TWI785789B - Heat dissipation system and electronic device - Google Patents

Heat dissipation system and electronic device Download PDF

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TWI785789B
TWI785789B TW110133853A TW110133853A TWI785789B TW I785789 B TWI785789 B TW I785789B TW 110133853 A TW110133853 A TW 110133853A TW 110133853 A TW110133853 A TW 110133853A TW I785789 B TWI785789 B TW I785789B
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accommodating space
pipeline
heat source
base
working fluid
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TW110133853A
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TW202312845A (en
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童凱煬
陳虹汝
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英業達股份有限公司
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Abstract

A heat dissipation system and an electronic device. Heat dissipation system includes casing, first and second tubing, condenser and flow controlling unit. Casing includes base and partition. Partition is fixed in accommodation space of base so as to divide it into first and second accommodation spaces. First accommodation space is located above second accommodation space along gravitational direction. Base includes inlet and outlet respectively connected to first and second accommodation spaces. First and second accommodation spaces are connected via dropping hole of partition. Working fluid drops on heat source in second accommodation space via dropping hole. End of first tubing is connected to inlet. End of second tubing is connected to outlet. First tubing is connected to second tubing via condenser. Flow controlling unit is disposed in first tubing.

Description

散熱系統以及電子裝置Cooling system and electronic device

本發明係關於一種散熱系統以及電子裝置，特別係關於一種包含流量控制單元的散熱系統以及電子裝置。The present invention relates to a heat dissipation system and an electronic device, in particular to a heat dissipation system and an electronic device including a flow control unit.

在一般的滴淋式冷卻系統中，輸送到伺服器中的介電液會滴至熱源而有效地吸收熱源產生的熱量，進而從液態蒸發成氣態。由於熱源在承受不同負載時會有不同的發熱量，因此通常是根據熱源處於高負載時包含的發熱量來決定輸送到伺服器中的介電液之量。如此一來，便能確保熱源即使處於高負載也仍能被介電液有效地冷卻。In a general drip cooling system, the dielectric fluid delivered to the server will drip onto the heat source to effectively absorb the heat generated by the heat source, and then evaporate from a liquid state to a gas state. Since heat sources generate different amounts of heat when subjected to different loads, the amount of dielectric fluid delivered to the server is usually determined based on the amount of heat contained in the heat source when it is under high load. This ensures that the heat source is effectively cooled by the dielectric fluid even at high loads.

然，當伺服器處於低負載時，輸送到伺服器中的介電液往往會有過量而無法有效地從液態蒸發成氣態的情形。如此一來，大部分的介電液在滴至熱源之後並沒有經過相變化，而僅在維持為液態的情況下利用自然對流吸收熱源產生的熱量，這使得滴淋式冷卻系統難以有效地冷卻熱源。However, when the servo is under low load, there is often too much dielectric fluid delivered to the servo to effectively evaporate from the liquid state to the gaseous state. In this way, most of the dielectric fluid does not undergo a phase change after dripping onto the heat source, but only uses natural convection to absorb the heat generated by the heat source while remaining in a liquid state, which makes it difficult for the drip cooling system to cool effectively heat source.

本發明在於提供一種散熱系統以及電子裝置藉由控制工作流體流入殼體的量來確保工作留體能經過相變化而有效地吸收熱源產生的熱量。The present invention provides a heat dissipation system and an electronic device to ensure that the working body can effectively absorb the heat generated by the heat source through phase change by controlling the amount of working fluid flowing into the casing.

本發明一實施例所揭露之散熱系統用以供一工作流體循環並用以冷卻一熱源。散熱系統包含一殼體、一第一管路、一第二管路、一冷凝器以及一流量控制單元。殼體包含一基座以及一隔板。基座包含一容置空間、一流入口以及一流出口。隔板固定於基座並位於容置空間中而將容置空間分隔成一第一容置空間以及一第二容置空間。第一容置空間在一重力方向上位於第二容置空間的上側。流入口連通於第一容置空間。流出口連通於第二容置空間。隔板包含一滴孔。第一容置空間以及第二容置空間透過滴孔彼此相連通。熱源用以位於第二容置空間中。工作流體用以透過滴孔滴至熱源。第一管路的一端連通於流入口。第二管路的一端連通於流出口。第一管路透過冷凝器連通於第二管路。流量控制單元設置於第一管路。The heat dissipation system disclosed in an embodiment of the present invention is used for circulating a working fluid and cooling a heat source. The cooling system includes a casing, a first pipeline, a second pipeline, a condenser and a flow control unit. The casing includes a base and a partition. The base includes an accommodating space, an inlet and an outlet. The partition plate is fixed on the base and located in the accommodation space to divide the accommodation space into a first accommodation space and a second accommodation space. The first accommodating space is located on the upper side of the second accommodating space in a gravity direction. The inflow port communicates with the first accommodating space. The outflow port communicates with the second accommodating space. The separator contains a drop hole. The first accommodating space and the second accommodating space communicate with each other through the drip hole. The heat source is located in the second accommodation space. The working fluid is used to drip to the heat source through the drip hole. One end of the first pipeline communicates with the inflow port. One end of the second pipeline communicates with the outflow port. The first pipeline communicates with the second pipeline through the condenser. The flow control unit is arranged on the first pipeline.

本發明另一實施例所揭露之一種電子裝置用以供一工作流體循環並包含一殼體、一第一管路、一第二管路、一冷凝器、一流量控制單元、一第一熱源以及一第一溫度感測器。殼體包含一基座以及一隔板。基座包含一容置空間、一流入口以及一流出口。隔板固定於基座並位於容置空間中而將容置空間分隔成一第一容置空間以及一第二容置空間。第一容置空間在一重力方向上位於第二容置空間的上側。流入口連通於第一容置空間。流出口連通於第二容置空間。隔板包含一滴孔。第一容置空間以及第二容置空間透過滴孔彼此相連通。第一管路的一端連通於流入口。第二管路的一端連通於流出口。第一管路透過冷凝器連通於第二管路。流量控制單元設置於第一管路。第一熱源位於基座的第二容置空間中。工作流體透過滴孔滴至第一熱源。第一溫度感測器設置於第一熱源而用以感測第一熱源的溫度。An electronic device disclosed in another embodiment of the present invention is used to circulate a working fluid and includes a casing, a first pipeline, a second pipeline, a condenser, a flow control unit, and a first heat source and a first temperature sensor. The casing includes a base and a partition. The base includes an accommodating space, an inlet and an outlet. The partition plate is fixed on the base and located in the accommodation space to divide the accommodation space into a first accommodation space and a second accommodation space. The first accommodating space is located on the upper side of the second accommodating space in a gravity direction. The inflow port communicates with the first accommodating space. The outflow port communicates with the second accommodating space. The separator contains a drop hole. The first accommodating space and the second accommodating space communicate with each other through the drip hole. One end of the first pipeline communicates with the inflow port. One end of the second pipeline communicates with the outflow port. The first pipeline communicates with the second pipeline through the condenser. The flow control unit is arranged on the first pipeline. The first heat source is located in the second accommodating space of the base. The working fluid drips to the first heat source through the drip hole. The first temperature sensor is disposed on the first heat source for sensing the temperature of the first heat source.

根據上述實施例所揭露之散熱系統及電子裝置，由於流量控制單元設置於第一管路，因此流量控制單元得以控制從流入口進入第二容置空間的工作流體之流量，進而控制從滴孔滴至熱源的工作流體之量。因此，流量控制單元得以根據實際需求增加或降低流入第一容置空間的工作流體之流量。如此一來，便不會浪費過多的工作流體而造成成本增加，也不會因工作流體的流量不夠而無法有效地冷卻熱源。According to the heat dissipation system and electronic device disclosed in the above embodiments, since the flow control unit is arranged in the first pipeline, the flow control unit can control the flow of the working fluid from the inlet into the second accommodating space, and then control the flow of the working fluid from the drip hole. The amount of working fluid that drops onto the heat source. Therefore, the flow control unit can increase or decrease the flow of the working fluid flowing into the first accommodating space according to actual needs. In this way, too much working fluid will not be wasted to increase the cost, and the heat source will not be effectively cooled due to insufficient flow of the working fluid.

以下在實施方式中詳細敘述本發明之實施例之詳細特徵以及優點，其內容足以使任何本領域中具通常知識者了解本發明之實施例之技術內容並據以實施，且根據本說明書所揭露之內容、申請專利範圍及圖式，任何本領域中具通常知識者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點，但非以任何觀點限制本發明之範疇。The detailed features and advantages of the embodiments of the present invention are described in detail below in the implementation modes, the content is enough for anyone with ordinary knowledge in the field to understand the technical content of the embodiments of the present invention and implement them accordingly, and according to the disclosure of this specification Anyone with ordinary knowledge in the art can easily understand the related objectives and advantages of the present invention. The following examples are to further describe the concept of the present invention in detail, but not to limit the scope of the present invention in any way.

請參閱圖1及圖2。圖1為根據本發明一實施例的電子裝置之側面示意圖。圖2為圖1中的電子裝置之殼體的側剖示意圖。電子裝置10用以供一工作流體F循環。Please refer to Figure 1 and Figure 2. FIG. 1 is a schematic side view of an electronic device according to an embodiment of the invention. FIG. 2 is a schematic side sectional view of the casing of the electronic device in FIG. 1 . The electronic device 10 is used for circulating a working fluid F. As shown in FIG.

於本實施例中，電子裝置10包含一機架100、一殼體150、一第一管路200、一第二管路250、一冷凝器300、一儲液箱350、一幫浦400、一流量控制單元450、一電路板500、一第一熱源550、一第二熱源600、一第一溫度感測器650、一第二溫度感測器700以及一液位計750。需注意的是，機架100、殼體150、第一管路200、第二管路250、冷凝器300、儲液箱350、幫浦400、流量控制單元450以及液位計750亦可共同作為一散熱系統。In this embodiment, the electronic device 10 includes a frame 100, a housing 150, a first pipeline 200, a second pipeline 250, a condenser 300, a liquid storage tank 350, a pump 400, A flow control unit 450 , a circuit board 500 , a first heat source 550 , a second heat source 600 , a first temperature sensor 650 , a second temperature sensor 700 and a liquid level gauge 750 . It should be noted that the frame 100, the casing 150, the first pipeline 200, the second pipeline 250, the condenser 300, the liquid storage tank 350, the pump 400, the flow control unit 450 and the liquid level gauge 750 can also be used together. as a cooling system.

殼體150設置於機架100並包含一基座151以及一隔板152。並且，殼體150例如為伺服器機殼。於本實施例中，基座151包含一底板153、一側板154、一容置空間155、一流入口156以及一流出口157。側板154立於底板153。隔板152固定於側板154並位於容置空間155中而將容置空間155分隔成一第一容置空間1551以及一第二容置空間1552。第一容置空間1551在一重力方向G上位於第二容置空間1552的上側。第二容置空間1552是由側板154、底板153以及隔板152所共同形成。流入口156連通於第一容置空間1551。於本實施例中，隔板152包含多個滴孔1520。第一容置空間1551以及第二容置空間1552透過滴孔1520彼此相連通。流出口157位於側板154並連通於第二容置空間1552。於本實施例中，流出口157相對底板153的最小高度H1大於工作流體F相對底板153的一預設液位H2。The casing 150 is disposed on the frame 100 and includes a base 151 and a partition 152 . Moreover, the casing 150 is, for example, a server casing. In this embodiment, the base 151 includes a bottom plate 153 , a side plate 154 , an accommodating space 155 , an inlet 156 and an outlet 157 . The side panels 154 stand on the bottom panel 153 . The partition plate 152 is fixed on the side plate 154 and located in the accommodating space 155 to divide the accommodating space 155 into a first accommodating space 1551 and a second accommodating space 1552 . The first accommodating space 1551 is located on the upper side of the second accommodating space 1552 in a gravitational direction G. The second accommodating space 1552 is jointly formed by the side board 154 , the bottom board 153 and the partition board 152 . The inlet 156 communicates with the first accommodating space 1551 . In this embodiment, the partition 152 includes a plurality of drip holes 1520 . The first accommodating space 1551 and the second accommodating space 1552 communicate with each other through the drip hole 1520 . The outlet 157 is located on the side plate 154 and communicates with the second accommodating space 1552 . In this embodiment, the minimum height H1 of the outlet 157 relative to the bottom plate 153 is greater than a predetermined liquid level H2 of the working fluid F relative to the bottom plate 153 .

於本實施例中，第一管路200包含一第一連接管201以及一第二連接管202。第一連接管201的相對兩端分別連通於冷凝器300以及儲液箱350。第二連接管202的相對兩端分別連通於幫浦400以及基座151的流入口156。第二管路250的相對兩端分別連通於基座151的流出口157以及冷凝器300。此外，於本實施例中，冷凝器300設置於機架100，且冷凝器300於重力方向G上位於基座151的上側。儲液箱350及幫浦400設置於機架100，且儲液箱350連通於幫浦400。於本實施例中，流量控制單元450設置於第一管路200的第二連接管202連通於流入口156的一端並例如為閥或是幫浦。In this embodiment, the first pipeline 200 includes a first connecting pipe 201 and a second connecting pipe 202 . Two opposite ends of the first connecting pipe 201 communicate with the condenser 300 and the liquid storage tank 350 respectively. The two opposite ends of the second connecting pipe 202 communicate with the pump 400 and the inlet 156 of the base 151 respectively. Two opposite ends of the second pipeline 250 communicate with the outlet 157 of the base 151 and the condenser 300 respectively. In addition, in this embodiment, the condenser 300 is disposed on the frame 100 , and the condenser 300 is located on the upper side of the base 151 in the direction G of gravity. The liquid storage tank 350 and the pump 400 are disposed on the rack 100 , and the liquid storage tank 350 is connected to the pump 400 . In this embodiment, the flow control unit 450 is disposed at one end of the second connecting pipe 202 of the first pipeline 200 connected to the inlet 156 and is, for example, a valve or a pump.

電路板500位於基座151的第二容置空間1552中。第一熱源550以及第二熱源600設置於電路板500並彼此相間隔。第一熱源550以及第二熱源600例如為中央處理器或圖形處理器。第一溫度感測器650設置於第一熱源550而用以感測第一熱源550的溫度。第二溫度感測器700設置於電路板500並鄰近於第二熱源600而用以感測第二熱源600的溫度。液位計750設置於基座151的第二容置空間1552並用以量測工作流體F於第二容置空間1552中相對底板153的液位。The circuit board 500 is located in the second accommodating space 1552 of the base 151 . The first heat source 550 and the second heat source 600 are disposed on the circuit board 500 and spaced apart from each other. The first heat source 550 and the second heat source 600 are, for example, a central processing unit or a graphics processing unit. The first temperature sensor 650 is disposed on the first heat source 550 to sense the temperature of the first heat source 550 . The second temperature sensor 700 is disposed on the circuit board 500 and adjacent to the second heat source 600 for sensing the temperature of the second heat source 600 . The liquid level gauge 750 is disposed in the second accommodating space 1552 of the base 151 and used for measuring the liquid level of the working fluid F in the second accommodating space 1552 relative to the bottom plate 153 .

工作流體F會透過幫浦400的協助從儲液箱350流動到第二連接管202，並在經由流量控制單元450調整流量之後由流入口156進入第一容置空間1551。進入第一容置空間1551的工作流體F會透過滴孔1520沿重力方向G滴至第一熱源550以及第二熱源600。當工作流體F吸收第一熱源550以及第二熱源600所產生的熱量而蒸發成氣體時，氣態的工作流體F會沿流出方向D從流出口157流出第二容置空間1552。流出第二容置空間1552的氣態工作流體F會透過第二管路250流動到冷凝器300中冷凝成液態，接著在透過第一連接管201流回儲液箱350。The working fluid F flows from the storage tank 350 to the second connecting pipe 202 with the help of the pump 400 , and enters the first accommodating space 1551 through the inlet 156 after the flow is adjusted by the flow control unit 450 . The working fluid F entering the first accommodating space 1551 will drop to the first heat source 550 and the second heat source 600 along the gravity direction G through the drip hole 1520 . When the working fluid F absorbs the heat generated by the first heat source 550 and the second heat source 600 and evaporates into a gas, the gaseous working fluid F flows out of the second accommodating space 1552 from the outlet 157 along the outflow direction D. The gaseous working fluid F flowing out of the second accommodating space 1552 flows into the condenser 300 through the second pipeline 250 to be condensed into a liquid state, and then flows back to the liquid storage tank 350 through the first connecting pipe 201 .

於本實施例中，可根據液位計750量測到的液位來控制流量控制單元450。舉例來說，若液位計750量測到的液位過高，則流量控制單元450會降低流入第一容置空間1551的工作流體F之流量。若液位計750量測到的液位過低，則流量控制單元450會增加流入第一容置空間1551的工作流體F之流量。如此一來，便不會浪費過多的工作流體F而造成成本增加，也不會因工作流體F的流量不夠而無法有效地冷卻第一熱源550以及第二熱源600。需注意的是，於其他實施例中，電子裝置亦可無須包含液位計750。In this embodiment, the flow control unit 450 can be controlled according to the liquid level measured by the liquid level gauge 750 . For example, if the liquid level measured by the liquid level gauge 750 is too high, the flow control unit 450 will reduce the flow rate of the working fluid F flowing into the first accommodating space 1551 . If the liquid level measured by the liquid level gauge 750 is too low, the flow control unit 450 will increase the flow rate of the working fluid F flowing into the first accommodating space 1551 . In this way, too much working fluid F will not be wasted to increase the cost, and the first heat source 550 and the second heat source 600 will not be effectively cooled due to insufficient flow of the working fluid F. It should be noted that, in other embodiments, the electronic device does not need to include the liquid level gauge 750 .

於本實施例中，可根據第一溫度感測器650或第二溫度感測器700量測到的溫度來控制流量控制單元450。舉例來說，若第一溫度感測器650或第二溫度感測器700量測到的溫度過高，則流量控制單元450會增加流入第一容置空間1551的工作流體F之流量。若第一溫度感測器650或第二溫度感測器700量測到的溫度過低，則流量控制單元450會降低流入第一容置空間1551的工作流體F之流量。如此一來，便不會浪費過多的工作流體F而造成成本增加，也不會因工作流體F的流量不夠而無法有效地冷卻第一熱源550以及第二熱源600。需注意的是，於其他實施例中，電子裝置亦可無須包含第一溫度感測器650及第二溫度感測器700。In this embodiment, the flow control unit 450 can be controlled according to the temperature measured by the first temperature sensor 650 or the second temperature sensor 700 . For example, if the temperature measured by the first temperature sensor 650 or the second temperature sensor 700 is too high, the flow control unit 450 will increase the flow of the working fluid F flowing into the first accommodating space 1551 . If the temperature measured by the first temperature sensor 650 or the second temperature sensor 700 is too low, the flow control unit 450 will reduce the flow rate of the working fluid F flowing into the first accommodating space 1551 . In this way, too much working fluid F will not be wasted to increase the cost, and the first heat source 550 and the second heat source 600 will not be effectively cooled due to insufficient flow of the working fluid F. It should be noted that in other embodiments, the electronic device does not need to include the first temperature sensor 650 and the second temperature sensor 700 .

根據上述實施例所揭露之散熱系統及電子裝置，由於流量控制單元設置於第一管路，因此流量控制單元得以控制從流入口進入第二容置空間的工作流體之流量，進而控制從滴孔滴至熱源的工作流體之量。因此，流量控制單元得以根據實際需求增加或降低流入第一容置空間的工作流體之流量。如此一來，便不會浪費過多的工作流體而造成成本增加，也不會因工作流體的流量不夠而無法有效地冷卻熱源。According to the heat dissipation system and electronic device disclosed in the above embodiments, since the flow control unit is arranged in the first pipeline, the flow control unit can control the flow of the working fluid from the inlet into the second accommodating space, and then control the flow of the working fluid from the drip hole. The amount of working fluid that drops onto the heat source. Therefore, the flow control unit can increase or decrease the flow of the working fluid flowing into the first accommodating space according to actual needs. In this way, too much working fluid will not be wasted to increase the cost, and the heat source will not be effectively cooled due to insufficient flow of the working fluid.

此外，由於冷凝器於重力方向上位於基座的上側，因此於冷凝器中凝結成液態的氣態工作流體能更順暢地回收至儲液箱，藉以增加工作流體與熱源的熱交換效率。In addition, since the condenser is located on the upper side of the base in the direction of gravity, the gaseous working fluid condensed into liquid in the condenser can be recovered to the liquid storage tank more smoothly, thereby increasing the heat exchange efficiency between the working fluid and the heat source.

在本發明的一實施例中，本發明之散熱系統以及電子裝置係可應用於伺服器，該伺服器係可用於人工智慧(英語：Artificial Intelligence，簡稱AI)運算、邊緣運算(Edge Computing)，亦可當作5G伺服器、雲端伺服器或車聯網伺服器使用。In one embodiment of the present invention, the heat dissipation system and the electronic device of the present invention can be applied to a server, and the server can be used for artificial intelligence (English: Artificial Intelligence, referred to as AI) computing, edge computing (Edge Computing), It can also be used as a 5G server, cloud server or Internet of Vehicles server.

雖然本發明以前述之諸項實施例揭露如上，然其並非用以限定本發明，任何熟習相像技藝者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be defined in the scope of patent application attached to this specification.

10:電子裝置 100:機架 150:殼體 151:基座 152:隔板 1520:滴孔 153:底板 154:側板 155:容置空間 1551:第一容置空間 1552:第二容置空間 156:流入口 157:流出口 200:第一管路 201:第一連接管 202:第二連接管 250:第二管路 300:冷凝器 350:儲液箱 400:幫浦 450:流量控制單元 500:電路板 550:第一熱源 600:第二熱源 650:第一溫度感測器 700:第二溫度感測器 750:液位計 F:工作流體 G:重力方向 H1:最小高度 H2:預設液位 D:流出方向10: Electronic device 100: Rack 150: shell 151: base 152: clapboard 1520: drip hole 153: Bottom plate 154: side panel 155:Accommodating space 1551: The first storage space 1552: The second storage space 156: Inflow port 157: outlet 200: the first pipeline 201: the first connecting pipe 202: the second connecting pipe 250: Second pipeline 300: condenser 350: liquid storage tank 400: pump 450: flow control unit 500: circuit board 550: first heat source 600: second heat source 650: the first temperature sensor 700: Second temperature sensor 750: liquid level gauge F: working fluid G: Gravity direction H1: minimum height H2: preset liquid level D: outflow direction

圖1為根據本發明一實施例的電子裝置之側面示意圖。 圖2為圖1中的電子裝置之殼體的側剖示意圖。 FIG. 1 is a schematic side view of an electronic device according to an embodiment of the invention. FIG. 2 is a schematic side sectional view of the casing of the electronic device in FIG. 1 .

10:電子裝置 10: Electronic device

100:機架 100: Rack

150:殼體 150: shell

200:第一管路 200: the first pipeline

201:第一連接管 201: the first connecting pipe

202:第二連接管 202: the second connecting pipe

250:第二管路 250: Second pipeline

300:冷凝器 300: condenser

350:儲液箱 350: liquid storage tank

400:幫浦 400: pump

450:流量控制單元 450: flow control unit

G:重力方向 G: Gravity direction

Claims (10)

一種散熱系統，用以供一工作流體循環並用以冷卻一熱源，該散熱系統包含：一殼體，包含一基座以及一隔板，該基座包含一容置空間、一流入口以及一流出口，該隔板固定於該基座並位於該容置空間中而將該容置空間分隔成一第一容置空間以及一第二容置空間，該第一容置空間在一重力方向上位於該第二容置空間的上側，該流入口連通於該第一容置空間，該流出口連通於該第二容置空間，該隔板包含一滴孔，該第一容置空間以及該第二容置空間透過該滴孔彼此相連通，該熱源用以位於該第二容置空間中，該工作流體用以透過該滴孔滴至該熱源；一第一管路，該第一管路的一端連通於該流入口；一第二管路，該第二管路的一端連通於該流出口；一冷凝器，該第一管路透過該冷凝器連通於該第二管路；以及一流量控制單元，設置於該第一管路。A heat dissipation system for circulating a working fluid and cooling a heat source, the heat dissipation system includes: a casing including a base and a partition, the base includes an accommodating space, an inlet and an outlet, The partition plate is fixed on the base and located in the accommodating space to divide the accommodating space into a first accommodating space and a second accommodating space, the first accommodating space is located in the first accommodating space in a gravity direction On the upper side of the two accommodating spaces, the inlet is connected to the first accommodating space, the outflow is connected to the second accommodating space, the partition plate includes a drip hole, the first accommodating space and the second accommodating space The spaces communicate with each other through the drip hole, the heat source is used to be located in the second accommodating space, the working fluid is used to drip to the heat source through the drop hole; a first pipeline, one end of the first pipeline communicates At the inlet; a second pipeline, one end of the second pipeline communicates with the outlet; a condenser, the first pipeline communicates with the second pipeline through the condenser; and a flow control unit , set in the first pipeline. 如請求項1所述之散熱系統，更包含一液位計，該液位計設置於該基座的該第二容置空間並用以量測該工作流體於該第二容置空間中的液位。The heat dissipation system as described in claim 1 further includes a liquid level gauge, which is installed in the second accommodation space of the base and used to measure the liquid level of the working fluid in the second accommodation space bit. 如請求項1所述之散熱系統，其中該流量控制單元為閥或幫浦。The cooling system according to claim 1, wherein the flow control unit is a valve or a pump. 如請求項1所述之散熱系統，更包含彼此連通的一儲液箱以及一幫浦，該第一管路包含一第一連接管以及一第二連接管，該第一連接管的相對兩端分別連通於該冷凝器以及該儲液箱，該第二連接管的相對兩端分別連通於該幫浦以及該殼體的該基座之該流入口，該流量控制單元設置於該第二連接管。The heat dissipation system as described in claim 1 further includes a liquid storage tank and a pump connected to each other, the first pipeline includes a first connecting pipe and a second connecting pipe, and the opposite two ends of the first connecting pipe The opposite ends of the second connecting pipe are respectively connected to the pump and the inlet of the base of the casing, and the flow control unit is arranged on the second Connecting pipe. 如請求項4所述之散熱系統，其中該流量控制單元設置於該第二連接管連通於該流入口的一端。The heat dissipation system according to claim 4, wherein the flow control unit is disposed at one end of the second connecting pipe connected to the inlet. 如請求項1所述之散熱系統，其中該基座包含一底板以及一側板，該側板立於該底板，該側板、該底板以及該隔板共同形成該第二容置空間，該流出口位於該側板。The heat dissipation system as described in claim 1, wherein the base includes a bottom plate and a side plate, the side plate stands on the bottom plate, the side plate, the bottom plate and the partition jointly form the second accommodating space, and the outlet is located at The side panels. 如請求項6所述之散熱系統，其中該流出口相對該底板的最小高度大於該工作流體相對該底板的一預設液位。The heat dissipation system as claimed in claim 6, wherein the minimum height of the outflow port relative to the bottom plate is greater than a preset liquid level of the working fluid relative to the bottom plate. 如請求項1所述之散熱系統，更包含一機架，該殼體的該基座設置於該機架，該冷凝器設置於該機架，該冷凝器於該重力方向上位於該基座的上側。The heat dissipation system as described in claim 1 further comprises a frame, the base of the housing is set on the frame, the condenser is set on the frame, and the condenser is located on the base in the direction of gravity on the upper side. 一種電子裝置，用以供一工作流體循環，該電子裝置包含：一殼體，包含一基座以及一隔板，該基座包含一容置空間、一流入口以及一流出口，該隔板固定於該基座並位於該容置空間中而將該容置空間分隔成一第一容置空間以及一第二容置空間，該第一容置空間在一重力方向上位於該第二容置空間的上側，該流入口連通於該第一容置空間，該流出口連通於該第二容置空間，該隔板包含一滴孔，該第一容置空間以及該第二容置空間透過該滴孔彼此相連通；一第一管路，該第一管路的一端連通於該流入口；一第二管路，該第二管路的一端連通於該流出口；一冷凝器，該第一管路透過該冷凝器連通於該第二管路； 一流量控制單元，設置於該第一管路；一第一熱源，位於該基座的該第二容置空間中，該工作流體透過該滴孔滴至該第一熱源；以及一第一溫度感測器，設置於該第一熱源而用以感測該第一熱源的溫度。An electronic device is used to circulate a working fluid. The electronic device includes: a casing, including a base and a partition, the base includes an accommodating space, an inlet and an outlet, and the partition is fixed on The base is located in the accommodating space and divides the accommodating space into a first accommodating space and a second accommodating space, the first accommodating space is located in a direction of gravity On the upper side, the inlet is connected to the first accommodating space, the outflow is connected to the second accommodating space, the partition plate includes a drop hole, and the first accommodating space and the second accommodating space pass through the drop hole communicate with each other; a first pipeline, one end of the first pipeline communicates with the inlet; a second pipeline, one end of the second pipeline communicates with the outlet; a condenser, the first pipe The pipeline is connected to the second pipeline through the condenser; a flow control unit is arranged in the first pipeline; a first heat source is located in the second accommodating space of the base, and the working fluid passes through the drip The hole drops to the first heat source; and a first temperature sensor is arranged on the first heat source to sense the temperature of the first heat source. 如請求項9所述之電子裝置，更包含一電路板、一第二熱源以及一第二溫度感測器，該電路板位於該第二容置空間中，該第一熱源以及該第二熱源設置於該電路板並彼此相間隔，該第二溫度感測器設置於該電路板並鄰近於該第二熱源而用以感測該第二熱源的溫度。The electronic device as described in Claim 9 further comprises a circuit board, a second heat source and a second temperature sensor, the circuit board is located in the second accommodating space, the first heat source and the second heat source Set on the circuit board and spaced apart from each other, the second temperature sensor is set on the circuit board and adjacent to the second heat source for sensing the temperature of the second heat source.
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CN1601733A (en) * 2004-10-27 2005-03-30 原泽 Active evaporating radiation tech of power semiconductor device or modular
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