式遮蔽機構，包括一第一距離感測單元及一第二距離感測單元，而第一連接臂具有一第一反射面，第二連接臂則具有一第二反射面，其中第一距離感測單元及第二距離感測單元設置在反應腔體上，並分別用以將一第一感測光束及一第二感測光束投射至第一連接臂的第一反射面及第二連接臂的第二反射面，以確認第一遮蔽板及第二遮蔽板操作在遮蔽狀態。The film deposition machine and the double-opening shielding mechanism include a first distance sensing unit and a second distance sensing unit, and the first connecting arm has a first reflective surface, and the second connecting arm has a first Two reflective surfaces, wherein the first distance sensing unit and the second distance sensing unit are arranged on the reaction cavity, and are respectively used to project a first sensing light beam and a second sensing light beam to the first connecting arm The first reflective surface and the second reflective surface of the second connecting arm are used to confirm that the first shielding plate and the second shielding plate are operating in a shielding state.
請參閱圖1，為本發明具有雙開式遮蔽機構的薄膜沉積機台操作在遮蔽狀態一實施例的側面剖面示意圖。如圖所示，薄膜沉積機台10主要包括一反應腔體11、一承載盤165及一雙開式遮蔽機構100，其中反應腔體11包括一容置空間12用以容置承載盤165及部分的雙開式遮蔽機構100。Please refer to FIG. 1 , which is a schematic side sectional view of an embodiment of a thin film deposition machine with a double-opening shielding mechanism operating in a shielding state according to the present invention. As shown in the figure, the thin
承載盤165位於反應腔體11的容置空間12內，並用以承載至少一基板163。以薄膜沉積機台10為物理氣相沉積腔體為例，反應腔體11內設置一靶材161，其中靶材161面對基板163及承載盤165。例如靶材161可設置在反應腔體11的上表面，並朝向位於容置空間12內的承載盤165及/或基板163。The
請配合參閱圖2，雙開式遮蔽機構100包括一第一遮蔽板151、一第二遮蔽板153及一驅動裝置17，其中第一遮蔽板151及第二遮蔽板153位於容置空間12內。驅動裝置17連接第一遮蔽板151及第二遮蔽板153，並分別驅動第一遮蔽板151及第二遮蔽板153朝相反方向擺動，使得第一遮蔽板151及第二遮蔽板153在遮蔽狀態及開啟狀態之間切換，例如第一遮蔽板151及第二遮蔽板153以驅動裝置17為軸心同步擺動。Please refer to FIG. 2 , the double-
本發明實施例所述的第一遮蔽板151及第二遮蔽板153操作在遮蔽狀態，可被定義為第一遮蔽板151及第二遮蔽板153相互靠近，並形成一遮蔽件15，以遮擋承載盤165。具體而言，操作在遮蔽狀態的第一遮蔽板151及第二遮蔽板153不會直接接觸，兩者之間的間距小於一門檻值，例如小於1mm，以防止第一遮蔽板151及第二遮蔽板153在接觸過程中產生微粒。The
請配合參閱圖3，第一遮蔽板151及第二遮蔽板153的表面可設置至少一凹槽154，透過凹槽154的設置可減少第一遮蔽板151及第二遮蔽板153的重量，同時亦不會影響第一遮蔽板151及第二遮蔽板153的遮蔽效果。例如第一遮蔽板151及第二遮蔽板153可為鈦，凹槽154的深度約為第一遮蔽板151及第二遮蔽板153厚度的30%至70%之間，凹槽154的截面積約為第一遮蔽板151及第二遮蔽板153面積的30%至70%之間。此外凹槽154的底部及側邊之間可設置一圓角或倒角。Please refer to Fig. 3, at least one
具體而言，第一遮蔽板151及第二遮蔽板153可為半圓形的板體，而凹槽154可以是部份環狀凹槽，例如二分之一環狀凹槽或四分之一環狀凹槽，並靠近第一遮蔽板151及第二遮蔽板153的外側或徑向外側。此外凹槽154可以對稱的方式設置在第一遮蔽板151及第二遮蔽板153上，以避免因為設置凹槽154而改變第一遮蔽板151及第二遮蔽板153的質量重心。Specifically, the
在本發明一實施例中，操作在遮蔽狀態的第一遮蔽板151及第二遮蔽板153用以遮蔽承載盤165，其中第一遮蔽板151及第二遮蔽板153的下表面朝向承載盤165，並將凹槽154設置在第一遮蔽板151及第二遮蔽板153的下表面，使得凹槽154面對承載盤165。In one embodiment of the present invention, the
在本發明一實施例中，驅動裝置17透過第一連接臂141及一第二連接臂143分別連接並驅動第一遮蔽板151及第二遮蔽板153朝相反方向擺動或轉動，例如第一連接臂141及第二連接臂143類似剪刀，其中第一連接臂141及第二連接臂143分別用以承載第一遮蔽板151及第二遮蔽板153。透過減少第一遮蔽板151及第二遮蔽板153的重量，可降低第一連接臂141及第二連接臂143的負擔，以避免第一連接臂141及第二連接臂143變形或斷裂。In one embodiment of the present invention, the
請配合參閱圖4，第一連接臂141及第二連接臂143分別設置至少一穿孔部142，以減少第一連接臂141及第二連接臂143的重量。此外在第一連接臂141及第二連接臂143上設置穿孔部142，亦不會降低第一連接臂141及第二連接臂143的結構強度。Please refer to FIG. 4 , the first connecting
在本發明一實施例中，第一遮蔽板151及第二遮蔽板153的表面亦可設置複數個定位凸部156，其中定位凸部156與凹槽154設置在第一遮蔽板151及第二遮蔽板153的同一表面上，例如下表面。第一連接臂141及第二連接臂143用以承載第一遮蔽板151及第二遮蔽板153的表面則設置複數個定位凹部144，透過定位凸部156及定位凹部144的設置，可將第一遮蔽板151及第二遮蔽板153分別放置在第一連接臂141及第二連接臂143的固定位置，並可避免第一遮蔽板151及第二遮蔽板153相對於第一連接臂141及第二連接臂143位移。In an embodiment of the present invention, the surfaces of the
上述在第一遮蔽板151及第二遮蔽板153的下表面設置定位凸部156，並於第一連接臂141及第二連接臂143的上表面設置定位凹部144僅為本發明一實施例，而非本發明權利範圍的限制。The
在不同實施例中，亦可於第一遮蔽板151及第二遮蔽板153的下表面設置定位凹部，並於第一連接臂141及第二連接臂143的上表面設置定位凸部。例如可於第一連接臂141及第二連接臂143上設置複數個螺孔，並將螺絲鎖固在螺孔上，以在第一連接臂141及第二連接臂143的上表面形成定位凸部，並透過凸出第一連接臂141及第二連接臂143上表面的螺絲與第一遮蔽板151及第二遮蔽板153下表面的定位凹部對位。In different embodiments, positioning recesses may be provided on the lower surfaces of the
在本發明一實施例中，請配合參閱圖5，驅動裝置17包括一驅動馬達171及一軸封裝置173，其中驅動馬達171透過軸封裝置173連接第一遮蔽板151及第二遮蔽板153，並透過軸封裝置173分別驅動第一遮蔽板151及第二遮蔽板153朝相反方向擺動，使得第一遮蔽板151及第二遮蔽板153在一開啟狀態及一遮蔽狀態之間切換。In one embodiment of the present invention, please refer to FIG. 5 , the driving
具體而言，軸封裝置173包括一外管體1733及一軸體1731，其中外管體1733包括一空間用以容置軸體1731，而驅動馬達171則同步驅動外管體1733及軸體1731朝相反方向轉動。Specifically, the
外管體1733及軸體1731同軸設置，且外管體1733及軸體1731可相對轉動。驅動馬達171透過軸體1731連接第一連接臂141，並經由第一連接臂141連接並帶動第一遮蔽板151擺動。驅動馬達171透過外管體1733連接第二連接臂143，並經由第二連接臂143連接並帶動第二遮蔽板153擺動。The
軸封裝置173可以是一般常見的軸封，主要用以隔離反應腔體11的容置空間12與外部的空間，以維持容置空間12的真空。例如外管體1733位於一固定管體1737內，並透過複數個軸承連接一固定管體1737，而軸體1731則透過複數個軸承連接外管體1733。在本發明另一實施例中，軸封裝置173可以是磁流體軸封，並包括複數個軸承、至少一永久磁鐵、至少一磁極片及至少一磁性流體。The
驅動馬達171的數量可為一個，如圖2所示，其中驅動馬達171透過一連動機構同時帶動軸體1731及外管體1733朝相反方向轉動。在本發明另一實施例中，如圖5所示，驅動馬達171的數量可為兩個，分別為第一驅動馬達1711及第二驅動馬達1713。第一驅動馬達1711連接並帶動軸體1731轉動，並經由軸體1731及第一連接臂141帶動第一遮蔽板151擺動。第二驅動馬達1713透過一傳動單元1735帶動外管體1733轉動，例如傳動單元1735可為傳動帶，並經由外管體1733及第二連接臂143帶動第二遮蔽板153擺動。The number of the driving
一般而言，可透過第一驅動馬達1711轉動的角度得知軸體1731轉動的角度或位置，並透過第二驅動馬達1713轉動的角度得知外管體1733轉動的角度或位置。然而第二驅動馬達1713在驅動外管體1733轉動的過程中，傳動單元1735有可能會相對於第二驅動馬達1713及外管體1733滑動。如此一來便無法以第二驅動馬達1713轉動的角度，正確的判斷外管體1733是否轉動到預設的角度或位置，當然亦無法判斷外管體1733連接及驅動的第二遮蔽板153是否正確的操作在遮蔽狀態或開啟狀態。Generally speaking, the rotation angle or position of the
為此，可於軸封裝置173的外管體1733側邊分別設置兩個感測單元131，其中兩個感測單元131之間具有一間距。例如兩個感測單元131與外管體1733的軸心形成一夾角，並分別用以感測外管體1733轉動到一第一位置(或第一角度)及一第二位置(或第二角度)。To this end, two sensing
具體而言，當外管體1733轉動第一位置時，會帶動第二遮蔽板153轉動至開啟狀態，而當外管體1733轉動到第二位置時，則會帶動第二遮蔽板153轉動至遮蔽狀態。外管體1733與第二遮蔽板153之間基本上不會相對轉動，因此可透過兩個感測單元131感測到外管體1733轉動到第一位置或第二位置，確認第二遮蔽板153是否確實操作在開啟狀態或遮蔽狀態。Specifically, when the
在本發明另一實施例中，軸封裝置173的軸體1731的側邊亦可設兩個感測單元131，其中兩個感測單元131之間具有一間距，並分別用以感測軸體1731轉動到一第三位置(或第三角度)及一第四位置(或第四角度)。In another embodiment of the present invention, two sensing
當軸體1731轉動第三位置時，會帶動第一遮蔽板151轉動至開啟狀態，而當軸體1731轉動到第四位置時，則會帶動第一遮蔽板151轉動至遮蔽狀態。因此可透過兩個感測單元131感測到軸體1731轉動到第三位置或第四位置，確認第一遮蔽板151是否確實轉動到開啟狀態或遮蔽狀態。When the
此外為了進一步確認第一遮蔽板151及第二遮蔽板153是否操作在遮蔽狀態，如圖2、圖4及圖6所示，本發明進一步在第一連接臂141及第二連接臂143上分別設置一第一反射面1411及一第二反射面1431，並於反應腔體11上設置一第一距離感測單元191及一第二距離感測單元193，例如第一距離感測單元191及第二距離感測單元193可以是光學測距儀。In addition, in order to further confirm whether the
具體而言，第一連接臂141及第二連接臂143分別包括一第一凸出部1413及一第二凸出部1433，並將第一反射面1411及第二反射面1431分別設置在第一凸出部1413及第二凸出部1433上。例如第一凸出部1413及第二凸出部1433分別沿著第一遮蔽板151及第二遮蔽板153的徑向凸出第一連接臂141及第二連接臂143。Specifically, the first connecting
第一距離感測單元191與第一連接臂141及第一遮蔽板151設置在反應腔體11的同一側，其中第一距離感測單元191用以將一第一感測光束L1投射至第一連接臂141。在實際應用時可調整第一距離感測單元191的設置位置，使得第一遮蔽板151操作在遮蔽狀態時，第一距離感測單元191產生的第一感測光束L1投射在第一連接臂141的第一反射面1411。此時第一感測光束L1會與第一反射面1411垂直，使得第一距離感測單元191接收到第一反射面1411反射的第一感測光束L1。第一距離感測單元191可由反射的第一感測光束L1量測出第一連接臂141與第一距離感測單元191之間的距離，並由量測的距離判斷第一遮蔽板151是否確實操作在遮蔽狀態。The first
第二距離感測單元193與第二連接臂143及第二遮蔽板153設置在反應腔體11的同一側，其中第二距離感測單元193用以將一第二感測光束L2投射至第二連接臂143。當第二遮蔽板153操作在遮蔽狀態時，第二距離感測單元193產生的第二感測光束L2會投射在第二連接臂143的第二反射面1431，其中第二感測光束L2與第二反射面1431垂直，使得第二距離感測單元193可接收到反射的第二感測光束L2，以量測出第二連接臂143與第二距離感測單元193之間的距離，並由量測的距離判斷第二遮蔽板153是否確實操作在遮蔽狀態。The second
在本發明一實施例中，如圖6及圖7所示，反應腔體11上分別設置兩個感測區113，其中兩個感測區113凸出反應腔體11，而第一距離感測單元191及第二距離感測單元193分別設置在兩個感測區113。In one embodiment of the present invention, as shown in FIG. 6 and FIG. 7, two sensing
此外，可進一步在兩個感測區113上分別設置一遮蔽板感測單元195，其中兩個遮蔽板感測單元195分別用以感測進入兩個感測區113的第一遮蔽板151及第二遮蔽板153。當兩個遮蔽板感測單元195感測到第一遮蔽板151及第二遮蔽板153時，可判斷第一遮蔽板151及第二遮蔽板153操作在開啟狀態，如圖7所示。操作在開啟狀態時第一遮蔽板151及第二遮蔽板153會相互遠離，其中第一遮蔽板151及第二遮蔽板153之間會形成一間隔空間152，使得第一遮蔽板151及第二遮蔽板153不會遮蔽承載盤165。In addition, a shielding
在本發明一實施例中，如圖1所示，反應腔體11的容置空間12可設置一擋件111，其中擋件111的一端連接反應腔體11，而擋件111的另一端則形成一開口112。承載盤165朝靶材161靠近時，會進入或接觸擋件111形成的開口112。反應腔體11、承載盤165及擋件111會在容置空間12內區隔出一反應空間，並在反應空間內的基板163表面沉積薄膜，可防止在反應空間外的反應腔體11及承載盤165的表面形成沉積薄膜。In one embodiment of the present invention, as shown in FIG. 1 , a
以上所述者，僅為本發明之一較佳實施例而已，並非用來限定本發明實施之範圍，即凡依本發明申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾，均應包括於本發明之申請專利範圍內。The above is only one of the preferred embodiments of the present invention, and is not used to limit the scope of the present invention, that is, all changes and equal changes made according to the shape, structure, characteristics and spirit described in the patent scope of the present invention Modifications should be included in the patent application scope of the present invention.
10:薄膜沉積機台 100:雙開式遮蔽機構 11:反應腔體 111:擋件 112:開口 113:感測區 12:容置空間 131:感測單元 141:第一連接臂 1411:第一反射面 1413:第一凸出部 142:穿孔部 143:第二連接臂 1431:第二反射面 1433:第二凸出部 144:定位凹部 15:遮蔽件 151:第一遮蔽板 153:第二遮蔽板 154:凹槽 156:定位凸部 161:靶材 163:基板 165:承載盤 17:驅動裝置 171:驅動馬達 1711:第一驅動馬達 1713:第二驅動馬達 173:軸封裝置 1731:軸體 1733:外管體 1735:傳動單元 1737:固定管體 191:第一距離感測單元 193:第二距離感測單元 195:遮蔽板感測單元 L1:第一感測光束 L2:第二感測光束 10: Thin film deposition machine 100: Double-opening shielding mechanism 11: Reaction chamber 111: block 112: opening 113: Sensing area 12:Accommodating space 131: Sensing unit 141: the first connecting arm 1411: the first reflective surface 1413: first protrusion 142: Perforation 143: Second connecting arm 1431: second reflective surface 1433: second protrusion 144: positioning recess 15: Covering piece 151: The first shielding plate 153: Second shielding plate 154: Groove 156: positioning convex part 161: target 163: Substrate 165: carrying plate 17: Drive device 171: Drive motor 1711: First drive motor 1713: Second drive motor 173: shaft sealing device 1731: Shaft body 1733: Outer body 1735: transmission unit 1737: fixed pipe body 191: The first distance sensing unit 193: The second distance sensing unit 195: Shielding plate sensing unit L1: the first sensing beam L2: Second sensing beam
[圖1]為本發明具有雙開式遮蔽機構的薄膜沉積機台操作在遮蔽狀態一實施例的側面剖面示意圖。[ FIG. 1 ] is a schematic side sectional view of an embodiment of a thin film deposition machine with a double-opening shielding mechanism operating in a shielding state according to the present invention.
[圖2]為本發明雙開式遮蔽機構的立體分解示意圖。[ Fig. 2 ] is a three-dimensional exploded schematic view of the double-opening type shielding mechanism of the present invention.
[圖3]為本發明雙開式遮蔽機構的遮蔽板一實施例的立體示意圖及部分剖面示意圖。[ Fig. 3 ] is a three-dimensional schematic diagram and a partial cross-sectional schematic diagram of an embodiment of the shielding plate of the double-opening shielding mechanism of the present invention.
[圖4]為本發明雙開式遮蔽機構的連接臂一實施例的俯視圖。[ Fig. 4 ] It is a top view of an embodiment of the connecting arm of the double-opening type shielding mechanism of the present invention.
[圖5]為本發明雙開式遮蔽機構的驅動裝置一實施例的立體剖面示意圖。[ Fig. 5 ] is a three-dimensional cross-sectional schematic view of an embodiment of the driving device of the double-opening type shielding mechanism of the present invention.
[圖6]為本發明具有雙開式遮蔽機構的薄膜沉積機台操作在遮蔽狀態一實施例的構造示意圖。[ FIG. 6 ] is a structural schematic view of an embodiment of a thin film deposition machine with a double-opening shielding mechanism operating in a shielded state.
[圖7]為本發明具有雙開式遮蔽機構的薄膜沉積機台操作在開啟狀態一實施例的構造示意圖。[ FIG. 7 ] is a structural diagram of an embodiment of the thin film deposition machine with a double-opening shielding mechanism operating in an open state.
141:第一連接臂 141: the first connecting arm
1411:第一反射面 1411: the first reflective surface
1413:第一凸出部 1413: first protrusion
142:穿孔部 142: Perforation
143:第二連接臂 143: Second connecting arm
1431:第二反射面 1431: second reflective surface
1433:第二凸出部 1433: second protrusion
144:定位凹部 144: positioning recess
15:遮蔽件 15: Covering piece
151:第一遮蔽板 151: The first shielding plate
153:第二遮蔽板 153: Second shielding plate
154:凹槽 154: Groove
156:定位凸部 156: positioning convex part
17:驅動裝置 17: Drive device
171:驅動馬達 171: Drive motor
173:軸封裝置 173: shaft sealing device
1731:軸體 1731: Shaft body
1733:外管體 1733: Outer body
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201334517Y (en) * | 2008-12-10 | 2009-10-28 | 中国电子科技集团公司第四十八研究所 | Single-drive double-motion baffle mechanism |
| CN103243302A (en) * | 2013-05-21 | 2013-08-14 | 上海和辉光电有限公司 | Baffle mechanism, thin film deposition device and thin film deposition method |
-
2021
- 2021-10-15 TW TW110138449A patent/TWI793810B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201334517Y (en) * | 2008-12-10 | 2009-10-28 | 中国电子科技集团公司第四十八研究所 | Single-drive double-motion baffle mechanism |
| CN103243302A (en) * | 2013-05-21 | 2013-08-14 | 上海和辉光电有限公司 | Baffle mechanism, thin film deposition device and thin film deposition method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202318528A (en) | 2023-05-01 |
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