TWI786016B - Flat panel detector detection system and flat panel detector detection method - Google Patents
Flat panel detector detection system and flat panel detector detection method Download PDFInfo
- Publication number
- TWI786016B TWI786016B TW111115891A TW111115891A TWI786016B TW I786016 B TWI786016 B TW I786016B TW 111115891 A TW111115891 A TW 111115891A TW 111115891 A TW111115891 A TW 111115891A TW I786016 B TWI786016 B TW I786016B
- Authority
- TW
- Taiwan
- Prior art keywords
- panel sensor
- driving circuit
- flat panel
- sensing image
- sensing
- Prior art date
Links
Images
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
- Burglar Alarm Systems (AREA)
- Measurement Of Radiation (AREA)
Abstract
Description
本揭示內容關於一種感測光源強度以產生影像之技術,特別是關於一種檢測平板感測器之組裝是否有異常的系統與方法。The disclosure relates to a technology for sensing light intensity to generate images, and in particular to a system and method for detecting whether there is abnormality in the assembly of a flat panel sensor.
平板感測器(Flat panel Detector)是一種可利用光電轉換技術,將X光訊號轉換成電訊號,並以數位影像呈現出X光訊號強度的裝置。相較於傳統的底片,平板感測器具有更高的感測度,能夠縮短人體暴露於X光的時間,降低人體接收的輻射劑量。然而,平板感測器在組裝上若產生偏差,則產生的數位影像亦可能出現錯誤,從而影響對於數位影像的判讀結果。Flat panel detector is a device that can use photoelectric conversion technology to convert X-ray signals into electrical signals and display the X-ray signal intensity in digital images. Compared with the traditional film, the flat panel sensor has a higher sensitivity, which can shorten the time when the human body is exposed to X-rays and reduce the radiation dose received by the human body. However, if there is a deviation in the assembly of the flat panel sensor, errors may occur in the generated digital image, thereby affecting the interpretation result of the digital image.
本揭示內容係關於一種平板感測器檢測方法,包含下列步驟:在平板感測器被光源照射的情形下,致能平板感測器之第一驅動電路,且禁能平板感測器之第二驅動電路,其中第一驅動電路及第二驅動電路用以提供複數個掃描訊號至平板感測器之一感測面板的複數個掃描線;透過讀取電路,取得感測面板產生的第一感測影像;以及比對第一感測影像中複數個第一區域的複數個第一亮度值,以辨識出該些掃描線中的至少一個異常掃描線。The disclosure relates to a detection method of a flat panel sensor, comprising the following steps: when the flat panel sensor is illuminated by a light source, enabling the first drive circuit of the flat panel sensor and disabling the second drive circuit of the flat panel sensor Two driving circuits, wherein the first driving circuit and the second driving circuit are used to provide a plurality of scanning signals to a plurality of scanning lines of the sensing panel of the flat panel sensor; through the reading circuit, the first sensing panel generated is obtained sensing images; and comparing a plurality of first brightness values of a plurality of first areas in the first sensing image to identify at least one abnormal scanning line among the scanning lines.
本揭示內容還關於一種平板感測器檢測系統,包含平板感測器及處理器。平板感測器包含感測面板、第一驅動電路及第二驅動電路。感測面板具有複數條掃描線。第一驅動電路電性連接該些掃描線的複數個第一端。第二驅動電路電性連接該些掃描線的複數個第二端。處理器電性連接於平板感測器。在平板感測器被光源照射的情形下,處理器用以致能第一驅動電路,且禁能第二驅動電路,以取得第一感測影像。處理器還用以比對第一感測影像中複數個第一區域的複數個第一亮度值,以辨識出該些掃描線中的至少一個異常掃描線。The disclosure also relates to a flat panel sensor detection system, including a flat panel sensor and a processor. The flat panel sensor includes a sensing panel, a first driving circuit and a second driving circuit. The sensing panel has a plurality of scan lines. The first driving circuit is electrically connected to a plurality of first ends of the scan lines. The second driving circuit is electrically connected to a plurality of second ends of the scan lines. The processor is electrically connected to the flat panel sensor. When the flat panel sensor is illuminated by the light source, the processor is used to enable the first driving circuit and disable the second driving circuit to obtain the first sensing image. The processor is also used for comparing the plurality of first brightness values of the plurality of first areas in the first sensing image to identify at least one abnormal scanning line among the scanning lines.
本揭示內容還關於一種平板感測器檢測方法,包含下列步驟:在平板感測器之感測面板被光源照射的情形下,驅動平板感測器之第一驅動電路掃描感測面板上的複數個掃描線,以取得第一感測影像;在平板感測器被光源照射的情形下,驅動平板感測器之第二驅動電路掃描感測面板上的該些掃描線,以取得第二感測影像;以及比對第一感測影像及第二感測影像的亮度,以辨識出該些掃描線中的至少一個異常掃描線。The present disclosure also relates to a detection method of a flat panel sensor, which includes the following steps: when the sensing panel of the flat panel sensor is illuminated by a light source, driving the first driving circuit of the flat panel sensor to scan the complex numbers on the sensing panel scanning lines to obtain the first sensing image; when the flat panel sensor is illuminated by the light source, the second driving circuit driving the flat panel sensor scans the scanning lines on the sensing panel to obtain the second sensing image and comparing the brightness of the first sensing image and the second sensing image to identify at least one abnormal scanning line among the scanning lines.
據此,透過分別驅動不同的驅動電路,取得感測影像並進行亮度分析,將可精確地辨識出感測影像中的異常位置,並據以發現平板感測器上的硬體組裝錯誤。Accordingly, by separately driving different driving circuits, obtaining sensing images and performing brightness analysis, abnormal positions in the sensing images can be accurately identified, and hardware assembly errors on the flat panel sensor can be found accordingly.
以下將以圖式揭露本發明之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。Several embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some well-known structures and components will be shown in a simple and schematic manner in the drawings.
於本文中,當一元件被稱為「連接」或「耦接」時,可指「電性連接」或「電性耦接」。「連接」或「耦接」亦可用以表示二或多個元件間相互搭配操作或互動。此外,雖然本文中使用「第一」、「第二」、…等用語描述不同元件,該用語僅是用以區別以相同技術用語描述的元件或操作。除非上下文清楚指明,否則該用語並非特別指稱或暗示次序或順位,亦非用以限定本發明。Herein, when an element is referred to as "connected" or "coupled", it may mean "electrically connected" or "electrically coupled". "Connected" or "coupled" may also be used to indicate that two or more elements cooperate or interact with each other. In addition, although terms such as “first”, “second”, . Unless clearly indicated by the context, the terms do not imply any particular order or sequence, nor are they intended to be limiting of the invention.
第1A及1B圖為根據本揭示內容之部份實施例的平板感測器檢測系統之示意圖。平板感測器檢測系統包含光源裝置L、平板感測器100及處理器200。光源裝置L用以產生測試光線(如:X光),測試光線在穿過檢測物或人體後,將照射在平板感測器100上。1A and 1B are schematic diagrams of flat panel sensor inspection systems according to some embodiments of the present disclosure. The flat panel sensor detection system includes a light source device L, a
平板感測器100包含第一驅動電路110、第二驅動電路120、感測面板130、讀取電路140及控制電路150。感測面板130設有多列(row)掃描線SL及多行(column)資料線DL,用以驅動感測面板130上的多個畫素單元(圖中未示)。在一實施例中,感測面板130可為薄膜電晶體影像感測面板(Thin Film Transistor image sensor panel ),其中薄膜電晶體可包含非晶矽(amorphous)、低溫多晶矽(LTPS)、氧化銦鎵鋅(IGZO)或其他,但本揭示內容並不以此為限。The
如第1A圖所示,在部份實施例中,平板感測器100還包含閃爍器131(Scintillator)。閃爍器131設置於感測面板130上方,用以接收光源裝置L產生的X光,並將X光轉換為可見光訊號。感測面板130中每個畫素單元可透過光電元件(如:光電二極體)將可見光訊號轉換為電訊號,再透過電晶體輸出感測訊號。感測訊號用以反應投射到對應之畫素單元的光源強度。As shown in FIG. 1A , in some embodiments, the
第一驅動電路110及第二驅動電路120分別設置於感測面板130的兩側,且電性連接於掃描線SL的兩端。換言之,第一驅動電路110電性連接於掃描線SL的第一端,第二驅動電路120則電性連接於掃描線SL的第二端。第一驅動電路110及第二驅動電路120可傳送掃描訊號,以依序驅動每一條掃描線SL,使感測面板130上的畫素單元根據資料線DL上的電壓及從可見光訊號轉換而成的電訊號,輸出對應的感測訊號。「掃描訊號」可為一種閘極導通(gate-on)電壓位準的閘極信號,例如閘極脈衝訊號。此一架構為「雙驅動架構」,第一驅動電路110及第二驅動電路120會提供相同的閘極脈衝訊號至同一條掃描線SL之兩端。The
讀取電路140電性連接於感測面板130的資料線DL,以提供電壓至資料線,或者接收感測面板130之畫素單元產生的感測訊號。The
控制電路150電性連接於第一驅動電路110、第二驅動電路120、感測面板130及讀取電路140,用以驅動第一驅動電路110及第二驅動電路120,並透過讀取電路140接收感測訊號。控制電路150可對所有的感測訊號進行數位化處理,以產生對應於投射在感測面板130上光強度的影像資料。由於本領域人士能理解透過閃爍器131轉換X光以產生影像的原理,故在此不另贅述。
The
處理器200電性連接於控制電路150,用以接收影像資料,以透過分析影像資料,判斷平板感測器100的各個元件組裝之間是否有異常。舉例而言,若第一驅動電路110/第二驅動電路120與感測面板130之間的壓合(bonding)製程不夠理想,則平板感測器100所產生的影像資料就會存在雜訊或錯誤圖像。
The
本揭示內容透過調整檢測方式,使得平板感測器檢測系統能精確辨識出平板感測器100是否存在硬體組裝的錯誤。第2圖所示為根據本揭示內容之部份實施例的平板感測器檢測方法的流程圖,在此根據第1及2圖說明如後。
In this disclosure, by adjusting the detection method, the flat panel sensor detection system can accurately identify whether there is a hardware assembly error in the
在步驟S201中,光源裝置L產生測試光線(如:X光)照射感測面板130。在步驟S202中,控制電路150致能/驅動第一驅動電路110,但禁能第二驅動電路120(或維持於待命狀態),使得第一驅動電路110依序提供掃描訊號至每一條掃描線SL。此時,第二驅動電路120並未被驅動,但第二驅動電路120仍會根據內部的偏壓,將掃描線SL維持在一個固定電壓。換言之,第一驅動電路
110提供致能電壓(即,掃描訊號)至掃描線SL的第一端,而第二驅動電路120則將掃描線SL的第二端固定於固定電壓。
In step S201 , the light source device L generates test light (such as X-ray) to irradiate the
在步驟S203中,掃描線SL輸出感測訊號至讀取電路140,控制電路150透過讀取電路140接收對應於每個畫素單元的感測訊號,並據以產生第一感測影像。
In step S203 , the scanning line SL outputs the sensing signal to the
具體而言,請參閱第3圖所示,係平板感測器100驅動以產生影像的階段示意圖。在提供掃描訊號之前,控制電路150會先控制第一驅動電路110對該些掃描線SL輸出高電壓,再輸出低電壓,以進行重置(clean)程序P301。接著,感測面板130於暴露(exposure)程序P302中被光源照射,同時第一驅動電路110依序掃描該些掃描線SL。在經過靜置延遲(front delay)程序P303後,讀取電路140接收感測訊號,以進行讀取(Acquire)程序P304。最後,控制電路150在傳輸(data transfer)程序P305中取得感測訊號並產生第一感測影像。
Specifically, please refer to FIG. 3 , which is a schematic diagram of stages in which the
在步驟S204中,在取得第一感測影像後,控制電路150將第一感測影像傳輸給處理器200分析。處理器200將比對第一感測影像中多個第一區域的第一亮度值,以辨識出異常亮度的區域(如:亮度與整體平均值之差異大於設定值)。第4A圖為根據本揭示內容之部份實施例的第一感測影像F1之示意圖。在一實施例中,處理器200會在第一感測影像F1上劃分出多個第一區域。例如:從感測面板130對應於第一掃描電路110的一側邊(第4A圖的左側)設定長度與寬度,以擷取多個第一區域401~404。In step S204, after obtaining the first sensing image, the
接著,處理器200根據每一個第一區域401~404的第一亮度,比對每個第一亮度的差異,以找出第一區域中的第一異常區域。如第4A圖所示,第一感測影像F1中的大部分區域都如同第一區域401、402般,並沒有出現圖案或線段,但第一區域403、404則分別有著黑線與白線,使得第一區域403、404的亮度會明顯異於其他第一區域(如:第一區域401、402)。因此,處理器200會將第一區域403、404設定為第一異常區域。根據第一區域403、404在第一感測影像F1中的座標或位置,處理器200將可進一步判斷出感測面板130上對應位置的掃描線SL(如:第80條掃描線)存在組裝錯誤。Next, the
前述步驟S201~S204係只驅動第一驅動電路110,以檢測異常的掃描線。在其他實施例中,為了以不同角度確認異常的掃描線,可透過步驟S205~S207,驅動第二驅動電路120來做檢測。The foregoing steps S201-S204 are to drive only the
在步驟S205中,在光源裝置L同樣持續照射感測面板130的情況下,控制電路150致能第二驅動電路120,但禁能第一驅動電路110,使得第二驅動電路120依序提供掃描訊號至每一條掃描線SL。此時,第一驅動電路110並未被驅動,但第一驅動電路110仍會根據內部的偏壓,將掃描線SL維持在固定電壓 。In step S205, when the light source device L also continues to illuminate the
在步驟S206中,掃描線SL輸出感測訊號至讀取電路140,控制電路150透過讀取電路140接收對應於每個畫素單元的感測訊號,並據以產生第二感測影像。In step S206 , the scanning line SL outputs the sensing signal to the
在步驟S207中,在取得第二感測影像後,控制電路150將第二感測影像傳輸給處理器200分析。處理器200將比對第二感測影像中多個第二區域405~408的第二亮度值,以辨識出異常亮度的區域。如第4B圖所示,第二區域407具有白線、第二區域408具有黑線,其亮度皆與其他第二區域(如:第二區域405、406)有明顯區隔,因此處理器200可將第二區域407、408列為異常區域。相似地,處理器200可根據異常區域的座標,來判斷出異常掃描線。In step S207, after obtaining the second sensing image, the
在步驟S208中,處理器200可比對第一感測影像及或第二感測影像的亮度,判斷出第一感測影像及/或第二感測影像中的異常區域,以辨識出異常掃描線。換言之,根據第一感測影像F1中所發現的第一異常區域,以及根據第二感測影像F2所發現的第二異常區域,處理器200可以根據第一異常區域及第二異常區域之「交集」或「聯集」的座標來判斷出異常的掃描線。In step S208, the
舉例而言,如第4A及4B圖所示,在辨識出第一感測影像F1及第二感測影像F2中的第一異常區域及第二異常區域後,處理器200可判斷第一異常區域的座標是否與第二異常區域的座標相同。若第一異常區域的座標是否與第二異常區域的座標相同(如:第一區域403對應第二區域407、第一區域404對應第二區域408),則處理器200再根據第一異常區域/第二異常區域的座標推算出異常掃描線。
For example, as shown in FIGS. 4A and 4B , after recognizing the first abnormal region and the second abnormal region in the first sensing image F1 and the second sensing image F2, the
透過分別驅動第一驅動電路110及第二驅動電路120,產生不同的感測影像,將能分別看出感測面板130不同側的清楚影像,以精確辨識出可能存在的組裝錯誤。第5A~5C圖為根據本揭示內容之部份實施例的實際檢測影像。從圖式可清楚看出,第一感測影像F1及第二感測影像F2上分別有多個亮度異常的區域ER。其中,第一感測影像F1之白線代表感測面板130對應於第一掃描電路110的側面(即,左側)具有壓合製程的錯誤。另一方面,第一感測影像F1之黑線則代表感測面板130對應於第二掃描電路120的側面(即,右側)具有壓合製程的錯誤,因為此時第二掃描電路120並未提供掃描訊號,僅將掃描線SL固定於固定電壓,因此會形成黑色線條。
By separately driving the
此外,在部份實施例中,在辨識出異常掃描線後,控制電路150還可同時致能第一驅動電路110及第二驅動電路120,以透過讀取電路取得第三感測影像。由於產生第三感測影像F3的方式與產生第一/第二感測影像的方式類似,故在此不再復述。
In addition, in some embodiments, after identifying the abnormal scanning line, the
承上,如第5C圖所示,處理器200可比對第三感測影像F3上多個第三區域的第三亮度,以找出異常亮度的異常區域(如:第5C圖中,具有垂直白線之區域ER),進而辨識出感測面板130上具有壓合問題的異常資料線。
Continuing, as shown in FIG. 5C, the
具體而言,在比對第一感測影像F1/第二感測影像
F2/第三感測影像F3中多個區域的亮度,以判斷異常亮度的區域時,處理器200可計算所有區域的平均亮度,作為「判斷閾值」。若任一區域的亮度與該閾值的差異超過設定值,則即可認定為異常區域。在其他實施例中,處理器200亦可自行設定一個固定閾值為判斷閾值,與每個區域的亮度值來判斷。或者,處理器200亦可將所有區域的亮度值中的中位數作為判斷閾值,來辨識異常亮度之區域。
Specifically, comparing the first sensing image F1/second sensing image
When detecting the luminance of multiple areas in F2/the third sensing image F3 to determine an area with abnormal luminance, the
前述實施例中,平板感測器檢測系統係由處理器200辨識異常區域及分析出異常掃描線。然而,在其他實施例中,處理器200亦可整合於平板感測器100中。或者,前述動作亦可由平板感測器100的控制電路150執行,而無須輸出至處理器200。
In the foregoing embodiments, the flat panel sensor detection system uses the
此外,前述實施例中之平板感測器檢測方法係執行於平板感測器100之出廠檢測階段。在其他實施例中,本揭示內容之平板感測器檢測方法亦可在畫素檢測階段中執行。換言之,在執行平板感測器檢測方法時,平板感測器100上可無須設置閃爍器,且光源裝置L可直接投射可見光至感測面板130,據此,感測面板130仍能透過內部之光電元件產生對應的感測影像。換言之,業者可在執行平板感測器檢測方法,確認平板感測器100沒有壓合或其他硬體組裝問題後,再將閃爍器裝設至感測面板130上。
In addition, the inspection method of the flat panel sensor in the foregoing embodiments is implemented in the factory inspection stage of the
第6圖所示為平板感測器100在接收不同劑量(dose)的X光情況下,呈現的影像讀取數值關係圖。第6圖中,曲線趨近於飽和時(讀取數值約60000)可視為X光感測的最高劑量(100%)。如圖所示,在線性操作區LR對應的劑量中,X光劑量強度與影像讀取數值呈線性關係。雖然X光劑量越高,影像會越清楚,但也會縮短平板感測器100內的元件的使用壽命。在部份實施例中,本揭示內容之平板感測器檢測系統可控制發光裝置L投射的X光劑量(例如將X光劑量控制於50%以下),且仍能清楚辨識出異常掃描線,因此可兼顧檢測精確性與元件壽命。FIG. 6 is a diagram showing the relationship between image reading values presented by the
前述各實施例中的各項元件、方法步驟或技術特徵,係可相互結合,而不以本揭示內容中的文字描述順序或圖式呈現順序為限。Various components, method steps or technical features in the above-mentioned embodiments can be combined with each other, and are not limited by the order of description in words or presentation in drawings in the present disclosure.
雖然本揭示內容已以實施方式揭露如上,然其並非用以限定本揭示內容,任何熟習此技藝者,在不脫離本揭示內容之精神和範圍內,當可作各種更動與潤飾,因此本揭示內容之保護範圍當視後附之申請專利範圍所界定者為準。Although the content of this disclosure has been disclosed above in terms of implementation, it is not intended to limit the content of this disclosure. Anyone who is skilled in this art can make various changes and modifications without departing from the spirit and scope of this disclosure. Therefore, this disclosure The scope of protection of the content shall be defined by the scope of the attached patent application.
L:光源裝置 100:平板感測器 110:第一驅動電路 120:第二驅動電路 130:感測面板L: light source device 100: Flat panel sensor 110: the first drive circuit 120: the second drive circuit 130: Sensing panel
131:閃爍器 131: scintillator
140:讀取電路 140: Read circuit
150:控制電路 150: control circuit
200:處理器 200: Processor
401-404:第一區域 401-404: the first area
405-408:第二區域 405-408: Second area
S201-S208:步驟 S201-S208: Steps
F1:第一感測影像 F1: The first sensing image
F2:第二感測影像 F2: Second sensing image
F3:第三感測影像 F3: The third sensing image
ER:區域 ER: area
DL:資料線 DL: data line
SL:掃描線 SL: scan line
LR:線性操作區 LR: linear operating region
P301:重置程序 P301: Reset program
P302:暴露程序 P302: Exposure procedures
P303:靜置延遲程序 P303: Standby delay program
P304:讀取程序 P304: Read program
P305:傳輸程序 P305: Transfer Procedure
第1A圖為根據本揭示內容之部份實施例之平板感測器檢測系統的示意圖。 第1B圖為根據本揭示內容之部份實施例之平板感測器檢測系統的示意圖。 第2圖為根據本揭示內容之部份實施例之平板感測器檢測方法的步驟流程圖。 第3圖為根據本揭示內容之部份實施例之平板感測器產生感測影像的流程示意圖。 第4A圖為根據本揭示內容之部份實施例之平板感測器所產生的第一感測影像示意圖。 第4B圖為根據本揭示內容之部份實施例之平板感測器所產生的第二感測影像示意圖。 第5A~5C圖為根據本揭示內容之部份實施例之平板感測器所產生的感測影像示意圖。 第6圖為根據本揭示內容之部份實施例之平板感測器的X光劑量與影像讀取數值關係圖。 FIG. 1A is a schematic diagram of a flat panel sensor inspection system according to some embodiments of the present disclosure. FIG. 1B is a schematic diagram of a flat panel sensor inspection system according to some embodiments of the present disclosure. FIG. 2 is a flow chart of the steps of the flat panel sensor detection method according to some embodiments of the present disclosure. FIG. 3 is a schematic diagram of a process of generating a sensing image by a flat panel sensor according to some embodiments of the present disclosure. FIG. 4A is a schematic diagram of a first sensing image generated by a flat panel sensor according to some embodiments of the present disclosure. FIG. 4B is a schematic diagram of a second sensing image generated by the flat panel sensor according to some embodiments of the present disclosure. FIGS. 5A-5C are schematic diagrams of sensing images generated by the flat panel sensor according to some embodiments of the present disclosure. FIG. 6 is a graph showing the relationship between X-ray dose and image reading value of the flat panel sensor according to some embodiments of the present disclosure.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none
S201-S208:步驟 S201-S208: Steps
Claims (20)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111115891A TWI786016B (en) | 2022-04-26 | 2022-04-26 | Flat panel detector detection system and flat panel detector detection method |
CN202211076615.3A CN115900797A (en) | 2022-04-26 | 2022-09-05 | Flat sensor detection system and flat sensor detection method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111115891A TWI786016B (en) | 2022-04-26 | 2022-04-26 | Flat panel detector detection system and flat panel detector detection method |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI786016B true TWI786016B (en) | 2022-12-01 |
TW202341935A TW202341935A (en) | 2023-11-01 |
Family
ID=85770829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111115891A TWI786016B (en) | 2022-04-26 | 2022-04-26 | Flat panel detector detection system and flat panel detector detection method |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN115900797A (en) |
TW (1) | TWI786016B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104124256A (en) * | 2014-07-01 | 2014-10-29 | 上海奕瑞光电子科技有限公司 | Pixel AEC flat panel detector |
US20180106908A1 (en) * | 2016-10-14 | 2018-04-19 | Konica Minolta, Inc. | Scintillator panel for x-ray talbot imaging apparatus, image detecting panel for x-ray talbot imaging apparatus, and x-ray talbot imaging apparatus |
WO2021189490A1 (en) * | 2020-03-27 | 2021-09-30 | 京东方科技集团股份有限公司 | X-ray flat panel detector and image correction method therefor |
CN114068591A (en) * | 2020-07-29 | 2022-02-18 | 京东方科技集团股份有限公司 | Flat panel detector and imaging system |
-
2022
- 2022-04-26 TW TW111115891A patent/TWI786016B/en active
- 2022-09-05 CN CN202211076615.3A patent/CN115900797A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104124256A (en) * | 2014-07-01 | 2014-10-29 | 上海奕瑞光电子科技有限公司 | Pixel AEC flat panel detector |
US20180106908A1 (en) * | 2016-10-14 | 2018-04-19 | Konica Minolta, Inc. | Scintillator panel for x-ray talbot imaging apparatus, image detecting panel for x-ray talbot imaging apparatus, and x-ray talbot imaging apparatus |
WO2021189490A1 (en) * | 2020-03-27 | 2021-09-30 | 京东方科技集团股份有限公司 | X-ray flat panel detector and image correction method therefor |
CN114068591A (en) * | 2020-07-29 | 2022-02-18 | 京东方科技集团股份有限公司 | Flat panel detector and imaging system |
Also Published As
Publication number | Publication date |
---|---|
TW202341935A (en) | 2023-11-01 |
CN115900797A (en) | 2023-04-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6663281B2 (en) | X-ray detector monitoring | |
US8004502B2 (en) | Correcting for ambient light in an optical touch-sensitive device | |
US20180063933A1 (en) | Radiation imaging apparatus, radiation imaging system, and exposure control method | |
CN109758169A (en) | Radiation imaging apparatus | |
US7822178B2 (en) | Radiographic imaging system | |
US10349914B2 (en) | Radiation imaging apparatus and method of controlling the same | |
EP1423733B1 (en) | Method and apparatus for identifying and correcting line artifacts in a solid state x-ray detector | |
US20040234032A1 (en) | Radiography apparatus, radiography method, radiography program, and recording medium | |
KR101156445B1 (en) | Driving method for light sensing pixel and X-ray detector including thereof | |
TWI786016B (en) | Flat panel detector detection system and flat panel detector detection method | |
JP6302122B1 (en) | Radiation detector | |
JP2020068516A (en) | Read circuit of infrared detector and inspection method therefor | |
US11154261B2 (en) | Radiation image capturing apparatus and radiation image capturing system | |
US20180098061A1 (en) | Imaging apparatus, endoscope apparatus, and temperature-measuring method | |
JP6808458B2 (en) | Radiation imaging device and radiation imaging system | |
US9715021B2 (en) | Radiation imaging apparatus and radiation imaging system | |
JP2016134776A (en) | Defect inspection unit, radiation detector, and defect inspection method | |
EP3462215B1 (en) | System and method for verifying the integrity of a radiation detector | |
JP7122152B2 (en) | Photodetector and method of operating same | |
JP2012090032A (en) | Line artifact detector and detection method | |
TWI669696B (en) | Pixel detecting and calibrating circuit, pixel circuit having the same, and pixel detecting and calibrating method | |
US20240168180A1 (en) | Radiation imaging apparatus and radiation imaging system | |
JP2020182667A (en) | Radiation imaging device and control method therefor | |
JP4569941B2 (en) | Method and apparatus for correcting an offset induced by a field effect transistor photoconductive effect of a solid state X-ray detector | |
JP7319809B2 (en) | Radiation imaging apparatus, its control method, and radiation imaging system |