TWI778647B - Improved electronic component implantation device and implantation method - Google Patents
Improved electronic component implantation device and implantation method Download PDFInfo
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- TWI778647B TWI778647B TW110119802A TW110119802A TWI778647B TW I778647 B TWI778647 B TW I778647B TW 110119802 A TW110119802 A TW 110119802A TW 110119802 A TW110119802 A TW 110119802A TW I778647 B TWI778647 B TW I778647B
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- elastic
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- sheet group
- bearing seat
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- 238000002513 implantation Methods 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- 230000006698 induction Effects 0.000 claims abstract description 10
- 238000006073 displacement reaction Methods 0.000 abstract description 3
- 239000007943 implant Substances 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Transmission Devices (AREA)
- Formation Of Insulating Films (AREA)
- Thermistors And Varistors (AREA)
- Magnetic Bearings And Hydrostatic Bearings (AREA)
Abstract
改良式電子元件植入裝置包括：一本體、一固設於本體之承載部、一驅動器及一彈片組；驅動器具有一與驅動器連接的螺桿；彈片組一端固設於本體，彈片組的另一端係用以供螺桿穿設，彈片組係用以沿著螺桿往復位移方向上提供彈性回復力；承載座更設置一第一感測件及一第二感測件，係用以與感應銅片感應以取得螺桿的往復位移位置；受驅動器驅動而往復位移的螺桿係用以使吸嘴進行電子元件植入載帶；本發明亦提供一種植入方式。藉由彈片組提供彈性回復力，增加螺桿往復位移以週期性的將電子元件植入載帶的速度，也提升螺桿往復位移的定位精準度。 The improved electronic component implantation device comprises: a main body, a bearing part fixed on the main body, a driver and a spring plate group; the driver has a screw rod connected with the driver; one end of the spring plate group is fixed on the main body, and the other end of the spring plate group It is used for the screw rod to pass through, and the shrapnel set is used to provide elastic restoring force along the direction of the screw rod to reset and move; the bearing base is further provided with a first sensing element and a second sensing element, which are used for contacting with the sensing copper sheet The reciprocating displacement position of the screw is obtained by induction; the reciprocating screw driven by the driver is used for the suction nozzle to implant the electronic components into the carrier tape; the present invention also provides an implantation method. The elastic restoring force is provided by the shrapnel group, which increases the speed of the reciprocating movement of the screw to periodically implant the electronic components into the carrier tape, and also improves the positioning accuracy of the reciprocating movement of the screw.
Description
本發明屬於一種改良式電子元件植入裝置，特別是指一種改良式電子元件植入裝置及植入方法。 The invention belongs to an improved electronic component implantation device, in particular to an improved electronic component implantation device and an implantation method.
現有技術中，在電子元件植入裝置長時間的操作下，容易因螺桿的往復作動，造成銅套的耗損，甚至連帶影響螺桿在往復作動位移位置的精準度，此外，普遍存在植入電子元件後的往復速度不如螺桿在進行電子元件植入時的速度的耗時缺陷性問題，是故，現有技術確實有待提出更佳解決方案之必要性。 In the prior art, when the electronic component implantation device is operated for a long time, the copper sleeve is easily worn out due to the reciprocating action of the screw, which even affects the accuracy of the screw in the reciprocating displacement position. In addition, implanted electronic components are common. The subsequent reciprocating speed is not as good as the time-consuming defect problem of the speed of the screw during implantation of electronic components. Therefore, the prior art does need to propose a better solution.
為解決前述問題，本發明之主要目的，在於提供一種改良式電子元件植入裝置。 In order to solve the aforementioned problems, the main purpose of the present invention is to provide an improved electronic device implantation device.
本發明之另一目的，在於提供一種植入方法。 Another object of the present invention is to provide an implantation method.
本發明之改良式電子元件植入裝置包括：一本體、一承載部、一驅動器及一彈片組。 The improved electronic component implantation device of the present invention comprises: a main body, a bearing part, a driver and a set of elastic pieces.
進一步說明的是，該承載部包括一第一承載座及一與該第一承載座間隔設置的第二承載座，該第一承載座及該第二承載座固設於該本體。 It is further illustrated that the bearing portion includes a first bearing seat and a second bearing seat spaced from the first bearing seat, and the first bearing seat and the second bearing seat are fixed on the body.
進一步說明的是，該驅動器設置於該第一承載座及該第二承載座之間，該驅動器具有一與該驅動器連接的螺桿，且可受該驅動器驅動而往復位移，且該螺桿穿設該第一承載座及該第二承載座。 It is further explained that the driver is arranged between the first bearing seat and the second bearing seat, the driver has a screw rod connected with the driver, and can be driven to move back and forth by the driver, and the screw rod passes through the a first bearing seat and the second bearing seat.
進一步說明的是，該驅動器和該第一承載座之間包括一感應銅片，其中該螺桿穿設該感應銅片，且該感應銅片具有一凸部。 It is further illustrated that an induction copper sheet is included between the driver and the first bearing base, wherein the screw rod passes through the induction copper sheet, and the induction copper sheet has a convex portion.
進一步說明的是，該彈片組包括一第一彈片組及一第二彈片組，該彈片組一端固設於該本體，該彈片組的另一端係用以供該螺桿穿設，其中該彈片組係用以沿著該螺桿往復位移方向上提供彈性回復力；再者，該螺桿的一端依序穿設該第一承載座及該第一彈片組，該螺桿相對於該驅動器的另一端依序穿設該第二承載座及該第二彈片組。 It is further described that the elastic sheet group includes a first elastic sheet group and a second elastic sheet group, one end of the elastic sheet group is fixed on the body, and the other end of the elastic sheet group is used for the screw to pass through, wherein the elastic sheet group It is used to provide elastic restoring force along the direction of reversing and returning of the screw; moreover, one end of the screw passes through the first bearing seat and the first elastic sheet group in sequence, and the other end of the screw is relative to the driver in sequence The second bearing seat and the second elastic sheet group are passed through.
進一步說明的是，該本體包括至少二溝槽、至少二定位柱及至少二壓固件，該等溝槽開設於該本體相對於該第一承載座的另一側；該二定位柱分別對應於該二溝槽，且該二定位柱係用以穿設該第一彈片組及該第二彈片組，使該第一彈片組的一端及該第二彈片組的一端固設於該本體；該二壓固件係用以將該二定位柱分別固定於該二溝槽。 It is further illustrated that the main body includes at least two grooves, at least two positioning posts and at least two pressing members, and the grooves are opened on the other side of the main body relative to the first bearing seat; the two positioning posts respectively correspond to The two grooves, and the two positioning posts are used to pass through the first elastic sheet group and the second elastic sheet group, so that one end of the first elastic sheet group and one end of the second elastic sheet group are fixed on the main body; the The two pressing members are used for fixing the two positioning posts to the two grooves respectively.
進一步說明的是，本發明之改良式電子元件植入裝置包括一吸嘴，其中該螺桿相對於該第一承載座依序穿設該第一彈片組及設置該吸嘴；該螺桿係用以使吸嘴於電子元件植入載帶的位置及吸附電子元件的位置之間往復位移。 It is further explained that the improved electronic component implantation device of the present invention includes a suction nozzle, wherein the screw rod passes through the first elastic sheet group and the suction nozzle is sequentially arranged relative to the first bearing seat; the screw rod is used for The suction nozzle is moved back and forth between the position where the electronic components are implanted into the carrier tape and the position where the electronic components are sucked.
進一步說明的是，該第一承載座包括一第一穿孔、一第一感測件，其中該第一穿孔係用以供該第一感測件穿設；該第二承載座包括一第二穿孔、一第二感測件，該第二穿孔係用以供該第二感測件穿設，其中該第一穿孔相對應於該第二穿孔，且該第一感測件和該第二感測件之間間隔一距離。 It is further described that the first bearing seat includes a first through hole and a first sensing element, wherein the first through hole is used for passing through the first sensing element; the second bearing seat includes a second a through hole, a second sensing element, the second through hole is used for passing through the second sensing element, wherein the first through hole corresponds to the second through hole, and the first sensing element and the second through hole The sensing elements are spaced apart by a distance.
進一步說明的是，該第一承載座包括一第一階梯部及一與該第一階梯部疊置的第二階梯部，此外，該第一階梯部的面積大於該第二階梯部的面積，該第二階梯部位於該第一彈片組及該第一階梯部之間，再者，該螺桿穿設部分之第一階梯部，部分之第一階梯部為未與該第二階梯部疊置。 It is further illustrated that the first bearing seat includes a first stepped portion and a second stepped portion overlapping with the first stepped portion, in addition, the area of the first stepped portion is larger than that of the second stepped portion, The second stepped portion is located between the first elastic sheet group and the first stepped portion, and furthermore, the first stepped portion of the screw penetration portion is not overlapped with the second stepped portion. .
進一步說明的是，該第一彈片組包括複數第一彈片、複數第二彈片及複數第三彈片，其中該等第一彈片之間的一端夾設各該等第二彈片，該等第一彈片之間的另一端夾設各該等第三彈片；該第二彈片組包括複數第一彈片、複數第二彈片及複數第三彈片，其中該等第一彈片之間的一端夾設各該等第二彈片，該等第一彈片的另一端設置該等第三彈片，其中該等第一彈片的另一端為背向該第二承載座。 It is further explained that the first elastic piece group includes a plurality of first elastic pieces, a plurality of second elastic pieces and a plurality of third elastic pieces, wherein each of the second elastic pieces is sandwiched at one end between the first elastic pieces, and the first elastic pieces Each of the third elastic pieces is sandwiched between the other ends; the second elastic piece group includes a plurality of first elastic pieces, a plurality of second elastic pieces and a plurality of third elastic pieces, wherein one end between the first elastic pieces is sandwiched with each of these For the second elastic pieces, the other ends of the first elastic pieces are provided with the third elastic pieces, wherein the other ends of the first elastic pieces face away from the second bearing seat.
進一步說明的是，本發明之改良式電子元件植入裝置包括一彈簧及一定位片，詳言之，該螺桿依序穿設部分之第一階梯部、該彈簧、該定位片及該第一彈片組。 It is further explained that the improved electronic component implantation device of the present invention includes a spring and a positioning piece. Shrapnel set.
使用本發明之改良式電子元件植入裝置進行的電子元件植入方法，包括下列步驟： 一驅動器驅動一與之連接的螺桿，使該螺桿作動，當一受該螺桿連動 的感應銅片與一第一感測件接觸以發出一第一感測訊號至控制器時，控制器依據該第一感測訊號控制一吸嘴的真空度以使該吸嘴返回至大氣壓，使被該吸嘴吸附的電子元件植入載帶中； 該驅動器驅動該螺桿，使該螺桿朝向遠離該吸嘴的方向進行往復位移，該彈片組係用以沿著該螺桿往復位移方向上提供彈性回復力，使該感應銅片與一第二感測件接觸以發出一第二感測訊號至控制器，控制器依據該第二感測訊號控制該吸嘴的真空度以使該吸嘴抽真空以吸附電子元件；及 該驅動器驅動該螺桿，使該螺桿朝向靠近該吸嘴的方向進行往復位移，該彈片組係用以沿著該螺桿往復位移方向上提供彈性回復力，使該感應銅片與該第一感測件接觸以發出該第一感測訊號至控制器，進行如前所述之電子元件植入載帶。 The electronic component implantation method using the improved electronic component implantation device of the present invention includes the following steps: A driver drives a screw connected to it to actuate the screw, and when a screw is linked by the screw When the inductive copper piece is in contact with a first sensing element to send out a first sensing signal to the controller, the controller controls the vacuum degree of a suction nozzle according to the first sensing signal to make the suction nozzle return to atmospheric pressure, Implant the electronic components sucked by the suction nozzle into the carrier tape; The driver drives the screw to make the screw move back and forth in the direction away from the suction nozzle. The elastic sheet group is used to provide elastic restoring force along the screw rod in the direction of reciprocation, so that the sensing copper sheet and a second sensing contacting the component to send a second sensing signal to the controller, and the controller controls the vacuum degree of the suction nozzle according to the second sensing signal, so that the suction nozzle is evacuated to suck the electronic components; and The driver drives the screw to make the screw move back and forth toward the direction close to the suction nozzle. The elastic sheet group is used to provide elastic restoring force along the screw rod in the direction of the reciprocating movement, so that the sensing copper sheet and the first sensing The device is contacted to send the first sensing signal to the controller, and the electronic component implantation carrier tape as described above is performed.
進一步說明的是，藉由控制器分別與該驅動器、該第一感測件及該第二感測件耦接，使控制器提供控制指令予該驅動器，及控制器依據該第一感測件發出的第一感測訊號及該第二感測件發出的第二感測訊號，經由電腦軟體設備中的程式系統進行運算，計算載帶自當前的容置槽(與吸嘴相對應的容置槽)移動到下一個容置槽，這中間所經過的時間差，搭配程式的運算來實現控制器提供控制指令予驅動器，及控制該吸嘴在電子元件植入位置及吸附電子元件位置之間進行恢復大氣壓及抽真空的調控。 It is further explained that the controller is coupled to the driver, the first sensing element and the second sensing element respectively, so that the controller provides control commands to the driver, and the controller is based on the first sensing element The first sensing signal sent out and the second sensing signal sent out by the second sensing element are calculated by the program system in the computer software device to calculate that the carrier tape is taken from the current accommodating slot (the container corresponding to the suction nozzle). slot) to move to the next accommodating slot, the elapsed time difference is matched with the operation of the program to realize that the controller provides control commands to the driver, and controls the suction nozzle between the position where the electronic components are implanted and the position where the electronic components are adsorbed Carry out the control of restoring atmospheric pressure and vacuuming.
該感應銅片接觸該第一感測件時，此時位於該螺桿一端的該吸嘴為位於植入電子元件的位置；該感應銅片接觸該第二感測件時，此時 位於該螺桿一端的該吸嘴為位於吸附電子元件的位置。 When the sensing copper piece contacts the first sensing piece, the suction nozzle at one end of the screw is at the position where the electronic component is implanted; when the sensing copper piece contacts the second sensing piece, at this time The suction nozzle at one end of the screw is positioned at a position for sucking electronic components.
本發明之有益功效在於： The beneficial effects of the present invention are:
1.藉由該彈片組係以沿著該螺桿往復位移方向上提供彈性回復力，使得植入裝置在電子元件植入的過程中，無需要高電壓輸出即可達到快速的螺桿往復作動，詳言之，彈片組的設置將有利於受到螺桿連動的吸嘴於電子元件植入位置及吸附電子元件位置之間，提升往復速度。 1. The elastic recovery force can be provided along the screw rod in the direction of the reciprocating movement by the elastic plate group, so that the implantation device can achieve fast screw reciprocating action without high voltage output during the process of implanting electronic components. In other words, the arrangement of the shrapnel group will help the suction nozzle linked by the screw between the position where the electronic components are implanted and the position where the electronic components are adsorbed, so as to increase the reciprocating speed.
2.藉由該彈片組的設置，有利於提升螺桿在往復作動上的定位精準度。本發明的彈片組取代現有的銅套，以解決長久以來螺桿往復作動而造成銅套磨耗的缺陷性問題，以及解決使用耗損的銅套而衍生出的螺桿定位精準的問題。詳言之，彈片組本身固設於該本體的方式，為利用該二定位柱穿設該第一彈片組及該第二彈片組，且該二壓固件係用以將該二定位柱分別固定於該二溝槽，如此一來，受到該二定位柱穿設的該第一彈片組及該第二彈片組，螺桿穿設於該第一彈片組及該第二彈片組時，得以在螺桿往復作動的方向維持在同軸心線上，簡言之，該第一彈片組及該第二彈片組的螺桿穿設孔為位於同軸心線上而相對應。 2. With the setting of the shrapnel group, it is beneficial to improve the positioning accuracy of the screw in the reciprocating action. The shrapnel set of the present invention replaces the existing copper sleeve, so as to solve the defect problem of the wear of the copper sleeve caused by the reciprocating action of the screw for a long time, and to solve the problem of accurate screw positioning caused by the use of the worn copper sleeve. To be more specific, the way of fixing the elastic sheet group itself on the main body is to use the two positioning posts to pass through the first elastic sheet group and the second elastic sheet group, and the two fasteners are used for fixing the two positioning posts respectively. In the two grooves, as a result, when the screw rod is penetrated through the first elastic sheet group and the second elastic sheet group through the two positioning posts, the screw can be inserted into the first elastic sheet group and the second elastic sheet group. The direction of the reciprocating action is maintained on the coaxial line. In short, the screw holes of the first elastic sheet group and the second elastic sheet group are located on the coaxial center line and correspond to each other.
100:本體 100: Ontology
110:溝槽 110: Groove
120:定位柱 120: Positioning post
130:壓固件 130: Press firmware
200:承載部 200: Bearing Department
210:第一承載座 210: The first bearing seat
211:第一階梯部 211: The first step department
212:第二階梯部 212: Second step part
213:第一穿孔 213: First Piercing
214:第一感測件 214: The first sensing element
220:第二承載座 220: The second bearing seat
221:第二穿孔 221: Second Perforation
222:第二感測件 222: second sensing element
300:驅動器 300: Drive
310:螺桿 310: Screw
400:彈片組 400: Shrapnel group
410:第一彈片組 410: The first shrapnel group
411:第一彈片 411: The first shrapnel
412:第二彈片 412: The second shrapnel
413:第三彈片 413: The third shrapnel
420:第二彈片組 420: The second shrapnel group
500:感應銅片 500: induction copper sheet
510:凸部 510: convex part
600:吸嘴 600: nozzle
700:彈簧 700: Spring
800:定位片 800: Positioning piece
900:固定片 900: Fixing piece
1000:載帶 1000: carrier tape
1100:容置槽 1100: accommodating slot
S71-S73:步驟 S71-S73: Steps
圖1繪示本發明改良式電子元件植入裝置的立體外觀圖；圖2繪示圖1之另一視角的立體外觀圖；圖3繪示圖1之立體分解圖；圖4繪示本發明之部分元件第一彈片組的立體分解圖； 圖5繪示本發明之部分元件第二彈片組的立體分解圖；圖6繪示本發明之一實施例，說明改良式電子元件植入裝置於進行電子元件植入載帶；圖7繪示本發明之植入方式之一實施例之一流程圖。 1 is a perspective view of the improved electronic component implantation device of the present invention; FIG. 2 is a perspective view of FIG. 1 from another perspective; FIG. 3 is an exploded perspective view of FIG. 1 ; The three-dimensional exploded view of the first shrapnel group of some components; FIG. 5 is an exploded perspective view of the second spring plate group of some components of the present invention; FIG. 6 is an embodiment of the present invention, illustrating an improved electronic component implantation device in carrying out an electronic component implantation carrier tape; FIG. 7 shows A flow chart of an embodiment of the implantation method of the present invention.
為利 貴審查委員了解本發明之技術特徵、內容與優點及其所能達到之功效，茲將本發明配合圖式，並以實施例之表達形式詳細說明如下，而其中所使用之圖式，其主旨僅為示意及輔助說明書之用，未必為本發明實施後之真實比例與精準配置，故不應就所附之圖式的比例與配置關係解讀、侷限本發明於實際實施上的權利範圍，合先敘明。 In order to help the examiners to understand the technical features, content and advantages of the present invention and the effects that can be achieved, the present invention is hereby described in detail as follows in the form of the drawings and the expressions of the embodiments. The subject matter is only for illustration and auxiliary description, and is not necessarily the real scale and precise configuration after the implementation of the present invention. Therefore, the ratio and configuration relationship of the attached drawings should not be interpreted or limited to the scope of rights of the present invention in actual implementation. Together first to describe.
參考圖1，本發明之改良式電子元件植入裝置包括：一本體100、一承載部200、一驅動器300及一彈片組400；詳言之，該承載部200包括一第一承載座210及一與該第一承載座210間隔設置的第二承載座220，該第一承載座210及該第二承載座220固設於該本體100；該驅動器300設置於該第一承載座210及該第二承載座220之間，該驅動器300具有一與該驅動器300連接的螺桿310，且該螺桿310可受該驅動器300驅動而往復位移，且該螺桿310穿設該第一承載座210及該第二承載座220；該彈片組400包括一第一彈片組410及一第二彈片組420，該彈片組400一端固設於該本體100，該彈片組400的另一端係用以供該螺桿310穿設，其中該彈片組400係用以沿著該螺桿310往復位移方向上提供彈性回復力；再者，該螺桿310的一端依序穿設該第一承載座210及該第一彈片組410，該螺桿310相對於該驅動器300 的另一端依序穿設該第二承載座220及該第二彈片組420。 Referring to FIG. 1 , the improved electronic component implantation device of the present invention includes: a main body 100 , a bearing portion 200 , a driver 300 and a set of elastic pieces 400 ; in detail, the bearing portion 200 includes a first bearing seat 210 and A second bearing seat 220 disposed at intervals from the first bearing seat 210, the first bearing seat 210 and the second bearing seat 220 are fixed on the main body 100; the driver 300 is arranged on the first bearing seat 210 and the second bearing seat 220 Between the second bearing bases 220, the driver 300 has a screw rod 310 connected with the driver 300, and the screw rod 310 can be driven by the driver 300 to move back and forth, and the screw rod 310 passes through the first bearing seat 210 and the The second bearing seat 220; the elastic sheet group 400 includes a first elastic sheet group 410 and a second elastic sheet group 420, one end of the elastic sheet group 400 is fixed on the main body 100, and the other end of the elastic sheet group 400 is used for the screw rod 310 is passed through, wherein the elastic sheet group 400 is used to provide elastic restoring force along the screw 310 in the direction of reset and movement; in addition, one end of the screw rod 310 is sequentially passed through the first bearing seat 210 and the first elastic sheet group 410, the screw 310 is relative to the driver 300 The other end of the second bearing seat 220 and the second elastic sheet group 420 are sequentially passed through.
此外，驅動器300包括但不限於步進馬達。
Additionally, the
此外，本發明之改良式電子元件植入裝置，包括一吸嘴600，其中該螺桿310相對於該第一承載座210依序穿設該第一彈片組410及設置該吸嘴600；該螺桿310係用以使該吸嘴600於電子元件植入載帶1000的位置及吸附電子元件的位置之間往復位移。
In addition, the improved electronic component implantation device of the present invention includes a
參考圖2，該驅動器300和該第一承載座210之間包括一感應銅片500，其中該螺桿310穿設該感應銅片500，且該感應銅片500具有一凸部510。
Referring to FIG. 2 , an
參考圖3，該本體100包括二溝槽110、二定位柱120及二壓固件130，該等溝槽110開設於該本體100相對於該第一承載座210的另一側；該二定位柱120分別對應於該二溝槽110，且該二定位柱120係用以穿設該第一彈片組410及該第二彈片組420，使該第一彈片組410的一端及該第二彈片組420的一端定位於該本體100；該二壓固件130係用以將該二定位柱120分別固定於該二溝槽110；此外，該二定位柱120係用以穿設該第一彈片組410及該第二彈片組420的部分，包括另一定位片800及一固定片900，該另一定位片800及該固定片900係分別設置於該第一彈片組410的對向側，且該二定位柱120朝向靠近該本體100的方向依序穿設該固定片900、該第一彈片組410及該定位片800，以提升該二定位柱120穿設該第一彈片組410的定位穩定性。 Referring to FIG. 3 , the body 100 includes two grooves 110 , two positioning posts 120 and two pressing members 130 , the grooves 110 are opened on the other side of the body 100 relative to the first bearing seat 210 ; the two positioning posts 120 respectively correspond to the two grooves 110, and the two positioning posts 120 are used for passing through the first elastic sheet group 410 and the second elastic sheet group 420, so that one end of the first elastic sheet group 410 and the second elastic sheet group One end of the 420 is positioned on the main body 100 ; the two pressing members 130 are used for fixing the two positioning posts 120 to the two grooves 110 respectively; in addition, the two positioning posts 120 are used for passing through the first elastic sheet group 410 and the part of the second elastic piece group 420, including another positioning piece 800 and a fixing piece 900, the other positioning piece 800 and the fixing piece 900 are respectively arranged on the opposite side of the first elastic piece group 410, and the The two positioning posts 120 pass through the fixing sheet 900 , the first elastic sheet group 410 and the positioning sheet 800 in sequence toward the direction close to the main body 100 , so as to improve the stability of the positioning of the two positioning posts 120 through the first elastic sheet group 410 sex.
此外，該二溝槽110的開設方向為自該第一彈片組410朝向該第二彈片組420的方向開設。
In addition, the opening direction of the two
此外，該第一承載座210包括一第一階梯部211及一與該第一階梯部211疊置的第二階梯部212，此外，該第一階梯部211的面積大於該第二階梯部212的面積，該第二階梯部212位於該第一彈片組410及該第一階梯部之間211，再者，該螺桿310穿設部分之第一階梯部211，部分之第一階梯部211為未與該第二階梯部212疊置；該第一承載座210包括一第一穿孔213、一第一感測件214，其中該第一穿孔213係用以供該第一感測件214穿設；該第二承載座220包括一第二穿孔221、一第二感測件222，該第二穿孔221係用以供該第二感測件222穿設，其中該第一穿孔213相對應於該第二穿孔221，且該第一感測件214和該第二感測件222之間間隔一距離；此外，第一感測件214及第二感測件222包括但不限於近接開關。
In addition, the
此外，本發明之改良式電子元件植入裝置包括一彈簧700及一定位片800，詳言之，該螺桿310依序穿設部分之第一階梯部211、該彈簧700、該定位片800及該第一彈片組410。
In addition, the improved electronic component implantation device of the present invention includes a
參考圖4，該第一彈片組410包括複數第一彈片411、複數第二彈片412及複數第三彈片413，其中所述第一彈片411之間的一端夾設各所述第二彈片412，所述第一彈片411之間的另一端夾設各所述第三彈片413；特別說明的是，該螺桿310穿設所述第一彈片411的一端及所述第二彈片412，該二定位柱120穿設所述第一彈片411的另一端及所述第三彈片413；在該螺桿310連動該第一彈片組410時，藉由該第一彈片組410的一端受到該螺桿310的連動，該第一彈片組410的另一端固定於該本體100，如此一來，該第一彈片組410係用以沿著該螺桿310往復位移方向上提供彈性回復力，即是利用槓桿原理於其中。
Referring to FIG. 4 , the first
參考圖5，該第二彈片組420包括複數第一彈片411、複數第二彈片412及複數第三彈片413，其中所述第一彈片411之間的一端夾設各所述第二彈片412，所述第一彈片411的另一端設置所述第三彈片413，其中所述第一彈片411的另一端為背向該第二承載座220；該螺桿310穿設所述第一彈片411的一端及所述第二彈片412，該二定位柱120穿設所述第一彈片411的另一端及所述第三彈片413；在該螺桿310連動該第二彈片組420時，藉由該第二彈片組420的一端受到該螺桿310的連動，該第二彈片組420的另一端固定於該本體100，如此一來，該第二彈片組420係用以沿著該螺桿310往復位移方向上提供彈性回復力，同樣是利用槓桿原理於其中；本發明之第一彈片411、第二彈片412及第三彈片413的數量及夾設位置包括但不限於前述技術特徵，換言之，第一彈片411、第二彈片412及第三彈片413的數量及夾設位置可依照實際需求而做調整。
Referring to FIG. 5 , the second
參考圖6及圖7，本發明之改良式電子元件植入裝置進行的電子元件植入方法，包括下列步驟：(步驟S71)一驅動器300驅動一與之連接的螺桿310，使該螺桿310作動，當一受該螺桿310連動的感應銅片500與一第一感測件214接觸以發出一第一感測訊號至控制器時，控制器依據該第一感測訊號控制一吸嘴600的真空度以使該吸嘴600返回至大氣壓，使被該吸嘴600吸附的電子元件植入載帶1000中，參考圖6所繪示；(步驟S72)該驅動器300驅動該螺桿310，使該螺桿310朝向遠離該吸嘴600的方向進行往復位移，該彈片組400係用以沿著該螺桿310往復位移方向上提供彈性回復力，使該感應銅片500與一第二感測件222接觸以發出一第二 感測訊號至控制器，控制器依據該第二感測訊號控制該吸嘴600的真空度以使該吸嘴600抽真空以吸附電子元件；(步驟S73)該驅動器300驅動該螺桿310，使該螺桿310朝向靠近該吸嘴600的方向進行往復位移，該彈片組400係用以沿著該螺桿310往復位移方向上提供彈性回復力，使該感應銅片500與該第一感測件214接觸以發出該第一感測訊號至控制器，進行如前所述之電子元件植入載帶1000中之容置槽1100。 Referring to FIGS. 6 and 7 , the electronic component implantation method performed by the improved electronic component implantation device of the present invention includes the following steps: (step S71 ) a driver 300 drives a screw 310 connected to it, so that the screw 310 is actuated , when a sensing copper piece 500 linked by the screw 310 contacts with a first sensing element 214 to send a first sensing signal to the controller, the controller controls the suction nozzle 600 according to the first sensing signal The vacuum is used to return the suction nozzle 600 to atmospheric pressure, so that the electronic components sucked by the suction nozzle 600 are implanted in the carrier tape 1000, as shown in FIG. 6; (step S72) the driver 300 drives the screw 310, so that the The screw 310 moves back and forth in the direction away from the suction nozzle 600 , and the elastic plate group 400 is used to provide elastic restoring force along the direction of the screw 310 to move back and forth, so that the sensing copper sheet 500 is in contact with a second sensing member 222 to issue a second The sensing signal is sent to the controller, and the controller controls the vacuum degree of the suction nozzle 600 according to the second sensing signal, so that the suction nozzle 600 is evacuated to absorb electronic components; (step S73) the driver 300 drives the screw 310 to make The screw rod 310 moves back and forth toward the direction close to the suction nozzle 600 , and the elastic sheet group 400 is used to provide elastic restoring force along the screw rod 310 in the direction of back and forth movement, so that the sensing copper sheet 500 and the first sensing element 214 The contact is made to send the first sensing signal to the controller, and the electronic components are implanted into the accommodating groove 1100 in the carrier tape 1000 as described above.
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。 However, the above are only preferred embodiments of the present invention, and should not limit the scope of the present invention, that is, any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the contents of the description of the invention, All still fall within the scope of the patent of the present invention.
100:本體 100: Ontology
200:承載部 200: Bearing Department
210:第一承載座 210: The first bearing seat
214:第一感測件 214: The first sensing element
220:第二承載座 220: The second bearing seat
222:第二感測件 222: second sensing element
300:驅動器 300: Drive
310:螺桿 310: Screw
400:彈片組 400: Shrapnel group
410:第一彈片組 410: The first shrapnel group
420:第二彈片組 420: The second shrapnel group
600:吸嘴 600: nozzle
Claims (12)
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|---|---|---|---|---|
| TW201343022A (en) * | 2012-02-28 | 2013-10-16 | Ueno Seiki Co Ltd | Abnormal contact testing method, electronic component holding device and electronic component transporting device |
| WO2019182435A1 (en) * | 2018-03-22 | 2019-09-26 | Visdynamics Research Sdn Bhd | Apparatus and method for filling carrier tapes with electronic components |
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|---|---|---|---|---|
| TW201343022A (en) * | 2012-02-28 | 2013-10-16 | Ueno Seiki Co Ltd | Abnormal contact testing method, electronic component holding device and electronic component transporting device |
| WO2019182435A1 (en) * | 2018-03-22 | 2019-09-26 | Visdynamics Research Sdn Bhd | Apparatus and method for filling carrier tapes with electronic components |
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