TWI777252B - Bag cutting module and bag cutting mechanism - Google Patents
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Abstract
本發明提供一種割袋模組,包括一本體、一吸取件、一裁切件以及一氣閥。吸取件連接於本體,且本體以及吸取件共同定義一腔室;裁切件的一部份配置於腔室內,且裁切件的另一部份相對於吸取件突出;氣閥連接於本體,且腔室透過氣閥連通於一抽氣幫浦。此外,本發明還提供一種包括上述割袋模組的割袋機構。The invention provides a bag cutting module, which includes a main body, a suction part, a cutting part and an air valve. The suction part is connected to the main body, and the main body and the suction part together define a cavity; a part of the cutting part is arranged in the cavity, and the other part of the cutting part protrudes relative to the suction part; the air valve is connected to the main body, And the chamber is communicated with an air pump through an air valve. In addition, the present invention also provides a bag cutting mechanism including the above bag cutting module.
Description
本發明提供一種割袋模組及割袋機構,且特別是關於一種可吸附袋體進行裁切且可防止傷到內部物體的割袋模組,以及利用上述割袋模組實現自動化割袋流程的割袋機構。The present invention provides a bag-cutting module and a bag-cutting mechanism, and particularly relates to a bag-cutting module capable of adsorbing a bag body for cutting and preventing damage to internal objects, and using the above-mentioned bag-cutting module to realize an automated bag-cutting process The bag cutting mechanism.
晶圓是一種在半導體產業中被高度利用的電子元件。一般而言,裝配有晶圓的晶圓盒可大致分為前開式通用晶圓盒(front opening unified pod, FOUP)以及前開式晶圓運輸盒(front opening shipping box, FOSB)兩大種類,在運送過程中,晶圓盒會被放入包裝晶圓盒的專用袋體內,以避免運輸過程中外界的雜質混入從而汙染晶圓。在放入晶圓盒後,操作人員會將袋體的內部空氣抽出,這樣的作法不僅可減少晶圓盒包佔據的體積,也可防止袋體內的空氣與晶圓產生反應而影響晶圓品質。A wafer is an electronic component that is highly utilized in the semiconductor industry. Generally speaking, wafer cassettes with wafers can be roughly divided into two types: front opening unified pod (FOUP) and front opening shipping box (FOSB). During the transportation process, the wafer cassette will be put into a special bag for packaging the wafer cassette, so as to avoid the contamination of the wafer by foreign impurities mixed in during transportation. After the wafer cassette is placed, the operator will extract the air inside the bag, which not only reduces the volume occupied by the wafer cassette, but also prevents the air in the bag from reacting with the wafer and affecting the quality of the wafer. .
當晶圓盒包運送至下一個加工區時,工作人員會需要將晶圓的包裝袋卸除以取出內部的晶圓盒。過往,上述的作業程序大多以人力進行,不僅曠日廢時,且由於晶圓盒的重量較重,在搬運過程中很有可能會不慎掉落造成晶圓盒甚至是內部的晶圓損傷。為此,諸多的業界人員以及研發單位均致力於將上述程序自動化以減少資源的支出,例如台灣專利公告號TW I631047B提出了一種自動拆袋系統以及應用上述系統的自動拆袋方法,可先透過吸力裝置固定包裝袋,並藉由刀具模組將包裝袋切割出開口後由移載模組將袋中的晶圓盒取出,實現拆袋的自動化。When the wafer cassette is transported to the next processing area, the staff will need to unpack the wafers to remove the inner wafer cassette. In the past, most of the above operation procedures were carried out manually, which not only took a long time, but also due to the heavy weight of the wafer cassette, it was very likely to accidentally drop during the handling process, causing damage to the wafer cassette or even the internal wafers. . To this end, many industry personnel and R&D units are committed to automating the above procedures to reduce resource expenditure. For example, Taiwan Patent Publication No. TW I631047B proposes an automatic bag opening system and an automatic bag opening method using the above system. The suction device fixes the packaging bag, and the cutting module cuts the packaging bag out of the opening, and then the transfer module takes out the wafer cassette in the bag to realize the automation of unpacking.
然而,上述的刀具模組必須使用鉤狀刀具,並利用鉤狀刀鋒的行進方向平行於晶圓盒體的方式進行切割避免切割盒體,這樣的配置不僅刀具需要特別客製化,且由於外層的包裝袋在真空狀態下緊貼於晶圓盒體,在初始下刀時,鉤狀刀具的外緣仍有割傷盒體的風險。除此之外,鉤狀刀具需要避開包裝袋的封口以進行切割,這也使得載送晶圓盒包的載送裝置或切割用的刀具模組需要額外判斷包裝袋的封口位置,使得流程更加繁瑣。However, the above-mentioned knife module must use hook-shaped knives, and use the way that the traveling direction of the hook-shaped knife edge is parallel to the wafer cassette to avoid cutting the cassette. This configuration not only requires special customization of the knives, but also because the outer layer The packaging bag is close to the wafer box body in a vacuum state, and the outer edge of the hook-shaped knife still has the risk of cutting the box body when the knife is initially cut. In addition, the hook-shaped cutter needs to avoid the sealing of the packaging bag for cutting, which also makes the carrier device for carrying the wafer cassette or the cutter module for cutting need to additionally judge the sealing position of the packaging bag, so that the process more cumbersome.
發明人遂竭其心智悉心研究,進而研發出一種可直接吸附袋體進行裁切的割袋模組,以及利用上述割袋模組實現自動化割袋流程的割袋機構,以期達到割袋作業自動化、節省人力以及提高晶圓盒品質的效果。The inventor has exhausted his mind and research, and then developed a bag cutting module that can directly absorb the bag body for cutting, and a bag cutting mechanism that uses the above bag cutting module to realize the automatic bag cutting process, in order to achieve the automation of the bag cutting operation. , saving manpower and improving the quality of wafer cassettes.
本發明提供一種割袋模組,包括一本體、一吸取件、一裁切件以及一氣閥。吸取件連接於本體,且本體以及吸取件共同定義一腔室;裁切件的一部份配置於腔室內,且裁切件的另一部份相對於吸取件突出;氣閥連接於本體,且腔室透過氣閥連通於一抽氣幫浦。The invention provides a bag cutting module, which includes a main body, a suction part, a cutting part and an air valve. The suction part is connected to the main body, and the main body and the suction part together define a cavity; a part of the cutting part is arranged in the cavity, and the other part of the cutting part protrudes relative to the suction part; the air valve is connected to the main body, And the chamber is communicated with an air pump through an air valve.
在一實施例中,上述的吸取件形成有一吸嘴,吸嘴具有一底面以及一端面。裁切件具有一刃部,刃部相對於底面突出,且端面與底面的高度差大於刃部的端部與底面的高度差。In one embodiment, the above-mentioned suction member is formed with a suction nozzle, and the suction nozzle has a bottom surface and an end surface. The cutting member has a blade portion, the blade portion protrudes relative to the bottom surface, and the height difference between the end surface and the bottom surface is greater than the height difference between the end portion and the bottom surface of the blade portion.
在一實施例中,上述的底面上形成有一裁切孔以及複數個吸取孔,其中刃部穿設於裁切孔,且裁切孔配置於這些吸取孔之間。In one embodiment, a cutting hole and a plurality of suction holes are formed on the bottom surface, wherein the blade portion penetrates the cutting holes, and the cutting holes are arranged between the suction holes.
在一實施例中,割袋模組還包括複數個導引件,這些導引件樞接於本體或吸取件且相鄰於吸嘴。In one embodiment, the bag cutting module further includes a plurality of guide members, which are pivotally connected to the body or the suction member and are adjacent to the suction nozzle.
在一實施例中,上述的裁切件為一靜態切刀或一超音波切刀。本體上還形成有至少一導引部,且導引部的尺寸沿吸取件的延伸方向漸縮。In one embodiment, the above-mentioned cutting element is a static cutter or an ultrasonic cutter. At least one guide portion is also formed on the body, and the size of the guide portion is tapered along the extension direction of the suction member.
在一實施例中,上述的裁切件為一滾刀。割袋模組還包括一裁切馬達以及一傳動件,其中裁切馬達連接於本體且相對於本體固定,且裁切馬達透過傳動件驅動滾刀轉動。In one embodiment, the above-mentioned cutting element is a hob. The bag cutting module further includes a cutting motor and a transmission element, wherein the cutting motor is connected to the main body and is fixed relative to the main body, and the cutting motor drives the hob to rotate through the transmission element.
在一實施例中,割袋模組還包括一輔助氣閥,輔助氣閥連接於本體,且腔室透過輔助氣閥連通於一真空檢知計。In one embodiment, the bag cutting module further includes an auxiliary air valve, the auxiliary air valve is connected to the main body, and the chamber is communicated with a vacuum detector through the auxiliary air valve.
除此之外,本發明還提供一種割袋機構,包括一架體、一機械手臂以及一種上述的割袋模組。架體上配置有至少一承載平台;機械手臂連接於架體;割袋模組連接於機械手臂。In addition, the present invention also provides a bag cutting mechanism, which includes a frame body, a mechanical arm and the above-mentioned bag cutting module. At least one bearing platform is arranged on the frame body; the mechanical arm is connected to the frame body; the bag cutting module is connected to the mechanical arm.
在一實施例中,割袋機構還包括一連接件以及複數個彈性件,其中割袋模組透過連接件連接於機械手臂,且這些彈性件配置於機械手臂以及割袋模組之間。In one embodiment, the bag cutting mechanism further includes a connecting member and a plurality of elastic members, wherein the bag cutting module is connected to the robotic arm through the connecting member, and the elastic members are disposed between the robotic arm and the bag cutting module.
在一實施例中,上述的承載平台形成有一開口,且承載平台上配置有一對承載件、一定位件以及一抵靠件。承載件架設於開口上且沿一第一方向滑設於承載平台;定位件相鄰於開口;抵靠件沿一第二方向滑設於承載平台,其中第二方向與第一方向線性獨立。In one embodiment, an opening is formed on the above-mentioned carrying platform, and a pair of carrying parts, a positioning part, and an abutting part are disposed on the carrying platform. The bearing member is erected on the opening and slidably arranged on the bearing platform along a first direction; the positioning member is adjacent to the opening; the abutting member is slidably arranged on the bearing platform along a second direction, wherein the second direction is linearly independent from the first direction.
藉此,本發明的割袋模組能透過吸取件吸附袋體,並透過裁切件相對於吸取件突出的部份裁切被吸附的袋體,可避免盒體受到損傷。另一方面,本發明的割袋機構能透過機械手臂移動割袋模組,因此可吸取晶圓盒體上任意部位的袋體進行裁切,從而達到節省人力、免去位置判斷以及提高晶圓盒品質的效果。Thereby, the bag cutting module of the present invention can absorb the bag body through the suction member, and cut the suctioned bag body through the protruding part of the cutting member relative to the suction member, so as to avoid damage to the box body. On the other hand, the bag-cutting mechanism of the present invention can move the bag-cutting module through the mechanical arm, so it can absorb the bag body at any part of the wafer cassette body for cutting, thereby saving manpower, eliminating the need for position judgment and improving the wafer quality. Box quality effect.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.
有關本發明之前述及其它技術內容、特點與功效,在以下配合參考圖式之較佳實施例的詳細說明中,將可清楚地呈現。值得一提的是,以下實施例所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,使用的方向用語是用以說明,而非對本發明加以限制。此外,在下列各個實施例中,相同或相似的元件將採用相同或相似的標號。The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the drawings. It is worth mentioning that the directional terms mentioned in the following embodiments, such as: up, down, left, right, front or rear, etc., are only for referring to the directions of the attached drawings. Accordingly, the directional terms used are intended to illustrate, but not to limit the invention. In addition, in each of the following embodiments, the same or similar elements will be given the same or similar reference numerals.
請參考圖1,圖1為本發明的割袋機構的一實施例的立體示意圖。本實施例的割袋機構1用以對一物體外層的包裝袋體進行裁切,其中物體例如是一晶圓盒,且包裝袋體的材質例如是且包括一架體100、一機械手臂200以及一割袋模組300,其中架體100上配置有至少一承載平台110,機械手臂200連接於架體100,且割袋模組300連接於機械手臂200。Please refer to FIG. 1 , which is a three-dimensional schematic diagram of an embodiment of the bag cutting mechanism of the present invention. The
請參考圖2,圖2為圖1中的承載平台的立體示意圖。詳細而言,承載平台110形成有一開口O,且承載平台110上配置有一對承載件112、一定位件114以及一抵靠件116,其中承載件112架設於開口O上且透過一汽缸112a沿一第一方向D1滑設於承載平台110,定位件114相鄰於開口O,且抵靠件116透過另一汽缸116a沿一第二方向D2滑設於承載平台110,其中第二方向D2與第一方向D1線性獨立,亦即第一方向D1以及第二方向D2兩者彼此不平形。當包裝有物體的袋體被運送至架體100上的承載平台時,承載件112會透過汽缸112a沿第一方向D1相對於承載平台110滑動以承載袋體,由於承載件112之間形成有凹口,因此袋體的一部份會經由凹口露出於開口O,以供機械手臂200移動割袋模組300進行裁切。之後,抵靠件116會透過汽缸116a沿第二方向相對於承載平台110滑動,並將袋體朝定位件114的方向推移,直到袋體碰觸到定位件114為止。透過這樣的配置,可協助機械手臂200對袋體進行定位,同時確保在割袋流程中割袋模組300每一次對袋體進行裁切的相對位置均相同,使割袋流程標準化並減少誤差。Please refer to FIG. 2 , which is a three-dimensional schematic diagram of the carrying platform in FIG. 1 . In detail, an opening O is formed on the
請參考圖3及圖4,其中圖3為圖1中的割袋模組的立體示意圖,而圖4為圖3另一角度的局部立體示意圖。本實施例的割袋模組300包括一本體310、一吸取件320、一裁切件330以及一氣閥340,其中吸取件320連接於本體310,且氣閥340連接於本體310。Please refer to FIGS. 3 and 4 , wherein FIG. 3 is a schematic perspective view of the bag cutting module in FIG. 1 , and FIG. 4 is a partial perspective view of FIG. 3 from another angle. The
具體而言,割袋模組300用以對上述的袋體進行裁切,其中本體310以及吸取件320均為中空結構,且本體310以及吸取件320共同定義一腔室C(請參考圖5),而裁切件330的一部份配置於腔室C內,且裁切件330的另一部份相對於吸取件320突出。另一方面,腔室C透過氣閥340連通於一抽氣幫浦(未繪示),因此割袋模組300可藉由抽氣幫浦使腔室C形成負壓環境,用以吸附袋體。Specifically, the
請同時參考圖4及圖5,其中圖5為圖4的前視示意圖,且為了便於說明,圖5中部份元件以透明的方式呈現。詳細而言,吸取件320形成有一吸嘴322,其中吸嘴322具有一底面322a以及一端面322b,且底面322a相對於端面322b向腔室C凹陷。另一方面,本實施例的裁切件330例如是一靜態切刀或一超音波切刀且具有一刃部332,且裁切件330透過刃部332對袋體進行裁切。換言之,裁切件330的刃部332相對於吸取件320固定或可相對於吸取件320做些許的上下振動,以利於裁切袋體。除此之外,刃部332相對於底面322a突出,且如圖5所示,端面322b與底面322a的高度差H1大於刃部332露出的端部與底面322a的高度差H2。透過這樣的配置,當抽氣幫浦啟動後,物體外層的袋體將會受到吸力作用脫離物體表面,並伸入吸嘴322內接觸到裁切件330的刃部從而被裁出切口,且由於端面322b與底面322a的高度差H1大於刃部332端部與底面322a的高度差H2,當袋體被吸入吸嘴322內時,物體會受到端面322b的抵頂,因此刃部332不會誤傷到物體的其它部份,從而達到保護物體的效果。Please refer to FIG. 4 and FIG. 5 at the same time, wherein FIG. 5 is a schematic front view of FIG. 4 , and for the convenience of description, some elements in FIG. 5 are shown in a transparent manner. In detail, the
更進一步而言,底面322a上形成有一裁切孔H
C以及複數個吸取孔H
S,其中刃部332穿設於裁切孔H
C,且裁切孔H
C配置於這些吸取孔H
S之間。透過這樣的配置,可以確保腔體C連通外部的氣孔不會受到刃部332的擋掣而造成吸力減弱。除此之外,當袋體的局部被吸取件320吸附時,割袋模組300有可能會受到袋體的材料張力拉扯而產生跳停的現象,為此,本實施例的割袋模組300還包括複數個導引件360,這些導引件360例如是滾輪,樞接於本體310且相鄰於吸嘴322。具體而言,如圖4及圖5所示,本體310上還形成有至少一導引部312,且導引部312的尺寸沿吸取件320的延伸方向漸縮。藉此,不僅吸取件320可移動至袋體的任何位置吸取並進行裁切,當袋體的局部被吸取件320吸附,且機械手臂200持續帶動割袋模組300移動時,袋體的相鄰區域所產生的皺摺會順應導引件360的滾動以及導引部312的傾斜而滑動,從而使得張力減小並避免割袋機構跳停。
More specifically, a cutting hole HC and a plurality of suction holes HS are formed on the bottom surface 322a , wherein the
除此之外,如3所示,為了更進一步增強割袋時的流暢度及穩定性,割袋機構1還包括一連接件210以及複數個彈性件220,其中連接件210例如是一配置有複數個導柱的底盤,而彈性件220例如是線性彈簧,且這些彈性件220配置於機械手臂200以及割袋模組300之間的導柱上。當割袋模組300因為上述吸附袋體而受到袋體材料張力作用時,這些張力會由彈性件220吸收,因此不會影響到機械手臂200的移動行程,進而確保割袋時的流暢度及穩定性。In addition, as shown in 3, in order to further enhance the smoothness and stability of bag cutting, the
較佳地,割袋模組300還包括一輔助氣閥350,其中輔助氣閥350連接於本體310,且腔室C透過輔助氣閥連通於一真空檢知計。透過這樣的配置,在割袋作業當中,使用者可透過真空檢知計隨時確認腔室C的真空度,避免割袋模組300由於吸力不足而無法裁切袋體的情況發生。Preferably, the
請參考圖6及圖7,其中圖6為本發明的割袋模組的另一實施例的立體示意圖,而圖7為圖6的前視示意圖,為了便於說明,在圖7中部份元件以透明的方式呈現。本實施例的割袋模組300’與圖3的割袋模組300相似,其主要的差別在於:割袋模組300’的裁切件320’為一滾刀,且割袋模組300’還包括一裁切馬達370以及一傳動件372。Please refer to FIG. 6 and FIG. 7 , wherein FIG. 6 is a three-dimensional schematic diagram of another embodiment of the bag cutting module of the present invention, and FIG. 7 is a front view schematic diagram of FIG. Presented in a transparent manner. The
詳細而言,本實施例的裁切件330’為一多邊形滾刀,但本發明對此並不加以限制,在其它可能的實施例中,裁切件330’也可以是一圓盤鋸或由複數個刀刃所組合而成的轉動型切刀。另一方面,裁切馬達370例如是一伺服馬達,而傳動件372例如是一皮帶,但也可以是傳動軸、齒輪或鏈條之類的傳動元件,且裁切馬達370透過傳動件372驅動滾刀轉動。在本實施例中,導引件360直接連接於吸取件320’的吸嘴322’上,且本體310不具備導引部。透過這樣的配置,在割袋過程中,裁切馬達370將持續驅動裁切件330’轉動,且裁切件330’的刃部332’的最長端處在旋轉過程中維持在底面322a’以及端面322b’之間,如此一來能以較快的速度對袋體進行裁切,且同時確保物體不會被刃部332’誤傷,可減少割袋流程所需的時間。In detail, the cutting
本發明在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,上述實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。且應注意的是,舉凡與上述實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。The present invention has been disclosed above with preferred embodiments, but those skilled in the art should understand that the above embodiments are only used to describe the present invention, and should not be construed as limiting the scope of the present invention. It should be noted that all the changes and substitutions equivalent to the above-mentioned embodiments should be considered to be included in the scope of the present invention. Therefore, the protection scope of the present invention should be defined by the scope of the patent application.
1:割袋機構
100:架體
110:承載平台
112:承載件
112a:汽缸
114:定位件
116:抵靠件
116a:汽缸
200:機械手臂
210:連接件
220:彈性件
300、300’:割袋模組
310、310’:本體
312:導引部
320、320’:吸取件
322、322’:吸嘴
322a、322a’:底面
322b、322b’:端面
330、330’:裁切件
332、332’:刃部
340:氣閥
350:輔助氣閥
360:導引件
370:裁切馬達
372:傳動件
C:腔室
D1:第一方向
D2:第二方向
H1、H2:高度差
H
C:裁切孔
H
S:吸取孔
O:開口
1: bag cutting mechanism 100: frame body 110: carrying platform 112: carrying
圖1為本發明的割袋機構的一實施例的立體示意圖。 圖2為圖1中的承載平台的立體示意圖。 圖3為圖1中的割袋模組的立體示意圖。 圖4為圖3另一角度的局部立體示意圖。 圖5為圖4的前視示意圖。 圖6為本發明的割袋模組的另一實施例的立體示意圖。 圖7為圖6的前視示意圖。 FIG. 1 is a schematic perspective view of an embodiment of the bag cutting mechanism of the present invention. FIG. 2 is a schematic perspective view of the carrying platform in FIG. 1 . FIG. 3 is a perspective view of the bag cutting module in FIG. 1 . FIG. 4 is a partial perspective view of FIG. 3 from another angle. FIG. 5 is a schematic front view of FIG. 4 . 6 is a schematic perspective view of another embodiment of the bag cutting module of the present invention. FIG. 7 is a schematic front view of FIG. 6 .
1:割袋機構 1: bag cutting mechanism
100:架體 100: Frame
110:承載平台 110: Bearing Platform
200:機械手臂 200: Robotic Arm
300:割袋模組 300: cutting bag module
Claims (10)
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TW109133098A TWI777252B (en) | 2020-09-24 | 2020-09-24 | Bag cutting module and bag cutting mechanism |
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TW109133098A TWI777252B (en) | 2020-09-24 | 2020-09-24 | Bag cutting module and bag cutting mechanism |
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TWI777252B true TWI777252B (en) | 2022-09-11 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5463841A (en) * | 1994-07-04 | 1995-11-07 | Oji Seital Kaisha, Ltd. | Unwrapping apparatus for stretch-wrapped load and shrink-wrapped load |
US20180118398A1 (en) * | 2016-10-31 | 2018-05-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for unpacking semiconductor wafer container |
CN211766790U (en) * | 2020-01-17 | 2020-10-27 | 康美包(苏州)有限公司 | Film cutting device and sack filling machine |
-
2020
- 2020-09-24 TW TW109133098A patent/TWI777252B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5463841A (en) * | 1994-07-04 | 1995-11-07 | Oji Seital Kaisha, Ltd. | Unwrapping apparatus for stretch-wrapped load and shrink-wrapped load |
US20180118398A1 (en) * | 2016-10-31 | 2018-05-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for unpacking semiconductor wafer container |
CN211766790U (en) * | 2020-01-17 | 2020-10-27 | 康美包(苏州)有限公司 | Film cutting device and sack filling machine |
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TW202212204A (en) | 2022-04-01 |
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