TWI783829B - Optical sensing integrated circuit and electronic device with the optical sensing integrated circuit - Google Patents
Optical sensing integrated circuit and electronic device with the optical sensing integrated circuit Download PDFInfo
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本發明是有關一種光感測積體電路,特別是關於一種具有偏振結構的光感測積體電路。 The invention relates to a light-sensing integrated circuit, in particular to a light-sensing integrated circuit with a polarization structure.
光學感測器被應用在具有顯示裝置的行動電子裝置及穿戴式電子裝置來達成一些功能,例如環境光感測器(ambient light sensor)被用來偵測環境的亮度以調整顯示裝置的亮度,接近感測器(proximity sensor)被用來偵測物件的靠近。傳統的光學感測器一般是放置在顯示裝置的屏幕外圍的空間。然而,隨著高屏佔比(screen-to-body ratio)的需求,屏幕外圍可以放置光學感測器的空間越來越少。在具有OLED顯示面板的顯示裝置中,光學感測器設置在OLED顯示面板之下,以達成高屏佔比的需求。 Optical sensors are used in mobile electronic devices and wearable electronic devices with display devices to achieve some functions, such as ambient light sensors (ambient light sensor) are used to detect the brightness of the environment to adjust the brightness of the display device, Proximity sensors are used to detect the approach of objects. Conventional optical sensors are generally placed in the peripheral space of the screen of the display device. However, with the demand for a high screen-to-body ratio, there is less and less space for placing optical sensors around the screen. In a display device with an OLED display panel, the optical sensor is disposed under the OLED display panel to achieve a high screen-to-body ratio.
然而,OLED顯示面板的光線會影響光學感測器的偵測結果。因此有必要對習知技術加以改良。 However, the light of the OLED display panel will affect the detection result of the optical sensor. Therefore it is necessary to improve the prior art.
本發明的目的之一,在於提出一種具有偏振結構的光感測積體電路。 One of the objectives of the present invention is to provide a photo-sensing integrated circuit with a polarization structure.
本發明的目的之一,在於提出一種使用具有偏振結構的光感測積體電路的電子裝置。 One of the objectives of the present invention is to provide an electronic device using a light-sensing integrated circuit with a polarization structure.
根據本發明,一種電子裝置包括一有機發光二極體顯示面板、一偏振片、一第一四分之一波片以及一光感測積體電路。該偏振片位於該有機發光二極體顯示面板的上方,具有一第一偏振方向。該第一四分之一波片位在該有機發光二極體顯示面板及該偏振片之間。該光感測積體電路位於該有機發光二極體顯示面板的下方。該光感測積體電路包含一基板、一晶片、一第一光學元件、一第二光學元件、一封裝體及一第二四分之一波片。該晶片位於該基板上,其中該晶片具有一第一光學感測器及一第二光學感測器分別產生一第一感測值及一第二感測值。該第一光學元件位於該第一光學感測器上並且包含一第一透明基底及一第一偏振結構位於該第一透明基底與該第一光學感測器之間,其中該第一偏振結構具有一第二偏振方向。該第二光學元件位於該第二光學感測器上並且包含一第二透明基底及一第二偏振結構位於該第二透明基底與該第二光學感測器之間,其中該第二偏振結構具有垂直於該第二偏振方向的一第三偏振方向。該封裝體與該基板之間形成一容置空間以容納該晶片、該第一光學元件及該第二光學元件,並且該封裝體具有一開口正對於該第一光學感測器及該第二光學感測器。該第二四分之一波片裝設在該開口以覆蓋該第一光學感測器及該第二光學感測器。 According to the present invention, an electronic device includes an organic light emitting diode display panel, a polarizer, a first quarter-wave plate, and a light-sensing integrated circuit. The polarizer is located above the OLED display panel and has a first polarization direction. The first quarter-wave plate is located between the OLED display panel and the polarizer. The photo-sensing integrated circuit is located under the OLED display panel. The photo-sensing integrated circuit includes a substrate, a chip, a first optical element, a second optical element, a packaging body and a second quarter-wave plate. The chip is located on the substrate, wherein the chip has a first optical sensor and a second optical sensor to generate a first sensing value and a second sensing value respectively. The first optical element is located on the first optical sensor and includes a first transparent substrate and a first polarizing structure located between the first transparent substrate and the first optical sensor, wherein the first polarizing structure has a second polarization direction. The second optical element is located on the second optical sensor and includes a second transparent substrate and a second polarization structure located between the second transparent substrate and the second optical sensor, wherein the second polarization structure There is a third polarization direction perpendicular to the second polarization direction. An accommodating space is formed between the package body and the substrate to accommodate the chip, the first optical element and the second optical element, and the package body has an opening facing the first optical sensor and the second optical sensor. optical sensor. The second quarter-wave plate is installed on the opening to cover the first optical sensor and the second optical sensor.
根據本發明,一種光感測積體電路包括一基板、一晶片、一第一光學元件、一第二光學元件、一封裝體以及一四分之一波片。該晶片位於該基板上,其中該晶片具有一第一光學感測器及一第二光學感測器分別產生一第一感測值及一第二感測值。該第一光學元件位於該第一光學感測器上並且包含一第一透明基底及一第一偏振結構位於該第一透明基底與該第一光學感測器之間,其中該第一偏振結構具有一第一偏振方向。該第二光學元件位於該第二光學感測器上並且包含一第二透明基底及一第二偏振結構位於該第二透明基底與該第二光學感測器之間,其中該第二偏振結構具有垂直於該第一偏振方向的一 第二偏振方向。該封裝體與該基板之間形成一容置空間以容納該晶片、該第一光學元件及該第二光學元件,並且該封裝體具有一開口正對於該第一光學感測器及該第二光學感測器。該四分之一波片裝設在該開口以覆蓋該第一光學感測器及該第二光學感測器。 According to the present invention, a photo-sensing integrated circuit includes a substrate, a chip, a first optical element, a second optical element, a package and a quarter-wave plate. The chip is located on the substrate, wherein the chip has a first optical sensor and a second optical sensor to generate a first sensing value and a second sensing value respectively. The first optical element is located on the first optical sensor and includes a first transparent substrate and a first polarizing structure located between the first transparent substrate and the first optical sensor, wherein the first polarizing structure has a first polarization direction. The second optical element is located on the second optical sensor and includes a second transparent substrate and a second polarization structure located between the second transparent substrate and the second optical sensor, wherein the second polarization structure with a direction perpendicular to the first polarization Second polarization direction. An accommodating space is formed between the package body and the substrate to accommodate the chip, the first optical element and the second optical element, and the package body has an opening facing the first optical sensor and the second optical sensor. optical sensor. The quarter-wave plate is installed on the opening to cover the first optical sensor and the second optical sensor.
根據本發明,一種電子裝置包括一有機發光二極體顯示面板、一偏振片、一第一四分之一波片以及一光感測積體電路。該偏振片位於該有機發光二極體顯示面板的上方,具有一第一偏振方向。該第一四分之一波片位在該有機發光二極體顯示面板及該偏振片之間。該光感測積體電路位於該有機發光二極體顯示面板的下方。該光感測積體電路包含:一基板、一晶片、一光學元件、一封裝體及一第二四分之一波片。該晶片位於該基板上,其中該晶片具有一第一光學感測器及一第二光學感測器分別產生一第一感測值及一第二感測值。該光學元件位於該第一光學感測器及該第二光學感測器上並且包含一透明基底、一第一偏振結構及一第二偏振結構,其中該第一偏振結構位於該透明基底與該第一光學感測器之間,該第二偏振結構位於該透明基底與該第二光學感測器之間,該第一偏振結構具有一第二偏振方向,該第二偏振結構具有垂直於該第二偏振方向的一第三偏振方向。該封裝體與該基板之間形成一容置空間以容納該晶片及該光學元件,並且該封裝體具有一開口正對於該第一光學感測器及該第二光學感測器。該第二四分之一波片裝設在該開口以覆蓋該第一光學感測器及該第二光學感測器。 According to the present invention, an electronic device includes an organic light emitting diode display panel, a polarizer, a first quarter-wave plate, and a light-sensing integrated circuit. The polarizer is located above the OLED display panel and has a first polarization direction. The first quarter-wave plate is located between the OLED display panel and the polarizer. The photo-sensing integrated circuit is located under the OLED display panel. The photo-sensing integrated circuit includes: a substrate, a chip, an optical element, a packaging body and a second quarter-wave plate. The chip is located on the substrate, wherein the chip has a first optical sensor and a second optical sensor to generate a first sensing value and a second sensing value respectively. The optical element is located on the first optical sensor and the second optical sensor and includes a transparent substrate, a first polarizing structure and a second polarizing structure, wherein the first polarizing structure is located on the transparent substrate and the transparent substrate Between the first optical sensors, the second polarization structure is located between the transparent substrate and the second optical sensor, the first polarization structure has a second polarization direction, and the second polarization structure has a direction perpendicular to the A third polarization direction of the second polarization direction. An accommodating space is formed between the package body and the substrate to accommodate the chip and the optical element, and the package body has an opening facing the first optical sensor and the second optical sensor. The second quarter-wave plate is installed on the opening to cover the first optical sensor and the second optical sensor.
根據本發明,一種光感測積體電路包括一基板、一晶片、一光學元件、一封裝體以及一四分之一波片。該晶片位於該基板上,其中該晶片具有一第一光學感測器及一第二光學感測器分別產生一第一感測值及一第二感測值。該光學元件位於該第一光學感測器及該第二光學感測器上並且包含一透明基底、一第一偏振結構及一第二偏振結構,其中該第一偏振結構位於該透明基 底與該第一光學感測器之間,該第二偏振結構位於該透明基底與該第二光學感測器之間,該第一偏振結構具有一第一偏振方向,該第二偏振結構具有垂直於該第一偏振方向的一第二偏振方向。該封裝體與該基板之間形成一容置空間以容納該晶片及該光學元件,並且該封裝體具有一開口正對於該第一光學感測器及該第二光學感測器。該四分之一波片裝設在該開口以覆蓋該第一光學感測器及該第二光學感測器。 According to the present invention, a photo-sensing integrated circuit includes a substrate, a chip, an optical element, a package and a quarter-wave plate. The chip is located on the substrate, wherein the chip has a first optical sensor and a second optical sensor to generate a first sensing value and a second sensing value respectively. The optical element is located on the first optical sensor and the second optical sensor and includes a transparent substrate, a first polarization structure and a second polarization structure, wherein the first polarization structure is located on the transparent substrate Between the bottom and the first optical sensor, the second polarization structure is located between the transparent substrate and the second optical sensor, the first polarization structure has a first polarization direction, and the second polarization structure has A second polarization direction perpendicular to the first polarization direction. An accommodating space is formed between the package body and the substrate to accommodate the chip and the optical element, and the package body has an opening facing the first optical sensor and the second optical sensor. The quarter-wave plate is installed on the opening to cover the first optical sensor and the second optical sensor.
10:光感測積體電路 10: Light sensing integrated circuit
12:基板 12: Substrate
14:晶片 14: Wafer
142:光學感測器 142: Optical sensor
144:光學感測器 144: Optical sensor
16:光學元件 16: Optical components
162:透明基底 162: Transparent base
164:偏振結構 164:Polarization structure
1642:金屬線 1642: metal wire
1644:金屬線 1644: metal wire
1646:金屬線 1646: metal wire
166:透明保護層 166: transparent protective layer
18:光學元件 18: Optical components
182:透明基底 182: Transparent base
184:偏振結構 184:Polarization structure
186:透明保護層 186: transparent protective layer
20:打線 20: Line up
22:封裝體 22: Encapsulation
24:容置空間 24:Accommodating space
26:四分之一波片 26: Quarter wave plate
30:光感測積體電路 30: Light sensing integrated circuit
32:光學元件 32: Optical components
322:透明基底 322: Transparent base
324:偏振結構 324:Polarization structure
326:偏振結構 326:Polarization structure
328:透明保護層 328: transparent protective layer
40:電子裝置 40:Electronic device
42:偏振片 42: Polarizer
44:四分之一波片 44: Quarter wave plate
46:OLED顯示面板 46: OLED display panel
P1:偏振方向 P1: polarization direction
P2:偏振方向 P2: Polarization direction
P3:偏振方向 P3: Polarization direction
L1:環境光 L1: ambient light
L2:線偏振光 L2: linearly polarized light
L3:圓偏振光 L3: circularly polarized light
L4:線偏振光 L4: linearly polarized light
圖1顯示本發明光感測積體電路的第一實施例的剖面圖。 FIG. 1 shows a cross-sectional view of the first embodiment of the photo-sensing integrated circuit of the present invention.
圖2顯示圖1的光感測積體電路的上視圖。 FIG. 2 shows a top view of the photo-sensing integrated circuit of FIG. 1 .
圖3為圖1中偏振結構的局部放大圖。 FIG. 3 is a partially enlarged view of the polarization structure in FIG. 1 .
圖4顯示圖1中光學元件的放大圖。 Figure 4 shows an enlarged view of the optical element in Figure 1 .
圖5至圖9顯示圖1的光感測積體電路的封裝流程。 5 to 9 show the packaging process of the photo-sensing integrated circuit shown in FIG. 1 .
圖10顯示本發明光感測積體電路的第二實施例的剖面圖。 FIG. 10 shows a cross-sectional view of the second embodiment of the photo-sensing integrated circuit of the present invention.
圖11顯示使用圖1的光感測積體電路的電子裝置。 FIG. 11 shows an electronic device using the photo-sensing IC of FIG. 1 .
圖1顯示本發明的光感測積體電路10的剖面圖,圖2顯示本發明的光感測積體電路10的上視圖。光感測積體電路10包括基板12、晶片14、光學元件16及18、打線20、封裝體22及四分之一波片26。晶片14位於基板12上,且晶片14具有二個光學感測器142及144用以感測光線以分別產生感測值C1及C2。在一實施例中,光學感測器142及144可以是但不限於光二極體(photodiode)。光學元件16位於光學感測器142上並且包含透明基底162、偏振結構164及透明保護層166。偏振結構164位於透明基底162與光學感測器142之間,且具有偏振方向P1。為了避免光學元件16放到晶片14上時,偏振結構164與晶片14碰撞而損毀,透明
保護層166被配置在偏振結構164及光學感測器142之間,並且包覆偏振結構164。光學元件18位於光學感測器144上並且包含透明基底182、偏振結構184及透明保護層186。偏振結構184位於透明基底182與光學感測器144之間,且具有垂直於偏振方向P1的偏振方向P2。為了避免光學元件18放到晶片14上時,偏振結構184與晶片14碰撞而損毀,透明保護層186被配置在偏振結構184及光學感測器144之間,並且包覆偏振結構184。打線20連接基板12及晶片14,以使晶片14上的訊號或資料可傳送至基板12上。封裝體22與基板12之間形成一容置空間24以容納晶片14、光學元件16及18以及打線20,封裝體22具有一開口222(參見圖9)正對於光學感測器142及144。四分之一波片26裝設在封裝體22的開口222以覆蓋光學感測器142及144。
FIG. 1 shows a cross-sectional view of the light-sensing
在圖1的光感測積體電路10中,偏振結構164是位在透明基底162之下靠近光學感測器142,能夠確保進入光學感測器142的光線必然會通過偏振結構164。如果是將偏振結構164設置於透明基底162之上而遠離光學感測器142,某些光線,例如無偏振態的光線或垂直於偏振方向P1的偏振光,可能沒經過偏振結構164,而是從透明基底162的側邊進入光學感測器142,影響到光學感測器142的感測結果。同樣的,偏振結構184是透過透明保護層186貼附在光學感測器144上,因此進入光學感測器144的光線也必然要通過偏振結構184,避免非預期的光線,例如無偏振態的光線或垂直於偏振方向P2的偏振光,進入光學感測器144。
In the photo-sensing
圖3為圖1中偏振結構164的局部放大圖。偏振結構164是由多條平行於偏振方向P1的金屬線1642、1644及1646構成,其中金屬線1642、1644及1646的線高(height)H可以是但不限於200nm~300nm,金屬線1642、1644及1646的線寬(width)W可以是但不限於30nm~80nm,相鄰金屬線之間的線間(space)S可以是但不限於20nm~100nm。金屬線1642、1644及1646的材質可以是鋁或金,但不限
於此。偏振結構184類似於偏振結構164,差別在於偏振結構184的金屬線是平行於偏振方向P2。
FIG. 3 is a partially enlarged view of the
圖4為圖1中光學元件16的放大圖。為了保護偏振結構164,透明保護層166的厚度T需大於金屬線1642、1644及1646的線高H。同樣的,光學元件18的透明保護層186的厚度T也會大於偏振結構184的金屬線的線高H。在一實施例中,透明保護層166及186的厚度T為1um,但本發明不限於此。
FIG. 4 is an enlarged view of the
在一實施例中,透明基底162、透明基底182及四分之一波片26可以是光學玻璃,但本發明不限於此,透明基底162、透明基底182及四分之一波片26也可以是其他耐熱的透明材料。
In one embodiment, the
圖5至圖9顯示光感測積體電路10的封裝流程。首先進行圖5的步驟S100,將晶片14固定在基板12上,如圖6所示。在一實施例中,晶片14可以藉由晶片黏結薄膜(Die Attach Film;DAF)貼附在基板12上,接著再進行烘烤以使晶片14固定在基板12上。在晶片14固定在基板12上後進行圖5的步驟S102,將光學元件16及18配置在晶片14上,如圖7所示。在一實施例中,光學元件16及18可以藉由黏著矽膠貼附在晶片14上,接著再進行烘烤以使光學元件16及18固定在晶片14上。在光學元件16及18固定在晶片14上後進行圖5的步驟S104,進行打線程序以在基板12及晶片14之間形成打線20,如圖8所示。在完成打線20後進行圖5的步驟S106,將封裝體22固定在基板12上,如圖9所示。在一實施例中,封裝體22可以藉由黏著矽膠貼附在基板12上,接著再進行烘烤以使封裝體22固定在基板12上。在將封裝體22固定在基板12上後進行圖5的步驟S108,將四分之一波片26裝設在封裝體22的開口222上以完成本發明的光感測積體電路10,如圖1所示。在一實施例中,四分之一波片26可以藉由黏著矽膠貼附在封裝體22上,接著再進行烘烤以使四分之一波片26固定在封裝體22上。
5 to 9 show the packaging process of the photo-sensing
習知的光感測積體電路中,可透過晶片14的金屬層在光學感測器
142及144上形成偏振結構,但此偏振結構的線寬會受限於晶片14的製程,而且較不易製作,造成晶片14的良率偏低。本發明將偏振結構164及184先分別製作在透明基底162及182上後,再貼附至光學感測器142及144上,因此偏振結構的線寬不必受限於晶片14的製程,而且更容易製作。
In a conventional light-sensing integrated circuit, the metal layer that can pass through the
圖10顯示本發明的光感測積體電路的另一實施例的剖面圖。光感測積體電路30與光感測積體電路10同樣包括基板12、晶片14、打線20、封裝體22及四分之一波片26,差別在於,光感測積體電路30只使用一個光學元件32。光學元件32位於光學感測器142及144上並且包含透明基底322、偏振結構324、偏振結構326及透明保護層328。偏振結構324位於透明基底322與光學感測器142之間,且具有偏振方向P1。偏振結構326位於透明基底322與光學感測器144之間,且具有垂直於偏振方向P1的偏振方向P2。為了避免光學元件42放到晶片14上時,偏振結構324及326與晶片14碰撞而損毀,透明保護層328被配置在偏振結構324及光學感測器142之間,以及在偏振結構326與光學感測器144之間,並且包覆偏振結構324及326。
FIG. 10 shows a cross-sectional view of another embodiment of the photo-sensing integrated circuit of the present invention. The light-sensing
光感測積體電路30的封裝流程與光感測積體電路10幾乎相同,可參照圖5的封裝流程,差異在於,光感測積體電路30的封裝流程在步驟S102時,將光學元件32配置在晶片14上。在一實施例中,光學元件32可以藉由黏著矽膠貼附在晶片14上,接著再進行烘烤以使光學元件32固定在晶片14上。
The packaging process of the photo-sensing
圖11顯示使用本發明的光感測積體電路10的電子裝置40。電子裝置40包括偏振片42、四分之一波片44、OLED顯示面板46及光感測積體電路10。偏振片42位於OLED顯示面板46的上方,且具有偏振方向P3。四分之一波片44位在偏振片42及OLED顯示面板46之間。光感測積體電路10位於OLED顯示面板46的下方。在此實施例中,偏振片42的偏振方向P3是平行於偏振結構164的偏振方向P1,但本發明不限於此,偏振方向P3與偏振方向P1之間也可以具有大於0度
且小於90度的夾角。
FIG. 11 shows an
在一實施例中,光感測積體電路10為一環境光感測器用以偵測電子裝置40外部的環境光強度。當電子裝置40外部的無偏振態(non-polarized)的環境光L1通過偏振片42後將成為具有偏振方向P3的線偏振光(linearly polarized light)L2。線偏振光L2再通過四分之一波片44後將成為圓偏振光L3。接著,當圓偏振光L3通過光感測積體電路10的四分一波片26後,圓偏振光L3會恢復為具有偏振方向P3的線偏振光L4。由於光感測積體電路10中光學元件16的偏振結構164的偏振方向P1平行於偏振方向P3,因此線偏振光L4可以通過偏振結構164進入光學感測器142。光感測積體電路10中光學元件18的偏振結構184的偏振方向P2垂直於偏振方向P3,因此線偏振光L4會被偏振結構184阻擋而無法進入光學感測器144。同時,OLED顯示面板46也可能會產生光線L5至光感測積體電路10,由於光線L5是無偏振態,因此光線L5通過四分之一波片26後幾乎不受影響。接著,光線L5會被偏振結構164及184濾除一部分。由於偏振結構164的偏振方向P1垂直於偏振結構184的偏振方向P2,因此可視為偏振結構164允許一半的光線L5進入光學感測器142,而偏振結構184也允許一半的光線L5進入光學感測器144。換言之,光學感測器142將產生感測值C1=L4+L5/2,而光學感測器144將產生感測值C2=L5/2,最後將感測值C1減去感測值C2即可消除OLED顯示面板46的干擾,得到線偏振光L4,進而能夠準確判斷環境光L1的強度。在一實施例中,圖11中的光感測積體電路10也可以用光感測積體電路30取代。
In one embodiment, the light-sensing
在上述實施例中,光感測積體電路10或30為一環境光感測器,但本發明不限於此,光感測積體電路10或30也可以是其他光學感測器,例如接近感測器、距離感測器或屏下指紋感測器。
In the above embodiments, the light-sensing
在傳統的電子裝置中,四分之一波片與環境光感測器是二個獨立元件,四分之一波片是設置在環境光感測器的封裝體之上,因此傳統的電子裝
置會有較大的厚度。此外,在組裝電子裝置時,四分之一波片與環境光感測器中的光學感測器需要準確對位,因此組裝工序較複雜,而且一旦組裝出現偏差,光路徑就可出現誤差,進而導致錯誤的偵測結果。本發明將四分之一波片26整合在光感測積體電路10或30中,因此可以減少電子裝置40的厚度,而且在光感測積體電路10或30的封裝過程中,四分之一波片26已與光學感測器142及144完成對位,因此組裝電子裝置40的工序可以被簡化,也不會因電子裝置40的組裝出現偏差導致錯誤的偵測結果。
In traditional electronic devices, the quarter-wave plate and the ambient light sensor are two independent components, and the quarter-wave plate is set on the package of the ambient light sensor. Therefore, the traditional electronic device
There will be a greater thickness. In addition, when assembling electronic devices, the quarter-wave plate and the optical sensor in the ambient light sensor need to be accurately aligned, so the assembly process is more complicated, and once the assembly deviates, the optical path may have errors. This leads to false detection results. The present invention integrates the quarter-
以上對於本發明之較佳實施例所作的敘述係為闡明之目的,而無意限定本發明精確地為所揭露的形式,基於以上的教導或從本發明的實施例學習而作修改或變化是可能的,實施例係為解說本發明的原理以及讓熟習該項技術者以各種實施例利用本發明在實際應用上而選擇及敘述,本發明的技術思想企圖由之後的申請專利範圍及其均等來決定。 The above descriptions of the preferred embodiments of the present invention are for the purpose of illustration, and are not intended to limit the present invention to the disclosed form. It is possible to modify or change based on the above teachings or learning from the embodiments of the present invention. The embodiment is selected and described in order to explain the principle of the present invention and to allow those familiar with the art to use the present invention in various embodiments for practical application. Decide.
10:光感測積體電路 10: Light sensing integrated circuit
12:基板 12: Substrate
14:晶片 14: Wafer
142:光學感測器 142: Optical sensor
144:光學感測器 144: Optical sensor
16:光學元件 16: Optical components
162:透明基底 162: Transparent base
164:偏振結構 164:Polarization structure
166:透明保護層 166: transparent protective layer
18:光學元件 18: Optical components
182:透明基底 182: Transparent base
184:偏振結構 184:Polarization structure
186:透明保護層 186: transparent protective layer
20:打線 20: Line up
22:封裝體 22: Encapsulation
24:容置空間 24:Accommodating space
26:四分之一波片 26: Quarter wave plate
Claims (22)
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US20160193963A1 (en) * | 2008-07-10 | 2016-07-07 | Gentex Corporation | Rearview mirror assemblies with anisotropic polymer laminates |
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US20160193963A1 (en) * | 2008-07-10 | 2016-07-07 | Gentex Corporation | Rearview mirror assemblies with anisotropic polymer laminates |
TW202102911A (en) * | 2019-07-07 | 2021-01-16 | 奕力科技股份有限公司 | Display device, operating method thereof and integrated control chip |
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