TWI788425B - 硬化密封體之抗翹曲用層合體,及硬化密封體之製造方法 - Google Patents
硬化密封體之抗翹曲用層合體,及硬化密封體之製造方法 Download PDFInfo
- Publication number
- TWI788425B TWI788425B TW107134887A TW107134887A TWI788425B TW I788425 B TWI788425 B TW I788425B TW 107134887 A TW107134887 A TW 107134887A TW 107134887 A TW107134887 A TW 107134887A TW I788425 B TWI788425 B TW I788425B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- resin layer
- curable resin
- adhesive
- mass
- Prior art date
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Sealing Battery Cases Or Jackets (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Gasket Seals (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Table Devices Or Equipment (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018068732 | 2018-03-30 | ||
JP2018-068725 | 2018-03-30 | ||
JP2018068725 | 2018-03-30 | ||
JP2018-068732 | 2018-03-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201942286A TW201942286A (zh) | 2019-11-01 |
TWI788425B true TWI788425B (zh) | 2023-01-01 |
Family
ID=68058708
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107134891A TWI796367B (zh) | 2018-03-30 | 2018-10-03 | 硬化密封體之抗翹曲用層合體、及硬化密封體之製造方法 |
TW107134887A TWI788425B (zh) | 2018-03-30 | 2018-10-03 | 硬化密封體之抗翹曲用層合體,及硬化密封體之製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107134891A TWI796367B (zh) | 2018-03-30 | 2018-10-03 | 硬化密封體之抗翹曲用層合體、及硬化密封體之製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP7240377B2 (ja) |
KR (2) | KR102674354B1 (ja) |
CN (2) | CN111902503A (ja) |
TW (2) | TWI796367B (ja) |
WO (2) | WO2019187248A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021117695A1 (ja) * | 2019-12-11 | 2021-06-17 | リンテック株式会社 | 粘着シート及び半導体装置の製造方法 |
JP7438740B2 (ja) * | 2019-12-13 | 2024-02-27 | 日東電工株式会社 | 半導体プロセスシート |
JP7438741B2 (ja) * | 2019-12-13 | 2024-02-27 | 日東電工株式会社 | 半導体プロセスシート |
CN114179465A (zh) * | 2021-11-26 | 2022-03-15 | 安徽森泰木塑科技地板有限公司 | 一种用于数码打印的基材、数码打印板材及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009227892A (ja) * | 2008-03-25 | 2009-10-08 | Lintec Corp | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
TW201520296A (zh) * | 2013-07-19 | 2015-06-01 | Nitto Denko Corp | 熱剝離型黏著帶及電子零件之切斷方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3594853B2 (ja) | 1999-11-08 | 2004-12-02 | 日東電工株式会社 | 加熱剥離型粘着シート |
JP2003264205A (ja) * | 2002-03-08 | 2003-09-19 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
JP2009152490A (ja) | 2007-12-21 | 2009-07-09 | Furukawa Electric Co Ltd:The | チップ保護用フィルム |
JP2011102383A (ja) * | 2009-10-14 | 2011-05-26 | Nitto Denko Corp | 熱硬化型ダイボンドフィルム |
JP5589388B2 (ja) | 2010-01-06 | 2014-09-17 | 住友ベークライト株式会社 | 熱硬化性接着剤組成物および半導体装置 |
WO2011132648A1 (ja) | 2010-04-20 | 2011-10-27 | 日東電工株式会社 | フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置 |
JP2012149181A (ja) * | 2011-01-19 | 2012-08-09 | Nitto Denko Corp | 両面粘着テープ又はシート、および被着体の加工方法 |
JP5937398B2 (ja) * | 2012-03-26 | 2016-06-22 | 株式会社巴川製紙所 | 半導体装置製造用接着シート及び半導体装置の製造方法 |
JP5937397B2 (ja) | 2012-03-26 | 2016-06-22 | 株式会社巴川製紙所 | 半導体装置製造用接着シート及び半導体装置の製造方法 |
JP2015185436A (ja) * | 2014-03-25 | 2015-10-22 | リンテック株式会社 | シート状封止材、封止シート、および発光素子封止体 |
CN107210205B (zh) * | 2015-02-05 | 2021-06-15 | 琳得科株式会社 | 树脂膜形成用复合片、以及带树脂膜的芯片的制造方法 |
JP2017092335A (ja) * | 2015-11-13 | 2017-05-25 | 日東電工株式会社 | 半導体パッケージの製造方法 |
CN111448275B (zh) * | 2017-12-26 | 2022-04-22 | 琳得科株式会社 | 粘合性层叠体、带树脂膜的加工对象物制造方法及带固化树脂膜的固化密封体的制造方法 |
-
2018
- 2018-10-02 KR KR1020207015350A patent/KR102674354B1/ko active IP Right Grant
- 2018-10-02 CN CN201880091673.9A patent/CN111902503A/zh active Pending
- 2018-10-02 JP JP2020509574A patent/JP7240377B2/ja active Active
- 2018-10-02 JP JP2020509573A patent/JP7240376B2/ja active Active
- 2018-10-02 CN CN201880091671.XA patent/CN111954703A/zh active Pending
- 2018-10-02 KR KR1020207015349A patent/KR102576309B1/ko active IP Right Grant
- 2018-10-02 WO PCT/JP2018/036811 patent/WO2019187248A1/ja active Application Filing
- 2018-10-02 WO PCT/JP2018/036810 patent/WO2019187247A1/ja active Application Filing
- 2018-10-03 TW TW107134891A patent/TWI796367B/zh active
- 2018-10-03 TW TW107134887A patent/TWI788425B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009227892A (ja) * | 2008-03-25 | 2009-10-08 | Lintec Corp | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
TW201520296A (zh) * | 2013-07-19 | 2015-06-01 | Nitto Denko Corp | 熱剝離型黏著帶及電子零件之切斷方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2019187247A1 (ja) | 2021-04-15 |
TWI796367B (zh) | 2023-03-21 |
WO2019187247A1 (ja) | 2019-10-03 |
JP7240377B2 (ja) | 2023-03-15 |
KR20200138150A (ko) | 2020-12-09 |
KR102674354B1 (ko) | 2024-06-11 |
KR20200138149A (ko) | 2020-12-09 |
TW201942286A (zh) | 2019-11-01 |
JPWO2019187248A1 (ja) | 2021-04-08 |
KR102576309B1 (ko) | 2023-09-07 |
CN111902503A (zh) | 2020-11-06 |
CN111954703A (zh) | 2020-11-17 |
TW201942283A (zh) | 2019-11-01 |
JP7240376B2 (ja) | 2023-03-15 |
WO2019187248A1 (ja) | 2019-10-03 |
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