TWI779140B - Tape sticking device - Google Patents

Tape sticking device Download PDF

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Publication number
TWI779140B
TWI779140B TW107145418A TW107145418A TWI779140B TW I779140 B TWI779140 B TW I779140B TW 107145418 A TW107145418 A TW 107145418A TW 107145418 A TW107145418 A TW 107145418A TW I779140 B TWI779140 B TW I779140B
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Prior art keywords
tape
roll
adhesive tape
protective film
adhesive
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TW107145418A
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Chinese (zh)
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TW201927674A (en
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吉村寛
大沼広希
岩瀬寛和
木崎清貴
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/68395—Separation by peeling using peeling wheel

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Replacement Of Web Rolls (AREA)
  • Package Closures (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Basic Packing Technique (AREA)

Abstract

[課題]使能夠切換不同品種之黏著膠帶而可以有效地利用黏著膠帶。 　　[解決手段]因膠帶黏貼裝置(1)具備將膠帶組(3、3A)引導至平台(10)之第1滾輪單元(30)；將黏著膠帶(4)從膠帶組(3、3A)剝離且使黏貼於環形框(F)和晶圓(W)之黏貼手段(50)；捲取保護薄膜(5)並予以廢棄的廢棄手段(60)；將保護薄膜(5)引導至廢棄手段(60)之第2滾輪單元(70)；選擇捲筒膠帶(2、2A)中之任一者而拉出膠帶組(3、3A)，定位在平台(10)的定位手段(40)；挾持膠帶組(3、3A)之端部而引導至廢棄手段(60)之膠帶組引導手段(80)；和切斷保護薄膜(5)之切斷手段(90)，故不用使用連結用膠帶，可以容易切換成不同品種之膠帶組(3、3A)，可以有效地利用黏著膠帶(4)。[Problem] Make it possible to switch between different types of adhesive tapes and effectively use adhesive tapes. [Solution] Because the tape sticking device (1) has the first roller unit (30) that guides the tape set (3, 3A) to the platform (10); peel off the adhesive tape (4) from the tape set (3, 3A) And the sticking means (50) to be pasted on the ring frame (F) and the wafer (W); the discarding means (60) that rolls up the protective film (5) and discards it; guides the protective film (5) to the discarding means ( 60) the second roller unit (70); select any one of the tape rolls (2, 2A) to pull out the tape group (3, 3A), and locate the positioning means (40) on the platform (10); The end of the adhesive tape group (3, 3A) is guided to the tape group guiding means (80) of the discarding means (60); and the cutting means (90) for cutting the protective film (5), so there is no need to use the adhesive tape for connection, It can be easily switched to different types of tape sets (3, 3A), and the adhesive tape (4) can be effectively used.

Description

膠帶黏貼裝置Tape sticking device

本發明係關於在晶圓黏貼黏著性之膠帶的膠帶黏貼裝置。The present invention relates to a tape sticking device for sticking an adhesive tape on a wafer.

分割晶圓等之被加工物之情況，例如在膠帶黏貼裝置(膠帶固定機)，在具有開口部之環形框黏貼黏著膠帶，在從該開口部露出之黏著膠帶黏貼晶圓，依此使環形框和晶圓一體化，防止在晶圓之分割時的晶片分散。在膠帶黏貼裝置中，有依分割晶圓之加工條件不同使用不同品種的黏著膠帶之情形。In the case of dividing a workpiece such as a wafer, for example, in a tape sticking device (tape fixing machine), an adhesive tape is pasted on a ring frame with an opening, and a wafer is pasted on the adhesive tape exposed from the opening. The frame and wafer are integrated to prevent chip dispersion during wafer splitting. In the tape bonding device, different types of adhesive tapes may be used depending on the processing conditions of the divided wafers.

通常，黏著膠帶成為基材和黏著劑層之兩層構造。作為黏著膠帶之材質，除例如具有硬之基材的膠帶、具有彈力性之基材的膠帶、具有熱收縮之基材的膠帶等之基材不同的情況外，有例如具有以紫外線硬化之黏著劑層之膠帶、黏著劑層厚的膠帶等之黏著劑層不同之情況。再者，因黏著膠帶防止塵埃附著於黏著劑層，故在黏著劑層貼附保護薄膜，捲筒狀地被捲在筒芯而成為捲筒膠帶之形態。例如，有使支持棒進入至捲筒膠帶之筒芯內而旋轉自如地支持捲筒膠帶之膠帶黏貼裝置(例如，參照下述專利文獻1及2)。在該膠帶黏貼裝置中，從捲筒膠帶之外側同時拉出保護薄膜和黏著膠帶，並使通過複數滾輪，將黏著膠帶從保護薄膜剝離而可以將黏著膠帶黏貼在環形框和晶圓。 [先前技術文獻] [專利文獻]Usually, the adhesive tape has a two-layer structure of a base material and an adhesive layer. As the material of the adhesive tape, in addition to the case where the base material is different, such as a tape with a hard base material, a tape with an elastic base material, and a tape with a heat-shrinkable base material, there are, for example, adhesives that are hardened by ultraviolet rays. Adhesive layers of tapes with adhesive layers, adhesive tapes with thick adhesive layers, etc. are different. Furthermore, since the adhesive tape prevents dust from adhering to the adhesive layer, a protective film is attached to the adhesive layer, and the adhesive tape is wound around the core in a roll shape to form a tape roll. For example, there is a tape sticking device that rotatably supports a roll tape by inserting a support rod into a core of the roll tape (see, for example, Patent Documents 1 and 2 below). In this tape sticking device, the protective film and the adhesive tape are simultaneously pulled out from the outside of the tape roll, and the adhesive tape is peeled off from the protective film by passing through a plurality of rollers, so that the adhesive tape can be attached to the ring frame and the wafer. [Prior Art Document] [Patent Document]

[專利文獻1]日本特開2014-27171號公報 　　[專利文獻2]日本特開2016-008104號公報[Patent Document 1] Japanese Patent Laid-Open No. 2014-27171 [Patent Document 2] Japanese Patent Laid-Open No. 2016-008104

[發明所欲解決之課題][Problem to be Solved by the Invention]

在上述般之膠帶黏貼裝置中，當切換黏著膠帶之品種時，必須使不同品種之黏著膠帶通過複數滾輪，需要用以連結切換膠帶之品種之前的黏著膠帶之未端，和之後切換的新黏著膠帶之前端的連結用之膠帶。In the above-mentioned adhesive tape sticking device, when switching the types of adhesive tapes, different types of adhesive tapes must pass through a plurality of rollers, which need to be used to connect the end of the adhesive tape before switching the type of tape and the new adhesive tape after switching. Adhesive tape used for connecting the front end of the tape.

本發明之目的在於膠帶黏著裝置中，能夠不使用連結用之膠帶而進行不同品種之黏著膠帶之切換而可以有效利用黏著膠帶。 [用以解決課題之手段]An object of the present invention is to enable effective use of adhesive tapes by switching between different types of adhesive tapes without using adhesive tapes for connection in an adhesive tape adhesive device. [Means to solve the problem]

本發明係一種膠帶黏貼裝置，其具備支持具有開口之環形框並且支持被定位在該開口之晶圓的平台，在被支持於該平台之環狀框和晶圓黏貼黏著膠帶而使一體化，該膠帶黏貼裝置至少具備：捲筒膠帶支持部，其係能夠旋轉地支持捲筒膠帶，且該捲筒膠帶係將事先對應於該環狀框而成形的複數該黏著膠帶隔著間隔被配設在帶狀的保護薄膜的膠帶組設成捲筒狀，捲筒膠帶支持手段，其係配設兩個以上該捲筒膠帶支持部；第1滾輪單元，其係將從該捲筒膠帶拉出之該膠帶組從該捲筒膠帶支持手段引導至該平台；黏貼手段，其係使該黏著膠帶從被引導至該平台之該膠帶組剝離，並使該黏著膠帶黏貼於該平台支持的該環狀框和晶圓；廢棄手段，捲取該黏著膠帶被剝離的該保護薄膜並予以廢棄；第2滾輪單元，其係將該黏著膠帶被剝離的該保護薄膜從該平台引導至該廢棄手段；定位手段，其係被配設在該捲筒膠帶支持手段和該第1滾輪單元之間，選擇被支持於兩個以上之該捲筒膠帶支持部的該捲筒膠帶中之任一者且把持該膠帶組之端部而予以拉出，定位在該平台；膠帶組引導手段，其係把持該定位手段定位的該膠帶組之端部而通過該第2滾輪單元而引導至該廢棄手段；及切斷手段，其係被配設在該平台和該廢棄手段之間，切斷該黏著膠帶被剝離的該保護薄膜，將新選擇的該膠帶組藉由該定位手段從該捲筒膠帶支持手段拉出之時，藉由該切斷手段切斷現在使用的該膠帶組之該保護薄膜，該廢棄手段捲取並予以廢棄，並且使現在使用的該捲筒膠帶支持部作動而可以捲取該膠帶組。 [發明效果]The present invention is an adhesive tape sticking device, which is equipped with a platform that supports an annular frame having an opening and supports a wafer positioned in the opening, and integrates the annular frame and the wafer supported by an adhesive tape by adhering, The adhesive tape sticking device includes at least: a roll tape support portion that rotatably supports a roll tape, and the roll tape is arranged at intervals between a plurality of the adhesive tapes formed in advance corresponding to the annular frame. The adhesive tape of the strip-shaped protective film is set in a roll shape, and the roll tape support means is equipped with two or more support parts of the roll tape; the first roller unit is pulled out from the roll tape The tape set is guided from the roll tape support means to the platform; the sticking means is to peel off the adhesive tape from the tape set guided to the platform, and stick the adhesive tape to the ring supported by the platform a frame and a wafer; a disposal means for winding up the protective film with the adhesive tape peeled off and discarding it; a second roller unit for guiding the protective film with the adhesive tape peeled off from the platform to the disposal means; positioning means, which is arranged between the tape roll support means and the first roller unit, and selects any one of the tape rolls supported by two or more tape roll supports; The end of the adhesive tape set is pulled out and positioned on the platform; the adhesive tape set guide means is used to guide the end of the adhesive tape set positioned by the positioning means to the disposal means through the second roller unit; and Cutting means, which is arranged between the platform and the discarding means, cuts off the protective film from which the adhesive tape is peeled off, and transfers the newly selected group of adhesive tapes from the reel tape supporting means by the positioning means When pulling out, cut off the protective film of the currently used tape group by the cutting means, wind up and discard it by the discarding means, and make the reel tape support part currently in use actuate to wind up the tape Adhesive tape set. [Invention effect]

因與本發明有關之膠帶黏貼裝置被構成至少具備：捲筒膠帶支持部，其係能夠旋轉地支持將膠帶組設成捲筒狀的捲筒膠帶；捲筒支持手段，其係配設有兩個以上捲筒膠帶支持部；第1滾輪單元，其係將從捲筒膠帶拉出之膠帶組從捲筒膠帶支持手段引導至平台；黏貼手段，其係使黏著膠帶從被引導至平台之膠帶組剝離，並使黏著膠帶黏貼於平台支持的環狀框和晶圓；廢棄手段，捲取黏著膠帶被剝離的保護薄膜並予以廢棄；第2滾輪單元，其係將黏著膠帶被剝離的保護薄膜從膠帶引導至廢棄手段；定位手段，其係選擇捲筒膠帶中之任一者且把持膠帶組之端部而予以拉出，定位在平台；膠帶組引導手段，其係把持定位手段定位的膠帶組之端部而通過第2滾輪單元而引導至廢棄手段；及切斷手段，其係被配設在平台和廢棄手段之間，切斷黏著膠帶被剝離的保護薄膜，將新選擇的膠帶組藉由定位手段從捲筒膠帶支持手段拉出之時，藉由切斷手段切斷現在使用的膠帶組之保護薄膜，廢棄手段捲取並予以廢棄，並且使現在使用的捲筒膠帶支持部作動而可以捲取膠帶組，故可以容易將藉由定位手段拉出之膠帶組切換成不同品種之膠帶組，無須以連結用膠帶連結使用中之膠帶組之切斷端，和欲重新使用的膠帶組之前端。因此，可以不使用連結用膠帶，選擇希望的膠帶組而將黏著膠帶黏貼於環形框和晶圓。 　　再者，若藉由本發明時，因以捲筒膠帶支持部捲取被切斷的剩餘膠帶組，故不會浪費膠帶組，可以有效利用。Because the adhesive tape sticking device related to the present invention is constituted to at least have: a reel tape support part, which is a rotatable support for a reel tape that is assembled into a reel; a reel support means, which is equipped with two More than one reel tape supporting part; the first roller unit, which guides the tape group pulled out from the reel tape from the reel tape support means to the platform; the sticking means, which makes the adhesive tape guide to the platform from the adhesive tape The group peels off and sticks the adhesive tape to the ring frame and wafer supported by the platform; the disposal means rolls up the protective film from which the adhesive tape has been peeled off and discards it; the second roller unit is the protective film from which the adhesive tape is peeled off Guide from the tape to the discarding means; the positioning means, which is to select any one of the roll tapes and hold the end of the tape group to pull it out, and position it on the platform; the tape group guiding means, which is to hold the tape for positioning by the positioning means The end of the group is guided to the discarding means through the second roller unit; and the cutting means is arranged between the platform and the discarding means to cut off the peeled protective film of the adhesive tape, and the newly selected tape group When the positioning means is pulled out from the roll tape support means, the protective film of the currently used tape set is cut by the cutting means, and the disposal means is wound up and discarded, and the currently used roll tape support part is actuated And the tape group can be rolled up, so the tape group pulled out by the positioning means can be easily switched to different types of tape groups, and there is no need to use connecting tape to connect the cut end of the tape group in use and the tape to be reused group front end. Therefore, the adhesive tape can be attached to the ring frame and the wafer by selecting a desired tape set without using the bonding tape. Furthermore, according to the present invention, since the cut remaining tape group is taken up by the reel tape support part, the tape group will not be wasted and can be effectively used.

圖1所示之膠帶黏貼裝置1係在具有開口之環形框F和被加工物之一例的晶圓W黏貼黏著膠帶並使一體化的膠帶黏貼裝置。膠帶黏貼裝置1具備支持環形框F並且支持被定位在開口之晶圓W的平台10，和使平台10在水平方向(X軸方向)移動的平台移動手段13。The tape sticking device 1 shown in FIG. 1 is a tape sticking device that sticks and integrates an adhesive tape on a ring frame F having an opening and a wafer W as an example of a to-be-processed object. The tape applying apparatus 1 includes a stage 10 that supports a ring frame F and supports a wafer W positioned in an opening, and a stage moving means 13 that moves the stage 10 in the horizontal direction (X-axis direction).

在平台10之周圍，設置有支持環形框F之框支持部11。平台10及框支持部11藉由支持台12從下方被支持。平台移動手段13具備在X軸方向延伸的基座14，和能夠沿著基座14在X軸方向移動的移動基台15。在移動基台15配設支持台12，移動基台15在X軸方向移動，依此可以使平台10及框支持部11經由支持台12在X軸方向移動。Around the platform 10, a frame support portion 11 for supporting the annular frame F is provided. The platform 10 and the frame support part 11 are supported by the support stand 12 from below. The stage moving means 13 includes a base 14 extending in the X-axis direction, and a moving base 15 movable in the X-axis direction along the base 14 . The support table 12 is arranged on the mobile base 15 , and the mobile base 15 moves in the X-axis direction, whereby the platform 10 and the frame support portion 11 can be moved in the X-axis direction via the support table 12 .

膠帶黏貼裝置1至少具備：捲筒膠帶支持部20、20A，其係能夠旋轉地支持將膠帶組3、3A設成捲筒狀之捲筒膠帶2、2A；捲筒膠帶支持手段21、21A，其係配設兩個以上捲筒膠帶支持部20、20A；第1滾輪單元30，其係將從捲筒膠帶2、2A拉出之膠帶組3、3A從捲筒膠帶支持手段21、21A引導至平台10；黏貼手段50，其係從被引導至平台10之膠帶組3、3A，剝離圖2所示之黏著膠帶4，使黏著膠帶4黏貼於平台10支持的環形框F和晶圓W；廢棄手段60，捲取黏著膠帶4被剝離的保護薄膜5並予以廢棄；第2滾輪單元70，其係將該黏著膠帶4被剝離的保護薄膜5從平台10引導至廢棄手段60；定位手段40，其係被配設在捲筒膠帶支持手段21、21A和第1滾輪單元30之間，選擇被支持於捲筒膠帶支持部20、20A之捲筒膠帶2、2A中之任一者且把持膠帶組3、3A之端部而予以拉出，定位在平台10；膠帶組引導手段80，其係把持定位手段40定位的膠帶組3、3A之端部而通過第2滾輪單元70而引導至廢棄手段60；及切斷手段90，其係被配設在平台10和廢棄手段60之間，切斷剝離黏著膠帶4的保護薄膜5。The tape sticking device 1 at least includes: tape roll support parts 20, 20A, which can rotatably support tape rolls 2, 2A with tape sets 3, 3A in a roll shape; tape roll support means 21, 21A, It is equipped with more than two reel tape support parts 20, 20A; the first roller unit 30 guides the tape group 3, 3A pulled out from the reel tape 2, 2A from the reel tape support means 21, 21A To platform 10; pasting means 50, which is to peel off adhesive tape 4 shown in FIG. Discarding means 60, coiling the protective film 5 peeled off from the adhesive tape 4 and discarding it; the second roller unit 70, guiding the peeled protective film 5 of the adhesive tape 4 from the platform 10 to the discarding means 60; positioning means 40, it is arranged between the roll tape support means 21, 21A and the first roller unit 30, select any one of the roll tape 2, 2A supported by the roll tape support part 20, 20A and Hold the ends of the tape sets 3, 3A and pull them out, and position them on the platform 10; the tape set guiding means 80 is to hold the ends of the tape sets 3, 3A positioned by the positioning means 40 and guide them through the second roller unit 70 to the discarding means 60; and the cutting means 90, which is arranged between the platform 10 and the discarding means 60, cuts and peels off the protective film 5 of the adhesive tape 4.

如圖2所示般，膠帶組3成為貼合帶狀之黏著膠帶4和帶狀之保護薄膜5的構造。黏著膠帶4係由基材4a和黏著劑層4b所構成，在黏著劑層4b側黏貼保護薄膜5。本實施形態所示之膠帶組3成為事先對應於圖1所示之環形框F而被成形的複數黏著膠帶4隔著間隔被配置在保護薄膜5的構成。圖示之例之黏著膠帶4因應成為黏著對象之環形框F之直徑而被全切割成圓形狀，在保護薄膜5例如隔著等間隔配設複數被全切割的黏著膠帶4。黏著膠帶4及保護薄膜5不特別限定於材質等。針對本實施形態所示之膠帶組3A，設成與膠帶組3不同之品種。即是，膠帶組3A係在由與膠帶組3之黏著膠帶4之材料或厚度不同的黏著膠帶黏貼保護薄膜5者。As shown in FIG. 2 , the adhesive tape set 3 has a structure in which a tape-shaped adhesive tape 4 and a tape-shaped protective film 5 are bonded together. The adhesive tape 4 is composed of a base material 4a and an adhesive layer 4b, and a protective film 5 is pasted on the side of the adhesive layer 4b. The adhesive tape set 3 shown in this embodiment has a structure in which a plurality of adhesive tapes 4 formed in advance corresponding to the ring frame F shown in FIG. 1 are arranged on the protective film 5 with intervals therebetween. The adhesive tape 4 of the illustrated example is fully cut into a circular shape according to the diameter of the ring frame F to be adhered, and a plurality of fully cut adhesive tapes 4 are placed on the protective film 5 at equal intervals, for example. The materials of the adhesive tape 4 and the protective film 5 are not particularly limited. For the adhesive tape set 3A shown in this embodiment, it is set as a different type from the adhesive tape set 3 . That is, the adhesive tape set 3A is one in which the protective film 5 is attached with an adhesive tape different in material or thickness from the adhesive tape 4 of the adhesive tape set 3 .

捲筒膠帶支持部20藉由例如筒芯被構成。膠帶組3捲筒狀地被捲在該捲筒膠帶支持部20而成為捲筒膠帶2。在捲筒膠帶支持部20之筒芯內，雖然無圖示，但被***能夠旋轉地支持捲筒膠帶支持部20之支持棒。支持棒連接有使捲筒支持部20正轉、逆轉之圖1所示的旋轉手段22。旋轉手段22係由例如伺服馬達所構成。即使針對捲筒膠帶支持部20A，也係與捲筒膠帶支持部20相同之構成，膠帶組3A捲筒狀地被捲在捲筒膠帶支持部20A而成為捲筒膠帶2A。當藉由定位手段40，將膠帶組3、3A從捲筒膠帶2、2A拉出之時，藉由旋轉手段22，使捲筒膠帶支持部20、20A朝正轉方向(例如順時鐘方向)旋轉。另外，藉由切斷手段90切斷保護薄膜5之後，以捲筒膠帶支持部20、20A捲取剩餘的膠帶組3、3A之時，藉由旋轉手段22，使捲筒膠帶支持部20、20A朝逆轉方向(例如逆時鐘方向)旋轉。The roll tape support part 20 is comprised by the core, for example. The tape set 3 is wound around the tape roll support part 20 in a roll shape, and becomes the tape roll 2 . In the core of the roll tape support part 20, although not shown in figure, the support rod which rotatably supports the roll tape support part 20 is inserted. The support rod is connected with the rotation means 22 shown in FIG. 1 for forward rotation and reverse rotation of the reel support part 20 . The rotating means 22 is constituted by, for example, a servo motor. Also about 20 A of roll tape support parts, it is the same structure as the roll tape support part 20, and 3 A of adhesive tape sets are wound around 20 A of roll tape support parts in roll shape, and become roll tape 2A. When the tape group 3, 3A is pulled out from the roll tape 2, 2A by the positioning means 40, the roll tape support part 20, 20A is turned in the forward direction (for example, clockwise direction) by the rotation means 22 rotate. In addition, after the protective film 5 is cut by the cutting means 90, when the remaining tape sets 3, 3A are wound up by the tape roll support parts 20, 20A, the tape roll support parts 20, 20A rotates in a reverse direction (for example, counterclockwise).

捲筒膠帶支持手段21具有收容捲筒膠帶2之框體210。在框體210之底壁，形成有用以使膠帶組3通過之開口211。在開口211之端部，配設有檢測出膠帶組3之前端的前端檢測部24。在開口211之正下方，配設有一對引導滾輪25，可以將膠帶組3引導至下方。即使針捲筒膠帶支持手段21A，也與捲筒膠帶支持手段21相同的構成。在圖示之例中，在捲筒膠帶支持手段21A側之引導滾輪25之附近，配設有朝向第1滾輪單元30而引導膠帶組3、3A之引導滾輪26。另外，在框體210之前方側(Y軸方向前方側)配設有能夠開關的蓋部。The tape roll support means 21 has a frame body 210 for accommodating the tape roll 2 . On the bottom wall of the frame body 210, there is formed an opening 211 for allowing the tape set 3 to pass through. At the end of the opening 211, a front-end detection part 24 for detecting the front end of the adhesive tape set 3 is arranged. Directly below the opening 211, a pair of guiding rollers 25 are arranged to guide the tape set 3 downward. Even the needle roll tape support means 21A has the same configuration as the roll tape support means 21 . In the illustrated example, guide rollers 26 for guiding the tape sets 3 and 3A toward the first roller unit 30 are disposed near the guide rollers 25 on the roll tape support means 21A side. In addition, a cover portion that can be opened and closed is disposed on the front side (the front side in the Y-axis direction) of the housing 210 .

在捲筒膠帶支持部20具備有將所使用之膠帶組3之品種資訊予以編碼化的二維碼23。在與二維碼23相向之位置，於上述蓋部之背面(捲筒膠帶支持部20側之面)具備有讀取二維碼23之攝影機。當以捲筒膠帶支持部20支持捲筒膠帶2而關閉蓋部時，藉由攝影機讀取二維碼23，可以識別被支持於捲筒膠帶支持部20之膠帶組3之品種。即使針對捲筒膠帶支持部20A也具備有將所使用之膠帶組3之品質資訊予以編碼化的二維碼23A。另外，二維碼23、23A之配設位置不限定於在本實施形態所示之位置，為任意。The two-dimensional code 23 which coded the type information of the tape set 3 used is provided in the roll tape support part 20. As shown in FIG. At a position facing the two-dimensional code 23, a camera for reading the two-dimensional code 23 is provided on the back surface of the cover (the surface on the side of the roll tape support part 20). When the roll tape support part 20 supports the roll tape 2 and the cover is closed, the type of the tape set 3 supported by the roll tape support part 20 can be identified by reading the two-dimensional code 23 with the camera. The two-dimensional code 23A which coded the quality information of the tape set 3 used also is equipped with 20 A of roll tape support parts. In addition, the arrangement position of the two-dimensional code 23, 23A is not limited to the position shown in this embodiment, It is arbitrary.

定位手段40具備被支持於支持構件41之一端的第1挾持部42，和被連接於支持構件41之另一端的旋轉機構43，和使第1挾持部42在水平方向(X軸方向)移動之滑動機構44。在第1挾持部42中，能夠挾持膠帶組3、3A之端部之兩端。The positioning means 40 is provided with a first clamping portion 42 supported on one end of the support member 41, and a rotation mechanism 43 connected to the other end of the support member 41, and moves the first clamping portion 42 in the horizontal direction (X-axis direction). The sliding mechanism 44. In the first pinching part 42, both ends of the ends of the tape sets 3, 3A can be pinched.

旋轉機構43成為能夠順時鐘及逆時鐘旋轉，可以定位在挾持從捲筒膠帶2被拉出之膠帶組3之第1挾持位置P1，和挾持從捲筒膠帶2A被拉出之膠帶組3A之第2挾持位置P2，和第1挾持部42開放膠帶組3、3A之開放位置P3(參照圖4)。第1挾持位置P1及第2挾持位置P2係指第1挾持部42可以挾持從捲筒膠帶2、2A被拉出且藉由一對引導滾輪25被引導之膠帶組3、3A的位置。開放位置P3係指可以將藉由第1挾持部42被挾持之膠帶組3、3A交給膠帶組引導手段80的位置。The rotating mechanism 43 can rotate clockwise and counterclockwise, and can be positioned between the first pinching position P1 that pinches the tape set 3 pulled out from the roll tape 2, and between the pinch position P1 that pinches the tape set 3A pulled out from the roll tape 2A. The second pinching position P2, and the opening position P3 (see FIG. 4 ) where the first pinching portion 42 releases the adhesive tape sets 3 and 3A. The first pinching position P1 and the second pinching position P2 are positions where the first pinching portion 42 can pinch the tape set 3 , 3A pulled out from the roll tape 2 , 2A and guided by the pair of guide rollers 25 . The open position P3 is a position where the adhesive tape sets 3 and 3A pinched by the first pinching part 42 can be handed over to the adhesive tape set guide means 80 .

滑動機構44係藉由在X軸方向延伸之基座45，在基座45能夠於X軸方向滑動的滑件46所構成。滑件46經由旋轉機構43支持第1挾持部42。而且，藉由滑件46在基座45於X軸方向滑動，可以使第1挾持部42與旋轉機構43一起在X軸方向滑動。The sliding mechanism 44 is constituted by a base 45 extending in the X-axis direction, and a slider 46 slidable in the X-axis direction on the base 45 . The slider 46 supports the first clamping portion 42 via the rotation mechanism 43 . Furthermore, when the slider 46 slides in the X-axis direction on the base 45 , the first clamping portion 42 can be slid in the X-axis direction together with the rotation mechanism 43 .

第1滾輪單元30至少藉由驅動滾輪31、兩個從動滾輪32、使驅動滾輪31和從動滾輪32相對性接近及分離之移動機構33所構成。移動機構33係藉由在X軸方向延伸之導軌34，和在導軌34能夠水平移動之移動部35所構成。移動部35在其前端部支持兩個從動滾輪32。藉由移動部35沿著導軌34移動，可以使驅動滾輪31和從動滾輪32相對性接近及分離。The first roller unit 30 is composed of at least a driving roller 31 , two driven rollers 32 , and a moving mechanism 33 for relatively approaching and separating the driving roller 31 and the driven rollers 32 . The moving mechanism 33 is constituted by a guide rail 34 extending in the X-axis direction, and a moving part 35 capable of horizontally moving on the guide rail 34 . The moving part 35 supports two driven rollers 32 at its front end. By moving the moving part 35 along the guide rail 34 , the driving roller 31 and the driven roller 32 can be relatively approached and separated.

黏貼手段50具備有將圖2所示之黏著膠帶4朝環狀框F及晶圓W推壓並與黏貼的黏貼滾輪51，和將黏貼膠帶4從通過第1滾輪單元30而被送出之保護薄膜5剝離的剝離板53。黏貼滾輪51被配設在平台10之上方側且成為能夠以軸部為中心而旋轉。在黏貼滾輪51連接黏貼滾輪推壓手段52，成為能夠在藉由黏貼滾輪推壓手段52朝平台10接近及分離的Z軸方向升降。黏貼滾輪51可以對被保持於平台10之晶圓W和被支持於框支持部11之環狀框F，推壓藉由剝離板53從保護薄膜5被剝離之黏著膠帶4並予以黏貼。The pasting means 50 is equipped with a pasting roller 51 that pushes the adhesive tape 4 shown in FIG. The peeling plate 53 from which the film 5 is peeled off. The sticking roller 51 is arranged on the upper side of the table 10 and is rotatable around the shaft. The sticking roller pressing means 52 is connected to the sticking roller 51 , and can be raised and lowered in the Z-axis direction in which the sticking roller pushing means 52 approaches and separates from the platform 10 . The sticking roller 51 can press and stick the adhesive tape 4 peeled off from the protective film 5 by the peeling plate 53 to the wafer W held on the stage 10 and the ring frame F supported by the frame support unit 11 .

剝離板53係藉由前端側朝黏貼滾輪51傾斜之臂部54，和被連接於臂部54之前端的推壓部55所構成。推壓部55成為能夠沿著臂部54往返移動，藉由以推壓部55推壓膠帶組3中保護薄膜5而形成銳角，可以將黏著膠帶4從保護薄膜5剝離。The peeling plate 53 is composed of an arm portion 54 whose front end is inclined toward the sticking roller 51 , and a pressing portion 55 connected to the front end of the arm portion 54 . The pressing part 55 can move back and forth along the arm part 54, and the adhesive tape 4 can be peeled off from the protective film 5 by pressing the protective film 5 in the tape set 3 with the pressing part 55 to form an acute angle.

廢棄手段60具備有挾持保護薄膜5之端部的兩端並且捲取成捲筒狀的捲取部61，和使捲取部61旋轉之馬達62，和被配設在捲取部61之下方且用以回收被捲取成捲筒狀之保護薄膜5的廢棄箱63。The disposal means 60 is equipped with a take-up unit 61 that clamps both ends of the end of the protective film 5 and winds it into a roll, and a motor 62 that rotates the take-up unit 61 , and is disposed below the take-up unit 61 . And it is used to recycle the waste box 63 of the protective film 5 wound into a roll.

第2滾輪單元70被配置在膠帶組引導手段80之移動路徑(X軸方向)上，成為與第1滾輪單元30相同的構成。即是，第2滾輪單元70至少藉由驅動滾輪71、兩個從動滾輪72、使驅動滾輪71和從動滾輪72相對性接近及分離之移動機構73所構成。移動機構73係藉由在Z軸方向延伸之導軌74，和在導軌74能夠水平移動之移動部75所構成。移動部75在其前端部支持兩個從動滾輪72。藉由移動部75沿著導軌74移動，可以使驅動滾輪71和從動滾輪72相對性接近及分離。The 2nd roller unit 70 is arrange|positioned on the movement path (X-axis direction) of the tape set guide means 80, and has the same structure as the 1st roller unit 30. As shown in FIG. That is, the second roller unit 70 is constituted by at least a driving roller 71, two driven rollers 72, and a moving mechanism 73 for relatively approaching and separating the driving roller 71 and the driven rollers 72. The moving mechanism 73 is constituted by a guide rail 74 extending in the Z-axis direction, and a moving part 75 capable of horizontally moving on the guide rail 74 . The moving part 75 supports two driven rollers 72 at its front end. By moving the moving part 75 along the guide rail 74, the driving roller 71 and the driven roller 72 can be relatively approached and separated.

膠帶組引導手段80具備被支持於支持構件81之一端的第2挾持部82，和被連接於支持構件81之另一端的且使第2挾持部82在水平方向(X軸方向)滑動之滑動機構85。在第2挾持部82之上端，安裝有載置藉由第2滾輪單元70被引導之保護薄膜5的載置台83。在載置台83形成有用以膠帶切斷器之刀頭的退避溝84。第2挾持部82可以接住第1挾持部42挾持的膠帶組3之端部的兩端並予以挾持。The tape set guiding means 80 is provided with a second clamping portion 82 supported on one end of the supporting member 81, and a slide mechanism connected to the other end of the supporting member 81 to slide the second clamping portion 82 in the horizontal direction (X-axis direction). Institution85. On the upper end of the second clamping portion 82, a mounting table 83 on which the protective film 5 guided by the second roller unit 70 is mounted is attached. A relief groove 84 for a cutter head of a tape cutter is formed on the mounting table 83 . The second pinching part 82 can catch and pinch both ends of the ends of the tape set 3 pinched by the first pinching part 42 .

滑動機構85係藉由在X軸方向延伸之基座86，在基座86能夠於X軸方向滑動的滑件87所構成。滑件87連接有第2挾持部82。滑件87可以藉由在基座86於X軸方向做一直線水平滑動，使支持構件81及第2挾持部82在同方向滑動。The sliding mechanism 85 is constituted by a base 86 extending in the X-axis direction, and a slider 87 slidable in the X-axis direction on the base 86 . The slider 87 is connected to the second clamping portion 82 . The slider 87 can slide the support member 81 and the second clamping portion 82 in the same direction by sliding horizontally on the base 86 in a straight line in the X-axis direction.

切斷手段90具備有切斷被載置於第2挾持部82之載置台83的保護薄膜5的膠帶切斷器91，和使膠帶切斷器91在Z軸方向升降之升降機構92，和推壓被載置於載置台83之保護薄膜5的推壓部93。雖然無圖示，膠帶黏貼裝置1具備控制膠帶黏貼裝置1之各種機構的控制部。控制部例如可以控制定位手段40以使選擇捲筒膠帶2、2A中之任一方而拉出膠帶組3或膠帶組3A。The cutting means 90 includes a tape cutter 91 that cuts the protective film 5 placed on the mounting table 83 of the second clamping portion 82, and a lifting mechanism 92 that lifts the tape cutter 91 in the Z-axis direction, and The pressing part 93 that presses the protective film 5 placed on the mounting table 83 . Although not shown in the figure, the tape sticking device 1 includes a control unit that controls various mechanisms of the tape sticking device 1 . For example, the control part may control the positioning means 40 so that one of the roll tapes 2 and 2A may be selected and the tape set 3 or the tape set 3A may be pulled out.

接著，針對膠帶黏貼裝置1之動作例予以說明。晶圓W為圓形板狀之被加工物之一例，並非特別限定於材質或大小。將晶圓W載置於平台10，並且將環形框F載置於框支持部11。接著，無圖示之吸引源動作動，以平台10之保持面吸引保持晶圓W。Next, an example of the operation of the tape sticking device 1 will be described. The wafer W is an example of a circular plate-shaped workpiece, and is not particularly limited in material and size. The wafer W is placed on the stage 10 , and the ring frame F is placed on the frame support portion 11 . Next, the suction source (not shown) operates to suction and hold the wafer W on the holding surface of the stage 10 .

定位手段40例如選擇例如被支持於捲筒膠帶支持部20之捲筒膠帶2，從捲筒膠帶2拉出膠帶組3。具體而言，一面藉由旋轉手段22使捲筒支持部20朝正轉方向(例如，順時鐘方向)旋轉，一面使膠帶組3從捲筒膠帶2通過一對引導滾輪25之間，藉由引導滾輪25朝下方送出。通常，位於捲筒膠帶2之最外周的膠帶組3之端部側僅露出保護薄膜5。因此，從捲筒膠帶2拉出膠帶組3之情況，藉由旋轉機構43將第1挾持部42定位在第1挾持位置P1，藉由引導滾輪25被送出之膠帶組3之端部，即是藉由第1挾持部42挾持保護薄膜5之端部的兩端。The positioning means 40 selects, for example, the tape roll 2 supported by the tape roll support part 20, and pulls out the tape set 3 from the tape roll 2, for example. Specifically, while the reel support part 20 is rotated in the normal rotation direction (for example, clockwise direction) by the rotating means 22, the adhesive tape set 3 is passed between the pair of guide rollers 25 from the reel adhesive tape 2, by The guide rollers 25 are sent out downwards. Normally, only the protective film 5 is exposed on the end side of the tape group 3 positioned on the outermost periphery of the roll tape 2 . Therefore, when the tape set 3 is pulled out from the roll tape 2, the first clamping part 42 is positioned at the first pinching position P1 by the rotating mechanism 43, and the end of the tape set 3 sent out by the guide roller 25, that is, Both ends of the end portion of the protective film 5 are pinched by the first pinching portion 42 .

如圖3所示般，藉由滑動機構44，使第1挾持部42與滑件46一起滑動至基座45之端部(在圖示之例中，為右方側之端部)為止，例如+X方向。依此，藉由挾持保護薄膜5之第1挾持部42從捲筒膠帶2拉出膠帶組3，並且將第1挾持部42定位在第1滾輪單元30側。As shown in FIG. 3 , by means of the sliding mechanism 44, the first clamping portion 42 slides together with the slider 46 to the end of the base 45 (in the example shown, the end on the right side), For example +X direction. According to this, the tape set 3 is pulled out from the roll tape 2 by the first pinching portion 42 pinching the protective film 5 , and the first pinching portion 42 is positioned on the side of the first roller unit 30 .

如圖4所示般，藉由旋轉機構43朝例如順時鐘方向旋轉，將以第1挾持部42挾持的保護薄膜5掛在引導滾輪26，並且通過驅動滾輪31和從動滾輪32之間而掛在驅動滾輪31，使第1挾持部42移動至開放位置P3。As shown in FIG. 4 , by rotating the rotating mechanism 43 clockwise, for example, the protective film 5 pinched by the first pinching portion 42 is hung on the guide roller 26, and passed between the driving roller 31 and the driven roller 32 to Hanging on the driving roller 31, the first pinching part 42 is moved to the release position P3.

接著，如圖5所示般，膠帶組引導手段80在開放位置P3挾持保護薄膜5。具體而言，藉由滑動機構85，使滑件87沿著基座86例如+X方向滑動，使第2挾持部82移動至開放位置P3。當第1挾持部42在開放位置P3開放保護薄膜5時，藉由第2挾持部82接住保護薄膜5之端部的兩端並予以挾持。Next, as shown in FIG. 5 , the tape set guide means 80 pinches the protective film 5 at the opening position P3. Specifically, the slide mechanism 85 slides the slider 87 along the base 86, for example, in the +X direction, and moves the second clamping portion 82 to the open position P3. When the first clamping part 42 releases the protective film 5 at the opening position P3, both ends of the ends of the protective film 5 are caught and clamped by the second clamping part 82 .

如圖6所示般，藉由滑動機構85，使滑件87沿著基座86而在例如-X方向滑動。依此，將以第2挾持部82挾持之保護薄膜85朝同方向拉伸，通過第2滾輪單元70之驅動滾輪71和從動滾輪72之間，將保護薄膜5引導至廢棄手段60。而且，廢棄手段60之捲取部61挾持保護薄膜5之端部的兩端。As shown in FIG. 6 , the slider 87 is slid along the base 86 in, for example, the −X direction by the slide mechanism 85 . Accordingly, the protective film 85 pinched by the second clamping portion 82 is stretched in the same direction, and passes between the driving roller 71 and the driven roller 72 of the second roller unit 70 to guide the protective film 5 to the disposal means 60 . And the winding part 61 of the disposal means 60 pinches both ends of the edge part of the protective film 5. As shown in FIG.

如圖7所示般，藉由第1滾輪單元30之移動機構33作動，移動部35沿著導軌34在例如-X方向移動，使兩個從動滾輪32接近於驅動滾輪31，使兩個從動滾輪32接觸於膠帶組3而藉由驅動滾輪31和兩個從動滾輪32挾入膠帶組3。再者，藉由第2滾輪單元70之移動機構73作動，移動部75沿著導軌74在例如-Z方向移動，使兩個從動滾輪72接近於驅動滾輪71，使兩個從動滾輪72接觸於保護薄膜5而藉由驅動滾輪71和兩個從動滾輪72挾入保護薄膜5。As shown in Figure 7, by the movement of the moving mechanism 33 of the first roller unit 30, the moving part 35 moves along the guide rail 34 in, for example, the -X direction, so that the two driven rollers 32 are close to the driving rollers 31, so that the two The driven roller 32 contacts the adhesive tape set 3 and entrains the adhesive tape set 3 by the driving roller 31 and the two driven rollers 32 . Furthermore, by moving the moving mechanism 73 of the second roller unit 70, the moving part 75 moves along the guide rail 74 in the -Z direction, for example, so that the two driven rollers 72 are close to the driving roller 71, so that the two driven rollers 72 The protective film 5 is pinched by the driving roller 71 and the two driven rollers 72 in contact with the protective film 5 .

接著，如圖8所示般，剝離板53係以推壓部55將膠帶組3之中之保護薄膜5朝向下方推壓而將保護薄膜5形成銳角。如此一來，黏著膠帶4從保護薄膜5剝離，黏著膠帶4被送入至黏貼滾輪51之下方。此時，使保持晶圓W之平台10及支持環狀框F之框支持部11事先移動至膠帶組3之下方側。Next, as shown in FIG. 8 , the peeling plate 53 pushes the protective film 5 in the tape set 3 downward with the pressing portion 55 to form an acute angle on the protective film 5 . In this way, the adhesive tape 4 is peeled off from the protective film 5 , and the adhesive tape 4 is sent under the adhesive roller 51 . At this time, the stage 10 holding the wafer W and the frame supporting part 11 supporting the annular frame F are moved to the lower side of the tape set 3 in advance.

一面以特定旋轉速度使黏貼滾輪51旋轉，一面藉由黏貼滾輪推壓手段52使黏貼滾輪51朝例如-Z方向下降，依此，從被支持於框支持部11之環形框F之一方側推壓黏著膠帶4。藉由平台移動手段13將平台10及框支持部11朝例如+X方向送出，以旋轉之黏貼滾輪51對晶圓W及環形框F推壓黏著膠帶4。此時，第1滾輪單元30邊以特定旋轉速度使驅動滾輪31旋轉，邊使兩個從動滾輪32也隨著驅動滾輪31之旋轉而旋轉，將膠帶組3朝向平台10引導至下方。再者，第2滾輪單元70邊以特定旋轉速度使驅動滾輪71旋轉，邊使兩個從動滾輪72也隨著驅動滾輪71之驅動而旋轉，藉由剝離板53將黏著膠帶4被剝離之保護薄膜5從平台10引導至廢棄手段60。While rotating the pasting roller 51 at a specific rotation speed, the pasting roller 51 is lowered, for example, in the -Z direction by the pasting roller pushing means 52, thereby pushing from one side of the ring frame F supported by the frame supporting part 11. Press adhesive tape 4. The platform 10 and the frame support part 11 are sent out in the +X direction by the platform moving means 13, and the adhesive tape 4 is pushed against the wafer W and the ring frame F by the rotating adhesive roller 51. At this time, the first roller unit 30 rotates the driving roller 31 at a specific rotation speed, and rotates the two driven rollers 32 with the rotation of the driving roller 31 to guide the adhesive tape set 3 downward toward the platform 10 . Furthermore, the second roller unit 70 rotates the driving roller 71 at a specific rotation speed, and rotates the two driven rollers 72 following the driving of the driving roller 71, and the adhesive tape 4 is peeled off by the peeling plate 53. The protective film 5 is guided from the platform 10 to a disposal means 60 .

當一面以黏貼滾輪51推壓黏著膠帶4，一面如圖9所示般，使平台10及框支持部11在+方向移動至特定位置時，可以將黏著膠帶4黏貼於晶圓W和環形框F。黏著膠帶4被剝離之保護薄膜5在藉由馬達62旋轉之捲取部61的外周，被捲取成捲筒狀，形成保護薄膜輥5A。經由黏著膠帶4而與環形框F成為一體之晶圓W，藉由無圖示之搬運手段，被移送至例如切割裝置等而進行切割等。如此一來，當完成黏著膠帶4對一片晶圓W的黏貼動作時，依序將新的晶圓W搬運至平台10，並且將環形框F搬運至框支持部11，與上述相同，重複進行黏著膠帶4之黏貼動作，和從黏著膠帶4被剝離的保護薄膜5之捲取動作。When the adhesive tape 4 is pushed by the adhesive roller 51, and the platform 10 and the frame support portion 11 are moved to a specific position in the + direction as shown in FIG. 9, the adhesive tape 4 can be attached to the wafer W and the ring frame. F. The protective film 5 from which the adhesive tape 4 has been peeled is wound up into a roll on the outer periphery of the winding unit 61 rotated by the motor 62 to form a protective film roll 5A. The wafer W integrated with the ring frame F via the adhesive tape 4 is transferred to, for example, a dicing device or the like by a transfer means not shown in the figure, where dicing or the like is performed. In this way, when the sticking operation of the adhesive tape 4 to a wafer W is completed, the new wafer W is sequentially transported to the platform 10, and the ring frame F is transported to the frame support part 11, and the same as above, is repeated. The sticking operation of the adhesive tape 4 and the winding operation of the protective film 5 peeled off from the adhesive tape 4 are performed.

藉由從捲筒膠帶2持續拉出膠帶組3，如圖10所示般，被支持於滾筒膠帶支持手段21之捲筒膠帶2縮徑。在此，在膠帶黏貼裝置1中，例如變更膠帶組3之品種之情況，藉由控制手段控制定位手段40，選擇新的膠帶組3A，從捲筒膠帶支持手段21A拉出。此時，藉由切斷手段90切斷現在使用的膠帶組3之保護薄膜5，並且以廢棄手段60捲取被切斷之保護薄膜5而予以廢棄。從膠帶組3切換至膠帶組3A而予以拉出之情況，在切斷手段90之下方，事先定位膠帶組引導手段80之載置台83。By continuously pulling out the tape group 3 from the roll tape 2, the roll tape 2 supported by the roll tape support means 21 is reduced in diameter as shown in FIG. 10 . Here, in the tape sticking device 1, for example, when changing the type of the tape set 3, the positioning means 40 is controlled by the control means to select a new tape set 3A and pull it out from the roll tape support means 21A. At this time, the protective film 5 of the currently used adhesive tape set 3 is cut by the cutting means 90, and the cut protective film 5 is wound up by the disposal means 60 and discarded. When switching from the tape set 3 to the tape set 3A and pulling it out, the mounting table 83 of the tape set guiding means 80 is positioned under the cutting means 90 in advance.

切斷手段90藉由升降機構92使推壓部93及膠帶切斷器91朝例如-Z方向下降，以推壓部93朝向載置台83從上方推壓保護薄膜5，並且將膠帶切斷器91之刀頭切入至退避溝84為止而完全切斷保護薄膜5。被切斷之保護薄膜5藉由捲取部61，進一步被捲取，保護薄膜輥5A成為大徑化。In the cutting means 90, the pressing part 93 and the tape cutter 91 are lowered in the -Z direction by the lifting mechanism 92, and the protective film 5 is pushed from above with the pressing part 93 toward the mounting table 83, and the tape cutter The cutter head of 91 cuts into till the escape groove 84 and completely cuts off the protective film 5 . The cut protective film 5 is further wound up by the winding unit 61, and the diameter of the protective film roll 5A is increased.

之後，如圖11所示般，切斷手段90朝+Z方向上升，朝離開載置台83之方向退避，並且保護薄膜輥5A被廢棄至廢棄箱63。此時，藉由旋轉手段22使現在使用的捲筒膠帶支持部20朝逆轉方向(例如，逆時鐘方向)旋轉，將被切斷之剩餘的膠帶組3捲取在捲筒膠帶支持部20。即是，朝平台10側被拉出的膠帶組3通過第1滾輪單元30、一對引導滾輪25及框體210之開口211而被捲取在捲筒膠帶支持部20。而且，當以前端檢測部24檢測出保護薄膜5時，停止捲筒膠帶支持部20之旋轉即可。Thereafter, as shown in FIG. 11 , the cutting means 90 rises in the +Z direction, retreats in a direction away from the mounting table 83 , and the protective film roll 5A is discarded in the disposal box 63 . At this time, the currently used roll tape support portion 20 is rotated in a reverse direction (for example, counterclockwise) by the rotating means 22 , and the remaining tape set 3 that has been cut is wound up on the roll tape support portion 20 . That is, the tape set 3 pulled out toward the platform 10 side is wound up on the roll tape support portion 20 through the first roller unit 30 , the pair of guide rollers 25 , and the opening 211 of the frame 210 . And what is necessary is just to stop rotation of the roll tape support part 20, when the protective film 5 is detected by the front-end|tip detection part 24.

針對藉由定位手段40從滾筒膠帶2A拉出膠帶組3A之動作，與從上述捲筒膠帶2拉出膠帶組3之動作相同。即是，藉由旋轉機構43將第1挾持部42定位在第2挾持位置P2，藉由第1挾持部42挾持藉由引導滾輪25被送出之膠帶組3A之端部，即是保護薄膜5之端部之兩端，若與上述同樣地拉出即可。而且，即使針對新被拉出之膠帶組3A，重複進行黏著膠帶4之黏貼動作和從黏著膠帶4被剝離之保護薄膜5之捲取動作。The operation of pulling out the tape set 3A from the tape roll 2A by the positioning means 40 is the same as the action of pulling out the tape set 3 from the tape roll 2 described above. That is, the first pinching part 42 is positioned at the second pinching position P2 by the rotating mechanism 43, and the end of the adhesive tape group 3A sent out by the guide roller 25 is pinched by the first pinching part 42, which is the protective film 5 The two ends of the end can be pulled out in the same way as above. And also for the adhesive tape group 3A which was pulled out newly, the sticking operation of the adhesive tape 4 and the winding operation of the protective film 5 peeled off from the adhesive tape 4 are repeated.

如同上述般，因與本發明有關之膠帶黏貼裝置1被構成至少具備：捲筒膠帶支持部20、20A，其係能夠旋轉地支持將膠帶組3、3A設成捲筒狀之捲筒膠帶2、2A；捲筒膠帶支持手段21、21A，其係配設兩個以上捲筒膠帶支持部20、20A；第1滾輪單元30，其係將從捲筒膠帶2、2A拉出之膠帶組3、3A從捲筒膠帶支持手段21、21A引導至平台10；黏貼手段50，其係從被引導至平台10之膠帶組3、3A，剝離黏著膠帶4，使黏著膠帶4黏貼於平台10支持的環形框F和晶圓W；廢棄手段60，捲取黏著膠帶4被剝離的保護薄膜5並予以廢棄；第2滾輪單元70，其係將該黏著膠帶4被剝離的保護薄膜5從平台10引導至廢棄手段60；定位手段40，其係選擇捲筒膠帶2、2A中之任一者且把持膠帶組3、3A之端部而予以拉出，定位在平台10；膠帶組引導手段80，其係把持定位手段40定位的膠帶組3、3A之端部而通過第2滾輪單元70而引導至廢棄手段60；及切斷手段90，其係被配設在平台10和廢棄手段60之間，切斷黏著膠帶4被剝離的保護薄膜5，將新選擇的該膠帶組3、3A藉由定位手段40從捲筒膠帶支持手段21、21A拉出之時，藉由該切斷手段90切斷現在使用的該膠帶組3、3A之保護薄膜5，廢棄手段60捲取並予以廢棄，並且使現在使用的捲筒膠帶支持部20、20A作動而可以捲取該膠帶組3、3A，故可以容易將藉由定位手段40拉出之膠帶組從例如膠帶組3切換成不同品種之膠帶組3A，無須以連結用膠帶連結膠帶組3之切斷端，和膠帶組3A之前端。因此，可以不使用連結用膠帶，選擇希望的膠帶組3、3A而將黏著膠帶4黏貼於環形框F和晶圓W。 　　再者，若藉由本發明時，由於以捲筒膠帶支持部20、20A捲取被切斷之剩餘的膠帶組3、3A，故不會浪費膠帶組3、3A，可以有效地利用。As mentioned above, because the adhesive tape sticking device 1 related to the present invention is constituted to at least include: the roll tape support part 20, 20A, it is the roll tape 2 that can rotatably support the tape set 3, 3A in a roll shape. , 2A; reel tape support means 21, 21A, which is equipped with more than two reel tape support parts 20, 20A; first roller unit 30, which is the tape group 3 that will be pulled out from the reel tape 2, 2A , 3A are guided to the platform 10 from the roll tape support means 21, 21A; the sticking means 50 is to peel off the adhesive tape 4 from the adhesive tape group 3, 3A guided to the platform 10, so that the adhesive tape 4 is pasted on the platform 10 supported The ring frame F and the wafer W; the discarding means 60, which winds up the protective film 5 from which the adhesive tape 4 has been peeled off and discards it; the second roller unit 70 guides the protective film 5 from which the adhesive tape 4 has been peeled off from the platform 10 To the waste means 60; the positioning means 40, which is to select any one of the roll tapes 2, 2A and hold the ends of the adhesive tape groups 3, 3A and pull it out, and be positioned on the platform 10; the adhesive tape group guiding means 80, its The end of the adhesive tape group 3, 3A positioned by the positioning means 40 is guided to the discarding means 60 by the second roller unit 70; and the cutting means 90 is arranged between the platform 10 and the discarding means 60, Cut off the peeled protective film 5 of the adhesive tape 4, and when the newly selected tape group 3, 3A is pulled out from the roll tape support means 21, 21A by the positioning means 40, it is cut by the cutting means 90. The protective film 5 of the adhesive tape set 3, 3A currently used is wound up by the disposal means 60 and discarded, and the roll tape support portion 20, 20A currently used is actuated to wind the adhesive tape set 3, 3A, so it can be It is easy to switch the tape set pulled out by the positioning means 40 from, for example, the tape set 3 to a different type of tape set 3A, without connecting the cut end of the tape set 3 and the front end of the tape set 3A with a connecting tape. Therefore, the adhesive tape 4 can be attached to the ring frame F and the wafer W by selecting a desired tape set 3 , 3A without using the connecting tape. Furthermore, according to the present invention, since the cut remaining tape sets 3, 3A are taken up by the reel tape support parts 20, 20A, the tape sets 3, 3A will not be wasted and can be effectively used.

1‧‧‧膠帶黏貼裝置2、2A‧‧‧捲筒膠帶3、3A‧‧‧膠帶組4‧‧‧黏著膠帶4a‧‧‧基材4b‧‧‧黏著劑層5‧‧‧保護薄膜10‧‧‧平台11‧‧‧框支持部12‧‧‧支持台13‧‧‧平台移動手段14‧‧‧基座15‧‧‧移動基台20、20A‧‧‧捲筒膠帶支持部21、21A‧‧‧捲筒膠帶支持手段210‧‧‧框體211‧‧‧開口22‧‧‧旋轉手段23‧‧‧二維碼24‧‧‧前端檢測部25‧‧‧引導滾輪26‧‧‧引導滾輪30‧‧‧第1滾輪單元31‧‧‧驅動滾輪32‧‧‧從動滾輪33‧‧‧移動機構34‧‧‧導軌35‧‧‧移動部40‧‧‧定位手段41‧‧‧支持構件42‧‧‧第1挾持部43‧‧‧旋轉機構44‧‧‧滑動機構45‧‧‧基座46‧‧‧滑件50‧‧‧黏貼手段51‧‧‧黏貼滾輪52‧‧‧黏貼滾輪推壓手段53‧‧‧剝離板54‧‧‧臂部55‧‧‧推壓部60‧‧‧廢棄手段61‧‧‧捲取部62‧‧‧馬達63‧‧‧廢棄箱70‧‧‧第2滾輪單元71‧‧‧驅動滾輪72‧‧‧從動滾輪73‧‧‧移動機構74‧‧‧導軌75‧‧‧移動部80‧‧‧膠帶組引導手段81‧‧‧支持構件82‧‧‧第2挾持部83‧‧‧載置台84‧‧‧退避溝85‧‧‧滑動機構86‧‧‧基座87‧‧‧滑件90‧‧‧切斷手段91‧‧‧膠帶切斷器92‧‧‧升降機構93‧‧‧推壓部1‧‧‧Adhesive Tape Apparatus 2, 2A‧‧‧Reel Tape 3,3A‧‧‧Tape Set 4‧‧‧Adhesive Tape 4a‧‧‧Substrate 4b‧‧‧Adhesive Layer 5‧‧‧Protective Film 10 . 21A‧‧‧Reel Tape Supporting Means 210‧‧‧Frame 211‧‧‧Opening 22‧‧‧Rotating Means 23‧‧‧QR Code 24‧‧‧Front Detection Unit 25‧‧‧Guide Roller 26‧‧‧ Guide roller 30‧‧‧first roller unit 31‧‧‧driving roller 32‧‧‧driven roller 33‧‧‧moving mechanism 34‧‧‧guide rail 35‧‧‧moving part 40‧‧‧positioning means 41‧‧‧ Supporting member 42‧‧‧first clamping part 43‧‧‧rotating mechanism 44‧‧‧sliding mechanism 45‧‧‧base 46‧‧‧slider 50‧‧‧adhesive means 51‧‧‧adhesive roller 52‧‧‧ Adhesive roller pushing means 53‧‧‧peeling plate 54‧‧‧arm part 55‧‧‧pressing part 60‧‧‧disposal means 61‧‧‧winding part 62‧‧‧motor 63‧‧‧disposal box 70‧ ‧‧Second Roller Unit 71‧‧‧Drive Roller 72‧‧‧Followed Roller 73‧‧‧Movement Mechanism 74‧‧‧Guide Rail 75‧‧‧Moving Part 80‧‧‧Guiding Means for Tape Set 81‧‧‧Supporting Member 82‧‧‧Second clamping part 83‧‧‧Placing platform 84‧‧‧Escape groove 85‧‧‧Sliding mechanism 86‧‧‧Base 87‧‧‧Slider 90‧‧‧Cutting means 91‧‧‧Adhesive tape Cutter 92‧‧‧Elevating mechanism 93‧‧‧Pushing part

圖1為表示膠帶黏貼裝置之構成的剖面圖。 　　圖2為表示捲筒狀地被捲在捲筒膠帶支持部的膠帶組之構成的斜視圖。 　　圖3為表示維持定位手段夾持膠帶組之端部之原樣滑動至第1滾輪單元側之狀態的剖面圖。 　　圖4為表示挾持膠帶組之端部的定位手段被定位在開放位置之狀態的剖面圖。 　　圖5為表示膠帶組引導手段在開放位置挾持膠帶組之端部之狀態的剖面圖。 　　圖6為表示維持膠帶組引導手段挾持膠帶組之端部之原樣滑動至廢棄手段之狀態的剖面圖。 　　圖7為表示以第1滾輪單元及第2滾輪單元挾持膠帶組之狀態的剖面圖。 　　圖8為表示藉由剝離板從保護薄膜剝離黏著膠帶，藉由黏貼滾輪將黏著膠帶黏貼於環形框及晶圓之狀態的剖面圖。 　　圖9為表示黏著膠帶被黏貼於環形框及晶圓之狀態，並且藉由廢棄手段捲取保護薄膜之狀態的剖面圖。 　　圖10為表示藉由切斷手段切斷黏著膠帶被剝離之保護薄膜之狀態的剖面圖。 　　圖11為表示定位手段挾持新選擇的膠帶組並予以拉出之時，以廢棄手段廢棄被切斷之保護薄膜，並且以捲筒膠帶支持部捲取現在使用的膠帶組之狀態的剖面圖。Fig. 1 is a cross-sectional view showing the configuration of a tape sticking device. Fig. 2 is a perspective view showing the configuration of a tape set wound in a roll on the roll tape support portion. Fig. 3 is a cross-sectional view showing the state where the positioning means holds the end of the adhesive tape set and slides to the side of the first roller unit as it is. Fig. 4 is a cross-sectional view showing a state in which the positioning means for pinching the end of the tape group is positioned at the open position. Fig. 5 is a cross-sectional view showing a state where the tape set guiding means pinches the end of the tape set at the open position. Fig. 6 is a cross-sectional view showing a state in which the end of the tape set is held by the tape set guiding means and slides to the discarding means as it is. Fig. 7 is a cross-sectional view showing a state in which the tape set is pinched by the first roller unit and the second roller unit. Fig. 8 is a cross-sectional view showing a state in which the adhesive tape is peeled off from the protective film by the peeling plate, and the adhesive tape is attached to the ring frame and the wafer by the adhesive roller. Fig. 9 is a cross-sectional view showing a state in which an adhesive tape is attached to a ring frame and a wafer, and a protective film is wound up by means of disposal. Fig. 10 is a cross-sectional view showing a state where the protective film from the adhesive tape is cut by cutting means. Fig. 11 is a cross-sectional view showing a state where a newly selected tape set is pinched by the positioning means and pulled out, the cut protective film is discarded by the discarding means, and the currently used tape set is wound up by the roll tape support part.

1‧‧‧膠帶黏貼裝置 1‧‧‧Tape sticking device

2、2A‧‧‧捲筒膠帶 2. 2A‧‧‧Reel Tape

3、3A‧‧‧膠帶組 3. 3A‧‧‧tape set

5‧‧‧保護薄膜 5‧‧‧Protective film

10‧‧‧平台 10‧‧‧platform

11‧‧‧框支持部 11‧‧‧Frame support department

12‧‧‧支持台 12‧‧‧Support Desk

13‧‧‧平台移動手段 13‧‧‧Platform mobile means

14‧‧‧基座 14‧‧‧base

15‧‧‧移動基台 15‧‧‧Mobile Base Station

20、20A‧‧‧捲筒膠帶支持部 20. 20A‧‧‧Reel tape support part

21、21A‧‧‧捲筒膠帶支持手段 21. 21A‧‧‧Reel Tape Support Means

22‧‧‧旋轉手段 22‧‧‧rotation means

23‧‧‧二維碼 23‧‧‧QR code

23A‧‧‧二維碼 23A‧‧‧QR code

24‧‧‧前端檢測部 24‧‧‧Front-end detection department

25‧‧‧引導滾輪 25‧‧‧Guide roller

26‧‧‧引導滾輪 26‧‧‧Guide roller

30‧‧‧第1滾輪單元 30‧‧‧1st roller unit

31‧‧‧驅動滾輪 31‧‧‧Drive roller

32‧‧‧從動滾輪 32‧‧‧Follower roller

33‧‧‧移動機構 33‧‧‧Moving mechanism

34‧‧‧導軌 34‧‧‧Guide rail

35‧‧‧移動部 35‧‧‧Mobile Department

40‧‧‧定位手段 40‧‧‧Positioning means

41‧‧‧支持構件 41‧‧‧Supporting components

42‧‧‧第1挾持部 42‧‧‧The first hostage department

43‧‧‧旋轉機構 43‧‧‧rotating mechanism

44‧‧‧滑動機構 44‧‧‧Sliding mechanism

45‧‧‧基座 45‧‧‧base

46‧‧‧滑件 46‧‧‧Slide

50‧‧‧黏貼手段 50‧‧‧Pasting means

51‧‧‧黏貼滾輪 51‧‧‧Pasting roller

52‧‧‧黏貼滾輪推壓手段 52‧‧‧Adhesive roller pushing means

53‧‧‧剝離板 53‧‧‧Peeling board

54‧‧‧臂部 54‧‧‧arm

55‧‧‧推壓部 55‧‧‧Pushing part

60‧‧‧廢棄手段 60‧‧‧Discard means

61‧‧‧捲取部 61‧‧‧Coiling Department

62‧‧‧馬達 62‧‧‧motor

63‧‧‧廢棄箱 63‧‧‧Discard box

70‧‧‧第2滾輪單元 70‧‧‧The second roller unit

71‧‧‧驅動滾輪 71‧‧‧Drive roller

72‧‧‧從動滾輪 72‧‧‧Follower wheel

73‧‧‧移動機構 73‧‧‧Moving mechanism

74‧‧‧導軌 74‧‧‧Guide rail

75‧‧‧移動部 75‧‧‧Mobile Department

80‧‧‧膠帶組引導手段 80‧‧‧Guiding means of tape group

81‧‧‧支持構件 81‧‧‧Supporting components

82‧‧‧第2挾持部 82‧‧‧The second hostage department

83‧‧‧載置台 83‧‧‧Placing table

84‧‧‧退避溝 84‧‧‧Retreat ditch

85‧‧‧滑動機構 85‧‧‧Sliding mechanism

86‧‧‧基座 86‧‧‧Plinth

87‧‧‧滑件 87‧‧‧slide

90‧‧‧切斷手段 90‧‧‧cutting means

91‧‧‧膠帶切斷器 91‧‧‧Tape cutter

92‧‧‧升降機構 92‧‧‧Elevating mechanism

93‧‧‧推壓部 93‧‧‧Pushing part

210‧‧‧框體 210‧‧‧frame

211‧‧‧開口 211‧‧‧opening

F‧‧‧環狀框 F‧‧‧ring frame

P1‧‧‧第1挾持位置 P1‧‧‧1st holding position

P2‧‧‧第2挾持位置 P2‧‧‧The second holding position

W‧‧‧晶圓 W‧‧‧Wafer

Claims (1)

一種膠帶黏貼裝置，其具備支持具有開口之環形框並且支持被定位在該開口之晶圓的平台，在被支持於該平台之環狀框和晶圓黏貼黏著膠帶而使一體化，該膠帶黏貼裝置至少具備：捲筒膠帶支持部，其係能夠旋轉地支持捲筒膠帶，且該捲筒膠帶係將事先對應於該環狀框而成形的複數該黏著膠帶隔著間隔配設在帶狀的保護薄膜的膠帶組設成捲筒狀，捲筒膠帶支持手段，其係配設兩個以上該捲筒膠帶支持部；第1滾輪單元，其係將從該捲筒膠帶拉出之該膠帶組從該捲筒膠帶支持手段引導至該平台；黏貼手段，其係使該黏著膠帶從被引導至該平台之該膠帶組剝離，並使該黏著膠帶黏貼於該平台支持的該環狀框和晶圓；廢棄手段，捲取該黏著膠帶被剝離的該保護薄膜並予以廢棄；第2滾輪單元，其係將該黏著膠帶被剝離的該保護薄膜從該平台引導至該廢棄手段；定位手段，其係被配設在該捲筒膠帶支持手段和該第1滾輪單元之間，選擇被支持於兩個以上之該捲筒膠帶支持部的該捲筒膠帶中之任一者且把持該膠帶組之端部而予 以拉出，定位在該平台；膠帶組引導手段，其係把持該定位手段定位的該膠帶組之端部而通過該第2滾輪單元而引導至該廢棄手段；及切斷手段，其係被配設在該平台和該廢棄手段之間，切斷該黏著膠帶被剝離的該保護薄膜，該捲筒膠帶支持手段具備檢測該膠帶組之前端的前端檢測部，將新選擇的該膠帶組藉由該定位手段從該捲筒膠帶支持手段拉出之時，藉由該切斷手段切斷現在使用的該膠帶組之該保護薄膜，該廢棄手段捲取並予以廢棄，並且使現在使用的該捲筒膠帶支持部作動，捲取該膠帶組，當該前端檢測部檢測出該保護膜時，則使該捲筒膠帶支持部之旋轉停止。 A kind of adhesive tape sticking device, it has the stage that supports the annular frame that has opening and supports the wafer that is positioned at this opening, sticks adhesive tape to the annular frame that is supported on this platform and wafer and makes integration, and this adhesive tape sticks The device includes at least: a roll tape support section that rotatably supports a roll tape, and the roll tape is a plurality of adhesive tapes that are formed in advance corresponding to the annular frame and arranged on a belt-shaped tape at intervals. The adhesive tape of the protective film is set in a reel shape, and the reel tape support means is equipped with two or more support parts of the reel tape; the first roller unit is the tape group that will be pulled out from the reel tape Leading from the reel tape support means to the platform; sticking means, which is to peel off the adhesive tape from the adhesive tape group guided to the platform, and stick the adhesive tape to the ring frame and crystal supported by the platform circle; discarding means, roll up the protective film from which the adhesive tape is peeled off and discard it; the second roller unit guides the protective film from the platform to the discarding means from the platform; positioning means, its It is arranged between the roll tape support means and the first roller unit, selects any one of the roll tapes supported by two or more roll tape support parts and holds the tape set at the end by pulling out, positioned on the platform; tape group guiding means, which is to hold the end of the tape group positioned by the positioning means and guide to the discarding means through the second roller unit; and cutting means, which are Arranged between the platform and the disposal means, the protective film from which the adhesive tape has been peeled off is cut off, the roll tape support means has a front end detection part that detects the front end of the tape set, and the newly selected tape set is passed When the positioning means is pulled out from the roll tape support means, the protective film of the adhesive tape set currently in use is cut off by the cutting means, and the discarding means is wound up and discarded, and the currently used roll is used The drum tape supporting part moves to wind up the adhesive tape group, and when the front end detecting part detects the protective film, the rotation of the drum tape supporting part is stopped.
TW107145418A 2017-12-18 2018-12-17 Tape sticking device TWI779140B (en)

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JP7351703B2 (en) * 2019-10-09 2023-09-27 株式会社ディスコ tape mounter
JP2022103995A (en) 2020-12-28 2022-07-08 株式会社ディスコ Tape mounter
KR102663485B1 (en) * 2021-11-16 2024-05-03 세메스 주식회사 Film stripping apparatus, and de-lamination equipment and semiconductor manufacturing equipment including the same

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CN110010540B (en) 2023-10-03
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TW201927674A (en) 2019-07-16
CN110010540A (en) 2019-07-12
KR102640590B1 (en) 2024-02-23

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