TWI777114B - Under-screen fingerprint identification device - Google Patents

Under-screen fingerprint identification device Download PDF

Info

Publication number
TWI777114B
TWI777114B TW108147945A TW108147945A TWI777114B TW I777114 B TWI777114 B TW I777114B TW 108147945 A TW108147945 A TW 108147945A TW 108147945 A TW108147945 A TW 108147945A TW I777114 B TWI777114 B TW I777114B
Authority
TW
Taiwan
Prior art keywords
layer
light
under
identification device
fingerprint identification
Prior art date
Application number
TW108147945A
Other languages
Chinese (zh)
Other versions
TW202125315A (en
Inventor
林哲玄
蕭嘉源
葉俊宏
葉佳明
Original Assignee
英屬開曼群島商敦泰電子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=72211657&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI777114(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 英屬開曼群島商敦泰電子有限公司 filed Critical 英屬開曼群島商敦泰電子有限公司
Priority to TW108147945A priority Critical patent/TWI777114B/en
Priority to CN202020535840.9U priority patent/CN211403454U/en
Publication of TW202125315A publication Critical patent/TW202125315A/en
Application granted granted Critical
Publication of TWI777114B publication Critical patent/TWI777114B/en

Links

Images

Landscapes

  • Image Input (AREA)
  • Collating Specific Patterns (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

An under-screen fingerprint identification device adapted to sense a finger is provided. The under-screen fingerprint identification device includes an image sensing module and a display module. The image sensing module includes a sensing layer, a transparent layer, a first light shielding layer, a second light shielding layer, and a micro lens layer. The sensing layer includes a plurality of sensing pixels. The first light shielding layer has a plurality of first openings. The second light shielding layer has a plurality of second openings, wherein the first light shielding layer is located between the second light shielding layer and the sensing layer. The second light shielding layer is located between the micro lens layer and the first light shielding layer. In the vertical direction, the position of the first openings is aligned with the position of the second openings and the position of at least a portion of the sensing pixels.

Description

屏下指紋辨識裝置Under-screen fingerprint recognition device

本發明是有關於一種電子裝置，且特別是有關於一種屏下指紋辨識裝置。 The present invention relates to an electronic device, and more particularly, to an under-screen fingerprint identification device.

為了提高顯示器的屏占比，屏下指紋感測技術已成為趨勢。簡單來說，屏下指紋感測技術乃是將指紋感測器配置在電子裝置的顯示螢幕的下方。在電子裝置偵測到使用者接觸顯示螢幕後，電子裝置會控制顯示螢幕發光以照亮使用者的手指表面。光線可經由使用者的手指反射進入顯示螢幕下方的指紋感測器，並由指紋感測器將反射光線轉換為數位影像信號，即可得到使用者指紋影像。 In order to increase the screen-to-body ratio of displays, under-screen fingerprint sensing technology has become a trend. To put it simply, the under-screen fingerprint sensing technology is to dispose the fingerprint sensor under the display screen of the electronic device. After the electronic device detects that the user touches the display screen, the electronic device controls the display screen to emit light to illuminate the surface of the user's finger. The light can be reflected by the user's finger and enter the fingerprint sensor under the display screen, and the reflected light can be converted into a digital image signal by the fingerprint sensor to obtain the fingerprint image of the user.

然而，在目前的發展中，具有屏下指紋感測技術的可攜式電子裝置較厚，堆疊較高。若需保持相鄰畫素間光學互不干涉，通常膜層堆疊的厚度需達到將近200微米。此外，為了減少畫素間光學干涉，製程中的光罩也較難製作。 However, in the current development, the portable electronic device with the under-screen fingerprint sensing technology is thicker and the stacking is higher. In order to maintain optical non-interference between adjacent pixels, the thickness of the film stack usually needs to reach nearly 200 microns. In addition, in order to reduce optical interference between pixels, the photomask in the process is also difficult to fabricate.

本發明提供一種屏下指紋辨識裝置，可減少體積且避免畫素間光學互相干涉。 The present invention provides an under-screen fingerprint identification device, which can reduce the volume and avoid optical mutual interference between pixels.

本發明的提供一種屏下指紋辨識裝置，適於感測一手指。屏下指紋辨識裝置包括一影像感測模組以及一顯示模組。影像感測模組包括一感測層、一透光層、一第一遮光層、一第二遮光層以及一微透鏡層。感測層包括多個感測畫素。透光層配置於感測層。第一遮光層配置於透光層，具有多個第一開口。第二遮光層配置於透光層，具有多個第二開口。微透鏡層配置於透光層，包括多個微透鏡。顯示模組配置於影像感測模組，其中第一遮光層位於第二遮光層與感測層之間。第二遮光層位於微透鏡層與第一遮光層之間。在垂直方向上，第一開口的位置對齊於第二開口的位置以及至少一部份感測畫素的位置。 The present invention provides an under-screen fingerprint identification device suitable for sensing a finger. The under-screen fingerprint identification device includes an image sensing module and a display module. The image sensing module includes a sensing layer, a light-transmitting layer, a first light-shielding layer, a second light-shielding layer, and a microlens layer. The sensing layer includes a plurality of sensing pixels. The light-transmitting layer is disposed on the sensing layer. The first light-shielding layer is disposed on the light-transmitting layer and has a plurality of first openings. The second light-shielding layer is disposed on the light-transmitting layer and has a plurality of second openings. The microlens layer is disposed on the light-transmitting layer and includes a plurality of microlenses. The display module is disposed in the image sensing module, wherein the first light shielding layer is located between the second light shielding layer and the sensing layer. The second light shielding layer is located between the microlens layer and the first light shielding layer. In the vertical direction, the position of the first opening is aligned with the position of the second opening and the position of at least a part of the sensing pixels.

在本發明的一實施例中，上述的第一開口的尺寸相同於第二開口的尺寸。 In an embodiment of the present invention, the size of the first opening is the same as the size of the second opening.

在本發明的一實施例中，上述的微透鏡的曲率半徑與微透鏡的曲面頂點至感測畫素的收光面的距離呈正比。 In an embodiment of the present invention, the radius of curvature of the microlens is proportional to the distance from the vertex of the curved surface of the microlens to the light-receiving surface of the sensing pixel.

在本發明的一實施例中，上述的屏下指紋辨識裝置還包括一紅外濾光層，適於吸收紅外光，形成於微透鏡層。微透鏡層位於紅外濾光層與透光層之間。 In an embodiment of the present invention, the above-mentioned under-screen fingerprint identification device further includes an infrared filter layer suitable for absorbing infrared light and formed on the microlens layer. The microlens layer is located between the infrared filter layer and the light transmission layer.

在本發明的一實施例中，上述的屏下指紋辨識裝置還包 括一紅外濾光層，適於吸收紅外光，形成於第二遮光層及透光層上。 In an embodiment of the present invention, the above-mentioned under-screen fingerprint identification device further includes: An infrared filter layer is included, which is suitable for absorbing infrared light, and is formed on the second light-shielding layer and the light-transmitting layer.

在本發明的一實施例中，上述的紅外濾光層隔開透光層與第二遮光層。 In an embodiment of the present invention, the above-mentioned infrared filter layer separates the light-transmitting layer and the second light-shielding layer.

在本發明的一實施例中，上述的部份紅外濾光層位於第二開口中。 In an embodiment of the present invention, the above-mentioned part of the infrared filter layer is located in the second opening.

在本發明的一實施例中，上述的屏下指紋辨識裝置還包括一紅外濾光層，適於吸收紅外光，形成於第一遮光層。 In an embodiment of the present invention, the above-mentioned under-screen fingerprint identification device further includes an infrared filter layer suitable for absorbing infrared light and formed on the first light shielding layer.

在本發明的一實施例中，上述的紅外濾光層隔開感測層與第一遮光層。 In an embodiment of the present invention, the above-mentioned infrared filter layer separates the sensing layer and the first light shielding layer.

在本發明的一實施例中，上述的部份紅外濾光層位於第一開口中。 In an embodiment of the present invention, the above-mentioned part of the infrared filter layer is located in the first opening.

在本發明的一實施例中，上述的透光層包括一第一透光層及一第二透光層。 In an embodiment of the present invention, the above-mentioned transparent layer includes a first transparent layer and a second transparent layer.

在本發明的一實施例中，上述的屏下指紋辨識裝置還包括一紅外濾光層，適於吸收紅外光，形成於第一透光層與第二透光層之間。 In an embodiment of the present invention, the above-mentioned under-screen fingerprint identification device further includes an infrared filter layer suitable for absorbing infrared light and formed between the first transparent layer and the second transparent layer.

在本發明的一實施例中，上述的紅外濾光層隔開第一透光層與第一遮光層。 In an embodiment of the present invention, the above-mentioned infrared filter layer separates the first light-transmitting layer and the first light-shielding layer.

基於上述，在本發明的屏下指紋辨識裝置中，影像感測模組配置於顯示模組下方，且影像感測模組包括在垂直方向上第 一開口的位置對齊於第二開口的位置的第一遮光層及第二遮光層。因此使用者手指所反射感測光可通過微透鏡層產生聚焦作用，並藉由第二遮光層及第一遮光層傳遞至不同位置的感測畫素。如此一來，可有效減少體積，並且避免畫素間光學互相干涉。 Based on the above, in the under-screen fingerprint identification device of the present invention, the image sensing module is disposed below the display module, and the image sensing module includes a first The position of an opening is aligned with the first light shielding layer and the second light shielding layer at the position of the second opening. Therefore, the sensing light reflected by the user's finger can be focused through the microlens layer and transmitted to the sensing pixels at different positions through the second light shielding layer and the first light shielding layer. In this way, the volume can be effectively reduced, and the optical interference between the pixels can be avoided.

為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。 In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.

10:手指 10: Fingers

50:屏下指紋辨識裝置 50: Under-screen fingerprint recognition device

100~100N:影像感測模組 100~100N: Image sensor module

110:感測層 110: Sensing layer

120、120A:透光層 120, 120A: transparent layer

122:第一透光層 122: the first transparent layer

124:第二透光層 124: The second light-transmitting layer

130、130A:第一遮光層 130, 130A: the first light shielding layer

140、140A:第二遮光層 140, 140A: the second light shielding layer

150:微透鏡層 150: Micro lens layer

160、160A、160B、160C:紅外濾光層 160, 160A, 160B, 160C: Infrared filter layer

200:顯示模組 200: Display module

D:距離 D: distance

N1:第一開口 N1: The first opening

N2:第二開口 N2: Second opening

M:微透鏡 M: Micro lens

P:感測畫素 P: Sensing pixel

R:曲率半徑 R: radius of curvature

圖1A為本發明一實施例的屏下指紋辨識裝置的剖面示意圖。 1A is a schematic cross-sectional view of an under-screen fingerprint identification device according to an embodiment of the present invention.

圖1B為圖1A的屏下指紋辨識裝置中A區域的放大示意圖。 FIG. 1B is an enlarged schematic view of area A in the under-screen fingerprint identification device of FIG. 1A .

圖2為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。 2 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention.

圖3為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。 3 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention.

圖4為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。 4 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention.

圖5為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。 5 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention.

圖6為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。 6 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention.

圖7為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。 7 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention.

圖8為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。 8 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention.

圖9為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。 9 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention.

圖10為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。 10 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention.

圖11為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。 11 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention.

圖12為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。 12 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention.

圖13為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。 13 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention.

圖14為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。 14 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention.

圖15為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。 15 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention.

圖1A為本發明一實施例的屏下指紋辨識裝置的剖面示意圖。請參考圖1A。本實施例提供一種屏下指紋辨識裝置50，適 於感測一手指10。屏下指紋辨識裝置50包括一影像感測模組100以及一顯示模組200，其中顯示模組200配置於影像感測模組100的上方。因此，在進行屏下指紋辨識時，使用者可將手指10放置於顯示模組200上，並藉由位於顯示模組200下方的影像感測模組100接收手指10所反射感測光以進行指紋辨識。感測光可由顯示模組200或額外配置的光源提供，本發明並不限於此。 1A is a schematic cross-sectional view of an under-screen fingerprint identification device according to an embodiment of the present invention. Please refer to Figure 1A. This embodiment provides an under-screen fingerprint identification device 50, which is suitable for for sensing a finger 10 . The under-screen fingerprint identification device 50 includes an image sensing module 100 and a display module 200 , wherein the display module 200 is disposed above the image sensing module 100 . Therefore, when performing fingerprint recognition under the screen, the user can place the finger 10 on the display module 200, and the image sensing module 100 located below the display module 200 receives the sensing light reflected by the finger 10 to perform fingerprinting Identify. The sensing light can be provided by the display module 200 or an additionally configured light source, and the present invention is not limited thereto.

詳細而言，顯示模組200例如是有機發光二極體(organic light-emitting diode，OLED)顯示面板、發光二極體(light-emitting diode，LED)顯示面板、微發光二極體(micro light-emitting diode，Micro LED)顯示面板或次毫米發光二極體(mini light-emitting diode，Mini LED)顯示面板，但本發明並不限於此。 Specifically, the display module 200 is, for example, an organic light-emitting diode (OLED) display panel, a light-emitting diode (LED) display panel, and a micro light-emitting diode (micro light) display panel. -emitting diode, Micro LED) display panel or sub-millimeter light-emitting diode (mini light-emitting diode, Mini LED) display panel, but the present invention is not limited to this.

影像感測模組100包括一感測層110、一透光層120、一第一遮光層130、一第二遮光層140以及一微透鏡層150。感測層110包括多個感測畫素P，適於朝向顯示模組200的一側收光。多個感測畫素P可連續或不連續排列，本發明並不限於此。 The image sensing module 100 includes a sensing layer 110 , a light-transmitting layer 120 , a first light-shielding layer 130 , a second light-shielding layer 140 and a microlens layer 150 . The sensing layer 110 includes a plurality of sensing pixels P, which are suitable for receiving light toward the side of the display module 200 . The plurality of sensing pixels P may be arranged continuously or discontinuously, and the present invention is not limited thereto.

透光層120配置於感測層110，以覆蓋感測層110。透光層120適於讓手指10所反射的感測光通過。透光層120的折射率例如介於1.3至1.8之間，或者是，適於通過透光層120的光波長例如介於380nm至780nm之間，但本發明並不限於此。在不同的實施例中，透光層120可依據製程手段而配置為多層，本發明並不限於此。在本實施例中，透光層120的厚度可依據對影像品質 要求而做調整，將由後續段落中詳細說明。 The light-transmitting layer 120 is disposed on the sensing layer 110 to cover the sensing layer 110 . The light-transmitting layer 120 is suitable for passing the sensing light reflected by the finger 10 . The refractive index of the light-transmitting layer 120 is, for example, between 1.3 and 1.8, or the wavelength of light suitable for passing through the light-transmitting layer 120 is, for example, between 380 nm and 780 nm, but the invention is not limited thereto. In different embodiments, the light-transmitting layer 120 may be configured as multiple layers according to the manufacturing method, but the present invention is not limited thereto. In this embodiment, the thickness of the light-transmitting layer 120 may depend on the image quality adjustments are required, as detailed in the following paragraphs.

第一遮光層130配置於透光層120，具有多個第一開口N1。而第二遮光層140也同樣配置於透光層120，且具有多個第二開口N2。第一遮光層130位於第二遮光層140與感測層110之間，且在垂直方向上，第一遮光層130的第一開口N1的位置對齊於第二遮光層140的第二開口N2的位置以及至少一部份感測畫素P的位置。舉例而言，在本實施例中，每一第一開口N1的位置即分別對齊每一第二開口N2的位置，且同時分別對齊每一感測畫素P的位置。但在不同的實施例中，每一第一開口N1的位置可對齊於每多個感測畫素P的位置。此外，第一開口N1的尺寸相同於第二開口N2的尺寸。但在一些實施例中，第二開口N2的尺寸可略大於第一開口N1的尺寸，本發明亦不限於此。第一開口N1的直徑越小則影像品質越好，例如是介於1微米至50微米之間。第一遮光層130及第二遮光層140例如為黑色材料，且以貼附或鍍膜方式形成於其他構件的表面。 The first light-shielding layer 130 is disposed on the light-transmitting layer 120 and has a plurality of first openings N1. The second light-shielding layer 140 is also disposed on the light-transmitting layer 120 and has a plurality of second openings N2. The first light shielding layer 130 is located between the second light shielding layer 140 and the sensing layer 110 , and in the vertical direction, the position of the first opening N1 of the first light shielding layer 130 is aligned with the position of the second opening N2 of the second light shielding layer 140 . position and at least a portion of the position of the sensing pixel P. For example, in this embodiment, the position of each first opening N1 is respectively aligned with the position of each second opening N2, and at the same time, the position of each sensing pixel P is respectively aligned. However, in different embodiments, the position of each first opening N1 may be aligned with the position of each of the plurality of sensing pixels P. In addition, the size of the first opening N1 is the same as the size of the second opening N2. However, in some embodiments, the size of the second opening N2 may be slightly larger than the size of the first opening N1, and the present invention is not limited thereto. The smaller the diameter of the first opening N1, the better the image quality, for example, between 1 μm and 50 μm. The first light-shielding layer 130 and the second light-shielding layer 140 are, for example, black materials, and are formed on the surfaces of other components by sticking or coating.

微透鏡層150配置於透光層120上以覆蓋透光層120。微透鏡層150由多個微透鏡M排列所組成，且在本實施例中，每一微透鏡M對齊於不同的第一開口N1。在不同的實施例中，根據微透鏡M的高與寬設計，相鄰微透鏡M間可為相連或不相連，本發明並不限於此。在本實施例中，第二遮光層140位於透光層120與微透鏡層150之間，且透光層120位於第一遮光層130與第二 遮光層140之間。換句話說，由感測層110朝向顯示模組200的一側依序為感測層110、第一遮光層130、透光層120、第二遮光層140以及微透鏡層150。因此，手指10所反射感測光可通過微透鏡層150產生聚焦作用，並藉由第二遮光層140及第一遮光層130傳遞至不同位置的感測畫素P。如此一來，可有效減少體積，並且避免畫素間光學互相干涉。 The microlens layer 150 is disposed on the transparent layer 120 to cover the transparent layer 120 . The microlens layer 150 is formed by arranging a plurality of microlenses M, and in this embodiment, each microlens M is aligned with a different first opening N1. In different embodiments, according to the design of the height and width of the microlenses M, adjacent microlenses M may be connected or not connected, and the present invention is not limited thereto. In this embodiment, the second light-shielding layer 140 is located between the light-transmitting layer 120 and the microlens layer 150, and the light-transmitting layer 120 is located between the first light-shielding layer 130 and the second light-shielding layer 130. between the light shielding layers 140 . In other words, the side facing the display module 200 from the sensing layer 110 is the sensing layer 110 , the first light shielding layer 130 , the light transmitting layer 120 , the second light shielding layer 140 and the microlens layer 150 in sequence. Therefore, the sensing light reflected by the finger 10 can be focused by the microlens layer 150 and transmitted to the sensing pixels P at different positions through the second light shielding layer 140 and the first light shielding layer 130 . In this way, the volume can be effectively reduced, and the optical interference between the pixels can be avoided.

值得一提的是，在本實施例中，相鄰感測畫素P的間距可依據指紋波峰的尺寸進一步設計。舉例而言，由奈奎斯特-夏農取樣定理(Nyquist-Shannon sampling theorem)可知，取樣空間頻率必須為至少兩倍以上於被取樣空間信號。換句話說，在本實施例中，可依據指紋波峰的間距週期(約介於0.1毫米至0.3毫米0.3之間)而計算出適當的感測畫素P間距週期可為5微米至150微米之間。舉例而言，在本實施例中，感測畫素P間距週期為25微米。因此，在本實施例中，第一遮光層130的第一開口N1、第二遮光層140的第二開口N2，以及微透鏡層150的微透鏡M的間距週期也同為25微米，但本發明並不限於此。 It is worth mentioning that, in this embodiment, the distance between adjacent sensing pixels P can be further designed according to the size of the fingerprint peaks. For example, according to the Nyquist-Shannon sampling theorem, the sampling spatial frequency must be at least twice that of the sampled spatial signal. In other words, in this embodiment, according to the pitch period of the fingerprint peaks (approximately between 0.1 mm and 0.3 mm and 0.3), it can be calculated that the appropriate sensing pixel P pitch period can be between 5 microns and 150 microns. between. For example, in this embodiment, the pitch period of the sensing pixels P is 25 microns. Therefore, in this embodiment, the first opening N1 of the first light shielding layer 130 , the second opening N2 of the second light shielding layer 140 , and the pitch period of the microlenses M of the microlens layer 150 are also 25 μm. The invention is not limited to this.

圖1B為圖1A的屏下指紋辨識裝置中A區域的放大示意圖。請參考圖1B。另一方面，在本實施例中，微透鏡M的曲率半徑R與微透鏡M的曲面頂點至感測畫素P收光面的距離D的相對關係可用下列公式(1)表示：

Figure 108147945-A0305-02-0011-1
FIG. 1B is an enlarged schematic diagram of area A in the under-screen fingerprint identification device of FIG. 1A . Please refer to Figure 1B. On the other hand, in this embodiment, the relative relationship between the radius of curvature R of the microlens M and the distance D from the vertex of the curved surface of the microlens M to the light-receiving surface of the sensing pixel P can be expressed by the following formula (1):
Figure 108147945-A0305-02-0011-1

其中，RM為微透鏡M的曲率半徑R；T為微透鏡M的曲面頂點至感測畫素P收光面的距離D；n為微透鏡M的折射率。 Wherein, RM is the radius of curvature R of the microlens M ; T is the distance D from the vertex of the curved surface of the microlens M to the light-receiving surface of the sensing pixel P; n is the refractive index of the microlens M.

換句話說，微透鏡M的曲率半徑R與微透鏡M的曲面頂點至感測畫素P收光面的距離D呈正比，並且，微透鏡M的曲面頂點至感測畫素P收光面的距離D可藉由設計透光層120的厚度加以調整。在一些實施例中，根據對影像品質的不同要求，距離D可設計介於理論長度乘上正負50%，本發明並不限於此。 In other words, the radius of curvature R of the microlens M is proportional to the distance D from the apex of the curved surface of the microlens M to the light-receiving surface of the sensing pixel P, and the apex of the curved surface of the microlens M to the light-receiving surface of the sensing pixel P The distance D can be adjusted by designing the thickness of the light-transmitting layer 120 . In some embodiments, according to different requirements for image quality, the distance D can be designed to be between the theoretical length multiplied by plus or minus 50%, but the invention is not limited to this.

圖2為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。請參考圖2。本實施例的影像感測模組100A類似於圖1所顯示的影像感測模組100。兩者不同之處在於，在本實施例中，影像感測模組100A還包括一紅外濾光層160，適於吸收紅外光，形成於微透鏡層150，而微透鏡層150位於紅外濾光層160與透光層120之間。詳細而言，紅外濾光層160以鍍膜方式形成於微透鏡層150中每個微透鏡M的彎曲表面上。如此一來，影像感測模組100A可進一步減少環境中紅外光的影響，進而提升屏下指紋辨識裝置50的感測光學品質。 2 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention. Please refer to Figure 2. The image sensing module 100A of this embodiment is similar to the image sensing module 100 shown in FIG. 1 . The difference between the two is that, in this embodiment, the image sensing module 100A further includes an infrared filter layer 160, which is suitable for absorbing infrared light, and is formed on the microlens layer 150, and the microlens layer 150 is located in the infrared filter layer. between the layer 160 and the light-transmitting layer 120 . In detail, the infrared filter layer 160 is formed on the curved surface of each microlens M in the microlens layer 150 in a coating manner. In this way, the image sensing module 100A can further reduce the influence of infrared light in the environment, thereby improving the sensing optical quality of the under-screen fingerprint identification device 50 .

圖3為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。請參考圖3。本實施例的影像感測模組100B類似於圖2所顯示的影像感測模組100A。兩者不同之處在於，在本實施例中， 形成第二遮光層140之後，將透光層120填充於第二遮光層140的第二開口N2中。換句話說，透光層120的頂面與第二遮光層140切齊。因此，可簡化配置透光層120的製程。詳細而言，在本實施例中，微透鏡M的曲面頂點至第二遮光層140的底面的距離約為4.7微米，且第二遮光層140的底面至感測層110頂面的距離約為30微米。 3 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention. Please refer to Figure 3. The image sensing module 100B of this embodiment is similar to the image sensing module 100A shown in FIG. 2 . The difference between the two is that, in this embodiment, After the second light-shielding layer 140 is formed, the light-transmitting layer 120 is filled in the second opening N2 of the second light-shielding layer 140 . In other words, the top surface of the light-transmitting layer 120 is flush with the second light-shielding layer 140 . Therefore, the process of disposing the light-transmitting layer 120 can be simplified. In detail, in this embodiment, the distance from the vertex of the curved surface of the microlens M to the bottom surface of the second light shielding layer 140 is about 4.7 μm, and the distance from the bottom surface of the second light shielding layer 140 to the top surface of the sensing layer 110 is about 30 microns.

圖4為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。請參考圖4。本實施例的影像感測模組100C類似於圖2所顯示的影像感測模組100A。兩者不同之處在於，在本實施例中，第一遮光層130A的第一開口N1A的直徑小於圖2所顯示的第一遮光層130的第一開口N1的直徑，且第二遮光層140A的第二開口N2A的直徑小於圖2所顯示的第二遮光層140的第一開口N2的直徑。因此，可進一步減少相鄰畫素間的光學干涉，進而提升屏下指紋辨識裝置的感測光學品質。此外，遮光層開口的直徑的設計也可適配於不同解析度的感測元件(即感測層110中感測畫素P的尺寸或排列密度)中，進而使不同解析度的感測元件皆能感測適當的感測目標。 4 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention. Please refer to Figure 4. The image sensing module 100C of this embodiment is similar to the image sensing module 100A shown in FIG. 2 . The difference between the two is that, in this embodiment, the diameter of the first opening N1A of the first light shielding layer 130A is smaller than the diameter of the first opening N1 of the first light shielding layer 130 shown in FIG. 2 , and the second light shielding layer 140A The diameter of the second opening N2A is smaller than the diameter of the first opening N2 of the second light shielding layer 140 shown in FIG. 2 . Therefore, the optical interference between adjacent pixels can be further reduced, thereby improving the sensing optical quality of the fingerprint identification device under the screen. In addition, the design of the diameter of the opening of the light shielding layer can also be adapted to the sensing elements with different resolutions (ie the size or arrangement density of the sensing pixels P in the sensing layer 110 ), so that the sensing elements with different resolutions can be used. All can sense the appropriate sensing target.

圖5為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。請參考圖5。本實施例的影像感測模組100D類似於圖2所顯示的影像感測模組100A。兩者不同之處在於，在本實施例中，在形成透光層120之後，將紅外濾光層160A形成透光層120上。 換句話說，即紅外濾光層160A隔開透光層120與第二遮光層140。因此，可進一步提升紅外濾光層160A的平坦度，進而簡化紅外濾光層160A的製程，且使得使用者在使用屏下指紋辨識裝置時有較佳的視覺外觀效果。 5 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention. Please refer to Figure 5. The image sensing module 100D of this embodiment is similar to the image sensing module 100A shown in FIG. 2 . The difference between the two is that, in this embodiment, after the light-transmitting layer 120 is formed, the infrared filter layer 160A is formed on the light-transmitting layer 120 . In other words, the infrared filter layer 160A separates the light-transmitting layer 120 from the second light-shielding layer 140 . Therefore, the flatness of the infrared filter layer 160A can be further improved, thereby simplifying the manufacturing process of the infrared filter layer 160A, and enabling the user to have a better visual appearance when using the under-screen fingerprint identification device.

圖6為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。請參考圖6。本實施例的影像感測模組100E類似於圖2所顯示的影像感測模組100A。兩者不同之處在於，在本實施例中，在形成第二遮光層140之後，將紅外濾光層160B形成第二遮光層140及透光層120上。換句話說，即部份紅外濾光層160B位於第二開口N2中。因此，可進一步提升紅外濾光層160B的平坦度，進而簡化紅外濾光層160B的製程，且使得使用者在使用屏下指紋辨識裝置時有較佳的視覺外觀效果。 6 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention. Please refer to Figure 6. The image sensing module 100E of this embodiment is similar to the image sensing module 100A shown in FIG. 2 . The difference between the two is that, in this embodiment, after the second light shielding layer 140 is formed, the infrared filter layer 160B is formed on the second light shielding layer 140 and the light transmitting layer 120 . In other words, a part of the infrared filter layer 160B is located in the second opening N2. Therefore, the flatness of the infrared filter layer 160B can be further improved, thereby simplifying the manufacturing process of the infrared filter layer 160B, and enabling the user to have a better visual appearance when using the under-screen fingerprint identification device.

圖7為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。請參考圖7。本實施例的影像感測模組100F類似於圖2所顯示的影像感測模組100A。兩者不同之處在於，在本實施例中，透光層120A包括一第一透光層122及一第二透光層124，且紅外濾光層160C形成於第一透光層122及第二透光層124之間。換句話說，即紅外濾光層160C與第一遮光層120及第二遮光層140具有間隔。因此，可進一步提升紅外濾光層160C的平坦度，進而簡化紅外濾光層160C的製程，且使得使用者在使用屏下指紋辨識裝置時有較佳的視覺外觀效果。 7 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention. Please refer to Figure 7. The image sensing module 100F of this embodiment is similar to the image sensing module 100A shown in FIG. 2 . The difference between the two is that, in this embodiment, the transparent layer 120A includes a first transparent layer 122 and a second transparent layer 124, and the infrared filter layer 160C is formed on the first transparent layer 122 and the second transparent layer 124. between the two light-transmitting layers 124 . In other words, the infrared filter layer 160C is spaced apart from the first light shielding layer 120 and the second light shielding layer 140 . Therefore, the flatness of the infrared filter layer 160C can be further improved, thereby simplifying the manufacturing process of the infrared filter layer 160C, and enabling the user to have a better visual appearance when using the under-screen fingerprint identification device.

圖8為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。請參考圖8。本實施例的影像感測模組100G類似於圖2所顯示的影像感測模組100A。兩者不同之處在於，在本實施例中，在形成第一遮光層130之後，將紅外濾光層160B形成第一遮光層130及感測層110上。換句話說，即部份紅外濾光層160B位於第一開口N1中。因此，可進一步提升紅外濾光層160B的平坦度，進而簡化紅外濾光層160B的製程，且使得使用者在使用屏下指紋辨識裝置時有較佳的視覺外觀效果。 8 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention. Please refer to Figure 8. The image sensing module 100G of this embodiment is similar to the image sensing module 100A shown in FIG. 2 . The difference between the two is that, in this embodiment, after the first light shielding layer 130 is formed, the infrared filter layer 160B is formed on the first light shielding layer 130 and the sensing layer 110 . In other words, a part of the infrared filter layer 160B is located in the first opening N1. Therefore, the flatness of the infrared filter layer 160B can be further improved, thereby simplifying the manufacturing process of the infrared filter layer 160B, and enabling the user to have a better visual appearance when using the under-screen fingerprint identification device.

圖9為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。請參考圖9。本實施例的影像感測模組100H類似於圖2所顯示的影像感測模組100A。兩者不同之處在於，在本實施例中，將紅外濾光層160A形成在感測層110上。換句話說，即紅外濾光層160A隔開感測層110與第一遮光層130。因此，可進一步提升紅外濾光層160A的平坦度，進而簡化紅外濾光層160A的製程，且使得使用者在使用屏下指紋辨識裝置時有較佳的視覺外觀效果。此外，在本實施例中，由於感測層110與紅外濾光層160A的材料皆為無機材料，故在製程上，紅外濾光層160A可以高溫方式鍍膜在感測層110上，進而提升鍍膜品質。 9 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention. Please refer to Figure 9. The image sensing module 100H of this embodiment is similar to the image sensing module 100A shown in FIG. 2 . The difference between the two is that, in this embodiment, the infrared filter layer 160A is formed on the sensing layer 110 . In other words, the infrared filter layer 160A separates the sensing layer 110 from the first light shielding layer 130 . Therefore, the flatness of the infrared filter layer 160A can be further improved, thereby simplifying the manufacturing process of the infrared filter layer 160A, and enabling the user to have a better visual appearance when using the under-screen fingerprint identification device. In addition, in this embodiment, since the materials of the sensing layer 110 and the infrared filter layer 160A are both inorganic materials, in the process, the infrared filter layer 160A can be coated on the sensing layer 110 at a high temperature, thereby improving the coating film quality.

圖10為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。請參考圖10。本實施例的影像感測模組100I類似於圖2所顯示的影像感測模組100A。兩者不同之處在於，在本實施例中， 透光層120A包括一第一透光層122及一第二透光層124，且紅外濾光層160A形成於第一透光層122上。換句話說，即紅外濾光層160A隔開第一透光層122與第二透光層124。因此，可進一步提升紅外濾光層160A的平坦度，進而簡化紅外濾光層160A的製程，且使得使用者在使用屏下指紋辨識裝置時有較佳的視覺外觀效果。此外，在一些實施例中，感測層110的表面不一定為平坦表面，故先形成第一透光層122以作為平坦層將有助於提升紅外濾光層160A的平坦度。 10 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention. Please refer to Figure 10. The image sensing module 100I of this embodiment is similar to the image sensing module 100A shown in FIG. 2 . The difference between the two is that, in this embodiment, The transparent layer 120A includes a first transparent layer 122 and a second transparent layer 124 , and the infrared filter layer 160A is formed on the first transparent layer 122 . In other words, the infrared filter layer 160A separates the first transparent layer 122 from the second transparent layer 124 . Therefore, the flatness of the infrared filter layer 160A can be further improved, thereby simplifying the manufacturing process of the infrared filter layer 160A, and enabling the user to have a better visual appearance when using the under-screen fingerprint identification device. In addition, in some embodiments, the surface of the sensing layer 110 is not necessarily a flat surface, so firstly forming the first transparent layer 122 as a flat layer will help to improve the flatness of the infrared filter layer 160A.

圖11為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。請參考圖11。本實施例的影像感測模組100J類似於圖2所顯示的影像感測模組100A。兩者不同之處在於，在本實施例中，透光層120A包括一第一透光層122及一第二透光層124，且紅外濾光層160B形成於第一遮光層130上。換句話說，即部份紅外濾光層160B位於第一開口N1中。因此，可進一步提升紅外濾光層160B的平坦度，進而簡化紅外濾光層160B的製程，且使得使用者在使用屏下指紋辨識裝置時有較佳的視覺外觀效果。 11 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention. Please refer to Figure 11. The image sensing module 100J of this embodiment is similar to the image sensing module 100A shown in FIG. 2 . The difference between the two is that, in this embodiment, the light-transmitting layer 120A includes a first light-transmitting layer 122 and a second light-transmitting layer 124 , and the infrared filter layer 160B is formed on the first light-shielding layer 130 . In other words, a part of the infrared filter layer 160B is located in the first opening N1. Therefore, the flatness of the infrared filter layer 160B can be further improved, thereby simplifying the manufacturing process of the infrared filter layer 160B, and enabling the user to have a better visual appearance when using the under-screen fingerprint identification device.

圖12為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。請參考圖12。本實施例的影像感測模組100K類似於圖2所顯示的影像感測模組100A。兩者不同之處在於，在本實施例中，透光層120A包括一第一透光層122及一第二透光層124，且第二遮光層140形成於第一透光層122與第二透光層124之間。因此， 可進一步使得使用者在使用屏下指紋辨識裝置時有較佳的視覺外觀效果。 12 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention. Please refer to Figure 12. The image sensing module 100K of this embodiment is similar to the image sensing module 100A shown in FIG. 2 . The difference between the two is that, in this embodiment, the light-transmitting layer 120A includes a first light-transmitting layer 122 and a second light-transmitting layer 124 , and the second light-shielding layer 140 is formed on the first light-transmitting layer 122 and the second light-transmitting layer 124 . between the two light-transmitting layers 124 . therefore, It can further enable the user to have a better visual appearance effect when using the under-screen fingerprint identification device.

圖13為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。圖14為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。圖15為本發明另一實施例的屏下指紋辨識裝置的剖面示意圖。請參考圖13至圖15。圖13至圖15的實施例的影像感測模組100L、100M、100N類似於圖12所顯示的影像感測模組100K。不同之處在於，在圖13至圖15的實施例中，在垂直方向上，影像感測模組100L、100M、100N的第一開口N1的位置錯位於第二開口N2的位置以及至少一部份感測畫素的位置。換句話說，第一遮光層130的第一開口N1可不對齊於第二遮光層140的第二開口N2。因此，影像感測模組100L、100M、100N可適於讓光線斜向進入。如此一來，影像感測模組100A可進一步減少環境中紅外光的影響，進而提升屏下指紋辨識裝置50的感測光學品質。 13 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention. 14 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention. 15 is a schematic cross-sectional view of an under-screen fingerprint identification device according to another embodiment of the present invention. Please refer to Figure 13 to Figure 15. The image sensing modules 100L, 100M, and 100N of the embodiments of FIGS. 13 to 15 are similar to the image sensing module 100K shown in FIG. 12 . The difference is that in the embodiments of FIGS. 13 to 15 , in the vertical direction, the positions of the first openings N1 of the image sensing modules 100L, 100M and 100N are staggered from the positions of the second openings N2 and at least a part of The position of the sensed pixel. In other words, the first opening N1 of the first light shielding layer 130 may not be aligned with the second opening N2 of the second light shielding layer 140 . Therefore, the image sensing modules 100L, 100M, and 100N can be adapted to allow light to enter obliquely. In this way, the image sensing module 100A can further reduce the influence of infrared light in the environment, thereby improving the sensing optical quality of the under-screen fingerprint identification device 50 .

綜上所述，在本發明的屏下指紋辨識裝置中，影像感測模組配置於顯示模組下方，且影像感測模組包括在垂直方向上第一開口的位置對齊於第二開口的位置的第一遮光層及第二遮光層。因此使用者手指所反射感測光可通過微透鏡層產生聚焦作用，並藉由第二遮光層及第一遮光層傳遞至不同位置的感測畫素。如此一來，可有效減少體積，並且避免畫素間光學互相干涉。 To sum up, in the under-screen fingerprint identification device of the present invention, the image sensing module is disposed below the display module, and the image sensing module includes a position of the first opening aligned with the second opening in the vertical direction. position of the first light shielding layer and the second light shielding layer. Therefore, the sensing light reflected by the user's finger can be focused through the microlens layer and transmitted to the sensing pixels at different positions through the second light shielding layer and the first light shielding layer. In this way, the volume can be effectively reduced, and the optical interference between the pixels can be avoided.

雖然本發明已以實施例揭露如上，然其並非用以限定本 發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Invention, anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be regarded as defined by the appended patent application scope as follows: allow.

10:手指10: Fingers

50:屏下指紋辨識裝置50: Under-screen fingerprint recognition device

100:影像感測模組100: Image sensor module

110:感測層110: Sensing layer

120:透光層120: transparent layer

130:第一遮光層130: The first shading layer

140:第二遮光層140: Second shading layer

150:微透鏡層150: Micro lens layer

200:顯示模組200: Display module

N1:第一開口N1: The first opening

N2:第二開口N2: Second opening

M:微透鏡M: Micro lens

P:感測畫素P: Sensing pixel

Claims (14)

一種屏下指紋辨識裝置，適於感測一手指，包括：一影像感測模組，包括：一感測層，包括多個感測畫素；一透光層，配置於該感測層；一第一遮光層，配置於該透光層，具有多個第一開口；一第二遮光層，配置於該透光層，具有多個第二開口；以及一微透鏡層，配置於該透光層，包括多個微透鏡；以及一顯示模組，配置於該影像感測模組，其中該第一遮光層位於該第二遮光層與該感測層之間，該第二遮光層位於該微透鏡層與該第一遮光層之間，且在垂直方向上，該些第一開口的位置對齊或錯位於該些第二開口的位置以及至少一部份該些感測畫素的位置，該些感測畫素的收光面朝向該顯示模組的一側收光。 An under-screen fingerprint identification device, suitable for sensing a finger, includes: an image sensing module, including: a sensing layer including a plurality of sensing pixels; a light-transmitting layer disposed on the sensing layer; a first light-shielding layer disposed on the light-transmitting layer and having a plurality of first openings; a second light-shielding layer disposed in the light-transmitting layer and having a plurality of second openings; and a microlens layer disposed in the transparent layer a light layer including a plurality of microlenses; and a display module disposed in the image sensing module, wherein the first light shielding layer is located between the second light shielding layer and the sensing layer, and the second light shielding layer is located at Between the microlens layer and the first light shielding layer, and in the vertical direction, the positions of the first openings are aligned or staggered at the positions of the second openings and the positions of at least a part of the sensing pixels , the light-receiving surfaces of the sensing pixels receive light toward the side of the display module. 如申請專利範圍第1項所述的屏下指紋辨識裝置，其中該些第一開口的尺寸小於或等於該些第二開口的尺寸。 The under-screen fingerprint identification device as claimed in claim 1, wherein the size of the first openings is smaller than or equal to the size of the second openings. 如申請專利範圍第1項所述的屏下指紋辨識裝置，其中該些微透鏡的曲率半徑與該些微透鏡的曲面頂點至該些感測畫素的收光面的距離呈正比。 The under-screen fingerprint identification device as claimed in claim 1, wherein the curvature radii of the microlenses are proportional to the distances from the curved vertexes of the microlenses to the light-receiving surfaces of the sensing pixels. 如申請專利範圍第1項所述的屏下指紋辨識裝置，還包括： 一紅外濾光層，適於吸收紅外光，形成於該微透鏡層，該微透鏡層位於該紅外濾光層與該透光層之間。 The under-screen fingerprint identification device as described in item 1 of the patent application scope further includes: An infrared filter layer, suitable for absorbing infrared light, is formed on the micro-lens layer, and the micro-lens layer is located between the infrared filter layer and the light-transmitting layer. 如申請專利範圍第1項所述的屏下指紋辨識裝置，還包括：一紅外濾光層，適於吸收紅外光，形成於該透光層上。 The under-screen fingerprint identification device as described in item 1 of the patent application scope further comprises: an infrared filter layer, which is suitable for absorbing infrared light, and is formed on the light-transmitting layer. 如申請專利範圍第5項所述的屏下指紋辨識裝置，其中該紅外濾光層隔開該透光層與該第二遮光層。 The under-screen fingerprint identification device as described in claim 5, wherein the infrared filter layer separates the light-transmitting layer and the second light-shielding layer. 如申請專利範圍第5項所述的屏下指紋辨識裝置，其中部份該紅外濾光層位於該些第二開口中。 The under-screen fingerprint identification device as described in item 5 of the patent application scope, wherein a part of the infrared filter layer is located in the second openings. 如申請專利範圍第1項所述的屏下指紋辨識裝置，還包括：一紅外濾光層，適於吸收紅外光，形成於該第一遮光層。 The under-screen fingerprint identification device as described in item 1 of the patent application scope further comprises: an infrared filter layer, which is suitable for absorbing infrared light, and is formed on the first light shielding layer. 如申請專利範圍第8項所述的屏下指紋辨識裝置，其中該紅外濾光層隔開該感測層與該第一遮光層。 The under-screen fingerprint identification device as described in claim 8, wherein the infrared filter layer separates the sensing layer and the first light shielding layer. 如申請專利範圍第8項所述的屏下指紋辨識裝置，其中部份該紅外濾光層位於該些第一開口中。 The under-screen fingerprint identification device as described in item 8 of the patent application scope, wherein a part of the infrared filter layer is located in the first openings. 如申請專利範圍第1項所述的屏下指紋辨識裝置，其中該透光層包括一第一透光層及一第二透光層。 The under-screen fingerprint identification device according to item 1 of the claimed scope, wherein the light-transmitting layer comprises a first light-transmitting layer and a second light-transmitting layer. 如申請專利範圍第11項所述的屏下指紋辨識裝置，還包括：一紅外濾光層，適於吸收紅外光，形成於該第一透光層與該 第二透光層之間。 The under-screen fingerprint identification device as described in item 11 of the scope of the patent application, further comprising: an infrared filter layer, suitable for absorbing infrared light, formed on the first light-transmitting layer and the between the second transparent layers. 如申請專利範圍第12項所述的屏下指紋辨識裝置，其中該紅外濾光層隔開該第一透光層與該第一遮光層。 The under-screen fingerprint identification device as claimed in claim 12, wherein the infrared filter layer separates the first light-transmitting layer and the first light-shielding layer. 如申請專利範圍第12項所述的屏下指紋辨識裝置，其中部份該紅外濾光層位於該些第一開口中。The under-screen fingerprint identification device as claimed in item 12 of the claimed scope, wherein a part of the infrared filter layer is located in the first openings.
TW108147945A 2019-12-26 2019-12-26 Under-screen fingerprint identification device TWI777114B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW108147945A TWI777114B (en) 2019-12-26 2019-12-26 Under-screen fingerprint identification device
CN202020535840.9U CN211403454U (en) 2019-12-26 2020-04-13 Fingerprint recognition device under screen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108147945A TWI777114B (en) 2019-12-26 2019-12-26 Under-screen fingerprint identification device

Publications (2)

Publication Number Publication Date
TW202125315A TW202125315A (en) 2021-07-01
TWI777114B true TWI777114B (en) 2022-09-11

Family

ID=72211657

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108147945A TWI777114B (en) 2019-12-26 2019-12-26 Under-screen fingerprint identification device

Country Status (2)

Country Link
CN (1) CN211403454U (en)
TW (1) TWI777114B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201919852A (en) * 2017-08-31 2019-06-01 日商索尼半導體解決方案公司 Laminated lens structure, solid-state imaging element, and electronic apparatus
CN209560569U (en) * 2019-02-14 2019-10-29 金佶科技股份有限公司 Photosensitive module and image capturing device
CN209640882U (en) * 2018-02-23 2019-11-15 深圳市汇顶科技股份有限公司 Optical sensor arrangement and electronic equipment
TWI680397B (en) * 2018-04-03 2019-12-21 薛英家 Sensor board and display with sensor board
TWM595262U (en) * 2019-12-26 2020-05-11 敦捷光電股份有限公司 Under-screen fingerprint identification device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201919852A (en) * 2017-08-31 2019-06-01 日商索尼半導體解決方案公司 Laminated lens structure, solid-state imaging element, and electronic apparatus
CN209640882U (en) * 2018-02-23 2019-11-15 深圳市汇顶科技股份有限公司 Optical sensor arrangement and electronic equipment
TWI680397B (en) * 2018-04-03 2019-12-21 薛英家 Sensor board and display with sensor board
CN209560569U (en) * 2019-02-14 2019-10-29 金佶科技股份有限公司 Photosensitive module and image capturing device
TWM595262U (en) * 2019-12-26 2020-05-11 敦捷光電股份有限公司 Under-screen fingerprint identification device

Also Published As

Publication number Publication date
CN211403454U (en) 2020-09-01
TW202125315A (en) 2021-07-01

Similar Documents

Publication Publication Date Title
TWM595262U (en) Under-screen fingerprint identification device
US10417473B2 (en) Optical imaging system with variable light field for biometrics application
WO2018040514A1 (en) Optical fingerprint sensor module
CN108292361A (en) The integrated optical fingerprint sensor of the display of reflector is limited with angle
TWI408429B (en) Optical sensing module
TWI725761B (en) Electronic apparatus having under-display infrared biometrics sensor
CN211653679U (en) Fingerprint sensing module and electronic device
TWI680397B (en) Sensor board and display with sensor board
TWI756056B (en) Sensing device
CN109753852B (en) Optical assembly for object texture, display assembly and electronic equipment
TW202122981A (en) Optical sensor, optical sensing system and manufacturing method of optical sensor
TWI753571B (en) In-cell optical biometrics sensor
WO2021249380A1 (en) Fingerprint recognition assembly and display substrate
TWI775094B (en) Fingerprint sensing module
CN114625264A (en) Display device
TW201512693A (en) Optical apparatus and light sensitive device with micro-lens
TWI777114B (en) Under-screen fingerprint identification device
US20230076282A1 (en) Display panel and display apparatus
CN113642396B (en) Sensing device
CN113486801B (en) Sensing device
WO2022041145A1 (en) Fingerprint recognition apparatus and electronic device
TWI704685B (en) Image capture apparatus
TWM579772U (en) Fingerprint identification module
CN113435382B (en) Sensing device
TWI840961B (en) Electronic device

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent