TWI781616B - Display panel and manufacture method of the display panel - Google Patents

Display panel and manufacture method of the display panel Download PDF

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TWI781616B
TWI781616B TW110117186A TW110117186A TWI781616B TW I781616 B TWI781616 B TW I781616B TW 110117186 A TW110117186 A TW 110117186A TW 110117186 A TW110117186 A TW 110117186A TW I781616 B TWI781616 B TW I781616B
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light
micro
electrode
adhesive
transparent substrate
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TW110117186A
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TW202245244A (en
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林益祥
林輝巨
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鴻海精密工業股份有限公司
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Abstract

The present disclosure provides a display panel including: a transparent substrate; a plurality of electrode blocks on the transparent substrate, each of the plurality of electrode blocks being provided with a light transmission slit; a plurality of conductive adhesive blocks, each of the plurality of conductive adhesive blocks being on a side of one of the plurality of electrode blocks away from the transparent substrate, and each of the plurality of conductive adhesive blocks being partially embedded in the light transmission slit of one of the plurality of electrode blocks; and a plurality of micro light-emitting diodes, each of the plurality of micro light-emitting diodes being fixed on and being electrically connected with one of the plurality of electrode blocks via one of the plurality of conductive adhesive blocks. The present disclosure also provides a manufacture method of the display panel.

Description

顯示面板及顯示面板的製備方法 Display panel and method for preparing display panel

本申請涉及顯示領域，尤其涉及一種顯示面板和該顯示面板的製備方法。 The present application relates to the display field, in particular to a display panel and a method for preparing the display panel.

目前的顯示技術中，微型發光二極體(Light Emitting Diode，LED)具有高亮度、低功耗的特點，且微型LED顯示面板採用自發光技術，具有更好的色彩表現。目前微型LED顯示面板的生產製程，在巨量轉移的過程中會出現黏合材料的非均勻溢出，導致短路或微型LED晶粒歪斜。在檢測與修復過程中，需要對微型LED進行點亮檢測，即對微型LED通電，並檢測微型LED是否發光。對於垂直型微型LED，點亮檢測需要在設置上電極塊後進行，若檢測出異常，其修復過程需要將上電極塊拆除，成本與修復難度較高。 In the current display technology, micro light emitting diodes (Light Emitting Diode, LED) have the characteristics of high brightness and low power consumption, and the micro LED display panel adopts self-luminous technology, which has better color performance. In the current production process of micro-LED display panels, there will be non-uniform overflow of adhesive materials during the mass transfer process, resulting in short circuits or skewed micro-LED grains. In the detection and repair process, it is necessary to perform lighting detection on the micro-LED, that is, power on the micro-LED and detect whether the micro-LED emits light. For vertical micro-LEDs, the lighting detection needs to be carried out after the upper electrode block is installed. If an abnormality is detected, the repair process needs to remove the upper electrode block, which is costly and difficult to repair.

本申請一方面提供一種顯示面板，其包括：透明基板；複數電極塊，所述複數電極塊位於所述透明基板上，每一電極塊上開設有透光狹縫；複數導電的黏合塊，每一黏合塊塗布於一電極塊遠離所述透明基板的表面，且每一黏合塊部分嵌入一電極塊的透光狹縫中；複數微型發光二極體，每一微型發光二極體經由一黏合塊固定在一電極塊上並與該電極塊電連接。 One aspect of the present application provides a display panel, which includes: a transparent substrate; a plurality of electrode blocks, the plurality of electrode blocks are located on the transparent substrate, each electrode block is provided with a light-transmitting slit; a plurality of conductive adhesive blocks, each An adhesive block is coated on the surface of an electrode block away from the transparent substrate, and each adhesive block is partially embedded in the light-transmitting slit of an electrode block; a plurality of micro light emitting diodes, each micro light emitting diode is bonded through a The block is fixed on an electrode block and is electrically connected with the electrode block.

所述透光狹縫與所述電極塊之間形成高度差，使得所述黏合塊在綁定過程中部分嵌入所述透光狹縫，從而有利於避免多餘的黏合材料溢出；同時，由於所述透光狹縫增大了所述黏合塊與所述電極塊的接觸面積，有利於提 升所述微型LED與所述電極塊之間的附著力，減小所述黏合塊的阻值，從而有利於提升綁定的品質。 A height difference is formed between the light-transmitting slit and the electrode block, so that the adhesive block is partially embedded in the light-transmitting slit during the binding process, thereby helping to prevent excess adhesive material from overflowing; at the same time, due to the The light-transmitting slit increases the contact area between the adhesive block and the electrode block, which is beneficial to improve Improve the adhesive force between the micro-LED and the electrode block, reduce the resistance of the adhesive block, which is beneficial to improve the binding quality.

在一實施例中，每一電極塊上的透光狹縫形成的狹縫圖案被一所述微型LED部分覆蓋。 In one embodiment, the slit pattern formed by the light-transmitting slits on each electrode block is partially covered by one of the micro LEDs.

在一實施例中，所述電極塊為不透明的導電材料。 In one embodiment, the electrode block is made of opaque conductive material.

所述透光狹縫在一不透明的電極塊上形成的狹縫圖案被一微型LED部分覆蓋，有利於在點亮檢測過程中，透過未被覆蓋的部分透光狹縫檢測微型LED是否發光。 The slit pattern formed by the light-transmitting slit on an opaque electrode block is partially covered by a micro-LED, which is beneficial to detect whether the micro-LED emits light through the uncovered part of the light-transmitting slit during the lighting detection process.

在一實施例中，所述微所述微型LED為水平式微型LED或垂直式微型LED。 In one embodiment, the micro LEDs are horizontal micro LEDs or vertical micro LEDs.

本申請另一方面提供一種顯示面板的製備方法，其包括：提供一透明基板；在所述透明基板上形成複數電極塊；在每一所述電極塊上開設透光狹縫；在每一所述電極塊遠離所述透明基板的表面上塗布黏合膠；轉移複數微型LED於所述透明基板上，使得每一所述微型LED藉由所述黏合膠固定在一電極塊上，並使得黏合膠部分嵌入所述電極塊的透光狹縫中。 Another aspect of the present application provides a method for manufacturing a display panel, which includes: providing a transparent substrate; forming a plurality of electrode blocks on the transparent substrate; opening a light-transmitting slit on each of the electrode blocks; Coating adhesive glue on the surface of the electrode block away from the transparent substrate; transferring a plurality of micro-LEDs on the transparent substrate, so that each of the micro-LEDs is fixed on an electrode block by the adhesive glue, and the adhesive glue Partially embedded in the light-transmitting slit of the electrode block.

所述使得黏合膠部分嵌入所述電極塊的透光狹縫中，有利於避免微型LED晶粒在綁定過程中歪斜。 The part of the adhesive glue embedded in the light-transmitting slit of the electrode block is beneficial to avoid skewing of micro-LED crystal grains during the binding process.

在一實施例中，所述轉移複數微型LED於所述透明基板上的步驟還包括使微型LED部分覆蓋所述透光狹縫。 In one embodiment, the step of transferring a plurality of micro-LEDs on the transparent substrate further includes making the micro-LEDs partially cover the light-transmitting slit.

在一實施例中，所述製備方法在轉移複數微型LED於所述透明基板上之後還包括：藉由所述電極塊對所述複數微型LED進行通電；透過所述透光狹縫，檢測所述複數微型LED是否發光。 In one embodiment, after transferring the plurality of micro-LEDs on the transparent substrate, the preparation method further includes: electrifying the plurality of micro-LEDs through the electrode block; Whether the plurality of micro-LEDs emit light.

在一實施例中，所述每一所述微型LED包括位於靠近所述透明基板一側的下電極與位於遠離所述透明基板一側的上電極。 In one embodiment, each of the micro-LEDs includes a lower electrode on a side close to the transparent substrate and an upper electrode on a side away from the transparent substrate.

在一實施例中，所述對所述電極塊進行通電的步驟具體為：使用探針對每一所述微型LED的上電極通電。 In one embodiment, the step of energizing the electrode block is specifically: using a probe to energize the upper electrode of each micro LED.

所述使微型LED部分覆蓋所述透光狹縫，有利於在點亮檢測過程中藉由狹縫檢查垂直型微型LED是否發光，避免了由於探針體積過大從而難以直接檢測微型LED的發光情況。所述使用探針對每一微型LED的上電極通電，用於點亮檢測，有利於在設置電極層之前進行檢查，優化了檢查的流程，避免了對微型LED進行更換或修復時還需一併拆解電極層，有利於節約成本，同時有利於減少拆裝流程並降低了技術難度。 The said part of the micro-LED covering the light-transmitting slit is beneficial to check whether the vertical micro-LED emits light through the slit during the lighting detection process, and avoids the difficulty of directly detecting the light-emitting situation of the micro-LED due to the excessive volume of the probe. . The use of probes to energize the upper electrode of each micro-LED for lighting detection is conducive to inspection before setting the electrode layer, optimizes the inspection process, and avoids the need to replace or repair the micro-LED together. Dismantling the electrode layer is conducive to saving costs, and at the same time helps to reduce the disassembly process and technical difficulty.

在一實施例中，所述黏合膠為紫外線固晶膠，所述使得每一微型發光二極體藉由一黏合膠固定在一電極塊上具體為：藉由所述透光狹縫進行光線輻照，固化所述黏合膠。 In one embodiment, the adhesive is an ultraviolet crystal-bonding adhesive, and the fixing of each miniature light-emitting diode on an electrode block by an adhesive is specifically: passing light through the light-transmitting slit Irradiation cures the adhesive.

所述藉由透光狹縫進行光線輻照，固化紫外線固晶膠，有利於優化綁定的流程以及提升綁定的品質。 The light irradiation through the light-transmitting slit and the curing of the ultraviolet crystal-bonding glue are beneficial to optimize the binding process and improve the binding quality.

100:顯示面板 100: display panel

10:透明基板 10: Transparent substrate

30:電極塊 30: electrode block

31:透光狹縫 31: Light-transmitting slit

50:黏合塊 50: Glue Block

70:微型LED 70: Micro LED

71:下電極 71: Bottom electrode

73:上電極 73: Upper electrode

40:絕緣層 40: insulation layer

41:黑矩陣 41: Black Matrix

80:平坦化層 80: Planarization layer

90:電極層 90: electrode layer

91:連接部 91: Connecting part

93:電極部 93: electrode part

a:探針 a: Probe

b:光學檢測機 b: optical detection machine

S1、S2、S3、S4、S5、S6、S7、S8:步驟 S1, S2, S3, S4, S5, S6, S7, S8: steps

圖1為本申請一實施例中顯示面板的部分剖視圖。 FIG. 1 is a partial cross-sectional view of a display panel in an embodiment of the present application.

圖2為本申請一實施例中電極塊的俯視圖。 FIG. 2 is a top view of an electrode block in an embodiment of the present application.

圖3為本申請一實施例中電極塊與微型LED綁定後的剖視圖。 FIG. 3 is a cross-sectional view of an electrode block and a micro LED bound together in an embodiment of the present application.

圖4為本申請其他實施例中電極塊的俯視圖。 Fig. 4 is a top view of an electrode block in another embodiment of the present application.

圖5為本申請一實施例中顯示面板製備的流程圖。 FIG. 5 is a flow chart of display panel preparation in an embodiment of the present application.

圖6為本申請一實施例中檢測顯示面板的原理圖。 FIG. 6 is a schematic diagram of detecting a display panel in an embodiment of the present application.

下面將結合本發明實施例中的附圖，對本發明實施例中的技術方案進行清楚、完整地描述，顯然，所描述的實施例為本發明一部分實施例，而非全部的實施例。 The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of them.

除非另有定義，本文所使用的所有的技術和科學術語與屬於本發明的技術領域的技術人員通常理解的含義相同。本文中在本發明的說明書中所使用的術語只是為了描述具體的實施例的目的，不是旨在於限制本發明。 Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

本為能進一步闡述本發明達成預定目的所採取的技術手段及功效，以下結合附圖及較佳實施方式，對本發明作出如下詳細說明。 In order to further explain the technical means and effects adopted by the present invention to achieve the intended purpose, the present invention will be described in detail below in conjunction with the accompanying drawings and preferred implementation modes.

本申請所述的“微型LED”或則“微型發光二極體”是指尺寸小於50μm的無機發光二極體。 The "miniature LED" or "miniature light-emitting diode" mentioned in this application refers to an inorganic light-emitting diode with a size smaller than 50 μm.

本實施例提供一種顯示面板，請參閱圖1，顯示面板100包括：透明基板10、複數電極塊30、複數黏合塊50、複數微型LED70、絕緣層40、黑矩陣41、平坦化層80以及電極層90。所述複數電極塊30設於透明基板10上，每一電極塊30上開設有透光狹縫31。黏合塊50塗布於每一電極塊30遠離透明基板10的一側上，且黏合塊50部分嵌入透光狹縫31中。微型LED70設於黏合塊50遠離電極塊30的一側，即每一微型LED70藉由一黏合塊50與一電極塊30綁定。絕緣層40填充於透明基板10設有電極塊30的一側，電極塊30、黏合塊50和微型LED70嵌入絕緣層40。黑矩陣41設於絕緣層40遠離透明基板10的一側，平坦化層80覆蓋絕緣層40和黑矩陣41。電極層90貫穿平坦化層80並與每一微型LED70電連接。 This embodiment provides a display panel, please refer to FIG. 1, the display panel 100 includes: a transparent substrate 10, a plurality of electrode blocks 30, a plurality of adhesive blocks 50, a plurality of micro LEDs 70, an insulating layer 40, a black matrix 41, a planarization layer 80 and electrodes Layer 90. The plurality of electrode blocks 30 are disposed on the transparent substrate 10 , and each electrode block 30 is provided with a light-transmitting slit 31 . The adhesive block 50 is coated on the side of each electrode block 30 away from the transparent substrate 10 , and the adhesive block 50 is partially embedded in the light-transmitting slit 31 . The micro-LEDs 70 are disposed on the side of the adhesive block 50 away from the electrode block 30 , that is, each micro-LED 70 is bound to an electrode block 30 through an adhesive block 50 . The insulating layer 40 is filled on the side of the transparent substrate 10 provided with the electrode block 30 , and the electrode block 30 , the adhesive block 50 and the micro LED 70 are embedded in the insulating layer 40 . The black matrix 41 is disposed on a side of the insulating layer 40 away from the transparent substrate 10 , and the planarization layer 80 covers the insulating layer 40 and the black matrix 41 . The electrode layer 90 penetrates the planarization layer 80 and is electrically connected with each micro-LED 70 .

在本實施例中，顯示面板100還包括驅動模組(圖未示)，驅動模組可為一積體電路、一驅動晶片或多顆晶片組合。所述驅動模組分別與每一電極塊30電連接，例如驅動模組藉由金屬線分別與每一電極塊30電連接，以向每一與電極塊30所綁定的微型LED70分別輸送電訊號(例如電壓訊號)。電極層90為共陰極，用於向複數微型LED70輸送相同的電壓訊號。所述驅動模組輸送的電壓訊號與電極層90輸送的電壓訊號不同，以在微型LED70的兩個電極之間構成電壓差，從而驅動微型LED70發光，每一微型LED70是否發光以及發光亮度可以由所述驅動模組進行控制。 In this embodiment, the display panel 100 further includes a driving module (not shown in the figure), and the driving module can be an integrated circuit, a driving chip or a combination of multiple chips. The drive module is electrically connected to each electrode block 30 respectively, for example, the drive module is electrically connected to each electrode block 30 through metal wires, so as to transmit electrical signals to each micro LED 70 bound to each electrode block 30 signal (such as a voltage signal). The electrode layer 90 is a common cathode for sending the same voltage signal to the plurality of micro LEDs 70 . The voltage signal transmitted by the driving module is different from the voltage signal transmitted by the electrode layer 90, so as to form a voltage difference between the two electrodes of the micro-LED 70, thereby driving the micro-LED 70 to emit light. The driving module performs control.

請一併參閱圖2和圖3，在本實施例中，透光狹縫31在電極塊30上形成狹縫圖案，所述狹縫圖案為“米”字型，即四條透光狹縫31共同相交於電極塊30的幾何中心，且任意相鄰兩透光狹縫31之間可以形成45°的夾角。黏合塊50設於所述狹縫圖案的中心位置，微型LED70設於黏合塊50上，且部分覆蓋所述狹縫圖案，透光狹縫31部分被黏合塊50嵌入。所述透光狹縫31構成的狹縫圖案，與電極塊30之間形成高低差，使得所述透光狹縫可以用於容納部分黏合塊50，微型LED70部分覆蓋所述狹縫圖案，可以保留部分狹縫空間，使多出的黏合塊50向未被覆蓋的狹縫空間中延伸，避免了黏合塊50的非均勻性溢出以及由於溢出導致的短路。由於黏合塊50部分嵌入透光狹縫31中，增大了黏合塊50和電極塊30之間的接觸面積，從而增大了黏合塊50與電極塊30之間的附著力，相當於 提高了微型LED70與電極塊30之間的附著力。同時，由於接觸面積的增加，黏合塊50相對的電阻值減小，提升了微型LED70與電極塊30之間的歐姆接觸。 Please refer to FIG. 2 and FIG. 3 together. In this embodiment, the light-transmitting slits 31 form a slit pattern on the electrode block 30, and the slit pattern is in the shape of a "rice", that is, four light-transmitting slits 31 They both intersect at the geometric center of the electrode block 30 , and an included angle of 45° can be formed between any two adjacent light-transmitting slits 31 . The adhesive block 50 is disposed at the center of the slit pattern, the micro LED 70 is disposed on the adhesive block 50 and partially covers the slit pattern, and the light-transmitting slit 31 is partially embedded by the adhesive block 50 . The slit pattern formed by the light-transmitting slit 31 forms a height difference with the electrode block 30, so that the light-transmitting slit can be used to accommodate part of the adhesive block 50, and the micro LED 70 partially covers the slit pattern, which can Part of the slit space is reserved, so that the excess adhesive block 50 extends into the uncovered slit space, so as to avoid non-uniform overflow of the adhesive block 50 and short circuit caused by the overflow. Since the adhesive block 50 is partially embedded in the light-transmitting slit 31, the contact area between the adhesive block 50 and the electrode block 30 is increased, thereby increasing the adhesion between the adhesive block 50 and the electrode block 30, equivalent to The adhesion between the micro-LED 70 and the electrode block 30 is improved. At the same time, due to the increase of the contact area, the relative resistance of the adhesive block 50 decreases, which improves the ohmic contact between the micro-LED 70 and the electrode block 30 .

請參閱圖4，在其他實施例中，透光狹縫31在電極塊30上構成的狹縫圖案還可為“S”型(參圖4中的(A)圖)、雪花型(參圖4中的(B)圖)、“卍”字型(參圖4中的(C)圖)、蛇型(參圖4中的(D)圖)、回廊型(參圖4中的(E)圖)、條紋型(參圖4中的(F)圖)或網孔型(參圖4中的(G)圖)等被微型LED70部分覆蓋的圖案。即所述狹縫圖案存在未被微型LED70覆蓋的部分，用於在黏合塊50溢出時容納多餘的部分黏合塊50。 Please refer to Fig. 4, in other embodiments, the slit pattern formed by the light-transmitting slit 31 on the electrode block 30 can also be "S" type (refer to (A) figure in Fig. 4 ), snowflake type (refer to Fig. (B) figure in 4), "卍" font (referring to (C) figure in Figure 4), snake type (referring to (D) figure in Figure 4), corridor type (referring to (E ) figure), stripe type (refer to (F) figure in FIG. 4 ) or mesh type (refer to (G) figure in FIG. 4 ), etc. are partially covered by micro LED 70 patterns. That is, the slit pattern has a part not covered by the micro-LED 70 , which is used to accommodate the excess adhesive block 50 when the adhesive block 50 overflows.

請再參閱圖1，在本實施例中，微型LED70為垂直型微型LED，即微型LED70包括靠近電極塊30的下電極71和遠離電極塊30的上電極73，下電極71和上電極73分別位於微型LED70相對的上下兩端。在其他實施例中，微型LED70還可為水準型微型LED，即微型LED70的兩個電極位於微型LED70的同一端。 Please refer to FIG. 1 again. In this embodiment, the micro-LED 70 is a vertical micro-LED, that is, the micro-LED 70 includes a lower electrode 71 close to the electrode block 30 and an upper electrode 73 far away from the electrode block 30. The lower electrode 71 and the upper electrode 73 are respectively Located at opposite upper and lower ends of the micro-LED 70 . In other embodiments, the micro-LED 70 can also be a horizontal micro-LED, that is, the two electrodes of the micro-LED 70 are located at the same end of the micro-LED 70 .

在本實施例中，透明基板10的材料可為玻璃，亦可為其他透明材料。 In this embodiment, the material of the transparent substrate 10 may be glass or other transparent materials.

在本實施例中，電極塊30為不透光的金屬導電材料。在其他實施例中，電極塊30亦可為其他導電材料如透明導電氧化物等。 In this embodiment, the electrode block 30 is an opaque metal conductive material. In other embodiments, the electrode block 30 can also be other conductive materials such as transparent conductive oxides.

在本實施例中，黏合塊50為導電的光固化膠。在其他實施例中，黏合塊50還可為銀膠或固晶膠、助焊劑等導電的固晶材料。 In this embodiment, the adhesive block 50 is a conductive light-curable adhesive. In other embodiments, the adhesive block 50 may also be a conductive die-bonding material such as silver glue, die-bonding glue, soldering flux, or the like.

在本實施例中，絕緣層40的材料為介電材料，黑矩陣41設於每一微型LED70周圍，用於將每一微型LED70發出的光線區分開，防止發生混光。平坦化層80為有機材料，用於調整顯示面板100上由於設置了不同功能層而產生的高低差，防止電場相互干擾，降低功耗。 In this embodiment, the material of the insulating layer 40 is a dielectric material, and the black matrix 41 is arranged around each micro-LED 70 to separate the light emitted by each micro-LED 70 to prevent light mixing. The planarization layer 80 is an organic material, which is used to adjust the height difference caused by different functional layers on the display panel 100 , prevent electric fields from interfering with each other, and reduce power consumption.

在本實施例中，電極層90包括用於與微型LED70的上電極73進行電連接的連接部91，以及設置於平坦化層80上的電極部93，電極部93位於黑矩陣41的覆蓋區域內。連接部91的材料為氧化銦錫，電極部93的材料可為不透光的金屬導電材料。在其他實施例中，連接部91的材料還可為其他透明導電材料。 In this embodiment, the electrode layer 90 includes a connecting portion 91 for electrically connecting the upper electrode 73 of the micro-LED 70 , and an electrode portion 93 disposed on the planarization layer 80 , and the electrode portion 93 is located in the covered area of the black matrix 41 Inside. The material of the connecting portion 91 is indium tin oxide, and the material of the electrode portion 93 may be an opaque metallic conductive material. In other embodiments, the material of the connecting portion 91 may also be other transparent conductive materials.

本實施例還提供一種顯示面板的製備方法，請參閱圖5，顯示面板的製備方法包括：步驟S1：提供一透明基板； 步驟S2：在所述透明基板上形成複數電極塊；步驟S3：在每一所述電極塊上開設透光狹縫；步驟S4：在每一所述電極塊遠離所述透明基板的表面上塗布黏合膠；步驟S5：轉移複數微型LED於所述透明基板上，使得每一微型LED藉由一黏合膠固定在一電極塊上；步驟S6：在每一組電極塊、微型LED之間設置絕緣層，並在所述絕緣層上設置黑矩陣；步驟S7：藉由所述電極塊對所述複數微型LED進行通電；步驟S8：透過所述透光狹縫，檢測所述複數微型LED是否發光。 This embodiment also provides a method for manufacturing a display panel, please refer to FIG. 5 , the method for manufacturing a display panel includes: Step S1: providing a transparent substrate; Step S2: forming a plurality of electrode blocks on the transparent substrate; Step S3: opening a light-transmitting slit on each of the electrode blocks; Step S4: coating the surface of each of the electrode blocks away from the transparent substrate Adhesive glue; step S5: transfer a plurality of micro-LEDs on the transparent substrate, so that each micro-LED is fixed on an electrode block by an adhesive glue; step S6: provide insulation between each group of electrode blocks and micro-LEDs layer, and set a black matrix on the insulating layer; step S7: energize the plurality of micro-LEDs through the electrode block; step S8: through the light-transmitting slit, detect whether the plurality of micro-LEDs emit light .

在本實施例中，步驟S2還包括設置驅動模組，並將每一電極塊分別與所述驅動模組電連接。 In this embodiment, step S2 further includes setting a driving module, and electrically connecting each electrode block to the driving module.

在本實施例中，步驟S3中開設透光狹縫的方法可為黃光蝕刻、鐳射雕刻或其他可以在電極塊上開設透光狹縫的方法。 In this embodiment, the method of opening the light-transmitting slit in step S3 may be yellow photolithography, laser engraving or other methods that can open the light-transmitting slit on the electrode block.

在本實施例中，步驟S4中黏合膠的塗布採用點膠的方式，所述黏合膠部分覆蓋所述透光狹縫31。步驟S5中將微型LED70轉移到透明基板10上具體為將每一微型LED70轉移到每一電極塊30的所述黏合膠上，由於微型LED70本身的重力，會將所述黏合膠部分壓入透光狹縫31中。於一實施例中，可以在轉移到電極塊30上時對微型LED70施加一定的壓力，此時溢流的所述黏合膠在壓力下進入透光狹縫31中，避免了由於所述黏合膠的擴散不均勻導致微型LED70在綁定後發生歪斜。 In this embodiment, the coating of the adhesive glue in step S4 is applied by dispensing, and the adhesive glue partially covers the light-transmitting slit 31 . In step S5, the transfer of the micro-LEDs 70 to the transparent substrate 10 is specifically to transfer each micro-LED 70 to the adhesive of each electrode block 30. Due to the gravity of the micro-LEDs 70 itself, the adhesive will be partially pressed into the transparent substrate. Light slit 31. In one embodiment, a certain pressure can be applied to the micro-LED 70 when it is transferred to the electrode block 30. At this time, the overflowing adhesive glue enters the light-transmitting slit 31 under pressure, avoiding the pressure caused by the adhesive glue. The non-uniform diffusion of the micro-LED 70 causes skewing after bonding.

在本實施例中，步驟S4塗布的黏合膠為紫外線固晶膠，步驟S5中使得每一微型LED70藉由所述黏合膠固定在一電極塊30上的方法具體為使用紫外光從透明基板10遠離電極塊30的一側進行照射，紫外光穿過透光狹縫31，照射到所述黏合膠上，使所述黏合膠固化形成黏合塊50，完成綁定過程。在其他實施例中，黏合膠還可以為銀膠或固晶膠，此時可以使用熱固化的方式使所述黏合膠固化形成黏合塊50，完成綁定。 In this embodiment, the adhesive glue coated in step S4 is ultraviolet crystal bonding glue, and the method of fixing each micro-LED 70 on an electrode block 30 through the adhesive glue in step S5 is to use ultraviolet light from the transparent substrate 10 The side away from the electrode block 30 is irradiated, and the ultraviolet light passes through the light-transmitting slit 31 and irradiates onto the adhesive, so that the adhesive is cured to form an adhesive block 50 , and the binding process is completed. In other embodiments, the adhesive can also be silver glue or die-bonding glue. At this time, the adhesive can be cured by heat curing to form the adhesive block 50 to complete the binding.

在本實施例中，步驟S5還包括使微型LED70部分覆蓋透光狹縫31，亦即透光狹縫31存在不被微型LED70覆蓋的部分，透光狹縫31未被微型LED70覆蓋的部分可透光，可藉由透光狹縫31對微型LED70進行點亮檢測，即執行步驟S7和步驟S8。 In this embodiment, step S5 also includes making the micro-LED 70 partially cover the light-transmitting slit 31, that is, there is a part of the light-transmitting slit 31 not covered by the micro-LED 70, and the part of the light-transmitting slit 31 not covered by the micro-LED 70 can be Through the light transmission, the light-on detection of the micro-LED 70 can be performed through the light-transmission slit 31 , that is, step S7 and step S8 are performed.

請參閱圖6，在本實施例中，步驟S7還包括使用一探針a對每一微型LED70的上電極73通電，亦即，以探針a施加給微型LED70的上電極73一檢測電壓，從而使得微型LED70的上電極73和下電極71之間形成電壓差，驅動微型LED70發光。步驟S8具體為將光學檢測機b設置在透明基板10遠離微型LED70的一側，且指向與探針a電連接的微型LED70，當對微型LED70通電時，光學檢測機b可以從透光狹縫31透光的部分檢測微型LED70是否發光，從而對微型LED70的品質進行檢測。由於微型LED70的大小為1-50μm，探針的針頭截面遠大於微型LED70，在通電時難以從微型LED70的上電極73一側檢測微型LED70的發光情況，是故藉由透光狹縫31，可以從顯示面板100的另一側對微型LED70的發光情況進行檢測。本實施例使用探針對微型LED70的上電極73進行通電，可以在設置電極層90之前對微型LED70進行點亮檢測，避免了對微型LED70進行更換或修復時還需一併拆解電極層90，是故有利於節約成本，同時有利於減少拆裝流程並降低了技術難度。在其他實施例中，光學檢測機b亦可以設置在透明基板10靠近微型LED70的一側，用於接收微型LED70未被探針a遮擋的光線，即光學檢測機b位於與探針a同一側的可以接收到微型LED70發出的光線的任意位置。這樣亦可以在設置電極層90之前對微型LED70進行點亮檢測。 Referring to FIG. 6, in this embodiment, step S7 also includes using a probe a to energize the upper electrode 73 of each micro-LED 70, that is, applying a detection voltage to the upper electrode 73 of the micro-LED 70 with the probe a, Thus, a voltage difference is formed between the upper electrode 73 and the lower electrode 71 of the micro-LED 70 to drive the micro-LED 70 to emit light. Step S8 is specifically to set the optical detector b on the side of the transparent substrate 10 away from the micro-LED 70, and point to the micro-LED 70 electrically connected to the probe a. 31 The light-transmitting part detects whether the micro-LED 70 emits light, so as to detect the quality of the micro-LED 70 . Since the size of the micro-LED 70 is 1-50 μm, the cross-section of the needle of the probe is much larger than that of the micro-LED 70, and it is difficult to detect the light emission of the micro-LED 70 from the side of the upper electrode 73 of the micro-LED 70 when power is applied. Therefore, by the light-transmitting slit 31, The light emission of the micro LED 70 can be detected from the other side of the display panel 100 . In this embodiment, a probe is used to energize the upper electrode 73 of the micro-LED 70, and the micro-LED 70 can be lighted and detected before the electrode layer 90 is installed, so as to avoid the need to dismantle the electrode layer 90 when the micro-LED 70 is replaced or repaired. Therefore, it is beneficial to save costs, and at the same time, it is beneficial to reduce the disassembly process and technical difficulty. In other embodiments, the optical detector b can also be arranged on the side of the transparent substrate 10 close to the micro-LED 70 to receive light from the micro-LED 70 that is not blocked by the probe a, that is, the optical detector b is located on the same side as the probe a Any position that can receive the light emitted by the micro-LED 70 . In this way, the lighting detection of the micro-LED 70 can also be performed before the electrode layer 90 is disposed.

在其他實施例中，電極塊30的材料還可為透明導電材料，此時點亮檢測流程既可以藉由透光狹縫31進行檢測，亦可以直接透過電極塊30進行檢測。微型LED70還可為水準型微型LED，此時步驟S7不需要使用探針a對每一微型LED70進行通電，步驟S8中檢測微型LED70是否發光亦可以不藉由透光狹縫31，即光學檢測機b還可以在透明基板10靠近微型LED70的一側進行點亮檢測。 In other embodiments, the material of the electrode block 30 can also be a transparent conductive material. At this time, the lighting detection process can be detected through the light-transmitting slit 31 or directly through the electrode block 30 . The micro-LEDs 70 can also be horizontal micro-LEDs. At this time, step S7 does not need to use the probe a to energize each micro-LED 70. In step S8, it is not necessary to use the light-transmitting slit 31 to detect whether the micro-LEDs 70 emit light, that is, optical detection. Machine b can also perform lighting detection on the side of the transparent substrate 10 close to the micro LED 70 .

在本實施例中，點亮檢測具體為使用探針a和光學檢測機b對每一微型LED70進行通電和檢測是否發光。在其他實施例中，亦可以將每三個微型LED70作為一組，每一組包括紅、綠、藍三種顏色的微型LED70，每次對一組微型LED70進行通電，並直接檢測每組的發光情況。還可以進行抽樣檢測，如每隔三個微型LED70檢查一個微型LED70的發光情況，從而得出整體的良品率。 In this embodiment, the lighting detection is specifically to use the probe a and the optical detection machine b to energize each micro-LED 70 and detect whether it emits light. In other embodiments, every three micro-LEDs 70 can also be used as a group, each group includes micro-LEDs 70 of three colors: red, green, and blue, each time a group of micro-LEDs 70 is energized, and the luminescence of each group is directly detected. Condition. Sampling inspection can also be carried out, such as checking the luminous condition of one micro-LED 70 every three micro-LEDs 70 , so as to obtain the overall yield rate.

本技術領域的普通技術人員應當認識到，以上的實施方式僅是用來說明本發明，而並非用作為對本發明的限定，只要在本發明的實質精神範圍之內，對以上實施例所作的適當改變和變化都落在本發明要求保護的範圍之內。 Those of ordinary skill in the art should recognize that the above embodiments are only used to illustrate the present invention, rather than to limit the present invention. Alterations and variations are within the scope of the claimed invention.

100:顯示面板 100: display panel

10:透明基板 10: Transparent substrate

30:電極塊 30: electrode block

31:透光狹縫 31: Light-transmitting slit

50:黏合塊 50: Glue Block

70:微型LED 70: Micro LED

71:下電極 71: Bottom electrode

73:上電極 73: Upper electrode

40:絕緣層 40: insulation layer

41:黑矩陣 41: Black Matrix

80:平坦化層 80: Planarization layer

90:電極層 90: electrode layer

91:連接部 91: Connecting part

93:電極部 93: electrode part

Claims (10)

一種顯示面板，其改良在於，包括：透明基板；複數電極塊，所述複數電極塊位於所述透明基板上，每一電極塊上開設有透光狹縫；複數導電的黏合塊，每一黏合塊塗布於一電極塊遠離所述透明基板的表面，且每一黏合塊部分嵌入一電極塊的透光狹縫中；複數微型發光二極體，每一微型發光二極體經由一黏合塊固定在一電極塊上並與該電極塊電連接。 A display panel, the improvement of which includes: a transparent substrate; a plurality of electrode blocks, the plurality of electrode blocks are located on the transparent substrate, each electrode block is provided with a light-transmitting slit; a plurality of conductive adhesive blocks, each adhesive The block is coated on the surface of an electrode block away from the transparent substrate, and each adhesive block is partially embedded in the light-transmitting slit of an electrode block; a plurality of micro light emitting diodes, each micro light emitting diode is fixed through an adhesive block It is on an electrode block and is electrically connected with the electrode block. 如請求項1所述之顯示面板，其中，每一電極塊上的透光狹縫形成的狹縫圖案被一所述微型發光二極體部分覆蓋。 The display panel as claimed in Claim 1, wherein the slit pattern formed by the light-transmitting slits on each electrode block is partially covered by one of the miniature light emitting diodes. 如請求項1所述之顯示面板，其中，所述電極塊為不透明的導電材料。 The display panel according to claim 1, wherein the electrode block is made of opaque conductive material. 如請求項1所述之顯示面板，其中，所述微型發光二極體為水平式微型發光二極體或垂直式微型發光二極體。 The display panel according to claim 1, wherein the micro light emitting diodes are horizontal micro light emitting diodes or vertical micro light emitting diodes. 一種顯示面板的製備方法，其改良在於，包括：提供一透明基板；在所述透明基板上形成複數電極塊；在每一所述電極塊上開設透光狹縫；在每一所述電極塊遠離所述透明基板的表面上塗布導電的黏合膠；轉移複數微型發光二極體於所述透明基板上，使得每一所述微型發光二極體藉由所述黏合膠固定在一電極塊上，並使得所述黏合膠部分嵌入所述電極塊的透光狹縫中。 A method for manufacturing a display panel, the improvement of which includes: providing a transparent substrate; forming a plurality of electrode blocks on the transparent substrate; opening a light-transmitting slit on each of the electrode blocks; Coating conductive adhesive glue on the surface away from the transparent substrate; transferring a plurality of miniature light-emitting diodes on the transparent substrate, so that each of the miniature light-emitting diodes is fixed on an electrode block by the adhesive glue , and make the adhesive partially embedded in the light-transmitting slit of the electrode block. 如請求項5所述之顯示面板的製備方法，其中，所述轉移複數微型發光二極體於所述透明基板上的步驟還包括使微型發光二極體部分覆蓋所述透光狹縫。 The method for manufacturing a display panel as claimed in Claim 5, wherein the step of transferring a plurality of micro light emitting diodes on the transparent substrate further includes making the micro light emitting diodes partially cover the light-transmitting slit. 如請求項5所述之顯示面板的製備方法，其中，所述製備方法在轉移複數微型發光二極體於所述透明基板上之後還包括：藉由所述電極塊對所述複數微型發光二極體進行通電；透過所述透光狹縫，檢測所述複數微型發光二極體是否發光。 The method for preparing a display panel according to claim 5, wherein, after transferring a plurality of micro light emitting diodes on the transparent substrate, the preparation method further includes: using the electrode block to align the plurality of micro light emitting diodes The pole body is electrified; through the light-transmitting slit, it is detected whether the plurality of miniature light-emitting diodes emit light. 如請求項7所述之顯示面板的製備方法，其中，每一所述微型發光二極體包括位於靠近所述透明基板一側的下電極與位於遠離所述透明基板一側的上電極。 The method for manufacturing a display panel as claimed in item 7, wherein each of the miniature light emitting diodes includes a lower electrode on a side close to the transparent substrate and an upper electrode on a side away from the transparent substrate. 如請求項8所述之顯示面板的製備方法，其中，所述對所述電極塊進行通電的步驟具體為：使用探針對每一所述微型發光二極體的上電極通電。 The method for manufacturing a display panel as claimed in item 8, wherein the step of electrifying the electrode blocks is specifically: electrifying the upper electrode of each micro light-emitting diode with a probe. 如請求項5所述之顯示面板的製備方法，其中，所述黏合膠為紫外線固晶膠，所述使得每一所述微型發光二極體藉由一黏合膠固定在一電極塊上具體為：藉由所述透光狹縫進行光線輻照，固化所述黏合膠。 The method for preparing a display panel as described in Claim 5, wherein the adhesive is an ultraviolet crystal-bonding adhesive, and each of the miniature light-emitting diodes is fixed on an electrode block by an adhesive. Specifically, : irradiating light through the light-transmitting slit to cure the adhesive.
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