TWI790889B - Series type water cooling structure - Google Patents
Series type water cooling structure Download PDFInfo
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- TWI790889B TWI790889B TW111101091A TW111101091A TWI790889B TW I790889 B TWI790889 B TW I790889B TW 111101091 A TW111101091 A TW 111101091A TW 111101091 A TW111101091 A TW 111101091A TW I790889 B TWI790889 B TW I790889B
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Abstract
Description
本發明係有關於液體冷卻裝置,尤指一種具有泵浦結構之液冷裝置。 The invention relates to a liquid cooling device, especially a liquid cooling device with a pump structure.
液體冷卻系統包含水冷頭(cold plate)、水泵(pump)及連接管等元件,並於循環管路中填充工作流體(一般為水)。據此,將水冷頭接觸發熱源以帶走熱,同時利用水泵驅動循環管路內的工作流體作循環流動,使工作流體流經水冷頭並進行熱交換,藉以達到散熱目的。 The liquid cooling system includes components such as a cold plate, a pump, and connecting pipes, and a working fluid (usually water) is filled in the circulating pipeline. Accordingly, the water cooling head is brought into contact with the heat source to take away the heat, and at the same time, the water pump is used to drive the working fluid in the circulation pipeline to circulate, so that the working fluid flows through the water cooling head and performs heat exchange, so as to achieve the purpose of heat dissipation.
然而,單一水泵的水泵壓力或揚程能夠提高的水流壓力有限,且水泵故障時會降低冷卻系統效能。又,現有的電子裝置經常需要設置複數散熱模組來對內部多個發熱元件進行散熱。此外,一般電子裝內部的散熱模組通常是獨立設置,各散熱模組僅設置單一個水泵及單一個水冷頭,並對單一發熱源進行散熱。由於該些散熱模組需要較多的連接管路,導致冷卻系統佔用較多的使用空間,故需對液體冷卻系統的散熱設計作進一步規劃,以符合使用需求,並提高液體冷卻系統的整體散熱效率。 However, the water flow pressure that can be increased by the water pump pressure or head of a single water pump is limited, and the efficiency of the cooling system will be reduced when the water pump fails. In addition, existing electronic devices often need to install multiple heat dissipation modules to dissipate heat from multiple internal heating elements. In addition, the heat dissipation modules inside the general electronic equipment are usually installed independently, and each heat dissipation module is only equipped with a single water pump and a single water cooling head, and dissipates heat from a single heat source. Since these heat dissipation modules require more connecting pipes, the cooling system takes up more space, so it is necessary to further plan the heat dissipation design of the liquid cooling system to meet the use requirements and improve the overall heat dissipation of the liquid cooling system efficiency.
有鑑於此,本發明人遂針對上述現有技術,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本發明人改良之目標。 In view of this, the inventor of the present invention aimed at the above-mentioned prior art, devoted himself to research and combined with the application of theories, and tried his best to solve the above-mentioned problems, which became the goal of the inventor's improvement.
本發明之一目的,在於提供一種串聯式水冷散熱結構,其係透過複數水泵的設置來達到均流的循環效果,進而提高液體冷卻系統的整體散熱效率。 An object of the present invention is to provide a serial water-cooling heat dissipation structure, which achieves a circulation effect of equal flow through the arrangement of a plurality of water pumps, thereby improving the overall heat dissipation efficiency of the liquid cooling system.
為了達成上述之目的,本發明係為一種串聯式水冷散熱結構,包括複數水冷頭、複數連接管、入水管、出水管、入水端水泵及出水端水泵。各水冷頭包含殼座,殼座設置有入水口及出水口。複數連接管串接在相鄰水冷頭之間,各連接管的一端連接相鄰水冷頭中一水冷頭的出水口、另一端連接相鄰水冷頭中另一水冷頭的入水口,從而形成串聯的水冷頭。入水管連接串聯的水冷頭中最外側之一水冷頭的入水口。出水管連接串聯的水冷頭之中最外側之另一水冷頭的出水口。入水端水泵設置在入水管上。出水端水泵設置在出水管上。 In order to achieve the above purpose, the present invention is a serial water cooling heat dissipation structure, including multiple water cooling heads, multiple connecting pipes, water inlet pipes, water outlet pipes, water inlet pumps and water outlet pumps. Each water cooling head includes a shell seat, and the shell seat is provided with a water inlet and a water outlet. A plurality of connecting pipes are connected in series between adjacent water-cooling heads, one end of each connecting pipe is connected to the water outlet of one water-cooling head in the adjacent water-cooling head, and the other end is connected to the water inlet of the other water-cooling head in the adjacent water-cooling head, thus forming a series connection water cooling head. The water inlet pipe is connected to the water inlet of the outermost one of the water cooling heads in series. The water outlet pipe is connected to the water outlet of another outermost water cooling head among the water cooling heads connected in series. The water pump at the water inlet end is arranged on the water inlet pipe. The water pump at the water outlet is arranged on the water outlet pipe.
相較於習知,本發明之串聯式水冷散熱結構設置有複數水冷頭、入水端水泵及出水端水泵,該些水冷頭係以串聯的方式設置,藉以簡化並縮小水冷散熱結構的整體體積,另外,其係在入水管及出水管皆設置有水泵,並透過在進水端及出水端的二水泵設定不同的泵浦壓力值,以調整入水端水泵及該出水端水泵的壓力及流量,進而達到均流、均溫的效果,據此在最小壓力下即能夠達到均流、均溫的功效,因而具備節能的效果,增加使用上的實用性。 Compared with the conventional ones, the serial water cooling structure of the present invention is provided with multiple water cooling heads, water inlet pumps and water outlet pumps. These water cooling heads are arranged in series to simplify and reduce the overall volume of the water cooling heat dissipation structure. In addition, it is equipped with water pumps in both the water inlet pipe and the water outlet pipe, and sets different pump pressure values through the two water pumps at the water inlet end and the water outlet end to adjust the pressure and flow of the water inlet end water pump and the water outlet end water pump, and then The effect of equalizing current and temperature can be achieved, and the effect of equalizing current and temperature can be achieved under the minimum pressure, so it has the effect of energy saving and increases the practicality of use.
1:串聯式水冷散熱結構 1: Series water cooling heat dissipation structure
10、10a~10c:水冷頭 10, 10a~10c: water cooling head
11a:殼座 11a: shell seat
111a~111c:入水口 111a~111c: water inlet
112a~112c:出水口 112a~112c: water outlet
12a:下座 12a: Get off the seat
120a:下容腔 120a: lower cavity
13a:上座 13a: Upper seat
14a:水冷鰭片 14a: Water cooling fins
15a:密封條 15a: sealing strip
16a:散熱鰭片 16a: cooling fins
20:連接管 20: connecting pipe
30:入水管 30: water inlet pipe
40:出水管 40: Outlet pipe
50:入水端水泵 50: Inlet water pump
60:出水端水泵 60:Water outlet pump
圖1係本發明之串聯式水冷散熱結構的立體外觀示意圖。 FIG. 1 is a schematic perspective view of the serial water cooling heat dissipation structure of the present invention.
圖2係為本發明之串聯式水冷散熱結構的上視圖。 Fig. 2 is a top view of the serial water cooling heat dissipation structure of the present invention.
圖3係為本發明之水冷頭的立體分解示意圖。 FIG. 3 is a three-dimensional exploded schematic view of the water cooling head of the present invention.
圖4係為本發明之水冷頭的組合剖視圖。 Fig. 4 is a combined sectional view of the water cooling head of the present invention.
有關本發明之詳細說明及技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。 The detailed description and technical content of the present invention are described below with the drawings, but the attached drawings are only for reference and description, and are not used to limit the present invention.
請參照圖1及圖2,係分別為本發明之串聯式水冷散熱結構的立體外觀示意圖及上視圖。本發明係為一種串聯式水冷散熱結構1,包含複數水冷頭10、複數連接管20、一入水管30、一出水管40、一入水端水泵50及一出水端水泵60。該些連接管20設置在該些水冷頭10之間,從而使該些水冷頭10形成串聯式的水冷頭10。此外,該入水管30及該出水管40、該入水端水泵50及該出水端水泵60分別對應設置在串聯的水冷頭10的二端。更詳細說明該串聯式水冷散熱結構1如後。
Please refer to FIG. 1 and FIG. 2 , which are respectively a three-dimensional appearance schematic diagram and a top view of the serial water-cooling heat dissipation structure of the present invention. The present invention is a series-type water-cooling
本實施例中,複數水冷頭10包含相鄰水冷頭10a、10b、10c,其中,最外側的二水冷頭為水冷頭10a、10c。又,請同時參照圖3及圖4,係分別為本發明之水冷頭的立體分解示意圖及組合剖視圖。本發明之水冷頭10的結構詳述如下。
In this embodiment, the plurality of
以水冷頭10a舉例來說,水冷頭10a包含一殼座11a。該殼座11a設置有一入水口111a及一出水口112a。又,該水冷頭10a的一側係用以貼接一發熱源(圖未示)、相對的另一側設置有該入水口111a及該出水口112a。此外,水冷頭10b具有入水口111b及出水口112b,另一水冷頭10c具有入水口111c及出水口112c。
Taking the
複數連接管20串接在相鄰的水冷頭10a、10b及水冷頭10b、10c之間。舉例而言,連接管20的一端連接相鄰水冷頭10a、10b中一水冷頭10a的出水口112a、另一端連接另一水冷頭10b的入水口111b。又,連接管20以相同連接方式連接相鄰水冷頭10b、10c,從而使該些相鄰水冷頭10a、10b、10b形成串聯式的水冷頭10。
A plurality of connecting
再者,入水管30連接串聯的水冷頭10中最外側之一水冷頭10a的入水口111a。出水管40連接串聯的水冷頭10之中最外側之另一水冷頭10c的出水口112c。又,該入水端水泵50設置在該入水管30上。該出水端水泵60設置在該出水管40上。
Moreover, the water inlet
進一步而言,該入水端水泵50及該出水端水泵60設定有不同的泵浦壓力值。較佳地,該入水端水泵50的泵浦壓力為正壓,該出水端水泵60的泵浦壓力為負壓。此外,該入水端水泵50的泵浦壓力大於該出水端水泵60的泵浦壓力。
Furthermore, the
據此,該串聯式水冷散熱結構1透過該入水端水泵50及該出水端水泵60設定不同的泵浦壓力值,另可隨時調整該入水端水泵50及該出水端水泵60的壓力及流量,藉此在最小壓力下即能夠達到均流、均溫的功效,因而具備節能的效果。
Accordingly, the serial
請參照圖3及圖4。以水冷頭10a舉例而言,水冷頭10a包含殼座11a,且殼座11a設置有入水口111a及出水口112a。又,該殼座11a包含一下座12a及一上座13a。該下座12a具有一下容腔120a,且該下容腔120a中設置有複數水冷鰭片14a。具體而言,該上座13a設置有該入水口111a及該出水口112a,且該上座13a結合該下座12a並罩合該下容腔120a。
Please refer to Figure 3 and Figure 4. Taking the
於本發明的一實施例中,水冷頭10a更包括一密封條15a。該密封條15a係夾設在該下座12a及該上座13a之間,藉以維持兩者之間的密封性。要說明的是,該入水口111a及該出水口112a係大致位於該上座13a的中間位置,以利該水冷頭10a內部的工作流體能夠均勻流動。
In an embodiment of the present invention, the
再者,該水冷頭10a另包含複數散熱鰭片16a。該些散熱鰭片16a設置在該上座13a的二側邊,藉以增加散熱面積,進而提高散熱效率。此外,該入水口111a及該出水口112a係以前、後排列的方式設置在該上座13a二側的散熱鰭片16a之間。
Furthermore, the
以上所述僅為本發明之較佳實施例,非用以定本發明之專利範圍,其他運用本發明之專利精神之等效變化,均應俱屬本發明之專利範圍。 The above descriptions are only preferred embodiments of the present invention, and are not used to define the patent scope of the present invention. Other equivalent changes using the patent spirit of the present invention should all belong to the patent scope of the present invention.
1:串聯式水冷散熱結構 1: Series water cooling heat dissipation structure
10、10a~10c:水冷頭 10, 10a~10c: water cooling head
111a~111c:入水口 111a~111c: water inlet
112a~112c:出水口 112a~112c: water outlet
20:連接管 20: connecting pipe
30:入水管 30: water inlet pipe
40:出水管 40: Outlet pipe
50:入水端水泵 50: Inlet water pump
60:出水端水泵 60:Water outlet pump
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TW111101091A TWI790889B (en) | 2022-01-11 | 2022-01-11 | Series type water cooling structure |
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TW111101091A TWI790889B (en) | 2022-01-11 | 2022-01-11 | Series type water cooling structure |
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TW202329797A TW202329797A (en) | 2023-07-16 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3137576U (en) * | 2007-09-18 | 2007-11-29 | ▲黄▼ 崇賢 | Horizontal heat dissipation device |
CN101583262A (en) * | 2008-05-16 | 2009-11-18 | 宏碁股份有限公司 | Liquid-cooled heat dissipation device |
JP2019125734A (en) * | 2018-01-18 | 2019-07-25 | 富士通株式会社 | Cooling apparatus |
TWM612914U (en) * | 2021-03-17 | 2021-06-01 | 奇鋐科技股份有限公司 | Liquid-cooling heat dissipation structure |
TWM627038U (en) * | 2022-01-11 | 2022-05-11 | 大訊科技股份有限公司 | Water cooling heat dissipation structure in serial connection |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3137576U (en) * | 2007-09-18 | 2007-11-29 | ▲黄▼ 崇賢 | Horizontal heat dissipation device |
CN101583262A (en) * | 2008-05-16 | 2009-11-18 | 宏碁股份有限公司 | Liquid-cooled heat dissipation device |
JP2019125734A (en) * | 2018-01-18 | 2019-07-25 | 富士通株式会社 | Cooling apparatus |
TWM612914U (en) * | 2021-03-17 | 2021-06-01 | 奇鋐科技股份有限公司 | Liquid-cooling heat dissipation structure |
TWM627038U (en) * | 2022-01-11 | 2022-05-11 | 大訊科技股份有限公司 | Water cooling heat dissipation structure in serial connection |
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