TWI788919B - touch sensor - Google Patents
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- TWI788919B TWI788919B TW110126148A TW110126148A TWI788919B TW I788919 B TWI788919 B TW I788919B TW 110126148 A TW110126148 A TW 110126148A TW 110126148 A TW110126148 A TW 110126148A TW I788919 B TWI788919 B TW I788919B
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- 239000000758 substrate Substances 0.000 claims abstract description 87
- 230000003287 optical effect Effects 0.000 claims abstract description 10
- 238000001514 detection method Methods 0.000 claims description 89
- 238000004458 analytical method Methods 0.000 claims description 15
- 238000009792 diffusion process Methods 0.000 claims description 10
- 238000002834 transmittance Methods 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 18
- 230000005489 elastic deformation Effects 0.000 description 6
- 238000010191 image analysis Methods 0.000 description 5
- 239000003550 marker Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
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- 229920002379 silicone rubber Polymers 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
- G01L5/166—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using photoelectric means
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Abstract
本發明之觸覺感測器包含感測器基板、彈性構件、被支撐構件、及光發射構件。感測器基板具有配置了可檢測第一波長之光的複數個光感測器之第一面。彈性構件配置於感測器基板之第一面側,且對第一波長具有透過性。被支撐構件支撐於彈性構件,且具有與彈性構件不同之光學特性。光發射構件比彈性構件在感測器基板側被彈性構件覆蓋而配置,並朝向彈性構件發射包含第一波長之光。The touch sensor of the present invention includes a sensor substrate, an elastic member, a supported member, and a light emitting member. The sensor substrate has a first surface configured with a plurality of light sensors capable of detecting light of a first wavelength. The elastic member is disposed on the first surface side of the sensor substrate and has transparency to the first wavelength. The supported member is supported by the elastic member and has different optical characteristics from the elastic member. The light emitting member is arranged to be covered with the elastic member on the sensor substrate side than the elastic member, and emits light including the first wavelength toward the elastic member.
Description
本發明係關於一種觸覺感測器。The present invention relates to a touch sensor.
觸覺感測器藉由各種構成來實現。例如,專利文獻1中揭示之光學式的觸覺感測器包含配置於物體接觸之部分的透明彈性體。在透明彈性體之內部配置有反射光的標識器(Marker)。透明彈性體藉由物體而受到壓力時,標識器之位置因透明彈性體之彈性變形而變化。藉由攝影機檢測該位置變化,可測量物體賦予透明彈性體之力的大小及方向。 [先前技術文獻] [專利文獻]The touch sensor is realized by various configurations. For example, the optical tactile sensor disclosed in Patent Document 1 includes a transparent elastic body disposed on a portion that is in contact with an object. A marker that reflects light is arranged inside the transparent elastic body. When the transparent elastic body is pressed by an object, the position of the marker changes due to the elastic deformation of the transparent elastic body. By detecting the position change with the camera, the magnitude and direction of the force imparted by the object to the transparent elastic body can be measured. [Prior Art Literature] [Patent Document]
[專利文獻1]國際公開第02/18893號[Patent Document 1] International Publication No. 02/18893
(發明所欲解決之問題)(Problem to be solved by the invention)
因為需要用攝影機拍攝標識器,所以光學式之觸覺感測器需要照射在標識器上之光源。結果,光學式之觸覺感測器構成為大型裝置。另外,例如機器人用手抓住物體時,為了調整其抓住力而使用觸覺感測器。假設將觸覺感測器用於此種用途時,特別要求小型化。為了不致縮小壓力之檢測範圍,而形成小型的觸覺感測器,觸覺感測器需要為薄型。Since a camera needs to be used to photograph the marker, an optical touch sensor requires a light source that illuminates the marker. As a result, the optical touch sensor constitutes a large device. In addition, for example, when a robot grasps an object with its hand, it uses a tactile sensor to adjust its grasping force. When a tactile sensor is assumed to be used for such an application, miniaturization is particularly required. In order not to narrow the detection range of the pressure and form a small tactile sensor, the tactile sensor needs to be thin.
本發明之一個目的為將觸覺感測器小型化。 (解決問題之手段)One object of the present invention is to miniaturize the touch sensor. (a means of solving a problem)
本發明一個實施形態提供一種觸覺感測器,係包含感測器基板、彈性構件、被支撐構件及光發射構件。感測器基板係具有配置了可檢測第一波長之光的複數個光感測器之第一面。彈性構件係配置於前述感測器基板之前述第一面側,且對前述第一波長具有透過性。被支撐構件係支撐於前述彈性構件,且具有與前述彈性構件不同之光學特性。光發射構件係比前述彈性構件在前述感測器基板側被前述彈性構件覆蓋而配置,並朝向前述彈性構件發射包含前述第一波長之光。An embodiment of the present invention provides a touch sensor, which includes a sensor substrate, an elastic member, a supported member, and a light emitting member. The sensor substrate has a first surface configured with a plurality of photosensors capable of detecting light of a first wavelength. The elastic member is disposed on the first surface side of the sensor substrate, and is transparent to the first wavelength. The supported member is supported by the elastic member and has different optical properties from the elastic member. The light emitting member is disposed so as to be covered with the elastic member on the sensor substrate side than the elastic member, and emits light including the first wavelength toward the elastic member.
前述光發射構件亦可具有光發射面,並以夾在前述感測器基板與前述彈性構件之間的狀態而配置,並對前述第一波長具有透過性。前述光發射面亦可配置於前述光感測器與前述彈性構件之間。前述光發射構件亦可支撐於前述感測器基板。The light-emitting member may have a light-emitting surface, be disposed sandwiched between the sensor substrate and the elastic member, and be transparent to the first wavelength. The aforementioned light emitting surface can also be disposed between the aforementioned light sensor and the aforementioned elastic member. The aforementioned light emitting member can also be supported on the aforementioned sensor substrate.
前述光發射構件亦可包含夾在前述感測器基板與前述彈性構件之間的面光源。前述面光源亦可包含EL元件。The aforementioned light emitting member may also include a surface light source sandwiched between the aforementioned sensor substrate and the aforementioned elastic member. The aforementioned surface light source may also include an EL element.
前述光發射構件包含光源及用於擴散來自前述光源之光,而導入前述彈性構件的光擴散板,前述光擴散板亦可被前述彈性構件與前述感測器基板夾著。The light emitting member includes a light source and a light diffusion plate for diffusing the light from the light source and introduced into the elastic member. The light diffusion plate can also be sandwiched between the elastic member and the sensor substrate.
前述被支撐構件亦可具有球體形狀。The aforementioned supported member may also have a spherical shape.
前述被支撐構件亦可具有網眼形狀。The aforementioned supported member may also have a mesh shape.
前述感測器基板亦可包含複數個光導入部,其係比前述複數個光感測器配置於前述光發射構件側,並分別對應於該複數個光感測器而配置。The aforementioned sensor substrate may also include a plurality of light-introducing parts, which are arranged on the side of the aforementioned light-emitting member than the aforementioned plurality of photosensors, and are respectively arranged corresponding to the plurality of photosensors.
前述第一波長亦可包含可見光以外之波長。The aforementioned first wavelength may also include wavelengths other than visible light.
前述第一波長亦可包含可見光之波長。The aforementioned first wavelength may also include the wavelength of visible light.
前述感測器基板係影像感測器,且亦可進一步包含解析裝置,其係依前述複數個光感測器之檢測結果解析從前述感測器基板輸出的影像信號,並輸出對前述彈性構件之壓力相關的資訊。The aforementioned sensor substrate is an image sensor, and may further include an analysis device, which analyzes the image signal output from the aforementioned sensor substrate according to the detection results of the aforementioned plurality of photosensors, and outputs to the aforementioned elastic member information about stress.
前述感測器基板係事件檢測型感測器,且亦可進一步包含解析裝置,其係依前述複數個光感測器之檢測結果解析從前述感測器基板輸出的事件資訊信號,並輸出對前述彈性構件之壓力相關的資訊。 (發明之效果)The aforementioned sensor substrate is an event detection sensor, and may further include an analysis device, which analyzes the event information signal output from the aforementioned sensor substrate according to the detection results of the plurality of photosensors, and outputs a corresponding Information related to the pressure of the aforementioned elastic member. (effect of invention)
採用本發明時,可將觸覺感測器小型化。According to the present invention, the touch sensor can be miniaturized.
以下,參照圖式詳係說明本發明一種實施形態之觸覺感測器。以下顯示之實施形態係一例,本發明並非限定於此等實施形態而解釋者。另外,本實施形態參照之圖式中,在具有相同部分或同樣功能之部分附加相同符號或類伺服號(在數字之後僅附加A、B等之符號),而省略其重複說明。此外,圖式之尺寸比率為了方便說明而與實際的比率不同,或是從圖式省略構成的一部分。 <第一種實施形態> [1.觸覺感測器之構成]Hereinafter, a touch sensor according to an embodiment of the present invention will be described in detail with reference to the drawings. The embodiments shown below are examples, and the present invention should not be interpreted as being limited to these embodiments. In addition, in the drawings referred to in this embodiment, the same symbols or servo-like numbers are attached to the same parts or parts with the same functions (only symbols such as A and B are added after the numbers), and repeated descriptions thereof are omitted. In addition, the dimensional ratios of the drawings are different from the actual ratios for convenience of explanation, or a part of the configuration is omitted from the drawings. <The first embodiment> [1. Composition of the touch sensor]
圖1係顯示本發明第一種實施形態之觸覺感測器的構成圖。圖2係說明本發明第一種實施形態之檢測裝置的構造圖。觸覺感測器1包含包括壓力檢測面60a之檢測裝置10、及解析裝置90。圖1所示之觸覺感測器中,關於檢測裝置10係假設與壓力檢測面60a垂直之剖面構造而圖示。圖2係用於容易瞭解檢測裝置10之各構成而說明的圖,且對應於分解立體圖。檢測裝置10包含影像感測器基板20、光發射構件40、彈性構件60及反射構件80。FIG. 1 is a diagram showing the configuration of a touch sensor according to the first embodiment of the present invention. Fig. 2 is a structural diagram illustrating a detection device according to a first embodiment of the present invention. The touch sensor 1 includes a
影像感測器基板20包含基板21、光檢測部25及光導入部28。基板21由具有剛性之材料,如由陶瓷等無機材料而形成。基板21只要比彈性構件60具有剛性即可,不限定於陶瓷,例如亦可由有機材料形成。光檢測部25包含複數個光感測器26。本例係複數個光感測器26在影像感測器基板20之第一面20a側配置成矩陣狀。The
光導入部28具有複數個開口部29,並覆蓋光檢測部25。複數個開口部29分別配置於與複數個光感測器26之各個對應的位置。開口部29具有針孔形狀,限定從光發射構件40側到達之光,並導入配置在對應於其開口部29之位置的光感測器26。由於開口部29只要可將光導入光感測器26即可,因此開口部29之內部亦可充填透明的構件。開口部29之形狀例如最好設定成來自反射構件80之反射光對光感測器26有效到達。The
以下,在本說明書中所謂「透明」,是指從光發射構件40發射之光中,對至少一部分波長之光(第一波長之光)具有透過性。如後述,該光不限於係可見光的情況。所謂具有透過性,並非藉由對其波長之透過率而明確規定者,只要是可實現作為本說明書中說明之觸覺感測器的功能之透過率的範圍即可。Hereinafter, the term "transparent" in this specification means that the light emitted from the
影像感測器基板20輸出依光感測器26之檢測結果的信號。光感測器26可檢測第一波長之光。這表示光感測器26至少可檢測第一波長之光,而並非僅檢測第一波長之光。該信號顯示依配置成矩陣狀之光感測器26的檢測結果之影像。該影像如後述包含顯示反射構件80之位置的資訊。The
光發射構件40係透明之構件,且係配置於影像感測器基板20之第一面20a側的面光源。光發射構件40在本例係構成被透明導電層夾著之有機EL的發光元件,且藉由接受電力供給而發射光。發射之光波長亦可係可見光以外之其他波長範圍(例如,紅外光、紫外光),且不限於可見光以外之波長,亦可係可見光波長,亦可係可見光以外之波長與可見光波長兩者。光發射構件40不限於有機EL元件,亦可係無機EL元件。The
彈性構件60例如係矽橡膠等透明之彈性體。彈性構件60配置於光發射構件40之兩面中與影像感測器基板20相對之面相反側的面。因此,光發射構件40藉由彈性構件60與影像感測器基板20夾著。彈性構件60之兩面中,與光發射構件40相反側之面係壓力檢測面60a。例如,藉由物體1000對壓力檢測面60a之壓力而彈性構件60彈性變形。此時,在彈性構件60中影像感測器基板20側之面(與壓力檢測面60a相反側之面)側,因為藉由影像感測器基板20(基板21)之剛性支撐,所以彈性構件60在壓力檢測面60a側大幅變形。對壓力檢測面60a之壓力不限於在與面垂直方向施加時,亦可在沿著面之方向施加。The
反射構件80具有球體形狀,且係具有與彈性構件60不同之光學特性的彈性構件。此處所謂球體形狀,不限於係完全之球,係表示概略球體者,且容許有一些變形的概念。反射構件80亦可並非彈性構件。反射構件80藉由具有與彈性構件60不同之光學特性,而反射來自光發射構件40的光。換言之,反射構件80中可反射來自光發射構件40之光者,可以說包圍反射構件80之彈性構件60與反射構件80具有不同的光學特性。The
複數個反射構件80在彈性構件60內部,在與第一面20a概略平行之面內配置成矩陣狀的狀態下支撐於彈性構件60。複數個反射構件80不限於配置在彈性構件60之內部的情況,例如亦可沿著壓力檢測面60a而配置。複數個反射構件80只須配置於追隨彈性構件60藉由對壓力檢測面60a之壓力而彈性變形來移動的位置即可,亦即,只須支撐於彈性構件60即可。反射構件80不限於具有球體形狀之情況,還可採用各種形態。The plurality of
返回圖1繼續說明。解析裝置90包含影像解析部95及電力供給部98。電力供給部98供給在檢測裝置10中消耗的電力。例如,該電力用於在光發射構件40中發光及影像感測器基板20之動作。電力供給源亦可係與解析裝置90以外的裝置。Return to Figure 1 to continue the description. The
影像解析部95解析從檢測裝置10(影像感測器基板20)輸出之信號(以下,有時稱影像信號),算出並輸出檢測裝置10對壓力檢測面60a施加之壓力相關的資訊(例如,壓力大小、壓力方向)。關於具體之解析方法於後述。以上係說明觸覺感測器1之構造。
[檢測原理]The
其次,說明觸覺感測器1檢測壓力之原理。此處,係假設壓力檢測面60a從物體1000接受壓力時在構造上產生變化(彈性構件60及反射構件80之變化)。Next, the principle of detecting pressure by the touch sensor 1 will be described. Here, it is assumed that the
圖3係顯示對壓力檢測面而從物體接受壓力時之反射構件的位置變化之一例圖。假設物體1000對壓力檢測面60a施加壓力。本例其壓力施加之方向與壓力檢測面60a垂直。以下之說明將該方向稱為z方向,將與z方向垂直且在圖3之左方向稱為x方向,並將與z方向與x方向垂直之方向稱為y方向。Fig. 3 is a diagram showing an example of the position change of the reflection member when the pressure detection surface receives pressure from an object. Assume that the
物體1000對壓力檢測面60a在z方向施加壓力時,彈性構件60變形。如圖1所示,物體1000從壓力檢測面60a離開時,彈性構件60藉由彈性力而恢復原來形狀。When the
彈性構件60變形時,反射構件80追隨其變形而移動。圖3所示之例。反射構件80移動後之位置以實線表示,原來位置以虛線表示。如圖示,彈性構件60藉由物體1000彈性變形而在z方向(接近影像感測器基板20之方向)壓縮,反射構件80相對地在z方向移動。在物體1000之周邊部,壓力成分不僅在z方向,亦存在於x方向等xy平面方向。因此,存在於物體1000周邊部之反射構件80的移動方向也具有z方向以外的成分(xy平面方向的成分)。When the
由於光發射構件40如上述係面光源,因此至少發射朝向影像感測器基板20之光(以下,例示為光Ld1、Ld2、Ld3)及朝向彈性構件60之光(以下,例示為光Lr1、Lr2、Lr3)。亦即,光發射構件40在影像感測器基板20側與彈性構件60側具有光發射面。Since the
光Ld1、Ld2、Ld3皆到達光檢測部25。光Lr1透過彈性構件60而從壓力檢測面60a放出外部。藉由放出之光Lr1被某物體反射,或在壓力檢測面60a中反射,光Lr1之一部分亦有時返回光檢測部25。例如,物體1000中假設不與壓力檢測面60a接觸的部分。光Lr2透過彈性構件60在反射構件80中反射而到達光檢測部25。光Lr3透過彈性構件60在與壓力檢測面60a接觸之部分的物體1000中反射,並到達光檢測部25。藉由此等光到達光檢測部25,關於藉由影像感測器基板20獲得之影像使用圖4及圖5作說明。All the lights Ld1 , Ld2 , and Ld3 reach the
圖4係顯示對壓力檢測面而從物體接受壓力時之反射構件的拍攝影像之一例圖。本例在圖3所示之狀況中,顯示藉由影像感測器基板20獲得之影像。來自光發射構件40之光Ld1、Ld2、Ld3作為面光源之整體光而到達影像感測器基板20的光檢測部25,不過光Lr2、Lr3亦作為反射光而到達。因此,藉由將光Ld1、Ld2、Ld3之成分作為背景而除去,並取出光Lr2之成分可獲得反射構件80的影像。此外,藉由取出光Lr3之成分可獲得物體1000(特別是與壓力檢測面60a接觸之部分)的影像。FIG. 4 is a diagram showing an example of a captured image of the reflection member when the pressure detection surface receives pressure from an object. In this example, in the situation shown in FIG. 3 , an image obtained by the
按照圖4,在物體1000正下方之反射構件80(例如80d1)在z方向移動而接近影像感測器基板20。結果,反射構件80d1獲得比移動前之反射構件80大的影像。對應於物體1000之周邊部的位置之反射構件80中,反射構件80d2係以對物體1000擠出外側之方式移動。結果,反射構件80d2獲得對移動前之反射構件80從物體1000離開的方向(圖4之例係X方向)移動的影像。反射構件80d3亦同樣獲得對移動前之反射構件80從物體1000離開的方向(圖4之例係合成X方向與Y方向之方向)移動的影像。由於反射構件80d2、80d3皆亦含有向z方向的移動,因此與反射構件80d1同樣地,獲得比移動前之反射構件80大的影像,不過係獲得比反射構件80d1小之影像。According to FIG. 4 , the reflective member 80 (for example, 80d1 ) directly below the
圖5係顯示對壓力檢測面而從物體接受壓力時之反射構件的拍攝影像之一例圖。圖4係假設物體1000對壓力檢測面60a在z方向施加壓力,而圖5係假設物體1000對壓力檢測面60a,除了z方向亦在x方向施加壓力。按照圖5,對應於反射構件80d1之位置的反射構件80d4獲得比反射構件80d1向x方向移動之影像。Fig. 5 is a diagram showing an example of a captured image of the reflective member when the pressure detection surface receives pressure from an object. FIG. 4 assumes that the
上述之影像解析部95藉由解析如此以影像感測器基板20取得之影像,而取得關於複數個反射構件80之各個變化資訊(大小之變化、位置變化及位置之變化量)。因為在影像上反射構件80之大小改變,所以反射構件80之位置作為反射構件80的重心(本例因為反射構件80係球體,所以在影像上相當於圓的中心)來處理。The above-mentioned
影像解析部95依據變化資訊算出關於物體1000對壓力檢測面60a之壓力的觸覺資訊。觸覺資訊例如表示對應於壓力檢測面60a在xy平面之各座標的大小及方向,亦可說是在各座標之壓力的向量資訊。此時,亦可用於算出從影像獲得之物體1000(特別是接觸壓力檢測面60a之部分)的位置。The
以上,一種實施形態之觸覺感測器1具有在影像感測器基板20與彈性構件60之間夾著成為面光源之光發射構件40的構成。彈性構件60及光發射構件40藉由對於從光發射構件40發射之光係透明,即使將光發射構件40夾在影像感測器基板20與彈性構件60之間,仍可以影像感測器基板20檢測來自配置於彈性構件60之反射構件80的反射光。As described above, the touch sensor 1 according to one embodiment has a structure in which the
採用該構成時,因為可將對反射構件80提供光之光源作為非常薄之面光源而配置,因此可將觸覺感測器1小型化(薄型化)。藉由影像感測器基板20比彈性構件60具有剛性,亦可使影像感測器基板20(基板21)發揮功能作為用於支撐在壓力檢測面60a接受壓力之彈性構件60的構件。According to this structure, since the light source which supplies light to the
藉由彈性構件60覆蓋光發射構件40,光發射構件40從反射構件80之正下方(沿著z方向之方向)對反射構件80發射光,來自反射構件80之反射光在z方向前進而到達影像感測器基板20。因而,在各種影像處理(例如透視轉換)中可減少處理負荷。藉由將反射構件80形成球體亦可減少影像處理之負荷。來自光發射構件40之光係紅外光等可見光以外的光情況下,也會無法辨識從壓力檢測面60a漏出之光。
<第二種實施形態>With the
第二種實施形態係取代面光源之光發射構件40,而就虛擬地具有形成面光源之光發射構件40A的檢測裝置10A作說明。In the second embodiment, instead of the
圖6係說明本發明第二種實施形態之檢測裝置的構造圖。檢測裝置10A包含光發射構件40A。因為光發射構件40A以外之構成與第一種實施形態相同,所以省略其說明。Fig. 6 is a structural diagram illustrating a detection device according to a second embodiment of the present invention. The
光發射構件40A包含:光擴散板45及光源48。光擴散板45在影像感測器基板20之第一面20a側,夾在彈性構件60與影像感測器基板20之間而配置。光源48例如光擴散板45從光源48提供光,將該光至少擴散至彈性構件60側,並且對該光亦具有透過性。The
從光擴散板45發射至彈性構件60之光在反射構件80反射。該反射光透過光擴散板45而到達光檢測部25。由於光擴散板45具有光之擴散效應,因此有時透過率也會比第一種實施形態之光發射構件40低,不過,只要從光源48提供之光最後到達光檢測部25即可。The light emitted from the
即使是具有此種構成之檢測裝置10A,仍可具有與第一種實施形態之檢測裝置10同樣的功能。
<第三種實施形態>Even the
第三種實施形態係取代面光源之光發射構件40,而就虛擬地具有用於形成面光源之複數個點光源的光發射構件40B之檢測裝置10B作說明。In the third embodiment, instead of the
圖7係說明本發明第三種實施形態之檢測裝置的構造圖。檢測裝置10B包含:影像感測器基板20B及光發射構件40B。就影像感測器基板20B及光發射構件40B以外的構成,因為與第一種實施形態相同,所以省略其說明。Fig. 7 is a structural diagram illustrating a detection device according to a third embodiment of the present invention. The
光檢測部25B對第一種實施形態中之光檢測部25,具有一部分光感測器26不存在之構成。光發射構件40B在基板21之第一面20Ba中配置於光感測器26不存在之區域。光發射構件40B係LED等發光元件。光導入部28B在對應於配置有光發射構件40B之區域的部分具有開口部。光發射構件40B亦可藉由該開口部而露出。通過該開口部而從光發射構件40B發射之光到達彈性構件60。只要從光發射構件40B發射之光到達存在於壓力檢測範圍之反射構件80的方式,來決定光發射構件40B之光發射角度即可。作為光發射構件40B之一部分,如第二種實施形態之光擴散板45亦可設於彈性構件60與影像感測器基板20B之間。The
即使是具有此種構成之檢測裝置10B,仍可具有與第一種實施形態之檢測裝置10同樣的功能。
<第四種實施形態>Even the
第四種實施形態係取代包含針孔形狀之開口部29的光導入部28,而就具有包括準直鏡之功能的光導入部28C之影像感測器基板20C作說明。In the fourth embodiment, instead of the
圖8係說明本發明第四種實施形態之影像感測器基板的構造圖。影像感測器基板20C包含準直鏡陣列之光導入部28C。光導入部28C配置於基板21之第一面20Ca側,且包含複數個孔29C。複數個孔29C分別配置於與複數個光感測器26之各個對應的位置。孔29C將與第一面20Ca垂直地延伸,並從光發射構件40側到達之光導入配置在對應於該孔29C之位置的光感測器26。由於孔29C只要可將光導入光感測器26即可,因此亦可在孔29C之內部充填透明的構件。Fig. 8 is a diagram illustrating the structure of an image sensor substrate according to a fourth embodiment of the present invention. The
即使是具有此種構成之影像感測器基板20C,仍可具有與第一種實施形態之影像感測器基板20同樣的功能。
<第五種實施形態>Even the
第五種實施形態係取代包含針孔形狀之開口部29的光導入部28,而就具有包括微透鏡陣列之聚光功能的光導入部28D之影像感測器基板20D作說明。In the fifth embodiment, instead of the
圖9係說明本發明第五種實施形態之影像感測器基板的構造圖。影像感測器基板20D包含配置於第一面20Da側之光導入部28D。光導入部28D包含微透鏡陣列27D與開口部29D的複數組。複數組分別配置於與複數個光感測器26之各個對應的位置,並將從光發射構件40側到達之光導入光感測器26。Fig. 9 is a diagram illustrating the structure of an image sensor substrate according to a fifth embodiment of the present invention. The
即使是具有此種構成之影像感測器基板20D,仍可具有與第一種實施形態之影像感測器基板20同樣的功能。
<修改例>Even the
以上,係說明本發明一種實施形態,不過本發明一種實施形態亦可如以下地修改成各種形態。此外,上述實施形態及以下說明之修改例亦可分別相互組合來應用。One embodiment of the present invention has been described above, but one embodiment of the present invention can be modified into various forms as follows. In addition, the above-mentioned embodiments and modifications described below can also be applied in combination with each other.
(1)比反射構件80在壓力檢測面60a側(例如,在壓力檢測面60a上),亦可配置遮蔽來自光發射構件40之光,並且可追隨彈性構件60之彈性變形而變形的遮光膜。此種情況下,雖然因為遮光膜之遮光性能而無法取得物體1000的影像,不過可減少洩漏至壓力檢測面60a之光。(1) On the side of the
(2)觸覺感測器亦可取代使用影像感測器基板20,而使用事件檢測型感測器。事件檢測型感測器並非輸出從藉由光檢測部25所檢測之光獲得的影像信號,而係輸出顯示依據影像之變化而檢測的事件資訊(例如在影像中有臨限值以上之亮度變化的座標)之信號。此種情況下,解析裝置90取代影像解析部95之功能,而包含具有解析事件資訊之功能的事件解析部。事件解析部解析從事件檢測型感測器輸出之信號(事件資訊信號),算出並輸出檢測裝置10對壓力檢測面60a施加之壓力的相關資訊(例如,壓力大小、壓力方向)。(2) Instead of using the
(3)光導入部28比光感測器26配置於光發射構件40側,而將來自光發射構件40之光(特別是如光Lr2之與反射構件80相關的光)導入光感測器26。例示了同樣功能之光導入部28B、28C、28D,不過只要具有此種功能即可,而不限於例示之構成。(3) The
(4)反射構件80為了使來自光發射構件40之光到達光感測器26,而具有至少對第一波長之光的反射功能。另外,藉由使來自光發射構件40之光到達光感測器26,只要可在影像感測器基板20上認識相當於反射構件80之構成,亦可不具該反射功能。彈性構件60亦可不支撐反射構件80,而支撐例如具有對第一波長之光的吸收功能之吸收構件。來自光發射構件40之光例如被壓力檢測面60a反射而到達光感測器26前,藉由吸收構件吸收光。藉此,影像感測器基板20可獲得吸收構件之影像。(4) The
如此,以可追隨彈性構件60之彈性變形而移動的方式被彈性構件60支撐之構件(被支撐構件)不限於反射構件80,亦可從具有與彈性構件60不同之光學特性的各種構件採用。彈性構件60亦可支撐複數種被支撐構件(例如,反射構件80與吸收構件兩者)。Thus, the member (supported member) supported by the
(5)不限於藉由彈性構件60支撐複數個反射構件80的情況,亦可支撐一個反射構件。一個反射構件例如亦可具有網眼形狀。此處所謂網眼形狀之構件係形成有複數個開口之面形狀的構件。網眼形狀之構件的一例為矩陣狀配置矩形之開口,且具有格柵狀的圖案形狀。藉由面形狀之構件被彈性構件60支撐,該構件追隨彈性構件60之彈性變形而變形。影像感測器基板20例如可獲得藉由該彈性變形而開口部分之形狀變化,或開口部分移動的影像。(5) The
1:觸覺感測器
10,10A,10B:檢測裝置
20,20B,20C,20D:影像感測器基板
20a,20Ba,20Ca,20Da:第一面
21:基板
25,25B:光檢測部
26:光感測器
27D:微透鏡陣列
28,28B,28C,28D:光導入部
29,29D:開口部
29C:孔
40,40A,40B:光發射構件
45:光擴散板
48:光源
60:彈性構件
60a:壓力檢測面
80,80d1,80d2,80d3,80d4:反射構件
90:解析裝置
95:影像解析部
98:電力供給部
1000:物體
Ld1,Ld2,Ld3,Lr1,Lr2,Lr3:光1:
[圖1]係顯示本發明第一種實施形態之觸覺感測器的構成圖。 [圖2]係說明本發明第一種實施形態之檢測裝置的構造圖。 [圖3]係顯示對壓力檢測面而從物體接受壓力時之反射構件的位置變化之一例圖。 [圖4]係顯示對壓力檢測面而從物體接受壓力時之反射構件的拍攝影像之一例圖。 [圖5]係顯示對壓力檢測面而從物體接受壓力時之反射構件的拍攝影像之一例圖。 [圖6]係說明本發明第二種實施形態之檢測裝置的構造圖。 [圖7]係說明本發明第三種實施形態之檢測裝置的構造圖。 [圖8]係說明本發明第四種實施形態之影像感測器的構造圖。 [圖9]係說明本發明第五種實施形態之影像感測器的構造圖。[ Fig. 1 ] is a diagram showing the configuration of a touch sensor according to the first embodiment of the present invention. [ Fig. 2 ] is a structural diagram illustrating a detection device according to a first embodiment of the present invention. [ Fig. 3 ] is a diagram showing an example of the position change of the reflection member when the pressure detection surface receives pressure from an object. [ Fig. 4 ] is an example of a photographed image of the reflective member when the pressure detection surface receives pressure from an object. [FIG. 5] It is a diagram showing an example of a photographed image of the reflective member when the pressure detection surface receives pressure from an object. [ Fig. 6 ] is a structural diagram illustrating a detection device according to a second embodiment of the present invention. [ Fig. 7 ] is a structural diagram illustrating a detection device according to a third embodiment of the present invention. [ Fig. 8 ] is a structural diagram illustrating an image sensor according to a fourth embodiment of the present invention. [ Fig. 9 ] is a diagram illustrating the structure of an image sensor according to a fifth embodiment of the present invention.
1:觸覺感測器1: Tactile sensor
10:檢測裝置10: Detection device
20:影像感測器基板20: Image sensor substrate
20a:第一面20a: First side
21:基板21: Substrate
25:光檢測部25: Light detection unit
28:光導入部28: Light introduction part
40:光發射構件40: light emitting member
60:彈性構件60: Elastic member
60a:壓力檢測面60a: Pressure detection surface
80:反射構件80:reflection member
90:解析裝置90: Analysis device
95:影像解析部95: Image analysis department
98:電力供給部98: Power supply department
1000:物體1000: object
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WO2023100515A1 (en) * | 2021-12-02 | 2023-06-08 | ソニーグループ株式会社 | Tactile sensor device, contact sensor module, and robot arm device |
KR20230096431A (en) * | 2021-12-23 | 2023-06-30 | 삼성전자주식회사 | Optical tactile sensor |
WO2023210376A1 (en) * | 2022-04-28 | 2023-11-02 | 富士フイルム株式会社 | Pressure sensor and robot |
WO2024101603A1 (en) * | 2022-11-11 | 2024-05-16 | 삼성전자주식회사 | Electronic device for obtaining contact information for object and control method therefor |
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CN114402183A (en) | 2022-04-26 |
JP2022033634A (en) | 2022-03-02 |
JP6864401B1 (en) | 2021-04-28 |
CN114402183B (en) | 2024-03-08 |
JP2022033691A (en) | 2022-03-02 |
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TW202208811A (en) | 2022-03-01 |
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