TWI788425B - 硬化密封體之抗翹曲用層合體，及硬化密封體之製造方法 - Google Patents

硬化密封體之抗翹曲用層合體，及硬化密封體之製造方法 Download PDF

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Publication number
TWI788425B
TWI788425B TW107134887A TW107134887A TWI788425B TW I788425 B TWI788425 B TW I788425B TW 107134887 A TW107134887 A TW 107134887A TW 107134887 A TW107134887 A TW 107134887A TW I788425 B TWI788425 B TW I788425B
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TW
Taiwan
Prior art keywords
layer
resin layer
curable resin
adhesive
mass
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TW107134887A
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English (en)
Chinese (zh)
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TW201942286A (zh
Inventor
佐藤明德
高麗洋佑
阿久津高志
垣內康彦
岡本直也
山田忠知
中山武人
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日商琳得科股份有限公司
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Publication of TW201942286A publication Critical patent/TW201942286A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Gasket Seals (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Table Devices Or Equipment (AREA)
TW107134887A 2018-03-30 2018-10-03 硬化密封體之抗翹曲用層合體，及硬化密封體之製造方法 TWI788425B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018068732 2018-03-30
JP2018-068725 2018-03-30
JP2018068725 2018-03-30
JP2018-068732 2018-03-30

Publications (2)

Publication Number Publication Date
TW201942286A TW201942286A (zh) 2019-11-01
TWI788425B true TWI788425B (zh) 2023-01-01

Family

ID=68058708

Family Applications (2)

Application Number Title Priority Date Filing Date
TW107134891A TWI796367B (zh) 2018-03-30 2018-10-03 硬化密封體之抗翹曲用層合體、及硬化密封體之製造方法
TW107134887A TWI788425B (zh) 2018-03-30 2018-10-03 硬化密封體之抗翹曲用層合體，及硬化密封體之製造方法

Family Applications Before (1)

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TW107134891A TWI796367B (zh) 2018-03-30 2018-10-03 硬化密封體之抗翹曲用層合體、及硬化密封體之製造方法

Country Status (5)

Country Link
JP (2) JP7240377B2 (ja)
KR (2) KR102674354B1 (ja)
CN (2) CN111902503A (ja)
TW (2) TWI796367B (ja)
WO (2) WO2019187248A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021117695A1 (ja) * 2019-12-11 2021-06-17 リンテック株式会社 粘着シート及び半導体装置の製造方法
JP7438740B2 (ja) * 2019-12-13 2024-02-27 日東電工株式会社 半導体プロセスシート
JP7438741B2 (ja) * 2019-12-13 2024-02-27 日東電工株式会社 半導体プロセスシート
CN114179465A (zh) * 2021-11-26 2022-03-15 安徽森泰木塑科技地板有限公司 一种用于数码打印的基材、数码打印板材及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009227892A (ja) * 2008-03-25 2009-10-08 Lintec Corp 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
TW201520296A (zh) * 2013-07-19 2015-06-01 Nitto Denko Corp 熱剝離型黏著帶及電子零件之切斷方法

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JP3594853B2 (ja) 1999-11-08 2004-12-02 日東電工株式会社 加熱剥離型粘着シート
JP2003264205A (ja) * 2002-03-08 2003-09-19 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JP2009152490A (ja) 2007-12-21 2009-07-09 Furukawa Electric Co Ltd:The チップ保護用フィルム
JP2011102383A (ja) * 2009-10-14 2011-05-26 Nitto Denko Corp 熱硬化型ダイボンドフィルム
JP5589388B2 (ja) 2010-01-06 2014-09-17 住友ベークライト株式会社 熱硬化性接着剤組成物および半導体装置
WO2011132648A1 (ja) 2010-04-20 2011-10-27 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
JP2012149181A (ja) * 2011-01-19 2012-08-09 Nitto Denko Corp 両面粘着テープ又はシート、および被着体の加工方法
JP5937398B2 (ja) * 2012-03-26 2016-06-22 株式会社巴川製紙所 半導体装置製造用接着シート及び半導体装置の製造方法
JP5937397B2 (ja) 2012-03-26 2016-06-22 株式会社巴川製紙所 半導体装置製造用接着シート及び半導体装置の製造方法
JP2015185436A (ja) * 2014-03-25 2015-10-22 リンテック株式会社 シート状封止材、封止シート、および発光素子封止体
CN107210205B (zh) * 2015-02-05 2021-06-15 琳得科株式会社 树脂膜形成用复合片、以及带树脂膜的芯片的制造方法
JP2017092335A (ja) * 2015-11-13 2017-05-25 日東電工株式会社 半導体パッケージの製造方法
CN111448275B (zh) * 2017-12-26 2022-04-22 琳得科株式会社 粘合性层叠体、带树脂膜的加工对象物制造方法及带固化树脂膜的固化密封体的制造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009227892A (ja) * 2008-03-25 2009-10-08 Lintec Corp 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
TW201520296A (zh) * 2013-07-19 2015-06-01 Nitto Denko Corp 熱剝離型黏著帶及電子零件之切斷方法

Also Published As

Publication number Publication date
JPWO2019187247A1 (ja) 2021-04-15
TWI796367B (zh) 2023-03-21
WO2019187247A1 (ja) 2019-10-03
JP7240377B2 (ja) 2023-03-15
KR20200138150A (ko) 2020-12-09
KR102674354B1 (ko) 2024-06-11
KR20200138149A (ko) 2020-12-09
TW201942286A (zh) 2019-11-01
JPWO2019187248A1 (ja) 2021-04-08
KR102576309B1 (ko) 2023-09-07
CN111902503A (zh) 2020-11-06
CN111954703A (zh) 2020-11-17
TW201942283A (zh) 2019-11-01
JP7240376B2 (ja) 2023-03-15
WO2019187248A1 (ja) 2019-10-03

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