TWI791346B - The ventilation equipment for high-low temperature ic test handler - Google Patents
The ventilation equipment for high-low temperature ic test handler Download PDFInfo
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- TWI791346B TWI791346B TW110146206A TW110146206A TWI791346B TW I791346 B TWI791346 B TW I791346B TW 110146206 A TW110146206 A TW 110146206A TW 110146206 A TW110146206 A TW 110146206A TW I791346 B TWI791346 B TW I791346B
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本發明是有關一種應用於電子元件高低溫測試設備之高低溫空氣循環機,尤其是一種可減少測試設備低温測試時結霜的機率、可單獨替換循環機,增加測試設備使用率、減少測試設備複雜度、減少低溫測試時產生的冷凝水對電子元件及測試設備的危害、使測試設備的保温箱內維持正壓,防止外部空氣進入,減少保温箱內結霜機率,進而使本發明達到使用上的便利及測試設備品質的提升之實用進步性之創新發明者。 The invention relates to a high and low temperature air cycle machine applied to high and low temperature testing equipment for electronic components, in particular, it can reduce the probability of frosting during low temperature testing of the testing equipment, can replace the circulator alone, increase the utilization rate of testing equipment, and reduce the number of testing equipment. Complexity, reducing the harm of condensed water generated during low-temperature testing to electronic components and testing equipment, maintaining positive pressure in the incubator of the testing equipment, preventing external air from entering, reducing the probability of frosting in the incubating box, and making the present invention reach the goal of using The innovative inventor of the convenience in the world and the practical progress of the improvement of the quality of testing equipment.
按,請參閱第9圖所示,其係習知電子元件的高低溫測試設備,所述電子元件係為積體電路(Integrated Circuit,IC),而習知設備包含有一保溫箱1、一熱交換器2,該熱交換器2一側設有一加熱器3,該熱交換器2之另一側設有一循環用風扇4,且該熱交換器2一端係管路連接一液態氮5,當該高低溫測試設備作高溫測試時,該加熱器3及該循環用風扇4開啟,使該保溫箱1內的空氣升溫至測試溫度後,以進行測試,而該保溫箱1一側設有一測試區6,該測試區6上、下端分別設有一入料軌道7及一出料軌道8,該入料軌道7及該出料軌道8可供預備測試的積體電路9(Integrated Circuit,IC)通過,並透過該測試區6進行測試;當該習知設備進行低溫測試時,需外接該液態氮5,並使該加熱器3及該循環用風扇4作開啟,使該保溫箱1內的空氣降至測試溫度後,再進行測試;然而當進行低溫測試時易發生的問題為:
Press, please refer to shown in Fig. 9, it is the high and low temperature testing equipment of conventional electronic component, and described electronic component is integrated circuit (Integrated Circuit, IC), and conventional equipment comprises an
1.易結霜:當測試設備運作時,因為有入料軌道7及一出料軌道8的問題,保溫箱1內部無法完全保持密封,因此當進行一段時間後,在熱交換器2上會開始結霜,最後影響溫度的穩定性。
1. Easy to frost: When the test equipment is in operation, due to the problem of the
2.降低設備的使用率:因除霜過程十分耗時,同時在進行除霜過程時測試設備也需要停機,且除完霜後,設備需再降溫也十分耗時。 2. Reduce the utilization rate of equipment: because the defrosting process is very time-consuming, the test equipment also needs to be shut down during the defrosting process, and it is also very time-consuming to cool down the equipment after defrosting.
3.對電子元件的積體電路(Integrated Circuit,IC)易造成危害:因為除了熱交換器2易結霜外,液態氮5管路若斷熱不良,也會在設備內部的管路造成結霜或出現冷凝水滴,會對電子元件的積體電路9(Integrated Circuit,IC)造成危害。
3. It is easy to cause harm to the integrated circuit (Integrated Circuit, IC) of electronic components: because in addition to the
即,本發明之主要目的,是在提供一種應用於電子元件高低溫測試設備之高低溫空氣循環機;其所欲解決之問題點,是針對習知1.易結霜、2.降低設備的使用率、3.對電子元件的積體電路(Integrated Circuit,IC)易造成危害的問題點加以改良突破;而其解決問題之技術特點,主要係包含有:一高低溫空氣循環機,內部形成一容置空間,該高低溫空氣循環機一側壁面預定位置由上而下依序貫設有與該容置空間相連通的一第一導孔、一第二導孔及一第三導孔,且該高低溫空氣循環機另側壁面預定位置由上而下依序貫設有與該容置空間相連通的一第四導孔、一第五導孔及一第六導孔;一熱交換器,設於該高低溫空氣循環機內部容置空間預定位置,該熱交換器頂部預定位置設有一第一出風管,該第一出風管一端係連通設置一鼓風機,該鼓風機一端設有一高低溫第二出風管,該高低溫第二出風管係穿伸出該高低溫空氣循環機之該第四導孔,其中該高低溫第二出風管末端組接有一第一組接頭;另該熱交換器一側壁面係接設有一液態 氮輸入管,該液態氮輸入管係穿伸出該高低溫空氣循環機之該第一導孔;該熱交換器相對該液態氮輸入管鄰側係接設有一高壓空氣引入管,該高壓空氣引入管係穿伸出該高低溫空氣循環機之該第二導孔;該熱交換器相對該高壓空氣引入管鄰側係接設有一氮氣排出管,該氮氣排出管係穿伸出該高低溫空氣循環機之該第三導孔;又該熱交換器底側壁面係接設有一高低溫高壓空氣導出管,該高低溫高壓空氣導出管係與該高壓空氣引入管及該液態氮輸入管相互連通,且該高低溫高壓空氣導出管之末端設有一第三組接頭,該高低溫高壓空氣導出管係穿伸出該高低溫空氣循環機之該第六導孔;該熱交換器相對該高低溫高壓空氣導出管鄰側係接設有一回風管,該回風管係與該第一出風管相互連通,該回風管之末端係連接有一第二組接頭,且該回風管係穿伸出該高低溫空氣循環機之該第五導孔;一加熱器,係結合覆掛於該熱交換器之一側,可供加熱該熱交換器內部所連通的該第一出風管、該液態氮輸入管、該高壓空氣引入管及該回風管;及一控制單元,用以自動控制該高低溫空氣循環機內部的熱交換器、加熱器及該鼓風機作啟閉運作者;藉此,本發明之應用於電子元件高低溫測試設備之高低溫空氣循環機為可改善習用之技術關鍵在於:第一:可減少測試設備低温測試時結霜的機率;第二:高低溫空氣循環機獨立於電子元件高低溫測試設備之外,故障或結霜時,可單獨替換循環機,增加測試設備使用率;第三:減少測試設備複雜度;第四:減少低溫測試時產生的冷凝水對電子元件及測試設備的危害;第五:電子元件高低溫測試設備少了產生高低溫空氣循環機的構 造,與高低温空氣循環機只靠出風及回風的風管聯結另外可接高壓空氣,以使測試設備的保温箱內維持正壓,防止外部空氣進入,減少保温箱內結霜機率。 That is, the main purpose of the present invention is to provide a high and low temperature air cycle machine applied to high and low temperature testing equipment for electronic components; the problems to be solved are aimed at the conventional 1. easy to frost, 2. reduce the equipment Utilization rate, 3. Improve and break through the problem points that are easy to cause harm to the integrated circuit (IC) of electronic components; and its technical characteristics for solving problems mainly include: a high and low temperature air cycle machine, internally formed An accommodating space, a first guide hole, a second guide hole and a third guide hole communicating with the accommodating space are sequentially provided at predetermined positions on the side wall of the high and low temperature air cycle machine from top to bottom , and the predetermined position on the other side wall of the high and low temperature air cycle machine is sequentially provided with a fourth guide hole, a fifth guide hole and a sixth guide hole communicating with the accommodating space from top to bottom; The heat exchanger is set at a predetermined position in the internal accommodation space of the high and low temperature air cycle machine. A first air outlet pipe is provided at a predetermined position on the top of the heat exchanger. One end of the first air outlet pipe is connected to a blower, and one end of the blower is provided There is a second high and low temperature air outlet pipe, the second high and low temperature air outlet pipe passes through the fourth guide hole of the high and low temperature air cycle machine, wherein the end of the second high and low temperature air outlet pipe is connected with a first group joint; another side wall of the heat exchanger is connected with a liquid Nitrogen input pipe, the liquid nitrogen input pipe passes through the first guide hole of the high and low temperature air cycle machine; the heat exchanger is connected with a high-pressure air introduction pipe adjacent to the liquid nitrogen input pipe, the high-pressure air The introduction pipe system passes through the second guide hole of the high and low temperature air cycle machine; the side of the heat exchanger opposite to the high pressure air introduction pipe is connected with a nitrogen discharge pipe, and the nitrogen discharge pipe system passes through the high and low temperature air cycle machine. The third guide hole of the air cycle machine; and the bottom side wall of the heat exchanger is connected with a high-low temperature high-pressure air outlet pipe, and the high-low temperature high-pressure air outlet pipe is connected with the high-pressure air inlet pipe and the liquid nitrogen input pipe. connected, and the end of the high-low temperature high-pressure air outlet pipe is provided with a third set of joints, the high-low temperature high-pressure air outlet pipe passes through the sixth guide hole of the high-low temperature air cycle machine; the heat exchanger is relatively high A return air pipe is connected to the adjacent side of the low-temperature high-pressure air outlet pipe, and the return air pipe is connected with the first air outlet pipe. The end of the return air pipe is connected with a second set of joints, and the return air pipe is Pass through the fifth guide hole of the high and low temperature air cycle machine; a heater is combined and hung on one side of the heat exchanger, which can be used to heat the first air outlet pipe connected to the inside of the heat exchanger , the liquid nitrogen input pipe, the high-pressure air inlet pipe and the air return pipe; and a control unit, which is used to automatically control the heat exchanger, the heater and the blower inside the high and low temperature air cycle machine for on-off operation; In this way, the high and low temperature air cycle machine applied to the high and low temperature testing equipment of electronic components of the present invention can improve the conventional technology. The circulator is independent of the high and low temperature test equipment for electronic components. In case of failure or frost, the circulator can be replaced separately to increase the utilization rate of the test equipment; third: reduce the complexity of the test equipment; fourth: reduce the condensation generated during low temperature testing The harm of water to electronic components and testing equipment; fifth: the high and low temperature testing equipment for electronic components lacks the mechanism for generating high and low temperature air circulation machines It is connected with the high and low temperature air cycle machine only by the air outlet and return air ducts, and can also be connected with high-pressure air to maintain positive pressure in the incubator of the test equipment, prevent external air from entering, and reduce the chance of frost in the incubator.
習知部份: Knowledge part:
1:保溫箱 1: incubator
2:熱交換器 2: heat exchanger
3:加熱器 3: Heater
4:循環用風扇 4: Circulation fan
5:液態氮 5: Liquid nitrogen
6:測試區 6: Test area
7:入料軌道 7: Feeding track
8:出料軌道 8: Discharge track
9:積體電路 9: Integrated circuit
本發明部份: Part of the invention:
10:高低溫空氣循環機 10: High and low temperature air cycle machine
101:配電盤 101: Switchboard
102:排水孔 102: drainage hole
11:容置空間 11:Accommodating space
12:第一導孔 12: The first guide hole
13:第二導孔 13: Second guide hole
14:第三導孔 14: The third guide hole
15:第五導孔 15: The fifth guide hole
16:第六導孔 16: The sixth guide hole
17:第四導孔 17: The fourth guide hole
171:溫度計 171: Thermometer
20:熱交換器 20: heat exchanger
201:加熱器 201: heater
21:第一出風管 21: The first outlet pipe
22:液態氮輸入管 22: Liquid nitrogen input pipe
23:高壓空氣引入管 23: High-pressure air inlet pipe
24:氮氣排出管 24: Nitrogen exhaust pipe
25:回風管 25: return air duct
251:第二組接頭 251: The second group of joints
26:高低溫高壓空氣導出管 26:High and low temperature high pressure air outlet pipe
261:第三組接頭 261: The third group of joints
30:加熱器 30: heater
40:鼓風機 40: Blower
401:鼓風馬達 401: Blower motor
41:高低溫第二出風管 41: High and low temperature second air outlet pipe
411:第一組接頭 411: The first set of joints
50:液態氮桶 50: Liquid Nitrogen Bucket
51:輸出管 51: output tube
52:開關閥 52: switch valve
60:電子元件高低溫測試設備 60: High and low temperature test equipment for electronic components
601:保溫箱體 601: insulation box
602:導風器 602: wind deflector
61:第一連接管 61: the first connecting pipe
62:第二連接管 62: Second connecting pipe
63:第三連接管 63: The third connecting pipe
64:入料軌道 64: Feeding track
65:入料槽 65: Feeding chute
66:出料槽 66: Outlet chute
67:測試區 67: Test area
68:分類機構 68: Classification agencies
69:出料軌道 69: Discharge track
70:控制單元 70: Control unit
A:保溫棉 A: Insulation cotton
第1圖:是本發明之前視立體外觀圖。 Fig. 1: is the three-dimensional appearance diagram of front view of the present invention.
第2圖:是本發明之後視立體外觀圖。 Fig. 2: is the three-dimensional appearance diagram of rear view of the present invention.
第3圖:是本發明高低溫空氣循環機之前視立體外觀圖。 Figure 3: It is a front perspective perspective view of the high and low temperature air cycle machine of the present invention.
第4圖:是本發明高低溫空氣循環機之後視立體外觀圖。 Figure 4: It is a rear perspective perspective view of the high and low temperature air cycle machine of the present invention.
第5圖:是本發明高低溫空氣循環機之內部立體外觀圖。 Fig. 5: is the internal three-dimensional appearance diagram of the high and low temperature air cycle machine of the present invention.
第6圖:是電子元件高低溫測試設備之前左側視角立體外觀圖。 Figure 6: It is a perspective view of the front left perspective of the high and low temperature test equipment for electronic components.
第7圖:是電子元件高低溫測試設備之前右側視角立體外觀圖。 Figure 7: It is a perspective view of the front right perspective of the high and low temperature test equipment for electronic components.
第8圖:是本發明之剖面示意圖。 Fig. 8: is a schematic cross-sectional view of the present invention.
第9圖:是習知高低溫空氣循環機結構圖。 Figure 9: It is a structural diagram of a known high and low temperature air cycle machine.
為使 貴審查委員對本發明有進一步之深入了解,茲列舉一較佳實施例,並配合圖式說明如后:請參閱第1~8圖所示,本發明之應用於電子元件高低溫測試設備之高低溫空氣循環機,所述電子元件於本實施例係為積體電路(Integrated Circuit,IC),本發明包含有:一高低溫空氣循環機10,內部形成一容置空間11,該容置空間11內設有一配電盤101,該高低溫空氣循環機10一側壁面預定位置由上而下依序貫設有與該容置空間11相連通的一第一導孔12、一第二導孔13及一第三導孔
14,且該高低溫空氣循環機10另側壁面預定位置由上而下依序貫設有與該容置空間11相連通的一第四導孔17、一第五導孔15及一第六導孔16,該高低溫空氣循環機10內朝底部貫設有一排水孔102,該高低溫空氣循環機10對應出風口預定位置設有一溫度計171,該溫度計171是配合加熱器201來控制出風溫度;一熱交換器20,該熱交換器20係為一蒸發器形態,設於該高低溫空氣循環機10內部容置空間11預定位置,該熱交換器20頂部預定位置設有一第一出風管21,該第一出風管21一端係連通設置一鼓風機40,該鼓風機40一端朝外設置有一鼓風馬達401,令該鼓風機40係藉由該鼓風馬達401驅動,該鼓風機40一端設有一高低溫第二出風管41,該高低溫第二出風管41係穿伸出該高低溫空氣循環機10之該第四導孔17,其中該高低溫第二出風管41末端組接有一第一組接頭411,其中該鼓風機40用以強制空氣循環;該熱交換器20用以冷卻循環空氣使用;該熱交換器20預定位置設有二加熱器201,該加熱器201用以控制高低溫度及除霜用;另該熱交換器20一側壁面係接設有一液態氮輸入管22,該液態氮輸入管22係穿伸出該高低溫空氣循環機10之該第一導孔12;該熱交換器20相對該液態氮輸入管22鄰側係接設有一高壓空氣引入管23,該高壓空氣引入管23係穿伸出該高低溫空氣循環機10之該第二導孔13;其中高壓空氣引入管23係連接一空氣壓縮機(圖未示);該熱交換器20相對該高壓空氣引入管23鄰側係接設有一氮氣排出管24,該氮氣排出管24係穿伸出該高低溫空氣循環機10之該第三導孔14;又該熱交換器20底側壁面係接設有一高低溫高壓空氣導出管26,該高低溫高壓空氣導出管26係與該高壓空氣引入管23及該液態氮輸入管22相
互連通,且該高低溫高壓空氣導出管26之末端設有一第三組接頭261,該高低溫高壓空氣導出管26係穿伸出該高低溫空氣循環機10之該第六導孔16;該熱交換器20相對該高低溫高壓空氣導出管26鄰側係接設有一回風管25,該回風管25係與該第一出風管21相互連通,該回風管25之末端係連接有一第二組接頭251,且該回風管25係穿伸出該高低溫空氣循環機10之該第五導孔15;一加熱器30,係結合覆掛於該熱交換器20之一側,可供加熱該熱交換器20內部所連通的該第一出風管21、該液態氮輸入管22、該高壓空氣引入管23及該回風管25,該加熱器30可產生高溫,加熱循環空氣及除霜使用;及一控制單元70,用以自動控制該高低溫空氣循環機10內部的熱交換器20、加熱器30及該鼓風機40作啟閉運作者。
In order to enable your examiners to have a further in-depth understanding of the present invention, hereby enumerate a preferred embodiment, and describe it with the drawings as follows: Please refer to Figures 1 to 8, which show the application of the present invention to the high and low temperature testing equipment for electronic components The high and low temperature air cycle machine, the electronic component is an integrated circuit (Integrated Circuit, IC) in this embodiment, the present invention includes: a high and low temperature
繼而,該熱交換器20之該液態氮輸入管22末端係連接一液態氮桶50所連設的一輸出管51,其中該液態氮輸入管22與該輸出管51之間係接設一開關閥52;再者,該高低溫空氣循環機10另側相對內部的熱交換器20及該鼓風機40所設的高低溫第二出風管41、該回風管25及該高低溫高壓空氣導出管26係用以外掛式配接一電子元件高低溫測試設備60,該電子元件高低溫測試設備60內部設有一保溫箱體601,該保溫箱體601內部設有一導風器602,該頂部設置有一入料軌道64,該入料軌道64底側設有一出料軌道69,該入料軌道64與該出料軌道69之間設置有一測試區67,該入料軌道64之一側設置有一入料槽65,且該出料軌道69之一側設置有一出料槽66,該電子元件高低溫測試設備60預定位置設有一分類機構68:其中
該電子元件高低溫測試設備60一側端分別由上而下依序設有一第一連接管61、一第二連接管62及一第三連接管63,其中該第一連接管61係連設於該高低溫第二出風管41之該第一組接頭411;該第二連接管62係連設於該回風管25之該第二組接頭251;該第三連接管63係連設於該高低溫高壓空氣導出管26之該第三組接頭261,其中該第一組接頭411、該第二組接頭251及該第三組接頭261所相對組接的高低溫第二出風管41與第一連接管61、該回風管25與該第二連接管62及該高低溫高壓空氣導出管26與該第三連接管63之接設型態為分別具有螺紋的螺帽方式螺接組設。
Then, the end of the liquid
較佳地,該液態氮輸入管22、該高低溫高壓空氣導出管26、該輸出管51及該第三連接管63外管壁係進一步包覆有一保溫棉A;是以,本發明之應用於電子元件高低溫測試設備60之高低溫空氣循環機10為可改善習用之技術關鍵在於:第一:可減少測試設備低温測試時結霜的機率;第二:高低溫空氣循環機10獨立於電子元件高低溫測試設備60之外,故障或結霜時,可單獨替換循環機,增加測試設備使用率;第三:減少測試設備複雜度;第四:減少低溫測試時產生的冷凝水對電子元件及測試設備的危害;第五:電子元件高低溫測試設備60少了產生高低溫空氣循環機10的構造,與高低温空氣循環機只靠出風及回風的風管聯結另外可接高壓空氣,以使測試設備的保温箱內維持正壓,防止外部空氣進入,減少保温箱內結霜機率。 Preferably, the liquid nitrogen input pipe 22, the high-low temperature high-pressure air outlet pipe 26, the output pipe 51 and the third connecting pipe 63 are further coated with an insulating cotton A; therefore, the application of the present invention The high and low temperature air cycle machine 10 in the high and low temperature test equipment 60 for electronic components is the key to improving the conventional technology: first: it can reduce the chance of frosting during low temperature testing of the test equipment; second: the high and low temperature air cycle machine 10 is independent of In addition to the high and low temperature test equipment for electronic components 60, when there is a failure or frost, the cycler can be replaced separately to increase the utilization rate of the test equipment; third: reduce the complexity of the test equipment; fourth: reduce the impact of condensed water generated during low temperature testing on electronics Harm of components and testing equipment; Fifth: the high and low temperature testing equipment 60 for electronic components lacks the structure to produce high and low temperature air circulation machines 10, and the high and low temperature air circulation machines are connected only by the air outlet and return air ducts, and can be connected to high pressure Air in order to maintain a positive pressure in the incubator of the test equipment, prevent external air from entering, and reduce the chance of frosting in the incubator.
據此,本發明實為一深具實用性及進步性之設計,然未見有相同之產品及刊物公開,從而允符發明專利申請要件,爰依法提出申請。 Accordingly, the present invention is actually a highly practical and progressive design. However, no similar product or publication has been published, which meets the requirements for a patent application, and the application is filed according to law.
10:高低溫空氣循環機 10: High and low temperature air cycle machine
11:容置空間 11:Accommodating space
12:第一導孔 12: The first guide hole
13:第二導孔 13: Second guide hole
14:第三導孔 14: The third guide hole
15:第五導孔 15: The fifth guide hole
16:第六導孔 16: The sixth guide hole
17:第四導孔 17: The fourth guide hole
20:熱交換器 20: heat exchanger
21:第一出風管 21: The first outlet duct
22:液態氮輸入管 22: Liquid nitrogen input pipe
23:高壓空氣引入管 23: High-pressure air inlet pipe
24:氮氣排出管 24: Nitrogen exhaust pipe
25:回風管 25: return air duct
251:第二組接頭 251: The second group of joints
26:高低溫高壓空氣導出管 26:High and low temperature high pressure air outlet pipe
261:第三組接頭 261: The third group of joints
30:加熱器 30: heater
40:鼓風機 40: Blower
41:高低溫第二出風管 41: High and low temperature second air outlet pipe
411:第一組接頭 411: The first set of joints
50:液態氮桶 50: Liquid Nitrogen Bucket
51:輸出管 51: output tube
52:開關閥 52: switch valve
60:電子元件高低溫測試設備 60: High and low temperature test equipment for electronic components
61:第一連接管 61: the first connecting pipe
62:第二連接管 62: Second connecting pipe
63:第三連接管 63: The third connecting pipe
70:控制單元 70: Control unit
Claims (5)
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TW110146206A TWI791346B (en) | 2021-12-10 | 2021-12-10 | The ventilation equipment for high-low temperature ic test handler |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0599610B1 (en) * | 1992-11-27 | 1998-04-08 | Thermo King Corporation | Air conditioning and refrigeration methods and apparatus utilizing a cryogen |
TW436634B (en) * | 1998-07-24 | 2001-05-28 | Advantest Corp | IC test apparatus |
JP6670146B2 (en) * | 2016-03-25 | 2020-03-18 | エスペック株式会社 | Environmental test equipment |
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2021
- 2021-12-10 TW TW110146206A patent/TWI791346B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0599610B1 (en) * | 1992-11-27 | 1998-04-08 | Thermo King Corporation | Air conditioning and refrigeration methods and apparatus utilizing a cryogen |
TW436634B (en) * | 1998-07-24 | 2001-05-28 | Advantest Corp | IC test apparatus |
JP6670146B2 (en) * | 2016-03-25 | 2020-03-18 | エスペック株式会社 | Environmental test equipment |
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