TWI779293B - Measuring fixture and measuring method - Google Patents
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本發明係有關一種校正作業，尤指一種用於校正量測裝置之檢測治具及檢測方法。 The invention relates to a calibration operation, in particular to a detection fixture and a detection method for calibrating a measuring device.
傳統產品生產線中，對於每一生產步驟均會進行可靠性量測，以避免於終端產品時才發現不良產品。例如，習知半導體製程中，晶圓於製造完成後，會進行研磨製程及拋光製程，之後再進行切單製程、封裝製程等生產程序。 In the traditional product production line, reliability measurement is performed for each production step to avoid detecting defective products in the final product. For example, in the conventional semiconductor manufacturing process, after the wafer is manufactured, it will undergo a grinding process and a polishing process, and then undergo production processes such as a singulation process and a packaging process.
然而，習知量測裝置於長期使用下，作用效果也逐漸受影響，而使量測結果愈趨不準確，故若未能即時發現量測裝置之量測精準度不良之問題，將使產品之之量測數據產生偏差，進而導致不良產品出貨之問題。 However, under the long-term use of conventional measuring devices, the effect will gradually be affected, and the measurement results will become more and more inaccurate. Therefore, if the problem of poor measurement accuracy of the measuring device is not found immediately, the product will be damaged. The measurement data deviates, which leads to the problem of defective product shipment.
例如，習知拋光設備於拋光作業完成後，其量測裝置會量測半導體晶圓之厚度是否符合需求，但若該量測裝置之量測作用已不精準(如量測誤差過大)，則會誤判該半導體晶圓之厚度，導致該半導體晶圓於後續封裝製程發生不良而需報廢該半導體晶圓。 For example, in the conventional polishing equipment, after the polishing operation is completed, the measuring device will measure whether the thickness of the semiconductor wafer meets the requirements, but if the measuring function of the measuring device is not accurate (such as the measurement error is too large), then The thickness of the semiconductor wafer will be misjudged, resulting in failure of the semiconductor wafer in the subsequent packaging process and the need to scrap the semiconductor wafer.
因此，如何克服上述習知技術之種種問題，實已成為目前業界亟待克服之難題。 Therefore, how to overcome the various problems of the above-mentioned conventional technologies has become a difficult problem to be overcome urgently in the industry at present.
鑑於上述習知技術之種種缺失，本發明提供一種檢測治具，係包括：定位件；以及校正塊，係接合該定位件，且具有相對之第一側與第二側，該校正塊以該第一側接合該定位件，且該第二側係形成一具有高度差之表面。 In view of the various deficiencies of the above-mentioned prior art, the present invention provides a detection fixture, which includes: a positioning piece; The first side engages the positioning member, and the second side forms a surface with a height difference.
前述之檢測治具中，該定位件係為框體。 In the aforementioned detection fixture, the positioning member is a frame.
前述之檢測治具中，該校正塊之第二側之表面係呈階梯結構。 In the aforementioned detection fixture, the surface of the second side of the calibration block has a stepped structure.
本發明復提供一種檢測方法，係包括：將至少一前述之檢測治具設於一承載件上，其中，於該承載件之上方係架設有至少一量測裝置；以及位移該承載件以同步帶動該檢測治具位移，使該校正塊通過該量測裝置，以令該量測裝置量測該校正塊之第二側之取樣外觀。 The present invention further provides a detection method, which includes: setting at least one of the aforementioned detection fixtures on a carrier, wherein at least one measuring device is erected above the carrier; and displacing the carrier to synchronize Driving the detection jig to move, making the calibration block pass through the measuring device, so that the measuring device measures the sampling appearance of the second side of the calibration block.
前述之檢測方法中，該定位件係黏固於該承載件上。 In the aforementioned detection method, the positioning element is glued on the carrier element.
前述之檢測方法中，該承載件係為旋轉平台。 In the aforementioned detection method, the carrier is a rotating platform.
前述之檢測方法中，該檢測治具係重複通過該量測裝置。 In the aforementioned detection method, the detection jig repeatedly passes through the measuring device.
前述之檢測方法中，該量測裝置係包含一資訊擷取器，其擷取該校正塊之第二側之取樣外觀，以作為目標訊號。例如，該量測裝置係包含一通訊連接該資訊擷取器之處理器，以接收該目標訊號。進一步，該處理器係比對該目標訊號與該校正塊之第二側之實際外觀，以獲取該目標訊號與該實際外觀之間的誤差值。因此，藉由該校正塊之設計，可建立該量測裝置之量測不確定度的可追朔性，使量測精度可追朔至對應該校正塊的檢測報告(或校正報告)。 In the aforementioned detection method, the measuring device includes an information extractor, which extracts the sampled appearance of the second side of the calibration block as the target signal. For example, the measurement device includes a processor communicatively connected to the information collector to receive the target signal. Further, the processor compares the target signal with the actual appearance of the second side of the calibration block to obtain an error value between the target signal and the actual appearance. Therefore, through the design of the calibration block, the traceability of the measurement uncertainty of the measurement device can be established, so that the measurement accuracy can be traced back to the detection report (or calibration report) corresponding to the calibration block.
此外，透過此方法，可校正該量測裝置之感測器之精準度及可靠度，並定量分析承載件，以確保量測品質、機構架設品質、旋轉機台機況、量測環境可靠度及/或其它項目。 In addition, through this method, the accuracy and reliability of the sensor of the measuring device can be calibrated, and the bearing part can be quantitatively analyzed to ensure the quality of measurement, the quality of mechanism erection, the condition of the rotating machine, and the reliability of the measurement environment and/or other items.
由上可知，本發明之檢測治具及檢測方法中，主要藉由該校正塊於該校正塊之第二側形成一具有高度差之表面，以於該量測裝置進行量測作業前量測該校正塊之第二側之取樣外觀，因而產生一校正指標(即誤差值)，進一步以此結果校正量測系統。故相較於習知技術，本發明之檢測治具及檢測方法能先期校正該量測裝置，以避免生產線因該量測裝置的不良作用致使產品之量測數據產生偏差之問題，因而能避免不良產品出貨之問題。 It can be seen from the above that in the inspection fixture and inspection method of the present invention, a surface with a height difference is mainly formed on the second side of the calibration block by the calibration block, so as to measure before the measurement device performs the measurement operation. The sampled appearance of the second side of the calibration block thus produces a calibration index (ie, error value), which is further used to calibrate the measurement system. Therefore, compared with the conventional technology, the detection fixture and detection method of the present invention can calibrate the measuring device in advance, so as to avoid the problem that the measurement data of the product will be deviated due to the bad effect of the measuring device in the production line, thus avoiding The problem of defective product shipment.
1:檢測治具 1: Detection fixture
10:定位件 10: Positioning parts
100:容置口 100: storage port
101:開口 101: opening
11,11’,11”:校正塊 11,11’,11”: correction block
11a:第一側 11a: First side
11b:第二側 11b: Second side
11c:缺口 11c: Gap
110,410:基座 110,410: base
111,411:第一台階 111,411: first step
112,412:第二台階 112,412: second step
113,413:第三台階 113,413: the third step
114,414:第四台階 114,414: the fourth step
20a,20b:鋸齒狀表面 20a, 20b: serrated surface
20c,20d:波浪狀表面 20c, 20d: wavy surface
20e:斜坡面 20e: slope surface
3:拋光設備 3: Polishing equipment
30:承載件 30: Carrier
30a:承載表面 30a: Bearing surface
300:轉軸 300: shaft
31:量測裝置 31: Measuring device
31a:資訊擷取器 31a: Information Extractor
31b:處理器 31b: Processor
310:電線 310: wire
415:第五台階 415: fifth step
D:檢測距離 D: detection distance
h1~h4:階梯高度 h1~h4: step height
R:旋轉方向 R: direction of rotation
S:階梯結構 S: ladder structure
S1:第一台階組合 S1: The first step combination
S2:第二台階組合 S2: The second step combination
Z1~Z5:階梯高度 Z1~Z5: Step height
第1A圖係為本發明之檢測治具之立體示意圖。 Fig. 1A is a three-dimensional schematic view of the detection fixture of the present invention.
第1B圖係為本發明之檢測治具之上視平面示意圖。 Fig. 1B is a top plan view of the testing fixture of the present invention.
第1C圖係為本發明之檢測治具之校正塊之側面示意圖。 Figure 1C is a schematic side view of the calibration block of the testing fixture of the present invention.
第1C’及1C”圖係為第1C圖之其它態樣之側面示意圖。 Figures 1C' and 1C" are schematic side views of other aspects of Figure 1C.
第1D圖係為本發明之檢測治具之定位件之上視平面示意圖。 Figure 1D is a top plan view of the positioning part of the testing fixture of the present invention.
第2A至2E圖係為本發明之檢測治具之校正塊之其它實施例之側面示意圖。 Figures 2A to 2E are schematic side views of other embodiments of the calibration block of the testing jig of the present invention.
第3圖係為使用本發明之檢測治具進行系統校正作業之立體示意圖。 Figure 3 is a three-dimensional schematic diagram of the system calibration operation using the testing fixture of the present invention.
第3’圖係為第3圖之另一態樣之上視平面示意圖。 Fig. 3 ' is a schematic plan view on another form of Fig. 3.
第4圖係為本發明之檢測方法之一實施例之示意圖。 Figure 4 is a schematic diagram of an embodiment of the detection method of the present invention.
第4A至4E圖係為本發明之檢測方法之檢測結果之長條圖。 Figures 4A to 4E are bar graphs of the detection results of the detection method of the present invention.
以下藉由特定的具體實施例說明本發明之實施方式，熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。 The implementation of the present invention is described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
須知，本說明書所附圖式所繪示之結構、比例、大小等，均僅用以配合說明書所揭示之內容，以供熟悉此技藝之人士之瞭解與閱讀，並非用以限定本發明可實施之限定條件，故不具技術上之實質意義，任何結構之修飾、比例關係之改變或大小之調整，在不影響本發明所能產生之功效及所能達成之目的下，均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時，本說明書中所引用之如「上」、「下」、「左」、「右」、「內」、「外」、「第一」、「第二」、「第三」、「第四」、「第五」及「一」等之用語，亦僅為便於敘述之明瞭，而非用以限定本發明可實施之範圍，其相對關係之改變或調整，在無實質變更技術內容下，當亦視為本發明可實施之範疇。 It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for the understanding and reading of those familiar with this technology, and are not used to limit the implementation of the present invention Therefore, it has no technical substantive meaning. Any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of this invention without affecting the effect and purpose of the present invention. The technical content disclosed by the invention must be within the scope covered. At the same time, references in this specification such as "upper", "lower", "left", "right", "inner", "outer", "first", "second", "third", "first The terms "four", "fifth" and "one" are only for the convenience of description and are not used to limit the scope of implementation of the present invention. Changes or adjustments of their relative relationships are not subject to substantial changes in technical content. , should also be regarded as the scope where the present invention can be implemented.
第1A至1D圖係為本發明之檢測治具1之示意圖。如第1A至1D圖所示，所述之檢測治具1係包括一定位件10以及一接合該定位件10之校正塊11。
Figures 1A to 1D are schematic diagrams of the
所述之定位件10係為框體，其具有一容置口100。於本實施例中，該定位件10係呈矩形框體，並於該容置口100之角落處延伸形成有至少一開口101，以利於取放該校正塊11。
The positioning
所述之校正塊11係具有相對之第一側11a與第二側11b，該第一側11a係為平面，使該校正塊11以其第一側11a接合該容置口100，且該第二側11b係形成一具有高度差之表面，如階梯結構S，並於該第二側11b之角落處可依需求形成至少一對應該開口101之缺口11c，以利於取放該校正塊11。
The
於本實施例中，該校正塊11之輪廓係呈矩形，且該階梯結構S係具有一基座110，以於該基座110上配置第一台階組合S1與第二台階組合S2。例如，該階梯結構S係呈凹狀。具體地，該第一台階組合S1與第二台階組合S2係相互對稱形成於該基座110上方之左、右兩側，以形成凹狀階梯結構S。應可理解地，有關該階梯結構S之態樣繁多，如凸狀或山狀(如第1C'圖所示之校正塊11’)、單向狀(如第1C"圖所示之校正塊11”)或其它等，並無特別限制。
In this embodiment, the outline of the
再者，該第一台階組合S1係包含第一至第四台階111~114。例如，基於該基座110作為基準面，該第一至第四台階111~114之階梯高度h1~h4係相同。具體地，該基座110之高度h係為1000微米(um)，且各該階梯高度h1~h4係為200微米(um)。應可理解地，有關該台階組合之態樣繁多，其可依需求調整階梯高度為相同或不同、及階數，並無特別限制。
Furthermore, the first step combination S1 includes first to fourth steps 111 - 114 . For example, based on the base 110 as a reference plane, the step heights h1 - h4 of the first to fourth steps 111 - 114 are the same. Specifically, the height h of the
又，由於該第一台階組合S1與第二台階組合S2係相互對稱，故同理可知，該第二台階組合S2亦包含第一至第四台階111~114。 Moreover, since the first step combination S1 and the second step combination S2 are symmetrical to each other, it can be understood that the second step combination S2 also includes the first to fourth steps 111 - 114 .
另外，有關具有高度差之表面之態樣繁多，如凹凸結構(如第2A及2B圖所示之第二側11b具有鋸齒狀表面20a,20b、如第2C及2D圖所示之第二側11b具有波浪狀表面20c,20d)、斜坡面20e(如第2E圖所示之第二側11b)或其它等，並不限於階梯結構S，特此述明。
In addition, there are many forms of surfaces with height differences, such as concave-convex structures (the
第3圖係為本發明之檢測治具1於使用時之立體示意圖。如第3圖所示，藉由該檢測治具1之設計，本發明提供一種檢測方法，其步驟如下所述。
Fig. 3 is a three-dimensional schematic view of the
首先，將該檢測治具1安裝於一承載件30上，其中，於該承載件30之上方係架設有至少一量測裝置31。
Firstly, the
於本實施例中，該承載件30係為旋轉平台，如拋光設備3之拋光墊，其用於承載半導體晶圓，並使該承載件30之頂面係作為承載表面30a，以安裝該檢測治具1。例如，該承載件30係為圓形座體，其圓心處係配置一轉軸300，以令該承載件30可相對該轉軸300進行旋轉。
In this embodiment, the
再者，該量測裝置31係包含一資訊擷取器31a及一通訊連接(如電線310或無線傳輸)該資訊擷取器31a之處理器31b。例如，該量測裝置31可配置於該拋光設備3上，以於拋光製程後量測該承載件30上之半導體晶圓之拋光程度。具體地，該處理器31b係為電腦主機或伺服器，且該資訊擷取器31a係為感測器(sensor)，如光學式、電磁波式或感應式等非接觸型感測器，其與該校正塊11保持一檢測距離D，即該資訊擷取器31a未接觸該該檢測治具1及該承載件30。
Moreover, the
又，於安裝該檢測治具1之過程中，係先將該定位件10黏固於該承載件30之承載表面30a上，再將該校正塊11以其第一側11a卡入該容
置口100中，以令該校正塊11鬆配合平穩接觸該承載件30之承載表面30a，並使該定位件10框住(或卡制)該校正塊11。應可理解地，該檢測治具1未碰觸該轉軸300。
Moreover, in the process of installing the
另一方面，若將該校正塊11之第一側11a直接黏貼於該承載表面30a上，該校正塊11會有黏貼不平整之疑慮，進而導致後續該量測裝置31之檢測不良之問題，故藉由該定位件10之設計，可避免該校正塊11置放不良而造成檢測不良之問題。
On the other hand, if the
接著，位移該承載件30以同步帶動該檢測治具1位移，使該檢測治具1通過該資訊擷取器31a之下方，以令該量測裝置31量測該校正塊11之第二側11b之取樣外觀。
Then, the bearing
於本實施例中，該承載件30之承載表面30a係沿順時針(圖未示)或逆時針方向(如第3圖所示之旋轉方向R)連續旋轉，使該檢測治具1係重複通過該資訊擷取器31a之一者或多者，以獲得所需資訊。應可理解地，由於該定位件10已框住(或卡制)該校正塊11，故該校正塊11不會因旋轉離心力而脫離該承載表面30a。
In this embodiment, the bearing
再者，該資訊擷取器31a係擷取該校正塊11之第二側11b之取樣外觀(如該階梯結構S之階梯高度h1~h4之取樣數值)，以作為目標訊號，並將該目標訊號傳輸至該處理器31b。例如，該檢測治具1於該承載表面20a上之擺設方向需沿圓弧線方向，即該旋轉方向R，以令該階梯結構S之各台階均可通過該資訊擷取器31a之下方。具體地，該檢測治具1於該承載表面30a上之擺設位置可依需求放置於接近該承載表面30a邊緣處(如第3’
圖所示之外側)或接近該轉軸300處(如第3’圖所示之內側)，且該資訊擷取器31a對應調整位置，以檢測該資訊擷取器31a於各處之作用狀態。
Furthermore, the
又，該處理器31b於接收該目標訊號後係比對該目標訊號與該校正塊11之第二側11b之實際外觀(如該階梯結構S之階梯高度h1~h4之實際值)，以獲取檢測結果，即該目標訊號與該實際外觀之間的誤差值。例如，若採用第1C”圖所示之校正塊11”進行檢測(如第4圖所示)，可得到如下表1所示之處理器31b之處理資訊，其中，基於該承載件30之各種旋轉速度下，該資訊擷取器31a之取樣頻率為1000赫茲(Hz)，且依據該取樣頻率(如該校正塊11通過該資訊擷取器31a之次數或該承載件10之旋轉圈數)，該處理器31b係將其所接收之第一至第五台階411~415之各階梯高度Z1~Z5(以該基座410作為基準面)之取樣數值平均化。
Also, after receiving the target signal, the
另外，本發明之檢測方法係需先定位該資訊擷取器31a(如第3’圖所示之內側或外側)，才位移該檢測治具1，故該資訊擷取器31a於單一次檢測作業中係採用定點擷取方式，以避免該資訊擷取器31a產生其它誤差變數(如位移誤差、擷取視角誤差)，而混淆使用者之判斷。
In addition, the detection method of the present invention needs to locate the
因此，藉由該檢測方法，使用者可制定一誤差範圍(如閥值k)，以判斷各誤差值e是否符合規範，故該誤差值e可作為該量測裝置31之校正指標，以於該誤差值e超出可接受之誤差範圍時(即｜e｜>k)，使用
者即可得知需校正該量測裝置31(如該資訊擷取器31a)之準確度，因而於後續使用該量測裝置31時，能確保該量測裝置31量測該承載件30上之半導體晶圓之拋光程度之精準度。例如，若將該閥值k設定為5，則當該承載件30於拋光製程時之轉速為10rpm時，該量測裝置31對於各該階梯高度Z1~Z5的誤差值e之絕對值均小於5，即｜e｜≦k，故該量測裝置31符合精準度之需求；若該承載件30於拋光製程時之轉速為40rpm時，該量測裝置31對於第三台階413之階梯高度Z3的誤差值e之絕對值係大於5，即｜e｜>k，故該量測裝置31不符合精準度之需求，因而需調整校正該量測裝置31。
Therefore, with this detection method, the user can set an error range (such as threshold k) to judge whether each error value e meets the specification, so the error value e can be used as a calibration index of the measuring
另一方面，有關位移該檢測治具1之方式繁多，如直線往復運動，並不限於上述之旋轉方式，且該定位件10亦可依據位移方式作設計，並不限於框體，故本發明之檢測治具1之用途廣泛，可校正多種量測裝置，並不限於上述之拋光設備3用之量測裝置31。
On the other hand, there are many ways to displace the
綜上所述，本發明之檢測治具及檢測方法，係藉由該校正塊之設計，以於量測裝置進行量測作業前，產生一校正指標(即誤差值)，以進一步供使用者判斷是否校正該量測裝置，故相較於習知技術，本發明之檢測治具及檢測方法能提升該量測裝置之量測精準度，以避免生產線因該量測裝置的不良作用致使產品之量測數據產生偏差之問題，因而能避免不良產品出貨之問題。 To sum up, the detection fixture and detection method of the present invention, through the design of the calibration block, can generate a calibration index (i.e. error value) before the measurement device performs the measurement operation, so as to further provide users with Determine whether to correct the measuring device, so compared with the conventional technology, the detection fixture and detection method of the present invention can improve the measurement accuracy of the measuring device, so as to prevent the production line from causing product damage due to the bad effect of the measuring device. The problem of deviation in the measurement data can avoid the problem of defective product shipment.
上述實施例係用以例示性說明本發明之原理及其功效，而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下，對上述實施例進行修改。因此本發明之權利保護範圍，應如後述之申請專利範圍所列。 The above-mentioned embodiments are used to illustrate the principles and effects of the present invention, but not to limit the present invention. Any person skilled in the art can modify the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of the patent application described later.
1:檢測治具 1: Detection fixture
10:定位件 10: Positioning parts
11:校正塊 11: Correction block
3:拋光設備 3: Polishing equipment
30:承載件 30: Carrier
30a:承載表面 30a: Bearing surface
300:轉軸 300: shaft
31:量測裝置 31: Measuring device
31a:資訊擷取器 31a: Information Extractor
31b:處理器 31b: Processor
310:電線 310: wire
D:檢測距離 D: detection distance
R:旋轉方向 R: direction of rotation
Claims (9)
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