TWI790878B

TWI790878B - Display system and a pad configuration adaptable thereto

Info

Publication number: TWI790878B
Application number: TW110149123A
Authority: TW
Inventors: 王惠民; 張耀光
Original assignee: 奇景光電股份有限公司
Priority date: 2021-12-28
Filing date: 2021-12-28
Publication date: 2023-01-21
Also published as: TW202326243A

Abstract

A pad configuration adaptable to a display system includes a plurality of input bond pads, via which a driver of the display system is mounted and signals are inputted to the driver; and a plurality of output bond pads, via which the driver is mounted and signals are outputted to a display panel of the display system. Input and output bond pads corresponding to one of two neighboring drivers are point symmetric with input and output bond pads corresponding to the other of the two neighboring drivers.

Description

顯示系統及適用於顯示系統的墊片配置Display system and gasket configuration suitable for display system

本發明係有關一種顯示系統，特別是關於一種適用於顯示系統的墊片配置。The present invention relates to a display system, and more particularly to a spacer arrangement suitable for a display system.

液晶顯示器為平板顯示器的一種，其藉由液晶的光調制特性以進行顯示。液晶顯示器可廣泛使用於各種應用，例如液晶電視、電腦螢幕及行動電話面板。A liquid crystal display is a type of flat panel display, which uses the light modulation properties of liquid crystals to display. Liquid crystal displays can be used in a wide variety of applications, such as LCD TVs, computer monitors, and mobile phone panels.

於傳統液晶顯示器，其玻璃面板與驅動該玻璃面板的驅動積體電路係接合於印刷電路板。為了降低印刷電路板面積與所需連接數目，且提供更多彈性，因此提出一種晶片薄膜接合(chip on film, COF)技術，用以將驅動積體電路接合於薄膜(例如軟性印刷電路板)。為了更降低接合面積，因此提出一種晶片玻璃接合(chip on glass, COG)技術，用以將驅動積體電路接合於玻璃面板的邊框區域。In a conventional liquid crystal display, the glass panel and the driving IC for driving the glass panel are bonded to a printed circuit board. In order to reduce the printed circuit board area and the number of required connections, and provide more flexibility, a chip on film (COF) technology is proposed to bond the driver integrated circuit to the film (such as a flexible printed circuit board) . In order to further reduce the bonding area, a chip on glass (COG) technology is proposed to bond the driving integrated circuit to the frame area of the glass panel.

然而，傳統液晶顯示器的玻璃邊框區域未能有效利用，浪費了許多面積。因此亟需提出一種新穎的液晶顯示器，以克服傳統液晶顯示器的缺失，實質降低玻璃面板的邊框。However, the glass frame area of conventional LCDs is not effectively utilized, wasting a lot of area. Therefore, it is urgent to propose a novel liquid crystal display to overcome the deficiency of the traditional liquid crystal display and substantially reduce the frame of the glass panel.

鑑於上述，本發明實施例的目的之一在於提出一種適用於顯示系統的墊片配置，使得晶片玻璃接合可有效利用顯示面板的邊框區域。In view of the above, one of the objectives of the embodiments of the present invention is to provide a spacer configuration suitable for a display system, so that wafer-glass bonding can effectively utilize the frame area of the display panel.

根據本發明實施例，顯示系統包含顯示面板、二相鄰驅動器、印刷電路板、軟性平連接線、複數輸入接合墊片及複數輸出接合墊片。顯示面板包含像素。二相鄰驅動器驅動顯示面板的像素。軟性平連接線電性連接於二相鄰驅動器與印刷電路板之間。驅動器藉由輸入接合墊片以進行接合，且信號藉由輸入接合墊片以輸入至驅動器。驅動器藉由輸出接合墊片以進行接合，且信號藉由輸出接合墊片以輸出至顯示面板。相應於二相鄰驅動器其中之一的輸入、輸出接合墊片，與相應於二相鄰驅動器之另一個的輸入、輸出接合墊片，兩者互為點對稱。According to an embodiment of the present invention, the display system includes a display panel, two adjacent drivers, a printed circuit board, flexible flat connecting wires, a plurality of input bonding pads and a plurality of output bonding pads. Display panels contain pixels. Two adjacent drivers drive the pixels of the display panel. The flexible flat connection wire is electrically connected between two adjacent drivers and the printed circuit board. The driver is bonded through the input bonding pad, and the signal is input to the driver through the input bonding pad. The driver is bonded through the output bonding pads, and the signal is output to the display panel through the output bonding pads. The input and output bonding pads corresponding to one of the two adjacent drivers are point-symmetrical to the input and output bonding pads corresponding to the other of the two adjacent drivers.

第一圖顯示本發明實施例之顯示系統100的透視圖。在本實施例中，顯示系統100可包含液晶顯示器。本實施例之顯示系統100可包含顯示面板110，其包含像素，並具有玻璃表面。The first figure shows a perspective view of a display system 100 according to an embodiment of the present invention. In this embodiment, the display system 100 may include a liquid crystal display. The display system 100 of this embodiment may include a display panel 110 including pixels and having a glass surface.

在本實施例中，顯示系統100可包含複數驅動器120(例如圖示的二個驅動器)，用以驅動顯示面板110的像素。在一實施例中，驅動器120使用晶片玻璃接合(chip on glass, COG)技術(其為表面接合技術的一種)，以接合於顯示面板110的玻璃表面。因此，在本說明書中，驅動器120也稱為晶片玻璃接合裝置。在本實施例中，驅動器120可為觸控與顯示驅動整合(touch and display driver integration, TDDI)積體電路，用以控制顯示系統100的顯示與觸控功能。In this embodiment, the display system 100 may include a plurality of drivers 120 (such as the two drivers shown in the figure) for driving the pixels of the display panel 110 . In one embodiment, the driver 120 is bonded to the glass surface of the display panel 110 using chip on glass (COG) technology (which is a type of surface bonding technology). Therefore, in this specification, the driver 120 is also referred to as a wafer glass bonding device. In the present embodiment, the driver 120 may be a touch and display driver integration (TDDI) integrated circuit for controlling the display and touch functions of the display system 100 .

本實施例之顯示系統100可包含軟性印刷電路板(flexible printed circuit, FPC)130，電性連接於驅動器120與(設於印刷電路板150之)控制器140之間。在本說明書中，軟性印刷電路板130也可稱為軟性平連接線(flat flexible cable)，其至少一部份為可彎。根據另一實施例，驅動器120使用晶片薄膜接合(chip on film, COF)技術(其為表面接合技術的一種)，以接合於軟性印刷電路板130。因此，在本說明書中，驅動器120也稱為晶片薄膜接合裝置。The display system 100 of this embodiment may include a flexible printed circuit (FPC) 130 electrically connected between the driver 120 and the controller 140 (disposed on the printed circuit board 150 ). In this specification, the flexible printed circuit board 130 can also be referred to as a flat flexible cable, at least a part of which is bendable. According to another embodiment, the driver 120 is bonded to the flexible printed circuit board 130 using chip on film (COF) technology (which is a type of surface bonding technology). Therefore, in this specification, the driver 120 is also referred to as a wafer thin film bonding device.

根據本實施例的特徵之一，如第一圖所例示，軟性印刷電路板130實質對齊於二相鄰驅動器120之間的間隙，因而共享於該二相鄰驅動器120。第二圖顯示第一圖之顯示系統100的側視圖，顯示了顯示面板110的一部份、二相鄰驅動器120、軟性印刷電路板130及印刷電路板150。According to one of the characteristics of this embodiment, as illustrated in the first figure, the flexible printed circuit board 130 is substantially aligned with the gap between two adjacent drivers 120 , and thus shared with the two adjacent drivers 120 . The second figure shows a side view of the display system 100 of the first figure, showing a part of the display panel 110 , two adjacent drivers 120 , a flexible printed circuit board 130 and a printed circuit board 150 .

第三A圖顯示本發明實施例之(第一圖)顯示系統100的上視圖。本實施例之顯示面板110可包含複數輸入接合墊片111(相應於一驅動器120)，例如墊片a~h，設於顯示面板110的玻璃表面。驅動器120可藉由輸入接合墊片111以接合於顯示面板110，且(電氣)信號可藉由輸入接合墊片111而從印刷電路板150輸入至驅動器120。值得注意的是，輸入電路區域112相應於驅動器120之輸入電路(用以處理輸入信號)，可相鄰於輸入接合墊片111。FIG. 3 A shows a top view of the display system 100 of the embodiment of the present invention (FIG. 1). The display panel 110 of this embodiment may include a plurality of input bonding pads 111 (corresponding to a driver 120 ), such as pads a~h, disposed on the glass surface of the display panel 110 . The driver 120 can be bonded to the display panel 110 through the input bonding pad 111 , and (electrical) signals can be input from the printed circuit board 150 to the driver 120 through the input bonding pad 111 . It should be noted that the input circuit region 112 corresponds to the input circuit of the driver 120 (for processing input signals), and may be adjacent to the input bonding pad 111 .

本實施例之顯示面板110可包含複數輸出接合墊片113(相應於一驅動器120)，例如墊片1~16，設於顯示面板110的玻璃表面。驅動器120可藉由輸出接合墊片113以接合於顯示面板110，且(電氣)信號可藉由輸出接合墊片113而輸出至顯示面板110的像素。The display panel 110 of this embodiment may include a plurality of output bonding pads 113 (corresponding to a driver 120 ), such as pads 1 to 16 , disposed on the glass surface of the display panel 110 . The driver 120 can be bonded to the display panel 110 through the output bonding pads 113 , and (electrical) signals can be output to the pixels of the display panel 110 through the output bonding pads 113 .

本實施例之顯示面板110可包含至少一定位標記(alignment mark)114(相應於一驅動器120)，設於顯示面板110的玻璃表面，用於接合時驅動器120與輸入/輸出接合墊片111/113的定位。定位標記114可設於驅動器120的相應角落。The display panel 110 of this embodiment may include at least one alignment mark (alignment mark) 114 (corresponding to a driver 120), which is arranged on the glass surface of the display panel 110, and is used for bonding the driver 120 and the input/output bonding pad 111/ 113 positioning. The positioning marks 114 can be disposed on corresponding corners of the driver 120 .

根據本實施例的另一特徵，相應於二相鄰驅動器120其中之一的輸入/輸出接合墊片111/113(及定位標記114)的墊片配置，與相應於該二相鄰驅動器120之另一個的輸入/輸出接合墊片111/113(及定位標記114)的墊片配置，兩者互為點對稱(point symmetric)或中心對稱(centrally symmetric)。換句話說，輸入/輸出接合墊片111/113(及定位標記114)的墊片配置經旋轉180度後是不變的。因此，二相鄰驅動器120其中之一的引腳(pin)配置與該二相鄰驅動器120之另一個的引腳配置，兩者互為點對稱(或中心對稱)。According to another feature of this embodiment, the pad configuration corresponding to the input/output bonding pads 111/113 (and alignment marks 114) of one of the two adjacent drivers 120 is the same as that corresponding to the two adjacent drivers 120. Another pad configuration of the input/output pads 111 / 113 (and the alignment mark 114 ) is point symmetric or centrally symmetric to each other. In other words, the pad configuration of the I/O bond pads 111/113 (and alignment marks 114) is unchanged after being rotated 180 degrees. Therefore, the pin configuration of one of the two adjacent drivers 120 is point-symmetric (or center-symmetric) to the pin configuration of the other of the two adjacent drivers 120 .

第三B圖顯示本發明另一實施例之(第一圖)顯示系統100的上視圖。第三B圖之實施例類似於第三A圖之實施例，不同的地方在於，第三A圖之輸入接合墊片111排列成列(亦即橫向(landscape)排列)，然而第三B圖之輸入接合墊片111排列成行(亦即直向(portrait)排列)。FIG. 3B shows a top view of a display system 100 according to another embodiment of the present invention (FIG. 1). The embodiment of the third figure B is similar to the embodiment of the third figure A, the difference is that the input bonding pads 111 of the third figure A are arranged in columns (that is, arranged in a landscape), but the third figure B The input bonding pads 111 are arranged in rows (ie, arranged in portrait).

第四圖顯示未採用本實施例第三A圖/第三B圖之特徵的顯示系統200的上視圖。值得注意的是，顯示系統200的輸入接合墊片201、輸出接合墊片202及定位標記203並未如第三A圖/第三B圖一般具有點對稱特性。因此，每一個驅動器21需相應於二組輸入接合墊片201及關聯的輸入電路區域204，然而僅有一組會實際使用到(另一組因此浪費掉)。舉例而言，第四圖所示左手邊的驅動器21僅使用其右手邊的輸入接合墊片201(及關聯的輸入電路區域204)，但是捨棄左手邊的輸入接合墊片201(及關聯的輸入電路區域204)。類似的情形，右手邊的驅動器21僅使用其左手邊的輸入接合墊片201(及關聯的輸入電路區域204)，但是捨棄右手邊的輸入接合墊片201(及關聯的輸入電路區域204)。因此，第四圖之墊片的指定區域當中，有一大部分浪費掉而未能有效利用。Figure 4 shows a top view of a display system 200 that does not adopt the features in Figure 3 A/Figure 3 B of this embodiment. It should be noted that the input bonding pads 201 , output bonding pads 202 and positioning marks 203 of the display system 200 do not have point symmetry as in the third figure A/third B figure. Thus, each driver 21 needs to correspond to two sets of input bond pads 201 and associated input circuit areas 204, however only one set is actually used (the other set is thus wasted). For example, the left-hand driver 21 shown in FIG. 4 uses only its right-hand input bond pad 201 (and associated input circuit area 204), but discards the left-hand input bond pad 201 (and associated input circuit area 204). circuit area 204). Similarly, the right-hand driver 21 uses only its left-hand input bond pad 201 (and associated input circuit area 204 ), but discards the right-hand input bond pad 201 (and associated input circuit area 204 ). Therefore, in the designated area of the pad in the fourth figure, a large part is wasted and cannot be effectively utilized.

以上所述僅為本發明之較佳實施例而已，並非用以限定本發明之申請專利範圍；凡其它未脫離發明所揭示之精神下所完成之等效改變或修飾，均應包含在下述之申請專利範圍內。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention; all other equivalent changes or modifications that do not deviate from the spirit disclosed by the invention should be included in the following within the scope of the patent application.

100:顯示系統 110:顯示面板 111:輸入接合墊片 112:輸入電路區域 113:輸出接合墊片 114:定位標記 120:驅動器 130:軟性印刷電路板 140:控制器 150:印刷電路板 200:顯示系統 201:輸入接合墊片 202:輸出接合墊片 203:定位標記 204:輸入電路區域 21:驅動器 1~16:墊片 a~h:墊片 100: display system 110: display panel 111: Input joint gasket 112: Input circuit area 113: Output bonding pad 114: positioning mark 120: drive 130: flexible printed circuit board 140: Controller 150: printed circuit board 200: display system 201: Input joint gasket 202: Output bonding pad 203: positioning mark 204: input circuit area 21: drive 1~16: Gasket a~h: Gasket

第一圖顯示本發明實施例之顯示系統的透視圖。第二圖顯示第一圖之顯示系統的側視圖。第三A圖顯示本發明實施例之(第一圖)顯示系統的上視圖。第三B圖顯示本發明另一實施例之(第一圖)顯示系統的上視圖。第四圖顯示未採用本實施例第三A圖/第三B圖之特徵的顯示系統的上視圖。 The first figure shows a perspective view of a display system according to an embodiment of the present invention. The second figure shows a side view of the display system of the first figure. The third figure A shows the top view of the (first figure) display system of the embodiment of the present invention. Figure 3B shows the top view of the display system (Figure 1) of another embodiment of the present invention. Figure 4 shows a top view of a display system that does not adopt the features of Figure 3 A/Figure 3 B of this embodiment.

100:顯示系統 100: display system

110:顯示面板 110: display panel

111:輸入接合墊片 111: Input joint gasket

112:輸入電路區域 112: Input circuit area

113:輸出接合墊片 113: Output bonding pad

114:定位標記 114: positioning mark

120:驅動器 120: drive

130:軟性印刷電路板 130: flexible printed circuit board

1~16:墊片 1~16: Gasket

a~h:墊片 a~h: Gasket

Claims

一種適用於顯示系統的墊片配置，包含：複數輸入接合墊片，藉以讓該顯示系統的驅動器進行接合，且藉以讓信號輸入至該驅動器；複數輸出接合墊片，藉以讓該驅動器進行接合，且藉以讓信號輸出至該顯示系統的顯示面板；及至少一定位標記，相應於每一個驅動器，用於接合時該每一個驅動器與相應輸入、輸出接合墊片之間的定位；其中相應於二相鄰驅動器其中之一的輸入、輸出接合墊片，與相應於該二相鄰驅動器之另一個的輸入、輸出接合墊片，兩者互為點對稱。 A pad arrangement for a display system comprising: a plurality of input bonding pads for bonding a driver of the display system and for allowing a signal to be input to the driver; a plurality of output bonding pads for bonding the driver, And so as to allow the signal output to the display panel of the display system; and at least one positioning mark, corresponding to each driver, for positioning between the each driver and the corresponding input and output bonding pads when bonding; wherein corresponding to two The input and output bonding pads of one of the adjacent drivers are point-symmetrical to the input and output bonding pads corresponding to the other of the two adjacent drivers.

如請求項1之適用於顯示系統的墊片配置，其中該複數輸入接合墊片與該複數輸出接合墊片使用晶片玻璃接合技術，以設於該顯示面板的玻璃表面。 According to claim 1, the gasket configuration applicable to a display system, wherein the plurality of input bonding pads and the plurality of output bonding pads are disposed on the glass surface of the display panel using wafer glass bonding technology.

如請求項1之適用於顯示系統的墊片配置，其中該複數輸入接合墊片與該複數輸出接合墊片使用晶片薄膜接合技術，以設於軟性平連接線。 According to claim 1, the pad configuration applicable to a display system, wherein the plurality of input bonding pads and the plurality of output bonding pads are arranged on flexible flat connection lines using wafer film bonding technology.

如請求項1之適用於顯示系統的墊片配置，其中相應於該二相鄰驅動器其中之一的定位標記，與相應於該二相鄰驅動器之另一個的定位標記，兩者互為點對稱。 According to claim 1, the spacer configuration applicable to the display system, wherein the positioning mark corresponding to one of the two adjacent drivers and the positioning mark corresponding to the other of the two adjacent drivers are point-symmetrical to each other .

一種顯示系統，包含：一顯示面板，包含像素；二相鄰驅動器，用以驅動該顯示面板的像素；一印刷電路板：一軟性平連接線，電性連接於該二相鄰驅動器與該印刷電路板之間；複數輸入接合墊片，藉以讓驅動器進行接合，且藉以讓信號輸入至該驅動器；複數輸出接合墊片，藉以讓該驅動器進行接合，且藉以讓信號輸出至該顯示面板；及至少一定位標記，相應於每一個驅動器，用於接合時該每一個驅動器與相應輸入、輸出接合墊片之間的定位；其中相應於該二相鄰驅動器其中之一的輸入、輸出接合墊片，與相應於該二相鄰驅動器之另一個的輸入、輸出接合墊片，兩者互為點對稱。 A display system, comprising: a display panel including pixels; two adjacent drivers for driving the pixels of the display panel; a printed circuit board: a flexible flat connection wire, electrically connected between the two adjacent drivers and the printed circuit board; a plurality of input bonding pads, so as to allow the drivers to be bonded, and to allow signals to be input to the driver; a plurality of output bonding pads, for bonding the driver and for outputting signals to the display panel; and at least one positioning mark corresponding to each driver for positioning between the driver and the corresponding input and output bonding pads during bonding; The input and output bonding pads corresponding to one of the two adjacent drivers are point-symmetrical to the input and output bonding pads corresponding to the other of the two adjacent drivers.

如請求項5之顯示系統，其中該二相鄰驅動器包含觸控與顯示驅動整合積體電路。 The display system according to claim 5, wherein the two adjacent drivers include touch and display driver integrated integrated circuits.

如請求項5之顯示系統，其中該軟性平連接線實質對齊於該二相鄰驅動器之間的間隙，且共享於該二相鄰驅動器。 The display system according to claim 5, wherein the flexible flat connection line is substantially aligned with the gap between the two adjacent drivers, and shared with the two adjacent drivers.

如請求項5之顯示系統，其中該軟性平連接線包含軟性印刷電路板。 The display system according to claim 5, wherein the flexible flat connection line includes a flexible printed circuit board.

如請求項5之顯示系統，其中該複數輸入接合墊片與該複數輸出接合墊片使用晶片玻璃接合技術，以設於該顯示面板的玻璃表面。 The display system according to claim 5, wherein the plurality of input bonding pads and the plurality of output bonding pads are disposed on the glass surface of the display panel using wafer-glass bonding technology.

如請求項5之顯示系統，其中該複數輸入接合墊片與該複數輸出接合墊片使用晶片薄膜接合技術，以設於該軟性平連接線。 The display system according to claim 5, wherein the plurality of input bonding pads and the plurality of output bonding pads are disposed on the flexible flat connection line using wafer film bonding technology.

如請求項5之顯示系統，其中相應於該二相鄰驅動器其中之一的定位標記，與相應於該二相鄰驅動器之另一個的定位標記，兩者互為點對稱。 The display system according to claim 5, wherein the positioning mark corresponding to one of the two adjacent drivers and the positioning mark corresponding to the other of the two adjacent drivers are point-symmetrical to each other.